TWI788935B - Electrode structure - Google Patents

Electrode structure Download PDF

Info

Publication number
TWI788935B
TWI788935B TW110128212A TW110128212A TWI788935B TW I788935 B TWI788935 B TW I788935B TW 110128212 A TW110128212 A TW 110128212A TW 110128212 A TW110128212 A TW 110128212A TW I788935 B TWI788935 B TW I788935B
Authority
TW
Taiwan
Prior art keywords
metal structure
circuit board
electrode
electrode structure
metal
Prior art date
Application number
TW110128212A
Other languages
Chinese (zh)
Other versions
TW202207762A (en
Inventor
林逸程
Original Assignee
乾坤科技股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 乾坤科技股份有限公司 filed Critical 乾坤科技股份有限公司
Publication of TW202207762A publication Critical patent/TW202207762A/en
Application granted granted Critical
Publication of TWI788935B publication Critical patent/TWI788935B/en

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F3/00—Cores, Yokes, or armatures
    • H01F3/10—Composite arrangements of magnetic circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
    • H01F41/0206—Manufacturing of magnetic cores by mechanical means
    • H01F41/0233—Manufacturing of magnetic circuits made from sheets
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type 
    • H01F17/04—Fixed inductances of the signal type  with magnetic core
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/24—Magnetic cores
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/24—Magnetic cores
    • H01F27/255—Magnetic cores made from particles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/24—Magnetic cores
    • H01F27/26—Fastening parts of the core together; Fastening or mounting the core on casing or support
    • H01F27/266—Fastening or mounting the core on casing or support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/28—Coils; Windings; Conductive connections
    • H01F27/30—Fastening or clamping coils, windings, or parts thereof together; Fastening or mounting coils or windings on core, casing, or other support
    • H01F27/306—Fastening or mounting coils or windings on core, casing or other support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F37/00—Fixed inductances not covered by group H01F17/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
    • H01F41/0206—Manufacturing of magnetic cores by mechanical means
    • H01F41/0246—Manufacturing of magnetic circuits by moulding or by pressing powder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F1/00—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties
    • H01F1/01—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials
    • H01F1/03—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity
    • H01F1/12—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials
    • H01F1/14—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys
    • H01F1/20—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys in the form of particles, e.g. powder
    • H01F1/22—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys in the form of particles, e.g. powder pressed, sintered, or bound together
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F3/00—Cores, Yokes, or armatures
    • H01F3/10—Composite arrangements of magnetic circuits
    • H01F2003/106—Magnetic circuits using combinations of different magnetic materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type 
    • H01F17/04—Fixed inductances of the signal type  with magnetic core
    • H01F2017/048—Fixed inductances of the signal type  with magnetic core with encapsulating core, e.g. made of resin and magnetic powder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/10—Energy storage using batteries

Abstract

An electrode structure on a circuit board, the electrode structure comprising a metal structure disposed on and electrically connected to the circuit board, wherein the metal structure and a surface of the circuit board forms a space therebetween, wherein at least one first electrical component is disposed in the space and an outer surface of the metal structure forms an electrode for electrically connecting with an external component.

Description

一種電極結構an electrode structure

本發明涉及一種電極結構，尤其涉及一種用於電性連接一電池的電極結構。The invention relates to an electrode structure, in particular to an electrode structure for electrically connecting a battery.

習知安裝在電池上的電路板具有非常厚的電極，以減少點焊過程中餘熱對電路板上的元件的影響。 然而，非常厚的電極會佔用電路板較大的空間，也會導致電極與電路板上的元件之間的距離加大。It is known that the circuit board mounted on the battery has very thick electrodes to reduce the influence of residual heat on the components on the circuit board during the spot welding process. However, very thick electrodes take up more space on the board and also result in a greater distance between the electrodes and the components on the board.

因此，業界需要一更好的解決方案來解決上述問題。Therefore, the industry needs a better solution to solve the above problems.

本發明的一個目的是提供一種電路板上的電極結構，以減少點焊時的餘熱影響。An object of the present invention is to provide an electrode structure on a circuit board to reduce the influence of residual heat during spot welding.

本發明的一個目的是在電路板上提供一種電極結構，用於減小電極與電路上的導電元件之間的距離。It is an object of the present invention to provide an electrode structure on a circuit board for reducing the distance between the electrodes and conductive elements on the circuit.

