TWI789798B - Lifting system and method for automatic horizontal adjustment - Google Patents
Lifting system and method for automatic horizontal adjustment Download PDFInfo
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- TWI789798B TWI789798B TW110123225A TW110123225A TWI789798B TW I789798 B TWI789798 B TW I789798B TW 110123225 A TW110123225 A TW 110123225A TW 110123225 A TW110123225 A TW 110123225A TW I789798 B TWI789798 B TW I789798B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B66—HOISTING; LIFTING; HAULING
- B66F—HOISTING, LIFTING, HAULING OR PUSHING, NOT OTHERWISE PROVIDED FOR, e.g. DEVICES WHICH APPLY A LIFTING OR PUSHING FORCE DIRECTLY TO THE SURFACE OF A LOAD
- B66F7/00—Lifting frames, e.g. for lifting vehicles; Platform lifts
- B66F7/02—Lifting frames, e.g. for lifting vehicles; Platform lifts with platforms suspended from ropes, cables, or chains or screws and movable along pillars
- B66F7/025—Lifting frames, e.g. for lifting vehicles; Platform lifts with platforms suspended from ropes, cables, or chains or screws and movable along pillars screw operated
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B66—HOISTING; LIFTING; HAULING
- B66F—HOISTING, LIFTING, HAULING OR PUSHING, NOT OTHERWISE PROVIDED FOR, e.g. DEVICES WHICH APPLY A LIFTING OR PUSHING FORCE DIRECTLY TO THE SURFACE OF A LOAD
- B66F7/00—Lifting frames, e.g. for lifting vehicles; Platform lifts
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B66—HOISTING; LIFTING; HAULING
- B66F—HOISTING, LIFTING, HAULING OR PUSHING, NOT OTHERWISE PROVIDED FOR, e.g. DEVICES WHICH APPLY A LIFTING OR PUSHING FORCE DIRECTLY TO THE SURFACE OF A LOAD
- B66F7/00—Lifting frames, e.g. for lifting vehicles; Platform lifts
- B66F7/28—Constructional details, e.g. end stops, pivoting supporting members, sliding runners adjustable to load dimensions
Abstract
本申請案係關於一種水平自動調整之升降系統及方法。在本申請案之一實施例中,上述水平自動調整之升降系統包含:複數個導向支承裝置,其連接至被升降裝置;複數個升降機構,其分別連接至上述複數個導向支承裝置中之對應一者;複數個電機,其分別設置在上述複數個升降機構中之對應一者上,用以驅動對應的升降機構帶動對應的導向支承裝置上升或下降;以及水平位置感測器,其設置在上述複數個導向支承裝置中之一個導向支承裝置之頂部上,用以偵測上述被升降裝置之傾斜度,並傳輸基於偵測結果之信號以控制上述複數個電機。This application relates to a lifting system and method for automatic horizontal adjustment. In one embodiment of the present application, the above-mentioned lifting system for automatic horizontal adjustment includes: a plurality of guiding support devices connected to the device to be lifted; a plurality of lifting mechanisms connected to corresponding ones of the above-mentioned plurality of guiding supporting devices. One; a plurality of motors, which are respectively arranged on the corresponding one of the above-mentioned plurality of lifting mechanisms, to drive the corresponding lifting mechanism to drive the corresponding guide support device to rise or fall; and a horizontal position sensor, which is arranged on The top of one of the plurality of guide support devices is used to detect the inclination of the above-mentioned lifted device, and transmit a signal based on the detection result to control the above-mentioned plurality of motors.
Description
本申請案大體上係關於半導體加工設備領域,且更特定言之,係關於一種水平自動調整之升降系統及方法。This application generally relates to the field of semiconductor processing equipment, and more specifically, relates to a lifting system and method for automatic horizontal adjustment.
