TWI784112B - Separation device - Google Patents

Separation device Download PDF

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TWI784112B
TWI784112B TW107146802A TW107146802A TWI784112B TW I784112 B TWI784112 B TW I784112B TW 107146802 A TW107146802 A TW 107146802A TW 107146802 A TW107146802 A TW 107146802A TW I784112 B TWI784112 B TW I784112B
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heating
workpiece
unit
sheet
expansion
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TW107146802A
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TW201929067A (en
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服部篤
植木篤
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日商迪思科股份有限公司
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836Wafer tapes, e.g. grinding or dicing support tapes
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67092Apparatus for mechanical treatment
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67098Apparatus for thermal treatment
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67098Apparatus for thermal treatment
    • H01L21/67103Apparatus for thermal treatment mainly by conduction
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67242Apparatus for monitoring, sorting or marking
    • H01L21/67248Temperature monitoring
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67242Apparatus for monitoring, sorting or marking
    • H01L21/67259Position monitoring, e.g. misposition detection or presence detection

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Dicing (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
  • Separation By Low-Temperature Treatments (AREA)
  • Sink And Installation For Waste Water (AREA)

Abstract

[課題]本發明提供一種分割裝置,即使在擴張片的鬆弛方式及延伸方式中任一者不同的情況下,都能夠恰當地加熱擴張片鬆弛的部分。[解決手段]分割裝置10具備框架固定部40、片擴張單元50以及加熱單元60。加熱單元60係加熱被擴張的擴張片的環狀區域且使擴張片的鬆弛部分收縮,具備多個加熱部63、轉動部以及加熱位置調整部。多個加熱部63係沿著環狀區域在圓周方向上設置。轉動部係使加熱部63沿著擴張片的環狀區域在圓周方向上移動。加熱位置調整部係在工件的徑方向上或與擴張片的遠近方向上調整加熱部63的位置。[Problem] The present invention provides a dividing device capable of appropriately heating the loosened portion of the expansion sheet even when either the relaxation method or the stretching method of the expansion sheet is different. [Solution] The dividing device 10 includes a frame fixing unit 40 , a sheet expanding unit 50 , and a heating unit 60 . The heating unit 60 heats the expanded annular region of the expanded sheet and shrinks the slack portion of the expanded sheet, and includes a plurality of heating units 63 , a rotating unit, and a heating position adjusting unit. The plurality of heating portions 63 are provided in the circumferential direction along the annular region. The rotating part moves the heating part 63 in the circumferential direction along the annular region of the expanding sheet. The heating position adjustment unit adjusts the position of the heating unit 63 in the radial direction of the workpiece or in the direction of distance from the expansion sheet.

Description

分割裝置Separation device

本發明是關於一種分割裝置。The present invention relates to a dividing device.

已知有使擴張片黏貼在沿著預定的分割預定線形成有分割起點之板狀的工件,該分割預定線用以分割個別的元件晶片,藉由擴張此擴張片而將外力施加至工件,並從分割起點沿著分割預定線分割為個別的元件晶片的方法(例如參閱專利文獻1)。 [習知技術文獻] [專利文獻]It is known that an expansion sheet is pasted on a plate-shaped workpiece having a division starting point formed along a predetermined dividing line for dividing individual element chips, and an external force is applied to the workpiece by expanding the expansion sheet. And a method of dividing into individual element wafers along a planned dividing line from the starting point of dividing (for example, refer to Patent Document 1). [Prior art documents] [Patent documents]

[專利文獻1] 日本特許第5791866號公報[Patent Document 1] Japanese Patent No. 5791866

[發明所欲解決的課題] 在如上述的方法中,已擴張之擴張片在工件外周上鬆弛的部分,有造成其後之搬送步驟中的障礙之可能性。此外,在此方法中,由於此擴張片會鬆弛,藉由將擴張片擴張而拉開的相鄰元件晶片之間隔會收縮,而有因元件晶片彼此間的磨擦產生崩缺的可能性。在專利文獻1的方法中,由於要降低這些可能性,藉由加熱擴張片鬆弛的部分,使該鬆弛收縮。[Problems to be Solved by the Invention] In the above-mentioned method, the loose portion of the expanded expansion piece on the outer periphery of the workpiece may cause an obstacle in the subsequent conveying step. In addition, in this method, since the expansion sheet is loosened, the space between the adjacent element wafers pulled apart by expanding the expansion sheet is contracted, and there is a possibility of chipping due to friction between the element wafers. In the method of Patent Document 1, in order to reduce these possibilities, the slack portion of the expansion sheet is heated to shrink the slack.

然而,分別根據元件晶片的形狀及大小,以及擴張片的捲繞狀態等,擴張片的鬆弛方式及延伸方式有很大的不同。而且,由擴張片鬆弛而產生擴張片向與工件正面正交的方向突出的形狀區域,會根據此擴張片的鬆弛方式及延伸方式而有不同。在專利文獻1的方法中,具有對於此擴張片的形狀區域不同的情形無法充分應對的問題。However, depending on the shape and size of the device wafer, the winding state of the expansion sheet, and the like, the manner of relaxation and extension of the expansion sheet differs greatly. Furthermore, the shape region where the expansion piece protrudes in a direction perpendicular to the front surface of the workpiece due to relaxation of the expansion piece varies depending on the way the expansion piece is relaxed and extended. In the method of patent document 1, there exists a problem that it cannot fully cope with the case where the shape area|region of this expansion piece differs.

本發明係鑑於此問題而提出,其目的在於提供一種分割裝置,即使在擴張片的鬆弛方式及延伸方式中任一者不同的情況下,都能夠恰當地加熱擴張片鬆弛的部分。The present invention has been made in view of this problem, and an object of the present invention is to provide a dividing device capable of properly heating the slack portion of the expansion sheet even when the expansion sheet is loosened or stretched in a different manner.

[解決課題的技術手段] 為解決上述課題並達成目的,本發明之分割裝置係一種將工件單元的擴張片擴張並分割工件的分割裝置,該工件單元由沿著分割預定線形成有分割起點的板狀的工件、黏貼有該工件的該擴張片以及黏貼有該擴張片的環狀框架所組成,該分割裝置具備:框架固定部,其固定該工件單元的該環狀框架;片擴張單元,其將該工件外周與該環狀框架內周之間的該擴張片的環狀區域往與該工件的正面正交的方向推壓且擴張該擴張片,並從該分割起點將該工件斷裂;以及加熱單元,其加熱該被擴張的該擴張片的該環狀區域,且使該擴張片的鬆弛部分收縮;其中,該加熱單元係具備:多個加熱部,其沿著該環狀區域的圓周方向設置;轉動部,其使該加熱部沿著該擴張片的該環狀區域在圓周方向上移動;以及加熱位置調整部,其在該工件的徑方向上或與該擴張片的遠近方向上調整該加熱部的位置。[Technical means to solve the problem] In order to solve the above-mentioned problems and achieve the object, the dividing device of the present invention is a dividing device that expands the expansion sheet of the workpiece unit and divides the workpiece. Composed of a plate-shaped workpiece, the expansion sheet attached to the workpiece, and an annular frame attached to the expansion sheet, the dividing device includes: a frame fixing part, which fixes the annular frame of the workpiece unit; a sheet expansion unit, It pushes the annular region of the expansion sheet between the outer circumference of the workpiece and the inner circumference of the annular frame in a direction perpendicular to the front of the workpiece and expands the expansion sheet, and breaks the workpiece from the splitting starting point; and a heating unit, which heats the expanded annular region of the expanded sheet, and shrinks the slack part of the expanded sheet; wherein, the heating unit is provided with: a plurality of heating parts, which are arranged along the annular region Arranged in the circumferential direction; a rotating part, which moves the heating part in the circumferential direction along the annular region of the expansion piece; Adjust the position of the heating part.

多個該加熱部也可以分別被調整為不同溫度。A plurality of the heating units may be adjusted to different temperatures, respectively.

[發明功效] 本發明之分割裝置,即使在擴張片的鬆弛方式及延伸方式中任一者不同的情況下,都會發揮能夠恰當地加熱擴張片鬆弛的部分之效果。[Advantages of the Invention] The dividing device of the present invention exhibits the effect of being able to properly heat the relaxed portion of the expansion sheet even when either the relaxation method or the stretching method of the expansion sheet is different.

參閱圖式並詳細說明用以實施本發明的實施例(實施方式)。本發明不為以下實施方式所記載之內容所限定。此外,對於以下所記載的構成要素,包含本領域的技術人員能輕易思及或實質相同者。進一步,以下所記載的構成可以作適當的組合。此外,在不脫離本發明主旨的範圍內,可以對構成進行各種的省略、置換或變更。An example (embodiment mode) for carrying out the present invention will be described in detail with reference to the drawings. The present invention is not limited by the contents described in the following embodiments. In addition, components described below include those that can be easily conceived by those skilled in the art or that are substantially the same. Furthermore, the configurations described below can be appropriately combined. In addition, various omissions, substitutions, or changes can be made in the configuration without departing from the scope of the present invention.

(實施方式1) 圖1是表示實施方式1之分割裝置10(參閱圖2)的分割對象之工件單元100的一例之俯視圖。首先,根據圖式說明本發明實施方式1之分割裝置10的分割對象之工件單元100。(Embodiment 1) FIG. 1 is a plan view showing an example of a workpiece unit 100 to be divided by a dividing device 10 (see FIG. 2 ) according to Embodiment 1. As shown in FIG. First, the workpiece unit 100 to be divided by the dividing device 10 according to Embodiment 1 of the present invention will be described based on the drawings.

實施方式1之分割裝置10(參閱圖2)的分割對象之工件單元100是如圖1所示,具有工件101、黏貼有工件101之正面102的背面側的背面之擴張片106,以及黏貼有擴張片106的外周部分之環狀框架107。工件101被黏貼在擴張片106之中央部分上。擴張片106在環狀框架107之內周的內緣與工件101之外周的外緣之間形成有環狀區域108。The workpiece unit 100 of the dividing object of the dividing device 10 (referring to FIG. 2 ) of Embodiment 1 is as shown in FIG. The ring frame 107 of the outer peripheral portion of the expansion sheet 106 . The workpiece 101 is pasted on the central portion of the expansion sheet 106 . The expansion piece 106 forms an annular region 108 between the inner edge of the inner periphery of the annular frame 107 and the outer edge of the outer periphery of the workpiece 101 .

工件101是以矽、藍寶石、砷化鎵或SiC(碳化矽)等作為基板的圓板狀半導體晶圓或光學元件晶圓。工件101是如圖1所示,在以分別延伸於正面102之互相交叉的A方向及B方向上之分割預定線103所劃分的各區域中,形成正方形的元件晶片105。工件101沿著分割預定線103形成改質層109。The workpiece 101 is a disc-shaped semiconductor wafer or an optical element wafer having silicon, sapphire, gallium arsenide, SiC (silicon carbide), or the like as a substrate. As shown in FIG. 1 , the workpiece 101 forms a square element wafer 105 in each area divided by the dividing line 103 extending on the front surface 102 and intersecting with each other in the A direction and the B direction. Modified layer 109 is formed on workpiece 101 along planned dividing line 103 .

工件101沿著分割預定線103,從背面側照射具有穿透性之波長的雷射光束,以形成改質層109。改質層109是意指密度、折射率、機械強度或其他物理特性成為與周圍不同狀態之區域,能夠例示為熔融處理區域、裂痕區域、絕緣破壞區域、折射率變化區域以及混合了該些區域的區域。改質層109是用於分割為個別元件晶片105之分割起點。The workpiece 101 is irradiated with a laser beam having a penetrating wavelength from the back side along the planned dividing line 103 to form the modified layer 109 . The modified layer 109 refers to a region in which the density, refractive index, mechanical strength, or other physical properties are different from those of the surrounding area, and can be exemplified by a molten processed area, a crack area, a dielectric breakdown area, a refractive index changed area, and a mixture of these areas. Area. Modified layer 109 is a division starting point for division into individual element wafers 105 .

擴張片106是由具有伸縮性的樹脂所構成,並具有被加熱時會收縮的熱收縮性。擴張片106的伸縮性具有各向異性,且具有容易擴張的方向和不容易擴張的方向。擴張片106是以容易擴張的方向朝向B方向而黏貼,B方向處會較A方向容易擴張,亦即容易延伸。擴張片106在被黏貼到工件101上之前,是被捲繞成滾筒狀,具有流動方向之MD(Machine Direction,縱向方向)方向,以及與流動方向正交之垂直方向的TD(Transverse Direction,橫向方向)方向。在本實施方式中,擴張片106雖是MD方向處比TD方向容易擴張,以MD方向與B方向一致且TD方向與A方向一致的方式黏貼,但本發明中並不限定於此,也可以是TD方向處比MD方向容易擴張,以TD方向與B方向一致且MD方向與A方向一致的方式黏貼。The expansion sheet 106 is made of stretchable resin, and has heat shrinkability that shrinks when heated. The stretchability of the expansion sheet 106 is anisotropic, and has a direction in which it is easy to expand and a direction in which it is not easy to expand. The expansion sheet 106 is pasted toward the B direction in a direction that is easy to expand, and the B direction is easier to expand than the A direction, that is, it is easier to extend. Before the expansion sheet 106 is pasted on the workpiece 101, it is wound into a drum shape, which has the MD (Machine Direction, longitudinal direction) direction of the flow direction, and the TD (Transverse Direction, transverse direction) which is perpendicular to the flow direction. direction) direction. In this embodiment, although the expansion sheet 106 is easier to expand in the MD direction than in the TD direction, and is pasted in such a way that the MD direction coincides with the B direction and the TD direction coincides with the A direction, the present invention is not limited thereto, and may be It is easier to expand in the TD direction than in the MD direction, and paste in such a way that the TD direction is consistent with the B direction and the MD direction is consistent with the A direction.

