CN115338903A - Box-entering mechanical arm with thin fragile substrate wiping and vibrating sensor and sensor - Google Patents

Abstract

The invention discloses a cassette-entering mechanical arm with a thin fragile substrate wiping and vibrating sensor, which comprises: the base, set up in above-mentioned base driving piece, at least one moving arm, hold carrier and at least one vibration sensor. The moving arm is connected to the base and driven by the driving member to move/rotate between at least one initial position and a target position relative to the base. The bearing piece is arranged on the moving arm and is used for bearing at least one thin brittle substrate. The oscillation sensor includes: at least one sensing device corresponding to the bearing piece, a storage device for storing a reference value range, a central processing unit for comparison and operation, and a warning module for warning when abnormal vibration is found in the bearing piece. The occurrence of the rubbing between the thin brittle substrate carried by the carrying element and the object is judged by detecting the damping vibration state of the carrying element carrying the thin brittle substrate when the carrying element moves to the positioning. In addition, the invention also discloses a thin brittle substrate rubbing and vibrating sensor.

Description

Box-entering mechanical arm with thin fragile substrate wiping and vibrating sensor and sensor

Technical Field

The invention relates to the technical field of wiping and vibrating detection of a thin brittle base material, in particular to a sensor capable of detecting the damping vibration state of a bearing piece bearing the thin brittle base material so as to judge whether the thin brittle base material rubs and collides with an object passing by the thin brittle base material and a mechanical arm with the sensor.

Background

Thin brittle substrates, such as semiconductor wafers, solar cell substrates, substrates for panels or glass for electronic devices, ceramic plates, etc., are often used in industrial applications, and are generally limited in material structure, and once sufficiently thin, the structural strength is quite limited, and thus are referred to as brittle substrates in this case. These substrates are often subjected to multiple processes, such as epitaxy, photolithography, etching, dicing, packaging, etc., to produce the final target product, and the glass plates are also subjected to annealing, etc. These processes are usually performed on different machines, so when a series of processes are performed on such thin and brittle substrates, the substrates need to be transported between machines, for example, semiconductor wafers, and are usually placed in a substrate container (wafer cassette) to protect the thin and brittle substrates from damage during the transport process.

When the robot arm is operated, vibration may be generated due to the structure of the mechanism itself, for example, vibration generated by the friction force between the motor and the robot arm or vibration generated by the damping effect of the structure when the robot arm is stationary at the moment after reaching the positioning from the moving state. The vibration generated by the robot arm may affect the transportation process of the thin and brittle substrate, for example, the substrate may be dropped or scratched due to too large vibration, so in the prior art, a vibration sensor is mostly disposed on the robot arm to measure the vibration state of the robot arm, so as to determine whether the vibration of the robot arm may damage the substrate during the transportation process of the substrate.

However, the above-mentioned prior art detects the vibration state of the robot itself during operation, and therefore, only can determine whether the vibration state of the robot itself affects the transportation of the substrate. When the robot arm carries the substrate to the processing area of the machine or carries the substrate into the substrate container, the prior art cannot determine the possible friction and collision of the substrate during the substrate carrying to the machine or the substrate container due to the error of the robot arm stroke or the error caused by the deformation of the processing area of the machine or the substrate container. The substrate may be damaged after being rubbed and the debris generated after the substrate is rubbed and bumped may be scattered into the space to pollute other substrates or machines.

In the case of semiconductor wafers, even if the damping vibration of the robot arm reaches a range of, for example, 1mm, the semiconductor wafer may collide with the wafer cassette or the machine table, resulting in severe breakage, even if the robot arm is slightly rubbed, a large amount of particles may be scattered, and the cleanliness of the air in the clean room may be seriously damaged.

At present, an optical monitor is generally installed to monitor and determine the stroke and position of the robot arm according to the image data, so as to detect errors or vibrations caused by mechanical loosening and aging. However, on one hand, various semiconductor wafers may have different colors due to the manufacturing process, so that the value of the optical monitoring needs to be frequently adjusted; on the other hand, to detect each machine, an optical monitoring device needs to be arranged from a multi-angle direction, which not only increases the cost, but also causes the limitation and burden of operation and maintenance; especially, the robot arm is shielded when entering the wafer cassette, so that the precise detection cannot be easily completed from the top or the side, and the detection warning effect is greatly reduced.

