TWI783658B - Wafer carrying and fixing mechanism and thin film deposition equipment using the same - Google Patents

Abstract

The invention is a wafer carrying and fixing mechanism, which mainly includes a ground shield, a cover ring and a carrying plate, wherein the ground shield is used for carrying the cover ring. An annular bottom of the ground shield connects a side wall and an annular convex portion, and forms an opening on the radial inner side of the annular convex portion. The carrying plate is used to carry a wafer, wherein the carrying plate is located under the cover ring and can enter the opening of the ground shield. The cover ring includes a main body and a shielding part, wherein the main body is an annular body, and a part of the main body covers the opening of the ground shield. The shielding part is connected to the radially outer side of the main body and protrudes toward the annular bottom of the ground shield. The distance between the shielding part of the cover ring and the side wall of the ground shield is between 3 to 10 mm, which can avoid process gas or the target atoms are transferred to the outside of the ground shield.

Description

Wafer carrying and fixing mechanism and thin film deposition device using the wafer carrying and fixing mechanism prepare

The invention relates to a wafer carrying and fixing mechanism, which is used to fix the wafer on the carrying plate, and can reduce process gas or target material atoms from polluting the cavity.

Chemical Vapor Deposition (CVD), Physical Vapor Deposition (PVD) and Atomic Layer Deposition (ALD) are commonly used thin film deposition equipment, and are widely used in the manufacturing processes of integrated circuits, light-emitting diodes and displays.

The deposition equipment mainly includes a cavity and a carrier plate, wherein the carrier plate is located in the cavity and is used to carry at least one wafer. Taking physical vapor deposition as an example, a target needs to be set in the chamber, wherein the target faces the wafer on the carrier. During physical vapor deposition, the wafer will be fixed on the carrier plate through the fixing device, and the inert gas and/or reaction gas will be transported into the chamber, and the bias voltage will be applied to the target material and the carrier plate respectively. The loaded wafer is heated. The inert gas in the chamber will form an ionized inert gas due to the action of the high-voltage electric field. The ionized noble gas is attracted by the bias voltage on the target and bombards the target. Target atoms or molecules sputtered from the target are attracted by the bias voltage on the susceptor plate and deposited on the surface of the heated wafer to form a thin film on the surface of the wafer.

In addition, during the physical vapor deposition process, the carrier plate can be displaced relative to the target material, and the distance between the wafer carried by the carrier plate and the target material can be changed to adjust the parameters of the deposition process.

As mentioned in the prior art, conventional thin film deposition equipment can change the parameters of the deposition process by adjusting the distance between the carrier plate and the target. However, the distance between the carrier plate and the target of the conventional thin film deposition equipment can be adjusted very little. When the carrier plate moves towards the target, it may cause the process gas and/or target atoms and/or target molecules Transfer to the cavity, and form film deposits on the inner surface of the cavity, thereby polluting the cavity. For this reason, the present invention proposes a novel wafer carrying and fixing mechanism and film deposition equipment using the wafer carrying and fixing mechanism, which can increase the adjustable range of the distance between the carrying plate and the target, and can reduce the process gas and/or target. material atoms and/or target molecules enter the cavity.

An object of the present invention is to provide a wafer carrying and fixing mechanism and thin film deposition equipment, which mainly include a carrying plate, a cover ring and a stopper, wherein the carrying plate is used to carry at least one wafer. The stopper is used to carry the cover ring. When the carrying plate drives the carried wafer towards the direction of the cover ring, the cover ring will contact the wafer to fix the wafer on the support plate. And/or a reaction space is formed between the cavities.

The distance between the side of the cover ring and the stopper of the present invention is less than 10 mm, so as to improve the shielding effect of the cover ring and the stopper on the cavity, and avoid reaction gas, target atoms and/or target materials in the reaction space Molecules contact the cavity outside the cover ring and/or the barrier to reduce film deposition on the inner surfaces of the cavity.

In addition, the carrying plate can drive the carried wafer and the cover ring to continue to approach the target, so that the cover ring leaves the stopper, so as to further shorten the distance between the wafer and the target. Due to the cover of the present invention The distance between the ring and the baffle is small, even if the cover ring is away from the baffle, the cover ring and the baffle can still provide a good shielding effect, which can avoid the transfer of reaction gas, target atoms and/or target molecules in the reaction space to the cavity outside the cover ring and/or stopper.

