TWI786794B - Resin sealing device - Google Patents
Resin sealing device Download PDFInfo
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- TWI786794B TWI786794B TW110132247A TW110132247A TWI786794B TW I786794 B TWI786794 B TW I786794B TW 110132247 A TW110132247 A TW 110132247A TW 110132247 A TW110132247 A TW 110132247A TW I786794 B TWI786794 B TW I786794B
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- 239000011347 resin Substances 0.000 title claims abstract description 59
- 229920005989 resin Polymers 0.000 title claims abstract description 59
- 238000007789 sealing Methods 0.000 title claims abstract description 47
- 230000007246 mechanism Effects 0.000 claims abstract description 85
- 238000004519 manufacturing process Methods 0.000 abstract description 17
- 238000010586 diagram Methods 0.000 description 18
- 230000003028 elevating effect Effects 0.000 description 17
- 238000000465 moulding Methods 0.000 description 16
- 239000000758 substrate Substances 0.000 description 5
- 239000000523 sample Substances 0.000 description 4
- 230000032258 transport Effects 0.000 description 4
- 230000001965 increasing effect Effects 0.000 description 3
- 230000008859 change Effects 0.000 description 2
- 238000000748 compression moulding Methods 0.000 description 2
- 230000004907 flux Effects 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 235000014443 Pyrus communis Nutrition 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000001721 transfer moulding Methods 0.000 description 1
- 230000007723 transport mechanism Effects 0.000 description 1
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/02—Transfer moulding, i.e. transferring the required volume of moulding material by a plunger from a "shot" cavity into a mould cavity
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
Abstract
本發明提供一種樹脂密封裝置,所述樹脂密封裝置減少了將工件搬運至密封模具之前的裝載機的作業量或工件的預加熱所需的時間,從而提高了生產效率。工件搬運機構包括:第一搬運路徑,串聯配置有多個搬運部;第二搬運路徑,與第一搬運路徑平行配置且串聯配置有多個搬運部;以及搬運路徑切換機構,於第一搬運路徑與第二搬運路徑之間切換移動體進行移動的搬運路徑。 The present invention provides a resin sealing device that reduces the work load of a loader before conveying a workpiece to a sealing mold or the time required for preheating the workpiece, thereby improving production efficiency. The workpiece conveying mechanism includes: a first conveying path, a plurality of conveying parts arranged in series; a second conveying path, arranged in parallel with the first conveying path, and a plurality of conveying parts arranged in series; and a conveying path switching mechanism, arranged on the first conveying path The conveyance path on which the mobile body moves is switched between the second conveyance path.
Description
本發明是有關於一種包括能夠自工件供給部向壓製部供給工件的工件搬運機構的樹脂密封裝置。 The present invention relates to a resin sealing device including a workpiece transfer mechanism capable of supplying workpieces from a workpiece supply unit to a pressing unit.
例如對作為工件的電源基板等電源卡(power card)進行樹脂密封的樹脂密封裝置由於基板的板厚厚且為大型,因此為了進行快速的密封,需要於搬入至密封模具之前進行預加熱。裝載機手(loader hand)自工件供給部接收工件,並放置於預加熱平台,接收平板樹脂,自預加熱平台接收受到預加熱的工件並搬入至密封模具。裝載機於將成形前的工件(基板等)與平板樹脂搬入至密封模具後,經清洗並重覆同樣的作業。於利用密封模具進行樹脂密封後,藉由卸載機將成形後的工件自密封模具搬出,分離不需要的樹脂,將成形品收納於成形品收納部。裝載機及卸載機以於共用的導軌上能夠移動的方式設置,且以能夠交替地移動至壓製部所包括的密封模具的方式設置(參照專利文獻1)。 For example, a resin sealing device that resin-seals a power card such as a power supply substrate as a workpiece requires preheating before loading it into a sealing mold in order to perform rapid sealing because the substrate is thick and large. The loader hand receives the workpiece from the workpiece supply part and places it on the preheating platform to receive the flat resin, receives the preheated workpiece from the preheating platform and moves it into the sealed mold. The loader loads the unformed workpiece (substrate, etc.) and flat resin into the sealed mold, cleans it, and repeats the same operation. After the sealing mold is used for resin sealing, the molded workpiece is carried out from the sealing mold by an unloader, unnecessary resin is separated, and the molded product is stored in the molded product storage section. The loader and the unloader are provided so as to be movable on a common guide rail, and are provided so as to be alternately movable to the sealing mold included in the pressing part (see Patent Document 1).
[專利文獻1]日本專利特開2008-179025號公報 [Patent Document 1] Japanese Patent Laid-Open No. 2008-179025
所述樹脂密封裝置中,於將成形前的工件搬入至密封模具之前,包括工件的預加熱在內的裝載機的處理動作多,因此裝載機的處理能力降低,將工件搬入至密封模具之前需要時間,生產效率降低。另外,若裝載機的作業區域增加,則裝載機的移動量增加,裝置亦相應地大型化。 In the above-mentioned resin sealing device, before loading the pre-molded workpiece into the sealing mold, there are many processing operations of the loader including the preheating of the workpiece, so the processing capacity of the loader is reduced, and it is necessary to carry the workpiece into the sealing mold. time, production efficiency is reduced. In addition, if the work area of the loader increases, the amount of movement of the loader increases, and the size of the device increases accordingly.
另外,於使用熱容量大的厚工件的情況下,若不對工件進行預加熱,則密封模具的成形溫度降低,因此樹脂密封耗費時間,生產效率降低,而且若被工件奪走熱量,則成形品有可能產生孔而使成形品質降低。 In addition, in the case of using a thick workpiece with a large heat capacity, if the workpiece is not preheated, the molding temperature of the sealed mold will drop, so resin sealing will take time and production efficiency will decrease, and if the heat is taken away by the workpiece, the molded product will be damaged. Pores may be generated to degrade the molding quality.
本發明鑒於所述情況而成,目的在於提供一種樹脂密封裝置,所述樹脂密封裝置減少了將工件搬運至密封模具之前的裝載機的作業量或工件的預加熱所需的時間,從而提高了生產效率。 The present invention is made in view of the above circumstances, and an object of the present invention is to provide a resin sealing device that reduces the workload of a loader before conveying the workpiece to the sealing mold or the time required for preheating the workpiece, thereby improving the efficiency. Productivity.
為了達成所述目的,本發明包括以下結構。 In order to achieve the object, the present invention includes the following structures.
一種樹脂密封裝置,包括工件搬運機構,所述工件搬運機構使移動體在自工件供給部至壓製部配置於裝載機的移動範圍內的搬運路徑上往復移動,並能夠自所述工件供給部向所述壓製部供給工件,所述樹脂密封裝置的特徵在於,所述工件搬運機構包括:第一搬運路徑,串聯配置有多個搬運部,自所述搬運部上的移動體將工件保持於所述裝載機並搬入至所述壓製部;第二搬運路徑,與所述第一搬運路徑平行配置,串聯配置有多個搬運部且所述移動體向所述工件供給部往復移動;以及搬運路徑切換機構,於所述移 動體進行移動的所述第一搬運路徑與所述第二搬運路徑之間切換搬運路徑。 A resin sealing device comprising a workpiece conveyance mechanism capable of reciprocating a moving body on a conveyance path disposed within a moving range of a loader from a workpiece supply part to a press part, and capable of moving from the workpiece supply part to the The pressing part supplies the workpiece, and the resin sealing device is characterized in that the workpiece conveying mechanism includes: a first conveying path, a plurality of conveying parts are arranged in series, and the workpiece is held by a moving body on the conveying part. the loader and carried into the pressing part; the second conveying path is arranged in parallel with the first conveying path, a plurality of conveying parts are arranged in series, and the moving body reciprocates toward the workpiece supply part; and the conveying path switching mechanism, the shift The conveyance path is switched between the first conveyance path on which the movable body moves and the second conveyance path.
