TWI795528B - Processing device - Google Patents

Abstract

Provided is a processing device that does not confuse the correction of the deviation of the cutting line and the correction of the deviation of the processing groove including the cutting groove and the dividing groove. The processing device (12) is at least equipped with: holding means (14) for holding the wafer (2); Form processing ditch (54); And X-axis feeding means, will keep means (14) and processing means (16) in X-axis direction processing feed relatively; And Y-axis feeding means, will keep means (14) and processing means ( 16) Relatively graded feeding in the Y-axis direction orthogonal to the X-axis direction; and the photographing means (18) has a microscope (36), and the microscope (36) photographs the wafer held in the holding means (14) ( 2) It has a reference line (L) for detecting the cutting line (4) and the processing groove (54); and a display means (20). In the display means (20), it is displayed: the image display part (38), which displays the image captured by the shooting means (18); and the cutting line correction button (40), which is used to align the cutting line (4) with the reference line The deviation of (L) is memorized as a correction value; and the processing groove correction button (42) is used to memorize the deviation of the processing groove (54) and the reference line (L) as a correction value; and the Y-axis actuating part ( 46), actuate the Y-axis feeding means; and a pair of movable wires (48), sandwich the reference line (L) and keep the line symmetry and approach and stay away from the reference line (L); and the movable wire actuating part (50), will A pair of movable wires (48) act. The interval between a pair of movable lines (48) is set to be recognized as the width of the cutting line (4), and when set to be recognized as the width of the processing groove (54). In the case of an interval between frames, the color of a pair of movable lines (48) changes. The color of the kerf correction button (40) is set to be the same color as the color of a pair of movable lines (48) when it is set to be recognized as the width interval of the kerf (4). The color of the processing groove correction button (42) is set to be the same color as the color of a pair of movable lines (48) when it is set to be recognized as the width interval of the processing groove (54).

Description

Processing device

The present invention relates to a processing device for forming a processing groove. The processing groove divides a plurality of devices (devices) separated by dicing streets (streets) to divide a wafer formed on the surface into individual devices.

Components such as IC and LSI are separated by dicing lines (segmentation planning lines) and formed on the surface of the wafer. The dicing lines are cut by the cutting device to be divided into individual components, and the separated components are divided into individual components. Used in electronic devices such as mobile phones and personal computers.

A cutting device at least includes: holding means for holding a wafer; and a cutting means for cutting a dicing line of a wafer held by the holding means with a cutting blade capable of rotating the cutting blade; and an X-axis feeding means for The holding means and the cutting means are cut and fed relative to the X-axis direction; and the Y-axis feeding means are indexed and fed by the holding means and the cutting means in the Y-axis direction perpendicular to the X-axis direction; and the photographing means has a microscope, This microscope photographs the wafer held by the holding means and is provided with reference lines for detecting dicing lines and cutting grooves; and display means; and can cut the dicing lines of the wafer with high precision (for example, refer to Patent Document 1).

That is, in display means, the system displays: image display part, to display the image captured by the shooting means; and the cutting line correction button, used to store the deviation between the cutting line and the reference line as a correction value; The deviation amount memory is used as a correction value; and the X-axis actuating part is used to actuate the X-axis feeding means; and the Y-axis actuating part is used to actuate the Y-axis feeding means; away from the reference line; and the movable line actuating part, actuating a pair of movable lines; when the Y-axis actuating part is actuated, the center of the cutting line is placed on the reference line and the distance between the pair of movable lines is placed on the width of the cutting line In the case of the frame, if you touch the cutting line correction button, the moving distance of the cutting line will be memorized as the correction value in the Y-axis direction, and will be corrected as the reference line and the cutting line in the next indexing feed of the cutting line. Central unanimity.

In addition, when the Y-axis actuating part is actuated so that the center of the cutting groove is placed on the reference line and the distance between a pair of movable lines is placed on the width of the cutting groove, the cutting groove will be cut when the cutting groove correction button is touched. The moving distance in the Y-axis direction will be memorized as the correction value in the Y-axis direction, and will be corrected so that the reference line coincides with the center of the cutting groove in the next indexing feed of the cutting road and the cutting groove will be formed on the cutting road the central.

