TWI788882B - 電磁鋼板用塗覆組成物、接著用表面被覆電磁鋼板及積層鐵心 - Google Patents
電磁鋼板用塗覆組成物、接著用表面被覆電磁鋼板及積層鐵心 Download PDFInfo
- Publication number
- TWI788882B TWI788882B TW110122208A TW110122208A TWI788882B TW I788882 B TWI788882 B TW I788882B TW 110122208 A TW110122208 A TW 110122208A TW 110122208 A TW110122208 A TW 110122208A TW I788882 B TWI788882 B TW I788882B
- Authority
- TW
- Taiwan
- Prior art keywords
- electrical steel
- steel sheets
- epoxy resin
- hardener
- steel sheet
- Prior art date
Links
- 229910000976 Electrical steel Inorganic materials 0.000 title claims abstract description 95
- 239000008199 coating composition Substances 0.000 title claims abstract description 32
- 239000003822 epoxy resin Substances 0.000 claims abstract description 58
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 58
- 239000004848 polyfunctional curative Substances 0.000 claims abstract description 48
- 150000001412 amines Chemical class 0.000 claims abstract description 30
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims abstract description 26
- 150000004982 aromatic amines Chemical class 0.000 claims abstract description 8
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical group [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 62
- 238000000576 coating method Methods 0.000 claims description 47
- 239000011248 coating agent Substances 0.000 claims description 44
- 229910000831 Steel Inorganic materials 0.000 claims description 42
- 239000010959 steel Substances 0.000 claims description 42
- 239000003795 chemical substances by application Substances 0.000 claims description 28
- 238000010030 laminating Methods 0.000 claims description 3
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 abstract description 7
- 239000002585 base Substances 0.000 description 24
- 230000001070 adhesive effect Effects 0.000 description 17
- 238000003475 lamination Methods 0.000 description 16
- 238000004519 manufacturing process Methods 0.000 description 16
- 238000004080 punching Methods 0.000 description 16
- 238000010438 heat treatment Methods 0.000 description 15
- 239000000853 adhesive Substances 0.000 description 14
- 229910052742 iron Inorganic materials 0.000 description 14
- 230000002093 peripheral effect Effects 0.000 description 13
- 238000000034 method Methods 0.000 description 12
- -1 laminated iron core (laminated iron Chemical group 0.000 description 10
- 229910000565 Non-oriented electrical steel Inorganic materials 0.000 description 8
- 230000000052 comparative effect Effects 0.000 description 8
- 238000005259 measurement Methods 0.000 description 7
- 229920003986 novolac Polymers 0.000 description 7
- 238000004804 winding Methods 0.000 description 7
- 238000009413 insulation Methods 0.000 description 6
- 239000002518 antifoaming agent Substances 0.000 description 5
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 5
- 229920000768 polyamine Polymers 0.000 description 5
- 238000003825 pressing Methods 0.000 description 5
- 239000002356 single layer Substances 0.000 description 5
- 125000001931 aliphatic group Chemical group 0.000 description 4
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 4
- 230000006866 deterioration Effects 0.000 description 4
- 238000011156 evaluation Methods 0.000 description 4
- WSFSSNUMVMOOMR-UHFFFAOYSA-N formaldehyde Natural products O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- 229910001224 Grain-oriented electrical steel Inorganic materials 0.000 description 3
- 150000008065 acid anhydrides Chemical class 0.000 description 3
- 150000008064 anhydrides Chemical class 0.000 description 3
- ZZTCPWRAHWXWCH-UHFFFAOYSA-N diphenylmethanediamine Chemical compound C=1C=CC=CC=1C(N)(N)C1=CC=CC=C1 ZZTCPWRAHWXWCH-UHFFFAOYSA-N 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000003995 emulsifying agent Substances 0.000 description 3
- 150000002460 imidazoles Chemical class 0.000 description 3
- 239000010410 layer Substances 0.000 description 3
- 229920001296 polysiloxane Polymers 0.000 description 3
- 239000003755 preservative agent Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 150000003512 tertiary amines Chemical class 0.000 description 3
- VILCJCGEZXAXTO-UHFFFAOYSA-N 2,2,2-tetramine Chemical compound NCCNCCNCCN VILCJCGEZXAXTO-UHFFFAOYSA-N 0.000 description 2
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 2
- GSKNLOOGBYYDHV-UHFFFAOYSA-N 2-methylphenol;naphthalen-1-ol Chemical compound CC1=CC=CC=C1O.C1=CC=C2C(O)=CC=CC2=C1 GSKNLOOGBYYDHV-UHFFFAOYSA-N 0.000 description 2
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 2
- NQRYJNQNLNOLGT-UHFFFAOYSA-N Piperidine Chemical compound C1CCNCC1 NQRYJNQNLNOLGT-UHFFFAOYSA-N 0.000 description 2
