CN116779493B - Wafer surface treatment mechanism and wafer surface treatment equipment - Google Patents

Abstract

The invention provides a wafer surface treatment mechanism and wafer surface treatment equipment, wherein the wafer surface treatment mechanism comprises a water supply system, a brush roller support and at least two brush rollers rotatably arranged on the brush roller support, at least two brush sleeves are sequentially arranged on the periphery of at least one brush roller along the axial direction, at least two brush sleeves positioned on the brush roller have different thermal expansion coefficients, the water supply system comprises a water storage chamber and a water supply channel, and the water supply channel is communicated with the water storage chamber and forms a water outlet arranged towards the brush sleeves. After the brush sleeve is deformed in a swelling way under the influence of temperature after liquid is obtained, different brush sleeves in the same brush roll deform and change in volume to different degrees, so that different brush sleeves are in contact with wafers in different conditions, and all the brush sleeves on the whole brush roll are not in contact with the wafers at the same time, thereby shortening the length of the area, which is in contact with the wafers, of the brush roll, meaning that the grooves between the brush roll and the wafers are shorter, and the shorter grooves mean that impurities and waste liquid remained in the grooves are smaller.

Description

Wafer surface treatment mechanism and wafer surface treatment equipment

Technical Field

The present disclosure relates to semiconductor processing, and particularly to a wafer surface processing mechanism and a wafer surface processing apparatus.

Background

Wafers are a widely used material in the fields of photovoltaic products, semiconductor devices, etc. The wafer is polished after cutting the ingot into a plurality of sheet-like structures to obtain a round thin plate-like wafer, and in order to improve the quality and reliability of a product made of the wafer, the wafer needs to be cleaned with a cleaning liquid.

The prior wafer surface treatment equipment comprises a brush roller and a driving mechanism, wherein the brush roller is used for brushing the round end face of a wafer, the driving mechanism comprises a rotatable rotating wheel, the rotating wheel contacts the periphery of the wafer to drive the wafer to rotate, and the brush roller repeatedly brushes the wafer along with the reciprocating rotation of the wafer.

The wafer surface treatment equipment is difficult to fully meet the current requirements, impurities and waste cleaning liquid are easy to accumulate in the grooves between the brush roller and the wafer, the impurities and the waste cleaning liquid are difficult to discharge, the wafer cleaning quality does not reach the standard, the residual impurities and the waste cleaning liquid are required to be removed by additional time, and the wafer cleaning efficiency is low.

Disclosure of Invention

In view of the foregoing, it is desirable to provide a wafer surface treatment mechanism that can reduce impurity and waste residue and improve wafer cleaning efficiency and cleaning efficiency.

The wafer surface treatment mechanism provided by the invention comprises a water supply system, a brush roller support and at least two brush rollers rotatably arranged on the brush roller support, wherein at least two brush sleeves are sequentially arranged on the periphery of at least one brush roller along the axial direction, the at least two brush sleeves positioned on the brush roller have different thermal expansion coefficients, the water supply system comprises a water storage chamber and a water supply channel, and the water supply channel is communicated with the water storage chamber and forms a water outlet arranged towards the brush sleeves.

Compared with the prior art, the wafer surface treatment mechanism has the following beneficial effects:

the method comprises the steps of supplying liquid with a certain temperature to the brush sleeve through a water supply system, expanding and shrinking the brush sleeve to obtain the liquid under the influence of the temperature, deforming and changing the volume of different brush sleeves to different degrees, wherein the brush sleeve with smaller volume is more difficult to even contact with the end face of a wafer, the brush sleeve with larger volume is more difficult to contact with the end face of the wafer, the priority of the brush sleeve with larger volume is higher, the strength is larger, the contact condition of different brush sleeves and wafers in the same brush roll is different, and all brush sleeves on the whole brush roll are not contacted with the wafers at the same time, so that the length of the contact area between the brush roll and the wafers is shortened, the grooves between the brush roll and the wafers are shorter, and the shorter grooves mean that impurities and waste liquid remained in the brush roll and the wafers are fewer.

In one embodiment, at least three brush sleeves are arranged on the periphery of at least one brush roller along the axial direction, and the brush sleeves positioned on the brush roller are sequentially arranged according to the magnitude sequence of the thermal expansion coefficients.

When the brush roller brushes the wafer, the pressure of the brush roller acting on the end face of the wafer through the brush sleeve is gradually reduced along the direction close to the axis of the wafer and gradually increased along the direction close to the periphery of the wafer, so that waste liquid and impurities accumulated near the edge of the wafer along with the rotation of the wafer can be more thoroughly cleaned.

In one embodiment, the water supply channel comprises a centrifugal drainage section arranged on the brush roller, and the water outlet is arranged on the periphery of the brush roller and communicated with the centrifugal drainage section.

So set up, along with the brush roll rotates, the liquid that flows into centrifugal drainage section can flow to the brush cover through the delivery port more fast under centrifugal acceleration's effect, therefore the efficiency that liquid flows and the brush cover is the efficiency improvement of deformation shrink under liquid temperature for the brush cover changes the volume fast in the short time, and centrifugal drainage section itself also can form certain negative pressure under centrifugal acceleration's effect simultaneously, thereby attracts the liquid of water storage room to continuously flow to centrifugal drainage section.

