TWI796692B - Detection device of surface inclination amount, control device, and laser processing device - Google Patents

Abstract

A surface inclination amount detecting device (10A) of the present invention includes an encoder vibration detection unit (15) receives a galvanic angle position indicating a rotation angle of galvanic mirrors (3X, 3Y) from an encoder (58) arranged on a rotation axis of the galvanic mirrors (3X, 3Y) that deflect a laser beam (L0) used for laser processing to a processing position, and a displacement amount calculation unit (16) calculates a residual vibration related to an inclination amount that is an angular deviation amount in a rotation direction of the galvanic mirror (3X, 3Y), based on the galvanic angle position.

Description

Surface skew detection device, control device and laser processing device

The disclosure relates to a surface deflection detecting device, a control device and a laser processing device for detecting the deflection of a Galvanic mirror (also known as a Galvanometer mirror).

The laser processing device for opening holes in the processed object such as printing uses a galvanic scanner (also known as a galvanometer scanner) to control the laser light irradiation position belonging to the processing position for processing the processed object. When the galvanometer scanner repeatedly moves the processing position at the same pitch, the surface skew resonance of the rotor and the galvanometer mirror will be caused due to the movement period of the processing position movement. In addition, when plane skew resonance occurs, a positional deviation of the processing position occurs in a direction perpendicular to the moving direction of the processing position controlled by the galvanometer scanner.

Although there is a method to strictly implement the weight balance adjustment of the rotor to reduce the amount of surface deflection, the exciting force will still increase with the increase of the required positioning speed, and it is difficult to obtain the required positioning speed only by weight balance adjustment. Positioning precision.

In the laser processing device disclosed in Patent Document 1, a piezoelectric element is attached to a galvanometer mirror in advance, and the surface distortion of the galvanometer mirror is detected by the piezoelectric element, and the surface distortion of the galvanometer mirror is corrected. (Prior Art Literature) (patent documents)

Patent Document 1: Japanese Patent Laid-Open Publication No. 2011-154196

[Problems to be Solved by the Invention]

However, in the technique of the above-mentioned Patent Document 1, since the piezoelectric element must be attached to the galvanometer mirror, the piezoelectric element affects the galvanometer mirror. Therefore, there is a problem that the configuration of the galvanometer scanner for driving the galvanometer mirror becomes complicated in order to accurately detect the amount of surface distortion of the galvanometer mirror.

The present disclosure was developed in view of the above, and an object thereof is to obtain a surface skew amount detection device capable of detecting the correct surface skew amount of a galvanometer mirror with a simple configuration. [means to solve the problem]

In order to solve the above-mentioned problems and achieve the object, the surface skew detection device of the present disclosure is provided with an input unit that receives a galvanometer angle indicating the rotation angle of the galvanometer mirror from an encoder disposed on the rotation axis of the galvanometer mirror. position, the galvanometer mirror deflects the laser light towards the processing position. In addition, the surface deflection detection device of the present disclosure is provided with a displacement calculation unit that calculates residual vibration based on the angular position of the galvanometer. face skew. [Effect of Invention]

The surface deflection detection device of the present disclosure achieves the effect of being able to detect the correct surface deflection of the galvanometer mirror with a simple structure.

Hereinafter, the surface distortion detection device, the control device, and the laser processing device according to the embodiments of the present disclosure will be described in detail based on the drawings.

implementation type Fig. 1 is a diagram showing the purchase of the laser processing device of the embodiment. The laser processing device 101 is a device that performs drilling processing of fine holes in the workpiece W by irradiation with laser light L1 that is a pulsed laser. That is, the laser processing device 101 performs drilling processing of microscopic holes in the workpiece W in a cycle pulse mode.

In this embodiment, the laser processing device 101 detects the amount of displacement of the mirror surface caused by the plane skew resonance of the galvanometer mirrors 3X and 3Y by means of an encoder. The encoder detects the angular position of the galvanometer which shows the rotation angle of the galvanometer mirror 3X, 3Y as the displacement of the mirror. The amount of displacement of the mirror surface corresponds to the positional deviation of the processing position belonging to the irradiation position of the laser light.

The laser processing device 101 uses the galvanometer mirror 3X, 3Y whose mirror surface has no displacement to eliminate the positional deviation of the processing position corresponding to the displacement of the galvanometer mirror 3X, 3Y, thereby making the positioning of the processing position precise degree of improvement.

The laser processing device 101 is equipped with: a laser oscillator 1, an image transfer optical mechanism 2, a laser processing part 4, and a control device 20; the laser oscillator 1 oscillates the laser light L0; the image transfer optical mechanism 2 is to shape the laser light L0 and adjust it to a desired beam shape and beam energy; the laser processing unit 4 is to perform laser processing of the workpiece W belonging to the workpiece. Exceptionally, in the cycle pulse mode here, a plurality of open machining positions set in the workpiece W are sequentially scanned, and laser irradiation to each hole is performed in a plurality of cycles. That is, the cyclic pulse mode is a process in which an irradiation cycle in which laser light L1 is irradiated by 1 shot (1 shot) is repeated a plurality of times.