- 239000004952 Polyamide Chemical class 0.000 description 2
- WNLRTRBMVRJNCN-UHFFFAOYSA-L adipate(2-) Chemical compound [O-]C(=O)CCCCC([O-])=O WNLRTRBMVRJNCN-UHFFFAOYSA-L 0.000 description 2
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 2
- 239000000440 bentonite Substances 0.000 description 2
- 229910000278 bentonite Inorganic materials 0.000 description 2
- SVPXDRXYRYOSEX-UHFFFAOYSA-N bentoquatam Chemical compound O.O=[Si]=O.O=[Al]O[Al]=O SVPXDRXYRYOSEX-UHFFFAOYSA-N 0.000 description 2
- 239000000470 constituent Substances 0.000 description 2
- 229930003836 cresol Natural products 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 150000004985 diamines Chemical class 0.000 description 2
- LYCAIKOWRPUZTN-UHFFFAOYSA-N ethylene glycol Natural products OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 2
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 239000004849 latent hardener Substances 0.000 description 2
- VYKXQOYUCMREIS-UHFFFAOYSA-N methylhexahydrophthalic anhydride Chemical compound C1CCCC2C(=O)OC(=O)C21C VYKXQOYUCMREIS-UHFFFAOYSA-N 0.000 description 2
- BDJRBEYXGGNYIS-UHFFFAOYSA-N nonanedioic acid Chemical compound OC(=O)CCCCCCCC(O)=O BDJRBEYXGGNYIS-UHFFFAOYSA-N 0.000 description 2
- 239000002736 nonionic surfactant Substances 0.000 description 2
- 239000005011 phenolic resin Substances 0.000 description 2
- WLJVNTCWHIRURA-UHFFFAOYSA-N pimelic acid Chemical compound OC(=O)CCCCCC(O)=O WLJVNTCWHIRURA-UHFFFAOYSA-N 0.000 description 2
- 229920002647 polyamide Chemical class 0.000 description 2
- 229920006295 polythiol Polymers 0.000 description 2
- 230000002335 preservative effect Effects 0.000 description 2
- 229920003987 resole Polymers 0.000 description 2
- CXMXRPHRNRROMY-UHFFFAOYSA-N sebacic acid Chemical compound OC(=O)CCCCCCCCC(O)=O CXMXRPHRNRROMY-UHFFFAOYSA-N 0.000 description 2
- 150000003335 secondary amines Chemical class 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 230000001360 synchronised effect Effects 0.000 description 2
- IMNIMPAHZVJRPE-UHFFFAOYSA-N triethylenediamine Chemical compound C1CN2CCN1CC2 IMNIMPAHZVJRPE-UHFFFAOYSA-N 0.000 description 2
- AAAQKTZKLRYKHR-UHFFFAOYSA-N triphenylmethane Chemical compound C1=CC=CC=C1C(C=1C=CC=CC=1)C1=CC=CC=C1 AAAQKTZKLRYKHR-UHFFFAOYSA-N 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- LTVUCOSIZFEASK-MPXCPUAZSA-N (3ar,4s,7r,7as)-3a-methyl-3a,4,7,7a-tetrahydro-4,7-methano-2-benzofuran-1,3-dione Chemical compound C([C@H]1C=C2)[C@H]2[C@H]2[C@]1(C)C(=O)OC2=O LTVUCOSIZFEASK-MPXCPUAZSA-N 0.000 description 1
- MUTGBJKUEZFXGO-OLQVQODUSA-N (3as,7ar)-3a,4,5,6,7,7a-hexahydro-2-benzofuran-1,3-dione Chemical compound C1CCC[C@@H]2C(=O)OC(=O)[C@@H]21 MUTGBJKUEZFXGO-OLQVQODUSA-N 0.000 description 1
- VUWCWMOCWKCZTA-UHFFFAOYSA-N 1,2-thiazol-4-one Chemical class O=C1CSN=C1 VUWCWMOCWKCZTA-UHFFFAOYSA-N 0.000 description 1
- WZCQRUWWHSTZEM-UHFFFAOYSA-N 1,3-phenylenediamine Chemical compound NC1=CC=CC(N)=C1 WZCQRUWWHSTZEM-UHFFFAOYSA-N 0.000 description 1
- QFGCFKJIPBRJGM-UHFFFAOYSA-N 12-[(2-methylpropan-2-yl)oxy]-12-oxododecanoic acid Chemical compound CC(C)(C)OC(=O)CCCCCCCCCCC(O)=O QFGCFKJIPBRJGM-UHFFFAOYSA-N 0.000 description 1
- PJGMVHVKKXYDAI-UHFFFAOYSA-O 2-(2-undecyl-1h-imidazol-1-ium-1-yl)propanenitrile Chemical compound CCCCCCCCCCCC1=NC=C[NH+]1C(C)C#N PJGMVHVKKXYDAI-UHFFFAOYSA-O 0.000 description 1
- FUIQBJHUESBZNU-UHFFFAOYSA-N 2-[(dimethylazaniumyl)methyl]phenolate Chemical compound CN(C)CC1=CC=CC=C1O FUIQBJHUESBZNU-UHFFFAOYSA-N 0.000 description 1
- XSXYESVZDBAKKT-UHFFFAOYSA-N 2-hydroxybenzohydrazide Chemical compound NNC(=O)C1=CC=CC=C1O XSXYESVZDBAKKT-UHFFFAOYSA-N 0.000 description 1
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- LXBGSDVWAMZHDD-UHFFFAOYSA-N 2-methyl-1h-imidazole Chemical compound CC1=NC=CN1 LXBGSDVWAMZHDD-UHFFFAOYSA-N 0.000 description 1
- NFVPEIKDMMISQO-UHFFFAOYSA-N 4-[(dimethylamino)methyl]phenol Chemical compound CN(C)CC1=CC=C(O)C=C1 NFVPEIKDMMISQO-UHFFFAOYSA-N 0.000 description 1
- ULKLGIFJWFIQFF-UHFFFAOYSA-N 5K8XI641G3 Chemical compound CCC1=NC=C(C)N1 ULKLGIFJWFIQFF-UHFFFAOYSA-N 0.000 description 1
- MWSKJDNQKGCKPA-UHFFFAOYSA-N 6-methyl-3a,4,5,7a-tetrahydro-2-benzofuran-1,3-dione Chemical compound C1CC(C)=CC2C(=O)OC(=O)C12 MWSKJDNQKGCKPA-UHFFFAOYSA-N 0.000 description 1
- 229930185605 Bisphenol Natural products 0.000 description 1
- RPNUMPOLZDHAAY-UHFFFAOYSA-N Diethylenetriamine Chemical compound NCCNCCN RPNUMPOLZDHAAY-UHFFFAOYSA-N 0.000 description 1
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 description 1
- BPQQTUXANYXVAA-UHFFFAOYSA-N Orthosilicate Chemical compound [O-][Si]([O-])([O-])[O-] BPQQTUXANYXVAA-UHFFFAOYSA-N 0.000 description 1
