TWI783674B - Electronic device - Google Patents

Abstract

An electronic device includes a base, a circuit board and a heat dissipating module. The base includes a bottom cover and a frame. The frame is disposed on the bottom cover. An accommodating space is between the bottom cover and the frame. The bottom cover has an air inlet. The circuit board is disposed in the accommodating space. The circuit board has a through hole. A position of the through hole corresponds to a position the air inlet. The heat dissipating module is disposed in the accommodating space and located above the circuit board. The heat dissipating module includes a fan. A position of the fan corresponds to the position of the through hole. The fan drives airflow to flow into the accommodating space from the air inlet and the through hole along an axial direction of the fan and then flow out of the base from the accommodating space along the axial direction of the fan.

Description

electronic device

The present invention relates to an electronic device, especially an electronic device that can effectively improve heat dissipation performance.

At present, notebook computers have been widely used in people's daily life. Generally speaking, a cooling module composed of a fan and cooling fins is provided in a notebook computer to dissipate heat from electronic components in the notebook computer. The fan of the existing notebook computer is air intake from the bottom to the rear or side outlet, resulting in the need to add cooling holes to the rear or side, making the appearance not clean and simple. In addition, with the improvement of the performance of electronic components, more and more heat energy is generated during the operation of electronic components, coupled with the demand for thinner and lighter notebook computers, resulting in more heat energy generated by electronic components and unable to achieve efficient heat dissipation. Therefore, the traditional heat dissipation design can no longer meet the demand.

The present invention provides an electronic device that can effectively improve heat dissipation performance to solve the above problems.

According to an embodiment, the electronic device of the present invention includes a base, a circuit board and a heat dissipation module. The seat body includes a bottom plate and a frame, the frame is arranged on the bottom plate, there is an accommodating space between the bottom plate and the frame, and the bottom plate has an air inlet. The circuit board is arranged in the accommodating space, and the circuit board has a through hole, and the position of the through hole corresponds to the position of the air inlet. The cooling module is arranged in the accommodating space and above the circuit board. The cooling module includes a fan, and the position of the fan corresponds to the position of the through hole. The fan drives an airflow into the accommodating space from the air inlet and the through hole along an axial direction of the fan, and flows out of the seat from the accommodating space along the axial direction of the fan.

In summary, the fan of the present invention drives the airflow along the axial direction of the fan to flow into the accommodation space of the base from the air inlet of the bottom plate and the through hole of the circuit board, and flows from the accommodation space of the base along the axial direction of the fan. Flow out of the seat body. In other words, the fan of the present invention takes in air from below the base along the axial direction of the fan and exhausts air from above the base. Since there is a completely open space above the heat dissipation module, the heat dissipation performance can be effectively improved. In addition, since the air is vented from the top of the seat in the present invention, there is no need to provide heat dissipation holes on the rear or side of the seat, so that the appearance can be kept simple.

The advantages and spirit of the present invention can be further understood through the following detailed description of the invention and the accompanying drawings.

Please refer to Figures 1 to 5, Figure 1 is a perspective view of an electronic device 1 according to an embodiment of the present invention, Figure 2 is a perspective view of the electronic device 1 in Figure 1 from another angle of view, and Figure 3 is Figure 1 is an exploded view of the electronic device 1 in Figure 1, Figure 4 is a perspective view of the heat dissipation module 14 in Figure 3 from another perspective, and Figure 5 is a cross-sectional view of the electronic device 1 in Figure 1 along line X-X .

As shown in FIGS. 1 to 5 , the electronic device 1 includes a base 10 , a circuit board 12 , a heat dissipation module 14 , an electronic component 16 , a heat conduction medium 18 , a plurality of fixing parts 20 and a display 22 . In this embodiment, the display 22 is pivotally connected to the base body 10 so that the electronic device 1 forms a notebook computer, but not limited thereto. In another embodiment, the electronic device 1 may also be other electronic devices that do not include the display 22 . Generally speaking, the electronic device 1 will also be provided with necessary software and hardware components for operation, such as memory, power supply, application program, communication module, etc., depending on the actual application.

The base body 10 includes a bottom plate 100 and a frame 102 . The frame 102 is disposed on the bottom plate 100 , and there is an accommodating space 104 between the bottom plate 100 and the frame 102 . The bottom plate 100 has an air inlet 106 . The circuit board 12 is disposed in the accommodating space 104 , and the circuit board 12 has a through hole 120 , wherein the position of the through hole 120 corresponds to the position of the air inlet 106 . In this embodiment, there are two electronic components 16 disposed on the circuit board 12 . It should be noted that the number of electronic components 16 can be determined according to actual applications, and is not limited to the embodiment shown in the figure. The electronic component 16 can be a central processing unit (CPU), a graphics processing unit (GPU), a solid-state drive (SSD) or other electronic components, depending on the actual application.

