TWI796562B - Sputtering target and method for manufacturing sputtering target - Google Patents

Abstract

Subject of this invention is to suppress peeling of shielding member. In a sputtering target according to this invention, a target body has a plurality of cylindrical target members that surround outer circumference surface of a cylindrical backing tube, each of the plurality of target members is disposed to be separated from each other in central axis direction of the backing tube, and the plurality of target members are disposed side by side in the central axis direction so that a clearance formed between adjacent target members orbits around the central axis of the backing tube, and a recess connecting with the clearance is formed on the backing tube side. A joining material is disposed between the backing tube and the target body, and joins the backing tube and each of the plurality of target members. A shielding member is disposed between the joining material and the target body, is housed in the recess, and shields the clearance from the joining material side.

Description

Sputtering target and manufacturing method of sputtering target

The invention relates to a sputtering target and a manufacturing method of the sputtering target.

Along with the enlargement of the screen of a thin TV, the size of the sputtering target used at the time of manufacture of a flat panel display (flat panel display) is advancing. Accompanied by this, a large-area oxide target has emerged. In particular, a film-forming device equipped with a long cylindrical oxide target is being developed. In order to obtain a long cylindrical oxide target, a method of joining a plurality of cylindrical oxide sintered bodies (sintered oxide) and a cylindrical backing tube with a bonding material is provided.

However, when the sputtering target is constituted by a plurality of target members, adjacent target members may come into contact with each other due to thermal expansion of the target members, and the target members may be broken. In order to prevent breakage due to this contact, a gap may be provided between adjacent target members (for example, refer to Patent Document 1).

However, if a void is provided, the bonding material may penetrate into the void, and the bottom tube may be exposed in the void, and components other than the target material may adhere to the void. If such a phenomenon occurs, components other than the target material will be mixed into the coating film, and the properties of the coating film will deteriorate. Also, it becomes a factor of abnormal discharge in the film forming step.

In order to cope with this problem, for example, the following countermeasures are taken in planar split sputtering targets: a shielding member is attached to the gap between adjacent target members from the backing plate side to prevent bonding. The material penetrates into the gap, and the bottom plate is exposed to the gap (for example, refer to Patent Document 2). [Prior Art Literature] [Patent Document]

[Patent Document 1] Japanese Patent Laid-Open No. 2015-168832. [Patent Document 2] Japanese Patent No. 4961514.

[Problem to be Solved by the Invention]

However, in the planar sputtering target, the general bonding method is to make the target member and the bottom plate face each other through the bonding material and then stick each other to bond. However, in the cylindrical sputtering target There are cases in which a joint material is injected between the target member and the bottom pipe to join the target member and the bottom pipe. Therefore, when manufacturing a cylindrical sputtering target, it becomes important how to suppress peeling of a shielding member at the time of injection|pouring of a bonding material.

In view of the above-mentioned situation, the object of this invention is to provide the manufacturing method of the sputtering target and the sputtering target which suppressed peeling of a shielding member. [Means to solve the problem]

In order to achieve the said object, the sputtering target of one aspect of this invention is provided with the cylindrical bottom pipe, a target main body, a bonding material, and a shielding member. The above-mentioned target system has a plurality of cylindrical target members which surround the outer peripheral surface of the bottom pipe. A plurality of target members are arranged side by side in the direction of the central axis, gaps formed between adjacent target members surround the circumference of the central axis of the bottom pipe, and recesses communicating with the gaps are formed on the bottom pipe side. The bonding material is provided between the bottom pipe and the target body, and joins the bottom pipe and each of the plurality of target members. The shielding member is arranged between the bonding material and the target body, is housed in the concave portion, and shields the gap from the bonding material side.

According to such a sputtering target, since a shielding member is accommodated in a recessed part, peeling of a shielding member is suppressed.

