TWI785130B - Method for producing composite body composed of metal coated with solid fine particles, and composite body - Google Patents

Method for producing composite body composed of metal coated with solid fine particles, and composite body Download PDF

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TWI785130B
TWI785130B TW107136197A TW107136197A TWI785130B TW I785130 B TWI785130 B TW I785130B TW 107136197 A TW107136197 A TW 107136197A TW 107136197 A TW107136197 A TW 107136197A TW I785130 B TWI785130 B TW I785130B
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TW201936932A (en
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西山宏昭
梅津寛
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國立大學法人山形大學
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/16Metallic particles coated with a non-metal
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F3/00Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
    • B22F3/10Sintering only
    • B22F3/105Sintering only by using electric current other than for infrared radiant energy, laser radiation or plasma ; by ultrasonic bonding
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F3/00Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
    • B22F3/12Both compacting and sintering
    • B22F3/16Both compacting and sintering in successive or repeated steps
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F9/00Making metallic powder or suspensions thereof
    • B22F9/16Making metallic powder or suspensions thereof using chemical processes
    • B22F9/30Making metallic powder or suspensions thereof using chemical processes with decomposition of metal compounds, e.g. by pyrolysis

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Abstract

提供容易實施習知技術中難以達成之固體微粒子之聚集,亦使圖型形成容易的技術。 Provides a technology that can easily implement the aggregation of solid particles that is difficult to achieve in the conventional technology, and also makes it easy to form patterns.

一種含有經固體微粒子被覆的金屬之複合體之製造方法,其包含藉由對含有金屬之離子、膠體,及/或錯合物之溶液,照射超短脈衝雷射光,使金屬析出,將分散於溶液中之由金屬氧化物粒子、非金屬氧化物粒子,或陶瓷粒子所構成之固體微粒子,被覆於所析出的金屬之步驟。 A method for producing a composite body containing metal coated with solid microparticles, which includes irradiating ultrashort pulse laser light to a solution containing metal ions, colloids, and/or complexes to precipitate metals and disperse them in The step of coating the precipitated metal with the solid particles composed of metal oxide particles, non-metal oxide particles, or ceramic particles in the solution.

Description

由經固體微粒子被覆的金屬所構成之複合體之製造方法,及複合體 Method for producing composite body composed of metal coated with solid fine particles, and composite body

本發明係關於一種如利用超短脈衝雷射光之非常短的時間幅度,且利用源自超短脈衝性之金屬離子、膠體、錯合物(以下記載為「金屬離子等」)的非線形光學吸收,而於超短脈衝雷射光聚光位置使金屬析出,於熱效應出現前對所析出的金屬瞬間給予非常大的能量,藉此被覆所析出之金屬般具有各種機能的固體微粒子聚集而成之複合體之製造方法。又,本發明關於即使為不具有感光性之透明性高的塗佈膜形成材料、固體電解質型燃料電池電解質材料、發光二極體或光響應半導體材料、電阻體膜形成材料、金屬磁性體粉末材料、超電導材料、壓電陶瓷厚膜材料、介電體膜材料、微粒子結合材料等之機能性材料的固體微粒子,亦藉由使超短脈衝雷射光聚光位置移動來形成圖型之製造方法。 The present invention relates to a very short time span of ultrashort pulse laser light, and utilizes nonlinear optical absorption of metal ions, colloids, complexes (hereinafter referred to as "metal ions, etc.") derived from ultrashort pulses , and the metal is precipitated at the spot where the ultra-short pulse laser light is concentrated, and a very large energy is given to the precipitated metal in an instant before the thermal effect occurs, thereby covering the precipitated metal as a compound formed by the aggregation of solid particles with various functions. Body manufacturing method. Also, the present invention relates to a highly transparent coating film-forming material, a solid electrolyte fuel cell electrolyte material, a light-emitting diode or a light-responsive semiconductor material, a resistive film-forming material, and a metal magnetic powder even if it does not have photosensitivity. Solid particles of functional materials such as materials, superconducting materials, piezoelectric ceramic thick film materials, dielectric film materials, and particle-bonded materials, etc., and a method of forming a pattern by moving the focused position of ultrashort pulse laser light .

近年來,以乾式來實施微粒子碰撞所致之各種塗佈的嘗試係被進行。該技術係藉由碰撞,將微粒子之動能,時間性及空間性地均局部地轉換為熱能,藉此材料成為(熔點以上之)高溫,產生粒子結合,以形成塗層者。 In recent years, attempts have been made to perform various coatings by collision of fine particles in a dry method. This technology converts the kinetic energy of microparticles into thermal energy in both time and space through collision, so that the material becomes high temperature (above the melting point) and particles combine to form a coating.

以微粒子碰撞所為的塗佈法之例子,首先可列舉使用電場之方法。具體而言,係有靜電微粒子衝擊塗佈(EPID)法(使用較原料微粒子硬度低的基板材料,將原料微粒子埋入基板中之方法)、簇離子束(cluster ion beam)法等。又,亦有以氣體輸送所為的方法(氣相沈積(GD)法)。依照該方法,可於室溫形成金屬奈米結晶膜。再者,藉由該方法所形成之膜的膜密度,可認為係理論密度之55~80%左右,欲得到塊材程度之電傳導,必需以熱結晶成長。進一步地,氣溶膠沈積(AD)法亦受到注目(專利文獻1)。依照該方法,可於常溫製作含有金屬且含有陶瓷材料之緻密且高硬度的膜。又,亦被報告亦可無蝕刻地得到微細之圖型,但操作作業環境等之微粉係有難度。此等方法均為需要大規模之裝置者。 As an example of the coating method by the collision of fine particles, first, a method using an electric field is mentioned. Specifically, there are electrostatic particle impact coating (EPID) method (a method of embedding raw material particles in a substrate using a substrate material having a hardness lower than that of the raw material particles), cluster ion beam method, and the like. In addition, there is also a method (gas deposition (GD) method) in which gas is transported. According to this method, a metal nanocrystal film can be formed at room temperature. Furthermore, the film density of the film formed by this method can be considered to be about 55-80% of the theoretical density. To obtain bulk-level electrical conduction, it is necessary to grow by thermal crystallization. Furthermore, an aerosol deposition (AD) method is attracting attention (patent document 1). According to this method, a dense and high-hardness film containing metal and ceramic material can be produced at room temperature. In addition, it is also reported that fine patterns can be obtained without etching, but it is difficult to handle the fine powder system in the working environment. These methods all require large-scale installations.

另一方面,作為雷射光照射所用的雷射,超短脈衝雷射可認為主要係利用其非常短的時間幅度,而具備於熱效應出現之前對物質瞬間給予非常大的能量之特性。例如,非專利文獻1中,報告有以超短脈衝雷射加工之例子,藉此,以銅為標的而照射10ps(皮秒)之脈衝雷射時,推測表面電子溫度達數千℃,另一方面熱擴散長為μm以下。 On the other hand, as the laser used for laser light irradiation, the ultrashort pulse laser can be considered to use its very short time span, and has the characteristic of giving a very large energy to the material instantaneously before the thermal effect occurs. For example, in Non-Patent Document 1, an example of ultrashort pulse laser processing is reported. By this, when copper is used as a target and irradiated with 10 ps (picosecond) pulse laser, it is estimated that the surface electron temperature reaches several thousand degrees Celsius. On the one hand, the thermal diffusion length is not more than μm.

因此,報告有對銀離子溶液照射超短脈衝雷射光,將溶液中之金屬離子還原,使銀析出的方法。 Therefore, it is reported that a silver ion solution is irradiated with ultrashort pulse laser light to reduce metal ions in the solution and precipitate silver.

例如,非專利文獻2中,報告有藉由波長800nm、脈衝寬度80fs、頻率82MHz、輸出14.97mW之高強度雷射束照射而還原銀離子,而得到銀點。For example, in Non-Patent Document 2, it is reported that silver dots are obtained by reducing silver ions by irradiation with a high-intensity laser beam with a wavelength of 800 nm, a pulse width of 80 fs, a frequency of 82 MHz, and an output of 14.97 mW.

又,非專利文獻3中,報告藉由利用使用波長1064nm之近紅外光源,與波長532nm或633nm之可見光源的比較弱之連續振盪脈衝雷射,利用硝酸銀之還原反應於玻璃基板上形成銀奈米粒子集合體之圖型化。In addition, in Non-Patent Document 3, it is reported that by using a near-infrared light source with a wavelength of 1064nm, and a relatively weak continuous oscillation pulsed laser with a visible light source with a wavelength of 532nm or 633nm, the reduction reaction of silver nitrate is used to form silver on the glass substrate. Patterning of aggregates of rice particles.

為了進行此等雷射光照射所致之材料圖型化,被加工材料具有對雷射光之適切的光吸收特性乃是必需的。例如,對Ag油墨等照射雷射光形成金屬(Ag)圖型的情況時,油墨適度地吸收雷射光乃是大前提。In order to carry out the patterning of materials caused by such laser light irradiation, it is necessary for the processed material to have suitable light absorption characteristics for laser light. For example, when Ag ink is irradiated with laser light to form a metal (Ag) pattern, it is a prerequisite for the ink to absorb laser light appropriately.