In one embodiment, the brush roller is of a hollow structure, and the cavity of the brush roller forms a centrifugal drainage section; and/or the water storage chamber is arranged on the brush roller.

So set up, water storage room exhaust liquid can flow and be obtained by the brush cover in the brush roll, can prevent that liquid from leaking outward, improves the brush cover and obtains efficiency to liquid.

In one embodiment, the number of the water outlets is two or more, the water outlets are sequentially arranged along the axial direction of the brush roller, and any one brush sleeve corresponds to at least one water outlet.

So set up, every brush cover can all obtain liquid through the delivery port that corresponds with it, and every brush cover carries out deformation and volume change of different degree under the liquid temperature effect, and the variable that influences the brush cover volume is less, and the contact condition of brush cover volume and wafer depends on the coefficient of thermal expansion of brush cover.

In one embodiment, the water storage chamber comprises a cold water chamber and a hot water chamber, the water supply channel comprises a cold water channel communicated with the cold water chamber and a hot water channel communicated with the hot water chamber, the water outlet comprises a cold water port arranged on the cold water channel and a hot water port arranged on the hot water channel, and the cold water port and the hot water port are arranged towards the brush sleeve.

So set up, can select to supply hot water or cold water to the brush cover as required, make the brush cover produce different deformation and volume change under the influence of different temperatures to the slot between messenger's brush roll and the wafer can appear different length under the influence of different temperatures, has realized that the contact area between brush roll and the wafer is adjustable.

In one embodiment, the water supply system further comprises a temperature regulator for regulating the temperature within the water storage chamber.

By the arrangement, the temperature of the liquid can be regulated by the temperature regulator, so that the volume of the brush sleeve after the liquid is obtained is changed, and the aim of regulating the brushing force of the brush roller on the wafer is fulfilled.

The invention also provides wafer surface treatment equipment, which comprises a driving mechanism and the wafer surface treatment mechanism, wherein the driving mechanism comprises a driving sleeve and a driven wheel, the driving sleeve and the driven wheel are circumferentially arranged at intervals around a preset material rotating axis to form a material carrying area for carrying a round wafer, and when the driving sleeve and the driven wheel carry the wafer, the material rotating axis coincides with the axis of the wafer.

The wafer surface treatment equipment provided by the invention realizes the adjustable length of the groove between the brush roller and the wafer, when impurities and waste liquid remained in the groove are required to be further removed, the brush sleeve is deformed and the volume is changed in a mode of supplying liquid with a certain temperature to the brush sleeve by the water supply system, so that different contact conditions are generated between the wafer and different brush sleeves, the length of the groove between the brush roller and the wafer is shortened, and the impurities and the waste liquid remained in the groove are fewer.

In one embodiment, the dimension of any one brush sleeve in the vertical direction of the material transferring axis is smaller than the material carrying diameter, and the material carrying diameter is the maximum dimension of the material carrying area in the vertical direction of the material transferring axis.

So arranged, the length of the contact section formed between any brush sleeve and the wafer is smaller than the diameter of the wafer.

In one embodiment, the wafer surface treatment mechanism further comprises an adjusting unit connected with the brush roller support, a cleaning driving piece connected with the brush roller and a mechanical sensor connected with the cleaning driving piece, wherein the mechanical sensor is used for measuring the load of the cleaning driving piece, and the adjusting unit is used for driving the brush roller support to move so as to change the pose of the brush roller relative to the material carrying area.

The device is arranged in such a way, the measured value of the mechanical sensor is used as an index for judging the brushing force between the brush roller and the wafer, the contact pressure between the brush roller and the wafer can be changed by using the adjusting unit, the contact pressure between the brush roller and the wafer is represented by the measured result of the mechanical sensor, and the brushing force between the brush roller and the wafer is in a proper range by adjusting, so that the cleaning effect and the cleaning efficiency are both facilitated.

In one embodiment, the number of the brush roller brackets and the number of the brush rollers are two, the two brush rollers are respectively arranged at two ends of the material carrying area and are respectively rotatably arranged on the two brush roller brackets, the adjusting unit is connected with the two brush roller brackets, and the adjusting unit is configured to drive the two brush roller brackets to swing relatively so as to change the included angle of the axes of the two brush rollers; and/or the adjusting unit is configured to drive the two brush roller brackets to relatively translate so as to change the distance between the two brush rollers.

So set up, adjust the axis contained angle of two brush rolls can adjust the brush roll and act on the pressure distribution area of wafer, adjust the interval of two brush rolls can adjust the brush roll and act on the pressure size of wafer.

Drawings

FIG. 1 is a schematic perspective view of a wafer surface treatment apparatus according to one embodiment of the present invention at a first viewing angle;

FIG. 2 is a schematic perspective view of a wafer surface treatment apparatus according to one embodiment of the present invention at a second perspective;

FIG. 3 is a schematic view showing a partial structure of a wafer surface treating apparatus according to an embodiment of the present invention;

fig. 4 is a schematic view of an arrangement of a brushroll and a loading area in accordance with one embodiment of the present invention.

