TWI789534B - Heat Peelable Adhesive Sheet - Google Patents

Abstract

The present invention provides a heat-peelable adhesive sheet, which can be suitably used in the processing of electronic component materials, and not only exhibits sufficient fixity for adherends whose adhered surfaces are flat, but also exhibits sufficient fixity for adherends with uneven surfaces. The attached body also showed sufficient fixity. The heat-peelable adhesive sheet of the present invention is a heat-peelable adhesive sheet with an adhesive layer, and the heat-peelable adhesive sheet includes an antistatic material, and the adhesive layer includes an adhesive and heat-expandable microspheres, constituting the adhesive layer. The base polymer contains a structural unit A derived from an alkyl (meth)acrylate having a side chain having a branched structure, and the content ratio of the structural unit A in the base polymer is 20% by weight or more.

Description

Heat Peelable Adhesive Sheet

The invention relates to a heat-peelable adhesive sheet.

Conventionally, when cutting the material of electronic parts, an adhesive sheet was used to fix the material. When this cutting is performed, the so-called chip fly, in which the electronic material that has been reduced into small pieces, falls off from the adhesive sheet and is scattered, may occur. In recent years, when processing electronic parts such as module parts and sensors, adhesive sheets are sometimes attached to uneven surfaces (such as encapsulating resin surfaces, electrode pattern surfaces, etc.), and the above-mentioned problem of chip scattering has become prominent. On the other hand, as an adhesive sheet used when cutting the material of an electronic component, the adhesive sheet which reduces adhesive force by heating is known (for example, patent document 1). When such an adhesive sheet is used, the adhesive force can be improved, and the peelability can be obtained to the extent that the workpiece can be peeled off well after cutting. However, such an adhesive sheet has a problem in that, although it exhibits specific fixability to a flat substrate, it does not exhibit sufficient fixability to a concave-convex substrate. [Prior Art Literature] [Patent Document] [Patent Document 1] Japanese Patent Laid-Open No. 2002-121510

[Problem to be solved by the invention] The adhesive force of the adhesive sheet can be improved, for example, by adding a tackifying resin to the adhesive layer. When the tackifying resin is added, the adhesive force of the adhesive layer itself is improved, and an adhesive sheet having sufficient fixability to an adherend whose adhered surface is flat can be obtained. However, even if such an adhesive sheet is used for an adherend having a fine uneven surface such as an electrode pattern surface, sufficient fixability cannot be obtained, and the above-mentioned problem of chip scattering cannot be solved. The present invention is made to solve the above-mentioned previous problems, and its object is to provide a heat-peelable adhesive sheet that can be suitably used in the processing of materials for electronic parts, and not only for the surface to be bonded. Adhesives with flat surface exhibit sufficient fixity, and also exhibit sufficient fixity for adherends with concave-convex surfaces. [Technical means to solve the problem] The heat-peelable adhesive sheet of the present invention is a heat-peelable adhesive sheet with an adhesive layer, and the heat-peelable adhesive sheet includes an antistatic material, and the adhesive layer includes an adhesive and heat-expandable microspheres, constituting the adhesive layer. The base polymer contains a structural unit A derived from an alkyl (meth)acrylate having a side chain having a branched structure, and the content ratio of the structural unit A in the base polymer is 20% by weight or more. In one embodiment, the adhesive layer includes the antistatic material. In one embodiment, the heat-peelable adhesive sheet of the present invention further includes a substrate, and the substrate includes the above-mentioned antistatic material. In one embodiment, the heat-peelable adhesive sheet of the present invention further includes an antistatic layer provided on the side of the substrate opposite to the adhesive layer, and the antistatic layer includes the antistatic material. In one embodiment, the heat-peelable adhesive sheet of the present invention further includes an antistatic layer provided between the base material and the adhesive layer, and the antistatic layer includes the antistatic material. In one embodiment, the carbon number of the side chain having a branched structure of the structural unit A is 5 or more. In one embodiment, the adhesive layer further includes a tackifying resin, and the content of the tackifying resin is 1 to 80 parts by weight relative to 100 parts by weight of the base polymer. In one embodiment, the heat-peelable adhesive sheet of the present invention has an adhesive force of 2 N/20 mm or more to a PET film. According to another embodiment of the present invention, a method of manufacturing an electronic component is provided. The manufacturing method of the electronic component includes the following steps: after attaching the electronic component material on the above-mentioned heat-peelable adhesive sheet, cutting the electronic component material. According to another embodiment of the present invention, an electronic component is provided. This electronic component is manufactured by the above-mentioned manufacturing method. [Effect of Invention] According to the present invention, by using the base polymer containing the structural unit A derived from the acrylic monomer having a side chain having a branched structure as the base polymer of the adhesive layer, excellent followability to uneven surfaces can be obtained. , and an adhesive sheet with sufficient adhesive force. Such an adhesive sheet can be suitably used as an adhesive sheet for fixing the material in the step of cutting the material of the electronic component, and can help prevent the chip from flying when cutting the material. Furthermore, the adhesive sheet of this invention is a heat-peelable adhesive sheet containing heat-expandable microspheres in an adhesive layer. The heat-peelable adhesive sheet of the present invention exhibits sufficient adhesive force in fixing the material of electronic parts when the material is processed (for example, cut), and exhibits appropriate peelability by heating after processing.

A. Overall structure of heat-peelable adhesive sheet Fig. 1 is a schematic sectional view of a heat-peelable adhesive sheet according to an embodiment of the present invention. The heat-peelable adhesive sheet 100 includes an adhesive layer 10 . The adhesive layer 10 includes an adhesive and a plurality of heat-expandable microspheres. The heat-peelable adhesive sheet of the present invention expands or foams the heat-expandable microspheres by heating, resulting in irregularities on the surface, resulting in reduced adhesive force, and exhibits appropriate peelability when the adherend needs to be peeled off. The heat-peelable adhesive sheet of the present invention having both adhesive force and peelability can be suitably used as an adhesive sheet for temporarily fixing the processed material when processing electronic component materials, for example. Furthermore, in this embodiment, the heat-peelable adhesive sheet 100 further includes a base material 20 . In the illustrated example, the example in which the adhesive layer 10 is disposed on one side of the base material 20 is shown, but the adhesive layer may be disposed on both sides of the base material. The above heat-peelable adhesive sheet contains an antistatic material. In one embodiment, the antistatic material is included in the adhesive layer. In addition, in other embodiments, the antistatic material is included in the base material. Antistatic materials may also be included in both the adhesive layer and the substrate. The details of the antistatic material will be described later. Fig. 2(a) and (b) are schematic cross-sectional views of a heat-peelable adhesive sheet according to still another embodiment of the present invention. The heat-peelable adhesive sheets 200 and 200 ′ further include an antistatic layer 30 . The antistatic layer 30 contains an antistatic material. The antistatic layer 30 can be disposed on the side of the substrate 20 opposite to the adhesive layer 10 ( FIG. 2( a )), or it can be disposed between the adhesive layer 10 and the substrate 20 ( FIG. 2( b )). Preferably, the antistatic layer is disposed on the side of the substrate opposite to the adhesive layer. Furthermore, when the adhesive layer is disposed on both sides of the base material, the above-mentioned antistatic layer can be disposed between the base material and the adhesive layer. In the heat-peelable adhesive sheet of the present invention, the structure unit A derived from an alkyl (meth)acrylate having a side chain having a branched structure (hereinafter also referred to as a side chain with a branched structure) is included as the basis When the polymer is used as the base polymer of the adhesive layer, an adhesive sheet having excellent followability to uneven surfaces and sufficient adhesive force can be obtained. On the other hand, the inventors of the present application discovered a new technology that, when an electronic component material is attached to an adhesive sheet having an adhesive layer composed of a base polymer containing a specific amount of structural unit A, the electronic component material is easily damaged. question. The present invention is an invention that can also solve the problem of this new technology. That is, the present invention provides a method that can improve the followability of the uneven surface and prevent damage to the electronic component material as the adherend by including an antistatic material. The invention of the heat-peelable adhesive sheet. The heat-peelable adhesive sheet of the present invention not only has excellent fixability to electronic component materials with a flat surface to be bonded, but also has excellent fixability to electronic component materials with various concave-convex surfaces, and can prevent the electronic component from being damaged. Wafer flying when material is supplied in the cutting step. In addition, the heat-peelable adhesive sheet of the present invention can prevent damage (such as short circuit) of the electronic component material as an adherend. Fig. 3 is a schematic sectional view of a heat-peelable adhesive sheet according to still another embodiment of the present invention. This heat-peelable adhesive sheet 300 further includes an elastic layer 40 . The elastic layer 40 can be disposed adjacent to the adhesive layer, and in one embodiment, as shown in the illustration, is disposed between the adhesive layer 10 and the substrate 20 . In addition, the elastic layer can also be provided on the opposite side of the base material to the adhesive layer, and can also be provided on both sides of the base material. By providing the elastic layer, the followability to an adherend having an uneven surface is improved. In addition, when the adhesive sheet provided with the elastic layer is heated during peeling, the deformation (expansion) of the adhesive layer in the plane direction is restricted, and the thickness direction is preferentially deformed. As a result, detachability improves. Furthermore, the above-mentioned antistatic material may also be included in the elastic layer. Although not shown, for the purpose of protecting the adhesive surface, the heat-peelable adhesive sheet of the present invention can be provided with a release liner on the outside of the adhesive layer until it is ready for use. The heat-peelable adhesive sheet of the present invention causes less peeling charge when the release liner is peeled off, and therefore can prevent damage (such as short circuit) of the electronic component material as the adherend. The adhesive force a1 at 23°C when the heat-peelable adhesive sheet of the present invention is attached to a polyethylene terephthalate (PET) film is preferably 2 N/20 mm or more, more preferably 3 N/20 mm mm to 20 N/20 mm, and more preferably 4 N/20 mm to 10 N/20 mm. If it is within such a range, a heat-peelable adhesive sheet useful as a temporary fixing sheet at the time of cutting electronic component materials and the like can be obtained. In this specification, the adhesive force means the adhesive force measured by the method based on JIS Z 0237:2000. The specific measurement method will be described later. Furthermore, the heat-peelable adhesive sheet of the present invention is an adhesive sheet whose adhesive force is lowered by heating, and the above-mentioned "adhesive force at 23°C" refers to the adhesive force before the adhesive force is lowered. The adhesive force a2 after attaching the adhesive surface of the heat-peelable adhesive sheet of the present invention to a polyethylene terephthalate film and heating is preferably 0.2 N/20 mm or less, more preferably 0.1 N/20 mm the following. In this specification, the heating of the heat-peelable adhesive sheet refers to heating at a temperature and time at which the heat-expandable microspheres expand or foam to reduce the adhesive force. This heating is, for example, heating at 70° C. to 270° C. for 1 minute to 10 minutes. The ratio of the adhesive force (ie, the adhesive force before heating (a1)) to the adhesive force after heating (a2) when the adhesive surface of the heat-peelable adhesive sheet of the present invention is attached to a polyethylene terephthalate film (a2/a1) is preferably at most 0.5, more preferably at most 0.1. The lower limit of (a2/a1) is preferably 0.0001, more preferably 0.0005. As described above, the heat-peelable adhesive sheet of the present invention generates irregularities on the adhesive surface by heating at a specific temperature. The surface roughness Ra of the adhesive surface after heating the heat-peelable adhesive sheet of the present invention is preferably at least 3 μm, more preferably at least 5 μm. If it is within such a range, the adhesive force will decrease or disappear after heating, and an adhesive sheet that can easily peel off the adherend can be obtained. Furthermore, the surface roughness Ra of the adhesive surface refers to the surface roughness Ra of the adhesive surface of the adhesive sheet after heating without an adherend. The surface roughness Ra can be measured based on JIS B 0601:1994. B. Antistatic material As the form of containing the above-mentioned antistatic material, for example: (1) The form contained in the adhesive layer as an additive, (2) The form contained in the base material as an additive, (3) The form contained in a layer (antistatic layer) different from the adhesive layer or base material, etc. Moreover, as an antistatic layer in form (3), the antistatic layer which consists of resin (form (3a)), the antistatic layer which consists of metal or a metal oxide (form (3b)), etc. are mentioned, for example. Preferably it is form (2) or (3), more preferably form (3a). Moreover, from a viewpoint of transparency, form (2) or (3a) can be preferably selected, and (3a) is more preferable. If the form (2) or (3a) contains an antistatic material, a heat-peelable adhesive sheet with excellent transparency (for example, light transmittance of 70% to 90%) can be obtained. Such a heat-peelable adhesive sheet can easily identify an adherend through the adhesive sheet. In the heat-peelable adhesive sheet of the present invention, the adhesive layer containing heat-expandable microspheres has optical turbidity, so it is preferable to increase the transparency of other members to increase the transparency of the heat-peelable adhesive sheet as a whole. In addition, if the form (1) or (3) is selected even if the antistatic material is not included in the base material, the leakage of the antistatic material over time can be prevented, and heat-peelable adhesive with excellent quality stability can be obtained. piece. Therefore, it is particularly preferable to include an antistatic material as in the form (3a). According to this form, a heat-peelable adhesive sheet excellent in transparency, quality stability, and the like can be obtained. In yet another embodiment, an aspect in which an antistatic material is included in the elastic layer, an aspect in which the base material itself functions as an antistatic material, such as a metal foil, is used as a base material.

The content ratio of the above-mentioned antistatic material can be adjusted according to the form of the antistatic material. The content ratio of the antistatic material is preferably 0.00001% by weight to 10% by weight, more preferably 0.0001% by weight to 5% by weight, based on the weight of the heat-peelable adhesive sheet.

B-1. The form in which the antistatic material is contained as an additive in the adhesive layer (form (1))

In the above aspect (1), the antistatic material is contained in the composition for forming an adhesive layer, and the adhesive layer containing the antistatic material is formed by forming the adhesive layer using the composition for forming an adhesive layer. In this case, the content ratio of the antistatic material in the adhesive layer is preferably 0.01 to 10 parts by weight, more preferably 0.05 parts by weight, relative to 100 parts by weight of the base polymer constituting the adhesive layer. ~5 parts by weight. If it is such a range, damage of the said electronic component material at the time of sticking to an electronic component material can be prevented.

As an antistatic material contained in the said composition for adhesive layer formation, a conductive polymer, an ionic liquid, etc. are mentioned, for example. Such antistatic materials may be used alone or in combination of two or more.