[Prior Art Literature] [Patent Document]

[Patent Document 1] Japanese Patent Laid-Open No. 2014-113669

However, when the Y-axis actuating part is actuated so that the center of the cutting line is placed on the reference line and the distance between a pair of movable lines is placed on the width of the cutting line, if the cutting groove correction button is touched, the cutting line The correction value of the cutting groove will be memorized as the correction value of the cutting groove, but there is a problem that the cutting track cannot be cut with high precision because of the high-precision index feeding.

In addition, when the Y-axis actuating part is actuated so that the center of the cutting groove is placed on the reference line and the distance between a pair of movable lines is placed on the width of the cutting groove, the cutting groove will be cut when the kerf correction button is touched. The correction value will be memorized as the correction value of the cutting line, but there is a problem that the center of the cutting line cannot be cut with high precision.

The above-mentioned problem may also occur in a laser processing device that irradiates a laser beam to a scribe line to form a dividing groove.

The problem to be solved of the present invention developed in view of the above facts is to provide a processing device that does not confuse the correction of the deviation of the cutting line and the correction of the deviation of the processing groove including the cutting groove and the dividing groove.

In order to solve the above-mentioned problem to be solved, the present invention provides the following processing apparatus. That is to say, a processing device is a processing device that forms a processing groove. The processing groove divides a wafer formed on the surface of a plurality of components by dicing streets (streets) into individual components. The device at least has: holding means, holding the wafer; and processing means, forming a processing groove on the dicing lane of the wafer held by the holding means; opposite direction ground processing feeding; and Y-axis feeding means, the holding means and the processing means are indexed and fed relative to the Y-axis direction perpendicular to the X-axis direction; The wafer of the means has the reference line for detecting the scribe line and the processing groove; and the display means; in the display means, it is displayed: the image display part displays the image captured by the shooting means; and the scribe line correction button is used for To store the deviation between the cutting line and the reference line as a correction value; and the processing groove correction button is used to store the deviation between the processing groove and the reference line as a correction value; and the Y-axis actuating part, the Y Axis feeding means is actuated; and a pair of movable wires sandwiches the reference line to maintain line symmetry and approaches and moves away from the reference line; and a movable wire actuating part operates the pair of movable wires; the distance between the pair of movable wires, The color of the pair of movable lines changes when it is set to be the interval between the widths that will be recognized as the slit and when it is set to the interval between the widths that will be recognized as the processing groove. , the color of the kerf correction button is set to be the same color as the color of the pair of movable lines when it is set to be recognized as the interval between the widths of the kerf, the color of the processing groove correction button, It is set to be the same color as the color of the pair of movable lines when it is set to be recognized as the interval between the widths of the processing grooves.

Preferably, when the interval between the pair of movable lines is not set to be recognized as the interval between the widths of the cutting lines, an error will be reported if the cutting line correction button is touched, and when the pair of movable lines If the interval of is not set to be recognized as the width interval of the processing groove, an error will be reported if the processing groove correction button is touched. Suitably, when the Y-axis actuating part is actuated to move the position of the cutting line displayed on the image display part to When moving to the reference line and actuating the movable wire actuating part to make the pair of movable wires coincide with the width of the cutting line, if the cutting line correction button is touched, the moving distance of the cutting line will be memorized as the cutting The correction value of the track, when the Y-axis actuating part is actuated to move the position of the processing groove displayed on the image display part to the reference line and the movable line actuating part is actuated to make the pair of movable lines coincide with In the case of the width of the processing groove, if the processing groove correction button is touched, the moving distance of the processing groove will be memorized as the correction value of the processing groove. The processing means is a cutting means provided with a cutting blade and the cutting blade can be rotated, and it is convenient if the processing groove is a cutting groove.