In the above-mentioned sputtering target, it is also possible that the above-mentioned adjacent target member is composed of a first target member and a second target member; the first target member has a first end surface opposite to the second target member; The second target member has a second end surface opposite to the first target member; the first target member has a first inner peripheral surface opposite to the bonding material with a first distance from the bottom tube. and the second inner peripheral surface is connected to the above-mentioned first end surface, and is separated from the above-mentioned bottom pipe by a second distance longer than the above-mentioned first distance and opposite to the above-mentioned shielding member; the above-mentioned first target member is A step difference is formed by the first inner peripheral surface and the second inner peripheral surface; the second target member has a third inner peripheral surface that is bonded to the bottom pipe with the first distance between them. and the fourth inner peripheral surface is connected to the above-mentioned second end surface, and is opposite to the above-mentioned shielding member with the above-mentioned second distance from the above-mentioned bottom pipe; the above-mentioned second target member The inner peripheral surface and the fourth inner peripheral surface form a step difference; the second inner peripheral surface and the fourth inner peripheral surface are arranged side by side in the direction of the central axis through the gap, whereby a gap is formed on the target body. the aforementioned recess.

According to such a sputtering target, since a shielding member is accommodated in the recessed part formed in the adjacent target member, peeling of a shielding member is suppressed.

In the said sputtering target, the distance between the said shielding member and the said bottom pipe may be longer than the said 1st distance.

According to such a sputtering target, since the shielding member is housed in the recess so that the distance between the shielding member and the bottom pipe becomes longer than the first distance, peeling of the shielding member is suppressed.

In the above-mentioned sputtering target, the above-mentioned target main bodies may be arranged in a row in the direction of the above-mentioned central axis of the above-mentioned bottom pipe, and a plurality of pieces may be arranged side by side.

According to such a sputtering target, a long sputtering target can be obtained easily.

In the above-mentioned sputtering target, each of the plurality of target members may be constituted by a sintered body of an oxide.

According to such a sputtering target, even if each of the plurality of target members is constituted by the sintered body of oxide, the intrusion of the bonding material into the gap is suppressed.

In the said sputtering target, the said oxide may have In, Ga, and Zn.

According to such a sputtering target, since the sintered body contains In, Ga, and Zn, a stable oxide semiconductor film is formed.

In order to achieve the said objective, in the manufacturing method of the sputtering target which concerns on one aspect of this invention, a cylindrical 1st target member and a cylindrical 2nd target member are arrange|positioned so that it may space|interval in each center axis direction. A gap formed by juxtaposing the first target member and the second target member is formed, and a recess communicating with the gap is formed inside each of the first target member and the second target member. A shielding member is accommodated in the concave portion, and the gap is shielded from insides of the first target member and the second target member by the shielding member. The outer peripheral surface of the bottom pipe is surrounded by the first target member and the second target member; after the molten bonding material is filled between the first target member and the bottom pipe, the molten bonding material Between the above-mentioned shielding member and the above-mentioned bottom pipe, it is filled between the above-mentioned second target member and the above-mentioned bottom pipe; The member is joined to the bottom pipe, and the target body having the first target member and the second target member is formed around the bottom pipe.

According to the manufacturing method of such a sputtering target, since a shielding member is accommodated in the recessed part formed in the adjacent target member, peeling of a shielding member is suppressed. [Efficacy of the invention]

As described above, according to the present invention, there are provided a sputtering target in which peeling of a shielding member is suppressed, and a method for manufacturing a sputtering target.

Hereinafter, embodiments of the present invention will be described with reference to the drawings. There are cases where XYZ axis coordinates are imported into each drawing. In addition, the same reference numerals may be attached to the same members or members having the same functions, and descriptions may be appropriately omitted after describing the members.

(a) in FIG. 1 is a schematic perspective view which shows the sputtering target of this embodiment. (b) in FIG. 1 is a schematic cross-sectional view which shows the sputtering target of this embodiment. (b) in FIG. 1 shows the X-Y axis section along the A1-A2 line in (a) in FIG. 1 .

The sputtering target 1 shown in (a) and (b) of FIG. 1 is a cylindrical target assembly (target assembly) for sputtering film formation. The sputtering target 1 includes a bottom tube 10 , a target body 20 , a bonding material 30 , and a shielding member 40 .

The bottom pipe 10 is a cylindrical body, and the inside of the bottom pipe 10 is hollow. The bottom pipe 10 extends in one axial direction (for example, the direction of the central axis 10c). The direction of the central axis 10c is the longitudinal direction of the bottom pipe 10 . Moreover, the bottom tube 10 is the base material of the sputtering target 1, and the central axis 10c is also the central axis of the sputtering target 1 accordingly.

The bottom pipe 10 has: an outer peripheral surface 101 surrounding the central axis 10c; and an inner peripheral surface 102 located on the opposite side of the outer peripheral surface 101 and surrounding the central axis 10c. When the bottom pipe 10 is cut on a plane (for example, an X-Y axis plane) perpendicular to the central axis 10c, the shape of the bottom pipe 10 becomes, for example, a ring shape.