Reference numerals: 100. a wafer surface treatment device; 10. a driving mechanism; 11. a driving unit; 111. a drive sleeve; 112. a material transferring driving piece; 113. an output shaft; 12. a wafer mounting unit; 121. driven wheel; 122. a wheel body bracket; 20. a wafer surface treatment mechanism; 21. a brush roller; 211. a contact section; 22. a brush roller bracket; 23. an adjusting unit; 24. a cleaning drive; 25. a brush sleeve; 30. a loading area; 40. a water supply system; 41. a water storage chamber; 42. a water supply channel; 420. a centrifugal drainage section; 43. a water outlet; 50. a base; 200. a wafer.

Detailed Description

The following description of the embodiments of the present invention will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are only some, but not all embodiments of the invention. All other embodiments, which can be made by those skilled in the art based on the embodiments of the present invention without making any inventive effort, are intended to fall within the scope of the present invention.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used herein in the description of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. The term "or/and" as used herein includes any and all combinations of one or more of the associated listed items.

The present invention provides a wafer surface treatment mechanism 20, and also provides a wafer surface treatment apparatus 100 including the wafer surface treatment mechanism 20. The wafer surface treatment apparatus 100 is used to clean impurities on the surface of a wafer, fine grains, and crystallization of a polishing liquid. The wafer mentioned in the invention is a material widely applicable to the fields of photovoltaic product manufacture, semiconductor device manufacture and the like, and is of a round thin plate-like structure and is obtained by cutting a crystal bar. After dicing the wafer, the polishing tool inevitably leaves dirt on the wafer surface during the polishing process, the polishing liquid is crystallized on the wafer surface after being dried, the wafer surface needs to be cleaned and removed, and the fine grains, dust and other impurities during dicing are also attached to the wafer surface.

The wafer surface treatment mechanism 20 is a mechanism for contacting a wafer and applying pressure to the wafer surface in the wafer surface treatment apparatus 100. In order to clearly demonstrate the structural composition, the principle of operation, and the cooperative coordination of the wafer surface treatment mechanism 20 and other devices in the wafer surface treatment apparatus 100, the wafer surface treatment mechanism 20 of the present invention is described below.

Referring to fig. 1-2, a wafer surface treatment apparatus 100 of the present invention includes a driving mechanism 10, a wafer surface treatment mechanism 20, and a spraying mechanism (not shown). The driving mechanism 10 comprises a driving unit 11 and a wafer carrying unit 12, wherein the driving unit 11 is used for driving the wafer 200 to rotate around the axis of the wafer 200, the wafer carrying unit 12 is used for carrying the wafer 200, and the wafer 200 is supported when the wafer 200 rotates so as to ensure that the wafer 200 does not move; the wafer surface treatment mechanism 20 comprises two or more brush rolls 21, a brush roll support 22 and a cleaning driving piece 24, wherein the brush rolls 21 are rotatably arranged on the brush roll support 22, and the cleaning driving piece 24 is in driving connection with the brush rolls 21 and can drive the brush rolls 21 to rotate around the axis of the brush rolls 21; the shower mechanism is used to shower the wafer 200 and the brush roller 21 with the cleaning liquid.

The wafer mounting unit 12 has a loading region 30 for carrying the wafer 200, the loading region 30 is actually present in the wafer mounting unit 12, the boundary of the loading region 30 is an imaginary boundary, the spatial shape of the loading region 30 is a cylinder with a short axial length, the shape of the wafer 200 is the same as the shape of the loading region 30, and the brush roller 21 is provided at an axial end of the loading region 30.

When the wafer 200 is mounted on the wafer mounting unit 12, the wafer 200 is entirely located in the loading area 30 and occupies the loading area 30 entirely, and at least two brush rollers 21 are located at both axial ends of the wafer 200, respectively, the outer peripheral walls of the brush rollers 21 contact the end face of the wafer 200, and the axis of the loading area 30 coincides with the axis of the wafer 200. The peripheral wall of the brush roller 21 brushes the end face of the wafer 200 in cooperation with the rotation of the brush roller 21 about the axis of the brush roller 21 itself and the rotation of the wafer 200 about the axis of the wafer 200 itself.

Specifically, the driving unit 11 includes a material-rotating driving member 112 and a driving sleeve 111, the material-rotating driving member 112 includes a driving motor and an output shaft 113, the driving motor includes a power shaft, the output shaft 113 is connected to the power shaft, the driving sleeve 111 is connected to the output shaft 113, and the driving sleeve 111 can rotate following the rotation of the power shaft and the output shaft 113; the wafer mounting unit 12 includes a wheel support 122 and a driven wheel 121 rotatably mounted to the wheel support 122. The driving sleeve 111 and the driven wheel 121 are circumferentially arranged at intervals around the axis of the loading area 30, the driving sleeve 111 and the driven wheel 121 are abutted against the periphery of the wafer 200 and bear the wafer 200, and after the wafer 200 is borne by the driving sleeve 111 and the driven wheel 121, the space occupied by the wafer 200 is the loading area 30, which is equivalent to the loading area 30 being filled with the wafer 200.

The driving sleeve 111 is driven by the output shaft 113 to rotate under the driving of the material-rotating driving piece 112, and contact pressure exists between the periphery of the wafer 200 and the peripheral wall of the driving sleeve 111, so that the wafer 200 is driven by the driving sleeve 111 to rotate; there is also a contact pressure between the outer periphery of the wafer 200 and the outer peripheral wall of the followers 121, and as the wafer 200 rotates about its own axis, all of the followers 121 rotate, thereby reducing the resistance to rotation of the wafer 200.

