TWI795618B - Inspection device and inspection method - Google Patents

Abstract

The object of the present invention is to intensively inspect the separated plural semiconductor light emitting elements and screen out the semiconductor light emitting elements with poor light emission immediately before mounting, and transport the screened plural semiconductor light emitting elements in a separated and arranged state through the temporary fixing part for mounting. An inspection device comprising: a first board having a first electrode; a second board having a second electrode disposed opposite to the first electrode; an insulating temporary fixing part for separating and arranging a plurality of semiconductor light emitting elements The state is temporarily fixed in a detachable manner; the driving power is electrically connected to the first electrode and the second electrode arranged across the inspection space; the optical instrument is observed from the side of either the first plate or the second plate For the light emission of semiconductor light emitting elements, the temporary fixing part has a temporary fixing part that is detachably mounted on any one of the first electrode or the second electrode, and faces a plurality of semiconductor light emitting elements, and holds a plurality of semiconductor light emitting elements by the temporary fixing part. The light-emitting elements can be transported from the inspection space to the installation position in a separated and arranged state. In the inspection space between the first electrode and the second electrode, a plurality of separately separated light emitting circuit parts are arranged, and the light emitting circuit parts are connected in series including a plurality of semiconductor light emitting elements and a capacitor of a temporary fixing part. Among the plurality of light emitting circuit parts, The plurality of semiconductor light emitting elements emit light when a forward current flows from the driving power source to the plurality of semiconductor light emitting elements.

Description

Inspection device and inspection method

The present invention relates to an inspection device for functional (optical) inspection of a plurality of semiconductor light-emitting elements including light-emitting diodes (LEDs) and an inspection method using the inspection device.

More specifically, it relates to an inspection device and an inspection method for performing light-emitting inspection of a plurality of light-emitting elements formed in an array in a separated state before mounting a plurality of semiconductor light-emitting elements.

Conventionally, as this kind of inspection apparatus and inspection method, there is one in which an LED having an upper side is disposed so as to face a p-n junction light-emitting portion of a plurality of LED devices formed on a support substrate (support substrate). The field plate of the electrode (electrode) is electrically grounded as the common electrode (common electrode) of the lower electrodes of a plurality of LED devices, and is applied to the upper electrode from an external voltage source (voltage source), thereby multiple Each LED device emits light, and its luminous brightness is measured by observation (for example, refer to Patent Document 1, Patent Document 2).

A plurality of LED devices are cut in half by trenches, but the trenches do not penetrate the common contact layer (common contact layer) of the lower electrodes, and are not separated on the support substrate ([0048], Figure 3A, 3B, etc.).

That is, a plurality of LED devices are subjected to luminescence measurement in a state where they are not separated from the support substrate. test and evaluate its functionality by measuring luminescence.

[Prior Art Literature] [Patent Document]

Patent Document 1: International Publication No. 2018/112267

Patent Document 2: Specification of US Patent Application Publication No. 2018/0259570

[Problem to be solved by the invention]

Among semiconductor light-emitting elements, LED chips are miniaturized in order to reduce costs, and are being used for high-speed. Research on mounting miniaturized LED chips with high precision. In particular, LEDs used in LED displays are LED chips with a size of 50 μm × 50 μm or less called micro LEDs, and it is required to transfer and mount LED chips in a disconnected state that reliably emit light at high speed with a precision of several μm.

However, in Patent Document 1, a plurality of LED devices are tested for light emission in an unseparated state, so in the chip bonding step of mounting each LED device, processing cannot be performed in an unseparated state, and it is necessary to perform dicing before mounting. A plurality of LED devices are individually separated.

In this case, there is a problem that even if the plurality of LED devices and the support substrate are evaluated as "no problem in function" by a light emission test in a state where they are not separated, it cannot be denied that new LED devices are generated due to the subsequent separation steps and the like. Possibility of failure, and since it is impossible to confirm the light emission immediately before installation, the reliability is poor.

In this case, there is a need for an inspection device and an inspection method, which can screen LED devices with poor light emission by inspecting a plurality of separated LED devices before mounting, and can transport the screened plurality of LED devices in a separated and arranged state to Install.

Also, in order to prevent damage to the LED device due to the light-emitting test, it is necessary to check under a low-voltage environment that avoids electrical contact.

In order to solve this kind of problem, the inspection device of the present invention optically inspects a plurality of semiconductor light-emitting elements arranged separately in a separated state before mounting, and is characterized in that it has: a first board with a first electrode; a second board with a The second electrode opposite to the first electrode; the insulating temporary fixing part temporarily fixes the plurality of semiconductor light-emitting elements in a separated and arranged state in a detachable and detachable manner; The electrodes are electrically connected to the aforementioned second electrodes; the optical instrument is used to observe the light emission of the plurality of semiconductor light-emitting elements from the side of any one of the aforementioned first board or the aforementioned second board, and the aforementioned temporary fixing part has the ability to be detachably mounted on Either one of the aforementioned first electrode or the aforementioned second electrode, and a temporary fixing portion facing a plurality of semiconductor light-emitting elements, the aforementioned plurality of semiconductor light-emitting elements can be separated and arranged in a state that can be separated from the aforementioned inspection by means of the temporary fixing portion. The space is transported to the installation position, and the inspection space between the first electrode and the second electrode is provided with a plurality of light-emitting circuit parts that are individually separated, and the light-emitting circuit part is connected in series and includes the plurality of semiconductor light-emitting elements and the temporary fixed In the capacitor part, in the plurality of light emitting circuit parts, when a forward current flows from the driving power supply to the plurality of semiconductor light emitting elements, the plurality of semiconductor light emitting elements emit light.

Also, in order to solve this problem, the inspection method of the present invention is to optically inspect a plurality of semiconductor light-emitting elements arranged in a separated state before mounting, and is characterized in that it includes: a temporary fixing step, separating the aforementioned plurality of semiconductor light-emitting elements The state of arrangement is temporarily fixed to the insulating temporary fixing part freely; the installation step is to install the aforementioned temporary fixing part on any one of the first electrode of the first plate or the second electrode of the second plate, and after forming In the aforementioned first The inspection space between the electrode and the aforementioned second electrode forms a plurality of light-emitting circuit parts that are individually separated, and the light-emitting circuit parts are connected in series to include the capacitors of the aforementioned plurality of semiconductor light-emitting elements and the aforementioned temporary fixing part; in the supplying step, from the aforementioned first electrode And the aforementioned second electrode applies the voltage of driving power to the aforementioned plurality of light emitting circuit parts; The plurality of semiconductor light emitting elements that emit light by supplying the voltage of the light emitting circuit part; and the mounting step of detaching the plurality of semiconductor light emitting elements from the temporary fixing part and performing substrate mounting. In the installation step, the temporary fixing part has With respect to the temporary fixing portion of the plurality of semiconductor light emitting elements, and the plurality of semiconductor light emitting elements can be transported from the inspection space to the installation position by holding the plurality of semiconductor light emitting elements in a separated and arranged state through the temporary fixing portion. In the inspection space, when a forward current flows from the driving power supply to the plurality of semiconductor light emitting elements, the plurality of semiconductor light emitting elements emit light, and in the aforementioned mounting step, the temporary fixing part transported from the aforementioned inspection space to the aforementioned mounting position is removed. The aforementioned plurality of semiconductor light emitting elements are mounted on a substrate.

1: first board

1a: first electrode

2: Second board

2a: Second electrode

3(31)(32):Temporarily fixed part

3a: Temporary fixed position

4: Drive power

5: Optical instruments

6: Dielectric layer

7: Drive Department

71: Drive unit for lifting

72: Drive unit for horizontal movement

8: Control Department

A: Check device

B: Check the equipment

D: dark room

E: Semiconductor light emitting element

E1: Luminous Department

F: Temporarily fixed chipset

H: Hold Chuck

L: Lighting Circuit Department

P2: Installation position

S: check space

Fig. 1 is an explanatory diagram showing the overall structure of an inspection device and an inspection method according to an embodiment of the present invention, Fig. 1(a) is a partial cutaway front view of an application step and an inspection step, and Fig. 1(b) is an application step and an inspection step cross-sectional plan.

2 is an explanatory diagram showing a modified example of the inspection device and inspection method according to the embodiment of the present invention, and FIGS.

Fig. 3 is an explanatory diagram showing a modified example of the inspection device and inspection method according to the embodiment of the present invention, and Fig. 3(a) and Fig. 3(b) are partially cutaway front views of the application step and the inspection step.

