TWI790554B - Supercapacitor carrier and server - Google Patents
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- TWI790554B TWI790554B TW110106868A TW110106868A TWI790554B TW I790554 B TWI790554 B TW I790554B TW 110106868 A TW110106868 A TW 110106868A TW 110106868 A TW110106868 A TW 110106868A TW I790554 B TWI790554 B TW I790554B
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/13—Energy storage using capacitors
Abstract
Description
本發明係關於一種超級電容器載體及伺服器,特別是一種適用於伺服器的超級電容器載體。The invention relates to a supercapacitor carrier and a server, in particular to a supercapacitor carrier suitable for a server.
伺服器作為提供給多個用戶使用的電子裝置,需要多個硬碟以儲存大量的資料,而這些硬碟大多需要超級電容器來保護所存儲的資料免受斷電等突發狀況而造成資料遺失。As an electronic device used by multiple users, a server requires multiple hard drives to store a large amount of data, and most of these hard drives need supercapacitors to protect the stored data from data loss caused by unexpected situations such as power outages .
然而,目前未有針對超級電容器的安裝規範,導致在不同機種的伺服器內需要額外找尋超級電容器的容置空間,還需要針對不同機種的伺服器來個別設計超級電容器載體,而不利於超級電容器載體的通用性。However, there is currently no installation specification for supercapacitors, resulting in the need to find additional space for supercapacitors in different types of servers, and it is also necessary to individually design supercapacitor carriers for different types of servers, which is not conducive to supercapacitors. Carrier versatility.
本發明在於提供一種超級電容器載體及伺服器,藉以解決先前技術中不易容置超級電容器的問題。The present invention provides a supercapacitor carrier and a server, so as to solve the problem in the prior art that it is difficult to accommodate supercapacitors.
本發明之一實施例所揭露之超級電容器載體,用以容置一超級電容器並用以安裝於一介面卡插槽。超級電容器載體包含一支撐件、一固定件以及一擋板。支撐件包含一承載板以及一插入部。承載板連接插入部。插入部用以插入介面卡插槽。固定件包含一主體板以及一第一側板。主體板與承載板彼此分離並於其間形成一容置空間。容置空間用以容置超級電容器。第一側板連接主體板,且第一側板設置於承載板上。擋板設置於承載板,且擋板與插入部位於承載板的相異側。A supercapacitor carrier disclosed in an embodiment of the present invention is used to accommodate a supercapacitor and to be installed in an interface card slot. The supercapacitor carrier includes a supporting piece, a fixing piece and a baffle. The supporting part includes a bearing plate and an inserting part. The carrier board is connected to the insertion part. The insertion part is used for inserting into the interface card slot. The fixing part includes a main board and a first side board. The main board and the bearing board are separated from each other and form an accommodating space therebetween. The accommodating space is used for accommodating the supercapacitor. The first side plate is connected to the main body plate, and the first side plate is arranged on the bearing plate. The baffle is arranged on the bearing plate, and the baffle and the insertion part are located on different sides of the bearing plate.
本發明之另一實施例所揭露之伺服器,包含一機殼本體、一電路板、一超級電容器載體以及一超級電容器。電路板設置於機殼本體,且電路板具有一介面卡插槽。超級電容器載體包含一支撐件、一固定件以及一擋板。支撐件包含一承載板以及一插入部。承載板連接插入部。插入部插入介面卡插槽。固定件包含一主體板以及一第一側板。主體板與承載板彼此分離並於其間形成一容置空間。第一側板連接主體板,且第一側板設置於承載板上。擋板設置於承載板與機殼本體,且擋板與插入部位於承載板的相異側。超級電容器設置於容置空間內。The server disclosed in another embodiment of the present invention includes a casing body, a circuit board, a supercapacitor carrier and a supercapacitor. The circuit board is arranged on the casing body, and the circuit board has an interface card slot. The supercapacitor carrier includes a supporting piece, a fixing piece and a baffle. The supporting part includes a bearing plate and an inserting part. The carrier board is connected to the insertion part. The insertion part is inserted into the interface card slot. The fixing part includes a main board and a first side board. The main board and the bearing board are separated from each other and form an accommodating space therebetween. The first side plate is connected to the main body plate, and the first side plate is arranged on the bearing plate. The baffle is disposed on the bearing plate and the casing body, and the baffle and the insertion portion are located on different sides of the bearing plate. The supercapacitor is arranged in the accommodating space.