The material of the bottom pipe 10 is a material with excellent thermal conductivity, such as titanium (Ti), copper (Cu) and the like. A flow path through which the refrigerant circulates may be appropriately formed inside the bottom pipe 10 .

The target body 20 surrounds the outer peripheral surface 101 of the bottom tube 10 . The target body 20 is arranged concentrically with respect to the bottom pipe 10 . The target body 20 has a plurality of target components. For example, in the examples of (a) and (b) in FIG. 1 , the target body 20 has a set of target members 20A, 20B. In this embodiment, let the target member 20A be a 1st target member, and let the target member 20B be a 2nd target member.

The target members 20A and 20B are each cylindrical. The target members 20A, 20B surround the bottom pipe 10, respectively. Moreover, the target members 20A and 20B are arranged side by side in the direction of the central axis 10c of the bottom pipe 10 .

When the target members 20A and 20B are respectively cut on the X-Y axis plane, the shape of the target members 20A and 20B is, for example, a ring shape. For example, the cross-sectional shapes of the target members 20A and 20B on the X-Y axis plane are the same shape. In addition, the respective lengths of the target members 20A and 20B in the Z-axis direction are the same.

The respective target members 20A, 20B are arranged side by side so as not to contact each other in the direction of the central axis 10c of the bottom pipe 10 and spaced apart from each other without contacting each other. In other words, the target body 20 has a divided structure divided in a direction along the central axis 10c.

A gap (divided portion) 201 is formed between the target member 20A and the target member 20B adjacent in the direction of the central axis 10c. The gap 201 is around the central axis 10c of the bottom pipe 10 . The gap 201 is located at the center of the recess 204 in the direction of the central axis 10c. The width in the direction of the central axis 10c of the gap 201 is not particularly limited, and is set to such an extent that the target members 20A, 20B do not come into contact with each other due to thermal expansion, for example. For example, the width of the gap 201 is not less than 0.1 mm and not more than 0.5 mm.

The target members 20A and 20B are made of the same material, for example, a sintered body of an oxide. As an example, the sintering system has In and Zn. For example, the sintering system is composed of In-Ga-Zn-O (IGZO). For example, the sintered body may be an In-Ti-Zn-Sn-O (ITZTO) sintered body, an In-Ti-Zn-Sn-O (IGTO) sintered body, or the like.

The bonding material 30 is sandwiched between the bottom tube 10 and the target body 20 . The bonding material 30 is in close contact with the bottom pipe 10 and the target body 20 . The joining material 30 joins each of the bottom pipe 10 and the plurality of target members 20A, 20B. The bonding material 30 includes, for example, indium (In), tin (Sn), solder, and the like.

The shielding member 40 is disposed between the bonding material 30 and the target body 20 . The shielding member 40 is located between the gap 201 and the bonding material 30 . The shielding member 40 shields the gap 201 from the bonding material 30 side.

A structure in which the shielding member 40 is attached to the target body 20 will be described in detail. (a) and (b) in FIG. 2 are schematic cross-sectional views showing a shielding member provided between the target body and the bonding material.

The shielding member 40 may be the shielding member 40A shown in FIG. 2( a ), or the shielding member 40B shown in FIG. 2( b ).

As shown in (a) of FIG. 2 , a concave portion 204 communicating with the gap 201 on the side of the bottom pipe 10 is formed on the target body 20 .

For example, the target member 20A has an end surface 202 (first end surface) facing the target member 20B, and the target member 20B has an end surface 203 (second end surface) facing the target member 20A.

The target member 20A has: an inner peripheral surface 205 (first inner peripheral surface) constituting most of the inner peripheral surface of the target member 20A; and an inner peripheral surface 206 (second inner peripheral surface) connected to the end surface 202. . The inner peripheral surface 205 faces the bottom pipe 10 with a distance A (first distance) interposed therebetween via the bonding material 30 . The inner peripheral surface 206 faces the shielding member 40A across a distance B (second distance) longer than the distance A from the bottom pipe 10 . A level difference is formed by the inner peripheral surface 205 and the inner peripheral surface 206 on the inner peripheral surface of the target member 20A.

