TWI787010B - Surface-mount resistor and method for manufacturing the same - Google Patents

Abstract

A surface-mount resistor includes an insulating substrate, a first heat conduction structure, a second heat conduction structure, a first terminal electrode, a second terminal electrode, and a resistive layer. The insulating substrate has a first surface and a second surface which is opposite to the first surface, and a first side surface and a second side surface which is opposite the first side surface. The insulating substrate is provided with a first through hole and a second through hole. The first through hole and the second through hole are respectively adjacent to the first side surface and the second side surface. The first heat conduction structure and the second heat conduction structure are respectively disposed in the first through hole and the second through hole. The first terminal electrode extends on the first surface, the first side surface, and the second surface, and is connected to two opposite end surfaces of the first heat conduction structure. The second terminal electrode extends on the first surface, the second side surface, and the second surface, and is connected to two opposite end surfaces of the second heat conduction structure. The resistive layer is disposed on the first surface and covers a portion of the first terminal electrode and a portion of the second terminal electrode.

Description

Surface mount resistor and manufacturing method thereof

The present disclosure relates to a manufacturing technology of a resistor, and in particular to a surface mount resistor and a manufacturing method thereof.

As the demand for the amount of current passing through electronic devices is getting higher and higher, the demand for the power that the resistance product can load is also increasing simultaneously. The high heat generated by the large current passing through the resistor needs to be dissipated quickly to avoid the heat from affecting the characteristics and life of the resistor.

Generally speaking, high thermal conductivity materials such as metal materials are attached below the resistive layer or added on the protective layer of the resistive layer to conduct heat away through conduction and convection. Another common practice is to increase the area of the bottom electrode to expand the heat convection area to increase the heat dissipation rate.

However, in the way of attaching the heat-conducting material under the resistance layer, there is a layer of colloid between the resistance layer and the heat-conducting material, resulting in poor heat conduction effect. However, the method of disposing a heat-conducting material above the resistance layer and increasing the area of the lower electrode to increase heat convection does not significantly contribute to the heat-conducting effect. Therefore, these heat dissipation methods cannot effectively increase the load power of the resistor.

One purpose of the present disclosure is to provide a surface mount resistor and a manufacturing method thereof, in which a first heat conduction structure and a second heat conduction structure penetrating through the insulating substrate are respectively provided at corresponding first end electrodes and second end electrodes of the insulating substrate . Since the first heat conduction structure can conduct the first terminal electrode on the opposite first surface and the second surface of the insulating substrate, the second heat conduction structure can conduct the second terminal electrode on the opposite first surface and the second surface of the insulating substrate. Therefore, the heat generated by the resistance layer on the first surface can be quickly conducted to the part of the first terminal electrode and the second terminal electrode on the second surface. In this way, not only the heat conduction speed of the surface mount resistor can be accelerated, but also the heat conduction area can be increased, thereby achieving the effect of increasing the load of the surface mount resistor.

According to the above purpose of the present disclosure, a surface mount resistor is proposed. The surface mount resistor includes an insulating substrate, at least one first heat conduction structure, at least one second heat conduction structure, a first terminal electrode, a second terminal electrode, and a resistance layer. The insulating substrate has a first surface and a second surface opposite to each other, and a first side and a second side opposite to each other and joined between the first surface and the second surface. The insulating substrate is provided with at least one first through hole and at least one second through hole extending from the first surface to the second surface. The at least one first through hole is adjacent to the first side, and the at least one second through hole is adjacent to the second side. The aforementioned at least one first heat conduction structure is disposed in the at least one first through hole. The aforementioned at least one second heat conduction structure is disposed in the at least one second through hole. The first terminal electrode extends on the first surface, the first side, and the second surface, and is connected with the The two opposite end surfaces of the aforementioned at least one first heat conduction structure are bonded. The second terminal electrode extends on the first surface, the second side surface, and the second surface, and is joined with two opposite end surfaces of the aforementioned at least one second heat conduction structure. The first terminal electrode is separated from the second terminal electrode. The resistance layer is arranged on the first surface and covers part of the first terminal electrode and part of the second terminal electrode.

According to an embodiment of the present disclosure, the material of the at least one first heat conduction structure is the same as that of the first terminal electrode, and the material of the at least one second heat conduction structure is the same as that of the second terminal electrode.

According to an embodiment of the present disclosure, the material of the at least one first heat conduction structure is different from that of the first terminal electrode, and the material of at least one second heat conduction structure is different from that of the second terminal electrode.

