TWI547333B - Laser cut apparatus - Google Patents

Laser cut apparatus Download PDF

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Publication number
TWI547333B
TWI547333B TW102104257A TW102104257A TWI547333B TW I547333 B TWI547333 B TW I547333B TW 102104257 A TW102104257 A TW 102104257A TW 102104257 A TW102104257 A TW 102104257A TW I547333 B TWI547333 B TW I547333B
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image capturing
panel
cut
light source
lens
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TW102104257A
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TW201431631A (en
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羅信宏
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旭東機械工業股份有限公司
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Description

雷射切割設備 Laser cutting equipment

本發明係關於一種雷射切割設備,尤其涉及一種具有精準定位且於精準定位後能同時完成雷射切割及檢測的雷射切割設備。 The invention relates to a laser cutting device, in particular to a laser cutting device with precise positioning and capable of simultaneously performing laser cutting and detecting after precise positioning.

一般來說,針對顯示面板周邊上的線路會利用一種先進的光學電子設備,例如雷射切割機,來對面板的週邊所需切割的線路進行雷射切割。雷射切割機的主要原理是利用高能量的雷射脈衝對面板上的線路進行局部加熱,使得線路的材料熔化,進而達到切割斷線路的目的。傳統的雷射切割機一般多屬於單軌道雷射切割機,其主要的配置是有用於承載一面板的移動平台、定位裝置與雷射切割機。移動平台係架設於Y軸軌道上,而定位裝置及雷射切割機則架設於X軸軌道上。Y軸軌道可運送面板至定位裝置及雷射切割機下方,以進行雷射切割加工作業。不過,由於只有單一X軸軌道,所以只能就一Y軸軌道上的面板進行加工,也就是說,即使增加另一組Y軸軌道,一次僅能對一個Y軸軌道上的面板進行定位及雷射切割,其後才能再對另一組Y軸軌道上的面板進行切割加工等作業。因此,傳統的雷射切割機的加工時間相當長,而其產能也大幅受限。 In general, the line on the perimeter of the display panel utilizes an advanced optical electronic device, such as a laser cutting machine, to perform laser cutting of the lines to be cut around the perimeter of the panel. The main principle of the laser cutting machine is to use the high-energy laser pulse to locally heat the line on the panel, so that the material of the line is melted, thereby achieving the purpose of cutting and breaking the line. Conventional laser cutting machines generally belong to single-track laser cutting machines, and their main configuration is a mobile platform, a positioning device and a laser cutting machine for carrying a panel. The mobile platform is mounted on the Y-axis track, and the positioning device and the laser cutting machine are mounted on the X-axis track. The Y-axis rail can transport panels to the positioning device and under the laser cutting machine for laser cutting operations. However, since there is only a single X-axis track, only the panels on a Y-axis track can be machined, that is, even if another set of Y-axis tracks is added, only the panels on one Y-axis track can be positioned at a time and After laser cutting, the panel on the other set of Y-axis rails can be cut and processed. As a result, conventional laser cutting machines have a relatively long processing time and their production capacity is greatly limited.

為了解決單軌雷射切割機之加工時間冗長之困境,一種雙軌雷射切割機因應而生。類似於單軌雷射切割機,雙軌雷射切割機同樣具有設置於Y軸軌道上的移動平台、定位裝置及雷射切割機。不同的是,雙軸雷射切割機架設有兩組X軸軌道,一X軸軌道上安裝有定位裝置及雷射切割機,而另一X軸軌道則安裝有定位檢測裝置等。因此,可藉由X軸軌道上的定位裝置及雷射切割機,先對其中之一Y軸軌道上的面板進行雷射切割加工作業,接著再運送到另一X軸軌道的定位檢測裝置下方,對此已 切割的面板進行定位、檢測,此時,另一Y軸軌道上的面板則同時移動到X軸軌道上的定位裝置及雷射切割機下方,以進行雷射切割加工作。由此可得知,藉由兩個X軸軌道上分別安裝有雷射切割機與定位檢測裝置等,可同時進行雷射切割加工及檢測加工等作業。故,相要於單軌雷射切割機,其加工時間可大幅縮短。 In order to solve the problem of the long processing time of the single-track laser cutting machine, a two-track laser cutting machine was born. Similar to a single-track laser cutting machine, the dual-track laser cutting machine also has a moving platform, positioning device and laser cutting machine disposed on the Y-axis track. The difference is that the two-axis laser cutting frame is provided with two sets of X-axis tracks, one X-axis track is equipped with a positioning device and a laser cutting machine, and the other X-axis track is equipped with a positioning detecting device. Therefore, the laser cutting operation can be performed on the panel on one of the Y-axis rails by the positioning device on the X-axis rail and the laser cutting machine, and then transported to the position detecting device of the other X-axis rail. , this has The cut panel is positioned and detected. At this time, the panel on the other Y-axis track is simultaneously moved to the positioning device on the X-axis track and below the laser cutting machine for laser cutting and adding work. From this, it can be seen that the laser cutting machine, the positioning detecting device, and the like are respectively mounted on the two X-axis rails, and the laser cutting processing and the detecting processing can be simultaneously performed. Therefore, compared with the single-track laser cutting machine, the processing time can be greatly shortened.

然而,儘管雙軌雷射切割機已經可以大幅提高產能、縮短加工時間,但是目前仍有技術瓶頸,無法再進一步增加產能。主要的原因大體上有二點,其一,習知雷射切割機,不論是單軌或雙軌雷射切割機,只能隨機抽查來檢測雷射切割的結果,也就是說一旦發生某些待切斷線路未被切割或者是未完全被切斷,更甚至是切斷了無須切割的線路,皆可能會造成漏電流的現象。其二,習用雷射切割機一般是以定位裝置或定位系統來調整面板之X軸方向與Y軸方向上的位置,然而此類型的定位裝置或定位系統僅能對面板上之對位標記之位置進行位置定位,卻無法完全確保面板上所欲切割的線路是否精確地係位於雷射切割加工的路徑上,因而仍有定位偏移、不精準等缺失。 However, although the two-track laser cutting machine has been able to significantly increase production capacity and shorten processing time, there are still technical bottlenecks that cannot further increase production capacity. The main reasons are basically two points. First, the conventional laser cutting machine, whether it is a monorail or a dual-track laser cutting machine, can only randomly check the results of laser cutting, that is, once some of the cutting is to occur The broken line is not cut or is not completely cut off, and even the line that does not need to be cut is cut, which may cause leakage current. Second, conventional laser cutting machines generally use a positioning device or a positioning system to adjust the position of the panel in the X-axis direction and the Y-axis direction. However, this type of positioning device or positioning system can only mark the alignment on the panel. Positioning for positional positioning does not completely ensure that the line to be cut on the panel is accurately positioned on the path of the laser cutting process, and thus there is still a lack of positioning offset, inaccuracy, and the like.

是以,該如何提高雷射切割機的定位精準度,同時兼具全面檢測線路,實為本領域人士亟欲解決之難題。 Therefore, how to improve the positioning accuracy of the laser cutting machine, and at the same time have a comprehensive detection circuit, which is a problem that people in the field are eager to solve.

本發明提供一種雷射切割設備,用以切割面板側邊一待切割區域之線路,從而解決先前技術中所述的各項問題。 The present invention provides a laser cutting apparatus for cutting a line on a side of a panel to be cut, thereby solving the problems described in the prior art.

