TWI793415B - Thermoplastic liquid crystal polymer film, multi-layered body and shaped article, and production methods thereof - Google Patents

Thermoplastic liquid crystal polymer film, multi-layered body and shaped article, and production methods thereof Download PDF

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TWI793415B
TWI793415B TW109113436A TW109113436A TWI793415B TW I793415 B TWI793415 B TW I793415B TW 109113436 A TW109113436 A TW 109113436A TW 109113436 A TW109113436 A TW 109113436A TW I793415 B TWI793415 B TW I793415B
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crystal polymer
thermoplastic liquid
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heat treatment
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TW202100608A (en
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澤田貴文
淺田光則
有本紀久雄
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日商可樂麗股份有限公司
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    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18Manufacture of films or sheets
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C35/00Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
    • B29C35/02Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/18Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using heated tools
    • B29C65/20Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using heated tools with direct contact, e.g. using "mirror"
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00Layered products comprising a layer of metal
    • B32B15/04Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/02Physical, chemical or physicochemical properties
    • B32B7/023Optical properties
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G63/00Macromolecular compounds obtained by reactions forming a carboxylic ester link in the main chain of the macromolecule
    • C08G63/02Polyesters derived from hydroxycarboxylic acids or from polycarboxylic acids and polyhydroxy compounds
    • C08G63/12Polyesters derived from hydroxycarboxylic acids or from polycarboxylic acids and polyhydroxy compounds derived from polycarboxylic acids and polyhydroxy compounds
    • C08G63/16Dicarboxylic acids and dihydroxy compounds
    • C08G63/18Dicarboxylic acids and dihydroxy compounds the acids or hydroxy compounds containing carbocyclic rings
    • C08G63/19Hydroxy compounds containing aromatic rings
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate

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  • Health & Medical Sciences (AREA)
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  • Organic Chemistry (AREA)
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Abstract

Provided are a thermoplastic liquid crystal polymer film, a multi-layered body, and a shaped article, the film having a wide process window for multilayering during production of a wiring board and being excellent in heat resistance and productivity. The thermoplastic liquid crystal polymer is formed from a thermoplastic liquid crystal polymer capable of forming an optically anisotropic melt phase, and diffraction profile of a polymer section of the film detected by wide-angle x-ray diffractometry satisfies the formula, 0≤UC≤2.0 (1), where UC is a value calculated as UC = B/A ×100, where A is an integrated intensity of the profile on the base line in the range of 2θ=14o to 26o , B is an integrated intensity of a sub-peak profile in the rage of 2θ=22.3o to 24.3o , after extracting a main peak profile by approximating the main peak profile to a linear function.

Description

熱塑性液晶聚合物薄膜、積層體、及成形體、以及彼等之製造方法Thermoplastic liquid crystal polymer film, laminate, and molded article, and their production methods

本發明係關於包含能形成光學性各向異性的熔融相之聚合物(以下,稱為熱塑性液晶聚合物),且耐熱性優異的薄膜、積層體、及成形體、以及彼等之製造方法。The present invention relates to a film, a laminate, and a molded article having excellent heat resistance, including a polymer capable of forming an optically anisotropic melt phase (hereinafter referred to as a thermoplastic liquid crystal polymer), and methods for producing the same.

近年來,在電子/電氣/通訊工業領域中,因設備的小型化/輕量化的要求,故印刷電路基板的高密度化的必要性正在提高。伴隨於此,正在發展電路基板的多層化、佈線間距的狹窄化、通孔的細微化等各式各樣的方法。例如,高密度化電路係將包含非金屬層與金屬層之覆金屬積層板隔著非金屬層進行多層化而製造。以往,印刷電路基板/電路主要係使用酚樹脂、環氧樹脂等熱固性樹脂作為非金屬層,並與銅箔等金屬層進行積層而製造。然而,已知熱固性樹脂在藉由加熱反應而變得能適合的積層為止前需要時間。In recent years, in the fields of electronics/electricity/communication industries, the need for higher densification of printed circuit boards has been increasing due to demands for miniaturization and weight reduction of equipment. Along with this, various methods such as multilayering of circuit boards, narrowing of wiring pitches, and miniaturization of via holes are being developed. For example, a high-density circuit is produced by multilayering a metal-clad laminate including a non-metal layer and a metal layer via a non-metal layer. In the past, printed circuit boards/circuits were mainly produced by using thermosetting resins such as phenol resins and epoxy resins as non-metallic layers, and laminating them with metal layers such as copper foil. However, it is known that thermosetting resins require time until they can be properly laminated by a heating reaction.

相對於此,將生產性提升作為目的,一般採用複數片的同時積層、由裝置所致之同時多段製造。在此種狀況下,熱塑性液晶聚合物材料可期待活用為熱塑性樹脂一事之生產性的提升效果,又,在物性面上亦因相較於其他材料,吸水率與介電損失極低,而以高頻率傳輸用途為代表正受到高度注目。On the other hand, for the purpose of improving productivity, simultaneous lamination of multiple sheets and simultaneous multi-stage manufacturing by devices are generally employed. Under such circumstances, thermoplastic liquid crystal polymer materials can be expected to improve productivity by utilizing them as thermoplastic resins. In addition, in terms of physical properties, water absorption and dielectric loss are extremely low compared to other materials. Representatives of high-frequency transmission applications are receiving high attention.

熱塑性液晶聚合物材料係利用熱塑性而使由熱壓接所致之多層化成為可能,但另一方面,亦需要在多層化之際的耐熱性。也就是說,即使在將使用於多層化之非金屬層適當地軟化/可塑化而在與積層板的金屬層或非金屬層穩固地附著之條件下製造積層體之際,在積層板的非金屬層具有高耐熱性之情形,亦能製造操作範圍(process window)(製造條件的最適範圍)寬廣且穩定的產品。The thermoplastic liquid crystal polymer material enables multilayering by thermocompression bonding by utilizing thermoplasticity, but on the other hand, heat resistance at the time of multilayering is also required. That is, even when the laminated body is produced under the condition that the non-metallic layer used for multilayering is properly softened/plasticized to firmly adhere to the metal layer or non-metallic layer of the laminated board, the non-metallic layer of the laminated board Even when the metal layer has high heat resistance, it is possible to manufacture a stable product with a wide process window (optimum range of manufacturing conditions).

作為多層積層體的穩定的製造法,作為不使用接著劑的例子,在專利文獻1(日本專利第4004139號公報)、專利文獻2(日本專利第4138995號公報)中記載有包含熔點不同的熱塑性液晶聚合物薄膜與金屬層之金屬積層體與非金屬層的多層積層板之製造方法。As an example of a stable production method for a multilayer laminate that does not use an adhesive, Patent Document 1 (Japanese Patent No. 4004139 ) and Patent Document 2 (Japanese Patent No. 4138995 ) describe thermoplastic materials with different melting points. A method for manufacturing a metal laminate of a liquid crystal polymer film and a metal layer and a multilayer laminate of a non-metal layer.

在專利文獻3(日本專利第3893930號公報)所提案之多層基板的製造方法中,積層包含熱塑性樹脂之複數片材,在一片一片地將前述積層片材保持在片材保持具的狀態下,隔著可撓性材料進行加熱及加壓,藉此可不利用以往的分批型真空室地製造多層基板。因此,根據該製造方法,相較於使用以往的分批型真空室之步驟,可大幅地提高生產效率。In the method of manufacturing a multilayer substrate proposed in Patent Document 3 (Japanese Patent No. 3893930), a plurality of sheets including a thermoplastic resin are laminated, and the laminated sheets are held one by one in a sheet holder. By applying heat and pressure through a flexible material, multilayer substrates can be manufactured without using conventional batch-type vacuum chambers. Therefore, according to this manufacturing method, compared with the steps using the conventional batch-type vacuum chamber, the production efficiency can be greatly improved.

關於材料本身的耐熱化,作為熱塑性液晶聚合物材料的耐熱化,在專利文獻4(日本專利第3878741號公報)中記載有將熔點為300℃以下的熱塑性液晶聚合物的熔點提高至300℃以上的方法。 [先前技術文獻] [專利文獻]Regarding the heat resistance of the material itself, as the heat resistance of the thermoplastic liquid crystal polymer material, Patent Document 4 (Japanese Patent No. 3878741 A) describes that the melting point of the thermoplastic liquid crystal polymer having a melting point of 300° C. or lower is raised to 300° C. or higher. Methods. [Prior Art Literature] [Patent Document]

專利文獻1:日本專利第4004139號公報 專利文獻2:日本專利第4138995號公報 專利文獻3:日本專利第3893930號公報 專利文獻4:日本專利第3878741號公報Patent Document 1: Japanese Patent No. 4004139 Patent Document 2: Japanese Patent No. 4138995 Patent Document 3: Japanese Patent No. 3893930 Patent Document 4: Japanese Patent No. 3878741

[發明欲解決之課題][Problem to be solved by the invention]

然而,在專利文獻1及2所提案之多層積層板中,因使用低熔點的熱塑性液晶聚合物薄膜的點,而難以擴大操作範圍。又,在提高熱塑性液晶聚合物薄膜的熔點之情形,因需要由多階段所致之4小時以上的熱處理,故有缺乏生產性這樣的問題點。However, in the multilayer laminates proposed in Patent Documents 1 and 2, it is difficult to expand the operating range due to the point of using a thermoplastic liquid crystal polymer film with a low melting point. In addition, when raising the melting point of the thermoplastic liquid crystal polymer film, a multi-stage heat treatment of 4 hours or more is required, which has a problem of lack of productivity.

又,在專利文獻3所提案之方法中,在隔著可撓性材料急速加熱積層片材之際,熱塑性樹脂會引起水解反應,例如在熱塑性液晶聚合物等中,樹脂的流動性變大,有導體圖案的位置偏離、在樹脂薄膜中發生空隙這樣的問題點。Also, in the method proposed in Patent Document 3, when the laminated sheet is rapidly heated through the flexible material, the thermoplastic resin undergoes a hydrolysis reaction. For example, in thermoplastic liquid crystal polymers, etc., the fluidity of the resin increases, There are problems such as misalignment of the conductor pattern and occurrence of voids in the resin film.

再者,在專利文獻4所記載之方法中,雖亦能藉由多階段且藉由4小時以上的加熱而提高熱塑性液晶聚合物的熔點,但此種方法有缺乏生產性這樣的問題點。Furthermore, in the method described in Patent Document 4, although the melting point of the thermoplastic liquid crystal polymer can be raised by heating in multiple stages for more than 4 hours, this method has a problem of lack of productivity.

因此,對於在使用熱塑性液晶聚合物薄膜進行多層化時擴大操作範圍,在設備、接著劑的改善方面有極限,無法充分地滿足進一步的多層化的要求。又,在僅單純地提升熔點方面,包含熱塑性液晶聚合物薄膜製造時的生產性在內,皆無法滿足市場要求。Therefore, there is a limit to the improvement of equipment and adhesives for expanding the operating range when multilayering using a thermoplastic liquid crystal polymer film, and it is not possible to fully satisfy the demand for further multilayering. In addition, simply raising the melting point cannot satisfy the market demand including the productivity at the time of production of the thermoplastic liquid crystal polymer film.

因此,本發明之目的在於提供在進行多層化之際操作範圍寬廣的熱塑性液晶聚合物薄膜、積層體、及成形體、以及能輕易地製造此等的方法。 [用以解決課題之手段]Therefore, an object of the present invention is to provide a thermoplastic liquid crystal polymer film, a laminate, and a molded article having a wide range of operations for multilayering, and a method for easily producing them. [Means to solve the problem]

本發明人等為了解決上述課題而專心致志地探討的結果,驚人地發現,在包含具有均勻性高的斜方晶結晶結構之結晶,且將由廣角X射線繞射測定所偵測之2θ=14~26度的積分強度設為A、將2θ=22.3~24.3度的積分強度設為B、並設為B/A×100=UC之情形,UC存在於特定範圍之熱塑性液晶聚合物薄膜係在耐熱化步驟中利用與以往的耐熱化步驟不同的機制控制結晶結構而進行耐熱化,此種熱塑性液晶聚合物薄膜因可控制配合所要求的耐熱性之結晶形成所需要的時間,故不僅會縮短耐熱化所需要的時間,在積層步驟及電路加工步驟雙方中,亦會具有源自高耐熱性的寬廣操作範圍,進而完成本發明。As a result of dedicated research by the present inventors in order to solve the above-mentioned problems, it was surprisingly found that in crystals containing a highly uniform orthorhombic crystal structure, the 2θ=14~14 detected by wide-angle X-ray diffraction measurement When the integrated intensity at 26 degrees is set to A, the integrated intensity at 2θ=22.3 to 24.3 degrees is set to B, and B/A×100=UC, the thermoplastic liquid crystal polymer film in which UC exists in a specific range is heat-resistant In the heat-resistant step, the crystal structure is controlled by a different mechanism from the conventional heat-resistant step. This kind of thermoplastic liquid crystal polymer film can control the time required for the formation of crystals that match the required heat resistance, so it will not only shorten the heat resistance. In addition, the time required for this process has a wide operating range due to high heat resistance in both the lamination step and the circuit processing step, and the present invention has been completed.