The laser oscillator 1 oscillates the laser light L0 and sends it to the image transfer optical mechanism 2 . The image transfer optical mechanism 2 includes a collimation lens (collimation lens) 2C and a mask 2M. The collimator lens 2C condenses the laser light L0 from the laser oscillator 1 and adjusts the optical axis for parallelization, and the mask 2M shapes the beam shape of the laser light L0.

The laser processing unit 4 is equipped with galvanometer mirrors 3X, 3Y, galvanometer scanners 5X, 5Y, fθ lens 6, XY slide table 8, and surface distortion detection device 10A. The galvanometer scanners 5X and 5Y have the function of changing the trajectory of the laser light L0 to move the irradiation position of the workpiece W (that is, the positioning function), and in order to scan the laser light L0 along the X-Y direction, the galvanometer mirror 3X, 3Y rotate along a predetermined angle. Thereby, the galvano scanners 5X, 5Y cause the galvano mirrors 3X, 3Y to deflect the laser light L1 toward the processing position set in the processing area.

The galvanometer mirrors 3X, 3Y reflect and deflect the laser light L0 as a light beam emitted from the mask 2M of the image transfer optical mechanism 2 at an arbitrary angle. The galvanometer mirror 3X deflects the laser light L0 in the X direction, and the galvanometer mirror 3Y deflects the laser light L0 in the Y direction. The fθ lens 6 condenses the laser light L1 that deflects the laser light L0 in a direction perpendicular to the surface of the workpiece W, and irradiates the surface of the workpiece W at the processing position.

The surface skew amount detection device 10A detects the residual vibration of the galvanometer mirrors 3X, 3Y based on the galvanometer angular position detected by the encoder. The residual vibration of the galvanometer mirrors 3X, 3Y corresponds to the amount of surface distortion of the galvanometer mirrors 3X, 3Y. The residual vibration is vibration in a state where the rotation of the galvanometer mirrors 3X and 3Y is stopped after rotation.

The residual vibration of the galvano mirrors 3X, 3Y detected by the surface deflection detection device 10A contains information on the frequency of the surface deflection during the residual vibration. The surface skew amount detecting device 10A transmits information of residual vibration (hereinafter referred to as residual vibration information) as a detection result to the control device 20 . In this embodiment, the surface deflection detection device 10A transmits the residual vibration information to the control device 20 as a preparation before laser processing.

The control device 20 corrects the positions of the galvano mirrors 3X, 3Y based on the frequency of the residual vibration transmitted from the surface distortion detection device 10A. In this embodiment, in the preparatory work before laser processing, the control device 20 calculates in advance the corrections for correcting the positions of the galvanometer mirrors 3X and 3Y based on the amount of surface skew included in the residual vibration information. quantity. The correction amount for correcting the positions of the galvanometer mirrors 3X, 3Y is the correction amount for correcting the irradiation position of the laser light (hereinafter referred to as the processing position correction amount).

The control device 20 stores the processing position correction amount and the frequency included in the residual vibration information in advance. During actual laser processing, the control device 20 calculates the frequency during laser processing based on the processing formula used for laser processing. When the difference between the calculated frequency and the pre-stored frequency is smaller than the reference value, the control device 20 corrects the positions of the galvano mirrors 3X, 3Y using the pre-stored processing position correction amount.

The control device 20 is constituted by a computer such as a personal computer, and controls the laser oscillator 1 , the image transfer optical mechanism 2 , and the laser processing unit 4 by numerical control (NC: Numerical Control) or the like.

The workpiece W is a substrate such as a printed circuit board, and is subjected to a plurality of drilling processes. The XY slide table 8 is for placing the workpiece W, and is driven by an unshown X-axis motor and a Y-axis motor to move freely on the X-axis-Y-axis two-dimensional plane. The XY slide table 8 moves the processing area irradiated with the laser light L1 in the XY direction.

FIG. 2 is a block diagram showing the configuration of a control device included in the laser processing device of the embodiment. The control device 20 is connected to the surface skew amount detection device 10A. The angular position of the galvanometer detected by the encoder is input to the surface skew amount detecting device 10A. In addition, the control device 20 is connected to the XY slide table 8, the laser oscillator 1, and the galvanometer scanners 5X, 5Y.

The control device 20 includes an input unit 21 , a machining formula storage unit 22 , a correction amount calculation unit 23 , an instruction generation unit 24 , an output unit 25 , and a correction amount storage unit 26 . The input unit 21 receives residual vibration information as a detection result from the surface skew amount detection device 10A, and sends it to the correction amount calculation unit 23 .

The processing formula memory unit 22 is a memory for storing a processing formula used for laser processing of the workpiece W, and the like. In the machining formula, coordinates and the like indicating the machining position on the workpiece W are set.

