TWI783364B - Electronic device and grounding assembly thereof - Google Patents
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本案關於一種接地模組,尤指一種適用於密閉式電子裝置,且可整機組裝後進行高壓測試之電子裝置及其接地模組。 This case relates to a grounding module, especially an electronic device and its grounding module that are suitable for closed electronic devices and can be assembled for high voltage testing.
隨著科技發展的進步以及各式電子產品的推陳出新,電子產品佔據了人們的大部份日常生活。於各式電子產品中,需藉由電源供應裝置將市電轉為直流電源,以供電子產品運作之用。 With the progress of technological development and the innovation of various electronic products, electronic products occupy most of people's daily life. In various electronic products, it is necessary to use a power supply device to convert the mains power into DC power for the operation of electronic products.
尤其是在戶外電子產品的設計使用上,為了避免雷擊產生的高壓電流突波導致電源供應裝置或是電子產品內部的電子元件損壞,是以於生產製造時,一般會對電源供應裝置進行高壓測試(High Potential Test),以確認電源供應裝置符合安規,並可避免雷擊的高壓電流突波損壞其內部電子零件。 Especially in the design and use of outdoor electronic products, in order to avoid damage to the power supply device or the electronic components inside the electronic product due to the high-voltage current surge generated by lightning strikes, the power supply device is generally tested for high voltage during production and manufacturing. (High Potential Test) to confirm that the power supply device complies with safety regulations, and to avoid damage to internal electronic components caused by high-voltage current surges caused by lightning strikes.
如第1圖所示,一般習知的電源供應裝置1具有機殼10及上蓋11,機殼10具有容置空間12及開口120。電路板13即經由開口120而對應設置於機殼10內之容置空間12中,且透過兩螺柱151、152而對應鎖固於機殼10之底板上。於此習知電源供應裝置1內,電路板13具有第一表面130及第二表面131,且第一表面130上具有輸入端132及輸出端133,其位置係分別對應鎖固於電路板13之第二
表面131之螺柱151、152。一般而言,於習知做法中,當電路板13已鎖固於機殼10上後,即對電源供應裝置1進行高壓測試。並於高壓測試結束後,再將兩接地螺絲141、142分別對應於輸入端132、輸出端133,由電路板13之第一表面130向下對應鎖固,以使接地螺絲141、142分別對應鎖固於螺柱151、152中,藉此以達成輸入端132、輸出端133之接地保護。最後,再將上蓋11對應封閉於機殼10之開口120上,以完成電源供應裝置1之整機組裝。
As shown in FIG. 1 , a conventional
然而,於此組裝流程中,需待高壓測試結束後方能整機組裝完成並進行封蓋,其難以確保組裝之穩定性及安全性,且此組裝流程繁複,實導致生產時間之浪費,亦難以確保產品品質。 However, in this assembly process, the whole machine can be assembled and sealed only after the high-voltage test is completed. It is difficult to ensure the stability and safety of the assembly, and the assembly process is complicated, which leads to a waste of production time and is difficult. Ensure product quality.
是以,如何發展一種可改善上述現有技術所遇到問題的電子裝置及其接地模組,實為重要的課題之一。 Therefore, how to develop an electronic device and its grounding module that can improve the above-mentioned problems encountered in the prior art is one of the important issues.
本案之一目的在於提供一種電子裝置,藉由接地模組之結構設計,使電子裝置可先整機組裝完成,進行高壓測試後,在無需開蓋的狀態下進行最後的接地保護程序,以確保電子裝置之穩定性及安全性。 One purpose of this case is to provide an electronic device. Through the structural design of the grounding module, the electronic device can be assembled first. After the high-voltage test, the final grounding protection procedure can be performed without opening the cover to ensure Stability and security of electronic devices.
本案之另一目的在於提供一種接地模組,其具有導接端子、第一接地件及第二接地件,藉由先將導接端子、第一接地件電連接裝設於電路板上,待電路板及其他電子組件裝設於電子裝置,並完成高壓測試後,最後再將第二接地件經由電子裝置之機殼之第一穿孔處對應穿設於電路板及導接端子上,以完成接地保護程序,以達結構簡單及快速組裝之功效,藉以解決習知技術中組裝流程繁複、浪費生產時間及成本,且難以確保產品品質之問題。 Another object of this case is to provide a grounding module, which has a conductive terminal, a first grounding piece and a second grounding piece, by first installing the conductive terminal and the first grounding piece on the circuit board electrically, and then The circuit board and other electronic components are installed on the electronic device, and after the high-voltage test is completed, the second grounding piece is passed through the first through hole of the electronic device's casing and correspondingly installed on the circuit board and the conductive terminal to complete The grounding protection program achieves the effect of simple structure and quick assembly, so as to solve the problems of complicated assembly process, waste of production time and cost, and difficulty in ensuring product quality in the conventional technology.
