TWI782507B - A cassette feeding robot arm and sensor with a thin and brittle substrate rubbing vibration sensor - Google Patents

Abstract

A mechanical arm, which includes: a base, a driving element disposed on the base, at least one moving arm, a bearing element and at least one oscillation sensor. The moving arm is connected to the base and is driven by the driving member to move/rotate relative to the base between at least a starting position and a target position. The bearing part is arranged on the moving arm, and is used for bearing at least one thin brittle substrate. The vibration sensor includes: at least one sensing device corresponding to the above-mentioned carrier, a storage device for storing a range of reference values, a central processing device for comparison calculation, and a warning device that sends out a warning when abnormal vibration of the carrier is found mod. By detecting the damped vibration state of the carrier carrying the thin brittle substrate from moving to the position, it is determined that the thin brittle substrate carried by the carrier collides with the object.

Description

Loading robot arm and sensor with thin brittle substrate rubbing vibration sensor

The present invention relates to the technical field of detection of rubbing and vibration of thin brittle substrates, in particular to a kind of damped vibration state of a carrier bearing thin brittle substrates that can be detected to determine whether the thin brittle substrates have rubbed against objects passing by The sensor and the robot arm that configures the sensor.

Thin brittle substrates are often used in industrial applications, such as semiconductor wafers, solar cell substrates, panel substrates or glass for electronic devices, ceramic plates, etc. These thin substrates are usually limited by the material structure. Once the thickness Thin enough, the structural strength is quite limited, so it is called a brittle substrate in this case. These substrates often need to go through multiple processes to produce the final target product, such as epitaxy, photolithography, etching, cutting, and packaging. The glass plate also needs to be annealed. These processes are usually carried out on different machines. Therefore, when a series of processing processes are to be performed on such thin and brittle substrates, they need to be transported between the machines. Taking semiconductor wafers as an example, they are usually placed on the substrate. In order to protect the thin brittle substrate from damage during transportation, when the substrate container is transported to the vicinity of the machine, the thin brittle substrate is usually replaced by a mechanical arm. The substrate is transported between the machine and the substrate container, such as transferring the substrate to be processed from the substrate container to the machine by clamping or supporting, or transferring the processed substrate Transfer from the machine table into the substrate holder.

The mechanical arm will vibrate due to the structure of its own mechanism when it is running. For example, the vibration of the motor is transmitted to the mechanical arm, the vibration generated by the friction between the mechanical structures, or the mechanical arm passes through the structure when it reaches the position from the moving state. Vibration due to damping effect, etc. The vibration generated by the mechanical arm will affect the handling process of thin and brittle substrates. For example, if the vibration is too large, it may easily cause the substrate to drop or be scratched. The vibration state of the robotic arm is used to determine whether the vibration of the robotic arm will cause damage to the substrate during the process of transporting the substrate.

However, the above-mentioned prior art detects the vibration state of the robot arm itself during operation, so it can only determine whether the vibration state of the robot arm itself affects the handling of the substrate. When the robot arm transports the substrate to the processing area of the machine or transports the substrate into the substrate holder, due to the error of the stroke of the robot arm or the deformation of the processing area of the machine or the substrate holder The error, so that the possible friction of the substrate when it is transported to the machine or the substrate container, cannot be judged by the prior art. After the substrate is rubbed, it may not only cause damage to the substrate itself, but the debris generated after the substrate is rubbed may also spread into the space and cause pollution to other substrates or machines.

Taking semiconductor wafers as an example, since the operation process needs to be kept in a clean room, even if the damped vibration of the robotic arm reaches the range of 1mm, for example, the semiconductor wafer may collide with the wafer cassette or machine, seriously Even if it is only slightly scratched, it may cause a large number of particles to scatter and seriously damage the cleanliness of the air in the clean room. Because this kind of accident is extremely difficult to be found immediately, and a single semiconductor wafer may be worth hundreds to Thousands of dollars, if the clean room or machine is continuously polluted for several hours, the commercial loss will be difficult to estimate.