式(A)中，Ra表示碳數4～20之烴基，Rb及Rc分別獨立地表示氫或碳數1～16之烴基。再者，Ra、Rb及Rc可包含雜原子。此外，氮原子藉由雙鍵進行鍵合之情形時，不存在Rc。 式(B)中，Rd表示碳數2～20之烴基，Re、Rf及Rg分別獨立地表示氫或碳數1～16之烴基。Rd、Re、Rf及Rg可包含雜原子。 式(C)中，Rh表示碳數2～20之烴基，Ri、Rj及Rk分別獨立地表示氫或碳數1～16之烴基。Rh、Ri、Rj及Rk可包含雜原子。 式(D)中，Z表示氮、硫、或磷原子，Rl、Rm、Rn及Ro分別獨立地表示碳數1～20之烴基，且可包含雜原子。其中，Z為硫原子之情形時，不存在Ro。 式(E)中，Rp表示碳數1～18之烴基，且可包含雜原子。 作為式(A)表示之陽離子，可列舉吡啶鎓陽離子、哌啶鎓陽離子、吡咯烷鎓陽離子、具有吡咯啉骨架之陽離子、具有吡咯骨架之陽離子等。例如可列舉吡啶鎓陽離子、哌啶鎓陽離子、吡咯烷鎓陽離子、具有吡咯啉骨架之陽離子、具有吡咯骨架之陽離子等。作為具體例，例如可列舉：1-乙基吡啶鎓陽離子、1-丁基吡啶鎓陽離子、1-己基吡啶鎓陽離子、1-丁基-3-甲基吡啶鎓陽離子、1-丁基-4-甲基吡啶鎓陽離子、1-己基-3-甲基吡啶鎓陽離子、1-丁基-3,4-二甲基吡啶鎓陽離子等吡啶鎓陽離子；1-丙基哌啶鎓陽離子、1-戊基哌啶鎓陽離子、1,1-二甲基哌啶鎓陽離子、1-甲基-1-乙基哌啶鎓陽離子、1-甲基-1-丙基哌啶鎓陽離子、1-甲基-1-丁基哌啶鎓陽離子、1-甲基-1-戊基哌啶鎓陽離子、1-甲基-1-己基哌啶鎓陽離子、1-甲基-1-庚基哌啶鎓陽離子、1-乙基-1-丙基哌啶鎓陽離子、1-乙基-1-丁基哌啶鎓陽離子、1-乙基-1-戊基哌啶鎓陽離子、1-乙基-1-己基哌啶鎓陽離子、1-乙基-1-庚基哌啶鎓陽離子、1,1-二丙基哌啶鎓陽離子、1-丙基-1-丁基哌啶鎓陽離子、1,1-二丁基哌啶鎓陽離子等哌啶鎓陽離子；1,1-二甲基吡咯烷鎓陽離子、1-甲基-1-乙基吡咯烷鎓陽離子、1-甲基-1-丙基吡咯烷鎓陽離子、1-甲基-1-丁基吡咯烷鎓陽離子、1-甲基-1-戊基吡咯烷鎓陽離子、1-甲基-1-己基吡咯烷鎓陽離子、1-甲基-1-庚基吡咯烷鎓陽離子、1-乙基-1-丙基吡咯烷鎓陽離子、1-乙基-1-丁基吡咯烷鎓陽離子、1-乙基-1-戊基吡咯烷鎓陽離子、1-乙基-1-己基吡咯烷鎓陽離子、1-乙基-1-庚基吡咯烷鎓陽離子、1,1-二丙基吡咯烷鎓陽離子、1-丙基-1-丁基吡咯烷鎓陽離子、1,1-二丁基吡咯烷鎓陽離子等吡咯烷鎓陽離子；2-甲基-1-吡咯啉陽離子、1-乙基-2-苯基吲哚陽離子、1,2-二甲基吲哚陽離子、1-乙基咔唑陽離子等。 作為式(B)表示之陽離子，可列舉：咪唑鎓陽離子、四氫嘧啶鎓陽離子、二氫嘧啶鎓陽離子等。例如可列舉：咪唑鎓陽離子、四氫嘧啶鎓陽離子、二氫嘧啶鎓陽離子等。作為具體例，例如可列舉：1,3-二甲基咪唑鎓陽離子、1,3-二乙基咪唑鎓陽離子、1-乙基-3-甲基咪唑鎓陽離子、1-丁基-3-甲基咪唑鎓陽離子、1-己基-3-甲基咪唑鎓陽離子、1-辛基-3-甲基咪唑鎓陽離子、1-癸基-3-甲基咪唑鎓陽離子、1-十二烷基-3-甲基咪唑鎓陽離子、1-十四烷基-3-甲基咪唑鎓陽離子、1,2-二甲基-3-丙基咪唑鎓陽離子、1-乙基-2,3-二甲基咪唑鎓陽離子、1-丁基-2,3-二甲基咪唑鎓陽離子、1-己基-2,3-二甲基咪唑鎓陽離子等咪唑鎓陽離子；1,3-二甲基-1,4,5,6-四氫嘧啶鎓陽離子、1,2,3-三甲基-1,4,5,6-四氫嘧啶鎓陽離子、1,2,3,4-四甲基-1,4,5,6-四氫嘧啶鎓陽離子、1,2,3,5-四甲基-1,4,5,6-四氫嘧啶鎓陽離子等四氫嘧啶鎓陽離子；1,3-二甲基-1,4-二氫嘧啶鎓陽離子、1,3-二甲基-1,6-二氫嘧啶鎓陽離子、1,2,3-三甲基-1,4-二氫嘧啶鎓陽離子、1,2,3-三甲基-1,6-二氫嘧啶鎓陽離子、1,2,3,4-四甲基-1,4-二氫嘧啶鎓陽離子、1,2,3,4-四甲基-1,6-二氫嘧啶鎓陽離子等二氫嘧啶鎓陽離子等及1-丁基-3-甲基吡啶鎓雙醯亞胺等1-丁基-3-甲基吡啶鎓陽離子。 作為式(C)表示之陽離子，可列舉：吡唑鎓陽離子、二氫化吡唑鎓陽離子等。例如可列舉：吡唑鎓陽離子、二氫化吡唑鎓陽離子等。作為具體例，例如可列舉：1-甲基吡唑鎓陽離子、3-甲基吡唑鎓陽離子、1-乙基-2-甲基二氫化吡唑鎓陽離子等。 作為式(D)表示之陽離子，可列舉：四烷基銨陽離子、三烷基鋶陽離子、四烷基鏻陽離子等。此外，亦可使用該等陽離子之烷基之一部分經烯基、烷氧基、或環氧基取代之陽離子。此外，Rl、Rm、Rn及Ro如上所述為碳數1～20之烴基，較佳為碳數1～20之烷基。此外，Rl、Rm、Rn及Ro亦可為芳香環基或脂環基。作為式(D)表示之陽離子之具體例，可列舉：四烷基銨陽離子、三烷基鋶陽離子、四烷基鏻陽離子、或上述烷基之一部分經烯基、烷氧基、進而環氧基取代而成之陽離子等。作為具體例，例如可列舉：N,N-二甲基-N-乙基-N-丙基銨陽離子、N,N-二甲基-N-乙基-N-丁基銨陽離子、N,N-二甲基-N-乙基-N-戊基銨陽離子、N,N-二甲基-N-乙基-N-己基銨陽離子、N,N-二甲基-N-乙基-N-庚基銨陽離子、N,N-二甲基-N-乙基-N-壬基銨陽離子、N,N-二甲基-N,N-二丙基銨陽離子、N,N-二甲基-N-丙基-N-丁基銨陽離子、N,N-二甲基-N-丙基-N-戊基銨陽離子、N,N-二甲基-N-丙基-N-己基銨陽離子、N,N-二甲基-N-丙基-N-庚基銨陽離子、N,N-二甲基-N-丁基-N-己基銨陽離子、N,N-二甲基-N-丁基-N-庚基銨陽離子、N,N-二甲基-N-戊基-N-己基銨陽離子、N,N-二甲基-N,N-二己基銨陽離子、三甲基庚基銨陽離子、N,N-二乙基-N-甲基-N-丙基銨陽離子、N,N-二乙基-N-甲基-N-戊基銨陽離子、N,N-二乙基-N-甲基-N-庚基銨陽離子、N,N-二乙基-N-丙基-N-戊基銨陽離子、三乙基甲基銨陽離子、三乙基丙基銨陽離子、三乙基戊基銨陽離子、三乙基庚基銨陽離子、N,N-二丙基-N-甲基-N-乙基銨陽離子、N,N-二丙基-N-甲基-N-戊基銨陽離子、N,N-二丙基-N-丁基-N-己基銨陽離子、N,N-二丙基-N,N-二己基銨陽離子、N,N-二丁基-N-甲基-N-戊基銨陽離子、N,N-二丁基-N-甲基-N-己基銨陽離子、三辛基甲基銨陽離子、N-甲基-N-乙基-N-丙基-N-戊基銨陽離子、四甲基銨陽離子、四乙基銨陽離子、四丁基銨陽離子、四己基銨陽離子、三丁基乙基銨陽離子、三甲基癸基銨陽離子、N,N-二乙基-N-甲基-N-(2-甲氧基乙基)銨陽離子、縮水甘油基三甲基銨陽離子、二烯丙基二甲基銨陽離子等四烷基銨陽離子；三甲基鋶陽離子、三乙基鋶陽離子、三丁基鋶陽離子、三己基鋶陽離子、二乙基甲基鋶陽離子、二丁基乙基鋶陽離子、二甲基癸基鋶陽離子等三烷基鋶陽離子；四甲基鏻陽離子、四乙基鏻陽離子、四丁基鏻陽離子、四己基鏻陽離子、鏻陽離子、三乙基甲基鏻陽離子、三丁基乙基鏻陽離子、三甲基癸基鏻陽離子等四烷基鏻陽離子等。 於本發明中，於上述陽離子成分之中，就能獲得特別優異之抗靜電能之方面而言，較佳使用式(A)表示之陽離子(特別係1-乙基吡啶鎓陽離子、1-丁基吡啶鎓陽離子、1-己基吡啶鎓陽離子、1-丁基-3-甲基吡啶鎓陽離子、1-丁基-4-甲基吡啶鎓陽離子、1-己基-3-甲基吡啶鎓陽離子、1-丁基-3,4-二甲基吡啶鎓陽離子等吡啶鎓陽離子)、式(D)表示之陽離子(特別係三乙基甲基銨陽離子、三丁基乙基銨陽離子、三甲基癸基銨陽離子、二乙基甲基鋶陽離子、二丁基乙基鋶陽離子、二甲基癸基鋶陽離子、三乙基甲基鏻陽離子、三丁基乙基鏻陽離子、三甲基癸基鏻陽離子等非對稱之四烷基銨陽離子、三烷基鋶陽離子、四烷基鏻陽離子、或N,N-二乙基-N-甲基-N-(2-甲氧基乙基)銨陽離子、二烯丙基二甲基銨陽離子、縮水甘油基三甲基銨陽離子等)等。 作為式(E)表示之陽離子之具體例，可列舉具有例如甲基、乙基、丙基、丁基、己基、辛基、壬基、癸基、十二烷基、十三烷基、十四烷基、十八烷基等碳數1～18之烷基作為Rp之鋶鹽。 作為上述陰離子成分，只要能夠與上述陽離子成分一起形成離子性液體，則可使用任意適當之陰離子成分。例如可列舉：Cl^- 、Br^- 、I^- 、AlCl₄ ^- 、Al₂ Cl₇ ^- 、BF₄ ^- 、PF₆ ^- 、ClO₄ ^- 、NO₃ ^- 、CH₃ COO^- 、CF₃ COO^- 、CH₃ SO₃ ^- 、CF₃ SO₃ ^- 、(CF₃ SO₂ )₂ N^- 、(CF₃ SO₂ )₃ C^- 、AsF₆ ^- 、SbF₆ ^- 、NbF₆ ^- 、TaF₆ ^- 、F(HF)_n ^- 、(CN)₂ N^- 、C₄ F₉ SO₃ ^- 、(C₂ F₅ SO₂ )₂ N^- 、C₃ F₇ COO^- 、(CF₃ SO₂ )(CF₃ CO)N等。疏水性之陰離子成分具有不易滲出於黏著劑表面之傾向，就低污染性之觀點而言較佳使用。進而，包含氟原子之陰離子成分能夠獲得低熔點之離子性化合物，因此特別較佳使用。 本發明中之離子性液體可自上述陽離子成分與陰離子成分之組合中適當選擇並使用，例如可列舉：1-丁基吡啶鎓四氟硼酸鹽、1-丁基吡啶鎓六氟磷酸鹽、1-丁基-3-甲基吡啶鎓四氟硼酸鹽、1-丁基-3-甲基吡啶鎓三氟甲磺酸鹽、1-丁基-3-甲基吡啶鎓雙(三氟甲磺醯基)醯亞胺、1-丁基-3-甲基吡啶鎓雙(五氟乙磺醯基)醯亞胺、1-己基吡啶鎓四氟硼酸鹽、1,1-二甲基吡咯烷鎓雙(三氟甲磺醯基)醯亞胺、1-甲基-1-乙基吡咯烷鎓雙(三氟甲磺醯基)醯亞胺、1-甲基-1-丙基吡咯烷鎓雙(三氟甲磺醯基)醯亞胺、1-甲基-1-丁基吡咯烷鎓雙(三氟甲磺醯基)醯亞胺、1-甲基-1-戊基吡咯烷鎓雙(三氟甲磺醯基)醯亞胺、1-甲基-1-己基吡咯烷鎓雙(三氟甲磺醯基)醯亞胺、1-甲基-1-庚基吡咯烷鎓雙(三氟甲磺醯基)醯亞胺、1-乙基-1-丙基吡咯烷鎓雙(三氟甲磺醯基)醯亞胺、1-乙基-1-丁基吡咯烷鎓雙(三氟甲磺醯基)醯亞胺、1-乙基-1-戊基吡咯烷鎓雙(三氟甲磺醯基)醯亞胺、1-乙基-1-己基吡咯烷鎓雙(三氟甲磺醯基)醯亞胺、1-乙基-1-庚基吡咯烷鎓雙(三氟甲磺醯基)醯亞胺、1,1-二丙基吡咯烷鎓雙(三氟甲磺醯基)醯亞胺、1-丙基-1-丁基吡咯烷鎓雙(三氟甲磺醯基)醯亞胺、1,1-二丁基吡咯烷鎓雙(三氟甲磺醯基)醯亞胺、1-丙基哌啶鎓雙(三氟甲磺醯基)醯亞胺、1-戊基哌啶鎓雙(三氟甲磺醯基)醯亞胺、1,1-二甲基哌啶鎓雙(三氟甲磺醯基)醯亞胺、1-甲基-1-乙基哌啶鎓雙(三氟甲磺醯基)醯亞胺、1-甲基-1-丙基哌啶鎓雙(三氟甲磺醯基)醯亞胺、1-甲基-1-丁基哌啶鎓雙(三氟甲磺醯基)醯亞胺、1-甲基-1-戊基哌啶鎓雙(三氟甲磺醯基)醯亞胺、1-甲基-1-己基哌啶鎓雙(三氟甲磺醯基)醯亞胺、1-甲基-1-庚基哌啶鎓雙(三氟甲磺醯基)醯亞胺、1-乙基-1-丙基哌啶鎓雙(三氟甲磺醯基)醯亞胺、1-乙基-1-丁基哌啶鎓雙(三氟甲磺醯基)醯亞胺、1-乙基-1-戊基哌啶鎓雙(三氟甲磺醯基)醯亞胺、1-乙基-1-己基哌啶鎓雙(三氟甲磺醯基)醯亞胺、1-乙基-1-庚基哌啶鎓雙(三氟甲磺醯基)醯亞胺、1,1-二丙基哌啶鎓雙(三氟甲磺醯基)醯亞胺、1-丙基-1-丁基哌啶鎓雙(三氟甲磺醯基)醯亞胺、1,1-二丁基哌啶鎓雙(三氟甲磺醯基)醯亞胺、1,1-二甲基吡咯烷鎓雙(五氟乙磺醯基)醯亞胺、1-甲基-1-乙基吡咯烷鎓雙(五氟乙磺醯基)醯亞胺、1-甲基-1-丙基吡咯烷鎓雙(五氟乙磺醯基)醯亞胺、1-甲基-1-丁基吡咯烷鎓雙(五氟乙磺醯基)醯亞胺、1-甲基-1-戊基吡咯烷鎓雙(五氟乙磺醯基)醯亞胺、1-甲基-1-己基吡咯烷鎓雙(五氟乙磺醯基)醯亞胺、1-甲基-1-庚基吡咯烷鎓雙(五氟乙磺醯基)醯亞胺、1-乙基-1-丙基吡咯烷鎓雙(五氟乙磺醯基)醯亞胺、1-乙基-1-丁基吡咯烷鎓雙(五氟乙磺醯基)醯亞胺、1-乙基-1-戊基吡咯烷鎓雙(五氟乙磺醯基)醯亞胺、1-乙基-1-己基吡咯烷鎓雙(五氟乙磺醯基)醯亞胺、1-乙基-1-庚基吡咯烷鎓雙(五氟乙磺醯基)醯亞胺、1,1-二丙基吡咯烷鎓雙(五氟乙磺醯基)醯亞胺、1-丙基-1-丁基吡咯烷鎓雙(五氟乙磺醯基)醯亞胺、1,1-二丁基吡咯烷鎓雙(五氟乙磺醯基)醯亞胺、1-丙基哌啶鎓雙(五氟乙磺醯基)醯亞胺、1-戊基哌啶鎓雙(五氟乙磺醯基)醯亞胺、1,1-二甲基哌啶鎓雙(五氟乙磺醯基)醯亞胺、1-甲基-1-乙基哌啶鎓雙(五氟乙磺醯基)醯亞胺、1-甲基-1-丙基哌啶鎓雙(五氟乙磺醯基)醯亞胺、1-甲基-1-丁基哌啶鎓雙(五氟乙磺醯基)醯亞胺、1-甲基-1-戊基哌啶鎓雙(五氟乙磺醯基)醯亞胺、1-甲基-1-己基哌啶鎓雙(五氟乙磺醯基)醯亞胺、1-甲基-1-庚基哌啶鎓雙(五氟乙磺醯基)醯亞胺、1-乙基-1-丙基哌啶鎓雙(五氟乙磺醯基)醯亞胺、1-乙基-1-丁基哌啶鎓雙(五氟乙磺醯基)醯亞胺、1-乙基-1-戊基哌啶鎓雙(五氟乙磺醯基)醯亞胺、1-乙基-1-己基哌啶鎓雙(五氟乙磺醯基)醯亞胺、1-乙基-1-庚基哌啶鎓雙(五氟乙磺醯基)醯亞胺、1,1-二丙基哌啶鎓雙(五氟乙磺醯基)醯亞胺、1-丙基-1-丁基哌啶鎓雙(五氟乙磺醯基)醯亞胺、1,1-二丁基哌啶鎓雙(五氟乙磺醯基)醯亞胺、2-甲基-1-吡咯啉四氟硼酸鹽、1-乙基-2-苯基吲哚四氟硼酸鹽、1,2-二甲基吲哚四氟硼酸鹽、1-乙基咔唑四氟硼酸鹽、1-乙基-3-甲基咪唑鎓四氟硼酸鹽、1-乙基-3-甲基咪唑鎓乙酸鹽、1-乙基-3-甲基咪唑鎓三氟乙酸鹽、1-乙基-3-甲基咪唑鎓七氟丁酸鹽、1-乙基-3-甲基咪唑鎓三氟甲磺酸鹽、1-乙基-3-甲基咪唑鎓全氟丁磺酸鹽、1-乙基-3-甲基咪唑鎓雙氰胺鹽、1-乙基-3-甲基咪唑鎓雙(三氟甲磺醯基)醯亞胺、1-乙基-3-甲基咪唑鎓雙(五氟乙磺醯基)醯亞胺、1-乙基-3-甲基咪唑鎓三(三氟甲磺醯基)甲基化物、1-丁基-3-甲基咪唑鎓四氟硼酸鹽、1-丁基-3-甲基咪唑鎓六氟磷酸鹽、1-丁基-3-甲基咪唑鎓三氟乙酸鹽、1-丁基-3-甲基咪唑鎓七氟丁酸鹽、1-丁基-3-甲基咪唑鎓三氟甲磺酸鹽、1-丁基-3-甲基咪唑鎓全氟丁磺酸鹽、1-丁基-3-甲基咪唑鎓雙(三氟甲磺醯基)醯亞胺、1-己基-3-甲基咪唑鎓溴化物、1-己基-3-甲基咪唑鎓氯化物、1-己基-3-甲基咪唑鎓四氟硼酸鹽、1-己基-3-甲基咪唑鎓六氟磷酸鹽、1-己基-3-甲基咪唑鎓三氟甲磺酸鹽、1-辛基-3-甲基咪唑鎓四氟硼酸鹽、1-辛基-3-甲基咪唑鎓六氟磷酸鹽、1-己基-2,3-二甲基咪唑鎓四氟硼酸鹽、1,2-二甲基-3-丙基咪唑鎓雙(三氟甲磺醯基)醯亞胺、1-甲基吡唑鎓四氟硼酸鹽、3-甲基吡唑鎓四氟硼酸鹽、N,N-二甲基-N-乙基-N-丙基銨雙(三氟甲磺醯基)醯亞胺、N,N-二甲基-N-乙基-N-丁基銨雙(三氟甲磺醯基)醯亞胺、N,N-二甲基-N-乙基-N-戊基銨雙(三氟甲磺醯基)醯亞胺、N,N-二甲基-N-乙基-N-己基銨雙(三氟甲磺醯基)醯亞胺、N,N-二甲基-N-乙基-N-庚基銨雙(三氟甲磺醯基)醯亞胺、N,N-二甲基-N-乙基-N-壬基銨雙(三氟甲磺醯基)醯亞胺、N,N-二甲基-N,N-二丙基銨雙(三氟甲磺醯基)醯亞胺、N,N-二甲基-N-丙基-N-丁基銨雙(三氟甲磺醯基)醯亞胺、N,N-二甲基-N-丙基-N-戊基銨雙(三氟甲磺醯基)醯亞胺、N,N-二甲基-N-丙基-N-己基銨雙(三氟甲磺醯基)亞胺鹽、N,N-二甲基-N-丙基-N-庚基銨雙(三氟甲磺醯基)醯亞胺、N,N-二甲基-N-丁基-N-己基銨雙(三氟甲磺醯基)醯亞胺、N,N-二甲基-N-丁基-N-庚基銨雙(三氟甲磺醯基)醯亞胺、N,N-二甲基-N-戊基-N-己基銨雙(三氟甲磺醯基)醯亞胺、N,N-二甲基-N,N-二己基銨雙(三氟甲磺醯基)醯亞胺、三甲基庚基銨雙(三氟甲磺醯基)醯亞胺、N,N-二乙基-N-甲基-N-丙基銨雙(三氟甲磺醯基)醯亞胺、N,N-二乙基-N-甲基-N-戊基銨雙(三氟甲磺醯基)醯亞胺、N,N-二乙基-N-甲基-N-庚基銨雙(三氟甲磺醯基)醯亞胺、N,N-二乙基-N-丙基-N-戊基銨雙(三氟甲磺醯基)醯亞胺、三乙基丙基銨雙(三氟甲磺醯基)醯亞胺、三乙基戊基銨雙(三氟甲磺醯基)醯亞胺、三乙基庚基銨雙(三氟甲磺醯基)醯亞胺、N,N-二丙基-N-甲基-N-乙基銨雙(三氟甲磺醯基)醯亞胺、N,N-二丙基-N-甲基-N-戊基銨雙(三氟甲磺醯基)醯亞胺、N,N-二丙基-N-丁基-N-己基銨雙(三氟甲磺醯基)醯亞胺、N,N-二丙基-N,N-二己基銨雙(三氟甲磺醯基)醯亞胺、N,N-二丁基-N-甲基-N-戊基銨雙(三氟甲磺醯基)醯亞胺、N,N-二丁基-N-甲基-N-己基銨雙(三氟甲磺醯基)醯亞胺、三辛基甲基銨雙(三氟甲磺醯基)醯亞胺、N-甲基-N-乙基-N-丙基-N-戊基銨雙(三氟甲磺醯基)醯亞胺、1-丁基吡啶鎓(三氟甲磺醯基)三氟乙醯胺、1-丁基-3-甲基吡啶鎓(三氟甲磺醯基)三氟乙醯胺、1-乙基-3-甲基咪唑鎓(三氟甲磺醯基)三氟乙醯胺、四己基銨雙(三氟甲磺醯基)醯亞胺、二烯丙基二甲基銨四氟硼酸鹽、二烯丙基二甲基銨三氟甲磺酸鹽、二烯丙基二甲基銨雙(三氟甲磺醯基)醯亞胺、二烯丙基二甲基銨雙(五氟乙磺醯基)醯亞胺、N,N-二乙基-N-甲基-N-(2-甲氧基乙基)銨四氟硼酸鹽、N,N-二乙基-N-甲基-N-(2-甲氧基乙基)銨三氟甲磺酸鹽、N,N-二乙基-N-甲基-N-(2-甲氧基乙基)銨雙(三氟甲磺醯基)醯亞胺、N,N-二乙基-N-甲基-N-(2-甲氧基乙基)銨雙(五氟乙磺醯基)醯亞胺、縮水甘油基三甲基銨三氟甲磺酸鹽、縮水甘油基三甲基銨雙(三氟甲磺醯基)醯亞胺、縮水甘油基三甲基銨雙(五氟乙磺醯基)醯亞胺、二烯丙基二甲基雙(五氟乙磺醯基)醯亞胺等。 作為離子性液體之合成方法，只要能夠獲得作為目標之離子性液體，則無特別限定，通常，可使用文獻「離子性液體-開發之最前線與未來-」[CMC股份有限公司出版發行]中記載之鹵化物法、氫氧化物法、酸酯法、錯合法、或中和法等。此外，亦可採用市售之離子性液體。 (導電性聚合物) 作為上述導電性聚合物，只要能夠獲得本發明之效果則可使用任意適當之聚合物。例如可列舉聚噻吩、聚苯胺、聚吡咯等。 B-2.抗靜電材料作為添加物包含於基材中之形態(形態(2)) 作為上述形態(2)中使用之抗靜電材料，只要能夠獲得本發明之效果則可使用任意適當之抗靜電材料。例如可使用B-1項中記載之導電性聚合物、後述B-3項中記載之抗靜電劑等。 上述形態(2)中，抗靜電材料之含有比率相對於基材之總重量較佳為20重量%以下，更佳為0.05重量%～10重量%。 作為使基材中含有抗靜電材料之方法，只要係上述抗靜電材料能夠均勻混合於基材所使用之樹脂中之方法則無特別限定，例如可列舉使用加熱輥、班伯里混合機、加壓捏合機、雙螺桿混練機等使其包含於基材中之方法。 B-3.抗靜電材料包含於與黏著劑層或基材不同之層(抗靜電層)中之形態(形態(3)) 如上所述，作為形態(3)中之抗靜電層，例如可列舉包含樹脂之抗靜電層(形態(3a))、由金屬或金屬氧化物構成之抗靜電層(形態(3b))等。 上述抗靜電層之表面電阻率較佳為1.0×10¹³ Ω/□以下，更佳為1.0×10¹² Ω/□以下，進而較佳為1.0×10¹¹ Ω/□以下。若為此種範圍，則於貼附於電子零件材料時，能夠防止該電子零件材料之損傷。表面電阻率可基於JIS K 6911來測定(於23℃/50%氣氛下、電極面積：20 cm² 、施加電壓：500 V、施加時間：30秒、使用同心圓電極(探針))。 ＜包含樹脂之抗靜電層(形態(3a))＞ 於一實施形態中，抗靜電層包含抗靜電材料及黏著劑樹脂(形態(3a-1))。 於該實施形態(形態(3a-1))中，作為上述抗靜電層中所含之抗靜電材料，例如可列舉：四級銨鹽、吡啶鎓鹽、具有第1、第2、第3胺基等陽離子性官能基之陽離子型抗靜電劑；磺酸鹽、或硫酸酯鹽、膦酸鹽、磷酸酯鹽等具有陰離子性官能基之陰離子型抗靜電劑；烷基甜菜鹼及其衍生物、咪唑啉及其衍生物、丙胺酸及其衍生物等兩性離子型抗靜電劑；胺基醇及其衍生物、甘油及其衍生物、聚乙二醇及其衍生物等非離子型抗靜電劑；使具有上述陽離子型、陰離子型、兩性離子型之離子導電性基之單體聚合或共聚而獲得之離子導電性聚合物等。該等化合物可單獨使用，亦可混合使用2種以上。 作為上述陽離子型之抗靜電劑之具體例，例如可列舉：烷基三甲基銨鹽、醯氧基醯胺丙基三甲基銨甲基硫酸鹽、烷基苄基甲基銨鹽、醯基氯化膽鹼、聚甲基丙烯酸二甲基胺基乙酯等具有四級銨基之(甲基)丙烯酸酯共聚物、聚乙烯基苄基三甲基氯化銨等具有四級銨基之苯乙烯共聚物、聚二烯丙基二甲基氯化銨等具有四級銨基之二烯丙基胺共聚物等。該等化合物可單獨使用，另外亦可混合使用2種以上。 作為上述陰離子型之抗靜電劑之具體例，例如可列舉：烷基磺酸鹽、烷基苯磺酸鹽、烷基硫酸酯鹽、烷基乙氧基硫酸酯鹽、烷基磷酸酯鹽、含磺酸基之苯乙烯共聚物等。該等化合物可單獨使用，另外亦可混合使用2種以上。 作為上述兩性離子型之抗靜電劑之具體例，例如可列舉烷基甜菜鹼、烷基咪唑鎓甜菜鹼、羧基甜菜鹼(carbobetaine)接枝共聚物等。該等化合物可單獨使用，另外亦可混合使用2種以上。 作為上述非離子型之抗靜電劑之具體例，例如可列舉：脂肪酸烷醇醯胺、二(2-羥基乙基)烷基胺、聚氧乙烯烷基胺、脂肪酸甘油酯、聚氧乙烯二醇脂肪酸酯、山梨糖醇酐脂肪酸酯、聚氧山梨糖醇酐脂肪酸酯、聚氧乙烯烷基苯基醚、聚氧乙烯烷基醚、聚乙二醇、聚氧乙烯二胺、包含聚醚與聚酯與聚醯胺之共聚物、甲氧基聚乙二醇(甲基)丙烯酸酯等。該等化合物可單獨使用，另外亦可混合使用2種以上。 作為構成上述抗靜電層之黏著劑樹脂，可使用任意適當之樹脂。例如可列舉：聚酯系樹脂、丙烯酸系樹脂、聚乙烯系樹脂、胺基甲酸酯系樹脂、三聚氰胺系樹脂、環氧系樹脂等。此外，亦可併用交聯劑。作為交聯劑，例如可列舉：羥甲基化或者烷基醇化之三聚氰胺系化合物、尿素系化合物、乙二醛系化合物、丙烯醯胺系化合物、環氧系化合物、異氰酸酯系化合物等。 於其他實施形態中，上述抗靜電層由導電性聚合物形成(形態(3a-2))。作為導電性聚合物，只要能獲得本發明之效果則可使用任意適當之聚合物。例如可列舉聚噻吩、聚苯胺、聚吡咯等。 作為包含樹脂(黏著劑樹脂、導電性聚合物)之抗靜電層之形成方法，例如可列舉如下之方法：將用任意適當之溶劑對上述抗靜電材料與黏著劑樹脂進行稀釋而調製之抗靜電層形成用組合物、或用任意適合之溶劑對上述導電性聚合物進行稀釋而調製之抗靜電層形成用組合物塗佈於基材、黏著劑層或彈性層並進行乾燥之方法。 作為上述塗覆液中使用之溶劑，可列舉：水；甲基乙基酮、丙酮、乙酸乙酯、四氫呋喃、二