根據本案之構想,本案提供一種電子裝置,包含:機殼、電路板及接地模組,機殼具有容置空間;電路板設置於容置空間中,具有第一表面及第二表面,第二表面上設置有輸入端及輸出端;接地模組包含導接端子、第一接地件及第二接地件,導接端子設置於電路板之第一表面上,且第一接地件鄰設於導接端子;其中,第一接地件穿設電路板,與導接端子及機殼電連接,第二接地件對應穿設電路板及導接端子,且第二接地件之第一部件與電路板之輸入端及輸出端電連接,第二接地件之第二部件與導接端子電連接。 According to the idea of this case, this case provides an electronic device, including: a casing, a circuit board and a grounding module, the casing has an accommodating space; the circuit board is arranged in the accommodating space, and has a first surface and a second surface. The surface is provided with an input end and an output end; the grounding module includes a conductive terminal, a first grounding piece and a second grounding piece, the conductive terminal is arranged on the first surface of the circuit board, and the first grounding piece is adjacent to the lead Connecting terminal; Wherein, the first grounding piece penetrates the circuit board and is electrically connected with the lead terminal and the chassis, the second grounding piece is correspondingly passed through the circuit board and the lead terminal, and the first part of the second grounding piece is connected to the circuit board The input end and the output end of the second grounding member are electrically connected to the lead terminal.
根據本案之構想,其中機殼具有底板,底板上具有第一穿孔,第二接地件穿越第一穿孔而對應鎖固於電路板上。 According to the idea of the present case, the casing has a bottom plate, the bottom plate has a first through hole, and the second grounding member passes through the first through hole and is correspondingly locked on the circuit board.
根據本案之構想,其中電子裝置更具有閥體,且閥體密封底板之第一穿孔。 According to the idea of this case, the electronic device further has a valve body, and the valve body seals the first through hole of the bottom plate.
根據本案之構想,其中導接端子具有第二穿孔,供第二接地件之第二部件穿設於其中。 According to the idea of the present case, the conducting terminal has a second through hole for the second part of the second grounding element to pass through.
根據本案之構想,其中導接端子為方形中空之殼體結構,且具有複數個腳部,複數個腳部對應穿設電路板,以使導接端子卡設於電路板之第一表面上。 According to the idea of this case, the conductive terminal is a square hollow shell structure, and has a plurality of legs, and the plurality of legs are correspondingly passed through the circuit board, so that the conductive terminal is clamped on the first surface of the circuit board.
根據本案之構想,其中第一接地件具有第三部件,且第三部件透過電路板之第一表面上之線路與導接端子電連接。 According to the idea of this case, the first grounding member has a third component, and the third component is electrically connected to the conductive terminal through the circuit on the first surface of the circuit board.
根據本案之構想,其中電子裝置更具有固定結構,固定結構設置於電路板之第二表面下,當第一接地件穿設電路板,第一接地件之第四部件與固定結構對應鎖固。 According to the idea of this case, the electronic device further has a fixing structure, and the fixing structure is arranged under the second surface of the circuit board. When the first grounding member passes through the circuit board, the fourth part of the first grounding member is correspondingly locked with the fixing structure.
根據本案之構想,本案提供一種接地模組,適用於電子裝置,電子裝置包括機殼及電路板,接地模組包含:導接端子、第一接地件及第二接地件,導接端子設置於電路板之第一表面上;第一接地件鄰設於導接端子,且穿設電路板,並與導接端子及機殼電連接;第二接地件對應穿設電路板及導接端子,俾使第一部件與電路板之第二表面上之輸入端及輸出端電連接,第二部件與導接端子電連接。 According to the idea of this case, this case provides a grounding module, which is suitable for electronic devices. The electronic device includes a casing and a circuit board. The grounding module includes: a conductive terminal, a first grounding piece and a second grounding piece. The conductive terminal is set on On the first surface of the circuit board; the first grounding piece is adjacent to the conductive terminal, and passes through the circuit board, and is electrically connected with the conductive terminal and the casing; the second grounding piece is correspondingly passed through the circuit board and the conductive terminal, The first component is electrically connected to the input terminal and the output terminal on the second surface of the circuit board, and the second component is electrically connected to the lead terminal.