Fig. 4 is an explanatory diagram showing a modified example of the inspection device and inspection method according to the embodiment of the present invention, Fig. 4(a) is a partial cutaway front view of a state in which a plurality of semiconductor light-emitting elements are transported by a temporary fixing part, and Fig. 4(b) ) is a partially cutaway front view of a state where a plurality of semiconductor light emitting elements are mounted and detached from the temporary fixing portion.

Fig. 5 is an explanatory diagram showing a modified example of the inspection device and inspection method according to the embodiment of the present invention, Fig. 5(a) is a partial cutaway front view showing a specific example of an optical device and a drive unit, and Fig. 5(b) is a reduced front view A reduced cross-sectional plan view showing a specific example of an optical device and a driving unit.

6 is a circuit diagram showing a modified example of the inspection device and inspection method according to the embodiment of the present invention. FIG. 6(a) is an equivalent circuit corresponding to FIGS. 1 to 5, and FIG. 6(b) is an equivalent circuit of the modified example. circuit.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

As shown in Figures 1 to 6, the inspection device A of the embodiment of the present invention is used for functional (optical) inspection (luminescent test) in a separate arrangement state before mounting a plurality of semiconductor light emitting elements E formed in an arrangement. A plurality of semiconductor light-emitting elements E, so as to prevent the installation of optically poor semiconductor light-emitting elements E optical characteristic measurement device.

Specifically, the inspection apparatus A according to the embodiment of the present invention includes, as main components: a first plate 1 having a first electrode 1a; a second plate 2 having a second electrode 2a; Temporary fixing part 3 provided for detachable temporary fixing; driving power supply 4 provided for electrical connection with first electrode 1a and second electrode 2a; An optical device 5 is provided for observing the light emission of a plurality of semiconductor light emitting elements E.

In addition, it is provided on the surface of any one of the first electrode 1a or the second electrode 2a or The dielectric layer 6 on the surface of both; the driving part 7 arranged in order to make the first board 1 and the second board 2 relatively move; good.

In addition, the 1st board 1 and the 2nd board 2 are normally provided so that it may oppose to an up-down direction. In the illustrated example, the first board 1 is arranged below, and the second board 2 is arranged above. Hereinafter, the direction in which the first board 1 and the second board 2 face each other is referred to as "Z direction". Hereinafter, the direction along the first plate 1 and the second plate 2 intersecting the Z direction is referred to as "XY direction".

As shown in Fig. 1(a), Fig. 1(b), etc., a plurality of semiconductor light emitting elements E are respectively formed into thin plate-shaped light-emitting diodes that are smooth and roughly rectangular (including rectangles and squares with right-angled quadrilaterals). (LED) and laser diode (LD) and other semiconductor diodes. Red (Red), green (Green), and blue (Blue) chip LEDs are also included as the semiconductor diode.

Specific examples of the plurality of semiconductor light emitting elements E mainly include LED chips and LD chips called micro LEDs that are 50 μm×50 μm or less, specifically 30 μm×30 μm or less, and more specifically tens of μm square.

In addition, as another example of the plurality of semiconductor light emitting elements E, for example, LED chips of around 100 μm square called mini-LEDs and semiconductor diodes of general size such as general LED chips and LD chips such as 200 to 300 μm square can also be included. .

In general chip processing, a plurality of semiconductor light-emitting elements E are arranged in a predetermined period along the XY direction on an element-forming substrate or wafer including silicon and other materials, and each has a light emitting element on its front or back side. Part E1. A plurality of semiconductor light-emitting elements E formed in an array go through a cutting process such as dicing to maintain the aligned state, and a light-emitting inspection process based on the inspection device A, and then transfer to the mounting step of substrate mounting on a printed circuit board or the like.

As a feature of the present invention, the plurality of semiconductor light emitting elements E maintain separation after the breaking process. The out-of-alignment state is transferred to the temporary fixing part 3 described later at the transfer position P1, and after the light-emitting inspection is carried out together with the temporary fixing part 3 in the inspection space S, it is transported to the mounting position P2 together with the temporary fixing part 3 for mounting. That is, as the plurality of semiconductor light emitting elements E, a temporary fixing chip group F in which a plurality of semiconductor light emitting elements E are individually and separately arranged and temporarily fixed to a temporary fixing portion 3 described later is used.

In addition, in the illustrated example, as an arrangement of a plurality of semiconductor light emitting elements E, all rectangular semiconductor light emitting elements E are set to have the same size for the sake of explanation. In addition, as another example, although not shown, the arrangement of the plurality of semiconductor light emitting elements E can be changed in addition to the illustrated example.

Figure 1(a), Figure 1(b), Figure 2(a), Figure 2(b), Figure 2(c), Figure 3(a), Figure 3(b) and Figure 4(a), Figure As shown in 4(b) etc., the first plate 1 and the second plate 2 are made of transparent or opaque rigid materials such as quartz or hard synthetic resin and formed into plate-shaped flat plates.

A first electrode 1 a is formed on a surface of the first board 1 facing the second board 2 in the Z direction. A second electrode 2 a is formed on a surface of the second board 2 facing the first board 1 in the Z direction with the inspection space S interposed therebetween.

The first electrode 1 a and the second electrode 2 a are also formed by laminating transparent or opaque materials similarly to the first plate 1 and the second plate 2 .

Either one of the first plate 1 and the second plate 2 or both of the first plate 1 and the second plate 2 may be supported so as to be able to reciprocate in the Z direction, and be opposed to each other in the Z direction by a drive unit 7 described later. move.

To any one of the first electrode 1a or the second electrode 2a, in order to temporarily fix a plurality of semiconductor light emitting elements E detachably, a temporary fixing unit 3 is detachably attached as an inspection stand.

As the installation mechanism of the temporary fixing part 3, it is better to set the holding chuck H on the first board 1 and the second board 2. 2a, the temporary fixing part 3 is detachably attached and cannot be moved. Specific examples of the holding chuck H include chucks equipped with gripping mechanisms such as vacuum suction chucks, adhesive chucks, claws, or combinations thereof.

Temporary fixing part 3 is made of hard synthetic resin such as synthetic quartz, polyethylene terephthalate (PET), polypropylene (PP), polyvinyl chloride (PVC), or has rigidity that cannot be deformed and is optically similar. A transparent insulating material (with a relative permittivity of about 3) is formed into a thin flat plate with smooth front and back surfaces. In particular, as the constituent material of the temporary fixing part 3, it is preferable to use a dielectric material with a high relative permittivity, more specifically, a transparent high dielectric material including titanium oxide having a relative permittivity of about 80 or the like.

At least the surface facing the plurality of semiconductor light emitting elements E in the temporary fixing portion 3 is formed to have a high flatness by planar polishing, and has a temporary fixing portion 3 a facing the plurality of semiconductor light emitting elements E.

Temporary fixing parts 3a are composed of adhesive materials, low-melting point wax (hot-melt adhesive material), dissolvable and removable adhesives, etc. Temporary fixing mechanisms are formed in a layer or film shape, and a plurality of them can be temporarily fixed in a separated and arranged state. Semiconductor light emitting element E. The thickness of the temporarily fixing portion 3a is formed so that even if the micro LEDs having a thickness of less than 10 μm as a plurality of semiconductor light emitting elements E are temporarily fixed, the surfaces of the micro LEDs have a uniform height without fluctuations.

Therefore, the plurality of semiconductor light emitting elements E are held immovably with respect to the temporary fixing part 3 by the temporary fixing by the temporary fixing part 3 a. Thereby, the temporarily fixed part 3 and several semiconductor light emitting elements E become the temporarily fixed chip group F which can be integrated and conveyed. that is, The temporary fixing part 3 is also a device transfer jig that holds a plurality of semiconductor light-emitting elements E in a separated and arranged state by the temporary fixing part 3a and can be transported from the transfer position P1 to the mounting position P2 through the inspection space S.

In the temporary fixing part 3, the surface shape having the temporary fixing part 3a has an example in which the surface including the temporary fixing part 3a is formed as a smooth surface as shown in FIG. 1(a), as shown in FIG. 2(a). Another example in which the temporarily fixing portion 3a for temporarily fixing a plurality of semiconductor light emitting elements E is formed in a concavo-convex shape partially protruding from other portions.

In another example in which the surface shape of the temporary fixing part 3 is concave-convex, concave parts 3b are respectively formed between adjacent convex temporary fixing parts 3a. It is preferable to set the intervals of the recessed parts 3b to correspond to the arrangement intervals of the plurality of semiconductor light emitting elements E arranged and formed at a predetermined period on the element formation substrate or wafer.

