TWM620754U - Wafer carrying and fixing device and thin film deposition equipment using the wafer carrying and fixing device - Google Patents

Abstract

The present invention is a wafer carrying and fixing device, which mainly includes a stopper, a cover ring and a carrying plate, wherein the stopper is used for carrying the cover ring. The annular bottom of the stop is connected with the side wall and the annular convex part, and an opening is formed on the radial inner side of the annular convex part. The carrier plate is used to carry a wafer, wherein the carrier plate is located under the cover ring and can enter the opening of the stopper. The cover ring includes a main body part and a shielding part, wherein the main body part is an annular body, and a part of the main body part covers the opening of the blocking member. The shielding portion is connected to the radially outer side of the main body and protrudes toward the annular bottom of the stopper. The distance between the shielding portion of the cover ring and the side wall of the stopper is between 3 to 10 mm, which can avoid process gas Or the target atoms are transferred to the outside of the stopper through the gap between the cover ring and the stopper.

Description

Wafer carrying and fixing device and thin film deposition equipment using the wafer carrying and fixing device

The present invention relates to a wafer carrying and fixing device, which is used for fixing the wafer on the carrying plate, and can reduce the contamination of the cavity by the process gas or target atoms.

Chemical vapor deposition (CVD), physical vapor deposition (PVD) and atomic layer deposition (ALD) are all commonly used thin film deposition equipment, and are commonly used in integrated circuits, light-emitting diodes, and display manufacturing processes.

The deposition equipment mainly includes a cavity and a carrier plate, wherein the carrier plate is located in the cavity and used to carry at least one wafer. Taking physical vapor deposition as an example, a target material needs to be set in the cavity, where the target material faces the wafer on the carrier plate. During physical vapor deposition, the wafer is fixed on the carrier plate through a fixing device, and the inert gas and/or reactive gas are transported into the cavity to apply bias to the target and the carrier plate respectively. The carrier plate also Will heat the loaded wafer. The inert gas in the cavity will form ionized inert gas due to the action of the high-voltage electric field. The ionized inert gas will be attracted by the bias on the target material and bombard the target material. The target atoms or molecules sputtered from the target are attracted by the bias voltage on the carrier plate and deposited on the surface of the heated wafer to form a thin film on the surface of the wafer.

In addition, during the physical vapor deposition process, the carrier plate can be displaced relative to the target material, and the distance between the wafer carried by the carrier plate and the target material can be changed to adjust the parameters of the deposition process.

As mentioned in the prior art, the conventional thin film deposition equipment can change the parameters of the deposition process by adjusting the distance between the carrier plate and the target. However, the distance between the carrier plate and the target of the conventional thin film deposition equipment can be adjusted to a small extent. When the carrier plate is displaced in the direction of the target, it may cause process gas and/or target atoms and/or target molecules. It is transferred to the cavity and forms a thin film deposit on the inner surface of the cavity, thereby causing pollution to the cavity. For this reason, the present invention proposes a novel wafer carrying and fixing device and thin film deposition equipment using the wafer carrying and fixing device, which can increase the adjustable range of the distance between the carrying plate and the target, and reduce the process gas and/or target. The material atoms and/or target molecules enter the cavity.

An object of the present invention is to provide a wafer carrying and fixing device and a thin film deposition equipment, which mainly include a carrying tray, a cover ring and a stopper, wherein the carrying tray is used to carry at least one wafer. The stopper is used to carry the cover ring. When the carrier plate drives the wafer to be carried close to the cover ring, the cover ring will contact the wafer to fix the wafer on the carrier plate. And/or a reaction space is formed between the cavities.

The distance between the side edge of the cover ring and the stopper of the present invention is less than 10 mm, so as to improve the shielding effect of the cover ring and the stopper on the cavity, and can avoid the reaction gas, the target atom and/or the target material in the reaction space The molecules contact the cavity outside the cover ring and/or the stopper to reduce film deposition on the inner surface of the cavity.