於雷射振盪波長使超短脈衝光於透過性高的玻璃內部聚光時,可僅將聚光點附近直接加工。非專利文獻4中,報告有以飛秒雷射加工透明材料的例子,其報告對二氧化矽玻璃照射波長800nm、脈衝寬度120fs之脈衝光,於玻璃內部之聚光點誘發晶格缺陷,而產生出高密度化。 但是,該手法中對在溶液中分散之固體微粒子的聚光係困難的,又,即使實現了,亦會將照射部之材料特性改質,因此無法避免固體微粒子之物性再產生變質。 本發明者等人,以超短脈衝雷射,利用源自超短脈衝性之非線形光學吸收,探討本來不具吸收之材料的聚集方法之結果,達成了本發明。 [先前技術文獻] [專利文獻]When ultra-short pulse light is condensed inside the highly transparent glass at the laser oscillation wavelength, only the vicinity of the condensed point can be directly processed. Non-Patent Document 4 reports an example of processing transparent materials with femtosecond lasers. It reports that irradiating silica glass with pulsed light with a wavelength of 800 nm and a pulse width of 120 fs induces lattice defects at the light-concentrating points inside the glass, and resulting in high density. However, in this method, it is difficult to collect light on the solid fine particles dispersed in the solution, and even if it is realized, the material properties of the irradiated part will be modified, so that the physical properties of the solid fine particles will not be avoided. The inventors of the present invention have arrived at the present invention as a result of investigating a method of gathering materials that do not originally have absorption using ultrashort pulse lasers, using nonlinear optical absorption derived from ultrashort pulses. [Prior Art Literature] [Patent Document]

[專利文獻1]日本特開2003-112976號公報 [非專利文獻][Patent Document 1] Japanese Patent Laid-Open No. 2003-112976 [Non-patent literature]

[非專利文獻1]S.I. Anisimov and B. Rethfeld, Proc. SPIE Nonresonant Laser-Matter Interaction (NLMI-9), 3093, 192 (1997) [非專利文獻2]A. Ishikawa, T. Tanaka, and S. Kawata, Apply.Phys.Lett.89, 113102(2006) [非專利文獻3]平成21年度一般研究開發贊助AF-2009216、大阪大學 大學院工學研究科 精密科學・應用物理學專攻 助教 吉川裕之 [非專利文獻4]K. Miura, Jianrong Qiu, H. Inouye, and T. Mitsuyu, Apply.Phys.Lett.71, 3329(1997)[Non-Patent Document 1] S.I. Anisimov and B. Rethfeld, Proc. SPIE Nonresonant Laser-Matter Interaction (NLMI-9), 3093, 192 (1997) [Non-Patent Document 2] A. Ishikawa, T. Tanaka, and S. Kawata, Apply.Phys.Lett.89, 113102 (2006) [Non-Patent Document 3] FY2019 General Research and Development Grant AF-2009216, Hiroyuki Yoshikawa, Assistant Professor, Department of Precision Science and Applied Physics, Graduate School of Engineering, Osaka University [Non-Patent Document 4] K. Miura, Jianrong Qiu, H. Inouye, and T. Mitsuyu, Apply.Phys.Lett.71, 3329(1997)

[發明所欲解決之課題][Problem to be Solved by the Invention]

本發明係提供容易地實施習知技術中難以達成之固體微粒子聚集,且使圖型形成容易的技術者。 [用以解決課題之手段]The present invention is to provide a technology that can easily implement the aggregation of solid fine particles that is difficult to achieve in the prior art, and make pattern formation easy. [Means to solve the problem]

本發明者等人,基於以超短脈衝雷射,利用源自超短脈衝性之非線形光學吸收,可使金屬粒子析出的見解,藉由設想以該金屬粒子作為微小熱源之利用,針對本來不具對雷射光之吸收的材料之聚集方法深入探討的結果,而達成本發明。 而本發明者等人為了解決上述課題,藉由使不具有感光性的材料等之固體微粒子,分散於存在有金屬離子等之溶液中,並照射超短脈衝雷射,而使製造固體微粒子聚集於金屬表面而成的複合體成為可能。超短脈衝雷射可瞬間釋出源自其短脈衝寬度之高強度光脈衝,該高強度脈衝所產生出的非線形光學吸收,可僅將聚光點附近直接加工。使用該特性,僅於溶液中之超短脈衝雷射聚光點附近使金屬析出,並且進一步進行該析出金屬的局部加熱,藉此使周邊的固體微粒子聚集於金屬表面。藉由該方法,可進行不具有感光性之材料的圖型化。 藉由本發明,即使為不具有感光性之透明性高的塗佈膜形成材料、固體電解質型燃料電池電解質材料、發光二極體或光響應半導體材料、電阻體膜形成材料、金屬磁性體粉末材料、超電導材料、壓電陶瓷厚膜材料、介電體膜材料、微粒子結合材料等之機能性材料之固體微粒子,亦藉由使超短脈衝雷射光聚光位置移動,而可形成圖型。The inventors of the present invention, based on the knowledge that metal particles can be precipitated by using ultrashort pulse laser by utilizing nonlinear optical absorption derived from ultrashort pulses, and by imagining the use of the metal particles as a tiny heat source, aimed at the original non-existent The present invention is achieved as a result of in-depth research on the aggregation method of materials that absorb laser light. In order to solve the above-mentioned problems, the inventors of the present invention disperse solid particles of non-photosensitive materials and the like in a solution containing metal ions, etc., and irradiate ultrashort pulse lasers to aggregate solid particles. Composites formed on metal surfaces become possible. The ultra-short pulse laser can instantly release high-intensity light pulses from its short pulse width. The nonlinear optical absorption generated by the high-intensity pulses can directly process only the vicinity of the focus point. Using this characteristic, the metal is deposited only near the spot of the ultrashort pulse laser in the solution, and the precipitated metal is further heated locally, so that the surrounding solid particles are gathered on the metal surface. By this method, it is possible to pattern non-photosensitive materials. According to the present invention, even high-transparency coating film forming materials without photosensitivity, solid electrolyte fuel cell electrolyte materials, light-emitting diodes or light-responsive semiconductor materials, resistive film forming materials, and metal magnetic powder materials Solid particles of functional materials such as superconducting materials, piezoelectric ceramic thick film materials, dielectric film materials, and particle-bonded materials can also be patterned by moving the focused position of ultrashort pulse laser light.

亦即,本發明為一種含有經固體微粒子被覆的金屬之複合體之製造方法,其包含藉由對含有金屬之離子、膠體,及/或錯合物之溶液,照射超短脈衝雷射光,使金屬析出,將分散於前述溶液中的由金屬氧化物粒子、非金屬氧化物粒子,或陶瓷粒子所構成之固體微粒子,被覆於前述所析出的金屬之步驟。That is, the present invention is a method for producing a composite body containing metals coated with solid fine particles, which includes irradiating ultrashort pulse laser light to a solution containing metal ions, colloids, and/or complexes, so that Metal precipitation, the step of coating the precipitated metal with solid microparticles composed of metal oxide particles, non-metal oxide particles, or ceramic particles dispersed in the aforementioned solution.

前述金屬,只要所析出之金屬不與溶劑化學反應則無特殊限制。溶劑選擇水時,較佳為選自由銀、銅、鎳、鉛、錫、鉑及金所成之群的不與水及高溫之水蒸氣反應的金屬。The aforementioned metals are not particularly limited as long as the precipitated metal does not chemically react with the solvent. When water is selected as the solvent, it is preferably a metal selected from the group consisting of silver, copper, nickel, lead, tin, platinum, and gold that does not react with water and high-temperature water vapor.

前述固體微粒子之熔點較佳為500℃~3500℃。 又,前述固體微粒子較佳具有0.005μm~1μm之直徑。 進一步地,前述固體微粒子之於前述溶液中之濃度,較佳為0.01質量%~3.0質量%。The melting point of the aforementioned solid fine particles is preferably 500°C to 3500°C. Also, the aforementioned solid fine particles preferably have a diameter of 0.005 μm to 1 μm. Furthermore, the concentration of the aforementioned solid fine particles in the aforementioned solution is preferably 0.01% by mass to 3.0% by mass.

前述超短脈衝雷射光之波長較佳為200nm~2000nm。 又,前述超短脈衝雷射光之能量密度(投入於單位面積之能量),較佳為0.01mJ/cm2 ~10mJ/cm2 。 進一步地,前述超短脈衝雷射光之重複頻率較佳為1Hz~500MHz。 前述超短脈衝雷射光之平均輸出較佳為10mW以上。 又,前述超短脈衝雷射光之聚光徑較佳為20μm以下。The wavelength of the aforementioned ultrashort pulse laser light is preferably 200 nm to 2000 nm. In addition, the energy density (energy input per unit area) of the aforementioned ultrashort pulse laser light is preferably 0.01mJ/cm 2 -10mJ/cm 2 . Further, the repetition frequency of the aforementioned ultrashort pulse laser light is preferably 1 Hz-500 MHz. The average output of the aforementioned ultrashort pulse laser light is preferably 10 mW or more. In addition, the focusing diameter of the aforementioned ultrashort pulse laser light is preferably 20 μm or less.