更詳而言之,本發明之雷射切割設備包含有取像裝置、雷射切割檢測裝置、移載裝置及電腦控制裝置。取像裝置係用以對面板側邊上之二對位標記進行一標記取像作業。雷射切割檢測裝置具有雷射光源及與雷射光源並排設置之檢測鏡頭,雷射光源係用以沿著二對位標記所連成之一預切割直線,對此些待斷線路進行雷射切割,而檢測鏡頭係用以對被切割後之該些線路立即進行一路線取像作業。移載裝置具有至少一組軌道及至少一承載台,承載台可沿該組軌道移動且可作θ角轉動,用以承載該面板。電腦控制裝置被配置成能依序進行以下運作:驅使承載台將面板運送到取像裝置下方之取像位置;當面板於取像裝置下方之取像位置時,驅 使取像裝置執行標記取像作業,以取得二對位標記的影像;檢測二對位標記的影像,以判斷面板是否有角度偏差;根據檢測結果,驅使移載裝置上的承載台作θ角轉動,以補償面板的角度偏差,使得面板上之二對位標記所構成的預切割直線平行於雷射光源的中心點與檢測鏡頭的中心點所構成的一加工直線;驅使承載台將面板運送到雷射切割檢測裝置下方之加工區域,雷射光源的中心點與檢測鏡頭的中心點係正對著面板的待切割區域;當面板於雷射切割檢測裝置下方之加工區域期間,驅使雷射光源對該些待斷線路進行雷射切割,且同步驅使檢測鏡頭對被切割後之該些線路立即進行路線取像作業;檢測被切割後的該些線路的影像,以判斷該被切割後的該些線路是否符合要求。 More specifically, the laser cutting apparatus of the present invention includes an image taking device, a laser cutting detecting device, a transfer device, and a computer control device. The image capturing device is used for performing a marking and image capturing operation on the two alignment marks on the side of the panel. The laser cutting detecting device has a laser light source and a detecting lens disposed side by side with the laser light source, and the laser light source is used to form a pre-cut straight line along the two alignment marks, and the lightning lines are to be broken. The cutting is performed, and the detecting lens is used to immediately perform a route image capturing operation on the cut lines. The transfer device has at least one set of rails and at least one carrying platform movable along the set of rails and rotatable at an angle θ for carrying the panel. The computer control device is configured to perform the following operations in sequence: driving the carrying platform to transport the panel to the image capturing position below the image capturing device; when the panel is in the image capturing position below the image capturing device, the driving The image capturing device performs a marking image capturing operation to obtain an image of the two-aligned mark; and detects the image of the two-aligned mark to determine whether the panel has an angular deviation; and according to the detection result, drives the carrying platform on the transfer device to make an angle θ Rotating to compensate for the angular deviation of the panel, such that the pre-cut line formed by the two alignment marks on the panel is parallel to a machining line formed by the center point of the laser light source and the center point of the detecting lens; driving the carrying platform to transport the panel To the processing area under the laser cutting detection device, the center point of the laser light source and the center point of the detecting lens are directly opposite to the area to be cut of the panel; when the panel is in the processing area under the laser cutting detecting device, the laser is driven The light source performs laser cutting on the lines to be broken, and synchronously drives the detecting lens to immediately perform the image capturing operation on the lines after the cutting; detecting the images of the cut lines to determine the cut Whether the lines meet the requirements.

在本發明之一實施例中,取像裝置具有兩個取像鏡頭,且此二取像鏡頭係配置位於雷射光源與檢測鏡頭之加工直線所延伸的一相同直線上。 In an embodiment of the invention, the image capturing device has two image taking lenses, and the two image capturing lens systems are disposed on a same straight line extending from the processing line of the laser light source and the detecting lens.

在本發明之另一實施例中,取像裝置之二取像鏡頭係被配置成位於與雷射光源與檢測鏡頭之加工直線平行的一相異直線上。 In another embodiment of the invention, the second image taking of the image capture device is configured to lie on a distinct line parallel to the line of processing of the laser source and the detection lens.

另外,本發明之更一實施例中,雷射切割設備包含機座、固設於機座上之載台、移載機構、雷射切割檢測裝置以及電腦控制裝置。移載機構係移動設置於機座上,而具有雷射光源與取像鏡頭之雷射切割檢測設備係固設於該移載機構上。雷射切割檢測設備之取像鏡頭係可分別二對位標記進行一標記取像作業以及對被切割後之該些線路進行一路線取像作業。此種雷射切割設備主要是應用於大尺寸面板,以面板固定不動,而雷射切割檢測機移動的模式,來進行大尺寸面板之側邊切割作業。 In addition, in a further embodiment of the present invention, the laser cutting apparatus includes a base, a stage fixed to the base, a transfer mechanism, a laser cutting detecting device, and a computer control device. The transfer mechanism is moved on the base, and the laser cutting detection device with the laser light source and the image taking lens is fixed on the transfer mechanism. The image capturing lens of the laser cutting detecting device can perform a marking and image capturing operation for the two alignment marks and a route image capturing operation for the cut lines. The laser cutting device is mainly applied to a large-sized panel, and the panel is fixed without moving, and the laser cutting detector moves the mode to perform side cutting operation of the large-sized panel.

至於本發明的其它發明內容與更詳細的技術及功能說明,將揭露於隨後的說明。 Other inventive aspects and more detailed technical and functional descriptions of the present invention are disclosed in the following description.

100‧‧‧面板 100‧‧‧ panel

102‧‧‧側邊 102‧‧‧ side

104‧‧‧線路 104‧‧‧ lines

106‧‧‧對位標記 106‧‧‧ alignment mark

110‧‧‧預切割直線 110‧‧‧Pre-cut straight line

200‧‧‧雷射切割設備 200‧‧ ‧ laser cutting equipment

202‧‧‧機座 202‧‧‧After

204‧‧‧取像裝置 204‧‧‧Image capture device

204a‧‧‧取像鏡頭 204a‧‧‧Image lens

204b‧‧‧取像鏡頭 204b‧‧‧Image lens

205‧‧‧調整裝置 205‧‧‧Adjustment device

206‧‧‧雷射切割檢測裝置 206‧‧‧Laser cutting detection device

206a‧‧‧雷射光源 206a‧‧‧Laser light source

206b‧‧‧檢測鏡頭 206b‧‧‧Detection lens

207‧‧‧調整裝置 207‧‧‧Adjustment device

210‧‧‧移載裝置 210‧‧‧Transfer device

212‧‧‧第一組軌道 212‧‧‧First set of tracks

214‧‧‧第二組軌道 214‧‧‧Second group of tracks

216‧‧‧承載台 216‧‧‧bearing station

220‧‧‧取像直線 220‧‧‧Image line

230‧‧‧加工直線 230‧‧‧Processing straight line

300‧‧‧雷射切割設備 300‧‧‧Laser cutting equipment

302‧‧‧機座 302‧‧‧ machine base

304‧‧‧取像裝置 304‧‧‧Image capture device

304a‧‧‧取像鏡頭 304a‧‧‧Image lens

304b‧‧‧取像鏡頭 304b‧‧‧Image lens

306‧‧‧雷射切割檢測裝置 306‧‧‧Laser cutting detection device

306a‧‧‧雷射光源 306a‧‧‧Laser light source

306b‧‧‧檢測鏡頭 306b‧‧‧Detection lens

308‧‧‧龍門 308‧‧‧Longmen

310‧‧‧移載裝置 310‧‧‧Transfer device

314‧‧‧第一組軌道 314‧‧‧First set of tracks

316‧‧‧承載台 316‧‧‧bearing station

320‧‧‧取像直線 320‧‧‧Image line

330‧‧‧加工直線 330‧‧‧Processing straight line

400‧‧‧雷射切割設備 400‧‧ ‧ laser cutting equipment

402‧‧‧機座 402‧‧‧ machine base

406‧‧‧雷射切割檢測裝置 406‧‧‧Laser cutting detection device

406a‧‧‧雷射光源 406a‧‧‧Laser light source

406b‧‧‧取像鏡頭 406b‧‧‧Image lens

第一圖,係顯示一待切割面板之上視圖。 The first figure shows a top view of the panel to be cut.