本發明的一個目的是提供一種電路板上的電極結構，以減小電路板的尺寸。An object of the present invention is to provide an electrode structure on a circuit board to reduce the size of the circuit board.

本發明的一實施例揭露一種電極結構，所述電極結構包括一金屬結構，其設置於一電路板上並電性連接所述電路板，其中所述第一金屬結構與所述電路板的一第一表面形成一第一空間，其中至少一第一導電元件設置於所述第一空間中，且所述第一金屬結構的一外表面形成一第一電極，用以與外部元件電性連接An embodiment of the present invention discloses an electrode structure, the electrode structure includes a metal structure, which is arranged on a circuit board and electrically connected to the circuit board, wherein the first metal structure and a part of the circuit board The first surface forms a first space, wherein at least one first conductive element is disposed in the first space, and an outer surface of the first metal structure forms a first electrode for electrically connecting with external elements

在一實施例中，所述外部元件為一電池，其中所述第一金屬結構電性連接至所述電池的正極或負極。In one embodiment, the external component is a battery, wherein the first metal structure is electrically connected to a positive pole or a negative pole of the battery.

在一實施例中，所述外部元件為一印刷電路板。In one embodiment, the external component is a printed circuit board.

在一實施例中，所述金屬結構具有U形或L形。In one embodiment, the metal structure has a U shape or an L shape.

在一實施例中，所述金屬結構包括銅。In one embodiment, the metal structure includes copper.

在一實施例中，所述第一金屬結構包括一銅層及一覆於該銅層上的一錫層。In one embodiment, the first metal structure includes a copper layer and a tin layer overlying the copper layer.

在一實施例中，所述電路板的第一表面為該電路板的一下表面。In one embodiment, the first surface of the circuit board is the lower surface of the circuit board.

在一實施例中，該金屬結構焊接於該電路板。In one embodiment, the metal structure is soldered to the circuit board.

在一實施例中，該至少一導電元件包括以下至少之一：電阻、電容及電感。In one embodiment, the at least one conductive element includes at least one of the following: a resistor, a capacitor, and an inductor.

在一實施例中，該第一金屬結構包括一銅層、覆蓋於該銅層上的一鎳層以及覆蓋於該鎳層上的一鋁層。In one embodiment, the first metal structure includes a copper layer, a nickel layer covering the copper layer, and an aluminum layer covering the nickel layer.

在一實施例中，該至少一導電元件包括主動元件與被動元件。In one embodiment, the at least one conductive element includes an active element and a passive element.

在一實施例中，該電極結構還包括一第二金屬結構，設置於該電路板上並電性連接該電路板，其中該第二金屬結構與該電路板的一第二表面形成一第二空間，其中 至少一第二導電元件設置於該第二空間內，且該第二金屬結構的外表面形成一第二電極，用以與該外部元件電性連接。In one embodiment, the electrode structure further includes a second metal structure disposed on the circuit board and electrically connected to the circuit board, wherein the second metal structure and a second surface of the circuit board form a second The space, wherein at least one second conductive element is arranged in the second space, and the outer surface of the second metal structure forms a second electrode for electrically connecting with the external element.

在一實施例中，所述外部元件為電池，所述第一金屬結構和所述第二金屬結構分別電性連接至所述電池的正極和負極。In one embodiment, the external component is a battery, and the first metal structure and the second metal structure are electrically connected to a positive pole and a negative pole of the battery, respectively.

在一實施例中，所述第一金屬結構包括一第一表面安裝墊片。In one embodiment, the first metal structure includes a first surface mount gasket.

在一實施例中，所述第二金屬結構包括一第二表面安裝墊片。In one embodiment, the second metal structure includes a second surface mount pad.

在一實施例中，所述第一金屬結構的側表面包括一封閉的金屬路徑。In one embodiment, the side surface of the first metal structure includes a closed metal path.

在一實施例中，所述第二金屬結構的側表面括一封閉的金屬路徑。In one embodiment, a side surface of the second metal structure includes a closed metal path.

在一實施例中，所述電路板上的導電元件由封裝體封裝。In an embodiment, the conductive elements on the circuit board are encapsulated by a package body.

在一實施例中，一封裝體將所述導電元件封裝在所述電路板上和所述電路板的至少一部分上。In one embodiment, a package encapsulates the conductive element on the circuit board and at least a portion of the circuit board.