根據所述結構,於在壓製部中向第一搬運路徑上的移動體供給工件時,藉由搬運路徑切換機構將移動體的搬運路徑自第一搬運路徑切換成第二搬運路徑。藉此,移動體可於第二搬運路徑上移動至工件供給部,接收下一個成形前的工件並返回壓製部。另外,藉由利用搬運路徑切換機構將搬運路徑自第二搬運路徑切換成第一搬運路徑,可使載置有下一個成形前的工件的移動體返回第一搬運路徑並供給至裝載機。因此,可減少利用裝載機進行的成形前的工件搬運作業,從而提高生產效率。 According to the above configuration, when the work is supplied to the movable body on the first conveyance path in the press section, the conveyance path of the movable body is switched from the first conveyance path to the second conveyance path by the conveyance path switching mechanism. Thereby, the mobile body can move to the workpiece supply part on the second transport path, receive the next workpiece before forming, and return to the pressing part. In addition, by switching the conveyance path from the second conveyance path to the first conveyance path by the conveyance path switching mechanism, the moving body on which the next workpiece before forming is placed can be returned to the first conveyance path and supplied to the loader. Therefore, it is possible to reduce the work of conveying workpieces before forming by a loader, thereby improving productivity.
所述工件搬運機構可為皮帶搬運機構,所述皮帶搬運機構包括:第一皮帶搬運路徑,串聯配置有移動體在環繞的環形皮帶上移動的皮帶模組;以及第二皮帶搬運路徑,與所述第一皮帶搬運路徑平行配置,並串聯配置有多個皮帶模組,所述搬運路徑切換機構於所述第一皮帶搬運路徑與所述第二皮帶搬運路徑之間移載所述移動體。 The workpiece conveying mechanism may be a belt conveying mechanism, and the belt conveying mechanism includes: a first belt conveying path, a belt module in which a mobile body moves on a surrounding endless belt is arranged in series; The first belt conveyance path is arranged in parallel, and a plurality of belt modules are arranged in series, and the conveyance path switching mechanism transfers the mobile body between the first belt conveyance path and the second belt conveyance path.
藉此,關於移動體,只要利用搬運路徑切換機構於串聯配置有皮帶模組的第一搬運路徑與第二搬運路徑上換載移動體即可,因此可利用簡單的結構減少利用裝載機進行的成形前的工件搬運作業,從而提高生產效率。 Thereby, as for the mobile body, it is only necessary to use the conveyance path switching mechanism to change the load of the mobile body on the first conveyance path and the second conveyance path in which the belt modules are arranged in series. Therefore, the simple structure can reduce the number of loads performed by the loader. Workpiece handling before forming to improve production efficiency.
所述工件搬運機構可為串聯配置有移動體在軌道部上自動行走的線性模組的線性搬運機構,第一搬運路徑具有多個第一 軌道部拆裝自如地相互串聯連接而成的第一直動軌道,第二搬運路徑具有多個第二軌道部拆裝自如地相互串聯連接而成且與所述第一直動軌道平行配置的第二直動軌道,所述搬運路徑切換機構使與載置有所述移動體的第一軌道部平行配置的第二軌道部一起平行移動,在所述第一軌道部彼此連接的第一直動軌道與連接在第二軌道部間的第二直動軌道之間切換軌道部彼此的連接。 The workpiece conveying mechanism may be a linear conveying mechanism in which a linear module in which the mobile body automatically walks on the rail portion is arranged in series, and the first conveying path has a plurality of first The first direct moving rail is a first straight moving rail in which the rail parts are detachably connected to each other in series, and the second conveyance path has a plurality of second rail parts that are detachably connected in series to each other and are arranged in parallel to the first straight moving rail. In the second linear motion rail, the conveyance path switching mechanism moves in parallel with the second rail portion arranged in parallel with the first rail portion on which the moving body is placed, and the first straight rail portion connected to the first rail portion Between the moving track and the second linear moving track connected between the second track parts, the connection between the track parts is switched.
藉此,僅藉由對載置有移動體的第一軌道部於第一直動軌道與第二直動軌道之間切換連接,移動體可於第二直動軌道上自動行走並向工件供給部移動。因此,藉由線性搬運機構,可高速且高精度地實現移動體的移動,可減少利用裝載機進行的成形前的工件搬運作業,從而提高生產效率。 Thereby, only by switching the connection between the first direct motion rail and the second direct motion rail to the first rail portion on which the mobile body is placed, the mobile body can automatically travel on the second direct motion rail and supply the workpiece department move. Therefore, the linear transfer mechanism can move the movable body at high speed and with high precision, and can reduce the workpiece transfer work before forming by the loader, thereby improving production efficiency.
所述移動體較佳為具有線性馬達動子,所述第一軌道部及所述第二軌道部分別具有線性馬達定子,所述第一軌道部與第二軌道部相互電性及機械性地串聯連接。 The moving body preferably has a linear motor mover, the first rail portion and the second rail portion respectively have a linear motor stator, and the first rail portion and the second rail portion are electrically and mechanically connected to each other. connected in series.
藉此,省略了構成線性模組的第一軌道部及第二軌道部的配線,因此第一直動軌道及第二直動軌道的配置結構的自由度高,可減少裝載機的作業區域而形成緊湊的設計。 Thereby, the wiring of the first rail part and the second rail part constituting the linear module is omitted, so the degree of freedom in the arrangement structure of the first direct motion rail and the second direct motion rail is high, and the working area of the loader can be reduced and the resulting in a compact design.
所述搬運路徑切換機構可為於第一高度位置與第二高度位置之間進行升降的升降機構,所述第一高度位置處所述第一軌道部及所述第二軌道部相互連結,所述第二高度位置成為載置有所述移動體的所述第一軌道部與所述第二軌道部連接且第二軌道部比所述第一軌道部低的高度位置。 The conveying path switching mechanism may be a lifting mechanism that lifts between a first height position and a second height position, and the first rail portion and the second rail portion are connected to each other at the first height position, so that The second height position is a height position where the first rail portion on which the moving body is placed is connected to the second rail portion and the second rail portion is lower than the first rail portion.
藉此,可將能夠於構成線性模組的第一軌道部及第二軌道部上自動行走的移動體與利用升降機構進行的升降動作組合,使移動體在壓製部與工件供給部之間往復移動,因此可減少利用裝載機進行的工件搬運作業,從而提高生產效率,而且能夠不增加設置面積而以緊湊的裝置結構進行工件搬運作業。 In this way, the mobile body that can automatically run on the first rail portion and the second rail portion constituting the linear module can be combined with the lifting operation performed by the lifting mechanism, so that the mobile body can reciprocate between the pressing part and the workpiece supply part. Therefore, it is possible to reduce the workpiece transportation work performed by the loader, thereby improving production efficiency, and it is possible to carry out workpiece transportation work with a compact device structure without increasing the installation area.
