TWI787425B - heat sink - Google Patents
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- TWI787425B TWI787425B TW107147646A TW107147646A TWI787425B TW I787425 B TWI787425 B TW I787425B TW 107147646 A TW107147646 A TW 107147646A TW 107147646 A TW107147646 A TW 107147646A TW I787425 B TWI787425 B TW I787425B
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- heat dissipation
- thermally connected
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
Abstract
本發明的目的是提供一種散熱器,即使發熱量多的熱點偏重在發熱體封裝的一部分領域,也能夠發揮優秀的冷卻性能。散熱器包括複數個散熱管,其中各散熱管包括:一個端部,熱連接到在封裝內具備發熱體的發熱體封裝;以及另一個端部,熱連接到散熱部。複數的該散熱管中至少存在有第1散熱管、以及熱輸送能力比該第1散熱管大的第2散熱管。It is an object of the present invention to provide a heat sink capable of exhibiting excellent cooling performance even when a hot spot with a large amount of heat is concentrated in a part of the heating element package. The heat sink includes a plurality of radiating pipes, wherein each radiating pipe includes: one end thermally connected to the heat-generating body package provided with the heat-generating body in the package; and the other end thermally connected to the heat-dissipating part. Among the plurality of heat radiation pipes, there are at least a first heat radiation pipe and a second heat radiation pipe having a higher heat transfer capability than the first heat radiation pipe.
Description
本發明係有關於一種對通過散熱管放出發熱體的熱之散熱片傳輸熱,藉此冷卻發熱體的散熱器。The present invention relates to a radiator that cools the heating element by transferring heat to the heat sink that emits the heat of the heating element through the heat dissipation pipe.
伴隨著電子機器的高性能化,在電子機器內部,會有發熱體封裝內搭載了複數的電子零件等的發熱體的情況。又,因應於電子零件等的功能的差異,各電子零件等的發熱量也各式各樣。因此,有時會有發熱量多的熱點偏重於發熱體封裝的一部分領域的情況。即使是這樣的發熱體封裝,為了確實且有效率地進行冷卻,會有複數的散熱管熱連接到發熱體封裝的情況。With the increase in performance of electronic equipment, there are cases where a plurality of heat generating elements such as electronic components are mounted in a heat generating body package inside the electronic equipment. In addition, according to the difference in functions of electronic components and the like, the amount of heat generated by each electronic component and the like also varies. Therefore, there may be a case where a hot spot with a large amount of heat generation is concentrated on a part of the heating element package. Even in such a heating element package, in order to perform cooling reliably and efficiently, a plurality of heat radiation pipes may be thermally connected to the heating element package.
複數的散熱管熱連接到發熱體的散熱器中,例如有一種散熱器被提出(專利文獻1),具備突部,將複數的散熱管當中距離發熱體較近的至少一個熱管,比起其他的散熱管更從發熱體往受熱板的厚度方向遠離。專利文獻1中,藉由具備突部,將複數的散熱管當中距離發熱體較近的至少一個熱管,比起其他的散熱管更從發熱體往受熱板的厚度方向遠離,使得一根散熱管與其他的散熱管距離熱源的距離均等化。因此,能夠減低對一根散熱管的熱負荷,有效率地冷卻發熱體。A plurality of radiating pipes are thermally connected to the radiator of the heating element. For example, a radiator has been proposed (Patent Document 1), which has a protrusion, and at least one of the plurality of radiating pipes is closer to the heating element than the other heat pipes. The radiating pipe is further away from the heating element to the thickness direction of the heating plate. In
另一方面,專利文獻1中,因為複數的散熱管的熱輸送能力略相同,使得從一根散熱管與其他的散熱管到熱源的距離均等化。因此,關於熱源在正上方的散熱管,因為與發熱體在受熱板的厚度方向上分離,所以仍然有靠近熱源進一步發揮熱輸送能力的空間。因此,散熱器的冷卻性能的提昇仍有改善空間。On the other hand, in
又,複數的散熱管的熱輸送能力略均一的話,需要配合位於熱源正上方的散熱管所被要求的熱輸送能力,來特定其他的熱管的規格。熱輸送能力大的散熱管,例如能夠舉出口徑大的規格的散熱管。另一方面,口徑大的散熱管有熱阻抗大、彎曲等的加工特性不佳,不容易做確切的配置等問題,因此提昇熱輸送特性上仍有改善空間。In addition, if the heat transfer capability of the plurality of heat pipes is slightly uniform, it is necessary to specify the specifications of other heat pipes in accordance with the required heat transfer capacity of the heat pipe directly above the heat source. Examples of heat pipes having a large heat transfer capability include heat pipes having a large diameter. On the other hand, large-diameter heat pipes have problems such as large thermal resistance, poor processing characteristics such as bending, and it is not easy to make exact configurations. Therefore, there is still room for improvement in improving heat transfer characteristics.
專利文獻1:日本特開2014-126249號公報Patent Document 1: Japanese Patent Laid-Open No. 2014-126249
有鑑於上述的問題點,本發明的目的是提供一種散熱器,即使發熱量多的熱點偏重在發熱體封裝的一部分領域,也能夠發揮優秀的冷卻性能。In view of the above-mentioned problems, an object of the present invention is to provide a heat sink capable of exhibiting excellent cooling performance even when a hot spot with a large amount of heat is concentrated in a part of the heating element package.
