TW201628152A - Electronic package structure - Google Patents

Abstract

An electronic package structure is provided, including an insulating layer, an electronic element embedded in the insulating layer and having a sensing zone exposed from the insulating layer, and a first circuit layer disposed on the insulating layer and electrically connecting to the electronic element, thereby reducing the overall thickness of the electronic package structure.

Description

Electronic package structure

The invention relates to an electronic package structure, in particular to an electronic package structure which can be thinned.

With the development of the electronics industry, today's electronic products have been designed in a light, short, and versatile manner, and semiconductor packaging technologies have also developed different packaging types.

Most of the electronic components currently used in sensor components or camera lenses are still in the wire bonding package type or the Chip On Board (COB) type.

As shown in FIG. 1A, the conventional wire-type package structure 1 includes a substrate 10, an electronic component 13, and an encapsulant 18.

The substrate 10 is provided with a first circuit layer 11 and a second circuit layer 12 on the upper and lower sides, and is electrically connected to the first and second through a via hole or a blind via type conductor 14 formed therein. The circuit layers 11, 12 are formed with a first insulating protective layer 16 and a second insulating protective layer 17 on the upper and lower sides to expose portions of the first and second circuit layers 11, 12 to the first and second insulating layers. The layers 16, 17 are protected and a plurality of conductive elements 15 are formed on the second wiring layer 12.

The electronic component 13 is a sensor component formed on the substrate The upper layer 10 is electrically connected to the first circuit layer 11 by a plurality of gold wires 130, and the upper surface of the electronic component 13 has a sensing region 131 for fingerprint identification.

The encapsulant 18 is formed on the upper side of the substrate 10 and covers the electronic component 13 and the gold wires 130.

In the conventional wire-type package structure 1, the thickness d of the effective sensing of the encapsulant 18 covering the sensing region 131 needs to be extremely thin (otherwise, it cannot be sensed), and thus requires extremely high precision.

However, the gold wire 130 has a certain height of the arc, and the molding process needs to have a height sufficient to uniformly cover the electronic component 13 by the encapsulant 18, which makes it difficult to control the extremely thin thickness of the encapsulant 18, so that The wire-type package structure 1 cannot meet the demand for thinning.

Fig. 1B is a schematic cross-sectional view showing a conventional COB type package structure 1'. As shown in FIG. 1B, the COB type package structure 1' includes: a substrate 10', an IC electronic component 13 of a camera lens, a light transmissive member 19, and an encapsulant 18, and the substrate 10' is referenced. The structure shown in Fig. 1A.

The electronic component 13 is formed on the upper side of the substrate 10' and electrically connected to the substrate 10' by a plurality of gold wires 130. The upper surface of the electronic component 13 has a sensing region 131 for light sensing.

The light transmissive member 19 is formed on the upper surface of the electronic component 13 by a plurality of support members 190 and covers the sensing region 131.

The encapsulant 18 is a non-transparent material, and is formed on the upper side of the substrate 10 and covers the transparent member 19, the electronic component 13 and the gold wires 130, and the upper surface of the transparent member 19 is exposed. The encapsulant 18 is encapsulated.

In the conventional COB type package structure 1', the camera lens needs to be thinned. The electronic component 13 is to be adhered to the substrate 10 ′, and the transparent component 19 is disposed on the electronic component 13 by the support member 190 , so that the overall thickness of the COB package structure 1 ′ is not easy to be thin. Chemical.

In order to solve the above problems, there is a semiconductor silicon-on-silicon (Through Silicon Via, TSV) technology for packaging. As shown in Fig. 1C, the conventional photo-sensing package structure 1" includes a substrate 10" and a light-transmissive member 19'.

The first substrate layer 11 and the second circuit layer 12 are disposed on the upper and lower sides, and the first circuit layer 11 and the second layer are electrically connected by the conductive germanium through holes 100 formed therein. The circuit layer 12 has a sensing region 131 formed on the upper side, and an insulating protective layer 17' is formed on the lower side to expose a portion of the second wiring layer 12 to the insulating protective layer 17', and the plurality of conductive elements 15 are formed in the first layer The two circuit layers 12 are exposed on the surface.