與所述第一直動軌道所包括的第一軌道部相比,所述第二直動軌道所包括的第二軌道部可在所述工件供給部側延伸設置得更長。 The second rail portion included in the second linear motion rail may extend longer on the side of the workpiece supply portion than the first rail portion included in the first linear motion rail.
藉此,可藉由升降機構使載置有沿著第二直動軌道向工件供給部移動的移動體的第二軌道部向工件接收位置升降。 Thereby, the second rail portion on which the moving body that moves to the workpiece supply portion along the second linear motion rail is placed can be raised and lowered toward the workpiece receiving position by the elevating mechanism.
所述移動體較佳為包括工件托盤,於所述工件托盤中內置有將成形前的工件預加熱至與成形溫度相同的程度的加熱器。 The moving body preferably includes a workpiece tray in which a heater for preheating the workpiece before forming to the same level as the forming temperature is incorporated.
藉此,可減少工件的升溫時間及進行預加熱的場所來提高生產效率,且不易被工件奪走熱量而使模具溫度降低,因此可提高成形品質。 In this way, the heating time of the workpiece and the place for preheating can be reduced to improve production efficiency, and it is not easy to be taken away by the workpiece to reduce the mold temperature, so the forming quality can be improved.
所述移動體可至少於第一搬運路徑及工件接收位置處向所述加熱器通電,將載置於工件托盤的成形前的工件預加熱至與成形溫度相同的程度。 The moving body may energize the heater at least at the first conveyance path and the workpiece receiving position to preheat the pre-forming workpiece placed on the workpiece tray to a level equal to the forming temperature.
藉此,藉由於多個部位對成形前的工件進行預加熱且盡可能地防止溫度降低,從而可效率良好地對成形前的工件進行預加熱。 Thereby, preheating the workpiece before forming can be efficiently preheated by preheating the workpiece before forming at a plurality of locations and preventing temperature drop as much as possible.
所述工件供給部中可進而設置有托盤用預加熱部,所述托盤用預加熱部於接收到工件之前將所述移動體的工件托盤預加 熱至與成形溫度相同的程度。 The workpiece supply part may further be provided with a pallet preheating part, and the pallet preheating part preheats the workpiece pallet of the moving body before receiving the workpiece. Heat to the same degree as the forming temperature.
藉此,由於在移動體去接收工件的移動過程中,工件托盤的溫度容易降低,因此藉由於托盤用預加熱部對工件托盤進行預加熱,可減低工件托盤的溫度降低,減少工件的預加熱時間,從而提高生產效率。 Thus, since the temperature of the workpiece pallet tends to drop during the movement of the moving body to receive the workpiece, the preheating of the workpiece pallet by the preheating part for the pallet can reduce the temperature drop of the workpiece pallet and reduce the preheating of the workpiece. time, thereby increasing production efficiency.
可提供一種樹脂密封裝置,所述樹脂密封裝置減少了將工件搬運至密封模具之前的裝載機的作業量或工件的預加熱所需的時間,從而提高了生產效率。 It is possible to provide a resin sealing device that reduces the workload of a loader before conveying a workpiece to a sealing mold or the time required for preheating the workpiece, thereby improving production efficiency.
W:工件 W: Workpiece
A:工件供給部 A:Work supply department
B、B1、B2、B3、B4:壓製部 B, B1, B2, B3, B4: pressing department
C:成形品收納部 C: Molded product storage department
D:工件搬運機構 D: Workpiece handling mechanism
E:工件接收位置 E: Workpiece receiving position
F:托盤用預加熱部 F: Preheating part for tray
R:樹脂 R: Resin
1:線性搬運機構 1: Linear handling mechanism
1A:第一直動軌道 1A: The first direct motion track
1B:第二直動軌道 1B: The second direct track
1C:線性馬達軌道部 1C: Linear motor track part
1a、1a0、1a1、1a2、1a3、1a4:第一軌道部 1a, 1a0, 1a1, 1a2, 1a3, 1a4: first track portion
1b、1b00、1b01、1b1、1b2、1b3、1b4:第二軌道部 1b, 1b00, 1b01, 1b1, 1b2, 1b3, 1b4: Second rail part
1c、1c0、1c1、1c2、1c3、1c4:移動體 1c, 1c0, 1c1, 1c2, 1c3, 1c4: moving body
1d:加熱器 1d: Heater
1e:工件托盤 1e: Workpiece pallet
2:樹脂密封裝置 2: Resin sealing device
3、3a、3b、3c、3d:密封模具 3, 3a, 3b, 3c, 3d: sealed mold
4:裝載機 4: Loader
5:供給箱 5: supply box
6:樹脂供給部 6: Resin supply department
7:軌道部 7: Track Department
8:打澆口部 8: Sprue part
9:成形品收納箱 9: Formed product storage box
10:升降機構 10: Lifting mechanism
11:支架機構 11: Bracket mechanism
12:拾取器 12: Pickup
圖1是樹脂密封裝置的平面佈局結構圖。 Fig. 1 is a plane layout structure diagram of a resin sealing device.
圖2是表示裝載機的動作範圍的示意圖。 Fig. 2 is a schematic diagram showing the operating range of the loader.
圖3是表示利用工件搬運機構進行的工件搬運動作的示意圖。 Fig. 3 is a schematic diagram showing a workpiece conveying operation by a workpiece conveying mechanism.
圖4是表示圖1的樹脂密封裝置的樹脂密封動作的說明圖。 FIG. 4 is an explanatory diagram showing a resin sealing operation of the resin sealing device shown in FIG. 1 .
圖5是表示對壓製部B1的工件搬運動作的說明圖。 FIG. 5 is an explanatory view showing the work conveyance operation to the pressing unit B1.
圖6是緊接著圖5的對壓製部B1的工件搬運動作的說明圖。 Fig. 6 is an explanatory diagram following Fig. 5 for conveying the work to the press section B1.
圖7是緊接著圖6的對壓製部B1的工件搬運動作的說明圖。 Fig. 7 is an explanatory diagram following Fig. 6 for conveying the work to the press section B1.
圖8是緊接著圖7的對壓製部B1的工件搬運動作的說明圖。 FIG. 8 is an explanatory diagram following FIG. 7 of the workpiece conveyance operation to the pressing part B1.
圖9是緊接著圖8的對壓製部B1的工件搬運動作的說明圖。 Fig. 9 is an explanatory diagram following Fig. 8 for conveying the work to the press section B1.
圖10是緊接著圖9的對壓製部B1的工件搬運動作的說明圖。 Fig. 10 is an explanatory diagram following Fig. 9 for conveying the work to the press section B1.
圖11是緊接著圖10的對壓製部B1的工件搬運動作的說明圖。 FIG. 11 is an explanatory diagram following FIG. 10 of the workpiece conveyance operation to the pressing part B1.
圖12是緊接著圖11的對壓製部B1的工件搬運動作的說明圖。 Fig. 12 is an explanatory diagram following Fig. 11 for conveying the work to the press section B1.
圖13是緊接著圖12的對壓製部B2的工件搬運動作的說明圖。 Fig. 13 is an explanatory diagram following Fig. 12 for conveying the work to the press section B2.