在一實施例中，一封裝體封裝設置於該電路板上的該導電元件、該電路板以及該第一金屬結構的一部分。In one embodiment, a package encapsulates the conductive element disposed on the circuit board, the circuit board and a part of the first metal structure.

為使本發明的上述和其他特徵和優點能更明顯易懂，下文特舉實施例，並配合附圖，作詳細說明如下。In order to make the above and other features and advantages of the present invention more comprehensible, the following specific embodiments together with the accompanying drawings are described in detail as follows.

圖1A示出本發明的一實施例的一封裝結構的側視圖，其中一電極結構包括設置於電路板101上並電性連接的第一金屬結構101a，其中第一金屬結構101a與電路板101的第一表面形成第一空間 101c，其中至少一個第一導電元件102設置在所述第一空間101c中，第一金屬結構101a的一外表面形成第一電極，用於與外部元件電性連接。1A shows a side view of a packaging structure according to an embodiment of the present invention, wherein an electrode structure includes a first metal structure 101a disposed on a circuit board 101 and electrically connected, wherein the first metal structure 101a is connected to the circuit board 101 The first surface of the first metal structure 101a forms a first space 101c, wherein at least one first conductive element 102 is disposed in the first space 101c, and an outer surface of the first metal structure 101a forms a first electrode for electrically connecting with external elements .

在一個實施例中，外部元件是一電池201，其中第一金屬結構101a電性連接到電池201的正極201P。In one embodiment, the external component is a battery 201 , wherein the first metal structure 101 a is electrically connected to the positive electrode 201P of the battery 201 .

在一個實施例中，外部元件是一電池201，其中第一金屬結構101a電性連接到電池201的負極201N。In one embodiment, the external component is a battery 201 , wherein the first metal structure 101 a is electrically connected to the negative electrode 201N of the battery 201 .

在一個實施例中，如圖1A所示，至少一導電元件104設置於一電路板101上。In one embodiment, as shown in FIG. 1A , at least one conductive element 104 is disposed on a circuit board 101 .

在一個實施例中，電路板101的第一表面是電路板的一下表面。In one embodiment, the first surface of the circuit board 101 is the lower surface of the circuit board.

在一個實施例中，電路板101的第一表面是電路板的一上表面。In one embodiment, the first surface of the circuit board 101 is an upper surface of the circuit board.

在一個實施例中，外部元件是一PCB。In one embodiment, the external component is a PCB.

在一個實施例中，第一金屬結構101a具有U形。In one embodiment, the first metal structure 101a has a U shape.

在一個實施例中，第一金屬結構101a具有L形。In one embodiment, the first metal structure 101a has an L shape.

在一個實施例中，第一金屬結構101a包括銅。In one embodiment, the first metal structure 101a includes copper.

在一個實施例中，第一金屬結構101a由銅製成。In one embodiment, the first metal structure 101a is made of copper.

在一個實施例中，第一金屬結構101a包括銅層和覆蓋在銅層上的錫層。In one embodiment, the first metal structure 101a includes a copper layer and a tin layer covering the copper layer.

在一個實施例中，第一金屬結構101a包括銅、鎳和鋁。In one embodiment, the first metal structure 101a includes copper, nickel and aluminum.

在一個實施例中，第一金屬結構101a包括銅層和覆蓋在銅層上的鎳層。In one embodiment, the first metal structure 101a includes a copper layer and a nickel layer covering the copper layer.

在一個實施例中，第一金屬結構101a包括銅層、覆蓋在銅層上的鎳層和覆蓋在鎳層上的鋁層。In one embodiment, the first metal structure 101a includes a copper layer, a nickel layer covering the copper layer, and an aluminum layer covering the nickel layer.

在一個實施例中，第一金屬結構101a包括銅層、覆蓋在銅層上的鎳層、覆蓋在鎳層上的鋁層和覆蓋在鋁層上的金層。In one embodiment, the first metal structure 101a includes a copper layer, a nickel layer overlying the copper layer, an aluminum layer overlying the nickel layer, and a gold layer overlying the aluminum layer.

