CN218772734U

CN218772734U - Case, cabinet and electronic equipment

Info

Publication number: CN218772734U
Application number: CN202222516383.0U
Authority: CN
Inventors: 刘志恒
Original assignee: Huawei Technologies Co Ltd
Current assignee: Huawei Technologies Co Ltd
Priority date: 2022-09-22
Filing date: 2022-09-22
Publication date: 2023-03-28
Anticipated expiration: 2032-09-22

Abstract

The application provides a machine case, a machine cabinet and electronic equipment. The case of the present application is provided with a concave-convex structure on two wall portions which are opposite to each other in the height direction. In this way, when the housing houses different electronic components arranged in a staggered manner in the height direction, or houses the same electronic component with different parts staggered in the height direction, the dead space in the internal space of the housing, which is not used for housing the electronic components, can be reduced, and the space utilization of the housing can be improved. The cabinet of the present application includes a plurality of the above-mentioned cabinets. The electronic equipment of the present application includes an electronic device including, but not limited to, a server, and at least one of the above-described enclosures.

Description

Case, cabinet and electronic equipment

Technical Field

The present application relates to a support structure for electronic equipment, and in particular, to a chassis, a cabinet including the chassis, and electronic equipment.

Background

In a server, such as a network server, a chassis and a circuit board assembly are included. The circuit board assembly includes a processor chip (such as a central processing unit chip and an image processor chip), a power supply chip, a memory device, and the like, which are disposed on the circuit board. In the server, the circuit board assembly is housed by the chassis so that the circuit board assembly is stably mounted in the chassis.

As the power consumption of the processor chip of the circuit board assembly of the server is higher and higher, the power consumption generated by the routing (e.g., copper foil) inside the circuit board is very large in the process of supplying power to the processor chip by the power supply chip. In order to reduce the power loss caused by the wiring inside the circuit board, a feasible scheme is to reduce the wiring distance between the power supply chip and the processor chip, so as to reduce the wiring resistance, reduce the heat generated by the wiring, and further reduce the power loss caused by the wiring inside the circuit board. Thus, in the improved circuit board assembly, as shown in fig. 1, the processor chip 202 may be disposed on the front surface of the circuit board 201, the power supply chip 203 may be disposed on the back surface of the circuit board 201, and the processor chip 202 and the power supply chip 203 may be in the same area. Thus, compared with the scheme that the processor chip and the power supply chip are both arranged on the front surface of the circuit board and are spaced apart by a large distance, the routing distance between the processor chip 202 and the power supply chip 203 can be significantly reduced, so that the power loss caused by routing inside the circuit board is reduced.

However, as shown in fig. 1, in the case where the circuit board assembly 20 modified as described above is placed in the rectangular parallelepiped internal space of the existing chassis 10, there is a case where the internal space of the chassis 10 is wasted as follows. On the other hand, since the power supply chip 203 is disposed on the back surface of the circuit board 201 and only electronic components (such as surface mount capacitors) with small height can be disposed on other portions of the back surface of the circuit board 201, a partial space surrounded by a dashed line frame on the back surface of the circuit board 201 in fig. 1 has no corresponding electronic component, thereby resulting in a waste of the internal space of the enclosure 10. On the other hand, since the height of the portion of the processor chip 202 on the front side of the circuit board 201 may be smaller than the height of other electronic components on the front side of the circuit board 201, the partial space surrounded by the dashed line frame on the front side of the circuit board 201 in fig. 1 has no corresponding electronic component, thereby also resulting in the waste of the internal space of the chassis 10.

SUMMERY OF THE UTILITY MODEL

In view of the above, the present application provides a chassis capable of reducing waste of an internal space of the chassis when accommodating the same electronic device having different portions shifted in a height direction or different electronic devices having different portions shifted in the height direction. The application also provides a cabinet comprising a plurality of the chassis and electronic equipment comprising the chassis and electronic devices.

Therefore, the following technical scheme is adopted in the application.