第二圖,係顯示本發明第一實施例中,雷射切割設備的平面示意圖。 The second figure shows a schematic plan view of a laser cutting apparatus in a first embodiment of the present invention.

第三圖至第四圖,係顯示本發明第一實施例中,雷射切割設備的操作 流程之平面示意圖。 3 to 4 are views showing the operation of the laser cutting apparatus in the first embodiment of the present invention A schematic diagram of the process.

第五圖,係顯示本發明第二實施例中,雷射切割設備之平面示意圖。 Fig. 5 is a plan view showing a laser cutting apparatus in a second embodiment of the present invention.

第六圖,係顯示本發明第三實施例中,雷射切割設備之平面示意圖。 Figure 6 is a plan view showing a laser cutting apparatus in a third embodiment of the present invention.

請參閱第一圖,其係顯示一待切割面板之上視圖。面板100具有一側邊102,且側邊102上之一待切割區域上具有數條待切斷線路104及至少二對位標記106,其中此二對位標記106係位於待切斷線路104之兩端。其次,二對位標記106之中心點連成用於切割待切斷線路104之一預切割直線110,且此二對位標記106之中心點分別為預切割直線110的起點與終點。需注意的是,此實施例中,對位標記106之形狀均為十字形,但並不僅限於此,也可以是例如圓形或其他形狀,或可由其他熟習此項技術者可輕易思及之形狀替代,故不限於上述之形狀。其次,面板100之側邊可以為面板的一長側邊,也可以一短側邊,而且如第一圖所是,該二對位標記106係位於面板100之側邊102之兩相對端,但也可以是位於面板一側邊中的某一段區域的兩相對端,只要是在待切斷線路104之兩端即可,此處僅是一種實施態樣,並非用以限定本發明之範圍。 Please refer to the first figure, which shows a view of the panel to be cut. The panel 100 has a side 102, and a region to be cut on the side 102 has a plurality of to-be-cut lines 104 and at least two alignment marks 106, wherein the two alignment marks 106 are located on the line to be cut. Both ends of 104. Next, the center point of the two alignment mark 106 is connected to cut a pre-cut straight line 110 of the line to be cut 104, and the center points of the two alignment marks 106 are the start point and the end point of the pre-cut line 110, respectively. It should be noted that, in this embodiment, the shape of the alignment mark 106 is a cross shape, but is not limited thereto, and may be, for example, a circle or other shape, or can be easily considered by other people skilled in the art. The shape is replaced, so it is not limited to the above shape. Secondly, the side of the panel 100 can be a long side of the panel, or a short side, and as shown in the first figure, the two alignment marks 106 are located at opposite ends of the side 102 of the panel 100. However, it may also be two opposite ends of a certain area in one side of the panel, as long as it is at both ends of the line to be cut 104. Here, it is only one embodiment, and is not intended to limit the present invention. range.

請參閱第二圖,其係顯示本發明之雷射切割設備的第一實施例的平面示意圖。雷射切割設備200係用於對該面板100進行切割、檢測,且包含有一機座202、一取像裝置204、一雷射切割檢測裝置206、一移載裝置210及一電腦控制裝置(未繪示)。其中,取像裝置204與雷射切割檢測裝置206係排列成同一直線。更具體來說,取像裝置204具有一取像直線220(即取像路線),雷射切割檢測裝置206具有一加工直線230(即加工路線),且取像裝置204之取像直線220係為雷射切割檢測裝置206之加工直線230所延伸的同一直線。簡言之,取像裝置204之取像直線220與雷射切割檢測裝置206之加工直線230係構成同一直線。 Referring to the second drawing, which is a plan view showing a first embodiment of the laser cutting apparatus of the present invention. The laser cutting device 200 is used for cutting and detecting the panel 100, and includes a base 202, an image capturing device 204, a laser cutting detecting device 206, a transfer device 210 and a computer control device (not Painted). The image capturing device 204 and the laser cutting detecting device 206 are arranged in the same straight line. More specifically, the image capturing device 204 has an image taking line 220 (ie, an image taking route), the laser cutting detecting device 206 has a processing line 230 (ie, a processing route), and the image capturing device 204 takes an image line 220. The same straight line extending by the processing line 230 of the laser cutting detecting device 206. In short, the image taking line 220 of the image capturing device 204 and the processing line 230 of the laser cutting detecting device 206 form the same straight line.

取像裝置204係設置在一個調整裝置205上,較佳地,其係包含二取像鏡頭204a/204b,且此二取像鏡頭204a/204b係位於同一水平面(即一XY平面)上,用以對面板100上之二對位標記106進行一標記取像作業。須注意的是,取像裝置204亦可以只包含一個或包含二以上的取像鏡頭, 但取像鏡頭的數量並非用以限定本發明。再者,此二取像鏡頭204a/204b係被配置成皆可沿著X軸移動,例如藉由一X軌道設置於調整裝置205上,以加快前述標記取像作業的速度。值得一提的是,取像鏡頭204a/204b之設置方式並不用以限定本發明,其也可以被配置成兩者皆固定不動,或者是其中之一的取像鏡頭,如204a被配置成可沿著X軸移動,另一取像裝置,如204b則固定不動。此外,上述之調整裝置205係用以調整取像鏡頭204a/204b相對於機座的位置,例如微調高或微調位置,調整好後就可以用於執行該標記取像作業。 The image capturing device 204 is disposed on an adjusting device 205. Preferably, the image capturing device 204 is provided with two image capturing lenses 204a/204b, and the two image capturing lenses 204a/204b are located on the same horizontal plane (ie, an XY plane). A mark taking operation is performed on the two alignment marks 106 on the panel 100. It should be noted that the image capturing device 204 may also include only one or more imaging lenses. However, the number of image taking lenses is not intended to limit the invention. Moreover, the two image taking lenses 204a/204b are configured to be movable along the X axis, for example, by an X track disposed on the adjusting device 205 to speed up the speed of the aforementioned image capturing operation. It is worth mentioning that the arrangement of the image taking lenses 204a/204b is not intended to limit the present invention, and it may be configured such that both are fixed or one of the image taking lenses, such as 204a is configured to be Moving along the X axis, another imaging device, such as 204b, is stationary. In addition, the adjusting device 205 is used to adjust the position of the taking lens 204a/204b relative to the base, for example, fine-tuning the high or fine-tuning position, and the adjusting device can be used to perform the marking and capturing operation.

