CN203695489U - Wafer cleaning device - Google Patents
Wafer cleaning device Download PDFInfo
- Publication number
- CN203695489U CN203695489U CN201420031288.4U CN201420031288U CN203695489U CN 203695489 U CN203695489 U CN 203695489U CN 201420031288 U CN201420031288 U CN 201420031288U CN 203695489 U CN203695489 U CN 203695489U
- Authority
- CN
- China
- Prior art keywords
- threaded rod
- resilient sleeve
- cleaning device
- wafer cleaning
- supporter
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Cleaning Or Drying Semiconductors (AREA)
Abstract
The utility model provides a wafer cleaning device which at least comprises an elastic sleeve with the two ends sealed, a shaft rod, a first upholder, a second upholder, a first threaded rod and a second threaded rod. The shaft rod is arranged in the elastic sleeve, and the two ends of the shaft rod are fixed at the first sealed end and the second sealed end of the elastic sleeve respectively. The first upholder and the second upholder are arranged on the shaft rod in a penetrating and sleeved mode and support the inner surface of the elastic sleeve. The first threaded rod and the second threaded rod penetrate through the first sealed end and the second sealed end of the elastic sleeve respectively and are used for enabling the first upholder and the second upholder in the elastic sleeve to move left and right. The first threaded rod and the second threaded rod are connected with the corresponding first upholder and the second upholder respectively, and the first threaded rod and the second threaded rod are provided with rotary nuts which can be meshed with the first threaded rod and the second threaded rod respectively. The rotary nuts are fixed on the outer portions of the two sealed ends of the elastic sleeve. The first upholder and the second upholder in the elastic sleeve are adjusted to control the heights of bristles on the surfaces of the wafer cleaning device, so that the bristles make full contact with the surface, where residues are not evenly distributed, of a wafer, and a good cleaning effect is achieved.
Description
Technical field
The utility model relates to semiconductor preparation field, particularly relates to a kind of wafer cleaning device.
Background technology
In semiconductor fabrication process, along with the continuous upgrading of process technique, more and more higher to the requirement of flatness of wafer surface.And cmp technology can realize the planarization of the crystal column surface overall situation.In follow-up processing technology, because front road grinding step can bring and stain material to crystal column surface, these are stained material and comprise abrasive grain as ceria, aluminium oxide, gluey silica dioxide granule and be added into the residues such as surfactant, aggressive agent and other additives in abrasive material.In chemical mechanical planarization process, make these particles embed crystal column surface under mechanical pressure, for fear of reducing the reliability of device and device being introduced to defect, therefore the cleaning of subsequent handling becomes more important and strict.
As shown in Figure 1, this cleaning brush at least comprises traditional wafer cleaning brush cross-sectional view: resilient sleeve 11, be positioned at the some equally distributed bristle on axostylus axostyle 10 and the sleeve outer surface on sleeve central shaft.In the cleaning process of wafer, described axostylus axostyle 10 drives described resilient sleeve 11 to rotate under the driving of motor, the cleaning fluid that device carries can flow on the bristle on cleaning brush surface and between bristle, realizes and cleaning thereby bristle can compress crystal column surface and form contact friction with crystal column surface.
The wafer producing due to existing technique, the residue skewness of its surface of different products after cmp, the residue that is some crystal column surface centre is more concentrated, and the residue of some crystal column surface edge is more concentrated, this just causes the more difficult cleaning of residue in some crystal column surface centre, and the more difficult cleaning of the residue at some crystal round fringes position.And the sleeve-shaped of existing conventional clean brush is cylindrical, the part of cylindrical sleeve surface as shown in Figure 1 except bristle is more smooth, be described sleeve longitudinal section be shaped as rectangle, when sleeve when rotated, drive the bristle cleaning wafer surface of sleeve surface, and carry out clean surface residue wafer pockety with the cleaning brush of surfacing, final cleaning performance is to cause the cleaning performance of whole crystal column surface identical, do not reach and clean thoroughly for the more position of residue, done non-essential cleaning for the position that residue is less.Therefore,, for traditional wafer cleaning brush, can not reach comparatively ideal cleaning performance for different product wafers, and up to the present this problem also do not have better solution.
Utility model content
The shortcoming of prior art in view of the above, the purpose of this utility model is to provide a kind of wafer cleaning device, for solving prior art because the planarization on cleaning brush surface makes the halfway problem of cleaning causing for the hangover on wafer surface skewness of different product.