本發明的態樣是一種散熱器,包括複數個散熱管,其中各散熱管包括:一個端部,熱連接到在封裝內具備發熱體的發熱體封裝;以及另一個端部,熱連接到散熱部。複數的該散熱管中至少存在有第1散熱管、以及熱輸送能力比該第1散熱管大的第2散熱管。An aspect of the present invention is a heat sink comprising a plurality of radiating pipes, wherein each radiating pipe comprises: one end thermally connected to a heat generating body package having a heat generating body inside the package; and the other end thermally connected to a heat sink department. Among the plurality of heat radiation pipes, there are at least a first heat radiation pipe and a second heat radiation pipe having a higher heat transfer capability than the first heat radiation pipe.
本發明的態樣是一種散熱器,一種散熱器,包括複數個散熱管,其中各散熱管包括:中央部,熱連接到在封裝內具備發熱體的發熱體封裝;以及兩端部,熱連接到散熱部。複數的該散熱管中至少存在有第1散熱管、以及熱輸送能力比該第1散熱管大的第2散熱管。An aspect of the present invention is a heat sink, a heat sink comprising a plurality of radiating pipes, wherein each radiating pipe comprises: a central portion thermally connected to a heat generating body package having a heat generating body inside the package; and two end portions thermally connected to to the cooling section. Among the plurality of heat radiation pipes, there are at least a first heat radiation pipe and a second heat radiation pipe having a higher heat transfer capability than the first heat radiation pipe.
本發明的態樣是複數的該散熱管的一個端部沿著該發熱體封裝的延伸方向並排配置。In an aspect of the present invention, one end portion of the plurality of heat radiation pipes is arranged side by side along the extending direction of the heating element package.
本發明的態樣是複數的該散熱管的中央部沿著該發熱體封裝的延伸方向並排配置。In an aspect of the present invention, the central portions of the plurality of heat radiation pipes are arranged side by side along the extending direction of the heating element package.
本發明的態樣是藉由該散熱管的橫向的尺寸的差異、該散熱管的橫向的形狀的差異、及/或該散熱管內收容的毛細構造體的差異,使該第2散熱管的熱輸送能力比該第1散熱管的熱輸送能力大。According to the aspect of the present invention, the difference in the lateral size of the heat pipe, the difference in the shape of the heat pipe, and/or the difference in the capillary structure accommodated in the heat pipe makes the second heat pipe The heat transfer capability is larger than the heat transfer capability of the first heat radiation pipe.
本發明的態樣是複數的該散熱管的一個端部熱連接到受熱板,該受熱板熱連接到該發熱體封裝。An aspect of the present invention is that one end of the plurality of heat dissipation pipes is thermally connected to a heating plate, and the heating plate is thermally connected to the heating element package.
本發明的態樣是複數的該散熱管的中央部熱連接到受熱板,該受熱板熱連接到該發熱體封裝。In an aspect of the present invention, the central parts of the plurality of heat dissipation pipes are thermally connected to a heating plate, and the heating plate is thermally connected to the heating element package.
本發明的態樣是該散熱器是用於冷卻在該封裝的延伸方向上配置了複數的該發熱體之該發熱體封裝。An aspect of the present invention is that the heat sink is used for cooling the heat generating body package in which a plurality of the heat generating bodies are arranged in the extending direction of the package.
本發明的態樣是該第2散熱管的一個端部熱連接到該發熱體的位置。In an aspect of the present invention, one end of the second heat radiation pipe is thermally connected to the position of the heat generating body.
本發明的態樣是該第2散熱管的中央部熱連接到該發熱體的位置。In an aspect of the present invention, the central part of the second heat radiation pipe is thermally connected to the position of the heating element.
本發明的態樣是該散熱器是用於冷卻在該封裝的延伸方向上存在發熱量多的熱點之該發熱體封裝。在本說明書中,「封裝的熱點」是指在封裝的全表面中,溫度比發熱體封裝表面全體的平均溫度高的領域。An aspect of the present invention is that the heat sink is used to cool the heat generating package in which there is a hot spot that generates a lot of heat in the extending direction of the package. In this specification, the "hot spot of the package" refers to a region where the temperature is higher than the average temperature of the entire package surface of the heating element on the entire surface of the package.
本發明的態樣是該第2散熱管的一個端部熱連接到該熱點。In an aspect of the present invention, one end portion of the second heat radiation pipe is thermally connected to the hot spot.
本發明的態樣是該第2散熱管的中央部熱連接到該熱點。In an aspect of the present invention, the central portion of the second heat radiation pipe is thermally connected to the hot spot.
根據本發明的態樣,至少合併使用第1散熱管以及比該第1散熱管的熱輸送能力大的第2散熱管,因此,將發熱體封裝的熱點或發熱體熱連接到相較於第1散熱管來說更靠近第2散熱管時,能夠藉由第2散熱管較大的熱輸送能力,對發熱體封裝發揮優秀的冷卻性能。又,即使發熱體封裝存在有熱點,藉由將熱點熱連接到第2散熱管的部位,利用第2散熱管相對大的熱輸送能力,有效率地冷卻熱點。又,第1熱管也熱連接到散熱部,因此能夠對熱輸送有所幫助,第2散熱管的負荷量減低,結果能夠對發熱體封裝發揮優秀的冷卻性能。According to the aspects of the present invention, at least the first radiating pipe and the second radiating pipe having a larger heat transfer capability than the first radiating pipe are used in combination, so that the hot spot of the heating element package or the heating element is thermally connected When the first heat pipe is closer to the second heat pipe, the second heat pipe has a greater heat transport capacity, and can exert excellent cooling performance on the heating element package. Also, even if there is a hot spot in the heating element package, by thermally connecting the hot spot to the position of the second heat dissipation pipe, the relatively large heat transfer capacity of the second heat dissipation pipe is used to efficiently cool the hot spot. In addition, the first heat pipe is also thermally connected to the radiating part, so it can contribute to heat transfer, and the load on the second heat pipe is reduced, resulting in excellent cooling performance for the heating element package.