The processing device provided by the present invention has at least: a holding means for holding the wafer; and a processing means for forming a processing groove on the dicing lane of the wafer held by the holding means; and an X-axis feeding means for connecting the holding means to the wafer The processing means is processed and fed relatively in the X-axis direction; and the Y-axis feed means is used to index and feed the holding means and the processing means in the Y-axis direction perpendicular to the X-axis direction; and the photographing means has a microscope, the The microscope photographs the wafer held by the holding means and has a reference line for detecting the dicing line and the cutting groove; and the display means; on the display means, it is displayed: the image display part displays the image captured by the imaging means; and The cutting line correction button is used to store the deviation between the cutting line and the reference line as a correction value; and the processing groove correction button is used to store the deviation between the processing groove and the reference line as a correction value; and the Y axis an actuating part for actuating the Y-axis feeding means; and a pair of movable wires sandwiching the reference line to maintain line symmetry and connect close to and away from the reference line; and the movable wire actuating part, which actuates the pair of movable wires; the interval between the pair of movable wires is set to be recognized as the interval between the width of the cutting line; and When it is set to be recognized as the gap between the width of the processing groove, the color of the pair of movable lines changes, and the color of the kerf correction button is set to be recognized when it is set to The color of the pair of movable lines is the same color when the width interval of the cutting line is the same color, and the color of the processing groove correction button is set to be recognized as the width interval of the processing groove when it is set. In this case, the pair of movable lines have the same color, so the deviation between the cutting line and the reference line will not be stored as the correction value of the processing groove, and the deviation between the processing groove and the reference line will not be stored as the correction of the cutting line value, it is possible to perform indexing feeding with high precision and form high-precision processing grooves on the cutting track.

2: Wafer

4: Cutting Road

12: Cutting device (processing device)

14: Keep Means

16: Cutting means (processing means)

18: Shooting means

20: Display means

34: Cutter

36: Microscope

38: Image display unit

40: Cutting path correction button

42: Processing groove correction button

46: Y-axis actuating part

48: Movable line

50: Movable wire moving part

54: cutting groove (processing groove)

L: baseline

[Fig. 1] A perspective view of a wafer.

[ Fig. 2 ] A perspective view of a processing device constructed in accordance with the present invention.

[Fig. 3] A perspective view of the imaging means and the wafer during correction.

[ Fig. 4 ] A model diagram showing an image of the display means shown in Fig. 2 .

[Fig. 5] Model diagram of the image before correction.

[ Fig. 6] Fig. 6 is a model diagram of an image in a state where the position of the scribe line is moved to the reference line from the state shown in Fig. 5 .

[ Fig. 7 ] A model diagram of an image in a state where a pair of movable lines are aligned with the width of the scribe line from the state shown in Fig. 6 .

[ Fig. 8] Fig. 8 is a model diagram of an image in a state where the position of the processing groove is moved to the reference line from the state shown in Fig. 7 .

[ Fig. 9 ] A model diagram of an image in a state where a pair of movable lines are aligned with the width of the processing groove from the state shown in Fig. 8 .

Embodiments of the processing apparatus constructed in accordance with the present invention will be described below with reference to the drawings.

In FIG. 1 there is shown a disk-shaped wafer 2 which can be processed by a processing device constructed in accordance with the present invention. The surface 2a of the wafer 2 is partitioned into a plurality of rectangular areas by a plurality of dicing lines 4 formed in a lattice, and a plurality of elements 6 such as ICs and LSIs are formed in each of the plurality of rectangular areas. The wafer 2 in the illustrated embodiment is attached to an adhesive tape 10 whose peripheral edge is fixed to a ring frame 8 .

The cutting device 12 shown in FIG. 2 is an example of a processing device configured according to the present invention, and at least possesses: a holding means 14 for holding a wafer 2; The cutting road 4 forms the processing means of processing groove; And X-axis feeding means (not shown), will keep means 14 and cutting means 16 in X-axis direction (direction shown by arrow X among Fig. 1) processing feed relatively; And Y-axis feeding means (not shown), will keep means 14 and cutting means 16 in the Y-axis direction (direction shown by arrow Y among Fig. 1) that is perpendicular to X-axis direction with holding means 14 and relatively index feed; And photographing means 18; and display means 20 . In addition, the planes specified by the X-axis direction and the Y-axis direction are substantially horizontal. In addition, the direction of the Z axis shown by the arrow Z in Figure 1 is the same as the direction of the X axis. and the Y-axis direction are perpendicular to the up-down direction.