圖14是緊接著圖13的對壓製部B2的工件搬運動作的說明圖。 Fig. 14 is an explanatory diagram following Fig. 13 for conveying the work to the press section B2.
圖15是緊接著圖14的對壓製部B2的工件搬運動作的說明圖。 Fig. 15 is an explanatory diagram following Fig. 14 for conveying the work to the press section B2.
圖16是緊接著圖15的對壓製部B2的工件搬運動作的說明圖。 Fig. 16 is an explanatory diagram following Fig. 15 for conveying the work to the press section B2.
圖17是緊接著圖16的對壓製部B2的工件搬運動作的說明圖。 Fig. 17 is an explanatory diagram following Fig. 16 for conveying the work to the press section B2.
圖18是緊接著圖17的對壓製部B2的工件搬運動作的說明圖。 Fig. 18 is an explanatory diagram following Fig. 17 of the work conveying operation to the pressing part B2.
首先,對本實施方式中的樹脂密封裝置進行說明。圖1是包括工件搬運機構D的樹脂密封裝置2的平面佈局結構圖。工件W是假設於板狀的載體(例如引線框架、樹脂基板、銅板、玻璃板、樹脂積層基板等)搭載有半導體晶片等電子零件者來進行說明。工件W可為長條狀,亦可有多個單片。
First, the resin sealing device in this embodiment will be described. FIG. 1 is a planar layout diagram of a
圖1中,作為一例,樹脂密封裝置2示出工件供給部A、壓製部B(B1~B4)、成形品收納部C作為能夠分離的單元橫向排布配置的結構。再者,亦可為該些單元成為一體的裝置結構。工件供給部A中包括能夠供給地收納成形前的工件W的供給箱5、供給樹脂R的樹脂供給部6。工件供給部A自收納多個工件W的供給箱5一張一張地取出工件W並供給至工件搬運機構D。另外,樹脂供給部6以與密封模具3的筒孔(pot hole)對應的排列將樹脂R保持於支架機構11,自所述支架機構11將樹脂R交接至裝載機4(參照圖2)。
In FIG. 1 , as an example, the
壓製部B(B1~B4)具有上模模腔型及下模模腔型的密封模具3(3a~3d)。本實施例中例示了並列設置四個壓製部B1~B4的情況,但亦可比其少亦可比其多。藉由裝載機4的一次進退動作將工件W及樹脂R搬入至密封模具3,並將成形後的工件W搬出。裝載機4沿著跨及工件供給部A、壓製部B、成形品收納部C而架設的軌道部7往復運動。
The press part B (B1~B4) has the sealing mold 3 (3a~3d) of an upper mold cavity type and a lower mold cavity type. In the present embodiment, the case where four pressing parts B1 to B4 are arranged in parallel was exemplified, but there may be fewer or more than that. The workpiece W and the resin R are carried into the sealed
成形品收納部C中設置有自成形後的工件W分離不需要的樹脂的打澆口(degate)部8、收納去除了不需要的樹脂的成形後的工件W(成形品)的成形品收納箱9。自密封模具3藉由裝載機4搬出的成形後的工件W被交接給拾取器12(參照圖2)並被移送至打澆口部8。於打澆口部8中切斷澆口(gate break)後的成形後的工件W被分離出不需要的樹脂,僅成形品被收納於成形品收納箱9中。
The molded product storage section C is provided with a
如圖1所示,裝載機4被設置成能夠沿著軌道部7自工件供給部A經由壓製部B往復移動至成形品收納部C。具體而言,可沿著配置於樹脂密封裝置2內的縱深側(圖1的上側)的軌道部7於左右方向上移動,並向裝置近前側(圖1的下側)進退移動。自工件供給部A供給的成形前的工件W藉由工件搬運機構D被搬運至壓製部B(B1~B4),藉由裝載機4保持工件W,並與樹脂R一起被搬入至密封模具3(3a~3d)。另外,密封模具3中,成形後的工件W由裝載機4搬出並被收納於成形品收納部C中。再者,亦可獨立於裝載機4而另行設置卸載機,藉由卸載機自壓製部B取出成形後的工件W,並搬運至成形品收納部C。
As shown in FIG. 1 , the
工件搬運機構D使移動體1c(1c0~1c4)於自工件供給部A至壓製部B(B1~B4)配置於裝載機4的移動範圍內的搬運路徑上往復移動,從而將工件W自工件供給部A供給至壓製部B。
The workpiece conveying mechanism D reciprocates the moving
工件搬運機構D包括:第一搬運路徑(後述的第一直動軌道1A),串聯配置有多個搬運部,自搬運部上的移動體1c(1c0~1c4)將工件W保持於裝載機4並搬入至壓製部B(B1~B4);第二搬運路徑(後述的第二直動軌道1B),與第一搬運路徑平行配置,串聯配置有多個搬運部,且移動體1c(1c0~1c4)向工件供給部A往復移動;以及搬運路徑切換機構(後述的升降機構10等),於移動體1c(1c0~1c4)能夠移動的第一搬運路徑與第二搬運路徑之間切換搬運路徑。
The workpiece conveying mechanism D includes: a first conveying path (a first
如圖2所示,作為工件搬運機構D,例如使用線性搬運
機構1。線性搬運機構1具有:第一直動軌道1A(第一搬運路徑),多個第一軌道部1a0~1a4拆裝自如地相互串聯連接;以及第二直動軌道1B(第二搬運路徑),多個第二軌道部1b00~1b4拆裝自如地相互串聯連接。第一直動軌道1A與第二直動軌道1B平行地配置於不同的高度。該些第一直動軌道1A與第二直動軌道1B構成線性馬達軌道部1C。線性馬達軌道部1C自工件供給部A至壓製部B(B1~B4)架設於裝載機4的移動範圍內。
As shown in Fig. 2, as the workpiece conveying mechanism D, for example, a linear conveying
移動體1c(1c0~1c4)分別具有線性馬達動子,線性馬達軌道部1C(第一軌道部1a0~第一軌道部1a4、第二軌道部1b00~第二軌道部1b4)分別具有線性馬達定子。構成第一直動軌道1A的第一軌道部1a0~第一軌道部1a4與構成第二直動軌道1B的第二軌道部1b00~第二軌道部1b4相互重組並電性及機械性地串聯連接。第一軌道部1a0~第一軌道部1a4及第二軌道部1b00~第二軌道部1b4包括未圖示的線性馬達定子(電磁鐵)、一對導軌、磁感測器等。移動體1c0~移動體1c4包括與未圖示的一對導軌相連的一對導向塊、或與線性馬達定子相向設置的線性馬達動子(永久磁鐵)、或與磁感測器相向設置的磁尺等。
The moving
由所述線性馬達動子與線性馬達定子形成線性馬達。藉由未圖示的馬達控制器,向線性馬達定子(電磁鐵的線圈)供給相位互不相同的U相、V相、W相中的任一種相的電流。藉此,於控制電磁鐵的通電時,藉由所述電磁鐵產生的磁通與相向的永久磁鐵的磁通的相互作用使移動體1c(1c0~1c4)生成推進力,藉
由所述推進力而沿著一對導軌行進。移動體1c(1c0~1c4)的停止位置藉由第一軌道部1a(1a0~1a4)、第二軌道部1b(1b00~1b4)分別包括的磁感測器檢測。藉由控制向線性馬達定子的電磁鐵的線圈的通電,移動體1c(1c0~1c4)可移動至線性馬達軌道部1C的目標位置並停止。
A linear motor is formed by the linear motor mover and the linear motor stator. A motor controller (not shown) supplies current in any one of U-phase, V-phase, and W-phase with different phases to the linear motor stator (coil of the electromagnet). Thereby, when the energization of the electromagnet is controlled, the interaction between the magnetic flux generated by the electromagnet and the magnetic flux of the opposing permanent magnet causes the moving