根據本發明的態樣,複數的該散熱管的一個端部或中央部沿著該發熱體的封裝的延伸方向並排配置,藉此能夠確實且容易地將第2散熱管熱連接到發熱體封裝的熱點或發熱體。According to the aspect of the present invention, one end portion or the central portion of the plurality of heat radiation pipes is arranged side by side along the extending direction of the package of the heating element, whereby the second heat dissipation pipe can be reliably and easily thermally connected to the heat generating element package. hot spot or heating body.
根據本發明的態樣,散熱管的一個端部或中央部熱連接到受熱板,藉此散熱管與發熱體封裝之間的熱連接性提昇。又,受熱板雖也具有將分配到並排配置的各個散熱管的熱負荷均一化這樣的均熱板的作用,但藉由熱輸送能力大的第2散熱管的存在,不需要像習知一樣重視均熱板的作用,能夠使受熱板薄片化。因此能夠努力使散熱器輕量化及小型化。According to an aspect of the present invention, one end portion or the central portion of the radiating pipe is thermally connected to the heat receiving plate, thereby improving the thermal connection between the radiating pipe and the heating element package. In addition, although the heat receiving plate also has the function of uniforming the thermal load distributed to the respective radiating pipes arranged side by side, the presence of the second radiating pipe with a large heat transfer capability eliminates the need for conventional heat transfer. Emphasis on the function of the vapor chamber can make the heating plate thin. Therefore, efforts can be made to reduce the weight and size of the heat sink.
以下,使用圖式說明本發明的第1實施型態例的散熱器。如第1圖~第3圖所示,第1實施型態例的散熱器1具備第1散熱管11、第2散熱管21、散熱部40。第1散熱管11會熱連接到封裝102內具備發熱體101的發熱體封裝100。第2散熱管21同樣會熱連接到封裝102內具備發熱體101的發熱體封裝100。散熱部40具有共通地熱連接到第1散熱管11及第2散熱管21的複數的散熱片41。發熱體封裝100是散熱器1的冷卻對象。第1散熱管11及第2散熱管21是內部空間被密封,被減壓處理的熱輸送構件。Hereinafter, a heat sink according to a first embodiment of the present invention will be described using the drawings. As shown in FIGS. 1 to 3 , the
第1散熱管11的一個端部12熱連接到發熱體封裝100,另一個端部13熱連接到散熱部40。第2散熱管21的一個端部22熱連接到發熱體封裝100,另一個端部23熱連接到散熱部40。One
散熱器1中,具備複數(第1~3圖中是2根)的第1散熱管11及複數(第1~3圖中是2根)的第2散熱管21組成的複數的散熱管(以下,有時會將包含第1散熱管及第2散熱管的複數的散熱管稱為「散熱管群」)。散熱管群的各個散熱管在側面觀看下並排配置。散熱器1中,各個散熱管在側面觀看下並排成一列。散熱管群中第2散熱管21配置在側面觀看下的中央,第1散熱管11配置在側面觀看下的兩端。具體來說,2根的第1散熱管11與2根的第2散熱管21並排配置,中央配置2根第2散熱管21,兩端分別配置1根第1散熱管11。In the
第1散熱管11的一個端部12熱連接到受熱板30的第1面31。第2散熱管21的一個端部22熱連接到受熱板30的第1面31。第1散熱管11及第2散熱管21射至於受熱板30的相同面。受熱板30的第1面31及方想側的第2面32熱連接到發熱體封裝100。因此,第1散熱管11及第2散熱管21會透過受熱板30熱連接到發熱體封裝100。另外,散熱器1中,會安裝蓋構件110,來覆蓋受熱板30、第1散熱管11的一個端部12、第2散熱管21的一個端部22的上面。One
第1散熱管11的一個端部12,在與第1散熱管11的縱向正交的方向(也就是第1散熱管11的橫向)的剖面形狀並沒有特別限定,在散熱器1中形成圓形。也就是說,散熱器1中,相對於第1散熱管11的熱輸送方向垂直的方向的剖面形狀是圓形狀。又,第2散熱管21的一個端部22,在與第2散熱管21的縱向垂直的方向(也就是第2散熱管21的橫向)上的剖面形狀並沒有特別限定,在散熱器1中與第1散熱管11同樣地形成圓形。也就是說,散熱器1中,相對於第2散熱管21的熱輸送方向垂直的方向的剖面形狀是圓形狀。因此,第1散熱管11的一個端部12的橫向的剖面形狀與第2散熱管21的一個端部22的橫向的剖面形狀略相同。另外,本說明書中,「散熱管的縱向」是指散熱管的熱輸送方向,「散熱管的橫向」是指與散熱管的熱輸送方向垂直的方向。
The cross-sectional shape of one
又,第1散熱管11及第2散熱管21的內部,任一者都收容了毛細構造體(未圖示),用來使液相的動作流體(未圖示)從另一個端部13、23回流到一個端部12、22。毛細構造體是具有毛細管力的構造體。散熱器1中,第1散熱管11的毛細構造體是與第2散熱管21的毛細構造體相同的構造物。