At present, to solve this kind of problem, an optical monitor is generally used for monitoring, and the stroke and position of the robot arm are judged by image data, so as to detect errors or vibrations caused by mechanical looseness and aging. However, on the one hand, various semiconductor wafers may have different colors due to the manufacturing process, resulting in frequent adjustment of optical monitoring values; on the other hand, to detect each machine, it is necessary to install optical monitoring devices from multiple angles , not only increases the cost, but also causes restrictions and burdens on operation and maintenance; especially when the robot arm enters the wafer cassette, it will be covered and cannot easily complete accurate detection from above or from the side, greatly reducing the effect of detection and warning.

In addition, during the process of grinding and planarizing the wafer, such as chemical mechanical planarization (CMP), the ground wafer may also be damaged due to abnormal vibration, such as deformation of the substrate (700 μm -700μm) makes the damped oscillation of the grinding and polishing process abnormal. In addition, general monitoring is aimed at the movement and vibration of the robotic arm, and cannot monitor the deformation of the cassette or the deformation of the substrate itself due to processing. Therefore, how to properly monitor this kind of thin and brittle substrate during the handling process, and give an immediate warning in the event of a slight scratch, so as to control the damage and avoid continuous expansion, and even further find out the deformation of the cassette or the damage of the substrate Deformation, solving the problem from the source is the technical contribution that the present invention will break through.

In view of this, the purpose of the present invention is to provide a box-loading robot arm with a thin brittle substrate rubbing vibration sensor, by detecting the damped vibration state of the robotic arm, it can be determined whether the thin brittle substrate has rubbed, and the real-time Discovery and effective damage control.

Another object of the present invention is to provide a box-loading robotic arm with a thin brittle substrate rubbing vibration sensor, which can detect the vibration state of the robotic arm in multiple directions and dimensions, and improve the accuracy and reliability of judging whether rubbing occurs. Spend.

Another object of the present invention is to provide a box-loading robotic arm with a thin brittle substrate rubbing vibration sensor, which can choose to activate the warning module when the robotic arm is close to the positioning, effectively avoiding false warnings.

Another object of the present invention is to provide a box-loading robot arm with a thin brittle substrate rubbing vibration sensor, which can select micro-electromechanical components for vibration monitoring, and obtain normal and abnormal frequencies of damped vibration without any shielding interference.

Another object of the present invention is to provide a rubbing vibration sensor for a box-loading robot arm. With a miniaturized sensing device, the measurement position can be close to the front end of the robot arm, thereby improving the measurement signal-to-noise ratio.

Yet another object of the present invention is to provide a wiping vibration sensor for a box-loading robot arm. By optionally connecting the sensing device with the central processing unit at the rear end in a wireless manner, it is further close to the end of the robot arm. The size of the sensing device is reduced to reduce the load added to the inertia of the manipulator.

In order to achieve the above object, the present invention provides a mechanical arm for transporting at least one thin brittle substrate. An embodiment of the mechanical arm of the present invention includes: a base, a driving member arranged on the base, at least one moving arm, A carrier and at least one vibration sensor. The moving arm is connected to the base and is driven by the driving member to move/rotate relative to the base between at least a starting position and a target position. The bearing part is arranged on the moving arm, and is used for bearing at least one thin brittle substrate. The vibration sensor includes: at least one sensing device corresponding to the bearing part, a storage device for storing a reference value range, a central processing device and a warning module. The sensing device includes three-dimensional vibration sensing elements perpendicular to each other for measuring the three-dimensional vibration of the moving arm and/or the bearing element and outputting a detection signal. The central processing device is signal-connected to the above-mentioned sensing device and the above-mentioned storage device for receiving the above-mentioned detection The detection signal is compared with the above-mentioned reference value range, and when the above-mentioned detection signal exceeds the above-mentioned reference value range, a warning signal is generated. The warning module is used for receiving the above warning signal and issuing a warning.

The invention provides a thin-type brittle substrate rubbing vibration sensor, which is used to measure the damped vibration of a bearing part of a mechanical arm when carrying and transporting a thin-shaped brittle substrate. An embodiment of the detector includes the above-mentioned thin brittle substrate rubbing vibration sensor, which is used to achieve the above-mentioned object of the present invention. The thin brittle substrate rubbing vibration sensor of the present invention includes at least one sensing device corresponding to the above-mentioned carrier, a storage device for storing a reference value range, a central processing device and a warning module. The sensing device includes three-dimensional vibration sensing elements perpendicular to each other for measuring the three-dimensional vibration of the moving arm and/or the bearing element and outputting a detection signal. The central processing device is signal-connected to the above-mentioned sensing device and the above-mentioned storage device for receiving the above-mentioned detection signal and comparing it with the above-mentioned reference value range. When the above-mentioned detection signal exceeds the above-mentioned reference value range, a warning signal is generated. , the warning module receives the warning signal and issues a warning.