The correction amount calculation unit 23 calculates the machining position correction amount based on the surface skew amount included in the residual vibration information. In the control device 20, the relationship between the machining position correction amount and the surface skew amount is memorized in advance in the machining formula memory unit 22, etc., and the correction amount calculation unit 23 is based on the relationship between the machining position correction amount and the surface skew amount and the detected Calculate the machining position correction amount based on the amount of surface skew.

The correction amount calculation unit 23 calculates the machining position correction amount in advance during the preparation work. The correction amount calculation unit 23 stores corresponding information in the correction amount storage unit 26 in advance during preparation. The corresponding information is a correspondence between the calculated processing position correction amount and the frequency contained in the residual vibration information. The correction amount storage unit 26 is a memory or the like for storing corresponding information.

When the residual vibration in the direction of rotation is to be detected during preparation, the control device 20 excites vibrations to the galvanometer scanners 5X, 5Y so that the galvanometer mirrors 3X, 3Y are vibrated by the natural frequencies of the galvanometer mirrors 3X, 3Y. Vibration, the natural frequency is measured in advance during the manufacture of the galvanometer mirrors 3X, 3Y. Thereby, the galvanometer mirrors 3X, 3Y are distorted due to the natural frequency of the galvanometer mirrors 3X, 3Y. In this way, the galvanometer mirrors 3X, 3Y vibrate at different frequencies for each individual, so the control device 20 vibrates the galvanometer mirrors 3X, 3Y with the natural frequencies of the galvanometer mirrors 3X, 3Y measured in advance. . Thereby, the frequency of vibration and the amount of surface distortion generated during laser processing can be generated in the galvano mirrors 3X and 3Y.

The correction amount calculation unit 23 calculates the frequency of residual vibration during laser processing based on the processing formula in the processing formula memory unit 22 during actual laser processing. Various operations of the galvanometer mirrors 3X and 3Y are specified in the processing formula, so the correction amount calculating unit 23 calculates the frequency of residual vibration during laser processing based on the operations specified in the processing formula. The correction amount calculation unit 23 compares the calculated frequency with the frequency previously stored in the correction amount memory unit 26 during actual laser processing.

The frequency included in the residual vibration information obtained by the correction amount calculation unit 23 during preparation is the first frequency, and the frequency calculated by the correction amount calculation unit 23 using the processing formula during actual laser processing is the second frequency.

When there is a frequency whose difference from the calculated frequency is smaller than the reference value among the frequencies previously stored in the correction amount storage unit 26, the correction amount calculation unit 23 extracts the corresponding frequency from the corresponding information in the correction amount storage unit 26. Corresponding processing position correction amount. The correction amount calculation unit 23 transmits the machining position correction amount to the instruction creation unit 24 .

The instruction creation unit 24 creates instruction information for the XY slide table 8 and the laser oscillator 1 based on the machining formula in the machining formula storage unit 22 . In addition, the instruction creation unit 24 creates instruction information for the galvanometer scanners 5X, 5Y based on the processing formula. In addition, the command creation unit 24 of this embodiment uses the machining position correction amount calculated by the correction amount calculation unit 23 to create a corrected position command for correcting the position commands for the galvanometer scanners 5X, 5Y. The instruction generating unit 24 generates a correction position instruction to offset the positional deviation of the laser light irradiation position caused by surface skew resonance, that is, to irradiate the laser light L1 to a desired laser light irradiation position. The command creation unit 24 creates a position command of command information for the galvanometer scanners 5X and 5Y using the position command and the corrected position command based on the machining formula.

The instruction generating unit 24 transmits the generated instruction information to the output unit 25 . The output unit 25 transmits the transmission information for the galvanometer scanner 5X, 5Y to the galvanometer scanner 5X, 5Y, and transmits the instruction information for the XY slide table 8 and the laser oscillator 1 to the XY slide table 8 and the XY slide table 8 and respectively. Laser Oscillator 1.

Here, the configuration of the galvanometer scanners 5X, 5Y will be described. In addition, the galvanometer scanner 5X has the same configuration as the galvanometer scanner 5Y. Therefore, when the galvanometer scanner is described below, the galvanometer scanner 5Y will be described.

Fig. 3 is a block diagram showing the configuration of a galvanometer scanner included in the laser processing device of the embodiment. The galvanometer scanner 5Y includes a part of the rotor 52 extending from the galvanometer mirror 3Y side. In the galvanometer scanner 5Y, bearings 55 and 57 , a mirror drive unit 56 , and an encoder 58 belonging to an angle detector are disposed on the rotor 52 . The rotor 52 is rotatably supported by bearings 55 and 57 .

The bearing 55 is arranged between the mirror driving unit 56 and the galvanometer mirror 3Y, and the bearing 57 is arranged between the mirror driving unit 56 and the encoder 58 . The rotor 52 expands and contracts in the axial direction as its temperature changes. Therefore, the bearing 55 is not completely fixed to the rotor 52 in the axial direction, but the rotor 52 passes through the bearing 55 when the rotor 52 expands and contracts. On the other hand, the bearing 57 fixes the rotor 52 in the axial direction.