The target member 20B has: an inner peripheral surface 207 (third inner peripheral surface) constituting most of the inner peripheral surface of the target member 20B; and an inner peripheral surface 208 (fourth inner peripheral surface) connected to the end surface 203. . The inner peripheral surface 207 faces the bonding material 30 at a distance A from the bottom pipe 10 . The inner peripheral surface 208 faces the shielding member 40A across a distance B from the bottom pipe 10 . On the inner peripheral surface of the target member 20B, a level difference is formed by the inner peripheral surface 207 and the inner peripheral surface 208 .

The inner peripheral surface 206 and the inner peripheral surface 208 are arranged side by side in the direction of the central axis 10c with the gap 201 interposed therebetween, whereby the concave portion 204 is formed on the bottom pipe 10 side of the target body 20 . The recess 204 surrounds the periphery of the central axis 10c. In addition, the inner peripheral surface 206 may be provided at both ends of the target member 20A, and the inner peripheral surface 208 may be provided at both ends of the target member 20B.

The shielding member 40A is housed in the concave portion 204 and shields the gap 201 from the side of the bonding material 30 . Also, the distance between the shielding member 40A and the bottom pipe 10 is longer than the distance A. As shown in FIG. That is, the shielding member 40A is accommodated in the recessed part 204 without protruding from the recessed part 204 .

The shielding member 40A has: an adhesive sheet 401 having adhesiveness; and a resin sheet 402 having plasma resistance. The resin sheet 402 is provided between the target members 20A, 20B and the adhesive sheet 401 . The resin sheet 402 is a shielding base material of the shielding member 40A. The adhesive sheet 401 is a sticker of the shielding member 40A.

The resin sheet 402 straddles the gap 201 , and a part of the resin sheet 402 is exposed in the gap 201 . The resin sheet 402 is pasted on the target members 20A and 20B from the side of the bonding material 30 through the adhesive sheet 401 . The respective materials of the adhesive sheet 401 and the resin sheet 402 include, for example, polyimide, fluororesin, silicone resin, and the like.

On the other hand, the shielding member 40B shown in (b) in FIG. 2 has an adhesive sheet 401 , a metal sheet 403 , and an oxide layer 404 . The shielding member 40B has a laminated structure in which the adhesive sheet 401 /metal sheet 403 /oxide layer 404 are arranged in order from the bonding material 30 toward the target members 20A, 20B. In the shielding member 40B, the metal sheet 403 functions as an intermediate layer that joins the adhesive sheet 401 and the oxide layer 404 and relaxes respective stresses, and the oxide layer 404 functions as a shielding base material.

The oxide layer 404 straddles the gap 201 , and a part of the oxide layer 404 is exposed in the gap 201 . Further, the oxide layer 404 is pasted on the target members 20A and 20B from the side of the bonding material 30 through the adhesive sheet 401 via the metal sheet 403 .

The metal sheet 403 includes, for example, titanium (Ti). The oxide layer 404 is made of the same material as the target members 20A, 20B. Thereby, even if the shielding member 40B is exposed to plasma during sputtering, components other than the components of the target body 20 are less likely to be mixed in the coating film.

The length of the distance B is appropriately set as the distance B' (B'>B) in accordance with the thickness of the shielding member 40B. In addition, after the bonding material 30 is filled between the base pipe 10 and the target body 20 , the bonding material 30 is also injected into a part of the concave portion 204 .

The manufacturing method of the sputtering target 1 is demonstrated.

First, the target member 20A and the target member 20B are arranged in a straight line so as to be spaced apart from each other in the central axis direction. At this time, the gap 201 is formed by arranging the target member 20A and the target member 20B, and the recess 204 communicating with the gap 201 is formed in each of the target member 20A and the target member 20B.

Next, as shown in (a) and (b) in FIG. The respective insides of the members 20B are shielded. Thereby, the target main body 20 in which the target member 20A and the target member 20B are connected by the shield member 40 is formed.

Next, the molten bonding material 30 is filled from below the bottom tube 10 between the bottom tube 10 and the target body 20 in a state where the bottom tube 10 is erected. Filling using a pressure (gravity) difference, press-fitting, and the like are used for filling the joining material 30 .

(a) and (b) in FIG. 3 are schematic diagrams showing how the bonding material is filled between the target body and the bottom pipe.