在一個實施例中，第一金屬結構101a與電路板101的下表面之間形成一空間，其中至少一導電元件設置在所述空間中，第一金屬結構101a的下表面形成一電極，用於與外部元件電性連接。In one embodiment, a space is formed between the first metal structure 101a and the lower surface of the circuit board 101, wherein at least one conductive element is disposed in the space, and the lower surface of the first metal structure 101a forms an electrode for Electrically connected to external components.

在一個實施例中，該電極包括一表面安裝墊片以與外部元件電性連接。In one embodiment, the electrode includes a surface mount pad for electrical connection with external components.

在一個實施例中，第一金屬結構101a與電路板101的上表面之間形成空間，其中至少一導電元件設置在所述空間中，並且金屬結構的上表面形成一電極，用於與外部元件電性連接。In one embodiment, a space is formed between the first metal structure 101a and the upper surface of the circuit board 101, wherein at least one conductive element is disposed in the space, and the upper surface of the metal structure forms an electrode for communicating with external elements. electrical connection.

在一個實施例中，該電極包括一表面安裝墊片以與外部元件電性連接。In one embodiment, the electrode includes a surface mount pad for electrical connection with external components.

在一個實施例中，第一金屬結構101a焊接到電路板101。In one embodiment, the first metal structure 101 a is soldered to the circuit board 101 .

在一個實施例中，至少一導電元件包括被動元件。In one embodiment, at least one conductive element comprises a passive element.

在一個實施例中，該至少一導電元件包括以下中的至少一個：電阻器、電容器和電感器。In one embodiment, the at least one conductive element includes at least one of: a resistor, a capacitor, and an inductor.

在一個實施例中，至少一導電元件包括主動元件。In one embodiment, at least one conductive element comprises an active element.

在一個實施例中，至少一導電元件包括IC。In one embodiment, at least one conductive element includes an IC.

在一個實施例中，至少一導電元件包括主動元件和被動元件。In one embodiment, the at least one conductive element includes an active element and a passive element.

在一個實施例中，如圖1A所示，電極結構還包括一第二金屬結構101b，設置於電路板101上並電性連接電路板101，其中第二金屬結構101b與電路板101的第二表面形成一第二空間101d，其中至少一第二導電元件103設置於所述第二空間101d內，且第二金屬結構101b的一外表面形成一第二電極，用於與外部元件電性連接。In one embodiment, as shown in FIG. 1A , the electrode structure further includes a second metal structure 101b disposed on the circuit board 101 and electrically connected to the circuit board 101, wherein the second metal structure 101b is connected to the second metal structure 101b of the circuit board 101. A second space 101d is formed on the surface, wherein at least one second conductive element 103 is disposed in the second space 101d, and an outer surface of the second metal structure 101b forms a second electrode for electrically connecting with external elements .

在一個實施例中，如圖1A所示，外部元件為電池201，且第一金屬結構101a和第二金屬結構101b分別電性連接至電池201的正極201P和負極201N。In one embodiment, as shown in FIG. 1A , the external component is a battery 201 , and the first metal structure 101 a and the second metal structure 101 b are electrically connected to the positive electrode 201P and the negative electrode 201N of the battery 201 , respectively.

在一個實施例中， 如圖1B所示，至少一導電元件105嵌入在電路板中。In one embodiment, as shown in FIG. 1B , at least one conductive element 105 is embedded in the circuit board.

在一個實施例中，如圖1B所示，其中多個導電元件102a、102b設置於第一空間101c中。In one embodiment, as shown in FIG. 1B , a plurality of conductive elements 102a, 102b are disposed in the first space 101c.

在一個實施例中，如圖1B所示，其中第二空間101d內設有多個導電元件103a、103b。In one embodiment, as shown in FIG. 1B , a plurality of conductive elements 103a, 103b are disposed in the second space 101d.

在一個實施例中，至少一個IC嵌入在電路板101中。In one embodiment, at least one IC is embedded in circuit board 101 .

在一個實施例中，電路板101上設置有以下導電元件中的至少一個：驅動器IC、控制IC、MOSFET、IGBT和二極體。In one embodiment, at least one of the following conductive components is disposed on the circuit board 101 : driver IC, control IC, MOSFET, IGBT and diode.

在一實施例中，至少一個主動元件和至少一個被動元件嵌入在電路板中。In one embodiment, at least one active component and at least one passive component are embedded in the circuit board.