The mirror driving unit 56 rotates the galvanometer mirror 3Y with the cylindrical axis of the rotor 52 as a rotation axis. The mirror driving unit 56 is constituted using, for example, a magnet and a coil, and by passing a current through the coil, torque is generated between it and the magnet. Thereby, the rotor 52 and the galvanometer mirror 3Y rotate and operate.

The encoder 58 is provided with an encoder disk, and uses the encoder disk to detect the galvanometer angle position belonging to the rotation angle of the galvanometer mirror 3Y. The encoder 58 is arranged on the rotation axis of the galvanometer mirror 3Y, and performs the same operation as that of the galvanometer mirror 3Y. The encoder 58 transmits the detected angular position of the galvanometer to the surface skew detection device 10A and the control device 20 .

The surface distortion detection device 10A detects the residual vibration of the galvanometer mirror 3Y based on the galvanometer angular position. The control device 20 controls the operation of the galvanometer mirror 3Y based on the angular position of the galvanometer, and corrects the operation of the galvanometer mirror 3Y based on the residual vibration.

Fig. 4 is a block diagram showing the configuration of a surface distortion detection device included in the laser processing device of the embodiment. The surface skew detection device 10A detects residual vibration in the rotational direction of the galvanometer mirrors 3X, 3Y based on the galvanometer angular position detected by the encoder 58 when the galvanometer scanners 5X, 5Y are positioned. The residual vibration in the rotation direction corresponds to the amount of inclination belonging to the amount of surface skew of the galvano mirrors 3X, 3Y, and changes according to the amount of angular deviation of the galvano mirrors 3X, 3Y. That is, the amount of surface skew of the galvanometer mirrors 3X, 3Y is the amount of angular deviation of the rotation direction of the galvanometer mirrors 3X, 3Y, and the larger the vibration of the galvanometer mirrors 3X, 3Y, the greater the amount of surface skew.

10 A of surface skew amount detection apparatuses have the encoder vibration detection part 15 which belongs to an input part, and the displacement amount calculation part 16. The encoder vibration detection unit 15 is connected to the encoder 58 , receives the angular position of the galvanometer from the encoder 58 , and inputs it to the displacement calculation unit 16 .

The encoder vibration detection unit 15 transmits the angular position of the galvanometer to the displacement calculation unit 16 . The displacement calculation unit 16 calculates the residual vibration indicating the displacement of the galvanometer mirrors 3X, 3Y based on the angular position of the galvanometer. The encoder vibration detection unit 15 calculates the frequency of vibration, the amount of surface skew, etc., as information of residual vibration. The encoder vibration detection unit 15 transmits residual vibration information including the frequency of the residual vibration and the amount of surface distortion to the control device 20 .

The control device 20 uses the value of the residual vibration of the galvanometer mirror 3X, 3Y to make a galvanometer instruction, and transmits it to the galvanometer scanner 5X, 5Y. The galvanometer instruction belongs to the instruction information for the galvanometer scanner 5X, 5Y. . When plane skew resonance occurs, the control device 20 transmits an ammeter command including a correction value to an axis perpendicular to the axis on which plane skew resonance occurs, so as to eliminate the plane skew amount.

When surface skew resonance occurs in the galvanometer mirror 3X, the control device 20 transmits a galvanometer command including a correction value to the galvanometer mirror 3Y perpendicular to the rotation axis of the galvanometer mirror 3X. Similarly, when plane skew resonance occurs in the galvanometer mirror 3Y, the control device 20 transmits a galvanometer command including a correction value to the galvanometer mirror 3X perpendicular to the rotation axis of the galvanometer mirror 3Y.

The control device 20 is capable of reflecting the plane skew resonance phenomenon in real time (real time) to the given positioning servo control mode, and correcting by adding or subtracting the detected plane skew amount to the detected angle of the orthogonal axis, In this way, the position deviation caused by the plane skew is eliminated. Thereby, the control device 20 can immediately eliminate the plane skew resonance after the movement to the target position. The elimination of surface skew may add or subtract a correction amount to the command position or detection position according to the setting of the positive and negative directions of the rotation axis, the arrangement of the rotation axes, the setting of the X-axis direction, or the setting of the Y-axis direction. Therefore, regarding the correction calculation, a sign is set in advance to the control device 20 so that the cancellation mechanism is appropriately activated.

Here, the plane skew resonance phenomenon will be described. Fig. 5 is a diagram for explaining the plane skew resonance phenomenon. In addition, illustration of the mirror driving unit 56 and the encoder 58 is omitted in FIG. 5 . The plane skew resonance phenomenon is a phenomenon in which the galvanometer mirror 3Y wobbles in a direction substantially perpendicular to the mirror surface. For example, in the case of the galvanometer mirror 3Y, since the bearing 57 fixes the rotor 52 in the axial direction, a surface skew resonance phenomenon occurs on the galvanometer mirror 3Y side closer to the end of the bearing 57 . The plane skew resonance phenomenon is a phenomenon in which the rotor 52 and the galvanometer mirror 3Y are bent with the bearing 57 as a fixed part, thereby changing the mirror surface angle of the galvanometer mirror 3Y to deviate the advancing direction of the deflected laser light L0.