Also, inside the
在第2散熱管21的一個端部22的橫向的徑長(外徑ψ2)比在第1散熱管11的一個端部12的橫向的徑長(外徑ψ1)更大。也就是說,第1散熱管11與第2散熱管21在上述橫向的徑長不同的點上,成為了不同構造的散熱管。藉由一個端部22的橫向的徑長(外徑ψ2)比一個端部12的橫向的徑長(外徑ψ1)更大,第2散熱管21會發揮比第1散熱管11更大的熱輸送能力。散熱器1中,第1散熱管11的橫向的形狀及徑長從一個端部12到另一個端部13為止大致相同,第2散熱管21的橫向的形狀及徑長從一個端部22到另一個端部23為止大致相同。
The lateral radial length (outer diameter ψ2 ) of the one
一個端部22的橫向的徑長(外徑ψ2)相對於一個端部12的橫向的徑長(外徑ψ1)的比率(外徑ψ2/外徑ψ1)超過1.00的話並沒有特別限制,例如1.05~3.00為佳,1.10~2.00更佳,1.20~1.50特佳。如果外徑ψ2/外徑ψ1比1.05小的話,第1散熱管11及第2散熱管21的熱輸送能力的差變小,會有無法在
熱點配置具有充分高的熱輸送能力的第2散熱管21的傾向。又,如果外徑ψ2/外徑ψ1比3.00小的話,第1散熱管11的彎曲以及第2散熱管21的彎曲等的受限的差異變大,做為一個散熱器內的構成要素,會有難以使用的傾向。又,一個端部22的橫向的剖面積相對於一個端部12的橫向的剖面面積的比率超過1.00的話並沒有特別限制,例如1.1~9.0為佳,1.2~4.0更佳,1.4~2.2特佳。
The ratio (outer diameter ψ2/outer diameter ψ1) of the lateral diameter length (outer diameter ψ2) of one
又,一個端部22的橫向的徑長(外徑ψ2)比一個端部12的橫向的徑長(外徑ψ1)大的話並沒有特別限制,一個端部12的橫向的徑長(外徑ψ1)例如能夠舉出5.0mm~10mm。又,一個端部22的橫向的徑長(外徑ψ2)例如能夠舉出5.3mm~30mm。
Also, if the lateral diameter length (outer diameter ψ2) of one
第1散熱管11的一個端部12與第2散熱管21的一個端部22沿著發熱體封裝100的延伸方向並排配置。又,第1散熱管11的一個端部12與第2散熱管21的一個端部22配置在略相同的平面上。因此,在第1散熱管11的一個端部12正下的受熱板30厚度與在第2散熱管21的一個端部22正下的受熱板30厚度略相同。另外,本說明書中,「封裝的延伸方向」是指封裝外面之中,沿著連接到散熱器的封裝面的方向。
One
如第2圖所示,第1散熱管11的一個端部12的平面觀看形狀是略直線狀,位於一個端部12與另一個端部13之間的中央部14的平面觀看的形狀也是略直線狀。第2散熱管21的一個端部22的平面觀看形狀是略直線狀,位於一個端部22與另一個端部23之間的中央部14的平面觀看的形狀也是略直線狀因此,第1散熱管11與第2散熱管21從一個端部12、22到中央部14、24,平面觀看略直線狀的部位橫方向排列配置。
As shown in FIG. 2, one
散熱器1中,關於第1散熱管11,熱連接到散熱部40的另一個端部13上形成有彎曲部15。因此,第1散熱管11任一者從平面觀看都形成L字狀。又,右側的一根第1散熱管11的彎曲部15向右方向彎曲,相對地,左側的一根第1散
熱管11的彎曲部15向左方向彎曲。也就是說,位於左側的第1散熱管11與位於右側的第1散熱管11,曲部15的彎曲方向相反。
In the
關於第2散熱管21,熱連接到散熱部40的另一個端部23上形成有彎曲部25。因此,第2散熱管21任一者從平面觀看都形成L字狀。又,右側的一根第2散熱管21的彎曲部25向右方向彎曲,相對地,左側的一根第2散熱管21的彎曲部25向左方向彎曲。也就是說,位於左側的第2散熱管21與位於右側的第2散熱管21,彎曲部25的彎曲方向相反。另外,第1散熱管11的橫向徑長比第2散熱管21小,因此比第2散熱管21更容易進行彎曲等的加工。因此,能夠因應需要,將第1散熱管11的彎曲部15的曲率半徑加工成比第2散熱管21的彎曲部25的曲率半徑小。根據上述內容,散熱器1中,能夠對散熱部40全體均勻地輸送熱,提昇散熱效率。
With regard to the second
第1散熱管11及第2散熱管21任一者藉由彎曲部15、25,形成另一個端部13、23沿著散熱部40的縱向平行延伸的態樣。散熱部40中,散熱片41並排配置,且散熱片41的主面(平面部)配置成略平行於第1散熱管11及第2散熱管21的一個端部12、22的延伸方向。散熱片41是薄平板狀的構件。散熱器1中,平行於散熱部40的縱向延伸的第1散熱管11的另一個端部、第2散熱管21的另一個端部23任一者都到達散熱部40的縱向的端部。
Either one of the first
如第1圖所示,散熱部40的外觀形狀是略立方體。散熱部40是外觀形狀為略立方體的第1散熱片群42及鄰接於第1散熱片群42且外觀形狀為略立方體的第2散熱片群43所積層的構造。第1散熱片群42和第2散熱片群43都是安裝於平板狀的支持體45上的複數的散熱片41沿著散熱部40的縱向平行排列的構造。
As shown in FIG. 1 , the external shape of the
第1散熱片群42及第2散熱片群43之間會插入第1散熱管11的另一個端部13以及第2散熱管21的另一個端部23。第1散熱片群42及第2散熱片群43之間,配置有其他的端部13、23,因此散熱部40與第1散熱管11及第2散熱管21熱連接。The
第1散熱管11及第2散熱管21所使用的容器的材質並沒有特別限定,例如銅、銅合金、鋁、鋁合金、不鏽鋼等。又,封入上述容器內的動作流體,能夠因應於與容器的材料的合適性而適當地選擇。例如水、碳氟化合物、環戊烷、乙二醇以及它們的混合物等。The material of the container used for the first