The thin brittle substrate rubbing vibration sensor of the present invention detects whether the damped vibration state of the carrier is different from that of the carrier in the same stroke by detecting the damped vibration state of the carrier carrying the thin brittle substrate from moving to positioning And the natural damping vibration produced by bearing the same thin brittle substrate is used to determine the friction between the thin brittle substrate carried by the carrier and the object. The thin brittle substrate rubbing shock sensor of the present invention can detect the vibration state of the bearing part in multiple directions by setting a three-dimensional vibration sensing part, so that it can effectively detect the rubbing generated in various directions. bump. In addition, the thin brittle substrate rubbing vibration sensor of the present invention can choose to transmit the warning signal to the warning module when it reaches the position, or turn on the warning module when it reaches the position, all of which can selectively make the thin The brittle substrate rubbing and vibration sensor activates the warning function only when it reaches the fixed position, so as to prevent the sensing part from detecting the vibration state of the bearing part that has nothing to do with the rubbing of the object and falsely giving a warning.

Especially for warnings that cannot be obtained through external optical observation, such as the deformation of the cassette or the deformation of the semiconductor wafer during the manufacturing process, through the detection of the present invention, it can also be known immediately when a scratch occurs, thereby Remind the problem and get timely treatment.

1: Mechanical arm

10: base

20: Driver

30: Moving arm

40: Carrier

50: Oscillation sensor

51: Sensing device

52: Central processing unit

53: storage device

54:Warning module

511: Three-dimensional vibration measurement parts

512: chip

513: Wireless signal sender

521: processor chip

522: Analog to digital conversion circuit

523: filter circuit

524: Wireless signal transceiver

C: substrate container

S: thin brittle substrate

W: the working area of the machine

Fig. 1 is a side view of an embodiment of the robot arm of the present invention.

FIG. 2 is a system block diagram of an embodiment of the thin brittle substrate rubbing vibration sensor of the present invention.

Fig. 3 is a top view of the robot arm of the present invention moving and transporting thin brittle substrates between the working area of the machine table and the substrate container.

Fig. 4 is a side view of the robotic arm of the present invention transporting thin brittle substrates into the substrate holder.

Fig. 5 is a graph showing the relationship between the vibration amplitude and time of the mechanical arm of the present invention in the process of transporting thin brittle substrates without rubbing and rubbing.

Fig. 6 is a graph showing the relationship between the vibration amplitude and frequency of the vibration without rubbing and rubbing with the robotic arm of the present invention during the process of transporting the thin brittle substrate.

Please refer to FIG. 1 , FIG. 2 , FIG. 3 and FIG. 4 , which represent an embodiment of the mechanical arm and the thin brittle substrate rubbing vibration sensor of the present invention. The robotic arm 1 of this embodiment includes a base 10 , a driving part 20 , a plurality of moving arms 30 , a supporting part 40 and a vibration sensor 50 .

As shown in FIG. 1 , the base 10 is set on a working reference plane, for example, the ground or the installation surface of a work machine, as a reference position for calculating the movement of the moving arm 30 . The base 10 is used for supporting the moving arm 30 , the supporting member 40 and the vibration sensor 50 .

A plurality of moving arms 30 are connected to each other, and the moving arms 30 in this embodiment are pivotally connected to each other, and each moving arm 30 can rotate with each other, thereby extending or rotating to a desired distance and angle. But the moving arm of the present invention is not limited thereto, it can also be a moving arm that is slidably assembled with each other and arranged orthogonally so that it can move along three orthogonal coordinate axes respectively, or is assembled with partial sliding assembly and partial rotational assembly. The way to connect each other is not particularly limited.

The driving member 20 can be disposed on the base 10 for driving the moving arm 30 to move or rotate. The driving member 20 may be a driving element such as a servo motor or a hydraulic motor. For the structure of a plurality of moving arms 30, since the movement or rotation of each moving arm 30 is controlled separately, a driving member 20 can be respectively set at the driving position or the center of rotation of each moving arm 30 to drive the corresponding The mobile arm 30 pivots, moves or telescopically.