The holding means 14 includes a circular chuck table 24 mounted on the device case 22 to be rotatable and movable in the X-axis direction. The chuck table 24 is rotated around an axis extending in the Z-axis direction by a chuck table motor (not shown) incorporated in the device case 22 . The above-mentioned X-axis feeding means in the illustrated embodiment is composed of a ball screw (not shown) that is connected to the chuck table 24 and extends in the X-axis direction, and a motor (not shown) that rotates the ball screw. , relative to the cutting means 16, the chuck platform 24 is processed and fed in the X-axis direction. On the upper end portion of the chuck platform 24, a porous circular adsorption chuck 26 connected to a suction means (not shown) is arranged. This attraction holds the wafer 2 carried thereon. In addition, a plurality of clamps (clamps) 28 for fixing the annular frame 8 are arranged at intervals in the circumferential direction on the periphery of the chuck platform 24 .

The cutting means 16 includes: a mandrel cover 30, which is supported by the device cover 22 freely movable in the Y-axis direction and freely movable (lifting freely) in the Z-axis direction; rotatably supported by the mandrel housing 30 ; and a motor (not shown) to rotate the mandrel 32 ; and a cutting knife 34 fixed to the tip of the mandrel 32 . In this way, the cutting means 16, which is a processing means for forming processing grooves on the scribe line 4 of the wafer 2, is provided with a cutting blade 34, and the cutting blade 34 can be rotated. The groove is a cutting groove formed by the cutting blade 34 . The above-mentioned Y-axis feeding means is composed of a ball screw (not shown) that is connected to the spindle housing 30 and extends toward the Y-axis direction, and a motor (not shown) that makes the ball screw rotate. As shown), the mandrel housing 30 is indexed and fed relative to the holding means 14 in the Y-axis direction. In addition, the spindle housing 30 is rotated in the Z-axis by a Z-axis feeding means composed of a ball screw (not shown) extending in the Z-axis direction and a motor (not shown) that rotates the ball screw. The direction is cut into the feed (lift).

As shown in FIG. 2 , the photographing means 18 is disposed above the moving path of the chuck platform 24 . 3 and 4, the photographing means 18 has a microscope 36, and the microscope 36 photographs the wafer 2 held in the holding means 14 and is equipped with a detection scribe line 4 and a processing groove (cutting groove in the illustrated embodiment). ) of the reference line L (refer to Figure 4). The reference line L extending in the X-axis direction is formed on a lens of the microscope 36 or an imaging element (not shown) such as a CCD. In addition, the microscope 36, supported by the spindle housing 30, is moved in the Y-axis direction by the Y-axis feeding means together with the spindle housing 30, and is moved in the Z-axis direction by the Z-axis feeding means.

The display means 20 in the illustrated embodiment is constituted by a touch panel provided on the upper front surface of the device cover 22 . As shown in Figure 4, on the display means 20, it is displayed: an image display part 38, which displays the image captured by the photographing means 18; To be memorized as a correction value; and the processing groove correction button 42 is used to memorize the deviation between the processing groove and the reference line L as a correction value; and the X-axis actuating part 44 is used to actuate the X-axis feeding means; and the Y-axis actuating part 46, actuating the Y-axis feeding means; and a pair of movable wires 48, sandwiching the reference line L to maintain line symmetry and approaching and away from the reference line L; and a movable wire actuating part 50, actuating a pair of movable wires 48; and correcting Value display section 52.

The image display part 38, which sets the horizontal axis as the X-axis direction and the vertical axis as the Y-axis direction to display the image captured by the photographing means 18, is set with the reference line L of the photographing means 18 as A pair of movable lines 48 that are line-symmetrical to the axis of symmetry are shown parallel to the X-axis direction. It is designed that when the interval between the pair of movable wires 48 is set to be recognized as the interval (for example, 45 μm or more) between the width (for example, 50 to 60 μm) of the cutting line 4, and when it is set to be When the interval (for example, less than 45 μm) is recognized as the width (for example, 25 to 35 μm) of the processing groove, the color of the pair of movable lines 48 displayed on the image display unit 38 changes. For example, when the interval between a pair of movable lines 48 is set to be recognized as the interval between the widths of the cutting lines 4, the color of the pair of movable lines 48 is red, and when the interval between the pair of movable lines 48 is set to be The color of the pair of movable wires 48 is blue when it is recognized as the gap between the widths of the processing grooves. In addition, the color of the kerf correction button 40 is set to be the same color (for example, red) as the color of the pair of movable lines 48 when it is set to be recognized as the interval between the widths of the kerf 4 , and the groove is processed. The color of the correction button 42 is set to be the same color (for example, blue) as the color of a pair of movable lines 48 when it is set to be recognized as the interval between the widths of the processing grooves.