- 229910019142 PO4 Inorganic materials 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- LGRFSURHDFAFJT-UHFFFAOYSA-N Phthalic anhydride Natural products C1=CC=C2C(=O)OC(=O)C2=C1 LGRFSURHDFAFJT-UHFFFAOYSA-N 0.000 description 1
- 229920003171 Poly (ethylene oxide) Polymers 0.000 description 1
- KDYFGRWQOYBRFD-UHFFFAOYSA-N Succinic acid Natural products OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 239000001361 adipic acid Substances 0.000 description 1
- 235000011037 adipic acid Nutrition 0.000 description 1
- 150000005215 alkyl ethers Chemical class 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- 239000010953 base metal Substances 0.000 description 1
- UTTHLMXOSUFZCQ-UHFFFAOYSA-N benzene-1,3-dicarbohydrazide Chemical compound NNC(=O)C1=CC=CC(C(=O)NN)=C1 UTTHLMXOSUFZCQ-UHFFFAOYSA-N 0.000 description 1
- KDYFGRWQOYBRFD-NUQCWPJISA-N butanedioic acid Chemical compound O[14C](=O)CC[14C](O)=O KDYFGRWQOYBRFD-NUQCWPJISA-N 0.000 description 1
- JHIWVOJDXOSYLW-UHFFFAOYSA-N butyl 2,2-difluorocyclopropane-1-carboxylate Chemical compound CCCCOC(=O)C1CC1(F)F JHIWVOJDXOSYLW-UHFFFAOYSA-N 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- KRVSOGSZCMJSLX-UHFFFAOYSA-L chromic acid Substances O[Cr](O)(=O)=O KRVSOGSZCMJSLX-UHFFFAOYSA-L 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 125000004122 cyclic group Chemical group 0.000 description 1
- QSAWQNUELGIYBC-UHFFFAOYSA-N cyclohexane-1,2-dicarboxylic acid Chemical compound OC(=O)C1CCCCC1C(O)=O QSAWQNUELGIYBC-UHFFFAOYSA-N 0.000 description 1
- ZWLIYXJBOIDXLL-UHFFFAOYSA-N decanedihydrazide Chemical compound NNC(=O)CCCCCCCCC(=O)NN ZWLIYXJBOIDXLL-UHFFFAOYSA-N 0.000 description 1
- 239000004205 dimethyl polysiloxane Substances 0.000 description 1
- XXBDWLFCJWSEKW-UHFFFAOYSA-N dimethylbenzylamine Chemical compound CN(C)CC1=CC=CC=C1 XXBDWLFCJWSEKW-UHFFFAOYSA-N 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- VGGRCVDNFAQIKO-UHFFFAOYSA-N formic anhydride Chemical compound O=COC=O VGGRCVDNFAQIKO-UHFFFAOYSA-N 0.000 description 1
- AWJWCTOOIBYHON-UHFFFAOYSA-N furo[3,4-b]pyrazine-5,7-dione Chemical compound C1=CN=C2C(=O)OC(=O)C2=N1 AWJWCTOOIBYHON-UHFFFAOYSA-N 0.000 description 1
- 239000004845 glycidylamine epoxy resin Substances 0.000 description 1
- 239000004519 grease Substances 0.000 description 1
- 150000004820 halides Chemical class 0.000 description 1
- FLBJFXNAEMSXGL-UHFFFAOYSA-N het anhydride Chemical compound O=C1OC(=O)C2C1C1(Cl)C(Cl)=C(Cl)C2(Cl)C1(Cl)Cl FLBJFXNAEMSXGL-UHFFFAOYSA-N 0.000 description 1
- WJRBRSLFGCUECM-UHFFFAOYSA-N hydantoin Chemical compound O=C1CNC(=O)N1 WJRBRSLFGCUECM-UHFFFAOYSA-N 0.000 description 1
- 229940091173 hydantoin Drugs 0.000 description 1
- OAKJQQAXSVQMHS-UHFFFAOYSA-N hydrazine Substances NN OAKJQQAXSVQMHS-UHFFFAOYSA-N 0.000 description 1
- 150000002429 hydrazines Chemical class 0.000 description 1
- 230000006698 induction Effects 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- ZFSLODLOARCGLH-UHFFFAOYSA-N isocyanuric acid Chemical compound OC1=NC(O)=NC(O)=N1 ZFSLODLOARCGLH-UHFFFAOYSA-N 0.000 description 1
- 150000004658 ketimines Chemical class 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 229910052744 lithium Inorganic materials 0.000 description 1
- 229940018564 m-phenylenediamine Drugs 0.000 description 1
- 230000005389 magnetism Effects 0.000 description 1
- 238000000691 measurement method Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- QOHMWDJIBGVPIF-UHFFFAOYSA-N n',n'-diethylpropane-1,3-diamine Chemical compound CCN(CC)CCCN QOHMWDJIBGVPIF-UHFFFAOYSA-N 0.000 description 1
- 239000012188 paraffin wax Substances 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 150000002989 phenols Chemical class 0.000 description 1
- 239000010452 phosphate Substances 0.000 description 1
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 description 1
- 229920000058 polyacrylate Polymers 0.000 description 1
- 229920006122 polyamide resin Polymers 0.000 description 1
- 229920001021 polysulfide Polymers 0.000 description 1
- 239000005077 polysulfide Substances 0.000 description 1
- 150000008117 polysulfides Polymers 0.000 description 1
- KCTAWXVAICEBSD-UHFFFAOYSA-N prop-2-enoyloxy prop-2-eneperoxoate Chemical compound C=CC(=O)OOOC(=O)C=C KCTAWXVAICEBSD-UHFFFAOYSA-N 0.000 description 1
- 239000011342 resin composition Substances 0.000 description 1
- 238000010008 shearing Methods 0.000 description 1
- 230000001629 suppression Effects 0.000 description 1
- 238000009864 tensile test Methods 0.000 description 1
- SRPWOOOHEPICQU-UHFFFAOYSA-N trimellitic anhydride Chemical compound OC(=O)C1=CC=C2C(=O)OC(=O)C2=C1 SRPWOOOHEPICQU-UHFFFAOYSA-N 0.000 description 1
