TWI669596B - Heat dissipating device - Google Patents

Abstract

A heat dissipation device includes a base, a heat dissipation platform and at least one lifting module. At least one lifting module is disposed on the base and connected to the heat dissipation platform. The at least one lifting module includes a driving component, a sliding mechanism, and a support member. The sliding mechanism is coupled to the drive element. The support member is disposed on the sliding mechanism and connected to the heat dissipation platform. The sliding mechanism moves the support by driving of the driving element, and the heat dissipation platform is lifted by the movement of the support.

Description

Heat sink

This invention relates to a device and, more particularly, to a heat sink.

The fan air inlet or fan air outlet of the notebook computer is usually placed at the bottom of the notebook or close to the screen. The air sucked into the outside air is discharged from the air outlet to take out the heat energy in the notebook computer by using convection air. In order to enhance the effect of such a heat dissipation mechanism, various heat dissipation devices for notebook computers such as a cooling pad and a cooling stand have been commercially available for a long time.

In order to achieve the heat dissipation efficiency of the notebook computer, it is necessary to provide sufficient flow of air from the air inlet to the fan or provide an exhaust path with a large outlet. Taking a heat sink as an example, it can increase the distance between the notebook and the desktop to provide an air convection space to enhance heat dissipation efficiency. In order to save space, there are many heat sinks on the market that can be lifted during use and closed when not in use to save space. However, the heat sink on the market must be manually raised or closed by the user.

The invention provides a heat dissipating device, which can automatically lift the heat dissipation platform.

The heat dissipation device of the present invention comprises a base, a heat dissipation platform and at least one lifting module. At least one lifting module is disposed on the base and connected to the heat dissipation platform. The at least one lifting module includes a driving component, a sliding mechanism, and a support member. The sliding mechanism is coupled to the drive element. The support member is disposed on the sliding mechanism and connected to the heat dissipation platform. The sliding mechanism moves the support by driving of the driving component, and the heat dissipation platform is lifted by the movement of the support.

The above described features and advantages of the invention will be apparent from the following description.

1A to 1C are respectively a top, side, and perspective views of a heat sink according to an embodiment of the present invention. 2 is a perspective view of the heat dissipation device of FIG. 1C hiding the heat dissipation platform. 3 is a perspective exploded view of the heat sink of FIG. 1C. Referring to FIG. 1A to FIG. 3 , in the embodiment, the heat dissipation device 100 is suitable for use in a portable electronic device 10 (see FIGS. 4A and 4B ), and the portable electronic device 10 is, for example, a notebook computer. However, the invention is not limited to this. The heat sink 100 includes a base 110 , a heat dissipation platform 120 , and at least one lift module 160 . The heat dissipation platform 120 is adapted to carry the portable electronic device 10. The heat dissipation platform 120 can be lifted by the driving of the lift module 160. In the present embodiment, the number of the lifting modules 160 is two. In other embodiments, the number of the lifting modules 160 may be one or other numbers, and the present invention is not limited thereto. In addition, in the embodiment, the base 110 has two accommodating spaces 112, and the two lifting modules 160 are respectively disposed in the two accommodating spaces 112, as shown in FIG.

4A and 4B are enlarged perspective views of the region A of Fig. 1B in a raised state and a closed state, respectively. The raised state is a state in which the heat dissipation platform 120 is lifted by the driving of the lifting module 160, and the closed state is a state in which the heat dissipation platform 120 is in the original position in a state where the driving module 160 is not driven. Referring to FIG. 1B , FIG. 4A and FIG. 4B , each lifting module 160 includes a driving component 180 , a sliding mechanism 170 , and a support 190 . Drive element 180 is, for example, a motor. The sliding mechanism 170 is coupled to the drive element 180. The support member 190 is disposed on the sliding mechanism 170 and connected to the heat dissipation platform 120. The sliding mechanism 170 moves the support member 190 by the driving of the driving member 180, and the heat dissipation platform 120 is lifted by the movement of the support member 190.