In a first aspect, embodiments of the present application provide a chassis enclosing an internal space for housing electronic devices, the chassis including a first wall and a second wall, the first wall and the second wall being opposite to each other in a height direction of the chassis,

the first wall portion is formed with at least one concave portion that is depressed toward one side in the height direction with respect to the other portion of the first wall portion, the second wall portion is formed with at least one convex portion that is projected toward the one side in the height direction with respect to the other portion of the second wall portion, the concave portion and the convex portion are provided in pairs, and the concave portion and the convex portion overlap with each other in the height direction in a pair of the concave portion and the convex portion.

By adopting the technical scheme, the chassis can contain different electronic devices staggered in the height direction, or can contain the same electronic device with different parts staggered in the height direction, so that the space utilization rate of the chassis in the state of containing the electronic devices is improved, and the waste of an internal space is reduced.

In a possible embodiment according to the first aspect, the chassis comprises a plurality of recesses and a plurality of protrusions, the recesses being arranged spaced apart from each other and the protrusions being arranged spaced apart from each other.

By adopting the technical scheme, compared with the scheme that only one concave part and one convex part are arranged, the case can accommodate more different electronic devices which are arranged in a staggered mode in the height direction, or can accommodate more same electronic devices of which different parts are staggered in the height direction.

In a possible embodiment according to the first aspect, the height of at least two of said recesses is different; and/or the heights of at least two of the projections are different.

By adopting the technical scheme, the case can be adapted to a plurality of electronic devices with different height sizes, or can be adapted to the same electronic device with different height sizes at different positions.

In a possible embodiment according to the first aspect, a plurality of said recesses extend parallel to each other; and/or a plurality of said projections extend parallel to each other.

By adopting the technical scheme, the structure of the case is facilitated to be simplified, so that the large-scale industrial production is facilitated.

In a possible embodiment according to the first aspect, the height of the inner space is equal at different locations.

By adopting the technical scheme, under the condition that the inner space of the case can contain one or more corresponding electronic devices, the height of the inner space of the case is set to be the same at each part, which is beneficial to simplifying the structure of the case.

In one possible embodiment according to the first aspect, in the pair of the concave portion and the convex portion, a width of the concave portion is equal to a width of the convex portion, or a width of the concave portion is 102% to 110% of the width of the convex portion.

In one possible embodiment according to the first aspect, the recess extends in its direction of extension over the first wall part; and/or the protrusion extends throughout the second wall portion in the extending direction thereof.

By adopting the technical scheme, the structure of the case is simplified, and the assembly of the cabinet comprising the case is facilitated.

In a second aspect, an embodiment of the present application provides a cabinet, which includes a plurality of enclosures described in any one of the above technical solutions.

A typical application scenario of the chassis of the present application is presented.

In one possible embodiment according to the second aspect, a plurality of the cabinets are arranged in a stack in the height direction, and the plurality of cabinets overlap each other along the height direction.

Through adopting above-mentioned technical scheme, be favorable to reducing the occupied space of rack.

In a possible embodiment according to the second aspect, the convex portion of one of the two adjacent chassis is inserted into the concave portion of the other chassis.

Through adopting above-mentioned technical scheme, be favorable to reducing the size of rack in the direction of height.

In one possible embodiment according to the second aspect, the first wall portion of one of the two adjacent chassis and the second wall portion of the other chassis abut against each other at respective portions.

Through adopting above-mentioned technical scheme, be favorable to constructing the rack that occupation space is less and the structure is stable.

In a third aspect, an embodiment of the present application provides an electronic apparatus, including an electronic device and the chassis according to any one of the above technical solutions, where at least one of the electronic devices is accommodated in one of the chassis.

Another exemplary application scenario of the chassis of the present application is presented.

In one possible embodiment according to the third aspect, the electronic device has a first portion and a second portion, both of which are offset from each other in the height direction, the first portion projecting toward one side in the height direction with respect to the second portion, the second portion projecting toward the other side in the height direction with respect to the first portion, the first portion is mounted to a portion of the internal space of the chassis corresponding to the concave portion and the convex portion, and the second portion is mounted to the other portion of the internal space of the chassis.