半導體加工設備通常包含反應腔及與其形成真空腔體之蓋板。可以藉由升降裝置來控制蓋板之升降。然而,當前半導體加工設備所使用之升降裝置無法實現水平自動調整。而工程機械中使用之水平自動調整裝置通常結構複雜,調整方式繁瑣,難以實現高精度之水平自動調整,並且使用磁塊產生磁場來穩固平台,因而不適合應用於半導體加工設備。Semiconductor processing equipment generally includes a reaction chamber and a cover plate forming a vacuum chamber therewith. The lifting of the cover can be controlled by the lifting device. However, the lifting device used in the current semiconductor processing equipment cannot realize automatic level adjustment. However, the automatic horizontal adjustment devices used in construction machinery are usually complex in structure and cumbersome in adjustment methods. It is difficult to achieve high-precision automatic horizontal adjustment, and use magnetic blocks to generate magnetic fields to stabilize the platform, so they are not suitable for semiconductor processing equipment.
本申請案提供了一種水平自動調整之升降系統,其可以自動調整被升降裝置之水平,升降平穩,可重複性高,維護週期長。This application provides a lifting system with automatic level adjustment, which can automatically adjust the level of the lifting device, and has stable lifting, high repeatability and long maintenance period.
在一態樣中,本申請案提供了一種水平自動調整之升降系統,其包含:複數個導向支承裝置,其連接至被升降裝置;複數個升降機構,其分別連接至上述複數個導向支承裝置中之對應一者;複數個電機,其分別設置在上述複數個升降機構中之對應一者上,用以驅動對應的升降機構帶動對應的導向支承裝置上升或下降;以及水平位置感測器,其設置在上述複數個導向支承裝置中之一個導向支承裝置之頂部上,用以偵測上述被升降裝置之傾斜度,並傳輸基於偵測結果之信號以控制上述複數個電機。In one aspect, the application provides a lifting system with automatic horizontal adjustment, which includes: a plurality of guiding support devices connected to the device to be lifted; a plurality of lifting mechanisms connected to the above-mentioned plurality of guiding supporting devices a corresponding one of them; a plurality of motors, which are respectively arranged on a corresponding one of the above-mentioned plurality of lifting mechanisms, to drive the corresponding lifting mechanism to drive the corresponding guide support device to rise or fall; and a horizontal position sensor, It is installed on the top of one of the plurality of guiding and supporting devices, and is used to detect the inclination of the above-mentioned lifted device, and transmit a signal based on the detection result to control the above-mentioned plurality of motors.
根據本申請案之實施例,上述複數個升降機構中之每一升降機構包含傳動裝置,上述傳動裝置連接至對應的電機,並藉由連接部件連接至對應的導向支承裝置。According to an embodiment of the present application, each lifting mechanism of the plurality of lifting mechanisms includes a transmission device, and the transmission device is connected to a corresponding motor and connected to a corresponding guide support device through a connecting member.
根據本申請案之實施例,上述傳動裝置包含減速機、絲杠及絲杠螺母。According to an embodiment of the present application, the transmission device includes a reducer, a lead screw and a lead screw nut.
根據本申請案之實施例,上述連接部件包含機械水平調整裝置,以調整對應的上述導向支承裝置之水平位置及鎖緊對應的上述導向支承裝置。According to an embodiment of the present application, the connecting part includes a mechanical level adjusting device for adjusting the horizontal position of the corresponding guiding and supporting device and locking the corresponding guiding and supporting device.
根據本申請案之實施例,上述機械水平調整裝置包含關節軸承及碟形彈簧。According to an embodiment of the present application, the mechanical level adjustment device includes joint bearings and disc springs.
根據本申請案之實施例,上述關節軸承包含分別設置在對應的上述導向支承裝置兩側之一對關節軸承,上述碟形彈簧包含分別設置在對應的上述導向支承裝置兩側之兩組碟形彈簧。According to an embodiment of the present application, the joint bearings include a pair of joint bearings respectively disposed on both sides of the corresponding guide support device, and the disc springs comprise two sets of disc springs respectively disposed on both sides of the corresponding guide support device. spring.
根據本申請案之實施例,上述升降系統亦包含控制模組,上述控制模組連接至上述水平位置感測器及上述複數個電機,以設定上述水平位置感測器之初始值以及上述複數個電機之輸出功率及轉速。According to an embodiment of the present application, the lifting system also includes a control module connected to the horizontal position sensor and the plurality of motors to set the initial value of the horizontal position sensor and the plurality of motors. The output power and speed of the motor.