When the galvanometer scanner 5Y repeatedly moves the machining position at equal pitches in the same direction, plane skew resonance of the rotor 52 and the galvanometer mirror 3Y occurs in a certain movement cycle. In other words, when the machining position is moved in the same direction at equal pitches, plane skew resonance occurs when the movement period is close to the reciprocal of the plane skew resonance frequency of the rotor 52 including the galvanometer mirror 3Y.

The plane skew resonance is a natural vibration of the mechanical bending of the rotor 52 including the galvanometer mirror 3Y. When the galvanometer moves at equal pitches, acceleration and deceleration of the rotation of the galvanometer mirror 3Y periodically occur. If there is an unbalanced weight between the center of the rotation movement and the galvanometer mirror 3Y and the rotor 52, the phenomenon of centrifugal rotation of the shaft will occur, and the acceleration of the rotation will be converted into the bending force of the shaft. This bending force becomes an excitation force, and when its period is close to the period of the plane skew resonance frequency, the plane skew vibration gradually increases, and a large positional deviation occurs at the laser light irradiation position at the processing point. Positional deviation due to plane skew resonance appears, for example, in a direction perpendicular to the traveling direction of the processing position.

Therefore, when plane skew resonance occurs in the galvano mirror 3X that is positioned in the X direction, the machining position deviates in the Y direction. Similarly, when plane skew resonance occurs in the galvanometer mirror 3Y positioned in the Y direction, the processing position deviates in the X direction.

During plane skew resonance, the rotor 52 and the galvanometer mirror 3Y swing in a direction substantially perpendicular to the mirror surface of the galvanometer mirror 3Y with the bearings 55 and 57 as fixed positions. Therefore, the reflection angle of the laser light L0 on the galvanometer mirror 3Y deviates from the desired reflection angle by a predetermined amount. The amount of deviation from the desired reflection angle corresponds to the amount of angular deviation in the rotation direction of the galvanometer mirror 3Y. That is, the amount of deviation from the desired reflection angle corresponds to the amount of surface distortion of the galvano mirror 3Y.

For example, in a state where the rotor 52 and the galvanometer mirror 3Y are most greatly bent toward the back side of the galvanometer mirror 3Y, the laser light L0 is reflected so as to deviate in the X direction by a reflection angle (+θ1), and becomes laser light L2 . On the other hand, in the state where the rotor 52 and the galvanometer mirror 3Y are most greatly bent toward the front side of the galvanometer mirror 3Y, the laser beam L0 is reflected in a manner deviated from the reflection angle (-θ1) in the X direction and becomes a laser beam. Shoot light L3.

In other words, if the rotor 52 and the galvanometer mirror 3Y bend due to surface skew resonance, a deviation corresponding to the bending amount will occur in the reflection angle of the laser light L0 relative to the X direction. In addition, in the state where the rotor 52 and the galvanometer mirror 3Y are most greatly bent, the deviation amount of the reflection angle in the X direction of the laser light L0 is also the largest.

In this embodiment, the encoder 58 detects the angular position of the galvanometer, and the angular position of the galvanometer belongs to the amount of deviation of the reflection angle of the laser light L0 in the X direction and the Y direction. Then, the control device 20 calculates the amount of surface skew in the X direction and the Y direction from the angular position of the galvanometer, and corrects the positional deviation of the laser light irradiation position (positional deviation of the processing position) based on the calculated surface deviation.

FIG. 6 is a diagram showing the hardware configuration of the control device included in the laser processing device of the embodiment. The overall configuration of the control system of the laser processing apparatus 101 is shown in FIG. 6 . The control device 20 includes a processing machine control unit 88 , ammeter control units 90X, 90Y, and a drive control unit 92 . The processing machine control section 88 controls the galvanometer control sections 90X, 90Y, the drive control section 92, and the laser oscillation according to the surface skew amounts of the galvanometer scanners 5X, 5Y transmitted from the processing formula or the surface skew amount detection device 10A. Device 1 transmits instruction information.

The processing machine control unit 88 transmits a position command in the X direction to the galvanometer control unit 90X, and transmits a position command in the Y direction to the galvanometer control unit 90Y. Specifically, the processing machine control unit 88 transmits a command for the positioning target coordinates of the galvanometer scanners 5X and 5Y to the galvanometer control units 90X and 90Y.

In the present embodiment, when the galvanometer mirror 3X undergoes surface skew resonance, the irradiation position of the laser light L1 deviates in the Y direction, so a position command including a processing position correction amount is sent to the galvanometer control unit 90Y. In addition, when the plane skew resonance occurs in the galvanometer mirror 3Y, the irradiation position of the laser light L1 deviates in the X direction, so a position command including a machining position correction amount is sent to the galvanometer control unit 90X.