In addition, during the process of polishing and planarization of the wafer, such as Chemical Mechanical Polishing (CMP), the polished wafer may be damaged due to abnormal vibration, such as the damping oscillation of the polishing process may be abnormal due to the deformation of the substrate (700 μm-700 μm). In addition, the general monitoring is directed to the movement and vibration of the robot arm, and the deformation of the cassette or the deformation of the substrate itself due to the processing cannot be monitored. Therefore, how to properly monitor the thin fragile substrate during the transportation process and warn in real time once slight rubbing occurs, thereby controlling the damage and avoiding continuous expansion, and even further finding out the deformation of the cassette or the deformation of the substrate is a technical contribution to solving the problems from the source.

Disclosure of Invention

In view of the above-mentioned shortcomings in the prior art, it is desirable to provide a cassette loading robot with a thin fragile substrate scrub shock sensor according to embodiments of the present invention, which is intended to achieve the following objectives: (1) By detecting the damping vibration state of the mechanical arm, whether the thin brittle base material is rubbed or not is judged, and damage is found in real time and effectively controlled; (2) The vibration state of the mechanical arm can be detected in multi-direction dimensions, and the accuracy and reliability of judging whether the rubbing and the collision are generated are improved; (3) The warning module can be started when the mechanical arm is close to the positioning, so that error warning is effectively avoided; (4) The micro-electromechanical element can be selected for oscillation monitoring, normal and abnormal frequencies of the damped oscillation can be obtained, and the micro-electromechanical element is not interfered by any shielding. In addition, the present invention also provides a rubbing and bumping oscillation sensor for a cassette loading mechanical arm, which can make the measurement position close to the front end of the mechanical arm by a miniaturized sensing device, so as to improve the signal-to-noise ratio of the measurement; by means of the wireless signal connection between the sensing device and the back end central processing unit, the size of the sensing device near the end of the mechanical arm is further reduced, and the load on the inertia of the mechanical arm is reduced.

According to an embodiment, the present invention provides a cassette loading robot with a thin brittle substrate wiping and vibrating sensor for transporting at least one thin brittle substrate, the robot comprising: the device comprises a base, a driving part arranged on the base, at least one moving arm, a bearing part and at least one oscillation sensor. The moving arm is connected to the base and driven by the driving part to move or rotate between at least one initial position and one target position relative to the base. The bearing piece is arranged on the moving arm and is used for bearing at least one thin brittle substrate. The oscillation sensor includes: at least one sensing device corresponding to the bearing piece, a storage device for storing a reference value range, a central processing unit and an alarm module. The sensing device comprises three-dimensional vibration sensing parts which are mutually vertical and are used for measuring the three-dimensional vibration of the moving arm and/or the bearing part and outputting a detection signal. The central processing unit is in signal connection with the sensing device and the storage device, and is used for receiving the detection signal and comparing the detection signal with the reference value range, and when the detection signal exceeds the reference value range, an alarm signal is generated. The warning module is used for receiving the warning signal and sending a warning.

According to the present invention, there is provided a thin brittle substrate rub-impact vibration sensor for measuring damped vibration of a carrier of a robot arm carrying a thin brittle substrate, the thin brittle substrate rub-impact vibration sensor comprising the thin brittle substrate rub-impact vibration sensor described above, for achieving the above objects of the present invention. The thin brittle substrate rubbing shock sensor comprises at least one sensing device arranged corresponding to the bearing piece, a storage device for storing a reference value range, a central processing device and an alarm module. The sensing device comprises three-dimensional vibration sensing parts which are mutually vertical and are used for measuring the three-dimensional vibration of the moving arm and/or the bearing part and outputting a detection signal. The central processing unit is in signal connection with the sensing device and the storage device, and is used for receiving the detection signal and comparing the detection signal with the reference value range, when the detection signal exceeds the reference value range, a warning signal is generated, and the warning module receives the warning signal and gives out a warning.