烷、環己酮、正己烷、甲苯、二甲苯、甲醇、乙醇、正丙醇、異丙醇等有機溶劑等。該等溶劑可單獨使用，亦可混合使用2種以上。 作為上述塗覆液之塗佈方法，可採用任意適當之方法。例如可列舉：輥塗法、凹版塗佈法、逆轉輥塗佈法、輥刷法、噴塗法、氣刀塗佈法、浸漬法、簾幕塗佈法等。 包含樹脂之抗靜電層之厚度較佳為0.01 μm～5 μm，更佳為0.03 μm～1 μm。於該抗靜電層之厚度未達0.01 μm時，有不能穩定表現出抗靜電功能之虞。此外，於抗靜電層之厚度大於5 μm時，有產生由塗佈不均等引起之外觀不良之虞。 ＜由金屬或金屬氧化物構成之抗靜電層(形態(3b))＞ 上述形態(3b)中，抗靜電層只要能獲得本發明之效果則可由任意適當之金屬或金屬氧化物形成。作為金屬，例如可列舉：銦、錫、銻、金、銀、銅、鋁、鎳、鉻、鈦、鐵、鈷、碘化銅、及該等之合金或混合物。其中較佳為鋁。此外，作為金屬氧化物，例如可列舉氧化銦錫、氧化銦鋅、氧化錫、氧化銻、氧化銦等。 作為由金屬或金屬氧化物構成之抗靜電層之形成方法，例如可列舉：真空蒸鍍法、濺射法、離子鍍法、化學蒸鍍法、噴霧熱解法、化學鍍法、電鍍法等。此外，亦可將金屬膜或金屬氧化物膜層積層於基材、黏著劑層或彈性層，形成抗靜電層。 由金屬或金屬氧化物構成之抗靜電層之厚度較佳為2 nm～1000 nm，更佳為5 nm～500 nm。 C.黏著劑層 上述黏著劑層較佳為包含黏著劑與熱膨脹性微球。此外，黏著劑層如B項中所說明般亦可包含抗靜電材料。 上述黏著劑層之厚度較佳為300 μm以下，更佳為5 μm～150 μm，進而較佳為10 μm～100 μm。黏著劑層之厚度大於300 μm時，有產生如下之不良情況之虞：使用設備受到限制、生產性顯著降低、供於切割等切斷步驟時之加工精度(切斷面之直線性、晶片缺口等)降低等不良情況。 上述黏著劑層之於25℃下利用奈米壓痕法測定之彈性模數較佳為0.1 MPa～100 MPa，更佳為0.5 MPa～50 MPa，進而較佳為0.8 MPa～30 MPa。利用奈米壓痕法測定之彈性模數係指：遍及負載時、卸載時而連續測定將壓頭壓入至試樣(黏著面)時之對壓頭之負載荷重與壓入深度，由獲得之負載荷重-壓入深度曲線求出之彈性模數。本說明書中，利用奈米壓痕法測定之彈性模數係指將測定條件設為荷重：1 mN、負載・卸載速度：0.1 mN/s、保持時間：1 s，並如上所述進行測定而成之彈性模數。此外，黏著劑層之利用奈米壓痕法測定之彈性模數係指選擇不存在熱膨脹性微球之部分並利用上述測定方法測定之彈性模數，即黏著劑之彈性模數。 上述黏著劑層包含抗靜電材料時，黏著劑層之表面電阻率較佳為1.0×10¹³ Ω/□以下，更佳為1.0×10¹² Ω/□以下，進而較佳為1.0×10¹¹ Ω/□以下。若為此種範圍，則於貼附於電子零件材料時，能夠防止該電子零件材料之損傷。 (黏著劑) 作為上述黏著劑，較佳使用丙烯酸系黏著劑。作為丙烯酸系黏著劑，例如可列舉：將使用(甲基)丙烯酸烷基酯之1種或2種以上作為單體成分而成之丙烯酸系聚合物(均聚物或共聚物)作為基礎聚合物之丙烯酸系黏著劑等。 構成上述黏著劑之基礎聚合物包含源自具有支鏈結構側鏈之(甲基)丙烯酸烷基酯之結構單元A。作為基礎聚合物，藉由使用包含結構單元A之聚合物，能夠獲得黏著力優異、且凹凸追隨性優異之熱剝離型黏著片。若將此種熱剝離型黏著片用於電子零件材料之切斷步驟時之臨時固定用，則能夠防止該材料之晶片飛散。 上述基礎聚合物中，結構單元A之含有比率較佳為20重量%以上，更佳為25重量%～99重量%，進而較佳為55重量%～99重量%。若為此種範圍，則上述效果(高黏著力、高凹凸追隨性)變顯著。 上述結構單元A之支鏈結構側鏈之碳數較佳為5以上，更佳為6～18，進而較佳為8～18。若於此種範圍時，則上述效果(高黏著力、高凹凸追隨性)變顯著。 作為構成上述結構單元A之(甲基)丙烯酸烷基酯，例如可列舉：(甲基)丙烯酸異丁酯、(甲基)丙烯酸第二丁酯、(甲基)丙烯酸第三丁酯、(甲基)丙烯酸2-乙基己酯、(甲基)丙烯酸異辛酯、(甲基)丙烯酸異壬酯、(甲基)丙烯酸異癸酯、(甲基)丙烯酸2-乙基丁酯、(甲基)丙烯酸2-甲基丁酯等。 於上述結構單元A中，構成支鏈結構側鏈之烷基之碳數較佳為5以上，更佳為6～18，進而較佳為8～18。若為此種範圍，則上述效果(高黏著力、高凹凸追隨性)變顯著。 作為構成上述結構單元A之(甲基)丙烯酸烷基酯以外之(甲基)丙烯酸烷基酯，例如可列舉：(甲基)丙烯酸甲酯、(甲基)丙烯酸乙酯、(甲基)丙烯酸丙酯、(甲基)丙烯酸丁酯、(甲基)丙烯酸戊酯、(甲基)丙烯酸己酯、(甲基)丙烯酸庚酯、(甲基)丙烯酸辛酯、(甲基)丙烯酸壬酯、(甲基)丙烯酸癸酯、(甲基)丙烯酸二十烷基酯等。可較佳使用具有碳數為1～18之直鏈狀烷基之(甲基)丙烯酸烷基酯。 上述基礎聚合物(丙烯酸系聚合物)就改質凝聚力、耐熱性、交聯性等為目的，根據需要可包含對應於能與上述(甲基)丙烯酸烷基酯共聚之其他單體成分之單元。作為此種單體成分，例如可列舉：丙烯酸、甲基丙烯酸、丙烯酸羧基乙酯、丙烯酸羧基戊酯、衣康酸、馬來酸、富馬酸、巴豆酸等含羧基之單體；馬來酸酐、衣康酸酐等酸酐單體；(甲基)丙烯酸羥基乙酯、(甲基)丙烯酸羥基丙酯、(甲基)丙烯酸羥基丁酯、(甲基)丙烯酸羥基己酯、(甲基)丙烯酸羥基辛酯、(甲基)丙烯酸羥基癸酯、(甲基)丙烯酸羥基月桂酯、甲基丙烯酸(4-羥甲基環己基)甲酯等含羥基之單體；苯乙烯磺酸、烯丙基磺酸、2-(甲基)丙烯醯胺-2-甲基丙磺酸、(甲基)丙烯醯胺丙磺酸、(甲基)丙烯酸磺丙酯、(甲基)丙烯醯氧基萘磺酸等含磺酸基之單體；(甲基)丙烯醯胺、N,N-二甲基(甲基)丙烯醯胺、N-丁基(甲基)丙烯醯胺、N-羥甲基(甲基)丙烯醯胺、N-羥甲基丙烷(甲基)丙烯醯胺等(N-取代)醯胺系單體；(甲基)丙烯酸胺基乙酯、(甲基)丙烯酸N,N-二甲基胺基乙酯、(甲基)丙烯酸第三丁基胺基乙酯等(甲基)丙烯酸胺基烷基酯系單體；(甲基)丙烯酸甲氧基乙酯、(甲基)丙烯酸乙氧基乙酯等(甲基)丙烯酸烷氧基烷基酯系單體；N-環己基馬來醯亞胺、N-異丙基馬來醯亞胺、N-月桂基馬來醯亞胺、N-苯基馬來醯亞胺等馬來醯亞胺系單體；N-甲基衣康醯亞胺、N-乙基衣康醯亞胺、N-丁基衣康醯亞胺、N-辛基衣康醯亞胺、N-2-乙基己基衣康醯亞胺、N-環己基衣康醯亞胺、N-月桂基衣康醯亞胺等衣康醯亞胺系單體；N-(甲基)丙烯醯氧基亞甲基琥珀醯亞胺、N-(甲基)丙烯醯基-6-氧基六亞甲基琥珀醯亞胺、N-(甲基)丙烯醯基-8-氧基八亞甲基琥珀醯亞胺等琥珀醯亞胺系單體；乙酸乙烯酯、丙酸乙烯酯、N-乙烯基吡咯烷酮、甲基乙烯基吡咯烷酮、乙烯基吡啶、乙烯基哌啶酮、乙烯基嘧啶、乙烯基哌嗪、乙烯基吡嗪、乙烯基吡咯、乙烯基咪唑、乙烯基噁唑、乙烯基嗎啉、N-乙烯基羧醯胺類、苯乙烯、α-甲基苯乙烯、N-乙烯基己內醯胺等乙烯系單體；丙烯腈、甲基丙烯腈等氰基丙烯酸酯單體；(甲基)丙烯酸縮水甘油酯等含環氧基丙烯酸系單體；(甲基)丙烯酸聚乙二醇酯、(甲基)丙烯酸聚丙二醇酯、(甲基)丙烯酸甲氧基乙二醇酯、(甲基)丙烯酸甲氧基聚丙二醇酯等二醇系丙烯酸酯單體；(甲基)丙烯酸四氫糠酯、氟(甲基)丙烯酸酯、有機矽(甲基)丙烯酸酯等具有雜環、鹵原子、矽原子等之丙烯酸酯系單體；己二醇二(甲基)丙烯酸酯、(聚)乙二醇二(甲基)丙烯酸酯、(聚)丙二醇二(甲基)丙烯酸酯、新戊二醇二(甲基)丙烯酸酯、季戊四醇二(甲基)丙烯酸酯、三羥甲基丙烷三(甲基)丙烯酸酯、季戊四醇三(甲基)丙烯酸酯、二季戊四醇六(甲基)丙烯酸酯、環氧丙烯酸酯、聚酯丙烯酸酯、胺基甲酸酯丙烯酸酯等多官能單體；異戊二烯、丁二烯、異丁烯等烯烴系單體；乙烯醚等乙烯醚系單體等。該等單體成分可單獨使用或組合使用2種以上。 關於上述與其他單體成分對應之單元之含有比率，相對於基礎聚合物100重量份，較佳為1重量份～20重量份，更佳為2重量份～15重量份，進而較佳為2重量份～10重量份。若為此種範圍，則能夠兼顧對被接著體之凹凸追隨性、黏著力、加熱剝離性之特性。 上述黏著劑根據需要可包含任意適當之添加劑。作為該添加劑，例如可列舉：交聯劑、增黏劑、增塑劑(例如偏苯三酸酯系增塑劑、均苯四酸酯系增塑劑)、顏料、染料、填充劑、抗老化劑、導電材料、紫外線吸收劑、光穩定劑、剝離調整劑、軟化劑、界面活性劑、阻燃劑、抗氧化劑等。 作為上述增黏劑，使用任意適當之增黏劑。作為增黏劑，例如使用增黏樹脂。作為增黏樹脂之具體例，可列舉：松香系增黏樹脂(例如未改性松香、改性松香、松香酚系樹脂、松香酯系樹脂等)、萜烯系增黏樹脂(例如萜烯系樹脂、萜烯酚系樹脂、苯乙烯改性萜烯系樹脂、芳香族改性萜烯系樹脂、氫化萜烯系樹脂)、烴系增黏樹脂(例如脂肪族系烴樹脂、脂肪族系環狀烴樹脂、芳香族系烴樹脂(例如苯乙烯系樹脂、二甲苯系樹脂等)、脂肪族・芳香族系石油樹脂、脂肪族・脂環族系石油樹脂、氫化烴樹脂、香豆酮系樹脂、香豆酮茚系樹脂等)、酚系增黏樹脂(例如烷基酚系樹脂、二甲苯甲醛系樹脂、甲酚樹脂、酚醛清漆等)、酮系增黏樹脂、聚醯胺系增黏樹脂、環氧系增黏樹脂、彈性體系增黏樹脂等。其中較佳為松香系增黏樹脂、萜烯系增黏樹脂或酚系增黏樹脂。特別較佳為松香酚系增黏樹脂及萜烯酚系增黏樹脂。該等增黏劑與基礎聚合物表現出較良好之相容性，因此，利用使用該增黏劑獲得之黏著劑，能夠獲得穩定之凹凸追隨性。其結果，能夠獲得晶片飛散之抑制優異之熱剝離型黏著片。增黏劑可單獨使用或組合使用2種以上。 上述增黏劑可使用市售品。作為市售品之增黏劑之具體例，可列舉：YASUHARA CHEMICAL公司製造之商品名「YS polystar S145」、「Mighty Ace K140」、荒川化學公司製造之商品名「Tamanol 901」等萜烯酚樹脂；住友電木公司製造之商品名「SUMILITERESIN PR-12603」、荒川化學公司製造之商品名「Tamanol 361」等松香酚樹脂；荒川化學公司製造之商品名「Tamanol 1010R」、「Tamanol 200N」等烷基酚樹脂；荒川化學公司製造之商品名「Alcon P-140」等脂環族系飽和烴樹脂等。 關於上述增黏劑之含量，相對於基礎聚合物100重量份，較佳為1重量份～80重量份，更佳為5重量份～70重量份，進而較佳為10重量份～50重量份，特別較佳為10重量份～40重量份。藉由添加增黏劑，能夠提高黏著力。另一方面，增黏劑之添加係阻礙黏著片之凹凸追隨性之主要原因，但於本發明中，藉由如上所述由具有源自特定之單體之結構單元A之基礎聚合物形成黏著劑層，能夠兼顧凹凸追隨性與高黏著力。 作為上述交聯劑，例如可列舉：異氰酸酯系交聯劑、環氧系交聯劑、三聚氰胺系交聯劑、過氧化物系交聯劑、以及尿素系交聯劑、金屬醇鹽系交聯劑、金屬螯合劑系交聯劑、金屬鹽系交聯劑、碳二亞胺系交聯劑、噁唑啉系交聯劑、氮雜環丙烷系交聯劑、胺系交聯劑等。其中較佳為異氰酸酯系交聯劑或環氧系交聯劑。 作為上述異氰酸酯系交聯劑之具體例，可列舉：伸丁基二異氰酸酯、六亞甲基二異氰酸酯等低級脂肪族聚異氰酸酯類；伸環戊基二異氰酸酯、伸環己基二異氰酸酯、異佛爾酮二異氰酸酯等脂環族異氰酸酯類；2,4-甲苯二異氰酸酯、4,4'-二苯基甲烷二異氰酸酯、二甲苯二異氰酸酯等芳香族異氰酸酯類；三羥甲基丙烷/甲苯二異氰酸酯3聚體加成物(日本聚胺酯工業公司製造，商品名「CORONATE L」)、三羥甲基丙烷/六亞甲基二異氰酸酯3聚物加成物(日本聚胺酯工業公司製造，商品名「CORONATE HL」)、六亞甲基二異氰酸酯之異氰脲酸酯體(日本聚胺酯工業公司製造，商品名「CORONATE HX」)等異氰酸酯加成物；等。異氰酸酯系交聯劑之含量可根據目標黏著力設定成任意適當之量，相對於基礎聚合物100重量份，代表性為0.1重量份～20重量份，更佳為0.5重量份～10重量份。 作為上述環氧系交聯劑，例如可列舉：N,N,N',N'-四縮水甘油基-間苯二甲胺、二縮水甘油基苯胺、1,3-雙(N,N-縮水甘油基胺基甲基)環己烷(三菱瓦斯化學公司製造，商品名「TETRAD C」)、1,6-己二醇二縮水甘油醚(共榮社化學公司製造，商品名「Epolight 1600」)、新戊二醇二縮水甘油醚(共榮社化學公司製造，商品名「Epolight 1500NP」)、乙二醇二縮水甘油醚(共榮社化學公司製造，商品名「Epolight 40E」)、丙二醇二縮水甘油醚(共榮社化學公司製造，商品名「Epolight 70P」)、聚乙二醇二縮水甘油醚(日本油脂公司製造，商品名「EPIOL E-400」)、聚丙二醇二縮水甘油醚(日本油脂公司製造，商品名「EPIOL P-200」)、山梨糖醇聚縮水甘油醚(Nagase ChemteX公司製造，商品名「Denacol EX-611」)、甘油聚縮水甘油醚(Nagase ChemteX公司製造，商品名「Denacol EX-314」)、季戊四醇聚縮水甘油醚、聚甘油聚縮水甘油醚(Nagase ChemteX公司製造，商品名「Denacol EX-512」)、山梨糖醇酐聚縮水甘油醚、三羥甲基丙烷聚縮水甘油醚、己二酸二縮水甘油酯、鄰苯二甲酸二縮水甘油酯、三縮水甘油基-三(2-羥乙基)異氰脲酸酯、間苯二酚二縮水甘油醚、雙酚-S-二縮水甘油醚、分子內具有2個以上環氧基之環氧系樹脂等。環氧系交聯劑之含量可根據所需黏著力設定為任意適當之量，代表性為，相對於基礎聚合物100重量份，為0.01重量份～10重量份，更佳為0.03重量份～5重量份。 (熱膨脹性微球) 作為上述熱膨脹性微球，只要為藉由加熱能膨脹或發泡之微球，則可使用任意適當之熱膨脹性微球。作為上述熱膨脹性微球，例如可使用將藉由加熱容易膨脹之物質內包於具有彈性之殼內而成之微球。此種熱膨脹性微球可利用任意適當之方法例如凝聚法、界面聚合法等來製造。 作為藉由加熱容易膨脹之物質，例如可列舉：丙烷、丙烯、丁烯、正丁烷、異丁烷、異戊烷、新戊烷、正戊烷、正己烷、異己烷、庚烷、辛烷、石油醚、甲烷之鹵化物、四烷基矽烷等低沸點液體；藉由熱解而氣化之偶氮二甲醯胺；等。 作為構成上述殼之物質，例如可列舉由下述物質構成之聚合物，該物質為：丙烯腈、甲基丙烯腈、α-氯丙烯腈、α-乙氧基丙烯腈、富馬腈等腈單體；丙烯酸、甲基丙烯酸、衣康酸、馬來酸、富馬酸、檸康酸等羧酸單體；偏氯乙烯；乙酸乙烯酯；(甲基)丙烯酸甲酯、(甲基)丙烯酸乙酯、(甲基)丙烯酸正丁酯、(甲基)丙烯酸異丁酯、(甲基)丙烯酸第三丁酯、(甲基)丙烯酸異冰片酯、(甲基)丙烯酸環己酯、(甲基)丙烯酸苄酯、丙烯酸β-羧基乙酯等(甲基)丙烯酸酯；苯乙烯、α-甲基苯乙烯、氯苯乙烯等苯乙烯單體；丙烯醯胺、取代丙烯醯胺、甲基丙烯醯胺、取代甲基丙烯醯胺等醯胺單體；等。由該等單體構成之聚合物可為均聚物，亦可為共聚物。作為該共聚物，例如可列舉：偏氯乙烯-甲基丙烯酸甲酯-丙烯腈共聚物、甲基丙烯酸甲酯-丙烯腈-甲基丙烯腈共聚物、甲基丙烯酸甲酯-丙烯腈共聚物、丙烯腈-甲基丙烯腈-衣康酸共聚物等。 作為上述熱膨脹性微球，可使用無機系發泡劑或有機系發泡劑。作為無機系發泡劑，例如可列舉：碳酸銨、碳酸氫銨、碳酸氫鈉、亞硝酸銨、硼氫化鈉、各種疊氮化物類等。此外，作為有機系發泡劑，例如可列舉：三氯一氟甲烷、二氯一氟甲烷等氯氟化烷烴系化合物；偶氮二異丁腈、偶氮二甲醯胺、偶氮二甲酸鋇等偶氮系化合物；對甲苯磺醯肼、二苯基碸-3,3'-二磺醯肼、4,4'-氧代雙(苯磺醯肼)、烯丙基雙(磺醯肼)等肼系化合物；對甲苯磺醯基胺基脲、4,4'-氧代雙(苯磺醯基胺基脲)等胺基脲系化合物；5-嗎啉基-1,2,3,4-硫代三唑等三唑系化合物；N,N'-二亞硝基五亞甲基四胺、N,N'-二甲基-N,N'-二亞硝基對苯二甲醯胺；等N-亞硝基系化合物等。 上述熱膨脹性微球亦可使用市售品。作為市售品之熱膨脹性微球之具體例，可列舉：松本油脂製藥公司製造之商品名「Matsumoto Microsphere」(型號：F-30、F-30D、F-36D、F-36LV、F-50、F-50D、F-65、F-65D、FN-100SS、FN-100SSD、FN-180SS、FN-180SSD、F-190D、F-260D、F-2800D)、Japan Fillite公司製造之商品名「Expancel」(型號：053-40、031-40、920-40、909-80、930-120)、吳羽化學工業公司製造「DAIFOAM」(型號：H750、H850、H1100、S2320D、S2640D、M330、M430、M520)、積水化學工業公司製造「ADVANCELL」(型號：EML101、EMH204、EHM301、EHM302、EHM303、EM304、EHM401、EM403、EM501)等。 上述熱膨脹性微球之加熱前之粒徑較佳為0.5 μm～80 μm，更佳為5 μm～45 μm，進而較佳為10 μm～20 μm，特別較佳為10 μm～15 μm。因此，以平均粒徑來說明上述熱膨脹性微球之加熱前之顆粒尺寸時，較佳為6 μm～45 μm，更佳為10 μm～35 μm。上述粒徑與平均粒徑係利用雷射散射法中之粒度分佈測定法求出之值。 上述熱膨脹性微球較佳為具有體積膨脹率直至達到較佳為5倍以上、更佳為7倍以上、進而較佳為10倍以上不會破裂之適宜之強度。使用此種熱膨脹性微球時，能夠藉由加熱處理而有效地降低黏著力。 上述黏著劑層之熱膨脹性微球之含有比率可根據所期望之黏著力之降低性等來適當設定。關於熱膨脹性微球之含有比率，相對於形成黏著劑層之基礎聚合物100重量份，例如為1重量份～150重量份，較佳為10重量份～130重量份，進而較佳為25重量份～100重量份。D. 基材 作為上述基材，例如可列舉：樹脂片、不織布、紙、金屬箔、織布、橡膠片、發泡片、該等之積層體(尤其係包含樹脂片之積層體)等。作為構成樹脂片之樹脂，例如可列舉：聚對苯二甲酸乙二酯(PET)、聚萘二甲酸乙二酯(PEN)、聚對苯二甲酸丁二酯(PBT)、聚乙烯(PE)、聚丙烯(PP)、乙烯-丙烯共聚物、乙烯-乙酸乙烯酯共聚物(EVA)、聚醯胺(尼龍)、全芳香族聚醯胺(芳綸)、聚醯亞胺(PI)、聚氯乙烯(PVC)、聚苯硫醚(PPS)、氟系樹脂、聚醚醚酮(PEEK)等。作為不織布，可列舉：包含馬尼拉麻之不織布等由具有耐熱性之天然纖維形成之不織布；聚丙烯樹脂不織布、聚乙烯樹脂不織布、酯系樹脂不織布等合成樹脂不織布等。 於一實施形態中，如B項中所說明般，上述基材可包含抗靜電材料。作為包含抗靜電材料之基材，例如可使用混練抗靜電材料之樹脂片。該樹脂片可由包含樹脂與抗靜電材料之基材形成用組合物形成。於其他實施形態中，作為基材，使用金屬箔等，基材自身亦可為抗靜電材料。 上述基材之厚度可根據所需強度或柔軟性、以及使用目的等設定為任意適當之厚度。基材之厚度較佳為1000 μm以下，更佳為1 μm～1000 μm，進而較佳為1 μm～500 μm，特別較佳為3 μm～300 μm，最佳為5 μm～250 μm。 上述基材可實施表面處理。作為表面處理，例如可列舉：電暈處理、鉻酸處理、臭氧暴露、火焰暴露、高壓電擊暴露、離子化輻射處理、利用底塗劑之塗佈處理等。若進行此種表面處理，則能夠提高黏著劑層與基材之密著性。 作為上述有機塗佈材料，例如可列舉塑膠硬塗材料II(CMC出版，(2004))中記載之材料。較佳為使用胺基甲酸酯系聚合物，更佳為使用聚丙烯酸胺基甲酸酯、聚酯胺基甲酸酯或該等之前驅物。其原因在於，對基材之塗覆・塗佈簡便、並且工業上可選擇多種物質而能夠廉價地獲取。該胺基甲酸酯系聚合物例如為包含異氰酸酯單體與含醇性羥基之單體(例如含羥基之丙烯酸化合物或含羥基酯之化合物)之反應混合物的聚合物。有機塗佈材料作為任意之添加劑可包含聚胺等擴鏈劑、抗老化劑、氧化穩定劑等。對有機塗佈層之厚度並無特別限定，例如為0.1 μm～10 μm左右較為適合，較佳為0.1 μm～5 μm左右，更佳為0.5 μm～5 μm左右。E. 彈性層 如上所述，本發明之熱剝離型黏著片可進而具備彈性層。 上述彈性層包含基礎聚合物，作為該基礎聚合物，可使用黏著性之聚合物。作為構成彈性層之基礎聚合物，例如可列舉：丙烯酸系聚合物：天然橡膠、合成橡膠(例如腈系、二烯系、丙烯酸系)等橡膠系聚合物；聚烯烴系、聚酯系等熱塑性彈性體；乙烯基烷基醚系聚合物；有機矽系聚合物；聚酯系聚合物；聚醯胺系聚合物；胺基甲酸酯系聚合物；苯乙烯-二烯嵌段共聚物；乙烯-乙酸乙烯酯共聚物；聚胺基甲酸酯系聚合物；聚丁二烯；軟質聚氯乙烯；輻射硬化型聚合物等。構成上述彈性層之基礎聚合物可與形成上述黏著劑層之基礎聚合物相同，亦可不同。上述彈性層亦可為由上述基礎聚合物形成之發泡膜。該發泡膜可利用任意適當之方法獲得。再者，彈性層與黏著劑層可藉由有無熱膨脹性微球(彈性層不包含熱膨脹性微球)來區別。 作為構成彈性層之基礎聚合物之上述丙烯酸系聚合物例如為使用(甲基)丙烯酸烷基酯之1種或2種以上作為單體成分之丙烯酸系聚合物(均聚物或共聚物)。作為該(甲基)丙烯酸烷基酯之具體例，可列舉具有碳數20以下之直鏈狀或支鏈狀烷基之(甲基)丙烯酸烷基酯。此外，上述丙烯酸系聚合物亦可包含與能與(甲基)丙烯酸烷基酯共聚之其他單體成分對應之單元。作為此種單體成分，例如可列舉：丙烯酸、甲基丙烯酸、衣康酸、丙烯酸羥基乙酯、甲基丙烯酸羥基乙酯、丙烯酸羥基丙酯、甲基丙烯酸羥基丙酯、N-羥甲基丙烯醯胺、丙烯腈、甲基丙烯腈、丙烯酸縮水甘油酯、甲基丙烯酸縮水甘油酯、乙酸乙烯酯、苯乙烯、異戊二烯、丁二烯、異丁烯、乙烯醚等。 上述彈性層根據需要可包含任意適當之添加劑。作為該添加劑，例如可列舉交聯劑、硫化劑、增黏劑、增塑劑、柔軟劑、填充劑、抗老化劑等。作為基礎聚合物，使用聚氯乙烯等硬質樹脂時，較佳為併用增塑劑及/或柔軟劑來形成具有目標彈性之彈性層。 上述彈性層之厚度較佳為3 μm～200 μm，更佳為5 μm～100 μm。若為此種範圍，則能夠充分發揮彈性層之上述功能。 上述彈性層之於25℃下之拉伸彈性模數較佳為未達100 Mpa，更佳為0.1 MPa～50 MPa，進而較佳為0.1 MPa～10 MPa。若為此種範圍，則能夠充分發揮彈性層之上述功能。F. 熱剝離型黏著片之製造方法 本發明之熱剝離型黏著片可利用任意適當之方法來製造。本發明之熱剝離型黏著片例如可列舉如下之方法：於基材上直接塗覆黏著劑層形成用組合物之方法、或將於任意適當之基體上塗覆黏著劑層形成用組合物而形成之塗覆層轉印於基材之方法等。 上述黏著劑層形成用組合物包含上述黏著劑及上述熱膨脹性微球，根據需要進而包含抗靜電材料。此外，黏著劑層形成用組合物亦可包含任意適當之溶劑。 上述熱剝離型黏著片具備包含樹脂之抗靜電層時，該抗靜電層如B-3項中所說明般，可將用任意適當之溶劑對上述抗靜電材料與黏著劑樹脂進行稀釋而成之抗靜電層形成用組合物、或用任意適當之溶劑對上述導電性聚合物進行稀釋而成之抗靜電層形成用組合物塗佈於基材、黏著劑層或彈性層而形成。 上述抗靜電層由金屬層或金屬氧化物層形成時，金屬層或金屬氧化物層如B-3項中所說明般，例如可利用真空蒸鍍法、濺射法、離子鍍法、化學蒸鍍法、噴霧熱解法、化學鍍法、電鍍法等製膜方法來形成。此外，亦可將金屬膜或金屬氧化物膜積層於基材、黏著劑層或彈性層來形成抗靜電層。 對形成上述抗靜電層之時機並無特別限定，可根據熱剝離型黏著片之構成於任意適當之時機形成。例如，抗靜電層可於形成基材與黏著劑層之積層體之後形成。此外，亦可於基材上形成抗靜電層後於附抗靜電層之基材上形成黏著劑層(或者彈性層)，亦可於黏著劑層上(或者彈性層上)形成抗靜電層後將附抗靜電層之黏著劑層(或者彈性層)轉印於基材。 黏著劑層具有上述彈性層時，該彈性層例如可於基材上或黏著劑層上塗覆彈性層形成用組合物來形成。此外，彈性層可將於任意適當之基體上塗覆彈性層形成用組合物而形成之塗覆層轉印來形成。 作為上述各組合物之塗覆方法，可採用任意適當之塗覆方法。例如可於塗佈後進行乾燥而形成各層。作為塗佈方法，例如可列舉使用複合塗敷器(Multicoater)、模塗機、凹版塗佈機、塗抹器等之塗佈方法。作為乾燥方法，例如可列舉自然乾燥、加熱乾燥等。加熱乾燥時之加熱溫度可根據作為乾燥對象之物質之特性設定為任意適當之溫度。G. 熱剝離型黏著片之使用方法 ( 電子零件之製造方法 ) 根據本發明之另一實施態樣，提供一種電子零件之製造方法。本發明之電子零件之製造方法包括如下步驟：於上述熱剝離型黏著片上以大面積貼附獲得之電子零件材料，對該電子零件材料進行切斷加工。 作為上述電子零件，例如可列舉：矽晶圓等半導體裝置用之零件；積層電容器；感應器；電阻；壓電元件；振子；LED；透明電極；等。 上述製造方法中，首先，於加工台上載置上述熱剝離型黏著片，並於該熱剝離型黏著片上以大面積貼附獲得之電子零件材料。 其後，利用任意適當之方法將上述電子零件材料切斷，可獲得電子零件。作為上述切斷加工之方法，例如可列舉使用旋轉刀、平面刀等刀具之方法，使用雷射光之方法等。 上述切斷加工中，可於加熱下進行切斷。例如可將上述加工台加熱至30℃～150℃進行切斷加工。 實施例 以下，利用實施例對本發明進行具體說明，但本發明並不限定於該等實施例。實施例中之評價方法如下所述。此外，於實施例中，只要無特別說明，則「份」及「%」為重量基準。 (1)切斷加工性 於熱剝離型黏著片之黏著劑層上貼附用環氧樹脂(日立化成公司製造，商品名「CEL-9200HF9」)進行封裝而成之QFN引線框(尺寸：125 mm×65 mm；與黏著片之貼附面為樹脂面(表面粗糙度Ra：3 μm))，將其安裝固定於6吋之切割環，經由切割機全切割為250個5 mm×5 mm尺寸之晶片(實施藉由切割來進行之切斷加工處理)，於該切割時，計算發生晶片飛散之個數，作為切斷加工性之評價。 切割刀使用DISCO公司製造之ZH05-SD2000-N1-110-DD。切割刀之進給速度設為70 mm/S，切割刀之轉速設為50000/s。 (2)加熱剝離性 上述(1)之切斷加工後，使用熱風乾燥器(ESPEC公司製造，商品名「SPH-201」)，於130℃下實施10分鐘加熱處理。加熱處理後，以晶片為下側之方式使熱剝離型黏著片反轉，令晶片自然下落。利用此時未自然下落而殘留於熱剝離型黏著片上之晶片數評價加熱剝離性。 (3)黏著力測定方法 將熱剝離型黏著片切斷成寬度：20 mm、長度：140 mm之尺寸，基於JIS Z 0237(2000年)，於溫度：23±2℃及濕度：65±5%RH之氣氛下，使2 kg之輥往復1次，將作為被接著體之聚對苯二甲酸乙二酯膜(商品名「lumirror S-10」東麗公司製造；厚度：25 μm、寬度：20 mm)壓接貼附於黏著劑層上。繼而，將附被接著體之熱剝離型黏著片置於附有設定於23℃之恆溫槽之拉伸試驗機(島津製作所公司製造，商品名「島津Autograph AG-120kN」)中，放置30分鐘。放置後，測定於23℃之溫度下將被接著體以剝離角度：180°、剝離速度(拉伸速度)：300 mm/min之條件自熱剝離型黏著帶剝離時之荷重，求出此時之最大荷重(測定初期之封頂除外之荷重之最大值)，將該最大荷重作為熱膨脹性黏著劑層之黏著力(N/20 mm)。 (4)總透光率 基於JIS-6714，使用積分球式透光率測定裝置(村上色彩技術研究所公司製造，商品名「HAZE METER HM-150」測定熱剝離型黏著片之總透光率。 (5)剝離帶電(剝離電壓之測定) 於熱剝離型黏著片(寬度70 mm×長度130 mm)之黏著面貼合經過除電之剝離襯墊(進行有機矽處理之PET膜，東麗公司製造，商品名「Cerapeel」，厚度：38 μm)之有機矽處理面，製作評價用樣品。此時，剝離襯墊之長度方向端部自熱剝離型黏著片突出30 mm。此外，用手壓輥使熱剝離型黏著片與剝離襯墊於基於JIS Z 0237(2000年)之條件下(溫度：23℃，濕度50%RH)貼附。 將評價用樣品於23℃、50%RH之環境下放置一日後，抓住剝離襯墊之突出部分，將該剝離襯墊以剝離角度150°、剝離速度10 m/min沿長度方向剝離。於相對黏著劑表面為垂直之方向距剝離襯墊與熱剝離型黏著片分離處100 mm之位置，測定剝離時產生之黏著劑層表面之電壓，將其最大值作為剝離電壓。再者，作為測定器，使用電位測定機(春日電器公司製造，商品名「KSD-0103」)。此外，測定環境設為23℃、50%RH。 (6)黏著特性之經時穩定性 將熱剝離型黏著片於溫度23℃、濕度50%之氣氛下保管2個月，由上述(2)中測定之黏著力(A0)與經過2個月後之黏著力(A1)，利用下述式(I)算出黏著力之變化率X%。表3中，將變化率X%未達50%之情況設為○、將變化率X%為50%以上之情況設為×。 X(%)＝(A1/A0)×100 [製造例1]黏著劑層形成用組合物I之調製 將作為基礎聚合物之丙烯酸系聚合物(丙烯酸2-乙基己酯：丙烯酸乙酯：甲基丙烯酸甲酯：丙烯酸羥基乙酯(重量比)＝30：70：5：5)100重量份、萜烯酚系增黏樹脂(YASUHARA CHEMICAL公司製造，商品名「YS polystar S145」)10重量份、異氰酸酯系交聯劑(日本聚胺酯公司製造，商品名「CORONATE L」)2重量份、交聯促進劑(Tokyo Fine Chemical公司製造，商品名「EMBILIZER OL-1」)0.03重量份、熱膨脹性微球(松本油脂製藥公司製造，商品名「Matsumoto Microsphere F-65」；150℃發泡膨脹型)30重量份與甲苯加以混合，調製樹脂溶液，將其作為黏著劑層形成用組合物I。 再者，若利用該黏著劑層形成用組合物I形成黏著劑層，則該黏著劑層中之結構單元A之含有比率相對於基礎聚合物100重量份為27重量份。 [製造例2～12]黏著劑層形成用組合物II～XII之調製 如表1所示設定構成丙烯酸系聚合物之單體之種類及重量比、交聯劑之種類及調配量、以及增黏樹脂之種類及調配量，除此以外，以與製造例1同樣之方式，獲得黏著劑層形成用組合物II～XII。再者，製造例9中，調配離子性液體(離子導電性賦予劑，Japan Carlit公司製造，商品名「PEL20A」)10重量份，調製黏著劑層形成用組合物IX。此外，製造例10中，調配離子性液體(Japan Carlit公司製造，商品名「CIL-312」)，1-丁基-3-甲基吡啶鎓雙(三氟甲磺醯基)亞胺鹽)3重量份，調製黏著劑層形成用組合物X。 表1中記載之交聯劑、增黏樹脂詳細情況如下所述。 ＜交聯劑＞ TETRAD C：三菱瓦斯化學公司製造，商品名「TETRAD C」，環氧系交聯劑 ＜增黏樹脂＞ Mighty Ace G125：YASUHARA CHEMICAL公司製造，商品名「Mighty Ace G125」，萜烯酚系增黏樹脂 Tamanol 901：荒川化學工業公司製造，商品名「Tamanol 901」，萜烯酚系增黏樹脂 Tamanol 200N：荒川化學工業公司製造，商品名「Tamanol 200N」，烷基酚系增黏樹脂 Super ester A125：荒川化學工業公司製造，商品名「Super ester A125」，松香系增黏樹脂 [表1]