圖2是表示實施方式1之分割裝置10的構成例之立體圖。圖2所示分割裝置10是將擴張片106擴張,並沿著分割預定線103將形成有改質層109的工件101分割為個別的元件晶片105之裝置。分割裝置10如圖2所示,具備腔室20、保持台30、框架固定部40、片擴張單元50、加熱單元60以及控制單元70。另外,圖2的X方向及Y方向都包含在水平方向上,彼此正交。此外,圖2的Z方向即是垂直方向,與X方向和Y方向正交。FIG. 2 is a perspective view showing a configuration example of the dividing device 10 according to the first embodiment. Dividing device 10 shown in FIG. 2 is a device that expands expansion sheet 106 and divides workpiece 101 on which modified layer 109 is formed into individual element wafers 105 along planned dividing line 103 . As shown in FIG. 2 , the dividing apparatus 10 includes a chamber 20 , a holding table 30 , a frame fixing unit 40 , a sheet expanding unit 50 , a heating unit 60 , and a control unit 70 . In addition, both the X direction and the Y direction in FIG. 2 are included in the horizontal direction, and are orthogonal to each other. In addition, the Z direction in FIG. 2 is the vertical direction, which is orthogonal to the X direction and the Y direction.

腔室20形成為上部有開口的箱狀。腔室20容納有保持台30、框架固定部40的框架載置板41以及片擴張單元50。The chamber 20 is formed in a box shape with an opening at the top. The chamber 20 accommodates the holding table 30 , the frame mounting plate 41 of the frame fixing portion 40 , and the sheet expanding unit 50 .

保持台30具有透過擴張片106吸引保持工件單元100之工件101的保持面31。保持台30為圓板形狀,具備由不銹鋼等金屬所組成的圓板狀框體32,以及用多孔陶瓷等多孔質材構成且被框體32圍繞之圓板狀吸附部33。框體32及吸附部33之上表面是配置在同一平面上,且構成為吸引保持工件101的保持面31。吸附部33是與工件101大致相同的直徑。保持台30是透過由搬送單元80搬送來的工件單元100之擴張片106將工件101的背面側載置於保持面31。保持台30是藉由吸附部33被連接至真空吸引源34,且吸附部33被由真空吸引源34吸引,而能夠將工件101之背面側吸引保持在保持面31上。The holding table 30 has a holding surface 31 that attracts and holds the workpiece 101 of the workpiece unit 100 through the expansion sheet 106 . The holding table 30 is disc-shaped, and includes a disc-shaped frame 32 made of metal such as stainless steel, and a disc-shaped adsorption portion 33 made of a porous material such as porous ceramics and surrounded by the frame 32 . The upper surfaces of the frame body 32 and the suction part 33 are arranged on the same plane, and are configured as the holding surface 31 for suction and holding the workpiece 101 . The suction portion 33 has substantially the same diameter as the workpiece 101 . The holding table 30 places the back side of the workpiece 101 on the holding surface 31 through the expansion piece 106 of the workpiece unit 100 conveyed by the conveying unit 80 . The holding table 30 is connected to the vacuum suction source 34 through the suction unit 33 , and the suction unit 33 is sucked by the vacuum suction source 34 to suck and hold the back side of the workpiece 101 on the holding surface 31 .

框架固定部40固定工件單元100的環狀框架107。框架固定部40具備框架載置板41以及框架壓板42。框架載置板41形成為設置有平面形狀為圓形的開口部43,且上表面44與水平方向平行而平坦地形成之板狀。框架載置板41的開口部43之內徑是形成為略大於環狀框架107的內徑。框架載置板41是將保持台30配置於開口部43內,且開口部43與保持台30同軸地配置。此外,框架載置板41在四角安裝有氣缸45的活塞桿45-1,且配置為藉由活塞桿45-1伸縮而升降自如。框架載置板41在水平方向上移動自如地設置於上表面44的四角,且藉由在水平方向上移動調整環狀框架107的位置,並設置有將工件101定位於與保持台30之吸附部33同軸的位置之中心導引件46。The frame fixing portion 40 fixes the ring frame 107 of the workpiece unit 100 . The frame fixing unit 40 includes a frame mounting plate 41 and a frame holding plate 42 . The frame mounting plate 41 is formed in a plate shape in which an opening 43 having a circular planar shape is provided, and an upper surface 44 is formed flat and parallel to the horizontal direction. The inner diameter of the opening 43 of the frame mounting plate 41 is formed to be slightly larger than the inner diameter of the annular frame 107 . In the frame mounting plate 41 , the holding table 30 is arranged in the opening 43 , and the opening 43 is arranged coaxially with the holding table 30 . In addition, the frame mounting plate 41 is provided with piston rods 45-1 of air cylinders 45 at four corners, and is arranged so as to be able to move up and down freely when the piston rods 45-1 expand and contract. The frame mounting plate 41 is provided on the four corners of the upper surface 44 freely movable in the horizontal direction, and the position of the annular frame 107 is adjusted by moving in the horizontal direction, and is provided with an adsorption mechanism for positioning the workpiece 101 on the holding table 30 The center guide 46 is positioned coaxially with the portion 33.

框架壓板42是形成為幾乎與框架載置板41相同尺寸的板狀,且在中央設置有與開口部43相同尺寸的圓形開口部47。框架壓板42安裝在氣缸48的活塞桿48-1之前端,藉由活塞桿48-1伸縮,而移動自如地橫越框架載置板41上方的位置與從框架載置板41上方撤離的位置。框架壓板42在四角設置有中心導引件46能夠插入的長孔49。The frame holding plate 42 is formed into a plate shape having substantially the same size as the frame mounting plate 41 , and a circular opening 47 having the same size as the opening 43 is provided at the center. The frame pressing plate 42 is installed on the front end of the piston rod 48-1 of the cylinder 48, and the piston rod 48-1 is stretched to move freely across the position above the frame mounting plate 41 and the position withdrawn from the frame mounting plate 41. . The frame holding plate 42 is provided with elongated holes 49 at four corners into which the center guide 46 can be inserted.

框架固定部40在框架壓板42定位在從框架載置板41的上方撤離的位置,且中心導引件46彼此互相分離的狀態下,由搬送單元80搬送來的工件單元100的環狀框架107被載置在框架載置板41的上表面44上。框架固定部40使中心導引件46彼此靠近,以定位工件單元100的工件101。框架固定部40將框壓板42定位在框架載置板41的上方,使氣缸45的活塞桿45-1伸展,使框架載置板41上昇,並將工件單元100的環狀框架107夾在框架載置板41與框架壓板42之間以固定。In the frame fixing part 40, the ring-shaped frame 107 of the workpiece unit 100 conveyed by the conveying unit 80 is fixed in a state where the frame holding plate 42 is positioned at a position evacuated from above the frame mounting plate 41 and the center guides 46 are separated from each other. It is placed on the upper surface 44 of the frame mounting plate 41 . The frame fixing part 40 brings the center guides 46 close to each other to position the workpiece 101 of the workpiece unit 100 . The frame fixing part 40 positions the frame pressing plate 42 above the frame mounting plate 41, extends the piston rod 45-1 of the air cylinder 45, raises the frame mounting plate 41, and clamps the annular frame 107 of the workpiece unit 100 on the frame. The mounting plate 41 is fixed to the frame pressing plate 42 .

圖3是在圖2之片擴張單元50的III-III剖面之剖面圖。圖4是在圖2之片擴張單元50的IV-IV剖面之剖面圖。圖2的III-III剖面與IV-IV剖面皆是與XZ平面平行的面。圖3與圖4分別表示保持台30與框架固定部40在垂直方向中不同位置的情況下之各個狀態。片擴張單元50藉由使保持台30與框架固定部40沿著垂直方向的軸心相對地移動到互相分離的位置上,將環狀區域108往與工件101的正面102正交的方向推壓以將擴張片106擴張,並從作為分割起點之改質層109將工件101斷裂。片擴張單元50是如圖3及圖4所示,具備上推構件51以及升降單元52。FIG. 3 is a sectional view of the section III-III of the sheet expansion unit 50 in FIG. 2 . FIG. 4 is a cross-sectional view taken along line IV-IV of the sheet expansion unit 50 of FIG. 2 . Both the section III-III and the section IV-IV in FIG. 2 are planes parallel to the XZ plane. FIG. 3 and FIG. 4 show respective states when the holding table 30 and the frame fixing portion 40 are at different positions in the vertical direction. The sheet expanding unit 50 pushes the ring-shaped area 108 in a direction perpendicular to the front surface 102 of the workpiece 101 by moving the holding table 30 and the frame fixing portion 40 to positions separated from each other relative to the axis center in the vertical direction. The expansion piece 106 is expanded, and the workpiece 101 is broken from the modified layer 109 as the starting point of division. The sheet expanding unit 50 includes a push-up member 51 and a lifting unit 52 as shown in FIGS. 3 and 4 .

上推構件51形成為圓筒狀,並形成為外徑比載置於框架載置板41之上表面44的環狀框架107的內徑小,內徑比黏貼於擴張片106之工件101與保持台30的外徑大。上推構件51在內側配置保持台30,並被配置為與保持台30同軸。在上推構件51的上端轉動自如地安裝有配置在與保持台30的保持面31相同平面的滾輪構件53。滾輪構件53是如圖4所示在上推構件51將擴張片106上推時,會緩和與擴張片106間的摩擦。The push-up member 51 is formed in a cylindrical shape, and its outer diameter is smaller than the inner diameter of the annular frame 107 placed on the upper surface 44 of the frame mounting plate 41, and the inner diameter is smaller than that of the workpiece 101 and the The outer diameter of the holding table 30 is large. The push-up member 51 is arranged inside the holding table 30 and arranged coaxially with the holding table 30 . A roller member 53 disposed on the same plane as the holding surface 31 of the holding table 30 is rotatably attached to an upper end of the push-up member 51 . The roller member 53 eases the friction with the expansion sheet 106 when the push-up member 51 pushes up the expansion sheet 106 as shown in FIG. 4 .

升降單元52具備氣缸54和55。在氣缸54的活塞桿54-1上安裝有保持台30,且配置為藉由活塞桿54-1伸縮而升降自如。在氣缸55的活塞桿55-1上安裝有上推構件51,且配置為藉由活塞桿55-1伸縮而升降自如。升降單元52是藉由氣缸54和55,使保持台30與上推構件51一體地升降。The lift unit 52 includes air cylinders 54 and 55 . The holding table 30 is attached to the piston rod 54-1 of the air cylinder 54, and is arrange|positioned so that it may move up and down freely when the piston rod 54-1 expands and contracts. The push-up member 51 is attached to the piston rod 55-1 of the air cylinder 55, and is arranged so as to be able to move up and down freely when the piston rod 55-1 expands and contracts. The lifting unit 52 lifts and lowers the holding table 30 integrally with the push-up member 51 by means of air cylinders 54 and 55 .

片擴張單元50是從安裝在上推構件51上端的滾輪構件53與保持面31位在比框架載置板41之上表面44下方的狀態,如圖4所示,藉由升降單元52使上推構件51與保持面30一體地上升直到滾輪構件53與保持面31位在比框架載置板41的上表面44更上方,來使擴張片106在平面方向上擴張。片擴張單元50從如圖4所示使擴張片106在平面方向上擴張的狀態,被下降直到滾輪構件53與保持面31成為與框架固定部40之上表面44相同平面的狀態。在片擴張單元50下降直到滾輪構件53與保持面31成為與框架固定部40之上表面44相同平面的狀態時,擴張片106的環狀區域108上,形成擴張片106鬆弛而構成的鬆弛部分108-2(參閱圖1、圖9及圖11)。The sheet expansion unit 50 is from the state that the roller member 53 installed on the upper end of the push-up member 51 and the holding surface 31 are located below the upper surface 44 of the frame mounting plate 41, as shown in FIG. The push member 51 rises integrally with the holding surface 30 until the roller member 53 and the holding surface 31 are located above the upper surface 44 of the frame mounting plate 41 to expand the expansion piece 106 in the planar direction. The sheet expansion unit 50 is lowered from the state where the expansion sheet 106 is expanded in the planar direction as shown in FIG. When the sheet expansion unit 50 descends until the roller member 53 and the holding surface 31 become the same plane state as the upper surface 44 of the frame fixing part 40, on the annular region 108 of the expansion sheet 106, a slack portion formed by the expansion sheet 106 being loosened is formed. 108-2 (see Figure 1, Figure 9 and Figure 11).

圖5是在圖2之加熱單元60的上表面圖。圖6是在圖5之加熱單元60的功能區塊圖。圖7是在圖5之加熱單元60的VII-VII剖面之剖面圖。圖5是從Z方向上方觀察加熱單元60的XY平面中的圖。圖5的VII-VII剖面是與XZ平面平行的面。加熱單元60加熱被擴張的擴張片106的環狀區域108,且使擴張片106的鬆弛部分108-2(參閱圖1、圖9及圖11)收縮。FIG. 5 is a top view of the heating unit 60 in FIG. 2 . FIG. 6 is a functional block diagram of the heating unit 60 in FIG. 5 . FIG. 7 is a sectional view of the section VII-VII of the heating unit 60 of FIG. 5 . FIG. 5 is a diagram in the XY plane viewing the heating unit 60 from above in the Z direction. The VII-VII section in FIG. 5 is a plane parallel to the XZ plane. The heating unit 60 heats the expanded annular region 108 of the expansion sheet 106 and shrinks the slack portion 108 - 2 (see FIGS. 1 , 9 and 11 ) of the expansion sheet 106 .

加熱單元60是如圖2及圖5所示,具備圓板狀的單元本體61,以及分別安裝在單元本體61的把持部62-1、62-2、62-3及62-4中的多個加熱部63-1、63-2、63-3及63-4。以下敘述中,在不區分把持部62-1、62-2、62-3及62-4的情況下斟酌記載為把持部62,且在不區分加熱部63-1、63-2、63-3及63-4的情況下斟酌記載為加熱部63。The heating unit 60 is, as shown in FIGS. 2 and 5 , equipped with a disc-shaped unit body 61, and a plurality of grips 62-1, 62-2, 62-3, and 62-4 installed in the unit body 61, respectively. There are three heating units 63-1, 63-2, 63-3 and 63-4. In the following description, it is considered to be described as the holding part 62 without distinguishing the holding parts 62-1, 62-2, 62-3 and 62-4, and the heating parts 63-1, 63-2, 63- In the case of 3 and 63-4, it is described as the heating part 63 as appropriate.

單元本體61是如圖2所示,配置在保持台30的上方且與保持台30同軸。單元本體61設置為在繞與垂直方向平行的軸心的方向上轉動自如。此外,單元本體61設置為藉由未圖示的移動單元升降自如。The unit body 61 is arranged above the holding table 30 and coaxially with the holding table 30 as shown in FIG. 2 . The unit body 61 is provided rotatably in a direction around an axis parallel to the vertical direction. In addition, the unit body 61 is provided so as to be able to move up and down freely by a moving unit not shown.