As shown in (a) of FIG. 3 , the outer peripheral surface 101 of the bottom tube 10 is surrounded by the target body 20 . Then, in the target main body 20 , the bonding material 30 is injected between the target member 20A and the base pipe 10 . Even if the bonding material 30 is continuously injected and the bonding material 30 reaches the position of the shielding member 40 , since the gap 201 is covered by the shielding member 40 , the bonding material 30 is not easy to leak from the side of the bottom pipe 10 to the gap 201 .

Furthermore, since the shielding member 40 is housed in the concave portion 204 , the space between the shielding member 40 and the bottom pipe 10 is ensured for the bonding material 30 . Thereby, the bonding material 30 is less likely to be loaded by the shielding member 40, and as shown in FIG. 3(b), the bonding material 30 is also filled between the base pipe 10 and the target member 20B.

After that, the bonding material 30 is solidified, the bottom pipe 10 and the target member 20A are bonded by the bonding material 30 , and the bottom pipe 10 and the target member 20B are bonded by the bonding material 30 . Thereby, the target body 20 is formed around the bottom pipe 10 . After that, finishing processing for adjusting the surface roughness of the target members 20A, 20B is applied as required.

An example of the effect when using the sputtering target 1 is demonstrated.

In the sputtering target 1 , the gap 201 between the target members 20A, 20B is shielded by the shield member 40 from the bottom tube 10 side.

Thereby, the gap 201 is reliably shielded from the side of the bottom pipe 10 by the shielding member 40 . As a result, it becomes difficult for the bonding material 30 to be inserted into the gap 201, and the components of the bonding material 30 and the bottom pipe 10 are less likely to be mixed into the coating film. Also, the base pipe 10 is not exposed in the gap 201 , and components (foreign matter) other than the components of the target member are less likely to be released from the gap 201 .

By accommodating the shielding member 40 in the concave portion 204 , the space between the shielding member 40 and the bottom pipe 10 is reliably ensured at the time of filling the bonding material 30 . Thereby, the melted bonding material 30 spreads completely between the base pipe 10 and the target member 20A and between the base pipe 10 and the target member 20B without being loaded by the shield member 40 .

In addition, the shielding member 40 is less likely to receive a load from the bonding material 30 when the bonding material 30 is filled, and the shielding member 40 is less likely to be peeled off from the target body 20 . Furthermore, since the shielding member 40 is housed in the concave portion 204 , positional displacement of the shielding member 40 is less likely to occur during filling of the bonding material 30 . Thereby, the gap 201 is surely shielded by the shielding member 40 .

(Modification)

FIG. 4 is a schematic perspective view showing a modified example of the sputtering target according to the present embodiment.

In the sputtering target 2, the target main bodies 20 are arranged in a row in the direction of the central axis 10c of the bottom tube 10, and are arranged side by side. The concave portion 204 is not limited to one set of target members 20A, 20B and is formed between adjacent target members. The plurality of target bodies 20 are arranged at a distance from each other in the direction of the central axis 10c. The length of the sputtering target 2 which has several target bodies 20 in the direction of the central axis 10c is 2000 mm or more.

According to such a structure, in addition to the effect mentioned above, the length of the sputtering target in the direction of the central axis 10c can be made long easily.

(Example)

As raw materials, In ₂ O ₃ powder with an average primary particle diameter of 1.1 μm, ZnO powder with an average primary particle diameter of 0.5 μm, and Ga ₂ O ₃ with an average primary particle diameter of 1.3 μm were used as oxides. Weighed in such a way that the molar ratio (molar ratio) became 1:2:1. These raw material powders were pulverized/mixed with a wet ball mill. A zirconia ball (zirconia ball) of φ5 mm was used as a pulverization medium. Dry and granulate the pulverized and mixed slurry with a spray dryer (spray dryer) to obtain granulated powder.

A rubber mold made of polyurethane (polyurethane) with a metal mandrel inside is filled with granulated powder, sealed with the granulated powder, and subjected to CIP (Cold Isostatic Pressing; Cold Isostatic Pressing) molding at a pressure of 98 MPa to obtain a round mold. Cylindrical molded body. The obtained molded body was fired at a set temperature of 1500° C. for 10 hours to obtain a cylindrical fired body (target members 20A, 20B). Further, the target member was machined so as to have an outer diameter of 155 mm, an inner diameter of 135 mm, and a length of 260 mm.