[製造例13]彈性層形成用組合物I之調製 將丙烯酸系聚合物(丙烯酸2-乙基己酯：丙烯酸乙酯：甲基丙烯酸甲酯：丙烯酸羥基乙酯(重量比)＝30：70：5：5)100重量份、異氰酸酯系交聯劑(日本聚胺酯公司製造，商品名「CORONATE L」)3重量份與甲苯加以混合，調製樹脂溶液，將其作為彈性層形成用組合物I。 [製造例14～20]彈性層形成用組合物II～VIII之調製 如表2所示設定構成丙烯酸系黏著劑之單體之種類及重量比、以及交聯劑之調配量，除此以外，以與製造例12同樣之方式，獲得彈性層形成用組合物II～VIII。 [表2]

[實施例1] 將作為抗靜電材料之以1.2重量%含有聚噻吩(聚乙烯二氧噻吩聚苯乙烯磺酸酯)之水分散體(Heraeus公司製造，商品名「Clevios P」)與聚酯系樹脂溶液(東洋紡公司製造，商品名「Vylonal MD1200」，固形物成分濃度：1.2重量%)以固形物成分重量比(水分散體：樹脂溶液)為6：4之方式加以混合，進而，使用異丙醇/純水混合溶劑(異丙醇：純水＝6：4(重量比))以固形物成分濃度為1重量%之方式進行稀釋，調製抗靜電層形成用組合物I。 將獲得之抗靜電層形成用組合物I塗佈於PET基材(東麗公司製造，商品名「lumirror S10」，厚度：100 μm)，進行乾燥，於基材上形成厚度50 nm之抗靜電層。 繼而，將製造例13中獲得之彈性層形成用組合物I塗佈於上述PET基材之與抗靜電層相反側之面，進行乾燥，於該面形成厚度15 μm之彈性層。 另外將製造例1中獲得之黏著劑層形成用組合物I塗佈於PET隔離膜(厚度：38 μm)之Si處理面上，進行乾燥，形成厚度35 μm之黏著劑層前驅物。將該前驅物轉印於上述彈性層之與PET基材相反側之面，獲得熱剝離型黏著片(抗靜電層(50 nm)/基材(100 μm)/彈性層(15 μm)/黏著劑層(35 μm))。 將獲得之熱剝離型黏著片供於上述評價(1)～(6)。將結果示於表3。 [實施例2] 使用彈性層形成用組合物II，代替彈性層形成用組合物I，使用黏著劑層形成用組合物II，代替黏著劑層形成用組合物I，除此以外，以與實施例1同樣之方式，獲得熱剝離型黏著片(抗靜電層(50 nm)/基材(100 μm)/彈性層(15 μm)/黏著劑層(35 μm))。將獲得之熱剝離型黏著片供於上述評價(1)～(6)。將結果示於表3。 [實施例3] 將作為抗靜電材料之聚(3,4-乙烯二氧噻吩)之醇分散液(化研產業公司製造，商品名「Enocoat BP105」)與丙醇加以混合，調製包含1重量%聚(3,4-乙烯二氧噻吩)之抗靜電層形成用組合物II。 使用抗靜電層形成用組合物II，代替抗靜電層形成用組合物I，使用彈性層形成用組合物III，代替彈性層形成用組合物I，使用黏著劑層形成用組合物III，代替黏著劑層形成用組合物I，除此以外，以與實施例1同樣之方式，獲得熱剝離型黏著片(抗靜電層(50 nm)/基材(100 μm)/彈性層(15 μm)/黏著劑層(35 μm))。將獲得之熱剝離型黏著片供於上述評價(1)～(6)。將結果示於表3。 [實施例4] 使用彈性層形成用組合物IV，代替彈性層形成用組合物III，使用黏著劑層形成用組合物IV，代替黏著劑層形成用組合物III，除此以外，以與實施例3同樣之方式，獲得熱剝離型黏著片(抗靜電層(50 nm)/基材(100 μm)/彈性層(15 μm)/黏著劑層(35 μm))。將獲得之熱剝離型黏著片供於上述評價(1)～(6)。將結果示於表3。 [實施例5] 使用彈性層形成用組合物V，代替彈性層形成用組合物I，使用黏著劑層形成用組合物V，代替黏著劑層形成用組合物I，除此以外，以與實施例1同樣之方式，獲得熱剝離型黏著片(抗靜電層(50 nm)/基材(100 μm)/彈性層(15 μm)/黏著劑層(35 μm))。將獲得之熱剝離型黏著片供於上述評價(1)～(6)。將結果示於表3。 [實施例6] 使用彈性層形成用組合物VI，代替彈性層形成用組合物I，使用黏著劑層形成用組合物VI，代替黏著劑層形成用組合物I，除此以外，以與實施例1同樣之方式，獲得熱剝離型黏著片(抗靜電層(50 nm)/基材(100 μm)/彈性層(15 μm)/黏著劑層(35 μm))。將獲得之熱剝離型黏著片供於上述評價(1)～(6)。將結果示於表3。 [實施例7] 使用黏著劑層形成用組合物VII，代替黏著劑層形成用組合物I，除此以外，以與實施例1同樣之方式，獲得熱剝離型黏著片(抗靜電層(50 nm)/基材(100 μm)/彈性層(15 μm)/黏著劑層(35 μm))。將獲得之熱剝離型黏著片供於上述評價(1)～(6)。將結果示於表3。 [實施例8] 作為基材，準備包含抗靜電材料之PET基材(東麗公司製造，商品名「X53 lumirror ＃100」，厚度：100 μm，表面電阻率：1×10¹⁰ Ω/□)。 於該包含抗靜電材料之PET基材上塗佈製造例13中獲得之彈性層形成用組合物I，進行乾燥，於該面形成厚度15 μm之彈性層。 另外將製造例1中獲得之黏著劑層形成用組合物I塗佈於PET隔離膜(厚度：38 μm)之Si處理面上，進行乾燥，形成厚度35 μm之黏著劑層前驅物。將該前驅物轉印於上述彈性層之與PET基材相反側之面，獲得熱剝離型黏著片(基材(100 μm)/彈性層(15 μm)/黏著劑層(35 μm))。 將獲得之熱剝離型黏著片供於上述評價(1)～(6)。將結果示於表3。 [實施例9] 使用黏著劑層形成用組合物VIII，代替黏著劑層形成用組合物I，除此以外，以與實施例1同樣之方式，獲得熱剝離型黏著片(抗靜電層(50 nm)/基材(100 μm)/彈性層(15 μm)/黏著劑層(35 μm))。將獲得之熱剝離型黏著片供於上述評價(1)～(6)。將結果示於表3。 [實施例10] 以與實施例1同樣方式，調製抗靜電層形成用組合物I。 將該抗靜電層形成用組合物I塗佈於PET基材(東麗公司製造，商品名「lumirror S10」，厚度：100 μm)，進行乾燥，於基材上形成厚度50 nm之抗靜電層。 繼而，將製造例13中獲得之彈性層形成用組合物I塗佈於上述抗靜電層上，進行乾燥，形成厚度15 μm之彈性層。 另外將製造例1中獲得之黏著劑層形成用組合物I塗佈於PET膜(厚度：38 μm)上，進行乾燥，形成厚度35 μm之黏著劑層前驅物。將該前驅物轉印於上述彈性層上，獲得熱剝離型黏著片(基材(100 μm)/抗靜電層(50 nm)/彈性層(15 μm)/黏著劑層(35 μm))。 將獲得之熱剝離型黏著片供於上述評價(1)～(6)。將結果示於表3。 [實施例11] 作為抗靜電層及基材之層疊體，準備藉由蒸鍍形成有抗靜電層之PET膜(東麗公司製造，商品名「半蒸著 FB-15」，厚度：50 μm，總透光率：15%)。 繼而，將製造例13中獲得之彈性層形成用組合物I塗佈於上述積層體之基材側(即PET膜中未進行蒸鍍之面)，進行乾燥，於該面形成厚度15 μm之彈性層。 另外將製造例1中獲得之黏著劑層形成用組合物I塗佈於PET隔離膜(厚度：38 μm)之Si處理面上，進行乾燥，形成厚度35 μm之黏著劑層前驅物。將該前驅物轉印於上述彈性層之與上述基材相反側之面，獲得熱剝離型黏著片(抗靜電層/基材/彈性層(15 μm)/黏著劑層(35 μm))。 將獲得之熱剝離型黏著片供於上述評價(1)～(6)。將結果示於表3。 [實施例12] 將製造例13中獲得之彈性層形成用組合物I塗佈於PET基材(東麗公司製造，商品名「lumirror S10」，厚度：100 μm)，進行乾燥，於該面形成厚度15 μm之彈性層。 另外將製造例9中獲得之黏著劑層形成用組合物IX塗佈於PET隔離膜(厚度：38 μm)之Si處理面上，進行乾燥，形成厚度35 μm之黏著劑層前驅物。將該前驅物轉印於上述彈性層之與PET基材相反側之面，獲得熱剝離型黏著片(基材(100 μm)/彈性層(15 μm)/黏著劑層(35 μm))。再者，本實施例係於黏著劑層中包含作為抗靜電材料之離子性液體時之實驗例。 將獲得之熱剝離型黏著片供於上述評價(1)～(6)。將結果示於表3。 [實施例13] 除不形成彈性層以外，以與實施例1同樣之方式，獲得(抗靜電層(50 nm)/基材(100 μm)/黏著劑層(35 μm))。將獲得之熱剝離型黏著片供於上述評價(1)～(6)。將結果示於表3。 [實施例14] 利用日本專利特開平4-348161號公報之實施例12中記載之方法來製作膜，將該膜(厚度：50 nm)作為抗靜電層積層於PET基材(東麗公司製造，商品名「lumirror S10」，厚度：100 μm)上。再者，該膜包含聚苯胺作為抗靜電材料，表面電阻率為2.5×10⁵ Ω/□。 繼而，將製造例13中獲得之彈性層形成用組合物I塗佈於上述PET基材之與抗靜電層相反側之面，進行乾燥，於該面形成厚度15 μm之彈性層。 另外將製造例1中獲得之黏著劑層形成用組合物I塗佈於PET隔離膜(厚度：38 μm)之Si處理面上，進行乾燥，形成厚度35 μm之黏著劑層前驅物。將該前驅物轉印於上述彈性層之與PET基材相反側之面，獲得熱剝離型黏著片(抗靜電層(50 nm)/基材(100 μm)/彈性層(15 μm)/黏著劑層(35 μm))。 將獲得之熱剝離型黏著片供於上述評價(1)～(6)。將結果示於表3。 [實施例15] 將製造例13中獲得之彈性層形成用組合物I塗佈於PET基材(東麗公司製造，商品名「lumirror S10」，厚度：100 μm)，進行乾燥，於該面形成厚度15 μm之彈性層。 另外將製造例10中獲得之黏著劑層形成用組合物X塗佈於PET隔離膜(厚度：38 μm)之Si處理面上，進行乾燥，形成厚度35 μm之黏著劑層前驅物。將該前驅物轉印於上述彈性層之與PET基材相反側之面，獲得熱剝離型黏著片(基材(100 μm)/彈性層(15 μm)/黏著劑層(35 μm))。再者，本實施例係於黏著劑層中包含作為抗靜電材料之離子性液體時之實驗例。 將獲得之熱剝離型黏著片供於上述評價(1)～(6)。將結果示於表3。 [比較例1] 使用彈性層形成用組合物VII，代替彈性層形成用組合物I，使用黏著劑層形成用組合物XI，代替黏著劑層形成用組合物I，除此以外，以與實施例1同樣之方式，獲得熱剝離型黏著片(抗靜電層(50 nm)/基材(100 μm)/彈性層(15 μm)/黏著劑層(35 μm))。將獲得之熱剝離型黏著片供於上述評價(1)～(6)。將結果示於表3。 [比較例2] 使用彈性層形成用組合物VIII，代替彈性層形成用組合物I，使用黏著劑層形成用組合物XII，代替黏著劑層形成用組合物I，除此以外，以與實施例1同樣之方式，獲得熱剝離型黏著片(抗靜電層(50 nm)/基材(100 μm)/彈性層(15 μm)/黏著劑層(35 μm))。將獲得之熱剝離型黏著片供於上述評價(1)～(6)。將結果示於表3。 [比較例3] 除不形成抗靜電層以外，以與實施例1同樣之方式，獲得熱剝離型黏著片(基材(100 μm)/彈性層(15 μm)/黏著劑層(35 μm))。將獲得之熱剝離型黏著片供於上述評價(1)～(6)。將結果示於表3。 [表3]

