TWI782139B - Mask unit and exposure device - Google Patents

Mask unit and exposure device Download PDF

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Publication number
TWI782139B
TWI782139B TW107140995A TW107140995A TWI782139B TW I782139 B TWI782139 B TW I782139B TW 107140995 A TW107140995 A TW 107140995A TW 107140995 A TW107140995 A TW 107140995A TW I782139 B TWI782139 B TW I782139B
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Taiwan
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mask
aforementioned
edge
photomask
film
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TW107140995A
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Chinese (zh)
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TW201937271A (en
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名古屋淳
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日商亞多特克工程股份有限公司
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    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/62Pellicles, e.g. pellicle assemblies, e.g. having membrane on support frame; Preparation thereof
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/62Pellicles, e.g. pellicle assemblies, e.g. having membrane on support frame; Preparation thereof
    • G03F1/64Pellicles, e.g. pellicle assemblies, e.g. having membrane on support frame; Preparation thereof characterised by the frames, e.g. structure or material, including bonding means therefor
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/708Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70908Hygiene, e.g. preventing apparatus pollution, mitigating effect of pollution or removing pollutants from apparatus
    • G03F7/70925Cleaning, i.e. actively freeing apparatus from pollutants, e.g. using plasma cleaning

Abstract

設計成能夠使薄膜光罩容易地緊貼於透明板,而消弭被轉印之圖樣的形狀精度的降低之問題。 被透明板(2)支承之薄膜光罩(1),其周邊部藉由光罩框(3)的真空吸附孔(34)被真空吸附。形成於透明板(2)的和薄膜光罩(1)相向的面之洩氣溝(21)係到達至該面的右側的邊緣,而在倒角部(22)的途中終結。曝光裝置所具備之清潔滾筒(91),從薄膜光罩(1)的左側的邊緣至右側的邊緣接觸薄膜光罩(1)而一面轉動一面移動,進行異物(c)之除去與氣泡(g)之擠出。形成氣泡(g)之氣體,經由洩氣溝(21)、吸引口(37)被排出。It is designed so that the film photomask can be easily attached to the transparent plate, and the problem of reducing the shape accuracy of the transferred pattern can be eliminated. The film photomask (1) supported by the transparent plate (2) is vacuum-adsorbed at its periphery through the vacuum suction holes (34) of the photomask frame (3). The vent groove (21) formed on the face facing the film photomask (1) of the transparent plate (2) reaches the edge on the right side of the face, and terminates on the way of the chamfer (22). The cleaning roller (91) of the exposure device contacts the film mask (1) from the left edge to the right edge and moves while rotating to remove foreign matter (c) and air bubbles (g). ) of extrusion. The gas forming bubbles (g) is discharged through the vent groove (21) and the suction port (37).

Description

光罩單元及曝光裝置Mask unit and exposure device

本申請案之發明,有關各種製品的製造中用於圖樣的轉印之曝光裝置,此外有關搭載於曝光裝置之光罩單元。The invention of this application relates to an exposure device used for pattern transfer in the manufacture of various products, and also relates to a mask unit mounted on the exposure device.

將規定圖樣的光照射至對象物而曝光之曝光裝置,係作為光微影(photo lithography)的核心技術而被使用於各種用途。曝光裝置中,已知有直接描繪圖樣的類型之物,但通常會通過光罩照射光,將光罩的圖樣轉印至對象物。An exposure device that irradiates an object with a predetermined pattern of light to expose it is used in various applications as a core technology of photolithography. Among the exposure devices, a type that directly draws a pattern is known, but light is usually irradiated through a mask to transfer the pattern on the mask to the object.

搭載於曝光裝置之光罩,是做成為在透明的玻璃板以遮光材料描繪有圖樣之構成。通常是使遮光材料的膜附著於玻璃板,藉由光微影做成圖樣化。 相對於這樣的玻璃製的光罩,最近所謂的薄膜光罩(film mask)也愈來愈多人使用。藉由遮光材料而形成有圖樣的,是由PET(聚對苯二甲酸乙二酯)薄膜這類的材料所形成之透明的薄的薄膜,而做成以玻璃板來支承此薄膜(薄膜光罩)之構造。 薄膜光罩的情形下,玻璃板能夠共用,只要配合品種來製作並保管各種薄膜光罩即可。因此,成為低成本,保管或取用亦容易。保管所需之空間亦變小。因這樣的理由,採用薄膜光罩的曝光裝置愈來愈多。 [先前技術文獻] [專利文獻]The photomask mounted on the exposure device has a pattern drawn on a transparent glass plate with a light-shielding material. Usually, a film of a light-shielding material is attached to a glass plate and patterned by photolithography. Compared with such a mask made of glass, a so-called film mask is used more and more recently. The pattern formed by the light-shielding material is a transparent thin film formed of a material such as PET (polyethylene terephthalate) film, and a glass plate is used to support the film (film light cover) structure. In the case of thin film masks, the glass plate can be shared, and it is only necessary to manufacture and store various thin film masks according to the type. Therefore, it becomes low cost, and it is easy to store or take out. The space required for storage is also reduced. For such reasons, more and more exposure apparatuses employ thin-film masks. [Prior Art Literature] [Patent Document]

[專利文獻1] 日本特開昭61-41151號公報 [專利文獻2] 日本特開平11-30851號公報[Patent Document 1] Japanese Patent Application Laid-Open No. 61-41151 [Patent Document 2] Japanese Patent Application Laid-Open No. 11-30851

[發明所欲解決之問題][Problem to be solved by the invention]

薄膜光罩,雖有上述這樣的長處,但一定要在使其對於玻璃板充分緊貼之狀態下搭載於曝光裝置,這點成為待解問題。薄而柔軟的薄膜光罩,即使抵著玻璃板而欲使其緊貼,其間也容易有氣泡殘留。若氣泡殘留,則在該部分薄膜光罩之圖樣會扭曲,因此導致被轉印之圖樣亦成為扭曲之物,而容易成為製品缺陷之原因。Although the film photomask has the advantages as described above, it is a problem to be solved that it must be mounted on the exposure device in a state in which it is sufficiently adhered to the glass plate. Even if the thin and soft film mask is pressed against the glass plate to make it close, air bubbles are likely to remain in it. If air bubbles remain, the pattern on the film photomask will be distorted in this part, so the transferred pattern will also become distorted, which will easily become the cause of product defects.

因此,將薄膜光罩推抵至玻璃板後,需要有作業者以抹刀抹過來將氣泡擠出至外側之麻煩的作業,而成為生產性提升之障礙。此外,以抹刀抹過時在薄膜光罩會發生形變(拉伸),薄膜光罩容易在扭曲的形態下被緊貼、固定於玻璃板。問題是,此形變是隨機地發生,因此難以控制。因此,容易造成被轉印之圖樣的形狀精度的降低。 本申請案之發明,是為了解決上述這樣薄膜光罩中的待解問題而研發,目的於設計成能夠使薄膜光罩容易地緊貼於透明板,而消弭被轉印之圖樣的形狀精度的降低之問題。 [解決問題之技術手段]Therefore, after pushing the film photomask onto the glass plate, it is necessary for the operator to wipe it with a spatula and squeeze out the air bubbles to the outside, which becomes an obstacle to the improvement of productivity. In addition, the film mask is deformed (stretched) when it is wiped with a spatula, and the film mask is easily adhered to and fixed to the glass plate in a distorted state. The problem is, this deformation happens randomly, so it is difficult to control. Therefore, the shape accuracy of the pattern to be transferred tends to be lowered. The invention of this application is developed to solve the unsolved problems in the above-mentioned film photomask, and the purpose is to design it so that the film photomask can be easily attached to the transparent plate, and eliminate the shape accuracy of the transferred pattern. problem of reduction. [Technical means to solve the problem]