本發明可進一步包含於前述溶液中浸漬基板之步驟,及使前述超短脈衝雷射光之束點沿著前述基板的表面移動之步驟。 或者,本發明可進一步包含於前述溶液中浸漬基板之步驟,及使前述超短脈衝雷射光之束點自前述基板的表面,移動至離開前述基板之前述溶液中的特定位置之步驟。 本發明進一步為一種複合體,其係含有經固體微粒子被覆的金屬之複合體,其中前述金屬係於溶液中作為金屬之離子、膠體,及/或錯合物而存在,可藉由對該溶液照射超短脈衝雷射光而析出者,前述固體微粒子為金屬氧化物粒子、非金屬氧化物粒子,或陶瓷粒子,前述金屬形成芯部(core),且該芯部於其內側具有空洞。 前述金屬,較佳係選自由銀、銅、鎳、鉛、錫、鉑及金所成之群。 又,前述固體微粒子之熔點較佳為500℃~3500℃。 進一步地,前述固體微粒子,較佳具有0.005μm~1μm之直徑。 [發明之效果]The present invention may further include a step of immersing the substrate in the aforementioned solution, and a step of moving the beam spot of the aforementioned ultrashort pulse laser light along the surface of the aforementioned substrate. Alternatively, the present invention may further include a step of immersing the substrate in the aforementioned solution, and a step of moving the beam spot of the aforementioned ultrashort pulse laser light from the surface of the aforementioned substrate to a specific position in the aforementioned solution away from the aforementioned substrate. The present invention is further a composite, which is a composite containing a metal coated with solid microparticles, wherein the aforementioned metal exists in a solution as metal ions, colloids, and/or complexes, and the solution can be For those precipitated by irradiation with ultrashort pulse laser light, the solid fine particles are metal oxide particles, non-metal oxide particles, or ceramic particles, the metal forms a core, and the core has a cavity inside. The aforementioned metals are preferably selected from the group consisting of silver, copper, nickel, lead, tin, platinum and gold. In addition, the melting point of the solid fine particles is preferably 500°C to 3500°C. Furthermore, the aforementioned solid particles preferably have a diameter of 0.005 μm˜1 μm. [Effect of Invention]

靜電微粒子衝撃塗佈(EPID)法、簇離子束法、氣溶膠沈積(AD)法等之使用以往之固體微粒子的膜形成方法中,係有具有眾多製程、於體積密度低之微粉體的防止飛散、健康面或安全面的對策等裝置為大規模、由於直接以粉體使用故原料損失大等許多問題,但依照本發明,此等習知技術所具有的問題均可解決。Electrostatic particle impingement coating (EPID) method, cluster ion beam method, aerosol deposition (AD) method and other film formation methods using solid particles in the past, there are many processes and the prevention of fine powders with low bulk density There are many problems such as large-scale equipment for scattering, countermeasures for health or safety, and large loss of raw materials due to direct use of powder. However, according to the present invention, these problems of conventional technologies can be solved.

又,依照本發明,藉由於在溶劑中分散有固體微粒子(二氧化矽、氧化鋁、氧化鈦粒子等)的液體中,預先以金屬離子或金屬錯合物等之狀態溶解金屬,並對該溶液照射超短脈衝雷射光,可將溶液中所分散之固體微粒子容易地被覆於金屬表面,而製造含有經固體微粒子被覆的金屬之複合體,此時,藉由控制超短脈衝雷射光之照射等,可期待使金屬氧化物、非金屬氧化物或陶瓷等之具有各種機能的固體微粒子自在地形成圖型,製造裝置等,於各種機會應用本發明。Also, according to the present invention, the metal is dissolved in the state of metal ions or metal complexes in advance in the liquid in which solid fine particles (silicon dioxide, aluminum oxide, titanium oxide particles, etc.) are dispersed in the solvent, and the The solution is irradiated with ultrashort pulse laser light, and the solid particles dispersed in the solution can be easily coated on the metal surface, and a composite containing metal covered by solid particles can be produced. At this time, by controlling the irradiation of ultrashort pulse laser light It is expected that the present invention can be applied to various occasions by freely forming patterns on solid fine particles having various functions such as metal oxides, non-metal oxides, or ceramics, and manufacturing devices.

進一步地,藉由將本發明之複合體之製造方法,於基板上或垂直於基板的方向連續地進行,可於基板上形成由經以往雷射光照射所致之圖型化為困難的不具感光性之材料所塗佈之金屬所構成的三維圖型。此時,本發明由於係於溶液中照射超短脈衝雷射光的低溫之光製程,故可不對塑膠基板或基板上的元件造成大的損傷地,來進行圖型化。Further, by continuously carrying out the manufacturing method of the complex of the present invention on the substrate or in a direction perpendicular to the substrate, it is possible to form on the substrate a non-photosensitive compound that is difficult to pattern by laser light irradiation in the past. A three-dimensional pattern made of metal coated with a non-volatile material. At this time, since the present invention is based on a low-temperature optical process of irradiating ultrashort pulse laser light in a solution, patterning can be performed without causing major damage to the plastic substrate or components on the substrate.

以下,說明用以實施本發明之形態。 本發明係一種含有經固體微粒子被覆的金屬之複合體之製造方法,其包含藉由對含有金屬之離子、膠體,及/或錯合物之溶液,照射超短脈衝雷射光,使金屬析出,將分散於前述溶液中的由金屬氧化物粒子、非金屬氧化物粒子,或陶瓷粒子所構成之固體微粒子,被覆於前述所析出的金屬之步驟。Hereinafter, the form for carrying out this invention is demonstrated. The present invention is a method for producing a composite body containing metal coated with solid microparticles, which includes irradiating ultrashort pulse laser light to a solution containing metal ions, colloids, and/or complexes to precipitate metals, The step of coating the precipitated metal with solid fine particles composed of metal oxide particles, non-metal oxide particles, or ceramic particles dispersed in the aforementioned solution.

參照顯示本發明之一實施形態的概念截面圖之圖1,本發明中,首先於溶液容器(holder)中,容納溶解有硝酸銀,且分散有固體微粒子之溶液,於其上,載置使雷射光透過的基板,使基板的一面與溶液接觸。接著,自基板之另一面側,對溶液照射超短脈衝雷射光,使溶液中之銀析出,並且藉由分散於溶液中之固體微粒子被覆所析出之銀,製造含有經固體微粒子被覆的銀之複合體。Referring to Fig. 1 showing a conceptual sectional view of an embodiment of the present invention, in the present invention, at first, in a solution container (holder), accommodating a solution in which silver nitrate is dissolved and solid microparticles are dispersed, on which a mine is placed. The substrate through which the light is transmitted is brought into contact with the solution on one side of the substrate. Next, from the other side of the substrate, the solution is irradiated with ultrashort pulse laser light to precipitate silver in the solution, and the precipitated silver is coated with solid fine particles dispersed in the solution to manufacture a silver coated with solid fine particles. Complex.

參照顯示本發明之原理的概念截面圖之圖2,可認為藉由對硝酸銀溶液照射超短脈衝雷射光,金屬(銀)於基板表面(溶液側)析出,該金屬成為芯部,金屬表面被局部地加熱,於金屬表面之溶劑氣化所致的劇烈膨脹後,透過產生減壓所致之劇烈收縮的現象,芯部周圍所存在之溶液中所分散的固體微粒子受到劇烈收縮的力,以高速碰撞於金屬表面,藉此於金屬表面聚集緻密的集合體,而生成含有經固體微粒子被覆的金屬之複合體,但並不拘束於任何理論。Referring to Fig. 2 which is a conceptual cross-sectional view showing the principle of the present invention, it can be considered that by irradiating the silver nitrate solution with ultrashort pulse laser light, metal (silver) is deposited on the substrate surface (solution side), the metal becomes the core, and the metal surface is covered. Locally heated, after the violent expansion caused by the vaporization of the solvent on the metal surface, through the phenomenon of violent shrinkage caused by decompression, the solid particles dispersed in the solution around the core are subjected to the force of violent contraction, so that It collides with the metal surface at high speed, thereby agglomerating dense aggregates on the metal surface, and forming a composite body containing metal coated with solid particles, but is not bound by any theory.

<金屬> 本發明所使用之金屬,為於照射超短脈衝雷射光之溶液中作為金屬之離子、膠體,及/或錯合物而存在者。又,只要所析出之金屬不與溶劑化學反應,則金屬之種類並無特殊限制。 本發明所使用之金屬,特別是選擇水作為溶劑時,較佳為選自由銀、銅、鎳、鉛、錫、鉑及金所成之群,且不與水及高溫之水蒸氣反應的金屬。即使為與水或高溫之水蒸氣反應的金屬(例如鉀、鎂、鋁、鋅、鐵等離子化傾向高的金屬)的情況,亦可藉由適當選擇溶劑,來選擇較佳的金屬。<Metal> The metal used in the present invention exists as metal ions, colloids, and/or complexes in the solution irradiated with ultrashort pulse laser light. Also, as long as the deposited metal does not chemically react with the solvent, the type of the metal is not particularly limited. The metal used in the present invention, especially when water is selected as the solvent, is preferably selected from the group consisting of silver, copper, nickel, lead, tin, platinum and gold, and does not react with water and high-temperature water vapor . Even in the case of metals that react with water or high-temperature water vapor (for example, metals with high ionization tendency such as potassium, magnesium, aluminum, zinc, and iron), suitable metals can be selected by appropriately selecting a solvent.

金屬於溶液中作為離子而存在時,金屬離子例如可為Ag+ 、Cu+ 、Cu2+ 、Ni2+ 、Sn2+ 、Sn3+ 、Sn4+ 、Pb2+ 、Pt2+ 、Au+ 、Au3+ 等。 金屬鹽之相對離子,較佳選自由硝酸離子、硫酸離子、羧酸離子、氰化物離子、磺酸離子、硼酸離子、鹵素離子、碳酸離子、磷酸離子及過氯酸離子所成之群。When the metal exists as ions in the solution, the metal ions can be, for example, Ag + , Cu + , Cu 2+ , Ni 2+ , Sn 2+ , Sn 3+ , Sn 4+ , Pb 2+ , Pt 2+ , Au + , Au 3+ etc. The counter ion of the metal salt is preferably selected from the group consisting of nitrate ions, sulfate ions, carboxylate ions, cyanide ions, sulfonate ions, borate ions, halogen ions, carbonate ions, phosphate ions and perchlorate ions.