That is, the intervals between the plurality of temporary fixing parts 3a are in either or both directions of the X direction or the Y direction in such a manner that the plurality of semiconductor light emitting elements E arranged at intervals in the XY direction are opposed to the Z direction. The other is set to an interval equal to the arrangement interval of the plurality of semiconductor light emitting elements E or an integer multiple thereof. Specifically, it is preferable to set the interval of the plurality of temporary fixing locations 3a to be a multiple multiple of the arrangement interval of the plurality of semiconductor light emitting elements E. Thereby, among the plurality of semiconductor light emitting elements E arranged separately in the XY direction, only the semiconductor light emitting elements E arranged in a predetermined row or a predetermined position can be brought into contact with the plurality of temporary fixing parts 3a, and by adhesion Or then wait for the temporary fixing mechanism to be temporarily fixed and maintained freely.

In addition, the temporary fixing part 3 temporarily fixes and holds either one of the front side and the back side where the light emitting part E1 is arranged among the plurality of semiconductor light emitting elements E by means of the temporary fixing part 3a. better.

As a specific example of such a temporary fixing part 3, there is a transparent light emitting side temporary fixing part 31 temporarily fixed to the surface side of a plurality of semiconductor light emitting elements E where the light emitting part E1 is arranged as shown in FIG. 1(a) and the like.

As another example, as shown in FIG. 2( c ), there is a transparent or opaque back side temporary fixing portion 32 temporarily fixed to the back side of a plurality of semiconductor light emitting elements E opposite to the light emitting portion E1.

The plurality of separated semiconductor light emitting elements E are held in a non-discrete manner by the temporary fixing part 3 (the light emitting side temporary fixing part 31 or the rear side temporary fixing part 32 ). In this holding state, the plurality of semiconductor light emitting elements E can be taken out from the temporary fixing part 3 (the light emitting side temporary fixing part 31 or the rear side temporary fixing part 32) by peeling or the like, so that the light emitting part E1 or the light emitting part E1 of the plurality of semiconductor light emitting elements E Mounting is possible while the back is exposed. Therefore, the alignment information of the chip at the time of separating among the plurality of semiconductor light emitting elements E can be used in the mounting step described later.

In addition, the temporary fixing part 3 is configured to sandwich the temporary fixing part 3 between the first electrode 1a and the second electrode 2a with respect to the inspection space S formed between the first electrode 1a and the second electrode 2a, so that multiple A semiconductor light emitting element E is energized.

The first electrode 1 a of the first plate 1 and the second electrode 2 a of the second plate 2 are arranged to face each other across the inspection space S in the Z direction. The interval in the Z direction of the inspection space S during the light-emitting test is set to be equal to or slightly longer than the interval in the Z direction of the temporarily fixed chip group F (a plurality of semiconductor light emitting elements E and the fixed part 3).

The first electrode 1 a and the second electrode 2 a are respectively electrically connected to a driving power source 4 described later. In addition, any one of the first electrode 1a or the second electrode 2a is attached and detached by a mounting mechanism (holding chuck H). The temporary fixing part 3 is attached freely.

Therefore, the temporarily fixed chip group F (a plurality of semiconductor light emitting elements E and the temporarily fixed part 3) is sandwiched between the inspection space S between the first electrode 1a and the second electrode 2a, and the inspection space S from the first electrode 1a and the second electrode 2a to the The plurality of semiconductor light emitting elements E are energized. In particular, the temporary fixing part 3 is electrically contacted with the first electrode 1a and the second electrode 2a, so that the temporary fixing part 3 sandwiched between the first electrode 1a and the second electrode 2a along the Z direction becomes an insulating dielectric body. is better.

Thereby, a plurality of semiconductor light emitting elements E and the insulating temporary fixing part 3 constitute capacitors and are connected in series. That is, between the first electrode 1a and the second electrode 2a, a plurality of separately separated light emitting circuit parts L are arranged and formed, and the light emitting circuit part L is connected in series with a capacitor including a plurality of semiconductor light emitting elements E and the temporary fixing part 3 .

Moreover, the temporary fixing part 3 is detachably attached to any one of the first electrode 1a or the second electrode 2a by holding the chuck H, and therefore, the plurality of semiconductor light emitting elements E are connected to the first electrode 1a via the temporary fixing part 3. Or one of the second electrodes 2a is in electrical contact. However, even if the plurality of semiconductor light emitting elements E have some gaps between them and the plurality of semiconductor light emitting elements E without contacting the other of the first electrode 1a or the second electrode 2a, since the gaps become suitable insulators , so that the luminescence test can be performed.

In addition, during this kind of light emission test, when the surfaces of the plurality of semiconductor light emitting elements E are temporarily fixed to the temporary fixing portion 3, the surfaces of the plurality of semiconductor light emitting elements E are slightly undulated and have uneven heights. The electrostatic capacitance corresponding to the element E varies, so it is not good.

In addition, after the inspection, the temporarily fixed chip group F (the plurality of semiconductor light emitting elements E and the temporarily fixed part 3 ) can be detached from the inspection space S by releasing the holding of the temporarily fixed part 3 by the holding chuck H.

Again, as shown in Figure 3 (a), Figure 3 (b) ~ Figure 5 (a), Figure 5 (b), the first plate 1 and the second plate 2 can also be formed so that the first plate 1 or the second plate The area of any one of the plates 2 is smaller than that of the other. In this case, one of the first plate 1 and the second plate 2 is supported in a direction (XY direction) intersecting with a direction (Z direction) where the first plate and the second plate face each other. Relatively movable, or it is preferable to support both the first plate and the second plate so as to be relatively movable in a direction (XY direction) intersecting with a direction (Z direction) in which the first plate and the second plate face each other. In addition, by ensuring a sliding gap (not shown) between the first electrode 1a of the first plate 1 on the moving side or the second electrode 2a of the second plate 2 and the plurality of semiconductor light emitting elements E, smooth movement can be achieved. relatively mobile. That is, with respect to one of the first plate 1 or the second plate 2, the other or both of the first plate 1 and the second plate 2 maintain the first plate 1 and the second plate 1 along the opposing direction (Z direction). The gap between the two plates 2 (gap for sliding) is supported on one side so as to be free to move in the intersecting direction (XY direction).

The drive power supply 4 is composed of an AC voltage source and a DC voltage source, and a predetermined amount of AC ( AC) voltage and direct current (DC) voltage.

When an AC voltage is applied from an AC voltage source serving as a driving power supply 4 to a plurality of light emitting circuit parts L, due to the rectification function of a plurality of semiconductor diodes serving as a semiconductor light emitting element E, the current is relatively low compared to the plurality of semiconductor light emitting elements E. The light-emitting part E1 emits light by flowing in the forward direction.

After the inspection of the plurality of semiconductor light emitting elements E is completed, it is preferable to turn OFF the power supply to the first electrode 1a and the second electrode 2a, and activate the static eliminator (not shown). Thereby, electrostatic destruction due to peeling charge generated when the temporarily fixed chip group F is taken out from the first electrode 1a and the second electrode 2a after the inspection is completed is prevented.

The optical device 5 includes an inspection camera and the like for observing the luminance of light emitted by the plurality of semiconductor light emitting elements E from the side of either the first plate 1 (first electrode 1 a ) or the second plate 2 (second electrode 2 a ).

That is, the first plate 1 (first electrode 1a) or One side of any one of the second plates 2 (second electrodes 2 a ) may be formed of a transparent material, and the other side may be formed of an opaque material.

As the inspection camera of the optical device 5, when a plurality of semiconductor light emitting elements E emit visible light, a CCD camera or the like using visible light is preferable. When a plurality of semiconductor light emitting elements E emit infrared light, it is preferable to use an infrared camera configured to match the field of view of the inspection area with respect to the plurality of semiconductor light emitting elements E so as to match a predetermined resolution.

In the arrangement of inspection cameras, a high-resolution fixed camera 51 or a movable camera 52 capable of moving according to the movement of the first board 1 or the second board 2 is used, or the fixed camera 51 and the movable camera 52 are used together. In particular, when a plurality of semiconductor light-emitting elements E are arranged in minute sizes such as micro LEDs, it is preferable to use the mobile camera 52 . Thereby, since the inspection area|region with respect to several semiconductor light emitting elements E is limited, even if it is a low-resolution camera, sufficient observation resolution can be ensured.

The average luminance data of a plurality of semiconductor light emitting elements E obtained by the fixed camera 51 and the moving camera 52 etc. can be made by making the average luminance data of each inspection batch correspond to the position of each semiconductor light emitting element E, as It is a database that can be referred to in subsequent steps.