為解決上述待解問題,本案申請專利範圍第1項所述之發明,係搭載於曝光裝置之光罩單元,具有下述構成,即,具備: 薄膜光罩;及 透明板,支承薄膜光罩;及 光罩框,將透明板在周邊部予以保持; 光罩框,具有可將薄膜光罩真空吸附之真空吸附孔, 在透明板的和薄膜光罩相向之面,設有形成到達該面的一邊的邊緣之洩氣空間之凹部或凸部。 此外,為解決上述待解問題,申請專利範圍第2項所述之發明,是在前述申請專利範圍第1項之構成中,具有下述構成,即,前述光罩框,在和前述透明板的端面相向之內側面,具有可被真空吸引之吸引口。 此外,為解決上述待解問題,申請專利範圍第3項所述之發明,是在前述申請專利範圍第1項之構成中,具有下述構成,即,其特徵為,前述透明板,具有將和前述薄膜光罩相向的表面與端面連接之斜向的面亦即倒角部, 前述部位,為前述洩氣空間到達至倒角部的途中之形狀。 此外,為解決上述待解問題,申請專利範圍第4項所述之發明,係具備:搬送系統,將基板搬送至曝光作業位置;及 如申請專利範圍第1項至第3項中任一項所述之光罩單元,配置於曝光作業位置;及 曝光單元,通過光罩單元內的前述薄膜光罩照射光而將基板曝光;之曝光裝置,具有下述構成,即, 設有除去前述薄膜光罩的表面的異物之清潔頭、及頭移動機構, 頭移動機構,為一面使清潔頭接觸前述薄膜光罩一面使其移動之機構,且為使清潔頭從前述透明板的和前述一邊相反側之一邊的邊緣朝向前述一邊的邊緣移動之機構。 此外,為解決上述待解問題,申請專利範圍第5項所述之發明,是在前述申請專利範圍第4項之構成中,具有下述構成,即,前述清潔頭,為在表面形成黏著層,一面接觸前述薄膜光罩一面旋轉之清潔滾筒。 此外,為解決上述待解問題,申請專利範圍第6項所述之發明,是在前述申請專利範圍第4項之構成中,具有下述構成,即,前述頭移動機構,為前述清潔頭趨近前述一邊的邊緣時使移動的速度減速之機構。 [發明之功效]In order to solve the above-mentioned problems to be solved, the invention described in item 1 of the scope of patent application of this case is mounted on the mask unit of the exposure device, and has the following structure, that is, it has: Thin film masks; and a transparent plate supporting a film mask; and a photomask frame to hold the transparent plate at the periphery; The photomask frame has a vacuum adsorption hole for vacuum adsorption of the film photomask, On the surface of the transparent plate facing the film photomask, there is provided a concave portion or a convex portion forming a vent space reaching one edge of the surface. In addition, in order to solve the above-mentioned problems to be solved, the invention described in item 2 of the scope of patent application has the following structure in the structure of item 1 of the scope of patent application, that is, the aforementioned photomask frame, and the aforementioned transparent plate The end face faces the inner side, and has a suction port that can be sucked by vacuum. In addition, in order to solve the above-mentioned problems to be solved, the invention described in item 3 of the scope of patent application has the following structure in the composition of item 1 of the scope of patent application, that is, it is characterized in that the aforementioned transparent plate has The oblique surface that is connected to the surface facing the above-mentioned film photomask and the end surface, that is, the chamfered portion, The above-mentioned part is a shape in the middle of the above-mentioned air leakage space reaching the chamfered part. In addition, in order to solve the above-mentioned problems to be solved, the invention described in item 4 of the scope of patent application is equipped with: a transport system to transport the substrate to the exposure operation position; and The mask unit described in any one of items 1 to 3 of the scope of the patent application is arranged at the exposure operation position; and The exposure unit exposes the substrate by irradiating light through the aforementioned film mask in the mask unit; the exposure device has the following configuration, namely, Equipped with a cleaning head and a head moving mechanism for removing foreign objects on the surface of the film photomask, The head moving mechanism is a mechanism that makes the cleaning head move while touching the film mask, and is a mechanism that moves the cleaning head from the edge of the side of the transparent plate opposite to the aforementioned side toward the edge of the aforementioned side. In addition, in order to solve the above-mentioned problems to be solved, the invention described in item 5 of the scope of patent application has the following structure in the composition of item 4 of the scope of patent application, that is, the aforementioned cleaning head is to form an adhesive layer on the surface , a cleaning roller that rotates while contacting the above-mentioned film photomask. In addition, in order to solve the above-mentioned problems to be solved, the invention described in item 6 of the scope of patent application has the following structure in the composition of item 4 of the scope of patent application, that is, the aforementioned head moving mechanism is a moving mechanism for the aforementioned cleaning head. A mechanism that decelerates the speed of movement when approaching the edge of the aforementioned side. [Efficacy of Invention]

如以下說明般,按照本案申請專利範圍第1項所述之發明,透明板的和薄膜光罩相向之面的一邊的邊緣之吸附力被緩和,形成氣泡之氣體會通過洩氣空間被排出,故不會有氣泡的殘留,薄膜光罩會成為充分地緊貼於透明板之狀態。因此,便不會有欲轉印之圖樣的形狀精度降低之問題。 此外,按照申請專利範圍第2項所述之發明,通過洩氣空間而跑出的氣體會從吸引口迅速地被排出,故氣泡殘留防止之效果會更加提高。 此外,按照申請專利範圍第3項所述之發明,除上述效果外,洩氣空間到達至倒角部的途中,故會防止薄膜光罩在倒角部被強力吸附而阻礙氣體的脫逃。因此,氣泡殘留防止的效果會更加提高。 此外,按照申請專利範圍第4項所述之發明,除上述效果外,藉由頭移動機構使清潔頭移動來除去氣泡,故可同時進行氣泡的除去與清潔。再加上,能夠使薄膜光罩的拉伸具有重現性,可避免圖樣的轉印精度降低的問題發生。 此外,按照申請專利範圍第5項所述之發明,除上述效果外,清潔頭為在薄膜光罩上轉動之清潔滾筒,故不易對薄膜光罩施加強硬的力,對於防止薄膜光罩的形變來說係為合適。 此外,按照申請專利範圍第6項所述之發明,除上述效果外,清潔頭趨近一邊的邊緣時會減速,故沒有氣體的逆流之虞,不會使生產性降低而能夠更加提高氣泡殘留防止之效果。As explained below, according to the invention described in item 1 of the patent scope of this application, the adsorption force of the edge of the side of the transparent plate facing the film mask is eased, and the gas forming the bubbles will be discharged through the air leakage space, so There will be no residual air bubbles, and the film mask will be fully adhered to the transparent plate. Therefore, there is no problem that the shape accuracy of the pattern to be transferred is lowered. In addition, according to the invention described in claim 2, the gas that escapes through the air leakage space is quickly discharged from the suction port, so the effect of preventing air bubbles from remaining is further enhanced. In addition, according to the invention described in item 3 of the scope of application, in addition to the above-mentioned effects, the air leakage space reaches the chamfered part, so the film photomask is prevented from being strongly adsorbed at the chamfered part to hinder the escape of gas. Therefore, the effect of preventing air bubbles remaining will be further enhanced. In addition, according to the invention described in claim 4, in addition to the above-mentioned effects, the cleaning head is moved by the head moving mechanism to remove air bubbles, so the removal and cleaning of air bubbles can be performed simultaneously. In addition, the stretching of the film photomask can be made reproducible, and the problem of lowering the transfer accuracy of the pattern can be avoided. In addition, according to the invention described in item 5 of the scope of patent application, in addition to the above effects, the cleaning head is a cleaning roller that rotates on the film mask, so it is not easy to apply strong force to the film mask, which is very important for preventing the film mask from deforming. It is appropriate to say. In addition, according to the invention described in claim 6 of the scope of application, in addition to the above-mentioned effects, the cleaning head will slow down when approaching the edge of one side, so there is no risk of backflow of gas, and the residual air bubbles can be further improved without reducing productivity. preventive effect.

接下來,說明本申請案之實施方式(實施形態)。 圖1為實施形態之光罩單元的正面截面概略圖,圖2為圖1之光罩單元的分解立體概略圖。 圖1及圖2所示之光罩單元,為搭載於曝光裝置之光罩單元。此光罩單元,具備薄膜光罩1、透明板2、及光罩框3。Next, embodiments (embodiments) of the present application will be described. FIG. 1 is a schematic front sectional view of a mask unit according to an embodiment, and FIG. 2 is a schematic exploded perspective view of the mask unit in FIG. 1 . The mask unit shown in FIGS. 1 and 2 is a mask unit mounted on an exposure device. This mask unit includes a film mask 1 , a transparent plate 2 , and a mask frame 3 .

薄膜光罩1,為聚酯薄膜這類材質之透明的薄的薄膜,厚度為例如100μm~200μm程度。由於是搭載於曝光裝置之物,因此在薄膜光罩1描繪有欲轉印之圖樣(未圖示)。另,本例中,薄膜光罩1為方形。The film mask 1 is a thin transparent film made of a material such as a polyester film, and has a thickness of, for example, about 100 μm to 200 μm. Since it is mounted on an exposure device, a pattern (not shown) to be transferred is drawn on the film mask 1 . In addition, in this example, the thin film mask 1 is square.

透明板2,為支承薄膜光罩1以便於曝光中保持沒有鬆弛之穩定形狀之構件。本實施形態中,透明板2為玻璃製(玻璃板)。透明板2,特別對於曝光波長之光而言必須充分透明,能夠使用以青板或白板的名稱市售之玻璃板。厚度,由確保機械性強度之觀點看來,較佳是訂為5mm~10mm程度。另,透明板2,為比薄膜光罩1還稍小之尺寸的方形。此外,作為透明板2,亦可使用丙烯酸樹脂這類玻璃以外的材質之物。The transparent plate 2 is a member that supports the film mask 1 so as to maintain a stable shape without slack during exposure. In this embodiment, the transparent plate 2 is made of glass (glass plate). The transparent plate 2 needs to be sufficiently transparent particularly to the light of the exposure wavelength, and a glass plate commercially available under the name of a blue plate or a white plate can be used. The thickness is preferably set to about 5 mm to 10 mm from the viewpoint of ensuring mechanical strength. In addition, the transparent plate 2 is a square shape slightly smaller than the film mask 1 . In addition, as the transparent plate 2 , a material other than glass such as acrylic resin may be used.

圖3為從下側觀看透明板2及光罩框3之平面概略圖。圖3中,薄膜光罩省略圖示。光罩框3,為鋁或不鏽鋼等金屬製,如圖2及圖3所示般為方形的框狀。如圖1所示,光罩框3,在內緣具有高低差。高低差的高度,和透明板2的厚度近乎相等,透明板2是在周邊部位於此高低差內之狀態下被安裝於光罩框3。以下,將高低差當中和透明板2的端面相向之面31稱為內側面,和透明板2的板面相向之面32稱為板支承面。FIG. 3 is a schematic plan view of the transparent plate 2 and the mask frame 3 viewed from the lower side. In FIG. 3 , the illustration of the film mask is omitted. The mask frame 3 is made of metal such as aluminum or stainless steel, and has a square frame shape as shown in FIGS. 2 and 3 . As shown in FIG. 1 , the inner edge of the photomask frame 3 has a height difference. The height of the step is almost equal to the thickness of the transparent plate 2 , and the transparent plate 2 is attached to the mask frame 3 with its peripheral portion within the step. Hereinafter, the surface 31 facing the end surface of the transparent plate 2 among the height differences is called an inner surface, and the surface 32 facing the plate surface of the transparent plate 2 is called a plate supporting surface.