By adopting the technical scheme, the electronic device adaptive to the case and the electronic equipment of the case are provided, so that the electronic equipment with high space utilization rate of the case is constructed.

In one possible embodiment according to the third aspect, the electronic device is a circuit board assembly, the circuit board assembly including a circuit board, a processor chip, and a power supply chip,

at the first portion, the processor chip is disposed on a front surface of the circuit board, the power supply chip is disposed on a back surface of the circuit board, and the power supply chip and the processor chip are electrically conducted through the circuit board.

By adopting the technical scheme, the circuit board assembly which is provided with the processor chip and the power supply chip in the same area of the circuit board is provided as the electronic device. In the circuit board assembly, the power supply path of the processor chip can be shortened, thereby reducing the loss of electric energy in the circuit board.

In one possible embodiment according to the third aspect, a plurality of the circuit board assemblies are housed in one case, the circuit boards of the plurality of circuit board assemblies are parallel to or offset from each other and perpendicular to the height direction, and the first portions of the plurality of circuit board assemblies are each located at a position corresponding to the concave portion and the convex portion in the internal space of the case.

By adopting the technical scheme, the alternative scheme of constructing the electronic equipment by utilizing the case and the circuit board assemblies is provided, the electronic equipment is constructed in a relatively flexible matching mode, and the space required by assembling a plurality of circuit board assemblies is saved.

In one possible implementation according to the third aspect, the electronic device is a server.

Has the advantages that: a typical application example of the electronic device of the present application is presented.

These and other aspects of the present application will be more readily apparent from the following description of the embodiment(s).

Drawings

The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate exemplary embodiments, features, and aspects of the application and, together with the description, serve to explain the principles of the application.

Fig. 1 is a schematic configuration diagram showing a conventional electronic apparatus.

Fig. 2A is a schematic structural diagram illustrating a chassis according to a first embodiment of the present application.

Fig. 2B is a schematic structural diagram illustrating an electronic device according to the first embodiment of the present application including the chassis in fig. 2A.

Fig. 3A is a schematic structural diagram illustrating a chassis according to a second embodiment of the present application.

Fig. 3B is a schematic structural diagram illustrating an electronic device according to a second embodiment of the present application including the chassis in fig. 3A.

Fig. 3C is a schematic diagram illustrating a cabinet according to an embodiment of the present application including the enclosure of fig. 3A.

Description of the reference numerals

10 a chassis; 20 a circuit board assembly; 201 a circuit board; 202 a processor chip; 203 power supply chip;

1, a chassis; 11 a first wall portion; 11c a recess; 12 a second wall portion; a 12p convex portion;

2, a circuit board assembly; 21 a circuit board; 22 a processor chip; 23 power supply chip; 24 a heat sink; 2a first part; 2b a second part;

h height direction

Detailed Description

Various exemplary embodiments, features and aspects of the present application will be described in detail below with reference to the accompanying drawings. In the drawings, like reference numbers can indicate functionally identical or similar elements. While the various aspects of the embodiments are presented in drawings, the drawings are not necessarily drawn to scale unless specifically indicated. In addition, the drawings in the present application are for schematically illustrating the relative positional relationship of the structures of the respective portions, and are not for precisely illustrating the specific dimensions and the mutual connection relationship of the respective portions.

The word "exemplary" is used exclusively herein to mean "serving as an example, embodiment, or illustration. Any embodiment described herein as "exemplary" is not necessarily to be construed as preferred or advantageous over other embodiments.

In addition, numerous specific details are set forth in the following specific examples in order to provide a better understanding of the present application. It will be understood by those skilled in the art that the present application may be practiced without some of these specific details. In some instances, methods, means, elements well known to those skilled in the art have not been described in detail so as not to obscure the present application.