The cutting line correction button 40 is a button for storing the deviation between the cutting line 4 and the reference line L as a correction value in the memory means (not shown) of the cutting device 12. When the Y-axis actuating part 46 is actuated, the When the position of the cutting line 4 displayed on the image display part 38 is moved to the reference line L, and the movable line actuating part 50 is actuated to make the pair of movable lines 48 coincide with the width of the cutting line 4, if the touch cut Road correction button 40 then cuts the moving distance of road 4 The distance is stored in the above-mentioned memory means as a correction value of the slit 4 . In the illustrated embodiment, as described above, the color of the kerf correction button 40 is set to the color of the movable line 48 when it is set to be recognized as the interval between the widths of the kerf 4 . The same color, so when the deviation between the cutting line 4 and the reference line L is memorized as the correction value, the color of the pair of movable lines 48 and the color of the cutting line correction button 40 are the same color, so the operator will not mistakenly touch the processing groove correction button 42.

The processing groove correction button 42 is a button for storing the deviation amount between the processing groove and the reference line L as a correction value in the above-mentioned memory means. When the Y-axis actuating part 46 is actuated, the processing displayed on the image display part 38 When the position of the groove is moved to the reference line L, and the movable wire actuating part 50 is actuated to make the pair of movable wires 48 coincide with the width of the processing groove, if the processing groove correction button 42 is touched, the moving distance of the processing groove will be It is memorized in the above-mentioned memory means as a correction value of the processing groove. In the illustrated embodiment, as described above, the color of the processing groove correction button 42 is set to be the same color as the color of a pair of movable lines 48 when it is set to be recognized as the interval between the widths of the processing groove. Therefore, when the deviation between the processing groove and the reference line L is stored as the correction value, the color of the pair of movable lines 48 and the color of the processing groove correction button 42 are the same color, so the operator will not accidentally touch the cutting line correction button 40 .

In addition, in the illustrated embodiment, it is designed so that when the distance between the pair of movable lines 48 is not set to be recognized as the wide distance between the cutting lines 4, when the cutting line correction button 40 is touched, a notification will be given. Error, when the interval between a pair of movable lines 48 is not set to be recognized as the interval between the width of the processing groove, if the processing groove correction button 42 is touched, it will be reported mistake. Therefore, when the deviation between the cutting line 4 and the reference line L is stored as a correction value, even if the operator accidentally touches the processing groove correction button 42, the correction value of the cutting line 4 will not be used as the correction value of the processing groove. Memory in the above memory means. In addition, when the deviation between the processing groove and the reference line L is stored as a correction value, even if the operator touches the cutting line correction button 40 by mistake, the correction value of the processing groove will not be stored as the correction value of the cutting line 4 in the the above memory means. In addition, as notification of an error, an error display on the display means 20 , flickering or lighting of a warning lamp (not shown), notification by a warning sound, etc. can be mentioned.

The X-axis actuating part 44 has a right direction actuating part 44a that actuates the X-axis feeding means to move the imaging area caused by the imaging means 18 to the right in FIG. 4, and actuates the X-axis feeding means to make the imaging means 18 The resulting shooting area moves to the left direction actuating part 44b in the left direction in FIG. 4 . In addition, the Y-axis actuating part 46 has an upward direction actuating part 46a for actuating the Y-axis feeding means to move the imaging means 18 upward in FIG. In the downward direction, the downward direction actuating part 46b is moved. In addition, the movable wire actuating part 50 has a movable wire approaching part 50a that makes the pair of movable wires 48 approach toward the reference line L while maintaining a line-symmetrical relationship with the reference line L as the axis of symmetry, and a movable wire approaching part 50a that keeps the reference line L as the axis of symmetry. The line-symmetric relationship between the symmetry axes makes the pair of movable wires 48 farther away from the reference line L than the movable wire distance part 50b.