亦即,本發明能由以下的態樣所構成。 [態樣1] 一種熱塑性液晶聚合物薄膜,其係由能形成光學性各向異性的熔融相之聚合物(以下,稱為熱塑性液晶聚合物)所構成, 在前述聚合物部分中,在由廣角X射線繞射測定所偵測的繞射量變曲線中,在將2θ=14~26度之基線上的積分強度設為A、將在2θ=22.3~24.3度中將主峰的量變曲線近似線性函數並去除後的次峰的量變曲線的積分強度設為B、並設為B/A×100=UC時,滿足下述式(1), 0≦UC≦2.0 (1)。 [態樣2] 如態樣1所記載之熱塑性液晶聚合物薄膜,其滿足下述式(2), 0.1≦UC≦1.5 (2)。 [態樣3] 如態樣1或2所記載之熱塑性液晶聚合物薄膜,其中,在將於2θ=20±1度存在最大值的前述主峰的半高寬(full width at half maximum)設為SC(度)時,滿足1.4≦SC。 [態樣4] 如態樣1至3中任一態樣所記載之熱塑性液晶聚合物薄膜,其中,使用示差掃描熱析儀,在從室溫起至400℃的溫度範圍中以10℃/min的速度升溫之際出現的吸熱峰位置為310℃以上(較佳為315℃以上,更佳為320℃以上)。 [態樣5] 一種積層體,其具備至少一層如態樣1至4中任一態樣所記載之熱塑性液晶聚合物薄膜。 [態樣6] 如態樣5所記載之積層體,其更具備至少一層金屬層。 [態樣7] 如態樣6所記載之積層體,其中,前述金屬層係由選自銅、銅合金、鋁、鋁合金、鎳、鎳合金、鐵、鐵合金、銀、銀合金、及此等的複合金屬種類的至少一種所構成。 [態樣8] 一種成形體,其係由如態樣1至4中任一態樣所記載之熱塑性液晶聚合物薄膜或如態樣5至7中任一態樣所記載之積層體所形成。 [態樣9] 如態樣8所記載之成形體,其為電路板。 [態樣10] 如態樣8或9所記載之成形體,其為高頻率用電路基板、車載用感測器、行動用電路基板、或天線。 [態樣11] 一種如態樣1至4中任一態樣所記載之熱塑性液晶聚合物薄膜的製造方法,其中,對於由熔點上升速度Rtm為0.20℃/min以上(較佳為0.22℃/min以上,再佳為0.25℃/min以上,又再佳為0.26℃/min以上)的熱塑性液晶聚合物所構成之熱塑性液晶聚合物薄膜(材料薄膜),進行熱處理而耐熱化。 [態樣12] 如態樣11所記載之熱塑性液晶聚合物薄膜的製造方法,其中,前述熱處理為一階段或複數階段的熱處理,在將熱塑性液晶聚合物的熔點設為Tm0 之情形,在Tm0 ℃以下,較佳為(Tm0 -2)℃以下進行第一熱處理而耐熱化。 [態樣13] 如態樣11或12所記載之熱塑性液晶聚合物薄膜的製造方法,其中,作為熱源,使用選自熱風烘箱、蒸氣烘箱、電熱器、紅外線加熱器、陶瓷加熱器、熱輥、熱壓、及電磁波照射機的至少一種。 [態樣14] 如態樣11至13中任一態樣所記載之熱塑性液晶聚合物薄膜的製造方法,其中,前述熱處理為一階段。 [態樣15] 一種如態樣5至7中任一態樣所記載之積層體的製造方法,其中,對於具備由熱塑性液晶聚合物所構成之聚合物層的積層體,亦即前述聚合物層係由熔點上升速度Rtm為0.20℃/min以上(較佳為0.22℃/min以上,再佳為0.25℃/min以上,又再佳為0.26℃/min以上)的熱塑性液晶聚合物所構成之積層體,進行熱處理而耐熱化。 [態樣16] 如態樣15所記載之積層體的製造方法,其中,前述熱處理為一階段或複數階段的熱處理,在將熱塑性液晶聚合物的熔點設為Tm0 之情形,在Tm0 ℃以下,較佳為(Tm0 -2)℃以下進行第一熱處理而耐熱化。 [態樣17] 如態樣15或16所記載之積層體的製造方法,其中,作為熱源,使用選自熱風烘箱、蒸氣烘箱、電熱器、紅外線加熱器、陶瓷加熱器、熱輥、熱壓、及電磁波照射機的至少一種。 [態樣18] 一種方法,其係藉由對於如態樣1至4中任一態樣所記載之熱塑性液晶聚合物薄膜、及/或如態樣5至7中任一態樣所記載之積層體進行後加工而製造成形體。That is, the present invention can be configured in the following aspects. [Aspect 1] A thermoplastic liquid crystal polymer film composed of a polymer capable of forming an optically anisotropic molten phase (hereinafter referred to as a thermoplastic liquid crystal polymer), wherein the polymer part is composed of In the diffraction curve detected by wide-angle X-ray diffraction measurement, the integrated intensity on the baseline of 2θ=14-26 degrees is set to A, and the quantitative curve of the main peak is approximately linear at 2θ=22.3-24.3 degrees When the integral intensity of the quantitative curve of the secondary peak after removal of the function is set to B, and set to B/A×100=UC, the following formula (1) is satisfied, 0≦UC≦2.0 (1). [Aspect 2] The thermoplastic liquid crystal polymer film as described in Aspect 1, which satisfies the following formula (2): 0.1≦UC≦1.5 (2). [Aspect 3] The thermoplastic liquid crystal polymer film as described in Aspect 1 or 2, wherein the full width at half maximum of the aforementioned main peak having a maximum value at 2θ=20±1 degrees is set to At SC (degrees), 1.4≦SC is satisfied. [Aspect 4] The thermoplastic liquid crystal polymer film according to any one of Aspects 1 to 3, wherein, using a differential scanning calorimeter, in a temperature range from room temperature to 400°C, at 10°C/ The position of the endothermic peak that appears when the temperature is raised at a rate of min is 310° C. or higher (preferably 315° C. or higher, more preferably 320° C. or higher). [Aspect 5] A laminate comprising at least one layer of the thermoplastic liquid crystal polymer film as described in any one of Aspects 1 to 4. [Aspect 6] The laminate according to Aspect 5, further comprising at least one metal layer. [Aspect 7] The laminate as described in Aspect 6, wherein the metal layer is made of copper, copper alloy, aluminum, aluminum alloy, nickel, nickel alloy, iron, iron alloy, silver, silver alloy, and Consists of at least one of the composite metal species. [Aspect 8] A molded body formed of the thermoplastic liquid crystal polymer film described in any one of Aspects 1 to 4 or the laminate described in any one of Aspects 5 to 7 . [Aspect 9] The molded body according to Aspect 8, which is a circuit board. [Aspect 10] The molded article according to Aspect 8 or 9, which is a high-frequency circuit board, a vehicle sensor, a mobile circuit board, or an antenna. [Aspect 11] A method for producing a thermoplastic liquid crystal polymer film as described in any one of Aspects 1 to 4, wherein the rising rate Rtm from the melting point is 0.20°C/min or more (preferably 0.22°C/min. Min or more, more preferably 0.25°C/min or more, and still more preferably 0.26°C/min or more), the thermoplastic liquid crystal polymer film (material film) composed of thermoplastic liquid crystal polymer is subjected to heat treatment to be heat-resistant. [Aspect 12] The method for producing a thermoplastic liquid crystal polymer film as described in Aspect 11, wherein the heat treatment is performed in one stage or in multiple stages, and when the melting point of the thermoplastic liquid crystal polymer is Tm 0 , Tm 0 °C or lower, preferably (Tm 0 -2)°C or lower, is heat-resistant by performing the first heat treatment. [Aspect 13] The method for producing a thermoplastic liquid crystal polymer film as described in Aspect 11 or 12, wherein, as a heat source, a heat source selected from a hot air oven, a steam oven, an electric heater, an infrared heater, a ceramic heater, and a heat roll is used. , heat press, and at least one of electromagnetic wave irradiation machine. [Aspect 14] The method for producing a thermoplastic liquid crystal polymer film according to any one of aspects 11 to 13, wherein the heat treatment is performed in one stage. [Aspect 15] A method for producing a laminate according to any one of aspects 5 to 7, wherein, for a laminate having a polymer layer composed of a thermoplastic liquid crystal polymer, that is, the aforementioned polymer The layer system is composed of a thermoplastic liquid crystal polymer with a melting point rise rate Rtm of 0.20°C/min or higher (preferably 0.22°C/min or higher, more preferably 0.25°C/min or higher, and still more preferably 0.26°C/min or higher) The laminate is heat-treated to be heat-resistant. [Aspect 16] The method for producing a laminate according to Aspect 15, wherein the heat treatment is performed in one or more stages, and when the melting point of the thermoplastic liquid crystal polymer is Tm 0 , at Tm 0 °C Thereafter, it is preferable to perform the first heat treatment at (Tm 0 -2)°C or lower to achieve heat resistance. [Aspect 17] The method for producing a laminate according to Aspect 15 or 16, wherein, as the heat source, a heat source selected from a hot air oven, a steam oven, an electric heater, an infrared heater, a ceramic heater, a hot roll, and a hot press is used. , and at least one of an electromagnetic wave irradiation machine. [Aspect 18] A method comprising the thermoplastic liquid crystal polymer film as described in any one of Aspects 1 to 4, and/or as described in any one of Aspects 5 to 7 The laminate is post-processed to produce a molded body.

在態樣11中,所謂熱塑性液晶聚合物的熔點上升速度,係在示差掃描熱析測定中,在常溫(例如25℃)與指定溫度(例如400℃)之間,將熱塑性液晶聚合物薄膜(原料薄膜)進行加熱、冷卻、再加熱之際,將在再加熱時出現吸熱峰的溫度設為熱塑性液晶聚合物的熔點Tm0 ,且將熱塑性液晶聚合物薄膜以Tm0 -10℃的溫度進行熱處理一小時後,在示差掃描熱析測定中,在從常溫(例如25℃)加熱至指定溫度(例如400℃)之際,將出現吸熱峰的溫度設為Tm’時,由Rtm=(Tm’-Tm0 )/60所算出的值。在上述的示差掃描熱析測定中之溫度變化率(升溫速度、降溫速度)可為10℃/min。In Aspect 11, the so-called melting point rise rate of the thermoplastic liquid crystal polymer refers to measuring a thermoplastic liquid crystal polymer film ( When heating, cooling, and reheating, the temperature at which an endothermic peak appears during reheating is defined as the melting point Tm 0 of the thermoplastic liquid crystal polymer, and the thermoplastic liquid crystal polymer film is heated at a temperature of Tm 0 -10°C. After one hour of heat treatment, in the differential scanning thermal analysis measurement, when heating from normal temperature (for example, 25°C) to a specified temperature (for example, 400°C), when the temperature at which the endothermic peak appears is set as Tm', Rtm=(Tm '-Tm 0 )/60 calculated value. The temperature change rate (heating speed, temperature falling speed) in the above-mentioned differential scanning thermal analysis measurement can be 10° C./min.

本說明書中,所謂積層體,意指已對於熱塑性液晶聚合物薄膜積層被黏著物的結構物,所謂成形體,意指已對於熱塑性液晶聚合物薄膜形成電路等的結構物。 [發明之效果]In this specification, a laminate means a structure in which an adherend is laminated on a thermoplastic liquid crystal polymer film, and a molded body means a structure in which a circuit or the like is formed on a thermoplastic liquid crystal polymer film. [Effect of Invention]

本發明中,可製造源自高耐熱性而在積層/電路加工之際具有寬廣操作範圍的熱塑性液晶聚合物薄膜、積層體及成形體,因此例如伴隨著至今為止繁雜的多層積層程序的簡略化,而能以低成本製造積層體。再者,變得亦能不使用特殊的設備、夾具地製造超多層積層基板。In the present invention, it is possible to manufacture thermoplastic liquid crystal polymer films, laminates, and moldings that have a wide operating range at the time of lamination/circuit processing due to high heat resistance. Therefore, for example, it is accompanied by simplification of the multilayer lamination process that has been complicated until now. , and the laminate can be manufactured at low cost. Furthermore, it becomes possible to manufacture a super multilayer laminate substrate without using special equipment or jigs.

此外,申請專利範圍及/或說明書所揭示之至少二個構成要素的任何組合亦包含在本發明中。尤其,申請專利範圍所記載之請求項的二個以上的任何組合亦包含在本發明中。In addition, any combination of at least two constituent elements disclosed in the patent claims and/or the specification is also included in the present invention. In particular, any combination of two or more of the claims described in the claims is also included in the present invention.

[用以實施發明的形態][Mode for Carrying Out the Invention]

以下,針對本發明的實施形態進行說明。此外,在以下的說明中,作為表現特定功能的化合物,雖揭示具體例,但本發明不受限於此。又,所例示之材料只要沒有特別說明,則可單獨使用亦可組合使用。Embodiments of the present invention will be described below. In addition, in the following description, specific examples are disclosed as compounds exhibiting specific functions, but the present invention is not limited thereto. In addition, unless otherwise specified, the illustrated materials may be used alone or in combination.

[熱塑性液晶聚合物] 本發明的熱塑性液晶聚合物薄膜係由熱塑性液晶聚合物所構成。此熱塑性液晶聚合物係由可熔融成形的液晶聚合物(或能形成光學性各向異性的熔融相之聚合物)所構成,只要是可熔融成形的液晶聚合物則不特別限定其化學構成,但可列舉例如熱塑性液晶聚酯、或在此中已導入醯胺鍵的熱塑性液晶聚酯醯胺等。[Thermoplastic liquid crystal polymer] The thermoplastic liquid crystal polymer film of the present invention is composed of thermoplastic liquid crystal polymer. The thermoplastic liquid crystal polymer is composed of a melt-formable liquid crystal polymer (or a polymer capable of forming an optically anisotropic melt phase), and its chemical composition is not particularly limited as long as it is a melt-formable liquid crystal polymer. However, examples thereof include thermoplastic liquid crystal polyesters, thermoplastic liquid crystal polyesteramides into which amide bonds have been introduced, and the like.

又,熱塑性液晶聚合物可為在芳香族聚酯或芳香族聚酯醯胺中已進一步導入醯亞胺鍵、碳酸酯鍵、碳二亞胺鍵、三聚異氰酸酯(isocyanurate)鍵等源自異氰酸酯的鍵等之聚合物。In addition, the thermoplastic liquid crystal polymer may be derived from isocyanate in which an imide bond, a carbonate bond, a carbodiimide bond, an isocyanurate bond, or the like has been further introduced into an aromatic polyester or an aromatic polyester amide. Polymers such as bonds.

作為能用於本發明的熱塑性液晶聚合物的具體例,可列舉由以下所例示之被分類成(1)至(4)的化合物及其衍生物所致之公知的熱塑性液晶聚酯及熱塑性液晶聚酯醯胺。惟,為了形成能形成光學性各向異性的熔融相之聚合物,理所當然地在各種原料化合物的組合中有適當的範圍。Specific examples of thermoplastic liquid crystal polymers that can be used in the present invention include known thermoplastic liquid crystal polyesters and thermoplastic liquid crystal polymers derived from compounds classified into (1) to (4) and derivatives thereof as exemplified below. Polyesteramide. However, in order to form a polymer capable of forming an optically anisotropic melt phase, there is naturally an appropriate range in the combination of various raw material compounds.

(1)芳香族或脂肪族二醇(代表例係參照表1) [表1]

Figure 02_image001
(1) Aromatic or aliphatic diols (refer to Table 1 for representative examples) [Table 1]
Figure 02_image001

(2)芳香族或脂肪族二羧酸(代表例係參照表2) [表2]

Figure 02_image003
(2) Aromatic or aliphatic dicarboxylic acids (refer to Table 2 for representative examples) [Table 2]
Figure 02_image003

(3)芳香族羥基羧酸(代表例係參照表3) [表3]

Figure 02_image005
(3) Aromatic hydroxycarboxylic acid (refer to Table 3 for representative examples) [Table 3]
Figure 02_image005

(4)芳香族二胺、芳香族羥基胺或芳香族胺基羧酸(代表例係參照表4) [表4]

Figure 02_image007
(4) Aromatic diamine, aromatic hydroxylamine or aromatic aminocarboxylic acid (refer to Table 4 for representative examples) [Table 4]
Figure 02_image007

作為由此等原料化合物所得之熱塑性液晶聚合物的代表例,可列舉具有表5及6所示之結構單元的共聚物。Typical examples of thermoplastic liquid crystal polymers obtained from these raw material compounds include copolymers having structural units shown in Tables 5 and 6.