As shown in FIG. 2 , recesses 204 are formed in the target members 20A and 20B respectively, and the recesses 204 are formed when the respective end faces of the two target members 20A and 20B face each other. The length of the concave portion 204 (inner peripheral surface 206 or inner peripheral surface 206208 ) formed in one target member in the direction of the central axis 10 c was 10 mm. That is, the length of the concave portion on the central axis 10 c is: twice the length of 10 mm plus the length of the width of the gap 201 . The depth of the recess 204 is 0.5 mm. The inner peripheral surface 206 is formed at both ends of the target member 20A, and the inner peripheral surface 208 is formed at both ends of the target member 20B.

Three sets of target members 20A and 20B (a total of 6 target members) are arranged in a straight line, and a polyimide film (polyimide film) with a thickness of 0.025 mm and a width of 5 mm is pasted in the center. A polyimide film adhesive tape was used as the shielding member 40, and was attached along the circumference from the inside to all the gaps 201.

After inserting the base pipe 10 made of Ti with an outer diameter of 133 mm, an inner diameter of 125 mm, and a length of 1600 mm into the aggregate of cylindrical target members, and aligning the base pipe 10 with the aggregate of target members, Heated and melted In was injected between the assembly of the bottom pipe 10 and the target member. After In was cooled, the respective gaps 201 were observed using a microscope, and it was confirmed that In did not penetrate into the gaps 201 .

As mentioned above, although embodiment of this invention was described, this invention is not limited only to the said embodiment, It goes without saying that various changes can be added. Each embodiment is not limited to an independent form, and can be combined as long as it is technically possible.

1,2: Sputtering target 10: Bottom tube 10c: central axis 20: Target body 20A, 20B: target member 30: Joining material 40, 40A, 40B: shielding components 101: Outer peripheral surface 102: inner peripheral surface 201: Gap (division part) 202: end face (first end face) 203: End face (second end face) 204: concave part 205: inner peripheral surface (first inner peripheral surface) 206: inner peripheral surface (second inner peripheral surface) 207: inner peripheral surface (third inner peripheral surface) 208: inner peripheral surface (fourth inner peripheral surface) 401: Adhesive sheet 402: resin sheet 403: metal sheet 404: oxide layer A,B,B': distance

(a) in [FIG. 1] is a schematic perspective view which shows the sputtering target of this embodiment. (b) in FIG. 1 is a schematic cross-sectional view which shows the sputtering target of this embodiment. [ Fig. 2 ] is a schematic cross-sectional view showing a shielding member provided between the target body and the bonding material. [ Fig. 3 ] is a schematic diagram showing a state in which a bonding material is filled between the target body and the bottom pipe. [FIG. 4] It is a schematic perspective view which shows the modification of the sputtering target of this embodiment.

1: Sputtering target

10: Bottom tube

10c: central axis

20: Target body

20A, 20B: target member

30: Joining material

40: Shielding components

101: Outer peripheral surface

102: inner peripheral surface

201: Gap (division part)

Claims (13)