在一個實施例中，如圖2所示，第一金屬結構形成第一表面安裝墊片101aB。In one embodiment, as shown in FIG. 2 , the first metal structure forms a first surface mount pad 101aB.

在一個實施例中， 如圖2所示，第一空間101c內設置有多個導電元件102a、102b。In one embodiment, as shown in FIG. 2 , a plurality of conductive elements 102a, 102b are disposed in the first space 101c.

在一個實施例中，如圖2所示，第一金屬結構101a的側表面101aL包括一封閉的金屬路徑。In one embodiment, as shown in FIG. 2 , the side surface 101aL of the first metal structure 101a includes a closed metal path.

在一個實施例中，第一金屬結構101a在第一金屬結構101a的側面具有通孔。In one embodiment, the first metal structure 101a has a through hole on the side of the first metal structure 101a.

在一個實施例中，第二金屬結構101b的側表面包括一封閉的金屬路徑。In one embodiment, the side surface of the second metal structure 101b includes a closed metal path.

在一個實施例中，第二金屬結構101b在第二金屬結構101b的側面具有通孔。In one embodiment, the second metal structure 101b has a through hole on a side of the second metal structure 101b.

在一個實施例中，如圖3A所示，封裝體101M封裝設置在電路板101上的導電元件。In one embodiment, as shown in FIG. 3A , the package body 101M encapsulates conductive elements disposed on the circuit board 101 .

在一個實施例中，如圖3B所示，封裝體01M封裝設置在電路板101上的導電元件和電路板101。In one embodiment, as shown in FIG. 3B , the package body 01M packages the conductive element disposed on the circuit board 101 and the circuit board 101 .

在一個實施例中，如圖3B所示，封裝體01M封裝電路板101上的導電元件、電路板101和第一金屬結構101a的一部分。In one embodiment, as shown in FIG. 3B , the package body 01M encapsulates the conductive elements on the circuit board 101 , the circuit board 101 and a part of the first metal structure 101a.

本發明的優點包括：1、減少了電路板的設計面積和電路板的成本； 2、減少電路板的厚度； 3. 增加電池可用空間； 4、增加主板的利用空間； 5、減少點焊接時餘熱對元件和電路板的影響； 6、減少電極與電路板上元件的距離。The advantages of the present invention include: 1. Reduce the design area of the circuit board and the cost of the circuit board; 2. Reduce the thickness of the circuit board; 3. Increase the available space for the battery; 4. Increase the utilization space of the main board; The influence of residual heat on components and circuit boards; 6. Reduce the distance between electrodes and components on circuit boards.

儘管已經參考上述實施例描述本發明，但是對於本領域普通技術人員來說顯而易見的是，在不脫離本發明的精神的情況下，可以對所描述的實施例進行修改。 因此，本發明的範圍將由所附權利要求限定，而不是由上面詳細描述限定。While the invention has been described with reference to the foregoing embodiments, it will be apparent to those of ordinary skill in the art that modifications may be made to the described embodiments without departing from the spirit of the invention. Accordingly, the scope of the invention is to be defined by the appended claims rather than by the above detailed description.

101:電路板 101a:第一金屬結構 101c:第一空間 102:第一導電元件 101b:第二金屬結構 101d:第二空間 101aB:第一表面安裝墊片 101aL:側表面 102a、102b:導電元件 101M:封裝體 201:電池 201P:正極 201N:負極 103:第二導電元件 103a、103b:導電元件 104、105:導電元件101: circuit board 101a: first metal structure 101c: The First Space 102: the first conductive element 101b: Second metal structure 101d: Second Dimension 101aB: First surface mount gasket 101aL: side surface 102a, 102b: conductive elements 101M: Encapsulation 201: battery 201P: Positive pole 201N: negative pole 103: the second conductive element 103a, 103b: conductive elements 104, 105: Conductive elements

包括附圖以提供對本發明的進一步理解且附圖包含在本說明書中並構成本說明書的一部分。附圖示出本發明的實施例並與說明書一起用於解釋本發明的原理。 圖1A為本發明的一實施例的一封裝結構的側視圖。 圖1B為本發明的一實施例的一封裝結構的側視圖。 圖2為本發明的一實施例的一電路板上的一電極結構的側視圖。 圖3A為本發明的一實施例的具有一封裝體的一封裝結構的側視圖。 圖3B為本發明的一個實施例的具有一封裝體的一封裝結構的側視圖。The accompanying drawings are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification. The drawings illustrate the embodiments of the invention and together with the description serve to explain the principles of the invention. FIG. 1A is a side view of a package structure according to an embodiment of the present invention. FIG. 1B is a side view of a package structure according to an embodiment of the present invention. FIG. 2 is a side view of an electrode structure on a circuit board according to an embodiment of the present invention. FIG. 3A is a side view of a package structure with a package body according to an embodiment of the present invention. FIG. 3B is a side view of a package structure with a package body according to an embodiment of the present invention.