In addition, the carrier tray can drive the loaded wafer and the cover ring to continue to approach the target, so that the cover ring leaves the stopper, so as to further shorten the distance between the wafer and the target. Due to the small distance between the cover ring and the stopper of the present invention, even if the cover ring leaves the stopper, the cover ring and the stopper can still provide a good shielding effect, and can avoid the reaction gas, target atoms and/or in the reaction space. Or the target molecules are delivered to the cavity outside the cover ring and/or the stopper.

An object of the present invention is to provide a wafer carrying and fixing device and a thin film deposition equipment, wherein the cover ring includes a first cover ring and a second cover ring, and the radius of the first cover ring is larger than that of the second cover ring, and is used for Carry the second cover ring. When the carrier plate is in contact with the cover ring, only the second cover ring will contact the wafer on the carrier plate, and the carrier plate is used to carry the first cover ring. Through the design of the first cover ring and the second cover ring, the pressure exerted by the cover ring on the wafer can be reduced, and the probability of the wafer being crushed by the cover ring can be reduced.

In order to achieve the above objective, the present invention proposes a wafer carrying and fixing device, which includes: a stopper, including a side wall, an annular bottom and an annular convex portion, wherein the annular bottom is connected to the side wall and the annular convex portion, and is connected to the annular convex portion An opening is formed on the inner side of the radial direction; a cover ring is used to be placed on the stopper, and includes: a main body part, the main body part is an annular body, part of the main body part is located at the extension position of the opening of the stopper; The shielding part is connected to a radially outer side of the main body part, and includes a first protrusion that protrudes toward the annular bottom of the stopper, or protrudes away from the annular bottom of the stopper, wherein the shielding part and the stopper The distance between the sidewalls of the carrier plate is between 3 and 10 mm; and a carrier plate, including a carrier surface for carrying a wafer, wherein the carrier plate is located below the cover ring, when the carrier plate drives the wafer to move toward the cover ring At this time, the main body of the cover ring contacts the wafer.

The present model provides a thin film deposition equipment, including: a cavity, including an accommodating space; a wafer carrying and fixing device, located in the accommodating space, including: a stopper, including a side wall, an annular bottom and an annular convex Part, wherein the side wall is connected to the cavity, and the annular bottom part is connected to the side wall and the annular convex part, and an opening is formed on a radial inner side of the annular convex part; a cover ring is used to be placed on the stopper and includes: a main body part , The main body is a ring-shaped body, part of the main body is located at the extension position of the opening of the stop; A directional protrusion, wherein the distance between the shielding portion and the side wall of the blocking member is between 3 to 10 mm; and a carrier plate including a carrier surface for carrying a wafer, wherein the carrier plate is located under the cover ring, When the carrier plate drives the wafer to move toward the cover ring, the main body of the cover ring contacts the wafer.

In the wafer supporting and fixing device and the thin film deposition equipment, the shielding portion includes a second protrusion that protrudes in a direction away from the annular bottom of the stopper.

In the wafer carrying and fixing device and the thin film deposition equipment, the cover ring and the carrying plate are respectively provided with a corresponding alignment unit, and the cover ring and the carrying plate are aligned through the alignment unit.

In the wafer carrying and fixing device and the thin film deposition equipment, the cover ring includes a first cover ring and a second cover ring, the first cover ring has a larger circumference than the second cover ring and is used to carry the second cover ring, When the carrier plate moves toward the cover ring, the carrier plate is used to carry the first cover ring, and the second cover ring will contact the wafer. The first cover ring and the second cover ring are respectively provided with a corresponding alignment unit, and through the alignment The positioning unit aligns the second cover ring and the first cover ring.

The wafer carrying and fixing device and the thin film deposition equipment include an annular member connected to the carrying plate, the annular member is located around the carrying surface of the carrying plate, wherein the annular member and the cover ring are respectively provided with a corresponding alignment unit, and through the alignment The bit unit aligns the ring member and the cover ring.