The galvanometer control unit 90X controls the galvanometer scanner 5X based on instruction information from the processing machine control unit 88 . In addition, the galvanometer control unit 90Y controls the galvanometer scanner 5Y based on instruction information from the processing machine control unit 88 . Specifically, the galvanometer control units 90X and 90Y perform positioning servo operations on the galvanometer scanners 5X and 5Y, respectively. And, the galvanometer scanners 5X, 5Y rotate the galvanometer mirrors 3X, 3Y by a predetermined angle around the rotor 52 as a rotation axis, respectively.

In addition, the processing machine control unit 88 instructs the laser oscillator 1 on conditions and timing for irradiating laser pulses with a desired laser output and pulse width. In this way, the laser oscillator 1 can emit laser pulses at the timing required for processing.

In addition, as shown in FIG. 1 , the laser processing apparatus 101 includes the XY slide 8 for placing the workpiece W, and the control device 20 includes the drive control unit 92 that controls the positioning drive of the XY slide 8 . The drive control unit 92 drives and controls the servo motors 93X and 93Y to drive and control the positioning of the XY slide table 8 in the X-Y direction. Thereby, the motors M94 and M95 are operated to move the XY slide table 8 in the X-Y direction. In addition, the drive control unit 92 performs positioning drive control on the vertical height direction (Z direction) of the fθ lens 6 and the vertical height direction of the Z-axis head part on which the galvanometer scanner 5X, 5Y is mounted. Specifically, the drive control unit 92 controls the drive of the servo amplifier 93Z. Thereby, the motor M96 is operated, and the fθ lens 6 and the Z-axis head portion are moved in the Z direction.

Here, an ammeter control system of a comparative example will be described. If the galvanometer control system of the comparative example is a galvanometer scanner in the X-axis direction, feedback control is performed using a signal from a sensor (for example, a rotary encoder) that detects the rotation angle of the X-axis. In addition, in order to perform positioning at high speed, the galvanometer control system of the comparative example assumes a model of the controlled object in advance, and executes the positioning operation using feedforward control.

However, in the galvanometer control system of the comparative example, information other than the sensor that detects the rotation is not used, and there is no structure for suppressing the surface distortion that occurs in the X-axis direction and the Y-axis direction. In this embodiment, the laser processing device 101 calculates the amount of deviation of the processing position from the detected amount of surface skew to correct the surface skew. And the laser processing apparatus 101 performs correction by adding the position command of the galvanometer scanner 5X with respect to the orthogonal axis, and the deviation amount of a processing position. Therefore, the laser processing apparatus 101 is configured in advance so as to correct mutual position commands so that each of the X direction and the Y direction cancels the mutual surface distortion in the same manner. In this way, the laser processing device 101 can eliminate the surface distortion Δy of the galvanometer mirror 3Y that occurs at the position used to control the X-axis direction by the galvanometer mirror 3Y in the Y-axis direction, and can use the galvanometer mirror 3Y in the X-axis direction The galvanometer mirror 3X cancels the irradiation position deviation amount Δx corresponding to the surface distortion amount of the galvanometer mirror 3Y occurring in the Y-axis direction. Therefore, even if the surface distortion occurs, the laser processing device 101 can deflect the laser light L0 toward a desired target position, and high-precision laser processing can be performed.

As the operating speed of the galvanometer scanner or the galvanometer mirror increases, the angular acceleration tends to increase and the excitation force in the oblique direction of the surface tends to increase. Furthermore, even with the same mechanical configuration, the amount of surface deflection increases, making it difficult to balance the processing speed and processing precision desired by users. In this embodiment, even if the surface skew resonance occurs due to the acceleration of the machining speed, the position commands for the galvanometer mirrors 3X and 3Y will be corrected according to the amount of surface skew, so the machining speed and machining precision can be taken into account. Spend.

In addition, since the laser processing device 101 calculates the amount of surface deflection in the rotation direction of the galvanometer mirrors 3X and 3Y based on the galvanometer angular position detected by the encoder 58, it is possible to easily detect the galvanometer mirrors 3X and 3Y with a simple configuration. The plane skew of mirror 3X, 3Y.

In addition, the laser processing device 101 detects the surface deflection of the galvanometer mirrors 3X, 3Y in the rotation direction without using components whose characteristics tend to change over time, and corrects the distortion of the galvanometer mirrors 3X, 3Y based on the detection results. Therefore, it is possible to stably reduce the surface deflection of the galvanometer mirrors 3X and 3Y.

There is a method of statically correcting the amount of surface skew as the temperature increases. In this method, it is not possible to dynamically correct the amount of surface skew that varies depending on the operation of the galvano mirrors 3X and 3Y. On the other hand, the laser processing apparatus 101 corrects the amount of surface distortion when the difference between the natural frequencies of the galvanometer mirrors 3X, 3Y memorized in advance and the frequencies calculated from the processing formula is smaller than the reference value. Thereby, the laser processing device 101 can dynamically correct the amount of surface distortion that changes according to the movement of the galvano mirrors 3X and 3Y.