[表5]

Figure 02_image009
[表6]
Figure 02_image011
[table 5]
Figure 02_image009
[Table 6]
Figure 02_image011

此等共聚物之中,較佳為至少包含對羥苯甲酸及/或6-羥基-2-萘甲酸作為重複單元之聚合物,尤其,較佳為(i)包含對羥苯甲酸與6-羥基-2-萘甲酸的重複單元之聚合物、或(ii)包含選自包含對羥苯甲酸及6-羥基-2-萘甲酸之群組的至少一種的芳香族羥基羧酸、至少一種的芳香族二醇、以及至少一種的芳香族二羧酸的重複單元之共聚物。Among these copolymers, preferred are polymers comprising at least p-hydroxybenzoic acid and/or 6-hydroxy-2-naphthoic acid as repeating units, especially, preferably (i) comprising p-hydroxybenzoic acid and 6- A polymer of repeating units of hydroxy-2-naphthoic acid, or (ii) comprising at least one aromatic hydroxycarboxylic acid selected from the group consisting of p-hydroxybenzoic acid and 6-hydroxy-2-naphthoic acid, at least one A copolymer of repeating units of aromatic diol and at least one aromatic dicarboxylic acid.

在熱塑性液晶聚合物係包含對羥苯甲酸(A)及6-羥基-2-萘甲酸(B)的重複單元之共聚物之情形,其莫耳比(A)/(B)較佳為(A)/(B)=10/90~90/10,更佳為50/50~90/10,再佳為75/25~90/10,又再佳為75/25~85/15,特佳為77/23~80/20。In the case where the thermoplastic liquid crystal polymer is a copolymer comprising repeating units of p-hydroxybenzoic acid (A) and 6-hydroxyl-2-naphthoic acid (B), the molar ratio (A)/(B) is preferably ( A)/(B)=10/90~90/10, more preferably 50/50~90/10, even better 75/25~90/10, and even better 75/25~85/15, especially The best is 77/23~80/20.

例如,(i)的共聚物之情形,除了對羥苯甲酸及6-羥基-2-萘甲酸的重複單元之外,由調整分子量等之觀點而言,亦可包含由芳香族二醇、芳香族二羧酸(例如,對苯二甲酸)所構成之重複單元。For example, in the case of the copolymer of (i), in addition to the repeating units of p-hydroxybenzoic acid and 6-hydroxy-2-naphthoic acid, from the viewpoint of molecular weight adjustment, etc., it may also contain aromatic diol, aromatic A repeating unit composed of a family of dicarboxylic acids (eg, terephthalic acid).

又,(ii)的共聚物之情形,可為包含以下重複單元的共聚物:選自包含對羥苯甲酸及6-羥基-2-萘甲酸之群組的至少一種的芳香族羥基羧酸;選自包含4,4’-二羥基聯苯、氫醌、苯基氫醌、及4,4’-二羥基二苯基醚之群組的至少一種的芳香族二醇;以及選自包含對苯二甲酸、間苯二甲酸及2,6-萘二甲酸之群組的至少一種的芳香族二羧酸。Also, in the case of the copolymer of (ii), it may be a copolymer comprising repeating units: at least one aromatic hydroxycarboxylic acid selected from the group consisting of p-hydroxybenzoic acid and 6-hydroxy-2-naphthoic acid; At least one aromatic diol selected from the group comprising 4,4'-dihydroxybiphenyl, hydroquinone, phenylhydroquinone, and 4,4'-dihydroxydiphenyl ether; and selected from the group comprising p- At least one aromatic dicarboxylic acid selected from the group of phthalic acid, isophthalic acid, and 2,6-naphthalene dicarboxylic acid.

此外,本發明中所謂能形成光學性各向異性的熔融相,例如可藉由將試料載置於熱載台,在氮氣體環境下進行升溫加熱,觀察試料的透射光而確認。In addition, in the present invention, the formation of an optically anisotropic molten phase can be confirmed, for example, by placing a sample on a heat stage, heating it under a nitrogen gas atmosphere, and observing the transmitted light of the sample.

本發明的熱塑性液晶聚合物薄膜,在上述共聚物之中,較佳為由熔點上升速度Rtm為0.20℃/min以上之熱塑性液晶聚合物所構成。更佳可為0.22℃/min以上,再佳可為0.25℃/min以上,又再佳可為0.26℃/min以上。熱塑性液晶聚合物的熔點上升速度Rtm的上限未被特別限制,但可為1.0℃/min以下。Among the above-mentioned copolymers, the thermoplastic liquid crystal polymer film of the present invention is preferably composed of a thermoplastic liquid crystal polymer having a melting point increase rate Rtm of 0.20° C./min or higher. More preferably, it may be above 0.22°C/min, even more preferably above 0.25°C/min, and even more preferably above 0.26°C/min. The upper limit of the melting point increase rate Rtm of the thermoplastic liquid crystal polymer is not particularly limited, but may be 1.0° C./min or less.

熔點上升速度RTm係如以下般算出。首先,使用示差掃描熱析儀,將熱塑性液晶聚合物薄膜的一部分置入試料容器,以10℃/min的速度從室溫(例如,25℃)升溫至400℃後,以10℃/min的速度冷卻至室溫,將再次以10℃/min的速度從室溫升溫至400℃之際出現的吸熱峰的位置作為構成熱塑性液晶聚合物薄膜之熱塑性液晶聚合物固有的熔點(以下稱為Tm0 )進行測定。 又,將用於Tm0 的測定之熱塑性液晶聚合物薄膜以Tm0 -10℃處理60分鐘後,將已進行該處理的熱塑性液晶聚合物薄膜的一部分置入試料容器,將以10℃/min的速度從室溫升溫至400℃之際出現的吸熱峰的位置作為已在Tm0 -10℃氣體環境熱處理60分鐘之熱塑性液晶聚合物薄膜的熔點Tm’進行測定。基於此等測定值,藉由以下的公式,算出構成熱塑性液晶聚合物薄膜之熱塑性液晶聚合物的熔點上升速度Rtm(℃/min)。 Rtm=(Tm’-Tm0 )/60The melting point rising rate RTm was calculated as follows. First, using a differential scanning thermal analyzer, put a part of the thermoplastic liquid crystal polymer film into the sample container, and after heating up from room temperature (for example, 25°C) to 400°C at a rate of 10°C/min, The temperature was cooled to room temperature, and the position of the endothermic peak that appeared when the temperature was raised from room temperature to 400°C at a rate of 10°C/min was taken as the intrinsic melting point (hereinafter referred to as Tm) of the thermoplastic liquid crystal polymer constituting the thermoplastic liquid crystal polymer film. 0 ) to measure. In addition, after treating the thermoplastic liquid crystal polymer film used for the measurement of Tm 0 at Tm 0 -10°C for 60 minutes, put a part of the treated thermoplastic liquid crystal polymer film into the sample container, and set the temperature at 10°C/min The position of the endothermic peak that appears when the speed is raised from room temperature to 400°C is measured as the melting point Tm' of the thermoplastic liquid crystal polymer film that has been heat-treated in Tm 0 -10°C gas environment for 60 minutes. Based on these measured values, the melting point rise rate Rtm (° C./min) of the thermoplastic liquid crystal polymer constituting the thermoplastic liquid crystal polymer film was calculated by the following formula. Rtm=(Tm'-Tm 0 )/60

如於後述的實施例及比較例所示,即使是由相同種類的單體所構成之情形,結晶的堆積(packing)特性亦能依據單體的構成比例的些微差異而變化。因此,難以利用單體的構成比例等表示結晶的堆積特性。As shown in the Examples and Comparative Examples described later, even when the crystals are composed of the same type of monomers, the packing characteristics of the crystals can vary depending on the slight difference in the composition ratio of the monomers. Therefore, it is difficult to express the packing characteristics of crystals by the constituent ratio of monomers and the like.

另一方面,本發明人等發現,藉由掌握熔點上升速度,能掌握有助於熱塑性液晶聚合物的耐熱性提升之結晶的堆積特性。藉此,只要可確認係熔點上升速度Rtm迅速的熱塑性液晶聚合物,則本發明所屬技術領域中具有通常知識者能輕易地判斷有無對耐熱化具貢獻的結晶的堆積特性。而且,本發明所屬技術領域中具有通常知識者不需要過度的嘗試錯誤,便可將具有對耐熱化具貢獻的結晶的堆積特性之熱塑性液晶聚合物進行熱處理,而獲得具有指定結晶量變曲線之熱塑性液晶聚合物薄膜等。On the other hand, the inventors of the present invention have found that by grasping the melting point rise rate, it is possible to grasp the packing characteristics of crystals which contribute to the improvement of the heat resistance of thermoplastic liquid crystal polymers. Thus, as long as it can be confirmed that the melting point rise rate Rtm is a thermoplastic liquid crystal polymer, those skilled in the art of the present invention can easily judge whether there is a crystal packing characteristic that contributes to heat resistance. Moreover, those skilled in the art to which the present invention pertains can heat-treat thermoplastic liquid crystal polymers having crystalline packing properties that contribute to heat-resistant compounds without excessive trial and error, so as to obtain thermoplastic liquid crystal polymers with specified crystallization curves. Liquid crystal polymer film, etc.

熱塑性液晶聚合物係熔點(Tm0 )例如較佳為300~380℃的範圍,更佳可為305~360℃的範圍,再佳可為310~350℃的範圍。此外,熔點係可使用示差掃描熱析儀,如上述般觀察熱塑性液晶聚合物樣品的熱行為而獲得。The melting point (Tm 0 ) of the thermoplastic liquid crystal polymer is, for example, preferably in the range of 300-380°C, more preferably in the range of 305-360°C, and even more preferably in the range of 310-350°C. In addition, the melting point can be obtained by observing the thermal behavior of the thermoplastic liquid crystal polymer sample as described above using a differential scanning calorimeter.

又,由熔融成形性的觀點而言,熱塑性液晶聚合物例如可具有在(Tm0 +20)℃之剪切速度1000/s的熔融黏度30~120Pa・s,較佳可具有熔融黏度50~100Pa・s。Also, from the viewpoint of melt formability, the thermoplastic liquid crystal polymer may have, for example, a melt viscosity of 30-120 Pa·s at a shear rate of (Tm 0 +20)°C at a shear rate of 1000/s, preferably a melt viscosity of 50-100 Pa ・s.

前述熱塑性液晶聚合物中,在不損及本發明的效果之範圍內,可添加聚對苯二甲酸乙二酯、改質聚對苯二甲酸乙二酯、聚烯烴、聚碳酸酯、聚芳酯(polyarylate)、聚醯胺、聚苯硫(polyphenylene sulfide)、聚醚醚酮、氟樹脂等熱塑性聚合物、各種添加劑。又,因應需要亦可添加填充劑。Among the aforementioned thermoplastic liquid crystal polymers, polyethylene terephthalate, modified polyethylene terephthalate, polyolefin, polycarbonate, polyarylene Thermoplastic polymers such as polyarylate, polyamide, polyphenylene sulfide, polyether ether ketone, fluororesin, and various additives. Moreover, a filler can also be added as needed.

[熱塑性液晶聚合物薄膜、積層體或成形體的製造方法] 本發明的熱塑性液晶聚合物薄膜係能藉由對於由熔點上升速度Rtm為0.20℃/min以上的熱塑性液晶聚合物所構成之熱塑性液晶聚合物薄膜(耐熱化前薄膜)進行熱處理而製造。[Method for producing thermoplastic liquid crystal polymer film, laminate or molded product] The thermoplastic liquid crystal polymer film of the present invention can be produced by heat-treating a thermoplastic liquid crystal polymer film (film before heat resistance) composed of a thermoplastic liquid crystal polymer having a melting point rise rate Rtm of 0.20° C./min or higher.

熱塑性液晶聚合物薄膜(耐熱化前薄膜)只要係由具有特定熔點上升速度Rtm的熱塑性液晶聚合物所構成,則其製造方法未被特別限定,例如,可將前述熱塑性液晶聚合物進行澆鑄成形而獲得薄膜,亦可將前述熱塑性液晶聚合物的熔融混練物進行擠壓成形而獲得薄膜。作為擠壓成形法,係使用任意方法者,但周知的T型模(T-DIE)法、充氣(Inflation)法等就工業上而言是有利的。尤其在充氣法中,不僅在熱塑性液晶聚合物薄膜的機械軸方向(以下,簡稱為MD方向),亦在與此正交的方向(以下,簡稱為TD方向)施加應力,而可在MD方向、TD方向均勻地延伸,因此能獲得已控制在MD方向與TD方向中之分子定向性、介電特性等的熱塑性液晶聚合物薄膜。The production method of the thermoplastic liquid crystal polymer film (pre-heat-resistant film) is not particularly limited as long as it is composed of a thermoplastic liquid crystal polymer having a specific melting point rise rate Rtm. For example, the aforementioned thermoplastic liquid crystal polymer can be cast and formed To obtain a film, a film can also be obtained by extruding the molten kneaded product of the aforementioned thermoplastic liquid crystal polymer. As the extrusion molding method, any method may be used, but well-known T-die (T-DIE) method, inflation (Inflation) method, etc. are industrially advantageous. Especially in the inflation method, stress is applied not only in the direction of the mechanical axis of the thermoplastic liquid crystal polymer film (hereinafter referred to as the MD direction) but also in a direction perpendicular thereto (hereinafter referred to as the TD direction). , The TD direction is uniformly extended, so it is possible to obtain a thermoplastic liquid crystal polymer film whose molecular orientation, dielectric properties, etc. have been controlled in the MD direction and the TD direction.

例如,在由T型模法所致之擠壓成形中,可將由T型模所擠壓之熔融體薄片,不僅對於熱塑性液晶聚合物薄膜的MD方向,而是對於此與TD方向雙方同時進行延伸而製膜,或可將由T型模所擠壓之熔融體薄片暫時先在MD方向進行延伸,接著在TD方向進行延伸而製膜。For example, in the extrusion molding by the T-die method, the melt sheet extruded by the T-die can be processed not only for the MD direction of the thermoplastic liquid crystal polymer film, but also for both this and the TD direction. Stretching to form a film, or stretching the molten sheet extruded by a T-die in the MD direction first, and then stretching in the TD direction to form a film.