- 239000004034 viscosity adjusting agent Substances 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D163/00—Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/01—Layered products comprising a layer of metal all layers being exclusively metallic
- B32B15/011—Layered products comprising a layer of metal all layers being exclusively metallic all layers being formed of iron alloys or steels
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/22—Di-epoxy compounds
- C08G59/24—Di-epoxy compounds carbocyclic
- C08G59/245—Di-epoxy compounds carbocyclic aromatic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
- C08G59/4014—Nitrogen containing compounds
- C08G59/4021—Ureas; Thioureas; Guanidines; Dicyandiamides
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/50—Amines
- C08G59/5006—Amines aliphatic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/50—Amines
- C08G59/5033—Amines aromatic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/50—Amines
- C08G59/56—Amines together with other curing agents
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/50—Amines
- C08G59/56—Amines together with other curing agents
- C08G59/60—Amines together with other curing agents with amides
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/62—Alcohols or phenols
- C08G59/621—Phenols
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F1/00—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties
- H01F1/01—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials
- H01F1/03—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity
- H01F1/12—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials
- H01F1/14—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys
- H01F1/147—Alloys characterised by their composition
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F1/00—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties
- H01F1/01—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials
- H01F1/03—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity
- H01F1/12—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials
- H01F1/14—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys
- H01F1/16—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys in the form of sheets
- H01F1/18—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys in the form of sheets with insulating coating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/24—Magnetic cores
- H01F27/245—Magnetic cores made from sheets, e.g. grain-oriented
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F3/00—Cores, Yokes, or armatures
- H01F3/02—Cores, Yokes, or armatures made from sheets
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2255/00—Coating on the layer surface
- B32B2255/06—Coating on the layer surface on metal layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2255/00—Coating on the layer surface
- B32B2255/26—Polymeric coating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
- B32B2307/208—Magnetic, paramagnetic
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/70—Other properties
- B32B2307/748—Releasability
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2400/00—Presence of inorganic and organic materials
- C09J2400/10—Presence of inorganic materials
- C09J2400/16—Metal
- C09J2400/166—Metal in the pretreated surface to be joined
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2463/00—Presence of epoxy resin
-
- C—CHEMISTRY; METALLURGY
- C21—METALLURGY OF IRON
- C21D—MODIFYING THE PHYSICAL STRUCTURE OF FERROUS METALS; GENERAL DEVICES FOR HEAT TREATMENT OF FERROUS OR NON-FERROUS METALS OR ALLOYS; MAKING METAL MALLEABLE, e.g. BY DECARBURISATION OR TEMPERING
- C21D8/00—Modifying the physical properties by deformation combined with, or followed by, heat treatment
- C21D8/12—Modifying the physical properties by deformation combined with, or followed by, heat treatment during manufacturing of articles with special electromagnetic properties
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C38/00—Ferrous alloys, e.g. steel alloys
- C22C38/02—Ferrous alloys, e.g. steel alloys containing silicon
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C38/00—Ferrous alloys, e.g. steel alloys
- C22C38/04—Ferrous alloys, e.g. steel alloys containing manganese
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C38/00—Ferrous alloys, e.g. steel alloys
- C22C38/06—Ferrous alloys, e.g. steel alloys containing aluminium
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/005—Impregnating or encapsulating
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Dispersion Chemistry (AREA)
- Wood Science & Technology (AREA)
- Materials Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Paints Or Removers (AREA)