The carrier 40 is connected to the last moving arm 30 among the plurality of moving arms 30. After the plurality of moving arms 30 rotate or move respectively, the last moving arm 30 will reach the target position, thereby moving the carrier 40 to the target position. target location. The carrier 40 is used to carry the thin brittle substrate S. Therefore, with the above structure, as shown in FIG. 3, the carrier 40 can move the thin brittle substrate between an initial position and a target position, for example, the The material S is moved from the substrate container C to the working area W of the machine for processing, or the processed thin brittle substrate S is moved from the working area W of the machine to the substrate container C. The carrier 40 in this embodiment is an example of a bracket supporting a thin brittle substrate, and the thin brittle substrate is illustrated as a semiconductor wafer, but those skilled in the art can easily understand that the carrier 40 can also be Grippers for gripping thin, brittle substrates. The bearing member 40 can be fixed at the end of the moving arm 30 , or be rotatably assembled or slidingly assembled with the moving arm 30 .

As shown in FIG. 3, when the carrier 40 moves the thin brittle substrate S between the working area W of the machine table and the substrate container C, the carrier 40 is driven by the driving member 20, the moving arm 30 The bearing 40 will vibrate due to factors such as the frictional force between the movable arm 30 and the rigidity of the material itself of the bearing 40 . In addition to the vibration of the moving arm 30 and the carrier 40 in the moving process, these vibrations, when the carrier 40 stops after the moving arm 30 arrives at the predetermined target position from the moving state, the carrier 40 itself will dynamically pass through the carrier 40. The damping effect of its own inertia produces damped vibration and gradually vibrates to a standstill.

In addition, as shown in FIG. 4, during the moving stroke of the movable arm 30, some structural objects may pass by, especially the machine components in the working area W of the machine and the frame of the substrate holder C, etc. , when the carrier 40 passes through these structural objects, due to factors such as stroke setting errors or deformation of the structural objects, the thin and brittle substrate S carried by the carrier 40 may rub against these structural objects in rare cases. Touch and other issues. After the thin brittle substrate S rubs against the structural object, the carrier 40 will produce a damped vibration pattern different from that when the thin brittle substrate S does not collide. By measuring the vibration of the carrier in each stroke The vibration state of 40, especially the damped vibration state of the carrier 40 from moving to the target position, is then compared with the natural vibration state of the carrier 40 in the same stroke and carrying the same thin brittle substrate S, if the current vibration If there is an obvious difference mode between the state and the natural vibration state, it is determined that the thin brittle substrate S carried by the bearing member 40 rubs against these structural objects.

Since the carrier 40 carries various thin brittle substrates S and the natural damping vibration states are different in different moving strokes, the carrier 40 can be used to carry various thin brittle substrates S in advance and the moving strokes set for various processing machines Measure the natural vibration state or natural damped vibration state of the carrier 40, and use the measured natural vibration state as a reference value range, which is used to compare with the vibration state or damped vibration of each stroke of the carrier 40 during processing The state is compared to determine whether the thin brittle substrate S is scratched or not.

In order to measure the vibration state of the carrier 40, the vibration sensor 50 of the present invention is arranged on the carrier 40. For example, the vibration sensor 50 can be arranged on the surface of the carrier 40 away from the thin brittle substrate S, that is, on the carrier The bottom surface of the component 40 can measure the vibration state of the carrier 40 on the one hand, and avoid affecting the force balance state when the carrier 40 carries the thin brittle substrate S and the carrier 40 moves.

As shown in FIG. 4 , the vibration sensor 50 includes a sensing device 51 , a central processing device 52 , a storage device 53 and an alarm module 54 . Wherein the sensing device 51 can be installed on the carrier 40, and the central processing unit 52, the storage device 53 and the warning module 54 can be installed in other positions, such as installed on the base 10, so as to avoid adding the carrier 40 or/and The weight carried by the mobile arm 30 does not affect the inertia of the carrier 40 or/and the mobile arm 30 as a whole.