雷射切割檢測裝置206具有一雷射光源206a及一檢測鏡頭206b,檢測鏡頭206b相鄰於雷射光源206a且與該雷射光源206a並排在一起。其中,雷射光源206a係用以對如第一圖所示的面板100上之二對位標記106所連成之一預切割直線110切割面板100上的線路104,而檢測鏡頭則係用以對被切割後之線路進行一路線取像作業。雷射光源206a與檢測鏡頭206b係藉由一調整裝置207而並排設置於機座202上,且係設置於取像裝置204一側。再者,雷射光源206a與檢測鏡頭206b皆係以一預定間隔並排於同一水平面(即一XY平面)上,且雷射光源206a的中心點與檢測鏡頭206b的中心點大致上係位於此加工直線230上。在此實施例中,檢測鏡頭206b可以為線掃描(line scan)檢測影像裝置。此外,上述之調整裝置207主要是根據不同尺寸的面板,用於微調整該雷射光源206a及檢測鏡頭206b相對於該機座的位置,例如微調高低或左右位置,調整好後就可以用於進行後續線路之切割與檢測的作業。在此實施例中,雷射光源206a與檢測鏡頭206b係皆固定設置於調整裝置207上,但並非以限定本發明 The laser cutting detecting device 206 has a laser light source 206a and a detecting lens 206b adjacent to the laser light source 206a and juxtaposed with the laser light source 206a. The laser source 206a is used to cut the line 104 on the panel 100 by connecting the two alignment marks 106 on the panel 100 as shown in the first figure, and the detecting lens is used for detecting the lens 104. Perform a route taking operation on the cut line. The laser light source 206a and the detecting lens 206b are arranged side by side on the base 202 by an adjusting device 207, and are disposed on the side of the image capturing device 204. Furthermore, the laser light source 206a and the detecting lens 206b are arranged at a predetermined interval on the same horizontal plane (ie, an XY plane), and the center point of the laser light source 206a and the center point of the detecting lens 206b are substantially located in the processing. Straight line 230. In this embodiment, the detecting lens 206b may be a line scan detecting image device. In addition, the adjusting device 207 is mainly used for finely adjusting the position of the laser light source 206a and the detecting lens 206b relative to the frame according to different sizes of panels, for example, fine-tuning the height or the left and right positions, and adjusting the image can be used for Perform the cutting and inspection of subsequent lines. In this embodiment, the laser light source 206a and the detecting lens 206b are fixedly disposed on the adjusting device 207, but are not intended to limit the present invention.

移載裝置210具有第一組軌道212、第二組軌道214以及用於承載面板100之二承載台216,其中第一組軌道212係平行於X軸地設置在該機座202上,第二組軌道214係平行於Y軸地設置在該第一組軌道212上,且能沿著該第一組軌道212作X方向移動。承載台216係設置於該第二組軌道214,且能沿著該第二組軌道214作Y方向移動。如此,承載台216便可沿第一組軌道212與第二組軌道214於XY平面上移動。再者,承載台216更藉由一個轉動機構(未繪示)設置於第二組軌道214上,使該承載台216可以於XY平面上作θ角轉動。特別注意的是,此實施例中有兩組軌 道供運送兩面板,但也可以依需求只配置成只有一組XY軌道運送一片面板,移載裝置210中的軌道及承載台之數量並非用以限定本發明。 The transfer device 210 has a first set of tracks 212, a second set of tracks 214, and two carrying platforms 216 for carrying the panels 100, wherein the first set of tracks 212 are disposed on the stand 202 parallel to the X-axis, and second The set of tracks 214 are disposed on the first set of tracks 212 parallel to the Y-axis and are movable in the X direction along the first set of tracks 212. The carrier 216 is disposed on the second set of tracks 214 and is movable in the Y direction along the second set of tracks 214. As such, the carrier 216 can move along the first set of tracks 212 and the second set of tracks 214 in the XY plane. Moreover, the carrying platform 216 is further disposed on the second set of rails 214 by a rotating mechanism (not shown), so that the carrying platform 216 can rotate at an angle θ on the XY plane. It is particularly noted that there are two sets of rails in this embodiment. The track is used to transport two panels, but it can also be configured to transport only one panel with only one set of XY rails. The number of rails and carriers in the transfer device 210 is not intended to limit the invention.

電腦控制裝置(未繪示)係被配置成可以進行以下運作:控制移載裝置210之運作(包含驅動該移載裝置210以使其上的承載台216水平移動到所需的位置以及控制該承載台216作θ角轉動)、控制取像裝置執行標記取像作業、根據該取像裝置所取得的影像判斷承載台上的面板是否有角度偏差,以及控制雷射切割檢測裝置同步進行雷射切割及檢測等等運作。以下將詳細說明本發明第一實施例之雷射切割設備的操作流程,包含電腦控制裝置進行何種操控運作。 The computer control device (not shown) is configured to perform the following operations: controlling the operation of the transfer device 210 (including driving the transfer device 210 to horizontally move the carrier 216 thereon to a desired position and controlling the The loading table 216 rotates at an angle θ, controls the image capturing device to perform a marking image capturing operation, determines whether the panel on the loading platform has an angular deviation according to the image acquired by the image capturing device, and controls the laser cutting detecting device to perform the laser scanning simultaneously. Cutting and testing, etc. The operation flow of the laser cutting apparatus according to the first embodiment of the present invention will be described in detail below, including the operation of the computer control device.

請依序參閱第二圖至第四圖,其係顯示本發明第一實施例中,雷射切割設備的操作流程之平面示意圖。 Referring to the second to fourth figures, a schematic plan view showing the operation flow of the laser cutting apparatus in the first embodiment of the present invention is shown.

首先,如第二圖所示,利用一入料移載裝置(未繪示)將二面板100從前一個製程設備中運輸出來,並且將它們分別運送到雷射切割設備200中的二承載台216上。接著,電腦控制裝置命令該移載裝置210進行運作,以使其上的二承載台216分別將其上之面板100運送到取像裝置204下方之取像位置。接著,請參閱第三圖,當面板100位於取像裝置204下方之取像位置時,電腦控制裝置命令取像裝置204之取像鏡頭204a/204b各自對兩面板100執行一標記取像作業,以各自取得兩面板100中的二對位標記106的影像。其後,電腦控制裝置對取像鏡頭204a/204b所取得的影像進行影像分析,並根據分析結果判斷面板100是否有角度偏差。倘若判斷結果顯示其中之一面板100有角度偏差,此時,針對有角度偏差之面板100,電腦控制裝置會驅使放置此面板100的承載台216作θ角轉動,以補償面板100的角度偏差,使得此面板100上之二對位標記106中心點所構成的預切割直線110剛好平行於雷射光源206a的中心點與檢測鏡頭206b的中心點所構成的加工直線230。至此即完成面板100之定位作業。 First, as shown in the second figure, the two panels 100 are transported from the previous process equipment by a feed transfer device (not shown) and transported separately to the two carriers 216 in the laser cutting device 200. on. Next, the computer control device commands the transfer device 210 to operate such that the upper loading platform 216 carries the panel 100 thereon to the image capturing position below the image capturing device 204. Next, referring to the third figure, when the panel 100 is located at the image capturing position below the image capturing device 204, the computer control device commands the image capturing lenses 204a/204b of the image capturing device 204 to perform a marking image capturing operation on the two panels 100, respectively. The images of the two alignment marks 106 in the two panels 100 are obtained. Thereafter, the computer control device performs image analysis on the image acquired by the image capturing lens 204a/204b, and determines whether the panel 100 has an angular deviation based on the analysis result. If the judgment result indicates that one of the panels 100 has an angular deviation, at this time, for the panel 100 with the angular deviation, the computer control device drives the loading platform 216 on which the panel 100 is placed to rotate at an angle θ to compensate the angular deviation of the panel 100. The pre-cut straight line 110 formed by the center point of the two alignment marks 106 on the panel 100 is just parallel to the processing line 230 formed by the center point of the laser light source 206a and the center point of the detecting lens 206b. This completes the positioning of the panel 100.