根據本申請案之實施例,上述被升降裝置係半導體加工設備之蓋板。According to an embodiment of the present application, the above-mentioned lifted device is a cover plate of a semiconductor processing equipment.
根據本申請案之實施例,上述半導體加工設備亦包含反應腔,上述複數個升降機構固定在上述反應腔上。According to an embodiment of the present application, the above-mentioned semiconductor processing equipment also includes a reaction chamber, and the plurality of lifting mechanisms are fixed on the above-mentioned reaction chamber.
根據本申請案之實施例,當上述被升降裝置之傾斜度超過上述水平位置感測器之設定值時,上述水平位置感測器根據上述被升降裝置之傾斜度計算電機脈衝輸出數,並將結果傳輸至上述複數個電機中之至少一者。According to an embodiment of the present application, when the inclination of the above-mentioned lifting device exceeds the setting value of the above-mentioned horizontal position sensor, the above-mentioned horizontal position sensor calculates the motor pulse output number according to the inclination of the above-mentioned lifting device, and The result is transmitted to at least one of the plurality of motors.
根據本申請案之實施例,上述複數個電機中之上述至少一者基於自上述水平位置感測器傳輸之電機脈衝輸出數,獨立地調整其輸出功率及轉速。According to an embodiment of the present application, at least one of the plurality of motors independently adjusts its output power and rotational speed based on the number of motor pulse outputs transmitted from the horizontal position sensor.
在另一態樣中,本申請案亦提供了一種使用上述任一升降系統之方法,其包含:控制上述複數個電機,使上述複數個導向支承裝置帶動上述被升降裝置上升或下降;及在上述被升降裝置上升或下降之過程中,藉由上述水平位置感測器偵測上述被升降裝置之傾斜度,並基於偵測結果調整上述複數個電機中之至少一者之輸出。In another aspect, the present application also provides a method of using any of the above-mentioned lifting systems, which includes: controlling the above-mentioned plurality of motors, so that the above-mentioned plurality of guide support devices drive the above-mentioned lifting device to rise or fall; and During the lifting or lowering process of the lifting device, the horizontal position sensor detects the inclination of the lifting device, and adjusts the output of at least one of the plurality of motors based on the detection result.
在以下附圖及描述中闡述本申請案之一或多個實例之細節。其他特徵、目標及優勢將根據以下描述及附圖以及申請專利範圍而顯而易見。The details of one or more examples of the application are set forth in the accompanying drawings and the description below. Other features, objects, and advantages will be apparent from the following description and drawings, as well as from the claims.
為更好地理解本發明之精神,以下結合本發明之部分實施例對其作進一步說明。In order to better understand the spirit of the present invention, it will be further described below in conjunction with some embodiments of the present invention.
本說明書內使用之詞彙「在一實施例中」或「根據一實施例」並不必要參照相同具體實施例,且本說明書內使用之「在其他(一些/某些)實施例中」或「根據其他(一些/某些)實施例」並不必要參照不同的具體實施例。其目的在於例如主張之主題包含全部或部分範例具體實施例之組合。本文所指「上」及「下」之意義並不限於圖式所直接呈現之關係,其應包括具有明確對應關係之描述,例如「左」及「右」,或者係「上」及「下」之相反。本文所稱之「連接」應理解為涵蓋「直接連接」以及「經由一或多個中間部件連接」。本說明書中所使用之各種部件之名稱僅出於說明之目的,並不具備限定作用,不同廠商可使用不同的名稱來指代具備相同功能之部件。The terms "in one embodiment" or "according to an embodiment" used in this specification do not necessarily refer to the same specific embodiment, and the terms "in other (some/certain) embodiments" or "in other (some) embodiments" used in this specification Reference is not necessarily to different specific embodiments according to other (some/certain) embodiments. It is intended, for example, that claimed subject matter encompasses combinations of all or some of the exemplified embodiments. The meanings of "upper" and "lower" mentioned in this article are not limited to the relationship directly presented in the diagram, but should include descriptions with clear corresponding relationships, such as "left" and "right", or "upper" and "lower". "The opposite. The "connection" mentioned herein should be understood to cover "direct connection" as well as "connection via one or more intermediate components". The names of various components used in this manual are for the purpose of illustration only, and do not have a limiting effect. Different manufacturers may use different names to refer to components with the same function.