The sensing device 51 includes a housing and a three-dimensional vibration measuring part 511 installed in the housing. The three-dimensional vibration measuring part 511 may include three wafers 512 for measuring acceleration or displacement, respectively arranged on three mutually orthogonal , so as to measure the three-dimensional vibration state of the carrier 40 or/and the moving arm 30 . The three-dimensional vibration measuring device 511 can be a micro-electromechanical three-axis acceleration measuring element, a capacitive displacement measuring element or a piezoelectric displacement measuring element, which is not limited, as long as it can measure three-dimensional acceleration or displacement components are applicable. The sensing device 51 also includes a circuit board on which a signal transmission interface or a wireless signal sending part 513 is provided, and the signal transmission interface can be connected to a signal transmission cable. The three-dimensional vibration measurement part generates a detection signal from the measured acceleration or displacement of the bearing part 40 or/and the mobile arm 30, and the detection signal is transmitted to the Central processing unit 52 .

The central processing device 52 includes a processor chip 521, an analog-to-digital conversion circuit 522, a filter circuit 523, a signal receiving interface or a wireless signal transceiver 524, etc., and the signal receiving interface The port can be used to connect the above-mentioned signal transmission cable to receive the detection signal generated by the three-dimensional vibration measurement part 511 , or to receive the detection signal sent from the wireless signal sending part 513 by the wireless signal receiving part 524 . The analog-to-digital conversion circuit 522 converts the analog detection signal generated by the three-dimensional vibration measurement device into a digital detection signal, which is used for calculation by the processor chip 521. The filter circuit 523 can filter out environmental noise to avoid affecting the quantity measured results.

The storage device 53 can store the physical quantities corresponding to the natural vibration states of various thin brittle substrates S carried by the above-mentioned carrier 40 and measured under different moving strokes, such as vibration amplitude and frequency. The storage device 53 can also store a program code for the central processing unit 52 to perform the comparison operation, and the program code corresponds to the algorithm of the comparison operation. Since the vibration phenomenon is a combination of multiple vibration waves, the program code can also include a program to convert the time domain data of the amplitude into frequency domain data. The storage device 53 may be a memory, a hard disk, or a USB flash drive.

The operator can input the type of the processing machine, the processing method and the type of the thin brittle substrate S into the vibration sensor 50. For example, a touch interface device can be provided on each robot arm 1 for displaying the state of the robot arm 1 or Modify and set the operating parameters of the mechanical arm 1, or modify the operating parameters of each mechanical arm 1 through the input device in the monitoring center. After the operator sets the operating parameters corresponding to the type of processing machine, the processing method, and the thin brittle substrate S, the central processing device 52 loads the corresponding comparison operation program code and Various reference value ranges of the natural vibration state corresponding to the type, processing method and type of thin brittle substrate S. After the central processing device 52 receives the detection signal, it compares the detection signal with the reference value range, as shown in Fig. 5 and Fig. 6, if the physical quantity value corresponding to the detection signal is outside the reference value range, Then it is determined that the thin brittle substrate S together with the carrier 42 has generated vibrations different from the natural vibration state. For example, when rubbing occurs, because the external force acts on the thin brittle substrate S together with the carrier 42, The increase in energy makes the amplitude of the vibration larger, as shown in the curve of detection signal 1 in FIG. 5 , or makes the vibration produce vibrations at frequencies other than the natural frequency, as shown in the curve of detection signal 3 in FIG. 6 . If the moving path is too close to the structural object, the structural object will inhibit the natural vibration, making the amplitude of the vibration smaller, as shown in the curve of the detection signal 2 in FIG. 5 . Therefore, as long as the vibration state of the carrier 42 is different from its natural vibration state, it can be judged that a scratch has occurred. Therefore, the moving stroke of the carrier 42 can be corrected or the position of the structural object can be adjusted to avoid further rubbing.

The signal of the warning module 54 is connected to the central processing unit 52. When the central processing unit 52 compares the detection signal with the reference value range of the natural vibration state, if it is determined that the thin brittle substrate S together with the carrier 42 produces a vibration different from the natural state vibration, the central processing unit 52 generates a warning signal, and the warning signal is sent to the warning module 54 to generate a warning. The warning module 54 can be arranged on the loudspeaker that can emit sound on the mechanical arm 1, a lamp that can emit light on the mechanical arm 1, or a program module installed in the server of the monitoring center. The warning signal can pass through the central processing unit 52 The wireless signal transceiver is sent to the server of the monitoring center, and the warning module 54 is executed in the server. After the server receives the warning signal, the server of the monitoring center will display on the screen which mechanical arm has the state of rubbing . The operator in the monitoring center can immediately stop the operation of the mechanical arm 1 after being warned, and perform subsequent maintenance operations and cleaning of substrate debris.