Specifically, as inspection data based on the fixed camera 51 and the mobile camera 52, etc., a plurality of semiconductor light emitting elements E in a light emitting state are measured as one image data, and a plurality of semiconductor light emitting elements E corresponding to the area of each semiconductor light emitting element E are measured. From the pixel data, the average luminance of each semiconductor light-emitting element E, etc. are obtained, and the presence or absence of light emission and the representative luminance of each semiconductor light-emitting element E are taken as Quantitative data, making a database of brightness per inspection lot. In addition, by changing the light emission when the voltage is applied from the drive power source 4, the light emission minimum voltage and the luminance variation of each semiconductor light emitting element E can be collectively measured.

In particular, when the plurality of semiconductor light emitting elements E are RGB chip LEDs, it is preferable to use a color camera with sufficient resolution for the RGB chip LEDs as the inspection camera, and to store the luminance components of the three colors of RGB as each hue database.

In addition, the database of these chip light emitting luminances can link the positions and data of a plurality of semiconductor light emitting elements E in each inspection lot. In this case, in the mounting step of each semiconductor light emitting element E by a die bonder or the like which becomes the next step, it can be used as a screening criterion for target chips immediately before taking out each semiconductor light emitting element E.

As shown in Figure 5(a) and Figure 5(b), in order to perform a more accurate inspection by luminous testing, the inspection device A of the embodiment of the present invention is installed in the inspection equipment B that constitutes the darkroom D during the inspection, and in the It is better to carry out the luminescence test in the state where no external light enters.

The reason for carrying out the luminescence test in the dark room D is that when external light less than the luminous frequency of each semiconductor light emitting element E enters a plurality of semiconductor light emitting elements E, an excitation phenomenon occurs in the internal charges of each semiconductor light emitting element E, making it difficult to observe Accurate lighting status.

Conversely, the excitation phenomenon by such external light can be used as an observation method assisted by light excitation by light emission in each semiconductor light emitting element E. A light source (not shown) that emits short-wavelength light that is lower than the light-emitting frequency of the plurality of semiconductor light-emitting elements E is installed in the dark room D, and it is relatively small to uniformly irradiate short-wavelength light from the light source toward the light-emitting portion E1 of the plurality of semiconductor light-emitting elements E. good. Thereby, the minimum voltage required for light emission can be reduced. Therefore, even if the driving power source 4 is set to a low voltage, the light emission of each semiconductor light emitting element E can be observed. For example, for a red LED, it can be achieved by weakly It is implemented by irradiating short-wavelength blue or ultraviolet light.

Specifically, the irradiation area of an illuminating device (not shown) including short-wavelength light having a light emission frequency lower than that of each semiconductor light emitting element E is made to coincide with the observation field of view of an inspection camera that observes light emission from a plurality of semiconductor light emitting elements E is better. Specifically, the short-wavelength illumination device is provided in combination with the fixed camera 51 or in the mobile camera 52 .

With this structure, the dark-time level of the observation value within the viewing angle of the camera obtained only by the irradiation of the short-wavelength illumination device is measured in advance, and the dark-time level is corrected by subtracting the dark-time level from the camera observation value at the time of inspection. data. In addition, if the external light to each semiconductor light-emitting element E is too strong, light-excited luminescence based on the photoluminescence effect will be generated. Therefore, it is better to adjust the illuminance level of the short-wavelength lighting device in advance to avoid luminescence that does not depend on the driving current. .

Also, when discriminating the color tone of the light emitting state of the RGB chip LED as a plurality of semiconductor light emitting elements E, the light emitting state can be observed with a color camera and used as an observed value for each RGB component. When using a short-wavelength illumination device in combination with the short-wavelength illumination device, measure in advance the dark-time level of the color tone of the RGB component in the observation value within the camera's viewing angle obtained only by the irradiation of the short-wavelength illumination device. It is preferable to correct the data by subtracting the dark level of the hue.

Either one of the first electrode 1a of the first plate 1 or the second electrode 2a of the second plate 2 or both of the first electrode 1a and the second electrode 2a along the surface of the first electrode 1a and the second electrode 2a It is better to arrange a dielectric layer 6 on the surface of the .

The dielectric layer 6 can be made of a dielectric material with a high relative permittivity, similarly to the temporary fixing portion 3 . As a specific example of the dielectric layer 6, it is preferable to use a transparent high-dielectric material including titanium oxide having a relative permittivity of about 80 or the like.

As the shape of the dielectric layer 6 in the first electrode 1a of the first plate 1 and the second electrode 2a of the second plate 2 In addition to forming a hard film by sputtering, etc., there is also a high ratio of thinly coating a fine powder state by using a liquid soft resin that has curability due to ultraviolet radiation and heating for the base material. The dielectric material is a method of forming a soft film obtained by pre-dispersing a soft resin in a liquid and hardening it.

In particular, when the soft film to be the dielectric layer 6 is formed of silicone resin or the like that is flexible even after hardening, unevenness or deformation of the surface shape or back surface shape of the plurality of semiconductor light emitting elements E, and the temporary fixing portion 3 can be expected. The displacement absorption. Thereby, the surface contact property is also improved with respect to the surface or the back surface of the plurality of semiconductor light-emitting elements E having poor flexibility and the temporarily fixed part 3, and the electrostatic capacity generated between the first electrode 1a and the second electrode 2a can be stabilized more .

It is preferable to provide a drive unit 7 on the first plate 1 or the second plate 2 for relatively moving either one of the first plate 1 or the second plate 2 or both of the first plate 1 and the second plate 2 . The temporarily fixed chip group F (semiconductor light emitting elements E and temporarily fixed unit 3 ) can be detachably inserted between the first electrode 1 a and the second electrode 2 a (inspection space S) by the operation of the driving unit 7 .

The drive unit 7 is composed of an actuator or the like that connects either one of the first plate 1 or the second plate 2 or both of the first plate 1 and the second plate 2 and moves back and forth by lifting, sliding, or reversing. , is controlled by the control unit 8 described later.

The direction of relative movement of the first plate 1 or the second plate 2 based on the driving unit 7 includes not only the opposing direction (Z direction) of the first plate 1 and the second plate 2, but also the opposing direction (Z direction) if necessary. Direction) the direction of intersection (XY direction).

That is, as the drive unit 7 , there are at least a lift drive unit 71 for relatively moving the first plate 1 or the second plate 2 in the Z direction, and a horizontal movement drive unit 71 for relatively moving the first plate 1 or the second plate 2 in the XY direction. Use the drive unit 72.

As a control example based on the lifting drive unit 71 of the control unit 8 described later, the first plate 1 and the The second plate 2 relatively separates and moves in the Z direction.

In addition, in the installation shown by the solid line in FIG.1(a) etc., the 1st plate 1 and the 2nd plate 2 are moved relatively close to Z direction. By this approaching movement, the temporarily fixed chip group F can be sandwiched between the first electrode 1 a of the first board 1 and the second electrode 2 a of the second board 2 (inspection space S) along the Z direction, and can be energized. In the illustrated example, the first electrode 1 a and the second electrode 2 a are pressurized through the dielectric layer 6 so as to be able to directly contact and conduct electricity. Also, although not shown in the figure as another example, the first electrode 1a and the second electrode 2a can also be directly in contact with the temporarily fixed chip group F without passing through the dielectric layer 6, and can be changed to be separated by a predetermined interval. Either one of the first electrode 1 a or the second electrode 2 a is brought close to between the temporarily fixed chip groups F and energized.

1 to 5 show specific examples of temporarily fixing the chip group F (a plurality of semiconductor light emitting elements E and the temporary fixing part 3), the optical device 5, the dielectric layer 6 and the driving part 7, and Fig. 6 shows these the equivalent circuit.

Figure 1(a), Figure 1(b), Figure 2(a), Figure 2(b), Figure 2(c), Figure 3(a), Figure 3(b), Figure 4(a), Figure 4 (b) and in the example shown in FIG. 5(a) and FIG. 5(b), a temporary fixing part 3 is formed on the first electrode 1a side, and a plurality of semiconductor light emitting elements E can be attached and detached by the temporary fixing part 3. The ground is placed on the first electrode 1a for temporary fixation.

Figure 1(a), Figure 1(b), Figure 2(b), Figure 2(c), Figure 3(a), Figure 3(b), Figure 4(a), Figure 4(b) and Figure 5 In the case of (a) and FIG. 5(b), the entire surface including the temporary fixing portion 3a of the temporary fixing portion 3 is formed on a smooth surface.