以下詳細地論述本發明之各種實施方式。儘管論述了具體的實施,但是應當理解,此等實施方式僅用於展示之目的。熟習相關技術者將認識到,在不偏離本發明之精神及保護範疇之情況下,可以使用其他部件及組態。Various embodiments of the invention are discussed in detail below. While specific implementations are discussed, it should be understood that these implementations are done for illustration purposes only. Those skilled in the relevant art will recognize that other components and configurations may be used without departing from the spirit and scope of the invention.
圖1展示了根據本申請案之一些實施例的水平自動調整之升降系統10之總體示意圖。在圖1中,升降系統10可控制被升降裝置(例如,蓋板500)之升降,蓋板500可與反應腔600貼合形成密封腔體以用於半導體加工。FIG. 1 shows an overall schematic diagram of a leveling automatic adjusting
升降系統10包含複數個導向支承裝置100、複數個升降機構200、複數個電機300及水平位置感測器400。儘管圖1中展示了特定數量之升降機構、導向支承裝置及電機,但熟習此項技術者將會理解,水平自動調整之升降系統10可包含更少或更多數量之升降機構、導向支承裝置及電機。The
導向支承裝置100藉由第一連接部件101連接至蓋板500,以帶動蓋板500隨其上升及下降。在上升及下降過程中,導向支承裝置100及蓋板500彼此相對固定。The
升降機構200藉由第二連接部件201連接至對應的導向支承裝置100。升降機構200之一端固定在反應腔600上。The
電機300設置在升降機構200之頂部上。每一電機300對應於一個單獨的升降機構200。電機300可驅動對應的升降機構200以使其藉由第二連接部件201帶動對應的導向支承裝置100上升及下降,從而實現蓋板500之上升及下降。The
水平位置感測器400設置在一個導向支承100之頂部上。水平位置感測器400可以設置在任意一個導向支承100之頂部上。水平位置感測器400可偵測蓋板500之傾斜度,並傳輸基於偵測結果之信號以控制各個電機300。水平位置感測器400之種類不受限制,可以係任意適合類型之水平位置感測器。The
在一些實施例中,水平自動調整之升降系統10亦可以包含控制模組(未展示),控制模組連接至水平位置感測器400及電機300,以設定水平位置感測器400之初始值以及電機300之輸出功率及轉速。在一實施例中,控制模組可以係工控機(PMC)控制模組。根據一些實施例,水平位置感測器400可將基於偵測結果之信號直接傳輸至電機300以控制電機300。根據另一些實施例,水平位置感測器400可將基於偵測結果之信號傳輸至控制模組,再由控制模組產生相應的控制信號以控制電機300。In some embodiments, the leveling automatic
水平自動調整之升降系統10可以應用於各種被升降裝置。在一些實施例中,水平自動調整之升降系統10可以應用於電漿化學增強氣相沈積設備、原子層沈積設備或3D真空設備。The
圖2展示了圖1中之升降機構200及導向支承裝置100沿虛線a-a'之剖視圖之一部分。如圖2所示,升降機構200可以包含傳動裝置210,傳動裝置210設置在升降機構200之內部。傳動裝置210(例如,上端)連接至對應的電機300,並藉由第二連接部件201連接至對應的導向支承裝置100,以將電機300之動力傳輸至上述對應的導向支承裝置100。在一實施例中,傳動裝置210可以包含減速機、絲杠及絲杠螺母。FIG. 2 shows a part of the cross-sectional view of the
減速機係一種減速傳動裝置,其用於匹配轉速及傳遞轉矩。本申請案之減速機不受限制,可以使用任意適合類型之減速機。The reducer is a reduction transmission device, which is used to match the speed and transmit the torque. The speed reducer of the present application is not limited, and any suitable type of speed reducer can be used.
