TWI783674B - Electronic device - Google Patents
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- TWI783674B TWI783674B TW110133758A TW110133758A TWI783674B TW I783674 B TWI783674 B TW I783674B TW 110133758 A TW110133758 A TW 110133758A TW 110133758 A TW110133758 A TW 110133758A TW I783674 B TWI783674 B TW I783674B
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Abstract
Description
本發明關於一種電子裝置,尤指一種可有效增進散熱效能之電子裝置。The present invention relates to an electronic device, especially an electronic device that can effectively improve heat dissipation performance.
目前,筆記型電腦已被廣泛地應用於人們的日常生活中。一般而言,筆記型電腦中皆設置有風扇與散熱鰭片所組成的散熱模組,以對筆記型電腦中的電子元件進行散熱。現有筆記型電腦的風扇係自下方進氣轉後方或側邊出氣,導致後方或側邊需要加開散熱孔,使外觀不夠乾淨簡潔。此外,隨著電子元件的效能提升,電子元件運作時產生的熱能也愈來愈多,加上筆記型電腦趨向於輕薄的需求,導致電子元件產生更多熱能而無法達到高效散熱。因此,傳統的散熱設計已無法滿足需求。At present, notebook computers have been widely used in people's daily life. Generally speaking, a cooling module composed of a fan and cooling fins is provided in a notebook computer to dissipate heat from electronic components in the notebook computer. The fan of the existing notebook computer is air intake from the bottom to the rear or side outlet, resulting in the need to add cooling holes to the rear or side, making the appearance not clean and simple. In addition, with the improvement of the performance of electronic components, more and more heat energy is generated during the operation of electronic components, coupled with the demand for thinner and lighter notebook computers, resulting in more heat energy generated by electronic components and unable to achieve efficient heat dissipation. Therefore, the traditional heat dissipation design can no longer meet the demand.
本發明提供一種可有效增進散熱效能之電子裝置,以解決上述之問題。The present invention provides an electronic device that can effectively improve heat dissipation performance to solve the above problems.
根據一實施例,本發明之電子裝置包含一座體、一電路板以及一散熱模組。座體包含一底板以及一框架,框架設置於底板上,底板與框架之間具有一容置空間,底板具有一進氣口。電路板設置於容置空間中,電路板具有一通孔,通孔之位置對應進氣口之位置。散熱模組設置於容置空間中,且位於電路板上方。散熱模組包含一風扇,風扇之位置對應通孔之位置。風扇帶動一氣流沿風扇之一軸向自進氣口與通孔流入容置空間,且沿風扇之軸向自容置空間流出座體。According to an embodiment, the electronic device of the present invention includes a base, a circuit board and a heat dissipation module. The seat body includes a bottom plate and a frame, the frame is arranged on the bottom plate, there is an accommodating space between the bottom plate and the frame, and the bottom plate has an air inlet. The circuit board is arranged in the accommodating space, and the circuit board has a through hole, and the position of the through hole corresponds to the position of the air inlet. The cooling module is arranged in the accommodating space and above the circuit board. The cooling module includes a fan, and the position of the fan corresponds to the position of the through hole. The fan drives an airflow into the accommodating space from the air inlet and the through hole along an axial direction of the fan, and flows out of the seat from the accommodating space along the axial direction of the fan.
綜上所述,本發明之風扇係帶動氣流沿風扇之軸向自底板之進氣口與電路板之通孔流入座體之容置空間,且沿風扇之軸向自座體之容置空間流出座體。換言之,本發明之風扇係沿風扇之軸向自座體之下方進氣且自座體之上方出氣。由於散熱模組之上方為完全開放的空間,因此,可有效增進散熱效能。此外,由於本發明係自座體之上方出氣,因此,座體之後方或側邊不須開設散熱孔,使外觀可維持簡潔。In summary, the fan of the present invention drives the airflow along the axial direction of the fan to flow into the accommodation space of the base from the air inlet of the bottom plate and the through hole of the circuit board, and flows from the accommodation space of the base along the axial direction of the fan. Flow out of the seat body. In other words, the fan of the present invention takes in air from below the base along the axial direction of the fan and exhausts air from above the base. Since there is a completely open space above the heat dissipation module, the heat dissipation performance can be effectively improved. In addition, since the air is vented from the top of the seat in the present invention, there is no need to provide heat dissipation holes on the rear or side of the seat, so that the appearance can be kept simple.