In the present application, unless otherwise specified, "longitudinal direction", "width direction" and "height direction" refer to the longitudinal direction, width direction and height direction of the chassis, respectively. Specifically, the longitudinal direction refers to a direction perpendicular to the paper surface in fig. 2A, 2B, 3A, 3B, and 3C, the width direction refers to the left-right direction in fig. 2A, 2B, 3A, 3B, and 3C, and the height direction refers to the up-down direction in fig. 2A, 2B, 3A, 3B, and 3C. Further, the height direction side refers to a lower side in fig. 2A, 2B, 3A, 3B, and 3C, and the height direction other side refers to an upper side in fig. 2A, 2B, 3A, 3B, and 3C.

In the present application, the two "overlap each other in the height direction" means that the two completely overlap (occlude each other) when viewed in the height direction. Here, the two members overlapping each other in the height direction may be the same size or may be different. In the case of two members of different sizes, the projection of the smaller member in the height direction may be located within the larger member. In addition, the two are "opposite to each other" in the sense that they face each other.

First, the technical idea of the enclosure of the present invention will be described below, in which the concave-convex structure is provided on two wall portions facing each other in the height direction, so that when the enclosure houses different electronic devices arranged in a staggered manner in the height direction or houses the same electronic device with different portions staggered in the height direction, the dead space in the internal space of the enclosure, which is not used for housing the electronic devices, can be reduced, and the space utilization of the enclosure can be improved.

The following first describes a chassis according to a first embodiment of the present application and a structure of an electronic apparatus according to the first embodiment of the present application including the chassis, with reference to the drawings of the specification.

(case according to the first embodiment of the present application and electronic apparatus according to the first embodiment of the present application)

As shown in fig. 2A and 2B, the housing of the chassis 1 according to the first embodiment of the present application encloses an internal space for housing electronic components such as the circuit board assembly 2. Specifically, in the present embodiment, the housing of the chassis 1 may include two wall portions that are parallel to each other and opposed to each other in the length direction, two wall portions that are parallel to each other and opposed to each other in the width direction, and two

wall portions

11, 12 that are parallel to each other and opposed to each other in the height direction H. The six wall portions collectively enclose the inner space.

In order to correspond to the shape and size of different electronic devices or the same electronic device having different portions shifted in the height direction H, two wall portions of the casing 1 facing each other in the height direction H are formed into a concave-convex structure. Specifically, as shown in fig. 2A and 2B, two walls of the cabinet 1 that oppose each other in the height direction H are a first wall 11 and a second wall 12. The first wall portion 11 is formed with one recess portion 11c, and the recess portion 11c is recessed toward one side in the height direction with respect to the other portion of the first wall portion 11. The longitudinal direction (i.e., extending direction) of the recess 11c may be the same as the longitudinal direction of the housing 1, and the width direction of the recess 11c may be the same as the width direction of the housing 1. The second wall portion 12 is formed with one projection 12p, and the projection 12p projects toward the height direction side with respect to the other portion of the second wall portion 12. The longitudinal direction (i.e., extending direction) of the convex portion 12p may be the same as the longitudinal direction of the chassis 1, and the width direction of the convex portion 12p may be the same as the width direction of the chassis 1. Further, in the present embodiment, the length of the concave portion 11c may be the same as the length of the convex portion 12p, the width of the concave portion 11c may be the same as the width of the convex portion 12p, and the height of the concave portion 11c may be the same as the width of the convex portion 12p. In the present embodiment, the concave portion 11c and the convex portion 12p are provided in pairs in which the concave portion 11c and the convex portion 12p overlap each other in the height direction H. In addition, in the present embodiment, the heights of the respective portions of the internal space of the housing 1 are always equal to each other, and may be equal to the maximum height of the electronic device to be housed. It is understood that in the alternative, the widths of the concave portion 11c and the convex portion 12p may be smaller than the width of the cabinet 1, and the lengths of the concave portion 11c and the convex portion 12p may be smaller than the length of the cabinet 1. The concave portion 11c and the convex portion 12p may assume a rectangular shape when viewed from above or from below (i.e., when the concave portion 11c or the convex portion 12p is viewed from, for example, the upper side or the lower side in fig. 2A).