又,在由充氣法所致之擠壓成形中,對於由環模所熔融擠壓之圓筒狀薄片,可以指定拉伸比(相當於MD方向的延伸倍率)及吹比(相當於TD方向的延伸倍率)進行延伸而製膜。Also, in extrusion molding by the inflation method, for a cylindrical sheet melted and extruded by a ring die, the draw ratio (equivalent to the stretch ratio in the MD direction) and the blow ratio (equivalent to the stretching ratio in the TD direction) can be specified. The extension ratio) is stretched to form a film.

此種擠壓成形的延伸倍率,作為MD方向的延伸倍率(或拉伸比),例如可為1.0~10左右,較佳可為1.2~7左右,再佳可為1.3~7左右。又,作為TD方向的延伸倍率(或吹比),例如可為1.5~20左右,較佳可為2~15左右,再佳可為2.5~14左右。The stretching ratio of such extrusion molding is, for example, about 1.0 to 10, preferably about 1.2 to 7, and more preferably about 1.3 to 7 as the stretching ratio (or draw ratio) in the MD direction. Also, the stretch ratio (or blow ratio) in the TD direction is, for example, about 1.5-20, preferably about 2-15, and more preferably about 2.5-14.

對於如此進行所得之熱塑性液晶聚合物薄膜(耐熱化前薄膜、材料薄膜)進行熱處理,而被耐熱化。 熱處理的方法只要經耐熱化的熱塑性液晶聚合物薄膜具有特定結晶量變曲線則未被特別限定,例如,可將熱塑性液晶聚合物薄膜(耐熱化前薄膜)藉由卷對卷等而進行直接熱處理,亦可將積層暫時得到之熱塑性液晶聚合物薄膜(耐熱化前薄膜)與被黏著物的積層體進行熱處理,亦可將藉由濺鍍或電鍍等而在熱塑性液晶聚合物薄膜(耐熱化前薄膜)上直接形成金屬層的積層體進行熱處理。此種積層體能利用熱壓或熱輥、雙帶沖壓(double belt press)等的熱壓接法而製造,但不特別受限於此。The thus obtained thermoplastic liquid crystal polymer film (film before heat-resistant, material film) is heat-treated to be heat-resistant. The method of heat treatment is not particularly limited as long as the heat-resistant thermoplastic liquid crystal polymer film has a specific crystallization curve. For example, the thermoplastic liquid crystal polymer film (film before heat resistance) can be directly heat-treated by roll-to-roll, etc. It is also possible to heat-treat the laminate of the temporarily obtained thermoplastic liquid crystal polymer film (film before heat resistance) and the adherend, or to heat-treat the laminate on the thermoplastic liquid crystal polymer film (film before heat resistance) ) The laminate with the metal layer formed directly on it is subjected to heat treatment. Such a laminate can be produced by thermocompression bonding methods such as hot pressing, hot rolls, and double belt presses, but is not particularly limited thereto.

作為進行熱處理之際的熱源,能利用公知或慣用的熱源。作為較佳的熱源,可列舉例如,熱風烘箱、蒸氣烘箱、電熱器、紅外線加熱器、陶瓷加熱器、熱輥、熱壓、電磁波照射機(例如,微波照射機等)等。此等熱源可單獨或組合二種以上而使用。As the heat source upon heat treatment, a known or commonly used heat source can be used. Preferable heat sources include, for example, hot air ovens, steam ovens, electric heaters, infrared heaters, ceramic heaters, hot rolls, hot presses, electromagnetic wave irradiators (eg, microwave irradiators, etc.) and the like. These heat sources can be used individually or in combination of 2 or more types.

耐熱化雖能藉由一階段或複數階段的熱處理而進行,但在本發明的熱塑性液晶聚合物薄膜中,較佳為以一至二階段進行熱處理,更佳為以一階段進行熱處理為較佳。Although heat resistance can be performed by one-stage or multiple-stage heat treatment, in the thermoplastic liquid crystal polymer film of the present invention, one to two-stage heat treatment is preferred, and one-stage heat treatment is more preferred.

在一階段或複數階段的熱處理中,例如,作為第一熱處理,在將熱塑性液晶聚合物的熔點設為(Tm0 )之情形,可在Tm0 ℃以下,較佳為(Tm0 -2)℃以下進行加熱處理。加熱溫度較佳可為(Tm0 -50)℃以上,更佳可為(Tm0 -40)℃以上。於此,熱塑性液晶聚合物的熔點(Tm0 )可藉由前述的熔點的測定方法而求取。在一階段的熱處理中,僅藉由第一熱處理進行耐熱化,而在複數階段的熱處理中,第一熱處理以後,下一階段的熱處理溫度可藉由比前階段的熱處理溫度更高的加熱溫度進行熱處理。In the heat treatment of one stage or multiple stages, for example, as the first heat treatment, when the melting point of the thermoplastic liquid crystal polymer is set to (Tm 0 ), it may be below Tm 0 °C, preferably (Tm 0 -2) Heat treatment below ℃. The heating temperature is preferably (Tm 0 -50)°C or higher, more preferably (Tm 0 -40)°C or higher. Here, the melting point (Tm 0 ) of the thermoplastic liquid crystal polymer can be obtained by the aforementioned melting point measurement method. In one-stage heat treatment, heat resistance is achieved only by the first heat treatment, and in multiple-stage heat treatment, after the first heat treatment, the heat treatment temperature of the next stage can be performed at a higher heating temperature than the heat treatment temperature of the previous stage. heat treatment.

熱塑性液晶聚合物薄膜的熔點雖因應熱處理而上升,但在本發明中因能迅速的耐熱化,故加熱溫度只要將熱塑性液晶聚合物的熔點(Tm0 )作為基準而決定即可。The melting point of the thermoplastic liquid crystal polymer film is raised by heat treatment, but in the present invention, rapid heat resistance can be achieved, so the heating temperature may be determined based on the melting point (Tm 0 ) of the thermoplastic liquid crystal polymer film.

因此,第二熱處理以後的加熱溫度可因應需要而在熱塑性液晶聚合物的熔點(Tm0 )以上進行,例如,在複數階段的熱處理中之最高到達溫度可為(Tm0 +30)℃以下,較佳可為(Tm0 +20)℃以下。Therefore, the heating temperature after the second heat treatment can be carried out above the melting point (Tm 0 ) of the thermoplastic liquid crystal polymer according to need. It is best to be below (Tm 0 +20)°C.

在熱處理中之各階段的加熱時間,可因應加熱溫度、熱處理的階段等而適當設定。在本發明中,因能迅速的耐熱化,故加熱時間例如整體可為10分鐘~3小時左右,較佳可為10分鐘~2小時左右(例如30分鐘~2小時左右),更佳可為10分鐘~1.3小時左右(例如45分鐘~1.3小時左右)。The heating time at each stage in the heat treatment can be appropriately set according to the heating temperature, the stage of the heat treatment, and the like. In the present invention, since heat resistance can be achieved rapidly, the overall heating time can be, for example, about 10 minutes to 3 hours, preferably about 10 minutes to 2 hours (for example, about 30 minutes to 2 hours), and more preferably about 10 minutes to 2 hours. About 10 minutes to 1.3 hours (for example, about 45 minutes to 1.3 hours).

作為被黏著物,只要可利用作為熱處理的支持體則未被特別限定,可列舉金屬層、耐熱性樹脂層等。The adherend is not particularly limited as long as it can be used as a heat-treated support, and examples thereof include a metal layer, a heat-resistant resin layer, and the like.

作為構成金屬層的金屬,只要為具有導電性的金屬則未被特別限定,但可列舉例如,銅、銅合金、鋁、鋁合金、鎳、鎳合金、鐵、鐵合金、銀、銀合金、及此等的複合金屬種類等。在此等金屬中,可以2000質量ppm以下包含其他金屬種類,亦可存在不可避免的雜質。The metal constituting the metal layer is not particularly limited as long as it is a conductive metal, but examples include copper, copper alloys, aluminum, aluminum alloys, nickel, nickel alloys, iron, iron alloys, silver, silver alloys, and Such composite metal types, etc. Among these metals, other metal species may be contained at 2000 mass ppm or less, and unavoidable impurities may be present.

使用金屬層作為被黏著物之情形,在熱處理後,能以熱塑性液晶聚合物薄膜部分經耐熱化的積層體的形態直接使用。例如,在需要導電性、放熱性之情形,只要使用銅、銅合金、銀、銀合金即可,若需要強磁性則使用鐵合金等即可,若需要便宜者則使用鋁等即可。In the case of using a metal layer as an adherend, after heat treatment, it can be used as it is in the form of a laminate in which the thermoplastic liquid crystal polymer film part has been heat-resistant. For example, copper, copper alloys, silver, and silver alloys may be used when conductivity and heat dissipation are required, iron alloys may be used if strong magnetism is required, and aluminum may be used if cheap ones are required.

較佳為,可使用銅作為電路基板用的金屬種類,具體而言,金屬層可由包含99.8%質量以上的銅,再包含2000質量ppm以下的選自包含銀、錫、鋅、鉻、硼、鈦、鎂、磷、矽、鐵、金、鐠、鎳、及鈷之群組的至少一種的其他金屬種類、及剩餘部分不可避免的雜質的銅所構成。Preferably, copper can be used as the metal species for the circuit substrate. Specifically, the metal layer can be composed of copper containing more than 99.8% by mass, and then containing less than 2000 mass ppm of silver, tin, zinc, chromium, boron, It is composed of at least one other metal species from the group of titanium, magnesium, phosphorus, silicon, iron, gold, nickel, and cobalt, and copper as an unavoidable impurity in the remainder.

作為在熱塑性液晶聚合物薄膜上形成金屬層的方法,可使用公知的方法。例如在熱塑性液晶聚合物薄膜上,可蒸鍍金屬層,亦可藉由無電解電鍍、電解電鍍而形成金屬層。又,亦可藉由熱壓接而將金屬箔(例如銅箔)積層在熱塑性液晶聚合物薄膜的表面。銅箔只要為在電路基板中能使用的銅箔,則未被特別限定,可為壓延銅箔、電解銅箔之任一者。As a method of forming the metal layer on the thermoplastic liquid crystal polymer film, known methods can be used. For example, a metal layer can be vapor-deposited on a thermoplastic liquid crystal polymer film, and a metal layer can also be formed by electroless plating or electrolytic plating. In addition, a metal foil (for example, copper foil) may be laminated on the surface of the thermoplastic liquid crystal polymer film by thermocompression bonding. Copper foil is not particularly limited as long as it is copper foil that can be used for a circuit board, and any of rolled copper foil and electrolytic copper foil may be used.

作為構成耐熱性樹脂層的樹脂,可列舉具有比在熱處理所實行的最高到達溫度更高的熔點之樹脂或熱固性樹脂等,較佳可列舉聚醯亞胺、聚苯醚(polyphenylene ether)、聚苯硫、氟樹脂(例如,聚四氟乙烯)等。As the resin constituting the heat-resistant resin layer, resins or thermosetting resins having a melting point higher than the highest temperature achieved by heat treatment may be mentioned, preferably polyimide, polyphenylene ether (polyphenylene ether), poly Benzene sulfur, fluororesins (for example, polytetrafluoroethylene), and the like.

作為在熱塑性液晶聚合物薄膜上形成耐熱性樹脂層之方法,可使用公知的方法,例如可藉由熱壓接而將耐熱性樹脂薄膜積層在熱塑性液晶聚合物薄膜的表面。As a method of forming the heat-resistant resin layer on the thermoplastic liquid crystal polymer film, known methods can be used. For example, the heat-resistant resin film can be laminated on the surface of the thermoplastic liquid crystal polymer film by thermocompression bonding.

前述熱塑性液晶聚合物薄膜與金屬層的積層體,若將在各個單層的厚度設為Ta(μm)、Tb(μm),則Ta、Tb分別能選自0.1~500μm的範圍。由近年的薄型化、輕量化的觀點而言,Ta較佳可為1~175μm,更佳可為5~130μm左右。又,Tb較佳可為1~20μm,更佳可為2~15μm左右。In the above-mentioned laminate of the thermoplastic liquid crystal polymer film and the metal layer, if the thickness of each single layer is Ta (μm) and Tb (μm), Ta and Tb can be selected from the range of 0.1 to 500 μm, respectively. From the viewpoint of thinning and weight reduction in recent years, Ta is preferably 1 to 175 μm, and more preferably about 5 to 130 μm. Also, Tb is preferably 1 to 20 μm, more preferably about 2 to 15 μm.

此外,前述積層體具有熱塑性液晶聚合物薄膜與金屬層的多層結構,包含至少一層的熱塑性液晶聚合物薄膜與至少一層的金屬層。例如,作為多層結構的積層體,可列舉具有以下積層結構者,但不限於此等, (i)金屬層/熱塑性液晶聚合物薄膜 (ii)金屬層/熱塑性液晶聚合物薄膜/金屬層 (iii)熱塑性液晶聚合物薄膜/熱塑性液晶聚合物薄膜/金屬層 (iv)熱塑性液晶聚合物薄膜/金屬層/熱塑性液晶聚合物薄膜 (v)金屬層/熱塑性液晶聚合物薄膜/熱塑性液晶聚合物薄膜/金屬層 (vi)金屬層/熱塑性液晶聚合物薄膜/金屬層/熱塑性液晶聚合物薄膜/金屬層等。In addition, the aforementioned laminate has a multi-layer structure of a thermoplastic liquid crystal polymer film and a metal layer, including at least one layer of thermoplastic liquid crystal polymer film and at least one metal layer. For example, as a laminate of a multilayer structure, those having the following laminate structures can be cited, but not limited thereto, (i) Metal layer/thermoplastic liquid crystal polymer film (ii) Metal layer/thermoplastic liquid crystal polymer film/metal layer (iii) thermoplastic liquid crystal polymer film/thermoplastic liquid crystal polymer film/metal layer (iv) thermoplastic liquid crystal polymer film/metal layer/thermoplastic liquid crystal polymer film (v) Metal layer/thermoplastic liquid crystal polymer film/thermoplastic liquid crystal polymer film/metal layer (vi) Metal layer/thermoplastic liquid crystal polymer film/metal layer/thermoplastic liquid crystal polymer film/metal layer, etc.

