CN218772734U - Case, cabinet and electronic equipment - Google Patents

Case, cabinet and electronic equipment Download PDF

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Publication number
CN218772734U
CN218772734U CN202222516383.0U CN202222516383U CN218772734U CN 218772734 U CN218772734 U CN 218772734U CN 202222516383 U CN202222516383 U CN 202222516383U CN 218772734 U CN218772734 U CN 218772734U
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cabinet
circuit board
height direction
chassis
electronic device
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刘志恒
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Huawei Technologies Co Ltd
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Huawei Technologies Co Ltd
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Abstract

本申请提供了一种机箱、机柜及电子设备。本申请的机箱通过在高度方向上彼此相对的两个壁部上设置凹凸结构。这样,在该机箱收纳在高度方向上错开布置的不同电子器件,或者收纳不同部分在高度方向上错开的同一电子器件的情况下,能够减小机箱的内部空间中未用于收纳电子器件的无效空间,改善机箱的空间利用率。本申请的机柜包括多个上述机箱。本申请的电子设备包括电子器件和至少一个上述机箱,该电子设备包括但不限于服务器。

Figure 202222516383

The application provides a case, a cabinet and electronic equipment. In the case of the present application, concave-convex structures are provided on the two wall parts opposite to each other in the height direction. In this way, when the case accommodates different electronic devices that are staggered in the height direction, or accommodates the same electronic device with different parts staggered in the height direction, it is possible to reduce the ineffectiveness of the internal space of the case that is not used to accommodate the electronic devices. Space, improve the space utilization of the chassis. The cabinet of the present application includes a plurality of above-mentioned cabinets. The electronic equipment of the present application includes an electronic device and at least one of the aforementioned chassis, and the electronic equipment includes but is not limited to a server.

Figure 202222516383

Description

机箱、机柜及电子设备Chassis, cabinets and electronics

技术领域technical field

本申请涉及电子设备的支撑结构,具体地涉及一种机箱、包括该机箱的机柜以及电子设备。The present application relates to a supporting structure of electronic equipment, in particular to a case, a cabinet including the case, and electronic equipment.

背景技术Background technique

在例如网络服务器等的服务器中,包括机箱和电路板组件。电路板组件包括设置在电路板上的处理器芯片(例如中央处理器芯片和图像处理器芯片)、供电芯片以及内存器件等。在服务器中,利用机箱收纳电路板组件,使得电路板组件稳定地载置于机箱中。In a server such as a web server, a chassis and a circuit board assembly are included. The circuit board assembly includes a processor chip (such as a central processing unit chip and an image processor chip), a power supply chip, and a memory device arranged on the circuit board. In the server, the case is used to house the circuit board assembly, so that the circuit board assembly is stably placed in the case.

随着服务器的电路板组件的处理器芯片的功耗越来越高,导致供电芯片向处理器芯片供电的过程中,电路板内部的走线(例如铜箔)产生的电能损耗非常大。为了降低电路板内部的走线导致的电能损耗,一种可行的方案是减小供电芯片与处理器芯片之间的走线距离,由此来降低走线电阻,减少走线发热,进而降低电路板内部的走线导致的电能损耗。由此,在改进的电路板组件中,如图1所示,可以将处理器芯片202设置在电路板201的正面,供电芯片203设置在电路板201的背面,处理器芯片202和供电芯片203处于同一区域。这样,与处理器芯片和供电芯片均设置在电路板的正面且间隔开较大距离的方案相比,能够显著减小处理器芯片202和供电芯片203之间的走线距离,从而降低电路板内部的走线导致的电能损耗。As the power consumption of the processor chip of the circuit board assembly of the server is getting higher and higher, the power loss generated by the wiring (such as copper foil) inside the circuit board is very large when the power supply chip supplies power to the processor chip. In order to reduce the power loss caused by the wiring inside the circuit board, a feasible solution is to reduce the wiring distance between the power supply chip and the processor chip, thereby reducing the wiring resistance, reducing the heating of the wiring, and further reducing the power consumption of the circuit. Power loss caused by traces inside the board. Thus, in the improved circuit board assembly, as shown in FIG. in the same area. In this way, compared with the solution in which the processor chip and the power supply chip are both arranged on the front of the circuit board and separated by a large distance, the wiring distance between the processor chip 202 and the power supply chip 203 can be significantly reduced, thereby reducing the size of the circuit board. Power loss caused by internal wiring.

但是,如图1所示,在将如上所述改进的电路板组件20置于现有的机箱10的长方体内部空间的情况下,存在如下的导致机箱10的内部空间浪费的情况。一方面,由于供电芯片203设置在电路板201的背面且电路板201的背面的其它部分只能设置高度较小的电子元器件(例如表贴电容等),导致图1中的电路板201的背面侧虚线框所包围的部分空间没有对应的电子元器件,由此导致机箱10的内部空间浪费。另一方面,由于处理器芯片202所在部位在电路板201的正面侧的高度可能小于其它电子元器件在电路板201的正面侧的高度,导致图1中的电路板201的正面侧虚线框所包围的部分空间没有对应的电子元件,由此也导致机箱10的内部空间浪费。However, as shown in FIG. 1 , when the above-mentioned improved circuit board assembly 20 is placed in the cuboid inner space of the existing housing 10 , there is a situation in which the inner space of the housing 10 is wasted as follows. On the one hand, since the power supply chip 203 is arranged on the back of the circuit board 201 and other parts of the back of the circuit board 201 can only be provided with electronic components with a small height (such as surface mount capacitors, etc.), the circuit board 201 in FIG. Part of the space surrounded by the dotted line frame on the back side has no corresponding electronic components, thus resulting in waste of the internal space of the chassis 10 . On the other hand, since the height of the processor chip 202 on the front side of the circuit board 201 may be smaller than the height of other electronic components on the front side of the circuit board 201, the front side of the circuit board 201 in FIG. There is no corresponding electronic component in the enclosed part of the space, which also leads to waste of the internal space of the chassis 10 .

实用新型内容Utility model content

有鉴于此,本申请提出了一种机箱,该机箱在收纳不同部分存在高度方向错位的同一电子器件或在高度方向上错开的不同电子器件的情况下能够减少机箱的内部空间的浪费。本申请还提供了一种包括多个上述机箱的机柜以及包括上述机箱和电子器件的电子设备。In view of this, the present application proposes a case that can reduce the waste of internal space of the case when accommodating the same electronic device with height misalignment in different parts or different electronic devices staggered in height direction. The present application also provides a cabinet including a plurality of the above-mentioned cabinets, and electronic equipment including the above-mentioned cabinets and electronic devices.

为此,本申请采用如下的技术方案。For this reason, the application adopts the following technical solutions.