絲杠及絲杠螺母主要用於旋轉運動與直線運動之間的變換。絲杠及絲杠螺母可以根據需要選擇任何合適的類型。例如,如圖2所示,絲杠螺母可以選用梯形絲杠螺母211。在一實施例中,電機300藉由減速機使絲杠旋轉,從而使絲杠螺母向上或向下移動,連接至絲杠螺母之第二連接部件201亦隨之向上或向下移動,進而帶動對應的導向支承裝置100上升或下降,連接至導向支承裝置100之被升降裝置即可隨之上升或下降。Lead screws and lead screw nuts are mainly used for conversion between rotary motion and linear motion. Lead screw and lead screw nut can be selected according to any suitable type. For example, as shown in FIG. 2 , the lead screw nut can be a trapezoidal
圖3展示了圖1中之導向支承裝置100沿虛線b-b'之剖視圖,同時展示了連接至導向支承裝置100之升降機構200之外部輪廓。圖4A為圖3中用虛線圈出部分之局部放大圖。圖4B係圖4A中之碟形彈簧221及關節軸承222之示意圖。如圖3所示,將升降機構200連接至導向支承裝置100之第二連接部件201可以包含機械水平調整裝置220,其可用以調整導向支承裝置100之水平位置及鎖緊導向支承裝置100。機械水平調整裝置220設置在升降機構200之連接有導向支承裝置100之一側上。如圖3及圖4A所示,機械水平調整裝置220可以包含碟形彈簧221及關節軸承222。連接件之下端可穿過碟形彈簧221之中心而安置於關節軸承222中,從而實現升降機構200與導向支承裝置100之連接。在一些實施例中,關節軸承222包含分別設置在導向支承裝置100兩側之一對關節軸承,碟形彈簧221包含分別設置在導向支承裝置100兩側之兩組碟形彈簧。FIG. 3 shows a cross-sectional view of the guide and
如圖4B所示,碟形彈簧221呈圓錐形盤狀,其被壓縮後可以產生變形,承受一定的載荷。為實現較好的調整效果,碟形彈簧221可以成對設置。例如,在導向支承裝置100之每一側可以設置5對碟形彈簧221。碟形彈簧221之數量可根據載荷大小來選擇。碟形彈簧221可以進行一定程度之位移補償並鎖緊導向支承裝置100。在一些實施例中,在使蓋板500下降之過程中,為保證蓋板500與反應腔600緊密貼合,蓋板500之下落位移小於升降機構200中之絲杠輸出之當量位移。絲杠輸出之當量位移係指電機輸出一定功率時,絲杠螺母移動之位移。碟形彈簧221可以吸收位移過盈量並且因變形而鎖緊導向支承裝置100,以防止電機300過載,從而保護電機300。As shown in FIG. 4B , the
關節軸承222具有弧面,允許發生一定之軸向偏移。當複數個電機300不同步或者導向支承裝置100發生較小之傾斜時,關節軸承222可以對導向支承裝置100之位置進行微調,並藉由碟形彈簧221進行位移補償及鎖緊,以保證導向支承裝置100及升降機構200不會出現卡死現象。The
在蓋板500上升或下降之過程中,水平位置感測器400可以偵測蓋板500之傾斜度。在蓋板500之傾斜度超出水平位置感測器400之設定值時,需要進行水平調整,水平位置感測器400或其他裝置可基於水平位置感測器400之偵測結果產生控制信號,以調整電機300中之至少一者之輸出(例如,輸出功率或轉速)。在一實施例中,水平位置感測器400按照公式(1)計算電機300之電機脈衝輸出數,並將計算結果傳輸給需要調整之電機300,電機300根據電機脈衝輸出數自動調整其輸出功率及轉速,從而使得蓋板500平穩上升及下降。熟習此項技術者可以理解,水平位置感測器400亦可以採用其他形式之公式或計算方式。公式(1)When the
在公式(1)中,電機距離L為電機之間的距離,傾角為由水平位置感測器400偵測之蓋板相對於水平面之傾角,導程為絲杠之導程,減速比為減速機之減速比,步距角為電機300之步距角。各個電機可基於自水平位置感測器400傳輸之電機脈衝輸出數,獨立地調整其輸出功率及轉速。In the formula (1), the motor distance L is the distance between the motors, the inclination is the inclination of the cover detected by the
再參照圖1,根據本申請案之一些實施例,一種使用升降系統10之方法可以包含:控制複數個電機300,使複數個導向支承裝置100帶動被升降裝置(例如蓋板500)上升或下降;在上述被升降裝置上升或下降之過程中,藉由水平位置感測器400偵測上述被升降裝置之傾斜度,並基於偵測結果調整至少一個電機300之輸出(例如輸出功率或轉速)。Referring to FIG. 1 again, according to some embodiments of the present application, a method of using the
在一些實施例中,一種使用本申請案之升降系統之方法可以包含:藉由控制模組設定水平位置感測器之初始值以及電機之輸出功率及轉速;在電機之驅動下,升降機構藉由傳動裝置帶動導向支承裝置上升或下降,以使被升降裝置隨著導向支承裝置上升或下降;水平位置感測器偵測被升降裝置之水平度,並把偵測結果傳輸給電機;電機基於上述偵測結果獨立地自動調整其各自的輸出功率及轉速。當電機不同步或導向支承裝置發生較小傾斜時,機械水平調整裝置調整導向支承之水平位置。In some embodiments, a method of using the lifting system of the present application may include: setting the initial value of the horizontal position sensor and the output power and rotation speed of the motor through the control module; driven by the motor, the lifting mechanism uses The transmission device drives the guide support device to rise or fall, so that the lifted device rises or falls with the guide support device; the horizontal position sensor detects the level of the lifted device, and transmits the detection result to the motor; the motor is based on The above detection results automatically adjust their respective output power and rotational speed independently. When the motor is not synchronous or the guide support device is slightly tilted, the mechanical level adjustment device adjusts the horizontal position of the guide support.