101:電路板101: circuit board

101a:第一金屬結構101a: first metal structure

101c:第一空間101c: The First Space

102:第一導電元件102: the first conductive element

101b:第二金屬結構101b: Second metal structure

101d:第二空間101d: Second Dimension

103:第二導電元件103: the second conductive element

104:導電元件104: Conductive element

201:電池201201: battery 201

201P:正極201P: Positive pole

201N:負極201N: negative pole

Claims (17)

一種電極結構，所述電極結構包括一第一金屬結構，其設置於一電路板上並電性連接所述電路板，其中所述第一金屬結構與所述電路板的一下表面形成一第一空間，其中至少一第一導電元件設置於所述第一空間中，且所述第一金屬結構的一外表面形成一第一電極，其中所述第一電極與一外部元件電性連接，其中，所述電路板位於所述第一金屬結構的一底表面的上方，且所述外部元件位於所述第一金屬結構的該底表面的下方。 An electrode structure, the electrode structure includes a first metal structure, which is arranged on a circuit board and electrically connected to the circuit board, wherein the first metal structure and the lower surface of the circuit board form a first space, wherein at least one first conductive element is disposed in the first space, and an outer surface of the first metal structure forms a first electrode, wherein the first electrode is electrically connected to an external element, wherein , the circuit board is located above a bottom surface of the first metal structure, and the external element is located below the bottom surface of the first metal structure. 根據請求項1所述的電極結構，其中所述外部元件為一電池，其中所述第一金屬結構電性連接至所述電池的正極或負極。 The electrode structure according to claim 1, wherein the external element is a battery, wherein the first metal structure is electrically connected to a positive pole or a negative pole of the battery. 根據請求項1所述的電極結構，其中所述外部元件為一印刷電路板。 The electrode structure according to claim 1, wherein the external component is a printed circuit board. 根據請求項1所述的電極結構，其中所述第一金屬結構具有U形或L形。 The electrode structure according to claim 1, wherein the first metal structure has a U shape or an L shape. 根據請求項1所述的電極結構，其中所述第一金屬結構包括銅。 The electrode structure of claim 1, wherein the first metal structure comprises copper. 根據請求項5所述的電極結構，其中所述第一金屬結構包括一銅層及一覆於該銅層上的一錫層。 The electrode structure according to claim 5, wherein the first metal structure comprises a copper layer and a tin layer overlying the copper layer. 根據請求項1所述的電極結構，其中該第一金屬結構焊接於該電路板。 The electrode structure according to claim 1, wherein the first metal structure is soldered to the circuit board. 根據請求項1所述的電極結構，其中該至少一第一導電元件包括以下至少之一：電阻、電容及電感。 The electrode structure according to claim 1, wherein the at least one first conductive element comprises at least one of the following: resistance, capacitance and inductance. 根據請求項1所述的電極結構，其中該第一金屬結構包括一銅層、覆蓋於該銅層上的一鎳層以及覆蓋於該鎳層上的一鋁層。 The electrode structure according to claim 1, wherein the first metal structure comprises a copper layer, a nickel layer covering the copper layer, and an aluminum layer covering the nickel layer. 根據請求項1所述的電極結構，其中該至少一第一導電元件包括至少一主動元件與至少一被動元件。 The electrode structure according to claim 1, wherein the at least one first conductive element includes at least one active element and at least one passive element. 根據請求項1所述的電極結構，其中，該電極結構還包括一第二金屬結構，其設置於該電路板上並電性連接該電路板，其中該第二金屬結構與該電路板的下表面形成一第二空間，其中至少一第二導電元件設置於該第二空間中，且該第二金屬結構的外表面形成一第二電極，用以與該外部元件電性連接。 The electrode structure according to claim 1, wherein the electrode structure further includes a second metal structure, which is arranged on the circuit board and electrically connected to the circuit board, wherein the second metal structure is connected to the lower part of the circuit board A second space is formed on the surface, at least one second conductive element is arranged in the second space, and a second electrode is formed on the outer surface of the second metal structure for electrically connecting with the external element. 根據請求項11所述的電極結構，其中，所述外部元件為一電池，所述第一金屬結構和所述第二金屬結構分別電性連接至所述電池的正極和負極。 The electrode structure according to claim 11, wherein the external element is a battery, and the first metal structure and the second metal structure are electrically connected to the positive pole and the negative pole of the battery, respectively. 根據請求項11所述的電極結構，其中所述第一金屬結構包括一第一表面安裝墊片。 The electrode structure according to claim 11, wherein said first metal structure comprises a first surface mount gasket. 根據請求項13所述的電極結構，其中所述第二金屬結構包括一第二表面安裝墊片。 The electrode structure according to claim 13, wherein said second metal structure comprises a second surface mount pad. 根據請求項1所述的電極結構，其中所述第一金屬結構的側表面包括一封閉的金屬路徑。 The electrode structure according to claim 1, wherein the side surface of the first metal structure comprises a closed metal path. 根據請求項11所述的電極結構，其中所述第二金屬結構的側表面包括一封閉的金屬路徑。 The electrode structure according to claim 11, wherein the side surface of the second metal structure comprises a closed metal path. 根據請求項1所述的電極結構，其中一封裝體封裝該至少一第一導電元件、該電路板以及該第一金屬結構的一部分。 According to the electrode structure according to claim 1, a package encapsulates the at least one first conductive element, the circuit board and a part of the first metal structure.
TW110128212A 2020-08-14 2021-07-30 Electrode structure TWI788935B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US202063065496P 2020-08-14 2020-08-14
US63/065,496 2020-08-14