The thin film deposition equipment includes a target set in the cavity and facing the carrier plate and the wafer. The carrier plate is located in the opening of the stopper and drives the cover ring away from the stopper to shorten the wafer on the carrier plate. The distance to the target.

Please refer to FIG. 1 and FIG. 2, which are respectively a cross-sectional schematic diagram of an embodiment of the novel wafer carrying and fixing device and a cross-sectional schematic diagram of an embodiment of the novel thin film deposition equipment operating in the feeding and discharging state. As shown in the figure, the wafer carrying and fixing device 10 is used to carry and fix at least one wafer 12, and mainly includes at least one carrier plate 11, a stopper 13, and a cover ring 15, wherein the stopper 13 is used to support the cover ring 15. , And the carrier plate 11 is located below the cover ring 15 and/or the stopper 13.

The carrier plate 11 includes a carrier surface 111 for carrying the wafer 12. The top view of the cover ring 15 and/or the stopper 13 is approximately ring-shaped. The stopper 13 includes a side wall 131, an annular bottom 133 and an annular protrusion 135, and the annular bottom 133 connects the sidewall 131 and the annular protrusion 135.

The side wall 131 of the stopper 13 is approximately cylindrical, hollow columnar, hollow cylindrical or hollow frustum-shaped in appearance, wherein one end of the side wall 131 of the stopper 13 can be connected to the cavity 17, and the other end of the side wall 131 Then connect the ring bottom 133.

The appearance of the annular bottom 133 is similar to an annular shape, wherein one end of the annular bottom 133 is connected to the side wall 131 of the stopper 13, for example, the radially outer side of the annular bottom 133 is connected to the bottom end of the side wall 131, and the angle between the side wall 131 and the annular bottom 133 Approximately 90 degrees.

The appearance of the annular convex portion 135 is approximately cylindrical, hollow columnar, hollow cylindrical or hollow frustum-shaped body. An opening 132 is formed on a radially inner side. Specifically, the side wall 131 and the annular protrusion 135 are respectively connected to the radially outer side and the radially inner side of the annular bottom 133 and protrude or extend in the same direction. The height of the side wall 131 is greater than the annular protrusion 135.

The cover ring 15 includes a main body 151 and a shielding portion 153. The main body 151 is a ring-shaped body, and the shielding portion 153 is approximately cylindrical, hollow cylindrical, hollow cylindrical or hollow truncated cone-shaped in appearance. . Specifically, the shielding portion 153 is connected to the radially outer side of the main body 151, and the included angle between the shielding portion 153 and the main body 151 is approximately 90 degrees.

The cover ring 15 can be placed on the stopper 13, for example, the annular protrusion 135 of the stopper 13 is used to carry the lower surface of the main body 151 of the cover ring 15. When the cover ring 15 is placed on the annular protrusion 135 of the stopper 13, part of the main body 151 will extend toward the annular bottom 133 of the stopper 13 and/or the radial inner side of the annular protrusion 135, and will be located in the opening of the stopper 13 The extended position of the 132 to shield or cover part of the opening 132. In addition, a part of the main body portion 151 will extend toward the radially outer side of the annular bottom 133 and/or the annular convex portion 135 of the stopper 13 and block or cover most of the annular bottom 133.

Specifically, the cover ring 15 of the present invention extends toward the side wall 131 of the blocking member 13 and reduces the distance between the shielding portion 153 of the cover ring 15 and the side wall 131, wherein the distance is between 3 to 10 millimeters (mm) between. Through the special design of the cover ring 15 of the present invention, the shielding effect of the cover ring 15 and the stopper 13 can be improved to reduce the reaction gas and/or the target atoms and/or target molecules generated during the deposition process from contacting the outside of the stopper 13的chamber 17.

The thin film deposition apparatus 100 shown in FIG. 2 mainly includes a cavity 17 and a wafer supporting and fixing device 10, wherein the wafer supporting and fixing device 10 is located in the accommodating space 14 of the cavity 17. One end of the stopper 13 can be connected to the cavity 17, and the other end is used to carry the cover ring 15. The carrier plate 11 is located below the cover ring 15 and/or the stopper 13 and can be displaced relative to the cover ring 15 and/or the stopper 13.