金屬於溶液中作為膠體而存在的例子,可列舉銀膠體、銅膠體、鎳膠體等。 金屬於溶液中作為錯合物而存在時,例如可列舉藉由使配位子配位於金屬原子,使得容易分散、溶解於溶劑的情況。 銀錯合物之例子,可列舉二十二酸銀、氯[1,3-雙(2,6-二異丙基苯基)咪唑-2-亞基]銀、吡啶-2-羧酸銀(II)、磺胺嘧啶銀(silver sulfadiazine)等。又,銅之錯合物可列舉乙酸銅(I)、雙(1,3-丙二胺)銅(II)二氯化物、乙醯丙酮銅(II)、雙(8-喹啉)銅(II)等。金之錯合物之例子,可列舉四氯金(III)酸四水合物、(二甲基硫醚)金(I)氯化物、氯[1,3-雙(2,6-二異丙基苯基)咪唑-2-亞基]金(I)等。鉛之錯合物可列舉四乙酸鉛、乙酸鉛(II)等。進一步地,可為如銀奈米油墨、銅奈米油墨之含有金屬錯合物的製品。Examples of metals present as colloids in a solution include silver colloids, copper colloids, and nickel colloids. When a metal exists as a complex in a solution, for example, the case where a ligand is coordinated to a metal atom makes it easy to disperse and dissolve in a solvent. Examples of silver complexes include silver behenate, silver chloro[1,3-bis(2,6-diisopropylphenyl)imidazol-2-ylidene], silver pyridine-2-carboxylate (II), silver sulfadiazine, etc. Also, copper complexes include copper(I) acetate, bis(1,3-propylenediamine)copper(II) dichloride, copper(II) acetylacetonate, bis(8-quinoline)copper(II) II) etc. Examples of gold complexes include tetrachloroaurate (III) acid tetrahydrate, (dimethyl sulfide) gold (I) chloride, chloro[1,3-bis(2,6-diisopropyl phenyl) imidazol-2-ylidene] gold (I) and so on. Lead complexes include lead tetraacetate, lead(II) acetate, and the like. Furthermore, it can be products containing metal complexes such as silver nano ink and copper nano ink.

本發明所使用之金屬於溶液中的濃度,並無特殊限定。只要於0.1質量%以上可均勻溶解或分散則不受限制。未達0.1質量%之稀溶液時,即使有固體微粒子之聚集,光效率亦變差。使溶液中之金屬濃度為高時,藉由照射超短脈衝雷射光所形成的金屬芯部之尺寸會增大。金屬於溶液中之濃度,較佳為3.0質量%以下。The concentration of the metal used in the present invention in the solution is not particularly limited. It is not limited as long as it can be dissolved or dispersed uniformly at 0.1% by mass or more. When the dilute solution is less than 0.1% by mass, even if there is aggregation of solid particles, the light efficiency will also deteriorate. When the metal concentration in the solution is made high, the size of the metal core formed by irradiating ultrashort pulse laser light increases. The concentration of the metal in the solution is preferably 3.0% by mass or less.

<固體微粒子> 本發明所使用之固體微粒子,係分散於照射超短脈衝雷射光之溶液中的金屬氧化物粒子、非金屬氧化物粒子,或陶瓷粒子。此處所稱的分散,固體微粒子並不一定必需於溶液全體均勻地分布,只要固體微粒子存在於聚光點附近,則其一部分亦可沈澱。 本發明所使用之固體微粒子,例如可使用碳化物、氮化物、硼化物等之無機化合物等。又,亦可依目的使用透明性高的塗佈膜形成材料、固體電解質型燃料電池電解質材料、發光二極體或光響應半導體材料、電阻體膜形成材料、金屬磁性體粉末材料、超電導材料、壓電陶瓷厚膜材料、介電體膜材料、微粒子結合材料等之機能性材料的固體微粒子。<Solid particles> The solid microparticles used in the present invention are metal oxide particles, non-metal oxide particles, or ceramic particles dispersed in a solution irradiated with ultrashort pulse laser light. The dispersion referred to here does not necessarily mean that the solid fine particles are uniformly distributed throughout the solution, and a part of the solid fine particles may be precipitated as long as the solid fine particles exist near the light-gathering point. As the solid fine particles used in the present invention, for example, inorganic compounds such as carbides, nitrides, and borides can be used. In addition, high transparency coating film forming materials, solid electrolyte fuel cell electrolyte materials, light emitting diodes or photoresponsive semiconductor materials, resistor film forming materials, metal magnetic powder materials, superconducting materials, Solid fine particles of functional materials such as piezoelectric ceramic thick film materials, dielectric film materials, and fine particle bonded materials.

此等之固體微粒子,可將不同種類者複數同時分散於溶劑,或亦可使用固體微粒子彼此接合而得的固體微粒子,或由複數成分所成之固體微粒子。進一步地,亦可與固體微粒子一起地使用如載持金的氧化鈦(Au/TiO2 )之固體微粒子。These solid fine particles may be dispersed in a solvent in plural of different kinds at the same time, or solid fine particles obtained by bonding solid fine particles to each other, or solid fine particles composed of plural components may be used. Further, solid fine particles such as gold-carrying titanium oxide (Au/TiO 2 ) can also be used together with the solid fine particles.

前述固體微粒子之熔點較佳為500℃~3500℃。 其例如使用銀作為金屬、使用氧化鈦作為固體微粒子時,會觀察到如圖4般的截面。氧化鈦與銀的交界面係廣範圍地接觸,相對於此,銀的內側存在有空洞。由於空洞之截面相對於銀的截面積之比係測定為5比1左右、氧化鈦之線膨脹係數(自室溫至1000℃之平均)為8×10-6 (1/K),以及銀之線膨脹係數為25×10-6 (1/K),故推測藉由照射超短脈衝雷射光,銀表面之最高到達溫度係5000K(4700℃以上)左右。因此,若為具備3500℃以下之熔點的固體微粒子,則可認為會熔解而容易地聚集於金屬表面。The melting point of the aforementioned solid fine particles is preferably 500°C to 3500°C. For example, when silver is used as the metal and titanium oxide is used as the solid fine particles, a cross section like that shown in FIG. 4 is observed. The interface system between titanium oxide and silver is widely in contact, while there are voids inside the silver. Since the ratio of the cross-sectional area of the cavity to the cross-sectional area of silver is determined to be about 5 to 1, the coefficient of linear expansion of titanium oxide (average from room temperature to 1000°C) is 8×10 -6 (1/K), and that of silver The coefficient of linear expansion is 25×10 -6 (1/K), so it is speculated that by irradiating ultrashort pulse laser light, the highest temperature reached on the silver surface is about 5000K (above 4700°C). Therefore, solid fine particles having a melting point of 3500° C. or lower are considered to melt and easily gather on the metal surface.

有用於作為塗佈材料之固體微粒子,就氧化物之固體微粒子而言,例如可列舉二氧化矽(1650℃)、氧化錫(1080℃)、氧化鐵(1565℃)、氧化鉻(2435℃)、氧化鈹(2570℃)、氧化鉿(2758℃)、(與水反應)、三氧化二錳(1080℃)、四氧化三錳(1567℃)、氧化錳(1650℃)、氧化鋇(1920℃)、氧化鍶(2531℃)、四氧化三鐵(1538℃)、氧化鈷(1933℃)、氧化鎳(1984℃)、鈦酸鋯酸鉛(1400℃)、鈦酸鋰(1520℃)、鈦酸鋁(1860℃)、鈦酸鍶(2080℃)、鈦酸鉛、鋯酸鉛、鈦酸鉛與鋯酸鉛之混晶(鈦酸鋯酸鉛)、氧化鈧(1000℃)、氧化釹(2270℃)、氧化釓(2330℃)、氧化釤(2300℃)、氧化釔(2410℃)、氧化鎳(600℃)、四氧化三鈷(895℃)、氧化銦錫(1800℃)、氧化鎂(2852℃)、氧化鋯(2715℃)、堇青石(1450℃)、鈣長石(1553℃)、鈣黃長石(1593℃)、鋁酸鈣(1600℃)、鋁酸鋰(1625℃)、鋁酸鍶(1790℃)、莫來石(1850℃)、鋁酸釔(1970℃)、尖晶石(2130℃)、氧化釹(1900℃)、氧化鈧(2485℃)、五倍子酸鑭系氧化物、PbZrTi系氧化物、LaSrCo系氧化物、LaSrMn系氧化物、YBa系氧化物、BiSrCa系氧化物、TlBaCa系氧化物、以氧化鐵為主成分之鐵氧體(ferrite)、上述以外之氧化物陶瓷等(括號內之溫度為熔點。以下相同)。There are solid fine particles used as coating materials, and solid fine particles of oxides include, for example, silicon dioxide (1650°C), tin oxide (1080°C), iron oxide (1565°C), chromium oxide (2435°C) , beryllium oxide (2570°C), hafnium oxide (2758°C), (reaction with water), manganese trioxide (1080°C), trimanganese tetraoxide (1567°C), manganese oxide (1650°C), barium oxide (1920°C ℃), strontium oxide (2531℃), ferric oxide (1538℃), cobalt oxide (1933℃), nickel oxide (1984℃), lead zirconate titanate (1400℃), lithium titanate (1520℃) , aluminum titanate (1860°C), strontium titanate (2080°C), lead titanate, lead zirconate, mixed crystal of lead titanate and lead zirconate (lead zirconate titanate), scandium oxide (1000°C), Neodymium oxide (2270°C), gadolinium oxide (2330°C), samarium oxide (2300°C), yttrium oxide (2410°C), nickel oxide (600°C), tricobalt tetroxide (895°C), indium tin oxide (1800°C), oxide Magnesium (2852°C), Zirconia (2715°C), Cordierite (1450°C), Anorthite (1553°C), Anorthite (1593°C), Calcium Aluminate (1600°C), Lithium Aluminate (1625°C) , strontium aluminate (1790°C), mullite (1850°C), yttrium aluminate (1970°C), spinel (2130°C), neodymium oxide (1900°C), scandium oxide (2485°C), lanthanum gallate oxides, PbZrTi oxides, LaSrCo oxides, LaSrMn oxides, YBa oxides, BiSrCa oxides, TlBaCa oxides, ferrite mainly composed of iron oxide, other than the above Oxide ceramics, etc. (The temperature in brackets is the melting point. The same below).