The heat dissipation module 14 is disposed in the accommodating space 104 and above the circuit board 12 . In this embodiment, the heat dissipation module 14 includes a fan 140 and a heat dissipation fin set 142 , wherein the fan 140 can be disposed at a middle position of the heat dissipation fin set 142 . The position of the fan 140 corresponds to the position of the through hole 120 of the circuit board 12 , and the position of the cooling fin set 142 corresponds to the position of the electronic component 16 . In this embodiment, there are two heat-conducting media 18 respectively disposed on the two electronic components 16, and abutting against the cooling fin set 142, so that the heat generated by each electronic component 16 can be conducted to the cooling fin set via the heat-conducting medium 18. 142 , and then the heat is dissipated to the outside of the electronic device 1 by the cooling fin set 142 . The heat conduction medium 18 can be heat conduction glue or other heat conduction elements, depending on the actual application.

In this embodiment, the cooling fin set 142 may include a plurality of fixing posts 144 . When assembling the seat body 10, a plurality of fixing parts 20 can first pass through the circuit board 12 and a plurality of fixing columns 144 and be locked to the frame 102, so that the circuit board 12 and the heat dissipation module 14 are fixed on the frame 102, and the electronic The heat conduction medium 18 on the element 16 is closely attached to the cooling fin set 142 . Then, the base plate 100 is combined with the frame 102 to complete the assembly of the seat body 10 . When it is desired to maintain the circuit board 12 and/or the heat dissipation module 14, only the base plate 100 and the fixing member 20 are removed sequentially, which is very convenient. In this embodiment, there are two fixing pieces 20 and two fixing posts 144 , but it is not limited thereto. The quantity of the fixing member 20 and the fixing column 144 can be determined according to the actual application.

As shown in FIG. 5 , the fan 140 can drive an airflow F to flow into the accommodating space 104 of the base 10 from the air inlet 106 of the bottom plate 100 and the through hole 120 of the circuit board 12 along the axial direction D of the fan 140 . At this time, the airflow F will take away the heat generated by the electronic components 16 and flow out of the base 10 from the accommodating space 104 of the base 10 along the axial direction D of the fan 140 . In other words, the fan 140 takes in air from below the base body 10 along the axial direction D of the fan 140 and exhausts air from above the base body 10 . Since the top of the cooling module 14 is a completely open space, the cooling performance can be effectively improved. In addition, since the air is vented from the top of the base 10 in the present invention, there is no need to provide cooling holes on the rear or sides of the base 10, so that the appearance can be kept simple. In addition, the heat generated by the electronic components 16 can also be conducted to the cooling fin set 142 through the heat conducting medium 18 , and then the heat can be dissipated to the outside of the electronic device 1 by the cooling fin set 142 . Thereby, the heat dissipation performance can be further improved.

Please refer to FIG. 6 and FIG. 7. FIG. 6 is a top view of an electronic device 1 according to another embodiment of the present invention, and FIG. 7 is a cross-sectional view of the electronic device 1 in FIG. 6 along line Y-Y.

As shown in FIGS. 6 and 7 , the base body 10 may further include a keyboard 108 and a lifting mechanism 110 . In this embodiment, the keyboard 108 is movably disposed on the frame 102 and located above the accommodating space 104 . The lifting mechanism 110 is used to drive the keyboard 108 to lift or close relative to the frame 102 . As shown in FIG. 7 , the lifting mechanism 110 can drive the keyboard 108 to move in the direction of arrow A1 to lift relative to the frame 102 , and can drive the keyboard 108 to move in the direction of arrow A2 to close relative to the frame 102 . When the keyboard 108 is lifted relative to the frame 102 , a gap G is formed between the keyboard 108 and the cooling module 14 . At this time, the heat dissipation module 14 can dissipate the heat to the outside of the electronic device 1 through the gap G, so as to prevent the keyboard 108 from overheating. In addition, when the keyboard 108 is closed relative to the frame 102 , the keyboard 108 will cover the cooling module 14 . In another embodiment, other mechanisms may also be used to drive the keyboard 108 to move back and forth relative to the frame 102 , depending on actual applications.

Please refer to FIG. 8 , which is a top view of an electronic device 1 according to another embodiment of the present invention.

As shown in FIG. 8 , the base body 10 may further include a keyboard 108 and a cover 112 . In this embodiment, the keyboard 108 is disposed on the frame 102 and staggered from the heat dissipation module 14 . The cover 112 is disposed on the frame 102 and adjacent to the keyboard 108 . The cover plate 112 is used to cover the heat dissipation module 14 to prevent the user from touching the heat dissipation module 14 . In addition, the cover plate 112 has a plurality of air holes 114 so that the heat dissipation module 14 can dissipate heat to the outside of the electronic device 1 through the air holes 114 .