A wafer inlet and outlet 171 can be provided on the cavity 17, wherein the carrier plate 11 can be displaced away from the cover ring 15 and/or the stopper 13, so that the height of the carrier surface 111 of the carrier plate 11 is close to the wafer inlet and outlet 171 . Then, the wafer 12 outside the cavity 17 can be placed on the carrying surface 111 of the carrier tray 11 through the wafer inlet and outlet 171 through a robotic arm. In addition, the robot arm can also transport the wafer 12 on the carrying surface 111 of the carrier tray 11 to the outside of the cavity 17 through the wafer inlet and outlet 171.

In an embodiment of the present invention, the thin film deposition equipment 100 may be a physical vapor deposition device, and a target 19 is disposed in the cavity 17, wherein the target 19 faces the carrier plate 11 and/or the wafer 12. The cavity 17 may be provided with at least one air inlet, wherein the air inlet is fluidly connected to the accommodating space 14 of the cavity 17 and is used to deliver a process gas to the accommodating space 14 for the deposition process. For example, the process gas can be It is an inert gas or a reactive gas. In addition, an air extraction port may be provided on the cavity 17, and the gas in the cavity 17 can be extracted through the pump through the air extraction port, so that the containing space 14 is low pressure or vacuum.

As shown in FIG. 3, the carrier plate 11 can drive the wafer 12 to be moved toward the cover ring 15, the stopper 13, and/or the target 19, so that the carrier plate 11 is located in the opening 132 of the stopper 13, wherein the cover ring The main body 151 of 15 contacts the wafer 12 on the carrier plate 11 to fix the wafer 12 on the carrier plate 11. At this time, the carrier plate 11, the cover ring 15, the stopper 13 and the cavity 17 define a reaction space 141 in the accommodating space 14, and a thin film is deposited on the surface of the wafer 12 in the reaction space 141. The reaction space 141 is basically an isolated space in the accommodating space 14, wherein the reaction gas, target atoms and/or target molecules in the reaction space 141 will not contact the cavity 17 outside the stopper 13, so as to avoid being trapped in the cavity. A thin film is deposited on the surface of 17, which in turn causes contamination of the cavity 17.

As shown in Figures 4 and 5, the carrier plate 11 in the opening 132 of the stopper 13 can continue to drive the carried wafer 12 to move in the direction of the target 19, so as to shorten the target 19 and the wafer carried by the carrier plate 11. The distance between circles 12. At this time, the carrier plate 11 will also carry the cover ring 15 and drive the cover ring 15 away from the stopper 13.

Since the gap between the shielding portion 153 of the cover ring 15 and the side wall 131 of the stopper 13 of the present invention is less than 10 mm, even if the carrier plate 11 drives the cover ring 15 away from the stopper 13, the reaction gas in the reaction space 141 can still be avoided , The target material atoms and/or target material molecules enter the accommodation space 14 outside the stopper 13.

Specifically, through the thin film deposition apparatus 100 of the present invention, it is possible to avoid increasing the adjustable distance between the wafer 12 carried by the carrier plate 11 and the target 19 when a deposited thin film is formed on the inner surface of the cavity 17 Scope. In this way, the distance between the wafer 12 and the target 19 can be adjusted according to the requirements of the deposition process to improve the uniformity of the film deposited on the surface of the wafer 12.

In contrast, the adjustable range of the distance between the wafer 12 carried by the carrier plate 11 of the general deposition chamber and the target 19 is relatively small. If the distance between the carrier plate 11 and the target 19 is to be reduced, it is often This will cause an excessively large gap between the cover ring 15 and the stopper 13 to cause the reaction gas, target atoms and/or target molecules in the reaction space 141 to enter the accommodating space 14 outside the stopper 13, and then enter the cavity 17 The inner surface of the film is deposited.