又,收容於容器的毛細構造體並沒有特別限定,例如能夠舉出銅、銅合金等金屬粉末燒結體,銅、銅合金等金屬線組成的網、銅、銅合金等的金屬編織物、樹脂成分組成的不織布、形成於容器內面的細溝(凹槽)等。又,散熱片41的材質並沒有特別限定,例如能夠舉出銅、銅合金等的金屬。Also, the capillary structure housed in the container is not particularly limited, and examples thereof include sintered bodies of metal powder such as copper and copper alloys, meshes composed of metal wires such as copper and copper alloys, metal braids such as copper and copper alloys, and resins. Non-woven fabrics composed of components, fine grooves (grooves) formed on the inner surface of containers, etc. Moreover, the material of the
接著,說明第1實施型態的散熱器1的使用方法例。如第3圖所示,設置散熱器1的散熱管群,使得發熱體封裝100的受熱板側平面之中做為熱點的發熱體101的正上以及其附近配置了第2散熱管21。第3圖中,發熱體101位於發熱體封裝100在側面觀看下的中央部。對應於此,第2散熱管群21配置於散熱管群的側面觀看下的中央,第1散熱管11配置於散熱管群的側面觀看下的兩端部。因此,第1散熱管11比較起第2散熱管21會位於距離熱點比較遠的部位。Next, an example of how to use the
發熱體封裝100的所發出的熱會傳達到受熱板30。往受熱板30傳達的熱會從受熱板30傳達到第1散熱管11的一個端部12及第2散熱管21的一個端部22。傳達到第1散熱管11的一個端部12的熱會透過第1散熱管11的熱輸送作用,從第1散熱管11的一個端部12往第1散熱管11的另一個端部13輸送。又,傳達到第2散熱管21的一個端部22的熱會透過第2散熱管21的熱輸送作用,從第2散熱管21的一個端部22往第2散熱管21的另一個端部23輸送。傳達到第1散熱管11的另一個端部13的熱以及傳達到第2散熱管21的另一個端部23的熱,會傳達到具有複數的散熱片41的散熱部40。傳達到散熱部40的熱會從散熱部40放出到外部環境,藉此能夠冷卻收納於發熱體封裝100內的發熱體101。
The heat emitted by the
此時,比第1散熱管11熱輸送能力大的第2散熱管21配置在發熱體封裝100當中的熱點,也就是發熱體101的正上方或其附近,因此藉由第2散熱管21的大的熱輸送能力,能夠對發熱體封裝100的熱點發揮優秀的冷卻性能。因此,即使發熱體封裝100產生了熱點,也能夠對發熱體封裝全體發揮出優秀的冷卻性能。又,第1散熱管11也會熱連接到發熱體封裝100,因此能夠對散熱管群的熱輸送有所幫助。因此,藉由第1散熱管11的熱輸送能力,能夠減低第2散熱管的負荷,對於發熱體封裝100當中的熱點周緣發揮出冷卻性能。結果,散熱器1能夠對發熱體封裝100全體發揮出優秀的冷卻性能。
At this time, the
又,散熱器1中,散熱管群的一個端部會沿著發熱體封裝100的延伸方向並排配置,因此能夠確實且簡單地將第2散熱管21熱連接到發熱體封裝100的熱點的領域。
Also, in the
受熱板30也具有使並排配置的散熱管群的熱負荷均一化的均熱板的功能,藉由配置熱輸送能力大的第2散熱管21於熱點,不需要像習知技術一樣那麼重視做為均熱板的作用,結果能夠使受熱板30薄片化。因此,能夠努力將散熱器1的輕量化及小型化。
The
接著,使用圖式說明本發明的第2實施型態例的散熱器。關於第2實施型態例的散熱器,與第1實施型態例的散熱器相同的構成要素會使用相同的符號來說明。 Next, a heat sink according to a second embodiment of the present invention will be described using the drawings. Regarding the radiator of the second embodiment, the same components as those of the radiator of the first embodiment will be described using the same symbols.
如上所述,第1實施型態例的散熱器1中,複數的第1散熱管11及複數的第2散熱管21在側面觀看下並排配置,中央配置了第2散熱管21,兩端配置了第1散熱管11。取而代之,如第4圖所示,第2實施型態例的散熱器2中,第2散熱管21任一者在側面觀看下配置於一個緣部側,第1散熱管11任一者在側面觀看下配置於另一個緣部側。As described above, in the
第4圖中,發熱體101在側面觀看下偏向封裝102的一個緣部側(第4圖中左半部側)配置,發熱體封裝100的熱點偏向一個緣部側形成。對應於此,散熱器2中,比第1散熱管11的熱輸送能力更大的第2散熱管21任一者都並排配置於一個緣部側(第4圖中的左半部側),第1散熱管11任一者都並排配置於另一個緣部側(第4圖中的右半部側)。即使是散熱器2,比第1散熱管11的熱輸送能力更大的第2散熱管21配置在發熱體封裝100當中的熱點,也就是發熱體101的正上方及其附近,因此能夠藉由第2散熱管21的較大的熱輸送能力,對發熱體封裝100的熱點發揮優秀的冷卻性能。In FIG. 4 , the
根據上述內容,散熱器2中,即使發熱體封裝100的熱點不形成於中央部而是偏向緣部形成,也能夠對發熱體封裝100的熱點發揮出優秀的冷卻性能,結果能夠對發熱體封裝100全體發揮出優秀的冷卻性能。According to the above, in the
接著,使用圖式說明本發明的第3實施型態例的散熱器。關於第3實施型態例的散熱器,與第1、第2實施型態例的散熱器相同的構成要素會使用相同的符號來說明。Next, a heat sink according to a third embodiment of the present invention will be described using the drawings. Regarding the radiator of the third embodiment, the same components as those of the radiators of the first and second embodiments will be described using the same symbols.