又,就碳化化合物而言,可列舉碳化鉻(1890℃)、碳化硼(2763℃)、碳化釩(2840℃)、碳化鎢(2870℃)、碳化鉬(2687℃)、碳化鈦(3170℃)、碳化鋯(3500℃)、碳化鈮(3500℃)、碳化鉭(3880℃)、碳化矽(2730℃)、鈦酸鉍(1203℃)等。 就氮化化合物而言,可列舉氮化鈮(2573℃)、氮化鈦(2930℃)、氮化鉭(3090℃)、氮化銦(1100℃)、氮化鎵(2500℃)、氮化銦(1100℃)、氮化鎵(2500℃)、氮化硼(2967℃)、氮化鋁(2200℃)等。 就硼化合物而言,可列舉硼(2076℃)、硼化鋁(1655℃)、硼化鉻(2373℃)、硼化鈦(2400℃)、硼化鉬(2543℃)、硼化鎢(2643℃)、硼化釩(2673℃)、硼化鋯(3100℃)、硼化鎂(800℃)、硼化鈮(3000℃)、硼化鉭(3037℃)等。 進一步地,就鹵化合物而言可列舉氟化鈰(1800℃)等,就磷酸化合物而言可列舉羥基磷灰石(1650℃)等,就鋰系化合物而言可列舉Li2 S-P2 S5 、LiCoO2 、xLi2 O-BPO4 (0.5≦x≦1.5)等,就化合物半導體而言可列舉使用II族元素與VI族元素之半導體等。Also, in terms of carbide compounds, chromium carbide (1890°C), boron carbide (2763°C), vanadium carbide (2840°C), tungsten carbide (2870°C), molybdenum carbide (2687°C), titanium carbide (3170°C ), zirconium carbide (3500°C), niobium carbide (3500°C), tantalum carbide (3880°C), silicon carbide (2730°C), bismuth titanate (1203°C), etc. In terms of nitride compounds, examples include niobium nitride (2573°C), titanium nitride (2930°C), tantalum nitride (3090°C), indium nitride (1100°C), gallium nitride (2500°C), nitrogen Indium nitride (1100°C), gallium nitride (2500°C), boron nitride (2967°C), aluminum nitride (2200°C), etc. In terms of boron compounds, boron (2076°C), aluminum boride (1655°C), chromium boride (2373°C), titanium boride (2400°C), molybdenum boride (2543°C), tungsten boride ( 2643°C), vanadium boride (2673°C), zirconium boride (3100°C), magnesium boride (800°C), niobium boride (3000°C), tantalum boride (3037°C), etc. Furthermore, examples of halogen compounds include cerium fluoride (1800°C), etc., examples of phosphoric acid compounds include hydroxyapatite (1650°C), and examples of lithium-based compounds include Li 2 SP 2 S 5 , LiCoO 2 , xLi 2 O-BPO 4 (0.5≦x≦1.5), and the like, and examples of compound semiconductors include semiconductors using Group II elements and Group VI elements.

特別是就有用於作為透明性高的塗佈膜形成材料之固體微粒子而言,可列舉氧化鎳、四氧化三鈷、氧化銦錫、氧化鎂、氧化鋯、氮化鋁、硼化鎂、氮化矽、碳化矽、氟化鈰等。In particular, solid fine particles used as materials for forming coating films with high transparency include nickel oxide, tricobalt tetroxide, indium tin oxide, magnesium oxide, zirconium oxide, aluminum nitride, magnesium boride, silicon nitride, Silicon carbide, cerium fluoride, etc.

就有用於作為固體電解質型燃料電池電解質材料之固體微粒子而言,可列舉氧化鈧、氧化釹、氧化釓、氧化釤(2300℃)、氧化釔、氧化釹、氧化鈧、LiCoO2 、硫化鋰系化合物等。 硫化鋰系化合物之具體例子,可列舉Li2 S-P2 S5 、Li2 S-P2 S5 -LiI、Li2 S-P2 S5 -LiCl、Li2 S-P2 S5 -LiBr、Li2 S-P2 S5 -Li2 O、Li2 S-P2 S5 -Li2 O-LiI、Li2 S-SiS2 、Li2 S-SiS2 -LiI、Li2 S-SiS2 -LiBr、Li2 S-SiS2 -LiCl、Li2 S-SiS2 -B2 S3 -LiI、Li2 S-SiS2 -P2 S5 -LiI、Li2 S-B2 S3 、Li2 S-P2 S5 -ZmSn(惟,m、n為正數。Z為Ge、Zn、Ga之任一者)、Li2 S-GeS2 、Li2 S-SiS2 -Li3 PO4 、Li2 S-SiS2 -Lix MOy (惟,x、y為正數。M為P、Si、Ge、B、Al、Ga、In之任一者)、Li10 GeP2 S12 、xLi2 O-BPO4 (0.5≦x≦1.5)、Lix B1-x/3 PO4 (0.75≦x<3)等。For solid fine particles used as electrolyte materials for solid electrolyte fuel cells, scandium oxide, neodymium oxide, gadolinium oxide, samarium oxide (2300°C), yttrium oxide, neodymium oxide, scandium oxide, LiCoO 2 , lithium sulfide series compounds etc. Specific examples of lithium sulfide compounds include Li 2 SP 2 S 5 , Li 2 SP 2 S 5 -LiI, Li 2 SP 2 S 5 -LiCl, Li 2 SP 2 S 5 -LiBr, Li 2 SP 2 S 5 -Li 2 O, Li 2 SP 2 S 5 -Li 2 O-LiI, Li 2 S-SiS 2 , Li 2 S-SiS 2 -LiI, Li 2 S-SiS 2 -LiBr, Li 2 S-SiS 2 - LiCl, Li 2 S-SiS 2 -B 2 S 3 -LiI, Li 2 S-SiS 2 -P 2 S 5 -LiI, Li 2 SB 2 S 3 , Li 2 SP 2 S 5 -ZmSn (only, m, n is a positive number. Z is any one of Ge, Zn, and Ga), Li 2 S-GeS 2 , Li 2 S-SiS 2 -Li 3 PO 4 , Li 2 S-SiS 2 -Li x MO y (only, x, y are positive numbers. M is any one of P, Si, Ge, B, Al, Ga, In), Li 10 GeP 2 S 12 , xLi 2 O-BPO 4 (0.5≦x≦1.5), Li x B 1-x/3 PO 4 (0.75≦x<3), etc.

就有用於作為發光二極體或光響應半導體材料之固體微粒子而言,可列舉氮化銦、氮化鎵、氮化鋁、使用II族元素與VI族元素之半導體等。 使用II族元素與VI族元素之半導體之具體例子,可列舉CuInSe2 、CuInS2 (CIS)、CuIn1-x Gax Se2 (CIGS)、Cu2 ZnSnS4 (CZTS)、CdTe系半導體等。As for solid microparticles used as light-emitting diodes or light-responsive semiconductor materials, examples include indium nitride, gallium nitride, aluminum nitride, semiconductors using group II elements and group VI elements, and the like. Specific examples of semiconductors using group II elements and group VI elements include CuInSe 2 , CuInS 2 (CIS), CuIn 1-x Ga x Se 2 (CIGS), Cu 2 ZnSnS 4 (CZTS), and CdTe-based semiconductors.

就有用於作為電阻體膜形成材料之固體微粒子而言,可列舉四氧化三鐵、氧化鈷、氧化鎳、氧化錸、氧化銥、氧化釕、鐵氧體、氧化物陶瓷等。 氧化物陶瓷之具體例子,可列舉SrVO3 、CaVO3 、LaTiO3 、SrMoO3 、CaMoO3 、SrCrO3 、CaCrO3 、LaVO3 、GdVO3 、SrMnO3 、CaMnO3 、NiCrO3 、BiCrO3 、LaCrO3 、LnCrO3 、SrRuO3 、CaRuO3 、SrFeO3 、BaRuO3 、LaMnO3 、LnMnO3 、LaFeO3 、LnFeO3 、LaCoO3 、LaRhO3 、LaNiO3 、PbRuO3 、Bi2 Ru2 O7 、LaTaO3 、BiRuO3 、LaB6 等。Examples of solid fine particles used as a material for forming a resistor film include triiron tetroxide, cobalt oxide, nickel oxide, rhenium oxide, iridium oxide, ruthenium oxide, ferrite, and oxide ceramics. Specific examples of oxide ceramics include SrVO 3 , CaVO 3 , LaTiO 3 , SrMoO 3 , CaMoO 3 , SrCrO 3 , CaCrO 3 , LaVO 3 , GdVO 3 , SrMnO 3 , CaMnO 3 , NiCrO 3 , BiCrO 3 , LaCrO 3 , LnCrO 3 , SrRuO 3 , CaRuO 3 , SrFeO 3 , BaRuO 3 , LaMnO 3 , LnMnO 3 , LaFeO 3 , LnFeO 3 , LaCoO 3 , LaRhO 3 , LaNiO 3 , PbRuO 3 , Bi 2 Ru 2 O 7 , LaTaO 3 , BiRuO 3 , LaB 6 , etc.