Further, as shown in fig. 2B, the electronic apparatus according to the first embodiment of the present application includes the chassis 1 shown in fig. 2A and the circuit board assembly 2 as an electronic device. One circuit board assembly 2 is accommodated in the housing 1, and the circuit board assembly 2 is arranged such that the circuit board 21 thereof is perpendicular to the height direction H of the housing 1, that is, the thickness direction of the circuit board 21 coincides with the height direction H of the housing 1.

Specifically, as shown in fig. 2B, the circuit board assembly 2 has a first portion 2a and a second portion 2B which are offset from each other in the height direction H, the first portion 2a projecting toward one side in the height direction with respect to the second portion 2B, and the second portion 2B projecting toward the other side in the height direction with respect to the first portion 2 a. The circuit board assembly 2 includes a circuit board 21 and various components (including chips, memories, etc.) disposed on the circuit board 21. At the above-mentioned first portion 2a, a processor chip 22 and a heat sink 24 are provided on the front surface of the circuit board 21, and a power supply chip 23 is provided on the rear surface of the circuit board 21. The power supply chip 23 is electrically connected to the processor chip 22 via the circuit board 21, so that the power supply chip 23 can supply power to the processor chip 22 via the circuit board 21 to realize a so-called vertical power supply architecture. Since the circuit board assembly 2 of the processor chip 22 and the power supply chip 23 is mounted on the same area of the circuit board 21, the power supply path of the processor chip 22 can be shortened, thereby reducing power loss. At the above-mentioned second portion 2b, a plurality of memories may be provided on the front surface of the circuit board 21. As shown in fig. 2B, in the electronic apparatus, the first portion 2a of the circuit board assembly 2 is mounted to a portion of the internal space of the housing 1 corresponding to the concave portion 11c and the convex portion 12p, and the second portion 2B is mounted to the other portion of the internal space of the housing 1 in cooperation with the internal space of the housing 1. In this way, the chassis 1 of the present application can significantly improve the utilization rate of the internal space in the case of housing the circuit board assemblies 2 whose different portions are arranged in a staggered manner in the height direction H.

The following describes configurations of a chassis according to a second embodiment of the present application, an electronic apparatus according to a second embodiment of the present application including the chassis, and a cabinet including a plurality of chassis, with reference to the drawings of the specification.

(Chassis according to second embodiment of the present application, electronic apparatus according to second embodiment of the present application, and cabinet according to an embodiment of the present application)

Similarly to the structure according to the first embodiment of the present application, as shown in fig. 3A and 3B, the housing of the chassis 1 according to the second embodiment of the present application surrounds and forms an internal space for housing electronic devices such as the circuit board assembly 2. Specifically, in the present embodiment, the housing of the chassis 1 may include two wall portions that are parallel to each other and opposed to each other in the length direction, two wall portions that are parallel to each other and opposed to each other in the width direction, and two