由表3可知，若使用本發明之熱剝離型黏著片作為電子零件材料之切斷步驟中之臨時固定用片，則能夠防止晶片飛散。此外，本發明之熱剝離型黏著片之剝離帶電量較少。再者，如比較例3般剝離帶電量較多之黏著片有會損傷貼附之電子零件材料之虞。 [產業上之可利用性] 本發明之製造方法及黏著片可適宜地用於半導體晶片等晶片狀電子零件之製造。(Ionic Liquid) An ionic liquid is a liquid organic compound, and refers to a molten salt (ionic compound) that is liquid at room temperature, and has good compatibility with the base polymer in the adhesive composition. Thereby, the segregation of the ionic liquid on the surface of the adhesive layer can be suppressed, and the decrease of the adhesive force over time and contamination caused by transfer to the adherend can be prevented. Furthermore, the compatibility refers to the property that when the ionic liquid and the base polymer are mixed by an appropriate mixing method (melt blending, solution blending), they are mixed uniformly and are not easy to separate phases. In addition, if an ionic liquid is used, an adhesive layer exhibiting excellent antistatic properties can be formed. The detailed reason why the excellent antistatic property can be obtained by using the ionic liquid is not clear, but it is speculated as follows. That is, since the ionic liquid is in a liquid state, molecular movement is easier than that of commonly used surfactants, and molecular rearrangement is easily performed due to the generation of charges. Therefore, it is considered that when an ionic liquid is used, a charge neutralization mechanism due to molecular rearrangement works, whereby an excellent antistatic effect can be obtained. In addition, since the ionic liquid is liquid at room temperature, it is easier to add to the binder and disperse or dissolve it than a solid salt. Furthermore, since the ionic liquid has no vapor pressure (non-volatility), it does not disappear over time, and has the characteristic of being able to continuously obtain antistatic properties. The content ratio of the above-mentioned ionic liquid is preferably 0.01 to 10 parts by weight, more preferably 0.01 to 8 parts by weight, more preferably 0.1 parts by weight with respect to 100 parts by weight of the base polymer constituting the adhesive layer. parts to 5 parts by weight. In such a range, a sufficient antistatic effect can be obtained. Any appropriate ionic liquid can be used as the above-mentioned ionic liquid as long as the effect of the present invention can be obtained. The ionic liquid is preferably a nitrogen-containing onium salt, a sulfur-containing onium salt, or a phosphonium-containing salt, and it is more preferable to use a salt containing organic cation components and anion components represented by the following general formulas (A) to (E). The reason is that it can exhibit excellent antistatic ability. [chemical 1]

In formula (A), Ra represents a hydrocarbon group having 4 to 20 carbons, and Rb and Rc each independently represent hydrogen or a hydrocarbon group having 1 to 16 carbons. Furthermore, Ra, Rb, and Rc may contain heteroatoms. In addition, when the nitrogen atom is bonded via a double bond, Rc does not exist. In formula (B), Rd represents a hydrocarbon group having 2 to 20 carbons, and Re, Rf and Rg each independently represent hydrogen or a hydrocarbon group having 1 to 16 carbons. Rd, Re, Rf and Rg may contain heteroatoms. In formula (C), Rh represents a hydrocarbon group having 2 to 20 carbons, and Ri, Rj and Rk each independently represent hydrogen or a hydrocarbon group having 1 to 16 carbons. Rh, Ri, Rj and Rk may contain heteroatoms. In formula (D), Z represents a nitrogen, sulfur, or phosphorus atom, and R1, Rm, Rn, and Ro each independently represent a hydrocarbon group having 1 to 20 carbon atoms, and may contain heteroatoms. However, when Z is a sulfur atom, Ro does not exist. In formula (E), Rp represents a hydrocarbon group having 1 to 18 carbon atoms, and may contain heteroatoms. Examples of the cation represented by the formula (A) include pyridinium cations, piperidinium cations, pyrrolidinium cations, cations having a pyrroline skeleton, cations having a pyrrole skeleton, and the like. Examples thereof include pyridinium cations, piperidinium cations, pyrrolidinium cations, cations having a pyrroline skeleton, and cations having a pyrrole skeleton. Specific examples include: 1-ethylpyridinium cation, 1-butylpyridinium cation, 1-hexylpyridinium cation, 1-butyl-3-methylpyridinium cation, 1-butyl-4 -pyridinium cation, 1-hexyl-3-methylpyridinium cation, 1-butyl-3,4-dimethylpyridinium cation and other pyridinium cations; 1-propylpiperidinium cation, 1- Pentylpiperidinium cation, 1,1-dimethylpiperidinium cation, 1-methyl-1-ethylpiperidinium cation, 1-methyl-1-propylpiperidinium cation, 1-methylpiperidinium cation Base-1-butylpiperidinium cation, 1-methyl-1-pentylpiperidinium cation, 1-methyl-1-hexylpiperidinium cation, 1-methyl-1-heptylpiperidinium Cation, 1-ethyl-1-propylpiperidinium cation, 1-ethyl-1-butylpiperidinium cation, 1-ethyl-1-pentylpiperidinium cation, 1-ethyl-1 -hexylpiperidinium cation, 1-ethyl-1-heptylpiperidinium cation, 1,1-dipropylpiperidinium cation, 1-propyl-1-butylpiperidinium cation, 1,1 -Piperidinium cations such as dibutylpiperidinium cation; 1,1-dimethylpyrrolidinium cation, 1-methyl-1-ethylpyrrolidinium cation, 1-methyl-1-propylpyrrole Alkylium cation, 1-methyl-1-butylpyrrolidinium cation, 1-methyl-1-pentylpyrrolidinium cation, 1-methyl-1-hexylpyrrolidinium cation, 1-methyl- 1-heptylpyrrolidinium cation, 1-ethyl-1-propylpyrrolidinium cation, 1-ethyl-1-butylpyrrolidinium cation, 1-ethyl-1-pentylpyrrolidinium cation , 1-ethyl-1-hexylpyrrolidinium cation, 1-ethyl-1-heptylpyrrolidinium cation, 1,1-dipropylpyrrolidinium cation, 1-propyl-1-butylpyrrolidinium Pyrrolidinium cations such as alkane cations, 1,1-dibutylpyrrolidinium cations; 2-methyl-1-pyrroline cations, 1-ethyl-2-phenylindole cations, 1,2-di Methylindole cation, 1-ethylcarbazole cation, etc. Examples of the cation represented by the formula (B) include imidazolium cations, tetrahydropyrimidinium cations, dihydropyrimidinium cations, and the like. For example, imidazolium cation, tetrahydropyrimidinium cation, dihydropyrimidinium cation, etc. are mentioned. Specific examples include: 1,3-dimethylimidazolium cation, 1,3-diethylimidazolium cation, 1-ethyl-3-methylimidazolium cation, 1-butyl-3- Methylimidazolium cation, 1-hexyl-3-methylimidazolium cation, 1-octyl-3-methylimidazolium cation, 1-decyl-3-methylimidazolium cation, 1-dodecyl -3-methylimidazolium cation, 1-tetradecyl-3-methylimidazolium cation, 1,2-dimethyl-3-propylimidazolium cation, 1-ethyl-2,3-di Imidazolium cations such as methylimidazolium cation, 1-butyl-2,3-dimethylimidazolium cation, 1-hexyl-2,3-dimethylimidazolium cation, and other imidazolium cations; 1,3-dimethyl-1 ,4,5,6-tetrahydropyrimidinium cation, 1,2,3-trimethyl-1,4,5,6-tetrahydropyrimidinium cation, 1,2,3,4-tetramethyl-1 ,4,5,6-tetrahydropyrimidinium cation, 1,2,3,5-tetramethyl-1,4,5,6-tetrahydropyrimidinium cation and other tetrahydropyrimidinium cations; 1,3-di Methyl-1,4-dihydropyrimidinium cation, 1,3-dimethyl-1,6-dihydropyrimidinium cation, 1,2,3-trimethyl-1,4-dihydropyrimidinium cation , 1,2,3-trimethyl-1,6-dihydropyrimidinium cation, 1,2,3,4-tetramethyl-1,4-dihydropyrimidinium cation, 1,2,3,4 -Dihydropyrimidinium cations such as tetramethyl-1,6-dihydropyrimidinium cations, etc., and 1-butyl-3-methylpyridinium cations such as 1-butyl-3-methylpyridinium bisimide . As a cation represented by formula (C), a pyrazolium cation, a dihydropyrazolium cation, etc. are mentioned. For example, a pyrazolium cation, a dihydropyrazolium cation, etc. are mentioned. Specific examples include 1-methylpyrazolium cation, 3-methylpyrazolium cation, 1-ethyl-2-methyldihydropyrazolium cation, and the like. Examples of the cation represented by the formula (D) include tetraalkylammonium cations, trialkylconium cations, tetraalkylphosphonium cations, and the like. In addition, a cation in which part of the alkyl group of these cations is substituted with an alkenyl group, an alkoxy group, or an epoxy group can also be used. In addition, R1, Rm, Rn and Ro are hydrocarbon groups having 1 to 20 carbons as described above, preferably alkyl groups having 1 to 20 carbons. In addition, R1, Rm, Rn and Ro may also be aromatic ring groups or alicyclic groups. Specific examples of cations represented by formula (D) include: tetraalkylammonium cations, trialkylconium cations, tetraalkylphosphonium cations, or a part of the above-mentioned alkyl groups through alkenyl, alkoxy, and epoxy cations substituted by radicals, etc. As specific examples, for example, N,N-dimethyl-N-ethyl-N-propylammonium cation, N,N-dimethyl-N-ethyl-N-butylammonium cation, N, N-Dimethyl-N-ethyl-N-pentylammonium cation, N,N-dimethyl-N-ethyl-N-hexylammonium cation, N,N-dimethyl-N-ethyl- N-heptyl ammonium cation, N,N-dimethyl-N-ethyl-N-nonyl ammonium cation, N,N-dimethyl-N,N-dipropyl ammonium cation, N,N-di Methyl-N-propyl-N-butylammonium cation, N,N-dimethyl-N-propyl-N-pentylammonium cation, N,N-dimethyl-N-propyl-N- Hexylammonium cation, N,N-dimethyl-N-propyl-N-heptyl ammonium cation, N,N-dimethyl-N-butyl-N-hexylammonium cation, N,N-dimethyl -N-butyl-N-heptyl ammonium cation, N,N-dimethyl-N-pentyl-N-hexyl ammonium cation, N,N-dimethyl-N,N-dihexyl ammonium cation, tri Methylheptyl ammonium cation, N,N-diethyl-N-methyl-N-propyl ammonium cation, N,N-diethyl-N-methyl-N-pentylammonium cation, N,N -Diethyl-N-methyl-N-heptyl ammonium cation, N,N-diethyl-N-propyl-N-pentylammonium cation, triethylmethyl ammonium cation, triethylpropyl Ammonium cation, triethylpentylammonium cation, triethylheptylammonium cation, N,N-dipropyl-N-methyl-N-ethylammonium cation, N,N-dipropyl-N-methylammonium cation -N-pentylammonium cation, N,N-dipropyl-N-butyl-N-hexylammonium cation, N,N-dipropyl-N,N-dihexylammonium cation, N,N-di Butyl-N-methyl-N-pentylammonium cation, N,N-dibutyl-N-methyl-N-hexylammonium cation, trioctylmethylammonium cation, N-methyl-N-ethyl Base-N-propyl-N-pentylammonium cation, tetramethylammonium cation, tetraethylammonium cation, tetrabutylammonium cation, tetrahexylammonium cation, tributylethylammonium cation, trimethyldecyl Ammonium cation, N,N-diethyl-N-methyl-N-(2-methoxyethyl)ammonium cation, glycidyltrimethylammonium cation, diallyldimethylammonium cation, etc. Alkyl ammonium cations; Trimethylcedium cations, triethylcedium cations, tributylcedium cations, trihexylcedium cations, diethylmethylcedium cations, dibutylethylcedium cations, dimethyldecylcedium cations Trialkylphosphonium cations such as cations; tetramethylphosphonium cations, tetraethylphosphonium cations, tetrabutylphosphonium cations, tetrahexylphosphonium cations, phosphonium cations, triethylmethylphosphonium cations, tributylethylphosphonium cations, Tetraalkylphosphonium cations such as trimethyldecylphosphonium cations and the like. In the present invention, among the above-mentioned cationic components, it is preferable to use a cation represented by formula (A) (particularly 1-ethylpyridinium cation, 1-butyl Basepyridinium cation, 1-hexylpyridinium cation, 1-butyl-3-methylpyridinium cation, 1-butyl-4-methylpyridinium cation, 1-hexyl-3-methylpyridinium cation, 1-butyl-3,4-dimethylpyridinium cation and other pyridinium cations), cations represented by formula (D) (especially triethylmethylammonium cation, tributylethylammonium cation, trimethyl Decyl ammonium cation, diethylmethyl phosphonium cation, dibutyl ethyl phosphonium cation, dimethyldecyl phosphonium cation, triethylmethyl phosphonium cation, tributyl ethyl phosphonium cation, trimethyl decyl Asymmetric tetraalkylammonium cations such as phosphonium cations, trialkylconium cations, tetraalkylphosphonium cations, or N,N-diethyl-N-methyl-N-(2-methoxyethyl)ammonium cation, diallyldimethylammonium cation, glycidyltrimethylammonium cation, etc.) and the like. Specific examples of the cation represented by formula (E) include methyl, ethyl, propyl, butyl, hexyl, octyl, nonyl, decyl, dodecyl, tridecyl, decadecyl, etc. An alkyl group having 1 to 18 carbons such as tetraalkyl and octadecyl is used as the percite salt of Rp. Any appropriate anion component can be used as the above-mentioned anion component as long as it can form an ionic liquid together with the above-mentioned cation component. For example, Cl ^- , Br ^- , I ^- , AlCl ₄ ^- , Al ₂ Cl ₇ ^- , BF ₄ ^- , PF ₆ ^- , ClO ₄ ^- , NO ₃ ^- , CH ₃ COO ^- , CF ₃ COO ^- , CH ₃ SO ₃ ^- , CF ₃ SO ₃ ^- , (CF ₃ SO ₂ ) ₂ N ^- , (CF ₃ SO ₂ ) ₃ C ^- , AsF ₆ ^- , SbF ₆ - , NbF ₆ ^{- ,} TaF ₆ ^- , F(HF ) _n ^- , (CN) ₂ N ^- , C ₄ F ₉ SO ₃ ^- , (C ₂ F ₅ SO ₂ ) ₂ N ^- , C ₃ F ₇ COO ^- , (CF ₃ SO ₂ )(CF ₃ CO)N wait. Hydrophobic anionic components tend not to bleed out on the surface of the adhesive, and are preferably used from the viewpoint of low contamination. Furthermore, an anionic component containing a fluorine atom can obtain an ionic compound with a low melting point, so it is particularly preferably used. The ionic liquid in the present invention can be appropriately selected and used from the combination of the above-mentioned cationic components and anionic components, for example, 1-butylpyridinium tetrafluoroborate, 1-butylpyridinium hexafluorophosphate, 1 -Butyl-3-methylpyridinium tetrafluoroborate, 1-butyl-3-methylpyridinium trifluoromethanesulfonate, 1-butyl-3-methylpyridinium bis(trifluoromethanesulfonate Acyl)imide, 1-butyl-3-methylpyridinium bis(pentafluoroethanesulfonyl)imide, 1-hexylpyridinium tetrafluoroborate, 1,1-dimethylpyrrolidine Onium bis(trifluoromethanesulfonyl)imide, 1-methyl-1-ethylpyrrolidinium bis(trifluoromethanesulfonyl)imide, 1-methyl-1-propylpyrrolidine Onium bis(trifluoromethanesulfonyl)imide, 1-methyl-1-butylpyrrolidinium bis(trifluoromethanesulfonyl)imide, 1-methyl-1-pentylpyrrolidine Onium bis(trifluoromethanesulfonyl)imide, 1-methyl-1-hexylpyrrolidinium bis(trifluoromethanesulfonyl)imide, 1-methyl-1-heptylpyrrolidinium Bis(trifluoromethanesulfonyl)imide, 1-ethyl-1-propylpyrrolidinium bis(trifluoromethanesulfonyl)imide, 1-ethyl-1-butylpyrrolidinium Bis(trifluoromethanesulfonyl)imide, 1-ethyl-1-pentylpyrrolidinium bis(trifluoromethanesulfonyl)imide, 1-ethyl-1-hexylpyrrolidinium bis (Trifluoromethylsulfonyl)imide, 1-ethyl-1-heptylpyrrolidinium bis(trifluoromethylsulfonyl)imide, 1,1-dipropylpyrrolidinium bis(tri Fluoromethanesulfonyl)imide, 1-propyl-1-butylpyrrolidinium bis(trifluoromethanesulfonyl)imide, 1,1-dibutylpyrrolidinium bis(trifluoromethane Sulfonyl)imide, 1-propylpiperidinium bis(trifluoromethanesulfonyl)imide, 1-pentylpiperidinium bis(trifluoromethanesulfonyl)imide, 1, 1-Dimethylpiperidinium bis(trifluoromethanesulfonyl)imide, 1-methyl-1-ethylpiperidinium bis(trifluoromethanesulfonyl)imide, 1-methyl -1-Propylpiperidinium bis(trifluoromethanesulfonyl)imide, 1-methyl-1-butylpiperidinium bis(trifluoromethanesulfonyl)imide, 1-methyl -1-pentylpiperidinium bis(trifluoromethanesulfonyl)imide, 1-methyl-1-hexylpiperidinium bis(trifluoromethanesulfonyl)imide, 1-methyl- 1-heptylpiperidinium bis(trifluoromethanesulfonyl)imide, 1-ethyl-1-propylpiperidinium bis(trifluoromethanesulfonyl)imide, 1-ethyl- 1-Butylpiperidinium bis(trifluoromethanesulfonyl)imide, 1-ethyl-1-pentylpiperidinium bis(trifluoromethanesulfonyl)imide, 1-ethyl- 1-hexylpiperidinium bis(trifluoromethanesulfonyl)imide, 1-ethyl-1-heptylpiperidinium bis(trifluoromethanesulfonyl)imide, 1,1-dipropyl Piperidinium bis(trifluoromethanesulfonyl)imide, 1-propyl-1-butylpiperidinium bis(trifluoromethanesulfonyl)imide, 1,1-dibutylpiperidinium Pyridinium bis(trifluoromethanesulfonyl)imide, 1,1-dimethylpyrrolidinium bis(pentafluoroethanesulfonyl)imide, 1-methyl-1-ethylpyrrolidinium Bis(pentafluoroethanesulfonyl)imide, 1-methyl-1-propylpyrrolidinium bis(pentafluoroethanesulfonyl)imide, 1-methyl-1-butylpyrrolidinium Bis(pentafluoroethanesulfonyl)imide, 1-methyl-1-pentylpyrrolidinium bis(pentafluoroethanesulfonyl)imide, 1-methyl-1-hexylpyrrolidinium bis (Pentafluoroethanesulfonyl)imide, 1-methyl-1-heptylpyrrolidinium bis(pentafluoroethanesulfonyl)imide, 1-ethyl-1-propylpyrrolidinium bis (Pentafluoroethanesulfonyl)imide, 1-ethyl-1-butylpyrrolidinium bis(pentafluoroethanesulfonyl)imide, 1-ethyl-1-pentylpyrrolidinium bis (Pentafluoroethanesulfonyl)imide, 1-ethyl-1-hexylpyrrolidinium bis(pentafluoroethanesulfonyl)imide, 1-ethyl-1-heptylpyrrolidinium bis( Pentafluoroethanesulfonyl) imide, 1,1-dipropylpyrrolidinium bis(pentafluoroethanesulfonyl)imide, 1-propyl-1-butylpyrrolidinium bis(pentafluoro Ethylsulfonyl)imide, 1,1-dibutylpyrrolidinium bis(pentafluoroethanesulfonyl)imide, 1-propylpiperidinium bis(pentafluoroethanesulfonyl)imide Amine, 1-pentylpiperidinium bis(pentafluoroethanesulfonyl)imide, 1,1-dimethylpiperidinium bis(pentafluoroethanesulfonyl)imide, 1-methyl- 1-ethylpiperidinium bis(pentafluoroethanesulfonyl)imide, 1-methyl-1-propylpiperidinium bis(pentafluoroethanesulfonyl)imide, 1-methyl- 1-Butylpiperidinium bis(pentafluoroethanesulfonyl)imide, 1-methyl-1-pentylpiperidinium bis(pentafluoroethanesulfonyl)imide, 1-methyl- 1-hexylpiperidinium bis(pentafluoroethanesulfonyl)imide, 1-methyl-1-heptylpiperidinium bis(pentafluoroethanesulfonyl)imide, 1-ethyl-1 -Propylpiperidinium bis(pentafluoroethanesulfonyl)imide, 1-ethyl-1-butylpiperidinium bis(pentafluoroethanesulfonyl)imide, 1-ethyl-1 -Pentylpiperidinium bis(pentafluoroethanesulfonyl)imide, 1-ethyl-1-hexylpiperidinium bis(pentafluoroethanesulfonyl)imide, 1-ethyl-1- Heptylpiperidinium bis(pentafluoroethanesulfonyl)imide, 1,1-dipropylpiperidinium bis(pentafluoroethanesulfonyl)imide, 1-propyl-1-butyl Piperidinium bis(pentafluoroethanesulfonyl)imide, 1,1-dibutylpiperidinium bis(pentafluoroethanesulfonyl)imide, 2-methyl-1-pyrroline tetrafluoro Borate, 1-ethyl-2-phenylindole tetrafluoroborate, 1,2-dimethylindole tetrafluoroborate, 1-ethylcarbazole tetrafluoroborate, 1-ethyl-3 -Methylimidazolium tetrafluoroborate, 1-ethyl-3-methylimidazolium acetate, 1-ethyl-3-methylimidazolium trifluoroacetate, 1-ethyl-3-methylimidazolium Onium heptafluorobutyrate, 1-ethyl-3-methylimidazolium trifluoromethanesulfonate, 1-ethyl-3-methylimidazolium perfluorobutanesulfonate, 1-ethyl-3- Methylimidazolium dicyandiamide salt, 1-ethyl-3-methylimidazolium bis(trifluoromethylsulfonyl)imide, 1-ethyl-3-methylimidazolium bis(pentafluoroethanesulfonyl) Acyl)imide, 1-ethyl-3-methylimidazolium tris(trifluoromethanesulfonyl)methide, 1-butyl-3-methylimidazolium tetrafluoroborate, 1-butane Base-3-methylimidazolium hexafluorophosphate, 1-butyl-3-methylimidazolium trifluoroacetate, 1-butyl-3-methylimidazolium heptafluorobutyrate, 1-butyl -3-methylimidazolium trifluoromethanesulfonate, 1-butyl-3-methylimidazolium perfluorobutanesulfonate, 1-butyl-3-methylimidazolium bis(trifluoromethanesulfonyl base) imide, 1-hexyl-3-methylimidazolium bromide, 1-hexyl-3-methylimidazolium chloride, 1-hexyl-3-methylimidazolium tetrafluoroborate, 1-hexyl -3-methylimidazolium hexafluorophosphate, 1-hexyl-3-methylimidazolium trifluoromethanesulfonate, 1-octyl-3-methylimidazolium tetrafluoroborate, 1-octyl- 3-methylimidazolium hexafluorophosphate, 1-hexyl-2,3-dimethylimidazolium tetrafluoroborate, 1,2-dimethyl-3-propylimidazolium bis(trifluoromethanesulfonyl base) imide, 1-methylpyrazolium tetrafluoroborate, 3-methylpyrazolium tetrafluoroborate, N,N-dimethyl-N-ethyl-N-propylammonium bis( Trifluoromethanesulfonyl)imide, N,N-Dimethyl-N-ethyl-N-butylammonium bis(trifluoromethanesulfonyl)imide, N,N-Dimethyl- N-ethyl-N-pentylammonium bis(trifluoromethanesulfonyl)imide, N,N-dimethyl-N-ethyl-N-hexylammonium bis(trifluoromethanesulfonyl)imide Imine, N,N-Dimethyl-N-ethyl-N-heptylammonium bis(trifluoromethylsulfonyl)imide, N,N-Dimethyl-N-ethyl-N-nonyl Ammonium bis(trifluoromethanesulfonyl)imide, N,N-dimethyl-N,N-dipropylammonium bis(trifluoromethanesulfonyl)imide, N,N-dimethyl N-propyl-N-butylammonium bis(trifluoromethanesulfonyl)imide, N,N-dimethyl-N-propyl-N-pentylammonium bis(trifluoromethanesulfonyl)imide base) imide, N,N-dimethyl-N-propyl-N-hexylammonium bis(trifluoromethanesulfonyl)imide salt, N,N-dimethyl-N-propyl-N -Heptylammonium bis(trifluoromethanesulfonyl)imide, N,N-Dimethyl-N-butyl-N-hexylammonium bis(trifluoromethanesulfonyl)imide, N,N -Dimethyl-N-butyl-N-heptyl ammonium bis(trifluoromethanesulfonyl)imide, N,N-dimethyl-N-pentyl-N-hexylammonium bis(trifluoromethanesulfonyl)imide Sulfonyl)imide, N,N-dimethyl-N,N-dihexylammonium bis(trifluoromethanesulfonyl)imide, trimethylheptylammonium bis(trifluoromethanesulfonyl)imide ) imide, N,N-diethyl-N-methyl-N-propylammonium bis(trifluoromethanesulfonyl)imide, N,N-diethyl-N-methyl-N -Amyl ammonium bis(trifluoromethanesulfonyl)imide, N,N-diethyl-N-methyl-N-heptylammonium bis(trifluoromethanesulfonyl)imide, N, N-diethyl-N-propyl-N-pentylammonium bis(trifluoromethanesulfonyl)imide, triethylpropylammonium bis(trifluoromethanesulfonyl)imide, triethylammonium Amylpentylammonium bis(trifluoromethanesulfonyl)imide, triethylheptylammonium bis(trifluoromethanesulfonyl)imide, N,N-dipropyl-N-methyl-N -Ethylammonium bis(trifluoromethanesulfonyl)imide, N,N-dipropyl-N-methyl-N-pentylammonium bis(trifluoromethanesulfonyl)imide, N, N-dipropyl-N-butyl-N-hexylammonium bis(trifluoromethanesulfonyl)imide, N,N-dipropyl-N,N-dihexylammonium bis(trifluoromethanesulfonyl)imide base) imide, N,N-dibutyl-N-methyl-N-pentylammonium bis(trifluoromethylsulfonyl)imide, N,N-dibutyl-N-methyl- N-hexylammonium bis(trifluoromethanesulfonyl)imide, trioctylmethylammonium bis(trifluoromethanesulfonyl)imide, N-methyl-N-ethyl-N-propyl -N-pentylammonium bis(trifluoromethanesulfonyl)imide, 1-butylpyridinium(trifluoromethanesulfonyl)trifluoroacetamide, 1-butyl-3-methylpyridinium (Trifluoromethanesulfonyl)trifluoroacetamide, 1-ethyl-3-methylimidazolium (trifluoromethanesulfonyl)trifluoroacetamide, tetrahexylammonium bis(trifluoromethanesulfonyl) ) imide, diallyldimethylammonium tetrafluoroborate, diallyldimethylammonium trifluoromethanesulfonate, diallyldimethylammonium bis(trifluoromethanesulfonyl) Imide, diallyldimethylammonium bis(pentafluoroethanesulfonyl)imide, N,N-diethyl-N-methyl-N-(2-methoxyethyl)ammonium Tetrafluoroborate, N,N-diethyl-N-methyl-N-(2-methoxyethyl)ammonium triflate, N,N-diethyl-N-methyl- N-(2-methoxyethyl)ammonium bis(trifluoromethanesulfonyl)imide, N,N-diethyl-N-methyl-N-(2-methoxyethyl)ammonium Bis(pentafluoroethanesulfonyl)imide, glycidyltrimethylammonium trifluoromethanesulfonate, glycidyltrimethylammonium bis(trifluoromethylsulfonyl)imide, glycidyl Trimethylammonium bis(pentafluoroethanesulfonyl)imide, diallyldimethylbis(pentafluoroethanesulfonyl)imide, and the like. The method for synthesizing the ionic liquid is not particularly limited as long as the desired ionic liquid can be obtained, and generally, the method described in the document "Ionic Liquids - The Frontline and Future of Development -" [published by CMC Co., Ltd.] can be used. The recorded halide method, hydroxide method, acid ester method, complex method, or neutralization method, etc. In addition, commercially available ionic liquids can also be used. (Conductive polymer) As the above-mentioned conductive polymer, any appropriate polymer can be used as long as the effect of the present invention can be obtained. For example, polythiophene, polyaniline, polypyrrole, etc. are mentioned. B-2. The form in which the antistatic material is contained in the substrate as an additive (form (2)) As the antistatic material used in the above form (2), any appropriate antistatic material can be used as long as the effect of the present invention can be obtained. static material. For example, the conductive polymer described in B-1 item, the antistatic agent described in B-3 item mentioned later, etc. can be used. In the above aspect (2), the content ratio of the antistatic material is preferably 20% by weight or less, more preferably 0.05% by weight to 10% by weight, based on the total weight of the substrate. As a method of making the base material contain an antistatic material, it is not particularly limited as long as it is a method in which the above-mentioned antistatic material can be uniformly mixed in the resin used for the base material. A method of including it in a base material such as a press kneader or a twin-screw kneader. B-3. The form in which the antistatic material is contained in a layer (antistatic layer) different from the adhesive layer or the base material (form (3)) As described above, as the antistatic layer in the form (3), for example, Examples include an antistatic layer made of resin (aspect (3a)), an antistatic layer made of metal or metal oxide (aspect (3b)), and the like. The surface resistivity of the antistatic layer is preferably at most 1.0×10 ¹³ Ω/□, more preferably at most 1.0×10 ¹² Ω/□, still more preferably at most 1.0×10 ¹¹ Ω/□. If it is such a range, when sticking to an electronic component material, the damage of the said electronic component material can be prevented. The surface resistivity can be measured based on JIS K 6911 (under 23° C./50% atmosphere, electrode area: 20 cm ² , applied voltage: 500 V, applied time: 30 seconds, using concentric circular electrodes (probes)). <Antistatic layer containing resin (form (3a))> In one embodiment, the antistatic layer contains an antistatic material and a binder resin (form (3a-1)). In this embodiment (form (3a-1)), examples of the antistatic material contained in the antistatic layer include quaternary ammonium salts, pyridinium salts, Cationic antistatic agents with cationic functional groups such as radicals; anionic antistatic agents with anionic functional groups such as sulfonates, or sulfate ester salts, phosphonates, and phosphate salts; alkyl betaines and their derivatives , imidazoline and its derivatives, alanine and its derivatives and other zwitterionic antistatic agents; amino alcohol and its derivatives, glycerin and its derivatives, polyethylene glycol and its derivatives and other non-ionic antistatic agents Agents; ion-conductive polymers obtained by polymerizing or copolymerizing monomers having the aforementioned cationic, anionic, and zwitterionic ion-conductive groups, and the like. These compounds may be used alone or in combination of two or more. Specific examples of the aforementioned cationic antistatic agents include, for example, alkyltrimethylammonium salts, acyloxyamidopropyltrimethylammonium methylsulfate, alkylbenzylmethylammonium salts, acyl (meth)acrylate copolymers with quaternary ammonium groups such as choline chloride, polydimethylaminoethyl methacrylate, etc., polyvinylbenzyltrimethylammonium chloride, etc. have quaternary ammonium groups Diallylamine copolymers with quaternary ammonium groups such as styrene copolymers, polydiallyldimethylammonium chloride, etc. These compounds may be used alone or in combination of two or more. Specific examples of the above-mentioned anionic antistatic agent include, for example, alkyl sulfonates, alkylbenzene sulfonates, alkyl sulfate ester salts, alkyl ethoxy sulfate ester salts, alkyl phosphate ester salts, Styrene copolymers containing sulfonic acid groups, etc. These compounds may be used alone or in combination of two or more. Specific examples of the aforementioned zwitterionic antistatic agent include alkyl betaines, alkylimidazolium betaines, and carbobetaine graft copolymers. These compounds may be used alone or in combination of two or more. Specific examples of the aforementioned nonionic antistatic agents include, for example, fatty acid alkanolamides, di(2-hydroxyethyl)alkylamines, polyoxyethylene alkylamines, fatty acid glycerides, polyoxyethylene dialkylamines, Alcohol fatty acid ester, sorbitan fatty acid ester, polyoxysorbitan fatty acid ester, polyoxyethylene alkylphenyl ether, polyoxyethylene alkyl ether, polyethylene glycol, polyoxyethylene diamine, Including polyether, copolymer of polyester and polyamide, methoxypolyethylene glycol (meth)acrylate, etc. These compounds may be used alone or in combination of two or more. Any appropriate resin can be used as the binder resin constituting the antistatic layer. For example, polyester resin, acrylic resin, polyethylene resin, urethane resin, melamine resin, epoxy resin, etc. are mentioned. Moreover, a crosslinking agent can also be used together. Examples of the crosslinking agent include methylolated or alkylated melamine-based compounds, urea-based compounds, glyoxal-based compounds, acrylamide-based compounds, epoxy-based compounds, and isocyanate-based compounds. In another embodiment, the antistatic layer is formed of a conductive polymer (aspect (3a-2)). As the conductive polymer, any appropriate polymer can be used as long as the effect of the present invention can be obtained. For example, polythiophene, polyaniline, polypyrrole, etc. are mentioned. As a method of forming an antistatic layer containing a resin (adhesive resin, conductive polymer), for example, the following method can be mentioned: an antistatic layer prepared by diluting the above-mentioned antistatic material and an adhesive resin with any appropriate solvent. A method in which the composition for layer formation, or the composition for antistatic layer formation prepared by diluting the above-mentioned conductive polymer with any suitable solvent is applied to a substrate, an adhesive layer or an elastic layer, and dried. Examples of solvents used in the above-mentioned coating solution include: water; methyl ethyl ketone, acetone, ethyl acetate, tetrahydrofuran, dihydrofuran,