When cutting trenches are formed on the dicing lines 4 of the wafer 2 using the above-mentioned cutting device 12 , firstly, the surface 2 a of the wafer 2 faces upward, and the wafer 2 is sucked and held on the chuck table 24 . In addition, with multiple clips Tool 28 fixes the ring frame 8. Next, the wafer 2 is photographed from above by the photographing means 18, based on the image of the wafer 2 photographed by the photographing means 18, the X-axis feeding means, the Y-axis feeding means, and the chuck table are motorized to make The scribe line 4 is aligned in the X-axis direction, and the cutting blade 34 is placed above the scribe line 4 aligned in the X-axis direction. Next, the cutter 34 is rotated together with the spindle 32 by a motor. Next, the mandrel housing 30 is lowered by the Z-axis feeding means, the tip of the cutting knife 34 is cut into the cutting line 4 aligned in the X-axis direction, and the X-axis feeding means is actuated to clamp the cutting means 16. The disk table 24 is relatively processed and fed in the direction of the X axis, thereby performing cutting processing along the dicing lane 4 to form cutting grooves for dividing the wafer 2 into individual components 6 . Next, the cutting means 16 is fed to the chuck platform 24 by the Y-axis by the amount of the pre-set index feeding amount (the interval in the Y-axis direction of the cutting line 4 in the state before being applied to the cutting process). Means to do index feed in Y axis direction. Then, when the cutting process and the index feeding are repeated alternately so as to perform the cutting process on the entire cutting line 4 aligned in the X-axis direction, if the cutting groove is formed by the cutting device 12 as described above, the cutting process will occur. The cutting process is accompanied by a deviation in the Y-axis direction of the cutting line 4 or a deviation in the Y-axis direction of the cutting blade 34 caused by the thermal expansion of the mandrel 32 . In the state where such a deviation has occurred, if the index feed is performed while performing the cutting process repeatedly with the index feed amount set in advance, the element 6 may be damaged by cutting to a position away from the scribe line 4 . In view of this, when the cutting groove is formed by the cutting device 12, the machining position correction (that is, the correction of the deviation between the cutting road 4 and the cutting groove) will be performed after several times of cutting. In the correction of the processing position, firstly, the Y-axis between the cutting line 4 and the reference line L is obtained. Then, the machining groove correction is performed to obtain the deviation amount between the cutting groove and the reference line L in the Y-axis direction and store it as the correction value of the cutting groove. In addition, the cutting groove formed along the scribe line 4 is indicated by reference numeral 54 in FIG. 3 .

In the kerf correction, firstly, as shown in FIG. 3 , the X-axis feeding means and the Y-axis feeding means are actuated to align the wafer 2 and the imaging means 18, and the imaging means 18 captures the area where the cutting groove 54 has recently been formed. Cutting lane 4. The image captured by the imaging means 18 is displayed on the image display unit 38 of the display means 20 as shown in FIG. 5 , for example. In the image displayed on the image display unit 38 at this time, the distance between the pair of movable lines 48 is set to be recognized as the wide distance between the scribe lines 4 (for example, 45 μm or more), and the pair of movable lines 48 The color of and the color of the cutting line correction button 40 are the same color (for example, red). In addition, when a metal pattern called TEG (Test Element Group; test element group) is periodically provided on the dicing line 4, metal burrs and the like are generated in the cutting groove where the TEG is cut. The cutting groove here is likely to be mistaken for the metal burr as the cutting groove. Therefore, in such a case, the position of the cutting road 4 photographed by the photographing means 18 will be adjusted by actuating the X-axis actuating part 44. Cutting groove where TEG is installed. Next, based on the captured image, the Y-axis actuator 46 is actuated to move the Y-axis central position of the scribe line 4 displayed on the image display section 38 toward the reference line L as shown in FIG. 6 . At this time, the operator looks at the captured image and adjusts the position of the cutting line 4 with the naked eye so that the central position of the cutting line 4 in the Y-axis direction coincides with the reference line L. One action to set the central position of the cutting line 4 in the Y-axis direction correctly Put it on the reference line L. Therefore, the movable wire actuating part 50 is actuated to fit the distance between the pair of movable wires 48 to the width of the scribe line 4 to check whether the central position of the scribe line 4 in the Y-axis direction coincides with the reference line L. As mentioned above, a pair of movable wires 48 approach and stay away from each other while keeping the relationship of line symmetry with the reference line L as the axis of symmetry. The central position of the track 4 in the Y-axis direction coincides with the reference line L. Then, the action of the Y-axis actuating part 46 and the action of the movable wire actuating part 50 are repeated appropriately. When the distance between a pair of movable wires 48 is consistent with the width of the cutting line 4 as shown in FIG. track correction button 40 . In this way, the moving distance of the scribe line 4 in the Y-axis direction from the position before correction (the amount of deviation between the scribe line 4 and the reference line L) will be stored as the correction value of the scribe line 4 in the Y-axis direction. The above-mentioned memory means of the cutting device 12. The correction value of the scribe line 4 is displayed on the correction value display part 52 of the display means 20 (-5.5 μm in the illustrated embodiment). In addition, in FIG. 7 , for simplicity, a pair of movable wires 48 are described with an interval slightly wider than the width of the scribe line 4 .