第1實施型態例的散熱器1中,複數的第1散熱管11及複數的第2散熱管21在側面觀看下並排配置,中央配置了第2散熱管21,兩端配置了第1散熱管11。取而代之,如第5圖所示,第3實施型態例的散熱器3中,第2散熱管21在側面觀看下配置於兩端,第1散熱管11配置於中央。In the
第5圖中,複數(第5圖中2個)的發熱體101被收容於封裝102,發熱體101在側面觀看下配置於封裝102的兩端。因此,發熱體封裝100的熱點以分離於兩端的狀態形成複數個(第5圖中2個)。對應於此,散熱器3中,比第1散熱管11的熱輸送能力更大的第2散熱管21配置於側面觀看下的兩端,第1散熱管11配置於側面觀看下的中央。即使是散熱器3,比第1散熱管11的熱輸送能力更大的第2散熱管21配置在發熱體封裝100當中的熱點,也就是發熱體101的正上方及其附近,因此能夠藉由第2散熱管21的較大的熱輸送能力,對發熱體封裝100的熱點發揮優秀的冷卻性能In FIG. 5 , a plurality of (two in FIG. 5 )
根據上述內容,散熱器3中,即使發熱體封裝100的熱點以分離的狀態形成複數個,也能夠對發熱體封裝100的熱點發揮出優秀的冷卻性能,結果能夠對發熱體封裝100全體發揮出優秀的冷卻性能。According to the above, in the
接著,使用圖式說明本發明的第4實施型態例的散熱器。關於第4實施型態例的散熱器,與第1~第3實施型態例的散熱器相同的構成要素會使用相同的符號來說明。Next, a heat sink according to a fourth embodiment of the present invention will be described using the drawings. Regarding the radiator of the fourth embodiment, the same components as those of the radiators of the first to third embodiments will be described using the same symbols.
第1實施型態例的散熱器1中,第1散熱管11的一個端部12與第2散熱管21的一個端部22熱連接到受熱板30。取而代之地,如第6圖(a)及(b)所示,第4實施型態例的散熱器4中,從受熱板30的一端33跨到另一端34,第1散熱管11從一個端部12延伸到另一個端部13,第2散熱管21從一個端部22延伸到另一個端部23。又,如第6圖(b)、(c)所示,第1散熱管11及第2散熱管21熱連接到受熱板30的第1面31。In the
散熱片41立設於受熱板30的第1面31上。散熱器4中,散熱片41立設於受熱板30的第1面31上的鉛直方向。散熱片41的緣部安裝於受熱板30的第1面31上。又,做為散熱部40,複數的散熱片41會從受熱板30的一端33到另一端34為止以既定的間隔並排配置。The cooling
發熱體封裝100熱連接到受熱板30的中央部35(也就是,受熱板30的一端33及另一端34以外的部位)。因此,第1散熱管11的中央部14(也就是,一個端部12與另一個端部13以外的部位)以及第2散熱管21的中央部24(也就是,一個端部22與另一個端部23以外的部位)會熱連接到發熱體封裝100,發揮蒸發部的功能。又,第1散熱管11的兩端部(也就是,一個端部12與另一個端部13)以及第2散熱管21的兩端部(也就是,一個端部22與另一個端部23)會熱連接到散熱部40,發揮凝縮部的功能。The
另外,散熱器4中,在受熱板30的中央部35,與第1散熱管11及第2散熱管21的縱向正交的方向上,第1散熱管11及第2散熱管21形成有若干的曲折,使得第1散熱管11及第2散熱管21靠向中心部。藉由上述態樣,能夠提昇散熱管群與發熱體封裝100的熱連接性。In addition, in the
即使是發熱體封裝100熱連接到第1散熱管11的中央部14及第2散熱管21的中央部24的散熱器4,藉由第2散熱管21的大的熱輸送能力,能夠對發熱體封裝100的熱點發揮優秀的冷卻性能,又,第1散熱管11也熱連接到發熱體封裝100,所以能夠對散熱管群的熱輸送有所幫助。Even the
接著,使用圖式說明本發明的其他實施型態例。與上述各實施型態例的散熱器相同的構成要素會使用相同的符號來說明。上述各實施型態例的散熱器中,藉由散熱管的橫向的尺寸不同,使第2散熱管的熱輸送能力比第1熱輸送管的熱輸送能力大。取而代之地,如第7圖(a)、(b)、(c)以及第8圖(a)、(b)、(c)所示,也可以藉由散熱管的橫向的形狀的不同,使第2散熱管的熱輸送能力比第1熱輸送管的熱輸送能力大。Next, other embodiments of the present invention will be described using the drawings. Components that are the same as those of the heat sinks in the above-mentioned embodiments are described using the same symbols. In the heat sinks of the above embodiments, the heat transfer capability of the second heat transfer pipe is greater than that of the first heat transfer pipe due to the difference in the lateral dimensions of the heat transfer pipes. Instead, as shown in Fig. 7 (a), (b), (c) and Fig. 8 (a), (b), (c), it is also possible to make The heat transfer capability of the second heat radiation pipe is greater than that of the first heat transfer pipe.