wall portions

Further, in the present embodiment, the two wall portions of the cabinet 1 facing each other in the height direction H also form the concave-convex structure. Specifically, as shown in fig. 3A and 3B, two wall portions of the chassis 1 that oppose each other in the height direction H are a first wall portion 11 and a second wall portion 12. The first wall portion 11 is formed with two recesses 11c, the two recesses 11c being arranged spaced apart from each other, each recess 11c being recessed toward the height direction side with respect to the other portion of the first wall portion 11 where the recess 11c is not provided. The length direction (i.e., extending direction) of the two recesses 11c may be the same as the length direction of the cabinet 1, and thus the two recesses 11c are parallel to each other. The width direction of the recess 11c may be the same as the width direction of the chassis 1. The second wall portion 12 is formed with two protrusions 12p, the two protrusions 12p being arranged spaced apart from each other, each protrusion 12p protruding toward the height direction side with respect to the other portion of the second wall portion 12 where the protrusion 12p is not provided. The length direction (i.e., extending direction) of the two convex portions 12p may be the same as the length direction of the chassis 1, and thus the two convex portions 12p are parallel to each other. The width direction of the convex portion 12p may be the same as the width direction of the chassis 1. Further, in the present embodiment, the recesses 11c and the projections 12p are provided in pairs, and the recesses 11c and the projections 12p overlap each other in the height direction H in each pair of the recesses 11c and the projections 12p. In the present embodiment, both the concave portion 11c and the convex portion 12p may extend throughout the entire chassis 1 in the longitudinal direction, and thus the length of the concave portion 11c may be the same as that of the convex portion 12p. In addition, the width of the concave portion 11c may be slightly larger than the width of the convex portion 12p, for example, the width of the concave portion 11c may be 102% to 110% of the width of the convex portion 12p, and the height of the concave portion 11c may be slightly larger than the height of the convex portion 12p, for example, the height of the concave portion 11c may be 102% to 110% of the height of the convex portion 12p. This dimensional relationship facilitates reducing the size of a cabinet comprising a plurality of chassis 1. In addition, in the present embodiment, the heights of the portions of the internal space of the cabinet 1 may be different.

Further, as shown in fig. 3B, an electronic apparatus according to the second embodiment of the present application includes a chassis 1 shown in fig. 3A and a circuit board assembly 2 as an electronic device. Two circuit board assemblies 2 are housed in the casing 1, each circuit board assembly 2 is arranged with its circuit board 21 perpendicular to the height direction H of the casing 1, and the first portions 2a of the two circuit board assemblies 2 are arranged in a stacked manner and the second portions 2b of the two circuit board assemblies 2 are arranged in a stacked manner.

Specifically, as shown in fig. 3B, similarly to the first embodiment, each circuit board assembly 2 of the electronic apparatus according to the second embodiment of the present application has a first portion 2a and a second portion 2B which are staggered from each other in the height direction H, the first portion 2a projecting toward one side in the height direction with respect to the second portion 2B, and the second portion 2B projecting toward the other side in the height direction with respect to the first portion 2 a. The circuit board assembly 2 includes a circuit board 21 and various components (including chips, memories, etc.) disposed on the circuit board 21. At the above-mentioned first portion 2a, a processor chip 22 and a heat sink 24 are provided on the front surface of the circuit board 21, and a power supply chip 23 is provided on the rear surface of the circuit board 21. The power supply chip 23 is electrically connected to the processor chip 22 via the circuit board 21, so that the power supply chip 23 can supply power to the processor chip 22 via the circuit board 21 to realize a so-called vertical power supply architecture. At the above-mentioned second portion 2b, a plurality of memories may be provided on the front surface of the circuit board 21. As shown in fig. 3B, in the electronic apparatus, the first portions 2a of the two circuit board assemblies 2 are arranged in a stacked manner in cooperation with the internal space of the chassis 1, and are located at portions of the internal space of the chassis 1 corresponding to the paired concave portions 11c and convex portions 12 p; the second portions 2b of the two circuit board assemblies 2 are arranged one above the other in the inner space of the cabinet 1. In this way, the housing 1 of the present application can accommodate more different electronic components that are offset in the height direction H or can accommodate more identical electronic components that are offset in the height direction H in different portions, as compared to a case in which only one concave portion and one convex portion are provided.

Here, in the example shown in fig. 3B, two processor chips 21 are provided on each circuit board 21 in the illustrated left-right direction, however, the present application is not limited thereto. In alternative, other numbers of processor chips 21 may be provided on one circuit board 21, for example, a plurality or a plurality of columns of processor chips 21 may be arranged in a direction perpendicular to the paper surface in fig. 3B. The plurality of processor chips 21 may be arranged in the form of, for example, a matrix of 1 × 2, 1 × 3, 2 × 2, 2 × 3, or the like. In the example shown in fig. 3B, one circuit board 21 extends from one side to the other side in the illustrated left-right direction, however, the present application is not limited thereto, and two circuit boards may be provided in the illustrated left-right direction, which may be independent of each other or have a connection relationship such as electrical connection.