The central processing device 52 can also include a warning activation unit, because the carrier 42 only generates damping vibration when it reaches a stationary state from moving during the entire moving stroke, so if the sensing device 51 is always in the detection state, The central processing device 52 then continues to compare during the entire moving process of the carrier 42, so it is easy to cause the warning module 54 to issue a warning due to the detection of abnormal vibrations that have nothing to do with the rubbing object, and this warning has nothing to do with the rubbing object. Unrelated, this will often cause unnecessary interruption of the handling operation of the thin and brittle substrate S. Therefore, the warning activation unit is used when the carrier 42 After moving to the target position, the alarm activation unit is activated, and the central processing unit 52 starts to transmit the alarm signal to the alarm module 54 . The warning activation unit may include a program module. The program module calculates the angle of rotation of the driving member 20 or the distance of movement to determine whether the carrier 42 has moved to the target position. When it is determined that the carrier 42 has moved to the target position, the central processing unit 52 starts to transmit the generated warning signal to the warning module 54, thereby generating a warning effect.

The thin brittle substrate rubbing vibration sensor of the present invention detects whether the damped vibration state of the carrier is different from that of the carrier in the same stroke by detecting the damped vibration state of the carrier carrying the thin brittle substrate from moving to positioning And the natural damping vibration produced by bearing the same thin brittle substrate is used to determine the friction between the thin brittle substrate carried by the carrier and the object. The thin brittle substrate rubbing shock sensor of the present invention can detect the vibration state of the bearing part in multiple directions by setting a three-dimensional vibration sensing part, so that it can effectively detect the rubbing generated in various directions. bump. In addition, the thin brittle substrate rubbing vibration sensor of the present invention starts to transmit the warning signal to the warning module when it reaches the positioning, so that the thin brittle substrate rubbing vibration sensor only starts the warning function when it reaches the positioning, It is avoided that the sensing part detects the vibration state of the bearing part which has nothing to do with the rubbing of the object and falsely sends out an alarm. The thin brittle substrate rubbing vibration sensor of the present invention can also be used to detect the vibration state of the wafer during the grinding process, if the vibration state (amplitude or frequency) different from the steady-state reference value is generated during the grinding process , it can be seen that abnormal stress is generated between the wafer and the grinding head during the grinding process.

The vibration state measured by the vibration sensor 50 is the original data directly measured, and the failure and aging of the machine part, the accuracy or displacement of the mechanical arm can be obtained through calculation, such as the vibration state and normal state when the machine part is faulty and aging. The state is different, by carrying the same workpiece with the same manipulator, the reference vibration mode will be obtained. According to the vibration mode, the mathematical model describing the vibration mode can be obtained. According to the mathematical model The corresponding algorithm can be derived from the formula, and the algorithm can be converted into a program code. When detecting the vibration state, it can be compared synchronously to see if the operation of the robotic arm is abnormal, and the accuracy or displacement of the robotic arm can also be calculated. In addition, detecting the vibration frequency can tell whether the mechanical arm is abnormal, which can be used as a basis for maintenance and achieve the effect of preventive maintenance.

The vibration sensor 50 can obtain the correlation between the vibration data and the frequency. After proper screening, the frequency that is easy to detect or monitor can be obtained according to the characteristic frequency. As shown in Figure 6, when there is no friction, the maximum vibration amplitude of the mechanical arm is The value is between 40Hz-50Hz, so the characteristic frequency corresponding to the inherent damped vibration state of the manipulator can be obtained, so after the vibration sensor 50 generates the detection signal, it can filter out the signal wave of other frequency bands with low correlation , leaving waves associated with the eigenfrequency.

The vibration data measured by the vibration sensor 50 can be used to monitor whether the mechanical arm is abnormal, so as to achieve real-time monitoring, respond to problems, and avoid wafer scrapping or defective products.

In addition, the monitoring solution of the robotic arm, wafer and substrate container can be integrated to monitor the entire process and related equipment, which is not only conducive to equipment maintenance, but also helps to improve yield.

