TWI782139B - Mask unit and exposure device - Google Patents
Mask unit and exposure device Download PDFInfo
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- TWI782139B TWI782139B TW107140995A TW107140995A TWI782139B TW I782139 B TWI782139 B TW I782139B TW 107140995 A TW107140995 A TW 107140995A TW 107140995 A TW107140995 A TW 107140995A TW I782139 B TWI782139 B TW I782139B
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/62—Pellicles, e.g. pellicle assemblies, e.g. having membrane on support frame; Preparation thereof
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/62—Pellicles, e.g. pellicle assemblies, e.g. having membrane on support frame; Preparation thereof
- G03F1/64—Pellicles, e.g. pellicle assemblies, e.g. having membrane on support frame; Preparation thereof characterised by the frames, e.g. structure or material, including bonding means therefor
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70908—Hygiene, e.g. preventing apparatus pollution, mitigating effect of pollution or removing pollutants from apparatus
- G03F7/70925—Cleaning, i.e. actively freeing apparatus from pollutants, e.g. using plasma cleaning
Abstract
設計成能夠使薄膜光罩容易地緊貼於透明板,而消弭被轉印之圖樣的形狀精度的降低之問題。 被透明板(2)支承之薄膜光罩(1),其周邊部藉由光罩框(3)的真空吸附孔(34)被真空吸附。形成於透明板(2)的和薄膜光罩(1)相向的面之洩氣溝(21)係到達至該面的右側的邊緣,而在倒角部(22)的途中終結。曝光裝置所具備之清潔滾筒(91),從薄膜光罩(1)的左側的邊緣至右側的邊緣接觸薄膜光罩(1)而一面轉動一面移動,進行異物(c)之除去與氣泡(g)之擠出。形成氣泡(g)之氣體,經由洩氣溝(21)、吸引口(37)被排出。It is designed so that the film photomask can be easily attached to the transparent plate, and the problem of reducing the shape accuracy of the transferred pattern can be eliminated. The film photomask (1) supported by the transparent plate (2) is vacuum-adsorbed at its periphery through the vacuum suction holes (34) of the photomask frame (3). The vent groove (21) formed on the face facing the film photomask (1) of the transparent plate (2) reaches the edge on the right side of the face, and terminates on the way of the chamfer (22). The cleaning roller (91) of the exposure device contacts the film mask (1) from the left edge to the right edge and moves while rotating to remove foreign matter (c) and air bubbles (g). ) of extrusion. The gas forming bubbles (g) is discharged through the vent groove (21) and the suction port (37).
Description
本申請案之發明,有關各種製品的製造中用於圖樣的轉印之曝光裝置,此外有關搭載於曝光裝置之光罩單元。The invention of this application relates to an exposure device used for pattern transfer in the manufacture of various products, and also relates to a mask unit mounted on the exposure device.
將規定圖樣的光照射至對象物而曝光之曝光裝置,係作為光微影(photo lithography)的核心技術而被使用於各種用途。曝光裝置中,已知有直接描繪圖樣的類型之物,但通常會通過光罩照射光,將光罩的圖樣轉印至對象物。An exposure device that irradiates an object with a predetermined pattern of light to expose it is used in various applications as a core technology of photolithography. Among the exposure devices, a type that directly draws a pattern is known, but light is usually irradiated through a mask to transfer the pattern on the mask to the object.
搭載於曝光裝置之光罩,是做成為在透明的玻璃板以遮光材料描繪有圖樣之構成。通常是使遮光材料的膜附著於玻璃板,藉由光微影做成圖樣化。 相對於這樣的玻璃製的光罩,最近所謂的薄膜光罩(film mask)也愈來愈多人使用。藉由遮光材料而形成有圖樣的,是由PET(聚對苯二甲酸乙二酯)薄膜這類的材料所形成之透明的薄的薄膜,而做成以玻璃板來支承此薄膜(薄膜光罩)之構造。 薄膜光罩的情形下,玻璃板能夠共用,只要配合品種來製作並保管各種薄膜光罩即可。因此,成為低成本,保管或取用亦容易。保管所需之空間亦變小。因這樣的理由,採用薄膜光罩的曝光裝置愈來愈多。 [先前技術文獻] [專利文獻]The photomask mounted on the exposure device has a pattern drawn on a transparent glass plate with a light-shielding material. Usually, a film of a light-shielding material is attached to a glass plate and patterned by photolithography. Compared with such a mask made of glass, a so-called film mask is used more and more recently. The pattern formed by the light-shielding material is a transparent thin film formed of a material such as PET (polyethylene terephthalate) film, and a glass plate is used to support the film (film light cover) structure. In the case of thin film masks, the glass plate can be shared, and it is only necessary to manufacture and store various thin film masks according to the type. Therefore, it becomes low cost, and it is easy to store or take out. The space required for storage is also reduced. For such reasons, more and more exposure apparatuses employ thin-film masks. [Prior Art Literature] [Patent Document]
[專利文獻1] 日本特開昭61-41151號公報 [專利文獻2] 日本特開平11-30851號公報[Patent Document 1] Japanese Patent Application Laid-Open No. 61-41151 [Patent Document 2] Japanese Patent Application Laid-Open No. 11-30851
[發明所欲解決之問題][Problem to be solved by the invention]
薄膜光罩,雖有上述這樣的長處,但一定要在使其對於玻璃板充分緊貼之狀態下搭載於曝光裝置,這點成為待解問題。薄而柔軟的薄膜光罩,即使抵著玻璃板而欲使其緊貼,其間也容易有氣泡殘留。若氣泡殘留,則在該部分薄膜光罩之圖樣會扭曲,因此導致被轉印之圖樣亦成為扭曲之物,而容易成為製品缺陷之原因。Although the film photomask has the advantages as described above, it is a problem to be solved that it must be mounted on the exposure device in a state in which it is sufficiently adhered to the glass plate. Even if the thin and soft film mask is pressed against the glass plate to make it close, air bubbles are likely to remain in it. If air bubbles remain, the pattern on the film photomask will be distorted in this part, so the transferred pattern will also become distorted, which will easily become the cause of product defects.