Alkanes, cyclohexanone, n-hexane, toluene, xylene, methanol, ethanol, n-propanol, isopropanol and other organic solvents. These solvents may be used alone or in combination of two or more. Any appropriate method can be adopted as the coating method of the above-mentioned coating liquid. For example, a roll coating method, a gravure coating method, a reverse roll coating method, a roll brush method, a spray coating method, an air knife coating method, a dipping method, a curtain coating method, etc. are mentioned. The thickness of the antistatic layer including resin is preferably from 0.01 μm to 5 μm, more preferably from 0.03 μm to 1 μm. When the thickness of the antistatic layer is less than 0.01 μm, the antistatic function may not be stably exhibited. In addition, when the thickness of the antistatic layer exceeds 5 μm, there is a possibility of occurrence of poor appearance due to uneven coating or the like. <Antistatic Layer Made of Metal or Metal Oxide (Aspect (3b))> In the above-mentioned aspect (3b), the antistatic layer may be formed of any appropriate metal or metal oxide as long as the effect of the present invention can be obtained. Examples of metals include indium, tin, antimony, gold, silver, copper, aluminum, nickel, chromium, titanium, iron, cobalt, copper iodide, and alloys or mixtures thereof. Among them, aluminum is preferable. In addition, examples of metal oxides include indium tin oxide, indium zinc oxide, tin oxide, antimony oxide, and indium oxide. Examples of methods for forming the antistatic layer made of metal or metal oxide include vacuum evaporation, sputtering, ion plating, chemical evaporation, spray pyrolysis, electroless plating, and electroplating. In addition, a metal film or a metal oxide film can also be laminated on the substrate, the adhesive layer or the elastic layer to form an antistatic layer. The thickness of the antistatic layer made of metal or metal oxide is preferably from 2 nm to 1000 nm, more preferably from 5 nm to 500 nm. C. Adhesive Layer The above-mentioned adhesive layer preferably includes an adhesive and heat-expandable microspheres. In addition, the adhesive layer may also include an antistatic material as described in item B. The thickness of the adhesive layer is preferably 300 μm or less, more preferably 5 μm to 150 μm, and still more preferably 10 μm to 100 μm. When the thickness of the adhesive layer is greater than 300 μm, there is a risk of the following disadvantages: the use of equipment is limited, the productivity is significantly reduced, and the processing accuracy when used in cutting steps such as dicing (straightness of the cut surface, wafer notch) etc.) to reduce adverse situations. The elastic modulus of the adhesive layer measured by nanoindentation method at 25° C. is preferably 0.1 MPa to 100 MPa, more preferably 0.5 MPa to 50 MPa, and still more preferably 0.8 MPa to 30 MPa. The elastic modulus measured by the nano-indentation method refers to the continuous measurement of the load and indentation depth of the indenter when the indenter is pressed into the sample (adhesive surface) throughout the loading and unloading. The elastic modulus obtained from the load load-indentation depth curve. In this manual, the elastic modulus measured by the nanoindentation method means that the measurement conditions are as follows: load: 1 mN, loading/unloading speed: 0.1 mN/s, holding time: 1 s, and measure as described above. The modulus of elasticity. In addition, the elastic modulus of the adhesive layer measured by the nanoindentation method refers to the elastic modulus measured by the above-mentioned measurement method by selecting a portion where no heat-expandable microspheres exist, that is, the elastic modulus of the adhesive. When the above-mentioned adhesive layer contains an antistatic material, the surface resistivity of the adhesive layer is preferably not more than 1.0×10 ¹³ Ω/□, more preferably not more than 1.0×10 ¹² Ω/□, and still more preferably not more than 1.0×10 ¹¹ Ω /□ below. If it is such a range, when sticking to an electronic component material, the damage of the said electronic component material can be prevented. (Adhesive) As the adhesive, an acrylic adhesive is preferably used. Examples of acrylic adhesives include acrylic polymers (homopolymers or copolymers) that use one or more alkyl (meth)acrylates as monomer components as base polymers. Acrylic adhesives, etc. The base polymer constituting the above-mentioned adhesive includes a structural unit A derived from an alkyl (meth)acrylate having a side chain of a branched structure. By using a polymer containing the structural unit A as the base polymer, it is possible to obtain a heat-peelable adhesive sheet excellent in adhesive force and excellent in uneven followability. If such a heat-peelable adhesive sheet is used for temporary fixation at the time of cutting the electronic component material, it is possible to prevent the chip of the material from flying. In the above-mentioned base polymer, the content ratio of the structural unit A is preferably at least 20% by weight, more preferably 25% by weight to 99% by weight, and still more preferably 55% by weight to 99% by weight. If it is such a range, the said effect (high adhesive force, high uneven|corrugation followability) will become remarkable. The carbon number of the side chain of the branched chain structure of the above-mentioned structural unit A is preferably 5 or more, more preferably 6-18, and still more preferably 8-18. If it is in such a range, the above-mentioned effects (high adhesive force, high unevenness followability) will become remarkable. Examples of the alkyl (meth)acrylate constituting the structural unit A include: isobutyl (meth)acrylate, second butyl (meth)acrylate, third butyl (meth)acrylate, ( 2-ethylhexyl methacrylate, isooctyl (meth)acrylate, isononyl (meth)acrylate, isodecyl (meth)acrylate, 2-ethylbutyl (meth)acrylate, 2-methylbutyl (meth)acrylate, etc. In the above structural unit A, the number of carbon atoms of the alkyl group constituting the side chain of the branched structure is preferably 5 or more, more preferably 6-18, and still more preferably 8-18. If it is such a range, the said effect (high adhesive force, high uneven|corrugation followability) will become remarkable. Examples of the alkyl (meth)acrylate other than the alkyl (meth)acrylate constituting the structural unit A include: methyl (meth)acrylate, ethyl (meth)acrylate, (meth)acrylate Propyl acrylate, Butyl (meth)acrylate, Pentyl (meth)acrylate, Hexyl (meth)acrylate, Heptyl (meth)acrylate, Octyl (meth)acrylate, Nonyl (meth)acrylate ester, decyl (meth)acrylate, eicosyl (meth)acrylate, etc. An alkyl (meth)acrylate having a linear alkyl group having 1 to 18 carbon atoms can be preferably used. The above-mentioned base polymer (acrylic polymer) may contain units corresponding to other monomer components that can be copolymerized with the above-mentioned alkyl (meth)acrylate for the purpose of modifying cohesion, heat resistance, cross-linking, etc. . Examples of such monomer components include carboxyl group-containing monomers such as acrylic acid, methacrylic acid, carboxyethyl acrylate, carboxypentyl acrylate, itaconic acid, maleic acid, fumaric acid, and crotonic acid; Acid anhydride monomers such as acid anhydride and itaconic anhydride; hydroxyethyl (meth)acrylate, hydroxypropyl (meth)acrylate, hydroxybutyl (meth)acrylate, hydroxyhexyl (meth)acrylate, (meth) Hydroxyl-containing monomers such as hydroxyoctyl acrylate, hydroxydecyl (meth)acrylate, hydroxylauryl (meth)acrylate, (4-hydroxymethylcyclohexyl)methyl methacrylate, etc.; styrenesulfonic acid, olefin Propylsulfonic acid, 2-(meth)acrylamide-2-methylpropanesulfonic acid, (meth)acrylamidopropanesulfonic acid, (meth)sulfopropyl acrylate, (meth)acryloxy Monomers containing sulfonic acid groups such as naphthalene sulfonic acid; (meth)acrylamide, N,N-dimethyl(meth)acrylamide, N-butyl(meth)acrylamide, N- (N-substituted) amide-based monomers such as methylol (meth)acrylamide, N-methylolpropane (meth)acrylamide; (meth)aminoethyl acrylate, (methyl) Aminoalkyl (meth)acrylate monomers such as N,N-dimethylaminoethyl acrylate and tertiary butylaminoethyl (meth)acrylate; methoxyethyl (meth)acrylate Alkoxyalkyl (meth)acrylate monomers such as ethoxyethyl (meth)acrylate; N-cyclohexylmaleimide, N-isopropylmaleimide, N -Maleimide-based monomers such as laurylmaleimide and N-phenylmaleimide; N-methyl itaconimide, N-ethyl itaconimide, N- Butyl itaconimide, N-octyl itaconimide, N-2-ethylhexyl itaconimide, N-cyclohexyl itaconimide, N-lauryl itaconimide Isoconyl imine monomer; N-(meth)acryloxymethylene succinimide, N-(meth)acryl-6-oxyhexamethylene succinimide , N-(meth)acryl-8-oxyoctamethylene succinimide and other succinimide-based monomers; vinyl acetate, vinyl propionate, N-vinylpyrrolidone, methylvinyl Vinylpyrrolidone, Vinylpyridine, Vinylpiperidone, Vinylpyrimidine, Vinylpiperazine, Vinylpyrazine, Vinylpyrrole, Vinylimidazole, Vinyloxazole, Vinylmorpholine, N-Vinylcarboxylate Vinyl monomers such as amides, styrene, α-methylstyrene, and N-vinylcaprolactam; cyanoacrylate monomers such as acrylonitrile and methacrylonitrile; glycidyl (meth)acrylate Epoxy group-containing acrylic monomers such as esters; polyethylene glycol (meth)acrylate, polypropylene glycol (meth)acrylate, methoxyethylene glycol (meth)acrylate, methyl (meth)acrylate Diol-based acrylate monomers such as oxypolypropylene glycol esters; tetrahydrofurfuryl (meth)acrylate, fluoro(meth)acrylate, silicone (meth)acrylate, etc. have heterocycles, halogen atoms, and silicon atoms Acrylate-based monomers such as hexanediol di(meth)acrylate, (poly)ethylene glycol di(meth)acrylate, (poly)propylene glycol di(meth)acrylate, neopentyl glycol diacrylate (meth)acrylate, pentaerythritol di(meth)acrylate, trimethylolpropane tri(meth)acrylate, pentaerythritol tri(meth)acrylate, dipentaerythritol hexa(meth)acrylate, epoxy Polyfunctional monomers such as acrylate, polyester acrylate, and urethane acrylate; olefin-based monomers such as isoprene, butadiene, and isobutylene; vinyl ether-based monomers such as vinyl ether, etc. These monomer components can be used individually or in combination of 2 or more types. The content ratio of the above-mentioned units corresponding to other monomer components is preferably 1 to 20 parts by weight, more preferably 2 to 15 parts by weight, and still more preferably 2 parts by weight to 100 parts by weight of the base polymer. Parts by weight to 10 parts by weight. If it is within such a range, it is possible to balance the characteristics of unevenness followability to the adherend, adhesive force, and heat peelability. The said adhesive agent may contain arbitrary appropriate additives as needed. Examples of such additives include crosslinking agents, tackifiers, plasticizers (for example, trimellitate-based plasticizers, pyromellitate-based plasticizers), pigments, dyes, fillers, Aging agent, conductive material, ultraviolet absorber, light stabilizer, peeling regulator, softener, surfactant, flame retardant, antioxidant, etc. Any appropriate thickener is used as the above-mentioned thickener. As a tackifier, for example, a tackifying resin is used. Specific examples of tackifying resins include: rosin-based tackifying resins (such as unmodified rosin, modified rosin, rosin-phenolic resins, rosin ester-based resins, etc.), terpene-based tackifying resins (such as terpene-based resin, terpene phenolic resin, styrene-modified terpene-based resin, aromatic-modified terpene-based resin, hydrogenated terpene-based resin), hydrocarbon-based tackifying resin (such as aliphatic Hydrocarbon resins, aromatic hydrocarbon resins (such as styrene-based resins, xylene-based resins, etc.), aliphatic and aromatic petroleum resins, aliphatic and alicyclic petroleum resins, hydrogenated hydrocarbon resins, coumarone-based resin, coumarone indene resin, etc.), phenolic tackifying resin (such as alkylphenol resin, xylene formaldehyde resin, cresol resin, novolak, etc.), ketone tackifying resin, polyamide tackifying resin Adhesive resin, epoxy tackifying resin, elastic system tackifying resin, etc. Of these, rosin-based tackifying resins, terpene-based tackifying resins, or phenol-based tackifying resins are preferred. Particularly preferred are rosin-phenol-based tackifying resins and terpene-phenol-based tackifying resins. These tackifiers show relatively good compatibility with the base polymer, therefore, the adhesive obtained by using the tackifier can obtain stable unevenness followability. As a result, a heat-peelable adhesive sheet excellent in suppression of wafer scattering can be obtained. A thickener can be used individually or in combination of 2 or more types. A commercial item can be used for the said thickener. Specific examples of commercially available thickeners include terpene phenol resins such as "YS polystar S145" and "Mighty Ace K140" manufactured by Yasuhara Chemical Co., Ltd., and "Tamanol 901" manufactured by Arakawa Chemical Co., Ltd. Rosin phenol resins such as "SUMILITERESIN PR-12603" manufactured by Sumitomo Bakelite Co., Ltd., "Tamanol 361" manufactured by Arakawa Chemical Co., Ltd.; alkanes such as "Tamanol 1010R" and "Tamanol 200N" manufactured by Arakawa Chemical Co., Ltd. phenolic resins; alicyclic saturated hydrocarbon resins such as "Alcon P-140" manufactured by Arakawa Chemical Co., Ltd., etc. The content of the above tackifier is preferably 1 to 80 parts by weight, more preferably 5 to 70 parts by weight, and still more preferably 10 to 50 parts by weight, based on 100 parts by weight of the base polymer. , particularly preferably 10 to 40 parts by weight. Adhesive force can be improved by adding a tackifier. On the other hand, the addition of a tackifier is the main reason for hindering the irregularity followability of the adhesive sheet. The agent layer can take into account the uneven followability and high adhesion. Examples of the crosslinking agent include isocyanate crosslinking agents, epoxy crosslinking agents, melamine crosslinking agents, peroxide crosslinking agents, urea crosslinking agents, and metal alkoxide crosslinking agents. agent, metal chelating agent-based cross-linking agent, metal salt-based cross-linking agent, carbodiimide-based cross-linking agent, oxazoline-based cross-linking agent, aziridine-based cross-linking agent, amine-based cross-linking agent, etc. Among these, an isocyanate-based crosslinking agent or an epoxy-based crosslinking agent is preferable. Specific examples of the above-mentioned isocyanate-based crosslinking agents include: lower aliphatic polyisocyanates such as butyl diisocyanate and hexamethylene diisocyanate; cyclopentyl diisocyanate, cyclohexylene diisocyanate, isophor Cycloaliphatic isocyanates such as ketone diisocyanate; Aromatic isocyanates such as 2,4-toluene diisocyanate, 4,4'-diphenylmethane diisocyanate, xylene diisocyanate; Trimethylolpropane/toluene diisocyanate3 Polymer adduct (manufactured by Nippon Polyurethane Industry Co., Ltd., trade name "CORONATE L"), trimethylolpropane/hexamethylene diisocyanate 3-polymer adduct (manufactured by Nippon Polyurethane Industry Co., Ltd., trade name "CORONATE HL") ”), isocyanurate adducts of hexamethylene diisocyanate (manufactured by Nippon Polyurethane Industry Co., Ltd., trade name “CORONATE HX”) and other isocyanate adducts; etc. The content of the isocyanate-based crosslinking agent can be set to any appropriate amount according to the target adhesive force, and is typically 0.1 to 20 parts by weight, more preferably 0.5 to 10 parts by weight, based on 100 parts by weight of the base polymer. Examples of the epoxy-based crosslinking agent include: N,N,N',N'-tetraglycidyl-m-xylylenediamine, diglycidylaniline, 1,3-bis(N,N- Glycidylaminomethyl)cyclohexane (manufactured by Mitsubishi Gas Chemical Co., trade name "TETRAD C"), 1,6-hexanediol diglycidyl ether (manufactured by Kyoeisha Chemical Co., Ltd., trade name "Epolight 1600") "), neopentyl glycol diglycidyl ether (manufactured by Kyoeisha Chemical Co., Ltd., trade name "Epolight 1500NP"), ethylene glycol diglycidyl ether (manufactured by Kyoeisha Chemical Co., Ltd., trade name "Epolight 40E"), Propylene glycol diglycidyl ether (manufactured by Kyoeisha Chemical Co., Ltd., trade name "Epolight 70P"), polyethylene glycol diglycidyl ether (manufactured by NOF Corporation, trade name "EPIOL E-400"), polypropylene glycol diglycidyl Ether (manufactured by NOF Corporation, trade name "EPIOL P-200"), sorbitol polyglycidyl ether (manufactured by Nagase ChemteX, trade name "Denacol EX-611"), glycerin polyglycidyl ether (manufactured by Nagase ChemteX) , trade name "Denacol EX-314"), pentaerythritol polyglycidyl ether, polyglycerol polyglycidyl ether (manufactured by Nagase ChemteX, trade name "Denacol EX-512"), sorbitan polyglycidyl ether, trihydroxy Methyl propane polyglycidyl ether, diglycidyl adipate, diglycidyl phthalate, triglycidyl-tris(2-hydroxyethyl)isocyanurate, resorcinol diglycidyl Glyceryl ether, bisphenol-S-diglycidyl ether, epoxy resin with more than 2 epoxy groups in the molecule, etc. The content of the epoxy-based crosslinking agent can be set to any appropriate amount according to the required adhesive force. Typically, it is 0.01 to 10 parts by weight, more preferably 0.03 to 10 parts by weight, relative to 100 parts by weight of the base polymer. 5 parts by weight. (Heat-expandable microspheres) As the above-mentioned heat-expandable microspheres, any appropriate heat-expandable microspheres can be used as long as they are capable of expanding or foaming by heating. As the above-mentioned heat-expandable microspheres, for example, microspheres obtained by enclosing a substance that is easily expanded by heating in an elastic shell can be used. Such heat-expandable microspheres can be produced by any appropriate method such as coacervation method, interfacial polymerization method and the like. Examples of substances that are easily expanded by heating include: propane, propylene, butene, n-butane, isobutane, isopentane, neopentane, n-pentane, n-hexane, isohexane, heptane, octane Alkanes, petroleum ether, halides of methane, tetraalkylsilanes and other low-boiling liquids; azodicarbonamide vaporized by pyrolysis; etc. Examples of the material constituting the above-mentioned shell include polymers composed of acrylonitrile, methacrylonitrile, α-chloroacrylonitrile, α-ethoxyacrylonitrile, fumaronitrile, and other nitriles. Monomer; Acrylic acid, methacrylic acid, itaconic acid, maleic acid, fumaric acid, citraconic acid and other carboxylic acid monomers; vinylidene chloride; vinyl acetate; (meth)methyl acrylate, (meth) Ethyl acrylate, n-butyl (meth)acrylate, isobutyl (meth)acrylate, tert-butyl (meth)acrylate, isobornyl (meth)acrylate, cyclohexyl (meth)acrylate, (Meth)acrylates such as benzyl (meth)acrylate and β-carboxyethyl acrylate; styrene monomers such as styrene, α-methylstyrene, and chlorostyrene; acrylamide, substituted acrylamide, Amide monomers such as methacrylamide and substituted methacrylamide; etc. The polymer composed of these monomers may be a homopolymer or a copolymer. Examples of such copolymers include: vinylidene chloride-methyl methacrylate-acrylonitrile copolymer, methyl methacrylate-acrylonitrile-methacrylonitrile copolymer, methyl methacrylate-acrylonitrile copolymer , Acrylonitrile-methacrylonitrile-itaconic acid copolymer, etc. As the heat-expandable microspheres, an inorganic foaming agent or an organic foaming agent can be used. Examples of the inorganic foaming agent include ammonium carbonate, ammonium bicarbonate, sodium bicarbonate, ammonium nitrite, sodium borohydride, various azides, and the like. In addition, examples of organic blowing agents include: chlorofluoroalkane compounds such as trichlorofluoromethane and dichlorofluoromethane; azobisisobutyronitrile, azodicarbonamide, azodicarboxylic acid Azo compounds such as barium; p-toluenesulfonylhydrazine, diphenylsulfone-3,3'-disulfonylhydrazine, 4,4'-oxobis(benzenesulfonylhydrazine), allylbis(sulfonylhydrazine) Hydrazine) and other hydrazine compounds; p-toluenesulfonyl semicarbazide, 4,4'-oxobis (benzenesulfonyl semicarbazide) and other semiurea compounds; 5-morpholino-1,2, Triazole compounds such as 3,4-thiotriazole; N,N'-dinitrosopentamethylenetetramine, N,N'-dimethyl-N,N'-dinitroso-p-phenylene Diformamide; N-nitroso compounds, etc. Commercially available items can also be used for the above-mentioned heat-expandable microspheres. Specific examples of commercially available heat-expandable microspheres