就有用於作為超電導材料之固體微粒子而言,可列舉YBa系氧化物、BiSrCa系氧化物、TlBaCa系氧化物等。 就有用於作為壓電陶瓷厚膜材料之固體微粒子而言,可列舉氧化鎂、三氧化二錳、四氧化三錳、氧化錳、氧化鋇、氧化鍶、鈦酸鋇、羥基磷灰石等。Examples of solid fine particles used as superconducting materials include YBa-based oxides, BiSrCa-based oxides, and TlBaCa-based oxides. Examples of solid fine particles used as piezoelectric ceramic thick film materials include magnesium oxide, manganese trioxide, trimanganese tetraoxide, manganese oxide, barium oxide, strontium oxide, barium titanate, and hydroxyapatite.

就有用於作為介電體膜材料之固體微粒子而言,可列舉氧化鈦、二氧化矽、氮化鋁、氧化鎂、鈦酸鋇、鈦酸鋯酸鉛、氧化物陶瓷等。 氧化物陶瓷之具體例子,可列舉PbTiO3 、PbZrO3 、Pb(Zr1-x Tix )O3 (0≦x≦1)之通式表示之PZT、 (Pb1-y Lay )(Zr1-x Tix )O3 (0≦x、y≦1)之通式表示之PLZT、Pb(Mg1/3 Nb2/3 )O3 、Pb(Ni1/3 Nb2/3 )O3 、Pb(Zn1/3 Nb2/3 )O3 、BaTiO3 、BaTi4 O9 、Ba2 Ti9 O20 、Ba(Zn1/3 Ta2/3 )O3 、Ba(Zn1/3 Nb2/3 )O3 、Ba(Mg1/3 Ta2/3 )O3 、Ba(Mg1/3 Ta2/3 )O3 、Ba(Co1/3 Ta2/3 )O3 、Ba(Co1/3 Nb2/3 )O3 、Ba(Ni1/3 Ta2/3 )O3 、Ba(Zr1-x Tix )O3 、(Ba1-x Srx )TiO3 、ZrSnTiO4 、CaTiO3 、MgTiO3 、SrTiO3 等。Examples of solid fine particles used as dielectric film materials include titanium oxide, silicon dioxide, aluminum nitride, magnesium oxide, barium titanate, lead zirconate titanate, and oxide ceramics. Specific examples of oxide ceramics include PZT, (Pb 1-y La y ) ( Zr PLZT, Pb(Mg 1/3 Nb 2/3 )O 3 , Pb(Ni 1/3 Nb 2/3 )O represented by the general formula of 1-x Ti x )O 3 (0≦x, y≦1) 3. Pb(Zn 1/3 Nb 2/3 )O 3 , BaTiO 3 , BaTi 4 O 9 , Ba 2 Ti 9 O 20 , Ba(Zn 1/3 Ta 2/3 )O 3 , Ba(Zn 1/3 3 Nb 2/3 )O 3 , Ba(Mg 1/3 Ta 2/3 )O 3 , Ba(Mg 1/3 Ta 2/3 )O 3 , Ba(Co 1/3 Ta 2/3 )O 3 , Ba(Co 1/3 Nb 2/3 )O 3 , Ba(Ni 1/3 Ta 2/3 )O 3 , Ba(Zr 1-x Ti x )O 3 , (Ba 1-x Sr x )TiO 3. ZrSnTiO 4 , CaTiO 3 , MgTiO 3 , SrTiO 3 , etc.

就有用於作為微粒子結合材料之固體微粒子,可列舉堇青石、鈣長石、鈣黃長石、鋁酸鈣、鋁酸鋰、鋁酸鍶、莫來石、鋁酸釔、尖晶石、氮化鋁等。There are solid microparticles used as microparticle binding materials, such as cordierite, anorthite, calcium feldspar, calcium aluminate, lithium aluminate, strontium aluminate, mullite, yttrium aluminate, spinel, aluminum nitride Wait.

本發明中,照射超短脈衝雷射光之方法,粗分有2者。1者為通過使金屬析出之透明基板進行照射之方法,與另1者為透過溶液對基板表面照射之方法。前者的情況不通過溶液,因此不易受到分散於溶液中的固體微粒子之影響。 後者的情況,可認為固體微粒子所致之於溶液中的光吸收若小,則光損失或散射被抑制,可使更多的固體微粒子分散於溶劑中,且可使所析出的金屬有效率地吸收雷射光,而不成問題,但相反地光吸收若大,則容易發生光損失或散射,此情況時,可藉由變化固體微粒子之粒子徑,或使溶液中之濃度低等,來控制使得雷射光對析出金屬之照射成為有效率。In the present invention, there are roughly two methods for irradiating ultrashort pulse laser light. One is a method of irradiating through a transparent substrate on which a metal is deposited, and the other is a method of irradiating the surface of a substrate through a solution. The former case does not pass through the solution, so it is not easily affected by the solid particles dispersed in the solution. In the latter case, it can be considered that if the light absorption caused by the solid microparticles in the solution is small, then light loss or scattering is suppressed, more solid microparticles can be dispersed in the solvent, and the precipitated metal can be efficiently removed. Absorbing laser light is not a problem, but on the contrary, if the light absorption is large, light loss or scattering will easily occur. In this case, it can be controlled by changing the particle diameter of solid particles or making the concentration in the solution low. The irradiation of laser light on the precipitated metal becomes effective.

<溶劑> 用於本發明所使用之溶液的溶劑,只要係適於固體微粒子的分散者則無特殊限定。可使分散於甲苯等之有機溶劑的固體微粒子,再分散於醇與水之混合溶劑中等,依使用來選擇溶劑。 本發明所使用之溶液的黏度並無特殊限定。欲使被覆作為芯部之金屬的固體微粒子之被覆為厚時,可考量使固體微粒子之濃度高,如此情況時,溶液的黏度增高。<Solvent> The solvent used for the solution used in the present invention is not particularly limited as long as it is suitable for dispersing solid fine particles. Solid fine particles dispersed in organic solvents such as toluene can be dispersed in a mixed solvent of alcohol and water, etc. The solvent is selected according to the use. The viscosity of the solution used in the present invention is not particularly limited. When it is desired to make the coating of the solid fine particles covering the metal as the core thick, it is considered to increase the concentration of the solid fine particles. In this case, the viscosity of the solution increases.

<其他成分> 只要不是溶解於使用於固體微粒子之分散的分散劑等者、妨礙雷射光之照射者,則亦可包含於溶液中。<Other ingredients> It may be contained in the solution as long as it does not dissolve in a dispersant used for dispersing solid fine particles or interfere with irradiation of laser light.

<雷射> 本發明中,「超短脈衝雷射」,係指具備數飛秒(1飛秒為1×10-15 秒,亦標記為fs)~數百皮秒(1皮秒為1×10-12 秒,亦標記為ps)之脈衝寬度的脈衝雷射。<Laser> In the present invention, "ultrashort pulse laser" refers to a laser with a few femtoseconds (1 femtosecond is 1×10 -15 seconds, also marked as fs) to hundreds of picoseconds (1 picosecond is 1 A pulsed laser with a pulse width of ×10 -12 seconds, also denoted as ps).

本發明所使用之超短脈衝雷射光之平均輸出,較佳為10mW以上。 又,超短脈衝雷射光之聚光徑,較佳為20μm以下。 藉由控制超短脈衝雷射光之照射量及強度,可控制所生成之金屬芯部的大小。 又,超短脈衝雷射光之重複頻率較佳為1Hz~500MHz。The average output of the ultrashort pulse laser light used in the present invention is preferably 10 mW or more. Also, the focusing diameter of the ultrashort pulse laser light is preferably 20 μm or less. By controlling the irradiation amount and intensity of the ultrashort pulse laser light, the size of the metal core formed can be controlled. Also, the repetition frequency of the ultrashort pulse laser light is preferably 1 Hz to 500 MHz.

本發明所使用之超短脈衝雷射光之波長,只要係被本發明所使用之金屬離子等所吸收的波長,且係莫耳吸光係數高的波長,則無特殊限定。若為固體微粒子之吸收少的波長,則本發明之複合體的生成效率更良好而較佳。 具體而言,將本發明所使用之超短脈衝雷射光的波長,配合於溶解於溶液之感光性的金屬化合物之吸收波長,例如以本發明所使用之金屬的莫耳吸光係數成為5l/mol・cm以上的方式選擇為較佳,但不特別限定於此。 超短脈衝雷射光之波長較佳為200nm~2000nm。 進一步地,超短脈衝雷射光之能量密度(投入於單位面積之能量)較佳為0.01mJ/cm2 ~10mJ/cm2The wavelength of the ultrashort pulse laser light used in the present invention is not particularly limited as long as it is a wavelength absorbed by the metal ions used in the present invention and has a high molar absorption coefficient. If the wavelength is less absorbed by solid fine particles, the production efficiency of the complex of the present invention will be better, which is preferable. Specifically, the wavelength of the ultrashort pulse laser light used in the present invention is matched with the absorption wavelength of the photosensitive metal compound dissolved in the solution. For example, the molar absorption coefficient of the metal used in the present invention is 5 l/mol ・It is preferable to select a form of cm or more, but it is not particularly limited thereto. The wavelength of the ultrashort pulse laser light is preferably 200nm-2000nm. Furthermore, the energy density of the ultrashort pulse laser light (energy input per unit area) is preferably 0.01mJ/cm 2 -10mJ/cm 2 .