On the other hand, in the case of FIG. 2( a), the difference lies in that the temporary fixing part 3 has The surface shape of the temporary fixing part 3a is formed in the concave-convex shape which partially protrudes from the temporary fixing part 3a. In the case of the illustrated example, the interval (pitch in the X direction) of the plurality of temporary fixing parts 3a is set to twice the arrangement interval (pitch in the X direction) of the plurality of semiconductor light emitting elements E arranged separately, and light is emitted from the plurality of semiconductor light emitting elements. In the element E, the plurality of temporary fixing portions 3a are brought into contact with only the semiconductor light emitting elements E arranged in a predetermined row (every other row in the X direction) and are held to be detachable.

Also, as another example, although not shown in the drawings, it is also possible to form a temporary fixing portion 3 on the side of the second electrode 2a, and temporarily hold a plurality of semiconductor light emitting elements E on the second electrode 2a by the temporary fixing portion 3 to perform temporary fixing. It is also possible to change the interval setting of the plurality of temporary fixing locations 3a to other than the illustrated example.

Figure 1(a), Figure 1(b), Figure 2(a), Figure 2(b), Figure 3(a), Figure 3(b), Figure 4(a), Figure 4(b) and Figure 5 (a) and the example shown in FIG. 5(b) are configured in such a way that the light-emitting portion E1 is arranged downward in a plurality of semiconductor light-emitting elements E, and the transparently formed first electrode 1a and the first electrode 1a pass through. The board 1 etc. observes the light emitting state of the light emitting part E1 from the side of the first board 1 with the optical instrument 5 .

Especially Fig. 1(a), Fig. 1(b), Fig. 2(a), Fig. 2(b), Fig. 2(c), Fig. 3(a), Fig. 3(b), Fig. 4(a), Fig. 4(b) and Fig. 5(a), Fig. 5(b) in the example shown, Fig. 1(a), Fig. 1(b), Fig. 2(a), Fig. 2(b), Fig. 3(a ), Fig. 3(b), Fig. 4(a), Fig. 4(b) and Fig. The temporary fixing portion 3a of the portion 31) is in direct contact with the surface side of the plurality of semiconductor light emitting elements E on which the light emitting portion E1 is disposed.

Figure 1(a), Figure 1(b), Figure 2(a), Figure 2(b), Figure 2(c), Figure 3(a), Figure 3(b), Figure 4(a), Figure 4 In the example shown in (b) and FIG. 5( a ), FIG. 5( b ), the dielectric layer 6 is formed along the surface of the second electrode 2 a.

Figure 1(a), Figure 1(b), Figure 2(a), Figure 3(a), Figure 3(b), Figure 4(a), Figure 4(b) and Figure 5(a), Figure 5 In the case of (b), the difference is that the dielectric layer 6 is brought into electrical contact with or close to the back side of the plurality of semiconductor light emitting elements E. FIG.

In the case of Fig. 2(b), the difference is that the film-like or sheet-like insulating film body 3 ' made of the same insulating material as the temporary fixing part 3 abuts against the back side of a plurality of semiconductor light-emitting elements E, and Temporarily fixed by adhesion or bonding etc. freely attachable and detachable. That is, the plurality of semiconductor light emitting elements E shown in FIG. 2( b ) are held detachably by being sandwiched between the temporary fixing portion 3 and the insulating film body 3 ′ by both the front side and the back side.

In addition, in the example shown in Fig. 1(a), Fig. 1(b), Fig. 2(a), Fig. 2(b) and Fig. 3(a), Fig. 3(b), it is configured that by The drive unit 71 for raising and lowering of 7 controls the movement of the second board 2 in the Z direction toward the first board 1 .

On the contrary, the difference between the examples shown in Fig. 2(c), Fig. 4(a), Fig. 4(b), Fig. 5(a), Fig. 5(b) and Fig. 6 is that the driving unit 7 controls the movement of the first board 1 in the Z direction toward the second board 2 .

Figure 2(c) and Figure 1(a), Figure 1(b), Figure 2(a), Figure 2(b), Figure 3(a), Figure 3(b), Figure 4(a), Figure 4 The difference between (b) and Fig. 5(a) and Fig. 5(b) is that, among the plurality of semiconductor light emitting elements E, the light emitting part E1 is arranged facing upward, through the transparent dielectric layer 6, the second electrode 2a, the second The board 2 observes the light-emitting state of the light-emitting part E1 from the side of the second board 2 with the optical instrument 5 .

Also, although not shown as another example, it can be changed to: in Fig. 1(a), Fig. 1(b), Fig. 2(a), Fig. ) in the example shown, the first board 1 is controlled to move toward the second board 2 along the Z direction by the lifting driving part 71 of the driving part 7; in Fig. 1 (a), Fig. 1 (b), Fig. 2 (a ), Figure 2(b), Figure 3(a), Figure 3(b), Figure 4(a), Figure 4(b) and Figure 5(a), Figure 5(b) shown in the example, The light emitting state and the like of the light emitting portion E1 are observed from the second plate 2 side by the optical instrument 5 .

In addition, in the example shown in FIG. 3(a), FIG. 3(b)~FIG. 5(a), and FIG. The second board 2 moves in the XY direction relative to the first board 1 .

Fig. 3 (a), under the situation of Fig. 4 (a), Fig. 4 (b) and Fig. 5 (a), Fig. 5 (b), the difference is that the area of the second plate 2 is formed to be smaller than that of the first plate 1 In the case of FIG. 3( b ), the difference lies in that one second plate 2 is moved sequentially in the XY direction relative to a plurality of first plates 1 arranged side by side in the XY direction.

In particular, in the case of Fig. 3(b), Fig. 4(a), Fig. 4(b) and Fig. 5(a), Fig. 5(b), support members including particles etc. are provided around the first plate 1 11, and the first plate 1 is detachably supported on the supporting member 11. In the illustrated example, the first board 1 and the temporarily fixed chip group F (a plurality of semiconductor light emitting elements E and the temporarily fixed part 3) are relatively supported by the supporting chuck 11a provided on the supporting member 11 of the first board 1. The member 11 is supported immovably and detachably.

With the support by the support chuck 11a, as shown in FIG. 4(a), the chip group F is temporarily fixed together with the first thin plate 1 with respect to the inspection space S formed between the first electrode 1a and the second electrode 2a. It is conveyed (carried in) from the transfer position P1 to the inspection space S. In addition, by releasing the support by the support chuck 11 a, the temporarily fixed chip group F is transported (carried into) from the inspection space S to the mounting position P2 together with the first plate 1 . Thereby, as shown in FIG. 4( b), in the transfer position P1, the temporary fixing operation of the plurality of semiconductor light emitting elements E relative to the temporary fixing part 3 can be easily implemented, and in the mounting position P2, it can be easily implemented from the mounting position P2. The temporary fixing part 3 takes out the role of a plurality of semiconductor light emitting elements E. As shown in FIG.

That is to say, in addition to the function of the inspection table in the inspection space S in the inspection device A, the temporary fixing part 3 also functions as an inspection table before inspection (temporary fixing steps, carrying-in steps, and installation steps to be described later). It functions as a device transfer jig for moving temporarily fixed chip group F (a plurality of semiconductor light emitting elements E and temporarily fixed part 3 ) from transfer position P1 to inspection space S. After the inspection (the carrying-out step or mounting step described later), the temporarily fixed chip group F (a plurality of semiconductor light-emitting elements E and the temporarily fixed part 3) is used as a device transfer jig for moving from the inspection space S to the mounting position P2. function.

Also, although not shown as another example, in the example shown in Fig. 1(a), Fig. 2(a), Fig. 2(b), Fig. 2(c) and Fig. 3(a), it can be compared to The first board 1 detaches the temporarily fixed chip group F (a plurality of semiconductor light emitting elements E and the temporary fixing part 3) by releasing the holding chuck H, and only the plurality of semiconductor light emitting elements E and the temporary fixing part 3 can be changed. Be transportable (in and out). In addition, in the example shown in FIG. 1(a), FIG. 2(a), FIG. 2(b), FIG. 2(c) and FIG. One plate 1 can be changed into a transportable structure, or the second plate 2 that suspends and temporarily fixes the chip group F can be changed into a transportable structure.

In the example shown in Fig. 5(a) and Fig. 5(b), the darkroom D configured when the inspection equipment B is inspected accommodates and arranges the first board 1 and the second board 2 and the optical instrument 5, and is equipped with a In the dark room D, the support member 11 of the first board 1 moves up and down in the Z direction toward the second board 2, and the second board 2 moves in the XY direction relative to the support member 11 of the first board 1 The drive unit 72 for horizontal movement.