According to an embodiment of the present disclosure, the materials of the at least one first heat conduction structure and the at least one second heat conduction structure include nickel, tin, copper, or any combination thereof.

According to an embodiment of the present disclosure, the quantity of the at least one first heat conduction structure is different from the quantity of the at least one second heat conduction structure.

According to the above purpose of the present disclosure, a method for manufacturing a surface mount resistor is proposed. In the method, at least one first through hole and at least one second through hole are formed in the insulating substrate. The insulating substrate has a first surface and a second surface opposite to each other, and a first side and a second side opposite to each other and joined between the first surface and the second surface. The at least one first through hole and the at least one second through hole extend from the first surface to the second surface. The aforementioned at least one first through hole is adjacent to the first side, and at least one second through hole is adjacent to the second side. forming at least one first heat conduction structure on the aforementioned at least one in the first through hole. At least one second heat conduction structure is formed in the at least one second through hole. The first terminal electrode is formed to extend on the first surface, the first side surface, and the second surface, and is joined to two opposite end surfaces of the aforementioned at least one first heat conduction structure. The second terminal electrode is formed to extend on the first surface, the second side surface, and the second surface, and is connected to two opposite end surfaces of the aforementioned at least one second heat conduction structure. The first terminal electrode is separated from the second terminal electrode. A resistance layer is formed on the first surface. The resistance layer covers part of the first terminal electrode and part of the second terminal electrode.

According to an embodiment of the present disclosure, the formation of the at least one first heat conduction structure, the formation of the at least one second heat conduction structure, the formation of the first terminal electrode, and the formation of the second terminal electrode use the same deposition process.

According to an embodiment of the present disclosure, the formation of the at least one first heat conduction structure and the formation of the at least one second heat conduction structure utilize a first deposition process, and the formation of the first terminal electrode and the formation of the two terminal electrodes utilize a second deposition process .

According to an embodiment of the present disclosure, forming the at least one first through hole and the at least one second through hole includes using laser drilling technology or drilling technology.

According to an embodiment of the present disclosure, the at least one first through hole and the at least one second through hole have different numbers.

100: surface mount resistor

110: insulating substrate

110a: first surface

110b: second surface

110c: first side

110d: second side

112: The first through hole

114: Second through hole

120: The first heat conduction structure

120a: end face

120b: end face

130: the second heat conduction structure

130a: end face

130b: end face

140: first terminal electrode

150: the second terminal electrode

160: resistance layer

170: protective layer

In order to allow the above and other objects, features, advantages and embodiments of this disclosure to It is more obvious and easy to understand, and the description of the accompanying drawings is as follows: [Fig. 1] is a schematic perspective view of a surface mount resistor according to an embodiment of the present disclosure; [Fig. A schematic cross-sectional view of a surface mount resistor according to an embodiment; [ FIG. 3 ] is a schematic perspective view of an insulating substrate according to an embodiment of the present disclosure; and [ FIG. 4A ] to [ FIG. 4D ] are diagrams illustrating A schematic cross-sectional view of various intermediate stages of a method for manufacturing a surface mount resistor according to an embodiment disclosed.

Embodiments of the present disclosure are discussed in detail below. It should be appreciated, however, that the embodiments provide many applicable concepts that can be implemented in a wide variety of specific contexts. The embodiments discussed and disclosed are for illustration only and are not intended to limit the scope of the disclosure. All the embodiments of the present disclosure disclose various features, but these features can be implemented individually or in combination as required.

In addition, "first", "second", . . . etc. used herein do not specifically refer to a sequence or sequence, but are only used to distinguish elements or operations described with the same technical terms.

The spatial relationship between the two elements described in this disclosure is not only applicable to the orientation shown in the drawing, but also applicable to the orientation not shown in the drawing, such as the inverted orientation. In addition, the "connection", "electrical connection" or similar terms of two components mentioned in this disclosure are not limited to the fact that the two components are directly connected. Connection or electrical connection may also include indirect connection or electrical connection as required.

Please refer to FIG. 1 and FIG. 2 , which are respectively a schematic perspective view and a schematic cross-sectional view of a surface mount resistor according to an embodiment of the present disclosure. In some examples, the surface mount resistor 100 mainly includes an insulating substrate 110 , at least one first heat conduction structure 120 , at least one second heat conduction structure 130 , a first end electrode 140 , a second end electrode 150 , and a resistance layer 160 .