本發明可進一步包含於溶液中浸漬基板之步驟,及使超短脈衝雷射光之束點沿著基板表面移動之步驟。 參照顯示本發明之其他實施形態的概念截面圖之圖3,基板其一面係浸漬於溶液,藉由於該狀態下使基板於掃描方向移動,可使超短脈衝雷射光之束點沿著基板表面移動。 以超短脈衝雷射照射而於溶液中析出金屬,透過非線形光學吸收,僅於雷射聚光點附近發生。因此,本發明中,藉由於離開基板之溶液中的任意位置配置雷射焦點,而不僅是基板表面上,並進行三維地掃描,可製造被固體微粒子被覆之三維金屬構造。亦即,本發明可進一步包含於溶液中浸漬基板之步驟,及使超短脈衝雷射光之束點自基板的表面移動至離開基板之溶液中的特定位置之步驟。 又,亦可藉由金屬芯部藉由蝕刻處理等而自所製造之複合體去除,將由固體微粒子所成之三維構造取出。The present invention may further include a step of immersing the substrate in the solution, and a step of moving the beam spot of the ultrashort pulse laser light along the surface of the substrate. Referring to Fig. 3, which is a conceptual cross-sectional view showing another embodiment of the present invention, one side of the substrate is immersed in the solution, and by moving the substrate in the scanning direction in this state, the beam spot of the ultrashort pulse laser light can be moved along the surface of the substrate. move. The metal is precipitated in the solution by ultrashort pulse laser irradiation, and only occurs near the laser focusing point through nonlinear optical absorption. Therefore, in the present invention, a three-dimensional metal structure covered with solid microparticles can be produced by arranging a laser focus at any position in the solution away from the substrate, not just on the surface of the substrate, and performing three-dimensional scanning. That is, the present invention may further include a step of immersing the substrate in the solution, and a step of moving the beam spot of the ultrashort pulse laser light from the surface of the substrate to a specific position in the solution away from the substrate. In addition, the three-dimensional structure made of solid fine particles can also be taken out by removing the metal core from the manufactured composite by etching or the like.

<後處理> 藉由對於以本發明之製造方法所製造之複合體以電爐、碳酸氣雷射照射等進行熱處理,可得構造安定化。又,亦可藉由將金屬芯部以蝕刻處理等自所製造之複合體去除,而僅取出被覆部分。 [實施例]<Post-processing> The structure can be stabilized by heat-treating the complex produced by the production method of the present invention in an electric furnace, carbon dioxide gas laser irradiation, or the like. Also, only the covered part can be taken out by removing the metal core part from the manufactured composite by etching or the like. [Example]

以下藉由實施例以更具體說明本發明,但本發明不限定於此等。The following examples illustrate the present invention in more detail, but the present invention is not limited thereto.

(實施例1) 於褐色瓶中置入純水6ml與乙醇10ml,置入硝酸銀溶液(1mol/l、純正化學股份有限公司)4ml,並攪拌。之後,置入二氧化矽奈米粒子分散水溶液(Sigma-aldrich,LUDOX、TM-50、奈米粒子粒徑22nm、濃度50質量%)0.7ml,再度攪拌1小時。此時之二氧化矽的濃度為2.5質量%。 將溶液自褐色瓶移至鐵氟龍(註冊商標)製之溶液容器,將作為基板之蓋玻璃蓋上容器,使基板之一面與容器中之溶液直接接觸。 接著,使用飛秒雷射(C-Fiber780、MenloSystems Ltd.),將焦點調整為基板與溶液之接觸面,以中心波長780nm、重複頻率100MHz、脈衝寬度127fs、平均雷射輸出20mW、聚光徑(理論值)2μm、能量密度6.4mJ/cm2 之條件照射。 藉由使容器以掃描速度10μm/s水平移動,於基板表面沿掃描方向連續地形成複合體。 對所形成之複合體覆蓋碳保護膜,以聚焦離子束切出切片,以顯微鏡觀察所形成之複合體的截面形狀(圖4)。確認到半圓之直徑約2.5μm銀的芯部與被覆其之厚度約2.5μm的二氧化矽奈米粒子的被覆。(Example 1) Put 6ml of pure water and 10ml of ethanol into a brown bottle, put 4ml of silver nitrate solution (1mol/l, Junzheng Chemical Co., Ltd.), and stir. Thereafter, 0.7 ml of a silica nanoparticle dispersion solution (Sigma-aldrich, LUDOX, TM-50, nanoparticle diameter 22 nm, concentration 50% by mass) was added, and stirred for another hour. The concentration of silicon dioxide at this time was 2.5% by mass. The solution was transferred from the brown bottle to a solution container made of Teflon (registered trademark), and the container was covered with a cover glass serving as a substrate, so that one side of the substrate was in direct contact with the solution in the container. Next, use a femtosecond laser (C-Fiber780, MenloSystems Ltd.) to adjust the focus to the contact surface between the substrate and the solution, with a center wavelength of 780nm, a repetition rate of 100MHz, a pulse width of 127fs, an average laser output of 20mW, and a focal diameter (Theoretical value) Conditional irradiation of 2 μm and energy density of 6.4 mJ/cm 2 . By moving the container horizontally at a scanning speed of 10 μm/s, composites were continuously formed on the surface of the substrate along the scanning direction. Cover the formed complex with a carbon protective film, cut out slices with a focused ion beam, and observe the cross-sectional shape of the formed complex with a microscope (Figure 4). A core of silver with a diameter of about 2.5 μm in a semicircle and a coating of silicon dioxide nanoparticles covering it with a thickness of about 2.5 μm were confirmed.

(實施例2) 除了於實施例1中,使用氧化鈦奈米粒子分散水溶液(NTB-1、昭和電工股份有限公司、奈米粒子粒徑10~20nm(型錄值)、濃度15質量%)1.9ml,以取代二氧化矽奈米粒子分散水溶液以外,係以與實施例1相同之條件,進行溶液之分散及雷射光照射。此時之氧化鈦濃度為1.5質量%。 以顯微鏡觀察所形成之複合體的截面形狀後,確認到半圓之直徑約5μm銀的芯部與被覆其之厚度約5μm之氧化鈦奈米粒子的被覆(圖5)。(Example 2) Except in Example 1, 1.9ml of titanium oxide nanoparticle dispersion aqueous solution (NTB-1, Showa Denko Co., Ltd., nanoparticle diameter 10-20nm (catalogue value), concentration 15% by mass) was used instead of The dispersion of the solution and the irradiation of laser light were carried out under the same conditions as in Example 1 except for the aqueous solution of silica nanoparticles dispersion. The concentration of titanium oxide at this time was 1.5% by mass. When the cross-sectional shape of the formed composite was observed with a microscope, a silver core with a semicircular diameter of about 5 μm and a coating of titanium oxide nanoparticles with a thickness of about 5 μm covering it were confirmed ( FIG. 5 ).

(實施例3~7) 於實施例1中,使用表1所示之各種類的固體微粒子以取代二氧化矽奈米粒子,以與實施例1相同之條件,進行溶液之分散及雷射光照射。 所有的實施例中均與實施例1同樣地確認到複合體形成。(Embodiments 3-7) In Example 1, various types of solid microparticles shown in Table 1 were used instead of silica nanoparticles, and the dispersion of the solution and laser irradiation were performed under the same conditions as in Example 1. In all Examples, complex formation was confirmed in the same manner as in Example 1.

Figure 02_image001
Figure 02_image001

(實施例8) 除了使容器之掃描速度為30μm/s、氧化鈦濃度為1.5質量%、平均雷射輸出變為15mW、25mW、30mW以外,係以與實施例2相同之條件,進行溶液之分散及雷射光照射。 以顯微鏡觀察所得到之複合體的截面,將氧化鈦之被膜的截面積與平均雷射輸出之關係整理於圖6。 由圖6可知,隨著雷射輸出增加,可得到具有大的截面積之複合體。(Embodiment 8) Except that the scanning speed of the container was 30 μm/s, the concentration of titanium oxide was 1.5% by mass, and the average laser output was changed to 15mW, 25mW, and 30mW, the solution dispersion and laser light irradiation were carried out under the same conditions as in Example 2. . The cross-section of the obtained complex was observed with a microscope, and the relationship between the cross-sectional area of the titanium oxide film and the average laser output is shown in FIG. 6 . It can be seen from Fig. 6 that as the laser output increases, a composite with a large cross-sectional area can be obtained.

(實施例9~12) 於實施例6中,將平均雷射輸出固定為25mW,將原本為1.5質量%之氧化鈦濃度減少為0.8質量%(實施例9)、0.3質量%(實施例10)、0.2質量%(實施例11)、0.01質量%(實施例12),與實施例6同樣地進行溶液之分散及雷射光照射。 以顯微鏡觀察所得到之複合體的截面。 將氧化鈦之被膜的截面積與氧化鈦濃度之關係整理於圖7。 由圖7可知,變化氧化鈦濃度時,截面積會變化,但濃度只要為0.1質量%以上,則即使為低的氧化鈦濃度亦得到良好的複合體。(Embodiments 9-12) In Example 6, the average laser output was fixed at 25mW, and the concentration of titanium oxide, which was originally 1.5% by mass, was reduced to 0.8% by mass (Example 9), 0.3% by mass (Example 10), and 0.2% by mass (Example 10). Example 11), 0.01% by mass (Example 12), dispersion of the solution and laser light irradiation were performed in the same manner as in Example 6. The cross section of the obtained composite was observed with a microscope. The relationship between the cross-sectional area of the titanium oxide film and the concentration of titanium oxide is shown in FIG. 7 . As can be seen from FIG. 7 , the cross-sectional area changes when the titanium oxide concentration is changed, but if the concentration is 0.1% by mass or more, a good composite can be obtained even at a low titanium oxide concentration.