第一方面,本申请的实施例提供了一种机箱,所述机箱包围形成内部空间,用于收纳电子器件,所述机箱包括第一壁部和第二壁部,所述第一壁部和所述第二壁部在所述机箱的高度方向上相对,In the first aspect, the embodiment of the present application provides a case, the case surrounds and forms an internal space for accommodating electronic devices, the case includes a first wall and a second wall, the first wall and the The second wall parts are opposite in the height direction of the cabinet,

所述第一壁部形成有至少一个凹部,所述凹部相对于所述第一壁部的其它部分朝向高度方向一侧凹陷,所述第二壁部形成有至少一个凸部,所述凸部相对于所述第二壁部的其它部分朝向所述高度方向一侧凸出,所述凹部和所述凸部成对设置,在一对所述凹部和所述凸部中所述凹部和所述凸部沿着所述高度方向彼此重叠。The first wall part is formed with at least one concave part, and the concave part is recessed toward one side in the height direction relative to other parts of the first wall part, and the second wall part is formed with at least one convex part, and the convex part The other part of the second wall protrudes toward one side in the height direction, the concave portion and the convex portion are provided in a pair, and the concave portion and the convex portion are arranged in a pair of the concave portion and the convex portion. The protrusions overlap each other along the height direction.

通过采用上述技术方案,本申请的机箱能够收纳在高度方向上错开的不同电子器件,或者能够收纳不同部分在高度方向上错开的同一电子器件,由此改善机箱收纳上述电子器件的状态下的空间利用率,减小内部空间的浪费。By adopting the above technical solution, the chassis of the present application can accommodate different electronic devices that are staggered in the height direction, or can accommodate the same electronic device with different parts that are staggered in the height direction, thereby improving the space in the state where the chassis accommodates the above-mentioned electronic devices Utilization, reduce the waste of internal space.

在根据第一方面的一种可能的实施方式中,所述机箱包括多个所述凹部和多个所述凸部,多个所述凹部彼此间隔开地布置,多个所述凸部彼此间隔开地布置。In a possible implementation manner according to the first aspect, the chassis includes a plurality of the recesses and a plurality of the protrusions, the plurality of the recesses are spaced apart from each other, and the plurality of the protrusions are spaced apart from each other Open layout.

通过采用上述技术方案,与仅设置一个凹部和一个凸部的方案相比,机箱能够收纳更多在高度方向上错开布置的不同电子器件,或者能够收纳更多不同部分在高度方向上错开的同一电子器件。By adopting the above technical solution, compared with the solution of only setting one concave part and one convex part, the chassis can accommodate more different electronic devices arranged staggered in the height direction, or can accommodate more different parts of the same electronic device staggered in the height direction. electronic devices.

在根据第一方面的一种可能的实施方式中,至少两个所述凹部的高度不同;并且/或者至少两个所述凸部的高度不同。In a possible implementation manner according to the first aspect, at least two of the recesses have different heights; and/or at least two of the protrusions have different heights.

通过采用上述技术方案,本申请的机箱能够适配高度尺寸不同的多个电子器件,或者能够适配不同部位高度尺寸不同的同一电子器件。By adopting the above technical solution, the chassis of the present application can be adapted to a plurality of electronic devices with different heights and dimensions, or can be adapted to the same electronic device with different heights and dimensions in different parts.

在根据第一方面的一种可能的实施方式中,多个所述凹部彼此平行地延伸;并且/或者多个所述凸部彼此平行地延伸。In a possible implementation manner according to the first aspect, the multiple concave parts extend parallel to each other; and/or the multiple convex parts extend parallel to each other.

通过采用上述技术方案,有利于简化机箱的构造,以便于大规模的工业生产。By adopting the above technical solution, it is beneficial to simplify the structure of the chassis so as to facilitate large-scale industrial production.

在根据第一方面的一种可能的实施方式中,在不同部位处,所述内部空间的高度相等。In a possible implementation manner according to the first aspect, at different positions, the heights of the internal spaces are equal.

通过采用上述技术方案,在机箱的内部空间能够收纳对应的一个或多个电子器件的情况下,将机箱的内部空间的高度设置成在各部位均相同,这有利于简化机箱的构造。By adopting the above technical solution, when the inner space of the case can accommodate one or more corresponding electronic devices, the height of the inner space of the case is set to be the same at all parts, which is beneficial to simplify the structure of the case.

在根据第一方面的一种可能的实施方式中,在一对所述凹部和所述凸部中,所述凹部的宽度与所述凸部的宽度相等,或者所述凹部的宽度为所述凸部的宽度的102%至110%。In a possible implementation manner according to the first aspect, in a pair of the concave portion and the convex portion, the width of the concave portion is equal to the width of the convex portion, or the width of the concave portion is equal to the 102% to 110% of the width of the convex portion.

通过采用上述技术方案,有利于简化机箱的构造,以便于大规模的工业生产。By adopting the above technical solution, it is beneficial to simplify the structure of the chassis so as to facilitate large-scale industrial production.

在根据第一方面的一种可能的实施方式中,所述凹部在其延伸方向上遍及所述第一壁部地延伸;并且/或者所述凸部在其延伸方向上遍及所述第二壁部地延伸。In a possible implementation manner according to the first aspect, the concave portion extends throughout the first wall portion in its extending direction; and/or the convex portion extends throughout the second wall portion in its extending direction partly extended.

通过采用上述技术方案,不仅有利于简化机箱的构造,而且还有利于包括机箱的机柜的组装。By adopting the above technical solution, it is not only beneficial to simplify the structure of the chassis, but also beneficial to the assembly of the cabinet including the chassis.

第二方面,本申请的实施例提供了一种机柜,包括多个以上技术方案中任意一项技术方案所述的机箱。In a second aspect, an embodiment of the present application provides a cabinet, including the cabinet described in any one of the above technical solutions.

提出了本申请的机箱的一种典型应用场景。A typical application scenario of the chassis of the present application is proposed.

在根据第二方面的一种可能的实施方式中,多个所述机箱在所述高度方向上层叠布置,并且多个所述机箱沿着所述高度方向彼此重叠。In a possible implementation manner according to the second aspect, a plurality of the chassis are stacked in the height direction, and the plurality of chassis overlap each other along the height direction.

通过采用上述技术方案,有利于减小机柜所占用的空间。By adopting the above technical solution, it is beneficial to reduce the space occupied by the cabinet.

在根据第二方面的一种可能的实施方式中,相邻的两个所述机箱中的一个机箱的凸部插入另一个机箱的凹部内。In a possible implementation manner according to the second aspect, the convex portion of one of the two adjacent casings is inserted into the concave portion of the other casing.

通过采用上述技术方案,有利于减小机柜在高度方向上的尺寸。By adopting the above technical solution, it is beneficial to reduce the size of the cabinet in the height direction.

在根据第二方面的一种可能的实施方式中,相邻的两个所述机箱中的一个机箱的所述第一壁部与另一个机箱的所述第二壁部在各部位处彼此抵靠。In a possible implementation manner according to the second aspect, the first wall part of one of the two adjacent cabinets and the second wall part of the other cabinet are against each other at various positions. Depend on.

通过采用上述技术方案,有利于构建占用空间较小且构造稳定的机柜。By adopting the above technical solution, it is beneficial to build a cabinet that occupies less space and has a stable structure.

第三方面,本申请的实施例提供了一种电子设备,包括电子器件以及以上技术方案中任意一项技术方案所述的机箱,在一个所述机箱内收纳至少一个所述电子器件。In a third aspect, an embodiment of the present application provides an electronic device, including an electronic device and a casing according to any one of the above technical solutions, and at least one electronic device is accommodated in one of the casings.