In detail, the sliding mechanism 170 includes a body 172, a screw 178, and a sliding portion 174. The screw 178 is coupled to the drive member 180 and the screw 178 is rotated relative to the body 172. The sliding portion 174 is slidably disposed on the main body 172. The sliding portion 174 has an internal thread (not shown) and is pivotally connected to the screw 178, and the support member 190 is fixed to the sliding portion 174. Specifically, in the embodiment, the body 172 is further provided with a driving member 176 and is pivotally connected between the driving component 180 and the screw 178 to avoid axial eccentricity between the driving component 180 and the screw 178, thereby lifting the driving component. The 180 axis is aligned to the accuracy of the axis of the screw 178, and the driver 176 is, for example, a coupling. Therefore, when the driving component 180 rotates, the driving member 176 can be driven to drive the screw 178, and since the sliding portion 174 is slidably disposed on the body 172, when the screw 178 is rotated, the sliding portion 174 pivotally connected to the screw 178 is provided by two The threading between the actuators causes the sliding portion 174 to move in the direction in which the screw 178 extends.

For example, in the present embodiment, the starting position of the sliding portion 174 is located at an end of the screw 178 that is farther from the driving member 180, and when the driving member 180 is activated to rotate, the sliding portion 174 is moved by the above-described actuation. To the end closer to the drive element 180. Since the support member 190 is fixed to the sliding portion 174, when the sliding portion 174 is moved to a closer end from the end farther from the driving member 180, the support member 190 will rotate as the sliding portion 174 moves, thereby propping up and Lift the cooling platform 120.

In the present embodiment, the support member 190 includes a pair of connecting portions 192 and a support rod 194. The pair of connecting portions 192 are respectively disposed on the sliding mechanism 170 and the heat dissipation platform 120, and the support rod 194 is connected between the pair of connecting portions 192. Specifically, one of the connecting portions 192 is disposed and fixed to the sliding portion 174, and the supporting rod 194 is pivotally connected to the connecting portion 192, so that the supporting rod 194 can be rotated by the connecting portion 192 as a fulcrum. One of the connecting portions 192 fixed to the sliding portion 174 (ie, the connecting portion 192 connected to the sliding portion 174) is moved by the action of the sliding mechanism 170, and the support rod 194 is connected by one of the connecting portions 192 (ie, connected) The movement of the connecting portion 192) of the sliding portion 174 is rotated to raise the heat dissipation platform 120. The other connecting portion 192 is connected between the support rod 194 and the heat dissipation platform 120.

5A and 5B are respectively enlarged perspective views of the heat dissipating device in the up state and the closed state of the region A in Fig. 1B according to another embodiment of the present invention. 5A and 5B, the heat sink 100A of the present embodiment is similar to the heat sink 100 of FIGS. 4A and 4B, except that in the present embodiment, the support member 190A of the lift module 160A includes A connecting portion 192 and a supporting rod 194 are disposed on the sliding mechanism 170, and the supporting rod 194 is connected between the connecting portion 192 and the heat dissipation platform 120. The connecting portion 192 is moved by the sliding mechanism 170, and the support rod 194 is rotated by the movement of the connecting portion 192 to lift the heat radiating platform 120. Specifically, the connecting portion 192 is disposed and fixed to the sliding portion 174, and both ends of the supporting rod 194 are respectively pivotally connected to the connecting portion 192 and the heat dissipation platform 120, so that the supporting rod 194 can be rotated by the connecting portion 192 as a fulcrum. The connecting portion 192 is moved by the action of the sliding mechanism 170, and the support rod 194 is rotated by the movement of the connecting portion 192 to lift the heat sink platform 120.