Here, the hardware structure of 10 A of surface distortion detection apparatuses is demonstrated. Fig. 7 is a diagram showing an example of the hardware configuration of the surface skew amount detecting device of the embodiment.

The surface skew detection device 10A can be realized by the input device 300 , the processor 100 , the memory 200 , and the output device 400 . Examples of the processor 100 are: CPU (also known as: Central Processing Unit, central processing device, processing device, calculation device, microprocessor, microcomputer, DSP (Digital Signal Processor, digital signal processor)) or system LSI (Large Scale Integration, large integrated circuits). Examples of the memory 200 are: RAM (Random Access Memory, random access memory), ROM (Read Only Memory, read only memory).

The surface skew detection device 10A is realized by reading and executing the surface skew detection program by the processor 100. The surface skew detection program can be executed by executing the surface skew detection device 10A stored in the memory 200. The computer performs the action. The surface deflection detection program belonging to the program for executing the operation of the surface deflection detection device 10A can also be referred to as one that causes a computer to execute the steps or methods of the surface deflection detection device 10A.

The surface deflection detection program executed by the surface deflection detection device 10A is constituted as a module including the encoder vibration detection part 15 and the displacement calculation part 16, and the above-mentioned parts are loaded into the main memory device, and used The above-mentioned parts are created on the main storage device.

The input device 300 receives the angular position of the galvanometer and transmits it to the processor 100 . The memory 200 is a temporary memory used when the processor 100 executes various processes. Moreover, the memory 200 stores: processing formulas, corresponding information, and the like. The output device 400 outputs the residual vibration information to the control device 20 .

The surface skew detection program can also be provided as a computer program product by storing an installable or executable file in a computer-readable storage medium. In addition, the surface skew amount detection program may also be provided to the surface skew amount detection device 10A via a network such as the Internet. In addition, about the function of 10 A of surface distortion detection apparatuses, some may be realized by dedicated hardware, such as a dedicated circuit, and some may be realized by software or firmware. In addition, all the functions of the surface skew amount detection device 10A may be realized by dedicated hardware such as dedicated circuits. In addition, the control device 20 can also be realized with the same hardware configuration as the surface distortion detection device 10A.

In this way, according to the embodiment, the surface skew detection device 10A calculates the residual vibration associated with the surface skew of the rotation direction of the galvanometer mirrors 3X, 3Y based on the angular position of the galvanometer received from the encoder 58, so it can be used With a simple structure, it is easy to detect the correct amount of surface distortion of the galvanometer mirrors 3X and 3Y.

In addition, the control device 20 memorizes corresponding information before the actual laser processing starts, and the corresponding information is formed by establishing a correspondence between the first frequency belonging to the natural frequency of the vibration of the galvanometer mirror 3X, 3Y and the correction amount of the surface skew. By. In addition, during actual laser processing, the control device 20 calculates the second frequency belonging to the natural frequency of the vibration of the galvano mirrors 3X and 3Y based on the processing equation. In actual laser processing, when the difference between the first frequency and the second frequency is smaller than the reference value, the control device 20 extracts the correction amount corresponding to the first frequency from the corresponding information, and uses the correction amount to Corrected the instructions to rotate the galvanometer mirror 3X, 3Y. Thereby, the control device 20 can stably reduce the amount of surface distortion of the galvano mirrors 3X, 3Y.

The configuration shown in the above embodiments is an example, and it may be combined with other known techniques, and a part of the configuration may be omitted or changed within the range not departing from the gist.

1:Laser oscillator 2: Image transfer optical mechanism 2C: Collimating lens 2M: mask 3X, 3Y: galvanometer mirror 4:Laser processing department 5X,5Y: Galvanometer Scanner 6: fθ lens 8:XY sliding table 10A: Surface skew detection device 15: Encoder vibration detection unit 16: Displacement Calculation Unit 20: Control device 21: Input part 22: Processing program memory 23: Correction amount calculation part 24: Instruction making department 25: output part 26: Correction amount memory 52: rotor 55,57: Bearing 56:Mirror drive unit 58: Encoder 88: Processing machine control department 90X, 90Y: ammeter control part 92:Drive control department 93X, 93Y: servo motor 93Z: Servo amplifier 100: Processor 101:Laser processing device 200: memory 300: input device 400: output device L0 to L3: laser light M94, M95, M96: motor W: processed object +θ1,-θ1: reflection angle

Fig. 1 is a diagram showing the configuration of a laser processing device of an embodiment. FIG. 2 is a block diagram showing the configuration of a control device included in the laser processing device of the embodiment. Fig. 3 is a block diagram showing the configuration of a galvanometer scanner included in the laser processing device of the embodiment. Fig. 4 is a block diagram showing the configuration of a surface distortion detection device included in the laser processing device of the embodiment. Fig. 5 is a diagram for explaining the plane skew resonance phenomenon. FIG. 6 is a diagram showing the hardware configuration of the control device included in the laser processing device of the embodiment. Fig. 7 is a diagram showing an example of the hardware configuration of the surface skew amount detecting device of the embodiment.