因此,將薄膜光罩推抵至玻璃板後,需要有作業者以抹刀抹過來將氣泡擠出至外側之麻煩的作業,而成為生產性提升之障礙。此外,以抹刀抹過時在薄膜光罩會發生形變(拉伸),薄膜光罩容易在扭曲的形態下被緊貼、固定於玻璃板。問題是,此形變是隨機地發生,因此難以控制。因此,容易造成被轉印之圖樣的形狀精度的降低。 本申請案之發明,是為了解決上述這樣薄膜光罩中的待解問題而研發,目的於設計成能夠使薄膜光罩容易地緊貼於透明板,而消弭被轉印之圖樣的形狀精度的降低之問題。 [解決問題之技術手段]Therefore, after pushing the film photomask onto the glass plate, it is necessary for the operator to wipe it with a spatula and squeeze out the air bubbles to the outside, which becomes an obstacle to the improvement of productivity. In addition, the film mask is deformed (stretched) when it is wiped with a spatula, and the film mask is easily adhered to and fixed to the glass plate in a distorted state. The problem is, this deformation happens randomly, so it is difficult to control. Therefore, the shape accuracy of the pattern to be transferred tends to be lowered. The invention of this application is developed to solve the unsolved problems in the above-mentioned film photomask, and the purpose is to design it so that the film photomask can be easily attached to the transparent plate, and eliminate the shape accuracy of the transferred pattern. problem of reduction. [Technical means to solve the problem]
為解決上述待解問題,本案申請專利範圍第1項所述之發明,係搭載於曝光裝置之光罩單元,具有下述構成,即,具備:
薄膜光罩;及
透明板,支承薄膜光罩;及
光罩框,將透明板在周邊部予以保持;
光罩框,具有可將薄膜光罩真空吸附之真空吸附孔,
在透明板的和薄膜光罩相向之面,設有形成到達該面的一邊的邊緣之洩氣空間之凹部或凸部。
此外,為解決上述待解問題,申請專利範圍第2項所述之發明,是在前述申請專利範圍第1項之構成中,具有下述構成,即,前述光罩框,在和前述透明板的端面相向之內側面,具有可被真空吸引之吸引口。
此外,為解決上述待解問題,申請專利範圍第3項所述之發明,是在前述申請專利範圍第1項之構成中,具有下述構成,即,其特徵為,前述透明板,具有將和前述薄膜光罩相向的表面與端面連接之斜向的面亦即倒角部,
前述部位,為前述洩氣空間到達至倒角部的途中之形狀。
此外,為解決上述待解問題,申請專利範圍第4項所述之發明,係具備:搬送系統,將基板搬送至曝光作業位置;及
如申請專利範圍第1項至第3項中任一項所述之光罩單元,配置於曝光作業位置;及
曝光單元,通過光罩單元內的前述薄膜光罩照射光而將基板曝光;之曝光裝置,具有下述構成,即,
設有除去前述薄膜光罩的表面的異物之清潔頭、及頭移動機構,
頭移動機構,為一面使清潔頭接觸前述薄膜光罩一面使其移動之機構,且為使清潔頭從前述透明板的和前述一邊相反側之一邊的邊緣朝向前述一邊的邊緣移動之機構。
此外,為解決上述待解問題,申請專利範圍第5項所述之發明,是在前述申請專利範圍第4項之構成中,具有下述構成,即,前述清潔頭,為在表面形成黏著層,一面接觸前述薄膜光罩一面旋轉之清潔滾筒。
此外,為解決上述待解問題,申請專利範圍第6項所述之發明,是在前述申請專利範圍第4項之構成中,具有下述構成,即,前述頭移動機構,為前述清潔頭趨近前述一邊的邊緣時使移動的速度減速之機構。
[發明之功效]In order to solve the above-mentioned problems to be solved, the invention described in
如以下說明般,按照本案申請專利範圍第1項所述之發明,透明板的和薄膜光罩相向之面的一邊的邊緣之吸附力被緩和,形成氣泡之氣體會通過洩氣空間被排出,故不會有氣泡的殘留,薄膜光罩會成為充分地緊貼於透明板之狀態。因此,便不會有欲轉印之圖樣的形狀精度降低之問題。
此外,按照申請專利範圍第2項所述之發明,通過洩氣空間而跑出的氣體會從吸引口迅速地被排出,故氣泡殘留防止之效果會更加提高。
此外,按照申請專利範圍第3項所述之發明,除上述效果外,洩氣空間到達至倒角部的途中,故會防止薄膜光罩在倒角部被強力吸附而阻礙氣體的脫逃。因此,氣泡殘留防止的效果會更加提高。
此外,按照申請專利範圍第4項所述之發明,除上述效果外,藉由頭移動機構使清潔頭移動來除去氣泡,故可同時進行氣泡的除去與清潔。再加上,能夠使薄膜光罩的拉伸具有重現性,可避免圖樣的轉印精度降低的問題發生。
此外,按照申請專利範圍第5項所述之發明,除上述效果外,清潔頭為在薄膜光罩上轉動之清潔滾筒,故不易對薄膜光罩施加強硬的力,對於防止薄膜光罩的形變來說係為合適。
此外,按照申請專利範圍第6項所述之發明,除上述效果外,清潔頭趨近一邊的邊緣時會減速,故沒有氣體的逆流之虞,不會使生產性降低而能夠更加提高氣泡殘留防止之效果。As explained below, according to the invention described in
接下來,說明本申請案之實施方式(實施形態)。
圖1為實施形態之光罩單元的正面截面概略圖,圖2為圖1之光罩單元的分解立體概略圖。
圖1及圖2所示之光罩單元,為搭載於曝光裝置之光罩單元。此光罩單元,具備薄膜光罩1、透明板2、及光罩框3。Next, embodiments (embodiments) of the present application will be described.