6A and 6B are respectively a perspective view and a side view of a heat dissipating device in a raised state according to another embodiment of the present invention. Referring to FIG. 6A and FIG. 6B, the heat dissipating device 100B of the present embodiment is similar to the heat dissipating device 100 of FIG. 1B and FIG. 1C, except that in the present embodiment, the lifting module 160B is, for example, upright. Lift the module. Specifically, the heat sink 100B includes a heat dissipation platform 120A and two vertical lift modules 160B. The two vertical lift modules 160B can stand directly on a horizontal surface. Each of the lifting modules 160B includes a driving member 180A, a sliding mechanism 170A, and a supporting member 190B. The sliding mechanism 170A moves the supporting member 190B by driving of the driving member 180, and the heat dissipation platform 120A is lifted by the movement of the supporting member 190B. In detail, in the present embodiment, the sliding mechanism 170A includes a body 172A, a driving member 176 and a screw 178, and the detailed lifting operation is similar to the heat dissipation module 100 of FIGS. 4A and 4B, and thus is no longer Narration.

On the other hand, in the embodiment, the heat dissipation platform 120A includes a frame body 130, a carrier plate (not shown), and at least one heat dissipating component 150. A carrier plate (not shown) is disposed on the frame 130. The at least one heat dissipating component 150 is disposed on the frame body 130 , and the frame body 130 surrounds the at least one heat dissipating component 150 . The heat dissipating component 150 is, for example, a fan. In other words, the heat dissipating platform 120A is provided with the heat dissipating component 150, and the heat dissipating component 150 can be disposed at any position within the housing 130.

In detail, in the embodiment, the frame 130 includes a frame 132 and at least two sliding bars 134. Two ends of each of the at least two sliding bars 134 are respectively connected to both sides of the frame 132, and at least two sliding bars 134 are slidable along the extending direction of the both sides. In this way, the distance between the slider 134 and the frame 132 can be adjusted according to the heat dissipating components 150 of different specifications.

The at least one heat dissipating component 150 is detachably coupled to at least two of the at least two sliding bars 134, and the at least one heat dissipating component 150 can be fixed to or moved along at least two of the sliding bars 134. For example, in the embodiment, the two heat dissipating components 150 are detachably connected between the two adjacent sliding bars 134, respectively, and the heat dissipating components 150 can be along the extending direction of the correspondingly connected two sliding bars 134. Move to adjust the position. In this way, a plurality of different heat dissipating components 150 can be disposed in the frame 130 of the heat dissipation platform 120A at the same time, and the positions thereof can be adjusted according to the use conditions to achieve a good heat dissipation effect. In addition, the distance between the slider 134 and the frame 132 can be adjusted to suit the heat sink elements 150 of different specifications.

Figure 7 is a perspective exploded view of another embodiment of the heat sink of Figure 6A in a raised state. Referring to FIG. 7 , the heat dissipation device 100C of the present embodiment is similar to the heat dissipation module 100B of FIG. 6A and FIG. 6B , but the difference between the two is that the number and size of the heat dissipation components 150 used in this embodiment are different from FIG. 6A . The number and size of the heat dissipating components 150 used in the heat dissipation module 100B are different. That is to say, the heat sink can be adjusted as needed for different sizes and numbers of heat dissipating components 150.

In detail, in the embodiment, the frame 130A includes a plurality of sliding connectors 136 , and each sliding connector 136 has a set of connecting portions 137 and a positioning portion 138 . The socket 137 detachably sleeves at least two sliders 134. The positioning portion 138 is connected and fixed to the at least one heat dissipating member 150. The sliding link 136 is movably disposed on the at least two slide bars 134. Specifically, the four corners of the heat dissipating component 150 are connected to the two sliders 134 by four sliding connectors 136, respectively. The socket portion 137 is, for example, a bent sheet-like structure whose bent shape can correspond to the outer shape of the slide bar 134. The positioning portion 138 is, for example, a columnar structure protruding from the surface, and the columnar structure shape may correspond to the shape of the positioning hole of the heat dissipating member 150. Therefore, the sliding connector 136 can be fixed to the heat dissipating component 150 by the positioning portion 138, and the heat dissipating component 150 can be slid by the sliding portion 134 by the positioning portion 138 being sleeved to the sliding bar 134. In other words, at least one heat dissipating component 150 can be moved by sliding of the sliding connecting members 136 on the at least two sliding bars 134, thereby adjusting the heat dissipating components 150 as shown in FIGS. 6A and 7 according to different usage situations. Position for good heat dissipation without the need for screws.