In summary, the fan of the present invention drives the airflow along the axial direction of the fan to flow into the accommodation space of the base from the air inlet of the bottom plate and the through hole of the circuit board, and flows from the accommodation space of the base along the axial direction of the fan. Flow out of the seat body. In other words, the fan of the present invention takes in air from the bottom of the base along the axial direction of the fan and exhausts air from above the base. Since there is a completely open space above the heat dissipation module, the heat dissipation performance can be effectively improved. In addition, since the air is vented from the top of the seat, no cooling holes are required on the rear or side of the seat, so that the appearance can be kept simple. In one embodiment, when the keyboard is located above the accommodating space of the base body, the lifting mechanism can be used to drive the keyboard to lift relative to the frame, so as to form a gap for heat dissipation between the keyboard and the cooling module. In another embodiment, when the keyboard and the heat dissipation module are staggered, the heat dissipation module can be covered by the cover plate, so as to prevent the user from touching the heat dissipation module. The above descriptions are only preferred embodiments of the present invention, and all equivalent changes and modifications made according to the scope of the patent application of the present invention shall fall within the scope of the present invention.

1: Electronic device 10: seat body 12: Circuit board 14: Cooling module 16: Electronic components 18: Heat conduction medium 20:Fixer 22: Display 100: Bottom plate 102: frame 104:Accommodating space 106: air inlet 108: keyboard 110: lifting mechanism 112: cover plate 114: stomata 120: through hole 140: fan 142: cooling fin group 144: fixed column A1,A2: Arrows D: Axial F: Airflow G: Gap X, Y: hatching

FIG. 1 is a perspective view of an electronic device according to an embodiment of the present invention. FIG. 2 is a perspective view of the electronic device in FIG. 1 at another viewing angle. FIG. 3 is an exploded view of the electronic device in FIG. 1 . FIG. 4 is a perspective view of the heat dissipation module in FIG. 3 from another perspective. FIG. 5 is a cross-sectional view of the electronic device in FIG. 1 . FIG. 6 is a top view of an electronic device according to another embodiment of the present invention. FIG. 7 is a cross-sectional view of the electronic device in FIG. 6 . FIG. 8 is a top view of an electronic device according to another embodiment of the present invention.

1: Electronic device

10: seat body

12: Circuit board

14: Cooling module

16: Electronic components

18: Heat conduction medium

20:Fixer

22: Display

100: Bottom plate

102: frame

104:Accommodating space

106: air inlet

120: through hole

140: fan

142: cooling fin group

144: fixed column

D: Axial

F: Airflow

Claims (9)

An electronic device comprising: The seat includes a base plate and a frame, the frame is arranged on the base plate, there is an accommodating space between the base plate and the frame, and the base plate has an air inlet; a circuit board, arranged in the accommodating space, the circuit board has a through hole, the position of the through hole corresponds to the position of the air inlet; and A heat dissipation module is arranged in the accommodating space and above the circuit board, the heat dissipation module includes a fan, and the position of the fan corresponds to the position of the through hole; Wherein, the fan drives an airflow into the accommodating space from the air inlet and the through hole along an axial direction of the fan, and flows out of the base from the accommodating space along the axial direction of the fan. The electronic device as described in Claim 1 further includes an electronic component disposed on the circuit board, and the heat dissipation module further includes a heat dissipation fin set, and the position of the heat dissipation fin set corresponds to the position of the electronic component. The electronic device as claimed in claim 2 further includes a heat conduction medium disposed on the electronic component and abutted against the heat dissipation fin group. The electronic device as described in claim 2 further includes a plurality of fixing pieces, the cooling fin set includes a plurality of fixing columns, and the plurality of fixing pieces pass through the circuit board and the plurality of fixing columns and are locked to the frame . The electronic device according to claim 1, wherein the base further includes a keyboard, which is movably arranged on the frame and located above the accommodating space, and when the keyboard is closed relative to the frame, the keyboard shields the heat dissipation When the keyboard is lifted relative to the frame, a gap is formed between the keyboard and the cooling module. The electronic device according to claim 5, wherein the base body further includes a lifting mechanism for driving the keyboard to lift or close relative to the frame. The electronic device according to claim 1, wherein the base body further includes a keyboard disposed on the frame and staggered from the heat dissipation module. The electronic device according to claim 7, wherein the base body further includes a cover plate disposed on the frame and adjacent to the keyboard, the cover plate covers the heat dissipation module, and the cover plate has a plurality of air holes. The electronic device according to claim 1 further includes a display pivotally connected to the base.

Images