把持部62是如圖2及圖5所示,在圓周方向上等間隔地配置在單元本體61之外緣部上。把持部62配置在與保持在保持台30及框架固定部40上的工件單元100之擴張片106的環狀區域108在垂直方向相向的位置上。把持部62是如圖5所示,在把持部62的大小範圍內於單元本體61的徑方向和垂直方向上可移動地,亦即,在工件101的徑方向或與擴張片106的遠近方向上可移動地把持加熱部63。把持部62是如圖2及圖5所示,成為加熱部63插通之開口。把持部62之該開口圓周方向的長度是可插通的程度、比加熱部63圓周方向的長度長。把持部62之該開口徑方向的長度比加熱部63徑方向的長度長,在徑方向可移動地把持加熱部63。在實施方式1中,較佳為設置有4個把持部62,但在本發明中,並不限定為4個。As shown in FIGS. 2 and 5 , the grips 62 are arranged at equal intervals in the circumferential direction on the outer edge of the unit body 61 . The gripping portion 62 is disposed at a position vertically facing the annular region 108 of the expanding piece 106 of the workpiece unit 100 held by the holding table 30 and the frame fixing portion 40 . As shown in FIG. 5 , the gripping portion 62 is movable in the radial direction and the vertical direction of the unit body 61 within the size range of the gripping portion 62, that is, in the radial direction of the workpiece 101 or in the far-near direction with the expansion piece 106. The heating part 63 is held movably. The holding portion 62 is an opening through which the heating portion 63 is inserted, as shown in FIGS. 2 and 5 . The length in the circumferential direction of the opening of the gripping portion 62 is to a degree that can be inserted therethrough, and is longer than the length in the circumferential direction of the heating portion 63 . The length in the radial direction of the opening of the holding part 62 is longer than the length in the radial direction of the heating part 63 , and the heating part 63 is held movably in the radial direction. In Embodiment 1, four gripping parts 62 are preferably provided, but in the present invention, the number is not limited to four.

加熱部63是如圖2及圖5所示,依照把持部62的配置,在圓周方向上等間隔地配置在單元本體61之外緣部上。亦即,加熱部63是藉由被把持部62所把持,配置在與保持在保持台30及框架固定部40上的工件單元100之擴張片106的環狀區域108在垂直方向相向的位置上,且沿著環狀區域108設置在圓周方向上。在實施方式1中,較佳為設置有4個加熱部63,但在本發明中,並不限定為4個。加熱部63是向下方照射紅外線以加熱擴張片106的環狀區域108之形式者,例如,當施加電壓時被加熱,以發射紅外線的紅外線陶瓷加熱器。另外,加熱部63並不限定在照射紅外線的形態,也可以是具有2種金屬的接合部,由直流電流控制在2種金屬中吸熱及發熱的泊耳帖(Peltier)元件,可以進一步具備這種泊耳帖元件。As shown in FIGS. 2 and 5 , the heating parts 63 are arranged at equal intervals in the circumferential direction on the outer edge of the unit body 61 in accordance with the arrangement of the holding parts 62 . That is, the heating unit 63 is held by the holding unit 62 and arranged at a position facing the annular region 108 of the expansion piece 106 of the workpiece unit 100 held on the holding table 30 and the frame fixing unit 40 in the vertical direction. , and arranged in the circumferential direction along the annular region 108 . In Embodiment 1, four heating parts 63 are preferably provided, but in the present invention, the number is not limited to four. The heating unit 63 is in the form of irradiating infrared rays downward to heat the annular region 108 of the expansion sheet 106 , for example, an infrared ceramic heater that is heated when a voltage is applied to emit infrared rays. In addition, the heating part 63 is not limited to the form of irradiating infrared rays, and may also be a joint part having two kinds of metals, and a Peltier (Peltier) element that absorbs heat and generates heat in the two kinds of metals is controlled by a direct current. A Peltier element.

加熱單元60是如圖6所示,具備多個第1加熱位置調整部64-1、64-2、64-3及64-4,以及轉動部65。多個第1加熱位置調整部64-1、64-2、64-3及64-4是分別連接至加熱部63-1、63-2、63-3及63-4,且在工件101的徑方向上使加熱部63-1、63-2、63-3及63-4的位置移動。以下敘述中,在不區分第1加熱位置調整部64-1、64-2、64-3及64-4的情況下斟酌記載為第1加熱位置調整部64。第1加熱位置調整部64是能夠使加熱部63的位置分別個別地在工件101的徑方向上移動的構成,例如,具備相對於加熱部63設置的皮帶滾輪以及驅動此皮帶滾輪的馬達。另外,第1加熱位置調整部64並不限定於此構成,也可以是具有氣缸或滾珠螺桿者。轉動部65連接至單元本體61。轉動部65具備藉由旋轉輸出軸,使單元本體61在繞與垂直方向平行的軸心的方向上旋轉的未圖示之馬達。As shown in FIG. 6 , the heating unit 60 includes a plurality of first heating position adjustment parts 64 - 1 , 64 - 2 , 64 - 3 , and 64 - 4 and a rotating part 65 . A plurality of first heating position adjustment parts 64-1, 64-2, 64-3 and 64-4 are respectively connected to the heating parts 63-1, 63-2, 63-3 and 63-4, and on the workpiece 101 The positions of the heating units 63-1, 63-2, 63-3, and 63-4 are moved in the radial direction. In the following description, when not distinguishing the 1st heating position adjustment part 64-1, 64-2, 64-3, and 64-4, it will be described as the 1st heating position adjustment part 64 as appropriate. The first heating position adjustment unit 64 is configured to individually move the position of the heating unit 63 in the radial direction of the workpiece 101 , and includes, for example, a belt pulley provided for the heating unit 63 and a motor for driving the belt pulley. In addition, the 1st heating position adjustment part 64 is not limited to this structure, What has an air cylinder or a ball screw may be sufficient as it. The rotating portion 65 is connected to the unit body 61 . The rotation unit 65 includes a motor (not shown) that rotates the unit main body 61 in a direction around an axis parallel to the vertical direction by rotating the output shaft.

因為具有如以上的構成,第1加熱位置調整部64是如圖7所示,藉由使加熱部63的位置分別個別地在工件101的徑方向上移動,以調整加熱部63在工件101徑方向的加熱位置。另外,也可以設定為能夠使面對面的加熱部63-1及加熱部63-3同時地向徑方向內側或徑方向外側移動,且能夠使面對面的加熱部63-2及加熱部63-4同時地向徑方向內側或徑方向外側移動。此外,轉動部65是如圖7所示,能夠使所有的加熱部63同時沿著擴張片106的環狀區域108在圓周方向上移動。Because of having the above structure, the first heating position adjustment unit 64 is as shown in FIG. Direction of heating position. In addition, it may be set so that the facing heating part 63-1 and the heating part 63-3 can be moved radially inward or radially outward at the same time, and the facing heating part 63-2 and the heating part 63-4 can be simultaneously moved. to move radially inward or radially outward. In addition, as shown in FIG. 7 , the rotating part 65 can move all the heating parts 63 in the circumferential direction along the annular region 108 of the expanding sheet 106 at the same time.

控制單元70是如圖2所示,分別控制分割裝置10的上述構成要素,即,片擴張單元50與加熱單元60等,以使分割裝置10對工件101實施加工動作者。另外,控制單元70是電子計算機。控制單元70係連接至由顯示加工動作的狀態或畫面的液晶顯示裝置之類所構成的未圖示的顯示單元,以及用於操作員登錄例如加工內容資訊時的未圖示之輸入單元。輸入單元係由設置於顯示單元的觸控面板及鍵盤等外部輸入裝置的至少其中之一所構成。As shown in FIG. 2 , the control unit 70 controls the above-mentioned components of the dividing device 10 , that is, the sheet expanding unit 50 and the heating unit 60 , so that the dividing device 10 performs processing operations on the workpiece 101 . In addition, the control unit 70 is an electronic computer. The control unit 70 is connected to a display unit (not shown) constituted by a liquid crystal display device or the like that displays the status of processing operations or a screen, and an input unit (not shown) for an operator to register, for example, processing content information. The input unit is composed of at least one of external input devices such as a touch panel and a keyboard provided on the display unit.

控制單元70是如圖6所示,電性連接至各第1加熱位置調整部64以及轉動部65。控制單元70透過各第1加熱位置調整部64,控制各加熱部63在工件101徑方向的加熱位置。控制單元70透過轉動部65,控制各加熱部63在工件101圓周方向的加熱位置。As shown in FIG. 6 , the control unit 70 is electrically connected to each of the first heating position adjustment parts 64 and the rotation part 65 . The control unit 70 controls the heating position of each heating unit 63 in the radial direction of the workpiece 101 through each first heating position adjustment unit 64 . The control unit 70 controls the heating position of each heating portion 63 in the circumferential direction of the workpiece 101 through the rotating portion 65 .

接著,說明實施方式1之分割裝置10的操作之一例的工件101之分割方法。圖8是實施方式1之分割裝置10的操作之一例的工件101之分割方法的流程圖。以下,將工件101之分割方法簡稱為分割方法。實施方式1的分割方法,是將圖1所示工件單元100的擴張片106擴張,以沿著分割預定線103所形成的改質層109作為起點將工件101斷裂,並分割為個別的元件晶片105之方法。實施方式1的分割方法是如圖8所示,具備框架固定步驟ST1、片擴張步驟ST2、吸引保持步驟ST3以及加熱步驟ST4。Next, a method for dividing the workpiece 101 as an example of the operation of the dividing device 10 according to the first embodiment will be described. FIG. 8 is a flowchart of a method for dividing a workpiece 101 as an example of the operation of the dividing device 10 according to the first embodiment. Hereinafter, the method of dividing the workpiece 101 is simply referred to as a method of dividing. The division method of Embodiment 1 is to expand the expansion piece 106 of the workpiece unit 100 shown in FIG. 105 method. The dividing method of Embodiment 1 is as shown in FIG. 8 , and includes a frame fixing step ST1 , a sheet expanding step ST2 , a sucking and holding step ST3 , and a heating step ST4 .

(框架固定步驟) 框架固定步驟ST1,是透過擴張片106將工件單元100的工件101載置於保持台30的保持面31上,並以框架固定部40固定環狀框架107的步驟。(Frame Fixing Step) The frame fixing step ST1 is a step of placing the workpiece 101 of the workpiece unit 100 on the holding surface 31 of the holding table 30 through the expansion piece 106 and fixing the ring frame 107 with the frame fixing portion 40 .

在框架固定步驟ST1中,控制單元70將框架固定部40的框架壓板42定位在撤離位置上,在使氣缸48的活塞桿48-1縮小的狀態下,藉由搬送單元80將沿著分割預定線103形成有改質層109的工件單元100搬送到保持台30的上方為止。在框架固定步驟ST1中,控制單元70藉由搬送單元80使工件單元100的環狀框架107載置於框架載置板41的上表面44,且透過擴張片106使工件101的背面與保持面31在垂直方向上相對。In the frame fixing step ST1, the control unit 70 positions the frame pressing plate 42 of the frame fixing part 40 at the evacuation position, and in the state where the piston rod 48-1 of the air cylinder 48 is shrunk, the transfer unit 80 moves the frame along the planned division. The workpiece unit 100 in which the modified layer 109 is formed on the line 103 is conveyed to the upper side of the holding table 30 . In the frame fixing step ST1, the control unit 70 places the ring-shaped frame 107 of the workpiece unit 100 on the upper surface 44 of the frame mounting plate 41 through the conveying unit 80, and the back surface of the workpiece 101 and the holding surface are connected through the expansion piece 106. 31 are opposite in the vertical direction.

在框架固定步驟ST1中,於實施方式1,控制單元70是藉由搬送單元80,使工件單元100的A方向在X方向上、工件單元100的B方向在Y方向上分別對齊,以載置工件單元100。In the frame fixing step ST1, in Embodiment 1, the control unit 70 uses the transfer unit 80 to align the A direction of the workpiece unit 100 in the X direction and the B direction of the workpiece unit 100 in the Y direction to place the Workpiece unit 100.

在框架固定步驟ST1中,控制單元70使框架固定部40的中心導引件46彼此靠近,將工件單元100的工件101定位,並將框架壓板42定位在框架載置板41的上方,使氣缸45的活塞桿45-1伸展,以使框架載置板41上昇。在框架固定步驟ST1中,控制單元70如圖3所示,將工件單元100的環狀框架107夾在框架載置板41與框架壓板42之間以固定。在框架固定步驟ST1中,當控制單元70將工件單元100的環狀框架107固定時,前進到片擴張步驟ST2。In the frame fixing step ST1, the control unit 70 brings the center guides 46 of the frame fixing part 40 close to each other, positions the workpiece 101 of the workpiece unit 100, and positions the frame pressing plate 42 above the frame mounting plate 41, and the air cylinder The piston rod 45-1 of 45 is extended to raise the frame mounting plate 41. In the frame fixing step ST1 , the control unit 70 clamps the ring-shaped frame 107 of the workpiece unit 100 between the frame mounting plate 41 and the frame pressing plate 42 to fix as shown in FIG. 3 . In the frame fixing step ST1, when the control unit 70 fixes the ring frame 107 of the work unit 100, it proceeds to the sheet expanding step ST2.

(片擴張步驟) 片擴張步驟ST2是在實施框架固定步驟ST1後,使保持台30與框架固定部40在與工件101之正面102正交的軸心方向上相對地移動,並擴張工件101外周之外緣與環狀框架107內周之內緣之間的擴張片106的環狀區域108之步驟。(Sheet Expanding Step) In the sheet expanding step ST2, after the frame fixing step ST1 is performed, the holding table 30 and the frame fixing part 40 are relatively moved in the axial direction perpendicular to the front surface 102 of the workpiece 101, and the outer periphery of the workpiece 101 is expanded. The step of expanding the annular region 108 of the sheet 106 between the outer edge and the inner edge of the inner periphery of the annular frame 107 .