The light transmissive member 19' is formed on the upper side of the crucible substrate 10" by an adhesive layer 190' and covers the sensing region 131.

However, in the conventional light-sensing package structure 1", the cost of manufacturing the conductive perforation 100 is expensive, the integration difficulty is high, and the technical difficulty is high, especially the electronic components applied to the sensor element or the camera lens are high in cost.

Therefore, how to overcome the various problems of the above-mentioned prior art has become a difficult problem to be overcome in the industry.

In view of the above-mentioned various deficiencies of the prior art, the present invention provides an electronic package structure comprising: an insulating layer having a first surface opposite thereto And a second surface; an electronic component embedded in the insulating layer and having at least one sensing region and a plurality of electrode pads exposed on the first surface of the insulating layer; and a first circuit layer disposed on the insulating layer And contacting the electrode pads on the first surface of the layer to electrically connect the electronic component, and the first circuit layer does not cover the sensing region.

In the foregoing electronic package structure, a second circuit layer is further included on the second surface of the insulating layer and electrically connected to the first circuit layer. The method further includes an insulating protective layer disposed on the second surface of the insulating layer and the second wiring layer, for example, the insulating protective layer exposes the second wiring layer. Alternatively, the second circuit layer may or may not be in contact with the electronic component.

The electronic package structure includes an insulating protective layer disposed on the first surface of the insulating layer and the first circuit layer, and the insulating protective layer does not cover the sensing region, for example, the exposed portion of the insulating protective layer The first circuit layer.

The present invention further provides an electronic package structure, comprising: an insulating layer having opposite first and second surfaces; an electronic component embedded in the insulating layer and having a first exposed surface of the insulating layer At least one sensing area and a plurality of electrode pads; a first circuit layer is disposed on the first surface of the insulating layer and is in contact with the electrode pads to electrically connect the electronic component, and the first circuit layer is uncovered The sensing area; and an insulating protective layer cover the sensing area.

In the foregoing electronic package structure, a second circuit layer is further included on the second surface of the insulating layer and electrically connected to the first circuit layer. In addition, another insulating protective layer is disposed on the second surface of the insulating layer and the second On the circuit layer. The other insulating protective layer exposes a portion of the second wiring layer. Alternatively, the second circuit layer may or may not be in contact with the electronic component.

In the above electronic package structure, the insulating protective layer is disposed on the first surface of the insulating layer and the first circuit layer, for example, the insulating protective layer exposes the first circuit layer.

In the above two electronic package structures, the plurality of conductive pillars are embedded in the insulating layer and electrically connected to the first circuit layer and the second circuit layer.

In the above two electronic package structures, a plurality of conductive elements disposed on the second surface of the insulating layer are further included.

The two electronic package structures include a line build-up structure disposed on the second surface of the insulating layer and electrically connected to the first circuit layer.

In the above two electronic package structures, a light transmissive member is included to cover the sensing area of the electronic component.

As can be seen from the above, the electronic package structure of the present invention is mainly embedded in the insulating layer, and the first circuit layer is electrically connected to the electronic component. Therefore, it is not necessary to consider the conventional wire bonding during manufacture. The thickness of the line arc or encapsulant is such that it is easy to control the thickness of the insulating layer for better uniformity and thinner thickness.