The insulating substrate 110 may be, for example, a quadrilateral structure. The insulating substrate 110 has a first surface 110a and a second surface 110b opposite to each other, and a first side 110c and a second side 110d opposite to each other. The first side 110c and the second side 110d are joined between the first surface 110a and the second surface 110b. That is, the first side 110c connects one side of the first surface 110a and one side of the second surface 110b, and the second side 110d connects another opposite side of the first surface 110a and another opposite side of the second surface 110b. For example, the first surface 110 a of the insulating substrate 110 may be the upper surface of the insulating substrate 110 , and the second surface 110 b may be the lower surface of the insulating substrate 110 .

The insulating substrate 110 has at least one first through hole 112 and at least one second through hole 114 . The first through hole 112 is adjacent to the first side 110c of the insulating substrate 110, and the second through hole 114 is adjacent to the second side 110d. Therefore, the first through hole 112 and the second through hole 114 are respectively disposed in two opposite edge regions of the insulating substrate 110 . Both the first through hole 112 and the second through hole 114 extend from the first surface 110 a to the second surface 110 b of the insulating substrate 110 , and penetrate through the insulating substrate 110 . The insulating substrate 110 may be aluminum oxide (Al ₂ O ₃ ) or aluminum nitride (AlN). In an exemplary example, the insulating substrate 110 is an alumina ceramic substrate.

As shown in FIG. 2 , at least one first heat conduction structure 120 is correspondingly embedded in at least one first through hole 112 . That is to say, the number of the first heat conduction structures 120 is the same as the number of the first through holes 112 , and the size and shape of the first heat conduction structures 120 are substantially the same as those of the corresponding first through holes 112 . According to product requirements, there may be one or more first heat conducting structures 120 . In an example where multiple first heat conduction structures 120 are provided, the shapes of these first heat conduction structures 120 may be the same as each other, or may be different from each other, or may be partly the same and partly different. In addition, in an example where the shapes of the first heat conducting structures 120 are the same, the sizes of the first heat conducting structures 120 may be the same or different from each other, or may be partly the same and partly different. The materials of the first heat conducting structures 120 may be the same or different from each other, or may be partly the same and partly different. The material of the first heat conducting structure 120 may include nickel, tin, copper, or any combination of the above materials, for example.

Similarly, at least one second heat conduction structure 130 is correspondingly embedded in at least one second through hole 114 . Therefore, the number of the second heat conducting structures 130 is the same as the number of the second through holes 114 , and the size and shape of the second heat conducting structures 130 are substantially the same as those of the corresponding second through holes 114 . Also, one or more second heat conduction structures 130 can be provided according to product requirements. In an example where a plurality of second heat conduction structures 130 are provided, the shapes of the second heat conduction structures 130 may be identical to each other, different from each other, or partially identical and partially different. The shapes of these second heat conducting structures 130 are similar to In different examples, the sizes of the second heat conducting structures 130 may be the same, different, or partly the same and partly different. The materials of the second heat conducting structures 130 may be the same, different, or partly the same and partly different. The material of the second heat conducting structure 130 may include nickel, tin, copper, or any combination of the above materials, for example.

In some examples, the number of the first heat conduction structures 120 is the same as the number of the second heat conduction structures 130 . In some other examples, the number of the first heat conduction structures 120 is different from the number of the second heat conduction structures 130 . In addition, the material of the first heat conduction structure 120 and the material of the second heat conduction structure 130 may be the same, or different from each other, or partly the same and partly different. The first heat conduction structure 120 may have the same shape as the second heat conduction structure 130, or a different shape.

The first terminal electrode 140 extends from a part of the first surface 110a of the insulating substrate 110 to a part of the second surface 110b through the first side surface 110c, thereby forming an inverted C-like structure. That is, the first terminal electrode 140 extends and covers a portion of the first surface 110 a , the first side surface 110 c , and a portion of the second surface 110 b of the insulating substrate 110 . In addition, the first terminal electrode 140 covers all of the first heat conduction structure 120 , and is bonded to the two end surfaces 120 a and 120 b of the first heat conduction structure 120 on the first surface 110 a and the second surface 110 b. In other words, the first heat conducting structure 120 is disposed in the area where the first terminal electrode 140 is to be disposed. The material of the first terminal electrode 140 can be the same as or different from that of the first heat conducting structure 120 .