For achieving the above object and other relevant objects, the utility model provides a kind of wafer cleaning device, and described wafer cleaning device at least comprises:
The resilient sleeve of closed at both ends;
Be positioned at described resilient sleeve two ends and be fixed on the axostylus axostyle of described first, second blind end of resilient sleeve;
Be set on described axostylus axostyle and support first, second supporter of described resilient sleeve inner surface;
The first threaded rod and the second threaded rod for first, second supporter in resilient sleeve is moved left and right through first, second blind end of described resilient sleeve respectively;
Described the first threaded rod and the second threaded rod are connected to described first, second supporter corresponding with it;
On described the first threaded rod and the second threaded rod, have be respectively engaged with can spin nut; The described described resilient sleeve sealing outside, two ends of can spin nut being fixed on.
As a kind of preferred version of wafer cleaning device of the present utility model, being shaped as of described resilient sleeve is cylindrical.
As a kind of preferred version of wafer cleaning device of the present utility model, described first, second supporter be shaped as spherical or elliposoidal.
As a kind of preferred version of wafer cleaning device of the present utility model, the axial line of described resilient sleeve, axostylus axostyle and first, second supporter overlaps.
As a kind of preferred version of wafer cleaning device of the present utility model, the material of described first, second supporter comprises rubber, plastics or light-weight metal.
As a kind of preferred version of wafer cleaning device of the present utility model, the coefficient of sliding friction between above support and described axostylus axostyle is less than 0.1.
As a kind of preferred version of wafer cleaning device of the present utility model, the coefficient of sliding friction of above support and described resilient sleeve inner surface is less than 0.1.
As a kind of preferred version of wafer cleaning device of the present utility model, described resilient sleeve outer surface is provided with equally distributed some bristles.
As a kind of preferred version of wafer cleaning device of the present utility model, first, second blind end of described wafer cleaning device is respectively arranged with the 3rd threaded rod and the 4th threaded rod that first, second supporter for making in resilient sleeve moves left and right; On described the 3rd threaded rod and the 4th threaded rod, be respectively arranged be engaged with can spin nut, describedly can be fixed on described resilient sleeve sealing outside, two ends by spin nut.
As a kind of preferred version of wafer cleaning device of the present utility model, described wafer cleaning device comprises the rotation motor being connected with described axostylus axostyle.
As mentioned above, wafer cleaning device of the present utility model, can spin nut by what two supporters that can move left and right are set on the axostylus axostyle in described resilient sleeve inside and are used for that left and right pulls the threaded rod of above support and fixing described threaded rod.There is following beneficial effect: the surface that the supporter that makes to move left and right is used for supporting described resilient sleeve makes resilient sleeve surface that elastic deformation occur, thereby can adjust the high low degree of described resilient sleeve surface bristle, thereby make it fully form and fully contact the cleaning performance that reaches good with residue crystal column surface pockety.
Accompanying drawing explanation
Fig. 1 is the wafer cleaning device cross-sectional view of prior art.
Fig. 2 is wafer cleaning device cross-sectional view of the present utility model.
Fig. 3 is another kind of wafer cleaning device cross-sectional view of the present utility model.
Element numbers explanation
10,21 axostylus axostyles
11,20 resilient sleeves
22 bristles
23 rotation motors
24 first blind ends
25 second blind ends
201 first supporters
202 second supporters
203 first threaded rods
204 second threaded rods
205 first can spin nut
206 second can spin nut
207 the 3rd threaded rods
208 the 4th threaded rods
209 the 3rd can spin nut
210 the 4th can spin nut
The specific embodiment
By particular specific embodiment, embodiment of the present utility model is described below, person skilled in the art scholar can understand other advantages of the present utility model and effect easily by the disclosed content of this description.
Refer to Fig. 2 to Fig. 3.It should be noted that, the diagram providing in the present embodiment only illustrates basic conception of the present utility model in a schematic way, satisfy and only show with assembly relevant in the utility model in graphic but not component count, shape and size drafting while implementing according to reality, when its actual enforcement, kenel, quantity and the ratio of each assembly can be a kind of random change, and its assembly layout kenel also may be more complicated.