- Iron Core Of Rotating Electric Machines (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Soft Magnetic Materials (AREA)
- Manufacture Of Motors, Generators (AREA)
- Laminated Bodies (AREA)
- Epoxy Resins (AREA)
Abstract
本發明之電磁鋼板用塗覆組成物含有:環氧樹脂、酚系硬化劑(A)以及選自芳香族胺及二氰二胺中之1種以上胺系硬化劑(B);並且,前述酚系硬化劑(A)之含量相對於前述環氧樹脂100質量份為1~40質量份,前述胺系硬化劑(B)之含量相對於前述環氧樹脂100質量份為0.5~5質量份。
Description
本發明有關電磁鋼板用塗覆組成物、接著用表面被覆電磁鋼板及積層鐵心。本案係依據已於2020年6月17日於日本提申之日本特願2020-104233號主張優先權,並於此援引其內容。
一般而言,使用電磁鋼板組裝馬達或變壓器等之積層鐵心時,係藉由剪切加工或沖裁來做成單位鐵心後,積層單位鐵心並藉由螺栓鎖緊、歛合、熔接或接著將其固接,而獲得積層鐵芯。由於在歛合或熔接之固接方法中會對積層鐵芯賦予機械應變或熱應變,因此會有鐵芯鐵損劣化的情況。
針對所述問題,例如於專利文獻1~3中已提案一種透過絕緣被膜(電磁鋼板用塗覆組成物)來接著之方法,該絕緣被膜係藉由加熱及加壓兩者或任一者來發揮接著能力。
先前技術文獻
專利文獻
專利文獻1:日本專利特開2000-173816號公報
專利文獻2:國際公開第2004/070080號
專利文獻3:日本專利特開2017-11863號公報
發明欲解決之課題
以絕緣被膜接著的積層鐵芯並未被賦予機械應變或熱應變,因此鐵芯鐵損優異。但是,近年來,有更進一步提升馬達效率之訴求,而要求更減低鐵芯鐵損。
為了減低鐵芯鐵損,有效作法係使電磁鋼板的厚度變薄。然而,由於電磁鋼板的楊氏模數會隨著板厚減少而降低,因此要求不對電磁鋼板賦予會成為鐵芯鐵損劣化之原因的應力應變。
此外,在如電動汽車用馬達的用途上還會要求高耐熱性,然而不對電磁鋼板賦予應力應變的絕緣被膜一般而言是柔軟的,且耐熱性差。
本發明係有鑑於前述情況而做成者,其目的在於提供一種電磁鋼板用塗覆組成物、接著用表面被覆電磁鋼板及積層鐵心,該電磁鋼板用塗覆組成物可更抑制對電磁鋼板賦予之應力應變,並且具有在馬達發熱時也可維持接著強度的耐熱性。
用以解決課題之手段
為了解決前述課題,本發明提案以下手段。
[1]本發明一態樣之電磁鋼板用塗覆組成物,含有:環氧樹脂、酚系硬化劑(A)以及選自芳香族胺及二氰二胺中之1種以上胺系硬化劑(B);並且,
前述酚系硬化劑(A)之含量相對於前述環氧樹脂100質量份為1~40質量份,前述胺系硬化劑(B)之含量相對於前述環氧樹脂100質量份為0.5~5質量份。
[2]如上述[1]之電磁鋼板用塗覆組成物,其中[前述酚系硬化劑(A)之含量]/[前述胺系硬化劑(B)之含量]所示質量比亦可為1~20。
[3]本發明一態樣之接著用表面被覆電磁鋼板於表面具有絕緣被膜且板厚為0.65mm以下,該絕緣被膜包含如上述[1]或[2]之電磁鋼板用塗覆組成物。
[4]本發明一態樣之積層鐵心係積層2片以上如上述[3]之接著用表面被覆電磁鋼板而成。
發明效果
根據本發明之上述態樣,可提供一種電磁鋼板用塗覆組成物、接著用表面被覆電磁鋼板及積層鐵心,該電磁鋼板用塗覆組成物可更抑制對電磁鋼板賦予之應力應變,並且具有在馬達發熱時也可維持接著強度的耐熱性。
用以實施發明之形態
以下,參照圖式來說明本發明一實施形態之積層鐵芯(積層鐵心)、具備該積層鐵芯之旋轉電機及形成該積層鐵芯之胚料。又,在本實施形態中,作為旋轉電機係舉電動機,具體而言係交流電動機,更具體而言係同步電動機,再更具體而言係舉永久磁鐵磁場型電動機為一例來說明。此種電動機譬如適合被採用於電動汽車等。
又,以下在夾著「~」而記載之數值限定範圍中,下限值及上限值係包含在該範圍內。顯示為「小於」或「大於」的數值,該值不包含在數值範圍內。
如圖1所示,旋轉電機10具備定子20、轉子30、罩殼50及旋轉軸60。定子20及轉子30容置於罩殼50內。並且,定子20固定於罩殼50內。
在本實施形態中,旋轉電機10採用了轉子30位於定子20之直徑方向內側的內轉子型。然而,旋轉電機10亦可採用轉子30位於定子20之外側的外轉子型。又,在本實施形態中,旋轉電機10為12極18槽的三相交流馬達。惟,極數、槽數及相數等可適當變更。
旋轉電機10例如藉由對各相施加有效值10A、頻率100Hz之激磁電流,而能以轉數1000rpm旋轉。
定子20具備定子用接著積層鐵芯(以下稱為定子鐵芯)21與未圖示之繞線。
定子鐵芯21具備環狀的芯背部22與複數個齒部23。以下,將定子鐵芯21(或芯背部22)之中心軸線O方向稱為軸方向,將定子鐵芯21(或芯背部22)之直徑方向(與中心軸線O正交的方向)稱為直徑方向,且將定子鐵芯21(或芯背部22)之圓周方向(在中心軸線O周圍環繞的方向)稱為圓周方向。
在從軸方向觀看定子20的俯視視角下,芯背部22係形成為圓環狀。
複數個齒部23係從芯背部22之內周朝向直徑方向內側(沿著直徑方向朝向芯背部22之中心軸線O)突出。並且,複數個齒部23係在圓周方向上空出同等角度間隔來配置。在本實施形態中,按以中心軸線O為中心之中心角20度為間隔,設置有18個齒部23。複數個齒部23彼此被形成為同等形狀且同等大小。藉此,複數個齒部23彼此具有相同的厚度尺寸。
前述繞線被捲繞於齒部23。前述繞線可呈集中捲繞,亦可呈分佈捲繞。
轉子30相對於定子20(定子鐵芯21)係配置於直徑方向的內側。轉子30具備轉子鐵芯31與複數個永久磁鐵32。
轉子鐵芯31係形成為環狀(圓環狀),該環狀(圓環狀)配置成與定子20同軸。在轉子鐵芯31內配置有前述旋轉軸60。旋轉軸60被固定於轉子鐵芯31。
複數個永久磁鐵32被固定於轉子鐵芯31。在本實施形態中,2個1組的永久磁鐵32會形成1個磁極。複數組永久磁鐵32係在圓周方向上空出同等角度間隔來配置。在本實施形態中,按以中心軸線O為中心之中心角30度為間隔,設置有12組(全體為24個)永久磁鐵32。
在本實施形態中,永久磁鐵磁場型電動機採用了磁鐵埋入型馬達。於轉子鐵芯31形成有在軸方向上貫通轉子鐵芯31之複數個貫通孔33。複數個貫通孔33係對應複數個永久磁鐵32之配置來設置。各永久磁鐵32係在配置於對應之貫通孔33內的狀態下被固定於轉子鐵芯31。將各永久磁鐵32固定到轉子鐵芯31這點,例如可藉由以接著劑接著永久磁鐵32之外表面與貫通孔33之內表面等來實現。另外,永久磁鐵磁場型電動機亦可取代磁鐵埋入型而採用表面磁鐵型馬達。
定子鐵芯21及轉子鐵芯31皆為積層鐵芯。例如,如圖2所示,定子鐵芯21係藉由在積層方向上積層複數片電磁鋼板(接著用表面被覆電磁鋼板)40而形成。
另外,定子鐵芯21及轉子鐵芯31各自的積層厚度(沿中心軸線O之總長)例如設為50.0mm。定子鐵芯21之外徑例如設為250.0mm。定子鐵芯21之內徑例如設為165.0mm。轉子鐵芯31之外徑例如設為163.0mm。轉子鐵芯31之內徑例如設為30.0mm。惟,該等數值為一例,定子鐵芯21之積層厚度、外徑及內徑、以及轉子鐵芯31之積層厚度、外徑及內徑不僅限於該等數值。在此,定子鐵芯21之內徑係以定子鐵芯21中之齒部23的前端部為基準。亦即,定子鐵芯21之內徑為與所有齒部23之前端部內接之假想圓的直徑。
形成定子鐵芯21及轉子鐵芯31之各電磁鋼板40例如係藉由將如圖4至圖6所示之胚料1沖裁加工等而形成。胚料1為電磁鋼板40之母材的鋼板(電磁鋼板)。胚料1可舉例如帶狀鋼板(電磁鋼帶)或切割板等。
雖然尚在說明積層鐵芯的途中,但以下是針對該胚料1進行說明。又,在本說明書中,有時會將電磁鋼板40之母材的帶狀鋼板稱為胚料1。並且有時會將沖裁加工胚料1而做成用於積層鐵芯之形狀後的鋼板稱為電磁鋼板40。
胚料1例如係以被捲成卷料1A的狀態來處理。在本實施形態中,胚料1係採用無方向性電磁鋼板。無方向性電磁鋼板可採用JIS C 2552:2014之無方向性電磁鋼帶。然而,胚料1亦可取代無方向性電磁鋼板而採用方向性電磁鋼板。此時之方向性電磁鋼板可採用JIS C 2553:2019之方向性電磁鋼帶。另外,還可採用JIS C 2558:2015之無方向性薄電磁鋼帶或方向性薄電磁鋼帶。
關於胚料1之平均板厚t0的上下限值,也考慮到胚料1作為電磁鋼板40來使用的情況,例如設定成如以下。
隨著胚料1變薄,胚料1的製造成本增加。因此,若考慮到製造成本,胚料1之平均板厚t0的下限值為0.10mm,且宜為0.15mm,較佳為0.18mm。
另一方面,若胚料1過厚,雖然製造成本變得良好,但在胚料1作為電磁鋼板40來使用的情況下,渦電流損耗會增加而鐵芯鐵損劣化。因此,若考慮鐵芯鐵損與製造成本,則胚料1之平均板厚t0的上限值為0.65mm,且宜為0.35mm,較佳為0.30mm。
作為滿足胚料1之平均板厚t0的上述範圍者,可例示0.20mm。
又,胚料1之平均板厚t0不僅包含後述母材鋼板2的厚度,還包含絕緣被膜3的厚度。另外,胚料1之平均板厚t0的測定方法譬如係利用以下測定方法。例如,在胚料1被捲成卷料1A之形狀的情況下,將胚料1的至少一部分退捲成平板形狀。在已退捲為平板形狀之胚料1中,選定胚料1之長邊方向的預定位置(例如,從胚料1之長邊方向端緣離開胚料1之總長10%份量之長度的位置)。在該選定位置上,將胚料1沿著其寬度方向區分為5個區域。在成為該等5個區域之境界的4處測定胚料1之板厚。並且可以4處板厚之平均值作為胚料1之平均板厚t0。
關於該胚料1之平均板厚t0,其上下限值當然亦可採用來作為電磁鋼板40之平均板厚t0的上下限值。又,電磁鋼板40之平均板厚t0的測定方法譬如係利用以下測定方法。例如,在圓周方向上空出同等間隔在4處(亦即,以中心軸線O為中心每隔90度)測定積層鐵芯之積層厚度。將所測出之4處的積層厚度分別除以被積層之電磁鋼板40的片數,算出每1片的板厚。並且可以4處之板厚平均值作為電磁鋼板40之平均板厚t0。
如圖5及圖6所示,胚料1具備母材鋼板2與絕緣被膜3。胚料1係帶狀母材鋼板2的兩面經絕緣被膜3被覆而成。在本實施形態中,胚料1大部分係由母材鋼板2形成,且於母材鋼板2表面積層有較母材鋼板2更薄之絕緣被膜3。
如以下所示,母材鋼板2的化學組成以質量%計含有2.5%~4.5%的Si。又,藉由將化學組成設為該範圍,可將胚料1(電磁鋼板40)之降伏強度設定為例如380MPa以上且在540MPa以下。
Si:2.5%~4.5%
Al:0.001%~3.0%
Mn:0.05%~5.0%
剩餘部分:Fe及不純物