Compared with the prior art, the thin brittle substrate rubbing and vibrating sensor provided by the invention judges whether the damping vibration state of the bearing piece bearing the thin brittle substrate is different from the natural damping vibration generated by the bearing piece bearing the same thin brittle substrate in the same stroke by detecting the damping vibration state of the bearing piece bearing the thin brittle substrate when the bearing piece moves to the positioning, so as to judge that the thin brittle substrate borne by the bearing piece is rubbed and bumped with an object. The thin brittle substrate rubbing shock sensor can detect the vibration state of the bearing part in multiple directions by arranging the three-dimensional vibration sensing part, so that rubbing generated in each direction can be effectively detected. In addition, the thin fragile substrate wiping vibration sensor can select to start transmitting the warning signal to the warning module when reaching the positioning, or start the warning module when reaching the positioning, so that the thin fragile substrate wiping vibration sensor can selectively start the warning function when reaching the positioning, and the phenomenon that the sensing piece senses the vibration state of the bearing piece unrelated to the object wiping vibration and mistakenly sends out the warning is avoided.

Especially for the warning that the deformation of the cassette or the deformation of the semiconductor wafer in the process cannot be obtained by external optical observation, the detection of the invention can also be immediately reflected when the wiping occurs, thereby reminding the problem location to obtain the timely treatment.

Drawings

Figure 1 is a side view of one embodiment of a robotic arm of the present invention.

Fig. 2 is a system block diagram of an embodiment of a thin brittle substrate rub-impact oscillation sensor according to the present invention.

FIG. 3 is a top view of the robot of the present invention moving between the work area of the machine and the substrate holder to transport thin brittle substrates.

Figure 4 is a side view of the robot of the present invention transferring a thin brittle substrate into a substrate holder.

Fig. 5 is a graph showing the relationship between the amplitude of vibration and time during which the robot arm of the present invention does not generate a scrub and a scrub occurs during a process of transporting a thin brittle substrate.

Fig. 6 is a graph showing the relationship between the amplitude and the frequency of vibration in which the robot arm of the present invention does not generate the rubbing or the rubbing during the process of transporting the thin brittle substrate.

Wherein: 1 is a mechanical arm; 10 is a base; 20 is a driving part; 30 is a moving arm; 40 is a bearing part; 50 is a vibration sensor; 51 is a sensing device; 52 is a central processing unit; 53 is a storage device; 54 is a warning module; 511 is a three-dimensional vibration measuring piece; 512 is a chip; 513 is a wireless signal transmitting part; 521 is a processor chip; 522 is an analog-to-digital conversion circuit; 523 is a filter circuit; 524 is a wireless signal transceiver; c is a base material container; s is a thin brittle base material; w is the working area of the machine.

Detailed Description

The invention is further illustrated with reference to the following figures and specific examples. These examples are to be construed as merely illustrative and not limitative of the remainder of the disclosure in any way whatsoever. After reading the description of the present invention, one skilled in the art can make various changes and modifications to the invention, and these equivalent changes and modifications also fall into the scope of the invention defined by the claims.

Referring to fig. 1, 2, 3 and 4, an embodiment of the robot arm and the thin brittle substrate scrub shock sensor of the present invention is shown. The robot arm 1 of the present embodiment includes a base 10, a driving member 20, a plurality of moving arms 30, a carrying member 40, and an oscillation sensor 50.

As shown in fig. 1, the base 10 is installed on a reference surface for work, for example, a ground surface or an installation surface of a work machine, and serves as a reference position for calculating the movement of the moving arm 30. The base 10 is used for carrying the moving arm 30, the carrying member 40 and the oscillation sensor 50.

The plurality of moving arms 30 are connected to each other, and the moving arms 30 of the present embodiment are pivotally connected to each other, whereby the moving arms 30 can be rotated to a desired distance and angle. However, the moving arms of the present invention are not limited to this, and may be slidably coupled to each other and orthogonally disposed so as to be movable along three orthogonal coordinate axes, or may be connected to each other in a partially slidably coupled manner or a partially rotatably coupled manner.

