TWI780800B - Wafer cleaning brush - Google Patents

Abstract

A wafer cleaning brush including a main body portion and a protruding portion. The protruding portion is connected to the main body portion. The protruding portion includes a wafer contact region and two side regions connected to two sides of the wafer contact region. The wafer contact region includes a valid die region and two invalid die regions connected to two sides of the valid die region. The height of the protruding portion located in the invalid die regions is lower than the height of the protruding portion located in the valid die region.

Description

Wafer cleaning brush

The embodiment of the present invention relates to a cleaning brush, and in particular to a wafer cleaning brush.

After the semiconductor manufacturing process is completed, the wafer is often cleaned to maintain the cleanliness of the wafer. For example, after a chemical mechanical polishing (CMP) process is performed on the wafer, a wafer cleaning brush is used to perform a cleaning process on the wafer. However, in the above-mentioned cleaning process, the wafer cleaning brushes are pressed by the edge of the wafer to generate cutting marks. As a result, when particles accumulate in the kerf, they will form a source of contamination, resulting in contamination of the wafer.

The invention provides a wafer cleaning brush, which can prevent cutting marks from being generated on the wafer cleaning brush.

The invention provides a wafer cleaning brush, which includes a main body and a protrusion. The protruding part is connected to the main part. The protrusion includes a wafer contact area and two side areas connected to two sides of the wafer contact area. The wafer contact area includes an effective grain area and two invalid grain areas connected to two sides of the effective grain area. The height of the protrusion located in the invalid die region is lower than the height of the protrusion located in the effective die region.

According to an embodiment of the present invention, in the above-mentioned wafer cleaning brush, the shape of the wafer cleaning brush is, for example, a roller shape.

According to an embodiment of the present invention, in the above-mentioned wafer cleaning brush, the height of the protrusion located in the invalid die area may be 10% to 30% lower than the height of the protrusion located in the effective die area.

According to an embodiment of the present invention, in the above-mentioned wafer cleaning brush, the height of the protrusions located in the side area may be lower than the height of the protrusions located in the effective die area.

According to an embodiment of the present invention, in the above-mentioned wafer cleaning brush, the height of the protrusion located in the side area may be 10% to 30% lower than the height of the protrusion located in the effective die area.

According to an embodiment of the present invention, in the above-mentioned wafer cleaning brush, the height of the protrusion located in the side area may be equal to the height of the protrusion located in the invalid die area.

According to an embodiment of the present invention, in the above-mentioned wafer cleaning brush, the main body part and the protruding part may be integrally formed.

According to an embodiment of the present invention, in the above-mentioned wafer cleaning brush, the protrusion may include at least one protrusion.

According to an embodiment of the present invention, in the above-mentioned wafer cleaning brush, the width of the invalid grain area may be 1% to 3% of the width of the wafer contact area.

According to an embodiment of the present invention, in the above-mentioned wafer cleaning brush, the material of the main body and the protrusion are, for example, foam or polyvinyl acetate (PVA).

Based on the above, in the wafer cleaning brush proposed by the present invention, the height of the protrusion in the invalid grain area of the wafer contact area is lower than the height of the protrusion in the effective grain area of the wafer contact area. high. Thereby, when the wafer is cleaned by the wafer cleaning brush, the pressure exerted by the edge of the wafer on the protruding portion in the invalid die area can be reduced, thereby preventing the generation of cut marks on the wafer cleaning brush. In this way, the problem of particles accumulating in the cut marks can be prevented. Therefore, when using the wafer cleaning brush to clean the wafer, the wafer can be prevented from being polluted.

In order to make the above-mentioned features and advantages of the present invention more comprehensible, the following specific embodiments are described in detail together with the accompanying drawings.

FIG. 1 is a perspective view of a wafer cleaning brush according to an embodiment of the present invention. Fig. 2 is a sectional view along the line I-I' in Fig. 1 . FIG. 3 is a cross-sectional view of a wafer using a wafer cleaning brush according to an embodiment of the present invention.