根據上述實施例所揭露的超級電容器載體及伺服器,容置空間可用來容置超級電容器,並且超級電容器載體可用來安裝於伺服器內閒置未使用的介面卡插槽上。超級電容器透過超級電容器載體安裝在伺服器的閒置空間內,藉以能省去額外配置超級電容器的空間。並且,超級電容器載體適用於使用相同介面卡插槽規格的伺服器,增加了超級電容器載體的通用性。According to the supercapacitor carrier and the server disclosed in the above embodiments, the accommodating space can be used for accommodating the supercapacitor, and the supercapacitor carrier can be used to be installed on the idle and unused interface card slot in the server. The supercapacitor is installed in the idle space of the server through the supercapacitor carrier, so as to save the space for additionally disposing the supercapacitor. Moreover, the supercapacitor carrier is suitable for servers using the same interface card slot specification, which increases the versatility of the supercapacitor carrier.
以上關於本發明內容的說明及以下實施方式的說明係用以示範與解釋本發明的原理,並且提供本發明的專利申請範圍更進一步的解釋。The above description of the content of the present invention and the following description of the implementation are used to demonstrate and explain the principle of the present invention, and provide further explanation of the patent application scope of the present invention.
以下將說明有關本發明之一實施例,請參照圖1至圖3,其中圖1係為根據本發明之一實施例所繪示之伺服器1的立體示意圖,圖2係為圖1之伺服器1之超級電容器載體100與超級電容器13的立體示意圖,且圖3係為圖2之超級電容器載體100與超級電容器13的分解示意圖。An embodiment of the present invention will be described below. Please refer to FIGS. 1 to 3, wherein FIG. 3 is an exploded schematic view of the
在本實施例中,伺服器1包含一機殼本體11、一電路板12、一超級電容器載體100以及一超級電容器(supercapacitor) 13。電路板12設置於機殼本體11,且電路板12具有一介面卡插槽1201。介面卡插槽1201例如為符合高速串列電腦擴展匯流排標準(PCI-e)的母連接器。超級電容器載體100安裝於電路板12的介面卡插槽1201。超級電容器13亦可稱為雙電層電容器或電雙層電容器(electrostatic double-layer capacitor),超級電容器13使用靜電雙層電容(electrostatic double-layer capacitance)與電化擬電容(electrochemical pseudocapacitance),係為擁有高能量密度的電化學電容器,比傳統的電解電容器多上十倍至千倍的容量。超級電容器13容置於超級電容器載體100。In this embodiment, the
詳細來說,超級電容器載體100包含一支撐件110、一固定件120以及一擋板130。支撐件110包含一承載板111以及一插入部112。承載板111連接插入部112,且承載板111具有相對的一第一面1111以及一第二面1112。插入部112例如為與符合高速串列電腦擴展匯流排標準(PCI-e)的公連接器具有相同外型的板件,且插入部112插入介面卡插槽1201。在本實施例以及本發明的部分實施例中,由於超級電容器13可透過額外的電路(未另標號),而可不透過插入部112與介面卡插槽1201來與電路板12電性連接,因此插入部112可不具有電性端子且可不與介面卡插槽1201電性連接,插入部112僅作為物理固定功能使用。然本發明不以此為限。在部分實施例中,超級電容器亦可透過插入部與介面卡插槽來與電路板電性連接。In detail, the
在本實施例中,固定件120包含一主體板121以及二第一側板122。主體板121與承載板111彼此分離並於其間形成一容置空間S。容置空間S容置超級電容器13。第一側板122連接主體板121的相對兩側。第一側板122例如透過螺絲鎖附的方式設置於承載板111上。In this embodiment, the
如圖3所示,在本實施例以及本發明的部分實施例中,第一側板122包含一第一側擋部1221以及一第一結合部1222。第一側擋部1221連接於主體板121與第一結合部1222之間。第一結合部1222貼合並例如透過螺絲鎖附的方式固定於承載板111的第一面1111。As shown in FIG. 3 , in this embodiment and some embodiments of the present invention, the