第7圖(a)、(b)、(c)中,第1散熱管11的橫向的形狀形成將圓形做扁平加工後的扁平形狀,第2散熱管21的橫向的形狀形成圓形狀。第1散熱管11中,扁平形狀當中形成有主表面的一個平坦部配置到下側(發熱體封裝100側)。散熱管的橫向的形狀形成圓形狀,藉此該形狀比起扁平形狀的散熱管更提昇熱輸送能力。In Fig. 7 (a), (b), (c), the lateral shape of the first
又,第8圖(a)、(b)、(c)中,更多的散熱管(第2散熱管21)熱連接到做為熱點的發熱體101的正上方,藉此,複數的第2散熱管21全體會提昇在發熱體101的正上方的散熱管的熱輸送能力。第8圖(a)、(b)、(c)中,第2散熱管21的橫向的形狀是扁平形狀,第1散熱管11的橫向的形狀是圓形狀。第2散熱管21中,扁平形狀當中厚度方向的面配置於下側(發熱體封裝100側)。扁平形狀當中厚度方向的面配置於發熱體封裝100側,藉此比起橫向的形狀為圓形狀的散熱管,能夠將更多的散熱管(第2散熱管21)熱連接到發熱體101的正上方。Also, in Fig. 8 (a), (b), (c), more radiating pipes (second radiating pipes 21) are thermally connected directly above the
又,做為本發明的其他的實施型態例,第1散熱管的橫向的形狀以及第2散熱管的橫向的形狀都可以是將圓形做扁平加工後的扁平形狀。In addition, as another embodiment of the present invention, both the lateral shape of the first heat radiation pipe and the lateral shape of the second heat radiation pipe may be flat shapes obtained by flattening a circle.
毛細構造體的差異,可舉出例如從金屬粉末燒結體,由金屬絲組成的網,金屬編織體,由樹脂成分組成的不織布、凹槽等當中,分別使用不同種類的毛細構造體於第1散熱管及第2散熱管。The difference in the capillary structure can be mentioned, for example, from the metal powder sintered body, the mesh composed of metal wire, the metal braid, the non-woven fabric composed of resin components, the groove, etc., using different types of capillary structures in the first Heat pipe and second heat pipe.
又,如第9圖(a)、(b)、(c)所示,關於第1散熱管11及第2散熱管21,也可以使彼此的散熱管的橫向上的毛細構造體的剖面形狀不同,藉此,第2散熱管21的熱輸送能力比第1散熱管11的熱輸送能力大。Also, as shown in Fig. 9 (a), (b), and (c), regarding the first
第9圖(a)、(b)、(c)中,第1散熱管11及第2散熱管21中,任一者都使用金屬粉末燒結體來做為毛細構造體。在第1散熱管11的內面,層狀地形成有毛細構造體51。在第2散熱管21在內面,形成有毛細構造體52,毛細構造體52具有層狀的毛細構造體以及從該層狀的毛細構造體往外突出的2個突出部53。毛細構造體52的突出部53相向配置。具有突出部53的毛細構造體52相較於不具有突出部53的毛細構造體51,液相的動作流體的回流特性高,結果,第2散熱管21的熱輸送能力變得比第1散熱管11的熱輸送能力大。另外,第9圖(a)、(b)、(c)中,第1散熱管11的橫向的形狀及第2散熱管21的橫向的形狀都是圓形,橫向的剖面積大致相同。In FIGS. 9( a ), ( b ), and ( c ), any of the first
上述第1~第3實施型態例的散熱器中,第1散熱管的另一個端部及第2散熱管的另一個端部形成有彎曲部,第1散熱管與第2散熱管在平面觀看下都形成L字形狀,但第1散熱管與第2散熱管在平面觀看下的形狀並沒有特別限定,也可以例如是略直線狀。在這個情況下,也可以並排配置散熱片,使得散熱片的主面(平面部)配置於與散熱片群的一個端部的延伸方向略正交的方向。 In the radiators of the above-mentioned first to third embodiments, the other end portion of the first heat radiation pipe and the other end portion of the second heat radiation pipe are formed with a bent portion, and the first heat radiation pipe and the second heat radiation pipe are aligned in a plane. Both are L-shaped when viewed, but the shapes of the first heat radiation pipe and the second heat radiation pipe are not particularly limited when viewed in plan, and may be, for example, approximately linear. In this case, the fins may be arranged side by side such that the principal surfaces (planar portions) of the fins are arranged in a direction substantially perpendicular to the direction in which one end of the fin group extends.
上述第1~第3實施型態例的散熱器中,第1散熱管及第2散熱管的橫向的剖面形狀是圓形,但第1散熱管及第2散熱管的橫向的剖面形狀並沒有特別限定,取而代之地,也可以不是上述的扁平形狀,而是橢圓形、四角形等的多角形、圓角長方形等。 In the radiators of the above-mentioned first to third embodiments, the lateral cross-sectional shapes of the first heat radiation pipe and the second heat radiation pipe are circular, but the lateral cross-sectional shapes of the first heat radiation pipe and the second heat radiation pipe are not circular. It is particularly limited, and instead of the above-mentioned flat shape, it may be a polygon such as an ellipse, a square, or a rectangle with rounded corners.
上述各實施型態例的散熱器中,設置了受熱板,但因為熱輸送能力大的第2散熱管配置於熱點,所以也可以因應使用狀況而不設置受熱板。又,上述各實施型態例中,散熱部是由複數的散熱片構成,但散熱手段並沒有限定,也可以例如是水冷套等。 In the radiators of the above-mentioned embodiments, a heat receiving plate is provided, but because the second radiating pipe with a large heat transfer capability is arranged at a hot spot, it is also possible to not provide a heat receiving plate according to the usage situation. In addition, in each of the above-mentioned embodiments, the heat dissipation part is composed of a plurality of heat dissipation fins, but the heat dissipation means is not limited, and may be, for example, a water cooling jacket or the like.