An object of the present invention is to provide a wafer carrying and fixing mechanism and thin film deposition equipment, wherein the cover ring includes a first cover ring and a second cover ring, and the radius of the first cover ring is larger than that of the second cover ring, and is used for Carries the second cover ring. When the susceptor is in contact with the cover ring, only the second cover ring contacts the wafer on the susceptor, and the susceptor is used to carry the first cover ring. Through the design of the first cover ring and the second cover ring, the pressure exerted by the cover ring on the wafer can be reduced, and the probability of the wafer being crushed by the cover ring can be reduced.

In order to achieve the above object, the present invention proposes a wafer carrying and fixing mechanism, including: a stopper, including a side wall, an annular bottom and an annular convex portion, wherein the annular bottom connects the side wall and the annular convex portion, and is connected to the annular convex portion A radial inner side forms an opening; a cover ring is used to be placed on the stopper, and includes: a main body, the main body is an annular body, and part of the main body is located at the extension position of the opening of the stopper; The shielding portion is connected to a radially outer side of the main body, and includes a first protruding portion protruding toward the direction of the annular bottom of the blocking member, or protruding toward a direction away from the annular bottom of the blocking member, wherein the shielding portion and the blocking member The distance between the side walls is between 3 and 10 millimeters; and a carrying plate, including a carrying surface for carrying a wafer, wherein the carrying plate is located under the cover ring, when the carrying plate drives the wafer to move towards the cover ring , the main body of the cover ring contacts the wafer.

The present invention provides a thin film deposition equipment, comprising: a cavity, including an accommodating space; a wafer carrying and fixing mechanism, located in the accommodating space, including: a stopper, including a side wall, an annular bottom and an annular convex part, wherein the side wall is connected to the cavity, and the annular bottom is connected to the side wall and the annular convex part, and an opening is formed on a radial inner side of the annular convex part; a cover ring is used to place the stopper above, and includes: a main body, the main body is an annular body, part of the main body is located at the extension position of the opening of the stopper; a shielding part, connected to a radially outer side of the main body, and includes a first protrusion The portion protrudes toward the annular bottom of the blocking member, wherein the distance between the blocking portion and the side wall of the blocking member is between 3 mm and 10 mm; and a carrying tray includes a carrying surface for carrying a wafer, wherein The carrying plate is located under the cover ring, and when the carrying plate drives the wafer to move toward the cover ring, the main body of the cover ring will contact the wafer.

In the wafer carrying and fixing mechanism and thin film deposition equipment, the shielding portion includes a second raised portion that protrudes away from the ring-shaped bottom of the shielding member.

In the wafer carrying and fixing mechanism and thin film deposition equipment, the cover ring and the carrier plate are respectively provided with a corresponding alignment unit, and the cover ring and the carrier plate are aligned through the alignment unit.

The wafer carrying and fixing mechanism and thin film deposition equipment, wherein the cover ring includes a first cover ring and a second cover ring, the circumference of the first cover ring is larger than that of the second cover ring, and is used to carry the second cover ring, When the carrier plate is displaced toward the cover ring, the carrier plate is used to carry the first cover ring, and the second cover ring will contact the wafer. The first cover ring and the second cover ring are respectively provided with a corresponding alignment unit, and through the alignment The bit unit aligns the second cover ring and the first cover ring.

The wafer carrying and fixing mechanism and thin film deposition equipment include a ring member connected to the carrier plate, the ring member is located around the carrying surface of the carrier plate, wherein the ring member and the cover ring are respectively provided with a corresponding alignment unit, and through the opposite The bit unit alignment ring member and the cover ring.

The thin film deposition equipment includes a target arranged in the cavity, facing the carrier plate and the wafer, the carrier plate is located in the opening of the stopper, and drives the cover ring away from the stopper, so as to shorten the wafer on the carrier plate distance from the target.

10: Wafer carrying and fixing mechanism

100: Thin film deposition equipment

11: carrying plate

111: bearing surface

113: concave part

115: ring member

12:Wafer

13: block

131: side wall

132: opening

133: ring bottom

135: Annular convex part

14:Accommodating space

141: Reaction space

15: Cover ring

151: Main body

153: Covering Department

1531: the first raised part

1533: second raised portion

1535: Raised part

155: protruding part

157: First cover ring

159: second cover ring

161: Lifting unit

163: Bearing member

17: Cavity

171:Wafer import and export

19: target

[ FIG. 1 ] is a schematic cross-sectional view of an embodiment of the wafer carrying and fixing mechanism of the present invention.