提出了本申请的机箱的另一种典型应用场景。Another typical application scenario of the chassis of the present application is proposed.

在根据第三方面的一种可能的实施方式中,所述电子器件具有第一部分和第二部分,所述第一部分和所述第二部分两者在所述高度方向上彼此错开,所述第一部分相对于所述第二部分朝向高度方向一侧凸出,所述第二部分相对于所述第一部分朝向高度方向另一侧凸出,所述第一部分安装于所述机箱的内部空间的与所述凹部和所述凸部对应的部分,所述第二部分安装于所述机箱的内部空间的其它部分。In a possible implementation manner according to the third aspect, the electronic device has a first part and a second part, both of the first part and the second part are staggered from each other in the height direction, and the first part A part protrudes toward one side in the height direction relative to the second part, and the second part protrudes toward the other side in the height direction relative to the first part, and the first part is installed on the inner space of the chassis and The corresponding part of the concave part and the convex part, the second part is installed in other parts of the inner space of the chassis.

通过采用上述技术方案,提出了包括与本申请的机箱适配的电子器件以及机箱的电子设备,从而构建机箱的空间利用率高的电子设备。By adopting the above technical solution, an electronic device including an electronic device adapted to the case of the present application and the case is proposed, so as to construct an electronic device with a high space utilization rate of the case.

在根据第三方面的一种可能的实施方式中,所述电子器件为电路板组件,所述电路板组件包括电路板、处理器芯片和供电芯片,In a possible implementation manner according to the third aspect, the electronic device is a circuit board assembly, and the circuit board assembly includes a circuit board, a processor chip, and a power supply chip,

在所述第一部分处,所述处理器芯片设置在所述电路板的正面上,所述供电芯片设置在所述电路板的背面上,所述供电芯片与所述处理器芯片经由所述电路板电性导通。At the first part, the processor chip is arranged on the front surface of the circuit board, the power supply chip is arranged on the back surface of the circuit board, and the power supply chip and the processor chip are connected via the circuit The board is electrically conductive.

通过采用上述技术方案,提出了在电路板的同一区域安装处理器芯片和供电芯片的电路板组件作为电子器件。在该电路板组件中,能够缩短处理器芯片的供电路径,由此减少电能在电路板中的损耗。By adopting the above technical solution, a circuit board assembly in which a processor chip and a power supply chip are mounted on the same area of the circuit board is proposed as an electronic device. In the circuit board assembly, the power supply path of the processor chip can be shortened, thereby reducing the loss of electric energy in the circuit board.

在根据第三方面的一种可能的实施方式中,在一个所述机箱中,收纳多个所述电路板组件,多个所述电路板组件的电路板彼此平行或错开且与所述高度方向垂直,多个所述电路板组件的第一部分均位于所述机箱的内部空间的与所述凹部和所述凸部对应的部位。In a possible implementation manner according to the third aspect, a plurality of the circuit board assemblies are accommodated in one case, and the circuit boards of the plurality of circuit board assemblies are parallel to each other or staggered and aligned with the height direction. Vertically, the first parts of the plurality of circuit board assemblies are all located at positions corresponding to the concave part and the convex part in the inner space of the chassis.

通过采用上述技术方案,提出了利用机箱与电路板组件构建电子设备的可选方案,有利于以相对灵活搭配的方式构建电子设备,并且节省多个电路板组件组装所需的空间。By adopting the above-mentioned technical solution, an optional solution for constructing electronic equipment by using the chassis and circuit board components is proposed, which is beneficial to construct electronic equipment in a relatively flexible manner and saves the space required for assembling multiple circuit board components.

在根据第三方面的一种可能的实施方式中,所述电子设备为服务器。In a possible implementation manner according to the third aspect, the electronic device is a server.

有益效果:提出了本申请的电子设备的典型应用示例。Beneficial effect: a typical application example of the electronic device of the present application is provided.

本申请的这些和其他方面在以下(多个)实施例的描述中会更加简明易懂。These and other aspects of the present application will be made more apparent in the following description of the embodiment(s).

附图说明Description of drawings

包含在说明书中并且构成说明书的一部分的附图与说明书一起示出了本申请的示例性实施例、特征和方面,并且用于解释本申请的原理。The accompanying drawings, which are incorporated in and constitute a part of the specification, illustrate exemplary embodiments, features, and aspects of the application and, together with the specification, serve to explain the principles of the application.

图1是示出了一种现有的电子设备的结构示意图。FIG. 1 is a schematic diagram showing the structure of a conventional electronic device.

图2A是示出了根据本申请的第一实施例的机箱的结构示意图。Fig. 2A is a schematic structural diagram showing a chassis according to the first embodiment of the present application.

图2B是示出了包括图2A中的机箱的根据本申请的第一实施例的电子设备的结构示意图。FIG. 2B is a schematic structural diagram showing an electronic device according to the first embodiment of the present application including the chassis in FIG. 2A .

图3A是示出了根据本申请的第二实施例的机箱的结构示意图。FIG. 3A is a schematic structural diagram showing a chassis according to a second embodiment of the present application.

图3B是示出了包括图3A中的机箱的根据本申请的第二实施例的电子设备的结构示意图。FIG. 3B is a schematic structural diagram showing an electronic device according to a second embodiment of the present application including the case in FIG. 3A .

图3C是示出了包括图3A中的机箱的根据本申请的一实施例的机柜的结构示意图。FIG. 3C is a schematic structural diagram showing a cabinet according to an embodiment of the present application including the cabinet in FIG. 3A .

附图标记说明Explanation of reference signs

10机箱;20电路板组件;201电路板;202处理器芯片;203供电芯片;10 chassis; 20 circuit board assembly; 201 circuit board; 202 processor chip; 203 power supply chip;

1机箱;11第一壁部;11c凹部;12第二壁部;12p凸部;1 chassis; 11 first wall; 11c concave; 12 second wall; 12p convex;

2电路板组件;21电路板;22处理器芯片;23供电芯片;24散热器;2a第一部分;2b第二部分;2 circuit board assembly; 21 circuit board; 22 processor chip; 23 power supply chip; 24 radiator; 2a first part; 2b second part;

H高度方向H height direction

具体实施方式Detailed ways

以下将参考附图详细说明本申请的各种示例性实施例、特征和方面。附图中相同的附图标记表示功能相同或相似的元件。尽管在附图中示出了实施例的各种方面,但是除非特别指出,不必按比例绘制附图。另外,本申请的附图用于示意性地示出各部分结构的相对位置关系,而并不用于精确示出各部分的具体尺寸和相互连接关系。Various exemplary embodiments, features, and aspects of the present application will be described in detail below with reference to the accompanying drawings. The same reference numbers in the figures indicate functionally identical or similar elements. While various aspects of the embodiments are shown in drawings, the drawings are not necessarily drawn to scale unless specifically indicated. In addition, the drawings of the present application are used to schematically show the relative positional relationship of the structures of various parts, and are not used to precisely show the specific dimensions and interconnection relationship of the various parts.