Further, as shown in fig. 3C, the cabinet according to an embodiment of the present application includes a plurality of the above-described cabinets 1. The plurality of cabinets 1 are arranged in a stacked manner in the height direction H. The plurality of cabinets 1 overlap each other as viewed in the height direction H. Further, since the concave portion 11c and the convex portion 12p of the cabinet 1 extend over the entire length of the cabinet 1 and both the width and the height of the concave portion 11c are slightly larger than those of the convex portion 12p, in the cabinet, the concave portion 11c of the cabinet 1 on one side in the height direction can receive the convex portion 12p of the cabinet 1 on the other side in the height direction. Thus, as shown in fig. 3C, when the convex-concave structures of two adjacent chassis 1 are plugged together, the space occupied by the cabinet can be significantly reduced, which is particularly beneficial for reducing the size of the cabinet in the height direction H. Further, in order to further construct a cabinet which occupies a small space and is stable in construction, for two adjacent cabinets 1, the first wall portion 11 of one cabinet 1 and the second wall portion 12 of the other cabinet 1 abut against each other at respective portions. In addition, it can be understood that the number of the chassis 1 in the cabinet according to the present application can be adjusted as needed.

In addition, the first wall 11 and the second wall 12 of two adjacent chassis 1 may be spaced apart for heat dissipation or other considerations.

The foregoing has outlined exemplary embodiments of the detailed description of the present application and related modifications, as well as additional descriptions that follow.

i. It is to be understood that the features of the various embodiments of the present application can be combined with each other to form new solutions, in the absence of conflict or contradiction with each other.

The casing 1 of the present application can house not only the same electronic components having different portions staggered in the height direction H but also different electronic components arranged staggered in the height direction H. For example, in one housing 1, a plurality of circuit board assemblies 2 stacked in the height direction H and having a number greater than or equal to two may be housed, the circuit boards 21 of the plurality of circuit board assemblies 2 are parallel to each other and perpendicular to the height direction H, and the first portions 2a of the adjacent circuit board assemblies 2 are each located at a portion of the internal space of the housing 1 corresponding to the concave portion 11c and the convex portion 12p. In this way, the electronic device can be built in a relatively flexible-fit manner and the space required for a plurality of circuit board assemblies 2 is saved. In addition, with the aspect of the present application, in the case of employing the circuit board assemblies 2 arranged as shown in fig. 2B and 3B, it is possible to leave a sufficient space on the front surface side of the circuit board 21 of each circuit board assembly 2 to mount a high-height electronic component, corresponding to the area where the second portion 2B is located.

in the embodiment of the present application, the dimensions and structures of the convex portion 12p and the concave portion 11c of the chassis 1 are defined, but the present application is not limited thereto.

For example, in the case where the first wall portion 11 of the housing 1 is provided with a plurality of concave portions 11c, the heights of at least two concave portions 11c may be made different according to the size of electronic components to be housed; in the case where the second wall portion 12 of the housing 1 is provided with the plurality of projections 12p, the heights of at least two projections 12p may be made different depending on the size of the electronic component to be housed.

Further, the plurality of concave portions 11c may extend in a non-parallel manner, and the plurality of convex portions 12p may extend in a non-parallel manner.

Further, the concave portion 11c and the convex portion 12p may not extend over the chassis 1 in the longitudinal direction.

Further, the heights of the respective portions of the housing 1 may be equal, and the heights of the respective portions of the internal space of the housing 1 may be equal.

The dimensions and structural modifications of the convex portion 12p and the concave portion 11c of the cabinet 1 are not described here by way of example. In summary, in the present invention, the dimensions and structures of the concave portion 11c and the convex portion 12p can be flexibly adjusted as needed.