The darkroom D is formed inside the inspection equipment B to block external light and is used for inspection. As the driving unit 71 for raising and lowering provided in the darkroom D, actuators such as sliders and linear motion guides are used.

As the drive unit 72 for horizontal movement formed in the darkroom D, an actuator such as an XY stage is used.

When the optical device 5 arranged in the darkroom D is a fixed camera 51, it is fixedly arranged on the extension line of the central axis of the first plate 1 at the position of the optical focus. In the case of moving the camera 52, it is arranged on the extension line of the central axis of the second board 2 and the optical focus position is supported so as to be connected to the second board 2 by The drive unit 72 for horizontal movement moves synchronously with the movement in the XY direction.

In addition, although not shown as another example, when the plurality of semiconductor light emitting elements E to be inspected are LEDs, a light source that emits light with a wavelength shorter than the light emission frequency of the LEDs can also be provided. In this case, it is preferable to perform the inspection while uniformly irradiating the inspection target area of the inspection space S with low illuminance, such as by moving the light source following the movement of the moving camera 52 in the dark room D.

The equivalent circuit shown in Figure 6(a) corresponds to Figure 1, Figure 2(a), Figure 2(c), Figure 3(a), Figure 3(b), Figure 4(a), Figure 4(b) And in the example shown in Fig. 5 (a) (b), with respect to the plurality of light emitting circuit parts L which are connected in series and include capacitors of a plurality of semiconductor light emitting elements E and temporary fixing parts 3 and are separated separately, from the first electrode 1a and the second An AC voltage of a driving power source (AC voltage source) 4 is applied to the two electrodes 2 a via a dielectric layer 6 . The displacement current flows through the plurality of light emitting circuit parts L by the application of the AC voltage. Also, the equivalent circuit corresponding to the example shown in FIG. 2(b) is similar to that in FIG. 6(a), so it is omitted.

The displacement current flowing in the plurality of light emitting circuit parts L flows forward current due to the rectification function of the plurality of semiconductor light emitting elements (semiconductor diodes) E. Specifically, the AC voltage applied from the drive power source 4 to the plurality of light emitting circuit units L is half-wave rectified by the plurality of semiconductor light emitting elements E.

Therefore, only when a forward current flows to the plurality of semiconductor light emitting elements E, the plurality of semiconductor light emitting elements E are made to emit light. By observing the light emitting state with the optical device 5, it is possible to sort good and bad according to the light emitting state of the plurality of semiconductor light emitting elements E.

In the case of FIG. 6( a ), a current-limiting resistor _RL for semiconductor diode protection is connected in series to the circuit to constitute a series RC circuit. That is, only an AC voltage within the range of the reverse withstand voltage is applied to the plurality of semiconductor light emitting elements E. As shown in FIG. Thereby, excessive current flow to the plurality of semiconductor light emitting elements E is restricted by the current limiting resistor _RL , thereby preventing destruction.

At this time, in order to secure the current required for the light emission of the semiconductor light emitting element E, the magnitude of the impedance of the series RC circuit is important. The impedance of the plurality of light emitting circuit units L changes depending on the capacitance and frequency. When ω is the frequency and C is the capacitance, the impedance Z of an ideal capacitor is represented by the following equation.

Z=1/jωC

That is, the impedance Z is inversely proportional to the frequency ω and the capacitance C. Therefore, as the capacitance C increases, the impedance Z decreases, and as the frequency ω increases, the impedance Z decreases. However, there is a limit to the response range of the frequency ω in the light emission of the semiconductor light emitting element E, so it cannot be too high. If the impedance Z is high, a high voltage is required for driving, but the light emission test based on high voltage may damage the semiconductor light emitting element E, so it is better to increase a larger electrostatic capacity C that can maintain a low voltage.

In order to increase the capacitance C, it is also effective to increase the projected area (electrode area) between the first electrode 1a and the second electrode 2a, but since the electrode area depends on the number of semiconductor light-emitting elements E for the light-emitting test, it is limited.

Therefore, in order to increase the dielectric constant between the first electrode 1a and the second electrode 2a, a dielectric layer 6 including a dielectric material with a high relative dielectric constant is added.

The equivalent circuit shown in FIG. 6( b ) is a circuit for the purpose of emitting light with as low a voltage as possible to avoid destruction of a plurality of semiconductor light emitting elements E during the light emitting test.

The forward half-wave current applied from the driving power source (AC voltage source) 4 to the plurality of light emitting circuit parts L is the same as that in Fig. 6(a), but the reverse voltage (-E ₂ ) is limited in the driving power source 4 . A low-voltage light emission test can be performed by applying a voltage waveform that is the lower limit of the reverse withstand voltage (-E ₂ ) limit from the drive power source 4 to the plurality of semiconductor light emitting elements E.

In the equivalent circuit shown in Fig. 6 (a) and Fig. 6 (b), the symbol _C1 is based on the capacitance of the insulating temporary fixing part 3, the symbol _C2 is based on the capacitance of each semiconductor light emitting element E, and the symbol _C3 is based on the electrostatic capacity of the dielectric layer 6, and symbol _C4 is based on the electrostatic capacity of the gap (air layer) arranged between the separated plurality of semiconductor light emitting elements E.

In addition, in the case of FIG. 6( a ) and FIG. 6( b ), only a sine wave is described as the drive power source (AC voltage source) 4 . If it is an AC waveform, although not shown, it may be a rectangular wave, a triangular wave, a trapezoidal wave, etc. instead of a sine wave.

In addition, for the ease and management of static elimination of the semiconductor light emitting element E, as long as the voltage (-E ₂ ) of the driving power supply 4 is set to zero potential, a DC voltage source can be used instead of an AC voltage source.

The control unit 8 is not only electrically connected with the drive power supply 4 and the drive unit 7, but also electrically connected with the transport-in mechanism (not shown) and the transport-out mechanism (not shown) of the temporarily fixed chip group F. .

The controller serving as the control unit 8 sequentially controls each operation at a preset timing according to a program preset in its control circuit (not shown).

Furthermore, a program set in the control circuit of the control unit 8 will be described as an optical inspection method for a plurality of semiconductor light emitting elements E by the inspection device A. FIG.

The inspection method of the embodiment of the present invention includes as the main steps: a temporary fixing step of temporarily fixing a plurality of semiconductor light emitting elements E to the temporary fixing part 3 in a state of being separated and arranged respectively; The first electrode 1a of the second plate 2 or the second electrode 2a of the second plate 2 is arranged to sandwich a plurality of semiconductor light emitting elements E and the temporary fixing part 3; the supply step is to supply voltage from the driving power supply 4 to the plurality of semiconductor light emitting elements E; And an observation step of observing the light emitting states of the plurality of semiconductor light emitting elements E from one side of the first board 1 and the second board 2 using the optical device 5 .

In addition, it also includes the step of carrying in the temporarily fixed chip group F (a plurality of semiconductor light emitting elements E and the temporarily fixed part 3) from the transfer position P1 to the inspection space S before the installation step, and moving to the mounting position P2 after the observation step. It is preferable to carry out the step of carrying out the temporarily fixed chip group F whose inspection has been completed. In addition, after the observation step or the carry-out step, a mounting step is included in which a plurality of semiconductor light-emitting elements E targeted from the temporarily fixed chip group F that has been inspected are detached from the temporarily fixed part 3 and mounted on a printed circuit board or the like. .

In the temporary fixing step, the plurality of semiconductor light-emitting elements E that are individually and separately arranged in the transfer position P1 are brought into contact with the temporary fixing part 3 a that becomes the surface of the temporary fixing part 3 , and the temporary fixing part 3 a is adhered or adhered to the temporary fixing part 3 a. Temporary fixation is performed, and the plurality of semiconductor light-emitting elements E that are separated and arranged are kept freely attached and detachable in the state of separated and arranged.

In the setting step, the temporarily fixed chip group F brought in from the transfer position P1 by the temporary fixing unit 3 is inserted into the inspection space S between the first electrode 1a and the second electrode 2a and electrically connected. Thereby, a plurality of individually separated light emitting circuit portions L are formed, and the light emitting circuit portions L are connected in series including a plurality of semiconductor light emitting elements E and capacitors including the temporary fixing portion 3 .

In the supply step, an AC voltage is applied to the plurality of light emitting circuit parts L by supplying the voltage of the driving power source 4 to the plurality of semiconductor light emitting elements E from the first electrode 1 a and the second electrode 2 a.