[ Fig. 2 ] is a schematic cross-sectional view of an embodiment of the thin film deposition equipment of the present invention operating in the feeding and discharging state.

[ Fig. 3 ] is a schematic cross-sectional view of an embodiment of the thin film deposition apparatus of the present invention operating in a deposition state.

[ Fig. 4 ] is a schematic cross-sectional view of another embodiment of the thin film deposition apparatus of the present invention operating in the deposition state.

[ FIG. 5 ] is a schematic cross-sectional view of another embodiment of the wafer carrying and fixing mechanism of the present invention.

[ FIG. 6 ] is a schematic cross-sectional view of another embodiment of the wafer carrying and fixing mechanism of the present invention.

[ FIG. 7 ] is a schematic cross-sectional view of another embodiment of the wafer carrying and fixing mechanism of the present invention.

Please refer to FIG. 1 and FIG. 2 , which are respectively a schematic cross-sectional view of an embodiment of the wafer carrying and fixing mechanism of the present invention and a schematic cross-sectional view of an embodiment of the thin-film deposition device of the present invention operating in the loading and unloading state. As shown in the figure, the wafer carrying and fixing mechanism 10 is used to carry and fix at least one wafer 12, and mainly includes at least one carrier plate 11, a stopper 13 and a cover ring 15, wherein the stopper 13 is used to carry the cover ring 15 , and the carrier tray 11 is located under the cover ring 15 and/or the stopper 13 .

The carrying tray 11 includes a carrying surface 111 for carrying the wafer 12 . The top view shape of the cover ring 15 and/or the blocking member 13 is approximately ring-shaped, wherein the blocking member 13 includes a side wall 131 , an annular bottom 133 and an annular protrusion 135 , and the annular bottom 133 connects the side wall 131 and the annular protrusion 135 .

The appearance of the side wall 131 of the stopper 13 is approximately cylindrical, hollow columnar, hollow cylindrical or hollow truncated, wherein one end of the sidewall 131 of the stopper 13 can be connected to the cavity 17, and the other end of the sidewall 131 The annular bottom 133 is then connected.

The appearance of the annular bottom 133 is approximately circular, wherein one end of the annular bottom 133 is connected to the side wall 131 of the stopper 13, for example, the radially outer side of the annular bottom 133 is connected to the bottom end of the side wall 131, wherein the angle between the side wall 131 and the annular bottom 133 About 90 degrees.

The appearance of the annular convex portion 135 is approximately cylindrical, hollow cylindrical, hollow cylindrical or hollow conical body, wherein one end of the annular convex portion 135 is connected to the radial inner side of the annular bottom 133, and is connected to the radial inner side of the annular convex portion 135. An opening 132 is formed on a radial inner side. Specifically, the sidewall 131 and the annular protrusion 135 are respectively connected to the radially outer side and the radially inner side of the annular bottom 133 , and protrude or extend toward the same direction, wherein the height of the sidewall 131 is greater than that of the annular protrusion 135 .

The cover ring 15 includes a main body 151 and a shielding portion 153, wherein the main body 151 is an annular body, and the shielding portion 153 is approximately cylindrical, hollow cylindrical, hollow cylindrical or hollow truncated . Specifically, the shielding portion 153 is connected to the radially outer side of the main body portion 151 , wherein an included angle between the shielding portion 153 and the main body portion 151 is approximately 90 degrees.

The cover ring 15 can be placed on the stopper 13 , for example, the annular protrusion 135 of the stopper 13 is used to support the lower surface of the main body 151 of the cover ring 15 . When the cover ring 15 is placed on the annular convex portion 135 of the blocking member 13, part of the main body portion 151 will extend towards the radial inner side of the annular bottom 133 and/or the annular convex portion 135 of the blocking member 13, and be located at the opening of the blocking member 13. 132 to cover or cover part of the opening 132 . In addition, part of the main body portion 151 extends radially outward of the annular bottom 133 and/or the annular protrusion 135 of the blocking member 13 , and covers or covers most of the annular bottom 133 .