The second terminal electrode 150 extends from another part of the first surface 110a of the insulating substrate 110 to another part of the second surface 110b through the second side surface 110d, thereby forming a C-like structure. Therefore, the second The terminal electrode 150 extends to cover another part of the first surface 110 a , the second side surface 110 d , and another part of the second surface 110 b of the insulating substrate 110 . In addition, the second terminal electrode 150 covers all of the second heat conduction structure 130 , and is bonded to the two end surfaces 130 a and 130 b of the second heat conduction structure 130 on the first surface 110 a and the second surface 110 b. That is, the second heat conducting structure 130 is disposed in the area where the second terminal electrode 150 is to be disposed. In addition, the first terminal electrode 140 is separated from the second terminal electrode 150 and is not in direct contact with each other. The material of the second terminal electrode 150 can be the same as or different from that of the second heat conducting structure 130 .

Referring to FIG. 2 again, the resistance layer 160 is disposed on the first surface 110 a of the insulating substrate 110 and covers a part of the first terminal electrode 140 and a part of the second terminal electrode 150 on the first surface 110 a. In other words, the resistance layer 160 extends from the first terminal electrode 140 through the first surface 110 a between the first terminal electrode 140 and the second terminal electrode 150 to reach the second terminal electrode 150 . The resistance layer 160 is separated from the first heat conducting structure 120 by the first terminal electrode 140 . The resistance layer 160 is separated from the second heat conducting structure 130 by the second terminal electrode 150 .

In some examples, the surface mount resistor 100 may optionally include a protective layer 170 . The protective layer 170 covers the resistive layer 160 to protect the resistive layer 160 . The material of the protective layer 170 can be moisture-resistant, solder-resistant, and highly thermally conductive.

By setting the first heat-conducting structure 120 and the second heat-conducting structure 130 through the insulating substrate 110 in the area where the first terminal electrode 140 and the second terminal electrode 150 are arranged on the insulating substrate 110, the first heat-conducting structure 120 is communicated. Located at the first end of the first surface 110a and the second surface 110b The electrode 140, and the second terminal electrode 150 connecting the second heat conducting structure 130 on the first surface 110a and the second surface 110b. The heat generated by the resistance layer 160 can pass through the first terminal electrode 140 and the second terminal electrode 150 on the first surface 110a, and then pass through the first heat conduction structure 120 and the second heat conduction structure 130 respectively, and then conduct to the second surface. Parts of the first terminal electrode 140 and the second terminal electrode 150 on 110b are quickly conducted to the outside. Therefore, not only the heat conduction speed of the surface mount resistor 100 can be increased, but also the heat conduction area can be increased, thereby increasing the load of the surface mount resistor 100 .

Please refer to FIG. 3 and FIG. 4A to FIG. 4D , wherein FIG. 3 is a schematic perspective view of an insulating substrate according to an embodiment of the present disclosure, and FIG. 4A to FIG. 4D are schematic views of a surface according to an embodiment of the present disclosure. Schematic cross-sectional views of various intermediate stages in the manufacturing process of adhesive resistors. When manufacturing the surface mount resistor 100 as shown in FIG. 4D , an insulating substrate 110 may be provided first, and at least one first through hole 112 and at least one second through hole 114 are formed in the insulating substrate 110 . In the example shown in FIG. 3 , the insulating substrate 110 is provided with four first through holes 112 and four second through holes 114 . In some examples, the first through hole 112 and the second through hole 114 can be formed in the insulating substrate 110 by using laser drilling technology or drilling technology. As shown in FIG. 4A , both the first through hole 112 and the second through hole 114 extend from the first surface 110 a to the second surface 110 b of the insulating substrate 110 to penetrate through the insulating substrate 110 . The first through hole 112 is adjacent to the first side 110c of the insulating substrate 110, and the second through hole 114 is adjacent to the second side 110d. The number of the first through hole 112 and the number of the second through hole 114 can be the same, also can be opposite to each other This is different. The structure and material properties of the insulating substrate 110 have been described above, and will not be repeated here.

Next, as shown in FIG. 4B , according to the number of the first through holes 112 , a corresponding number of first heat conducting structures 120 can be formed. The first heat conducting structures 120 are correspondingly disposed in the first through holes 112 . The first heat conduction structure 120 can be formed in the first through hole 112 by means of deposition. For example, the first heat conducting structure 120 can be formed by sputtering deposition. The shape and material properties of the first heat conducting structure 120 have been described above, and will not be repeated here.