1:電源供應裝置 1: Power supply device
10:機殼 10: Chassis
11:上蓋 11: Upper cover
12:容置空間 12:Accommodating space
120:開口 120: opening
13:電路板 13: Circuit board
130:第一表面 130: first surface
131:第二表面 131: second surface
131:輸入端 131: input terminal
132:輸出端 132: output terminal
141、142:接地螺絲 141, 142: Grounding screw
151、152:螺柱 151, 152: studs
100:電子裝置 100: Electronic device
2:機殼 2: Chassis
20:蓋板 20: cover plate
21:底板 21: Bottom plate
22:第一穿孔 22: First piercing
200:容置空間 200: storage space
201:開口 201: opening
3:電路板 3: circuit board
31:第一表面 31: first surface
31a:線路 31a: Line
32:第二表面 32: second surface
32a:輸入端 32a: input terminal
32b:輸出端 32b: output terminal
33:第一孔洞 33: The first hole
34:第二孔洞 34: Second Hole
35:第三孔洞 35: The third hole
36、37:固定結構 36, 37: fixed structure
4:接地模組 4: Grounding module
40:導接端子 40: lead terminal
40a:頂面 40a: top surface
40b:第二穿孔 40b: Second perforation
40c:側面 40c: side
40d:腳部 40d: feet
41:第一接地件 41: The first grounding piece
41a:第三部件 41a: The third component
41b:第四部件 41b: The fourth component
42:第二接地件 42: Second grounding piece
42a:第一部件 42a: first part
42b:第二部件 42b: Second component
5:閥體 5: valve body
50:第一表面 50: first surface
第1圖為習知電源供應裝置之內部結構示意圖。 Figure 1 is a schematic diagram of the internal structure of a conventional power supply device.
第2圖為本案較佳實施例之電子裝置外觀之示意圖。 Figure 2 is a schematic diagram of the appearance of the electronic device of the preferred embodiment of the present case.
第3圖為本案較佳實施例之電子裝置於高壓測試前之剖面結構示意圖。 Fig. 3 is a schematic cross-sectional structure diagram of the electronic device of the preferred embodiment of the present application before the high-voltage test.
第4圖為本案較佳實施例之電子裝置於高壓測試後之剖面結構示意圖。 Fig. 4 is a schematic cross-sectional structure diagram of an electronic device in a preferred embodiment of the present application after a high-voltage test.
第5圖為第3圖所示之接地模組之導接端子之結構示意圖。 Fig. 5 is a schematic structural view of the conductive terminals of the grounding module shown in Fig. 3 .
第6圖為第3圖所示之電路板之部分上視結構示意圖。 Fig. 6 is a partial top view structural diagram of the circuit board shown in Fig. 3 .
第7圖為第4圖所示之接地模組之導接端子、第一接地件及閥體之立體結構示意圖。 Fig. 7 is a three-dimensional structure diagram of the grounding module shown in Fig. 4, the first grounding member and the valve body.
體現本案特徵與優點的一些典型實施例將在後段的說明中詳細敘述。應理解的是本案能夠在不同的態樣上具有各種的變化,其皆不脫離本案的範圍,且其中的說明及圖示在本質上當作說明之用,而非限制本案。 Some typical embodiments embodying the features and advantages of the present application will be described in detail in the description in the following paragraphs. It should be understood that this case can have various changes in different aspects without departing from the scope of this case, and that the descriptions and diagrams therein are used for illustration in nature rather than as limitations on this case.