在片擴張步驟ST2中,控制單元70使片擴張單元50的升降單元52的氣缸54和55之活塞桿54-1和55-1伸長,以使上推構件51和保持台30一體地上升。於是,框架載置板41與保持台30位在上表面44與安裝在上推構件51上端的滾軸構件53及保持面31位在相同平面上的相鄰位置,且上推構件51的滾軸構件53抵接擴張片106。在片擴張步驟ST2中,控制單元70由此進一步使片擴張單元50的升降單元52的氣缸54和55之活塞桿54-1和55-1伸長,以使上推構件51和保持台30一體地上升。於是,由於擴張片106抵接在安裝於上推構件51上端的滾軸構件53上,擴張片106在平面方向上被擴張。In the sheet expanding step ST2, the control unit 70 extends the piston rods 54-1 and 55-1 of the air cylinders 54 and 55 of the lifting unit 52 of the sheet expanding unit 50 to integrally lift the push-up member 51 and the holding table 30. Thus, the frame mounting plate 41 and the holding table 30 are positioned adjacent to the upper surface 44 on the same plane as the roller member 53 mounted on the upper end of the push-up member 51 and the holding surface 31, and the rollers of the push-up member 51 The shaft member 53 abuts against the expansion piece 106 . In the sheet expanding step ST2, the control unit 70 thus further extends the piston rods 54-1 and 55-1 of the air cylinders 54 and 55 of the lifting unit 52 of the sheet expanding unit 50 so that the push-up member 51 and the holding table 30 are integrated. to rise. Then, since the expansion piece 106 abuts on the roller member 53 mounted on the upper end of the push-up member 51, the expansion piece 106 is expanded in the planar direction.

在片擴張步驟ST2中,由於擴張片106的擴張,拉力放射狀地作用在擴張片106上。如此一來當拉力放射狀地作用在黏貼於工件101背面的擴張片106上時,工件101由於沿著分割預定線103形成有改質層109,以此改質層109作為起點,被沿著分割預定線103分割的同時,元件晶片105之間分別在A方向及B方向(參閱圖1)上擴展,並在元件晶片105之間形成各個間隔113。在片擴張步驟ST2中,各個間隔113如圖1所示,沿著分割預定線103分別排列形成在A方向及B方向上,使得工件101被分割為個別的元件晶片105。In the sheet expanding step ST2 , due to the expansion of the expanding sheet 106 , tension acts radially on the expanding sheet 106 . In this way, when the pulling force radially acts on the expansion sheet 106 pasted on the back of the workpiece 101, the workpiece 101 is formed with the modified layer 109 along the planned dividing line 103, and the modified layer 109 is used as the starting point to be moved along the At the same time as the division line 103 divides, the element wafers 105 expand in the A direction and the B direction (see FIG. 1 ), respectively, and each space 113 is formed between the element wafers 105 . In the sheet expanding step ST2, the respective spaces 113 are arranged and formed in the A direction and the B direction along the dividing line 103 as shown in FIG. 1 , so that the workpiece 101 is divided into individual element wafers 105 .

此外,在片擴張步驟ST2之後,擴張片106如圖4所示,環狀區域108的剖面從環狀框架107的下表面朝向滾軸構件53的上表面成為直線狀。在片擴張步驟ST2中,當控制單元70使上推構件51和保持台30一體地上升後,前進到吸引保持步驟ST3。In addition, after the sheet expanding step ST2 , as shown in FIG. 4 , the expanding sheet 106 has a cross section of the annular region 108 that is linear from the lower surface of the annular frame 107 toward the upper surface of the roller member 53 . In the sheet expanding step ST2, after the control unit 70 integrally raises the push-up member 51 and the holding table 30, the process proceeds to the sucking and holding step ST3.

(吸引保持步驟) 吸引保持步驟ST3在片擴張步驟ST2之後,透過擴張片106將工件101吸引保持於保持台30的保持面31上,並維持擴張片106的擴張之步驟。在吸引保持步驟ST3中,控制單元70驅動真空吸引源34,由真空吸引源34吸引吸附部33,以透過擴張片106將工件101的背面側吸引保持在保持面31上,並維持元件晶片105之間的間隔113。(Suction and holding step) The suction and holding step ST3 is a step of sucking and holding the workpiece 101 on the holding surface 31 of the holding table 30 through the expansion sheet 106 and maintaining the expansion of the expansion sheet 106 after the sheet expansion step ST2. In the suction and holding step ST3, the control unit 70 drives the vacuum suction source 34, and the suction portion 33 is sucked by the vacuum suction source 34 to suction and hold the back side of the workpiece 101 on the holding surface 31 through the expansion sheet 106, and hold the element wafer 105. The interval between 113.

在吸引保持步驟ST3中,控制單元70在透過擴張片106將工件101的背面側吸引保持在保持面31的狀態下,使片擴張單元50的升降單元52的氣缸54和55之活塞桿54-1和55-1收縮,以使上推構件51和保持台30一體地下降,使得保持台30的保持面31以及安裝在上推構件51上端的滾軸構件53移動到位於與框架載置板41之上表面44相同平面上的相鄰位置為止。在吸引保持步驟ST3中,控制單元70使上推構件51以及保持台30一體地下降到此相鄰位置為止,藉此擴張片106的環狀區域108鬆弛,並變形為朝向垂直方向上側具有橢圓形凸狀之形狀的鬆弛部分108-2(參閱圖9及圖11)。在吸引保持步驟ST3中,當控制單元70使上推構件51以及保持台30一體地下降直接相鄰位置為止,接著在透過擴張片106將工件101之背面側吸引保持在保持面31上的狀態下,前進到加熱步驟ST4。In the sucking and holding step ST3, the control unit 70 makes the piston rods 54 of the air cylinders 54 and 55 of the lifting unit 52 of the sheet expanding unit 50 - 1 and 55-1 shrink, so that the push-up member 51 and the holding table 30 are integrally lowered, so that the holding surface 31 of the holding table 30 and the roller member 53 installed on the upper end of the push-up member 51 move to the position on the frame mounting plate. 41 to the adjacent position on the same plane as the upper surface 44. In the suction and holding step ST3, the control unit 70 lowers the push-up member 51 and the holding table 30 integrally to the adjacent position, whereby the annular region 108 of the expansion piece 106 is relaxed and deformed to have an ellipse toward the vertical upper side. The slack portion 108-2 has a convex shape (see Fig. 9 and Fig. 11). In the suction and holding step ST3, when the control unit 70 lowers the push-up member 51 and the holding table 30 integrally to the directly adjacent position, then the back side of the workpiece 101 is sucked and held on the holding surface 31 through the expansion piece 106. Next, proceed to heating step ST4.

(加熱步驟) 圖9是表示在執行圖8的加熱步驟ST4時分割裝置10的主要部分之剖面圖。圖10是表示圖8的加熱步驟ST4中進行加熱的加熱單元60之俯視圖。圖11是放大表示圖9的XI部之剖面圖。(Heating Step) FIG. 9 is a cross-sectional view showing the main part of the dividing apparatus 10 when the heating step ST4 of FIG. 8 is performed. FIG. 10 is a plan view showing the heating unit 60 for heating in the heating step ST4 of FIG. 8 . FIG. 11 is an enlarged cross-sectional view showing portion XI in FIG. 9 .

在加熱步驟ST4是在實施吸引保持步驟ST3後,接在透過擴張片106將工件101的背面側吸引保持在保持面31上的狀態下,加熱以使已擴張的擴張片106的環狀區域108之鬆弛部分108-2(參閱圖9及圖11)收縮之步驟在加熱步驟ST4中,首先,控制單元70進行對加熱單元60的加熱部63施加電壓等,加熱到預定溫度為止以使紅外線發射,並且使未圖示的移動單元將加熱單元60下降,如圖9所示,將加熱部63靠近環狀區域108。In the heating step ST4, after the suction and holding step ST3 is carried out, the back side of the workpiece 101 is sucked and held on the holding surface 31 through the expansion sheet 106, and the annular region 108 of the expanded expansion sheet 106 is heated to The step of shrinking the slack part 108-2 (refer to FIG. 9 and FIG. 11 ) is in the heating step ST4. First, the control unit 70 applies a voltage to the heating part 63 of the heating unit 60, and heats to a predetermined temperature to emit infrared rays. , and the heating unit 60 is lowered by a moving unit not shown, and the heating unit 63 is brought close to the annular region 108 as shown in FIG. 9 .

工件單元100經過片擴張步驟ST2以及吸引保持步驟ST3,如圖1所示,被沿著分割預定線103分割,且間隔113分別排列在A方向和B方向上形成在元件晶片105之間。在工件單元100中,間隔113是成為在元件晶片105之間分別沿著A方向和B方向延伸的槽。Work unit 100 passes through sheet expanding step ST2 and suction holding step ST3, and as shown in FIG. In the workpiece unit 100 , the spaces 113 are grooves extending in the A direction and the B direction between the element wafers 105 .

在片擴張步驟ST2中,工件單元100的擴張片106在B方向之處比A方向上擴張更多。藉此,吸引保持步驟ST3執行後產生的環狀區域108的鬆弛量,B方向的量會變成比A方向大。從而,環狀區域108的凸狀部分之垂直方向的高度成為極大的凸頂部108-1是如圖1所示,成為在B方向上延展的橢圓形狀。亦即,凸頂部108-1在長軸區域115中位在比環狀區域108徑方向的中央部分更外側,長軸區域115是鬆弛部分108-2之中橢圓形狀之長軸方向的區域,在短軸區域116中位在比環狀區域108徑方向的中央部分更內側,短軸區域116是鬆弛部分108-2之中橢圓形狀之短軸方向的區域。再者,決定長軸區域115及短軸區域116的邊界線117和118是根據施加在擴張片106上的張力大小等適當地決定。In the sheet expanding step ST2, the expanded sheet 106 of the workpiece unit 100 is expanded more at the B direction than in the A direction. As a result, the amount of slack in the annular region 108 generated after the suction and holding step ST3 is larger in the B direction than in the A direction. Therefore, the convex top portion 108-1 whose height in the vertical direction of the convex portion of the annular region 108 becomes maximum becomes an elliptical shape extending in the B direction as shown in FIG. 1 . That is, the convex top 108-1 is located outside the central part in the radial direction of the annular region 108 in the long-axis region 115, which is the region in the long-axis direction of the oval shape in the slack portion 108-2, The short-axis region 116 is located on the inner side of the central portion in the radial direction of the annular region 108 in the short-axis region 116, which is a region in the short-axis direction of the ellipse in the slack portion 108-2. Furthermore, the boundary lines 117 and 118 defining the long-axis region 115 and the short-axis region 116 are appropriately determined according to the magnitude of tension applied to the expansion sheet 106 and the like.

在加熱步驟ST4中,使加熱單元60下降以使加熱部63靠近環狀區域108之後,控制單元70藉由轉動部65,如圖10所示使加熱單元60的單元本體61在圓周方向上轉動90度的範圍,藉以使加熱部63-1、63-2、63-3和63-4分別在區域67-1、67-2、67-3和67-4內於圓周方向上移動。另外,在加熱步驟ST4中,控制單元70藉由轉動部65,使單元本體61在圓周方向上僅90度單方向地轉動,藉以使各加熱部63在各區域67內在圓周方向上單程移動,或使單元本體61在圓周方向上來回90度範圍地轉動,即擺動,藉以使各加熱部63在各區域67內在圓周方向上往復運動。在此,因為以框架固定步驟ST1將工件單元100的A方向在X方向上、工件單元100的B方向在Y方向上分別對齊,區域67-1及區域67-3在短軸區域116的垂直方向上側重疊,區域67-2及區域67-4在長軸區域115的垂直方向上側重疊。藉此,在加熱步驟ST4中,控制單元70藉由這般在圓周方向上進行往復運動,以加熱部63-1及加熱部63-3加熱短軸區域116,並以加熱部63-2及加熱部63-4加熱長軸區域115。In the heating step ST4, after the heating unit 60 is lowered so that the heating portion 63 is close to the annular region 108, the control unit 70 rotates the unit body 61 of the heating unit 60 in the circumferential direction as shown in FIG. 10 by using the rotating portion 65. The range of 90 degrees is used to make the heating parts 63-1, 63-2, 63-3, and 63-4 move in the circumferential direction in the areas 67-1, 67-2, 67-3, and 67-4, respectively. In addition, in the heating step ST4, the control unit 70 uses the rotating part 65 to rotate the unit body 61 only 90 degrees in the circumferential direction in one direction, so that each heating part 63 moves in a single direction in the circumferential direction in each area 67, Alternatively, the unit body 61 is rotated back and forth by 90 degrees in the circumferential direction, that is, swings, so as to make each heating part 63 reciprocate in the circumferential direction in each area 67 . Here, since the A direction of the workpiece unit 100 is aligned in the X direction and the B direction of the workpiece unit 100 is aligned in the Y direction by the frame fixing step ST1, the regions 67-1 and 67-3 are perpendicular to the minor axis region 116. They overlap in the upper direction, and the region 67 - 2 and the region 67 - 4 overlap in the vertical direction of the major axis region 115 . Thus, in the heating step ST4, the control unit 70 heats the short-axis region 116 with the heating part 63-1 and the heating part 63-3 by reciprocating in the circumferential direction in this way, and heats the short-axis region 116 with the heating part 63-2 and the heating part 63-2. The heating unit 63 - 4 heats the long-axis region 115 .

在加熱步驟ST4中,控制單元70藉由第1加熱位置調整部64-2和64-4,如圖10及圖11(A)所示,在工件101的徑方向使加熱部63-2和63-4的位置向徑方向外側移動,藉此在長軸區域115中靠近位在比環狀區域108徑方向之中央部要外側的凸頂部108-1的垂直方向上側。又,在加熱步驟ST4中,控制單元70藉由第1加熱位置調整部64-1和64-3,如圖10及圖11(B)所示,在工件101的徑方向使加熱部63-1和63-3的位置向徑方向內側移動,藉此在短軸區域116中靠近位在比環狀區域108徑方向之中央部要內側的凸頂部108-1的垂直方向上側。藉此,在加熱步驟ST4中,控制單元70以加熱部63-1和63-3有效率地加熱短軸區域116中的凸頂部108-1,並以加熱部63-2和63-4有效率地加熱長軸區域115中的凸頂部108-1,藉此在長軸區域115與短軸區域116之間平均且有效率地使鬆弛部分108-2收縮。In the heating step ST4, the control unit 70 uses the first heating position adjustment parts 64-2 and 64-4, as shown in FIG. 10 and FIG. The position of 63 - 4 is shifted outward in the radial direction so as to approach the vertical upper side of the convex top 108 - 1 located outside the radial center of the annular region 108 in the major axis region 115 . Moreover, in the heating step ST4, the control unit 70 uses the first heating position adjustment parts 64-1 and 64-3, as shown in FIG. 10 and FIG. 11(B), to make the heating part 63- The positions of 1 and 63-3 are shifted inward in the radial direction, thereby approaching the vertical upper side of the convex top 108-1 located on the inner side than the central portion of the ring-shaped region 108 in the short-axis region 116 in the radial direction. Thereby, in the heating step ST4, the control unit 70 efficiently heats the convex top 108-1 in the short-axis region 116 with the heating parts 63-1 and 63-3, and efficiently heats the convex top 108-1 in the short-axis region 116 with the heating parts 63-2 and 63-4. The convex top 108 - 1 in the major axis region 115 is efficiently heated, thereby shrinking the slack portion 108 - 2 evenly and efficiently between the major axis region 115 and the minor axis region 116 .