The electronic device of the present application may be, but is not limited to, various servers such as a web server, in which a circuit board assembly having a high-power processor chip and a vertical power supply architecture may be disposed. When the electronic device is in an operating state, the height direction of the electronic device may coincide with the vertical direction.

While the present application has been described in connection with various embodiments, other variations to the disclosed embodiments can be understood and effected by those skilled in the art in practicing the claimed application, from a review of the drawings, the disclosure, and the appended claims. In the claims, the word "comprising" does not exclude other elements or steps, and the word "a" or "an" does not exclude a plurality. The mere fact that certain measures are recited in mutually different dependent claims does not indicate that a combination of these measures cannot be used to advantage.

Having described embodiments of the present application, the foregoing description is intended to be exemplary, not exhaustive, and not limited to the disclosed embodiments. Many modifications and variations will be apparent to those of ordinary skill in the art without departing from the scope and spirit of the described embodiments. The terminology used herein is chosen in order to best explain the principles of the embodiments, the practical application, or improvements made to the technology in the marketplace, or to enable others of ordinary skill in the art to understand the embodiments disclosed herein.

Claims

1. A cabinet enclosing an internal space for housing electronic components, the cabinet including a first wall portion and a second wall portion opposing each other in a height direction of the cabinet,

2. A cabinet according to claim 1, comprising a plurality of the recesses and a plurality of the projections, the plurality of recesses being spaced apart from each other, and the plurality of projections being spaced apart from each other.

3. A cabinet according to claim 2,

the heights of at least two of the recesses are different; and/or

The heights of at least two of the projections are different.

4. A cabinet according to claim 2,

a plurality of said recesses extending parallel to each other; and/or

The plurality of projections extend parallel to each other.

5. A cabinet according to any one of claims 1 to 4, wherein the height of the inner space is equal at different locations.

6. A cabinet according to any one of claims 1 to 4, wherein, in the pair of the concave portion and the convex portion, the width of the concave portion is equal to the width of the convex portion, or the width of the concave portion is 102% to 110% of the width of the convex portion.

7. A cabinet according to any one of claims 1 to 4,

the recess extends over the first wall portion in an extending direction thereof; and/or

The protrusion extends across the second wall portion in the extending direction thereof.

8. A cabinet comprising a plurality of enclosures according to any of claims 1 to 7.

9. The cabinet of claim 8, wherein a plurality of the chassis are arranged in a stack in the height direction, and the plurality of the chassis overlap each other along the height direction.

10. The cabinet of claim 8 or 9, wherein the male portion of one of the two adjacent cabinets is inserted into the female portion of the other cabinet.

11. The cabinet of claim 10, wherein the first wall of one of the two adjacent enclosures abuts against the second wall of the other enclosure at various locations.

12. An electronic apparatus comprising electronic devices and the chassis of any one of claims 1 to 7, at least one of the electronic devices being housed in one of the chassis.

13. The electronic apparatus according to claim 12, wherein the electronic device has a first portion and a second portion, both of which are offset from each other in the height direction, the first portion projecting toward one side in the height direction with respect to the second portion, the second portion projecting toward the other side in the height direction with respect to the first portion, the first portion being mounted to a portion of the internal space of the housing corresponding to the recessed portion and the raised portion, the second portion being mounted to the other portion of the internal space of the housing.

14. The electronic device of claim 13, wherein the electronic device is a circuit board assembly comprising a circuit board, a processor chip, and a power supply chip,

at the first portion, the processor chip is disposed on a front surface of the circuit board, the power supply chip is disposed on a back surface of the circuit board, and the power supply chip and the processor chip are electrically conducted via the circuit board.

15. The electronic apparatus according to claim 14, wherein a plurality of the circuit board assemblies are housed in one case, the circuit boards of the plurality of circuit board assemblies are parallel to or offset from each other and perpendicular to the height direction, and the first portions of the plurality of circuit board assemblies are each located at a position corresponding to the concave portion and the convex portion in the internal space of the case.

16. The electronic device according to any one of claims 12 to 15, wherein the electronic device is a server.