Next, processing groove correction will be described. The machining groove correction starts from the state where the central position of the cutting line 4 in the Y-axis direction coincides with the reference line L. First, as shown in FIG. The central position of the cutting groove 54 in the Y-axis direction at 38 moves toward the reference line L. Next, the movable wire actuating part 50 is actuated to fit the distance between the pair of movable wires 48 to the width of the cutting groove 54 to confirm whether the central position of the cutting groove 54 in the Y-axis direction coincides with the reference line L. At this time, the color of the pair of movable wires 48 changes to be the same color (for example, blue) as the color of the processing groove correction button 42 . Then, the action of the Y-axis action part 46 and the action of the movable line are repeated appropriately. When the action of the moving part 50 is as shown in FIG. 9 , when the distance between a pair of movable wires 48 is consistent with the width of the cutting groove 54, the processing groove correction button 42 is touched. In this way, the movement distance of the cutting groove 54 in the Y-axis direction calculated from the state where the central position of the scribe line 4 in the Y-axis direction coincides with the reference line L is calculated as a correction value in the Y-axis direction of the cutting groove 54. It is memorized in the above-mentioned memory means of the cutting device 12 . The correction value of the cutting groove 54 is displayed on the correction value display part 52 of the display means 20 (+1.2 μm in the illustrated embodiment). In addition, in FIG. 9 , for simplicity, a pair of movable wires 48 are described with an interval slightly wider than the width of the cutting groove 54 .

In the correction of the machining position as described above, first in the correction of the cutting line, the moving distance of the cutting line 4 in the Y-axis direction (the deviation between the cutting line 4 and the reference line L) from the position before correction is obtained, and then In the processing groove correction, the movement distance of the cutting groove 54 in the Y-axis direction (the amount of deviation between the cutting groove 54 and the reference line L) calculated from the state where the central position of the scribe line 4 in the Y-axis direction coincides with the reference line L is obtained. Therefore, the amount of deviation between the scribe line 4 and the cutting groove 54 can be accurately calculated using the reference line L. Then, by adding the correction value of cutting groove 54 to the index feed amount set in advance, the index feed amount after correction is used for index feed, so that the center position in the Y-axis direction of the cutting line 4 can be Cut grooves 54 are formed.

In the embodiment shown above, when the distance between the pair of movable wires 48 is set to be recognized as the width distance of the scribe line 4 and is set to be recognized as the cutting groove 54 In the case of intervals between widths, the color of a pair of movable lines 48 will change, and the color of the line correction button 40 is set to and when set to be recognized as the line 4 In the case of a wide interval, the color of a pair of movable lines 48 is the same color, so the operator can carry out the cutting line by touching the line correction button 40 with the same color as the pair of movable lines 48 during the line correction Correction without accidentally touching the processing groove correction button 42. In addition, in the illustrated embodiment, the color of the processing groove correction button 42 is set to be the same color as the color of the movable line 48 when it is set to be recognized as the interval between the widths of the cutting groove 54, Therefore, during the processing groove correction, the operator can perform the processing groove correction by touching the processing groove correction button 42 of the same color as the pair of movable lines 48 , and the operator will not accidentally touch the cutting line correction button 40 . Therefore, in the illustrated embodiment, the deviation between the cutting line 4 and the reference line L is not stored as the correction value of the cutting groove 54, and the deviation between the cutting line 54 and the reference line L is not stored as the cutting line. With a correction value of 4, it is possible to perform index feeding with high precision and form a high-precision cutting groove 54 on the cutting road 4 .