include: Matsumoto Yushi Pharmaceutical Co., Ltd.'s trade name "Matsumoto Microsphere" (model: F-30, F-30D, F-36D, F-36LV, F-50 , F-50D, F-65, F-65D, FN-100SS, FN-100SSD, FN-180SS, FN-180SSD, F-190D, F-260D, F-2800D), trade names manufactured by Japan Fillite Corporation " Expancel” (Model: 053-40, 031-40, 920-40, 909-80, 930-120), Kureha Chemical Industry Co., Ltd. “DAIFOAM” (Model: H750, H850, H1100, S2320D, S2640D, M330, M430, M520), "ADVANCELL" manufactured by Sekisui Chemical Industry Co., Ltd. (model: EML101, EMH204, EHM301, EHM302, EHM303, EM304, EHM401, EM403, EM501), etc. The particle size of the thermally expandable microspheres before heating is preferably 0.5 μm to 80 μm, more preferably 5 μm to 45 μm, further preferably 10 μm to 20 μm, particularly preferably 10 μm to 15 μm. Therefore, when the particle size of the thermally expandable microspheres before heating is described by the average particle diameter, it is preferably 6 μm to 45 μm, more preferably 10 μm to 35 μm. The above-mentioned particle diameter and average particle diameter are the values obtained by the particle size distribution measurement method in the laser scattering method. The above-mentioned heat-expandable microspheres preferably have a volume expansion rate until reaching a suitable strength that is preferably 5 times or more, more preferably 7 times or more, and more preferably 10 times or more without breaking. When such heat-expandable microspheres are used, the adhesive force can be effectively reduced by heat treatment. The content ratio of the heat-expandable microspheres of the said adhesive layer can be suitably set according to the reduction property of the desired adhesive force, etc. The content ratio of heat-expandable microspheres is, for example, 1 to 150 parts by weight, preferably 10 to 130 parts by weight, and more preferably 25 parts by weight relative to 100 parts by weight of the base polymer forming the adhesive layer. Parts to 100 parts by weight. D. Substrate Examples of the substrate include resin sheets, nonwoven fabrics, paper, metal foils, woven fabrics, rubber sheets, foam sheets, and laminates thereof (especially laminates containing resin sheets). As the resin constituting the resin sheet, for example, polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polybutylene terephthalate (PBT), polyethylene (PE ), polypropylene (PP), ethylene-propylene copolymer, ethylene-vinyl acetate copolymer (EVA), polyamide (nylon), fully aromatic polyamide (aramid), polyimide (PI) , polyvinyl chloride (PVC), polyphenylene sulfide (PPS), fluororesin, polyether ether ketone (PEEK), etc. Examples of nonwoven fabrics include: nonwoven fabrics made of heat-resistant natural fibers such as Manila hemp nonwoven fabrics; synthetic resin nonwoven fabrics such as polypropylene resin nonwoven fabrics, polyethylene resin nonwoven fabrics, and ester resin nonwoven fabrics; and the like. In one embodiment, as described in item B, the above-mentioned substrate may include an antistatic material. As a base material containing an antistatic material, for example, a resin sheet kneaded with an antistatic material can be used. The resin sheet can be formed from a substrate-forming composition comprising a resin and an antistatic material. In other embodiments, a metal foil or the like is used as the base material, and the base material itself may be an antistatic material. The thickness of the above-mentioned substrate can be set to any appropriate thickness according to the required strength, flexibility, purpose of use, and the like. The thickness of the substrate is preferably less than 1000 μm, more preferably 1 μm to 1000 μm, further preferably 1 μm to 500 μm, particularly preferably 3 μm to 300 μm, most preferably 5 μm to 250 μm. The aforementioned base material may be subjected to surface treatment. Examples of surface treatment include corona treatment, chromic acid treatment, ozone exposure, flame exposure, high-voltage electric shock exposure, ionizing radiation treatment, coating treatment with a primer, and the like. Such surface treatment can improve the adhesiveness between the adhesive layer and the substrate. Examples of the organic coating material include those described in Plastic Hard Coating Material II (CMC Press, (2004)). It is preferable to use urethane polymer, more preferably to use polyacrylate urethane, polyester urethane or their precursors. The reason for this is that it is easy to apply and apply to the substrate, and industrially, various substances can be selected and obtained at low cost. The urethane polymer is, for example, a polymer comprising a reaction mixture of an isocyanate monomer and an alcoholic hydroxyl-containing monomer (such as a hydroxyl-containing acrylic compound or a hydroxyl-containing ester compound). The organic coating material may contain chain extenders such as polyamines, anti-aging agents, oxidation stabilizers, etc. as optional additives. The thickness of the organic coating layer is not particularly limited, for example, about 0.1 μm to 10 μm is suitable, more preferably about 0.1 μm to 5 μm, more preferably about 0.5 μm to 5 μm. E. Elastic layer As described above, the heat-peelable adhesive sheet of the present invention may further include an elastic layer. The elastic layer includes a base polymer, and an adhesive polymer can be used as the base polymer. Examples of the base polymer constituting the elastic layer include: acrylic polymers: rubber-based polymers such as natural rubber and synthetic rubber (such as nitrile, diene, and acrylic); thermoplastic polymers such as polyolefin and polyester; Elastomers; Vinyl alkyl ether polymers; Silicone polymers; Polyester polymers; Polyamide polymers; Urethane polymers; Styrene-diene block copolymers; Ethylene-vinyl acetate copolymer; polyurethane polymer; polybutadiene; soft polyvinyl chloride; radiation hardening polymer, etc. The base polymer constituting the elastic layer may be the same as or different from the base polymer forming the adhesive layer. The above-mentioned elastic layer may also be a foamed film formed of the above-mentioned base polymer. The foamed film can be obtained by any appropriate method. Furthermore, the elastic layer and the adhesive layer can be distinguished by the presence or absence of heat-expandable microspheres (the elastic layer does not contain heat-expandable microspheres). The above-mentioned acrylic polymer as the base polymer constituting the elastic layer is, for example, an acrylic polymer (homopolymer or copolymer) using one or two or more alkyl (meth)acrylates as monomer components. Specific examples of the alkyl (meth)acrylate include alkyl (meth)acrylates having a linear or branched alkyl group having 20 or less carbon atoms. In addition, the above-mentioned acrylic polymer may contain units corresponding to other monomer components copolymerizable with the alkyl (meth)acrylate. Examples of such monomer components include acrylic acid, methacrylic acid, itaconic acid, hydroxyethyl acrylate, hydroxyethyl methacrylate, hydroxypropyl acrylate, hydroxypropyl methacrylate, N-methylol Acrylamide, acrylonitrile, methacrylonitrile, glycidyl acrylate, glycidyl methacrylate, vinyl acetate, styrene, isoprene, butadiene, isobutylene, vinyl ether, etc. The above-mentioned elastic layer may contain any appropriate additives as needed. Examples of such additives include crosslinking agents, vulcanizing agents, tackifiers, plasticizers, softeners, fillers, antiaging agents and the like. When a hard resin such as polyvinyl chloride is used as the base polymer, it is preferable to use a plasticizer and/or a softener in combination to form an elastic layer having desired elasticity. The thickness of the elastic layer is preferably from 3 μm to 200 μm, more preferably from 5 μm to 100 μm. If it is such a range, the said function of an elastic layer can fully be exhibited. The tensile elastic modulus at 25° C. of the elastic layer is preferably less than 100 MPa, more preferably 0.1 MPa to 50 MPa, still more preferably 0.1 MPa to 10 MPa. If it is such a range, the said function of an elastic layer can fully be exhibited. F. Manufacturing method of heat-peelable adhesive sheet The heat-peelable adhesive sheet of the present invention can be manufactured by any appropriate method. The heat-peelable adhesive sheet of the present invention includes, for example, the method of directly coating the composition for forming an adhesive layer on the substrate, or the method of coating the composition for forming an adhesive layer on any appropriate substrate. The method of transferring the coating layer to the substrate, etc. The composition for forming an adhesive layer includes the adhesive and the heat-expandable microspheres, and further includes an antistatic material if necessary. In addition, the composition for adhesive layer formation may contain arbitrary appropriate solvents. When the above-mentioned heat-peelable adhesive sheet has an antistatic layer containing a resin, the antistatic layer can be obtained by diluting the above-mentioned antistatic material and adhesive resin with any appropriate solvent as described in item B-3. The composition for forming an antistatic layer, or the composition for forming an antistatic layer obtained by diluting the above-mentioned conductive polymer with any appropriate solvent is applied to a base material, an adhesive layer or an elastic layer. When the above-mentioned antistatic layer is formed by a metal layer or a metal oxide layer, the metal layer or the metal oxide layer can be as described in item B-3, for example, by vacuum evaporation, sputtering, ion plating, chemical evaporation, etc. Plating method, spray pyrolysis method, chemical plating method, electroplating method and other film-making methods to form. In addition, the antistatic layer can also be formed by laminating a metal film or a metal oxide film on the substrate, the adhesive layer or the elastic layer. The timing of forming the antistatic layer is not particularly limited, and may be formed at any appropriate timing depending on the configuration of the heat-peelable adhesive sheet. For example, the antistatic layer can be formed after forming the laminate of the substrate and the adhesive layer. In addition, it is also possible to form an adhesive layer (or an elastic layer) on a base material with an antistatic layer after forming an antistatic layer on the substrate, or to form an antistatic layer on the adhesive layer (or an elastic layer). Transfer the adhesive layer (or elastic layer) with antistatic layer to the substrate. When the adhesive layer has the above-mentioned elastic layer, the elastic layer can be formed, for example, by coating the composition for forming an elastic layer on the substrate or on the adhesive layer. In addition, the elastic layer can be formed by transferring a coating layer formed by coating an elastic layer-forming composition on any appropriate substrate. Any appropriate coating method can be employed as a coating method for each of the above-mentioned compositions. For example, each layer can be formed by drying after coating. As a coating method, the coating method using a multicoater (multicoater), a die coater, a gravure coater, a spreader, etc. is mentioned, for example. As a drying method, natural drying, heat drying, etc. are mentioned, for example. The heating temperature during heat drying can be set to any appropriate temperature according to the characteristics of the material to be dried. G. Method of Using Heat Peelable Adhesive Sheet ( Method of Manufacturing Electronic Parts ) According to another embodiment of the present invention, a method of manufacturing electronic parts is provided. The manufacturing method of the electronic component of the present invention comprises the following steps: attaching the obtained electronic component material in a large area on the above-mentioned heat-peelable adhesive sheet, and cutting the electronic component material. Examples of the aforementioned electronic components include: components for semiconductor devices such as silicon wafers; multilayer capacitors; inductors; resistors; piezoelectric elements; vibrators; LEDs; transparent electrodes; In the above-mentioned manufacturing method, first, the above-mentioned heat-peelable adhesive sheet is placed on the processing table, and the obtained electronic component material is attached in a large area on the heat-peelable adhesive sheet. Thereafter, the electronic component material can be obtained by cutting the above-mentioned electronic component material by any appropriate method. As the method of the above-mentioned cutting process, for example, a method using a cutter such as a rotary knife or a flat knife, a method using a laser beam, and the like are mentioned. In the cutting process described above, cutting may be performed under heating. For example, the cutting process can be performed by heating the above-mentioned processing table to 30°C to 150°C. EXAMPLES Hereinafter, although an Example demonstrates this invention concretely, this invention is not limited to these Examples. The evaluation methods in the examples are as follows. In addition, in an Example, unless otherwise indicated, "part" and "%" are based on weight. (1) Cutting workability A QFN lead frame (size: 125mm) encapsulated with epoxy resin (manufactured by Hitachi Chemical Co., Ltd., trade name "CEL-9200HF9") is attached to the adhesive layer of the heat-peelable adhesive sheet. mm×65 mm; the adhesive surface of the adhesive sheet is a resin surface (surface roughness Ra: 3 μm), which is installed and fixed on a 6-inch cutting ring, and is fully cut into 250 pieces of 5 mm×5 mm by a cutting machine Wafers of different sizes (cutting processing by dicing were performed), and the number of wafers that scattered during the dicing was counted as an evaluation of the cutting workability. The cutter uses ZH05-SD2000-N1-110-DD manufactured by DISCO. The feed speed of the cutting knife is set to 70 mm/S, and the rotational speed of the cutting knife is set to 50000/s. (2) Heat Peelability After cutting in (1) above, heat treatment was performed at 130° C. for 10 minutes using a hot air dryer (manufactured by ESPEC, trade name “SPH-201”). After the heat treatment, turn the heat-peelable adhesive sheet over so that the wafer is on the lower side, and let the wafer fall naturally. Heat-peelability was evaluated by the number of wafers remaining on the heat-peelable adhesive sheet without falling naturally at this time. (3) Adhesion measurement method Cut the heat-peelable adhesive sheet into a size of width: 20 mm, length: 140 mm, based on JIS Z 0237 (2000), at temperature: 23±2°C and humidity: 65±5 Under an atmosphere of %RH, a 2 kg roll was reciprocated once, and a polyethylene terephthalate film (trade name "lumirror S-10" manufactured by Toray Corporation; thickness: 25 μm, width : 20 mm) crimped and attached to the adhesive layer. Next, place the heat-peelable adhesive sheet with the adherend in a tensile testing machine (manufactured by Shimadzu Corporation, trade name "Shimadzu Autograph AG-120kN") with a constant temperature bath set at 23°C, and let it stand for 30 minutes . After standing, measure the load when the adherend is peeled off from the heat-peelable adhesive tape at a temperature of 23°C under the conditions of peeling angle: 180° and peeling speed (tensile speed): 300 mm/min, and obtain the load at this time The maximum load (the maximum value of the load excluding the initial capping) is taken as the adhesive force (N/20 mm) of the heat-expandable adhesive layer. (4) Total light transmittance Based on JIS-6714, the total light transmittance of the heat-peelable adhesive sheet was measured using an integrating sphere light transmittance measuring device (manufactured by Murakami Color Technology Research Institute Co., Ltd., trade name "HAZE METER HM-150") (5) Peeling charge (measurement of peeling voltage) Attach a destaticized release liner (PET film treated with silicone, Toray Co., Ltd. Manufactured, trade name "Cerapeel", thickness: 38 μm) silicone treatment surface, to prepare samples for evaluation. At this time, the end of the release liner in the longitudinal direction protrudes 30 mm from the heat-peelable adhesive sheet. In addition, press Roll the heat-peelable adhesive sheet and the release liner under the conditions (temperature: 23°C, humidity 50%RH) based on JIS Z 0237 (2000). Place the sample for evaluation in an environment of 23°C and 50%RH After leaving it for a day, grasp the protruding part of the release liner, and peel the release liner along the length direction at a peeling angle of 150° and a peeling speed of 10 m/min. The distance between the release liner and the Measure the voltage on the surface of the adhesive layer generated during peeling at a position 100 mm away from the separation point of the heat-peelable adhesive sheet, and use the maximum value as the peeling voltage. Furthermore, as a measuring device, a potentiometer (manufactured by Kasuga Electric Co., Ltd., commercial product) is used. (named "KSD-0103"). In addition, the measurement environment was set to 23°C, 50%RH. (6) Time-dependent stability of adhesive properties. Store the heat-peelable adhesive sheet in an atmosphere with a temperature of 23°C and a humidity of 50% for 2 month, from the adhesive force (A0) measured in (2) above and the adhesive force (A1) after 2 months, use the following formula (I) to calculate the change rate X% of the adhesive force. In Table 3, the The case where the rate of change X% is less than 50% is marked as ○, and the case where the rate of change X% is more than 50% is marked as ×. X(%)=(A1/A0)×100 [Manufacturing example 1] Adhesive layer formation The preparation of composition I will use the acrylic polymer as the base polymer (2-ethylhexyl acrylate: ethyl acrylate: methyl methacrylate: hydroxyethyl acrylate (weight ratio) = 30:70:5: 5) 100 parts by weight, 10 parts by weight of terpene-phenol-based tackifying resin (manufactured by YASUHARA CHEMICAL, trade name "YS polystar S145"), isocyanate-based crosslinking agent (manufactured by Nippon Polyurethane Co., Ltd., trade name "CORONATE L") 2 Parts by weight, crosslinking accelerator (manufactured by Tokyo Fine Chemical Company, trade name "EMBILIZER OL-1") 0.03 parts by weight, heat-expandable microspheres (manufactured by Matsumoto Yushi Pharmaceutical Co., Ltd., trade name "Matsumoto Microsphere F-65"; 150°C 30 parts by weight of foaming expansion type) and toluene were mixed to prepare a resin solution, which was used as a composition I for forming an adhesive layer. In addition, when forming an adhesive layer using this adhesive layer forming composition I, the content ratio of the structural unit A in this adhesive layer is 27 weight part with respect to 100 weight part of base polymers. [Manufacturing Examples 2 to 12] Preparation of Adhesive Layer Forming Compositions II to XII As shown in Table 1, the types and weight ratios of the monomers constituting the acrylic polymer, the type and amount of the crosslinking agent, and the increase Except the kind and compounding quantity of adhesive resin, it carried out similarly to manufacture example 1, and obtained the composition II-XII for adhesive layer formation. Furthermore, in Production Example 9, 10 parts by weight of an ionic liquid (ionic conductivity imparting agent, manufactured by Japan Carlit, trade name "PEL20A") was prepared to prepare an adhesive layer forming composition IX. In addition, in Production Example 10, an ionic liquid (manufactured by Japan Carlit, trade name "CIL-312"), 1-butyl-3-methylpyridinium bis(trifluoromethanesulfonyl)imide) was prepared 3 parts by weight to prepare a composition X for forming an adhesive layer. The details of the crosslinking agent and tackifying resin listed in Table 1 are as follows. <Cross-linking agent> TETRAD C: manufactured by Mitsubishi Gas Chemical Co., Ltd., trade name "TETRAD C", epoxy-based cross-linking agent <tackifier resin> Mighty Ace G125: manufactured by YASUHARA CHEMICAL, trade name "Mighty Ace G125", terpene Enol-based tackifying resin Tamanol 901: manufactured by Arakawa Chemical Co., Ltd., trade name "Tamanol 901", terpene phenol-based tackifying resin Tamanol 200N: manufactured by Arakawa Chemical Co., Ltd., trade name "Tamanol 200N", alkylphenol-based tackifying resin Adhesive resin Super ester A125: manufactured by Arakawa Chemical Industry Co., Ltd., trade name "Super ester A125", rosin-based tackifying resin [Table 1]