(實施例13~15) 除了於實施例2中,使氧化鈦濃度為1.5質量%,且使奈米粒子粒徑成為更大者以外,係以與實施例2相同之條件,進行溶液之分散及雷射光照射。 以顯微鏡觀察使奈米粒子粒徑為0.1μm(實施例13)、0.5μm(實施例14)、1.0μm(實施例15)時所得之複合體的截面之結果,確認到不管何者均得到形成有被覆層之良好的複合體。 (實施例16~19) 將實施例1之硝酸銀溶液(1mol/l)4ml,置換為硫酸銅(實施例16)、四氯金(III)酸四水合物(實施例17)、硫酸鎳(實施例18)、硝酸鉛(II)(實施例19)之各水溶液(1mol/l) 4ml,於褐色瓶中與純水6ml及乙醇10ml一起攪拌。之後,置入二氧化矽奈米粒子分散水溶液(Sigma-aldrich,LUDOX、TM-50、奈米粒子粒徑22nm、濃度50質量%)0.7ml,再度攪拌1小時,以與實施例1相同之條件,進行溶液之分散及雷射光照射。此時之二氧化矽的濃度為2.5質量%。 實施例16~19的所有情況均確認到二氧化矽微粒子之聚集,於截面之顯微鏡觀察中亦確認得到形成有被覆層之良好的複合體。(Examples 13-15) Dispersion of the solution and irradiation of laser light were performed under the same conditions as in Example 2, except that the titanium oxide concentration was 1.5% by mass and the nanoparticle size was made larger. As a result of microscopic observation of the cross-sections of the complexes obtained when the particle size of the nanoparticles was 0.1 μm (Example 13), 0.5 μm (Example 14), and 1.0 μm (Example 15), it was confirmed that any of them were formed. Good composite with coating. (Example 16-19) Silver nitrate solution (1mol/l) 4ml of embodiment 1 is replaced by copper sulfate (embodiment 16), tetrachloroauric (III) acid tetrahydrate (embodiment 17), nickel sulfate (embodiment 18), lead nitrate (II) 4ml of each aqueous solution (1mol/l) of (Example 19) was stirred together with 6ml of pure water and 10ml of ethanol in a brown bottle. Afterwards, 0.7ml of silicon dioxide nanoparticle dispersion solution (Sigma-aldrich, LUDOX, TM-50, nanoparticle particle size 22nm, concentration 50% by mass) was placed, and stirred again for 1 hour, with the same method as in Example 1. Conditions, dispersion of the solution and laser light irradiation. The concentration of silicon dioxide at this time was 2.5% by mass. In all cases of Examples 16 to 19, the aggregation of silica fine particles was confirmed, and it was also confirmed in cross-sectional microscopic observation that a good composite body with a coating layer was formed.

[圖1]顯示本發明之一實施形態之概念截面圖。 [圖2]顯示本發明之原理之概念截面圖。 [圖3]顯示本發明之其他實施形態之概念截面圖。 [圖4]實施例1所製造之複合體之截面的顯微鏡照片。 [圖5]實施例2所製造之複合體之截面的顯微鏡照片。 [圖6]顯示被膜之截面積與平均雷射輸出的關係之圖。 [圖7]顯示氧化鈦濃度與被膜之截面積的關係之圖。[ Fig. 1 ] A conceptual sectional view showing an embodiment of the present invention. [ Fig. 2 ] A conceptual sectional view showing the principle of the present invention. [ Fig. 3 ] A conceptual cross-sectional view showing another embodiment of the present invention. [ Fig. 4 ] Micrograph of a cross-section of the composite produced in Example 1. [ Fig. 5 ] Micrograph of a cross-section of the composite produced in Example 2. [ Fig. 6 ] A graph showing the relationship between the cross-sectional area of the coating and the average laser output. [ Fig. 7 ] A graph showing the relationship between the concentration of titanium oxide and the cross-sectional area of the film.

Claims (12)

一種由經固體微粒子被覆的金屬所構成之複合體之製造方法,其特徵為包含藉由對含有金屬之離子、膠體,及/或錯合物之溶液,照射超短脈衝雷射光,使金屬析出,將分散於前述溶液中的由金屬氧化物粒子、非金屬氧化物粒子,或陶瓷粒子所構成之固體微粒子聚集,被覆於前述所析出的金屬之步驟,前述超短脈衝雷射光之能量密度為0.01mJ/cm2~10mJ/cm2,前述固體微粒子具有0.005μm~1μm之直徑。 A method for manufacturing a composite body composed of metals coated with solid microparticles, characterized in that the metal is precipitated by irradiating ultrashort pulse laser light to a solution containing metal ions, colloids, and/or complexes , the step of aggregating solid microparticles composed of metal oxide particles, non-metal oxide particles, or ceramic particles dispersed in the aforementioned solution, and coating the aforementioned precipitated metal, the energy density of the aforementioned ultrashort pulse laser light is: 0.01mJ/cm 2 ~10mJ/cm 2 , the aforementioned solid particles have a diameter of 0.005μm~1μm. 如請求項1之製造方法,其中前述金屬係選自由銀、銅、鎳、鉛、錫、鉑及金所成之群。 The manufacturing method according to claim 1, wherein the aforementioned metal is selected from the group consisting of silver, copper, nickel, lead, tin, platinum and gold. 如請求項1或請求項2之製造方法,其中前述固體微粒子之熔點為500℃~3500℃。 The manufacturing method of claim 1 or claim 2, wherein the melting point of the aforementioned solid fine particles is 500°C to 3500°C. 如請求項1或請求項2之製造方法,其中前述固體微粒子之於前述溶液中之濃度,為0.01質量%~3.0質量%。 The manufacturing method of Claim 1 or Claim 2, wherein the concentration of the aforementioned solid fine particles in the aforementioned solution is 0.01% by mass to 3.0% by mass. 如請求項1或請求項2之製造方法,其中前述超短脈衝雷射光之波長為200nm~2000nm。 The manufacturing method of claim 1 or claim 2, wherein the wavelength of the ultrashort pulse laser light is 200nm~2000nm. 如請求項1或請求項2之製造方法,其中前述超短脈衝雷射光之重複頻率為1Hz~500MHz。 The manufacturing method of Claim 1 or Claim 2, wherein the repetition frequency of the aforementioned ultrashort pulse laser light is 1 Hz to 500 MHz. 如請求項1或請求項2之製造方法,其進一步包含於前述溶液中浸漬基板之步驟,及使前述超短脈衝雷射光之束點沿著前述基板的表面移動之步驟。 The manufacturing method according to claim 1 or claim 2, which further includes the step of dipping the substrate in the aforementioned solution, and the step of moving the beam spot of the aforementioned ultrashort pulse laser light along the surface of the aforementioned substrate. 如請求項1或請求項2之製造方法,其進一步包含於前述溶液中浸漬基板之步驟,及使前述超短脈衝雷射光之束點自前述基板的表面,移動至離開前述基板之前述溶液中的特定位置之步驟。 The manufacturing method according to claim 1 or claim 2, which further includes the step of immersing the substrate in the aforementioned solution, and moving the beam spot of the aforementioned ultrashort pulse laser light from the surface of the aforementioned substrate to the aforementioned solution away from the aforementioned substrate steps at a specific location. 一種複合體,其係由經固體微粒子被覆的金屬所構成之複合體,其特徵為前述金屬係於溶液中作為金屬之離子、膠體,及/或錯合物而存在,可藉由對該溶液照射超短脈衝雷射光而析出者,前述固體微粒子為金屬氧化物粒子、非金屬氧化物粒子,或陶瓷粒子,前述固體微粒子具有0.005μm~1μm之直徑,前述金屬形成芯部,且該芯部於其內側具有空洞。 A composite body, which is a composite body composed of metal coated with solid particles, characterized in that the metal exists in a solution as metal ions, colloids, and/or complexes, which can be obtained by using the solution Those precipitated by irradiating ultrashort pulse laser light, the aforementioned solid fine particles are metal oxide particles, non-metallic oxide particles, or ceramic particles, the aforementioned solid fine particles have a diameter of 0.005 μm to 1 μm, the aforementioned metal forms the core, and the core There is a cavity inside it. 如請求項9之複合體,其中前述金屬係選自由銀、 銅、鎳、鉛、錫、鉑及金所成之群。 As the complex of claim 9, wherein the aforementioned metal is selected from silver, Group of copper, nickel, lead, tin, platinum and gold. 如請求項9或請求項10之複合體,其中前述固體微粒子之熔點為500℃~3500℃。 As in the composite of claim 9 or claim 10, wherein the melting point of the aforementioned solid particles is 500°C to 3500°C. 如請求項9或請求項10之複合體,其中前述固體微粒子具有0.005μm~1μm之直徑。 The composite of claim 9 or claim 10, wherein the aforementioned solid particles have a diameter of 0.005 μm to 1 μm.
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