In addition, in the illustrated embodiment, although the cutting device 12 provided with the cutting blade 34 for cutting the scribe line 4 of the wafer 2 held by the holding means 14 and the cutting means 16 capable of rotating the cutting blade 34 has been described. , but may also be a laser processing apparatus including laser beam irradiation means for forming division grooves by irradiating laser beams to the dicing lines 4 of the wafer 2 held by the holding means.

4‧‧‧Cutting Road

20‧‧‧display means

38‧‧‧Image display unit

40‧‧‧Cutting line correction button

42‧‧‧Processing groove correction button

44‧‧‧X-axis actuator

44a‧‧‧Right direction actuating part

44b‧‧‧Left direction actuating part

46‧‧‧Y-axis actuator

46a‧‧‧upward actuating part

46b‧‧‧Down direction actuating part

48‧‧‧movable line

50‧‧‧Moveable wire moving part

50a‧‧‧Moveable wire close part

50b‧‧‧movable line away from the part

52‧‧‧Correction value display part

54‧‧‧Cutting groove (processing groove)

L‧‧‧base line

Claims (4)

A processing device is a processing device that forms a processing groove. The processing groove is to divide a wafer formed on the surface of a plurality of components by dicing streets (streets) into individual components. The processing device has at least : holding means, holding the wafer; and processing means, forming a processing groove in the dicing lane of the wafer held by the holding means; and X-axis feeding means, processing the holding means and the processing means in the X-axis direction feeding; and Y-axis feeding means, the holding means and the processing means are indexed and fed relative to the Y-axis direction perpendicular to the X-axis direction; The wafer has reference lines for detecting scribe lines and processing grooves; and display means; in the display means, it is displayed: an image display part, which displays images captured by the shooting means; and a scribe line correction button, which is used to change the The deviation between the cutting line and the reference line is memorized as a correction value; and the processing groove correction button is used to store the deviation between the processing groove and the reference line as a correction value; and the Y-axis actuating part feeds the Y-axis means to actuate; and a pair of movable wires, which surround the reference line and keep the lines symmetrical and approach and stay away from the reference line; and a movable wire actuating part, which actuates the pair of movable wires; The color of the pair of movable lines changes when the interval between the widths is set to be recognized as the cutting line and when the interval between the widths is set to be recognized as the processing groove. The color of the kerf correction button, is set to and when set to When the color of the pair of movable lines is the same color when it is recognized as the interval between the width of the cutting line, the color of the processing groove correction button is set to and when it is set to be recognized as the width of the processing groove The color of the pair of movable lines is the same color when there is a gap between them. The processing device described in claim 1 of the scope of the patent application, wherein, when the distance between the pair of movable lines is not set to be recognized as the wide distance between the cutting lines, if the cutting line correction button is touched An error will be reported. When the interval between the pair of movable lines is not set to be recognized as the interval between the width of the processing groove, an error will be reported if the processing groove correction button is touched. The processing device described in Claim 1, wherein when the Y-axis actuating part is actuated, the position of the cutting line displayed on the image display part is moved to the reference line and the movable line actuating part When actuating to make the pair of movable lines consistent with the width of the cutting line, if the cutting line correction button is touched, the moving distance of the cutting line will be memorized as the correction value of the cutting line. When the Y-axis actuating part When actuating to move the position of the processing groove displayed on the image display part to the reference line and actuating the movable line actuating part to make the pair of movable lines coincide with the width of the processing groove, if the touch If the processing groove correction button is used, the moving distance of the processing groove will be memorized as the processing Groove correction value. The processing device described in Claim 1, wherein the processing means is a cutting means provided with a cutting blade and the cutting blade can be rotated, and the processing groove is a cutting groove.

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