透明板2,於周邊部對於光罩框3藉由接著而被固定。亦即,如圖1所示,在透明板2的周邊部的上面與光罩框3的板支承面32之間,設有接著層20。另,在透明板2的端面與光罩框3的內側面31之間,存在有間隙30。以下,將此間隙30稱為周圍空間。The transparent plate 2 is fixed to the mask frame 3 at the peripheral portion by bonding. That is, as shown in FIG. 1 , an adhesive layer 20 is provided between the upper surface of the peripheral portion of the transparent plate 2 and the plate support surface 32 of the photomask frame 3 . In addition, there is a gap 30 between the end surface of the transparent plate 2 and the inner surface 31 of the mask frame 3 . Hereinafter, this gap 30 is referred to as a surrounding space.

薄膜光罩1,對於透明板2及光罩框3是藉由真空吸附而被固定。將光罩框3的支承薄膜光罩1之面33稱為薄膜支承面。如圖1所示,在薄膜支承面33,形成有真空吸附孔34。真空吸附孔34,為溝狀,朝光罩框3的各邊延伸而形成為周狀。The film photomask 1 is fixed to the transparent plate 2 and the photomask frame 3 by vacuum suction. The surface 33 of the mask frame 3 that supports the pellicle mask 1 is called a pellicle support surface. As shown in FIG. 1 , vacuum suction holes 34 are formed in the film support surface 33 . The vacuum suction hole 34 is groove-shaped, and is formed in a circumferential shape extending toward each side of the photomask frame 3 .

真空吸附孔34,透過設於光罩框3內之連通路(詳細圖示略)35而連接至管連接部36。如圖1所示,光罩單元被使用時,在管連接部36會連接排氣管61而受到真空吸引。如此一來,薄膜光罩1會被真空吸附於光罩框3。真空吸附孔34為周狀的溝,故薄膜光罩1是周邊部以周狀吸附於光罩框3。 此外,在光罩框3的內側面31,形成有吸引口37,吸引口37連接至光罩框3內的連通路35。因此,周圍空間30亦受到真空排氣而成為負壓。The vacuum suction hole 34 is connected to the tube connecting portion 36 through a communication path (not shown in detail) 35 provided in the photomask frame 3 . As shown in FIG. 1 , when the mask unit is used, an exhaust pipe 61 is connected to the pipe connection portion 36 to receive vacuum suction. In this way, the film photomask 1 will be vacuum-adsorbed to the photomask frame 3 . The vacuum suction hole 34 is a circumferential groove, so the film mask 1 is adsorbed to the mask frame 3 in a circumferential shape. In addition, on the inner surface 31 of the mask frame 3 , a suction port 37 is formed, and the suction port 37 is connected to the communication path 35 in the mask frame 3 . Therefore, the surrounding space 30 is also subjected to vacuum exhaust to become a negative pressure.

本實施形態中,光罩單元是在水平的姿勢下被使用,薄膜光罩1藉由真空吸附而被保持於透明板2的下側。以下,為求說明方便,將透明板2的薄膜光罩1側之面稱為表面,和其相反側稱為背面。In this embodiment, the mask unit is used in a horizontal posture, and the film mask 1 is held on the lower side of the transparent plate 2 by vacuum suction. Hereinafter, for convenience of description, the surface of the transparent plate 2 on the film mask 1 side is called the front surface, and the opposite side thereof is called the back surface.

這樣的實施形態之光罩單元,具有用來防止前述的氣泡的發生之構造。具體而言,如圖1及圖2所示,在透明板2的表面形成有溝21。此溝21,係形成用來讓氣體逃逸的空間(以下稱為洩氣空間)以免在薄膜光罩1與透明板2之間形成氣泡。以下,將此溝21稱為洩氣溝。The mask unit of such an embodiment has a structure for preventing the above-mentioned generation of air bubbles. Specifically, as shown in FIGS. 1 and 2 , grooves 21 are formed on the surface of the transparent plate 2 . The groove 21 is used to form a space for gas to escape (hereinafter referred to as a gas leak space) so as not to form air bubbles between the film mask 1 and the transparent plate 2 . Hereinafter, this groove 21 is called a vent groove.

如圖2所示,洩氣溝21設有複數個,各洩氣溝21到達至透明板2的表面的右側的邊的邊緣。各洩氣溝21延伸之方向,和透明板2的朝左右延伸之邊的方向平行。 各洩氣溝21的左端,為比透明板2的中央還大幅靠向右側之位置。亦即,各洩氣溝21,是以橫越透明板2的表面的右端的留白(margin)區域之方式形成。 另,這樣的洩氣構21,當透明板2為玻璃板的情形下,能夠藉由磨削加工或化學蝕刻來形成。當透明板2為樹脂製的情形下,能夠藉由成模時使用之模具的形狀來實現。As shown in FIG. 2 , a plurality of air release grooves 21 are provided, and each air release groove 21 reaches the edge of the right side of the surface of the transparent plate 2 . The direction in which each vent groove 21 extends is parallel to the direction in which the sides of the transparent plate 2 extend toward the left and right. The left end of each vent groove 21 is the position that is also largely leaning to the right side than the center of the transparent plate 2 . That is, each vent groove 21 is formed across a margin area at the right end of the surface of the transparent plate 2 . In addition, such a venting mechanism 21 can be formed by grinding or chemical etching when the transparent plate 2 is a glass plate. When the transparent plate 2 is made of resin, it can be realized by the shape of the mold used for molding.

此外,如圖1所示,在透明板2的表面的周緣,形成有倒角部22。倒角部22,為連接透明板2的表面和端面之斜向的面。倒角部22,係避免透明板2的表面的周緣成為銳利的角而為防止薄膜光罩1的損傷之物。又,如圖1所示,各洩氣溝21,從表面的邊緣到達至倒角部22,倒角部22的途中成為終端。In addition, as shown in FIG. 1 , a chamfer 22 is formed on the peripheral edge of the surface of the transparent plate 2 . The chamfered portion 22 is an oblique surface connecting the surface and the end surface of the transparent plate 2 . The chamfer 22 prevents the pellicle 1 from being damaged by preventing the peripheral edge of the surface of the transparent plate 2 from becoming a sharp corner. Also, as shown in FIG. 1 , each vent groove 21 reaches from the edge of the surface to the chamfered portion 22 , and terminates midway through the chamfered portion 22 .

藉由這樣的各洩氣溝22,薄膜光罩1會在沒有氣泡的狀態下緊貼於透明板2。以下,有關這點參照圖4說明之。圖4為揭示有關洩氣溝21的作用之正面截面概略圖。圖4(A)揭示沒有洩氣溝21的參考例之光罩單元,(B)揭示實施形態之光罩單元。Through the vent grooves 22, the film photomask 1 is tightly attached to the transparent plate 2 without air bubbles. Hereinafter, this point will be described with reference to FIG. 4 . FIG. 4 is a schematic front cross-sectional view showing the function of the vent groove 21. FIG. FIG. 4(A) shows the mask unit of the reference example without the vent groove 21, and (B) shows the mask unit of the embodiment.

如上述般,若從排氣管61做真空排氣,則薄膜光罩1在周邊部會被真空吸附於光罩框3。此時,當為了使薄膜光罩1緊貼於透明板2,而以抹刀等抹過而欲將氣泡g擠出的情形下,在沒有洩氣構21的參考例中,如圖4(A)所示,薄膜光罩1於透明板2的表面的邊緣會被強力吸附,因此氣泡g難以被擠出。即使欲強行擠出,氣泡又會產生(移動)到別的地方。薄膜光罩1在透明板2的表面的邊緣的部分會被強力吸附之理由,在於靠近光罩框3的真空吸附孔34或吸引口37,因此藉由來自吸引口37的吸引而透明板2的端面與光罩框3的內側面31之間的空間特別會成為負壓,因此薄膜光罩1在透明板2的表面的周緣容易被強力吸附。As described above, when vacuum is exhausted from the exhaust pipe 61 , the peripheral portion of the thin film mask 1 is vacuum-adsorbed to the mask frame 3 . At this time, in order to make the film photomask 1 close to the transparent plate 2 and wipe it with a spatula to squeeze out the air bubble g, in the reference example without the air release mechanism 21, as shown in Figure 4 (A ) shows that the edge of the film mask 1 on the surface of the transparent plate 2 will be strongly adsorbed, so the air bubble g is difficult to be squeezed out. Even if it is forced to squeeze out, the bubbles will be generated (moved) to other places. The reason why the film photomask 1 will be strongly adsorbed at the edge of the surface of the transparent plate 2 is that it is close to the vacuum suction hole 34 or the suction port 37 of the photomask frame 3, so that the transparent plate 2 is sucked by the suction from the suction port 37. In particular, the space between the end surface and the inner surface 31 of the photomask frame 3 becomes negative pressure, so the peripheral edge of the surface of the transparent plate 2 is easily attracted by the film photomask 1 strongly.

另一方面,在有洩氣溝21的實施形態之構造中,透明板2的表面的周緣之吸附力會被緩和,而且當以抹刀等抹過時形成氣泡g之氣體會通過洩氣溝21到達周圍空間30,而從吸引口37被排氣。因此,如圖4(B)所示,不會有氣泡g的殘留,薄膜光罩1成為充分緊貼於透明板2的表面之狀態。另,洩氣溝21的寬幅,例如為0.5mm~1mm程度,深度為0.05mm~0.3mm程度即可。此外,從周緣起算的長度為5mm~30mm程度。On the other hand, in the structure of the embodiment with the air release groove 21, the adsorption force on the periphery of the surface of the transparent plate 2 will be relaxed, and the gas that forms the bubble g will pass through the air release groove 21 to reach the surroundings when it is wiped with a spatula. The space 30 is exhausted from the suction port 37. Therefore, as shown in FIG. 4(B) , the air bubbles g do not remain, and the film photomask 1 is in a state of being sufficiently adhered to the surface of the transparent plate 2 . In addition, the width of the vent groove 21 may be, for example, about 0.5 mm to 1 mm, and the depth may be about 0.05 mm to 0.3 mm. In addition, the length calculated from the peripheral edge is about 5 mm to 30 mm.