在本實施例以及本發明的部分實施例中,固定件120更可包含二第二側板123。第二側板123連接主體板121的相對兩側,且第二側板123位於第一側板122之間;或者如圖3所示,第一側板122與第二側板123交替地位於主體板121的相異側。第二側板123朝向承載板111延伸,且第二側板123呈凸向容置空間S的彎曲狀。In this embodiment and some embodiments of the present invention, the
在本實施例中,擋板130設置於承載板111。在本實施例以及本發明的部分實施例中,擋板130包含一第二側擋部131以及一第二結合部132。第二側擋部131位於承載板111之一側。第二側擋部131例如透過螺絲鎖附的方式設置於機殼本體11,以避免外界灰塵進入機殼本體11。第二結合部132連接第二側擋部131,且第二結合部132貼合並例如透過螺絲鎖附的方式固定於承載板111的第二面1112。在本實施例中,擋板130與插入部112位於承載板111的相異側,以避免干涉插入部112插入介面卡插槽1201。In this embodiment, the
在本實施例中,超級電容器載體100的容置空間S可用來容置超級電容器13,並且超級電容器載體100可用來安裝於伺服器1內閒置未使用的介面卡插槽1201上。超級電容器13透過超級電容器載體100安裝在伺服器1的閒置空間內,藉以能省去額外配置超級電容器13的空間。並且,超級電容器載體100適用於使用相同介面卡插槽1201規格的伺服器1,增加了超級電容器載體100的通用性。再者,第一側板122能避免超級電容器13從容置空間S的側向滑出,藉以將超級電容器13固定在超級電容器載體100。In this embodiment, the accommodating space S of the
在本實施例以及本發明的部分實施例中,第一側板122與第二側板123位於主體板121的四側,能避免超級電容器13從容置空間S的四周滑出,藉以進一步地將超級電容器13固定在超級電容器載體100。並且,第二側板123呈凸向容置空間S的彎曲狀,而可向容置空間S的內部方向抵頂超級電容器13,以避免些許的機械公差所造成超級電容器13在容置空間S內的滑動。In this embodiment and some embodiments of the present invention, the
在本實施例以及本發明的部分實施例中,固定件120更可包含一彈性部124。彈性部124具有彈性,且彈性部124連接主體板121。彈性部124朝向承載板111延伸,將超級電容器13往承載板111的方向抵頂,以更進一步地將超級電容器13固定於容置空間S內。In this embodiment and some embodiments of the present invention, the fixing
在本實施例以及本發明的部分實施例中,固定件120的主體板121可具有一鏤空部1211。鏤空部1211連通容置空間S,以將容置於容置空間S內的超級電容器13的一側暴露於外,而達到透氣散熱的效果。In this embodiment and some embodiments of the present invention, the
根據上述實施例之超級電容器載體及伺服器,容置空間可用來容置超級電容器,並且超級電容器載體可用來安裝於伺服器內閒置未使用的介面卡插槽上。超級電容器透過超級電容器載體安裝在伺服器的閒置空間內,藉以能省去額外配置超級電容器的空間。並且,超級電容器載體適用於使用相同介面卡插槽規格的伺服器,增加了超級電容器載體的通用性。再者,第一側板能避免超級電容器從容置空間的側向滑出,藉以將超級電容器固定在超級電容器載體。According to the supercapacitor carrier and the server of the above embodiments, the accommodating space can be used for accommodating the supercapacitor, and the supercapacitor carrier can be used to be installed on the idle and unused interface card slot in the server. The supercapacitor is installed in the idle space of the server through the supercapacitor carrier, so as to save the space for additionally disposing the supercapacitor. Moreover, the supercapacitor carrier is suitable for servers using the same interface card slot specification, which increases the versatility of the supercapacitor carrier. Furthermore, the first side plate can prevent the supercapacitor from sliding out laterally from the accommodating space, so as to fix the supercapacitor on the supercapacitor carrier.