在这里专用的词“示例性”意为“用作例子、实施例或说明性”。这里作为“示例性”所说明的任何实施例不必解释为优于或好于其它实施例。The word "exemplary" is used exclusively herein to mean "serving as an example, embodiment, or illustration." Any embodiment described herein as "exemplary" is not necessarily to be construed as superior or better than other embodiments.

另外,为了更好的说明本申请,在下文的具体实施例中给出了众多的具体细节。本领域技术人员应当理解,没有某些具体细节,本申请同样可以实施。在一些实例中,对于本领域技术人员熟知的方法、手段、元件未作详细描述,以便于凸显本申请的主旨。In addition, in order to better illustrate the present application, numerous specific details are given in the following specific examples. It will be understood by those skilled in the art that the present application may be practiced without certain of the specific details. In some instances, methods, means, and elements well known to those skilled in the art are not described in detail in order to highlight the gist of the present application.

在本申请中,如无特殊说明,“长度方向”、“宽度方向”、“高度方向”分别是指机箱的长度方向、宽度方向和高度方向。具体地,长度方向是指图2A、图2B、图3A、图3B和图3C中垂直纸面的方向,宽度方向是指图2A、图2B、图3A、图3B和图3C中的左右方向,高度方向是指图2A、图2B、图3A、图3B和图3C中的上下方向。进一步地,高度方向一侧是指图2A、图2B、图3A、图3B和图3C中的下侧,高度方向另一侧是指图2A、图2B、图3A、图3B和图3C中的上侧。In this application, unless otherwise specified, "length direction", "width direction" and "height direction" refer to the length direction, width direction and height direction of the chassis respectively. Specifically, the length direction refers to the direction perpendicular to the paper in Figure 2A, Figure 2B, Figure 3A, Figure 3B and Figure 3C, and the width direction refers to the left-right direction in Figure 2A, Figure 2B, Figure 3A, Figure 3B and Figure 3C , the height direction refers to the up-down direction in Fig. 2A, Fig. 2B, Fig. 3A, Fig. 3B and Fig. 3C. Further, one side in the height direction refers to the lower side in Fig. 2A, Fig. 2B, Fig. 3A, Fig. 3B and Fig. 3C, and the other side in the height direction refers to the lower side in Fig. 2A, Fig. 2B, Fig. 3A, Fig. 3B and Fig. 3C on the upper side.

在本申请中,两者“沿着高度方向彼此重叠”是指当沿着高度方向观察时这两者完全重叠(相互遮挡)。这里,沿着高度方向彼此重叠的两个构件大小可以相同,也可以不同。在两个构件大小不同的情况下,较小的构件的沿着高度方向的投影可以位于较大的构件内。另外,两者“彼此相对”是指两者面对面。In the present application, the two "overlap each other in the height direction" means that the two completely overlap (shade each other) when viewed in the height direction. Here, the sizes of the two members overlapping each other in the height direction may be the same or different. In the case of two components of different sizes, the heightwise projection of the smaller component can lie within the larger component. In addition, both "opposite each other" means that both face each other.

以下首先说明本申请的机箱的技术构思,本申请的机箱通过在高度方向上彼此相对的两个壁部上设置凹凸结构,使得在该机箱收纳在高度方向上错开布置的不同电子器件,或者收纳不同部分在高度方向上错开的同一电子器件的情况下,能够减小机箱的内部空间中未用于收纳电子器件的无效空间,改善机箱的空间利用率。The technical concept of the chassis of the present application will be described first below. The chassis of the present application is provided with concave-convex structures on the two walls facing each other in the height direction, so that different electronic devices arranged in a staggered manner in the height direction can be accommodated in the chassis, or In the case of the same electronic device whose different parts are staggered in the height direction, the invalid space in the inner space of the case that is not used for accommodating the electronic device can be reduced, and the space utilization rate of the case can be improved.

以下首先结合说明书附图说明根据本申请的第一实施例的机箱以及包括该机箱的根据本申请的第一实施例的电子设备的结构。The structure of the chassis according to the first embodiment of the present application and the structure of the electronic device including the chassis according to the first embodiment of the present application will be firstly described below with reference to the accompanying drawings.

(根据本申请的第一实施例的机箱和根据本申请的第一实施例的电子设备)(The chassis according to the first embodiment of the present application and the electronic device according to the first embodiment of the present application)

如图2A和图2B所示,根据本申请的第一实施例的机箱1的壳体包围形成内部空间,该内部空间用于收纳例如电路板组件2的电子器件。具体地,在本实施例中,机箱1的壳体可以包括彼此平行且在长度方向上彼此相对的两个壁部、彼此平行且在宽度方向上彼此相对的两个壁部和彼此平行且在高度方向H上彼此相对的两个壁部11、12。这六个壁部共同包围形成上述内部空间。As shown in FIG. 2A and FIG. 2B , the shell of the case 1 according to the first embodiment of the present application surrounds and forms an inner space for accommodating electronic devices such as a circuit board assembly 2 . Specifically, in this embodiment, the casing of the chassis 1 may include two wall portions parallel to each other and opposite to each other in the length direction, two wall portions parallel to each other and opposite to each other in the width direction, and two wall portions parallel to each other and opposite to each other in the width direction. Two wall portions 11 , 12 facing each other in the height direction H. These six wall portions jointly surround and form the above-mentioned internal space.

为了与在高度方向H上错开的不同电子器件或者不同部分在高度方向H上错开的同一电子器件的形状和尺寸对应,机箱1的在高度方向H上彼此相对的两个壁部形成凹凸结构。具体地,如图2A和图2B所示,机箱1的在高度方向H上彼此相对的两个壁部为第一壁部11和第二壁部12。第一壁部11形成有一个凹部11c,凹部11c相对于第一壁部11的其它部分朝向高度方向一侧凹陷。凹部11c的长度方向(也就是延伸方向)可以与机箱1的长度方向相同,凹部11c的宽度方向可以与机箱1的宽度方向相同。第二壁部12形成有一个凸部12p,凸部12p相对于第二壁部12的其它部分朝向高度方向一侧凸出。凸部12p的长度方向(也就是延伸方向)可以与机箱1的长度方向相同,凸部12p的宽度方向可以与机箱1的宽度方向相同。进一步地,在本实施例中,凹部11c的长度可以与凸部12p的长度相同,凹部11c的宽度可以与凸部12p的宽度相同,凹部11c的高度可以与凸部12p的宽度相同。在本实施例中,凹部11c和凸部12p成对设置,在这对凹部11c和凸部12p中凹部11c和凸部12p沿着高度方向H彼此重叠。另外,在本实施例中,机箱1的内部空间的各部分的高度始终相等,并且可以与所要收纳的电子器件的最大高度相等。可以理解,在可选的方案中,凹部11c和凸部12p的宽度可以小于机箱1的宽度,凹部11c和凸部12p的长度可以小于机箱1的长度。当俯视或仰视观察时(即,从例如图2A中的上侧或下侧观察凹部11c或凸部12p时),凹部11c和凸部12p可以呈现出矩形形状。In order to correspond to the shape and size of different electronic devices staggered in the height direction H or the same electronic device with different parts staggered in the height direction H, the two walls of the chassis 1 opposite to each other in the height direction H form a concave-convex structure. Specifically, as shown in FIGS. 2A and 2B , two wall portions of the cabinet 1 that face each other in the height direction H are a first wall portion 11 and a second wall portion 12 . The first wall portion 11 is formed with a concave portion 11 c that is recessed toward one side in the height direction with respect to the other portion of the first wall portion 11 . The longitudinal direction (that is, the extending direction) of the concave portion 11c may be the same as the longitudinal direction of the chassis 1 , and the width direction of the concave portion 11c may be the same as the width direction of the chassis 1 . The second wall portion 12 is formed with one convex portion 12 p that protrudes toward one side in the height direction relative to the other portion of the second wall portion 12 . The length direction (that is, the extension direction) of the protrusion 12p may be the same as the length direction of the case 1 , and the width direction of the protrusion 12p may be the same as the width direction of the case 1 . Further, in this embodiment, the length of the concave portion 11c may be the same as the length of the convex portion 12p, the width of the concave portion 11c may be the same as the width of the convex portion 12p, and the height of the concave portion 11c may be the same as the width of the convex portion 12p. In the present embodiment, the concave portion 11c and the convex portion 12p are provided as a pair in which the concave portion 11c and the convex portion 12p overlap each other in the height direction H. In addition, in this embodiment, the height of each part of the inner space of the chassis 1 is always equal, and may be equal to the maximum height of the electronic device to be accommodated. It can be understood that, in an optional solution, the width of the concave portion 11c and the convex portion 12p may be smaller than the width of the chassis 1 , and the length of the concave portion 11c and the convex portion 12p may be smaller than the length of the chassis 1 . The concave portion 11c and the convex portion 12p may assume a rectangular shape when viewed from above or below (ie, when viewing the concave portion 11c or the convex portion 12p from, for example, the upper or lower side in FIG. 2A ).