FIG. 1 is a schematic front sectional view of a mask unit according to an embodiment, and FIG. 2 is a schematic exploded perspective view of the mask unit in FIG. 1 .
The mask unit shown in FIGS. 1 and 2 is a mask unit mounted on an exposure device. This mask unit includes a
薄膜光罩1,為聚酯薄膜這類材質之透明的薄的薄膜,厚度為例如100μm~200μm程度。由於是搭載於曝光裝置之物,因此在薄膜光罩1描繪有欲轉印之圖樣(未圖示)。另,本例中,薄膜光罩1為方形。The
透明板2,為支承薄膜光罩1以便於曝光中保持沒有鬆弛之穩定形狀之構件。本實施形態中,透明板2為玻璃製(玻璃板)。透明板2,特別對於曝光波長之光而言必須充分透明,能夠使用以青板或白板的名稱市售之玻璃板。厚度,由確保機械性強度之觀點看來,較佳是訂為5mm~10mm程度。另,透明板2,為比薄膜光罩1還稍小之尺寸的方形。此外,作為透明板2,亦可使用丙烯酸樹脂這類玻璃以外的材質之物。The
圖3為從下側觀看透明板2及光罩框3之平面概略圖。圖3中,薄膜光罩省略圖示。光罩框3,為鋁或不鏽鋼等金屬製,如圖2及圖3所示般為方形的框狀。如圖1所示,光罩框3,在內緣具有高低差。高低差的高度,和透明板2的厚度近乎相等,透明板2是在周邊部位於此高低差內之狀態下被安裝於光罩框3。以下,將高低差當中和透明板2的端面相向之面31稱為內側面,和透明板2的板面相向之面32稱為板支承面。FIG. 3 is a schematic plan view of the
透明板2,於周邊部對於光罩框3藉由接著而被固定。亦即,如圖1所示,在透明板2的周邊部的上面與光罩框3的板支承面32之間,設有接著層20。另,在透明板2的端面與光罩框3的內側面31之間,存在有間隙30。以下,將此間隙30稱為周圍空間。The
薄膜光罩1,對於透明板2及光罩框3是藉由真空吸附而被固定。將光罩框3的支承薄膜光罩1之面33稱為薄膜支承面。如圖1所示,在薄膜支承面33,形成有真空吸附孔34。真空吸附孔34,為溝狀,朝光罩框3的各邊延伸而形成為周狀。The
真空吸附孔34,透過設於光罩框3內之連通路(詳細圖示略)35而連接至管連接部36。如圖1所示,光罩單元被使用時,在管連接部36會連接排氣管61而受到真空吸引。如此一來,薄膜光罩1會被真空吸附於光罩框3。真空吸附孔34為周狀的溝,故薄膜光罩1是周邊部以周狀吸附於光罩框3。
此外,在光罩框3的內側面31,形成有吸引口37,吸引口37連接至光罩框3內的連通路35。因此,周圍空間30亦受到真空排氣而成為負壓。The
本實施形態中,光罩單元是在水平的姿勢下被使用,薄膜光罩1藉由真空吸附而被保持於透明板2的下側。以下,為求說明方便,將透明板2的薄膜光罩1側之面稱為表面,和其相反側稱為背面。In this embodiment, the mask unit is used in a horizontal posture, and the
這樣的實施形態之光罩單元,具有用來防止前述的氣泡的發生之構造。具體而言,如圖1及圖2所示,在透明板2的表面形成有溝21。此溝21,係形成用來讓氣體逃逸的空間(以下稱為洩氣空間)以免在薄膜光罩1與透明板2之間形成氣泡。以下,將此溝21稱為洩氣溝。The mask unit of such an embodiment has a structure for preventing the above-mentioned generation of air bubbles. Specifically, as shown in FIGS. 1 and 2 ,
如圖2所示,洩氣溝21設有複數個,各洩氣溝21到達至透明板2的表面的右側的邊的邊緣。各洩氣溝21延伸之方向,和透明板2的朝左右延伸之邊的方向平行。
各洩氣溝21的左端,為比透明板2的中央還大幅靠向右側之位置。亦即,各洩氣溝21,是以橫越透明板2的表面的右端的留白(margin)區域之方式形成。
另,這樣的洩氣構21,當透明板2為玻璃板的情形下,能夠藉由磨削加工或化學蝕刻來形成。當透明板2為樹脂製的情形下,能夠藉由成模時使用之模具的形狀來實現。As shown in FIG. 2 , a plurality of
此外,如圖1所示,在透明板2的表面的周緣,形成有倒角部22。倒角部22,為連接透明板2的表面和端面之斜向的面。倒角部22,係避免透明板2的表面的周緣成為銳利的角而為防止薄膜光罩1的損傷之物。又,如圖1所示,各洩氣溝21,從表面的邊緣到達至倒角部22,倒角部22的途中成為終端。In addition, as shown in FIG. 1 , a
藉由這樣的各洩氣溝22,薄膜光罩1會在沒有氣泡的狀態下緊貼於透明板2。以下,有關這點參照圖4說明之。圖4為揭示有關洩氣溝21的作用之正面截面概略圖。圖4(A)揭示沒有洩氣溝21的參考例之光罩單元,(B)揭示實施形態之光罩單元。Through the
如上述般,若從排氣管61做真空排氣,則薄膜光罩1在周邊部會被真空吸附於光罩框3。此時,當為了使薄膜光罩1緊貼於透明板2,而以抹刀等抹過而欲將氣泡g擠出的情形下,在沒有洩氣構21的參考例中,如圖4(A)所示,薄膜光罩1於透明板2的表面的邊緣會被強力吸附,因此氣泡g難以被擠出。即使欲強行擠出,氣泡又會產生(移動)到別的地方。薄膜光罩1在透明板2的表面的邊緣的部分會被強力吸附之理由,在於靠近光罩框3的真空吸附孔34或吸引口37,因此藉由來自吸引口37的吸引而透明板2的端面與光罩框3的內側面31之間的空間特別會成為負壓,因此薄膜光罩1在透明板2的表面的周緣容易被強力吸附。As described above, when vacuum is exhausted from the