在部分實施例中,第一側板與第二側板位於主體板的四側,能避免超級電容器從容置空間的四周滑出,藉以進一步地將超級電容器固定在超級電容器載體。並且,第二側板呈凸向容置空間的彎曲狀,而可向容置空間的內部方向抵頂超級電容器,以避免些許的機械公差所造成超級電容器在容置空間內的滑動。In some embodiments, the first side plate and the second side plate are located on four sides of the main body plate, which can prevent the supercapacitor from sliding out from around the accommodating space, thereby further fixing the supercapacitor on the supercapacitor carrier. Moreover, the second side plate is in a curved shape protruding toward the accommodating space, and can abut against the supercapacitor toward the interior of the accommodating space, so as to avoid sliding of the supercapacitor in the accommodating space caused by some mechanical tolerances.
雖然本發明以前述之諸項實施例揭露如上,然其並非用以限定本發明,任何熟習相像技藝者,在不脫離本發明之精神和範圍內,當可作些許之更動與潤飾,因此本發明之專利保護範圍須視本說明書所附之申請專利範圍所界定者為準。Although the present invention is disclosed above with the foregoing embodiments, it is not intended to limit the present invention. Any person familiar with similar skills may make some changes and modifications without departing from the spirit and scope of the present invention. Therefore, this The scope of patent protection for inventions shall be defined in the scope of patent application attached to this specification.
1:伺服器 11:機殼本體 12:電路板 1201:介面卡插槽 13:超級電容器 100:超級電容器載體 110:支撐件 111:承載板 1111:第一面 1112:第二面 112:插入部 120:固定件 121:主體板 1211:鏤空部 122:第一側板 1221:第一側擋部 1222:第一結合部 123:第二側板 124:彈性部 130:擋板 131:第二側擋部 132:第二結合部 S:容置空間 1: Server 11: Case body 12: Circuit board 1201: interface card slot 13: Supercapacitor 100: supercapacitor carrier 110: support piece 111: Loading board 1111: the first side 1112: the second side 112: Insertion part 120:Fixer 121: Main board 1211: hollow out part 122: The first side panel 1221: first side stop 1222: the first junction 123: Second side panel 124: elastic part 130: Baffle 131: second side stop 132: the second junction S: storage space
圖1係為根據本發明之一實施例所繪示之伺服器的立體示意圖。 圖2係為圖1之伺服器之超級電容器載體與超級電容器的立體示意圖。 圖3係為圖2之超級電容器載體與超級電容器的分解示意圖。 FIG. 1 is a schematic perspective view of a server according to an embodiment of the present invention. FIG. 2 is a three-dimensional schematic diagram of the supercapacitor carrier and the supercapacitor of the server in FIG. 1 . FIG. 3 is an exploded schematic view of the supercapacitor carrier and the supercapacitor in FIG. 2 .
13:超級電容器 13: Supercapacitor
100:超級電容器載體 100: supercapacitor carrier
110:支撐件 110: support piece
111:承載板 111: Loading board
1111:第一面 1111: the first side
1112:第二面 1112: the second side
112:插入部 112: Insertion part
120:固定件 120:Fixer
121:主體板 121: Main board
122:第一側板 122: The first side panel
123:第二側板 123: Second side panel
124:彈性部 124: elastic part
130:擋板 130: Baffle
131:第二側擋部 131: second side stop
132:第二結合部 132: the second junction
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TWI522029B (en) * | 2013-08-22 | 2016-02-11 | 英業達股份有限公司 | Server |
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TW200829110A (en) * | 2006-12-20 | 2008-07-01 | Compal Electronics Inc | Partial temperature control fixture applied to reflow process for circuit board |
US8339794B2 (en) * | 2009-03-10 | 2012-12-25 | Samsung Electronics Co., Ltd. | Super capacitor casing and supercapacitor embedded device |
CN103200799A (en) * | 2012-01-10 | 2013-07-10 | Hzo股份有限公司 | Electronic device with internal moisture-resistant coating |
TWI522029B (en) * | 2013-08-22 | 2016-02-11 | 英業達股份有限公司 | Server |
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