在加熱步驟ST4中,因為分別設置有4個把持部62以及加熱部63,能夠將朝向單元本體61的中心方向彼此成對相向的2對把持部62以及加熱部63的一個用於長軸區域115的加熱,且將2對把持部62以及加熱部63的另一個用於短軸區域116的加熱,故而可以平均且有效率地加熱具有橢圓形狀凸頂部108-1的鬆弛部分108-2。In the heating step ST4, since four holding parts 62 and heating parts 63 are respectively provided, one of the two pairs of holding parts 62 and heating parts 63 facing each other in pairs toward the center direction of the unit body 61 can be used for the long-axis region. 115, and the other of the two pairs of holding parts 62 and heating part 63 is used for heating the short-axis region 116, so that the slack part 108-2 having the elliptical convex top 108-1 can be heated evenly and efficiently.

在加熱步驟ST4中,當通過鬆弛部分108-2充分收縮而變形以使凸頂部108-1的高度成為0變成平坦的形狀時,控制單元70停止真空吸引源34以及加熱部63的加熱,使加熱單元60上升,並解除框架固定部40的環狀框架107的固定。於是,工件單元100即使是鬆弛部分108-2收縮,且解除保持台30的吸附部33之吸引,也能正確地維持元件晶片105之間的間隔113。In the heating step ST4, when the slack portion 108-2 is sufficiently contracted and deformed so that the height of the convex top portion 108-1 becomes 0 and becomes flat, the control unit 70 stops the heating of the vacuum suction source 34 and the heating unit 63, and the The heating unit 60 rises, and the fixing of the ring frame 107 of the frame fixing part 40 is released. Therefore, even if the slack portion 108 - 2 of the workpiece unit 100 shrinks and the attraction of the suction portion 33 of the holding table 30 is released, the gap 113 between the element wafers 105 can be accurately maintained.

在加熱步驟ST4中,在分割相同批量的相同產品之工件101的情況下,控制單元70在對第1個工件101實施分割方法時,使用基於加熱部63位置的控制資訊之位置控制程式,以控制加熱部63的位置。In the heating step ST4, in the case of dividing the workpieces 101 of the same product in the same batch, the control unit 70 uses the position control program based on the control information of the position of the heating part 63 when implementing the division method for the first workpiece 101, so as to The position of the heating part 63 is controlled.

另外,在實施方式1中,擴張片106被施加張力的方向之A方向與分割預定線103的位置方向對齊,在框架固定步驟ST1中,工件單元100的A方向與X方向、工件單元100的B方向與Y方向分別對齊,但本發明並不限定於此。在本發明中,已知至少此A方向與分割預定線103所沿方向之間的關係,並且,在框架固定步驟ST1中以框架固定部40固定環狀框架107時,只要能知道此A方向是朝向哪個方向即可,在此情況下,能夠基於此A方向與分割預定線103所沿方向斟酌決定長軸區域115和短軸區域116,並基於此決定之長軸區域115和短軸區域116適當地執行加熱步驟ST4。In addition, in Embodiment 1, the A direction of the direction in which tension is applied to the expansion sheet 106 is aligned with the position direction of the planned dividing line 103, and in the frame fixing step ST1, the A direction of the workpiece unit 100 and the X direction, and the direction of the workpiece unit 100 are aligned. The B direction and the Y direction are respectively aligned, but the present invention is not limited thereto. In the present invention, at least the relationship between the direction A and the direction along which the planned dividing line 103 is known is known, and when the ring-shaped frame 107 is fixed by the frame fixing part 40 in the frame fixing step ST1, as long as the direction A can be known It doesn’t matter which direction it is facing. In this case, the long-axis region 115 and the short-axis region 116 can be determined based on the A direction and the direction along which the planned dividing line 103 follows, and the long-axis region 115 and short-axis region can be determined based on this. 116 appropriately performs the heating step ST4.

如以上所說明的,實施方式1的分割裝置10即使是在起因於擴張片106的捲繞狀態等使擴張片106的鬆弛方式有所不同的情況下,也能夠藉由根據該區域變更徑方向的加熱位置,恰當地加熱擴張片106鬆弛所構成的鬆弛部分108-2。因此,實施方式1的分割裝置10能夠正確地維持由擴張片106擴張所形成的元件晶片105之間的間隔113,並能夠抑制分割後的元件晶片105彼此磨擦。As described above, even in the case where the expansion sheet 106 relaxes differently due to the winding state of the expansion sheet 106, the dividing device 10 according to Embodiment 1 can change the radial direction according to the region. The heating position is to properly heat the slack portion 108-2 formed by the expansion sheet 106 being slack. Therefore, the dividing apparatus 10 according to Embodiment 1 can accurately maintain the space 113 between the element wafers 105 expanded by the expanding sheet 106 , and can suppress the friction between the divided element wafers 105 .

(實施方式2) 圖12是實施方式2之分割裝置10-2的加熱單元60-2之功能區塊圖。實施方式2的分割裝置10-2是在實施方式1的分割裝置10中,將加熱單元60變更為加熱單元60-2者。在實施方式2之分割裝置10-2的說明中,與實施方式1相同部分標記相同符號並省略說明。(Embodiment 2) Fig. 12 is a functional block diagram of heating unit 60-2 of dividing device 10-2 according to Embodiment 2. The dividing apparatus 10-2 of Embodiment 2 is what changed the heating unit 60 into the heating unit 60-2 in the dividing apparatus 10 of Embodiment 1. As shown in FIG. In the description of the dividing device 10 - 2 according to the second embodiment, the same parts as those in the first embodiment are denoted by the same reference numerals and their descriptions are omitted.

實施方式2的加熱單元60-2是在實施方式1的加熱單元60中將第1加熱位置調整部64-1、64-2、64-3及64-4分別變更為第2加熱位置調整部66-1、66-2、66-3及66-4者。加熱單元60-2是如圖12所示,具備多個第2加熱位置調整部66-1、66-2、66-3及66-4,以及轉動部65。多個第2加熱位置調整部66-1、66-2、66-3及66-4是分別連接至加熱部63-1、63-2、63-3及63-4,且在與擴張片106的遠近方向上使加熱部63-1、63-2、63-3及63-4的位置移動。以下敘述中,在不區分第2加熱位置調整部66-1、66-2、66-3及66-4的情況下斟酌記載為第2加熱位置調整部66。第2加熱位置調整部66是能夠使加熱部63的位置分別個別地往與擴張片106的遠近方向移動的構成,例如,具備相對於加熱部63設置的皮帶滾輪以及驅動此皮帶滾輪的馬達。另外,第2加熱位置調整部66並不限定於此構成,也可以是具有氣缸或滾珠螺桿者。In the heating unit 60-2 of Embodiment 2, in the heating unit 60 of Embodiment 1, the first heating position adjustment parts 64-1, 64-2, 64-3, and 64-4 are respectively changed into second heating position adjustment parts. 66-1, 66-2, 66-3 and 66-4. As shown in FIG. 12 , the heating unit 60 - 2 includes a plurality of second heating position adjustment parts 66 - 1 , 66 - 2 , 66 - 3 , and 66 - 4 and a rotating part 65 . A plurality of second heating position adjustment parts 66-1, 66-2, 66-3 and 66-4 are respectively connected to the heating parts 63-1, 63-2, 63-3 and 63-4, and are connected to the expansion sheet 106 moves the positions of the heating units 63-1, 63-2, 63-3, and 63-4 in the far-near direction. In the following description, when not distinguishing the 2nd heating position adjustment part 66-1, 66-2, 66-3, and 66-4, it describes as the 2nd heating position adjustment part 66 as appropriate. The second heating position adjustment unit 66 is configured to individually move the position of the heating unit 63 in the direction of distance from the expansion piece 106 , and includes, for example, a belt pulley provided for the heating unit 63 and a motor for driving the belt pulley. In addition, the 2nd heating position adjustment part 66 is not limited to this structure, What has an air cylinder or a ball screw may be sufficient as it.

圖13是實施方式2之加熱單元60-2的剖面圖。圖13的剖面圖是在與實施方式1之圖7的剖面圖相同剖面上的剖面圖。第2加熱位置調整部66是如圖13所示,藉由使加熱部63的位置分別個別地在與擴張片106的遠近方向上移動,通過調整加熱部63與工件101之間的距離,調整由加熱部63對工件101的加熱溫度。控制單元70透過各第2加熱位置調整部66,控制各加熱部63在工件101的加熱溫度。另外,也可以設定為能夠使面對面的加熱部63-1及加熱部63-3同時地在與擴張片106的遠近方向上移動,且能夠使面對面的加熱部63-2及加熱部63-4同時地在與擴張片106的遠近方向上移動。Fig. 13 is a sectional view of a heating unit 60-2 according to the second embodiment. The cross-sectional view in FIG. 13 is a cross-sectional view on the same cross-sectional plane as the cross-sectional view in FIG. 7 of the first embodiment. The second heating position adjustment unit 66 is, as shown in FIG. 13 , adjusting the distance between the heating unit 63 and the workpiece 101 by individually moving the position of the heating unit 63 in the far-near direction with the expansion sheet 106 . The temperature at which the workpiece 101 is heated by the heating unit 63 . The control unit 70 controls the heating temperature of each heating unit 63 on the workpiece 101 through each second heating position adjustment unit 66 . In addition, it may be set so that the heating part 63-1 and the heating part 63-3 which face each other can simultaneously move in the far-near direction with the expansion sheet 106, and the heating part 63-2 and the heating part 63-4 which face to face can be moved simultaneously. Simultaneously move in the far-near direction with the expansion sheet 106 .

接著,說明實施方式2之分割裝置10-2的操作之一例的工件101之分割方法。實施方式2的分割方法是在實施方式1的分割方法中變更加熱步驟ST4者。Next, a method for dividing the workpiece 101 as an example of the operation of the dividing device 10 - 2 according to the second embodiment will be described. The division method of Embodiment 2 is what changed the heating step ST4 in the division method of Embodiment 1.

工件單元100如上所述,吸引保持步驟ST3執行後產生的環狀區域108的鬆弛量,B方向的量會變成比A方向大。藉此,在長軸區域115中鬆弛部分108-2的隆起量會比短軸區域116中鬆弛部分108-2的隆起量大。在此,鬆弛部分108-2的隆起量是以例如鬆弛部分108-2中每單位面積的隆起體積來表示。因此,工件單元100即使在吸引保持步驟ST3中吸引保持的狀態解除了之後,為了正確地維持片擴張步驟ST2中形成的間隔113,藉由以較短軸區域116高的溫度加熱長軸區域115處以使其更加收縮是有必要的,其中長軸區域115在鬆弛部分108-2之中鬆弛量較大的B方向,短軸區域116在鬆弛部分108-2之中鬆弛量較小的A方向。As described above, in the workpiece unit 100 , the amount of slack in the annular region 108 generated after the suction and holding step ST3 is larger in the B direction than in the A direction. Accordingly, the amount of bulge of the slack portion 108 - 2 in the major axis region 115 is larger than that of the slack portion 108 - 2 in the minor axis region 116 . Here, the uplift amount of the slack portion 108-2 is represented by, for example, the uplift volume per unit area in the slack portion 108-2. Therefore, even after the suction-holding state of the workpiece unit 100 is released in the suction-holding step ST3, in order to correctly maintain the gap 113 formed in the sheet expanding step ST2, the long-axis region 115 is heated at a higher temperature than the short-axis region 116. It is necessary to make it shrink more, wherein the long-axis region 115 is in the B direction with a large amount of relaxation in the slack portion 108-2, and the short-axis region 116 is in the A direction with a small amount of slack in the slack portion 108-2. .

圖14是放大表示實施方式2之加熱步驟ST4中工件單元100及加熱單元60-2的主要部分之剖面圖。圖14的剖面圖是放大了與實施方式1之圖11的剖面圖相同區域的剖面圖。在實施方式2的加熱步驟ST4中,控制單元70一邊使加熱部63-1、63-2、63-3及63-4發射相同強度的紅外線,一邊藉由第2加熱位置調整部66-1和66-3,如圖14(B)所示,配合短軸區域116中鬆弛部分108-2的隆起量調整加熱部63-1和63-3垂直方向下側的端部位置,且藉由第2加熱位置調整部66-2和66-4,如圖14(A)所示,配合長軸區域115中鬆弛部分108-2的隆起量調整加熱部63-2和63-4垂直方向下側的端部位置。在實施方式2的加熱步驟ST4中,控制單元70因為鬆弛部分108-2的隆起量在長軸區域115中相較於短軸區域116為大,故調整加熱部63-2和63-4相較於加熱部63-1和63-3以更接近擴張片106。藉此,在實施方式2的加熱步驟ST4中,控制單元70能夠以加熱部63-1和63-3將短軸區域116在溫度T2下加熱,並以加熱部63-2和63-4將長軸區域115在比溫度T2高的溫度T1下加熱,使長軸區域115相對短軸區域116更加收縮。Fig. 14 is an enlarged cross-sectional view showing the main parts of the workpiece unit 100 and the heating unit 60-2 in the heating step ST4 of the second embodiment. The cross-sectional view in FIG. 14 is an enlarged cross-sectional view of the same area as the cross-sectional view in FIG. 11 of the first embodiment. In the heating step ST4 of Embodiment 2, the control unit 70 makes the heating parts 63-1, 63-2, 63-3, and 63-4 emit infrared rays of the same intensity, and the second heating position adjustment part 66-1 and 66-3, as shown in FIG. 14(B), adjust the positions of the ends of the heating parts 63-1 and 63-3 in the vertical direction in accordance with the bulge of the slack portion 108-2 in the short-axis region 116, and by The second heating position adjustment parts 66-2 and 66-4, as shown in FIG. 14(A), adjust the vertical direction of the heating parts 63-2 and 63-4 in accordance with the bulge of the loose part 108-2 in the long axis region 115. side end position. In the heating step ST4 of Embodiment 2, the control unit 70 adjusts the phase of the heating parts 63-2 and 63-4 because the swelling amount of the slack portion 108-2 is larger in the major axis region 115 than in the minor axis region 116. It is closer to the expansion sheet 106 than the heating parts 63-1 and 63-3. Thereby, in the heating step ST4 of Embodiment 2, the control unit 70 can heat the short-axis region 116 at the temperature T2 with the heating units 63-1 and 63-3, and can heat the short-axis region 116 at the temperature T2 with the heating units 63-2 and 63-4. The long-axis region 115 is heated at a temperature T1 higher than the temperature T2, so that the long-axis region 115 shrinks more than the short-axis region 116 .