But what is described above is only a preferred embodiment of the present invention, and cannot limit the scope of the present invention. All simple equivalent changes and modifications made according to the patent scope of the present invention and the contents of the description should still be It is within the scope of the present invention. After the description of the preferred embodiments of the present invention, those familiar with this technical field should be able to understand that this case is indeed a novel, progressive and industrially applicable invention patent, which has great development value.

1: Mechanical arm

10: Base

20: Driver

30: Moving arm

40: Carrier

50: Oscillation sensor

51: Sensing device

52: Central processing unit

53: storage device

S: thin brittle substrate

W: the working area of the machine

Claims (10)

A box-loading robot arm with a thin brittle substrate rubbing vibration sensor is used to transport at least one thin brittle substrate. The robot arm includes: a base; One is set on the above-mentioned base driving member; At least one moving arm, connected to the base and driven by the driving member, can move/rotate between at least a starting position and a target position relative to the base; A carrier is arranged on the above-mentioned moving arm, and is used to carry at least one thin brittle substrate; and at least one vibration sensor, including At least one sensing device corresponding to the above-mentioned bearing part, the aforementioned sensing device includes three-dimensional vibration sensing parts perpendicular to each other, for measuring the three-dimensional vibration of the above-mentioned moving arm and/or the above-mentioned bearing part, and output a detection signal; a storage device for storing a range of reference values; A central processing device, the signal is connected to the above-mentioned sensing device and the above-mentioned storage device, for receiving the above-mentioned detection signal and comparing it with the above-mentioned reference value range, when the above-mentioned detection signal exceeds the above-mentioned reference value range, a warning is generated signal; and A warning module is used for receiving the above-mentioned warning signal and issuing a warning. According to claim 1, the loading robotic arm with a thin brittle substrate rubbing and vibrating sensor, wherein the carrier is a semiconductor wafer gripper. According to claim 1, the loading robot arm with a thin brittle substrate rubbing and vibrating sensor, wherein the bearing part is a bracket. As described in claim 1, 2, or 3, the mechanical arm with a thin brittle substrate rubbing and vibrating sensor, wherein the storage device stores the mobile arm and/or the carrier is loaded with the thin The brittle substrate movement/rotation is the memory of the range of reference values for naturally damped oscillations. The box-loading robot arm with a thin brittle substrate rubbing shock sensor as described in claim 4, wherein the central processing device further includes an alarm activation unit for when the moving arm is close to the starting position and the target position When the above-mentioned warning device is activated. As described in claim 1, the box-loading robot arm with a thin brittle substrate rubbing and vibrating sensor, wherein the above-mentioned sensing device further includes a wireless sending part, and the signal is connected to the above-mentioned three-dimensional vibration sensing part, and the above-mentioned central processing device is further It includes a wireless receiving part, and the detection signal is transmitted to the wireless receiving part through the wireless sending part. A thin-type brittle substrate rubbing vibration sensor is used to measure the damped vibration of a carrier part of a mechanical arm when carrying and transporting a thin brittle substrate. The above-mentioned thin brittle substrate rubbing vibration sensor includes: At least one sensing device corresponding to the above-mentioned carrier, the aforementioned sensing module includes three-dimensional vibration sensing parts perpendicular to each other, for measuring the three-dimensional vibration of the above-mentioned mobile arm and/or the above-mentioned carrier, and outputting a detection signal; a storage device for storing a range of reference values; A central processing device, the signal is connected to the above-mentioned sensing device and the above-mentioned storage device, for receiving the above-mentioned detection signal and comparing it with the above-mentioned reference value range, when the above-mentioned detection signal exceeds the above-mentioned reference value range, a warning is generated signal; and A warning module is used for receiving the above-mentioned warning signal and issuing a warning. The thin brittle substrate rubbing vibration sensor as described in claim 7, wherein the storage device stores the above-mentioned mobile arm and/or the above-mentioned carrier is a natural damped oscillation reference when the thin brittle substrate moves/rotates range of values in memory. The thin brittle substrate rubbing vibration sensor according to claim 7, wherein the central processing device further includes a warning activation unit for activating the warning device when the moving arm approaches the starting position and the target position. The thin-type brittle substrate rubbing vibration sensor as described in claim 7, wherein the above-mentioned sensing device further includes a wireless sending part, and the signal is connected to the above-mentioned three-dimensional vibration sensing part, and the above-mentioned central processing device further includes a wireless receiving part, The detection signal is transmitted to the wireless receiver through the wireless transmitter.

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