Specifically, the cover ring 15 of the present invention extends toward the side wall 131 of the blocking member 13, and reduces the distance between the shielding portion 153 of the cover ring 15 and the side wall 131, wherein the distance is between 3 and 10 millimeters (mm) between. Through the special design of the cover ring 15 of the present invention, the shielding effect of the cover ring 15 and the blocking member 13 can be improved, so as to reduce the reaction gas and/or the target material atoms and/or target material molecules generated in the deposition process from contacting the outside of the blocking member 13 The cavity 17.

The thin film deposition equipment 100 shown in FIG. 2 mainly includes a cavity 17 and a wafer carrying and fixing mechanism 10 , wherein the wafer carrying and fixing mechanism 10 is located in the accommodating space 14 of the cavity 17 . One end of the stopper 13 can be connected to the cavity 17 , and the other end is used for carrying the cover ring 15 . The carrying tray 11 is located below the cover ring 15 and/or the stopper 13 and can be displaced relative to the cover ring 15 and/or the stopper 13 .

A wafer inlet and outlet 171 can be provided on the cavity 17, wherein the carrier tray 11 can be displaced in a direction away from the cover ring 15 and/or the stopper 13, so that the height of the carrier surface 111 of the carrier tray 11 is similar to the wafer inlet and outlet 171 . Then, the wafer 12 outside the cavity 17 can be placed on the carrying surface 111 of the carrying tray 11 through a robot arm through the wafer inlet and outlet 171 . In addition, the robot arm can also transport the wafer 12 on the carrying surface 111 of the carrying tray 11 to the outside of the cavity 17 through the wafer inlet and outlet 171 .

In an embodiment of the present invention, the thin film deposition apparatus 100 may be a physical vapor deposition device, and a target 19 is disposed in the chamber 17 , wherein the target 19 faces the carrier plate 11 and/or the wafer 12 . At least one gas inlet can be provided on the cavity 17, wherein the gas inlet is fluidly connected to the accommodating space 14 of the cavity 17, and is used to deliver a process gas into the accommodating space 14 to perform a deposition process. For example, the process gas can be Is an inert gas or reactive gas. In addition, a gas extraction port can also be provided on the cavity body 17, and the gas in the cavity body 17 can be sucked out through the pump through the gas suction port, so that the accommodating space 14 is under low pressure or vacuum.

As shown in FIG. 3 , the carrying tray 11 can drive the carried wafer 12 to displace in the direction of the cover ring 15, the stopper 13 and/or the target 19, so that the carrying tray 11 is located in the opening 132 of the stopper 13, wherein the cover ring The main body 151 of 15 contacts the wafer 12 on the susceptor 11 to fix the wafer 12 on the susceptor 11 . At this time, the carrier plate 11 , the cover ring 15 , the stopper 13 and the cavity 17 define a reaction space 141 in the accommodating space 14 , and film deposition is performed on the surface of the wafer 12 in the reaction space 141 . The reaction space 141 is basically an isolated space in the accommodating space 14, wherein the reaction gas, target atoms and/or target molecules in the reaction space 141 will not contact the cavity 17 outside the barrier 13, so as to avoid the A thin film is deposited on the surface of the cavity 17, thereby causing pollution of the cavity 17.

As shown in FIGS. 4 and 5 , the carrying plate 11 in the opening 132 of the stopper 13 can continue to drive the carried wafer 12 to move toward the direction of the target material 19, so as to shorten the target material 19 and the wafer carried by the carrying plate 11. The distance between circles 12. At this time, the supporting plate 11 also carries the cover ring 15 and drives the cover ring 15 away from the stopper 13 .

Since the gap between the shielding portion 153 of the cover ring 15 and the side wall 131 of the stopper 13 of the present invention is less than 10 mm, even if the carrier plate 11 drives the cover ring 15 away from the stopper 13, the reaction gas in the reaction space 141 can still be avoided. , target atoms and/or target molecules enter the accommodating space 14 outside the blocking member 13 .

Specifically, through the thin film deposition equipment 100 of the present invention, it is possible to prevent the formation of a deposited film on the inner surface of the cavity 17, increasing the adjustable distance between the wafer 12 carried by the carrier plate 11 and the target 19. scope. In this way, the distance between the wafer 12 and the target 19 can be adjusted according to the requirements of the deposition process, so as to improve the uniformity of the film deposited on the surface of the wafer 12 .