For convenience of description, the axis of the loading area 30 will be hereinafter referred to as a rotation axis, which is a reference for determining the mounting position of the driven wheel 121 on the wheel body support 122, and a reference for determining the relative positions of the rotation driving member 112 and the wheel body support 122. The wafer 200 rotates about its own axis in the loading region 30, which corresponds to the rotation of the wafer 200 about the loading axis; the maximum dimension of the loading area 30 along the vertical direction of the transfer axis is defined as a loading diameter, the shortest distance from the transfer axis to the driving sleeve 111 or the driven wheel 121 is defined as a loading radius, the length of the loading radius is one half of the length of the loading diameter, after the wafer 200 is placed in the loading area 30, the loading radius corresponds to the radius of the wafer 200, the loading diameter corresponds to the diameter of the wafer 200, and the vertical direction of the transfer axis corresponds to the set of countless radial directions of the wafer 200.

Optionally, the number of the driven wheels 121 is at least two, the driving sleeve 111 and all the driven wheels 121 are arranged along the circumference of the material carrying area 30, and the length of the shortest distance line from the material transferring axis to the driving sleeve 111 is equal to the length of the shortest distance line from the material transferring axis to any one of the driven wheels 121, and the circumference of the material carrying area 30 is also the circumference of the material transferring axis.

Alternatively, a water channel may be provided inside the brush roller 21 instead of the shower mechanism, the water channel penetrating the outer periphery of the brush roller 21, and the cleaning liquid being able to flow into the water channel and be sprayed from the outer periphery of the brush roller 21.

Preferably, the number of the driven wheels 121 is three or more, and the positions of the loading area 30 and the transfer axis in the wafer surface treatment apparatus 100 depend on the positions of the wafer carrying unit 12 in the wafer surface treatment apparatus 100, and all the driven wheels 121 are arranged in the circumferential direction of one axis, namely, the transfer axis, and after the driven wheels 121 carry the wafer 200, the axes are coincident with the axis of the wafer 200.

Referring to fig. 1-2, in the illustrated embodiment, the number of the brush rollers 21 is two, the two brush rollers 21 are respectively located at two axial ends of the loading area 30, and when the wafer 200 rotates around the loading axis in the loading area 30, the two brush rollers 21 are respectively located at two axial ends of the wafer 200, and peripheral walls of the two brush rollers can respectively contact and lead two end surfaces of the wafer 200.

Optionally, the wafer surface treatment apparatus 100 further includes a base 50, the brush roller support 22, the material rotation driving member 112, and the wheel support 122 are all mounted on the base 50, and any one of the brush roller support 22, the material rotation driving member 112, and the wheel support 122 is movable relative to the base 50 to change a mounting position thereof on the base 50.

In the existing wafer surface treatment equipment, a cylindrical brush roller with uniform outer diameter is adopted to brush the wafer, in the wafer surface treatment equipment, the axial length of the brush roller is larger than or equal to the diameter of the wafer, and the area of the brush roller contacting the wafer necessarily passes through the axis of the wafer, which means that a groove with the length reaching the diameter of the wafer is formed between the peripheral wall of the brush roller and the end face of the wafer, impurities, dirt and cleaning waste liquid are accumulated in the groove, and finally the cleaning effect of the wafer is poor.

In view of this, the wafer surface treatment mechanism 20 of the wafer surface treatment apparatus 100 of the present invention further includes a plurality of brush holders 25, at least one brush roller 21 is provided with two or more brush holders 25, the brush holders 25 provided on the brush roller 21 are sequentially provided in the axial direction of the brush roller 21, and at least two brush holders 25 on the brush roller 21 have different thermal expansion coefficients.

The wafer surface treatment mechanism 20 of the present invention further comprises a water supply system 40, the water supply system 40 comprises a water storage chamber 41 and at least one water supply channel 42, the water supply channel 42 is communicated with the water storage chamber 41 and forms a water outlet 43, the water outlet 43 is arranged towards the brush sleeve 25, and after the water supply system 40 is started to operate, liquid in the water storage chamber 41 flows into the water supply channel 42 and is discharged from the water outlet 43 to be obtained by the brush sleeve 25.

The present invention is not limited to a specific range of values of the coefficients of thermal expansion of the brush holders 25, and it is only necessary that the plurality of brush holders 25 located in one brush roller 21 have different coefficients of thermal expansion.

For the plurality of brush sleeves 25 provided on one brush roll 21, the coefficients of thermal expansion of the brush sleeves 25 may be all different, that is, the coefficients of thermal expansion of any two brush sleeves 25 on the same brush roll 21 may be all different, or may be partially different, that is, two brush sleeves 25 having different coefficients of thermal expansion may be present on the same brush roll 21, or two brush sleeves 25 having the same coefficient of thermal expansion may be present; in addition, the brush holders 25 provided on the same brush roller 21 may be of the heat expansion and cold contraction type, the heat shrinkage and cold expansion type, or the heat expansion and cold contraction type, or the heat shrinkage and cold expansion type.

Further, the dimension of any one brush holder 25 in the radial direction of the material transfer axis is smaller than the material carrying diameter, so that after any one brush holder 25 contacts the wafer 200, the length of the groove formed between the peripheral wall of the brush holder 25 and the end of the wafer 200 is smaller than the diameter of the wafer 200.