The driving member 20 may be provided at the base 10 for driving the moving arm 30 to move or rotate. The drive member 20 may be a drive element such as a servo motor or a hydraulic motor. For the structure of the plurality of moving arms 30, since the movement or rotation of each moving arm 30 is controlled separately, a driving member 20 may be provided at a driving position or a rotation center of each moving arm 30 to drive the corresponding moving arm 30 to pivot, move, or telescope.

The supporting member 40 is connected to the endmost moving arm 30 of the plurality of moving arms 30, and after the plurality of moving arms 30 are rotated or moved, the endmost moving arm 30 reaches the target position, thereby moving the supporting member 40 to the target position. The supporting member 40 is used for supporting the thin and brittle substrate S, so with the above structure, as shown in fig. 3, the supporting member 40 can move the thin and brittle substrate S between an initial position and a target position, for example, move the thin and brittle substrate S from the substrate container C to the working area W of the machine for processing, or move the processed thin and brittle substrate S from the working area W of the machine to the substrate container C. The supporting member 40 of the present embodiment is exemplified by a bracket for supporting a thin brittle substrate, and the thin brittle substrate is exemplified by a semiconductor wafer, but those skilled in the art can easily understand that the supporting member 40 may also be a claw clamp for clamping the thin brittle substrate. The bearing member 40 may be fixed to the end of the moving arm 30, or may be rotatably or slidably coupled to the moving arm 30.

As shown in fig. 3, when the supporting member 40 moves the thin brittle substrate S between the working area W of the stage and the substrate container C, the supporting member 40 vibrates due to the driving of the driving member 20, the friction between the moving arms 30, and the rigidity of the materials of the moving arms 30 and the supporting member 40. These vibrations are, in addition to the vibrations of the moving arm 30 and the load bearing member 40 during movement, when the load bearing member 40 is stopped by the moving arm 30 after reaching a predetermined target position from a moving state, the load bearing member 40 itself gradually vibrates to a standstill from a damping vibration dynamically generated by the damping action of the inertia of the load bearing member 40 itself.

As shown in fig. 4, during the moving stroke of the moving arm 30, some structural objects may pass through, particularly, the table member in the working area W of the table, the frame of the substrate container C, and the like, and when the carrier 40 passes through these structural objects, due to a stroke setting error, deformation of the structural objects, and the like, the thin brittle substrate S carried by the carrier 40 may be rubbed against these structural objects in a very small number of cases. After the thin and brittle substrate S and the structural objects are rubbed against each other, the supporting member 40 generates a damping vibration pattern different from that generated when the thin and brittle substrate S is not rubbed against each other, and by measuring the vibration state of the supporting member 40 in each stroke, particularly the damping vibration state after the supporting member 40 moves to, for example, a target position, and then comparing the measured vibration state with the natural vibration state of the supporting member 40 in the same stroke and supporting the same thin and brittle substrate S, if the current vibration state and the natural vibration state have a significant difference mode, it is determined that the thin and brittle substrate S supported by the supporting member 40 is rubbed against the structural objects.

Since the supporting member 40 supports various thin brittle substrates S and the natural damping vibration states of the supporting member 40 in different moving strokes are different, the supporting member 40 can support various thin brittle substrates S in advance, the natural vibration state or the natural damping vibration state of the supporting member 40 can be measured for the moving strokes set by various processing machines, and the measured natural vibration state is used as a reference value range to be compared with the vibration state or the damping vibration state of the supporting member 40 in each stroke in the processing process, so as to determine whether the thin brittle substrate S is rubbed or bumped.

In order to measure the vibration state of the supporting member 40, the oscillation sensor 50 of the present invention is disposed on the supporting member 40, for example, the oscillation sensor 50 may be disposed on the surface of the supporting member 40 away from the thin brittle substrate S, i.e., on the bottom surface of the supporting member 40, thereby on one hand, measuring the vibration state of the supporting member 40 and on the other hand, avoiding affecting the load bearing of the supporting member 40 on the thin brittle substrate S and the force balance state of the supporting member 40 during movement.