上述實施形態之光罩單元的構造中,洩氣溝21到達至倒角部22這點,意義在於即使當提高真空吸附力而提高了薄膜光罩1的固定力的情形下仍不會使氣泡的殘留發生。有關這點,參照圖5說明之。圖5為揭示有關當洩氣溝21未到達倒角部22的情形下之問題之正面截面概略圖。In the structure of the photomask unit of the above-mentioned embodiment, the vent groove 21 reaches the chamfered portion 22, which means that even if the vacuum suction force is increased to improve the fixing force of the film photomask 1, the air bubbles will not be formed. Residue occurs. This point will be described with reference to FIG. 5 . FIG. 5 is a schematic front cross-sectional view illustrating a problem related to a situation where the vent groove 21 does not reach the chamfered portion 22 .

如上述般,當薄膜光罩1被真空吸附於光罩框3時,周圍空間30亦會成為負壓,因此薄膜光罩1會成為朝周圍空間30之側突出而稍微彎曲的狀態。在此情形下,若洩氣溝21在透明板2的表面的邊緣終結,則薄膜光罩1會強力吸附於倒角部22,而可能在該處被封閉。在此情形下,形成氣泡之氣體會變得無法流至周圍空間30,而如圖5所示般氣泡g容易殘留。另一方面,若洩氣溝21到達至倒角部22的途中,則如圖4(B)所示般薄膜光罩1不會在倒角部22被強力吸附,氣泡不會殘留。As mentioned above, when the pellicle mask 1 is vacuum-adsorbed to the mask frame 3 , the surrounding space 30 will also become negative pressure, so the pellicle mask 1 will protrude toward the side of the surrounding space 30 and be in a slightly curved state. In this case, if the vent groove 21 terminates at the edge of the surface of the transparent plate 2 , the film mask 1 will be strongly attracted to the chamfered portion 22 and may be closed there. In this case, the gas forming the bubbles cannot flow to the surrounding space 30, and the bubbles g tend to remain as shown in FIG. 5 . On the other hand, if the vent groove 21 reaches the middle of the chamfered portion 22, the film mask 1 will not be strongly attracted to the chamfered portion 22 as shown in FIG. 4(B), and air bubbles will not remain.

但,若不將真空吸引力提高那麼多,則即使洩氣溝21未到達至倒角部22的途中也不會成為圖5所示這樣的狀態,而不構成問題。反過來說,洩氣溝21到達至倒角部22的途中之構造,有著能夠提高真空吸引力而更加提高薄膜光罩1的固定強度之優點。另,若要獲得此效果,當然地,洩氣溝21不必在倒角部22的途中終結,亦可連續至倒角部22與端面之交界即可。However, if the vacuum suction force is not increased so much, even if the vent groove 21 does not reach the middle of the chamfered portion 22, it will not be in the state shown in FIG. 5 , and there will be no problem. Conversely, the structure in which the vent groove 21 reaches the chamfered portion 22 has the advantage of improving the vacuum suction force and further improving the fixing strength of the film photomask 1 . In addition, if this effect is to be obtained, of course, the vent groove 21 does not have to end on the way of the chamfered portion 22 , and can also continue to the boundary between the chamfered portion 22 and the end surface.

上述實施形態之光罩單元中,光罩框3的內側面31的吸引口37未必為必須。形成了氣泡之氣體,只要周圍空間30不是完全地被氣密密封之空間便會漏出。例如,會從將透明板2與光罩框3接合之接著層20所具有的微細的孔等被排出。此外,當供薄膜光罩1受到真空吸附之真空吸附孔34並非無終端的周狀,光罩薄膜1不是在將周圍空間30氣密密封的狀態下被真空吸附之情形下,氣體會從未密封之處漏出。但,跟這些比起來,設置吸引口37來吸引之構成中傳導性(conductance)會變高,故氣體會迅速地被排出。因此,氣泡殘留防止的效果會更加提高。另,當接著層20是間歇性地設置而氣體的傳導性高的情形下,亦可不設有吸引口37。但,接著強度會降低,故較佳是設置吸引口37並且將接著層20以無終端的周狀(非間歇性地)設置。In the mask unit of the above-mentioned embodiment, the suction port 37 on the inner surface 31 of the mask frame 3 is not necessarily essential. The gas forming bubbles will leak out as long as the surrounding space 30 is not completely hermetically sealed. For example, it will be discharged from the fine hole etc. which the adhesive layer 20 which joins the transparent board 2 and the photomask frame 3 has. In addition, when the vacuum suction holes 34 for the film photomask 1 to be vacuum-suctioned are not endless, and the photomask film 1 is not vacuum-suctioned in a state where the surrounding space 30 is airtightly sealed, the gas will never Seal leaks. However, compared with these, the conductance (conductance) becomes higher in the configuration where the suction port 37 is provided for suction, so the gas is quickly discharged. Therefore, the effect of preventing air bubbles remaining will be further enhanced. In addition, when the adhesive layer 20 is provided intermittently and the gas conductivity is high, the suction port 37 may not be provided. However, since the strength will decrease after that, it is preferable to provide the suction port 37 and to arrange the adhesive layer 20 in an endless circle (non-intermittently).

接下來,說明形成洩氣空間之其他形狀。圖6及圖7為揭示形成洩氣空間的其他形狀之概略圖。當中,圖6為揭示洩氣溝21的另一例之平面概略圖,圖7為揭示形成洩氣空間的例子之側面截面概略圖。Next, other shapes for forming the deflated space will be described. FIG. 6 and FIG. 7 are schematic diagrams illustrating other shapes for forming the deflated space. Among them, FIG. 6 is a schematic plan view illustrating another example of the air leakage groove 21, and FIG. 7 is a schematic side cross-sectional view illustrating an example of forming an air leakage space.

上述實施形態中的洩氣溝21,是於透明板2的表面的一邊的方向散佈之複數個之物,而全部以均等間隔設置,但亦可如圖6(1)所示,設有複數個由以窄間隔設置的複數個洩氣溝21所成之群組。此外,如圖6(2)(3)所示,亦可為分枝之洩氣溝21,亦可為設有複數個分枝之物。 上述實施形態之洩氣溝21,側面截面圖中會成為圖7(1)所示般的形狀,但除此之外,亦有藉由如圖7(2)所示般的凸部23來形成洩氣空間之情形。在此情形下,凸部23,可為朝向透明板2的表面的邊緣之長形狀(凸條),亦可為突起散佈之形狀。另,凹部或凸部,亦有僅1個也能形成洩氣空間之情形,亦可採用那樣的形狀。The vent groove 21 in the above-mentioned embodiment is a plurality of things scattered in the direction of one side of the surface of the transparent plate 2, and all of them are arranged at equal intervals, but as shown in Figure 6 (1), a plurality of them can also be provided. A group consisting of a plurality of vent grooves 21 arranged at narrow intervals. In addition, as shown in Fig. 6 (2) (3), it can also be a vent groove 21 with branches, and it can also be a thing with a plurality of branches. The vent groove 21 of the above-mentioned embodiment will have a shape as shown in FIG. 7(1) in a side cross-sectional view, but in addition, it may also be formed by a convex portion 23 as shown in FIG. 7(2). The situation of deflated space. In this case, the protrusion 23 may be a long shape (convex line) facing the edge of the surface of the transparent plate 2, or may be a shape in which protrusions are scattered. In addition, only one of the concave portion or the convex portion may form the bleed space, and such a shape may also be adopted.

接下來,說明曝光裝置之發明之實施形態。 圖8為實施形態之曝光裝置的正面概略圖。圖8所示之曝光裝置,具備搬送身為曝光對象物的基板S之搬送系統4、及配置於曝光作業位置之光罩單元10、及通過光罩單元10的薄膜光罩1對基板S照射光而曝光之曝光單元5。 實施形態之曝光裝置,作為一例係為將撓性印刷基板用的基板這類帶狀的撓性的基板S予以曝光之裝置。是故,搬送系統4,為以捲對捲(roll-to-roll)方式搬送基板S之機構。Next, an embodiment of the invention of the exposure apparatus will be described. Fig. 8 is a schematic front view of an exposure apparatus according to the embodiment. The exposure apparatus shown in FIG. 8 includes a transport system 4 for transporting a substrate S as an exposure target, a mask unit 10 arranged at an exposure work position, and the substrate S is irradiated with the film mask 1 passing through the mask unit 10. Exposure unit 5 for light exposure. The exposure apparatus of the embodiment is, for example, an apparatus that exposes a strip-shaped flexible substrate S such as a substrate for a flexible printed circuit board. Therefore, the transport system 4 is a mechanism for transporting the substrate S in a roll-to-roll manner.