In addition, the gap between the shielding portion 153 of the cover ring 15 and the side wall 131 of the stopper 13 of the present invention will be greater than 3 mm to avoid electrical conduction between the cover ring 15 and the stopper 13 and prevent the shielding portion 153 of the cover ring 15 from being electrically connected. The side wall 131 of the stopper 13 is contacted or rubbed, resulting in particle contamination.

In an embodiment of the present invention, as shown in FIG. 1, a corresponding alignment unit may be provided between the cover ring 15 and the carrier plate 11, for example, a protrusion 155 is provided on the lower surface of the cover ring 15, and A concave portion 113 is provided on the carrier plate 11, wherein a corresponding inclined surface is formed between the convex portion 155 and the concave portion 113. When the carrier plate 11 approaches the cover ring 15, the protruding part 155 of the cover ring 15 will contact the concave part 113 of the carrier plate 11 and align the cover ring 15 and the carrier plate 11.

In another embodiment of the present invention, the carrier plate 11 may include a ring member 115, wherein the ring member 115 is located around the bearing surface 111 of the carrier plate 11, and a corresponding alignment unit is provided between the cover ring 15 and the ring member 115 , To align the cover ring 15 and the ring member 115.

In an embodiment of the present invention, the wafer carrying and fixing device 10 may include at least one lifting unit 161 and a carrying member 163, wherein the carrying member 163 is arranged on the carrying tray 11 and located below the wafer 12 carried by the carrying tray 11, For example, the appearance of the bearing member 163 may be ring-shaped and located on the inner side of the ring-shaped member 115.

The lifting unit 161 connects the bearing member 163 and the bearing plate 11 and is used to drive the bearing member 163 to move relative to the bearing plate 11. For example, the lifting unit 161 can extend relative to the bearing surface 111 of the bearing plate 11 and drive the bearing member 163 to leave the bearing plate 11 In order to drive the wafer 12 away from the carrying surface 111 of the carrier tray 11 through the carrying member 163, it is advantageous to take the wafer 12 through the robotic arm.

In another embodiment of the present invention, the lifting unit 161 is connected to the carrier plate 11 and is located below the wafer 12 carried by the carrier plate 11. The lifting unit 161 can extend relative to the carrying surface 111 of the carrier tray 11 and drive the wafer 12 away from the carrying surface 111 of the carrier tray 11. In this way, there is no need to provide a carrying member 163.

The shielding portion 153 of FIG. 1 includes a first raised portion 1531 and a second raised portion 1533. The first raised portion 1531 protrudes toward the annular bottom 133 of the stopper 13, and the second raised portion 1533 Then, it bulges in a direction away from the annular bottom 133 of the stopper 13.

As shown in Figure 5, the cover ring 15 may include a first cover ring 157 and a second cover ring 159. The length and/or the maximum radius are greater than the maximum circumference and/or the maximum radius of the second cover ring 159. The second cover ring 159 is located above the first cover ring 157, and the second cover ring 159 is carried by the first cover ring 157. When the carrier plate 11 is displaced toward the first cover ring 157 and/or the second cover ring 159, the second cover ring 159 will contact the edge of the wafer 12 carried by the carrier plate 11 and fix the wafer 12 on the carrier plate 11载面111。 Bearing surface 111.

In practical applications, the second cover ring 159 can be placed on the first cover ring 157, and the smaller-sized wafer 12 can be fixed on the carrier tray 11 through the second cover ring 159. In addition, the second cover ring 159 can also be removed from the first cover ring 157, and the larger-sized wafer 12 can be fixed on the carrier tray 11 through the first cover ring 157. When the first cover ring 157 is used to fix the larger-sized wafer 12 on the carrier plate 11, it may be necessary to replace the carrier plate 11 or configure additional components on the carrier plate 11. A corresponding alignment unit can be provided between the first cover ring 157 and the second cover ring 159 respectively, and the first cover ring 157 and the second cover ring 159 can be aligned through the alignment unit.