As shown in fig. 4, the oscillation sensor 50 includes a sensing device 51, a central processing device 52, a storage device 53 and an alarm module 54. Wherein the sensing device 51 can be mounted on the supporting member 40, and the central processing device 52, the storage device 53 and the warning module 54 can be mounted at other positions, such as on the base 10, so as to avoid increasing the weight carried by the supporting member 40 or/and the moving arm 30 and affecting the inertia of the supporting member 40 or/and the moving arm 30 as a whole.

The sensing device 51 includes a housing and a three-dimensional vibration measuring part 511 mounted in the housing, and the three-dimensional vibration measuring part 511 may include three chips 512 for measuring acceleration or displacement, respectively, disposed in three mutually orthogonal directions, thereby measuring the three-dimensional vibration state of the supporting member 40 or/and the moving arm 30. The three-dimensional vibration measuring device 511 may be a micro-electromechanical three-axis acceleration measuring device, a capacitive displacement measuring device, or a piezoelectric displacement measuring device, and is not limited thereto, as long as it can measure three-dimensional acceleration or displacement. The sensing device 51 further includes a circuit board, and a signal transmission interface or a wireless signal transmitter 513 is disposed on the circuit board, and the signal transmission interface is connected to a signal transmission cable. The three-dimensional vibration measuring device generates a detection signal according to the measured acceleration or displacement of the supporting member 40 or/and the moving arm 30, and the detection signal is transmitted to the central processing device 52 through the signal transmission interface or the wireless signal transmitting device 513 in a wired or wireless manner.

The central processing device 52 includes a processor chip 521, an analog-to-digital conversion circuit 522, a filter circuit 523, and a signal receiving interface or a wireless signal transceiver 524, etc., where the signal receiving interface is connected to the signal transmission cable to receive the detection signal generated by the three-dimensional vibration measuring device 511, or the wireless signal transceiver 524 receives the detection signal transmitted from the wireless signal transmitter 513. The analog-to-digital conversion circuit 522 converts the analog detection signal generated by the three-dimensional vibration measurement component into a digital detection signal for the processor chip 521 to operate, and the filter circuit 523 can filter the environmental noise to avoid affecting the measurement result.

The storage device 53 can store the physical quantities, such as the amplitude and frequency of the vibration, corresponding to the natural vibration state measured by the supporting member 40 under different moving strokes and various thin brittle substrates S. The storage device 53 may also store program codes for the central processing device 52 to perform the comparison operation, wherein the program codes correspond to the algorithm of the comparison operation. Since the vibration phenomenon is a combination of a plurality of types of vibration waves, the program code may include a program for converting time domain data of amplitude into frequency domain data. The storage device 53 may be a memory, a hard disk, or a USB flash drive.

The operator can input the type and processing method of the processing machine and the type of the thin brittle substrate S into the oscillation sensor 50, for example, a touch interface device may be provided on each robot 1 for displaying the state of the robot 1 or modifying the operation parameters of the robot 1, or an input device in the monitoring center may modify the operation parameters of each robot 1. After the operator sets the operation parameters corresponding to the type and the processing method of the processing machine and the thin and brittle substrate S, the central processing unit 52 loads the corresponding comparison program code and the various reference value ranges of the natural vibration state corresponding to the type and the processing method of the processing machine and the type of the thin and brittle substrate S from the storage unit 53. After the central processing unit 52 receives the detection signal, it compares the detection signal with the reference value range, and as shown in fig. 5 and 6, if the physical quantity value corresponding to the detection signal is outside the reference value range, it is determined that the thin and brittle substrate S and the supporting member 42 generate vibration different from the natural vibration state. For example, when the rubbing occurs, the external force acts on the thin brittle substrate S and the supporting member 42, and the energy increases to increase the amplitude of the vibration as shown by the curve of the detection signal 1 in fig. 5, or the vibration generates vibration of a frequency other than the natural frequency as shown by the curve of the detection signal 3 in fig. 6. If the motion path is too close to the structural object, the structural object suppresses the natural vibration, so that the amplitude of the vibration becomes smaller, as shown by the curve of the detection signal 2 in fig. 5. Therefore, as long as the vibration state of the bearing member 42 is different from the natural vibration state, the occurrence of rubbing can be determined, so that the moving stroke of the bearing member 42 can be corrected or the position of the structural object can be adjusted, thereby achieving the effect of avoiding rubbing again.