相較於現有的升降系統,本申請案之水平自動調整之升降系統可以自動調整被升降裝置之水平,升降平穩,可重複性高,維護週期長,具有生產經濟價值。並且,本申請案之水平自動調整之升降系統可以允許電機之同步出現一定偏移量,並且在複數個電機不同步時使電機根據水平位置感測器之偵測結果自動調整其輸出功率及轉速,以實現電機同步。另外,本申請案之水平自動調整之升降系統可以使蓋板在下落後與反應腔緊密貼合,從而保證真空腔體。Compared with the existing lifting system, the automatic horizontal adjustment lifting system of this application can automatically adjust the level of the lifting device, the lifting is stable, the repeatability is high, the maintenance period is long, and it has economic value for production. In addition, the automatic horizontal adjustment lifting system of this application can allow a certain amount of deviation in the synchronization of the motors, and when the multiple motors are out of sync, the motors can automatically adjust their output power and speed according to the detection results of the horizontal position sensor , to achieve motor synchronization. In addition, the lifting system with automatic horizontal adjustment of the present application can make the cover closely fit the reaction chamber after falling, thereby ensuring the vacuum chamber.
本文中之描述經提供以使熟習此項技術者能夠進行或使用本發明。熟習此項技術者將易於顯而易見對本發明之各種修改,且本文中所定義之一般原理可應用於其他變化形式而不會脫離本發明之精神或範疇。因此,本發明不限於本文所述之實例及設計,而是被賦予與本文所揭示之原理及新穎特徵一致的最寬範疇。The description herein is provided to enable any person skilled in the art to make or use the invention. Various modifications to this invention will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other variations without departing from the spirit or scope of this invention. Thus, the invention is not limited to the examples and designs described herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
10:升降系統 100:導向支承裝置 101:第一連接部件 200:升降機構 201:第二連接部件 210:傳動裝置 211:梯形絲杠螺母 220:機械水平調整裝置 221:碟形彈簧 222:關節軸承 300:電機 400:水平位置感測器 500:蓋板 600:反應腔10: Lifting system 100: guide support device 101: the first connecting part 200: lifting mechanism 201: the second connecting part 210: transmission 211: trapezoidal screw nut 220: mechanical level adjustment device 221: disc spring 222: joint bearing 300: motor 400: Horizontal position sensor 500: cover plate 600: reaction chamber
本說明書中之揭示內容提及且包括以下各圖: 圖1係根據本申請案之一些實施例的水平自動調整之升降系統之總體示意圖; 圖2係圖1中之升降機構及導向支承裝置沿虛線a-a'之剖視圖之一部分; 圖3係圖1中之導向支承裝置沿虛線b-b'之剖視圖; 圖4A係圖3中用虛線圈出部分之局部放大圖; 圖4B係圖4A中之碟形彈簧及關節軸承之示意圖。 根據慣例,圖示中所說明之各種特徵可能並非按比例繪製。因此,為了清晰起見,可任意擴大或減小各種特徵之尺寸。圖示中所說明之各部件之形狀僅為例示性形狀,並非限定部件之實際形狀。另外,為了清楚起見,可簡化圖示中所說明之實施。因此,圖示可能並未說明給定設備或裝置之全部組件。最後,可貫穿說明書及圖示使用相同參考標號來表示相同特徵。The disclosure in this specification refers to and includes the following figures: Fig. 1 is the overall schematic diagram of the lifting system with automatic horizontal adjustment according to some embodiments of the present application; Fig. 2 is a part of the cross-sectional view of the lifting mechanism and the guide support device in Fig. 1 along the dotted line a-a'; Fig. 3 is the cross-sectional view of the guide support device in Fig. 1 along the dotted line bb'; Fig. 4A is a