进一步地,如图2B所示,根据本申请的第一实施例的电子设备包括图2A所示的机箱1以及作为电子器件的电路板组件2。在该机箱1内收纳一个电路板组件2,电路板组件2以其电路板21与机箱1的高度方向H垂直的方式布置,即电路板21的厚度方向与机箱1的高度方向H一致。Further, as shown in FIG. 2B , the electronic device according to the first embodiment of the present application includes the case 1 shown in FIG. 2A and a circuit board assembly 2 as an electronic device. A circuit board assembly 2 is accommodated in the case 1, and the circuit board assembly 2 is arranged in such a way that its circuit board 21 is perpendicular to the height direction H of the case 1, that is, the thickness direction of the circuit board 21 is consistent with the height direction H of the case 1.

具体地,如图2B所示,电路板组件2具有在高度方向H上彼此错开的第一部分2a和第二部分2b,第一部分2a相对于第二部分2b朝向高度方向一侧凸出,第二部分2b相对于第一部分2a朝向高度方向另一侧凸出。电路板组件2包括电路板21和设置于电路板21上的各种元器件(包括芯片、内存等等)。在上述第一部分2a处,在电路板21的正面上设置处理器芯片22和散热器24,在电路板21的背面上设置供电芯片23。供电芯片23与处理器芯片22经由电路板21实现电性导通,使得供电芯片23能够经由电路板21向处理器芯片22供电,以实现所谓的垂直供电架构。由于在电路板21的同一区域安装处理器芯片22和供电芯片23的电路板组件2,能够缩短处理器芯片22的供电路径,由此减少电能损耗。在上述第二部分2b处,在电路板21的正面上可以设置有多个内存。如图2B所示,在电子设备中,与机箱1的内部空间相配合地,电路板组件2的第一部分2a安装于机箱1的内部空间的与凹部11c和凸部12p对应的部分,第二部分2b安装于机箱1的内部空间的其它部分。这样,在收纳不同部分在高度方向H上错开布置的电路板组件2的情况下,本申请的机箱1能够显著改善内部空间的利用率。Specifically, as shown in FIG. 2B, the circuit board assembly 2 has a first portion 2a and a second portion 2b that are staggered from each other in the height direction H, the first portion 2a protrudes toward one side in the height direction relative to the second portion 2b, and the second portion The portion 2b protrudes toward the other side in the height direction with respect to the first portion 2a. The circuit board assembly 2 includes a circuit board 21 and various components (including chips, memory, etc.) disposed on the circuit board 21 . At the above-mentioned first part 2 a , a processor chip 22 and a heat sink 24 are arranged on the front side of the circuit board 21 , and a power supply chip 23 is arranged on the back side of the circuit board 21 . The power supply chip 23 and the processor chip 22 are electrically connected through the circuit board 21 , so that the power supply chip 23 can supply power to the processor chip 22 through the circuit board 21 to realize a so-called vertical power supply architecture. Since the circuit board assembly 2 of the processor chip 22 and the power supply chip 23 are mounted on the same area of the circuit board 21, the power supply path of the processor chip 22 can be shortened, thereby reducing power consumption. At the above-mentioned second part 2b, a plurality of memories may be provided on the front side of the circuit board 21 . As shown in FIG. 2B, in the electronic equipment, in cooperation with the internal space of the case 1, the first part 2a of the circuit board assembly 2 is installed in the part corresponding to the concave part 11c and the convex part 12p of the internal space of the case 1, and the second The part 2b is installed in the other part of the inner space of the cabinet 1 . In this way, in the case of accommodating the circuit board assembly 2 whose different parts are staggered in the height direction H, the case 1 of the present application can significantly improve the utilization rate of the internal space.

以下结合说明书附图说明根据本申请的第二实施例的机箱、包括该机箱的根据本申请的第二实施例的电子设备以及包括多个机箱的机柜的结构。The structure of the cabinet according to the second embodiment of the present application, the electronic device including the cabinet according to the second embodiment of the present application, and the cabinet including multiple cabinets will be described below with reference to the accompanying drawings.

(根据本申请的第二实施例的机箱、根据本申请的第二实施例的电子设备以及根据本申请的一实施例的机柜)(The chassis according to the second embodiment of the present application, the electronic device according to the second embodiment of the present application, and the cabinet according to an embodiment of the present application)

与根据本申请的第一实施例的结构类似地,如图3A和图3B所示,根据本申请的第二实施例的机箱1的壳体包围形成内部空间,该内部空间用于收纳例如电路板组件2的电子器件。具体地,在本实施例中,机箱1的壳体可以包括彼此平行且在长度方向上彼此相对的两个壁部、彼此平行且在宽度方向上彼此相对的两个壁部和彼此平行且在高度方向H上彼此相对的两个壁部11、12。这六个壁部共同包围形成上述内部空间。Similar to the structure according to the first embodiment of the present application, as shown in FIG. 3A and FIG. 3B , according to the second embodiment of the present application, the casing of the chassis 1 surrounds and forms an internal space for accommodating, for example, a circuit Electronics of board assembly 2. Specifically, in this embodiment, the casing of the chassis 1 may include two wall portions parallel to each other and opposite to each other in the length direction, two wall portions parallel to each other and opposite to each other in the width direction, and two wall portions parallel to each other and opposite to each other in the width direction. Two wall portions 11 , 12 facing each other in the height direction H. These six wall portions jointly surround and form the above-mentioned internal space.