[Production Example 13] Preparation of Elastic Layer Forming Composition I Acrylic polymer (2-ethylhexyl acrylate: ethyl acrylate: methyl methacrylate: hydroxyethyl acrylate (weight ratio) = 30:70 :5:5) 100 parts by weight, 3 parts by weight of an isocyanate-based crosslinking agent (manufactured by Nippon Polyurethane Co., Ltd., trade name "CORONATE L") were mixed with toluene to prepare a resin solution, which was used as composition I for forming an elastic layer. [Production Examples 14 to 20] Preparation of Elastic Layer Forming Compositions II to VIII The types and weight ratios of the monomers constituting the acrylic adhesive and the compounding amount of the crosslinking agent were set as shown in Table 2. In addition, In the same manner as in Production Example 12, compositions II to VIII for forming an elastic layer were obtained. [Table 2]

[Example 1] As an antistatic material, an aqueous dispersion containing 1.2% by weight of polythiophene (polyethylenedioxythiophene polystyrene sulfonate) (manufactured by Heraeus, trade name "Clevios P") and polyester A resin solution (manufactured by Toyobo Co., Ltd., trade name "Vylonal MD1200", solid content concentration: 1.2% by weight) was mixed so that the solid content weight ratio (water dispersion: resin solution) was 6:4, and then used The isopropanol/pure water mixed solvent (isopropanol:pure water=6:4 (weight ratio)) was diluted so that the solid content concentration might be 1% by weight, and the antistatic layer forming composition I was prepared. The obtained antistatic layer-forming composition I was coated on a PET substrate (manufactured by Toray Corporation, trade name "lumirror S10", thickness: 100 μm), and dried to form an antistatic layer with a thickness of 50 nm on the substrate. layer. Next, the composition I for forming an elastic layer obtained in Production Example 13 was applied to the surface of the PET substrate opposite to the antistatic layer, and dried to form an elastic layer with a thickness of 15 μm on the surface. Separately, the composition I for forming an adhesive layer obtained in Production Example 1 was coated on the Si-treated surface of a PET separator (thickness: 38 μm), and dried to form an adhesive layer precursor with a thickness of 35 μm. The precursor was transferred to the surface of the elastic layer opposite to the PET substrate to obtain a heat-peelable adhesive sheet (antistatic layer (50 nm)/substrate (100 μm)/elastic layer (15 μm)/adhesive agent layer (35 μm)). The obtained heat-peelable adhesive sheet was used for said evaluation (1)-(6). The results are shown in Table 3. [Example 2] In addition to using the composition II for forming an elastic layer instead of the composition I for forming an elastic layer, and using the composition II for forming an adhesive layer instead of the composition I for forming an adhesive layer, the same method as in the implementation In the same manner as Example 1, a heat-peelable adhesive sheet (antistatic layer (50 nm)/substrate (100 μm)/elastic layer (15 μm)/adhesive layer (35 μm)) was obtained. The obtained heat-peelable adhesive sheet was used for said evaluation (1)-(6). The results are shown in Table 3. [Example 3] An alcohol dispersion of poly(3,4-ethylenedioxythiophene) as an antistatic material (manufactured by Kaken Sangyo Co., Ltd., trade name "Enocoat BP105") was mixed with propanol to prepare 1 wt. % poly(3,4-ethylenedioxythiophene) antistatic layer-forming composition II. Antistatic layer forming composition II was used instead of antistatic layer forming composition I, elastic layer forming composition III was used instead of elastic layer forming composition I, and adhesive layer forming composition III was used instead of adhesive Except for the composition I for forming the agent layer, in the same manner as in Example 1, a heat-peelable adhesive sheet (antistatic layer (50 nm)/substrate (100 μm)/elastic layer (15 μm)/ Adhesive layer (35 μm)). The obtained heat-peelable adhesive sheet was used for said evaluation (1)-(6). The results are shown in Table 3. [Example 4] In addition to using the elastic layer-forming composition IV instead of the elastic layer-forming composition III, and using the adhesive layer-forming composition IV instead of the adhesive layer-forming composition III, the same procedure was carried out. In the same manner as Example 3, a heat-peelable adhesive sheet (antistatic layer (50 nm)/substrate (100 μm)/elastic layer (15 μm)/adhesive layer (35 μm)) was obtained. The obtained heat-peelable adhesive sheet was used for said evaluation (1)-(6). The results are shown in Table 3. [Example 5] In addition to using the composition V for forming an elastic layer instead of the composition I for forming an elastic layer, and using the composition V for forming an adhesive layer instead of the composition I for forming an adhesive layer. In the same manner as Example 1, a heat-peelable adhesive sheet (antistatic layer (50 nm)/substrate (100 μm)/elastic layer (15 μm)/adhesive layer (35 μm)) was obtained. The obtained heat-peelable adhesive sheet was used for said evaluation (1)-(6). The results are shown in Table 3. [Example 6] In addition to using the elastic layer-forming composition VI instead of the elastic layer-forming composition I, and using the adhesive layer-forming composition VI instead of the adhesive layer-forming composition I, the same procedure was carried out. In the same manner as Example 1, a heat-peelable adhesive sheet (antistatic layer (50 nm)/substrate (100 μm)/elastic layer (15 μm)/adhesive layer (35 μm)) was obtained. The obtained heat-peelable adhesive sheet was used for said evaluation (1)-(6). The results are shown in Table 3. [Example 7] A heat-peelable adhesive sheet (antistatic layer (50 nm)/substrate (100 μm)/elastic layer (15 μm)/adhesive layer (35 μm)). The obtained heat-peelable adhesive sheet was used for said evaluation (1)-(6). The results are shown in Table 3. [Example 8] A PET substrate containing an antistatic material was prepared as a substrate (manufactured by Toray Corporation, trade name "X53 lumirror #100", thickness: 100 μm, surface resistivity: 1×10 ¹⁰ Ω/□) . The elastic layer-forming composition I obtained in Production Example 13 was coated on the PET substrate containing the antistatic material, and dried to form an elastic layer with a thickness of 15 μm on the surface. Separately, the composition I for forming an adhesive layer obtained in Production Example 1 was coated on the Si-treated surface of a PET separator (thickness: 38 μm), and dried to form an adhesive layer precursor with a thickness of 35 μm. The precursor was transferred to the surface of the elastic layer opposite to the PET substrate to obtain a heat-peelable adhesive sheet (substrate (100 μm)/elastic layer (15 μm)/adhesive layer (35 μm)). The obtained heat-peelable adhesive sheet was used for said evaluation (1)-(6). The results are shown in Table 3. [Example 9] A heat-peelable adhesive sheet (antistatic layer (50 nm)/substrate (100 μm)/elastic layer (15 μm)/adhesive layer (35 μm)). The obtained heat-peelable adhesive sheet was used for said evaluation (1)-(6). The results are shown in Table 3. [Example 10] In the same manner as in Example 1, a composition I for forming an antistatic layer was prepared. The composition I for forming an antistatic layer was coated on a PET substrate (manufactured by Toray Corporation, trade name "lumirror S10", thickness: 100 μm), and dried to form an antistatic layer with a thickness of 50 nm on the substrate . Next, the elastic layer-forming composition I obtained in Production Example 13 was coated on the antistatic layer and dried to form an elastic layer with a thickness of 15 μm. Separately, the composition I for forming an adhesive layer obtained in Production Example 1 was coated on a PET film (thickness: 38 μm) and dried to form an adhesive layer precursor with a thickness of 35 μm. The precursor was transferred onto the elastic layer to obtain a heat-peelable adhesive sheet (substrate (100 μm)/antistatic layer (50 nm)/elastic layer (15 μm)/adhesive layer (35 μm)). The obtained heat-peelable adhesive sheet was used for said evaluation (1)-(6). The results are shown in Table 3. [Example 11] As a laminate of the antistatic layer and the base material, a PET film (manufactured by Toray Corporation, trade name "semi-evaporated FB-15", thickness: 50 μm) with an antistatic layer formed by vapor deposition was prepared. , total light transmittance: 15%). Next, the composition I for forming an elastic layer obtained in Production Example 13 was applied to the substrate side of the above-mentioned laminate (that is, the side of the PET film that was not vapor-deposited), and dried to form a 15-μm-thick layer on the side. Elastic layer. Separately, the composition I for forming an adhesive layer obtained in Production Example 1 was coated on the Si-treated surface of a PET separator (thickness: 38 μm), and dried to form an adhesive layer precursor with a thickness of 35 μm. The precursor was transferred to the surface of the above-mentioned elastic layer opposite to the above-mentioned substrate to obtain a heat-peelable adhesive sheet (antistatic layer/substrate/elastic layer (15 μm)/adhesive layer (35 μm)). The obtained heat-peelable adhesive sheet was used for said evaluation (1)-(6). The results are shown in Table 3. [Example 12] The composition I for forming an elastic layer obtained in Production Example 13 was applied to a PET substrate (manufactured by Toray Corporation, trade name "lumirror S10", thickness: 100 μm), dried, and the surface An elastic layer with a thickness of 15 μm was formed. Separately, the composition IX for forming an adhesive layer obtained in Production Example 9 was coated on the Si-treated surface of a PET separator (thickness: 38 μm), and dried to form an adhesive layer precursor with a thickness of 35 μm. The precursor was transferred to the surface of the elastic layer opposite to the PET substrate to obtain a heat-peelable adhesive sheet (substrate (100 μm)/elastic layer (15 μm)/adhesive layer (35 μm)). Furthermore, this embodiment is an experimental example when the adhesive layer contains an ionic liquid as an antistatic material. The obtained heat-peelable adhesive sheet was used for said evaluation (1)-(6). The results are shown in Table 3. [Example 13] (antistatic layer (50 nm)/substrate (100 μm)/adhesive layer (35 μm)) was obtained in the same manner as in Example 1 except that no elastic layer was formed. The obtained heat-peelable adhesive sheet was used for said evaluation (1)-(6). The results are shown in Table 3. [Example 14] A film was produced by the method described in Example 12 of Japanese Patent Laid-Open No. 4-348161, and the film (thickness: 50 nm) was laminated on a PET substrate (manufactured by Toray Corporation) as an antistatic laminate. , product name "lumirror S10", thickness: 100 μm). Furthermore, the film contained polyaniline as an antistatic material and had a surface resistivity of 2.5×10 ⁵ Ω/□. Next, the composition I for forming an elastic layer obtained in Production Example 13 was applied to the surface of the PET substrate opposite to the antistatic layer, and dried to form an elastic layer with a thickness of 15 μm on the surface. Separately, the composition I for forming an adhesive layer obtained in Production Example 1 was coated on the Si-treated surface of a PET separator (thickness: 38 μm), and dried to form an adhesive layer precursor with a thickness of 35 μm. The precursor was transferred to the surface of the elastic layer opposite to the PET substrate to obtain a heat-peelable adhesive sheet (antistatic layer (50 nm)/substrate (100 μm)/elastic layer (15 μm)/adhesive agent layer (35 μm)). The obtained heat-peelable adhesive sheet was used for said evaluation (1)-(6). The results are shown in Table 3. [Example 15] The composition I for forming an elastic layer obtained in Production Example 13 was applied to a PET substrate (manufactured by Toray Corporation, trade name "lumirror S10", thickness: 100 μm), dried, and the surface An elastic layer with a thickness of 15 μm was formed. Separately, the composition X for forming an adhesive layer obtained in Production Example 10 was coated on the Si-treated surface of a PET separator (thickness: 38 μm) and dried to form an adhesive layer precursor with a thickness of 35 μm. The precursor was transferred to the surface of the elastic layer opposite to the PET substrate to obtain a heat-peelable adhesive sheet (substrate (100 μm)/elastic layer (15 μm)/adhesive layer (35 μm)). Furthermore, this embodiment is an experimental example when the adhesive layer contains an ionic liquid as an antistatic material. The obtained heat-peelable adhesive sheet was used for said evaluation (1)-(6). The results are shown in Table 3. [Comparative Example 1] In addition to using the composition VII for forming an elastic layer instead of the composition I for forming an elastic layer, and using the composition XI for forming an adhesive layer instead of the composition I for forming an adhesive layer. In the same manner as Example 1, a heat-peelable adhesive sheet (antistatic layer (50 nm)/substrate (100 μm)/elastic layer (15 μm)/adhesive layer (35 μm)) was obtained. The obtained heat-peelable adhesive sheet was used for said evaluation (1)-(6). The results are shown in Table 3. [Comparative Example 2] In addition to using the elastic layer-forming composition VIII instead of the elastic layer-forming composition I, and using the adhesive layer-forming composition XII instead of the adhesive layer-forming composition I, in the same manner as in the embodiment In the same manner as Example 1, a heat-peelable adhesive sheet (antistatic layer (50 nm)/substrate (100 μm)/elastic layer (15 μm)/adhesive layer (35 μm)) was obtained. The obtained heat-peelable adhesive sheet was used for said evaluation (1)-(6). The results are shown in Table 3. [Comparative Example 3] In the same manner as in Example 1, except that no antistatic layer was formed, a heat-peelable adhesive sheet (substrate (100 μm)/elastic layer (15 μm)/adhesive layer (35 μm) ). The obtained heat-peelable adhesive sheet was used for said evaluation (1)-(6). The results are shown in Table 3. [table 3]

As can be seen from Table 3, when the heat-peelable adhesive sheet of the present invention is used as a temporary fixing sheet in the cutting step of electronic component materials, it is possible to prevent the chip from flying. In addition, the heat-peelable adhesive sheet of the present invention has less peeling charge. Furthermore, peeling off an adhesive sheet with a large amount of electrification as in Comparative Example 3 may damage the attached electronic component material. [Industrial Applicability] The production method and adhesive sheet of the present invention can be suitably used in the production of wafer-shaped electronic components such as semiconductor wafers.

10‧‧‧adhesive layer 20‧‧‧Substrate 30‧‧‧antistatic layer 40‧‧‧elastic layer 100, 200, 300‧‧‧adhesive sheet

Fig. 1 is a schematic cross-sectional view of a heat-peelable adhesive sheet according to an embodiment of the present invention. Fig. 2(a) and (b) are schematic sectional views of a heat-peelable adhesive sheet according to another embodiment of the present invention. Fig. 3 is a schematic cross-sectional view of a heat-peelable adhesive sheet according to another embodiment of the present invention.

10‧‧‧adhesive layer

20‧‧‧Substrate

100‧‧‧adhesive sheet

Claims (14)

A heat-peelable adhesive sheet, which is provided with an adhesive layer, and the heat-peelable adhesive sheet includes an antistatic material, the adhesive layer includes an adhesive and thermally expandable microspheres, and the antistatic material is selected from conductive polymer At least one of the group consisting of substances, ionic liquids, cationic antistatic agents, anionic antistatic agents, zwitterionic antistatic agents, nonionic antistatic agents, metals and metal oxides, constituting the adhesive The base polymer contains a structural unit A derived from an alkyl (meth)acrylate having a side chain having a branched structure, the content ratio of the structural unit A in the base polymer is 20% by weight or more, and the adhesive The elastic modulus of the agent layer measured by nanoindentation method at 25°C is 0.1MPa~100MPa. The heat-peelable adhesive sheet according to claim 1, wherein the above-mentioned adhesive layer contains the above-mentioned antistatic material, and the antistatic material is a conductive polymer and/or an ionic liquid. Such as the heat-peelable adhesive sheet of claim 1, which further includes a substrate, the substrate includes the above-mentioned antistatic material, and the above-mentioned antistatic material is selected from conductive polymers, cationic antistatic agents, anionic antistatic agents, At least one of the group consisting of zwitterionic antistatic agents and nonionic antistatic agents. The heat-peelable adhesive sheet according to claim 1, further comprising a substrate, and an antistatic layer disposed on the opposite side of the substrate to the above-mentioned adhesive layer, the antistatic layer includes the above-mentioned antistatic material, and the antistatic The material is at least one selected from the group consisting of cationic antistatic agents, anionic antistatic agents, zwitterionic antistatic agents and nonionic antistatic agents. The heat-peelable adhesive sheet according to claim 1, further comprising a substrate, and an antistatic layer provided on the opposite side of the substrate to the adhesive layer, and the antistatic layer includes a conductive polymer. The heat-peelable adhesive sheet according to claim 1, further comprising a substrate, and an antistatic layer provided on the opposite side of the substrate to the adhesive layer, and the antistatic layer includes metal or metal oxide. The heat-peelable adhesive sheet according to claim 1, further comprising a substrate, and an antistatic layer disposed between the substrate and the above-mentioned adhesive layer, the antistatic layer comprising the above-mentioned antistatic material, The antistatic material is at least one selected from the group consisting of cationic antistatic agents, anionic antistatic agents, zwitterionic antistatic agents and nonionic antistatic agents. The heat-peelable adhesive sheet according to claim 1, further comprising a substrate, and an antistatic layer disposed between the substrate and the adhesive layer, and the antistatic layer includes a conductive polymer. The heat-peelable adhesive sheet according to claim 1, further comprising a base material and an antistatic layer provided between the base material and the above-mentioned adhesive layer, the antistatic layer comprising metal or metal oxide. The heat-peelable adhesive sheet according to any one of claims 1 to 9, wherein the carbon number of the side chain having a branched chain structure of the above-mentioned structural unit A is 5 or more. The heat-peelable adhesive sheet according to any one of Claims 1 to 9, wherein the above-mentioned adhesive layer further includes a tackifying resin, and the content of the tackifying resin is 1 to 80 parts by weight relative to 100 parts by weight of the above-mentioned base polymer. parts by weight. The heat-peelable adhesive sheet according to any one of claims 1 to 9, wherein the adhesive force to the PET film is 2N/20mm or more. A method of manufacturing an electronic component, comprising the following steps: after attaching the electronic component material to the heat-peelable adhesive sheet according to any one of claims 1 to 9, cutting the electronic component material. An electronic component manufactured by the manufacturing method according to claim 13.

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