8A and 8B are respectively perspective views of the heat dissipation platform hidden carrier plate of the heat dissipation device of FIG. 1C. Referring to FIG. 8A and FIG. 8B, the heat sink 100 of the present embodiment is similar to the heat sink 100B of FIG. 6A, except that in the embodiment, the frame 130 further includes a plurality of sliding connectors 136A. Each of the at least two sliding bars 134A has a sliding groove B extending in a direction parallel to the extending direction of the at least two sliding bars 134A. The sliding connecting members 136A extend through the sliding grooves B and connect the at least one heat dissipating member 150. Specifically, the sliding joint 136A is, for example, a bolt and a nut, and the bolt is fixed to the nut through the sliding groove B and the heat dissipating member 150. In this way, the position of the heat dissipating component 150 on the two sliders 134A can be adjusted by adjusting the tightness of the sliding connector 136A to adapt to portable electronic devices of different specifications.

On the other hand, in the embodiment, the two sides of the frame 132A respectively have a groove A, and the two ends of the at least two sliding bars 134A are respectively received and connected to the grooves A on both sides, and each of the at least two sliding bars 134A can be Slides along the direction in which the groove A extends. Further, the frame 132A has two slide rails O and a plurality of fixing elements P, which are respectively disposed at both ends of each of the at least two slide bars 134A. The fixing elements P are respectively detachably passed through the two slide rails O to fix at least two slide bars 134A to the frame 132A. In other words, both ends of the slide bar 134A accommodate the inside of the groove A of both sides of the frame 132A, and the slide bar 134A is fixed to the frame 132A by the slide rail O by the fixing member P corresponding to the number of the slide bars 134A. In this way, the position of the slider 134A and the heat dissipating component 150 on the two sliding rails O can be adjusted by adjusting the tightness of the fixing component P to adapt to portable electronic devices of different specifications.

In summary, in the heat dissipation device of the present invention, the heat dissipation device includes a base, a heat dissipation platform and at least one lifting module, the lifting module includes a driving component, a sliding mechanism and a support member, and the sliding mechanism comprises a body, a screw and a sliding portion The driving component drives the screw, and the sliding portion moves relative to the body by the rotation of the screw to rotate the supporting member, so that the heat dissipation platform is lifted. Therefore, the heat sink platform can be automatically raised, thereby improving the comfort of the user using the portable electronic device. In addition, the heat dissipation platform includes a frame body, a carrier plate and at least one heat dissipating component, the frame body includes a frame and at least two sliding bars, and at least two sliding bars are provided with sliding connecting members, wherein the heat dissipating components can be at least by the sliding connecting members The slide on the two sliders moves. Therefore, the position of the heat dissipating component can be adjusted according to different usage conditions, thereby improving the heat dissipation effect of the portable electronic device.

Although the present invention has been disclosed in the above embodiments, it is not intended to limit the present invention, and any one of ordinary skill in the art can make some changes and refinements without departing from the spirit and scope of the present invention. The scope of the invention is defined by the scope of the appended claims.