此外,熱塑性液晶聚合物薄膜可以已與被黏著物積層的狀態,直接以積層體的形態使用,亦可與被黏著物分離而單獨使用熱塑性液晶聚合物薄膜。再者,對於熱塑性液晶聚合物薄膜,亦可隔著適當的接著層而進行多層化。作為接著層,可列舉例如,聚苯醚、環氧樹脂、聚胺基甲酸酯、熱塑性聚醯亞胺、聚醚醯亞胺等。In addition, the thermoplastic liquid crystal polymer film may be used in the form of a laminate as it is in the state of being laminated with the adherend, or the thermoplastic liquid crystal polymer film may be used alone after being separated from the adherend. Furthermore, the thermoplastic liquid crystal polymer film can also be multilayered via an appropriate adhesive layer. Examples of the adhesive layer include polyphenylene ether, epoxy resin, polyurethane, thermoplastic polyimide, polyetherimide, and the like.

又,例如,成形體亦可藉由對於熱塑性液晶聚合物薄膜、及/或積層體進行後加工而被製造。Also, for example, a molded article can also be produced by post-processing a thermoplastic liquid crystal polymer film and/or a laminate.

例如,對於熱塑性液晶聚合物薄膜,可藉由在表面上形成導體圖案,而製造電路板等成形體(或單位電路基板)。又,對於積層體的金屬層,可藉由形成導體圖案,而製造電路板等成形體(或單位電路基板)。 再者,亦可將已形成導體圖案的單位電路基板對於其他基板材料進行重疊而多層化,藉此製造電路板等成形體(或電路基板)。作為基板材料,可例示上述的熱塑性液晶聚合物薄膜、金屬層、單位電路基板等,因應需要亦可使用接著層。For example, in the case of a thermoplastic liquid crystal polymer film, a molded body such as a circuit board (or a unit circuit board) can be manufactured by forming a conductive pattern on the surface. Moreover, molded objects such as circuit boards (or unit circuit boards) can be produced by forming conductive patterns on the metal layers of the laminate. Furthermore, a unit circuit board on which a conductor pattern has been formed can be laminated on another board material to form a molded body (or a circuit board) such as a circuit board. As the substrate material, the above-mentioned thermoplastic liquid crystal polymer film, metal layer, unit circuit board, etc. can be exemplified, and an adhesive layer can also be used if necessary.

或者,亦可對於具備由熱塑性液晶聚合物所構成之聚合物層的預備成形體,亦即前述聚合物層係由熔點上升速度Rtm為0.20℃/min以上的熱塑性液晶聚合物所構成之預備成形體,進行熱處理,而獲得成形體。該情形,成形體的聚合物部分具有後述之特定範圍的UC。Alternatively, for a preformed article having a polymer layer composed of a thermoplastic liquid crystal polymer, that is, a preform in which the aforementioned polymer layer is composed of a thermoplastic liquid crystal polymer having a melting point rise rate Rtm of 0.20°C/min or higher The body is subjected to heat treatment to obtain a shaped body. In this case, the polymer portion of the molded article has UC in a specific range described later.

[熱塑性液晶聚合物薄膜、積層體及成形體] 本發明的熱塑性液晶聚合物薄膜、積層體、及成形體係藉由熱處理而在熱塑性液晶聚合物中產生具有特定結晶結構(斜方晶結構)的結晶,因此熱塑性液晶聚合物部分在由廣角X射線繞射測定所偵測之繞射量變曲線中,在將2θ=14~26度之基線上的積分強度設為A、將在2θ=22.3~24.3度中將主峰的量變曲線近似線性函數並去除後的次峰的量變曲線的積分強度設為B、並設為B/A×100=UC時,滿足下述式(1),更佳為滿足下述式(2)。 0≦UC≦2.0 (1) 0.1≦UC≦1.5 (2)[Thermoplastic liquid crystal polymer films, laminates and moldings] The thermoplastic liquid crystal polymer film, laminate, and molding system of the present invention produce crystals with a specific crystal structure (orthorhombic crystal structure) in the thermoplastic liquid crystal polymer by heat treatment, so the thermoplastic liquid crystal polymer part is exposed to wide-angle X-rays. In the diffraction quantitative curve detected by diffraction measurement, the integrated intensity on the baseline of 2θ=14-26 degrees is set as A, and the quantitative curve of the main peak is approximated to a linear function at 2θ=22.3-24.3 degrees and removed When the integral intensity of the quantitative curve of the subsequent secondary peak is B and B/A×100=UC, the following formula (1) is satisfied, and the following formula (2) is more preferably satisfied. 0≦UC≦2.0 (1) 0.1≦UC≦1.5 (2)

本發明中所謂之UC,可被視為斜方晶結晶的結構的均勻性(結晶性)之指標。數值愈大,意指斜方晶的(200)面的繞射信號愈靈敏。亦即,結晶結構的均勻性高的斜方晶大幅成長。此外,由廣角X射線繞射測定所致之UC,係藉由後述實施例所記載的方法所測定之值。 由上述觀點而言,UC較佳為0.20以上,更佳為0.50以上,再佳為0.80以上,又再佳為1.00以上,特佳為1.25以上。The so-called UC in the present invention can be regarded as an indicator of the uniformity (crystallinity) of the orthorhombic crystal structure. The larger the value, the more sensitive the diffraction signal of the (200) plane of the orthorhombic crystal. That is, orthorhombic crystals with high uniformity in the crystal structure grow significantly. In addition, UC by wide-angle X-ray diffraction measurement is a value measured by the method described in the Example mentioned later. From the above viewpoint, UC is preferably at least 0.20, more preferably at least 0.50, even more preferably at least 0.80, still more preferably at least 1.00, and most preferably at least 1.25.

又,將在2θ=20±1度存在最大值之前述主峰的半高寬設為SC(度)時,較佳為滿足1.4≦SC。在SC的值為高之情形,能進一步使斜方晶的生成度提升。在一般的熱處理中熔點提升之情形,能藉由提高SC的值而進行耐熱化,但在本發明中,藉由熱塑性液晶聚合物部分具有源自特定結晶結構之特定值的參數UC,即使SC的值相對地低,亦能進行高熔點化。Also, when the full width at half maximum of the main peak having a maximum value at 2θ=20±1° is SC (°), it is preferable to satisfy 1.4≦SC. When the value of SC is high, the generation degree of orthorhombic crystals can be further improved. When the melting point is raised in general heat treatment, the heat resistance can be improved by increasing the value of SC, but in the present invention, the thermoplastic liquid crystal polymer part has a parameter UC of a specific value derived from a specific crystal structure, even if SC The value of is relatively low, and a high melting point can also be achieved.

主峰的半高寬SC再佳為1.7以下。在滿足1.4≦SC≦1.7之情形,可被視為在多數薄膜中產生具有大微晶尺寸的斜方晶。The half width SC of the main peak is more preferably 1.7 or less. When 1.4≦SC≦1.7 is satisfied, it can be considered that orthorhombic crystals with a large crystallite size are generated in most thin films.

又,本發明的熱塑性液晶聚合物薄膜係使用示差掃描熱析儀,將以10℃/min的速度從室溫(例如25℃)升溫至400℃的溫度範圍之際出現的吸熱峰位置設為熱塑性液晶聚合物薄膜的熔點(Tm)。例如,熱塑性液晶聚合物薄膜的熔點(Tm)可為310℃以上,較佳可為315℃以上,更佳可為320℃以上。熔點(Tm)的上限未被特別限定,但例如可為400℃左右。In addition, the thermoplastic liquid crystal polymer film of the present invention uses a differential scanning thermal analyzer, and the position of the endothermic peak that appears when the temperature is raised from room temperature (for example, 25° C.) to a temperature range of 400° C. at a rate of 10° C./min is set as Melting point (Tm) of thermoplastic liquid crystal polymer films. For example, the melting point (Tm) of the thermoplastic liquid crystal polymer film may be above 310°C, preferably above 315°C, more preferably above 320°C. The upper limit of the melting point (Tm) is not particularly limited, but may be, for example, about 400°C.

例如,在熱塑性液晶聚合物部分中,將SC與熔點(Tm)的關係以Tm/SC表示之情形,在本發明的熱塑性液晶聚合物薄膜、積層體及成形體中,Tm/SC例如可為180~240左右,較佳可為182~235左右,更佳可為185~230左右。For example, when the relationship between SC and melting point (Tm) is represented by Tm/SC in the thermoplastic liquid crystal polymer part, in the thermoplastic liquid crystal polymer film, laminate and molded article of the present invention, Tm/SC can be, for example, About 180-240, preferably about 182-235, more preferably about 185-230.

本發明中之最大的特徵在於,藉由利用上述參數記載在被使用作為積層體或成形體之際所求取的耐熱性及其積層體的生產性,而發現迄今未見過的嶄新的熱塑性液晶聚合物薄膜、積層體及成形體。The greatest feature of the present invention is that by using the above parameters to describe the heat resistance and the productivity of the laminate when it is used as a laminate or a molded product, a novel thermoplasticity that has not been seen so far has been discovered. Liquid crystal polymer films, laminates and moldings.

即使係已市售的熱塑性液晶聚合物薄膜,例如亦存在熔點為280~340℃的高耐熱性薄膜,但在此種熱塑性液晶聚合物薄膜中,UC不存在於指定範圍。在此種熱塑性液晶聚合物薄膜中,耐熱化不是藉由斜方晶的形成而進行,而主要是藉由固相聚合程序而進行,因此耐熱化變得需要龐大時間的熱處理,就生產性的點而言為不利。Even if it is a commercially available thermoplastic liquid crystal polymer film, for example, there are high heat-resistant films having a melting point of 280 to 340° C., but in such thermoplastic liquid crystal polymer film, UC does not exist in the specified range. In such a thermoplastic liquid crystal polymer film, the heat resistance is not performed by the formation of orthorhombic crystals, but mainly by the solid-state polymerization process, so the heat resistance becomes a heat treatment that requires a lot of time, and it is difficult to achieve productivity. It is disadvantageous in point of view.

於此,重要的點在於,根據本發明,即使係具有與由以往技術所得之熱塑性液晶聚合物薄膜相同的熔點之情形,在本發明的熱塑性液晶聚合物薄膜、積層體及成形體中,因UC存在於特定範圍,故其耐熱性與生產性亦高。又,藉由控制耐熱化的熱處理溫度及時間,熱塑性液晶聚合物薄膜的熔點能任意地控制成與以往同樣的溫度。Here, the important point is that according to the present invention, even if it has the same melting point as that of the thermoplastic liquid crystal polymer film obtained by the prior art, in the thermoplastic liquid crystal polymer film, laminate and molded article of the present invention, because UC exists in a specific range, so its heat resistance and productivity are also high. Also, by controlling the heat treatment temperature and time for heat resistance, the melting point of the thermoplastic liquid crystal polymer film can be arbitrarily controlled to the same temperature as conventional ones.

因此,本發明的熱塑性液晶聚合物薄膜、積層體及成形體不僅耐熱性優異,且操作範圍亦寬廣,因此可適合使用在各種用途。Therefore, the thermoplastic liquid crystal polymer film, laminate, and molded article of the present invention are not only excellent in heat resistance, but also have a wide operating range, so they can be suitably used in various applications.

例如,具備至少一層的熱塑性液晶聚合物薄膜與至少一層的金屬層之積層體,可在金屬層形成電路圖案,作為電路板是有用的。又,在成形體具備複數電路層之情形,能滿足高密度化、高功能化的要求,因此成形體適合作為多層電路基板。For example, a laminate comprising at least one thermoplastic liquid crystal polymer film and at least one metal layer can form a circuit pattern on the metal layer, and is useful as a circuit board. In addition, when the molded body has a plurality of circuit layers, it can meet the demands for higher density and higher functionality, so the molded body is suitable as a multilayer circuit board.

本發明的熱塑性液晶聚合物薄膜、積層體及成形體不僅生產性優異,且耐熱性亦明顯地高,因此適合高頻率用電路基板、車載用感測器、行動用電路基板、天線等的用途,但不限定於此等。 [實施例]The thermoplastic liquid crystal polymer film, laminate, and molded article of the present invention are not only excellent in productivity, but also have remarkably high heat resistance, so they are suitable for applications such as high-frequency circuit boards, automotive sensors, mobile circuit boards, and antennas. , but not limited to these. [Example]

以下列舉實施例更詳細地說明本發明,但本發明不受此等實施例任何限定。The following examples are given to illustrate the present invention in more detail, but the present invention is not limited by these examples.

(膜厚) 使用數位厚度計(Mitutoyo股份有限公司製),將所得之熱塑性液晶聚合物薄膜在TD方向以1cm間隔進行測定,將從中心部及端部任意選擇的10點的平均值設為膜厚。(film thickness) The obtained thermoplastic liquid crystal polymer film was measured at intervals of 1 cm in the TD direction using a digital thickness meter (manufactured by Mitutoyo Co., Ltd.), and the average value of 10 points arbitrarily selected from the center and edge was defined as the film thickness.

(Tm) 使用示差掃描熱析儀(島津製作所股份有限公司製),從在實施例及比較例中所得之熱塑性液晶聚合物薄膜採樣指定大小並置入試料容器,將以10℃/min的速度從室溫升溫至400℃之際出現的吸熱峰的位置設為熱塑性液晶聚合物薄膜的熔點Tm。(Tm) Using a differential scanning thermal analyzer (manufactured by Shimadzu Corporation), sample a specified size from the thermoplastic liquid crystal polymer films obtained in Examples and Comparative Examples and put them into sample containers. The position of the endothermic peak that appeared when the temperature was raised to 400° C. was defined as the melting point Tm of the thermoplastic liquid crystal polymer film.

(Tm0 及Rtm) 使用示差掃描熱析儀(島津製作所股份有限公司製),從熱塑性液晶聚合物薄膜(耐熱化前薄膜)採樣指定大小並置入試料容器,在以10℃/min的速度從室溫升溫至400℃後,以10℃/min的速度冷卻至室溫,將再次以10℃/min的速度從室溫升溫至400℃之際出現的吸熱峰的位置設為構成熱塑性液晶聚合物薄膜之熱塑性液晶聚合物的熔點Tm0(Tm 0 and Rtm) Using a differential scanning thermal analyzer (manufactured by Shimadzu Corporation), a sample of a specified size is sampled from a thermoplastic liquid crystal polymer film (film before heat resistance), and placed in a sample container, and the temperature is increased at a rate of 10°C/min. After heating up from room temperature to 400°C, cool down to room temperature at a rate of 10°C/min, and set the position of the endothermic peak that appears when the temperature is raised from room temperature to 400°C at a rate of 10°C/min again to constitute a thermoplastic liquid crystal The melting point Tm 0 of the thermoplastic liquid crystal polymer of the polymer film.