In the observation step, as the alternating current is applied to the plurality of light-emitting circuit parts L, it is observed from the side of any one of the first plate 1 and the first electrode 1 a and the second plate 2 and the second electrode 2 a by the optical instrument 5 . A plurality of semiconductor light emitting elements E that emit light due to a voltage are screened into semiconductor light emitting elements E that emit light well and semiconductor light emitting elements E that emit light badly according to the light emitting states of the plurality of semiconductor light emitting elements E.

As a screening method based on the light-emitting state of a plurality of semiconductor light-emitting elements E, there are predetermined bases such as discrimination based on the presence or absence of light emission, screening based on brightness deviation, and color tone screening. It is better to come and proceed.

In the mounting step, only the plurality of semiconductor light-emitting elements E that are well-lit by the observation of the optical device 5 are screened out from the inspection space S to the temporarily-fixed chip group F at the mounting position P2 by the temporary fixing part 3. It is taken out from the temporary fixing part 3 a of the temporary fixing part 3 by peeling or the like. Thereby, board|substrate mounting using the alignment information which temporarily fixes the chip group F with respect to a printed board etc. can be performed.

According to the inspection device A and the inspection method according to the embodiment of the present invention, the plurality of semiconductor light emitting elements E and the temporary fixing part 3 arranged separately in the inspection space S are temporarily fixed to the first electrode 1a or the second electrode 2a in a detachable manner. on any of them. In this temporarily fixed state, the AC voltage of the driving power source 4 is applied from the first electrode 1a and the second electrode 2a to a plurality of light emitting circuit parts L that are separated separately, and the light emitting circuit part L includes one of the insulating temporary fixing part 3. The capacitor is connected in series to each of the plurality of semiconductor light emitting elements E, and the current flows in the forward direction due to the rectification action of the plurality of semiconductor light emitting elements (semiconductor diodes) E.

Therefore, when a positive current flows to the plurality of semiconductor light emitting elements E, good semiconductor light emitting elements E emit light. The light emitting states of the plurality of semiconductor light emitting elements E are observed by the optical instrument 5, and the light emitting states of the plurality of semiconductor light emitting elements E are optically inspected, so that good and bad can be screened based on the light emitting states.

After the pass/fail screening, by detaching the temporary fixing part 3 from any one of the first electrode 1a or the second electrode 2a, a plurality of semiconductor light emitting elements E are separated and arranged together with the temporary fixing part 3. The inspection space S is transported to the installation position P2 and can be installed.

Therefore, it is possible to collectively inspect a plurality of separated semiconductor light-emitting elements E immediately before mounting and screen out semiconductor light-emitting elements E with poor light emission, and arrange them in isolation by the temporary fixing part 3 The selected semiconductor light-emitting elements E are transported and mounted.

As a result, compared with the prior art that performs a light-emitting test in an unseparated state of half-cutting a plurality of LED devices, the temporary fixing part 3 functions not only as an inspection table for a plurality of semiconductor light-emitting elements E, but also as a component handling tool. Since it functions, it is possible to separate the plurality of semiconductor light emitting elements E immediately before mounting after transporting the inspected plurality of semiconductor light emitting elements E to the mounting position P2 and then taking them out from the temporary fixing portion 3 .

Thereby, it is unnecessary to separate the inspected plurality of semiconductor light-emitting elements E before mounting, prevent the dissipation of the semiconductor light-emitting elements E divided in the separation step, and manage and process the plurality of semiconductor light-emitting elements E in units of desired numbers. It is possible to uniformly manage the access height of the temporary fixing part 3 (temporary fixing step) and removal from the temporary fixing part 3 (mounting step) before and after the component transportation, which is excellent in reliability and easy to handle. .

In particular, even a plurality of semiconductor light-emitting elements E-based micro LEDs can be easily mounted and are excellent in operability, and convenience can be improved. Thereby, it is possible to prevent semiconductor light-emitting elements E with defective functions (optics) from being mounted in advance, and to improve yield.

In particular, the temporary fixing part 3 is electrically contacted with the first electrode 1a and the second electrode 2a so that the temporary fixing part 3 sandwiched between the first electrode 1a and the second electrode 2a becomes a dielectric body.

In this case, the AC voltage of the driving power source 4 is applied from the first electrode 1a and the second electrode 2a to the plurality of light emitting circuit parts L through the temporary fixing part 3, thereby, the voltage between the first electrode 1a and the second electrode 2a The temporary fixing part 3 becomes a dielectric body and forms a capacitor.

Therefore, when a positive current flows to the plurality of semiconductor light emitting elements E, good semiconductor light emitting elements E emit light.

Therefore, only by sandwiching the temporary solid state energically between the first electrode 1a and the second electrode 2a The fixed unit 3 can perform light emission inspection of a plurality of semiconductor light emitting elements E. As shown in FIG.

As a result, it is not necessary to make the temporary fixing part 3 always in contact with any one of the first electrode 1a or the second electrode 2a, the overall structure can be simplified, and a plurality of semiconductor light emitting elements E can be easily fixed relative to each other. Temporary fixing work and take-out work of part 3.

Also, when the temporary fixing part 3 is made of a material with a high relative permittivity, the capacitance between the first electrode 1 a and the second electrode 2 a increases due to the temporary fixing part 3 with a high relative permittivity. Since capacitance and impedance are in an inversely proportional relationship, the impedance between the first electrode 1 a and the second electrode 2 a becomes small, and current flows easily.

Therefore, a plurality of semiconductor light emitting elements E can be made to emit light at a low voltage.

As a result, it is possible to reduce the risk of a short circuit (short) while preventing unavoidable destruction of the semiconductor light emitting element E due to high voltage. Thereby, withstand voltage and leakage countermeasures on the device side can also be realized.

In addition, as shown in FIG. 2( a ), it is preferable that the surface of the temporary fixing part 3 has a plurality of temporary fixing parts 3 a arranged at an integer multiple of the arrangement interval of the plurality of semiconductor light emitting elements E.

In this case, with respect to the plurality of semiconductor light emitting elements E spaced apart and arranged at a predetermined period, the interval between the plurality of temporary fixing parts 3a of the temporary fixing part 3 facing in the Z direction can be set to be equal to that of the plurality of semiconductor light emitting elements E Multiple multiples of the permutation interval.

Thereby, among the plurality of semiconductor light emitting elements E arranged separately, only the semiconductor light emitting elements E arranged in a predetermined row or a predetermined position abut against the plurality of temporary fixing parts 3a and are temporarily fixed detachably.

Therefore, it is possible to select and detach (temporarily fix and take out) a specific semiconductor light emitting element E from among the plurality of semiconductor light emitting elements E arranged in isolation from the temporary fixing portion 3 .

As a result, before mounting a plurality of semiconductor light emitting elements E, only the semiconductor light emitting element E to be mounted can be selected and inspected, resulting in excellent workability.

Moreover, it is provided with a dielectric layer 6 disposed on the surface of either one or both of the first electrode 1a or the second electrode 2a, and the dielectric layer 6 is preferably made of a material with a high relative permittivity.

In this case, the AC voltage of the driving power source 4 is applied from the first electrode 1 a and the second electrode 2 a to the plurality of light emitting circuit parts L through the dielectric layer 6 , thereby, in the dielectric layer 6 with a high relative permittivity, , the electrostatic capacity between the first electrode 1a and the second electrode 2a increases.

Since capacitance and impedance are in an inversely proportional relationship, the impedance between the first electrode 1 a and the second electrode 2 a becomes small, and current flows easily.

Therefore, a plurality of semiconductor light emitting elements E can be made to emit light at a low voltage.

As a result, it is possible to reduce the risk of a short circuit (short) while preventing unavoidable destruction of the semiconductor light emitting element E due to high voltage. Thereby, withstand voltage and leakage countermeasures on the device side can also be realized.

In addition, as shown in Fig. 3(a), Fig. 4(a) and Fig. 5(a), Fig. 5(b), the area of one of the first plate 1 or the second plate 2 is smaller than that of the other. The area is small, with respect to one of the first plate 1 or the second plate 2, the other is supported in a direction (XY Direction) relatively free movement is better.

In this case, between the first electrode 1 a and the second electrode 2 a, a plurality of light emitting circuit parts L are formed so as to be larger than the first board 1 or the second board 2 (the first board 1 ). The contact area of the smaller one (second plate 2) is the same size.