As shown in Figure 2, the utility model provides a kind of wafer cleaning device, described wafer cleaning device Elastic sleeve 20 is one and is shaped as columniform resilient sleeve, be that described resilient sleeve has certain thickness, and inner formation is hollow, the two ends of this sleeve are blind end, form the first blind end 24 and the second blind end 25 in Fig. 2, meanwhile, described resilient sleeve 20 has the some bristles 22 that are uniformly distributed on its outer surface; Axostylus axostyle 21 is through the first blind end 24 and second blind end 25 of described resilient sleeve 20, and the two ends of this axostylus axostyle 21 are individually fixed in two blind ends of described resilient sleeve 20; The axial line of sleeve described in the present embodiment and described axostylus axostyle overlaps each other.
As shown in Figure 2, there are two supporters at described axostylus axostyle upper sleeve through, i.e. the first supporter 201 in figure and the second supporter 202.The shape of described two supporters can be spherical, can be also elliposoidal.The first supporter 201 described in the present embodiment and the second supporter 202 adopt respectively spherical.Described first, second supporter is respectively to adopt the mode wearing to be positioned on described axostylus axostyle 21, the aperture of wherein said first, second supporter equals the diameter of described axostylus axostyle, also can be greater than the diameter of described axostylus axostyle, described two supporters can be slidably reciprocated on described axostylus axostyle; Meanwhile, first, second supporter described in the present embodiment and the coefficient of sliding friction of described axostylus axostyle contact portion are less than 0.1, make first, second supporter and described axostylus axostyle contact portion in sliding process be subject to less wearing and tearing as far as possible.In the present embodiment, the axial line of described the first supporter 201 and the second supporter 202 overlaps with the axial line of described axostylus axostyle and described resilient sleeve.
The overall diameter of described the first supporter and the second supporter is all greater than the interior diameter of described resilient sleeve 20.Described first, second supporter plays the effect of support to the surface of described resilient sleeve, that is to say that described first, second supporter can make the inner surface generation elastic deformation of resilient sleeve 20, thereby drive its outer surface generation deformation to such an extent as to the fluctuating position of described bristle 22 on described resilient sleeve outer surface can be adjusted; As mentioned above described first, second supporter can slidably reciprocate on axostylus axostyle, in order to reduce the inner surface of resilient sleeve described in sliding process due to the wearing and tearing that are subject to sliding friction and bring, so in this enforcement, the coefficient of sliding friction of described first, second supporter and described resilient sleeve inner surface is less than 0.1.In the present embodiment, the material of described first, second supporter adopts rubber to make.In addition, the material of described two supporters also can adopt the embodiment of plastics or light-weight metal also within the utility model scope required for protection.
As shown in Figure 2, the first threaded rod 203 and the second threaded rod 204 pass respectively the first blind end 26 and second blind end 27 of described resilient sleeve 20.Entering described first threaded rod 203 of described resilient sleeve inside and one end of the second threaded rod 204 is connected on corresponding with it the first supporter 201 and the second supporter 202, the other end of described the first threaded rod 203 and the second threaded rod 204 is exposed at the outside of 20 liang of blind ends of described resilient sleeve, simultaneously owing to being all carved with screw thread on described the first threaded rod 203 and the second threaded rod 204, therefore be individually fixed in can be engaged on described the first threaded rod 203 and the second threaded rod 204 by spin nut on described resilient sleeve 20 first blind ends 24 and the second blind end 25, due to described can spin nut be two blind ends that are fixed on described resilient sleeve outside, therefore the described blind end that can spin nut can only be close to described resilient sleeve around the axial line of himself rotates, and can not move around along described threaded rod.Described can spin nut be for moving left and right back and forth described the first supporter 201 and the second supporter 202, when turn on described threaded rod can spin nut time, with described first, second supporter can spin nut corresponding and that be connected with first, second threaded rod respectively will be in the hollow part of resilient sleeve inside, and be set on described axostylus axostyle and move to and fro, due to the supporting role of first, second supporter, make the surface of described resilient sleeve 20 that deformation occur, can fluctuations thereby reach its surperficial bristle position.