在實施方式2的加熱步驟ST4中,通過加熱以使鬆弛部分108-2收縮,逐漸地減少鬆弛部分108-2的隆起量。於是,在實施方式2的加熱步驟ST4中,控制單元70藉由第2加熱位置調整部66,如圖14(A)及(B)所示,根據鬆弛部分108-2的隆起量, 隨時調整加熱部63與擴張片106的遠近方向上的位置,且不論在實施方式2的加熱步驟ST4中的經過時間為何都將加熱溫度保持固定。再者,在實施方式2的加熱步驟ST4中,控制單元70分別將長軸區域115的加熱溫度保持在溫度T1,並將短軸區域116的加熱溫度保持在溫度T2。In the heating step ST4 of Embodiment 2, the swelling amount of the slack portion 108-2 is gradually reduced by heating to shrink the slack portion 108-2. Therefore, in the heating step ST4 of Embodiment 2, the control unit 70 uses the second heating position adjustment unit 66 to adjust as needed according to the amount of swelling of the slack portion 108-2 as shown in FIGS. 14(A) and (B). The heating temperature is kept constant regardless of the positions in the far-near direction of the heating portion 63 and the expansion sheet 106 , regardless of the elapsed time in the heating step ST4 of the second embodiment. Furthermore, in the heating step ST4 of Embodiment 2, the control unit 70 maintains the heating temperature of the long-axis region 115 at the temperature T1 and the heating temperature of the short-axis region 116 at the temperature T2, respectively.

在實施方式2的加熱步驟ST4中,控制單元70雖藉由第2加熱位置調整部66,以鬆弛部分108-2的隆起量作為基準來調整加熱部63垂直方向下側的端部位置,但本發明並不限定於此,例如,在鬆弛部分108-2的隆起形狀為平緩且平滑時,也可以根據分別在長軸區域115及短軸區域116中凸頂部108-1的高度H1和H2,調整凸頂部108-1與加熱部63垂直方向下側的端部間的垂直方向距離h1和h2。In the heating step ST4 of Embodiment 2, the control unit 70 uses the second heating position adjustment unit 66 to adjust the vertically lower end position of the heating unit 63 using the slack portion 108-2 as a reference. The present invention is not limited thereto. For example, when the raised shape of the slack portion 108-2 is gentle and smooth, the heights H1 and H2 of the convex top 108-1 in the major axis region 115 and the minor axis region 116, respectively, can also be , adjust the vertical distances h1 and h2 between the convex top 108 - 1 and the vertically lower end of the heating portion 63 .

在加熱步驟ST4中,因為分別設置有4個把持部62以及加熱部63,能夠將朝向單元本體61的中心方向彼此成對相向的2對把持部62以及加熱部63的一個用於長軸區域115的加熱,且將2對把持部62以及加熱部63的另一個用於短軸區域116的加熱,故而可以穩定且有平衡地加熱鬆弛的環狀區域108。In the heating step ST4, since four holding parts 62 and heating parts 63 are respectively provided, one of the two pairs of holding parts 62 and heating parts 63 facing each other in pairs toward the center direction of the unit body 61 can be used for the long-axis region. 115, and the other of the two pairs of gripping parts 62 and heating part 63 is used for heating the short-axis region 116, so the loose annular region 108 can be heated stably and in a balanced manner.

如以上所說明的,實施方式2的分割裝置10-2是根據擴張片106鬆弛所構成的鬆弛部分108-2的區域,藉由調整加熱部63與擴張片106間的遠近方向上的位置,以將各個區域調整為不同加熱溫度,藉此能夠恰當地加熱鬆弛部分108-2。因此,實施方式2的分割裝置10-2與實施方式1的分割裝置10相同,能夠正確地維持由擴張片106擴張所形成的元件晶片105之間的間隔113,並能夠抑制分割後的元件晶片105彼此磨擦。As described above, the dividing device 10-2 according to Embodiment 2 adjusts the position in the far-near direction between the heating unit 63 and the expanding sheet 106 according to the area of the loosened portion 108-2 formed by the expanding sheet 106 being relaxed. Each region can be adjusted to a different heating temperature, so that the slack part 108-2 can be properly heated. Therefore, like the dividing apparatus 10 of the first embodiment, the dividing apparatus 10 - 2 of the second embodiment can accurately maintain the interval 113 between the element wafers 105 expanded by the expanding sheet 106 and can suppress the separation of the element wafers after dividing. 105 rub against each other.

(實施方式3) 圖15是實施方式3之分割裝置10-3的加熱單元60-3之功能區塊圖。實施方式3的分割裝置10-3是在實施方式2的分割裝置10-2中,將加熱單元60-2變更為加熱單元60-3者。在實施方式3之分割裝置10-3的說明中,與實施方式2相同部分標記相同符號並省略說明。(Embodiment 3) Fig. 15 is a functional block diagram of a heating unit 60-3 of a dividing device 10-3 according to Embodiment 3. The dividing apparatus 10-3 of Embodiment 3 is what changed the heating unit 60-2 into the heating unit 60-3 in the dividing apparatus 10-2 of Embodiment 2. In the description of the dividing device 10 - 3 of the third embodiment, the same parts as those of the second embodiment are denoted by the same reference numerals, and descriptions thereof are omitted.

實施方式3的加熱單元60-3是在實施方式2的加熱單元60-2中將第2加熱位置調整部66-1、66-2、66-3及66-4分別變更為加熱溫度調整部68-1、68-2、68-3及68-4者。加熱單元60-3是如圖15所示,具備多個加熱溫度調整部68-1、68-2、68-3及68-4,以及轉動部65。多個加熱溫度調整部68-1、68-2、68-3及68-4是分別連接至加熱部63-1、63-2、63-3及63-4,且調整加熱部63-1、63-2、63-3及63-4的加熱溫度。以下敘述中,在不區分加熱溫度調整部68-1、68-2、68-3及68-4的情況下斟酌記載為加熱溫度調整部68。加熱溫度調整部68是能夠分別將加熱部63的加熱溫度個別地變更的構成,例如,具備通過脈衝振幅調變方式變更供給至加熱部63的交流電壓之平均電壓的電子電路。另外。加熱溫度調整部68在加熱部63具備泊耳帖元件的情況下,也可以具備變更控制此泊耳帖元件之吸熱和發熱的施加電壓之電子電路。In the heating unit 60-3 of the third embodiment, in the heating unit 60-2 of the second embodiment, the second heating position adjustment parts 66-1, 66-2, 66-3, and 66-4 are respectively changed into heating temperature adjustment parts. 68-1, 68-2, 68-3 and 68-4. As shown in FIG. 15 , the heating unit 60 - 3 includes a plurality of heating temperature adjustment units 68 - 1 , 68 - 2 , 68 - 3 , and 68 - 4 and a rotating unit 65 . A plurality of heating temperature adjustment parts 68-1, 68-2, 68-3 and 68-4 are respectively connected to the heating parts 63-1, 63-2, 63-3 and 63-4, and adjust the heating part 63-1 , 63-2, 63-3 and 63-4 heating temperature. In the following description, when the heating temperature adjustment parts 68-1, 68-2, 68-3, and 68-4 are not distinguished, it is described as the heating temperature adjustment part 68 as appropriate. The heating temperature adjustment unit 68 is configured to individually change the heating temperature of the heating unit 63 , for example, includes an electronic circuit that changes the average voltage of the AC voltage supplied to the heating unit 63 by pulse amplitude modulation. in addition. The heating temperature adjustment unit 68 may include an electronic circuit for changing the applied voltage for controlling the heat absorption and heat generation of the Peltier element when the heating unit 63 has a Peltier element.

接著,說明實施方式3之分割裝置10-3的操作之一例的工件101之分割方法。實施方式3的分割方法是在實施方式2的分割方法中變更加熱步驟ST4者。實施方式3的加熱步驟ST4是在實施方式2的加熱步驟ST4中,控制單元70由透過第2加熱位置調整部66使加熱部63的位置在與擴張片106的遠近方向上移動以調整加熱部63與工件101之間的距離,取代為調整由加熱部63對工件101的加熱溫度,透過加熱溫度調整部68調整加熱部63的加熱溫度。Next, a method for dividing the workpiece 101, which is an example of the operation of the dividing device 10-3 according to the third embodiment, will be described. The division method of Embodiment 3 is what changed the heating step ST4 in the division method of Embodiment 2. In the heating step ST4 of Embodiment 3, in the heating step ST4 of Embodiment 2, the control unit 70 moves the position of the heating part 63 in the far-near direction from the expansion sheet 106 through the second heating position adjustment part 66 to adjust the heating part. 63 and the workpiece 101 , instead of adjusting the heating temperature of the workpiece 101 by the heating unit 63 , the heating temperature of the heating unit 63 is adjusted through the heating temperature adjusting unit 68 .

如以上所說明的,實施方式3的分割裝置10-3是根據擴張片106鬆弛所構成的鬆弛部分108-2的區域,藉由加熱溫度調整部68調整加熱部63的加熱溫度,以將各個區調整為不同加熱溫度,藉此能夠恰當地加熱鬆弛部分108-2。因此,實施方式3的分割裝置10-3與實施方式2的分割裝置10-2相同,能夠正確地維持由擴張片106擴張所形成的元件晶片105之間的間隔113,並能夠抑制分割後的元件晶片105彼此磨擦。As described above, the dividing device 10-3 of the third embodiment is based on the region of the loose part 108-2 formed by the expansion piece 106 being relaxed, and the heating temperature of the heating part 63 is adjusted by the heating temperature adjustment part 68, so that each The zones are adjusted to different heating temperatures, whereby the relaxed portion 108-2 can be properly heated. Therefore, like the dividing apparatus 10-2 of the second embodiment, the dividing apparatus 10-3 of the third embodiment can accurately maintain the interval 113 between the element wafers 105 expanded by the expanding sheet 106, and can suppress the gap between the element wafers 105 after dividing. The element wafers 105 rub against each other.

(變形例) 圖16是表示作為分割裝置10的分割對象之變形例的工件單元200的俯視圖。根據圖式說明變形例之工件單元200。分割變形例的工件單元200之分割裝置10是具有與實施方式1的分割裝置10相同的構成。變形例的說明中,與實施方式1相同部分標記相同符號並省略說明。(Modification) FIG. 16 is a plan view showing a workpiece unit 200 as a modification of the division target of the division device 10 . A workpiece unit 200 of a modified example will be described based on the drawings. The splitting device 10 of the workpiece unit 200 according to the splitting modification has the same configuration as the splitting device 10 of the first embodiment. In the description of the modified example, the same parts as those in the first embodiment are given the same reference numerals and their descriptions are omitted.

工件單元200是如圖16所示,具有工件201、黏貼在工件201之正面202背面側的背面之擴張片206,以及黏貼在擴張片206的外周部分之環狀框架207。工件201被黏貼在擴張片206之中央部分上。擴張片206在環狀框架207之內周的內緣與工件201之外周的外緣之間形成有環狀區域208。The workpiece unit 200 is as shown in FIG. 16 , has a workpiece 201 , an expansion sheet 206 attached to the back side of the front surface 202 of the workpiece 201 , and an annular frame 207 attached to the outer peripheral portion of the extension sheet 206 . The workpiece 201 is pasted on the central portion of the expansion sheet 206 . The expansion piece 206 forms an annular region 208 between the inner edge of the inner periphery of the annular frame 207 and the outer edge of the outer periphery of the workpiece 201 .

工件201是與工件101相同的晶圓。工件201是如圖16所示,在以分別延伸於正面202之互相交叉的C方向及D方向上之第1分割預定線203及第2分割預定線204所劃分的各區域中,形成具有延伸於C方向上的長邊和延伸於D方向上的短邊之長方形的元件晶片205。第1分割預定線203的間距由元件晶片205的短邊長度決定。第2分割預定線204的間距由元件晶片205的長邊長度決定。因此,第1分割預定線203的間距比第2分割預定線204的間距小。工件201分別沿著第1分割預定線203以及第2分割預定線204,形成與形成在工件101上的改質層109相同的改質層209。The workpiece 201 is the same wafer as the workpiece 101 . As shown in FIG. 16, the workpiece 201 is formed in each area divided by the first planned dividing line 203 and the second planned dividing line 204 respectively extending on the front surface 202 in the mutually intersecting C direction and D direction. A rectangular device chip 205 with a long side in the C direction and a short side extending in the D direction. The pitch of the first planned division lines 203 is determined by the length of the short side of the element wafer 205 . The pitch of the second planned division lines 204 is determined by the length of the long side of the element wafer 205 . Therefore, the pitch of the first planned division lines 203 is smaller than the pitch of the second planned division lines 204 . On the workpiece 201 , the same modified layer 209 as the modified layer 109 formed on the workpiece 101 is formed along the first planned dividing line 203 and the second planned dividing line 204 .

擴張片206具有與擴張片106相同的性質,張力所施加的方向配置為朝向元件晶片205的長邊方向即圖16的C方向。The expansion sheet 206 has the same properties as the expansion sheet 106 , and the direction in which tension is applied is arranged to face the long side direction of the element wafer 205 , that is, the direction C in FIG. 16 .