A sputtering target is provided with: a cylindrical bottom tube; a target body has a plurality of cylindrical target components surrounding the outer peripheral surface of the bottom tube, and the plurality of target components are formed on the bottom tube respectively. The center axis direction of the bottom tube is arranged side by side in a manner spaced apart, and the aforementioned plurality of target members are arranged side by side in the direction of the aforementioned center axis, and the gap formed between adjacent target members surrounds the center axis of the aforementioned bottom tube, and is in line with the aforementioned gap. The concave part communicating with and surrounding the aforementioned central axis is formed inside the aforementioned plurality of target members; the bonding material is provided between the aforementioned bottom tube and the aforementioned target body, and connects the aforementioned bottom tube and each of the aforementioned plurality of target members. bonding; and a shielding member, which is accommodated in the aforementioned recess between the aforementioned bonding material and the aforementioned target body, the two sides of the aforementioned shielding member are respectively bonded to the aforementioned plurality of target members, and the inner side of the aforementioned shielding member is formed from the aforementioned bonding material The side of the shielding member is bonded to the bonding material so as to cover the gap, and the outer side of the shielding member is disposed in the recess in such a manner that it is exposed from the gap but does not protrude from the recess into the gap. The sputtering target according to claim 1, wherein the shielding member has an oxide layer provided on the outside of the shielding member and is made of the same material as the target member. The sputtering target according to claim 2, wherein the shielding member has a laminated structure in which an adhesive sheet, a metal sheet, and the oxide layer are arranged side by side in order from the bonding material toward the adjacent target member; the metal sheet is It has the function of being an intermediate layer that relieves the stress between the adhesive sheet and the oxide layer, and the oxide layer has the function of shielding the base material. The sputtering target as described in claim 1, wherein the adjacent target members are composed of a first target member and a second target member; the first target member has a first target member facing the second target member. The end face; the aforementioned second target member has a second end face opposite to the aforementioned first target member; the aforementioned first target member has: a first inner peripheral surface, which is separated from the aforementioned bottom tube by a first distance and joined to the aforementioned and the second inner peripheral surface is connected to the aforementioned first end surface, and is opposite to the aforementioned shielding member with the aforementioned bottom pipe separated by a second distance longer than the aforementioned first distance; the aforementioned first target The member system has a step difference formed by the aforementioned first inner peripheral surface and the aforementioned second inner peripheral surface; the aforementioned second target member system has: a third inner peripheral surface separated from the aforementioned bottom pipe by the aforementioned first distance. The aforementioned bonding material is opposite; and the fourth inner peripheral surface is connected to the aforementioned second end surface, and is opposed to the aforementioned shielding member with the aforementioned second distance from the aforementioned bottom pipe; the aforementioned second target member is formed by the aforementioned The third inner peripheral surface and the aforementioned fourth inner peripheral surface form a step difference; the aforementioned second inner peripheral surface and the aforementioned fourth inner peripheral surface are arranged side by side in the direction of the aforementioned central axis through the aforementioned gap, whereby the target body The aforementioned concave portion is formed. The sputtering target according to claim 4, wherein the distance between the shielding member and the bottom tube is longer than the first distance. The sputtering target according to any one of Claims 1 to 5, wherein the target system is arranged in a row in the direction of the central axis of the bottom tube, and a plurality of them are arranged side by side. The sputtering target as described in any one of claims 1 to 5, wherein the plurality of target structures The components are respectively composed of sintered bodies of oxides. The sputtering target as described in claim 6, wherein the plurality of target members are each formed of a sintered body of oxide. The sputtering target according to claim 7, wherein the oxide system contains In, Ga, and Zn. The sputtering target according to claim 8, wherein the oxide system contains In, Ga, and Zn. A method for manufacturing a sputtering target, which is to manufacture a sputtering target having a cylindrical bottom tube, a target body and a bonding material, the aforementioned target system surrounds the aforementioned bottom tube, and the aforementioned bonding material is sandwiched between the aforementioned bottom tube and the aforementioned target between the main body and the aforementioned bottom tube and the aforementioned target body; The gap formed by the side-by-side arrangement of the aforementioned first target member and the aforementioned second target member is formed, and a recess communicating with the aforementioned gap and surrounding the center axis of the aforementioned bottom tube is formed in the aforementioned first target member. Each inner side of a target member and the aforementioned second target member; the shielding member is accommodated in the aforementioned recess, and the aforementioned gap is shielded from the respective inner sides of the aforementioned first target member and the aforementioned second target member by the aforementioned shielding member; A target member and the second target member surround the outer peripheral surface of the bottom pipe; after the molten bonding material is filled between the first target member and the bottom pipe, the molten bonding material is passed through the shield between the member and the aforementioned bottom pipe and fill between the aforementioned second target member and the aforementioned bottom pipe; The bonding material is solidified to join between the first target member and the bottom pipe and between the second target member and the bottom pipe, and to combine the first target member and the second target member The target body is formed around the bottom tube, the shielding member is accommodated in the recess between the bonding material and the target body, and both sides of the shielding member are joined to the plurality of target members respectively, so that the joint The inner side of the shielding member is joined to the bonding material so that the side of the material covers the gap, and the outer side of the shielding member is arranged in the recess so that it is exposed from the gap but does not protrude from the recess into the gap. The method of manufacturing a sputtering target according to claim 11, wherein the shielding member has an oxide layer provided on the outside of the shielding member and is made of the same material as the target member. The method for manufacturing a sputtering target according to claim 12, wherein the shielding member has a laminated structure in which an adhesive sheet, a metal sheet, and the oxide layer are arranged side by side in order from the bonding material toward the adjacent target member; The metal sheet has the function of being an intermediate layer for relieving the stress between the adhesive sheet and the oxide layer, and the oxide layer has the function of shielding the base material.

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