In contrast, the adjustable range of the distance between the wafer 12 and the target material 19 carried by the carrier plate 11 of the general deposition chamber is small. If the distance between the carrier plate 11 and the target material 19 is to be reduced, It often causes an excessively large gap between the cover ring 15 and the stopper 13, causing the reaction gas, target atoms and/or target molecules in the reaction space 141 to enter the accommodation space 14 outside the stopper 13, and then in the cavity The inner surface of 17 forms a thin film deposition.

In addition, the gap between the shielding portion 153 of the cover ring 15 and the side wall 131 of the stopper 13 of the present invention is greater than 3 millimeters to avoid electrical conduction between the cover ring 15 and the stopper 13 and to prevent the shielding portion 153 of the cover ring 15 from The sidewall 131 of the blocking member 13 is contacted or rubbed to generate particulate pollution.

In an embodiment of the present invention, as shown in FIG. 1 , a corresponding alignment unit can be provided between the cover ring 15 and the carrier plate 11, for example, a protrusion 155 is provided on the lower surface of the cover ring 15, and A concave portion 113 is disposed on the carrier plate 11 , wherein there is a corresponding slope between the protruding portion 155 and the concave portion 113 . When the carrier plate 11 approaches the cover ring 15 , the protruding portion 155 of the cover ring 15 contacts the concave portion 113 of the carrier plate 11 , and aligns the cover ring 15 and the carrier plate 11 .

In another embodiment of the present invention, the carrier tray 11 may include an annular member 115, wherein the annular member 115 is located around the bearing surface 111 of the carrier tray 11, and a corresponding alignment unit is provided between the cover ring 15 and the annular member 115. , to align the cover ring 15 and the ring member 115 .

In an embodiment of the present invention, the wafer carrying and fixing mechanism 10 may include at least one lifting unit 161 and a carrying member 163, wherein the carrying member 163 is arranged on the carrying plate 11 and is located below the wafer 12 carried by the carrying plate 11, For example, the bearing member 163 may be ring-shaped in appearance and located inside the ring member 115 .

The lifting unit 161 connects the carrying member 163 and the carrying plate 11, and is used to drive the carrying member 163 to move relative to the carrying plate 11. For example, the lifting unit 161 can be extended relative to the carrying surface 111 of the carrying plate 11, and drives the carrying member 163 to leave the carrying plate 11 , so as to drive the wafer 12 away from the carrying surface 111 of the carrying tray 11 through the carrying member 163 , which is beneficial to take the wafer 12 through the robot arm.

In another embodiment of the present invention, the lifting unit 161 is connected to the susceptor 11 and located below the wafer 12 carried by the susceptor 11 . The lifting unit 161 can be extended relative to the carrying surface 111 of the carrying tray 11 and drive the wafer 12 away from the carrying surface 111 of the carrying tray 11 , so that the carrying member 163 is not required.

The shielding part 153 of Fig. 1 comprises a first protruding part 1531 and a second protruding part 1533, wherein the first protruding part 1531 protrudes toward the direction of the annular bottom 133 of the stopper 13, and the second protruding part 1533 Then it protrudes in a direction away from the annular bottom 133 of the blocking member 13 .

As shown in Figure 5, the cover ring 15 can include a first cover ring 157 and a second cover ring 159, the top view shapes of the first cover ring 157 and the second cover ring 159 are ring-shaped, wherein the largest circumference of the first cover ring 157 The length and/or maximum radius are greater than the maximum circumference and/or maximum radius of the second cover ring 159 . The second cover ring 159 is located above the first cover ring 157 , and the second cover ring 159 is supported by the first cover ring 157 . When the carrier tray 11 is displaced toward the first cover ring 157 and/or the second cover ring 159, the second cover ring 159 will contact the edge of the wafer 12 carried by the carrier tray 11 and fix the wafer 12 on the carrier tray 11. Bearing surface 111 .

In actual application, the second cover ring 159 can be placed on the first cover ring 157 , and the wafer 12 with a smaller size can be fixed on the susceptor 11 through the second cover ring 159 . In addition, the second cover ring 159 can also be removed from the first cover ring 157 , and the wafer 12 with a larger size can be fixed on the susceptor 11 through the first cover ring 157 . When the wafer 12 with a larger size is fixed on the susceptor 11 by the first cover ring 157 , it may be necessary to replace the susceptor 11 or configure additional components on the susceptor 11 . A corresponding alignment unit can be provided between the first cover ring 157 and the second cover ring 159 respectively, and the first cover ring 157 and the second cover ring 159 can be aligned through the alignment unit.