The brush cover 25 is used to directly contact the end surface of the wafer 200, and includes soft scrubbing materials such as brushes, porous plastics, brushes, etc., which can change in shape and volume with changes in external incoming temperature; the water supply system 40 is used for supplying liquid with a certain temperature to the brush sleeve 25, and the brush sleeve 25 with different thermal expansion coefficients deforms and changes volume to different degrees under the thermodynamic effect of the liquid.

It should be noted that the above-mentioned thermodynamic action not only heats the brush sleeve 25, but also cools the brush sleeve 25, and the purpose of supplying the liquid to the brush sleeve 25 is to make the brush sleeve 25 generate thermal expansion and contraction deformation or thermal expansion and contraction deformation.

The relative pose relationship between the brushroll 21 and the loading area 30 is configured to: when the brush sleeve 25 acquires liquid and undergoes a volume change, the larger the volume the brush sleeve 25 preferentially contacts the wafer 200, and the larger the pressure applied to the wafer 200, the smaller the volume the more difficult or even the less likely the brush sleeve 25 contacts the wafer 200. In the same brush roll 21, the contact condition between different brush sleeves 25 and the wafer 200 is different, and not all brush sleeves 25 on the whole brush roll 21 contact the wafer 200. The present invention significantly shortens the length of the contact area of the brush roller 21 and the wafer 200, compared to the existing wafer surface treatment apparatus, thereby significantly reducing the length of the groove between the brush roller 21 and the wafer 200.

Optionally, the wafer surface treatment mechanism 20 includes two brush rollers 21 respectively located at two ends of the loading area 30, at least one brush roller 21 is provided with more than three brush sleeves 25, and the brush sleeves 25 located on the brush roller 21 have brush sleeves 25 with different thermal expansion coefficients. The brush holders 25 are sequentially arranged in the axial direction of the brush roller 21 in the order of the thermal expansion coefficient, and the volume changes occurring after the brush holders 25 acquire the liquid are different.

Referring to fig. 4, each of the two brush rolls 21 is provided with three or more brush holders 25. For any one brush roller 21, the brush sleeves 25 are arranged in order of volume and size after deformation along the axial direction of the brush roller 21, and the sequence of volume and size shows that the brush sleeves 25 on the brush roller 21 are arranged in order of thermal expansion coefficient.

For the brush sleeve 25 of the same brush roll 21, there is one brush sleeve 25 at a critical position, which is called a critical brush sleeve 25 for short, and after the brush sleeve 25 obtains liquid, all brush sleeves 25 with a volume larger than that of the critical brush sleeve 25 enter a material carrying area 30 respectively, which is called a contact brush sleeve 25 for short. The space occupied by the brush holders 25 and the space of the loading area 30 form an intersection, which is defined as the contact section 211 of the brush roller 21, the contact section 211 being formed either by one brush holder 25 or by a plurality of brush holders 25 together.

Accordingly, after the liquid is obtained, all of the brush sleeves 25 having a volume smaller than the critical brush sleeve 25 are located outside the loading area 30, i.e., the brush sleeves 25 are in less or no contact with the wafer 200. After the water supply system 40 supplies the liquid to the brush sleeve 25, and when the wafer 200 is mounted on the wafer mounting unit 12 and fills the loading area 30, the contact brush sleeve 25 forming the contact section 211 applies pressure to the wafer 200, and the brush sleeve 25 having a volume smaller than the critical brush sleeve 25 is located outside the loading area 30 and does not play a role in brushing the wafer 200.

The length of the contact section 211 along the axial direction of the brush roller 21 is not fixed, the contact brush sleeve 25 for applying pressure to the wafer 200 is not fixed, the number of the contact brush sleeves 25 for contacting the brush roller 21 and the distribution position on the brush roller 21 can be changed by changing the temperature of the liquid to enable the brush sleeve 25 to deform and change the volume to different degrees under the influence of different temperatures, so that the length of the contact section 211 is changed.

Alternatively, the brush sleeve 25 comprises a soft scrubbing material made of a thermally expansive material, i.e., the volume of the brush sleeve 25 increases as the temperature of the brush sleeve 25 increases and decreases as the temperature of the brush sleeve 25 decreases. Referring to fig. 4, the brush sleeves 25 are sequentially arranged in descending order of thermal expansion coefficients along the axial direction pointing to the left side of the drawing, and after the brush sleeves 25 are heated up under the action of liquid, the volumes of the brush sleeves 25 are sequentially and progressively arranged along the axial direction pointing to the left side of the drawing.

In some embodiments. The axes of the two brush rolls 21 are parallel to each other, and the axes of the two brush rolls 21 are perpendicular to the material transfer axis, and the two brush rolls 21 respectively form two contact sections 211. A wafer plane is now defined, which is an imaginary plane parallel to the two end faces of the loading area 30, which bisects the loading area 30 in the radial direction of the transfer axis. When the wafer 200 is positioned in the loading area 30, the wafer plane is parallel to the end face of the wafer 200 and bisects the wafer 200 in the radial direction. After orthographic projection of the two contact sections 211 of the two brush rolls 21 on the wafer plane, the projection patterns formed by the two contact sections 211 are at least partially overlapped.

By this arrangement, the pressures of the two brush rolls 21 acting on the two ends of the wafer 200 can cancel each other out to some extent, so that the wafer 200 can be prevented from having a large bending stress, and the risk of breakage of the wafer 200 is reduced.