具體而言,搬送系統4,具備:捲繞有未曝光的基板S之送出側芯滾筒41、及從送出側芯滾筒41將基板S拉出之送出側夾送滾筒(pinch roller)42、及供曝光後的基板S捲繞之捲取側芯滾筒43、及將曝光後的基板S拉出而使捲取側芯滾筒43捲取之捲取側夾送滾筒44。另,將搬送系統4所致之基板S的饋送方向訂為X方向,將和其垂直之水平方向訂為Y方向。Y方向為基板S寬幅方向。將垂直於XY平面之方向訂為Z方向。Specifically, the transport system 4 includes: a delivery-side core roller 41 around which an unexposed substrate S is wound; a delivery-side pinch roller 42 that pulls the substrate S out from the delivery-side core roller 41; and The winding-side core roller 43 on which the exposed substrate S is wound, and the winding-side pinch roller 44 which pulls out the exposed substrate S and winds the winding-side core roller 43 . In addition, the feeding direction of the substrate S by the transfer system 4 is defined as the X direction, and the horizontal direction perpendicular thereto is defined as the Y direction. The Y direction is the width direction of the substrate S. The direction perpendicular to the XY plane is defined as the Z direction.

在送出側夾送滾筒42與捲取側夾送滾筒44之間,設定有曝光作業位置。實施形態之曝光裝置,為將基板S的兩面同時曝光之裝置,在曝光作業位置的基板S的兩側(本例中為上下)配置有光罩單元10與曝光單元5。是故,光罩單元10與曝光單元5係分別設有二個。An exposure work position is set between the sending-side pinch roller 42 and the take-up-side pinch roller 44 . The exposure device of the embodiment is a device for simultaneously exposing both surfaces of the substrate S, and the mask unit 10 and the exposure unit 5 are arranged on both sides (upper and lower in this example) of the substrate S at the exposure operation position. Therefore, there are two photomask units 10 and two exposure units 5 respectively.

上下的光罩單元10及曝光單元5,分別為同一構成之物,包夾曝光作業位置的基板S而呈上下對稱之配置。亦即,上側的光罩單元10以將薄膜光罩1面向下側之狀態配置,透明板(圖8中未圖示)在上側支承薄膜光罩1。下側的光罩單元10以將薄膜光罩1面向上側之狀態配置,透明板在下側支承薄膜光罩1。 裝置,具備用來安裝各光罩單元10之未圖示的平台(以下稱光罩平台)。各光罩單元10,將光罩框3對於光罩平台予以固定,藉此搭載於裝置。The upper and lower mask units 10 and the exposure unit 5 have the same configuration, and are disposed in a vertically symmetrical manner sandwiching the substrate S at the exposure work position. That is, the mask unit 10 on the upper side is arranged in a state where the pellicle mask 1 faces downward, and a transparent plate (not shown in FIG. 8 ) supports the pellicle mask 1 on the upper side. The mask unit 10 on the lower side is arranged in a state where the pellicle mask 1 faces upward, and the transparent plate supports the pellicle mask 1 on the lower side. The apparatus is provided with an unillustrated stage (hereinafter referred to as a mask stage) on which each mask unit 10 is mounted. Each mask unit 10 is mounted on the apparatus by fixing the mask frame 3 to the mask stage.

此外,裝置,具備用來造出於各光罩單元10中薄膜光罩1被吸附於光罩框3的狀態之真空排氣系統6。真空排氣系統6的各排氣管61,如前述般連接至各光罩框3的管連接部36。真空排氣系統6,藉由後述的主控制器8而受到控制,但亦可藉由來自主控制器8的輸入部81的輸入而做手動控制。另,雖省略說明,但在各薄膜光罩1設有校準用的標記(以下稱光罩標記)。In addition, the device is provided with a vacuum exhaust system 6 for creating a state in which the thin-film photomask 1 in each photomask unit 10 is adsorbed to the photomask frame 3 . Each exhaust pipe 61 of the vacuum exhaust system 6 is connected to the pipe connection portion 36 of each mask frame 3 as described above. The vacuum exhaust system 6 is controlled by a main controller 8 described later, but may also be manually controlled by an input from an input unit 81 of the main controller 8 . In addition, although description is omitted, marks for alignment (hereinafter referred to as mask marks) are provided on each film mask 1 .

各曝光單元5,具備光源51、及將來自光源51的光照射至薄膜光罩1之光學系統52等。本實施形態之裝置為進行接觸(contact)曝光之裝置,各曝光單元5為對各薄膜光罩1照射平行光之單元。是故,光學系統52,包含準直透鏡。 為做接觸曝光,在各光罩單元10設有光罩移動機構7。各光罩移動機構7,為使光罩朝Z方向移動,而使光罩緊貼於基板S或於曝光後使其從基板S遠離之機構。另,各光罩移動機構7,為了曝光時之校準,還具備使各光罩單元10於XY方向移動而對於基板S做校準(定位)之機能。Each exposure unit 5 includes a light source 51, an optical system 52 for irradiating light from the light source 51 to the film mask 1, and the like. The device of this embodiment is a device for performing contact exposure, and each exposure unit 5 is a unit for irradiating parallel light to each film mask 1 . Therefore, the optical system 52 includes a collimating lens. For contact exposure, each mask unit 10 is provided with a mask moving mechanism 7 . Each mask moving mechanism 7 is a mechanism for moving the mask in the Z direction, making the mask stick to the substrate S or separating it from the substrate S after exposure. In addition, each mask moving mechanism 7 also has a function of moving each mask unit 10 in the XY direction to align (position) the substrate S for alignment during exposure.

此外,實施形態之曝光裝置,具備將附著於薄膜光罩1的異物除去之光罩清潔手段。清潔手段,針對上下的薄膜光罩1的各者設置。 各清潔手段,具備清潔頭、及在抵接至薄膜光罩1的狀態下使清潔頭移動藉此進行清潔之頭移動機構。本實施形態中,清潔頭為在表面具有黏著層之滾筒(以下稱清潔滾筒)91,頭移動機構為滾筒移動機構92。Moreover, the exposure apparatus of embodiment is equipped with the mask cleaning means which removes the foreign matter adhering to the film mask 1. The cleaning means is provided for each of the upper and lower pellicle masks 1 . Each cleaning means includes a cleaning head and a head moving mechanism that moves the cleaning head in a state of being in contact with the pellicle 1 to perform cleaning. In this embodiment, the cleaning head is a roller (hereinafter referred to as cleaning roller) 91 with an adhesive layer on the surface, and the head moving mechanism is a roller moving mechanism 92 .

滾筒移動機構92的細節省略圖示,惟各清潔滾筒91係可繞著沿Y方向之旋轉軸而從動旋轉地被保持,滾筒移動機構92,為在透過軸承而以兩端保持著旋轉軸之臂,連結有X方向移動源與Z方向(上下方向)移動源而成之構造。例如,可設想一在底板上設置線性滑軌,將線性馬達設置於臂與線性滑軌之連結部分以便在受到線性滑軌導引的狀態下朝X方向移動,再對於底板設置空氣汽缸這類的移動源而使其朝Z方向移動之機構。The details of the roller moving mechanism 92 are omitted from the illustration, but each cleaning roller 91 is held to be driven to rotate around the rotating shaft along the Y direction. The roller moving mechanism 92 maintains the rotating shaft at both ends through bearings. The arm is a structure that connects the source of movement in the X direction and the source of movement in the Z direction (up and down). For example, it is conceivable to set a linear slide rail on the bottom plate, install a linear motor on the connecting part of the arm and the linear slide rail so as to move in the X direction while being guided by the linear slide rail, and then set an air cylinder on the bottom plate. A mechanism that moves the source of the source to move in the Z direction.

此外,如圖8所示,裝置,具備控制各部之主控制器8。在主控制器8,建置有控制使得裝置的各部以規定的手續動作之主順序程式(main sequence program)82。亦即,在主控制器8的記憶部80記憶有主順序程式82,而可藉由主控制器8的處理器(未圖示)來執行。另,主控制器8,具備用來做手動動作等之輸入部81。In addition, as shown in FIG. 8, the device includes a main controller 8 for controlling each part. In the main controller 8, a main sequence program (main sequence program) 82 for controlling the operation of each part of the device according to a predetermined procedure is installed. That is, the main sequence program 82 is stored in the storage unit 80 of the main controller 8 and can be executed by a processor (not shown) of the main controller 8 . In addition, the main controller 8 includes an input unit 81 for performing manual operations and the like.

接下來,針對上述曝光裝置的動作概略地說明之。 一對光罩單元10,於Z方向位於遠離基板S之待命位置。主順序程式82,對搬送系統4送出控制訊號,使基板S饋送恰好規定的行程。饋送完畢後,進行校準。在基板S設有校準用的標記(基板標記),將各薄膜光罩1的光罩標記與基板標記以未圖示之相機拍攝,光罩移動機構7遵照拍攝資料來使光罩單元10朝XY方向移動,藉此進行校準。Next, the operation|movement of the said exposure apparatus is demonstrated schematically. A pair of photomask units 10 are located at a standby position away from the substrate S in the Z direction. The main sequence program 82 sends a control signal to the conveying system 4, so that the substrate S is fed for a precisely prescribed stroke. After the feed is complete, perform the calibration. A mark (substrate mark) for alignment is provided on the substrate S, and the mask mark and the substrate mark of each film mask 1 are photographed with a camera not shown in the figure, and the mask moving mechanism 7 moves the mask unit 10 in accordance with the photographed data. Calibration is performed by moving in the XY direction.

校準完畢後,主順序程式82,對光罩移動機構7送出控制訊號,使各光罩單元10朝向基板S移動,緊貼於薄膜光罩1。在此狀態下,主順序程式82,使各曝光單元5動作,通過各薄膜光罩1使光照射,進行曝光。 規定時間的曝光之後,主順序程式82,對光罩移動機構7送出控制訊號,使各光罩單元10朝遠離基板S之方向移動,返回當初的待命位置。然後,對搬送系統4送出控制訊號,再次進行規定的行程之饋送。其後,重覆上述動作。After the calibration is completed, the main sequence program 82 sends a control signal to the mask moving mechanism 7 to make each mask unit 10 move toward the substrate S and stick to the film mask 1 . In this state, the main sequence program 82 operates each exposure unit 5, irradiates light through each film mask 1, and performs exposure. After exposure for a predetermined time, the main sequence program 82 sends a control signal to the mask moving mechanism 7 to move each mask unit 10 away from the substrate S and return to the original standby position. Then, a control signal is sent to the conveyance system 4, and the predetermined stroke is fed again. Thereafter, the above operation is repeated.