进一步地,在本实施例中,机箱1的在高度方向H上彼此相对的两个壁部也形成凹凸结构。具体地,如图3A和图3B所示,机箱1的在高度方向H上彼此相对的两个壁部为第一壁部11和第二壁部12。第一壁部11形成有两个凹部11c,两个凹部11c彼此间隔开地布置,每个凹部11c相对于第一壁部11的未设置凹部11c的其它部分朝向高度方向一侧凹陷。两个凹部11c的长度方向(也就是延伸方向)可以与机箱1的长度方向相同,因此这两个凹部11c彼此平行。凹部11c的宽度方向可以与机箱1的宽度方向相同。第二壁部12形成有两个凸部12p,两个凸部12p彼此间隔开地布置,每个凸部12p相对于第二壁部12的未设置凸部12p的其它部分朝向高度方向一侧凸出。两个凸部12p的长度方向(也就是延伸方向)可以与机箱1的长度方向相同,因此这两个凸部12p彼此平行。凸部12p的宽度方向可以与机箱1的宽度方向相同。进一步地,在本实施例中,凹部11c和凸部12p成对设置,在每对凹部11c和凸部12p中凹部11c和凸部12p沿着高度方向H彼此重叠。在本实施例中,凹部11c和凸部12p均可以在长度方向上遍及整个机箱1地延伸,因而凹部11c的长度可以与凸部12p的长度相同。另外,凹部11c的宽度可以略大于凸部12p的宽度,例如,凹部11c的宽度可以为凸部12p的宽度的102%至110%,凹部11c的高度可以略大于凸部12p的高度,例如,凹部11c的高度可以为凸部12p的高度的102%至110%。这种尺寸关系有利于减小包括多个机箱1的机柜的尺寸。另外,在本实施例中,机箱1的内部空间的各部分的高度可以不同。Further, in this embodiment, the two wall portions of the cabinet 1 that face each other in the height direction H also form a concave-convex structure. Specifically, as shown in FIGS. 3A and 3B , the two wall portions of the cabinet 1 facing each other in the height direction H are a first wall portion 11 and a second wall portion 12 . The first wall portion 11 is formed with two recesses 11c arranged spaced apart from each other, each recess 11c being recessed toward one side in the height direction relative to the other portion of the first wall portion 11 where no recess 11c is provided. The length direction (that is, the extending direction) of the two recesses 11c may be the same as the length direction of the chassis 1, so the two recesses 11c are parallel to each other. The width direction of the concave portion 11 c may be the same as the width direction of the cabinet 1 . The second wall portion 12 is formed with two convex portions 12p arranged spaced apart from each other, each convex portion 12p facing one side in the height direction with respect to the other portion of the second wall portion 12 where the convex portion 12p is not provided. protruding. The length direction (that is, the extending direction) of the two protrusions 12p may be the same as the length direction of the chassis 1, so the two protrusions 12p are parallel to each other. The width direction of the convex portion 12p may be the same as the width direction of the cabinet 1 . Further, in this embodiment, the concave portion 11c and the convex portion 12p are provided in pairs, and the concave portion 11c and the convex portion 12p overlap each other along the height direction H in each pair of the concave portion 11c and the convex portion 12p. In this embodiment, both the concave portion 11c and the convex portion 12p may extend throughout the entire chassis 1 in the length direction, so the length of the concave portion 11c may be the same as that of the convex portion 12p. In addition, the width of the concave portion 11c can be slightly larger than the width of the convex portion 12p, for example, the width of the concave portion 11c can be 102% to 110% of the width of the convex portion 12p, and the height of the concave portion 11c can be slightly larger than the height of the convex portion 12p, for example, The height of the concave portion 11c may be 102% to 110% of the height of the convex portion 12p. This dimensional relationship is favorable for reducing the size of a cabinet including a plurality of chassis 1 . In addition, in this embodiment, the height of each part of the inner space of the cabinet 1 may be different.

进一步地,如图3B所示,根据本申请的第二实施例的电子设备包括图3A所示的机箱1以及作为电子器件的电路板组件2。在该机箱1内收纳两个电路板组件2,每个电路板组件2以其电路板21与机箱1的高度方向H垂直的方式布置,而且两个电路板组件2的第一部分2a层叠布置,两个电路板组件2的第二部分2b层叠布置。Further, as shown in FIG. 3B , the electronic device according to the second embodiment of the present application includes the case 1 shown in FIG. 3A and a circuit board assembly 2 as an electronic device. Two circuit board assemblies 2 are accommodated in the case 1, each circuit board assembly 2 is arranged in such a way that its circuit board 21 is perpendicular to the height direction H of the case 1, and the first parts 2a of the two circuit board assemblies 2 are stacked, The second parts 2b of the two circuit board assemblies 2 are stacked.

具体地,如图3B所示,与第一实施例类似地,根据本申请的第二实施例的电子设备的每个电路板组件2具有在高度方向H上彼此错开的第一部分2a和第二部分2b,第一部分2a相对于第二部分2b朝向高度方向一侧凸出,第二部分2b相对于第一部分2a朝向高度方向另一侧凸出。电路板组件2包括电路板21和设置于电路板21上的各种元器件(包括芯片、内存等等)。在上述第一部分2a处,在电路板21的正面上设置处理器芯片22和散热器24,在电路板21的背面上设置供电芯片23。供电芯片23与处理器芯片22经由电路板21实现电性导通,使得供电芯片23能够经由电路板21向处理器芯片22供电,以实现所谓的垂直供电架构。在上述第二部分2b处,在电路板21的正面上可以设置有多个内存。如图3B所示,在电子设备中,与机箱1的内部空间相配合地,两个电路板组件2的第一部分2a层叠布置,且位于机箱1的内部空间的与成对的凹部11c和凸部12p对应的部分;两个电路板组件2的第二部分2b层叠布置,其位于机箱1的内部空间的其它部分。这样,与仅设置一个凹部和一个凸部的方案相比,本申请的机箱1能够收纳更多在高度方向H上错开的不同电子器件,或者能够收纳更多不同部分在高度方向H上错开的同一电子器件。Specifically, as shown in FIG. 3B , similar to the first embodiment, each circuit board assembly 2 of the electronic device according to the second embodiment of the present application has a first portion 2a and a second portion staggered from each other in the height direction H. For the portion 2b, the first portion 2a protrudes toward one side in the height direction relative to the second portion 2b, and the second portion 2b protrudes toward the other side in the height direction relative to the first portion 2a. The circuit board assembly 2 includes a circuit board 21 and various components (including chips, memory, etc.) disposed on the circuit board 21 . At the above-mentioned first part 2 a , a processor chip 22 and a heat sink 24 are arranged on the front side of the circuit board 21 , and a power supply chip 23 is arranged on the back side of the circuit board 21 . The power supply chip 23 and the processor chip 22 are electrically connected through the circuit board 21 , so that the power supply chip 23 can supply power to the processor chip 22 through the circuit board 21 to realize a so-called vertical power supply architecture. At the above-mentioned second part 2b, a plurality of memories may be provided on the front side of the circuit board 21 . As shown in FIG. 3B , in an electronic device, the first parts 2 a of two circuit board assemblies 2 are stacked to match the inner space of the chassis 1 , and are located in the inner space of the chassis 1 with the paired concave portion 11 c and the convex portion. The part corresponding to the part 12p; the second parts 2b of the two circuit board assemblies 2 are stacked and located in other parts of the internal space of the chassis 1 . In this way, compared with the solution of only providing one concave portion and one convex portion, the chassis 1 of the present application can accommodate more different electronic devices that are staggered in the height direction H, or can accommodate more different parts that are staggered in the height direction H the same electronic device.