Similarly, the same number of second heat conducting structures 130 as the number of second through holes 114 can be formed. The second heat conducting structures 130 are correspondingly disposed in the second through holes 114 . The second heat conduction structure 130 can be formed in the second through hole 114 by a deposition method, such as a sputtering deposition method.

The fabrication order of the first heat conduction structure 120 and the second heat conduction structure 130 can be adjusted according to requirements, or can be fabricated at the same time. The shape and material properties of the second heat conduction structure 130 , as well as the design changes in quantity, material, and shape of the first heat conduction structure 120 have been described above, and will not be repeated here.

The first terminal electrode 140 may be formed by deposition, wherein the first terminal electrode 140 extends on a portion of the first surface 110 a , the first side surface 110 c , and a portion of the second surface 110 b of the insulating substrate 110 . In some examples, the first terminal electrode 140 is formed by sputtering deposition. The first terminal electrode 140 covers all the first heat conduction structures 120 , and is connected to the opposite two end surfaces 120 a and 120 b of each first heat conduction structure 120 .

The second terminal electrode 150 can also be formed by deposition, wherein the second terminal electrode 150 extends on the first surface 110a of the insulating substrate 110 The other part, the second side 110d, and the other part of the second surface 110b. For example, the second terminal electrode 150 can be fabricated by sputtering deposition. The second terminal electrode 150 covers all the second heat conduction structures 130 , and is connected to the two opposite end surfaces 130 a and 130 b of each second heat conduction structure 130 . In addition, the first terminal electrode 140 is separated from the second terminal electrode 150 .

The fabrication sequence of the first terminal electrode 140 and the second terminal electrode 150 can be adjusted according to requirements, or can be fabricated simultaneously. The shape and material properties of the second terminal electrode 150 , as well as the design variation of the material of the first terminal electrode 140 have been described above, and will not be repeated here.

In some examples, the first heat conduction structure 120 , the second heat conduction structure 130 , the first terminal electrode 140 , and the second terminal electrode 150 can be fabricated individually. In other examples, the same deposition process is used to form the first heat conduction structure 120 , form the second heat conduction structure 130 , form the first terminal electrode 140 , and form the second terminal electrode 150 . In still some examples, the formation of the first heat conduction structure 120 and the formation of the second heat conduction structure 130 utilize a first deposition process, and the formation of the first terminal electrode 140 and the formation of the second terminal electrode 150 utilize a second deposition process. In still some examples, the first heat conduction structure 120 and the first terminal electrode 140 are fabricated by a first deposition process, and the second heat conduction structure 130 and the second terminal electrode 150 are fabricated by a second deposition process.

As shown in FIG. 4C , after the fabrication of the first terminal electrode 140 and the second terminal electrode 150 is completed, a resistive layer 160 can be formed on the first surface 110 a of the insulating substrate 110 by deposition. The resistive layer 160 covers a part of the first terminal electrode 140 and a part of the second terminal electrode 150 located on the first surface 110a, and the first terminal electrode 140 and the second terminal electrode 150 on the first surface 110a between them. Since the first heat conduction structure 120 and the second heat conduction structure 130 have been respectively covered by the first end electrode 140 and the second end electrode 150 before the resistance layer 160 is fabricated, the resistance layer 160 and the first heat conduction structure 120 and the second heat conduction structure 130 entities separate.

As shown in FIG. 4D , in some examples, after the resistive layer 160 is completed, a protective layer 170 may be selectively formed to cover the resistive layer 160 to protect the resistive layer 160 . In some exemplary examples, the protective layer 170 can completely cover the resistive layer 160 .

It can be seen from the above-mentioned embodiments that one of the advantages of the present disclosure is that the surface mount resistor and the manufacturing method thereof of the present disclosure are respectively provided with the first terminal electrode and the second terminal electrode of the insulating substrate to penetrate the insulating substrate. A heat conduction structure and a second heat conduction structure. Since the first heat conduction structure can conduct the first terminal electrode on the opposite first surface and the second surface of the insulating substrate, the second heat conduction structure can conduct the second terminal electrode on the opposite first surface and the second surface of the insulating substrate. Therefore, the heat generated by the resistance layer on the first surface can be quickly conducted to the part of the first terminal electrode and the second terminal electrode on the second surface. Therefore, not only the heat conduction speed of the surface mount resistor can be accelerated, but also the heat conduction area can be increased, thereby achieving the effect of increasing the load of the surface mount resistor.