關於本發明之優點與精神可以藉由以下的發明詳述及所附圖式得到進一步的瞭解。The advantages and spirit of the present invention can be further understood through the following detailed description of the invention and the accompanying drawings.
請參閱第1圖至第5圖,第1圖為根據本發明一實施例之電子裝置1的立體圖,第2圖為第1圖中的電子裝置1於另一視角的立體圖,第3圖為第1圖中的電子裝置1的爆炸圖,第4圖為第3圖中的散熱模組14於另一視角的立體圖,第5圖為第1圖中的電子裝置1沿X-X線的剖面圖。Please refer to Figures 1 to 5, Figure 1 is a perspective view of an
如第1圖至第5圖所示,電子裝置1包含一座體10、一電路板12、一散熱模組14、一電子元件16、一導熱介質18、複數個固定件20以及一顯示器22。在本實施例中,顯示器22樞接於座體10,使得電子裝置1形成筆記型電腦,但不以此為限。在另一實施例中,電子裝置1亦可為不包含顯示器22之其它電子裝置。一般而言,電子裝置1中還會設有運作時必要的軟硬體元件,如記憶體、電源供應器、應用程式、通訊模組等,視實際應用而定。As shown in FIGS. 1 to 5 , the
座體10包含一底板100以及一框架102。框架102設置於底板100上,且底板100與框架102之間具有一容置空間104。底板100具有一進氣口106。電路板12設置於容置空間104中,且電路板12具有一通孔120,其中通孔120之位置對應進氣口106之位置。在本實施例中,有二電子元件16設置於電路板12上。需說明的是,電子元件16的數量可根據實際應用而決定,不以圖中所繪示的實施例為限。電子元件16可為中央處理器(central processing unit,CPU)、圖形處理器(graphics processing unit,GPU)、固態硬碟(solid-state drive,SSD)或其它電子元件,視實際應用而定。The
散熱模組14設置於容置空間104中,且位於電路板12上方。在本實施例中,散熱模組14包含一風扇140以及一散熱鰭片組142,其中風扇140可設置於散熱鰭片組142之中間位置處。風扇140之位置對應電路板12之通孔120之位置,且散熱鰭片組142之位置對應電子元件16之位置。在本實施例中,有二導熱介質18分別設置於二電子元件16上,且抵接於散熱鰭片組142,使得各電子元件16所產生的熱量可經由導熱介質18傳導至散熱鰭片組142,進而由散熱鰭片組142將熱量消散至電子裝置1之外部。導熱介質18可為導熱膠或其它導熱元件,視實際應用而定。The
在本實施例中,散熱鰭片組142可包含複數個固定柱144。組裝座體10時,可先將複數個固定件20穿過電路板12與複數個固定柱144而鎖固於框架102,以將電路板12與散熱模組14固定於框架102,且使電子元件16上的導熱介質18緊密地貼合於散熱鰭片組142。接著,再將底板100與框架102結合,即可完成座體10的組裝。當欲對電路板12及/或散熱模組14進行維修時,只要將底板100與固定件20依序拆下即可,非常方便。在本實施例中,固定件20與固定柱144皆為二個,但不以此為限。固定件20與固定柱144的數量可根據實際應用而決定。In this embodiment, the cooling fin set 142 may include a plurality of
如第5圖所示,風扇140可帶動一氣流F沿風扇140之一軸向D自底板100之進氣口106與電路板12之通孔120流入座體10之容置空間104。此時,氣流F即會將電子元件16產生的熱量帶走,且沿風扇140之軸向D自座體10之容置空間104流出座體10。換言之,風扇140係沿風扇140之軸向D自座體10之下方進氣且自座體10之上方出氣。由於散熱模組14之上方為完全開放的空間,因此,可有效增進散熱效能。此外,由於本發明係自座體10之上方出氣,因此,座體10之後方或側邊不須開設散熱孔,使外觀可維持簡潔。此外,電子元件16所產生的熱量還可經由導熱介質18傳導至散熱鰭片組142,進而由散熱鰭片組142將熱量消散至電子裝置1之外部。藉此,即可進一步增進散熱效能。As shown in FIG. 5 , the
請參閱第6圖以及第7圖,第6圖為根據本發明另一實施例之電子裝置1的俯視圖,第7圖為第6圖中的電子裝置1沿Y-Y線的剖面圖。Please refer to FIG. 6 and FIG. 7. FIG. 6 is a top view of an
如第6圖與第7圖所示,座體10可另包含一鍵盤108以及一抬升機構110。在本實施例中,鍵盤108可移動地設置於框架102上,且位於容置空間104上方。抬升機構110用以驅動鍵盤108相對框架102抬升或閉合。如第7圖所示,抬升機構110可驅動鍵盤108朝箭頭A1的方向移動而相對框架102抬升,且可驅動鍵盤108朝箭頭A2的方向移動而相對框架102閉合。當鍵盤108相對框架102抬升時,鍵盤108與散熱模組14之間即會形成一間隙G。此時,散熱模組14即可經由間隙G將熱量消散至電子裝置1之外部,以避免鍵盤108溫渡過高。此外,當鍵盤108相對框架102閉合時,鍵盤108即會遮蔽散熱模組14。在另一實施例中,亦可藉由其它機構驅動鍵盤108相對框架102前後移動,視實際應用而定。As shown in FIGS. 6 and 7 , the