The warning module 54 is connected to the central processing unit 52 by signals, and when the central processing unit 52 compares the detection signal with the reference value range of the natural vibration state, if it is determined that the thin brittle substrate S and the supporting member 42 generate vibration different from the natural vibration state, the central processing unit 52 generates a warning signal, and the warning signal is transmitted to the warning module 54 to generate a warning. The warning module 54 may be a speaker disposed on the robot arm 1 and capable of emitting sound, a lamp disposed on the robot arm 1 and capable of emitting light, or a program module disposed in a server of the monitoring center, the warning signal may be transmitted to the server of the monitoring center via the wireless signal transceiver of the central processing unit 52, the warning module 54 is executed in the server, and after the server receives the warning signal, the server of the monitoring center displays on the screen which robot arm has a wiping and touching status. After being warned, an operator in the monitoring center can immediately stop the operation of the mechanical arm 1 and perform subsequent maintenance operation and cleaning operation of base material scraps.

The central processing device 52 may further include a warning start unit, since the damping vibration is generated only when the supporting member 42 reaches a stationary state from the moving state during the whole moving process, if the sensing device 51 is in a detection state all the time, the central processing device 52 continuously performs comparison during the whole moving process of the supporting member 42, so that the warning module 54 is easily caused to send a warning by detecting abnormal vibration unrelated to the object to be rubbed, and the warning is not related to the object to be rubbed, which often causes unnecessary interruption of the transporting operation of the thin and brittle substrate S. Therefore, the alarm activating unit is used for activating the alarm activating unit when the carrier 42 moves to the target position, and the central processing unit 52 starts to transmit the alarm signal to the alarm module 54. The warning start unit may include a program module, which calculates a rotation angle value or a moving distance of the driving member 20 to determine whether the supporting member 42 moves to the target position, and when it is determined that the supporting member 42 moves to the target position, the central processing unit 52 starts to transmit the generated warning signal to the warning module 54, thereby generating a warning effect.

The wiping and bumping shock sensor for the thin fragile substrate judges whether the damping vibration state of the bearing piece is different from the natural damping vibration generated by the bearing piece in the same stroke and bearing the same thin fragile substrate or not by detecting the damping vibration state of the bearing piece bearing the thin fragile substrate when the bearing piece moves to reach the positioning, so as to judge that the wiping and bumping between the thin fragile substrate borne by the bearing piece and an object occur. The thin fragile substrate rubbing and vibrating sensor can detect the vibration state of the bearing piece in multiple directions by arranging the three-dimensional vibration sensing piece, thereby effectively detecting rubbing and touching generated in all directions. In addition, the thin fragile substrate wiping vibration sensor starts to transmit the warning signal to the warning module when reaching the positioning, so that the warning function is started when the thin fragile substrate wiping vibration sensor reaches the positioning, and the phenomenon that the sensing piece senses the vibration state of the bearing piece and the object which is irrelevant to wiping is avoided, and the warning is mistakenly sent out. The thin brittle substrate friction-impact oscillation sensor can also be used for detecting the vibration state of the wafer in the grinding process, and if the vibration state (amplitude or frequency) different from the steady-state reference value is generated in the grinding process, the abnormal stress generated between the wafer and the grinding head in the grinding process can be known.

The vibration state measured by the oscillation sensor 50 is directly measured raw data, and machine failure and aging, and the accuracy or displacement of the robot arm can be obtained through calculation, for example, when the vibration state is different from a normal state, the same robot arm bears the same workpiece to obtain a reference vibration mode, a mathematical mode describing the vibration mode can be obtained according to the vibration mode, a corresponding algorithm can be obtained according to the mathematical mode, the algorithm is converted into a program code, when the vibration state is detected, whether the operation of the robot arm is abnormal or not can be synchronously compared, and the accuracy or displacement of the robot arm can be calculated. In addition, whether the mechanical arm is abnormal or not can be known by detecting the vibration frequency, and the mechanical arm can be used as a basis for maintenance, and the effect of prevention and maintenance is achieved.