Although the present disclosure has been disclosed above with embodiments, it is not intended to limit the present disclosure. Any person with ordinary knowledge in this technical field may make various modifications and modifications without departing from the spirit and scope of the present disclosure. Therefore, the scope of protection of this disclosure should be defined by the scope of the appended patent application.

100: surface mount resistor

110: insulating substrate

110a: first surface

110b: second surface

110c: first side

110d: second side

112: The first through hole

114: Second through hole

120: The first heat conduction structure

120a: end face

120b: end face

130: the second heat conduction structure

130a: end face

130b: end face

140: first terminal electrode

150: the second terminal electrode

160: resistance layer

170: protective layer

Claims (10)

A surface mount resistor, comprising: an insulating substrate having a first surface and a second surface opposite to each other, and a first side surface and a first side opposite to each other and joined between the first surface and the second surface A second side, wherein the insulating substrate is provided with at least one first through hole and at least one second through hole extending from the first surface to the second surface, the at least one first through hole is adjacent to the first side, the At least one second through hole is adjacent to the second side; at least one first heat conduction structure is arranged in the at least one first through hole; at least one second heat conduction structure is arranged in the at least one second through hole; a first A terminal electrode continuously extends on the first surface, the first side surface, and the second surface, and is joined to two opposite end surfaces of the at least one first heat conduction structure, wherein the first terminal electrode and the first The surface, the first side, and the second surface are in contact; a second terminal electrode continuously extends on the first surface, the second side, and the second surface, and is in contact with the at least one second heat-conducting structure The opposite end surfaces of the two end surfaces are joined, wherein the second end electrode is in contact with the first surface, the second side surface, and the second surface, and the first end electrode is separated from the second end electrode; and a resistive layer is provided. on the first surface and cover part of the first terminal electrode and part of the second terminal electrode. The surface mount resistor as claimed in claim 1, wherein the material of the at least one first heat conduction structure is the same as the material of the first terminal electrode, And the material of the at least one second heat conducting structure is the same as that of the second terminal electrode. The surface mount resistor as claimed in claim 1, wherein the material of the at least one first heat conduction structure is different from the material of the first terminal electrode, and the material of the at least one second heat conduction structure is different from that of the second terminal electrode The materials are different. The surface mount resistor according to claim 1, wherein the material of the at least one first heat conduction structure and the at least one second heat conduction structure comprises nickel, tin, copper, or any combination thereof. The surface mount resistor as claimed in claim 1, wherein the quantity of the at least one first heat conduction structure is different from the quantity of the at least one second heat conduction structure. A method of manufacturing a surface mount resistor, comprising: forming at least one first through hole and at least one second through hole in an insulating substrate, wherein the insulating substrate has a first surface and a second surface opposite to each other, and a first side and a second side opposite to each other and joined between the first surface and the second surface, and the at least one first through hole and the at least one second through hole extend from the first surface To the second surface, the at least one first through hole is adjacent to the first side, and the at least one second through hole is adjacent to the second side; Forming at least one first heat conduction structure in the at least one first through hole; forming at least one second heat conduction structure in the at least one second through hole; forming a first terminal electrode continuously extending on the first surface, the the first side surface is joined to the second surface and to the opposite end surfaces of the at least one first heat conduction structure, wherein the first terminal electrode is in contact with the first surface, the first side surface, and the second surface; A second terminal electrode is formed to continuously extend on the first surface, the second side surface, and the second surface, and is joined to two opposite end surfaces of the at least one second heat conduction structure, wherein the second terminal electrode is connected to the second surface. The first surface, the second side, and the second surface are in contact, and the first terminal electrode is separated from the second terminal electrode; and forming a resistive layer on the first surface, wherein the resistive layer covers part of the The first end electrode and part of the second end electrode. The method of manufacturing a surface mount resistor as described in Claim 6, wherein forming the at least one first heat conduction structure, forming the at least one second heat conduction structure, forming the first terminal electrode, and forming the second terminal electrode are a system using the same deposition process. The method for manufacturing a surface-mount resistor as described in Claim 6, wherein forming the at least one first heat conduction structure and forming the at least one second heat conduction structure utilizes a first deposition process to form the first terminal electrode and the at least one second heat conduction structure. A second deposition process is used to form the second terminal electrode. The method of manufacturing a surface mount resistor according to claim 6, wherein forming the at least one first through hole and the at least one second through hole includes using a laser drilling technique or a drilling technique. The method of manufacturing a surface mount resistor according to claim 6, wherein the at least one first through hole and the at least one second through hole have different numbers.

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