这里,在图3B所示的示例中,在图示的左右方向上,每个电路板21上设置两个处理器芯片21,然而,本申请不限于此。在可选的方案中,可以在一个电路板21上设置其他数量的处理器芯片21,例如,在垂直于图3B中的纸面的方向上,可以排布多个或多列处理器芯片21。多个处理器芯片21可以排列成例如1×2、1×3、2×2、2×3等矩阵的形式。在图3B所示的示例中,在图示的左右方向上,一个电路板21从一侧延伸到另一侧,然而,本申请不限于此,在图示的左右方向上,可以设置两个电路板,这两个电路板可以彼此独立或者具有电连接等连接关系。Here, in the example shown in FIG. 3B , two processor chips 21 are provided on each circuit board 21 in the illustrated left and right directions, however, the present application is not limited thereto. In an optional solution, other numbers of processor chips 21 can be arranged on one circuit board 21, for example, in a direction perpendicular to the paper plane in FIG. 3B, multiple or multiple columns of processor chips 21 can be arranged. . A plurality of processor chips 21 may be arranged in a matrix such as 1×2, 1×3, 2×2, 2×3 and so on. In the example shown in FIG. 3B, one circuit board 21 extends from one side to the other in the left-right direction of the illustration, however, the present application is not limited thereto, and two Circuit boards, the two circuit boards may be independent of each other or have a connection relationship such as electrical connection.

进一步地,如图3C所示,根据本申请的一实施例的机柜包括多个上述机箱1。多个机箱1在高度方向H上层叠布置。沿着高度方向H观察,多个机箱1彼此重叠。进一步地,由于机箱1的凹部11c和凸部12p遍及机箱1的整个长度地延伸并且凹部11c的宽度和高度都略大于凸部12p的宽度和高度,因而在该机柜中,位于高度方向一侧的机箱1的凹部11c能够收纳位于高度方向另一侧的机箱1的凸部12p。这样,如图3C所示,当相邻的两个机箱1的凸凹部结构插接在一起时,能够显著减小机柜所占用的空间,尤其有利于减小机柜在高度方向H上的尺寸。进一步地,为了进一步构建占用空间较小且构造稳定的机柜,对于相邻的两个机箱1,一个机箱1的第一壁部11与另一个机箱1的第二壁部12在各部位处彼此抵靠。另外,可以理解,根据本申请的机柜中机箱1的数量可以根据需要进行调整。Further, as shown in FIG. 3C , a cabinet according to an embodiment of the present application includes a plurality of the above-mentioned cabinets 1 . A plurality of cabinets 1 are stacked in the height direction H. Viewed along the height direction H, a plurality of chassis 1 overlap each other. Further, since the concave portion 11c and the convex portion 12p of the cabinet 1 extend throughout the entire length of the cabinet 1 and the width and height of the concave portion 11c are slightly larger than the width and height of the convex portion 12p, therefore in this cabinet, on one side in the height direction The concave portion 11c of the cabinet 1 can accommodate the convex portion 12p of the cabinet 1 located on the other side in the height direction. In this way, as shown in FIG. 3C , when the convex-concave structures of two adjacent cabinets 1 are plugged together, the space occupied by the cabinet can be significantly reduced, and it is especially beneficial to reduce the size of the cabinet in the height direction H. Further, in order to further construct a cabinet with a small footprint and a stable structure, for two adjacent cabinets 1, the first wall portion 11 of one cabinet 1 and the second wall portion 12 of the other cabinet 1 are connected to each other at various positions. against. In addition, it can be understood that the number of chassis 1 in the cabinet according to the present application can be adjusted as required.

另外,出于散热或其它考虑,两个相邻机箱1的第一壁部11和第二壁部12也可以间隔开。In addition, for heat dissipation or other considerations, the first wall portion 11 and the second wall portion 12 of two adjacent cabinets 1 may also be spaced apart.

以上内容对本申请的具体实施方式的示例性实施例及相关的变型例进行了阐述,以下进行补充说明。The above content has described the exemplary embodiments and related modification examples of the specific implementation manners of the present application, and supplementary descriptions are given below.

i.可以理解,在不存在彼此冲突或矛盾的情况下,本申请的各实施例中的特征能够彼此结合来构成新的技术方案。i. It can be understood that the features in the various embodiments of the present application can be combined with each other to form a new technical solution under the condition that there is no mutual conflict or contradiction.

ii.本申请的机箱1不仅能够收纳不同部分在高度方向H上错开的同一电子器件,而且能够收纳在高度方向H上错开布置的不同电子器件。例如,在一个机箱1中,可以收纳多个在高度方向H上层叠且数量大于或等于两个的电路板组件2,多个电路板组件2的电路板21彼此平行且与高度方向H垂直,相邻的电路板组件2的第一部分2a均位于机箱1的内部空间的与凹部11c和凸部12p对应的部分。这样,能够以相对灵活搭配的方式构建电子设备,并且节省多个电路板组件2所需的空间。另外,由于采用本申请的方案,在采用如图2B和图3B那样布置的电路板组件2的情况下,对应第二部分2b所在的区域,能够在各电路板组件2的电路板21的正面侧留下足够的空间以安装高度较大的电子元器件。ii. The chassis 1 of the present application can not only accommodate the same electronic device whose different parts are staggered in the height direction H, but also accommodate different electronic devices staggered in the height direction H. For example, in a cabinet 1, a plurality of circuit board assemblies 2 stacked in the height direction H and the number is greater than or equal to two can be accommodated, and the circuit boards 21 of the plurality of circuit board assemblies 2 are parallel to each other and perpendicular to the height direction H, The first parts 2 a of the adjacent circuit board assemblies 2 are all located in the inner space of the case 1 corresponding to the concave part 11 c and the convex part 12 p. In this way, the electronic equipment can be constructed in a relatively flexible manner, and the space required by multiple circuit board assemblies 2 can be saved. In addition, due to the adoption of the scheme of the present application, in the case of adopting the circuit board assembly 2 arranged as shown in Fig. 2B and Fig. 3B, corresponding to the area where the second part 2b is located, the front surface of the circuit board 21 of each circuit board assembly 2 can be There is enough space on the side to install electronic components with a large height.

iii.在本申请的实施例中,对机箱1的凸部12p和凹部11c的尺寸和结构进行了限定,但是本申请不限于此。iii. In the embodiment of the present application, the size and structure of the convex portion 12p and the concave portion 11c of the cabinet 1 are limited, but the present application is not limited thereto.