在完成面板100之定位作業後,電腦控制裝置會再次驅動移載裝置210,以驅使承載台216將其上的面板100運送到雷射切割裝置206下方之加工區域,並且使其沿著一直線通過雷射切割裝置206下方的加工區域,如第四圖所示。當面板100沿著一直線通過雷射切割裝置206下方加工區域的期間,雷射光源206a的中心點與檢測鏡頭206b的中心點會剛好正 對著面板100上待切割區域中的待切割直線110。再者,當面板100沿著一直線通過雷射切割裝置206下方期間,電腦控制裝置會驅使雷射光源206a對面板上線路104進行雷射切割,並且同時驅動檢測鏡頭206b立即對被切割後之該些線路104進行一路線取像作業。 Upon completion of the positioning operation of the panel 100, the computer control device will again drive the transfer device 210 to drive the carrier 216 to transport the panel 100 thereon to the processing area below the laser cutting device 206 and pass it along a straight line. The processing area below the laser cutting device 206 is as shown in the fourth figure. While the panel 100 passes the straight line through the processing area under the laser cutting device 206, the center point of the laser light source 206a and the center point of the detecting lens 206b are just right. A line 110 to be cut in the area to be cut on the panel 100 is opposed. Moreover, while the panel 100 is passing under the laser cutting device 206 along the straight line, the computer control device drives the laser light source 206a to perform laser cutting on the line 104 on the panel, and simultaneously drives the detecting lens 206b to immediately after being cut. These lines 104 perform a route taking operation.

檢測鏡頭206b會將於該線路取像作業中所取得的影像傳到電腦控制裝置,讓電腦控制裝置進行影像分析,及根據分析結果判斷被切割後之該些線路104是否符合要求。當電腦控制裝置判斷每一面板100的切割結果為符合要求,例如被切割後之該些線路104都確實被切斷,且切割路線沒有偏斜到超出預設範圍,此時電腦控制裝置會通知一出料移載裝置,將符合要求的面板100運送到一出料位置(未繪示),並通知下一個製程設備的運送裝置來將面板100取走。當電腦控制裝置判斷出其中有一面板的切割結果不符合要求,例如切割路線偏離二對位標記106之中心點所構成之直線110(也就是切歪了)、未完全切斷線路104,切割寬度太窄或太寬、或者是切割到無須切割區域等,此時,電腦控制裝置會通知該出料移載裝置,將面板100運送到該出料位置,並發出通警報聲,通知工作人員取走面板100。 The detecting lens 206b transmits the image obtained in the line taking operation to the computer control device, causes the computer control device to perform image analysis, and determines whether the cut lines 104 meet the requirements according to the analysis result. When the computer control device determines that the cutting result of each panel 100 meets the requirements, for example, the lines 104 after being cut are indeed cut off, and the cutting route is not skewed beyond the preset range, the computer control device will notify A discharge transfer device transports the compliant panel 100 to a discharge position (not shown) and notifies the delivery device of the next process device to remove the panel 100. When the computer control device determines that the cutting result of one of the panels does not meet the requirements, for example, the cutting route deviates from the straight line 110 formed by the center point of the two registration mark 106 (that is, cuts), and the line 104 is not completely cut, cutting The width is too narrow or too wide, or is cut to the area where no cutting is required. At this time, the computer control device notifies the discharge transfer device, transports the panel 100 to the discharge position, and emits an alarm sound to notify the staff. The panel 100 is removed.

請參閱第五圖,其係顯示本發明之雷射切割設備的第二實施例之平面示意圖。第二實施例與第一實施例之不同處在於,雷射切割設備300中之取像裝置304係位於平行於雷射切割檢測裝置306的加工直線330的另一直線上。具體而言,雷射切割設備300包含機座302、取像裝置304、雷射切割檢測裝置306、移載裝置310及電腦控制裝置(未繪示)。其中,取像裝置304係移動設置於龍門308之一側上,且可沿著X軸方向移動;而雷射切割檢測裝置306係移動設置於龍門308之另一側(相對於取像裝置304之一側)上,且亦可沿著X軸方向移動。換言之,取像裝置304之取像直線320(即取像路線)與雷射切割檢測裝置306之加工直線330(即加工路線)係為兩相異且互相平行直線。 Please refer to the fifth drawing, which is a plan view showing a second embodiment of the laser cutting apparatus of the present invention. The second embodiment differs from the first embodiment in that the image capturing device 304 in the laser cutting apparatus 300 is located on another line parallel to the processing line 330 of the laser cutting detecting device 306. Specifically, the laser cutting device 300 includes a base 302, an image capturing device 304, a laser cutting detecting device 306, a transfer device 310, and a computer control device (not shown). The image capturing device 304 is disposed on one side of the gantry 308 and is movable along the X axis direction; and the laser cutting detecting device 306 is disposed on the other side of the gantry 308 (relative to the image capturing device 304) On one side), it can also move along the X axis. In other words, the image taking line 320 of the image capturing device 304 (ie, the image taking route) and the processing line 330 (ie, the processing route) of the laser cutting detecting device 306 are two different and parallel to each other.

取像裝置304包含二取像鏡頭304a/304b,且係被配置成皆可沿著X軸移動。需注意的是,取像鏡頭的數量以及配置的方式並非用以限定本發明,熟悉此技術者當可依需求變化。雷射切割檢測裝置306具有雷射光源306a及與雷射光源306a並排的檢測鏡頭306b,且其係被配置成皆 可沿著X軸方向移動。移載裝置310具有第一組軌道314以及用於承載面板100之二承載台316,其中第一組軌道314係平行於Y軸設置在該機座302上,承載台316係設置於該第一組軌道314且能沿著第一組軌道314作Y方向移動。再者,承載台316更可藉由一個轉動機構(未繪示)設置於第一組軌道314上,使承載台316可以作θ角轉動。 The image capturing device 304 includes two image taking lenses 304a/304b and is configured to be movable along the X axis. It should be noted that the number of image taking lenses and the manner of configuration are not intended to limit the present invention, and those skilled in the art may change as needed. The laser cutting detecting device 306 has a laser light source 306a and a detecting lens 306b arranged side by side with the laser light source 306a, and is configured to be both It can be moved along the X axis. The transfer device 310 has a first set of tracks 314 and two carrying platforms 316 for carrying the panel 100, wherein the first set of tracks 314 are disposed on the base 302 parallel to the Y axis, and the carrying platform 316 is disposed on the first The set of tracks 314 can be moved in the Y direction along the first set of tracks 314. Moreover, the carrying platform 316 can be disposed on the first set of rails 314 by a rotating mechanism (not shown), so that the carrying platform 316 can be rotated at an angle θ.