另一方面,在有洩氣溝21的實施形態之構造中,透明板2的表面的周緣之吸附力會被緩和,而且當以抹刀等抹過時形成氣泡g之氣體會通過洩氣溝21到達周圍空間30,而從吸引口37被排氣。因此,如圖4(B)所示,不會有氣泡g的殘留,薄膜光罩1成為充分緊貼於透明板2的表面之狀態。另,洩氣溝21的寬幅,例如為0.5mm~1mm程度,深度為0.05mm~0.3mm程度即可。此外,從周緣起算的長度為5mm~30mm程度。On the other hand, in the structure of the embodiment with the
上述實施形態之光罩單元的構造中,洩氣溝21到達至倒角部22這點,意義在於即使當提高真空吸附力而提高了薄膜光罩1的固定力的情形下仍不會使氣泡的殘留發生。有關這點,參照圖5說明之。圖5為揭示有關當洩氣溝21未到達倒角部22的情形下之問題之正面截面概略圖。In the structure of the photomask unit of the above-mentioned embodiment, the
如上述般,當薄膜光罩1被真空吸附於光罩框3時,周圍空間30亦會成為負壓,因此薄膜光罩1會成為朝周圍空間30之側突出而稍微彎曲的狀態。在此情形下,若洩氣溝21在透明板2的表面的邊緣終結,則薄膜光罩1會強力吸附於倒角部22,而可能在該處被封閉。在此情形下,形成氣泡之氣體會變得無法流至周圍空間30,而如圖5所示般氣泡g容易殘留。另一方面,若洩氣溝21到達至倒角部22的途中,則如圖4(B)所示般薄膜光罩1不會在倒角部22被強力吸附,氣泡不會殘留。As mentioned above, when the
但,若不將真空吸引力提高那麼多,則即使洩氣溝21未到達至倒角部22的途中也不會成為圖5所示這樣的狀態,而不構成問題。反過來說,洩氣溝21到達至倒角部22的途中之構造,有著能夠提高真空吸引力而更加提高薄膜光罩1的固定強度之優點。另,若要獲得此效果,當然地,洩氣溝21不必在倒角部22的途中終結,亦可連續至倒角部22與端面之交界即可。However, if the vacuum suction force is not increased so much, even if the
上述實施形態之光罩單元中,光罩框3的內側面31的吸引口37未必為必須。形成了氣泡之氣體,只要周圍空間30不是完全地被氣密密封之空間便會漏出。例如,會從將透明板2與光罩框3接合之接著層20所具有的微細的孔等被排出。此外,當供薄膜光罩1受到真空吸附之真空吸附孔34並非無終端的周狀,光罩薄膜1不是在將周圍空間30氣密密封的狀態下被真空吸附之情形下,氣體會從未密封之處漏出。但,跟這些比起來,設置吸引口37來吸引之構成中傳導性(conductance)會變高,故氣體會迅速地被排出。因此,氣泡殘留防止的效果會更加提高。另,當接著層20是間歇性地設置而氣體的傳導性高的情形下,亦可不設有吸引口37。但,接著強度會降低,故較佳是設置吸引口37並且將接著層20以無終端的周狀(非間歇性地)設置。In the mask unit of the above-mentioned embodiment, the
接下來,說明形成洩氣空間之其他形狀。圖6及圖7為揭示形成洩氣空間的其他形狀之概略圖。當中,圖6為揭示洩氣溝21的另一例之平面概略圖,圖7為揭示形成洩氣空間的例子之側面截面概略圖。Next, other shapes for forming the deflated space will be described. FIG. 6 and FIG. 7 are schematic diagrams illustrating other shapes for forming the deflated space. Among them, FIG. 6 is a schematic plan view illustrating another example of the
上述實施形態中的洩氣溝21,是於透明板2的表面的一邊的方向散佈之複數個之物,而全部以均等間隔設置,但亦可如圖6(1)所示,設有複數個由以窄間隔設置的複數個洩氣溝21所成之群組。此外,如圖6(2)(3)所示,亦可為分枝之洩氣溝21,亦可為設有複數個分枝之物。
上述實施形態之洩氣溝21,側面截面圖中會成為圖7(1)所示般的形狀,但除此之外,亦有藉由如圖7(2)所示般的凸部23來形成洩氣空間之情形。在此情形下,凸部23,可為朝向透明板2的表面的邊緣之長形狀(凸條),亦可為突起散佈之形狀。另,凹部或凸部,亦有僅1個也能形成洩氣空間之情形,亦可採用那樣的形狀。The
接下來,說明曝光裝置之發明之實施形態。
圖8為實施形態之曝光裝置的正面概略圖。圖8所示之曝光裝置,具備搬送身為曝光對象物的基板S之搬送系統4、及配置於曝光作業位置之光罩單元10、及通過光罩單元10的薄膜光罩1對基板S照射光而曝光之曝光單元5。
實施形態之曝光裝置,作為一例係為將撓性印刷基板用的基板這類帶狀的撓性的基板S予以曝光之裝置。是故,搬送系統4,為以捲對捲(roll-to-roll)方式搬送基板S之機構。Next, an embodiment of the invention of the exposure apparatus will be described.