Referring to FIGS. 1 and 2 , the wafer cleaning brush 100 includes a main body 102 and a protrusion 104 . In some embodiments, please refer to FIG. 3 , the wafer cleaning brush 100 may be a wafer cleaning brush for cleaning the wafer W in post-CMP cleaning. In FIG. 3, although only the wafer cleaning brushes 100 on one side of the wafer W are shown, in fact, the wafer cleaning brushes 100 can be respectively arranged on both sides of the wafer W to clean the wafer W respectively. Clean the front and back. In some embodiments, when using the wafer cleaning brush 100 to clean the wafer W, the wafer cleaning brush 100 can be sleeved on a core (core) (not shown), wherein the core can drive the wafer cleaning brush 100 Make a turn. In addition, the shape of the wafer cleaning brush 100 is, for example, a roller shape. The material of the main body 102 is, for example, foam or polyvinyl acetate (PVA).

Referring to FIG. 1 and FIG. 2 , the protruding portion 104 is connected to the main body portion 102 . In some embodiments, the main body portion 102 and the protruding portion 104 can be integrally formed, but the invention is not limited thereto. In some other embodiments, the main body portion 102 and the protruding portion 104 may not be integrally formed. The material of the protrusion 104 is, for example, foam or polyvinyl acetate (PVA). The protrusion 104 may include at least one protrusion 106 . The shape of the protrusions 106 can be granular, strip, wave, spiral or a combination thereof. In this embodiment, the protruding portion 104 is exemplified to include a plurality of protruding objects 106 , and the shape of the protruding objects 106 is exemplified in a granular shape, but the present invention is not limited thereto.

Referring to FIGS. 1 and 2 , the protruding portion 104 includes a wafer contact region R1 and two side regions R2 connected to two sides of the wafer contact region R1 . In this embodiment, as shown in FIG. 3 , the wafer contact region R1 refers to the region where the protruding portion 104 contacts the wafer W when the wafer W is cleaned. In this embodiment, the side region R2 refers to the region of the protruding portion 104 outside the wafer contact region R1 . The wafer contact region R1 includes an effective die region R3 and two ineffective die regions R4 connected to two sides of the effective die region R3 . In this embodiment, the effective die region R3 may correspond to the region of the effective die on the wafer W, and the invalid die region R4 may correspond to the region of the invalid die on the wafer W. In some embodiments, the area of the dead die on the wafer W is usually located at the edge of the wafer W. In some embodiments, the width W2 of the ineffective die region R4 is 1% to 3% of the width W1 of the wafer contact region R1 . In some embodiments, the width W1 of the wafer contact region R1 may be equal to the diameter R of the wafer W, as shown in FIG. 3 .

As shown in FIG. 2 , the height H2 of the protrusion 104 located in the invalid die region R4 is lower than the height H1 of the protrusion 104 located in the active die region R3 . The height H2 of the protruding portion 104 in the invalid die region R4 may be 10% to 30% lower than the height H1 of the protruding portion 104 in the effective die region R3.

In addition, as shown in FIG. 2 , the height H3 of the protrusion 104 located in the side region R2 may be lower than the height H1 of the protrusion 104 located in the effective die region R3 . The height H3 of the protruding portion 104 in the side region R2 may be 10% to 30% lower than the height H1 of the protruding portion 104 in the effective die region R3. In some embodiments, the height H3 of the protruding portion 104 located in the side region R2 may be equal to the height H2 of the protruding portion 104 located in the invalid die region R4.

In some embodiments, as shown in FIG. 3 , when the wafer W is cleaned with the wafer cleaning brush 100 , the portion of the protruding portion 104 that is in contact with the wafer W will be pressed by the wafer W, resulting in a highly temporary reduce. In some embodiments, the wafer W can be cleaned by using the wafer cleaning brush 100 and the cleaning solution at the same time.