以下將詳細說明本發明第二實施例之雷射切割設備的操作流程,包含電腦控制裝置進行何種操控運作。 The operation flow of the laser cutting apparatus according to the second embodiment of the present invention will be described in detail below, including the operation operation of the computer control device.

請繼續參考第五圖,首先將二面板100分別放置到雷射切割設備300中二承載台316上,接著,電腦控制裝置之控制命令該移載裝置310進行運作,以使其上的二承載台316分別將其上之面板100運送到取像裝置304下方之取像位置。隨後,電腦控制裝置驅使取像裝置304之取像鏡頭304a/304b沿著平行於X軸方向移動並且同時分別對兩面板100執行一標記取像作業,以分別取得兩面板100中的二對位標記106的影像。其後,電腦控制裝置對取像鏡頭204a/204b所取得的影像進行影像分析,並根據分析結果判斷面板100是否有角度偏差。如有角度偏差,電腦控制裝置會驅動承載台316作θ角轉動,以補償面板100的角度偏差。詳細的檢測與補償等作業與第一實施例相同,故不在此多加贅述。 Please continue to refer to the fifth figure. First, the two panels 100 are respectively placed on the two loading platforms 316 of the laser cutting device 300. Then, the control of the computer control device commands the transfer device 310 to operate to make the two carriers thereon. The stage 316 transports the panel 100 thereon to the image taking position below the image taking device 304. Subsequently, the computer control device drives the image capturing lenses 304a/304b of the image capturing device 304 to move parallel to the X-axis direction and simultaneously perform a marking image capturing operation on the two panels 100 to obtain two pairs of the two panels 100, respectively. Mark the image of 106. Thereafter, the computer control device performs image analysis on the image acquired by the image capturing lens 204a/204b, and determines whether the panel 100 has an angular deviation based on the analysis result. If there is an angular deviation, the computer control device drives the carrier 316 to rotate at an angle θ to compensate for the angular deviation of the panel 100. Detailed operations such as detection and compensation are the same as those of the first embodiment, and therefore will not be described here.

完成面板100之定位作業後,電腦控制裝置會再次驅動移載裝置310,以驅使承載台316將其上的面板100運送到雷射切割裝置306下方之加工區域。接著,驅動雷射光源306a與檢測鏡頭306b沿著加工直線330移動,並且同時進行雷射切割及路線取像作業路線取像作業。最後,檢測鏡頭306b會將於該線路取像作業中所取得的影像回傳到電腦控制裝置,讓電腦控制裝置進行影像分析,及根據分析結果判斷被切割後之該些線路104是否符合要求。至於電腦控制裝置如何判斷切割結果是否為符合要求,與第一實施例相同,故不在此多加贅述。。 Upon completion of the positioning operation of the panel 100, the computer control device will again drive the transfer device 310 to drive the carrier 316 to transport the panel 100 thereon to the processing area below the laser cutting device 306. Next, the laser light source 306a and the detecting lens 306b are driven to move along the processing straight line 330, and at the same time, the laser cutting and the route image capturing operation route image capturing operation are performed. Finally, the detecting lens 306b returns the image obtained in the line taking operation to the computer control device, causes the computer control device to perform image analysis, and determines whether the cut lines 104 meet the requirements according to the analysis result. As for how the computer control device determines whether the cutting result is in compliance with the requirements, it is the same as the first embodiment, and therefore will not be described here. .

請參閱第六圖,其係顯示本發明第三實施例中,雷射切割設備之示意圖。第三實施例不同於第一、第二實施例為,第三實施例中的用於承載面板100之載台(未繪示)係固定於機座402上,而且雷射切割檢測裝置406係藉由一移載裝置移動設置於機座402上。具體來說,第三實施例之雷射切割設備400包含機座402、載台(未繪示)、雷射切割檢測裝置406、 移載裝置(未繪示)及電腦控制裝置(未繪示),其中載台係固定設置於機座402上,用以承載面板100。移載裝置係移動設置於機座402。雷射切割檢測裝置406具有雷射光源406a與取像鏡頭406b,且雷射光源406a與取像鏡頭406b係並列在一起,且固設於移載機構上。其中,上述的取像鏡頭406b係整合了定位取像及檢測取像之功能,因此,無須額外架設用於定位取像之取像裝置。 Please refer to the sixth drawing, which is a schematic view showing a laser cutting apparatus in a third embodiment of the present invention. The third embodiment is different from the first and second embodiments. The carrier (not shown) for carrying the panel 100 in the third embodiment is fixed on the base 402, and the laser cutting detecting device 406 is attached. The movement is set on the base 402 by a transfer device. Specifically, the laser cutting apparatus 400 of the third embodiment includes a base 402, a stage (not shown), a laser cutting detecting device 406, A transfer device (not shown) and a computer control device (not shown), wherein the carrier is fixedly disposed on the base 402 for carrying the panel 100. The transfer device is moved to the base 402. The laser cutting detection device 406 has a laser light source 406a and an image capturing lens 406b, and the laser light source 406a and the image capturing lens 406b are juxtaposed together and fixed to the transfer mechanism. Wherein, the above-mentioned image taking lens 406b integrates the functions of positioning and image capturing, and therefore, there is no need to additionally provide an image capturing device for positioning and capturing images.

第三實施例之雷射切割設備主要是應用於大尺寸面板。首先,將面板100放置於載台上,其後電腦控制裝置命令移載裝置將其上的雷射切割檢測裝置406運送到面板100之待切割區域上方,以便於進行標記取像作業。接著,當雷射切割檢測裝置406通過面板100之待切割區域上方時,電腦控制裝置驅使取像裝置406b執行一標記取像作業,以取得二對位標記106的影像。隨後,電腦控制裝置對取像鏡頭406b所取得的影像進行影像分析,並根據分析結果判斷面板100是否有角度偏差。如有角度偏差,電腦控制裝置會驅動移載裝置調整雷射光源406a及取像鏡頭406b之移動路徑,以使雷射光源406a之中心點與取像鏡頭406b之中心點正好對準二對位標記106之中心點所構成之一預切割直線110。至此即完成面板100之定位作業。 The laser cutting apparatus of the third embodiment is mainly applied to a large-sized panel. First, the panel 100 is placed on the stage, after which the computer control device commands the transfer device to transport the laser cutting detection device 406 thereon to the area of the panel 100 to be cut to facilitate the marking and image taking operation. Next, when the laser cutting detecting device 406 passes over the area to be cut of the panel 100, the computer control device drives the image capturing device 406b to perform a mark taking operation to obtain an image of the two-aligned mark 106. Subsequently, the computer control device performs image analysis on the image acquired by the image capturing lens 406b, and determines whether the panel 100 has an angular deviation based on the analysis result. If there is an angular deviation, the computer control device drives the transfer device to adjust the moving path of the laser light source 406a and the image capturing lens 406b so that the center point of the laser light source 406a and the center point of the image capturing lens 406b are exactly aligned with the two alignment marks. One of the center points of 106 constitutes a pre-cut straight line 110. This completes the positioning of the panel 100.