Publications (2)

Publication Number Publication Date
TW202207762A TW202207762A (en) 2022-02-16
TWI788935B true TWI788935B (en) 2023-01-01

Family

ID=80223021

Family Applications (2)

Application Number Title Priority Date Filing Date
TW110128209A TWI769903B (en) 2020-08-14 2021-07-30 Electrical component and the method to make the same
TW110128212A TWI788935B (en) 2020-08-14 2021-07-30 Electrode structure

Family Applications Before (1)

Application Number Title Priority Date Filing Date
TW110128209A TWI769903B (en) 2020-08-14 2021-07-30 Electrical component and the method to make the same

Country Status (3)

Country Link
US (2) US20220052424A1 (en)
CN (2) CN114080101A (en)
TW (2) TWI769903B (en)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103228105A (en) * 2012-01-12 2013-07-31 揖斐电株式会社 Wiring board and method for manufacturing the same
TW201541480A (en) * 2014-04-30 2015-11-01 Cyntec Co Ltd An electrode structure and the corresponding electrical component using the same and the fabrication method thereof
TW201810443A (en) * 2016-04-29 2018-03-16 優尼卡塔股份有限公司 Connecting electronic components to substrates
TW202023014A (en) * 2018-12-12 2020-06-16 美商艾馬克科技公司 Semiconductor device and method of manufacturing a semiconductor device