As a preferred embodiment, the brush sleeves 25 are arranged on the two brush rolls 21 in the same manner, i.e. the brush sleeves 25 arranged on the two brush rolls 21 are identical in number and arrangement sequence, the two brush rolls 21 are symmetrically arranged about the wafer plane, and the two contact sections 211 formed by the two brush rolls 21 are symmetrically arranged about the wafer plane.

In some embodiments, the brush sleeves 25 are hollow, the brush roller 21 is a cylinder, and all the brush sleeves 25 are sleeved on the peripheral wall of the brush roller 21 and are coaxially arranged. In the embodiment shown in fig. 4, the coefficient of thermal expansion of any two brush sleeves 25 on the same brush roll 21 is different, so that when the brush sleeves 25 are deformed by the liquid, the outer diameters of any two brush sleeves 25 are different.

Specifically, referring to fig. 4, the revolving body formed by the brush sleeve 25 and the brush roller 21 is in a stepped shaft shape, the peripheral wall of the brush sleeve 25 forms the peripheral wall of the stepped shaft structure, the axis of the brush roller 21 forms the axis of the stepped shaft structure, and a shaft shoulder is formed between any two adjacent brush sleeves 25. Referring to fig. 1 to 2, in the embodiment shown in fig. 1 to 2, the revolution body formed by the brush sleeve 25 and the brush roller 21 is in a truncated cone shape, the peripheral wall of the brush sleeve 25 forms the peripheral wall of the truncated cone-shaped structure, and the axis of the brush roller 21 forms the axis of the truncated cone-shaped structure.

Alternatively, in the embodiment shown in fig. 1-3, all brush sleeves 25 are hot-expanded and cold-contracted, and water supply system 40 supplies high-temperature liquid higher than room temperature (15 ℃ -25 ℃) to these brush sleeves 25.

In some embodiments, the wafer surface treatment mechanism 20 further includes an adjusting unit 23, where the adjusting unit 23 is connected to the brush roller support 22, and is used to drive the brush roller support 22 to move relative to the base 50, so as to drive the brush roller 21 to move relative to the loading area 30, so as to change the position and the posture of the brush roller 21 relative to the loading area 30. Changing the position of the brush roller 21 relative to the material carrying area 30, namely indirectly driving the brush roller 21 to translate relative to the material carrying area 30 by driving the brush roller bracket 22 to translate relative to the base 50; the posture of the brush roller 21 relative to the material carrying area 30 is changed, namely the brush roller support 22 is driven to swing relative to the base 50, and the brush roller 21 is indirectly driven to swing relative to the material carrying area 30, so that the angle of the axis of the brush roller 21 relative to the material rotating axis is changed.

Referring to fig. 1, the number of the brush roll brackets 22 is two, two brush rolls 21 respectively located at two ends of the material carrying area 30 are respectively rotatably installed on the two brush roll brackets 22, the adjusting unit 23 is connected with the two brush roll brackets 22, and can drive the two brush roll brackets 22 to swing relatively so as to change the axis included angle gamma of the two brush rolls 21, and the adjusting unit 23 can drive either one brush roll bracket 22 to swing relatively to the base 50 or simultaneously drive the two brush roll brackets 22 to swing relatively to the base 50. By varying the included angle y of the axes of the brush rolls 21, the size of the contact sections 211 of the two brush rolls 21 in the radial direction of the loading area 30, and the pressure of the two brush rolls 21 against the wafer 200, can be varied.

Of course, in other embodiments, the adjusting unit 23 may be further configured to move the two brush roll holders 22 relatively to translate to change the distance between the two brush rolls 21, and increasing the distance between the two brush rolls 21 increases the pressure of the brush rolls 21 on the wafer 200, and conversely decreases the pressure of the brush rolls 21 on the wafer 200.

Further, the wafer surface treatment mechanism 20 further includes a mechanical sensor connected to the cleaning drive member 24 for measuring the load of the cleaning drive member 24 in real time during the driving of the brush roller 21 by the cleaning drive member 24. The pressure of the brush roller 21 acting on the wafer 200 through the brush sleeve 25 directly affects the load of the cleaning driving member 24, the greater the pressure of the wafer 200 is, the more sufficient the brushing force and the better the brushing effect of the brush roller 21 on the wafer 200 are, but correspondingly, the greater the load of the cleaning driving member 24 is, the greater the load may cause the rotation speed of the brush roller 21 to be reduced, and the brushing efficiency is reduced; the smaller the load on the cleaning drive 24, the less pressure the wafer 200 is subjected to, and the problem of insufficient brushing may occur.

By the arrangement, a debugger can judge whether the brushing force of the brush roller 21 on the wafer 200 is proper or not according to the mechanical sensor, and adjust the position or the posture of the brush roller support 22 according to the situation so as to change the brushing force of the brush roller 21 until the brushing force reaches a proper interval, so that the brushing effect and the brushing efficiency are considered.