Fig. 8 is a schematic front view of an exposure apparatus according to the embodiment. The exposure apparatus shown in FIG. 8 includes a
具體而言,搬送系統4,具備:捲繞有未曝光的基板S之送出側芯滾筒41、及從送出側芯滾筒41將基板S拉出之送出側夾送滾筒(pinch roller)42、及供曝光後的基板S捲繞之捲取側芯滾筒43、及將曝光後的基板S拉出而使捲取側芯滾筒43捲取之捲取側夾送滾筒44。另,將搬送系統4所致之基板S的饋送方向訂為X方向,將和其垂直之水平方向訂為Y方向。Y方向為基板S寬幅方向。將垂直於XY平面之方向訂為Z方向。Specifically, the
在送出側夾送滾筒42與捲取側夾送滾筒44之間,設定有曝光作業位置。實施形態之曝光裝置,為將基板S的兩面同時曝光之裝置,在曝光作業位置的基板S的兩側(本例中為上下)配置有光罩單元10與曝光單元5。是故,光罩單元10與曝光單元5係分別設有二個。An exposure work position is set between the sending-
上下的光罩單元10及曝光單元5,分別為同一構成之物,包夾曝光作業位置的基板S而呈上下對稱之配置。亦即,上側的光罩單元10以將薄膜光罩1面向下側之狀態配置,透明板(圖8中未圖示)在上側支承薄膜光罩1。下側的光罩單元10以將薄膜光罩1面向上側之狀態配置,透明板在下側支承薄膜光罩1。
裝置,具備用來安裝各光罩單元10之未圖示的平台(以下稱光罩平台)。各光罩單元10,將光罩框3對於光罩平台予以固定,藉此搭載於裝置。The upper and
此外,裝置,具備用來造出於各光罩單元10中薄膜光罩1被吸附於光罩框3的狀態之真空排氣系統6。真空排氣系統6的各排氣管61,如前述般連接至各光罩框3的管連接部36。真空排氣系統6,藉由後述的主控制器8而受到控制,但亦可藉由來自主控制器8的輸入部81的輸入而做手動控制。另,雖省略說明,但在各薄膜光罩1設有校準用的標記(以下稱光罩標記)。In addition, the device is provided with a
各曝光單元5,具備光源51、及將來自光源51的光照射至薄膜光罩1之光學系統52等。本實施形態之裝置為進行接觸(contact)曝光之裝置,各曝光單元5為對各薄膜光罩1照射平行光之單元。是故,光學系統52,包含準直透鏡。
為做接觸曝光,在各光罩單元10設有光罩移動機構7。各光罩移動機構7,為使光罩朝Z方向移動,而使光罩緊貼於基板S或於曝光後使其從基板S遠離之機構。另,各光罩移動機構7,為了曝光時之校準,還具備使各光罩單元10於XY方向移動而對於基板S做校準(定位)之機能。Each
此外,實施形態之曝光裝置,具備將附著於薄膜光罩1的異物除去之光罩清潔手段。清潔手段,針對上下的薄膜光罩1的各者設置。
各清潔手段,具備清潔頭、及在抵接至薄膜光罩1的狀態下使清潔頭移動藉此進行清潔之頭移動機構。本實施形態中,清潔頭為在表面具有黏著層之滾筒(以下稱清潔滾筒)91,頭移動機構為滾筒移動機構92。Moreover, the exposure apparatus of embodiment is equipped with the mask cleaning means which removes the foreign matter adhering to the
滾筒移動機構92的細節省略圖示,惟各清潔滾筒91係可繞著沿Y方向之旋轉軸而從動旋轉地被保持,滾筒移動機構92,為在透過軸承而以兩端保持著旋轉軸之臂,連結有X方向移動源與Z方向(上下方向)移動源而成之構造。例如,可設想一在底板上設置線性滑軌,將線性馬達設置於臂與線性滑軌之連結部分以便在受到線性滑軌導引的狀態下朝X方向移動,再對於底板設置空氣汽缸這類的移動源而使其朝Z方向移動之機構。The details of the
此外,如圖8所示,裝置,具備控制各部之主控制器8。在主控制器8,建置有控制使得裝置的各部以規定的手續動作之主順序程式(main sequence program)82。亦即,在主控制器8的記憶部80記憶有主順序程式82,而可藉由主控制器8的處理器(未圖示)來執行。另,主控制器8,具備用來做手動動作等之輸入部81。In addition, as shown in FIG. 8, the device includes a
接下來,針對上述曝光裝置的動作概略地說明之。
一對光罩單元10,於Z方向位於遠離基板S之待命位置。主順序程式82,對搬送系統4送出控制訊號,使基板S饋送恰好規定的行程。饋送完畢後,進行校準。在基板S設有校準用的標記(基板標記),將各薄膜光罩1的光罩標記與基板標記以未圖示之相機拍攝,光罩移動機構7遵照拍攝資料來使光罩單元10朝XY方向移動,藉此進行校準。Next, the operation|movement of the said exposure apparatus is demonstrated schematically.