第一軌道部1a0~第一軌道部1a4與第二軌道部1b00~第二軌道部1b4省略了通信線及供電線等而相互連接。軌道部彼此的電連接可藉由相互的端子間連接來進行,亦可經由中繼構件進行端子間連接。如此,第一軌道部1a0~第一軌道部1a4與第二軌道部1b00~第二軌道部1b4具有省略了配線的模組結構,因此第一直動軌道1A及第二直動軌道1B的配置結構的自由度高,可減少裝載機4的作業區域而形成緊湊的設計。
The first rail portion 1a0 to the first rail portion 1a4 and the second rail portion 1b00 to the second rail portion 1b4 are connected to each other without omitting communication lines and power supply lines. The electrical connection between the rail parts may be performed by mutual terminal connection, or the terminal connection may be performed via a relay member. In this way, the first rail part 1a0~the first rail part 1a4 and the second rail part 1b00~the second rail part 1b4 have a module structure in which wiring is omitted, so the arrangement of the first
另外,移動體1c(1c0~1c4)於上表面部設置有能夠搭載工件W的不鏽鋼金屬系的工件托盤1e。工件托盤1e中內置有加熱器1d(參照圖1)。加熱器1d例如使用紅外線加熱器、夾套加熱器(sheath heater)、筒式加熱器(cartridge heater)等。藉此,可於移動體1c(1c0~1c4)與載置有其的第一軌道部1a0~第一軌道部1a4的探針彼此連接時,向加熱器1d供電,經由工件托盤1e將工件W預加熱至與成形溫度(例如170°左右)相同的程度。圖2中以梨皮狀包圍的部分表示向加熱器1d通電,經由工件托盤1e對工件W進行預加熱。因此,減少工件W的預加熱的時間來提高生產效率,不易被工件W奪走熱量而使模具溫度降低,因此可提
高成形品質。
Moreover, the
如圖4所示,關於移動體1c(1c0~1c4),至少於第一直動軌道1A(第一搬運路徑)上及工件接收位置E向加熱器1d通電,將成形前的工件W預加熱至與成形溫度(例如170°左右)相同的程度。藉此,自工件W的供給至搬入至壓製部B為止進行多次預加熱,因此可於短時間內進行工件W的預加熱。
As shown in Fig. 4, with respect to the moving
圖2中,第一直動軌道1A於裝載機4保持成形前的工件W並相對於壓製部B(B1~B4)進退移動的高度位置,架設在與工件供給部A之間。第二直動軌道1B在與第一直動軌道1A相比高度低且平行的第二高度位置架設在與工件供給部A之間。再者,第二直動軌道1B亦可平行配置於比第一直動軌道1A高的位置。
In FIG. 2 , the first moving
另外,圖2中,升降機構10(搬運路徑切換機構)使與載置有移動體1c的第一軌道部1a0~第一軌道部1a4平行配置的第二軌道部1b01~第二軌道部1b4一起平行移動,從而在第一軌道部1a0~第一軌道部1a4彼此連接的第一直動軌道1A和將第一軌道部1a0~第一軌道部1a4與第二軌道部1b00~第二軌道部1b4連接的第二直動軌道1B之間切換搬運路徑。
In addition, in FIG. 2 , the elevating mechanism 10 (conveyance path switching mechanism) makes the second rail portion 1b01 to the second rail portion 1b4 arranged in parallel with the first rail portion 1a0 to the first rail portion 1a4 on which the
具體而言,圖3中,升降機構10於第一軌道部1a0~第一軌道部1a4彼此及第二軌道部1b00~第二軌道部1b4彼此相互連結的第一高度位置、和將相互的連結解除而第一軌道部1a0~第一軌道部1a4與第二軌道部1b00~第二軌道部1b4連接的第二高
度位置之間進行升降。進而,使載置有移動體1c(1c0~1c4)的第二軌道部1b00在第二直動軌道1B的高度位置與工件接收位置E之間升降,使載置有移動體1c(1c0~1c4)的第一軌道部1a0在第二直動軌道1B的高度位置與後述的托盤用預加熱部F之間升降。升降機構10的結構可採用各種各樣的結構,亦可使上下平行配置的第一軌道部1a0~第一軌道部1a4及第二軌道部1b00~第二軌道部1b4平行地支撐於臂等或者由手等握持並藉由馬達驅動等升降。
Specifically, in FIG. 3, the
升降機構10使自下降至第二高度位置的第一軌道部1a0~第一軌道部1a4沿著第二直動軌道1B移動至工件供給部A的移動體1c(1c0~1c4)與第二軌道部1b00一起下降至工件接收位置E,並使載置有接收了成形前的工件W的移動體1c(1c0~1c4)的第二軌道部1b00上升至再次與第二直動軌道1B連接的位置。然後,使移動體1c(1c0~1c4)自動行走而移動的第一軌道部1a1~第一軌道部1a4及其正下方的第二軌道部1b1~第二軌道部1b4上升至原來的與第一直動軌道1A及第二直動軌道1B再次連接的第一高度位置。藉由重覆所述動作,使移動體1c(1c0~1c4)在壓製部B與工件供給部A之間往復移動。
The
藉此,於向第一直動軌道1A上的移動體1c0~移動體1c4供給工件W的情況下,利用升降機構10使載置有移動體1c(1c0~1c4)的第一軌道部1a0~第一軌道部1a4自第一高度位置平行移動至第二高度位置並與第二軌道部1b00~第二軌道部1b4
連接,藉此可使移動體1c0~移動體1c4在第二直動軌道1B上自動行走並移動至工件供給部A,從而供給下一個成形前的工件W。因此,可減少利用裝載機4進行的工件搬運作業,從而提高生產效率。
Thereby, when the workpiece W is supplied to the moving body 1c0 to the moving body 1c4 on the first straight-moving
如圖2所示,與第一直動軌道1A所包括的第一軌道部1a0~第一軌道部1a4相比,第二直動軌道1B所包括的第二軌道部1b00~第二軌道部1b4在工件供給部A側延伸設置得更長。具體而言,第一直動軌道1A中,自設置於壓製部B1的第一軌道部1a1在工件供給部A側延伸設置有第一軌道部1a0。第二直動軌道1B中,自設置於壓製部B1的第二軌道部1b1在工件供給部A側延伸設置有第二軌道部1b01及第二軌道部1b00。因此,第二直動軌道1B形成為較第一直動軌道1A而言在工件供給部A側長第二軌道部1b00。藉此,如圖3所示,沿著第二直動軌道1B移動至工件供給部A的移動體1c0~移動體1c4可藉由升降機構10與第二軌道部1b00一起升降至工件接收位置E(圖3例示了使移動體1c1升降的情況)。
As shown in FIG. 2 , compared with the first rail portion 1a0 to the first rail portion 1a4 included in the first
另外,於移動體1c0~移動體1c4去接收成形前的工件W的移動過程中工件托盤1e的溫度容易降低。因此,工件供給部A中進而設置有托盤用預加熱部F,所述托盤用預加熱部F於接收成形前的工件W之前將移動體1c0~移動體1c4的工件托盤1e預加熱至與成形溫度相同的程度。具體而言,圖3中,藉由利用升降機構10使第一軌道部1a0及與其平行配置的第二軌道部1b01
升降,從而於將在工件供給部A側延伸設置的第一軌道部1a0上自動行走的移動體1c1~移動體1c4與第一直動軌道1A連接的高度位置,向加熱器1d供電,將工件托盤1e預加熱至與成形溫度(例如170°左右)相同的程度。圖3中,例示了於托盤用預加熱部F配置有移動體1c0且工件托盤1e受到預加熱的狀態。