又,將熱塑性液晶聚合物薄膜(耐熱化前薄膜)在批式烘箱中於Tm0 -10℃的氣體環境下處理60分鐘。使用示差掃描熱析儀,從已處理的熱塑性液晶聚合物薄膜採樣指定大小並置入試料容器,將以10℃/min的速度從室溫升溫至400℃之際出現的吸熱峰的位置設為經上述處理的熱塑性液晶聚合物薄膜的熔點Tm’,藉由以下的公式,算出構成熱塑性液晶聚合物薄膜之熱塑性液晶聚合物的熔點上升速度Rtm(℃/min)。 Rtm=(Tm’-Tm0 )/60Also, the thermoplastic liquid crystal polymer film (film before heat resistance) was treated in a batch oven in an atmosphere of Tm 0 -10°C for 60 minutes. Using a differential scanning calorimeter, sample a specified size from the processed thermoplastic liquid crystal polymer film and put it into a sample container, and set the position of the endothermic peak that appears when the temperature is raised from room temperature to 400°C at a rate of 10°C/min as From the melting point Tm' of the thermoplastic liquid crystal polymer film treated above, the melting point rise rate Rtm (° C./min) of the thermoplastic liquid crystal polymer constituting the thermoplastic liquid crystal polymer film was calculated by the following formula. Rtm=(Tm'-Tm 0 )/60

(廣角X射線繞射) 廣角X射線繞射測定係使用Bruker AXS公司製、D8 Discover裝置。將熱塑性液晶聚合物薄膜裁切成10mm四邊形,貼附在標準的樣品座。為了提高數據的S/N比,熱塑性液晶聚合物薄膜係以使MD方向一致之方式重疊複數片,以厚度成為0.5mm左右之方式進行調整。X射線源係設為CuKα,將燈絲電壓設為45kV,將電流設為110mA。準直器係使用0.3mm者。(Wide Angle X-ray Diffraction) For the wide-angle X-ray diffraction measurement system, a D8 Discover device manufactured by Bruker AXS Co., Ltd. was used. Cut the thermoplastic liquid crystal polymer film into a 10mm quadrilateral and attach it to a standard sample holder. In order to increase the S/N ratio of data, a plurality of thermoplastic liquid crystal polymer films are stacked so that the MD directions are aligned, and the thickness is adjusted to be about 0.5 mm. The X-ray source system was CuKα, the filament voltage was 45 kV, and the current was 110 mA. The collimator is 0.3mm.

將標準樣品座安裝至裝置,以從與熱塑性液晶聚合物薄膜的法線一致的方向照射X射線之方式進行位置調整。亦即,對於熱塑性液晶聚合物薄膜表面,垂直地照射X射線。將熱塑性液晶聚合物薄膜與偵測器的距離(攝影機距離)設為100mm。偵測器係使用二維PSPC偵測器,取得二維繞射影像。偵測器係設置在試料的後方,以熱塑性液晶聚合物薄膜的法線、偵測器的法線、X射線照射方向全部一致之方式進行配置。曝光時間係設為600秒鐘。The standard sample holder is attached to the device, and the position is adjusted so that X-rays are irradiated from a direction consistent with the normal line of the thermoplastic liquid crystal polymer film. That is, to the surface of the thermoplastic liquid crystal polymer film, X-rays are irradiated perpendicularly. The distance between the thermoplastic liquid crystal polymer film and the detector (camera distance) was set to 100 mm. The detector uses a two-dimensional PSPC detector to obtain a two-dimensional diffraction image. The detector is arranged behind the sample, and is arranged in such a way that the normal line of the thermoplastic liquid crystal polymer film, the normal line of the detector, and the X-ray irradiation direction are all consistent. The exposure time was set at 600 seconds.

將所得之二維繞射影像進行圓環平均處理,轉換成一維量變曲線(數據1)。圓環平均的範圍以繞射角(2θ)表示係設為10~30度。方位角範圍係設為0~180度。2θ的節距(step)係設為0.05度。此外,使方位角0度對應於熱塑性液晶聚合物薄膜的MD方向。The obtained two-dimensional diffraction image is subjected to circular average processing and converted into a one-dimensional quantitative curve (data 1). The range of the circular average is set to 10 to 30 degrees in terms of diffraction angle (2θ). The azimuth range is set to 0~180 degrees. The 2θ step is set to 0.05 degrees. In addition, an azimuth angle of 0 degrees is made to correspond to the MD direction of the thermoplastic liquid crystal polymer film.

經轉換的一維量變曲線(數據1)係使用以相同條件所取得之背景值數據(未安裝試料時的測定數據)進行寄生散射等的處理。亦即,在將背景值數據進行一維量變曲線化後,從熱塑性液晶聚合物薄膜的數據扣除。將此作為數據2。The converted one-dimensional quantitative curve (data 1) is processed by using the background value data (measurement data when the sample is not installed) obtained under the same conditions to perform processing such as parasitic scattering. That is, after the background value data is one-dimensionally plotted, it is subtracted from the data of the thermoplastic liquid crystal polymer film. Take this as data2.

對於經背景值處理的數據2,設定基線並扣除。基線係設為在背景值處理後的數據中,連接2θ在14度與26度之強度值的線性函數。此外,在14度及26度之強度值,係分別設為13.8~14.2度、25.8~26.2度的範圍之強度的平均值(間隔0.05度)。從數據2扣除上述線性函數。將此作為數據3。對於數據3,在繞射角2θ為14~26度的範圍求取積分強度,將所求取的積分強度設為A。For data 2 treated with background values, a baseline was set and subtracted. The baseline was set as a linear function connecting the intensity values at 14 and 26 degrees 2Θ in the background value processed data. In addition, the intensity values at 14° and 26° are respectively set as the average value (0.05° interval) of the intensity in the ranges of 13.8° to 14.2° and 25.8° to 26.2°. Subtract the above linear function from data 2. Take this as data 3. For the data 3, the integrated intensity was obtained in the range of the diffraction angle 2θ of 14 to 26 degrees, and the obtained integrated intensity was defined as A.

再者,在數據3中,計算連接繞射角2θ在22.3度與24.3度之強度值的線性函數,從數據3再減去線性函數。將此作為數據4。對於數據4,求取2θ為22.3~24.3度的範圍之積分強度(B)。再計算B/A×100(=UC)。Furthermore, in Data 3, a linear function connecting intensity values at diffraction angles 2θ of 22.3 degrees and 24.3 degrees is calculated, and the linear function is subtracted from Data 3 again. Take this as data 4. For data 4, the integral intensity (B) in the range of 2θ of 22.3 to 24.3 degrees was obtained. Then calculate B/A×100(=UC).

又,在數據3中,求取繞射角2θ在19~21度之範圍的最大強度值(M),求取成為其一半的強度(M/2)。在數據3中,求取強度成為M/2的二點的繞射角2θ,計算二點的2θ差,設為半高寬(=SC)。此值可被視為表示來自結晶的繞射峰的寬度之指標。In addition, in data 3, the maximum intensity value (M) at which the diffraction angle 2θ is in the range of 19 to 21 degrees is obtained, and the intensity (M/2) which is half of it is obtained. In data 3, the diffraction angle 2θ of the two points whose intensity is M/2 is obtained, and the difference in 2θ between the two points is calculated and set as the full width at half maximum (=SC). This value can be regarded as an index showing the width of the diffraction peak from the crystal.

(覆金屬積層板的製作) 如圖1所示,重疊熱塑性液晶聚合物薄膜1與金屬箔2,製作組件。金屬箔係使用福田金屬箔粉工業股份有限公司製(CF-H9A-DS-HD2-12厚度12μm)。將此組件在北川精機股份有限公司製真空壓製機中,於真空下,以6℃/min使其從室溫(25℃)升溫至250℃,保持15分鐘後,以6℃/min升溫至300℃後,以面壓4MPa的條件使其熱壓接,在10分鐘後以7℃/min降溫至250℃,到達250℃後急速冷卻,藉此確認成為50℃,釋放真空,製作具備熱塑性液晶聚合物薄膜1與金屬箔2的覆金屬積層板3。(Manufacturing of metal-clad laminates) As shown in FIG. 1, a thermoplastic liquid crystal polymer film 1 and a metal foil 2 are laminated to form a module. As the metal foil, the product made by Fukuda Metal Foil Powder Industry Co., Ltd. (CF-H9A-DS-HD2-12 thickness 12 μm) was used. This assembly was heated from room temperature (25°C) to 250°C at 6°C/min under vacuum in a vacuum press made by Kitagawa Seiki Co., Ltd., held for 15 minutes, and then raised to After 300°C, make it thermocompression-bonded under the condition of surface pressure 4MPa, and then cool down to 250°C at 7°C/min after 10 minutes, and cool rapidly after reaching 250°C, thereby confirming that it is 50°C, release the vacuum, and produce thermoplasticity. Metal-clad laminate 3 of liquid crystal polymer film 1 and metal foil 2 .

(耐熱性-浮焊(solder float)) 由浮焊所致之耐熱性,係利用調查在保持於指定溫度的熔融銲料浴(solder bath)上熱塑性液晶聚合物薄膜面是否保持當初的形狀之方法進行測定。亦即,將覆金屬積層板3載置於288℃的銲料浴上60秒鐘,以目視觀察熱塑性液晶聚合物薄膜表面的鼓起、變形等形態變化。評價基準係如以下。 A:藉由60秒鐘的銲料浴,幾乎未確認到鼓起、變形。 B:藉由60秒鐘的銲料浴,確認到鼓起、一定程度的劇烈變形。 以下,表中所記載的A表示合格,B表示不合格。(heat resistance - solder float) Heat resistance due to solder float is measured by investigating whether the surface of the thermoplastic liquid crystal polymer film maintains its original shape on a molten solder bath kept at a specified temperature. That is, the metal-clad laminate 3 was placed on a solder bath at 288° C. for 60 seconds, and morphological changes such as swelling and deformation on the surface of the thermoplastic liquid crystal polymer film were observed visually. The evaluation criteria are as follows. A: Swelling and deformation were hardly observed by the solder bath for 60 seconds. B: Swelling and some severe deformation were confirmed by the solder bath for 60 seconds. Hereinafter, A described in the table indicates pass, and B indicates fail.

(耐熱性-層流/操作範圍) 由層流所致之耐熱性,係觀察多層積層基板四角落的熱塑性液晶聚合物薄膜形狀變化而進行評價。如圖2所示,將二片由圖1所得之覆金屬積層板3,以彼此的熱塑性液晶聚合物薄膜1相合之方式重疊,製作組件。在此組件的上下表面分別配設SUS板4及緩衝材5而夾住組件,在真空壓製機中,以310℃、面壓2MPa的條件使其熱壓接,製作多層積層基板。藉由目視觀察所製作之多層積層基板四角落的熱塑性液晶聚合物薄膜形狀變化,並藉由以下的基準進行評價。 A:熱塑性液晶聚合物幾乎不流動,在四角落完全未從金屬層確認到大於1mm的毛邊。 B:在積層條件中,藉由熱塑性液晶聚合物的流動,在四角落的任一部分從金屬層確認到大於1mm的毛邊。(Heat Resistance - Laminar Flow/Operating Range) The heat resistance due to laminar flow was evaluated by observing the shape change of the thermoplastic liquid crystal polymer film at the four corners of the multilayer substrate. As shown in FIG. 2, two metal-clad laminates 3 obtained in FIG. 1 are stacked so that the thermoplastic liquid crystal polymer films 1 are aligned with each other to make a module. The upper and lower surfaces of the module were respectively provided with SUS boards 4 and cushioning materials 5 to clamp the module, and then thermocompression-bonded in a vacuum press at 310°C and a surface pressure of 2 MPa to produce a multi-layer laminated substrate. The shape change of the thermoplastic liquid crystal polymer film at the four corners of the produced multi-layer laminate substrate was visually observed, and evaluated according to the following criteria. A: The thermoplastic liquid crystal polymer hardly flowed, and no burrs larger than 1 mm were observed from the metal layer at the four corners. B: Under the lamination condition, due to the flow of the thermoplastic liquid crystal polymer, burrs larger than 1 mm were confirmed from the metal layer at any part of the four corners.

(生產性) 生產性的評價係針對熱塑性液晶聚合物薄膜(耐熱化前薄膜),在後述的實施例及比較例中,將在熱處理1小時、或在複數階段的熱處理中最初熱處理1小時熔點上升至325℃以上之情形設為A,將需要更多時間之情形、或在熱處理1小時熔點未上升至325℃以上之情形設為B。(productive) Productivity was evaluated for thermoplastic liquid crystal polymer films (films before heat resistance). In the examples and comparative examples described later, the melting point was raised to 325°C after heat treatment for 1 hour or the first heat treatment in multiple stages of heat treatment. The above case was set as A, and the case where more time was required or the case where the melting point did not rise to 325° C. or higher after heat treatment for 1 hour was set as B.

(熱塑性液晶聚合物的製作) 作為熱塑性液晶聚合物的聚合的代表例,實施例1的方法係為以下。投入對羥苯甲酸6.1kg(23莫耳份)、2-羥基-6-萘甲酸28.1kg(77莫耳份)、及乙酸酐20.1kg,在乙醯基化(160℃,回流下約2小時)後,以1℃/min進行升溫並保持在340℃,進行60分鐘減壓處理(1000Pa),進行熔融聚縮合。(Production of thermoplastic liquid crystal polymer) As a representative example of polymerization of thermoplastic liquid crystal polymers, the method of Example 1 is as follows. Drop into p-hydroxybenzoic acid 6.1kg (23 mole parts), 2-hydroxyl-6-naphthoic acid 28.1kg (77 mole parts), and acetic anhydride 20.1kg, in acetylation (160 ℃, about 2 hours), the temperature was raised at 1° C./min and kept at 340° C., and a reduced pressure treatment (1000 Pa) was performed for 60 minutes to carry out melt polycondensation.