使用胚料1來作為電磁鋼板40時,絕緣被膜3係在積層方向上相鄰之電磁鋼板40間發揮絕緣性能。又,在本實施形態中,絕緣被膜3具備接著能力,可將在積層方向上相鄰之電磁鋼板40接著。絕緣被膜3可為單層結構,亦可為多層結構。更具體而言,例如絕緣被膜3可為兼具絕緣性能與接著能力的單層結構,亦可為包含絕緣性能優異之基底絕緣被膜與接著性能優異之表層絕緣被膜之多層結構。又,本實施形態中之「絕緣被膜3之接著能力」意指以下能力:在由夾著絕緣被膜3來積層之複數個電磁鋼板40所構成的積層體中,可在預定溫度條件下展現預定值以上之接著強度的能力。
在本實施形態中,絕緣被膜3係遍及母材鋼板2兩面的整面無間隙地覆蓋該兩面。然而,在可確保前述絕緣性能或接著能力之範圍中,絕緣被膜3之一部分的層亦可非無間隙地覆蓋母材鋼板2的兩面。換言之,絕緣被膜3之一部分的層亦可間斷性地設置於母材鋼板2的表面。惟,為了確保絕緣性能,母材鋼板2兩面必須被絕緣被膜3覆蓋,使整面皆不露出。具體而言,絕緣被膜3不具有絕緣性能優異之基底絕緣被膜而為兼具絕緣性能與接著能力之單層結構時,絕緣被膜3必須遍及母材鋼板2整面無間隙地形成。相對於此,當絕緣被膜3為包含絕緣性能優異之基底絕緣被膜與接著能力優異之表層絕緣被膜之多層結構時,除了遍及母材鋼板2的整面無間隙地形成基底絕緣被膜與表層絕緣被膜兩者之外,就算是遍及母材鋼板整面無間隙地形成基底絕緣被膜並且間斷性地設置表層絕緣被膜,也可兼顧絕緣性能與接著能力。
構成基底絕緣被膜之塗覆組成物並無特別限定,例如可使用含鉻酸處理劑、含磷酸鹽處理劑等一般處理劑。
具備接著能力之絕緣被膜為後述之電磁鋼板用塗覆組成物被塗佈於母材鋼板上而成。具備接著能力之絕緣被膜例如為兼具絕緣性能與接著能力之單層結構的絕緣被膜、或設置於基底絕緣被膜上之表層絕緣被膜。具備接著能力之絕緣被膜在製造積層鐵芯時,於加熱壓接前係呈未硬化狀態或半硬化狀態(B階段),並且會透過加熱壓接時的加熱使硬化反應推進而展現出接著能力。
絕緣被膜3包含本實施形態之電磁鋼板用塗覆組成物。電磁鋼板用塗覆組成物含有環氧樹脂與環氧樹脂硬化劑。
環氧樹脂若為一分子中具有2個以上環氧基之環氧樹脂,則可無特別限制地使用。所述環氧樹脂可舉例如雙酚A型環氧樹脂、雙酚F型環氧樹脂、三苯甲烷型環氧樹脂、苯酚酚醛清漆型環氧樹脂、甲酚酚醛清漆型環氧樹脂、脂環式環氧樹脂、環氧丙基酯型環氧樹脂、環氧丙基胺型環氧樹脂、海因(hydantoin)型環氧樹脂、三聚異氰酸酯型環氧樹脂、丙烯酸改質環氧樹脂(環氧丙烯酸酯)、含磷環氧樹脂、及該等之鹵化物(溴化環氧樹脂等)或加氫物等。該等環氧樹脂可單獨使用1種,亦可將2種以上併用。
環氧樹脂含量相對於電磁鋼板用塗覆組成物之總質量,譬如宜為30~90質量%,較佳為40~80質量%,50~70質量%更佳。環氧樹脂含量若在上述下限值以上,可更提高電磁鋼板40的接著強度。環氧樹脂含量若在上述上限值以下,可更抑制電磁鋼板40的應力應變。
環氧樹脂硬化劑可分類為室溫(1~30℃)硬化型、加熱硬化型及其他(光硬化型等)。
接著塗層(絕緣被膜)用之環氧樹脂硬化劑可使用加熱硬化型之物。加熱硬化型環氧樹脂硬化劑可舉芳香族胺、酚系硬化劑、酸酐系硬化劑、二氰二胺等。
本實施形態之環氧樹脂硬化劑含有酚系硬化劑(A)與胺系硬化劑(B)。
酚系硬化劑(A)可舉例如苯酚酚醛清漆樹脂、甲酚酚醛清漆樹脂、雙酚酚醛清漆樹脂、三𠯤改質苯酚酚醛清漆樹脂、可溶酚醛酚樹脂、甲酚萘酚甲醛縮合體等。
酚系硬化劑(A)可單獨使用1種,亦可將2種以上併用。
酚系硬化劑(A)之含量相對於環氧樹脂100質量份為1~40質量份。酚系硬化劑(A)之含量下限值宜為5質量份以上,較佳為10質量份以上,更佳為大於15質量份。又,酚系硬化劑(A)之含量上限值宜為35質量份以下,較佳為30質量份以下。酚系硬化劑(A)之含量若在上述下限值以上,可更提高電磁鋼板用塗覆組成物的耐熱性。酚系硬化劑(A)之含量若在上述上限值以下,可更抑制對電磁鋼板40賦予之應力應變。
胺系硬化劑(B)為選自芳香族胺及二氰二胺之1種以上。在本實施形態中,藉由環氧樹脂硬化劑使用胺系硬化劑(B),可更抑制對電磁鋼板40賦予之應力應變,結果可大幅提升電磁鋼板40之磁特性。從所述觀點來看,胺系硬化劑(B)宜至少使用芳香族胺。
芳香族胺可舉例如間茬二胺、間苯二胺、二胺基二苯甲烷、二胺基二苯基碸等。
二氰二胺亦作為潛伏性硬化劑為人所知。潛伏性硬化劑與環氧樹脂摻混而可在室溫下穩定儲存,且具有藉由熱、光、壓力等使樹脂組成物急速硬化的能力。
應用二氰二胺時,宜與硬化促進劑併用。硬化促進劑可舉三級胺、咪唑類、芳香族胺等。
胺系硬化劑(B)可單獨使用1種,亦可將2種以上併用。
胺系硬化劑(B)之含量相對於環氧樹脂100質量份為0.5~5.0質量份。胺系硬化劑(B)之含量下限值宜為1.0質量份以上,較佳為2.0質量份以上,更佳為2.5質量份以上。又,胺系硬化劑(B)之含量上限值宜為4.5質量份以下,較佳為4.0質量份以下。胺系硬化劑(B)之含量若在上述下限值以上,可更抑制對電磁鋼板40賦予之應力應變。胺系硬化劑(B)之含量若在上述上限值以下,可更提高電磁鋼板40的接著強度。
[酚系硬化劑(A)之含量]/[胺系硬化劑(B)之含量]所示質量比(以下亦稱為「A/B比」)宜為1.0~20.0。A/B比較佳為5.0以上,更佳為大於10.0,大於15.0又更佳。A/B比若在上述數值範圍內,可謀求更良好地兼顧抑制應力應變及耐熱性。
本實施形態之環氧樹脂硬化劑亦可含有酚系硬化劑(A)與胺系硬化劑(B)以外之其他環氧樹脂硬化劑(D)。
其他環氧樹脂硬化劑(D)可列舉酸酐系硬化劑、脂肪族多胺、改質胺、聚醯胺胺(polyamide amine)、二級胺、三級胺、咪唑類、聚硫醇(polymercaptan)類、醯肼化合物等。
該等其他環氧樹脂硬化劑(D)可單獨使用1種,亦可將2種以上併用。
酸酐系硬化劑可舉例如酞酸酐、六氫酞酸酐、甲基四氫酞酸酐、甲基六氫酞酸酐、甲基納迪克酸酐、氯茵酸酐等、焦蜜石酸酐、二苯基酮四甲酸酐、乙二醇雙(脫水偏苯三甲酸酯)、甲基環己烯四甲酸酐、偏苯三甲酸酐、聚壬二酸酐等。
脂肪族多胺可舉例如二伸乙三胺、三伸乙四胺、二伸丙二胺、二乙基胺基丙胺等。
聚醯胺胺可舉例如藉由二羧酸與脂肪族多胺縮合而生成之聚醯胺樹脂等。
二羧酸可舉例如琥珀酸、己二酸、庚二酸、壬二酸、癸二酸、十二烷二酸、六氫酞酸等。
改質胺可舉例如多胺環氧樹脂加成物(胺加成物)、酮亞胺等。
二級胺可舉例如哌啶等。
三級胺可舉例如N,N-二甲基哌𠯤、三伸乙二胺、二甲苄胺、2-(二甲基胺基甲基)酚、2,4,6-參(二甲基胺基甲基)酚等。
咪唑類可舉例如2-甲基咪唑、2-乙基-4-甲基咪唑、1-氰基乙基-2-十一基咪唑鎓・三烯丙酯等。
聚硫醇類可舉例如液態聚硫醇、聚硫樹脂等。
醯肼化合物可舉例如己二酸二醯肼、異酞酸二醯肼、癸二酸二醯肼、柳酸醯肼等。
其他環氧樹脂硬化劑之含量宜相對於環氧樹脂100質量份為3質量份以下。
本實施形態之電磁鋼板用塗覆組成物亦可含有環氧樹脂、環氧樹脂硬化劑以外之其他成分(以下亦稱為「任意成分」)。
任意成分可舉上述不符合環氧樹脂硬化劑之硬化促進劑(硬化觸媒)、乳化劑、消泡劑、調平劑、黏性調整劑、防腐劑等。
乳化劑可舉例如非離子系界面活性劑等。
消泡劑可舉例如聚矽氧系消泡劑等。
調平劑可舉例如丙烯酸聚合物系調平劑或聚矽氧系調平劑等。
黏性調整劑可舉例如膨土或鋰膨潤石等黏土系矽酸鹽等。
防腐劑可舉例如異噻唑啉酮衍生物系防腐劑等。
本實施形態之電磁鋼板用塗覆組成物包含任意成分時,任意成分之含量宜相對於環氧樹脂100質量份為0.01~5質量份。
將本實施形態之電磁鋼板用塗覆組成物塗佈於電磁鋼板後,使其乾燥來獲得絕緣被膜3。在將本實施形態之電磁鋼板用塗覆組成物塗佈於電磁鋼板時,宜進行燒附而塗佈。
燒附時之到達溫度例如以120~220℃為佳,130~210℃較佳,140~200℃更佳。到達溫度若在上述下限值以上,電磁鋼板用塗覆組成物便會與電磁鋼板充分接著,而可抑制剝離。到達溫度若在上述上限值以下,可抑制環氧樹脂的硬化,且可維持電磁鋼板用塗覆組成物之接著能力。
燒附時的燒附時間例如以5~60秒為佳,10~30秒較佳,10~20秒更佳。燒附時間若在上述下限值以上,電磁鋼板用塗覆組成物會與電磁鋼板充分接著,而會抑制剝離。燒附時間若在上述上限值以下,可抑制環氧樹脂的硬化,且可維持電磁鋼板用塗覆組成物之接著能力。
關於絕緣被膜3之平均厚度t1的上下限值,也考慮到胚料1作為電磁鋼板40來使用的情況,例如可設定成如以下。
胚料1作為電磁鋼板40來使用時,絕緣被膜3之平均厚度t1(電磁鋼板40(胚料1)每面的厚度)係調整成可確保在彼此積層之電磁鋼板40間的絕緣性能及接著能力。
在單層結構之絕緣被膜3的情況下,絕緣被膜3之平均厚度t1(電磁鋼板40(胚料1)每面的厚度)例如可設為1.5µm以上且8.0µm以下。
在多層結構之絕緣被膜3的情況下,基底絕緣被膜之平均厚度例如可設為0.3µm以上且2.5µm以下,且宜為0.5µm以上且1.5µm以下。表層絕緣被膜之平均厚度例如可設為1.5µm以上且8.0µm以下。
又,胚料1中之絕緣被膜3之平均厚度t1的測定方法可按與胚料1之平均板厚t0同樣想法,求算複數處之絕緣被膜3的厚度,作為該等厚度之平均來求算。
關於該胚料1中之絕緣被膜3之平均厚度t1,其上下限值當然亦可採用來作為電磁鋼板40中之絕緣被膜3之平均厚度t1的上下限值。
又,電磁鋼板40中之絕緣被膜3之平均厚度t1的測定方法譬如係利用以下測定方法。例如,選定形成積層鐵芯的複數片電磁鋼板之中位於積層方向最外側之電磁鋼板40(表面在積層方向露出之電磁鋼板40)。在所選定之電磁鋼板40的表面中,選定直徑方向的預定位置(例如,在電磁鋼板40之內周緣與外周緣的正中間(中央)的位置)。在所選定之位置上,在圓周方向上空出同等間隔,在4處(亦即,以中心軸線O為中心每隔90度)測定電磁鋼板40之絕緣被膜3的厚度。並且可以所測出之4處厚度之平均值作為絕緣被膜3之平均厚度t1。
又,如所述這般在位於積層方向最外側之電磁鋼板40中測定絕緣被膜3之平均厚度t1的理由在於:絕緣被膜3係被精心製作成絕緣被膜3之厚度在沿著電磁鋼板40之積層方向的積層位置上幾乎不變。
藉由將如以上所述之胚料1沖裁加工來製造電磁鋼板40,並且利用電磁鋼板40來製造積層鐵芯(定子鐵芯21或轉子鐵芯31)。
以下,回到積層鐵芯之說明。
如圖3所示,形成定子鐵芯21之複數片電磁鋼板40係透過絕緣被膜3來積層。
在積層方向上相鄰之電磁鋼板40係藉由絕緣被膜3遍及整面來接著。換言之,在電磁鋼板40中朝向積層方向的面(以下稱為第1面)係遍及整面皆成為接著區域41a。然而,在積層方向上相鄰之電磁鋼板40亦可未遍及整面被接著。換言之,在電磁鋼板40之第1面中,亦可混合存在有接著區域41a與非接著區域(未圖示)。
在本實施形態中,用以形成轉子鐵芯31之複數片電磁鋼板係藉由圖1所示之歛合件42(定位銷)來彼此固定。但,形成轉子鐵芯31之複數片電磁鋼板也可與定子鐵芯21同樣地具有藉由絕緣被膜3來固定之積層結構。
另外,定子鐵芯21或轉子鐵芯31等積層鐵芯亦可藉由所謂之捲繞層疊來形成。