重覆了上述動作後,當切換至相異品種的製品用之曝光的情形下,會進行薄膜光罩1的交換作業。實施形態之裝置,具備於此交換作業時使用之特別的構成。以下,針對這點說明之。 如圖8所示,在主控制器8,作為維護用的程式,建置有光罩維護程式83。光罩維護程式83,主要為薄膜光罩1的交換時執行之程式,藉由來自輸入部81之輸入而可執行。圖9為揭示有關曝光裝置所具備的光罩維護程式83之正面概略圖。After repeating the above-mentioned operations, when switching to exposure for a product of a different type, an exchange operation of the film photomask 1 will be performed. The device of the embodiment has a special structure used in this exchange operation. In the following, this point will be explained. As shown in FIG. 8, in the main controller 8, a mask maintenance program 83 is built as a program for maintenance. The mask maintenance program 83 is mainly a program executed when the film mask 1 is exchanged, and can be executed by input from the input unit 81 . FIG. 9 is a schematic front view showing a mask maintenance program 83 included in the exposure device.

如前述般,若品種相異則需要相異的薄膜光罩1,而會進行薄膜光罩1的交換。本實施形態中,薄膜光罩1的交換,是將光罩單元10拆卸而進行。 首先,作業者,停止吸附著薄膜光罩1之真空排氣系統6的動作,從光罩平台拆卸。然後,將先前使用的薄膜光罩1拆卸,將下一品種用的薄膜光罩1裝配至光罩框3。此時,將薄膜光罩1相對於光罩框3在規定位置披覆,以黏著膠帶等暫時固定。在光罩框3,形成有示意薄膜光罩1的裝配位置之標記,故以其作為指標來披覆、暫時固定。As mentioned above, if the type is different, a different pellicle mask 1 is required, and the pellicle mask 1 is exchanged. In this embodiment, the exchange of the film mask 1 is performed by detaching the mask unit 10 . First, the operator stops the operation of the vacuum exhaust system 6 holding the film photomask 1 and removes it from the photomask platform. Then, the previously used pellicle mask 1 is disassembled, and the pellicle mask 1 for the next type is attached to the mask frame 3 . At this time, the pellicle mask 1 is covered at a predetermined position with respect to the mask frame 3 and temporarily fixed with an adhesive tape or the like. The mask frame 3 is formed with a mark showing the mounting position of the pellicle mask 1, so it is covered and temporarily fixed as an index.

然後,將交換了薄膜光罩1之光罩單元10如原先般固定至光罩平台。在此狀態下,作業者操作主控制器8的輸入部81,使真空排氣系統6動作。如此一來,薄膜光罩1會被真空吸附於光罩框3。在此狀態下,作業者操作輸入部81而執行光罩維護程式83。Then, the mask unit 10 with the thin film mask 1 replaced is fixed to the mask platform as before. In this state, the operator operates the input unit 81 of the main controller 8 to operate the vacuum exhaust system 6 . In this way, the film photomask 1 will be vacuum-adsorbed to the photomask frame 3 . In this state, the operator operates the input unit 81 to execute the mask maintenance program 83 .

光罩維護程式83,被編寫成對滾筒移動機構92送出控制訊號,以便進行使各清潔滾筒91一面接觸各薄膜光罩1一面朝各規定的方向以規定的速度移動之控制。一對清潔滾筒91為上下對稱,光罩維護程式83所做的動作亦上下對稱。作為一例,上側的清潔滾筒91的動作,如圖9所示。The mask maintenance program 83 is programmed to send a control signal to the roller moving mechanism 92 so as to control the movement of each cleaning roller 91 at a prescribed speed in each prescribed direction while contacting each film photomask 1 . The pair of cleaning rollers 91 are vertically symmetrical, and the actions of the mask maintenance program 83 are also vertically symmetrical. As an example, the operation of the cleaning roller 91 on the upper side is as shown in FIG. 9 .

如圖9(1)所示,滾筒移動機構92,使清潔滾筒91上昇,以使上側的清潔滾筒91在被設定於上側的薄膜光罩1的左側之開始位置抵接至該薄膜光罩1。開始位置,為在X方向相當於透明板2的左緣之位置。滾筒移動機構92,從開始位置使清潔滾筒91朝向右緣移動(圖9(2))。滾筒移動機構92,使清潔滾筒91移動至被設定於薄膜光罩1的右側之結束位置,一旦到達了結束位置,便使其下降規定距離,而如圖9(3)所示送返至左側的當初的待命位置。結束位置,為在X方向相當於透明板2的右緣之位置。順序程式,對滾筒移動機構92送出控制訊號以使清潔滾筒91做出這樣的動作。As shown in FIG. 9(1), the roller moving mechanism 92 raises the cleaning roller 91 so that the cleaning roller 91 on the upper side abuts against the film photomask 1 at the starting position on the left side of the film photomask 1 set on the upper side. . The starting position is a position corresponding to the left edge of the transparent plate 2 in the X direction. The roller moving mechanism 92 moves the cleaning roller 91 toward the right edge from the start position ( FIG. 9( 2 )). The roller moving mechanism 92 makes the cleaning roller 91 move to the end position set on the right side of the film photomask 1. Once the end position is reached, it will be lowered by a predetermined distance and returned to the left side as shown in Figure 9 (3). original standby position. The end position is a position corresponding to the right edge of the transparent plate 2 in the X direction. Sequence program sends control signal to the cylinder moving mechanism 92 to make the cleaning cylinder 91 do such an action.

上述動作中,清潔滾筒91,藉由與薄膜光罩1之摩擦力而做從動旋轉。然後,藉由表面的黏著層,薄膜光罩1的表面的異物c會被除去。 又,如圖9所示,存在於薄膜光罩1與透明板2之間的形成氣泡g之氣體,會藉由清潔滾筒91而被擠出。此時,如前述般,氣體會通過洩氣溝21而迅速地被擠出。During the above actions, the cleaning roller 91 is driven to rotate by friction with the film mask 1 . Then, the foreign matter c on the surface of the film mask 1 is removed by the adhesive layer on the surface. Also, as shown in FIG. 9 , the gas forming bubbles g existing between the film mask 1 and the transparent plate 2 is squeezed out by the cleaning roller 91 . At this time, as mentioned above, the gas will be squeezed out rapidly through the air leakage groove 21 .

上述動作中重點在於,清潔滾筒91是在和設有洩氣溝21之側相反側的邊緣(開始位置)抵接至薄膜光罩1,而朝向設有洩氣溝21之側的邊緣(結束位置)移動。如果此動作顛倒,則清潔滾筒91將氣體擠出的終點不會有洩氣溝21,故會導致氣體逆流而氣泡g容易殘留。The important point in the above-mentioned action is that the cleaning roller 91 abuts against the film photomask 1 at the edge (starting position) on the side opposite to the side where the air release groove 21 is provided, and faces the edge (end position) on the side where the air release groove 21 is provided. move. If this action is reversed, there will be no air leakage groove 21 at the end point where the cleaning roller 91 squeezes out the gas, so the gas will flow backward and the air bubbles g will easily remain.

由上述說明可知,實施形態中的光罩維護程式83,係實現同時進行薄膜光罩1的清潔與氣泡除去之機能。藉由光罩維護程式83可進行氣泡除去,故作業者於薄膜光罩1的交換時無需以人工作業做氣泡除去。因此,薄膜光罩1的交換作業全體而言會在短時間完畢。這意味著裝置的運轉停止時間變短,有助於生產性的提升。As can be seen from the above description, the mask maintenance program 83 in the embodiment realizes the function of cleaning the film mask 1 and removing air bubbles at the same time. Air bubbles can be removed by the mask maintenance program 83, so the operator does not need to manually remove air bubbles when exchanging the film mask 1. Therefore, the replacement work of the film photomask 1 is completed in a short time as a whole. This means that the operation stop time of the device is shortened, which contributes to the improvement of productivity.

另,清潔滾筒91將形成氣泡之氣體擠出時,在薄膜光罩1會發生些許的拉伸。這雖可說是薄膜光罩1扭曲,但薄膜光罩1的拉伸,若清潔滾筒91的對於薄膜光罩1之推壓力為一定而清潔滾筒91的移動速度為一定,則薄膜光罩1的拉伸亦為一定。也就是說,薄膜光罩1的拉伸有重現性,而可控制。因此,能夠採取將拉伸納入考量來形成薄膜光罩1的圖樣等之措施,而能夠避免圖樣的轉印精度降低的問題發生。In addition, when the cleaning roller 91 squeezes out the gas that forms the bubbles, the film mask 1 will be slightly stretched. Although this can be said to be that the film photomask 1 is twisted, the stretching of the film photomask 1, if the pushing force of the cleaning roller 91 for the film photomask 1 is constant and the moving speed of the cleaning roller 91 is constant, then the film photomask 1 The stretching of is also constant. That is to say, the stretching of the film mask 1 is reproducible and controllable. Therefore, it is possible to take measures such as forming the pattern of the film mask 1 in consideration of the stretching, and avoid the occurrence of the problem of lowering the transfer accuracy of the pattern.