As compared with the prior art, the length, area and weight of the cover ring 15 may be larger in the present invention, and the pressure applied by the cover ring 15 to the wafer 12 will be increased, thereby increasing the probability of the wafer 12 being broken. When the cover ring 15 includes the first cover ring 157 and the second cover ring 159, the weight of the first cover ring 157 can be carried through the carrier plate 11, and the second cover ring 159 can contact and fix the wafer 12 on the carrier plate 11 Therefore, the pressure applied by the cover ring 15 on the wafer 12 can be reduced, and the probability of chipping of the wafer 12 can be reduced.

As shown in FIG. 6, the shielding portion 153 of the cover ring 15 includes a first protrusion 1531, wherein the first protrusion 1531 protrudes in the direction of the annular bottom 133 of the stopper 13. As shown in FIG. 7, the shielding portion 153 of the cover ring includes a raised portion 1535, wherein the raised portion 1535 protrudes in a direction away from the annular bottom 133 of the stopper 13.

Since the cover ring 15 of the present invention can provide a good shielding effect, the heights of the annular protrusion 135 of the stopper 13 and the first protrusion 1531 of the shielding portion 153 can be further shortened, so as not to affect the cover ring 15 and the first protrusion 1531. In the case of the shielding effect of the stopper 13 on the cavity 17, increase the adjustable distance between the wafer 12 carried on the carrier plate 11 and the target 19, for example, the main body 151 of the cover ring 15 can still contact the wafer 12 Under the premise, the distance between the wafer 12 and the target 19 is increased.

The foregoing is only one of the preferred embodiments of the present invention, and is not used to limit the scope of implementation of the present invention, that is, all the equivalent changes and changes in the shape, structure, characteristics and spirit described in the scope of the patent application of the present invention Modifications should be included in the scope of the patent application for this new model.

10: Wafer carrying fixture 100: Thin film deposition equipment 11: Carrier plate 111: bearing surface 113: Concave 115: Ring member 12: Wafer 13: stop 131: Sidewall 132: opening 133: Ring bottom 135: Ring convex 14: accommodating space 141: Reaction Space 15: cover ring 151: Main Body 153: Shading part 1531: first protrusion 1533: second protrusion 1535: bulge 155: Protruding part 157: first cover ring 159: second cover ring 161: Lifting unit 163: Load-bearing member 17: Cavity 171: Wafer Import and Export 19: Target

[Fig. 1] is a schematic cross-sectional view of an embodiment of the novel wafer carrying and fixing device.

[Figure 2] is a schematic cross-sectional view of an embodiment of the new thin film deposition equipment operating in the feeding and discharging state.

[Figure 3] is a schematic cross-sectional view of an embodiment of the new thin film deposition equipment operating in the deposition state.

[Figure 4] is a schematic cross-sectional view of another embodiment of the new thin film deposition equipment operating in the deposition state.

[Fig. 5] is a schematic cross-sectional view of another embodiment of the novel wafer carrying and fixing device.

[Fig. 6] is a schematic cross-sectional view of another embodiment of the novel wafer carrying and fixing device.

[Fig. 7] is a schematic cross-sectional view of another embodiment of the novel wafer carrier fixing device.

10: Wafer carrying fixture

11: Carrier plate

111: bearing surface

113: Concave

115: Ring member

12: Wafer

13: stop

131: Sidewall

132: opening

133: Ring bottom

135: Ring convex

15: cover ring

151: Main Body

153: Shading part

1531: first protrusion

1533: second protrusion

155: Protruding part

161: Lifting unit

163: Load-bearing member

Claims (10)