As shown in Figure 2, rotation motor 23 is connected with one end of described axostylus axostyle, in the time that wafer cleaning device of the present utility model is started working, first start central control system, the effect of described central control system is to collect by computer the distribution situation that needs the hangover on wafer surface cleaning, then the distribution situation of this residue is fed back to transmission control system, described transmission control system demonstrates the distribution situation of crystal column surface.Then the situation that engineer can distribute according to hangover on wafer surface decides position how to adjust described first, second supporter.If the distribution that the distribution situation of the hangover on wafer surface of learning from described transmission control system is residue concentrates on the central part of crystal column surface.Engineer need to by the first threaded rod described in described wafer cleaning device and the second threaded rod corresponding can spin nut turn, respectively described first, second supporter is moved near described resilient sleeve end positions region, make the bristle on described resilient sleeve surface present center projections, the bristle that is positioned at resilient sleeve surface middle section makes described resilient sleeve outer surface middle section projection owing to being supported by its inner supporter, thereby drives the bristle projection that is positioned at its middle section.So just can effectively remove the more middle section part that concentrates on crystal column surface of residue.Equally, if the residue of learning from described transmission system is distributed as the situation of the fringe region that concentrates on described crystal column surface, engineer is as long as regulating that described first, second threaded rod is corresponding can spin nut, the middle position that makes first, second supporter move to described resilient sleeve can make the bristle projection of described resilient sleeve outer surface central part, thereby reaches the effect of cleaning described wafer center position residue.
As shown in Figure 3, the threaded rod that different from above-described embodiment is in the present embodiment increases to 4 by above two to another embodiment of the present utility model, and two threaded rods that newly increase are and first, second threaded rod corresponding the 3rd, the 4th threaded rod respectively.The described the 3rd, the 4th can spin nut and described first, second can spin nut respectively about described axostylus axostyle symmetry, described the first threaded rod and the 3rd threaded rod lay respectively at the both sides of described axostylus axostyle, the two is about described axostylus axostyle symmetry; Described the second threaded rod and the 4th threaded rod lay respectively at the both sides of described axostylus axostyle, and the two is about described axostylus axostyle symmetry.Described the 3rd, the 4th threaded rod in the present embodiment distributes respectively with first, second threaded rod about described axostylus axostyle symmetry, described the 3rd, the 4th threaded rod in other distribution situations of two blind ends of resilient sleeve also within the utility model scope required for protection.Simultaneously the present embodiment increase distinguish the corresponding the 3rd, the 4th with described the 3rd, the 4th threaded rod can spin nut, the described the 3rd, the 4th can be engaged on respectively on described the 3rd, the 4th threaded rod by spin nut, and with described first, second can the same outside that is individually fixed in two blind ends of described resilient sleeve of spin nut.Why increase with described first, second threaded rod respectively corresponding the 3rd, the 4th threaded rod and with first, second can spin nut respectively corresponding object that can spin nut be that described first, second supporter can be carried out more reposefully in the process moving left and right.But in the process of the present embodiment operation, respectively when mobile described the first supporter, described in turn simultaneously first can spin nut and the 3rd can spin nut, and described the first supporter is moved to same direction; Equally in the time of mobile described the second supporter, described in turn simultaneously second can described the second supporter be moved spin nut to same direction by spin nut and the 4th.
In sum, wafer cleaning device of the present utility model, can spin nut by what two supporters that can move left and right are set on the axostylus axostyle in described resilient sleeve inside and are used for that left and right pulls the threaded rod of above support and fixing described threaded rod.There is following beneficial effect: the surface that the supporter that makes to move left and right is used for supporting described resilient sleeve makes resilient sleeve surface that elastic deformation occur, thereby can adjust the high low degree of described resilient sleeve surface bristle, thereby make it fully form and fully contact the cleaning performance that reaches good with residue crystal column surface pockety.So the utility model has effectively overcome various shortcoming of the prior art and tool high industrial utilization.
Above-described embodiment is illustrative principle of the present utility model and effect thereof only, but not for limiting the utility model.Any person skilled in the art scholar all can, under spirit of the present utility model and category, modify or change above-described embodiment.Therefore, have in technical field under such as and conventionally know that the knowledgeable modifies or changes not departing from all equivalences that complete under spirit that the utility model discloses and technological thought, must be contained by claim of the present utility model.
Claims (10)
1. a wafer cleaning device, is characterized in that, described wafer cleaning device at least comprises:
The resilient sleeve of closed at both ends;
Be positioned at described resilient sleeve two ends and be fixed on the axostylus axostyle of described first, second blind end of resilient sleeve;
Be set on described axostylus axostyle and support first, second supporter of described resilient sleeve inner surface;
The first threaded rod and the second threaded rod for first, second supporter in resilient sleeve is moved left and right through first, second blind end of described resilient sleeve respectively;
Described the first threaded rod and the second threaded rod are connected to described first, second supporter corresponding with it;
On described the first threaded rod and the second threaded rod, have be respectively engaged with can spin nut; The described described resilient sleeve sealing outside, two ends of can spin nut being fixed on.