完成面板100之定位作業後,電腦控制裝置會再次驅動移載裝置,以驅使其上的雷射光源406a及取像鏡頭406b一起運送到面板100之待切割區域上方,並且使雷射光源406a及取像鏡頭406b沿一直線移動。此時,當雷射光源406a及取像鏡頭406b沿一直線通過面板100之待切割區域上方期間,電腦控制裝置會驅使雷射光源406a對面板100上該些線路104進行雷射切割,且同時驅使檢測鏡頭406b立即對被切割後之該些線路104進行一路線取像作業。至於電腦控制裝置如何判斷切割結果是否為符合要求,與第一實施例相同,故不在此多加贅述。。 After the positioning operation of the panel 100 is completed, the computer control device drives the transfer device again to drive the laser light source 406a and the image capturing lens 406b thereon to be transported over the area to be cut of the panel 100, and the laser light source 406a and The image taking lens 406b moves in a straight line. At this time, while the laser light source 406a and the image capturing lens 406b pass through the area to be cut of the panel 100 in a straight line, the computer control device drives the laser light source 406a to perform laser cutting on the lines 104 on the panel 100, and simultaneously drive The detecting lens 406b immediately performs a route image capturing operation on the lines 104 after cutting. As for how the computer control device determines whether the cutting result is in compliance with the requirements, it is the same as the first embodiment, and therefore will not be described here. .

因此,本發明所揭露的雷射切割設備不僅可以藉由移載裝置之θ角轉動以及電腦控制裝置等設計,讓面板上之所欲切割的線路能準確地定位於雷射切割的加工路線,進而提高定位之精確度。再者,本發明之雷射切割設備更可以對面板側邊進行雷射切割,而且可以於雷射切割後,立即同步對切割後的線路進行檢測,以確保切割的正確性。因為雷射 切割與檢測係同步進行,所以可進一步縮短加工時間,進而提高產能。 Therefore, the laser cutting device disclosed in the present invention can not only accurately design the desired cutting line on the panel to be processed by the laser cutting process by the θ angle rotation of the transfer device and the design of the computer control device. Thereby improving the accuracy of positioning. Furthermore, the laser cutting device of the present invention can perform laser cutting on the side of the panel, and can simultaneously detect the cut line immediately after the laser cutting to ensure the correctness of the cutting. Because of the laser The cutting and the detection system are carried out simultaneously, so that the processing time can be further shortened, thereby increasing the productivity.

無論如何,任何人都可以從上述例子的說明獲得足夠教導,並據而了解本發明內容確實不同於先前技術,且具有產業上之利用性,及足具進步性。是本發明確已符合專利要件,爰依法提出申請。 In any event, anyone can obtain sufficient teaching from the description of the above examples, and it is understood that the present invention is indeed different from the prior art, and is industrially usable and progressive. It is the invention that has indeed met the patent requirements and has filed an application in accordance with the law.

100‧‧‧面板 100‧‧‧ panel

200‧‧‧雷射切割設備 200‧‧ ‧ laser cutting equipment

202‧‧‧機座 202‧‧‧After

204‧‧‧取像裝置 204‧‧‧Image capture device

204a‧‧‧取像鏡頭 204a‧‧‧Image lens

204b‧‧‧取像鏡頭 204b‧‧‧Image lens

205‧‧‧調整裝置 205‧‧‧Adjustment device

206‧‧‧雷射切割檢測裝置 206‧‧‧Laser cutting detection device

206a‧‧‧雷射光源 206a‧‧‧Laser light source

206b‧‧‧檢測鏡頭 206b‧‧‧Detection lens

207‧‧‧調整裝置 207‧‧‧Adjustment device

210‧‧‧移載裝置 210‧‧‧Transfer device

212‧‧‧第一組軌道 212‧‧‧First set of tracks

214‧‧‧第二組軌道 214‧‧‧Second group of tracks

216‧‧‧承載台 216‧‧‧bearing station

220‧‧‧取像直線 220‧‧‧Image line

230‧‧‧加工直線 230‧‧‧Processing straight line

Claims (10)