Compared with the prior art, the present invention may have larger length, area and weight of the cover ring 15, which will increase the pressure applied to the wafer 12 by the cover ring 15, thereby improving the chance of breaking the wafer 12. Rate. When the cover ring 15 includes the first cover ring 157 and the second cover ring 159, the weight of the first cover ring 157 can be carried through the carrier plate 11, and the wafer 12 can be fixed on the carrier plate 11 through the second cover ring 159. , can reduce the pressure exerted by the cover ring 15 on the wafer 12 , and reduce the probability of the wafer 12 breaking.

As shown in FIG. 6 , the shielding portion 153 of the cover ring 15 includes a first protrusion 1531 , wherein the first protrusion 1531 protrudes toward the annular bottom 133 of the blocking member 13 . As shown in FIG. 7 , the shielding portion 153 of the cover ring includes a protruding portion 1535 , wherein the protruding portion 1535 protrudes away from the annular bottom portion 133 of the blocking member 13 .

Since the cover ring 15 of the present invention can provide a good shielding effect, the heights of the annular convex portion 135 of the blocking member 13 and the first raised portion 1531 of the shielding portion 153 can be further shortened so as not to affect the cover ring 15 and In the case of the shielding effect of the stopper 13 on the cavity 17, the adjustable distance between the wafer 12 carried by the susceptor 11 and the target 19 is increased, for example, the main body 151 of the cover ring 15 can still contact the wafer 12. On the premise, the distance between the wafer 12 and the target 19 is increased.

The above is only one of the preferred embodiments of the present invention, and is not used to limit the scope of the present invention, that is, all changes and equal changes made according to the shape, structure, characteristics and spirit described in the patent scope of the present invention Modifications should be included in the patent application scope of the present invention.

10: Wafer carrying and fixing mechanism

11: carrying plate

111: bearing surface

113: concave part

115: ring member

12:Wafer

13: block

131: side wall

132: opening

133: ring bottom

135: Annular convex part

15: Cover ring

151: Main body

153: Covering Department

1531: the first raised part

1533: second raised portion

155: protruding part

161: Lifting unit

163: Bearing member

Claims (7)