此外,依發明者之研究,清潔滾筒91的移動速度,較佳是於趨近設有洩氣溝21之側的邊緣時使其降低。其理由在於,若清潔滾筒91趨近設有洩氣溝21之側的邊緣,則形成氣泡之氣體的壓力有變高的傾向,若在到達至洩氣溝21前壓力變高到某一程度,則可能會導致氣體越過清潔滾筒91的往薄膜光罩1之抵接處而氣體。是故,針對清潔滾筒91,較佳是進行最初設為高速,其後設為低速之速度控制。此速度控制,亦藉由光罩維護程式83的順序來實現。另,雖亦可最初就設為低速,但所需時間會變長而有生產性降低之問題。若要揭示速度之一例,清潔滾筒91的速度(線速度),最先為100~150mm/秒程度,在洩氣溝21的位置或其稍微前方減速至1~10mm/秒程度。In addition, according to the research of the inventor, the moving speed of the cleaning roller 91 is preferably reduced when approaching the edge of the side where the air leakage groove 21 is provided. Its reason is that if the cleaning roller 91 approaches the edge on the side where the air release groove 21 is provided, the pressure of the gas forming the bubbles tends to become higher. If the pressure becomes higher to a certain extent before reaching the air release groove 21, then It may cause the gas to pass through the abutting part of the cleaning roller 91 toward the film mask 1 and gas out. Therefore, for the cleaning roller 91, it is preferable to perform speed control such that the speed is first set to a high speed and then set to a low speed. This speed control is also realized by the sequence of the mask maintenance program 83 . In addition, although it is also possible to set it to a low speed from the beginning, it takes a long time and there is a problem that productivity falls. To reveal an example of the speed, the speed (linear speed) of the cleaning roller 91 is about 100-150 mm/sec at first, and then decelerates to about 1-10 mm/sec at the position of the air release groove 21 or slightly in front of it.

針對各清潔滾筒91,若重覆使用則會成為附著有許多異物之狀態,故會構成為交換成新的、或使異物移附至另外設置之移附滾筒。移附滾筒設於各清潔滾筒91的待命位置的附近,被做成為比各清潔滾筒91的黏著力還高黏著力之滾筒。移附滾筒被做成驅動旋轉之構成,構成為一面接觸各清潔滾筒91一面旋轉,使各清潔滾筒91上的異物移附至自身。Since each cleaning roller 91 is repeatedly used, it will be in a state where many foreign substances are attached, so it is configured to be replaced with a new one or to transfer foreign substances to a transfer roller provided separately. The transfer roller is provided near the stand-by position of each cleaning roller 91 , and is made as a roller having a higher adhesive force than that of each cleaning roller 91 . The transfer roller is configured to be driven to rotate, and is configured to rotate while contacting each cleaning roller 91, so that foreign matter on each cleaning roller 91 is transferred to itself.

上述曝光裝置之構成中,作為光罩單元10中的洩氣空間,不限於洩氣溝21,可採用圖6或圖7所示般的各種構成。 此外,清潔頭雖為清潔滾筒91,但亦可使用非滾筒狀之清潔頭(例如抹刀狀之物)。但,若使用在薄膜光罩1上轉動之清潔滾筒,則不易對薄膜光罩1施加強硬的力,對於防止薄膜光罩1的形變來說係為合適。另,針對清潔頭,亦有不藉由黏著力來除去異物者,而是使用將異物掃出而除去者之情形,亦有使用藉由靜電來吸附異物者之情形。In the configuration of the exposure apparatus described above, the vent space in the mask unit 10 is not limited to the vent groove 21, and various configurations as shown in FIG. 6 or FIG. 7 can be employed. In addition, although the cleaning head is a cleaning roller 91, a non-roller-shaped cleaning head (such as a spatula-shaped object) can also be used. However, if a cleaning roller that rotates on the pellicle mask 1 is used, it is difficult to apply strong force to the pellicle mask 1, which is suitable for preventing deformation of the pellicle mask 1 . In addition, as for the cleaning head, there are cases where the foreign matter is not removed by adhesive force, but the foreign matter is swept out and removed, and there is also a case where the foreign matter is adsorbed by static electricity.

另,光罩單元10中,對於光罩框3之透明板2的固定,亦可不為接著而為螺固等其他方法。例如,亦可設置鉗夾透明板2之構件,將該構件螺固於光罩框3藉此固定。但,當為接觸方式或近接(proximity)方式的情形下,較佳是在薄膜光罩1的前側(基板S之側)沒有比薄膜光罩1還突出之構件,就這點而言接著層20所致之固定為合適。In addition, in the photomask unit 10, the fixing of the transparent plate 2 of the photomask frame 3 may not be adhesive but other methods such as screw fastening. For example, a member for clamping the transparent plate 2 may also be provided, and the member is screwed to the photomask frame 3 so as to be fixed. However, in the case of a contact method or a proximity method, it is preferable that there is no member protruding from the film photomask 1 on the front side (the side of the substrate S) of the film photomask 1. In this regard, the adhesive layer 20 caused by the fixation is suitable.

作為曝光裝置之實施形態,未必限於進行兩面曝光者,亦可為僅曝光基板S的單面者。在此情形下,僅在基板S的單側設有光罩單元10,針對1個薄膜光罩1設有進行清潔與氣泡除去之1個清潔滾筒91。 針對曝光的對象物,亦可不是上述般帶狀的基板S,而是以方形的基板作為對象物,亦可以非撓性之剛性的基板作為曝光對象物。是故,作為基板的搬送方式,除捲對捲方式外,亦可為單片式的搬送。單片式的裝置的情形下,設有成為和薄膜光罩相向的狀態之平台,在平台上載置基板。然後,光罩單元或平台移動,造出基板緊貼於薄膜光罩之狀態而進行曝光。 又,針對曝光的方式,除接觸方式外,亦可為近接方式,亦可為投影曝光方式。As an embodiment of the exposure apparatus, it is not necessarily limited to one that performs exposure on both sides, and one that exposes only one side of the substrate S may be used. In this case, the mask unit 10 is provided only on one side of the substrate S, and one cleaning roller 91 for cleaning and removing air bubbles is provided for one film mask 1 . The object to be exposed may not be the strip-shaped substrate S as described above, but a square substrate may be used as the object, or a non-flexible rigid substrate may be used as the object to be exposed. Therefore, as the conveyance method of the substrate, in addition to the roll-to-roll method, single-sheet conveyance may also be used. In the case of a monolithic device, a stage facing the pellicle mask is provided, and a substrate is placed on the stage. Then, the photomask unit or platform moves to make the substrate close to the state of the film photomask for exposure. In addition, the method of exposure may be a proximity method or a projection exposure method in addition to the contact method.

1‧‧‧薄膜光罩 2‧‧‧透明板 21‧‧‧洩氣溝 3‧‧‧光罩框 30‧‧‧周圍空間 31‧‧‧內側面 32‧‧‧板支承面 33‧‧‧薄膜支承面 34‧‧‧真空吸附孔 35‧‧‧連通路 36‧‧‧管連接部 37‧‧‧吸引口 4‧‧‧搬送系統 5‧‧‧曝光單元 6‧‧‧真空排氣系統 61‧‧‧排氣管 7‧‧‧光罩移動機構 8‧‧‧主控制器 83‧‧‧光罩維護程式 91‧‧‧清潔滾筒 92‧‧‧滾筒移動機構1‧‧‧Thin film mask 2‧‧‧Transparent board 21‧‧‧Discharge ditch 3‧‧‧Reticle frame 30‧‧‧surrounding space 31‧‧‧inner side 32‧‧‧Board support surface 33‧‧‧Film supporting surface 34‧‧‧Vacuum adsorption hole 35‧‧‧connected road 36‧‧‧Pipe connection 37‧‧‧Attraction port 4‧‧‧Transportation system 5‧‧‧Exposure unit 6‧‧‧Vacuum exhaust system 61‧‧‧exhaust pipe 7‧‧‧Reticle moving mechanism 8‧‧‧Main controller 83‧‧‧Reticle maintenance program 91‧‧‧Cleaning roller 92‧‧‧Drum moving mechanism

[圖1] 實施形態之光罩單元的正面截面概略圖。 [圖2] 圖1之光罩單元的分解立體概略圖。 [圖3] 從下側觀看光罩框及玻璃板之平面概略圖。 [圖4] 揭示有關洩氣溝的作用之正面截面概略圖。 [圖5] 揭示有關當洩氣溝未到達倒角部的情形下之問題之正面截面概略圖。 [圖6] 揭示形成洩氣空間的其他形狀之概略圖。 [圖7] 揭示形成洩氣空間的其他形狀之概略圖。 [圖8] 實施形態之曝光裝置的正面概略圖。 [圖9] 揭示有關曝光裝置所具備的光罩維護程式之正面概略圖。[FIG. 1] A schematic front cross-sectional view of a mask unit according to an embodiment. [Fig. 2] An exploded perspective view of the mask unit in Fig. 1. [Fig. 3] A schematic plan view of the mask frame and glass plate viewed from the bottom. [Fig. 4] A schematic front cross-sectional view revealing the function of the air vent. [FIG. 5] A schematic front cross-sectional view showing a problem in a case where the vent groove does not reach the chamfered portion. [FIG. 6] A schematic diagram showing other shapes forming the deflated space. [FIG. 7] A schematic diagram showing other shapes forming the deflated space. [ Fig. 8 ] A schematic front view of an exposure device according to an embodiment. [Fig. 9] A schematic front view showing the mask maintenance program of the exposure device.