本發明的散熱器能夠運用於廣泛的領域,因為即使發熱量多的熱點偏向冷卻對象的一部分領域也能夠發揮優秀的冷卻性能,所以能夠運用於例如資料中心中使用的伺服器等,這種使用了高性能的電子零件的領域。The heat sink of the present invention can be used in a wide range of fields, because it can exert excellent cooling performance even if a hot spot with a lot of heat is biased toward a part of the cooling object, so it can be applied to servers used in data centers, etc., for example. The field of high-performance electronic components.
1、2、3:散熱器 1, 2, 3: Radiator
4:散熱器 4: Radiator
11:第1散熱管 11: The first heat pipe
12:一個端部 12: One end
13:另一個端部 13: The other end
14:中央部 14: Central part
15:彎曲部 15: Bending part
21:第2散熱管 21: The second cooling pipe
22:一個端部 22: One end
23:另一個端部 23: The other end
24:中央部 24: central part
25:彎曲部 25: bending part
30:受熱板 30: heating plate
31:第1面
31:
32:第2面
32:
33:一端 33: one end
34:另一端 34: the other end
35:中央部 35: central part
40:散熱部 40: cooling part
41:散熱片 41: heat sink
42:第1散熱片群 42: The first heat sink group
43:第2散熱片群 43: The second heat sink group
45:支持體 45: Support body
51、52:毛細構造體 51, 52: capillary structure
53:突出部 53: protrusion
100:發熱體封裝 100: heating element package
101:發熱體 101: heating element
102:封裝 102: Encapsulation
110:蓋構件 110: cover member
第1圖係本發明第1實施型態例的散熱器的立體圖。 第2圖係本發明第1實施型態例的散熱器的平面圖。 第3圖係本發明第1實施型態例的散熱器的一個端部的側視圖。 第4圖係本發明第2實施型態例的散熱器的一個端部的側視圖。 第5圖係本發明第3實施型態例的散熱器的一個端部的側視圖。 第6圖中(a)是本發明第4實施型態例的散熱器的平面圖,(b)是本發明第4實施型態例的散熱器的側視圖,(c)是本發明第4實施型態例的散熱器的A-A剖面圖。 第7圖中(a)、(b)、(c)都是本發明的其他實施型態例的散熱器的說明圖。 第8圖中(a)、(b)、(c)都是本發明的其他實施型態例的散熱器的說明圖。 第9圖中(a)、(b)、(c)都是本發明的其他實施型態例的散熱器的說明圖。Fig. 1 is a perspective view of a heat sink according to the first embodiment of the present invention. Fig. 2 is a plan view of a heat sink according to the first embodiment of the present invention. Fig. 3 is a side view of one end of the heat sink according to the first embodiment of the present invention. Fig. 4 is a side view of one end of a heat sink according to the second embodiment of the present invention. Fig. 5 is a side view of one end of a heat sink according to a third embodiment of the present invention. In Fig. 6, (a) is a plan view of the radiator of the fourth embodiment of the present invention, (b) is a side view of the radiator of the fourth embodiment of the present invention, and (c) is the fourth embodiment of the present invention. A-A sectional view of the heat sink of the type example. (a), (b), and (c) in Fig. 7 are explanatory diagrams of radiators according to other embodiments of the present invention. (a), (b), and (c) in Fig. 8 are explanatory diagrams of radiators according to other embodiments of the present invention. (a), (b), and (c) in Fig. 9 are explanatory diagrams of radiators according to other embodiments of the present invention.
1‧‧‧散熱器 1‧‧‧Radiator
11‧‧‧第1散熱管 11‧‧‧The first cooling pipe
12‧‧‧一個端部 12‧‧‧one end
13‧‧‧另一個端部 13‧‧‧The other end
14‧‧‧中央部 14‧‧‧Central Department
21‧‧‧第2散熱管 21‧‧‧The second cooling pipe
22‧‧‧一個端部 22‧‧‧one end
23‧‧‧另一個端部 23‧‧‧The other end
24‧‧‧中央部 24‧‧‧Central Department
40‧‧‧散熱部 40‧‧‧Heat Dissipation
41‧‧‧散熱片 41‧‧‧Heat sink
42‧‧‧第1散熱片群 42‧‧‧The first heat sink group
43‧‧‧第2散熱片群 43‧‧‧The second heat sink group
45‧‧‧支持體 45‧‧‧Support
110‧‧‧蓋構件 110‧‧‧Cover component
Claims (17)
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US (1) | US20200326131A1 (en) |
JP (1) | JPWO2019131814A1 (en) |
CN (1) | CN212673920U (en) |
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US11543188B2 (en) * | 2016-06-15 | 2023-01-03 | Delta Electronics, Inc. | Temperature plate device |
US11306974B2 (en) * | 2016-06-15 | 2022-04-19 | Delta Electronics, Inc. | Temperature plate and heat dissipation device |
JP1643634S (en) * | 2018-12-28 | 2020-10-12 | ||
CN210072299U (en) * | 2019-06-05 | 2020-02-14 | 中强光电股份有限公司 | Heat dissipation module and projection device |
JP1662414S (en) | 2019-09-12 | 2020-06-29 | ||
EP4131369A4 (en) * | 2020-03-27 | 2024-04-17 | Sony Interactive Entertainment Inc | Heat dissipation device and electronic apparatus |
CN213841858U (en) * | 2020-11-05 | 2021-07-30 | 亚浩电子五金塑胶(惠州)有限公司 | Heat pipe and heat radiation structure with same |
CN114333592B (en) * | 2021-12-31 | 2023-08-25 | 湖北长江新型显示产业创新中心有限公司 | display device |
JP7235922B1 (en) * | 2022-07-26 | 2023-03-08 | 古河電気工業株式会社 | heat sink |
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