1‧‧‧Wire type package structure

1'‧‧‧COB type package structure

1”‧‧‧Light-sensing package structure

10,10’‧‧‧substrate

10"‧‧‧矽 substrate

100‧‧‧ Conductive piercing

11, 21‧‧‧ first circuit layer

12,22‧‧‧second circuit layer

13,23‧‧‧Electronic components

130‧‧‧ Gold wire

131,231‧‧‧sensing area

14‧‧‧through hole or blind via conductor

15,25‧‧‧ conductive elements

16,26,26’‧‧‧First insulation protection layer

17,27‧‧‧Second insulation protection layer

17'‧‧‧Insulating protective layer

18‧‧‧Package colloid

19,19’,40‧‧‧Lighting parts

190‧‧‧Support

190’‧‧‧Adhesive layer

2a-2e, 3a-3c, 4a-4b‧‧‧ electronic package structure

20‧‧‧First insulation

20a‧‧‧ first surface

20b‧‧‧second surface

200‧‧‧Second insulation

23a‧‧‧Action surface

23b‧‧‧Non-active surface

230‧‧‧electrode pads

24,302‧‧‧Electrical cylinder

260‧‧‧ first opening

270‧‧‧Second opening

30‧‧‧Line layering structure

300‧‧‧ dielectric layer

301‧‧‧circuit layer

D‧‧‧thickness

1A is a schematic cross-sectional view of a conventional wire-type package structure; FIG. 1B is a schematic cross-sectional view of a conventional COB-type package structure; and FIG. 1C is a schematic cross-sectional view of a conventional light-sensing package structure; 2A to 2E are schematic cross-sectional views showing various aspects of the first embodiment of the electronic package structure of the present invention; wherein, the 2A' and 2B' views are another mode of the 2A and 2B drawings; 3C is a schematic cross-sectional view of various aspects of a second embodiment of the electronic package structure of the present invention; wherein, FIGS. 3A' and 3B' are another mode of FIGS. 3A and 3B; and 4A and 4B is a cross-sectional view showing various aspects of a third embodiment of the electronic package structure of the present invention.

The other embodiments of the present invention will be readily understood by those skilled in the art from this disclosure.

It is to be understood that the structure, the proportions, the size, and the like of the present invention are intended to be used in conjunction with the disclosure of the specification, and are not intended to limit the invention. The conditions are limited, so it is not technically meaningful. Any modification of the structure, change of the proportional relationship or adjustment of the size should remain in this book without affecting the effects and the objectives that can be achieved by the present invention. The technical content disclosed in the invention can be covered. In the meantime, the terms "upper", "first", "second", "one" and "the" are used in the description, and are not intended to limit the scope of the invention. Changes or adjustments in the relative relationship are considered to be within the scope of the invention without substantial changes.

2A to 2E are diagrams of the electronic package structure 2a-2e of the present invention. A schematic cross-sectional view of various aspects of an embodiment. The electronic package structure 2a-2e of the present embodiment can be applied to, for example, a product of a fingerprint recognition or image sensor.

As shown in FIG. 2A, the electronic package structure 2a includes a first insulating layer 20, a second insulating layer 200, an electronic component 23, a conductive pillar 24, and a first wiring layer 21 and a second. Circuit layer 22.

The first insulating layer 20 has opposite first and second surfaces 20a, 20b. In this embodiment, the first insulating layer 20 is, for example, a molding compound, a dielectric material, an epoxy resin (Epoxy), a polyimide (PI), or other photosensitive materials. Or an organic resin such as a non-photosensitive material, and a second insulating layer 200 having the same material or different from the first insulating layer 20 may be formed on the first surface 20a of the first insulating layer 20. The first insulating layer 20 and the second insulating layer 200 may also be formed at the same time.

The electronic component 23 is embedded in the first insulating layer 20. In this embodiment, the electronic component 23 is a sensor component, such as a semiconductor wafer structure, having an active surface 23a and an inactive surface 23b opposite to the active surface 23a. The active surface 23a has a light perception. The sensing area 231 and the plurality of electrode pads 230 are exposed to the sensing area 231 and the electrode pads 230 are exposed on the first surface 20a of the first insulating layer 20.

Since the electronic component 23 is embedded in the first insulating layer 20, it is not necessary to fabricate a conventional encapsulant at the time of fabrication, so that the thickness of the overall structure can be reduced.