In addition, the temperature of the
藉此,藉由於托盤用預加熱部F對工件托盤1e進行預加熱,可減低工件托盤1e的溫度降低,減少工件W的預加熱時間,從而提高生產效率。再者,藉由進而包括比壓製部B1~壓製部B4的數量多的移動體1c0,可預先於工件供給部A的托盤用預加熱部F將工件托盤1e預加熱並接收成形前的工件W且使用經預加熱的移動體1c0,來迅速地供給至成形結束的任一壓製部B,因此壓製部B1~壓製部B4的運轉率提高而提高生產效率。
Thereby, by preheating the
此處,將樹脂密封裝置2的動作例與利用裝載機4進行的工件搬運動作一起示於圖4中。圖中以梨皮狀包圍的部分表示工件W經由工件托盤1e受到預加熱。裝載機4於工件供給部A中自支架機構11交接樹脂R,移動至所需的壓製部B,自移動體1c(1c0~1c4)接收預加熱至與成形溫度相同程度的成形前的工件W,並搬入至密封模具3(例如下模)。將搬入有工件W及樹脂R的密封模具3閉模,進行壓縮成形。成形後,裝載機4自開模的密封模具3(例如上模)接收成形後的工件W並搬出。裝載機4於保持有成形後的工件W的狀態下,自壓製部B向成形品收納部C進行搬運並交接給拾取器12。裝載機4重覆進行以上的動作。
再者,亦可利用裝載機4進行工件W及樹脂R的搬入,利用卸載機(未圖示)進行成形後的工件W的搬出。
Here, an example of the operation of the
接著,參照圖5~圖18說明利用線性搬運機構1進行的成形前的工件W向壓製部B(B1~B4)的搬運動作的一例。如圖2所示,關於載置於架設在壓製部B1~壓製部B4的第一直動軌道1A(第一軌道部1a1~第一軌道部1a4)的移動體1c1~移動體1c4,由於探針與加熱器配線連接且向加熱器1d通電,因此工件W經由工件托盤1e被預加熱至與成形溫度相同的程度(例如170°左右)並待機。同樣地,於設置於工件供給部A的托盤用預加熱部F中,移載至第一軌道部1a0上的移動體1c0的工件托盤1e亦由於探針與加熱器配線連接且向加熱器1d通電,因此被預加熱至與成形溫度相同的程度。
Next, an example of the conveyance operation of the unformed workpiece W to the pressing part B ( B1 to B4 ) by the
以下說明對壓製部B的成形前的工件供給動作。對位於圖2的壓製部B1~壓製部B4的第一直動軌道1A上的移動體1c0~移動體1c4向工件供給部A去接收成形前的工件W的動作例進行說明。如圖5所示,使自於托盤用預加熱部F中受到預加熱的移動體1c0去接收成形前的工件W的動作開始。圖中以梨皮狀包圍的部分表示受到預加熱。
Next, the operation of supplying the workpiece to the press part B before forming will be described. An operation example in which the moving bodies 1c0 to 1c4 positioned on the first moving
如圖5所示,升降機構10使載置有移動體1c0的第一軌道部1a0與平行配置於其下方的第二軌道部1b01下降,將第一軌道部1a0連接於第二軌道部1b00與第二軌道部1b1之間。如圖6所示,移動體1c0自第一軌道部1a0自動行走至第二軌道部1b00。
如圖7所示,升降機構10使載置有移動體1c0的第二軌道部1b00下降至工件接收位置E。然後,移動體1c0自供給箱5於工件托盤1e上接收成形前的工件W(參照圖1),工件W藉由內置於工件托盤1e中的加熱器1d被預加熱至與成形溫度相同的程度。
As shown in FIG. 5 , the elevating
圖8中,藉由升降機構10,於壓製部B1中使載置有移動體1c1的第一軌道部1a1與其下方的第二軌道部1b1下降,將第一軌道部1a1連接於第一軌道部1a0與第二軌道部1b2之間。移動體1c1於第二直動軌道1B上向第一軌道部1a0自動行走。繼而,如圖9所示,升降機構10使載置有移動體1c1的第一軌道部1a0及與其平行的第二軌道部1b01一起上升,第二軌道部1b01與第一軌道部1a1連接。此時,移動至托盤用預加熱部F的移動體1c1的工件托盤1e於第一軌道部1a0上被預加熱至與成形溫度相同的程度。
In FIG. 8, the first rail part 1a1 on which the moving body 1c1 is placed and the second rail part 1b1 below it are lowered in the pressing part B1 by the elevating
繼而,如圖10所示,升降機構10使載置有接收了工件W的移動體1c0的第二軌道部1b00自工件接收位置E上升至與第二軌道部1b01連接的高度位置。然後,如圖11所示,使移動體1c0自第二軌道部1b00經過第二軌道部1b01自動行走至第一軌道部1a1上。
Next, as shown in FIG. 10 , the elevating
如圖12所示,藉由升降機構10使載置有移動體1c0的第一軌道部1a1及與其平行配置的第二軌道部1b1上升,使第一軌道部1a1與第一軌道部1a2連接,使第二軌道部1b1連接於第一軌道部1a0與第二軌道部1b2之間。藉此,載置有工件W的移
動體1c0的工件托盤1e於第一軌道部1a1上被預加熱至與成形溫度相同的程度。再者,於工件托盤1e上受到預加熱的工件W藉由保持有樹脂R的裝載機4被搬入至壓製部B1的密封模具3a(參照圖1)。
As shown in FIG. 12, the first rail portion 1a1 on which the moving body 1c0 is placed and the second rail portion 1b1 arranged in parallel therewith are raised by the elevating
另外,關於在托盤用預加熱部F中工件托盤1e受到預加熱的移動體1c1,如圖12所示,藉由升降機構10使第一軌道部1a0及與其平行的第二軌道部1b01下降,使第一軌道部1a0連接於第二軌道部1b00及第二軌道部1b1之間。繼而,如圖13所示,移動體1c1自第一軌道部1a0向第二軌道部1b00自動行走。
In addition, as for the moving body 1c1 in which the
另外,壓製部B2中,升降機構10使載置有移動體1c2的第一軌道部1a2及與其平行配置的第二軌道部1b2下降,第一軌道部1a2連接於第二軌道部1b1與第二軌道部1b3之間。
In addition, in the pressing part B2, the elevating
圖14中,藉由升降機構10使載置有移動體1c1的第二軌道部1b00下降至工件接收位置E。然後,移動體1c1自供給箱5於工件托盤1e上接收成形前的工件W(參照圖1),工件W藉由內置於工件托盤1e中的加熱器1d被預加熱至與成形溫度相同的程度。另外,移動體1c2自第一軌道部1a2經過第二軌道部1b1自動行走至第一軌道部1a0上。
In FIG. 14 , the second rail portion 1b00 on which the moving body 1c1 is placed is lowered to the workpiece receiving position E by the elevating
圖15中,升降機構10使載置有移動體1c2的第一軌道部1a0及與其平行配置的第二軌道部1b01上升,使第一軌道部1a0與第一軌道部1a1連接,使第二軌道部1b01與第二軌道部1b1連接。此時,移動至托盤用預加熱部F的移動體1c2的工件托盤
1e於第一軌道部1a0上被預加熱至與成形溫度相同的程度。
In Fig. 15, the elevating
繼而,如圖16所示,升降機構10使載置有接收了工件W的移動體1c1的第二軌道部1b00自工件接收位置E上升至與第二軌道部1b01連接的高度位置。然後,如圖17所示,使移動體1c1自第二軌道部1b00經過第二軌道部1b01及第二軌道部1b1自動行走至第一軌道部1a2上。
Next, as shown in FIG. 16 , the elevating
如圖18所示,藉由升降機構10使載置有移動體1c1的第一軌道部1a2及與其平行配置的第二軌道部1b2上升,使第一軌道部1a2連接於第一軌道部1a1與第一軌道部1a3之間,使第二軌道部1b2連接於第二軌道部1b1與第二軌道部1b3之間。藉此,載置於移動體1c1的工件托盤1e的工件W於第一軌道部1a2上被預加熱至與成形溫度相同的程度。再者,於工件托盤1e上受到預加熱的工件W藉由保持有樹脂R的裝載機4被搬入至壓製部B2的密封模具3b(參照圖1)。