It should be noted that, the manner of adjusting the brushing force of the brush roller 21 on the wafer 200 is not limited to adjusting the position or the posture of the brush roller support 22, but the volume of the brush sleeve 25 can be changed, so as to change the contact section 211 formed by the brush roller 21. In some embodiments, the water supply 40 further includes a temperature regulator that heats or cools the liquid in the reservoir 41, and by varying the temperature of the liquid, the extent of change in volume that occurs after the brush sleeve 25 has acquired the liquid is correspondingly varied. For example, when the measurement result of the mechanical sensor indicates that the load of the current cleaning driving member 24 is larger, the temperature regulator may cool the liquid so that the brush sleeve 25 obtains a liquid with a lower temperature, and the brush sleeve 25 deforms with cold contraction after obtaining the liquid with a lower temperature, thereby reducing the pressure of the brush roller 21 acting on the wafer 200, and when the brushing force needs to be increased, the temperature regulator heats the liquid so that the brush sleeve 25 deforms with hot expansion after obtaining the liquid with a higher temperature, thereby increasing the pressure of the brush roller 21 acting on the wafer 200.

In some embodiments, the water supply channel 42 includes a centrifugal drain 420 provided on the brush roller 21, the water outlet 43 is provided on the brush roller 21, and the water outlet 43 communicates with the centrifugal drain 420 and extends toward the brush sleeve 25. Referring to fig. 3 and 4, specifically, the brush roller 21 is of a hollow structure, the cavity of the brush roller 21 forms a centrifugal drainage section 420, the number of water outlets 43 is two or more, the water outlets 43 are sequentially arranged along the axial direction of the brush roller 21, one end of each water outlet 43 penetrates through the inner wall of the brush roller 21 to be communicated with the centrifugal drainage section 420, the other end of each water outlet 43 penetrates through the peripheral wall of the brush roller 21 to be directed to the brush sleeve 25, any one brush sleeve 25 corresponds to at least one water outlet 43, and it is ensured that each brush sleeve 25 can obtain liquid of the water supply system 40 and generate deformation and volume change.

In the embodiment shown in fig. 4, the water outlets 43 and the brush sleeves 25 are equal in number and correspond to each other one by one, the water outlets 43 and the brush sleeves 25 are sequentially arranged along the axial direction of the brush roll 21, and each water outlet 43 is responsible for releasing liquid to the brush sleeve 25 corresponding to the water outlet 43.

The brush roller 21 is provided with a hollow structure, and the centrifugal drainage section 420 formed by the cavity of the brush roller 21 is used as at least one part of the water supply channel 42, so that liquid in the water storage chamber 41 can be more efficiently led to flow out of the centrifugal drainage section 420 and reach the brush sleeve 25 through the water outlet 43, when the brush roller 21 rotates, the liquid in the centrifugal drainage section 420 has centrifugal acceleration, a certain negative pressure is generated in the central area of the centrifugal drainage section 420, and under the action of the negative pressure, the residual liquid in the water storage chamber 41 continuously flows to the centrifugal drainage section 420 to fill the negative pressure.

The water storage chamber 41 can be arranged on the brush roller 21 or can be independently arranged in other areas, when the water storage chamber 41 is arranged on the brush roller 21, the cavity of the brush roller 21 can be used as the water supply channel 42, the cavity of the water storage chamber 41 can be directly communicated with the cavity of the brush roller 21, and the water storage chamber 41 is in sealing fit with the peripheral wall of the brush roller 21.

It will be appreciated that in other embodiments, the water supply channel 42 may be provided separately and that it is not necessary to provide a flow path to the brush roller 21 as part of the water supply channel 42, and that in these embodiments, the water supply channel 42 may supply liquid to the brush sleeve 25 by spraying or sprinkling. The invention does not limit the way of obtaining the liquid by the brush sleeve 25, as long as the brush sleeve 25 generates different degrees of thermal expansion and cold contraction deformation or thermal expansion and cold expansion deformation after obtaining the liquid.

In an embodiment not shown in the drawings, the water storage chamber 41 comprises a cold water chamber and a hot water chamber, the water supply channel 42 comprises a cold water channel communicated with the cold water chamber and a hot water channel communicated with the hot water chamber, the water outlet 43 comprises a cold water port arranged on the cold water channel and a hot water port arranged on the hot water channel, and the cold water port and the hot water port are arranged towards the brush sleeve 25. The cold water chamber, the cold water passage, and the cold water port form a low temperature system for supplying a low temperature liquid to the brush holder 25, and the hot water chamber, the hot water passage, and the hot water port form a high temperature system for supplying a high temperature liquid to the brush holder 25. The two systems can be independently operated respectively, and one of the two systems is started as required, or the operation states of the two systems are switched.

For example, when the brushing force of the brush roller 21 on the wafer 200 needs to be increased, the low-temperature system is turned off or the supply speed of the low-temperature liquid is reduced, the high-temperature system starts to operate or the supply speed of the high-temperature liquid is increased, and the brush sleeve 25 is thermally expanded and deformed after obtaining the high-temperature liquid of the high-temperature system, so that the pressure of the brush roller 21 on the wafer 200 is increased; when the measurement result of the mechanical sensor indicates that the load of the cleaning driving member 24 is too large, the high-temperature system is turned off or the feeding speed of the high-temperature liquid is reduced, the low-temperature system starts to operate or the feeding speed of the low-temperature liquid is increased, and the brush sleeve 25 is deformed in a shrink manner after obtaining the low-temperature liquid of the low-temperature system, so that the pressure of the brush roller 21 on the wafer 200 is reduced.