<實施例1> (1)將包含6-羥基-2-萘甲酸單元23莫耳份、對羥苯甲酸單元77莫耳份的莫耳比例之熱致液晶性聚酯進行聚合,由充氣模進行擠壓成形,獲得厚度50μm的熱塑性液晶聚合物薄膜(耐熱化前薄膜)。構成所得之熱塑性液晶聚合物薄膜(耐熱化前薄膜)之熱塑性液晶聚合物的Tm0 為310℃。 (2)針對由上述所得之熱塑性液晶聚合物薄膜(耐熱化前薄膜),以290℃進行熱處理1小時。所得之熱塑性液晶聚合物薄膜的Tm為328℃。 (3)使用由上述(2)所得之熱塑性液晶聚合物薄膜製作覆金屬積層板、多層積層基板。針對所得之熱塑性液晶聚合物薄膜與多層積層基板,進行關於廣角X射線繞射與浮焊、層流的評價之結果係如同表所示。此外,圖3係揭示由實施例1所得之熱處理後的熱塑性液晶聚合物薄膜之廣角X射線繞射量變曲線(數據3)的圖表。<Example 1> (1) Polymerize thermotropic liquid crystalline polyester comprising 23 moles of 6-hydroxy-2-naphthoic acid units and 77 moles of p-hydroxybenzoic acid units. Extrusion molding was performed to obtain a thermoplastic liquid crystal polymer film (film before heat resistance) having a thickness of 50 μm. Tm 0 of the thermoplastic liquid crystal polymer constituting the obtained thermoplastic liquid crystal polymer film (film before heat resistance) was 310°C. (2) Heat treatment was performed at 290°C for 1 hour on the thermoplastic liquid crystal polymer film (film before heat resistance) obtained above. The Tm of the obtained thermoplastic liquid crystal polymer film was 328°C. (3) Using the thermoplastic liquid crystal polymer film obtained in the above (2) to produce metal-clad laminates and multi-layer laminated substrates. The evaluation results of wide-angle X-ray diffraction, solder float, and laminar flow on the obtained thermoplastic liquid crystal polymer film and multilayer laminated substrate are shown in the table. In addition, FIG. 3 is a graph showing the wide-angle X-ray diffraction curve (data 3) of the heat-treated thermoplastic liquid crystal polymer film obtained in Example 1.

<實施例2> (1)將包含6-羥基-2-萘甲酸單元23莫耳份、對羥苯甲酸單元77莫耳份的莫耳比例之熱致液晶性聚酯進行聚合,由充氣模進行擠壓成形,獲得厚度50μm的熱塑性液晶聚合物薄膜(耐熱化前薄膜)。構成所得之熱塑性液晶聚合物薄膜(耐熱化前薄膜)之熱塑性液晶聚合物的Tm0 為310℃。 (2)針對由上述所得之熱塑性液晶聚合物薄膜(耐熱化前薄膜),以310℃進行熱處理1小時。所得之熱塑性液晶聚合物薄膜的Tm為337℃。 (3)使用由上述(2)所得之熱塑性液晶聚合物薄膜製作覆金屬積層板、多層積層基板。針對所得之熱塑性液晶聚合物薄膜與多層積層基板,進行關於廣角X射線繞射與浮焊、層流的評價之結果係如同表所示。<Example 2> (1) Polymerize thermotropic liquid crystalline polyester comprising 23 moles of 6-hydroxy-2-naphthoic acid units and 77 moles of p-hydroxybenzoic acid units, Extrusion molding was performed to obtain a thermoplastic liquid crystal polymer film (film before heat resistance) having a thickness of 50 μm. Tm 0 of the thermoplastic liquid crystal polymer constituting the obtained thermoplastic liquid crystal polymer film (film before heat resistance) was 310°C. (2) Heat treatment was performed at 310° C. for 1 hour with respect to the thermoplastic liquid crystal polymer film (film before heat resistance) obtained above. The Tm of the obtained thermoplastic liquid crystal polymer film was 337°C. (3) Using the thermoplastic liquid crystal polymer film obtained in the above (2) to produce metal-clad laminates and multi-layer laminated substrates. The evaluation results of wide-angle X-ray diffraction, solder float, and laminar flow on the obtained thermoplastic liquid crystal polymer film and multilayer laminated substrate are shown in the table.

<實施例3> (1)將包含6-羥基-2-萘甲酸單元20莫耳份、對羥苯甲酸單元80莫耳份、對苯二甲酸單元1莫耳份的莫耳比例之熱致液晶性聚酯進行聚合,由充氣模進行擠壓成形,獲得厚度50μm的熱塑性液晶聚合物薄膜(耐熱化前薄膜)。構成所得之熱塑性液晶聚合物薄膜(耐熱化前薄膜)之熱塑性液晶聚合物的Tm0 為320℃。 (2)針對由上述所得之熱塑性液晶聚合物薄膜(耐熱化前薄膜),以300℃施以熱處理1小時,製作薄膜。所得之熱塑性液晶聚合物薄膜的Tm為334℃。 (3)使用由上述(2)所得之熱塑性液晶聚合物薄膜製作覆金屬積層板、多層積層基板。針對所得之熱塑性液晶聚合物薄膜與多層積層基板,進行關於廣角X射線繞射與浮焊、層流的評價之結果係如同表所示。<Example 3> (1) The thermogenic ratio of 20 moles of 6-hydroxy-2-naphthoic acid units, 80 moles of p-hydroxybenzoic acid units, and 1 mole of terephthalic acid units The liquid crystalline polyester was polymerized and extruded by an inflatable mold to obtain a thermoplastic liquid crystal polymer film (film before heat resistance) with a thickness of 50 μm. Tm 0 of the thermoplastic liquid crystal polymer constituting the obtained thermoplastic liquid crystal polymer film (film before heat resistance) was 320°C. (2) The thermoplastic liquid crystal polymer film (film before heat resistance) obtained above was heat-treated at 300° C. for 1 hour to produce a film. The Tm of the obtained thermoplastic liquid crystal polymer film was 334°C. (3) Using the thermoplastic liquid crystal polymer film obtained in the above (2) to produce metal-clad laminates and multi-layer laminated substrates. The evaluation results of wide-angle X-ray diffraction, solder float, and laminar flow on the obtained thermoplastic liquid crystal polymer film and multilayer laminated substrate are shown in the table.

<實施例4> (1)將包含6-羥基-2-萘甲酸單元20莫耳份、對羥苯甲酸單元80莫耳份、對苯二甲酸1莫耳份的莫耳比例之熱致液晶性聚酯進行聚合,由充氣模進行擠壓,獲得厚度50μm的熱塑性液晶聚合物薄膜(耐熱化前薄膜)。構成所得之熱塑性液晶聚合物薄膜(耐熱化前薄膜)之熱塑性液晶聚合物的Tm0 為320℃。 (2)針對由上述所得之熱塑性液晶聚合物薄膜(耐熱化前薄膜),以320℃施以熱處理1小時,製作熱塑性液晶聚合物薄膜。所得之熱塑性液晶聚合物薄膜的Tm為360℃。 (3)使用由上述(2)所得之熱塑性液晶聚合物薄膜製作覆金屬積層板、多層積層基板。針對所得之熱塑性液晶聚合物薄膜與多層積層基板,進行關於廣角X射線繞射與浮焊、層流的評價之結果係如同表所示。<Example 4> (1) Thermotropic liquid crystals containing 20 moles of 6-hydroxy-2-naphthoic acid units, 80 moles of p-hydroxybenzoic acid units, and 1 mole of terephthalic acid Polymerized polyester, extruded by an inflatable die to obtain a thermoplastic liquid crystal polymer film (film before heat resistance) with a thickness of 50 μm. Tm 0 of the thermoplastic liquid crystal polymer constituting the obtained thermoplastic liquid crystal polymer film (film before heat resistance) was 320°C. (2) The thermoplastic liquid crystal polymer film (film before heat resistance) obtained above was heat-treated at 320° C. for 1 hour to produce a thermoplastic liquid crystal polymer film. The Tm of the obtained thermoplastic liquid crystal polymer film was 360°C. (3) Using the thermoplastic liquid crystal polymer film obtained in the above (2) to produce metal-clad laminates and multi-layer laminated substrates. The evaluation results of wide-angle X-ray diffraction, solder float, and laminar flow on the obtained thermoplastic liquid crystal polymer film and multilayer laminated substrate are shown in the table.

<比較例1> (1)將包含6-羥基-2-萘甲酸單元27莫耳份、對羥苯甲酸單元73莫耳份的莫耳比例之熱致液晶性聚酯進行聚合,由充氣模進行擠壓,獲得厚度50μm的熱塑性液晶聚合物薄膜。構成所得之熱塑性液晶聚合物薄膜之熱塑性液晶聚合物的Tm0 為280℃。 (2)使用由上述(1)所得之熱塑性液晶聚合物薄膜製作覆金屬積層板、多層積層基板。針對所得之熱塑性液晶聚合物薄膜與多層積層基板,進行關於廣角X射線繞射與浮焊、層流的評價之結果係如同表所示。<Comparative Example 1> (1) Polymerize thermotropic liquid crystalline polyester containing 27 moles of 6-hydroxy-2-naphthoic acid units and 73 moles of p-hydroxybenzoic acid units. Extrusion was performed to obtain a thermoplastic liquid crystal polymer film with a thickness of 50 μm. Tm 0 of the thermoplastic liquid crystal polymer constituting the obtained thermoplastic liquid crystal polymer film was 280°C. (2) Using the thermoplastic liquid crystal polymer film obtained in the above (1) to produce metal-clad laminates and multi-layer laminated substrates. The evaluation results of wide-angle X-ray diffraction, solder float, and laminar flow on the obtained thermoplastic liquid crystal polymer film and multilayer laminated substrate are shown in the table.

<比較例2> (1)將包含6-羥基-2-萘甲酸單元23莫耳份、對羥苯甲酸單元77莫耳份的莫耳比例之熱致液晶性聚酯進行聚合,由充氣模進行擠壓,獲得厚度50μm的熱塑性液晶聚合物薄膜。構成所得之熱塑性液晶聚合物薄膜之熱塑性液晶聚合物的Tm0 為310℃。 (2)使用由上述(1)所得之熱塑性液晶聚合物薄膜製作覆金屬積層板、多層積層基板。針對所得之熱塑性液晶聚合物薄膜與多層積層基板,進行關於廣角X射線繞射與浮焊、層流的評價之結果係如同表所示。<Comparative Example 2> (1) Polymerize thermotropic liquid crystalline polyester containing 23 moles of 6-hydroxy-2-naphthoic acid units and 77 moles of p-hydroxybenzoic acid units. Extrusion was performed to obtain a thermoplastic liquid crystal polymer film with a thickness of 50 μm. Tm 0 of the thermoplastic liquid crystal polymer constituting the obtained thermoplastic liquid crystal polymer film was 310°C. (2) Using the thermoplastic liquid crystal polymer film obtained in the above (1) to produce metal-clad laminates and multi-layer laminated substrates. The evaluation results of wide-angle X-ray diffraction, solder float, and laminar flow on the obtained thermoplastic liquid crystal polymer film and multilayer laminated substrate are shown in the table.

<比較例3> (1)將包含6-羥基-2-萘甲酸單元20莫耳份、對羥苯甲酸單元80莫耳份、對苯二甲酸1莫耳份的莫耳比例之熱致液晶性聚酯進行聚合,由充氣模進行擠壓,獲得厚度50μm的熱塑性液晶聚合物薄膜。構成所得之熱塑性液晶聚合物薄膜之熱塑性液晶聚合物的Tm0 為320℃。 (2)使用由上述(1)所得之熱塑性液晶聚合物薄膜製作覆金屬積層板、多層積層基板。針對所得之熱塑性液晶聚合物薄膜與多層積層基板,進行關於廣角X射線繞射與浮焊、層流的評價之結果係如同表所示。<Comparative Example 3> (1) Thermotropic liquid crystals containing 20 moles of 6-hydroxy-2-naphthoic acid units, 80 moles of p-hydroxybenzoic acid units, and 1 mole of terephthalic acid Polymerize the permanent polyester and extrude through an inflatable mold to obtain a thermoplastic liquid crystal polymer film with a thickness of 50 μm. Tm 0 of the thermoplastic liquid crystal polymer constituting the obtained thermoplastic liquid crystal polymer film was 320°C. (2) Using the thermoplastic liquid crystal polymer film obtained in the above (1) to produce metal-clad laminates and multi-layer laminated substrates. The evaluation results of wide-angle X-ray diffraction, solder float, and laminar flow on the obtained thermoplastic liquid crystal polymer film and multilayer laminated substrate are shown in the table.

<比較例4> (1)將比較例1的材料以260℃進行熱處理1小時。所得之熱塑性液晶聚合物薄膜的Tm為290℃。 (2)使用由上述(1)所得之熱塑性液晶聚合物薄膜製作覆金屬積層板、多層積層基板。針對所得之熱塑性液晶聚合物薄膜與多層積層基板,進行關於廣角X射線繞射與浮焊、層流的評價之結果係如同表所示。<Comparative example 4> (1) The material of Comparative Example 1 was heat-treated at 260° C. for 1 hour. The Tm of the obtained thermoplastic liquid crystal polymer film was 290°C. (2) Using the thermoplastic liquid crystal polymer film obtained in the above (1) to produce metal-clad laminates and multi-layer laminated substrates. The evaluation results of wide-angle X-ray diffraction, solder float, and laminar flow on the obtained thermoplastic liquid crystal polymer film and multilayer laminated substrate are shown in the table.

<比較例5> (1)將比較例1的材料以280℃進行熱處理1小時。所得之熱塑性液晶聚合物薄膜的Tm為303℃。 (2)使用由上述(1)所得之熱塑性液晶聚合物薄膜製作覆金屬積層板、多層積層基板。針對所得之熱塑性液晶聚合物薄膜與多層積層基板,進行關於廣角X射線繞射與浮焊、層流的評價之結果係如同表所示。<Comparative example 5> (1) The material of Comparative Example 1 was heat-treated at 280° C. for 1 hour. The Tm of the obtained thermoplastic liquid crystal polymer film was 303°C. (2) Using the thermoplastic liquid crystal polymer film obtained in the above (1) to produce metal-clad laminates and multi-layer laminated substrates. The evaluation results of wide-angle X-ray diffraction, solder float, and laminar flow on the obtained thermoplastic liquid crystal polymer film and multilayer laminated substrate are shown in the table.

<比較例6> (1)將比較例1的材料以260℃進行熱處理1小時後,再以280℃進行熱處理6小時。所得之熱塑性液晶聚合物薄膜的Tm為335℃。 (2)使用由上述(1)所得之熱塑性液晶聚合物薄膜製作覆金屬積層板、多層積層基板。針對所得之熱塑性液晶聚合物薄膜與多層積層基板,進行關於廣角X射線繞射與浮焊、層流的評價之結果係如同表所示。<Comparative example 6> (1) The material of Comparative Example 1 was heat-treated at 260°C for 1 hour, and then heat-treated at 280°C for 6 hours. The Tm of the obtained thermoplastic liquid crystal polymer film was 335°C. (2) Using the thermoplastic liquid crystal polymer film obtained in the above (1) to produce metal-clad laminates and multi-layer laminated substrates. The evaluation results of wide-angle X-ray diffraction, solder float, and laminar flow on the obtained thermoplastic liquid crystal polymer film and multilayer laminated substrate are shown in the table.