A wafer carrying and fixing device includes: A stopper including a side wall, an annular bottom and an annular convex portion, wherein the annular bottom connects the side wall and the annular convex portion, and forms an opening on a radial inner side of the annular convex portion; A cover ring to be placed on the stopper and includes: A main body, the main body is an annular body, and a part of the main body is located at an extension position of the opening of the stop; A shielding portion connected to a radially outer side of the main body portion and including a first protrusion protruding toward the annular bottom of the blocking member, wherein the distance between the shielding portion and the side wall of the blocking member Less than 10 mm, and the shielding portion does not contact the side wall of the stop; and A carrier plate includes a carrier surface for carrying a wafer, wherein the carrier plate is located below the cover ring, and when the carrier plate drives the wafer to move toward the cover ring, the main body portion of the cover ring contacts The wafer. The wafer carrying and fixing device according to claim 1, wherein the shielding portion includes a second protruding portion that protrudes in a direction away from the annular bottom of the stopper. The wafer carrier fixing device according to claim 1, wherein the cover ring and the carrier plate are respectively provided with a corresponding alignment unit, and the cover ring and the carrier plate are aligned through the alignment unit. The wafer carrying and fixing device according to claim 1, wherein the cover ring includes a first cover ring and a second cover ring, and the first cover ring has a larger circumference than the second cover ring and is used to carry the first cover ring Two cover rings, when the carrier plate is displaced toward the cover ring, the carrier plate is used to carry the first cover ring, and the second cover ring will contact the wafer, the first cover ring and the second cover ring A corresponding alignment unit is respectively arranged, and the second cover ring and the first cover ring are aligned through the alignment unit. The wafer carrying and fixing device according to claim 1, comprising an annular member connected to the carrying plate, and the annular member is located around the carrying surface of the carrying plate, wherein the annular member and the cover ring are respectively provided with a corresponding pair The positioning unit aligns the ring member and the cover ring through the positioning unit. A wafer carrying and fixing device includes: A stopper including a side wall, an annular bottom and an annular convex portion, wherein the annular bottom connects the side wall and the annular convex portion, and forms an opening on a radial inner side of the annular convex portion; A cover ring to be placed on the stopper and includes: A main body, the main body is an annular body, and a part of the main body is located at an extension position of the opening of the stop; A shielding portion connected to a radially outer side of the main body portion, and including a protrusion that protrudes in a direction away from the annular bottom of the stopper, wherein the distance between the shielding portion and the side wall of the stopper is smaller than 10 mm, and the shielding portion does not touch the side wall of the stop; and A carrier plate includes a carrier surface for carrying a wafer, wherein the carrier plate is located below the cover ring, and when the carrier plate drives the wafer to move toward the cover ring, the main body portion of the cover ring contacts The wafer. A thin film deposition equipment, including: A cavity, including an accommodating space; A wafer carrying and fixing device, located in the accommodating space, includes: A stopper includes a side wall, an annular bottom and an annular convex portion, wherein the side wall connects the cavity, and the annular bottom connects the side wall and the annular convex portion, and is formed on a radial inner side of the annular convex portion An opening A cover ring to be placed on the stopper and includes: A main body, the main body is an annular body, and a part of the main body is located at an extension position of the opening of the stop; A shielding portion connected to a radially outer side of the main body portion and including a first protrusion protruding toward the annular bottom of the blocking member, wherein the distance between the shielding portion and the side wall of the blocking member Less than 10 mm, and the shielding portion does not contact the side wall of the stop; and A carrier plate includes a carrier surface for carrying a wafer, wherein the carrier plate is located below the cover ring, and when the carrier plate drives the wafer to move toward the cover ring, the main body portion of the cover ring contacts The wafer. The thin film deposition apparatus according to claim 7, wherein the shielding portion includes a second protrusion that protrudes in a direction away from the annular bottom of the stopper. The thin film deposition apparatus according to claim 7, wherein the cover ring includes a first cover ring and a second cover ring, and the circumference of the first cover ring is greater than that of the second cover ring, and is used to carry the second cover When the carrier plate is displaced toward the second cover ring, the second cover ring will contact the wafer. The first cover ring and the second cover ring are respectively provided with a corresponding alignment unit, and pass through the pair The positioning unit aligns the second cover ring and the first cover ring. The thin film deposition apparatus according to claim 7, comprising a target disposed in the cavity and facing the carrier plate and the wafer, the carrier plate is located in the opening of the stopper, and drives the cover ring away The stopper can shorten the distance between the wafer on the carrier plate and the target material.

Images