Based on the above embodiment, it can be seen that in the wafer cleaning brush 100, the height H2 of the protrusion 104 located in the invalid grain region R4 of the wafer contact region R1 is lower than the height H2 of the effective grain region R3 located in the wafer contact region R1 The height H1 of the protruding part 104 in. Thereby, as shown in FIG. 3, when the wafer W is cleaned by the wafer cleaning brush 100, the pressure exerted by the edge of the wafer W on the protruding portion 104 in the ineffective die region R4 can be reduced, thereby preventing Cut marks are generated on the wafer cleaning brush 100 . In this way, the problem of particles accumulating in the cut marks can be prevented. Therefore, when the wafer W is cleaned by the wafer cleaning brush 100 , contamination of the wafer W can be avoided.

To sum up, when using the wafer cleaning brush of the above-mentioned embodiment to clean the wafer, it can prevent the generation of cut marks on the wafer cleaning brush, so it can prevent the problem of particles accumulating in the cut marks, thereby avoiding the problem of wafer cleaning. Contaminated during cleaning.

Although the present invention has been disclosed above with the embodiments, it is not intended to limit the present invention. Anyone with ordinary knowledge in the technical field may make some changes and modifications without departing from the spirit and scope of the present invention. The scope of protection of the present invention should be defined by the scope of the appended patent application.

100: Wafer cleaning brush 102: Main body 104: protrusion 106: Prominence H1~H3: Height R: Diameter R1: wafer contact area R2: side area R3: effective grain area R4: invalid grain area W: Wafer W1, W2: width

FIG. 1 is a perspective view of a wafer cleaning brush according to an embodiment of the present invention. Fig. 2 is a sectional view along the line I-I' in Fig. 1 . FIG. 3 is a cross-sectional view of a wafer using a wafer cleaning brush according to an embodiment of the present invention.

100: Wafer cleaning brush

102: Main body

104: protrusion

106: Prominence

H1~H3: Height

R1: wafer contact area

R2: side area

R3: effective grain area

R4: invalid grain area

W1, W2: width

Claims (10)

A wafer cleaning brush, comprising: a main body; and a protrusion, connected to the main body, and including a wafer contact area and two side areas connected to both sides of the wafer contact area, wherein the The wafer contact area includes an effective grain area and two invalid grain areas connected to both sides of the effective grain area, and the bottom surface to the top of the protrusion located in the two invalid grain areas The height of the surface is lower than the height from the bottom surface to the top surface of the protrusion located in the effective grain area. The wafer cleaning brush as claimed in claim 1, wherein the shape of the wafer cleaning brush includes a roller shape. The wafer cleaning brush according to claim 1, wherein the height from the bottom surface to the top surface of the protrusions located in the two invalid grain areas is higher than that of the protrusions located in the effective grain area The height from the bottom surface to the top surface of the head is 10% to 30% lower. The wafer cleaning brush according to claim 1, wherein the height from the bottom surface to the top surface of the protrusions located in the two side regions is lower than that of the protrusions located in the effective grain area The height from the bottom surface to the top surface of the section. The wafer cleaning brush according to claim 4, wherein the height from the bottom surface to the top surface of the protrusions located in the two side regions is higher than that of the protrusions located in the effective grain area 10% to 30% lower height from the bottom surface to the top surface. The wafer cleaning brush according to claim 4, wherein the height from the bottom surface to the top surface of the protrusions located in the two side regions is equal to the height of the protrusions located in the two invalid grain regions. The height from the bottom surface of the protrusion to the top surface. The wafer cleaning brush according to claim 1, wherein the main body part and the protruding part are integrally formed. The wafer cleaning brush according to claim 1, wherein the protrusion comprises at least one protrusion. The wafer cleaning brush according to claim 1, wherein the width of the invalid grain area is 1% to 3% of the width of the wafer contact area. The wafer cleaning brush according to claim 1, wherein the material of the main body and the protrusion include foam or polyvinyl acetate.

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