It should be noted that, whether the adjustment unit 23 adjusts the brushing force of the brush roller 21 on the wafer 200, the temperature adjuster adjusts the liquid temperature to change the brushing force, or the operation conditions of the high temperature system and the low temperature system are switched to change the brushing force, the contact section 211 formed by the brush roller 21 may be changed, so as to achieve the purpose of extending or shortening the length of the groove formed between the brush sleeve 25 and the end of the wafer 200.

The technical features of the above-described embodiments may be combined in any manner, and for brevity, all of the possible combinations of the technical features of the above-described embodiments are not described, however, all of the combinations of the technical features should be considered as being within the scope of the present disclosure as long as there is no contradiction between the combinations of the technical features.

It will be appreciated by persons skilled in the art that the above embodiments have been provided for the purpose of illustrating the invention and are not to be construed as limiting the invention, and that suitable modifications and variations of the above embodiments are within the scope of the invention as claimed.

Claims (10)

1. A wafer surface treatment device is characterized by comprising a driving mechanism (10), a water supply system (40), a brush roller bracket (22) and at least two brush rollers (21) rotatably arranged on the brush roller bracket (22),

the driving mechanism (10) is provided with a loading area (30) and is used for driving a round wafer (200) loaded in the loading area (30) to rotate around the axis of the wafer (200);

at least two brush sleeves (25) are sequentially arranged on the periphery of at least one brush roller (21) along the axial direction, and at least two brush sleeves (25) positioned on the brush roller (21) have different thermal expansion coefficients;

the water supply system (40) comprises a water storage chamber (41) and a water supply channel (42), wherein the water supply channel (42) is communicated with the water storage chamber (41) and forms a water outlet (43) arranged towards the brush sleeve (25);

at least two brush rollers (21) are respectively positioned at the two axial ends of the wafer (200) loaded in the loading area (30) and are used for contacting the two axial ends of the wafer (200);

a part of the brush sleeve (25) in the same brush roll (21) contacts the wafer (200), and the length of the area where any brush roll (21) contacts the wafer (200) is smaller than the diameter of the wafer (200).

2. Wafer surface treatment device according to claim 1, characterized in that at least three brush sleeves (25) are provided on the outer periphery of at least one brush roll (21) in the axial direction, the brush sleeves (25) located on the brush roll (21) being arranged in order of magnitude of thermal expansion coefficient.

3. Wafer surface treatment device according to claim 1, characterized in that the water supply channel (42) comprises a centrifugal drain section (420) open to the brush roll (21), the water outlet (43) is open to the outer periphery of the brush roll (21) and communicates with the centrifugal drain section (420).

4. A wafer surface treatment apparatus according to claim 3, wherein the brush roll (21) is of hollow construction, the cavities of the brush roll (21) forming the centrifugal drain section (420); and/or the water storage chamber (41) is arranged on the brush roller (21).

5. A wafer surface treatment apparatus according to claim 3, wherein the number of the water outlets (43) is two or more, and the water outlets (43) are sequentially arranged in the axial direction of the brush roller (21), and any one of the brush holders (25) corresponds to at least one of the water outlets (43).

6. Wafer surface treatment apparatus according to claim 1, wherein the water supply system (40) further comprises a temperature regulator for regulating the temperature within the water reservoir (41); and/or the number of the groups of groups,

the water storage chamber (41) comprises a cold water chamber and a hot water chamber, the water supply channel (42) comprises a cold water channel communicated with the cold water chamber and a hot water channel communicated with the hot water chamber, the water outlet (43) comprises a cold water port arranged on the cold water channel and a hot water port arranged on the hot water channel, and the cold water port and the hot water port face the brush sleeve (25).

7. Wafer surface treatment apparatus according to claim 1, characterized in that the drive mechanism (10) comprises a drive sleeve (111) and a driven wheel (121), the drive sleeve (111) and the driven wheel (121) being arranged circumferentially spaced around a preset transfer axis to form the loading zone (30), the transfer axis coinciding with the axis of the wafer (200) when the drive sleeve (111) and the driven wheel (121) are carrying the wafer (200).

8. Wafer surface treatment device according to claim 7, characterized in that the dimension of any one of the brush sleeves (25) in the direction perpendicular to the transfer axis is smaller than a loading diameter, which is the largest dimension of the loading area (30) in the direction perpendicular to the transfer axis.

9. Wafer surface treatment apparatus according to claim 7, characterized in that the wafer surface treatment mechanism (20) further comprises an adjusting unit (23) connected to the brush roller support (22), a cleaning drive (24) connected to the brush roller (21) and a mechanical sensor connected to the cleaning drive (24), the mechanical sensor being used for measuring the load of the cleaning drive (24), the adjusting unit (23) being used for driving the brush roller support (22) to move so as to change the pose of the brush roller (21) relative to the loading area (30).

10. The apparatus according to claim 9, wherein the number of the brush roller holders (22) and the number of the brush rollers (21) are two, the two brush rollers (21) are respectively disposed at both ends of the loading area (30) and are respectively rotatably mounted on the two brush roller holders (22), the adjusting unit (23) is connected to the two brush roller holders (22),

the adjusting unit (23) is configured to drive the two brush roller brackets (22) to swing relatively so as to change the included angle of the axes of the two brush rollers (21); and/or the number of the groups of groups,

the adjusting unit (23) is configured to drive the two brush roller supports (22) to translate relatively so as to change the distance between the two brush rollers (21).