1‧‧‧薄膜光罩 1‧‧‧Thin film mask

2‧‧‧透明板 2‧‧‧Transparent board

3‧‧‧光罩框 3‧‧‧Reticle frame

10‧‧‧光罩單元 10‧‧‧Reticle unit

21‧‧‧洩氣溝 21‧‧‧Discharge ditch

91‧‧‧清潔滾筒 91‧‧‧Cleaning roller

c‧‧‧異物 c‧‧‧foreign matter

g‧‧‧氣泡 g‧‧‧bubble

Claims (7)

一種光罩單元,係搭載於曝光裝置之光罩單元,其特徵為,具備:薄膜光罩;及透明板,支承前述薄膜光罩;及光罩框,將前述透明板在周邊部予以保持;前述光罩框,具有可將前述薄膜光罩真空吸附之真空吸附孔,在前述透明板的和前述薄膜光罩相向之面的和前述薄膜光罩相向之區域,設有形成到達該面的一邊的邊緣之洩氣空間之凹部或凸部。 A mask unit, which is a mask unit mounted on an exposure device, is characterized by comprising: a film mask; and a transparent plate supporting the film mask; and a mask frame holding the transparent plate at the peripheral portion; The aforementioned photomask frame has a vacuum suction hole capable of vacuum-absorbing the aforementioned thin film photomask, and on the area of the aforementioned transparent plate facing the aforementioned thin film photomask and the aforementioned thin film photomask, there is provided a side that reaches the surface. Concavity or convexity of the deflated space at the edge of the 如申請專利範圍第1項所述之光罩單元,其中,前述光罩框,在和前述透明板的端面相向之內側面,具有可被真空吸引之吸引口。 The photomask unit as described in Claim 1 of the patent application, wherein the photomask frame has a suction port that can be sucked by vacuum on the inner side facing the end surface of the aforementioned transparent plate. 如申請專利範圍第1項所述之光罩單元,其中,前述透明板,具有將和前述薄膜光罩相向之面與端面連接之斜向的面亦即倒角部,前述凹部或凸部,為前述洩氣空間到達至前述倒角部的途中之形狀。 The photomask unit described in claim 1, wherein the transparent plate has an oblique surface that connects the surface facing the film photomask to the end surface, that is, a chamfered portion, the concave portion or the convex portion, It is the shape on the way from the aforementioned air leakage space to the aforementioned chamfered portion. 如申請專利範圍第1項至第3項中任一項所述之光罩單 元,其中,前述凹部或凸部,於前述相向之面,係從前述一邊的邊緣與和前述一邊的邊緣相反側的邊的邊緣之間的位置起到達前述一邊的邊緣,而從前述一邊的邊緣與和前述一邊的邊緣相反側的邊的邊緣之間的位置起到達和前述一邊的邊緣相反側的邊的邊緣則不具有形成洩氣空間之凹部及凸部。 The mask list as described in any one of the 1st to 3rd items of the scope of the patent application element, wherein the above-mentioned concave part or convex part, on the above-mentioned opposing surface, starts from the position between the edge of the aforementioned one side and the edge of the side opposite to the edge of the aforementioned one side to the edge of the aforementioned one side, and from the position between the edge of the aforementioned one side The position between the edge and the edge of the side opposite to the edge of the one side reaches the edge of the side opposite to the edge of the one side without the concave and convex portions forming the air leakage space. 一種曝光裝置,係具備:搬送系統,將基板搬送至曝光作業位置;及如申請專利範圍第1項至第3項中任一項所述之光罩單元,配置於前述曝光作業位置;及曝光單元,通過前述光罩單元的前述薄膜光罩照射光而將前述基板曝光;該曝光裝置,其特徵為,設有除去前述薄膜光罩的表面的異物之清潔頭、及頭移動機構,前述頭移動機構,為一面使前述清潔頭接觸前述薄膜光罩一面使其移動之機構,且為使前述清潔頭從前述透明板的和前述一邊相反側之一邊的邊緣朝向前述一邊的邊緣移動之機構,前述凹部或凸部,於前述透明板的和前述光罩框相向之面,係從前述清潔頭的移動方向的途中的位置到達前述一邊的邊緣,而從前述清潔頭的移動方向的途中的位置到達和前述一邊相反側的邊的邊緣則不具有形成洩氣空間之凹部及凸部。 An exposure device comprising: a conveying system for conveying a substrate to an exposure operation position; and a mask unit as described in any one of items 1 to 3 of the scope of the patent application, arranged at the aforementioned exposure operation position; and exposure A unit for exposing the substrate by irradiating light through the film mask of the mask unit; the exposure device is characterized in that it is provided with a cleaning head for removing foreign matter on the surface of the film mask and a head moving mechanism, and the head The moving mechanism is a mechanism that makes the cleaning head touch the film photomask while moving it, and is a mechanism that moves the cleaning head from the edge of the side of the transparent plate opposite to the side toward the edge of the side, The above-mentioned concave part or convex part, on the surface of the above-mentioned transparent plate facing the above-mentioned photomask frame, is from the position in the middle of the moving direction of the aforementioned cleaning head to the edge of the aforementioned side, and from the position on the middle of the moving direction of the aforementioned cleaning head The edge that reaches the side opposite to the aforementioned side does not have the concave and convex portions that form the air leakage space. 如申請專利範圍第5項所述之曝光裝置,其中,前述清潔頭,為在表面形成黏著層,一面接觸前述薄膜光罩一面旋轉之清潔滾筒。 The exposure device as described in claim 5 of the patent application, wherein the aforementioned cleaning head is a cleaning roller that forms an adhesive layer on the surface and rotates while touching the aforementioned film photomask. 如申請專利範圍第5項或第6項所述之曝光裝置,其中,前述頭移動機構,為前述清潔頭趨近前述一邊的邊緣時使移動的速度減速之機構。 The exposure device as described in claim 5 or claim 6, wherein the head moving mechanism is a mechanism that decelerates the moving speed of the cleaning head when it approaches the edge of the one side.
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Publication number Priority date Publication date Assignee Title
CN112462575A (en) * 2019-09-06 2021-03-09 台湾恒基股份有限公司 Photoetching process method and plate positioning device thereof
CN113885298B (en) * 2021-09-22 2022-06-17 哈尔滨工业大学 Magnetic suspension type mask table of photoetching machine
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Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0221652U (en) * 1988-07-29 1990-02-14
TW200516355A (en) * 2003-11-13 2005-05-16 Dms Co Ltd Mask supporting apparatus using vacuum and light exposing system, and method using the same
TW200629972A (en) * 2005-01-05 2006-08-16 Samsung Sdi Co Ltd Mask frame and method of fixing mask on the mask frame
JP2009157249A (en) * 2007-12-27 2009-07-16 Orc Mfg Co Ltd Exposure apparatus
TW201030476A (en) * 2009-02-02 2010-08-16 Ushio Electric Inc Workpiece platen and exposure apparatus using the same
TW201126276A (en) * 2010-01-27 2011-08-01 Ushio Electric Inc Light radiation device
US8075730B2 (en) * 2004-07-02 2011-12-13 Tokyo Electron Limited Apparatus for manufacturing a semiconductor device
CN103092007A (en) * 2013-02-06 2013-05-08 京东方科技集团股份有限公司 Mask plate installing device of exposure machine

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6141151A (en) 1984-08-02 1986-02-27 Hitachi Chem Co Ltd Resist pattern forming method
JPH10161320A (en) * 1996-11-28 1998-06-19 Sanee Giken Kk Exposure device
JPH1130851A (en) 1997-07-10 1999-02-02 Nec Toyama Ltd Film for photomask as well as photomask and its production
JP2004271952A (en) * 2003-03-10 2004-09-30 Semiconductor Leading Edge Technologies Inc Gas replacement mechanism and gas replacement method
JP2005300753A (en) * 2004-04-08 2005-10-27 Toray Eng Co Ltd Proximity aligner
GB0620955D0 (en) * 2006-10-20 2006-11-29 Speakman Stuart P Methods and apparatus for the manufacture of microstructures
US7807001B2 (en) * 2007-06-28 2010-10-05 Eastman Kodak Company Lamination device method for flexographic plate manufacturing
KR100946996B1 (en) * 2008-06-27 2010-03-10 한양대학교 산학협력단 Apparatus for contacting mask and exposuring apparatus having the same
JP5163401B2 (en) * 2008-09-29 2013-03-13 ウシオ電機株式会社 Mask holding means for light irradiation device
JP2009009166A (en) * 2008-10-14 2009-01-15 Toray Eng Co Ltd Proximity aligner
JP2014092768A (en) * 2012-11-07 2014-05-19 Adtec Engineeng Co Ltd Adsorption plate
KR20160064923A (en) * 2014-11-28 2016-06-08 삼성전자주식회사 Pellicle and exposure mask comprising the same

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0221652U (en) * 1988-07-29 1990-02-14
TW200516355A (en) * 2003-11-13 2005-05-16 Dms Co Ltd Mask supporting apparatus using vacuum and light exposing system, and method using the same
US8075730B2 (en) * 2004-07-02 2011-12-13 Tokyo Electron Limited Apparatus for manufacturing a semiconductor device
TW200629972A (en) * 2005-01-05 2006-08-16 Samsung Sdi Co Ltd Mask frame and method of fixing mask on the mask frame
JP2009157249A (en) * 2007-12-27 2009-07-16 Orc Mfg Co Ltd Exposure apparatus
TW201030476A (en) * 2009-02-02 2010-08-16 Ushio Electric Inc Workpiece platen and exposure apparatus using the same
TW201126276A (en) * 2010-01-27 2011-08-01 Ushio Electric Inc Light radiation device
CN103092007A (en) * 2013-02-06 2013-05-08 京东方科技集团股份有限公司 Mask plate installing device of exposure machine

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CN110018609B (en) 2024-03-26
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JP6986317B2 (en) 2021-12-22
TWI812492B (en) 2023-08-11
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CN110018609A (en) 2019-07-16

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