The first circuit layer 21 is disposed on the first of the first insulating layer 20 The surface of the electrode pad 230 is electrically connected to the electronic component 23, and the first circuit layer 21 does not cover the sensing region 231. In the present embodiment, the first wiring layer 21 such as copper is formed by plating, deposition or etching in a patterning process.

In the embodiment, the electronic package structure 2a includes a second circuit layer 22 bonded to the second surface 20b of the first insulating layer 20. For example, the second circuit layer 22 is embedded in the first insulating layer 20 from the second surface 20b, wherein the surface of the second circuit layer 22 may be flush or slightly lower than the first insulating layer 20. The second surface layer 22b may be disposed on the second surface 20b of the first insulating layer 20.

Furthermore, a second wiring layer 22 such as a copper material is formed by electroplating, deposition or etching of a patterning process.

Moreover, a portion of the second circuit layer 22 can contact the non-active surface 23b of the electronic component 23 for heat dissipation of the electronic component 23.

In addition, the electronic package structure 2a includes a plurality of conductive pillars 24 embedded in the first insulating layer 20 and electrically connected to the first circuit layer 21, so that the second circuit layer 22 is electrically conductive. The pillar 24 is electrically connected to the first wiring layer 21, but the first wiring layer 21 is not electrically connected to the inactive surface 23b of the electronic component 23.

In another embodiment, as shown in FIG. 2A', the second circuit layer 22 does not contact the non-active surface 23b of the electronic component 23, that is, the second circuit layer 22 and the electronic component 23 are inactive. The first insulating layer 20 is disposed between the faces 23b, and the conductive paths of the first circuit layer 21, the conductive pillars 24 and the second circuit layer 22 extend to the inactive surface of the electronic component 23. Below 23b.

Since the electronic component 23 is directly electrically connected to the first circuit layer 21, the electronic component 23 and the first wiring layer 21 need not be electrically connected by wire bonding, thereby reducing the thickness of the overall structure.

As shown in FIG. 2B, the electronic package structure 2b includes a plurality of conductive elements 25 disposed on the second surface 20b of the first insulating layer 20. Specifically, the conductive elements 25 are disposed on the second circuit layer 22 to electrically connect the second circuit layer 22.

In the present embodiment, the conductive elements 25 are in various aspects, such as solder balls, solder bumps, copper bumps, and the like, and are not particularly limited.

In another aspect, as shown in FIG. 2B', corresponding to the structure of FIG. 2A', the second circuit layer 22 does not contact the non-active surface 23b of the electronic component 23, that is, the second circuit layer 22 The first insulating layer 20 is provided between the non-active surface 23b of the electronic component 23.

As shown in FIG. 2C, the electronic package structure 2c includes a first insulating protective layer 26' disposed on the first surface 20a of the first insulating layer 20 and the first portion. A circuit layer 21 is disposed, and the first insulating protective layer 26' does not cover the sensing region 231. For example, the first insulating protective layer 26' is a dielectric material.

Furthermore, the electronic package structure 2c may not form the second circuit layer 22, so that the conductive elements 25 can be directly contacted on the conductive pillar 24.

The electronic package structure 2d shown in FIG. 2D is another aspect of FIGS. 2B and 2C, and the first insulating protective layer 26 is a dielectric layer or a solder resist layer. (solder mask), and the first insulating protective layer 26 exposes a portion of the first wiring layer 21. For example, the first insulating protection layer 26 has a plurality of first openings 260 to expose a portion of the first circuit layer 21 to each of the first openings 260; or (not shown) to protect the first insulation The surface of the layer is flush with the surface of the first circuit layer such that the first insulating protective layer exposes the top surface of the first circuit layer.

Moreover, the electronic package structure 2d further includes a second insulating protective layer 27 disposed on the second surface 20b of the first insulating layer 20 and the second wiring layer 22. For example, the second insulating protective layer 27 is a dielectric layer or a solder mask.