請參閱第8圖,第8圖為根據本發明另一實施例之電子裝置1的俯視圖。Please refer to FIG. 8 , which is a top view of an
如第8圖所示,座體10可另包含一鍵盤108以及一蓋板112。在本實施例中,鍵盤108設置於框架102上,且與散熱模組14錯開。蓋板112設置於框架102上,且鄰接於鍵盤108。蓋板112用以遮蔽散熱模組14,以防止使用者觸摸散熱模組14。此外,蓋板112具有複數個氣孔114,使得散熱模組14可經由氣孔114將熱量消散至電子裝置1之外部。As shown in FIG. 8 , the
綜上所述,本發明之風扇係帶動氣流沿風扇之軸向自底板之進氣口與電路板之通孔流入座體之容置空間,且沿風扇之軸向自座體之容置空間流出座體。換言之,本發明之風扇係沿風扇之軸向自座體之下方進氣且自座體之上方出氣。由於散熱模組之上方為完全開放的空間,因此,可有效增進散熱效能。此外,由於本發明係自座體之上方出氣,因此,座體之後方或側邊不須開設散熱孔,使外觀可維持簡潔。在一實施例中,當鍵盤位於座體之容置空間上方時,可利用抬升機構驅動鍵盤相對框架抬升,以於鍵盤與散熱模組之間形成散熱用的間隙。在另一實施例中,當鍵盤與散熱模組錯開時,可利用蓋板遮蔽散熱模組,以防止使用者觸摸散熱模組。 以上所述僅為本發明之較佳實施例,凡依本發明申請專利範圍所做之均等變化與修飾,皆應屬本發明之涵蓋範圍。 In summary, the fan of the present invention drives the airflow along the axial direction of the fan to flow into the accommodation space of the base from the air inlet of the bottom plate and the through hole of the circuit board, and flows from the accommodation space of the base along the axial direction of the fan. Flow out of the seat body. In other words, the fan of the present invention takes in air from the bottom of the base along the axial direction of the fan and exhausts air from above the base. Since there is a completely open space above the heat dissipation module, the heat dissipation performance can be effectively improved. In addition, since the air is vented from the top of the seat, no cooling holes are required on the rear or side of the seat, so that the appearance can be kept simple. In one embodiment, when the keyboard is located above the accommodating space of the base body, the lifting mechanism can be used to drive the keyboard to lift relative to the frame, so as to form a gap for heat dissipation between the keyboard and the cooling module. In another embodiment, when the keyboard and the heat dissipation module are staggered, the heat dissipation module can be covered by the cover plate, so as to prevent the user from touching the heat dissipation module. The above descriptions are only preferred embodiments of the present invention, and all equivalent changes and modifications made according to the scope of the patent application of the present invention shall fall within the scope of the present invention.