Orient the smaller one (second plate 2) to the opposite of the larger one (first plate 1) The direction (XY direction) intersecting the direction (Z direction) moves so as to maintain the distance between the first board 1 and the second board 2 , and AC voltage is applied to the plurality of light emitting circuit parts L from the driving power source 4 . Thereby, the entire area of the larger one (the first board 1 ) is divided into a plurality, and the light emitting states of the plurality of semiconductor light emitting elements E can be inspected in units of divided areas.

Therefore, it is possible to inspect the plurality of semiconductor light emitting elements E spaced apart and arranged in the temporary fixing portion 3 for every appropriate number of divided regions.

As a result, it is effective when inspecting a large temporarily fixed chip group F in which a plurality of semiconductor light emitting elements E are arranged.

In addition, it is preferable to form a dark room D that blocks external light in the inspection facility B.

In this case, the light emission test of a plurality of semiconductor light emitting elements E is carried out in the dark room D, whereby the external light lower than the light emission frequency of each semiconductor light emitting element E is blocked, so that the inside of each semiconductor light emitting element E can not be affected. The luminescence test is carried out in the state where the charge is excited.

Therefore, accurate light emission of the plurality of semiconductor light emitting elements E with respect to the drive power source 4 can be observed.

As a result, semiconductor light-emitting elements E with poor light emission can be more accurately screened, and reliability can be further improved.

In particular, it is preferable to equip the darkroom D with a light source that emits short-wavelength light having a wavelength lower than the light-emitting frequency of the plurality of semiconductor light-emitting elements E, and to uniformly irradiate the short-wavelength light from the light source toward the light-emitting portion E1 of the plurality of semiconductor light-emitting elements E.

In this case, when the darkroom D is formed, inspection is performed while uniformly irradiating short-wavelength light from a pre-installed light source, so that light emission from the light-emitting part E1 of the plurality of semiconductor light-emitting elements E can be reduced. minimum voltage required.

Therefore, even if the driving power supply 4 is set to a low voltage, it is possible to observe the light emission of the plurality of semiconductor light emitting elements E.

As a result, the destruction of the plurality of semiconductor light emitting elements E can be further prevented by lowering the voltage.

In addition, in the foregoing embodiment, the case where a plurality of semiconductor light emitting elements E are detachably mounted on the first electrode 1a and temporarily fixed by the temporary fixing portion 3 formed on the first electrode 1a has been described. However, the present invention is not limited to this, and the temporary fixing portion 3 may be formed on the second electrode 2a, and a plurality of semiconductor light emitting elements E may be detachably suspended from the second electrode 2a and temporarily fixed.

In addition, although the case where the dielectric layer 6 was provided on the 1st electrode 1a and the 2nd electrode 2a was demonstrated, it is not limited to this, The dielectric layer 6 may not exist. In order to ensure insulation instead of the dielectric layer 6 , an air layer can be interposed between the temporarily fixed chip group F and the first electrode 1 a and the second electrode 2 a so that they do not come into contact.

Again, in the example shown in Fig. 3 (a), Fig. 4 (a) and Fig. 5 (a), Fig. 5 (b), the area of the second plate 2 is formed to be smaller than the area of the first plate 1, so that The second plate 2 moves in the XY direction with respect to the first plate 1 by the drive unit 72 for horizontal movement. One plate 1 moves in the XY direction with respect to the second plate 2 by the drive unit 72 for horizontal movement, and both the first plate 1 and the second plate 2 can be relatively moved in the XY direction by the drive unit 72 for horizontal movement .

1: first board

1a: first electrode

2: Second board

2a: Second electrode

3(31):Temporarily fixed part

3a: Temporary fixed position

4: Drive power

5: Optical instruments

6: Dielectric layer

7(71): Drive Department

8: Control Department

A: Check device

E: Semiconductor light emitting element

E1: Luminous Department

H: Hold Chuck

F: Temporarily fixed chipset

L: Lighting Circuit Department

S: check space

Claims (8)

An inspection device, which is characterized in that it optically inspects a plurality of semiconductor light-emitting elements arranged separately in a separated state before mounting, and includes: a first board with a first electrode; The second electrode facing the first electrode; the insulating temporary fixing part, which temporarily fixes the plurality of semiconductor light-emitting elements in a separated and arranged state; And the aforementioned second electrode is electrically connected; and an optical instrument, which observes the light emission of the aforementioned plurality of semiconductor light-emitting elements from the side of any one of the aforementioned first plate or the aforementioned second plate; the aforementioned temporary fixing part has a detachable mounting In any one of the aforementioned first electrode or the aforementioned second electrode, the temporary fixing portion facing the aforementioned plurality of semiconductor light-emitting elements, the aforementioned plurality of semiconductor light-emitting elements can be separated and arranged in a state through the aforementioned temporary fixing portion The test space between the first electrode and the second electrode is provided with a plurality of separately separated light emitting circuit parts, and the light emitting circuit part is connected in series and includes the plurality of semiconductors. The capacitors of the light-emitting element and the temporary fixing part, and the plurality of light-emitting circuit parts are such that the plurality of semiconductor light-emitting elements emit light when forward current flows from the driving power supply to the plurality of semiconductor light-emitting elements. The inspection device according to claim 1, wherein the temporary fixing part is made of a dielectric body It is in electrical contact with the aforementioned first electrode and the aforementioned second electrode. The inspection device according to claim 1 or 2, wherein the surface of the temporary fixing part has a plurality of temporary fixing parts arranged as an integral multiple of the arrangement interval of the plurality of semiconductor light emitting elements. The inspection device according to claim 1 or 2, which is provided with a dielectric layer disposed on the surface of any one of the aforementioned first electrode or the aforementioned second electrode or both surfaces, and the aforementioned dielectric layer includes a relative permittivity of Materials with a high relative permittivity above 80. The inspection device according to claim 1 or 2, wherein the area of any one of the aforementioned first plate or the aforementioned second plate is formed to be smaller than the area of the other, and for one of the aforementioned first plate or the aforementioned second plate The other is supported relatively movable in a direction intersecting with the opposing direction of the aforementioned first plate and the aforementioned second plate, or both of the aforementioned first plate and the aforementioned second plate are aligned with the aforementioned first plate and the aforementioned second plate. The direction in which the opposing directions of the second plate intersect is supported so as to be relatively movable. An inspection device is characterized in that it is equipped with the inspection device according to claim 1 or 2, and the inspection device forms a dark room shielded from external light. The inspection device according to claim 6, wherein the darkroom is equipped with a light source emitting short-wavelength light rays having a light emission frequency lower than that of the plurality of semiconductor light-emitting elements, and uniform irradiation from the light source toward the light-emitting parts of the plurality of semiconductor light-emitting elements does not cause The aforementioned short-wavelength light at the intensity of photoexcitation due to photoluminescence. An inspection method, which is characterized in that it optically inspects a plurality of semiconductor light emitting elements arranged separately in a separated state before mounting, and includes: a temporary fixing step, which allows the plurality of semiconductor light emitting elements to be freely attached and detached in a state arranged separately Temporarily fixed to the insulating temporary fixing part; the step of installing the temporary fixing part detachably on any one of the first electrode of the first plate or the second electrode of the second plate is formed on the first In the inspection space between the electrode and the second electrode, a plurality of light-emitting circuit parts are separately separated, and the light-emitting circuit part is connected in series, including the plurality of semiconductor light-emitting elements and the capacitor of the temporary fixing part; supply process, which is obtained from the first An electrode and the aforementioned second electrode apply the voltage of the driving power supply to the aforementioned plurality of light emitting circuit parts; the observation process is observed from the side of any one of the aforementioned first board or the aforementioned second board by using an optical instrument to observe the aforementioned plurality of The above-mentioned plurality of semiconductor light-emitting elements that emit light by supplying voltage to each light-emitting circuit portion; and the mounting step of removing the above-mentioned plurality of semiconductor light-emitting elements from the aforementioned temporary fixing portion and performing board mounting; in the aforementioned installation step, the aforementioned temporary fixing portion has With regard to the temporary fixing part of the aforementioned plurality of semiconductor light emitting elements, and the aforementioned plurality of semiconductor light emitting elements can be transported from the aforementioned inspection space to the installation position in a state of being separated and arranged through the aforementioned temporary fixing position and held therein, in the aforementioned observation step, When a forward current flows from the driving power source to the plurality of semiconductor light emitting elements in the inspection space, the plurality of semiconductor light emitting elements For light emission, in the mounting step, substrate mounting is performed by detaching the plurality of semiconductor light emitting elements from the temporary fixing portion transported from the inspection space to the mounting position.

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