A wafer carrying and fixing mechanism, comprising: a stopper, including a side wall, an annular bottom, and an annular convex portion, wherein the annular bottom connects the side wall and the annular convex portion, and is located on a radial inner side of the annular convex portion An opening is formed; a cover ring is used to be placed on the blocking member, and includes: a main body part, the main body part is an annular body, and part of the main body part is located at the extending position of the opening of the blocking member; The shielding portion is connected to a radially outer side of the main body, and includes a first protruding portion protruding toward the direction of the annular bottom of the blocking member, wherein the distance between the shielding portion and the side wall of the blocking member is between Between 3 and 10 millimeters, wherein the shielding portion includes a second raised portion protruding away from the annular bottom of the shielding member; and a carrying tray including a carrying surface for carrying a wafer, Wherein the carrying plate is located under the cover ring, when the carrying plate drives the wafer to move towards the cover ring, the main body of the cover ring will contact the wafer. The wafer carrying and fixing mechanism according to claim 1, wherein the cover ring and the carrier tray are respectively provided with a corresponding alignment unit, and the cover ring and the carrier tray are aligned through the alignment unit. A wafer carrying and fixing mechanism, comprising: a stopper, including a side wall, an annular bottom, and an annular convex portion, wherein the annular bottom connects the side wall and the annular convex portion, and is located on a radial inner side of the annular convex portion An opening is formed; a cover ring is used to be placed on the blocking member, and includes: a main body portion, the main body portion is an annular body, wherein a part of the main body portion is located at the extension position of the opening of the blocking member; A shielding portion, connected to a radially outer side of the main body portion, and comprising a first raised portion protruding toward the direction of the annular bottom of the blocking member, wherein the distance between the shielding portion and the side wall of the blocking member is Between 3 and 10 millimeters; and a carrier plate, including a carrier surface for carrying a wafer, wherein the carrier plate is located below the cover ring, when the carrier plate drives the wafer to move towards the cover ring , the main body portion of the cover ring will contact the wafer, wherein the cover ring includes a first cover ring and a second cover ring, the circumference of the first cover ring is larger than that of the second cover ring, and is used to carry the The second cover ring, when the carrier plate is displaced towards the cover ring, the carrier plate is used to carry the first cover ring, and the second cover ring will contact the wafer, the first cover ring and the second cover ring The rings are respectively provided with a corresponding alignment unit, and the second cover ring and the first cover ring are aligned through the alignment unit. A wafer carrying and fixing mechanism, comprising: a stopper, including a side wall, an annular bottom, and an annular convex portion, wherein the annular bottom connects the side wall and the annular convex portion, and is located on a radial inner side of the annular convex portion An opening is formed; a cover ring is used to be placed on the blocking member, and includes: a main body part, the main body part is an annular body, and part of the main body part is located at the extending position of the opening of the blocking member; The shielding portion is connected to a radially outer side of the main body, and includes a first protruding portion protruding toward the direction of the annular bottom of the blocking member, wherein the distance between the shielding portion and the side wall of the blocking member is between Between 3 and 10 millimeters; a carrying plate, including a carrying surface for carrying a wafer, wherein the carrying plate is located below the cover ring, when the carrying plate drives the wafer to move towards the cover ring, the carrying plate The main body portion of the cover ring will contact the wafer; and an annular member connected to the carrier plate, the ring member is located around the carrier surface of the carrier plate, wherein the ring member and the cover ring are respectively provided with a corresponding pair of position unit, and align the ring member and the cover ring through the position unit. A thin film deposition equipment, comprising: a cavity, including an accommodating space; a wafer carrying and fixing mechanism, located in the accommodating space, including: a stopper, including a side wall, an annular bottom and an annular convex portion, Wherein the side wall is connected to the cavity, and the annular bottom is connected to the side wall and the annular protrusion, and an opening is formed on a radial inner side of the annular protrusion; a cover ring is used to be placed on the stopper, and It includes: a main body, the main body is an annular body, and part of the main body is located at the extension position of the opening of the stopper; a shielding part is connected to a radially outer side of the main body, and includes a first The raised portion protrudes toward the annular bottom of the blocking member, wherein the distance between the blocking portion and the side wall of the blocking member is between 3 mm and 10 mm, wherein the blocking portion includes a second protrusion part, protruding toward the direction away from the annular bottom of the stopper; and a carrying plate, including a carrying surface for carrying a wafer, wherein the carrying plate is located under the cover ring, when the carrying plate drives the wafer The main body portion of the cover ring contacts the wafer when the circle is displaced toward the cover ring. The thin film deposition equipment as described in Claim 5, comprising a target disposed in the cavity, and facing the carrier plate and the wafer, the carrier plate is located in the opening of the stopper, and drives the cover ring away The stopper is used to shorten the distance between the wafer on the carrier plate and the target. A thin film deposition equipment, comprising: a cavity, including an accommodating space; a wafer carrying and fixing mechanism, located in the accommodating space, including: A stopper, comprising a side wall, an annular bottom and an annular protrusion, wherein the side wall is connected to the cavity, and the annular bottom is connected to the side wall and the annular protrusion, and is formed on a radial inner side of the annular protrusion An opening; a cover ring, used to be placed on the stopper, and includes: a main body, the main body is an annular body, wherein part of the main body is located at the extension position of the opening of the stopper; a shield part, connected to a radially outer side of the main body part, and includes a first protrusion protruding toward the direction of the annular bottom of the stopper, wherein the distance between the shielding part and the side wall of the stopper is between between 3 and 10 mm; and a carrying plate, including a carrying surface for carrying a wafer, wherein the carrying plate is located below the cover ring, when the carrying plate drives the wafer to move toward the cover ring, the carrying plate The main body portion of the cover ring will contact the wafer, wherein the cover ring includes a first cover ring and a second cover ring, the circumference of the first cover ring is larger than that of the second cover ring, and is used to carry the second cover ring Cover ring, when the carrier plate is displaced towards the second cover ring, the second cover ring will contact the wafer, the first cover ring and the second cover ring are respectively provided with a corresponding alignment unit, and through the The alignment unit aligns the second cover ring and the first cover ring.

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