As shown in FIG. 18, the first rail portion 1a2 on which the moving body 1c1 is placed and the second rail portion 1b2 arranged in parallel therewith are raised by the elevating
另外,圖18中,關於在托盤用預加熱部F中工件托盤1e受到預加熱的移動體1c2,藉由升降機構10使第一軌道部1a0及與其平行配置的第二軌道部1b01下降,使第一軌道部1a0連接於第二軌道部1b00與第二軌道部1b1之間。
In addition, in FIG. 18, regarding the moving body 1c2 in which the
然後,移動體1c2自第一軌道部1a0向第二軌道部1b00自動行走(參照圖6、圖13)。繼而,升降機構10使載置有移動體1c2的第二軌道部1b00下降至工件接收位置E(參照圖7、圖14)。然後,移動體1c2自供給箱5於工件托盤1e上接收成形前的工件W
(參照圖1),工件W藉由內置於工件托盤1e中的加熱器1d被預加熱至與成形溫度相同的程度(參照圖7、圖14)。
Then, the mobile body 1c2 automatically travels from the first rail portion 1a0 to the second rail portion 1b00 (see FIG. 6 and FIG. 13 ). Next, the elevating
關於利用壓製部B3所包括的移動體1c3及壓製部B4所包括的移動體1c4進行的工件搬運動作,亦是緊接著移動體1c2,交替進行托盤用預加熱部F中的工件托盤1e的預加熱與工件接收位置E處的工件W的預加熱,對壓製部B3、壓製部B4搬運工件W。詳細的說明與移動體1c0及移動體1c1相同,因此省略。
Regarding the work conveying operation performed by the movable body 1c3 included in the pressing part B3 and the moving body 1c4 included in the pressing part B4, the preheating of the
如以上說明般,使與第一軌道部1a0~第一軌道部1a4、即載置有形成第一直動軌道1A的第一軌道部1a0~第一軌道部1a4上的移動體1c0~移動體1c4的第一軌道部1a0~第一軌道部1a4平行配置的第二軌道部1b01~第二軌道部1b4平行移動,使第一軌道部1a0~第一軌道部1a4與第二軌道部1b00~第二軌道部1b4連接,藉此移動體1c(1c0~1c4)可於第二直動軌道1B上自動行走並移動至工件供給部A來供給下一個成形前的工件W。藉此,可減少利用裝載機4進行的工件搬運作業,從而提高生產效率。
As described above, the first rail portion 1a0 to the first rail portion 1a4, that is, the moving body 1c0 to the moving body on the first rail portion 1a0 to the first rail portion 1a4 forming the first straight-moving
另外,第一軌道部1a0~第一軌道部1a4及第二軌道部1b00~第二軌道部1b4具有相互重組並電性及機械性地連接的模組結構,因此第一直動軌道1A及第二直動軌道1B的配置結構的自由度高,可減少裝載機4的作業區域並形成緊湊的設計。
In addition, the first track part 1a0~the first track part 1a4 and the second track part 1b00~the second track part 1b4 have a module structure that is recombined and electrically and mechanically connected to each other, so the first direct moving
另外,第一直動軌道1A中移動體1c1~移動體1c4的工件托盤1e受到加熱,將工件成形前的工件W預加熱至與成形溫度相
同的程度,因此減少工件W的預加熱的時間來提高生產效率,不易被工件W奪走熱量而使模具溫度降低,因此可提高成形品質。
In addition, the
另外,於壓製部B1~壓製部B4的移動體1c1~移動體104去接收工件W的移動過程中,工件托盤1e的溫度容易降低。因此,若於工件供給部A設置有托盤用預加熱部F,則藉由於托盤用預加熱部F將工件托盤1e預加熱至與成形溫度相同的程度,可減低工件托盤1e的溫度降低,減少工件W的預加熱時間,從而提高生產效率。另外,藉由進而包括比壓製部B1~壓製部B4的數量多的移動體1c0,可使用移動體1c0預先於工件供給部A接收成形前的工件W並將經預加熱的工件W供給至成形結束的任一壓製部B,因此壓製部B的運轉率提高而可提高生產效率。
In addition, the temperature of the
再者,所述線性搬運機構1所包括的第一直動軌道1A與第二直動軌道1B平行配置於不同的高度位置,但不限定於所述態樣。例如,第一直動軌道1A與第二直動軌道1B亦可以相同高度平行配置於在水平方向上不同的位置。於所述情況下,搬運路徑切換機構使用水平移動機構代替升降機構10,使第一軌道部1a0~第一軌道部1a4及第二軌道部1b00~第二軌道部1b4於同一平面上向裝置近前側或裝置縱深側滑動移動,藉此可將載置有移動體1c(1c0~1c4)的第一軌道部1a0~第一軌道部1a4與第二軌道部1b00~第二軌道部1b4相互連接。
Furthermore, the first straight-moving
另外,第一直動軌道1A與第二直動軌道1B亦可平行配置於在高度方向及水平方向上不同的位置。於所述情況下,搬運路徑切
換機構亦可利用三維移動機械臂等使第一軌道部1a0~第一軌道部1a4及第二軌道部1b00~第二軌道部1b4移動。
In addition, the first
進而,於工件供給部A中,使移動至第二軌道部1b00上的移動體1c(1c0~1c4)與第二軌道部1b00一起自第二直動軌道1B下降至工件接收位置E,對於移動至第二軌道部1b00上的移動體1c,亦可自配置於第二直動軌道1B的延長線上的供給箱5將成形前的工件W供給至工件托盤1e。或者,亦可自配置於第二軌道部1b00的上方的供給箱5將成形前的工件W供給至移動體1c(1c0~1c4)。
Furthermore, in the workpiece supply part A, the moving
所述實施例中,作為工件搬運機構D,使用線性搬運機構1,但並不限定於此。工件搬運機構D亦可為皮帶搬運機構。具體而言,皮帶搬運機構亦可包括:第一皮帶搬運路徑(相當於第一直動軌道1A),串聯配置有移動體1c於環繞的環形皮帶上移動的皮帶模組;以及第二皮帶搬運路徑(相當於第二直動軌道1B),與第一皮帶搬運路徑平行配置,且串聯配置有多個皮帶模組。例如圖2中亦可代替第一軌道部1a0~第一軌道部1a4而配置皮帶模組,代替第二軌道部1b00~第二軌道部1b4而分別配置皮帶模組。再者,第一皮帶搬運路徑與第二皮帶搬運路徑可平行配置於不同的高度位置,亦可以相同的高度平行配置於在水平方向上不同的位置,亦可以高度位置及水平方向位置不同的方式配置。
In the above-mentioned embodiment, the
移動體1c(1c0~1c4)的如下方面相同:於上表面部設置有能夠搭載工件W的不鏽鋼金屬系的工件托盤1e,於工件托盤
1e中內置有加熱器1d(參照圖1)。加熱器1d例如使用紅外線加熱器、夾套加熱器、筒式加熱器等。如下結構亦相同:移動體1c0~移動體1c4碰到設置於第一皮帶搬運路徑的止動器而停止,將設置於移動體1c0~移動體1c4的探針與設置於第一皮帶搬運路徑的加熱器配線連接,藉此向加熱器1d供電,經由工件托盤1e將工件W預加熱至與成形溫度(例如170℃左右)相同的程度。另外,工件供給部A中亦包括托盤用預加熱部F的方面亦相同。於所述情況下,搬運路徑切換機構較佳為僅使移動體1c於第一皮帶搬運路徑與第二皮帶搬運路徑之間移載來切換搬運路徑。
The
藉此,關於移動體1c,只要於串聯配置有皮帶模組的第一搬運路徑與第二搬運路徑上利用搬運路徑切換機構來換載移動體1c即可,因此可以簡單的結構減少利用裝載機4進行的成形前的工件W的搬運作業,從而提高生產效率。