A pair of
校準完畢後,主順序程式82,對光罩移動機構7送出控制訊號,使各光罩單元10朝向基板S移動,緊貼於薄膜光罩1。在此狀態下,主順序程式82,使各曝光單元5動作,通過各薄膜光罩1使光照射,進行曝光。
規定時間的曝光之後,主順序程式82,對光罩移動機構7送出控制訊號,使各光罩單元10朝遠離基板S之方向移動,返回當初的待命位置。然後,對搬送系統4送出控制訊號,再次進行規定的行程之饋送。其後,重覆上述動作。After the calibration is completed, the
重覆了上述動作後,當切換至相異品種的製品用之曝光的情形下,會進行薄膜光罩1的交換作業。實施形態之裝置,具備於此交換作業時使用之特別的構成。以下,針對這點說明之。
如圖8所示,在主控制器8,作為維護用的程式,建置有光罩維護程式83。光罩維護程式83,主要為薄膜光罩1的交換時執行之程式,藉由來自輸入部81之輸入而可執行。圖9為揭示有關曝光裝置所具備的光罩維護程式83之正面概略圖。After repeating the above-mentioned operations, when switching to exposure for a product of a different type, an exchange operation of the
如前述般,若品種相異則需要相異的薄膜光罩1,而會進行薄膜光罩1的交換。本實施形態中,薄膜光罩1的交換,是將光罩單元10拆卸而進行。
首先,作業者,停止吸附著薄膜光罩1之真空排氣系統6的動作,從光罩平台拆卸。然後,將先前使用的薄膜光罩1拆卸,將下一品種用的薄膜光罩1裝配至光罩框3。此時,將薄膜光罩1相對於光罩框3在規定位置披覆,以黏著膠帶等暫時固定。在光罩框3,形成有示意薄膜光罩1的裝配位置之標記,故以其作為指標來披覆、暫時固定。As mentioned above, if the type is different, a
然後,將交換了薄膜光罩1之光罩單元10如原先般固定至光罩平台。在此狀態下,作業者操作主控制器8的輸入部81,使真空排氣系統6動作。如此一來,薄膜光罩1會被真空吸附於光罩框3。在此狀態下,作業者操作輸入部81而執行光罩維護程式83。Then, the
光罩維護程式83,被編寫成對滾筒移動機構92送出控制訊號,以便進行使各清潔滾筒91一面接觸各薄膜光罩1一面朝各規定的方向以規定的速度移動之控制。一對清潔滾筒91為上下對稱,光罩維護程式83所做的動作亦上下對稱。作為一例,上側的清潔滾筒91的動作,如圖9所示。The
如圖9(1)所示,滾筒移動機構92,使清潔滾筒91上昇,以使上側的清潔滾筒91在被設定於上側的薄膜光罩1的左側之開始位置抵接至該薄膜光罩1。開始位置,為在X方向相當於透明板2的左緣之位置。滾筒移動機構92,從開始位置使清潔滾筒91朝向右緣移動(圖9(2))。滾筒移動機構92,使清潔滾筒91移動至被設定於薄膜光罩1的右側之結束位置,一旦到達了結束位置,便使其下降規定距離,而如圖9(3)所示送返至左側的當初的待命位置。結束位置,為在X方向相當於透明板2的右緣之位置。順序程式,對滾筒移動機構92送出控制訊號以使清潔滾筒91做出這樣的動作。As shown in FIG. 9(1), the
上述動作中,清潔滾筒91,藉由與薄膜光罩1之摩擦力而做從動旋轉。然後,藉由表面的黏著層,薄膜光罩1的表面的異物c會被除去。
又,如圖9所示,存在於薄膜光罩1與透明板2之間的形成氣泡g之氣體,會藉由清潔滾筒91而被擠出。此時,如前述般,氣體會通過洩氣溝21而迅速地被擠出。During the above actions, the cleaning
上述動作中重點在於,清潔滾筒91是在和設有洩氣溝21之側相反側的邊緣(開始位置)抵接至薄膜光罩1,而朝向設有洩氣溝21之側的邊緣(結束位置)移動。如果此動作顛倒,則清潔滾筒91將氣體擠出的終點不會有洩氣溝21,故會導致氣體逆流而氣泡g容易殘留。The important point in the above-mentioned action is that the cleaning
由上述說明可知,實施形態中的光罩維護程式83,係實現同時進行薄膜光罩1的清潔與氣泡除去之機能。藉由光罩維護程式83可進行氣泡除去,故作業者於薄膜光罩1的交換時無需以人工作業做氣泡除去。因此,薄膜光罩1的交換作業全體而言會在短時間完畢。這意味著裝置的運轉停止時間變短,有助於生產性的提升。As can be seen from the above description, the
另,清潔滾筒91將形成氣泡之氣體擠出時,在薄膜光罩1會發生些許的拉伸。這雖可說是薄膜光罩1扭曲,但薄膜光罩1的拉伸,若清潔滾筒91的對於薄膜光罩1之推壓力為一定而清潔滾筒91的移動速度為一定,則薄膜光罩1的拉伸亦為一定。也就是說,薄膜光罩1的拉伸有重現性,而可控制。因此,能夠採取將拉伸納入考量來形成薄膜光罩1的圖樣等之措施,而能夠避免圖樣的轉印精度降低的問題發生。In addition, when the cleaning
此外,依發明者之研究,清潔滾筒91的移動速度,較佳是於趨近設有洩氣溝21之側的邊緣時使其降低。其理由在於,若清潔滾筒91趨近設有洩氣溝21之側的邊緣,則形成氣泡之氣體的壓力有變高的傾向,若在到達至洩氣溝21前壓力變高到某一程度,則可能會導致氣體越過清潔滾筒91的往薄膜光罩1之抵接處而氣體。是故,針對清潔滾筒91,較佳是進行最初設為高速,其後設為低速之速度控制。此速度控制,亦藉由光罩維護程式83的順序來實現。另,雖亦可最初就設為低速,但所需時間會變長而有生產性降低之問題。若要揭示速度之一例,清潔滾筒91的速度(線速度),最先為100~150mm/秒程度,在洩氣溝21的位置或其稍微前方減速至1~10mm/秒程度。In addition, according to the research of the inventor, the moving speed of the cleaning