partially enlarged view of the part circled by a dotted line in Fig. 3; Fig. 4B is a schematic diagram of the disc spring and joint bearing in Fig. 4A. According to common practice, the various features illustrated in the drawings may not be drawn to scale. Accordingly, the dimensions of the various features may be arbitrarily expanded or reduced for clarity. The shapes of the components shown in the drawings are only illustrative shapes, and do not limit the actual shapes of the components. Additionally, the implementations illustrated in the figures may be simplified for clarity. Accordingly, a drawing may not illustrate all components of a given device or device. Finally, the same reference numerals may be used throughout the description and drawings to refer to the same features.
10:升降系統10: Lifting system
100:導向支承裝置100: guide support device
101:第一連接部件101: the first connecting part
200:升降機構200: lifting mechanism
201:第二連接部件201: the second connecting part
300:電機300: motor
400:水平位置感測器400: Horizontal position sensor
500:蓋板500: cover plate
600:反應腔600: reaction chamber
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Citations (6)
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TW457623B (en) * | 1997-12-15 | 2001-10-01 | Semitool Inc | Semiconductor processing apparatus having lift and tilt mechanism |
TWM248014U (en) * | 1998-06-29 | 2004-10-21 | Samsung Electronics Co Ltd | Elevator system for boat transfer with horizontality automatic control function |
US20100035526A1 (en) * | 1995-10-27 | 2010-02-11 | Applied Materials, Inc. | Chemical mechanical polishing system having multiple polishing stations and providing relative linear polishing motion |
CN109643684A (en) * | 2016-08-26 | 2019-04-16 | 韩华泰科株式会社 | Tilt plummer system |
US10359707B2 (en) * | 2013-10-30 | 2019-07-23 | Nikon Corporation | Substrate holding device, exposure apparatus, and device manufacturing method |
CN110692130A (en) * | 2017-05-31 | 2020-01-14 | 朗姆研究公司 | Detection system for adjustable/replaceable edge coupling ring |
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2020
- 2020-06-24 CN CN202010589131.3A patent/CN113830700A/en active Pending
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US20100035526A1 (en) * | 1995-10-27 | 2010-02-11 | Applied Materials, Inc. | Chemical mechanical polishing system having multiple polishing stations and providing relative linear polishing motion |
TW457623B (en) * | 1997-12-15 | 2001-10-01 | Semitool Inc | Semiconductor processing apparatus having lift and tilt mechanism |
TWM248014U (en) * | 1998-06-29 | 2004-10-21 | Samsung Electronics Co Ltd | Elevator system for boat transfer with horizontality automatic control function |
US10359707B2 (en) * | 2013-10-30 | 2019-07-23 | Nikon Corporation | Substrate holding device, exposure apparatus, and device manufacturing method |
CN109643684A (en) * | 2016-08-26 | 2019-04-16 | 韩华泰科株式会社 | Tilt plummer system |
CN110692130A (en) * | 2017-05-31 | 2020-01-14 | 朗姆研究公司 | Detection system for adjustable/replaceable edge coupling ring |
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