第2圖為本案較佳實施例之電子裝置外觀之示意圖。第3圖為本案較佳實施例之電子裝置於高壓測試前之剖面結構示意圖。第4圖為本案較佳實施例之電子裝置於高壓測試後之剖面結構示意圖。如第2至4圖所示,本案之電子裝置100包括機殼2、電路板3及接地模組4。機殼2具有容置空間200,電路板3即設置於容置空間200中,且電路板3具有相對應設置之第一表面31及第二表面32,第二表面32上設置有輸入端32a及輸出端32b。接地模組4包含導接端子40、第一接地件41及第二接地件42,導接端子40設置於電路板3之第一表面31上,且第一接地件41鄰設於導接端子40。如第4圖所示,第一接地件41穿設電路板3,並與導接端子40及機殼2電連接,第二接地件42對應穿設電路板3及導接端子40,且第二接地件42之第一部件42a與電路板3之輸入端32a及輸出端32b電連接,第二部件42b與導接端子40電連接。
Figure 2 is a schematic diagram of the appearance of the electronic device of the preferred embodiment of the present case. Fig. 3 is a schematic cross-sectional structure diagram of the electronic device of the preferred embodiment of the present application before the high-voltage test. Fig. 4 is a schematic cross-sectional structure diagram of an electronic device in a preferred embodiment of the present application after a high-voltage test. As shown in FIGS. 2 to 4 , the
請參閱第2圖及第3圖,於本實施例中,電子裝置100可為但不限為密閉式電源供應器。電子裝置100具有殼體2,殼體2為方形中空之殼體,其具有容置空間200及開口201,其中容置空間200用以容置電路板3及其他電子組件(未圖示),開口201設置於殼體2之上方,且於容置空間200相連通。如圖所示,殼體2更具有蓋板20,當電路板3及其他電子組件透過殼體2上方之開口201而設置於殼體2之容置空間200後,即可將蓋板20對應覆蓋於開口201上,藉此以完成整機組裝。除此之外,殼體2亦具有底板21,且於底板21上設有第一穿孔22,第一穿孔22係貫穿底板21,並與容置空間200相連通。當電子裝置100進行完高壓測試(High
Potential Test)之後,即透過第一穿孔22以完成後續的接地保護程序,最後,再透過閥體5密封於第一穿孔22,並透過閥體5以調整電子裝置100內部的壓力平衡。
Please refer to FIG. 2 and FIG. 3 , in this embodiment, the
請參閱第3圖,其係為前述電子裝置100已完成封蓋組裝後之剖面結構示意圖。如圖所示,電路板3已設置於電子裝置100之容置空間200內,且透過兩固定結構36、37設置於殼體2之底板21上。於本實施例中,固定結構36、37可為但不限為螺柱,其設置於電路板3之第二表面32,以輔助支撐電路板3。如圖所示,導接端子40及第一接地件41均設置於電路板3之第一表面31上,且第一接地件41鄰設於導接端子40。
Please refer to FIG. 3 , which is a schematic cross-sectional structure diagram of the aforementioned
請同時參閱第3圖及第5圖。第5圖為第3圖所示之接地模組之導接端子之結構示意圖。如第5圖所示,接地模組4之導接端子40係為由頂面40a及4個側面40c所構成之方形中空殼體結構,但不以此為限。且導接端子40之材質係為由可導電之材質所構成,例如:金屬材質。以及,導接端子40具有第二穿孔40b,用以供第二接地件42穿設於其中。於一些實施例中,第二穿孔40b係設置於頂面40a上,且其位置係如第3圖所示,對應於電路板3之第二孔洞34以及殼體2上之第一穿孔22。又如第5圖所示,導接端子40更具有複數個腳部40d,於本實施例中,腳部40d之數量為4,且此4個腳部40d係由兩相鄰側面40c之交接處向下延伸以構成。當導接端子40設置於電路板3上時,即為透過此4個腳部40d對應穿設電路板3,以使導接端子40卡合設置於電路板3之第一表面31上。
Please refer to Figure 3 and Figure 5 at the same time. Fig. 5 is a schematic structural view of the conductive terminals of the grounding module shown in Fig. 3 . As shown in FIG. 5, the
請參閱第3圖,如圖所示,接地模組4之第一接地件41係鄰設於導接端子40,且其係由上而下穿設電路板3,進而與電路板3下方之固定結構36相互鎖固。以本實施例為例,第一接地件41由可導電之材質所構成,且其可為但不限為一螺絲。第一接地件41具有第三部件41a及第四部件41b,於本實施例中,
第三部件41a即為該螺絲之頭部,第四部件41b即為螺絲之腳部。當第一接地件41穿越電路板3而向下對應鎖固於固定結構36之螺柱內時,其係可透過第四部件41b,即其腳部,以直接或是間接的方式與殼體2之底板21電導接。
Please refer to Fig. 3, as shown in the figure, the
請同時參閱第3圖及第6圖。第6圖為第3圖所示之電路板之部分上視結構示意圖。如圖所示,電路板3上具有複數個第一孔洞33、第二孔洞34、第三孔洞35,其中第一孔洞33之位置係對應於電路板3下方之固定結構36,用以供第一接地件41穿設於其中。第二孔洞34之位置則對應於殼體2之底板21上之第一穿孔22以及導接端子40之第二穿孔40b,用以供第二接地件42對應穿設於其中。於本實施例中,第三孔洞35為複數個方形孔洞,其數量及位置係對應於導接端子40之複數個腳部40d(如第5圖所示)。如第3圖及第6圖所示,當第一接地件41穿越電路板3時,即為穿越第一表面31上之第一孔洞33,並向下對應與固定結構36相互鎖固。此時,第一接地件41之第三部件41a,即其頭部,則設置於電路板3之第一表面31上,並透過第一表面31上之線路31a而與導接端子40形成電連接。由第6圖可見,線路31a係連接第一孔洞33及第三孔洞35,換言之,當導接端子40對應設置於電路板3之第一表面31上時,其設置於電路板3上之側面40c可透過線路31a而與第一接地件41之第三部件41a電連接。