The vibration sensor 50 can obtain the relationship between the vibration data and the frequency, and can obtain the frequency easy to detect or monitor according to the characteristic frequency through proper screening, as shown in fig. 6, when no rubbing occurs, the maximum value of the vibration amplitude of the mechanical arm is between the frequency 40Hz and 50Hz, so that the characteristic frequency corresponding to the inherent damping vibration state of the mechanical arm can be obtained, and after the vibration sensor 50 generates the detection signal, the signal waves of other frequency bands with low correlation can be filtered out, and the waves related to the characteristic frequency are left.

The vibration data measured by the vibration sensor 50 can be used to monitor whether the mechanical arm is abnormal, so as to achieve real-time monitoring and response problems, and avoid chip scrap or defective products.

In addition, the monitoring schemes of the mechanical arm, the wafer and the substrate container can be integrated to monitor the whole manufacturing process and related equipment, so that the maintenance of the equipment is facilitated, and the yield is also improved.

Claims (10)

1. The utility model provides a utensil slim fragile substrate rubs income casket arm that bumps and vibrate sensor for carrying at least a slim fragile substrate, characterized by, this arm includes:

a base;

a driving member disposed on the base;

at least one moving arm connected to the base and driven by the driving part to move or rotate between at least one initial position and one target position relative to the base;

a bearing part which is arranged on the moving arm and is used for bearing at least one thin brittle substrate; and

at least one oscillation sensor comprising:

at least one sensing device corresponding to the bearing part, wherein the sensing device comprises three-dimensional vibration sensing parts which are vertical to each other and are used for measuring the three-dimensional vibration of the moving arm and/or the bearing part and outputting a detection signal;

a storage device for storing a reference value range;

a central processing unit, which is connected to the sensing device and the storage device in a signal manner, and is used for receiving the detection signal, comparing the detection signal with the reference value range, and generating a warning signal when the detection signal exceeds the reference value range; and

and the warning module is used for receiving the warning signal and sending out a warning.

2. The loading robot of claim 1, wherein said carrier is a semiconductor wafer gripper.

3. The loading robot of claim 1 wherein said carrier member is a carriage.

4. A loading robot as claimed in claim 1, 2 or 3 wherein said storage means is a memory storing a reference range of natural damped oscillation for movement or rotation of said arm and/or said carrier on said thin brittle substrate.

5. The loading robot as recited in claim 4, wherein said central processing unit further comprises an alarm activation unit for activating said alarm device when said movable arm approaches said home position and said target position.

6. The loading robot as claimed in claim 1, wherein said sensing device further comprises a wireless transmitter for signal connection to said three-dimensional vibration sensor, said central processing unit further comprises a wireless receiver, and said detection signal is transmitted to said wireless receiver via said wireless transmitter.

7. A thin brittle substrate rubs and bumps and shakes the sensor, measure a bearing part of a mechanical arm and carry the damped vibration of a thin brittle substrate in bearing, its characteristic is, including:

at least one sensing device corresponding to the bearing part, wherein the sensing device comprises three-dimensional vibration sensing parts which are mutually vertical and used for measuring the three-dimensional vibration of the moving arm and/or the bearing part and outputting a detection signal;

a storage device for storing a reference value range;

a central processing unit, which is connected to the sensing device and the storage device in a signal manner, and is used for receiving the detection signal, comparing the detection signal with the reference value range, and generating a warning signal when the detection signal exceeds the reference value range; and

and the warning module is used for receiving the warning signal and sending a warning.

8. The thin brittle substrate rub-impact shock sensor according to claim 7, wherein the storage means is a memory storing a reference range of natural damped oscillation for the movement/rotation of the thin brittle substrate carried by the moving arm and/or the carrier.

9. The thin brittle substrate scuffing shock sensor of claim 7 wherein the central processing unit further comprises a warning activation unit for activating the warning device when the moving arm approaches the starting position and the target position.

10. The thin brittle substrate rub-impact shock sensor according to claim 7, wherein the sensing device further comprises a wireless transmitter in signal communication with the three-dimensional vibration sensor, the central processing unit further comprises a wireless receiver, and the detection signal is transmitted to the wireless receiver via the wireless transmitter.

Images