針對各清潔滾筒91,若重覆使用則會成為附著有許多異物之狀態,故會構成為交換成新的、或使異物移附至另外設置之移附滾筒。移附滾筒設於各清潔滾筒91的待命位置的附近,被做成為比各清潔滾筒91的黏著力還高黏著力之滾筒。移附滾筒被做成驅動旋轉之構成,構成為一面接觸各清潔滾筒91一面旋轉,使各清潔滾筒91上的異物移附至自身。Since each cleaning
上述曝光裝置之構成中,作為光罩單元10中的洩氣空間,不限於洩氣溝21,可採用圖6或圖7所示般的各種構成。
此外,清潔頭雖為清潔滾筒91,但亦可使用非滾筒狀之清潔頭(例如抹刀狀之物)。但,若使用在薄膜光罩1上轉動之清潔滾筒,則不易對薄膜光罩1施加強硬的力,對於防止薄膜光罩1的形變來說係為合適。另,針對清潔頭,亦有不藉由黏著力來除去異物者,而是使用將異物掃出而除去者之情形,亦有使用藉由靜電來吸附異物者之情形。In the configuration of the exposure apparatus described above, the vent space in the
另,光罩單元10中,對於光罩框3之透明板2的固定,亦可不為接著而為螺固等其他方法。例如,亦可設置鉗夾透明板2之構件,將該構件螺固於光罩框3藉此固定。但,當為接觸方式或近接(proximity)方式的情形下,較佳是在薄膜光罩1的前側(基板S之側)沒有比薄膜光罩1還突出之構件,就這點而言接著層20所致之固定為合適。In addition, in the
作為曝光裝置之實施形態,未必限於進行兩面曝光者,亦可為僅曝光基板S的單面者。在此情形下,僅在基板S的單側設有光罩單元10,針對1個薄膜光罩1設有進行清潔與氣泡除去之1個清潔滾筒91。
針對曝光的對象物,亦可不是上述般帶狀的基板S,而是以方形的基板作為對象物,亦可以非撓性之剛性的基板作為曝光對象物。是故,作為基板的搬送方式,除捲對捲方式外,亦可為單片式的搬送。單片式的裝置的情形下,設有成為和薄膜光罩相向的狀態之平台,在平台上載置基板。然後,光罩單元或平台移動,造出基板緊貼於薄膜光罩之狀態而進行曝光。
又,針對曝光的方式,除接觸方式外,亦可為近接方式,亦可為投影曝光方式。As an embodiment of the exposure apparatus, it is not necessarily limited to one that performs exposure on both sides, and one that exposes only one side of the substrate S may be used. In this case, the
1‧‧‧薄膜光罩
2‧‧‧透明板
21‧‧‧洩氣溝
3‧‧‧光罩框
30‧‧‧周圍空間
31‧‧‧內側面
32‧‧‧板支承面
33‧‧‧薄膜支承面
34‧‧‧真空吸附孔
35‧‧‧連通路
36‧‧‧管連接部
37‧‧‧吸引口
4‧‧‧搬送系統
5‧‧‧曝光單元
6‧‧‧真空排氣系統
61‧‧‧排氣管
7‧‧‧光罩移動機構
8‧‧‧主控制器
83‧‧‧光罩維護程式
91‧‧‧清潔滾筒
92‧‧‧滾筒移動機構1‧‧‧
[圖1] 實施形態之光罩單元的正面截面概略圖。 [圖2] 圖1之光罩單元的分解立體概略圖。 [圖3] 從下側觀看光罩框及玻璃板之平面概略圖。 [圖4] 揭示有關洩氣溝的作用之正面截面概略圖。 [圖5] 揭示有關當洩氣溝未到達倒角部的情形下之問題之正面截面概略圖。 [圖6] 揭示形成洩氣空間的其他形狀之概略圖。 [圖7] 揭示形成洩氣空間的其他形狀之概略圖。 [圖8] 實施形態之曝光裝置的正面概略圖。 [圖9] 揭示有關曝光裝置所具備的光罩維護程式之正面概略圖。[FIG. 1] A schematic front cross-sectional view of a mask unit according to an embodiment. [Fig. 2] An exploded perspective view of the mask unit in Fig. 1. [Fig. 3] A schematic plan view of the mask frame and glass plate viewed from the bottom. [Fig. 4] A schematic front cross-sectional view revealing the function of the air vent. [FIG. 5] A schematic front cross-sectional view showing a problem in a case where the vent groove does not reach the chamfered portion. [FIG. 6] A schematic diagram showing other shapes forming the deflated space. [FIG. 7] A schematic diagram showing other shapes forming the deflated space. [ Fig. 8 ] A schematic front view of an exposure device according to an embodiment. [Fig. 9] A schematic front view showing the mask maintenance program of the exposure device.
