TW441845U - Self-alignment mechanism for mark shielding clamp ring application in PVD process chamber and process chamber using the same - Google Patents
Self-alignment mechanism for mark shielding clamp ring application in PVD process chamber and process chamber using the sameInfo
- Publication number
- TW441845U TW441845U TW87218157U TW87218157U TW441845U TW 441845 U TW441845 U TW 441845U TW 87218157 U TW87218157 U TW 87218157U TW 87218157 U TW87218157 U TW 87218157U TW 441845 U TW441845 U TW 441845U
- Authority
- TW
- Taiwan
- Prior art keywords
- process chamber
- self
- same
- clamp ring
- alignment mechanism
- Prior art date
Links
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW87218157U TW441845U (en) | 1998-11-02 | 1998-11-02 | Self-alignment mechanism for mark shielding clamp ring application in PVD process chamber and process chamber using the same |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW87218157U TW441845U (en) | 1998-11-02 | 1998-11-02 | Self-alignment mechanism for mark shielding clamp ring application in PVD process chamber and process chamber using the same |
Publications (1)
Publication Number | Publication Date |
---|---|
TW441845U true TW441845U (en) | 2001-06-16 |
Family
ID=21637315
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW87218157U TW441845U (en) | 1998-11-02 | 1998-11-02 | Self-alignment mechanism for mark shielding clamp ring application in PVD process chamber and process chamber using the same |
Country Status (1)
Country | Link |
---|---|
TW (1) | TW441845U (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101787513A (en) * | 2010-03-12 | 2010-07-28 | 上海宏力半导体制造有限公司 | Metal deposition chamber |
TWI783658B (en) * | 2021-08-31 | 2022-11-11 | 天虹科技股份有限公司 | Wafer carrying and fixing mechanism and thin film deposition equipment using the same |
-
1998
- 1998-11-02 TW TW87218157U patent/TW441845U/en not_active IP Right Cessation
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101787513A (en) * | 2010-03-12 | 2010-07-28 | 上海宏力半导体制造有限公司 | Metal deposition chamber |
TWI783658B (en) * | 2021-08-31 | 2022-11-11 | 天虹科技股份有限公司 | Wafer carrying and fixing mechanism and thin film deposition equipment using the same |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
GD4K | Issue of patent certificate for granted utility model filed before june 30, 2004 | ||
MK4K | Expiration of patent term of a granted utility model |