10A: Surface skew detection device

15: Encoder vibration detection part

16: Displacement Calculation Unit

20: Control device

58:Encoder

Claims (5)

A surface deflection detection device comprising: an input unit that receives a galvanometer angle position indicating the rotation angle of the galvanometer mirror from an encoder disposed on the rotation axis of the galvanometer mirror, and the galvanometer mirror emits laser light Deviation towards the processing position; and the displacement amount calculation part, which calculates the residual vibration based on the angular position of the aforementioned galvanometer, and the residual vibration is related to the surface skew amount belonging to the angular deviation of the rotation direction of the aforementioned galvanometer mirror; the aforementioned residual vibration Vibration in a state where the rotation of the galvanometer mirror is stopped after the rotation of the galvanometer mirror. The surface deflection detection device according to claim 1, wherein the residual vibration includes: information on the surface deflection and natural frequency information of the vibration of the galvanometer mirror. A control device comprising: an input unit that receives, as residual vibration information, information of residual vibration that is correlated with a surface skew amount that is an angular deviation amount of a rotation direction of a galvanometer mirror, the galvanometer mirror being used The laser light is deflected toward the processing position; the correction amount calculation part is used to calculate the correction amount used for the correction of the aforementioned surface skew; the correction amount memory part is used to memorize in advance the corresponding information that establishes the corresponding relationship between the first frequency and the aforementioned correction amount , the first frequency belongs to the natural frequency of the vibration of the aforementioned galvanometer mirror contained in the aforementioned residual vibration information; the processing formula memory part is to memorize the processing formula used for laser processing in advance; the instruction making part is to make the aforementioned galvanometer mirror Rotating galvanometer scanner to generate instruction information based on the aforementioned processing formula; and The output part is to output the aforementioned instruction information to the aforementioned galvanometer scanner; the aforementioned correction amount calculation part is to calculate the aforementioned correction amount in advance during the preparation work before the actual laser processing starts, and during the actual laser processing, according to The aforementioned processing formula calculates the second frequency belonging to the natural frequency of the vibration of the aforementioned galvanometer mirror, and when the difference between the aforementioned second frequency and the aforementioned first frequency is smaller than the reference value, the corresponding information corresponding to the aforementioned first frequency is extracted from the aforementioned corresponding information. The corresponding correction amount is sent to the instruction creation part; the instruction creation part uses the correction amount transmitted from the correction amount calculation part to correct the instruction information. A laser processing device, comprising: a galvanometer mirror, which deflects laser light toward a processing position; a galvanometer scanner, which rotates the galvanometer mirror; an encoder, which is arranged on the rotating shaft of the galvanometer mirror, And detect the angular position of the galvanometer showing the rotation angle of the aforementioned galvanometer mirror; the surface skew detection device calculates the residual vibration based on the angular position of the aforementioned galvanometer, and the residual vibration deviates from the angle belonging to the rotation direction of the aforementioned galvanometer mirror and the control device is used to control the aforementioned galvanometer scanner according to the aforementioned residual vibration, thereby correcting the aforementioned surface skew; the aforementioned control device is equipped with: an input unit that receives the information of the aforementioned residual vibration as Residual vibration information; the correction amount calculation unit is used to calculate the correction amount used for the correction of the aforementioned surface deflection contained in the aforementioned residual vibration information; The correction amount memory part is to memorize in advance the corresponding information formed by establishing a corresponding relationship between the first frequency and the aforementioned correction amount. The first frequency belongs to the natural frequency of the vibration of the aforementioned galvanometer mirror contained in the aforementioned residual vibration information; the processing formula memory The part is to memorize the processing formula used for laser processing in advance; the instruction creation part is to make the instruction information according to the aforementioned processing formula for the aforementioned galvanometer scanner; and the output part is to output the aforementioned instruction information to the aforementioned galvanometer Scanner; the aforementioned correction amount calculation unit calculates the aforementioned correction amount in advance during the preparatory work before the actual laser processing starts, and during the actual laser processing, calculates the natural frequency belonging to the aforementioned galvanometer mirror vibration according to the aforementioned processing formula and if the difference between the second frequency and the first frequency is smaller than the reference value, the correction amount corresponding to the first frequency is extracted from the corresponding information and sent to the instruction creation unit; The instruction creation part corrects the instruction information using the correction amount sent from the correction amount calculation part. The laser processing device according to claim 4, wherein, during the preparatory work, the control device excites the vibration of the galvanometer scanner so that the galvanometer mirror vibrates according to the natural frequency of the galvanometer mirror , thereby causing the surface distortion of the aforementioned galvanometer mirror, the natural frequency of which is measured in advance during the manufacture of the aforementioned galvanometer mirror; the aforementioned encoder detects the angular position of the aforementioned galvanometer for the aforementioned surface distortion generated by the aforementioned control device .

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