接著,說明變形例之分割裝置10的操作之一例的工件201之分割方法。變形例的分割方法是在實施方式1的分割方法中將工件101變更為工件201者。在片擴張步驟ST2中,工件201由於分別沿著第1分割預定線203及第2分割預定線204形成有改質層209,以此改質層209作為起點,被沿著第1分割預定線203及第2分割預定線204分割的同時,元件晶片205之間分別在C方向及D方向(參閱圖16)上擴展,並在元件晶片205之間形成間隔。在片擴張步驟ST2中,如圖16所示,間隔沿著第1分割預定線203排列形成在C方向上,並且沿著第2分割預定線204排列形成在D方向上,藉以使工件201被分割為個別的元件晶片205。Next, a method for dividing the workpiece 201 as an example of the operation of the dividing device 10 according to the modified example will be described. The division method of the modified example is one in which the workpiece 101 is changed to the workpiece 201 in the division method of the first embodiment. In the sheet expanding step ST2, since the modified layer 209 is formed along the first planned dividing line 203 and the second planned dividing line 204, the workpiece 201 is moved along the first planned dividing line with the modified layer 209 as a starting point. 203 and the second dividing line 204 divide, the element wafers 205 expand in the C direction and the D direction (refer to FIG. 16 ), respectively, and gaps are formed between the element wafers 205 . In the sheet expanding step ST2, as shown in FIG. 16 , the intervals are arranged in the C direction along the first planned dividing line 203 and arranged in the D direction along the second planned dividing line 204, so that the workpiece 201 is Divide into individual element wafers 205 .

在工件單元200中,因為元件晶片205的長邊方向朝向C方向,在C方向中擴張片206未擴張及收縮而由元件晶片205所固定的長度,比在D方向中擴張片206未擴張而由元件晶片205所固定的長度要長。因此,在工件單元200中,擴張片206在片擴張步驟ST2中是D方向之處比C方向更加擴張,藉此,吸引保持步驟ST3執行後產生的環狀區域208的鬆弛量,D方向的量會變成比C方向大。再加上,在工件單元200中,由於擴張片206被捲繞而具有拉伸方向的殘留應力之方向是朝向C方向,所以吸引保持步驟ST3執行後產生的環狀區域208的鬆弛量,D方向的量會變成比C方向大。In the workpiece unit 200, because the long side direction of the element wafer 205 faces the C direction, the length fixed by the element wafer 205 without expanding and shrinking the expansion piece 206 in the C direction is larger than that in the D direction without expanding the expansion piece 206. The length fixed by the element wafer 205 is long. Therefore, in the workpiece unit 200, the expansion sheet 206 is expanded more in the D direction than in the C direction in the sheet expansion step ST2, whereby the slack in the ring-shaped region 208 generated after the execution of the suction and holding step ST3 is absorbed and held. The amount will become larger than the C direction. In addition, in the workpiece unit 200, since the expansion sheet 206 is wound and the direction of the residual stress in the tensile direction is toward the direction C, the amount of slack in the ring-shaped region 208 generated after the suction and holding step ST3 is performed, D The magnitude of the direction will become larger than that of the C direction.

從而,環狀區域208的凸狀部分之垂直方向的高度成為極大的凸頂部208-1是如圖16所示,成為在D方向上延展的橢圓形狀。亦即,凸頂部208-1在長軸區域215中位在比環狀區域208徑方向的中央部分更外側,長軸區域215是鬆弛部分208-2之中橢圓形狀之長軸方向的區域,在短軸區域216中位在比環狀區域208徑方向的中央部分更內側,短軸區域216是鬆弛部分208-2之中橢圓形狀之短軸方向的區域。起因於元件晶片205的形狀及大小,此凸頂部208-1的橢圓形狀,相較於實施方式1的凸頂部108-1的橢圓形狀,長軸/短軸比更大。再者,決定長軸區域215及短軸區域216的邊界線217和218是根據施加在擴張片206上的張力大小以及元件晶片205的形狀和大小等斟酌決定。Accordingly, the convex top portion 208-1 in which the height in the vertical direction of the convex portion of the annular region 208 is maximized has an elliptical shape extending in the D direction as shown in FIG. 16 . That is, the convex top 208-1 is located outside the central part in the radial direction of the annular region 208 in the long-axis region 215, which is the region in the long-axis direction of the ellipse in the slack portion 208-2, The minor axis region 216 is located further inside than the central portion in the radial direction of the annular region 208 in the minor axis region 216, which is a region in the minor axis direction of the oval shape in the slack portion 208-2. Due to the shape and size of the element wafer 205, the elliptical shape of the convex top 208-1 has a larger major axis/short axis ratio than the elliptical shape of the convex top 108-1 of the first embodiment. Furthermore, the boundary lines 217 and 218 determining the major axis region 215 and the minor axis region 216 are determined according to the tension applied on the expansion sheet 206 and the shape and size of the device wafer 205 .

變形例的加熱步驟ST4是與實施方式1的加熱步驟ST4相同,控制單元70藉由第1加熱位置調整部64,根據凸頂部208-1的位置,在工件201的徑方向上調整加熱部63的位置以執行。The heating step ST4 of the modified example is the same as the heating step ST4 of the first embodiment. The control unit 70 adjusts the heating part 63 in the radial direction of the workpiece 201 by the first heating position adjustment part 64 according to the position of the convex top part 208-1. location to execute.

如以上所說明的,變形例的分割裝置10即使是在起因為元件晶片205的形狀及大小使擴張片206的伸長方式不同的情況下,也能夠藉由根據該區域變更徑方向的加熱位置,以恰當地加熱擴張片206鬆弛所構成的鬆弛部分208-2。因此,變形例的分割裝置10與實施方式1的分割裝置10相同,能夠正確地維持由擴張片206擴張所形成的元件晶片205之間的各間隔,並能夠抑制分割後的元件晶片205彼此磨擦。As described above, even if the splitting device 10 of the modified example causes the expansion sheet 206 to be stretched differently due to the shape and size of the element wafer 205, by changing the heating position in the radial direction according to the area, The formed slack portion 208-2 is loosened by appropriately heating the expansion sheet 206. Therefore, like the dividing apparatus 10 of the first embodiment, the dividing apparatus 10 of the modified example can accurately maintain the respective intervals between the element wafers 205 expanded by the expanding sheet 206, and can suppress the friction between the divided element wafers 205. .

另外,實施方式2的分割裝置10-2以及實施方式3的分割裝置10-3中,也是與上述變形例相同,能夠將分割對象從工件101變更為工件201。即使在該些情況下,與實施方式2以及實施方式3相同,能夠恰當地加熱鬆弛部分208-2,且能夠正確地維持由擴張片206擴張所形成的元件晶片205之間的各間隔,並能夠抑制分割後的元件晶片205彼此磨擦。In addition, also in the dividing apparatus 10 - 2 of the second embodiment and the dividing apparatus 10 - 3 of the third embodiment, the object of dividing can be changed from the workpiece 101 to the workpiece 201 as in the above modification. Even in these cases, as in Embodiments 2 and 3, the slack portion 208-2 can be properly heated, and the intervals between the element wafers 205 formed by expanding the expansion sheet 206 can be accurately maintained, and It is possible to prevent the divided element wafers 205 from rubbing against each other.

(實施方式4) 圖17是實施方式4之分割裝置10-4的加熱單元60-4之功能區塊圖。實施方式4的分割裝置10-4是組合實施方式1的分割裝置10、實施方式2的分割裝置10-2以及實施方式3的分割裝置10-3。具體而言,實施方式4的分割裝置10-4具備組合了實施方式1的加熱單元60、實施方式2的加熱單元60-2以及實施方式3的加熱單元60-3之加熱單元60-4。在實施方式4之分割裝置10-4的說明中,與從實施方式1到實施方式3及變形例相同部分標記相同符號並省略說明。(Embodiment 4) Fig. 17 is a functional block diagram of heating unit 60-4 of dividing device 10-4 according to Embodiment 4. The dividing device 10 - 4 of the fourth embodiment is a combination of the dividing device 10 of the first embodiment, the dividing device 10 - 2 of the second embodiment, and the dividing device 10 - 3 of the third embodiment. Specifically, the division apparatus 10-4 of Embodiment 4 is equipped with the heating unit 60-4 which combined the heating unit 60 of Embodiment 1, the heating unit 60-2 of Embodiment 2, and the heating unit 60-3 of Embodiment 3. In the description of the dividing device 10 - 4 of the fourth embodiment, the same parts as those in the first to third embodiments and the modified example are denoted by the same reference numerals and descriptions thereof are omitted.

加熱單元60-4是如圖17所示,具備多個加熱調整部69-1、69-2、69-3及69-4,以及轉動部65。多個加熱調整部69-1、69-2、69-3及69-4是分別連接至加熱部63-1、63-2、63-3及63-4。以下敘述中,在不區分加熱調整部69-1、69-2、69-3及69-4的情況下斟酌記載為加熱調整部69。加熱調整部69具備第1加熱位置調整部64、第2加熱位置調整部66以及加熱溫度調整部68。As shown in FIG. 17 , the heating unit 60 - 4 includes a plurality of heating adjustment units 69 - 1 , 69 - 2 , 69 - 3 , and 69 - 4 and a rotating unit 65 . A plurality of heating adjustment parts 69-1, 69-2, 69-3 and 69-4 are respectively connected to the heating parts 63-1, 63-2, 63-3 and 63-4. In the following description, when not distinguishing between the heating adjustment parts 69-1, 69-2, 69-3, and 69-4, it will be described as the heating adjustment part 69 as appropriate. The heating adjustment unit 69 includes a first heating position adjustment unit 64 , a second heating position adjustment unit 66 , and a heating temperature adjustment unit 68 .

因為具有如以上的構成,加熱調整部69是使加熱部63的位置分別個別地,藉由在工件101的徑方向上移動以調整加熱部63在工件101徑方向的加熱位置,同時藉由在與擴張片106的遠近方向上移動以調整由加熱部63與工件101之間的距離,以及,通過調整加熱部63的加熱溫度,調整由加熱部63對工件101的加熱溫度。Because of the structure as above, the heating adjustment unit 69 makes the position of the heating unit 63 individually, and adjusts the heating position of the heating unit 63 in the radial direction of the workpiece 101 by moving in the radial direction of the workpiece 101. Move in the far-near direction with the expansion piece 106 to adjust the distance between the heating part 63 and the workpiece 101 , and adjust the heating temperature of the workpiece 101 by the heating part 63 by adjusting the heating temperature of the heating part 63 .

如以上所說明的,實施方式4的分割裝置10-4能夠同時發揮由實施方式1至實施方式3以及變形例所帶來的各種作用效果。As described above, the dividing device 10 - 4 according to Embodiment 4 can exhibit various functions and effects brought about by Embodiments 1 to 3 and the modified examples at the same time.

再者,若依據前述實施方式1及實施方式2的分割裝置,可得到以下的工件分割方法。 (附記1) 一種工件分割方法,其將工件單元的擴張片擴張並分割工件,該工件單元由沿著分割預定線形成有分割起點的板狀的工件、黏貼有該工件的該擴張片以及黏貼有該擴張片的環狀框架所組成,該工件分割方法具備: 框架固定步驟,固定該工件單元的該環狀框架; 片擴張步驟,將該工件外周與該環狀框架內周之間的該擴張片的環狀區域往與該工件的正面正交的方向推壓且擴張該擴張片,並從該分割起點將該工件斷裂;以及 加熱步驟,加熱該被擴張的該擴張片的該環狀區域,且使該擴張片的鬆弛部分收縮; 其中,該加熱步驟中,在該工件的徑方向上或與該擴張片的遠近方向上調整沿著該環狀區域設置於圓周方向上的多個加熱部的位置。 (附記2) 如附記1所述的工件分割方法,其中,該加熱步驟中,將多個該加熱部分別調整為不同溫度。Furthermore, according to the dividing apparatuses of Embodiment 1 and Embodiment 2 described above, the following workpiece dividing methods can be obtained. (Additional Note 1) A method of dividing a workpiece by expanding an expansion piece of a workpiece unit, the workpiece unit is composed of a plate-shaped workpiece with a starting point for division formed along a planned division line, the expansion piece on which the workpiece is pasted, and a pasted Composed of an annular frame with the expansion sheet, the workpiece division method includes: a frame fixing step, fixing the annular frame of the workpiece unit; a sheet expansion step, the The annular region of the expansion sheet pushes and expands the expansion sheet in a direction perpendicular to the front surface of the workpiece, and breaks the workpiece from the splitting starting point; and a heating step of heating the expanded annular area of the expansion sheet region, and shrink the slack part of the expansion sheet; wherein, in the heating step, adjust the radial direction of the workpiece or the direction of the distance from the expansion sheet to adjust a plurality of The position of the heating part. (Supplementary Note 2) The workpiece dividing method according to Supplementary Note 1, wherein in the heating step, the plurality of heating parts are adjusted to different temperatures, respectively.

上述工件分割方法是與實施方式的分割裝置相同,即使在擴張片的鬆弛方式及延伸方式中任一者不同的情況下,都能夠恰當地加熱擴張片鬆弛的部分。因此,上述工件分割方法能夠正確地維持由擴張片的擴張所形成的元件晶片之間的各間隔,並能夠抑制分割後的元件晶片彼此磨擦。The workpiece dividing method described above is the same as the dividing device of the embodiment, and even when either the relaxation method or the stretching method of the expansion sheet is different, the relaxed portion of the expansion sheet can be appropriately heated. Therefore, the above-mentioned workpiece dividing method can accurately maintain the respective intervals between the element wafers formed by the expansion of the expansion piece, and can suppress the friction between the divided element wafers.

另外,本發明非限定於上述實施方式。亦即,在未超出本發明精神的範圍內可以實施各種變形。In addition, this invention is not limited to the said embodiment. That is, various modifications can be made within the scope not departing from the spirit of the present invention.