Please refer to Figure 3 and Figure 6 at the same time. Fig. 6 is a partial top view structural diagram of the circuit board shown in Fig. 3 . As shown in the figure, there are a plurality of
請同時參閱第3圖、第4圖及第7圖,第7圖為第4圖所示之接地模組之導接端子、第一接地件及閥體之立體結構示意圖。於本實施例中,電路板3之第二表面32上設有輸入端32a及輸出端32b,然此輸入端32a及輸出端32b並未與第一接地件41直接連接。且輸入端32a及輸出端32b分別設置於第二孔洞34之兩相對側,且鄰近於第二孔洞34。於一些實施例中,輸入端32a及輸出端32b分別為一次側及二次側,但不以此為限。當電子裝置100如前所述,將電路板3及其他電
子零件裝設於電子裝置100內部之容置空間200內後,其係透過將蓋板20封閉覆蓋於開口201上以完成封蓋程序,換言之,此時已完成電子裝置100之整機組裝,並可進行後續的產品高壓測試。於本實施例中,高壓測試係為分別進行一次側迴路高壓測試以及二次側迴路高壓測試,但不以此為限。且於進行此等高壓測試時,需移除接地才可進行測試,是以本實施例係待高壓測試結束後,再進行最後的接地保護程序。於本實施例中,由於電子裝置100已完成整機組裝,是以接地保護程序不會再開啟電子裝置100之蓋板20,而是透過殼體2之底板21上的第一穿孔22來進行,如此一來,即可於兼顧裝置氣密性的前提下,快速、可靠,且不破壞裝置氣密性的進行接地復位,俾利於產品進行後續的氣密測試。
Please refer to Fig. 3, Fig. 4 and Fig. 7 at the same time. Fig. 7 is a three-dimensional structural diagram of the grounding module shown in Fig. 4, the first grounding piece and the valve body. In this embodiment, the
如第4圖所示,此接地保護程序為將第二接地件42先對應穿越底板21的第一穿孔22,其後再向上穿設,並使第二接地件42由下至上對應穿越電路板3之第二孔洞34,並繼續向上穿越導接端子40之頂板40a上的第二穿孔40b。於本實施例中,第二接地件42亦由可導電之材質所構成,且可為但不限為一螺絲。第二接地件42具有第一部件42a及第二部件42b,於本實施例中,第一部件42a即為該螺絲之頭部,第二部件42b即為螺絲之腳部。如第4圖所示,當第二接地件42穿越殼體2之第一穿孔22後,則對應穿設鎖固於電路板3之第二表面32上,是以其第一部件42a,即其頭部,係對應設置於電路板3之第二表面32上,並與第二表面32上之輸入端32a及輸出端32b電連通。以及,由於第二接地件42之第二部件42b,即其腳部,向上對應穿越導接端子40之第二穿孔40b,是以其亦與導接端子40構成電連接。如此一來,透過第二接地件42將輸入端32a、輸出端32b與導接端子40產生電導通,再透過第一接地件41將導接端子40與殼體2之底板21電導通,藉此以使電子裝置100可在不開蓋作業的情況下,便利且有效地完成接
地保護程序。最後,再將閥體5,例如:洩氣閥,但不以此為限,密封於殼體2之底板21之第一穿孔22上,以確保電子裝置100內部的壓力平衡,並可確保其內部零件的穩定性及安全性。如第7圖所示,可見閥體5之第一表面50係完整密封第一穿孔22,並與底板21之表面齊平。於一些實施例中,閥體5係由矽膠或橡膠材質所構成,但不以此為限,其係可依實際施作情形而任施變化。由此可見,透過本案之接地模組4及其接地保護程序,不僅接地結構簡單,且組裝程序簡便快速,更利於節省生產人力及成本。
As shown in Figure 4, the grounding protection procedure is to pass the
綜上所述,本案提供了一種電子裝置及其接地模組,接地模組具有導接端子、第一接地件及第二接地件,藉由先將導接端子、第一接地件電連接裝設於電路板上,待電路板及其他電子組件裝設於電子裝置,並完成高壓測試後,最後再將第二接地件經由電子裝置之機殼之第一穿孔處對應穿設於電路板及導接端子上,進而完成接地保護程序,使生產組裝流程更為簡便快速,且可於兼顧產品氣密性的前提下,達成結構簡單、快速組裝且利於進行高壓測試及後續的氣密測試之功效。是以,透過本案之電子裝置及其接地模組,不僅可節省組裝人力及工時,更可使電子裝置可先整機組裝完成,進行高壓測試後,在無需開蓋的狀態下進行最後的接地保護程序,以確保電子裝置之穩定性及安全性。 To sum up, this case provides an electronic device and its grounding module. The grounding module has a conductive terminal, a first grounding piece, and a second grounding piece. Installed on the circuit board, after the circuit board and other electronic components are installed on the electronic device, and after the high-voltage test is completed, the second grounding part is passed through the first hole of the electronic device's casing and correspondingly installed on the circuit board and On the lead terminal, and then complete the grounding protection procedure, which makes the production and assembly process easier and faster, and can achieve a simple structure, quick