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05243050A (en) * 1991-02-27 1993-09-21 Tokin Corp Chip coil magnetic core and fabrication thereof
US5666721A (en) * 1994-01-18 1997-09-16 Matsushita Electric Industrial Co., Ltd. Method of soldering an electronic connector on a printed circuit board
US6110608A (en) * 1996-12-10 2000-08-29 The Furukawa Electric Co., Ltd. Lead material for electronic part, lead and semiconductor device using the same
JP2002026173A (en) * 2000-07-10 2002-01-25 Fuji Photo Film Co Ltd Ic device, substrate, and ic assembling substrate
US7394663B2 (en) * 2003-02-18 2008-07-01 Matsushita Electric Industrial Co., Ltd. Electronic component built-in module and method of manufacturing the same
JP2004327201A (en) * 2003-04-24 2004-11-18 Sii Micro Parts Ltd Electrochemical cell
CN101467500B (en) * 2006-06-27 2012-08-08 松下电器产业株式会社 Interconnect substrate and electronic circuit mounted structure
US8466764B2 (en) * 2006-09-12 2013-06-18 Cooper Technologies Company Low profile layered coil and cores for magnetic components
US11355276B2 (en) * 2009-02-27 2022-06-07 Cyntec Co., Ltd. Choke
US20110175218A1 (en) * 2010-01-18 2011-07-21 Shiann-Ming Liou Package assembly having a semiconductor substrate
KR101085733B1 (en) * 2010-05-28 2011-11-21 삼성전기주식회사 Printed circuit board having electronic component and method for manufacturing thereof
DE102012206225A1 (en) * 2012-04-16 2013-10-17 Vacuumschmelze Gmbh & Co. Kg Soft magnetic core with location-dependent permeability
CN202887902U (en) * 2012-09-17 2013-04-17 深圳顺络电子股份有限公司 Molding power inductance component
TWI479516B (en) * 2013-04-19 2015-04-01 Delta Electronics Inc Non-linear inductor
JP2016025159A (en) * 2014-07-17 2016-02-08 富士通株式会社 Wiring board structure and method for manufacturing wiring board structure
KR102047564B1 (en) * 2014-09-18 2019-11-21 삼성전기주식회사 Chip electronic component and manufacturing method thereof
KR20160076840A (en) * 2014-12-23 2016-07-01 삼성전기주식회사 Chip electronic component and manufacturing method thereof
CN106548851A (en) * 2016-08-31 2017-03-29 珠海经济特区宝诚电子有限公司 A kind of sectional forming inductor and preparation method thereof
JP7021459B2 (en) * 2017-05-02 2022-02-17 Tdk株式会社 Inductor element
JP6902695B2 (en) * 2017-05-17 2021-07-14 パナソニックＩｐマネジメント株式会社 Powder magnetic core and mixed soft magnetic powder
US11367556B2 (en) * 2018-03-29 2022-06-21 Tdk Corporation Coil device
JP6784275B2 (en) * 2018-04-03 2020-11-11 株式会社村田製作所 Surface Mount Inductors and Their Manufacturing Methods

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103228105A (en) * 2012-01-12 2013-07-31 揖斐电株式会社 Wiring board and method for manufacturing the same
TW201541480A (en) * 2014-04-30 2015-11-01 Cyntec Co Ltd An electrode structure and the corresponding electrical component using the same and the fabrication method thereof
TW201810443A (en) * 2016-04-29 2018-03-16 優尼卡塔股份有限公司 Connecting electronic components to substrates
TW202023014A (en) * 2018-12-12 2020-06-16 美商艾馬克科技公司 Semiconductor device and method of manufacturing a semiconductor device

Also Published As

Publication number Publication date
CN114078620A (en) 2022-02-22
US20220052424A1 (en) 2022-02-17
TW202207762A (en) 2022-02-16
TW202207252A (en) 2022-02-16
US20220051841A1 (en) 2022-02-17
CN114080101A (en) 2022-02-22
TWI769903B (en) 2022-07-01

Similar Documents

Publication Publication Date Title
US10991681B2 (en) Three-dimensional package structure
KR101463075B1 (en) Heat sink package
US20110278704A1 (en) Three-dimensional package structure
TWI679927B (en) Stacked electronic structure
KR20200073155A (en) Semiconductor device and method of manufacturing a semiconductor device
TWI711357B (en) Electronic module and circuit board
US20020189853A1 (en) BGA substrate with direct heat dissipating structure
WO2016162938A1 (en) Semiconductor device
US11024702B2 (en) Stacked electronic structure
JP5285347B2 (en) Circuit equipment
TWI788935B (en) Electrode structure
TWI831193B (en) Electronic module
TW202243556A (en) Electronic module
TWI582905B (en) Chip package structure and manufacturing method thereof
JP2014220305A (en) Multilayer substrate and electronic device using the same, method of manufacturing electronic device
JP6945513B2 (en) Electronic control device
JP2009277940A (en) Semiconductor package, circuit board for mounting, and mounting structure
JP5062376B1 (en) Manufacturing method of electronic component mounting board
JP2020202311A (en) Semiconductor device
CN210866176U (en) Packaging structure
TWI731737B (en) Lead frame package structure
JP2018026394A (en) Circuit module and method of manufacturing circuit module
US20230352382A1 (en) Semiconductor device
US20220399255A1 (en) Circuit module
JP2007059430A (en) Semiconductor device