In addition, the second insulating protective layer 27 exposes a portion of the second wiring layer 22 for bonding the conductive elements 25. For example, the second insulating protection layer 27 has a plurality of second openings 270 to expose a portion of the second circuit layer 22 to each of the second openings 270; or (not shown) to protect the second insulation The surface of the layer is flush with the surface of the second circuit layer such that the second insulating protective layer exposes the top surface of the second circuit layer to bond the conductive elements.

The electronic package structure 2e shown in Fig. 2E, according to another aspect of the 2C and 2D drawings, the first insulating protective layer 26' covers the sensing region 231 to seal the sensing region 231.

3A to 3C are cross-sectional views showing various aspects of the second embodiment of the electronic package structure 3a-3c of the present invention. The difference between this embodiment and the first embodiment lies in the design of the multilayer circuit, and the other configurations are substantially the same, so the differences will be described in detail below, and the same points will not be described.

As shown in Figures 3A and 3A', the structure corresponding to Figures 2A and 2A' is The electronic package structure 3a further includes a line build-up structure 30 disposed on the second surface 20b of the first insulating layer 20 and electrically connected to the conductive pillars 24 via the second circuit layer 22 The first circuit layer 21.

In the present embodiment, the circuit build-up structure 30 has at least one dielectric layer 300 and a circuit layer 301 disposed on the dielectric layer 300, and the circuit layer 301 is disposed in the dielectric layer 300. The conductive pillar 302 is electrically connected to the second circuit layer 22.

Moreover, the circuit layer 301 is exposed to the dielectric layer 300 for bonding the conductive elements 25.

As shown in Figs. 3B and 3B', in correspondence with the structures shown in Figs. 2B and 2B', the electronic package structure 3b can be changed in accordance with any of the technical features of the structure of the 2C or 2D. For example, according to one of the technical features of FIG. 2C, a first insulating protective layer 26 such as a dielectric layer or a solder resist layer is disposed on the first surface 20a of the first insulating layer 20 and the first wiring layer 21 The first insulating protective layer 26 does not cover the sensing region 231.

The electronic package structure 3c as shown in Fig. 3C corresponds to the structure shown in Fig. 2E, that is, the first insulating protective layer 26' such as a dielectric material covers the sensing region 231.

4A and 4B are cross-sectional views showing various aspects of a third embodiment of the electronic package structures 4a, 4b of the present invention. The difference between this embodiment and the above two embodiments is that the electronic package structures 4a, 4b of the present embodiment are applied to a camera lens, for example, the design of the new light transmissive member 40, and the other structures are substantially the same, so the differences are detailed below. Do not repeat the same place.

As shown in Figures 4A and 4B, taking the 2D and 3B diagrams as an example, the electron The package structure 4a, 4b further comprises a light transmissive member 40, such as a lens or glass, which is covered on the sensing region 231 of the electronic component 23. For example, the light transmissive member 40 is adhered to the first insulating protective layer 26 without forming a conventional support member, so that the thickness of the overall structure can be reduced.

In the present embodiment, as shown in FIG. 4A, the surface of the first insulating protective layer 26 is flush with the surface of the first wiring layer 21.

Alternatively, as shown in FIG. 4B, the first insulating protective layer 26 covers the first wiring layer 21.

In summary, the electronic package structures 2a-2e, 3a-3c, 4a-4b of the present invention are mainly embedded in the first insulating layer 20 by the electronic component 23, and the first circuit layer 21 is electrically Since the electronic component 23 is connected, it is not necessary to consider the thickness of the wire arc or the thickness of the encapsulant at the time of fabrication, so that the thickness of the first insulating layer 20 can be easily controlled to achieve better uniformity and a thinner thickness.

Furthermore, since the non-semiconductor process is used, the manufacturing cost can be reduced.

Moreover, the electronic package structures 2a-2e, 3a-3c, 4a-4b are easy to adjust the structure and design according to product requirements, so that the design flexibility is good.

In addition, the above embodiments are applicable to a Land Grid Array (LGA) or a Ball Grid Array (BGA).