10‧‧‧Portable electronic devices

100, 100A, 100B, 100C‧‧‧ heat sink

110, 110A‧‧‧ base

112‧‧‧ accommodating space

120, 120A, 120B‧‧‧ cooling platform

130, 130A‧‧‧ frame

132, 132A‧‧‧ framework

134, 134A‧‧ ‧ slide bar

136, 136A‧‧‧ sliding joints

137‧‧‧ Sockets

138‧‧‧ Positioning Department

150‧‧‧ Heat Dissipation Components

160, 160A, 160B‧‧‧ lifting module

170, 170A‧‧‧ sliding mechanism

172, 172A‧‧‧ ontology

174, 174A‧‧ ‧ sliding part

176‧‧‧Drives

178‧‧‧ screw

180, 180A‧‧‧ drive components

190, 190A, 190B‧‧‧ support

192‧‧‧Connecting Department

194‧‧‧Support rod

A‧‧‧ groove

B‧‧‧ slippery

O‧‧‧rails

P‧‧‧Fixed components

1A to 1C are respectively a top, side, and perspective views of a heat sink according to an embodiment of the present invention. 2 is a perspective view of the heat dissipation device of FIG. 1C hiding the heat dissipation platform. 3 is a perspective exploded view of the heat sink of FIG. 1C. 4A and 4B are enlarged perspective views of the region A of Fig. 1B in a raised state and a closed state, respectively. 5A and 5B are respectively enlarged perspective views of the heat dissipating device in the up state and the closed state of the region A in Fig. 1B according to another embodiment of the present invention. 6A and 6B are respectively a perspective view and a side view of a heat dissipating device in a raised state according to another embodiment of the present invention. Figure 7 is a perspective exploded view of another embodiment of the heat sink of Figure 6A in a raised state. 8A and 8B are respectively perspective views of the heat dissipation platform hidden carrier plate of the heat dissipation device of FIG. 1C.

Claims (8)

A heat dissipating device includes: a base; a heat dissipation platform; at least one lifting module disposed on the base and connected to the heat dissipation platform, the at least one lifting module comprising: a driving component; and a sliding mechanism coupled to the driving And a support member disposed on the sliding mechanism and coupled to the heat dissipation platform, wherein the sliding mechanism moves the support member by driving the driving member, and the heat dissipation platform is lifted by the movement of the support member; a frame body; and at least one heat dissipating component disposed on the frame body, wherein the frame body comprises: a frame; and at least two sliding bars, wherein the two ends of the sliding bar are respectively slidably coupled to both sides of the frame The at least one heat dissipating component is detachably coupled to two of the at least two slide bars. The heat dissipating device of claim 1, wherein the sliding mechanism comprises: a body; a screw coupled to the driving element, the screw being adapted to rotate relative to the body; a sliding portion is slidably disposed on the body and pivotally connected to the screw, the sliding portion has an internal thread, the supporting member is fixed to the sliding portion, and the driving component drives the screw to rotate, and the sliding portion is driven by the screw to be opposite The body moves to rotate the support. The heat dissipating device of claim 1, wherein the support member comprises: a pair of connecting portions respectively disposed on the sliding mechanism and the heat dissipating platform; and a supporting rod connected between the pair of connecting portions, the One of the connecting portions is moved by the action of the sliding mechanism, and the support rod is rotated by the movement of the connecting portion to lift the heat dissipation platform. The heat dissipation device of claim 1, wherein the frame further comprises a plurality of sliding connectors movably disposed on the at least two sliding bars, each of the sliding connectors having a set of joints and a positioning Each of the sleeves detachably sleeves one of the slide bars, and each of the positioning portions is connected and fixed to the corresponding heat dissipating component. The heat dissipation device of claim 1, wherein the frame further comprises a plurality of sliding connectors, each of the sliding bars has a sliding groove, and each of the sliding grooves extends in a direction parallel to the corresponding extension of the sliding bar. In the direction, the sliding connectors are disposed in the sliding grooves and connected to the at least one heat dissipating component. The heat dissipating device of claim 1, wherein each of the two sides of the frame has a groove, and the two ends of the at least two sliding rods are respectively accommodated and slidably coupled to the two The two grooves on the side. The heat dissipating device of claim 1, wherein the frame has two sliding rails and a plurality of fixing components, and the fixing components are respectively disposed on the at least two sliding The two fixing members respectively detachably pass through the two sliding rails at two ends of each of the rods to fix the at least two sliding rods to the frame. The heat dissipating device of claim 1, wherein the base has at least one accommodating space, and the at least one lifting module is disposed in the at least one accommodating space.