1‧‧‧薄膜光罩 1‧‧‧Thin film mask
2‧‧‧透明板 2‧‧‧Transparent board
3‧‧‧光罩框 3‧‧‧Reticle frame
10‧‧‧光罩單元 10‧‧‧Reticle unit
21‧‧‧洩氣溝 21‧‧‧Discharge ditch
91‧‧‧清潔滾筒 91‧‧‧Cleaning roller
c‧‧‧異物 c‧‧‧foreign matter
g‧‧‧氣泡 g‧‧‧bubble
Claims (7)
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JP2017233853A JP6986317B2 (en) | 2017-12-05 | 2017-12-05 | Mask unit and exposure equipment |
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TW111136667A TWI812492B (en) | 2017-12-05 | 2018-11-19 | Thin film mask exchange method and mask maintenance program |
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JP (1) | JP6986317B2 (en) |
KR (1) | KR20190066584A (en) |
CN (1) | CN110018609B (en) |
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CN112462575A (en) * | 2019-09-06 | 2021-03-09 | 台湾恒基股份有限公司 | Photoetching process method and plate positioning device thereof |
CN113885298B (en) * | 2021-09-22 | 2022-06-17 | 哈尔滨工业大学 | Magnetic suspension type mask table of photoetching machine |
KR102473207B1 (en) * | 2022-09-06 | 2022-11-30 | 정동훈 | Substrate mask arrangement apparatus for exposure apparatus |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0221652U (en) * | 1988-07-29 | 1990-02-14 | ||
TW200516355A (en) * | 2003-11-13 | 2005-05-16 | Dms Co Ltd | Mask supporting apparatus using vacuum and light exposing system, and method using the same |
TW200629972A (en) * | 2005-01-05 | 2006-08-16 | Samsung Sdi Co Ltd | Mask frame and method of fixing mask on the mask frame |
JP2009157249A (en) * | 2007-12-27 | 2009-07-16 | Orc Mfg Co Ltd | Exposure apparatus |
TW201030476A (en) * | 2009-02-02 | 2010-08-16 | Ushio Electric Inc | Workpiece platen and exposure apparatus using the same |
TW201126276A (en) * | 2010-01-27 | 2011-08-01 | Ushio Electric Inc | Light radiation device |
US8075730B2 (en) * | 2004-07-02 | 2011-12-13 | Tokyo Electron Limited | Apparatus for manufacturing a semiconductor device |
CN103092007A (en) * | 2013-02-06 | 2013-05-08 | 京东方科技集团股份有限公司 | Mask plate installing device of exposure machine |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6141151A (en) | 1984-08-02 | 1986-02-27 | Hitachi Chem Co Ltd | Resist pattern forming method |
JPH10161320A (en) * | 1996-11-28 | 1998-06-19 | Sanee Giken Kk | Exposure device |
JPH1130851A (en) | 1997-07-10 | 1999-02-02 | Nec Toyama Ltd | Film for photomask as well as photomask and its production |
JP2004271952A (en) * | 2003-03-10 | 2004-09-30 | Semiconductor Leading Edge Technologies Inc | Gas replacement mechanism and gas replacement method |
JP2005300753A (en) * | 2004-04-08 | 2005-10-27 | Toray Eng Co Ltd | Proximity aligner |
GB0620955D0 (en) * | 2006-10-20 | 2006-11-29 | Speakman Stuart P | Methods and apparatus for the manufacture of microstructures |
US7807001B2 (en) * | 2007-06-28 | 2010-10-05 | Eastman Kodak Company | Lamination device method for flexographic plate manufacturing |
KR100946996B1 (en) * | 2008-06-27 | 2010-03-10 | 한양대학교 산학협력단 | Apparatus for contacting mask and exposuring apparatus having the same |
JP5163401B2 (en) * | 2008-09-29 | 2013-03-13 | ウシオ電機株式会社 | Mask holding means for light irradiation device |
JP2009009166A (en) * | 2008-10-14 | 2009-01-15 | Toray Eng Co Ltd | Proximity aligner |
JP2014092768A (en) * | 2012-11-07 | 2014-05-19 | Adtec Engineeng Co Ltd | Adsorption plate |
KR20160064923A (en) * | 2014-11-28 | 2016-06-08 | 삼성전자주식회사 | Pellicle and exposure mask comprising the same |
-
2017
- 2017-12-05 JP JP2017233853A patent/JP6986317B2/en active Active
-
2018
- 2018-11-19 TW TW111136667A patent/TWI812492B/en active
- 2018-11-19 TW TW107140995A patent/TWI782139B/en active
- 2018-12-03 KR KR1020180153624A patent/KR20190066584A/en not_active Application Discontinuation
- 2018-12-05 CN CN201811477894.8A patent/CN110018609B/en active Active
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0221652U (en) * | 1988-07-29 | 1990-02-14 | ||
TW200516355A (en) * | 2003-11-13 | 2005-05-16 | Dms Co Ltd | Mask supporting apparatus using vacuum and light exposing system, and method using the same |
US8075730B2 (en) * | 2004-07-02 | 2011-12-13 | Tokyo Electron Limited | Apparatus for manufacturing a semiconductor device |
TW200629972A (en) * | 2005-01-05 | 2006-08-16 | Samsung Sdi Co Ltd | Mask frame and method of fixing mask on the mask frame |
JP2009157249A (en) * | 2007-12-27 | 2009-07-16 | Orc Mfg Co Ltd | Exposure apparatus |
TW201030476A (en) * | 2009-02-02 | 2010-08-16 | Ushio Electric Inc | Workpiece platen and exposure apparatus using the same |
TW201126276A (en) * | 2010-01-27 | 2011-08-01 | Ushio Electric Inc | Light radiation device |
CN103092007A (en) * | 2013-02-06 | 2013-05-08 | 京东方科技集团股份有限公司 | Mask plate installing device of exposure machine |
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Publication number | Publication date |
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TW201937271A (en) | 2019-09-16 |
CN110018609B (en) | 2024-03-26 |
JP2019101306A (en) | 2019-06-24 |
JP6986317B2 (en) | 2021-12-22 |
TWI812492B (en) | 2023-08-11 |
KR20190066584A (en) | 2019-06-13 |
TW202305501A (en) | 2023-02-01 |
CN110018609A (en) | 2019-07-16 |
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