The above embodiments are intended to illustrate the principles of the invention and its effects, and are not intended to limit the invention. Any of the above-described embodiments may be modified by those skilled in the art without departing from the spirit and scope of the invention. Therefore, the scope of protection of the present invention should be as follows. Listed around.

2a‧‧‧Electronic package structure

20‧‧‧First insulation

20a‧‧‧ first surface

20b‧‧‧second surface

200‧‧‧Second insulation

21‧‧‧First line layer

22‧‧‧Second circuit layer

23‧‧‧Electronic components

23a‧‧‧Action surface

23b‧‧‧Non-active surface

230‧‧‧electrode pads

231‧‧‧ Sensing area

24‧‧‧Electrical cylinder

Claims (24)

An electronic package structure comprising: an insulating layer having opposite first and second surfaces; an electronic component embedded in the insulating layer and having at least one exposed on the first surface of the insulating layer a sensing region and a plurality of electrode pads; and a first circuit layer disposed on the first surface of the insulating layer and contacting the electrode pads to electrically connect the electronic component, and the first circuit layer does not cover the sensing region . The electronic package structure of claim 1, further comprising a second circuit layer bonded to the second surface of the insulating layer and electrically connected to the first circuit layer. The electronic package structure of claim 2, further comprising an insulating protective layer disposed on the second surface of the insulating layer and the second circuit layer. The electronic package structure of claim 3, wherein the insulating protective layer exposes a portion of the second circuit layer. The electronic package structure of claim 2, wherein the second circuit layer contacts the electronic component. The electronic package structure of claim 2, wherein the second circuit layer does not contact the electronic component. The electronic package structure of claim 1, further comprising a plurality of conductive pillars embedded in the insulating layer and electrically connected to the first circuit layer. The electronic package structure of claim 1, further comprising a plurality of conductive elements disposed on the second surface of the insulating layer. The electronic package structure of claim 1, further comprising an insulating protective layer disposed on the first surface of the insulating layer and the first circuit layer, and the insulating protective layer does not cover the sensing region. The electronic package structure of claim 9, wherein the insulating protective layer exposes a portion of the first circuit layer. The electronic package structure of claim 1, further comprising a line build-up structure disposed on the second surface of the insulating layer and electrically connected to the first circuit layer. The electronic package structure of claim 1, further comprising a light transmissive member covering the sensing area of the electronic component. An electronic package structure comprising: an insulating layer having opposite first and second surfaces; an electronic component embedded in the insulating layer and having at least one exposed on the first surface of the insulating layer a sensing layer and a plurality of electrode pads; a first circuit layer disposed on the first surface of the insulating layer and contacting the electrode pads to electrically connect the electronic component, and the first circuit layer does not cover the sensing region; And an insulating protective layer covering the sensing area. The electronic package structure of claim 13 further comprising a second circuit layer bonded to the second surface of the insulating layer and electrically connected to the first circuit layer. The electronic package structure of claim 14, further comprising another insulating protective layer disposed on the second surface of the insulating layer and the second circuit layer. The electronic package structure of claim 15, wherein the another insulating protective layer exposes a portion of the second circuit layer. The electronic package structure of claim 14, wherein the second circuit layer contacts the electronic component. The electronic package structure of claim 14, wherein the second circuit layer does not contact the electronic component. The electronic package structure of claim 13 further comprising a plurality of conductive pillars embedded in the insulating layer and electrically connected to the first circuit layer. The electronic package structure of claim 13 further comprising a plurality of conductive elements disposed on the second surface of the insulating layer. The electronic package structure of claim 13, wherein the insulating protective layer is disposed on the first surface of the insulating layer and the first circuit layer. The electronic package structure of claim 21, wherein the insulating protective layer exposes a portion of the first circuit layer. The electronic package structure of claim 13 further comprising a line build-up structure disposed on the second surface of the insulating layer and electrically connected to the first circuit layer. The electronic package structure of claim 13 further comprising a light transmissive member covering the sensing area of the electronic component.