一種雷射切割設備,用以切割一面板的一側邊,其中該面板的該側邊之一待切割區域具有數條待切斷線路及二對位標記,該設備包括:一取像裝置,用以對該二對位標記進行一標記取像作業;一雷射切割檢測裝置,具有一雷射光源及與該雷射光源並排設置之一檢測鏡頭,該雷射光源用以沿著該二對位標記所連成之一預切割直線對該些待斷線路進行雷射切割,該檢測鏡頭用以對被切割後之該些線路立即進行一路線取像作業;一移載裝置,具有一組軌道及一承載台,該承載台移動設置於該組軌道上,且該承載台被配置成可作θ角轉動,該承載台用以承載該面板;及一電腦控制裝置,被配置成能進行以下運作:驅使該承載台將該面板運送到該取像裝置下方之取像位置;當該面板於該取像裝置下方之取像位置時,驅使該取像裝置執行該標記取像作業,以取得該二對位標記的影像;檢測該二對位標記的影像,以判斷該面板是否有角度偏差;根據檢測結果,驅使該移載裝置上的該承載台作θ角轉動,以補償該面板的角度偏差,使得該面板上之該二對位標記所構成的該預切割直線平行於該雷射光源的中心點與該檢測鏡頭的中心點所構成的一加工直線; 驅使該承載台將該面板運送到該雷射切割檢測裝置下方之加工區域,該雷射光源的中心點與該檢測鏡頭的中心點係正對著該面板的該待切割區域;當該面板於該雷射切割檢測裝置下方之加工區域期間,驅使該雷射光源對該些待斷線路進行雷射切割,且同步驅使該檢測鏡頭對被切割後之該些線路立即進行該路線取像作業,以取得被切割後的該些線路的影像;及檢測被切割後的該些線路的影像,以判斷該被切割後的該些線路是否符合要求。 A laser cutting device for cutting one side of a panel, wherein one of the sides of the panel to be cut has a plurality of lines to be cut and two alignment marks, the device comprising: an image capturing device a laser cutting detection device having a laser light source and a detection lens disposed alongside the laser light source, the laser light source is used along the The two-paragraph mark is connected to one of the pre-cut lines to perform laser cutting on the lines to be broken, and the detecting lens is used for immediately performing a route image capturing operation on the cut lines; a transfer device, Having a set of rails and a carrying platform, the carrying platform is movably disposed on the set of rails, and the carrying platform is configured to rotate at an angle θ, the carrying platform is configured to carry the panel; and a computer control device is configured The operation is performed to drive the loading platform to transport the panel to the image capturing position below the image capturing device; and when the panel is in the image capturing position below the image capturing device, the image capturing device is driven to perform the marking image capturing Homework The image of the two-aligned mark; detecting the image of the two-aligned mark to determine whether the panel has an angular deviation; according to the detection result, driving the loading platform on the transfer device to rotate at an angle θ to compensate the panel An angular deviation such that the pre-cut line formed by the two alignment marks on the panel is parallel to a processing line formed by a center point of the laser light source and a center point of the detecting lens; Driving the carrying platform to transport the panel to a processing area below the laser cutting detecting device, the center point of the laser light source and the center point of the detecting lens are directly opposite to the area to be cut of the panel; During the processing area under the laser cutting detecting device, the laser light source is driven to perform laser cutting on the to-be-broken lines, and synchronously drives the detecting lens to perform the image capturing operation on the lines after being cut. Obtaining images of the cut lines; and detecting images of the cut lines to determine whether the cut lines meet the requirements. 如申請專利範圍第1項所述之設備,其中該取像裝置係位於該雷射切割檢測裝置之該加工直線所延伸的一相同直線上。 The apparatus of claim 1, wherein the image taking device is located on an same straight line extending from the processing line of the laser cutting detecting device. 如申請專利範圍第1項所述之設備,其中該取像裝置係位於與該雷射切割檢測裝置之該加工直線平行之一相異直線上。 The apparatus of claim 1, wherein the image taking device is located on a line that is different from one of the processing lines of the laser cutting detecting device. 如申請專利範圍第2或3項所述之設備,其中該取像裝置包含至少兩個取像鏡頭,該些取像鏡頭被配置成可沿著該相同直線或該相異直線移動。 The apparatus of claim 2, wherein the image capturing device comprises at least two image taking lenses, the image capturing lenses being configured to be movable along the same straight line or the distinct straight line. 如申請專利範圍第2或3項所述之設備,其中該取像裝置包含至少兩個取像鏡頭,該些取像裝置的其中之一被配置成可沿著該相同直線或該相異直線移動。 The apparatus of claim 2, wherein the image capturing device comprises at least two image taking lenses, one of the image capturing devices being configured to be along the same straight line or the different straight line mobile. 如申請專利範圍第1項所述之設備,其中該雷射光源與該檢測鏡頭被配置成可沿著該加工直線移動。 The apparatus of claim 1, wherein the laser source and the detecting lens are configured to be movable along the processing line. 一種雷射切割設備,用以切割一面板的一側邊,其中該面板的該側邊之一待切割區域具有數條待切斷線路及二對位標記,該設備包括:一取像裝置,用以對該二對位標記進行一標記取像作業;一雷射切割檢測裝置,具有一雷射光源及與該雷射光源並排設置之一檢測鏡頭,該雷射光源用以沿著該二對位標記所連成之一預切割直線對該些待斷線路進行雷射切割,該檢測鏡頭用以隨著該雷射光源沿著該預切割直線對被切割後之該些線路立即進行一路線取像作業;一移載裝置,具有一組軌道及一承載台,該承載台移動設置於該組軌道上,且該承載台被配置成可作θ角轉動,使得承載於其上之該面板的該二對位標記所構成的該預切割直線平行於該雷射光源的中心點與該檢測鏡頭的中心點所構成的一加工直線;及一電腦控制裝置,用以分別控制該取像裝置、該雷射切割檢測裝置以及移載裝置。 A laser cutting device for cutting one side of a panel, wherein one of the sides of the panel to be cut has a plurality of lines to be cut and two alignment marks, the device comprising: an image capturing device a laser cutting detection device having a laser light source and a detection lens disposed alongside the laser light source, the laser light source is used along the The two alignment marks are connected to one of the pre-cut lines for performing laser cutting on the lines to be broken, and the detecting lens is used for the lines immediately after the laser light source is cut along the pre-cut line Performing a route image capturing operation; a transfer device having a set of tracks and a carrying platform, the carrier is movably disposed on the set of tracks, and the carrying platform is configured to rotate at an angle θ so as to be carried thereon The pre-cut line formed by the two alignment marks of the panel is parallel to a processing line formed by a center point of the laser light source and a center point of the detecting lens; and a computer control device for respectively controlling the Image capture device, the Detecting means and cutting the exit transfer means. 如申請專利範圍第7項所述之設備,其中該取像裝置係位於該雷射切割檢測裝置之該加工直線所延伸的一相同直線上。 The apparatus of claim 7, wherein the image taking device is located on an same straight line extending from the processing line of the laser cutting detecting device. 如申請專利範圍第7項所述之設備,其中該取像裝置係位於與該雷射切割檢測裝置之該加工直線平行之一相異直線上。 The apparatus of claim 7, wherein the image taking device is located on a line that is different from one of the processing lines of the laser cutting detecting device. 一種雷射切割設備,用以對一面板的一側邊進行切割,其中該面板的該側邊之一待切割區域上具有數條待切斷線 路及至少二對位標記,該二對位標記係位於該些待切斷線路之兩端,該設備包括:一機座;一載台,固設於該機座上,用以承載該面板;一移載機構,移動設置於該機座上;一雷射切割檢測裝置,具有一雷射光源與一取像鏡頭,且該雷射光源與該取像鏡頭係固設於該移載機構,該雷射光源用以沿著該二對位標記所連成之一預切割直線切割該些線路,該取像鏡頭用以分別該二對位標記進行一標記取像作業以及對被切割後之該些線路進行一路線取像作業;及一電腦控制裝置,被配置成能進行以下運作:驅使該移載機構將該取像鏡頭運送到該面板之該待切割區域上方,供該取像鏡頭對該面板上之該二對位標記進行該標記取像作業;當該取像鏡頭通過該面板之該待切割區域上方時,驅使該取像裝置執行該標記取像作業,以取得該二對位標記的影像;檢測該二對位標記的影像,以判斷該雷射光源與該取像鏡頭之移動路徑是否有偏差;根據取像結果,驅使移載裝置調整該雷射光源與該取像鏡頭之移動路徑,以使該雷射光源之中心點與該取像鏡頭之中心點對準該二對位標記之中心點所構成之該預切割直線; 驅動該移載機構將雷射光源與取像鏡頭運送到該面板之該待切割區域上方,並驅使該雷射光源與該取像鏡頭沿該預切割直線移動;及當該雷射光源與該取像鏡頭通過該面板之該待切割區域上方期間,驅使該雷射光源對該些待斷線路進行雷射切割,且同步驅使該檢測鏡頭對被切割後之該些線路進行該路線取像作業。 A laser cutting device for cutting one side of a panel, wherein one of the sides of the panel has a plurality of lines to be cut on the area to be cut And a second alignment mark, the two alignment marks are located at the two ends of the to-be-cut line, the device comprises: a base; a stage fixed on the base for carrying the a transfer mechanism is disposed on the base; a laser cutting detecting device has a laser light source and an image capturing lens, and the laser light source and the image capturing lens are fixed to the moving image a laser light source for cutting the lines along a pre-cut line formed by the two alignment marks, wherein the image capturing lens is used for performing a marking image capturing operation and cutting the two alignment marks respectively And the circuit control device is configured to perform the following operations: driving the transfer mechanism to transport the image capturing lens to the area to be cut of the panel for the fetching The image capturing operation is performed on the two alignment marks on the panel by the lens; when the image capturing lens passes over the area to be cut of the panel, the image capturing device is driven to perform the marking image capturing operation to obtain the image capturing device Image of the second alignment mark; detecting the Aligning the image of the mark to determine whether the laser light source and the moving path of the image capturing lens are offset; according to the image capturing result, driving the transfer device to adjust the moving path of the laser light source and the image capturing lens to make the a pre-cut straight line formed by a center point of the laser light source and a center point of the image capturing lens aligned with a center point of the two alignment marks; Driving the transfer mechanism to transport the laser light source and the image taking lens to the area to be cut of the panel, and driving the laser light source and the image capturing lens to move along the pre-cut line; and when the laser light source and the laser light source While the image capturing lens passes over the area to be cut of the panel, the laser light source is driven to perform laser cutting on the to-be-broken lines, and synchronously drives the detecting lens to perform image capturing on the cut lines. operation.
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