10、10-2、10-3、10-4‧‧‧分割裝置20‧‧‧腔室30‧‧‧保持台31‧‧‧保持面32‧‧‧框體33‧‧‧吸附部34‧‧‧真空吸引源40‧‧‧框架固定部41‧‧‧框架載置板42‧‧‧框架壓板43、47‧‧‧開口部44‧‧‧上表面45、48、54、55‧‧‧氣缸45-1、48-1、54-1、55-1‧‧‧活塞桿46‧‧‧中心導引件49‧‧‧長孔50‧‧‧片擴張單元51‧‧‧上推構件52‧‧‧升降單元53‧‧‧滾軸構件60、60-2、60-3、60-4‧‧‧加熱單元61‧‧‧單元本體62、62-1、62-2、62-3、62-4‧‧‧把持部63、63-1、63-2、63-3、63-4‧‧‧加熱部64、64-1、64-2、64-3、64-4‧‧‧第1加熱位置調整部65‧‧‧轉動部66、66-1、66-2、66-3、66-4‧‧‧第2加熱位置調整部67-1、67-2、67-3、67-4‧‧‧區域68、68-1、68-2、68-3、68-4‧‧‧加熱溫度調整部69、69-1、69-2、69-3、69-4‧‧‧加熱調整部70‧‧‧控制單元80‧‧‧搬送單元100、200‧‧‧工件單元101、201‧‧‧工件102、202‧‧‧正面103‧‧‧分割預定線105、205‧‧‧元件晶片106、206‧‧‧擴張片107、207‧‧‧環狀框架108、208‧‧‧環狀區域108-1、208-1‧‧‧凸頂部108-2、208-2‧‧‧鬆弛部分109、209‧‧‧改質層113、213、214‧‧‧間隔115、215‧‧‧長軸區域116、216‧‧‧短軸區域117、118、217、218‧‧‧邊界線203‧‧‧第1分割預定線204‧‧‧第2分割預定線10, 10-2, 10-3, 10-4‧‧‧Splitting device 20‧‧‧chamber 30‧‧holding platform 31‧‧‧holding surface 32‧‧‧frame 33‧‧‧adsorption part 34‧ ‧‧Vacuum suction source 40‧‧‧Frame fixing part 41‧‧‧Frame mounting plate 42‧‧‧Frame pressing plate 43, 47‧‧‧Opening 44‧‧‧Upper surface 45, 48, 54, 55‧‧‧ Cylinder 45-1, 48-1, 54-1, 55-1‧‧‧piston rod 46‧‧‧center guide 49‧‧‧long hole 50‧‧‧piece expansion unit 51‧‧‧push member 52 ‧‧‧Elevating unit 53‧‧‧Roller members 60, 60-2, 60-3, 60-4‧‧‧Heating unit 61‧‧‧Unit body 62, 62-1, 62-2, 62-3, 62-4‧‧‧Gripping part 63, 63-1, 63-2, 63-3, 63-4‧‧‧Heating part 64, 64-1, 64-2, 64-3, 64-4‧‧‧ 1st heating position adjustment part 65‧‧‧rotation part 66, 66-1, 66-2, 66-3, 66-4‧‧‧second heating position adjustment part 67-1, 67-2, 67-3, 67-4‧‧‧Areas 68, 68-1, 68-2, 68-3, 68-4‧‧‧Heating temperature adjustment unit 69, 69-1, 69-2, 69-3, 69-4‧‧ ‧Heating adjustment part 70‧‧‧Control unit 80‧‧‧Conveying unit 100, 200‧‧‧Workpiece unit 101, 201‧‧‧Workpiece 102, 202‧‧‧Front side 103‧‧‧Scheduled dividing line 105, 205‧‧ ‧Element chip 106, 206‧‧‧expansion piece 107, 207‧‧‧ring frame 108, 208‧‧‧ring area 108-1, 208-1‧‧‧convex top 108-2, 208-2‧‧ ‧Loose part 109, 209‧‧‧modified layer 113,213,214‧‧‧interval 115,215‧‧‧major axis area 116,216‧‧‧short axis area 117,118,217,218‧‧‧boundary Line 203‧‧‧The first planned dividing line 204‧‧‧The second planned dividing line

圖1是表示實施方式1之分割裝置的分割對象之工件單元的一例之俯視圖。 圖2是表示實施方式1之分割裝置的構成例之立體圖。 圖3是在圖2之片擴張單元的III-III剖面之剖面圖。 圖4是在圖2之片擴張單元的IV-IV剖面之剖面圖。 圖5是在圖2之加熱單元的上表面圖。 圖6是在圖5之加熱單元的功能區塊圖。 圖7是在圖5之加熱單元的VII-VII剖面之剖面圖。 圖8是實施方式1之分割裝置的操作之一例的工件分割方法之流程圖。 圖9是表示在執行圖8的加熱步驟時分割裝置的主要部分之剖面圖。 圖10是表示圖8的加熱步驟中進行加熱的加熱單元之俯視圖。 圖11是放大表示圖9的XI部之剖面圖。 圖12是實施方式2之分割裝置的加熱單元之功能區塊圖。 圖13是實施方式2之加熱單元的剖面圖。 圖14是放大表示實施方式2之加熱步驟中工件單元及加熱單元的主要部分之剖面圖。 圖15是實施方式3之分割裝置的加熱單元之功能區塊圖。 圖16是表示作為分割裝置的分割對象之變形例的工件單元之俯視圖。 圖17是實施方式4之分割裝置的加熱單元之功能區塊圖。FIG. 1 is a plan view showing an example of a workpiece unit to be divided by the dividing device according to the first embodiment. FIG. 2 is a perspective view showing a configuration example of a dividing device according to Embodiment 1. FIG. Fig. 3 is a cross-sectional view of the section III-III of the sheet expansion unit of Fig. 2 . Fig. 4 is a cross-sectional view at section IV-IV of the sheet expansion unit of Fig. 2 . FIG. 5 is a top view of the heating unit in FIG. 2 . FIG. 6 is a functional block diagram of the heating unit in FIG. 5 . FIG. 7 is a cross-sectional view at section VII-VII of the heating unit of FIG. 5 . 8 is a flowchart of a workpiece dividing method as an example of the operation of the dividing device according to the first embodiment. Fig. 9 is a cross-sectional view showing the main part of the dividing device when the heating step of Fig. 8 is performed. Fig. 10 is a plan view showing a heating unit for heating in the heating step of Fig. 8 . FIG. 11 is an enlarged cross-sectional view of portion XI in FIG. 9 . FIG. 12 is a functional block diagram of a heating unit of a dividing device according to Embodiment 2. FIG. Fig. 13 is a sectional view of a heating unit according to Embodiment 2. 14 is an enlarged cross-sectional view showing a main part of a workpiece unit and a heating unit in a heating step of Embodiment 2. FIG. FIG. 15 is a functional block diagram of a heating unit of a dividing device according to Embodiment 3. FIG. Fig. 16 is a plan view showing a modified example of a workpiece unit to be divided by the dividing device. FIG. 17 is a functional block diagram of a heating unit of a dividing device according to Embodiment 4. FIG.

10‧‧‧分割裝置 10‧‧‧Splitting device

20‧‧‧腔室 20‧‧‧chamber

30‧‧‧保持台 30‧‧‧Holding table

31‧‧‧保持面 31‧‧‧Retaining surface

32‧‧‧框體 32‧‧‧frame

33‧‧‧吸附部 33‧‧‧Adsorption part

34‧‧‧真空吸引源 34‧‧‧Vacuum suction source

40‧‧‧框架固定部 40‧‧‧Frame fixing part

41‧‧‧框架載置板 41‧‧‧Frame mounting plate

42‧‧‧框架壓板 42‧‧‧Frame pressure plate

43、47‧‧‧開口部 43, 47‧‧‧opening

44‧‧‧上表面 44‧‧‧upper surface

45、48‧‧‧氣缸 45, 48‧‧‧Cylinder

45-1、48-1‧‧‧活塞桿 45-1, 48-1‧‧‧piston rod

46‧‧‧中心導引件 46‧‧‧center guide

49‧‧‧長孔 49‧‧‧long hole

50‧‧‧片擴張單元 50‧‧‧expansion unit

60‧‧‧加熱單元 60‧‧‧heating unit

61‧‧‧單元本體 61‧‧‧unit body

62-1、62-2、62-3、62-4‧‧‧把持部 62-1, 62-2, 62-3, 62-4‧‧‧Control Department

63-1、63-2、63-3、63-4‧‧‧加熱部 63-1, 63-2, 63-3, 63-4‧‧‧heating part

70‧‧‧控制單元 70‧‧‧control unit

80‧‧‧搬送單元 80‧‧‧Conveyor unit

100‧‧‧工件單元 100‧‧‧work unit

Claims (3)

一種分割裝置,其將工件單元的擴張片擴張並分割工件,該工件單元由沿著分割預定線形成有分割起點的板狀的工件、黏貼有該工件的該擴張片以及黏貼有該擴張片的環狀框架所組成,該分割裝置具備:框架固定部,其固定該工件單元的該環狀框架;片擴張單元,其將該工件外周與該環狀框架內周之間的該擴張片的環狀區域往與該工件的正面正交的方向推壓且擴張該擴張片,並從該分割起點將該工件斷裂;以及加熱單元,其加熱該被擴張的該擴張片的該環狀區域,且使該擴張片的鬆弛部分收縮;其中,該加熱單元係具備:多個加熱部,其沿著該環狀區域的圓周方向設置;轉動部,其使該些加熱部沿著該擴張片的該環狀區域在圓周方向上移動;以及加熱位置調整部,其使該些加熱部的位置分別個別地,藉由在該工件的徑方向上移動,以在該工件的徑方向上調整該些加熱部的位置;該分割裝置進一步具備:控制單元,其控制構成要素,該控制單元藉由該加熱位置調整部,使將相對於該擴張片的該環狀區域之A方向交叉且較該A方向容易擴張之B方向的兩端部加熱的加熱部,定位在較將該擴張片的該環狀區域之A方向的兩端部加熱的加熱部更徑方向之外側。 A splitting device, which expands the expansion piece of the workpiece unit and divides the workpiece. The workpiece unit is composed of a plate-shaped workpiece with a starting point of division formed along the planned division line, the expansion piece pasted with the workpiece, and the Composed of a ring-shaped frame, the dividing device has: a frame fixing part, which fixes the ring-shaped frame of the workpiece unit; a sheet expansion unit, which connects the ring of the expanded sheet between the outer circumference of the workpiece and the inner circumference of the ring-shaped frame. a shape area pushes and expands the expansion sheet in a direction perpendicular to the front surface of the workpiece, and breaks the workpiece from the dividing starting point; and a heating unit heats the expanded annular area of the expansion sheet, and contracting the slack part of the expansion sheet; wherein, the heating unit is provided with: a plurality of heating parts arranged along the circumferential direction of the annular region; a rotating part making the heating parts along the expansion sheet The annular area moves in the circumferential direction; and the heating position adjustment part adjusts the heating parts in the radial direction of the workpiece by moving the positions of the heating parts individually in the radial direction of the workpiece. The position of the portion; the dividing device further includes: a control unit, which controls the constituent elements, and the control unit uses the heating position adjustment part to make the direction A of the annular region relative to the expansion piece intersect and compare the A direction The heating portion for heating the both ends in the direction B that is easy to expand is positioned radially outward of the heating portion for heating the both ends of the annular region in the A direction of the expandable sheet. 一種分割裝置,其將工件單元的擴張片擴張並分割工件,該工件單元由沿著分割預定線形成有分割起點的板狀的工件、黏貼有該工件的該擴張片以及黏貼有該擴張片的環狀框架所組成,該分割裝置具備:框架固定部,其固定該工件單元的該環狀框架;片擴張單元,其將該工件外周與該環狀框架內周之間的該擴張片的環狀區域往與該工件的正面正交的方向推壓且擴張該擴張片,並從該分割起點將該工件斷裂;以及 加熱單元,其加熱該被擴張的該擴張片的該環狀區域,且使該擴張片的鬆弛部分收縮;其中,該加熱單元係具備:多個加熱部,其沿著該環狀區域的圓周方向設置;轉動部,其使該些加熱部沿著該擴張片的該環狀區域在圓周方向上移動;以及加熱位置調整部,其使該些加熱部的位置分別個別地,藉由在與該擴張片的遠近方向上移動,以在與該擴張片的遠近方向上調整該些加熱部的位置;該分割裝置進一步具備:控制單元,其控制構成要素,該控制單元藉由該加熱位置調整部,使將相對於該擴張片的該環狀區域之A方向交叉且較該A方向容易擴張之B方向的兩端部加熱的加熱部,較將該擴張片的該環狀區域之A方向的兩端部加熱的加熱部更接近該擴張片。 A splitting device, which expands the expansion piece of the workpiece unit and divides the workpiece. The workpiece unit is composed of a plate-shaped workpiece with a starting point of division formed along the planned division line, the expansion piece pasted with the workpiece, and the Composed of a ring-shaped frame, the dividing device has: a frame fixing part, which fixes the ring-shaped frame of the workpiece unit; a sheet expansion unit, which connects the ring of the expanded sheet between the outer circumference of the workpiece and the inner circumference of the ring-shaped frame. pushes and expands the expansion sheet in a direction perpendicular to the front of the workpiece, and breaks the workpiece from the splitting starting point; and a heating unit, which heats the expanded annular region of the expanded sheet, and shrinks the slack part of the expanded sheet; wherein, the heating unit is provided with: a plurality of heating parts along the circumference of the annular region The direction is set; the rotating part, which makes the heating parts move in the circumferential direction along the annular region of the expansion piece; and the heating position adjustment part, which makes the positions of the heating parts individually, by The expansion sheet moves in the far-near direction to adjust the positions of the heating parts in the far-near direction of the expansion sheet; the dividing device further includes: a control unit, which controls the constituent elements, and the control unit is adjusted by the heating position part, the heating part that heats the two ends of the B direction that crosses the A direction of the annular region of the expansion sheet and is easier to expand than the A direction The heating parts that are heated at both ends are closer to the expansion sheet. 如請求項1或2所述的分割裝置,其中,多個該加熱部分別被調整為不同溫度。 The dividing device according to claim 1 or 2, wherein the plurality of heating parts are respectively adjusted to different temperatures.
TW107146802A 2017-12-27 2018-12-24 Separation device TWI784112B (en)

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JP2017252048A JP7109916B2 (en) 2017-12-27 2017-12-27 splitter
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JP7486345B2 (en) 2020-05-01 2024-05-17 株式会社ディスコ EXPANSION METHOD AND EXPANSION DEVICE
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