前述定子鐵芯21例如係使用圖7所示製造裝置100來製造。以下,在說明製造方法時,首先先說明積層鐵芯之製造裝置100(以下簡稱為製造裝置100)。
在製造裝置100中,係從卷料1A(鋼帶)將胚料1朝向箭頭F方向送出的同時,藉由配置於各站的模具進行複數次沖裁而逐漸形成電磁鋼板40的形狀。然後,將沖裁後之電磁鋼板40積層,並且一邊使其升溫一邊加壓。其結果,透過絕緣被膜3使在積層方向上相鄰之電磁鋼板40接著(亦即,使絕緣被膜3之中位於接著區域41a的部分發揮接著能力),而完成接著。
如圖7所示,製造裝置100具備有複數階之沖裁站110。沖裁站110可為二階,亦可為三階以上。各階之沖裁站110具備配置於胚料1之下方的母模111與配置於胚料1之上方的公模112。
製造裝置100在較最下游之沖裁站110更下游的位置,進一步具備積層站140。該積層站140具備有加熱裝置141、外周沖裁母模142、隔熱構件143、外周沖裁公模144及彈簧145。
加熱裝置141、外周沖裁母模142及隔熱構件143配置於胚料1之下方。另一方面,外周沖裁公模144及彈簧145配置於胚料1之上方。又,符號21表示定子鐵芯。
在具有以上說明之結構的製造裝置100中,首先從卷料1A將胚料1沿圖7之箭頭F方向依序送出。然後,藉由複數階之沖裁站110對於該胚料1依序施行沖裁加工。藉由該等沖裁加工,在胚料1獲得圖3所示之具有芯背部22與複數個齒部23之電磁鋼板40的形狀。惟,在此時間點尚未完全沖裁,因此沿著箭頭F方向往下一個步驟前進。
然後,最後胚料1會被送出到積層站140,被外周沖裁公模144沖裁並且精確地積層。在該積層時,電磁鋼板40係藉由彈簧145而受到固定的加壓力。藉由依序重複如以上說明之沖裁步驟與積層步驟,可堆疊預定片數之電磁鋼板40。且更進一步,以如上述方式堆疊電磁鋼板40而形成的積層體係藉由加熱裝置141被加熱至例如200℃的溫度。藉由該加熱,相鄰之電磁鋼板40之絕緣被膜3彼此會被接著(接著步驟)。
又,加熱裝置141亦可不配置於外周沖裁母模142。亦即,亦可在要接著經外周沖裁母模142積層之電磁鋼板40之前,將其取出至外周沖裁母模142外。在此情況下,於外周沖裁母模142亦可無隔熱構件143。此外,在此情況下,亦可將所堆疊之接著前的電磁鋼板40利用未圖示之夾具從積層方向的兩側夾住並保持後,將其運送或加熱。
藉由以上各步驟,定子鐵芯21便完成。
接著步驟中之加熱溫度例如以120~250℃為佳,150~230℃較佳,200~220℃更佳。加熱溫度若在上述下限值以上,絕緣被膜3會充分硬化,可更提高積層鐵芯之接著強度。加熱溫度若在上述上限值以下,可抑制絕緣被膜3之熱劣化,而可更提高積層鐵芯之接著強度。
接著步驟中之加熱時間會因積層鐵芯之大小或加熱方法而受到影響,例如宜為30~120分鐘,45~100分鐘較佳,60~80分鐘更佳。加熱時間若在上述下限值以上,絕緣被膜3會充分硬化,可更提高積層鐵芯之接著強度。加熱時間若在上述上限值以下,可抑制絕緣被膜3之熱劣化,而可更提高積層鐵芯之接著強度。
使絕緣被膜3彼此接著時,亦可藉由加壓積層體來使其接著。
加壓積層體時的壓力譬如宜為2~50MPa,3~30MPa較佳,4~20MPa更佳。加壓積層體時的壓力若在上述下限值以上,絕緣被膜3會充分密著,可更提高積層鐵芯之接著強度。加壓積層體時的壓力若在上述上限值以下,可抑制絕緣被膜3從端部溢出,而可更提升積層鐵芯之層疊精度。
加壓積層體時的加壓時間譬如宜為3~120分鐘,10~100分鐘較佳,30~80分鐘更佳。加壓時間若在上述下限值以上,絕緣被膜3會充分密著,可更提高積層鐵芯之接著強度。加壓時間若在上述上限值以下,可抑制絕緣被膜3從端部溢出,而可更提升積層鐵芯之層疊精度。
以上,已說明了本發明之一實施形態。惟,本發明之技術範圍並不僅限定於前述實施形態,在不脫離本發明主旨之範圍內可加入各種變更。
譬如,定子鐵芯21的形狀並不僅限定於上述實施形態所示之形態。具體而言,定子鐵芯21之外徑及內徑尺寸、積層厚度、槽數、齒部23之圓周方向與直徑方向的尺寸比例、齒部23與芯背部22之直徑方向的尺寸比例等,可因應所欲之旋轉電機特性來任意設計。
雖然在前述實施形態之轉子30中,2個1組的永久磁鐵32形成有1個磁極,但本發明並不僅限於該形態。例如,亦可為1個永久磁鐵32形成有1個磁極,或可為3個以上永久磁鐵32形成有1個磁極。
在上述實施形態中,作為旋轉電機10係舉永久磁鐵磁場型電動機為一例進行了說明,但如以下所例示這般,旋轉電機10之構造並不僅限於此,也可進一步採用以下未例示之各種公知構造。
在上述實施形態中,作為旋轉電機10係舉永久磁鐵磁場型電動機為一例進行了說明,但本發明並不僅限於此。例如,旋轉電機10亦可為磁阻型電動機或電磁鐵磁場型電動機(磁場繞組型電動機)。
在上述實施形態中,作為交流電動機係舉同步電動機為一例進行了說明,但本發明不限於此。例如,旋轉電機10亦可為感應電動機。
在上述實施形態中,作為旋轉電機10係舉交流電動機為一例進行了說明,但本發明不限於此。例如,旋轉電機10亦可為直流電動機。
在上述實施形態中,作為旋轉電機10係舉電動機為一例進行了說明,但本發明不限於此。例如,旋轉電機10亦可為發電機。
另外,在不脫離本發明主旨之範圍內,可將前述實施形態之構成要素適當置換成周知之構成要素,又,亦可適當組合前述變形例。
實施例
以下,藉由實施例及比較例更具體地說明本發明一態樣之效果,但實施例中之條件係為了確認本發明之可實施性及效果而採用的一條件例,本發明不限定於以下實施例。只要能在不脫離本發明主旨下達成本發明之目的,則本發明可採用各種條件。
[實施例1~9、比較例1~11]
製造出厚度:0.25mm且寬度:100mm之無方向性電磁鋼板,該無方向性電磁鋼板以質量%計為Si:3.0%、Mn:0.2%及Al:0.5%,且剩餘部分由Fe及不純物所構成。電磁鋼板用塗覆組成物係使用表1所示環氧樹脂組成物。
以使絕緣被膜之厚度以平均計成為3µm之方式,在表1之燒附條件下塗佈環氧樹脂組成物。具體而言,首先從無方向性電磁鋼板裁切出55mm×55mm尺寸之單板,且將該單板沖裁成外徑300mm、內徑240mm之環狀。接著,於單板表面塗佈電磁鋼板用塗覆組成物,然後重疊2片單板並加壓,藉此製作出積層體。加壓條件設為鋼板溫度200℃、壓力10MPa、加壓時間1小時。
<測定磁特性>
使用上述積層體,根據JIS C2556:2015,以單板試驗機進行磁特性之測定。又,磁特性(磁性)係作為鐵損評估了「W10/400(W/kg)」。「W10/400」為頻率400Hz且最大磁通密度1.0T時的鐵損。磁特性之評估基準設為W10/400為12.0W/kg以下,在W10/400為12.0W/kg以下時評為磁特性無劣化(在表2中標記為「佳」)。
<測定接著強度>
剪切接著強度之測定係藉由以下方法來實施。首先,從無方向性電磁鋼板裁切出2片30mm×60mm尺寸之單板。接著,於表面塗佈電磁鋼板用塗覆組成物,將塗佈後之2片單板以重疊30mm×10mm的方式疊合並加壓,製作出測定用試樣。加壓條件設為鋼板溫度200℃、壓力10MPa、加壓時間1小時。
針對所得試樣,分別在將氣體環境溫度設為25℃與150℃的氣體環境下,藉由拉伸試驗機測定拉伸至剝離為止的最大荷重(N),並將該最大荷重(N)除以接著面積後之數值定為該溫度之接著強度。
表1中,電磁鋼板用塗覆組成物之各成分種類如下述。
<環氧樹脂>
E1:雙酚A型環氧樹脂。
E2:雙酚F型環氧樹脂。
E3:三苯甲烷型環氧樹脂。
<酚系硬化劑(A)(硬化劑A)>
A1:可溶酚醛酚樹脂。
A2:苯酚酚醛清漆樹脂。
A3:甲酚萘酚甲醛縮合體。
<硬化劑A之比較成分>
C1:三伸乙四胺。
C2:甲基六氫酞酸酐。
<胺系硬化劑(B)(硬化劑B)>
B1:間茬二胺。
B2:二胺基二苯甲烷。
B3:二氰二胺。
<其他環氧樹脂硬化劑(D)>
D1:己二酸二醯肼
D2:胺加成物(融點100℃,數量平均分子量1500)
<任意成分>
乳化劑:非離子系界面活性劑(聚氧伸乙基烷基醚)。
消泡劑:聚矽氧系消泡劑(聚二甲基矽氧烷系化合物型消泡劑)。
<判定>
從上述磁特性之測定與接著強度之測定的結果,根據下述評估基準評估了鐵損及耐熱性。鐵損越小意味著對電磁鋼板賦予之應力應變越被抑制。將測定結果及評估之判定列示於表2。在表中,針對發明範圍外之值附加了底線。
<評估基準>
「佳」:150℃之接著強度為0.5MPa以上,且鐵損為12.0W/kg以下。
「不佳」:150℃之接著強度小於0.5MPa或者鐵損大於12.0W/kg。
如表2所示,在應用了本發明之實施例1~9中,150℃之接著強度為0.5MPa以上且鐵損為12.0W/kg以下,判定為「佳」。
另一方面,酚系硬化劑(A)之含量在本發明範圍外之比較例1~2,其等的鐵損大於12.0W/kg,判定為「不佳」。胺系硬化劑(B)之含量在本發明範圍外之比較例3~6,其等的鐵損大於12.0W/kg,判定為「不佳」。取代酚系硬化劑(A)而使用了脂肪族多胺或酸酐系硬化劑之比較例7~8,其等的鐵損大於12.0W/kg,判定為「不佳」。不含酚系硬化劑(A)之比較例9與11,其等的150℃之接著強度小於0.5MPa,判定為「不佳」。不含胺系硬化劑(B)之比較例10的鐵損大於12.0W/kg,判定為「不佳」。
從以上結果可知根據本發明電磁鋼板用塗覆組成物,對電磁鋼板賦予之應力應變會更被抑制,並且具有在馬達發熱時也可維持接著強度之耐熱性。
1:胚料
1A:卷料
2:母材鋼板
3:絕緣被膜
10:旋轉電機
20:定子
21:定子用接著積層鐵芯(定子鐵芯)
22:芯背部
23:齒部
30:轉子
31:轉子鐵芯
32:永久磁鐵
33:貫通孔
40:電磁鋼板
41a:接著區域
42:歛合件
50:罩殼
60:旋轉軸
100:製造裝置
110:沖裁站
111:母模
112:公模
140:積層站
141:加熱裝置
142:外周沖裁母模
143:隔熱構件
144:外周沖裁公模
145:彈簧
A-A,B-B:線
C:部位
F:箭頭
O:中心軸線
t0:胚料之平均板厚
t1:絕緣被膜之平均厚度
圖1為旋轉電機的截面圖,該旋轉電機具備有本發明一實施形態之積層鐵芯。
圖2為圖1所示積層鐵芯的側視圖。
圖3為圖2的A-A截面圖。
圖4為用以形成圖1所示積層鐵芯之胚料的俯視圖。
圖5為圖4的B-B截面圖。
圖6為圖5之C部位的放大圖。
圖7為製造裝置的側視圖,該製造裝置係用來製造圖1所示積層鐵芯。
10:旋轉電機
20:定子
21:定子用接著積層鐵芯(定子鐵芯)
22:芯背部
23:齒部
30:轉子
31:轉子鐵芯
32:永久磁鐵
33:貫通孔
40:電磁鋼板
42:歛合件
50:罩殼
60:旋轉軸
O:中心軸線
Claims (4)
- 一種電磁鋼板用塗覆組成物,含有:環氧樹脂、酚系硬化劑(A)以及胺系硬化劑(B);並且,前述胺系硬化劑(B)為芳香族胺,前述酚系硬化劑(A)之含量相對於前述環氧樹脂100質量份為1~40質量份,前述胺系硬化劑(B)之含量相對於前述環氧樹脂100質量份為0.5~5質量份。