Thereby, as for the
另外,揭示了於所述壓製部B並排設置四個壓製部B1~B4的實施例,但壓製部B的數量可比其多亦可比其少,可為任一者。另外,壓製部B所包括的密封模具3可為轉移成形裝置,亦可為壓縮成形裝置,可為任一者。
In addition, an embodiment in which four pressing parts B1 to B4 are arranged side by side in the pressing part B is disclosed, but the number of pressing parts B may be larger or smaller than this, and may be either. In addition, the sealing
另外,裝載機4供給成形前的工件及樹脂R且取出成形後的工件W,但並不限定於此,亦可包括供給成形前的工件W的裝載機與取出成形後的工件W的卸載機。
In addition, the
另外,樹脂R例示了平板樹脂,亦可為顆粒狀樹脂、粉狀樹脂、液狀樹脂等其他形態的樹脂。 In addition, the resin R exemplifies flat-plate resins, and resins in other forms, such as granular resins, powdery resins, and liquid resins, may be used.
A:工件供給部 A:Work supply department
B、B1、B2、B3、B4:壓製部 B, B1, B2, B3, B4: pressing department
C:成形品收納部 C: Molded product storage department
E:工件接收位置 E: Workpiece receiving position
F:托盤用預加熱部 F: Preheating part for tray
R:樹脂 R: Resin
1:線性搬運機構 1: Linear handling mechanism
1A:第一直動軌道 1A: The first direct motion track
1B:第二直動軌道 1B: The second direct track
1C:線性馬達軌道部 1C: Linear motor track part
1a0、1a1、1a2、1a3、1a4:第一軌道部 1a0, 1a1, 1a2, 1a3, 1a4: the first track part
1b00、1b01、1b1、1b2、1b3、1b4:第二軌道部 1b00, 1b01, 1b1, 1b2, 1b3, 1b4: the second track part
1c0、1c1、1c2、1c3、1c4:移動體 1c0, 1c1, 1c2, 1c3, 1c4: moving objects
1e:工件托盤 1e: Workpiece pallet
2:樹脂密封裝置 2: Resin sealing device
4:裝載機 4: Loader
10:升降機構 10: Lifting mechanism
11:支架機構 11: Bracket mechanism
12:拾取器 12: Pickup
Claims (8)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2020200905A JP7495734B2 (en) | 2020-12-03 | 2020-12-03 | Resin sealing equipment |
JP2020-200905 | 2020-12-03 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW202224036A TW202224036A (en) | 2022-06-16 |
TWI786794B true TWI786794B (en) | 2022-12-11 |
Family
ID=81854102
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW110132247A TWI786794B (en) | 2020-12-03 | 2021-08-31 | Resin sealing device |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP7495734B2 (en) |
TW (1) | TWI786794B (en) |
WO (1) | WO2022118518A1 (en) |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW201516430A (en) * | 2011-12-28 | 2015-05-01 | Advantest Corp | Electronic component transfer apparatus, electronic component handling apparatus and electronic component test apparatus |
TWM578234U (en) * | 2018-08-31 | 2019-05-21 | 鉅鋼機械股份有限公司 | Mold exchange mechanism for linear multi-station type shaping machine |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000286277A (en) | 1999-03-31 | 2000-10-13 | Nippon Rekku Kk | Vacuum printer and vacuum printing method |
JP2005302983A (en) | 2004-04-12 | 2005-10-27 | Shimadzu Corp | Vacuum processing equipment |
JP5793806B2 (en) | 2011-08-17 | 2015-10-14 | アピックヤマダ株式会社 | Resin molding equipment |
JP6804410B2 (en) | 2017-08-09 | 2020-12-23 | Towa株式会社 | Conveying mechanism, resin molding device, method of delivering the object to be molded to the molding mold, and method of manufacturing the resin molded product |
-
2020
- 2020-12-03 JP JP2020200905A patent/JP7495734B2/en active Active
-
2021
- 2021-08-31 TW TW110132247A patent/TWI786794B/en active
- 2021-09-10 WO PCT/JP2021/033324 patent/WO2022118518A1/en active Application Filing
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW201516430A (en) * | 2011-12-28 | 2015-05-01 | Advantest Corp | Electronic component transfer apparatus, electronic component handling apparatus and electronic component test apparatus |
TWM578234U (en) * | 2018-08-31 | 2019-05-21 | 鉅鋼機械股份有限公司 | Mold exchange mechanism for linear multi-station type shaping machine |
Also Published As
Publication number | Publication date |
---|---|
JP7495734B2 (en) | 2024-06-05 |
JP2022088838A (en) | 2022-06-15 |
WO2022118518A1 (en) | 2022-06-09 |
TW202224036A (en) | 2022-06-16 |
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