assembly and facilitate the high-voltage test and subsequent air-tightness test on the premise of taking into account the airtightness of the product. effect. Therefore, through the electronic device and its grounding module in this case, not only can the assembly manpower and man-hours be saved, but also the electronic device can be assembled as a whole first, and after the high-voltage test, the final assembly can be performed without opening the cover. Grounding protection procedures to ensure the stability and safety of electronic devices.
本案得由熟習此技術之人士任施匠思而為諸般修飾,然皆不脫如附申請專利範圍所欲保護者。 This case can be modified in various ways by people who are familiar with this technology, but it does not deviate from the intended protection of the scope of the attached patent application.
100:電子裝置 100: Electronic device
2:機殼 2: Chassis
20:蓋板 20: cover plate
21:底板 21: Bottom plate
22:第一穿孔 22: First piercing
3:電路板 3: circuit board
31:第一表面 31: first surface
31a:線路 31a: Line
32:第二表面 32: second surface
32a:輸入端 32a: input terminal
32b:輸出端 32b: output terminal
36、37:固定結構 36, 37: fixed structure
40:導接端子 40: lead terminal
40a:頂面 40a: top surface
40b:第二穿孔 40b: Second perforation
41:第一接地件 41: The first grounding piece
41a:第三部件 41a: The third component
41b:第四部件 41b: The fourth component
42:第二接地件 42: Second grounding piece
42a:第一部件 42a: first part
42b:第二部件 42b: Second component
5:閥體 5: valve body
Claims (9)
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TW110103824A TWI783364B (en) | 2021-02-02 | 2021-02-02 | Electronic device and grounding assembly thereof |
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TW202233017A TW202233017A (en) | 2022-08-16 |
TWI783364B true TWI783364B (en) | 2022-11-11 |
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Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW201438359A (en) * | 2013-03-29 | 2014-10-01 | Askey Computer Corp | Power connection module and electronic device having the same |
US20140301047A1 (en) * | 2012-12-25 | 2014-10-09 | Murata Manufacturing Co., Ltd. | Circuit board and electronic device |
CN105356163A (en) * | 2014-11-21 | 2016-02-24 | 连展科技电子(昆山)有限公司 | Socket electric connector |
CN108718011A (en) * | 2018-05-29 | 2018-10-30 | 苏州佳世达电通有限公司 | Electronic device |
-
2021
- 2021-02-02 TW TW110103824A patent/TWI783364B/en active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20140301047A1 (en) * | 2012-12-25 | 2014-10-09 | Murata Manufacturing Co., Ltd. | Circuit board and electronic device |
TW201438359A (en) * | 2013-03-29 | 2014-10-01 | Askey Computer Corp | Power connection module and electronic device having the same |
CN105356163A (en) * | 2014-11-21 | 2016-02-24 | 连展科技电子(昆山)有限公司 | Socket electric connector |
CN108718011A (en) * | 2018-05-29 | 2018-10-30 | 苏州佳世达电通有限公司 | Electronic device |
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