1:電子裝置 10:座體 12:電路板 14:散熱模組 16:電子元件 18:導熱介質 20:固定件 22:顯示器 100:底板 102:框架 104:容置空間 106:進氣口 108:鍵盤 110:抬升機構 112:蓋板 114:氣孔 120:通孔 140:風扇 142:散熱鰭片組 144:固定柱 A1,A2:箭頭 D:軸向 F:氣流 G:間隙 X,Y:剖面線1: Electronic device 10: seat body 12: Circuit board 14: Cooling module 16: Electronic components 18: Heat conduction medium 20:Fixer 22: Display 100: Bottom plate 102: frame 104:Accommodating space 106: air inlet 108: keyboard 110: lifting mechanism 112: cover plate 114: stomata 120: through hole 140: fan 142: cooling fin group 144: fixed column A1,A2: Arrows D: Axial F: Airflow G: Gap X, Y: hatching
第1圖為根據本發明一實施例之電子裝置的立體圖。 第2圖為第1圖中的電子裝置於另一視角的立體圖。 第3圖為第1圖中的電子裝置的爆炸圖。 第4圖為第3圖中的散熱模組於另一視角的立體圖。 第5圖為第1圖中的電子裝置的剖面圖。 第6圖為根據本發明另一實施例之電子裝置的俯視圖。 第7圖為第6圖中的電子裝置的剖面圖。 第8圖為根據本發明另一實施例之電子裝置的俯視圖。 FIG. 1 is a perspective view of an electronic device according to an embodiment of the present invention. FIG. 2 is a perspective view of the electronic device in FIG. 1 at another viewing angle. FIG. 3 is an exploded view of the electronic device in FIG. 1 . FIG. 4 is a perspective view of the heat dissipation module in FIG. 3 from another perspective. FIG. 5 is a cross-sectional view of the electronic device in FIG. 1 . FIG. 6 is a top view of an electronic device according to another embodiment of the present invention. FIG. 7 is a cross-sectional view of the electronic device in FIG. 6 . FIG. 8 is a top view of an electronic device according to another embodiment of the present invention.
1:電子裝置 1: Electronic device
10:座體 10: seat body
12:電路板 12: Circuit board
14:散熱模組 14: Cooling module
16:電子元件 16: Electronic components
18:導熱介質 18: Heat conduction medium
20:固定件 20:Fixer
22:顯示器 22: Display
100:底板 100: Bottom plate
102:框架 102: frame
104:容置空間 104:Accommodating space
106:進氣口 106: air inlet
120:通孔 120: through hole
140:風扇 140: fan
142:散熱鰭片組 142: cooling fin group
144:固定柱 144: fixed column
D:軸向 D: Axial
F:氣流 F: Airflow
Claims (9)
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Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
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TWI410782B (en) * | 2008-05-30 | 2013-10-01 | Foxconn Tech Co Ltd | Notebook computer having heat dissipation device |
TW201427577A (en) * | 2012-11-23 | 2014-07-01 | Hon Hai Prec Ind Co Ltd | Heat dissipation device with spray |
TWI573519B (en) * | 2010-09-24 | 2017-03-01 | 鴻準精密工業股份有限公司 | Portable electronic apparatus and thermal module tehreof |
TWM589820U (en) * | 2019-10-08 | 2020-01-21 | 邁萪科技股份有限公司 | Heat sink module for display card |
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Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI410782B (en) * | 2008-05-30 | 2013-10-01 | Foxconn Tech Co Ltd | Notebook computer having heat dissipation device |
TWI573519B (en) * | 2010-09-24 | 2017-03-01 | 鴻準精密工業股份有限公司 | Portable electronic apparatus and thermal module tehreof |
TW201427577A (en) * | 2012-11-23 | 2014-07-01 | Hon Hai Prec Ind Co Ltd | Heat dissipation device with spray |
TWM589820U (en) * | 2019-10-08 | 2020-01-21 | 邁萪科技股份有限公司 | Heat sink module for display card |
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