例如,在机箱1的第一壁部11设置有多个凹部11c的情况下,根据所需收纳的电子器件的尺寸可以使至少两个凹部11c的高度不同;在机箱1的第二壁部12设置有多个凸部12p的情况下,根据所需收纳的电子器件的尺寸可以使至少两个凸部12p的高度不同。For example, in the case where the first wall 11 of the cabinet 1 is provided with a plurality of recesses 11c, the heights of at least two recesses 11c can be different according to the size of electronic devices to be accommodated; When a plurality of protrusions 12p are provided, the heights of at least two protrusions 12p may be different according to the size of electronic components to be housed.

进一步地,多个凹部11c可以采用非平行的方式延伸,多个凸部12p可以采用非平行的方式延伸。Further, the plurality of concave parts 11c may extend in a non-parallel manner, and the plurality of convex parts 12p may extend in a non-parallel manner.

进一步地,凹部11c和凸部12p在长度方向上可以不遍及机箱1地延伸。Further, the concave portion 11c and the convex portion 12p may not extend throughout the chassis 1 in the length direction.

进一步地,机箱1在各部位的高度可以相等,机箱1的内部空间在各部位的高度也可以相等。Further, the height of each part of the cabinet 1 may be equal, and the height of each part of the internal space of the cabinet 1 may also be equal.

此处对于机箱1的凸部12p和凹部11c的尺寸和结构的变型不进行一一列举说明。总的来说,在本申请的技术方案中,能够根据需要灵活调整凹部11c和凸部12p的尺寸和结构。Here, the modification of the size and structure of the convex portion 12p and the concave portion 11c of the cabinet 1 will not be enumerated and described one by one. In general, in the technical solution of the present application, the size and structure of the concave portion 11c and the convex portion 12p can be flexibly adjusted as required.

iv.本申请的电子设备可以是但是不限于例如网络服务器等各种服务器,这些服务器内可以设置具有大功率处理器芯片且垂直供电架构的电路板组件。当电子设备处于工作状态时,电子设备的高度方向可以与竖直方向一致。iv. The electronic equipment of the present application can be but not limited to various servers such as network servers, and circuit board assemblies with high-power processor chips and vertical power supply structures can be installed in these servers. When the electronic device is in a working state, the height direction of the electronic device may be consistent with the vertical direction.

尽管在此结合各实施例对本申请进行了描述,然而,在实施所要求保护的本申请过程中,本领域技术人员通过查看附图、公开内容、以及所附权利要求书,可理解并实现所公开实施例的其它变化。在权利要求中,“包括”一词不排除其他组成部分或步骤,“一”或“一个”不排除多个的情况。相互不同的从属权利要求中记载了某些措施,但这并不表示这些措施不能组合起来产生良好的效果。Although the present application has been described in conjunction with various embodiments herein, those skilled in the art can understand and realize the present application by referring to the drawings, the disclosure, and the appended claims during the implementation of the claimed application. Other variations of the embodiments are disclosed. In the claims, the word "comprising" does not exclude other elements or steps, and "a" or "an" does not exclude a plurality. The mere fact that certain measures are recited in mutually different dependent claims does not indicate that these measures cannot be combined to advantage.

以上已经描述了本申请的各实施例,上述说明是示例性的,并非穷尽性的,并且也不限于所披露的各实施例。在不偏离所说明的各实施例的范围和精神的情况下,对于本技术领域的普通技术人员来说许多修改和变更都是显而易见的。本文中所用术语的选择,旨在最好地解释各实施例的原理、实际应用或对市场中的技术的改进,或者使本技术领域的其它普通技术人员能理解本文披露的各实施例。Having described various embodiments of the present application above, the foregoing description is exemplary, not exhaustive, and is not limited to the disclosed embodiments. Many modifications and alterations will be apparent to those of ordinary skill in the art without departing from the scope and spirit of the described embodiments. The terminology used herein is chosen to best explain the principle of each embodiment, practical application or improvement of technology in the market, or to enable other ordinary skilled in the art to understand each embodiment disclosed herein.

Claims (16)

1. A cabinet enclosing an internal space for housing electronic components, the cabinet including a first wall portion and a second wall portion opposing each other in a height direction of the cabinet,
the first wall portion is formed with at least one concave portion that is depressed toward one side in the height direction with respect to the other portion of the first wall portion, the second wall portion is formed with at least one convex portion that is projected toward the one side in the height direction with respect to the other portion of the second wall portion, the concave portion and the convex portion are provided in pairs, and the concave portion and the convex portion overlap with each other in the height direction in a pair of the concave portion and the convex portion.
2. A cabinet according to claim 1, comprising a plurality of the recesses and a plurality of the projections, the plurality of recesses being spaced apart from each other, and the plurality of projections being spaced apart from each other.
3. A cabinet according to claim 2,
the heights of at least two of the recesses are different; and/or
The heights of at least two of the projections are different.
4. A cabinet according to claim 2,
a plurality of said recesses extending parallel to each other; and/or
The plurality of projections extend parallel to each other.
5. A cabinet according to any one of claims 1 to 4, wherein the height of the inner space is equal at different locations.
6. A cabinet according to any one of claims 1 to 4, wherein, in the pair of the concave portion and the convex portion, the width of the concave portion is equal to the width of the convex portion, or the width of the concave portion is 102% to 110% of the width of the convex portion.
7. A cabinet according to any one of claims 1 to 4,
the recess extends over the first wall portion in an extending direction thereof; and/or
The protrusion extends across the second wall portion in the extending direction thereof.
8. A cabinet comprising a plurality of enclosures according to any of claims 1 to 7.
9. The cabinet of claim 8, wherein a plurality of the chassis are arranged in a stack in the height direction, and the plurality of the chassis overlap each other along the height direction.
10. The cabinet of claim 8 or 9, wherein the male portion of one of the two adjacent cabinets is inserted into the female portion of the other cabinet.
11. The cabinet of claim 10, wherein the first wall of one of the two adjacent enclosures abuts against the second wall of the other enclosure at various locations.
12. An electronic apparatus comprising electronic devices and the chassis of any one of claims 1 to 7, at least one of the electronic devices being housed in one of the chassis.
13. The electronic apparatus according to claim 12, wherein the electronic device has a first portion and a second portion, both of which are offset from each other in the height direction, the first portion projecting toward one side in the height direction with respect to the second portion, the second portion projecting toward the other side in the height direction with respect to the first portion, the first portion being mounted to a portion of the internal space of the housing corresponding to the recessed portion and the raised portion, the second portion being mounted to the other portion of the internal space of the housing.
14. The electronic device of claim 13, wherein the electronic device is a circuit board assembly comprising a circuit board, a processor chip, and a power supply chip,
at the first portion, the processor chip is disposed on a front surface of the circuit board, the power supply chip is disposed on a back surface of the circuit board, and the power supply chip and the processor chip are electrically conducted via the circuit board.
15. The electronic apparatus according to claim 14, wherein a plurality of the circuit board assemblies are housed in one case, the circuit boards of the plurality of circuit board assemblies are parallel to or offset from each other and perpendicular to the height direction, and the first portions of the plurality of circuit board assemblies are each located at a position corresponding to the concave portion and the convex portion in the internal space of the case.
16. The electronic device according to any one of claims 12 to 15, wherein the electronic device is a server.
CN202222516383.0U 2022-09-22 2022-09-22 Case, cabinet and electronic equipment Active CN218772734U (en)

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