[表7]   熱處理條件 Tm0 (℃) Rtm (℃/min) UC SC Tm (℃) Tm / SC 生產性 耐熱性 浮焊 層流操作範圍 實施例1 290℃ 1小時 310 0.28 1.30 1.50 328 219 A A A 實施例2 310℃ 1小時 310 0.28 1.45 1.50 337 225 A A A 實施例3 300℃ 1小時 320 0.45 1.18 1.80 334 186 A A A 實施例4 320℃ 1小時 320 0.45 1.20 1.80 360 200 A A A 比較例1 - 280 0.17 -0.65 1.55 - - - B B 比較例2 - 310 0.28 -0.45 1.75 - - - A B 比較例3 - 320 0.45 -0.12 1.90 - - - A B 比較例4 260℃ 1小時 280 0.17 -0.55 1.60 290 181 B B B 比較例5 280℃ 1小時 280 0.17 -0.50 1.65 303 184 B B B 比較例6 260℃ 1小時 290℃ 6小時 280 0.17 -0.20 1.85 335 181 B A A [Table 7] heat treatment conditions Tm 0 (°C) Rtm (℃/min) UC SC Tm (℃) Tm/SC productivity heat resistance Float Laminar operating range Example 1 290°C for 1 hour 310 0.28 1.30 1.50 328 219 A A A Example 2 310°C for 1 hour 310 0.28 1.45 1.50 337 225 A A A Example 3 300℃ for 1 hour 320 0.45 1.18 1.80 334 186 A A A Example 4 320°C for 1 hour 320 0.45 1.20 1.80 360 200 A A A Comparative example 1 - 280 0.17 -0.65 1.55 - - - B B Comparative example 2 - 310 0.28 -0.45 1.75 - - - A B Comparative example 3 - 320 0.45 -0.12 1.90 - - - A B Comparative example 4 260°C 1 hour 280 0.17 -0.55 1.60 290 181 B B B Comparative Example 5 280℃ for 1 hour 280 0.17 -0.50 1.65 303 184 B B B Comparative example 6 260℃ for 1 hour 290℃ for 6 hours 280 0.17 -0.20 1.85 335 181 B A A

由表7可知,在比較例1中,因UC不存在於特定範圍,故薄膜中的結晶不具有均勻性高的斜方晶結晶結構,且因耐熱性不良,故無法滿足浮焊及層流雙方。在比較例4及5中,雖藉由以比較例1的熱塑性液晶聚合物薄膜的(Tm0 -20)℃或Tm0 ℃加熱1小時而進行耐熱化,但UC皆非特定的範圍,無法滿足耐熱化的基準之浮焊及層流雙方。又,在比較例6中,因藉由歷經7小時加熱比較例1的熱塑性液晶聚合物薄膜而進行耐熱化,故就生產性的點而言係不充分。又,即使是經耐熱化之情形,在比較例6中亦因薄膜中的結晶的斜方晶結晶結構不均勻,故UC不存在於特定範圍。It can be seen from Table 7 that in Comparative Example 1, because UC does not exist in a specific range, the crystals in the film do not have a highly uniform orthorhombic crystal structure, and due to poor heat resistance, it cannot meet the requirements of float soldering and laminar flow. both sides. In Comparative Examples 4 and 5, heat resistance was achieved by heating the thermoplastic liquid crystal polymer film of Comparative Example 1 at (Tm 0 -20)°C or Tm 0 °C for 1 hour, but UC was not in a specific range and could not be obtained. Satisfies both float soldering and laminar flow which meet the standard of heat resistance. In addition, in Comparative Example 6, heat resistance was achieved by heating the thermoplastic liquid crystal polymer film of Comparative Example 1 over 7 hours, so it was insufficient in terms of productivity. Also, even in the case of heat resistance, in Comparative Example 6, the orthorhombic crystal structure of crystals in the thin film was not uniform, so UC did not exist in a specific range.

又,在比較例2及3中,因UC不存在於特定範圍,薄膜中的結晶不具有均勻性高的斜方晶結晶結構,故無法滿足層流。In addition, in Comparative Examples 2 and 3, since UC did not exist in a specific range, the crystals in the thin film did not have a highly uniform orthorhombic crystal structure, so laminar flow could not be satisfied.

相對於此,在實施例1~4中,因UC存在於特定範圍,故薄膜所含之斜方晶的結晶結構的均勻性高,滿足生產性與耐熱性的任一者。在此等熱塑性液晶聚合物薄膜中,雖皆係將Rtm為特定範圍的薄膜在1小時這樣的短時間進行熱處理之熱塑性液晶聚合物薄膜,但可達成充分的耐熱性。On the other hand, in Examples 1 to 4, since UC exists in a specific range, the uniformity of the orthorhombic crystal structure contained in the thin film is high, and any of productivity and heat resistance is satisfied. Among these thermoplastic liquid crystal polymer films, a film having an Rtm in a specific range is heat-treated in a short time of 1 hour, but sufficient heat resistance can be achieved.

因此,相對於以上的比較例,如同實施例1~4,斜方晶的均勻性高之熱塑性液晶聚合物薄膜係滿足生產性與耐熱性之任一者。若使用具有此種熱塑性液晶聚合物薄膜之覆金屬積層板,則在積層及電路加工雙方中具有寬廣的操作範圍,因此能不使用特殊的設備、夾具地以低成本製造積層體。 [產業上利用之可能性]Therefore, compared to the above comparative examples, like Examples 1 to 4, the thermoplastic liquid crystal polymer film with high uniformity of orthorhombic crystals satisfies either of productivity and heat resistance. Using a metal-clad laminate having such a thermoplastic liquid crystal polymer film has a wide range of operations in both lamination and circuit processing, and thus a laminate can be manufactured at low cost without using special equipment or jigs. [Possibility of industrial use]

本發明的熱塑性液晶聚合物薄膜及積層板適合作為各種成形體(例如,電路板)的材料,尤其適合作為多層積層電路材料等,例如,作為在電子/電氣/通訊工業領域中之印刷電路板,在高頻率用電路基板、車載用感測器、行動用電路基板、天線等用途中是有用的。The thermoplastic liquid crystal polymer film and laminate of the present invention are suitable as materials for various moldings (for example, circuit boards), especially as multilayer laminated circuit materials, etc., for example, as printed circuit boards in the fields of electronics/electricity/communication industries , It is useful in applications such as high-frequency circuit boards, automotive sensors, mobile circuit boards, and antennas.

如以上所述,雖說明本發明的適合的實施形態,但在不脫離本發明要旨的範圍內,各種的追加、變更或刪除是可能的,該者亦被包含在本發明的範圍內。As described above, although preferred embodiments of the present invention have been described, various additions, changes, and deletions are possible without departing from the gist of the present invention, and these are also included in the scope of the present invention.

1:熱塑性液晶聚合物薄膜 2:金屬層(銅箔) 3:覆金屬積層板 4:SUS板 5:緩衝材1: Thermoplastic liquid crystal polymer film 2: Metal layer (copper foil) 3: Metal-clad laminate 4: SUS board 5: buffer material

圖1係本發明的一態樣中之覆金屬積層板的剖面圖。 圖2係本發明的一態樣中之多層積層基板製作時的組件的剖面圖。 圖3係揭示由本發明的實施例1所得之熱處理後的薄膜之廣角X射線繞射量變曲線(數據3)的圖表。Fig. 1 is a sectional view of a metal-clad laminate in one aspect of the present invention. Fig. 2 is a cross-sectional view of an assembly during fabrication of a multi-layer laminate substrate in one aspect of the present invention. Fig. 3 is a graph showing the wide-angle X-ray diffraction curve (data 3) of the heat-treated film obtained in Example 1 of the present invention.

Claims (18)

一種熱塑性液晶聚合物薄膜,其係由能形成光學性各向異性的熔融相之聚合物(以下,稱為熱塑性液晶聚合物)所構成,在該聚合物部分中,在由廣角X射線繞射測定所偵測的繞射量變曲線中,在將2θ=14~26度之基線上的積分強度設為A、將在2θ=22.3~24.3度中將主峰的量變曲線近似線性函數並去除後的次峰的量變曲線的積分強度設為B、並設為B/A×100=UC時,滿足下述式(1),0≦UC≦2.0 (1)。 A thermoplastic liquid crystal polymer film, which is composed of a polymer capable of forming an optically anisotropic molten phase (hereinafter referred to as a thermoplastic liquid crystal polymer), and in the polymer part, a wide-angle X-ray diffracted In the detected diffraction curve, the integrated intensity on the baseline of 2θ=14~26 degrees is set to A, and the quantitative curve of the main peak in 2θ=22.3~24.3 degrees is approximated to a linear function and removed. When the integrated intensity of the quantitative curve of the secondary peak is B and B/A×100=UC, the following formula (1) is satisfied, and 0≦UC≦2.0 (1). 如請求項1之熱塑性液晶聚合物薄膜,其滿足下述式(2),0.1≦UC≦1.5 (2)。 The thermoplastic liquid crystal polymer film according to claim 1, which satisfies the following formula (2): 0.1≦UC≦1.5 (2). 如請求項1或2之熱塑性液晶聚合物薄膜,其中,在將於2θ=20±1度存在最大值的該主峰的半高寬(full width at half maximum)設為SC(度)時,滿足1.4≦SC。 Such as the thermoplastic liquid crystal polymer film of claim 1 or 2, wherein when the full width at half maximum (full width at half maximum) of the main peak with a maximum value at 2θ=20±1 degrees is set to SC (degrees), it satisfies 1.4≦SC. 如請求項1或2之熱塑性液晶聚合物薄膜,其中,使用示差掃描熱析儀,在從室溫起至400℃的溫度範圍中以10℃/min的升溫速度出現的吸熱峰位置為310℃以上。 The thermoplastic liquid crystal polymer film according to claim 1 or 2, wherein the position of the endothermic peak occurring at a temperature increase rate of 10°C/min in the temperature range from room temperature to 400°C is 310°C using a differential scanning thermal analyzer above. 一種積層體,其具備至少一層如請求項1至4中任一項之熱塑性液晶聚合物薄膜。 A laminate comprising at least one layer of the thermoplastic liquid crystal polymer film according to any one of claims 1 to 4. 如請求項5之積層體,其更具備至少一層金屬層。 As in the laminated body of claim 5, it further has at least one metal layer. 如請求項6之積層體,其中,該金屬層係由選自銅、銅合金、鋁、鋁合金、鎳、鎳合金、鐵、鐵合金、銀、銀合金、及此等的複合金屬種類的至少一種所構成。 The laminated body of claim 6, wherein the metal layer is made of at least a kind of composition. 一種成形體,其係由如請求項1至4中任一項之熱塑性液晶聚合物薄膜或如請求項5至7中任一項之積層體所形成。 A molded article formed from the thermoplastic liquid crystal polymer film according to any one of claims 1 to 4 or the laminate according to any one of claims 5 to 7. 如請求項8之成形體,其為電路板。 The molded body according to claim 8, which is a circuit board. 如請求項8或9之成形體,其為高頻率用電路基板、車載用感測器、行動用電路基板、或天線。 The molded body according to claim 8 or 9, which is a high-frequency circuit board, a vehicle sensor, a mobile circuit board, or an antenna. 一種如請求項1至4中任一項之熱塑性液晶聚合物薄膜的製造方法,其中,對於由熔點上升速度Rtm為0.20℃/min以上的熱塑性液晶聚合物所構成之熱塑性液晶聚合物薄膜,進行熱處理而耐熱化。 A method for producing a thermoplastic liquid crystal polymer film according to any one of claims 1 to 4, wherein, for a thermoplastic liquid crystal polymer film composed of a thermoplastic liquid crystal polymer whose melting point rise rate Rtm is 0.20°C/min or higher, Heat treatment and heat resistance. 如請求項11之熱塑性液晶聚合物薄膜的製造方法,其中,該熱處理為一階段或複數階段的熱處理,在將該熱塑性液晶聚合物的熔點設為Tm0之情形,在Tm0℃以下進行第一熱處理而耐熱化。 The method for producing a thermoplastic liquid crystal polymer film as claimed in claim 11, wherein the heat treatment is a one-stage or multiple-stage heat treatment, and when the melting point of the thermoplastic liquid crystal polymer is set as Tm 0 , the second step is performed at Tm 0 °C or lower. Heat treatment and heat resistance. 如請求項11或12之熱塑性液晶聚合物薄膜的製造方法,其中,作為熱源,使用選自熱風烘箱、蒸氣烘箱、電熱器、紅外線加熱器、陶瓷加熱器、熱輥、熱壓、及電磁波照射機的至少一種。 The manufacturing method of the thermoplastic liquid crystal polymer film as claimed in item 11 or 12, wherein, as the heat source, use is selected from hot air oven, steam oven, electric heater, infrared heater, ceramic heater, hot roller, hot press, and electromagnetic wave irradiation at least one type of machine. 如請求項11或12之熱塑性液晶聚合物薄膜的製造方法,其中,該熱處理為一階段。 The method for manufacturing a thermoplastic liquid crystal polymer film according to claim 11 or 12, wherein the heat treatment is one stage. 一種如請求項5至7中任一項之積層體的製造方法,其中,對於具備由熱塑性液晶聚合物所構成之聚合物層的積層體,亦即該聚合物層係由熔點上升速度Rtm為0.20℃/min以上的熱塑性液晶聚合物所構成之積層體,進行熱處理而耐熱化。 A method for producing a laminate according to any one of Claims 5 to 7, wherein, for a laminate having a polymer layer made of a thermoplastic liquid crystal polymer, that is, the polymer layer has a melting point rise rate Rtm of The laminated body composed of thermoplastic liquid crystal polymer at 0.20°C/min or above is heat-treated to be heat-resistant. 如請求項15之積層體的製造方法,其中,該熱處理為一階段或複數階段的熱處理,在將該熱塑性液晶聚合物的熔點設為Tm0之情形,在Tm0℃以下進行第一熱處理而耐熱化。 The method for producing a laminate according to Claim 15, wherein the heat treatment is one-stage or multiple-stage heat treatment, and when the melting point of the thermoplastic liquid crystal polymer is set to Tm 0 , the first heat treatment is performed at Tm 0 ° C. or lower. heat resistance. 如請求項15或16之積層體的製造方法,其中,作為熱源,使用選自熱風烘箱、蒸氣烘箱、電熱器、紅外線加熱器、陶瓷加熱器、熱輥、熱壓、及電磁波照射機的至少一種。 The method for producing a laminate according to Claim 15 or 16, wherein, as a heat source, at least A sort of. 一種製造成形體之方法,其係藉由對於如請求項1至4中任一項之熱塑性液晶聚合物薄膜、及/或如請求項5至7中任一項之積層體進行後加工。 A method of manufacturing a molded body by post-processing the thermoplastic liquid crystal polymer film according to any one of claims 1 to 4, and/or the laminate according to any one of claims 5 to 7.
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