- 如請求項1之電磁鋼板用塗覆組成物,其中[前述酚系硬化劑(A)之含量]/[前述胺系硬化劑(B)之含量]所示質量比為1~20。
- 一種接著用表面被覆電磁鋼板,於表面具有絕緣被膜且板厚為0.65mm以下,該絕緣被膜包含如請求項1或2之電磁鋼板用塗覆組成物。
- 一種積層鐵心,係積層2片以上如請求項3之接著用表面被覆電磁鋼板而成者。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2020104233 | 2020-06-17 | ||
JP2020-104233 | 2020-06-17 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW202208485A TW202208485A (zh) | 2022-03-01 |
TWI788882B true TWI788882B (zh) | 2023-01-01 |
Family
ID=79268053
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW110122208A TWI788882B (zh) | 2020-06-17 | 2021-06-17 | 電磁鋼板用塗覆組成物、接著用表面被覆電磁鋼板及積層鐵心 |
Country Status (9)
Country | Link |
---|---|
US (1) | US20230250323A1 (zh) |
EP (1) | EP4169715A4 (zh) |
JP (1) | JP7415198B2 (zh) |
KR (1) | KR20230010702A (zh) |
CN (1) | CN115768924A (zh) |
CA (1) | CA3181582A1 (zh) |
MX (1) | MX2022015824A (zh) |
TW (1) | TWI788882B (zh) |
WO (1) | WO2021256529A1 (zh) |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH11193475A (ja) * | 1997-12-26 | 1999-07-21 | Nkk Corp | 接着強度、耐食性及び耐ブロッキング性に優れた接着鉄芯用電磁鋼板の製造方法 |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5739510A (en) * | 1980-08-20 | 1982-03-04 | Matsushita Electric Ind Co Ltd | Manufacture of electromagnetic steel plate |
JPH0238042A (ja) * | 1988-07-28 | 1990-02-07 | Kawasaki Steel Corp | 加熱接着用表面被覆鋼板の製造方法 |
JP3369941B2 (ja) * | 1997-11-27 | 2003-01-20 | 日本鋼管株式会社 | 接着強度、耐食性及び耐ブロッキング性に優れた接着鉄芯用電磁鋼板の製造方法 |
JP3369940B2 (ja) * | 1997-11-27 | 2003-01-20 | 日本鋼管株式会社 | 接着強度、耐食性及び耐ブロッキング性に優れた接着鉄芯用電磁鋼板の製造方法 |
JP2000173816A (ja) | 1998-12-02 | 2000-06-23 | Nippon Steel Corp | 接着用表面被覆電磁鋼板とその製造方法 |
JP3732971B2 (ja) | 1999-05-28 | 2006-01-11 | Jfeスチール株式会社 | 剪断強度及び剥離強度に優れた接着鉄芯用電磁鋼板の製造方法 |
WO2004070080A1 (ja) | 2003-02-03 | 2004-08-19 | Nippon Steel Corporation | 接着用表面被覆電磁鋼板 |
JP4860480B2 (ja) * | 2004-10-18 | 2012-01-25 | 新日本製鐵株式会社 | 耐熱接着性被膜を被覆した耐熱接着性被膜付き電磁鋼板ならびに当該電磁鋼板を用いた鉄心およびその製造方法 |
US20070087201A1 (en) * | 2005-10-13 | 2007-04-19 | Michael Wimmer | Self-bonding coating composition |
JP6134497B2 (ja) * | 2012-11-08 | 2017-05-24 | 京セラ株式会社 | 積層コアの製造方法 |
JP5739510B2 (ja) | 2013-12-12 | 2015-06-24 | 大阪瓦斯株式会社 | 風呂湯張り装置 |
JP2017011863A (ja) | 2015-06-22 | 2017-01-12 | 新日鐵住金株式会社 | モータ鉄心用積層電磁鋼板およびその製造方法 |
DE102015012172A1 (de) * | 2015-09-23 | 2017-03-23 | Universität Kassel | Thermisch aktivierbare, schnellhärtende Klebstoffbeschichtung |
JP6737454B2 (ja) | 2016-12-27 | 2020-08-12 | アイシン・エィ・ダブリュ株式会社 | ロータの製造方法および接着剤の塗布装置 |
JP7115306B2 (ja) | 2018-12-28 | 2022-08-09 | トヨタ自動車株式会社 | 組付装置 |
-
2021
- 2021-06-17 US US18/010,548 patent/US20230250323A1/en active Pending
- 2021-06-17 CA CA3181582A patent/CA3181582A1/en active Pending
- 2021-06-17 JP JP2022531902A patent/JP7415198B2/ja active Active
- 2021-06-17 MX MX2022015824A patent/MX2022015824A/es unknown
- 2021-06-17 KR KR1020227043613A patent/KR20230010702A/ko unknown
- 2021-06-17 CN CN202180042912.3A patent/CN115768924A/zh active Pending
- 2021-06-17 TW TW110122208A patent/TWI788882B/zh active
- 2021-06-17 WO PCT/JP2021/023022 patent/WO2021256529A1/ja active Application Filing
- 2021-06-17 EP EP21825772.3A patent/EP4169715A4/en active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH11193475A (ja) * | 1997-12-26 | 1999-07-21 | Nkk Corp | 接着強度、耐食性及び耐ブロッキング性に優れた接着鉄芯用電磁鋼板の製造方法 |
Also Published As
Publication number | Publication date |
---|---|
WO2021256529A1 (ja) | 2021-12-23 |
EP4169715A4 (en) | 2023-11-29 |
CN115768924A (zh) | 2023-03-07 |
CA3181582A1 (en) | 2021-12-23 |
JPWO2021256529A1 (zh) | 2021-12-23 |
JP7415198B2 (ja) | 2024-01-17 |
EP4169715A1 (en) | 2023-04-26 |
US20230250323A1 (en) | 2023-08-10 |
TW202208485A (zh) | 2022-03-01 |
KR20230010702A (ko) | 2023-01-19 |
MX2022015824A (es) | 2023-01-24 |
BR112022024499A2 (pt) | 2022-12-27 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
TW202037041A (zh) | 定子用接著積層鐵芯、其製造方法、及旋轉電機 | |
TWI769867B (zh) | 電磁鋼板、積層鐵芯及積層鐵芯製造方法 | |
TWI788883B (zh) | 電磁鋼板用塗覆組成物、接著用表面被覆電磁鋼板及積層鐵心 | |
US12005487B2 (en) | Method of manufacturing laminated core | |
TWI788882B (zh) | 電磁鋼板用塗覆組成物、接著用表面被覆電磁鋼板及積層鐵心 | |
TWI786685B (zh) | 電磁鋼板用塗覆組成物、電磁鋼板、積層鐵芯及旋轉電機 | |
TWI792355B (zh) | 電磁鋼板、積層鐵芯及旋轉電機 | |
TWI774428B (zh) | 電磁鋼板用塗覆組成物、電磁鋼板、積層鐵芯及旋轉電機 | |
TWI780778B (zh) | 電磁鋼板用塗覆組成物、電磁鋼板、積層鐵芯及旋轉電機 | |
RU2814180C1 (ru) | Покрывающая композиция для листа электротехнической стали, лист электротехнической стали с покрытой адгезивом поверхностью и шихтованный сердечник | |
TWI782582B (zh) | 電磁鋼板用塗覆組成物、電磁鋼板、積層鐵芯及旋轉電機 | |
BR112022024499B1 (pt) | Composição de revestimento para uma chapa de aço elétrico, chapa de aço elétrico revestida com superfície adesiva, e, núcleo laminado | |
JP2022000537A (ja) | 電磁鋼板、積層コア及び回転電機、ならびに電磁鋼板の製造方法 |