2. wafer cleaning device according to claim 1, is characterized in that: being shaped as of described resilient sleeve is cylindrical.
3. wafer cleaning device according to claim 1, is characterized in that: described first, second supporter be shaped as spherical or elliposoidal.
4. according to the wafer cleaning device described in claim 2 or 3, it is characterized in that: the axial line of described resilient sleeve, axostylus axostyle and first, second supporter overlaps.
5. wafer cleaning device according to claim 1, is characterized in that: the material of described first, second supporter comprises rubber, plastics or light-weight metal.
6. wafer cleaning device according to claim 1, is characterized in that: the coefficient of sliding friction between above support and described axostylus axostyle is less than 0.1.
7. wafer cleaning device according to claim 1, is characterized in that: the coefficient of sliding friction of above support and described resilient sleeve inner surface is less than 0.1.
8. wafer cleaning device according to claim 1, is characterized in that: described resilient sleeve outer surface is provided with equally distributed some bristles.
9. wafer cleaning device according to claim 1, is characterized in that: first, second blind end of described wafer cleaning device is respectively arranged with the 3rd threaded rod and the 4th threaded rod that first, second supporter for making in resilient sleeve moves left and right; On described the 3rd threaded rod and the 4th threaded rod, be respectively arranged be engaged with can spin nut, describedly can be fixed on described resilient sleeve sealing outside, two ends by spin nut.
10. wafer cleaning device according to claim 1, is characterized in that: described wafer cleaning device comprises the rotation motor being connected with described axostylus axostyle.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420031288.4U CN203695489U (en) | 2014-01-17 | 2014-01-17 | Wafer cleaning device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420031288.4U CN203695489U (en) | 2014-01-17 | 2014-01-17 | Wafer cleaning device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203695489U true CN203695489U (en) | 2014-07-09 |
Family
ID=51045988
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420031288.4U Expired - Fee Related CN203695489U (en) | 2014-01-17 | 2014-01-17 | Wafer cleaning device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203695489U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI780800B (en) * | 2021-06-30 | 2022-10-11 | 力晶積成電子製造股份有限公司 | Wafer cleaning brush |
-
2014
- 2014-01-17 CN CN201420031288.4U patent/CN203695489U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI780800B (en) * | 2021-06-30 | 2022-10-11 | 力晶積成電子製造股份有限公司 | Wafer cleaning brush |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN107398779A (en) | A kind of final polishing method of wafer | |
| CN105689343A (en) | Cleaning machine for gas spring pressure pipe | |
| CN203695489U (en) | Wafer cleaning device | |
| CN107257639A (en) | The Archimedes's brush cleaned for semiconductor | |
| CN203887683U (en) | Grinding head and grinding device | |
| CN204247115U (en) | Wall mixer is scraped in a kind of powder stuffing surface treatment | |
| CN203992195U (en) | The screw moulding dental lamina of integral type | |
| CN206345455U (en) | A kind of base plate transfer device | |
| CN204544896U (en) | The clear swab of enamel insulated aluminium wire | |
| CN204135861U (en) | A kind of small-sized steel ball automatic polishing machine | |
| CN103846250A (en) | Filter liquid discharging device and liquid discharging method of ultrasonic washing trough | |
| CN204102870U (en) | A kind of cleaning device of wafer placement platform | |
| CN105364699A (en) | A chemical mechanical polishing method and a chemical mechanical polishing apparatus | |
| CN203620984U (en) | Wafer cleaning brush and wafer cleaning device | |
| CN203664279U (en) | Wafer cleaning brush | |
| CN203887682U (en) | Grinding head and grinding device | |
| WO2014193880A3 (en) | Liquid cleaning composition with abrasives | |
| CN104353650A (en) | Cleaning device for pipelines | |
| CN207155495U (en) | A kind of sanding apparatus of wafer cleaning brush | |
| CN203678772U (en) | Wafer cleaning device | |
| CN106272530A (en) | A kind of friction-type robot ball ancillary equipment | |
| CN204118044U (en) | A kind of crystal grain cleaning device | |
| CN203936803U (en) | A kind of slurry conveyer | |
| CN106737042A (en) | The application method of pipe fitting skin grinder | |
| CN103509657A (en) | Component surface cleaning method |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140709 Termination date: 20190117 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |