TWI779448B - Wafer container - Google Patents

Wafer container Download PDF

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Publication number
TWI779448B
TWI779448B TW110100156A TW110100156A TWI779448B TW I779448 B TWI779448 B TW I779448B TW 110100156 A TW110100156 A TW 110100156A TW 110100156 A TW110100156 A TW 110100156A TW I779448 B TWI779448 B TW I779448B
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filter
unit
airflow
wafer container
airflow unit
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TW110100156A
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Chinese (zh)
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TW202228188A (en
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黃日正
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南亞科技股份有限公司
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Priority to TW110100156A priority Critical patent/TWI779448B/en
Priority to CN202110561108.8A priority patent/CN114724988A/en
Publication of TW202228188A publication Critical patent/TW202228188A/en
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Publication of TWI779448B publication Critical patent/TWI779448B/en

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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735Closed carriers
    • H01L21/67389Closed carriers characterised by atmosphere control
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735Closed carriers
    • H01L21/67389Closed carriers characterised by atmosphere control
    • H01L21/67393Closed carriers characterised by atmosphere control characterised by the presence of atmosphere modifying elements inside or attached to the closed carrierl

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
  • Control And Other Processes For Unpacking Of Materials (AREA)
  • Packaging Frangible Articles (AREA)
  • Packages (AREA)

Abstract

A wafer container includes a container body, a plurality of supporting structures, and a filter. The container has a sealed accommodating space. The supporting structures are vertically arranged in the accommodating space. The filter is located in the accommodating space for filtering airborne molecular contamination, and one of the supporting structures carries the filter.

Description

晶圓容器Wafer container

本發明關於一種容器,特別涉及用於收納晶圓的容器。The present invention relates to a container, in particular to a container for accommodating wafers.

在半導體製造工業中,前開式晶圓傳送盒(Front Opening Unified Pod;FOUP)為一種存放半導體晶圓的可攜式容器。在製程步驟之間,鑑於各種因素,諸如生產運行、迴圈次數的多寡等,晶圓可能存放於前開式晶圓傳送盒內一段時間。在這段時間內,氧氣或濕氣可能滲入至前開式晶圓傳送盒。不幸地,氧氣及濕氣可能對半導體晶圓的表面造成有害的影響,故減少晶圓表面曝露於這些元素是必要的。In the semiconductor manufacturing industry, a Front Opening Unified Pod (FOUP) is a portable container for storing semiconductor wafers. Between process steps, wafers may be stored in the FOUP for a period of time due to various factors such as production runs, number of cycles, etc. During this time, oxygen or moisture may seep into the FOUP. Unfortunately, oxygen and moisture can have detrimental effects on the surface of semiconductor wafers, so it is necessary to reduce the exposure of the wafer surface to these elements.

為解決上述問題本發明提供一種晶圓容器,其包括容器本體、複數支撐結構及過濾器。容器本體具有密閉的容置空間。複數支撐結構縱向排列於容置空間內。過濾器則用於過濾氣體分子汙染物,其中過濾器設置於容置空間內,複數支撐結構的一者承載過濾器。To solve the above problems, the present invention provides a wafer container, which includes a container body, a plurality of support structures and a filter. The container body has a closed accommodating space. Multiple support structures are arranged longitudinally in the accommodation space. The filter is used for filtering gas molecular pollutants, wherein the filter is arranged in the containing space, and one of the plurality of supporting structures carries the filter.

在本發明的一個或多個實施方式中,晶圓容器更包括氣流單元,其中氣流單元設置於容置空間內並用以產生通過至少一過濾器的氣流。In one or more embodiments of the present invention, the wafer container further includes an airflow unit, wherein the airflow unit is disposed in the accommodating space and used to generate airflow passing through at least one filter.

在本發明的一個或多個實施方式中,氣流單元設置於些支撐結構的上方或下方。In one or more embodiments of the present invention, the airflow unit is disposed above or below the supporting structures.

在本發明的一個或多個實施方式中,晶圓容器更包括第一氣流單元及第二氣流單元,其中第一氣流單元及第二氣流單元橫向間隔設置於容置空間內,第一氣流單元及第二氣流單元分別用於產生方向相反的縱向氣流。In one or more embodiments of the present invention, the wafer container further includes a first airflow unit and a second airflow unit, wherein the first airflow unit and the second airflow unit are laterally spaced in the accommodation space, and the first airflow unit and the second airflow unit are respectively used to generate longitudinal airflows in opposite directions.

在本發明的一個或多個實施方式中,至少一過濾器包括第一過濾器及第二過濾器,些支撐結構中的最上者及最下者分別承載第一過濾器及第二過濾器。In one or more embodiments of the present invention, at least one filter includes a first filter and a second filter, and the uppermost and the lowermost of the supporting structures respectively carry the first filter and the second filter.

在本發明的一個或多個實施方式中,至少一過濾器包括濾芯及殼體,其中殼體包覆濾芯並在縱向上部分裸露濾芯。In one or more embodiments of the present invention, at least one filter includes a filter element and a casing, wherein the casing covers the filter element and partially exposes the filter element in the longitudinal direction.

在本發明的一個或多個實施方式中,濾芯為活性碳濾芯或其他用以濾除氣體分子汙染物之濾材。In one or more embodiments of the present invention, the filter element is an activated carbon filter element or other filter materials for filtering gas molecular pollutants.

在本發明的一個或多個實施方式中,晶圓容器更包括氣體感測器,氣體感測器用以感測容置空間內的氣體分子汙染物。In one or more embodiments of the present invention, the wafer container further includes a gas sensor for sensing gas molecule pollutants in the containing space.

在本發明的一個或多個實施方式中,晶圓容器更包括控制器、氣流單元及氣體感測器,控制器連接氣體感測器及氣流單元,當氣體感測器偵測到容置空間內的氣體分子汙染物到達或超過濃度閾值時,控制器驅動氣流單元產生通過至少一過濾器的氣流。In one or more embodiments of the present invention, the wafer container further includes a controller, an airflow unit, and a gas sensor. The controller is connected to the gas sensor and the airflow unit. When the gas sensor detects that the accommodating space When the gas molecular pollutants in the gas reach or exceed the concentration threshold, the controller drives the airflow unit to generate airflow through at least one filter.

在本發明的一個或多個實施方式中,晶圓容器更包括電源模組及氣流單元,其中電源模組連接氣流單元,電源模組用以供電給氣流單元並具有無線充電功能,而氣流單元用以產生通過至少一過濾器的氣流。In one or more embodiments of the present invention, the wafer container further includes a power supply module and an airflow unit, wherein the power supply module is connected to the airflow unit, the power supply module is used to supply power to the airflow unit and has a wireless charging function, and the airflow unit for generating air flow through at least one filter.

綜上所述,本發明的晶圓容器具有密閉的容置空間,可以將晶圓及過濾器放置於晶圓容器的容置空間內,過濾器將容置空間內的氣體分子汙染物過濾,進而降低氣體分子汙染物的濃度,因此能避免晶圓容器內的晶圓受到氣體分子汙染物影響而降低品質。In summary, the wafer container of the present invention has an airtight accommodating space, and the wafer and the filter can be placed in the accommodating space of the wafer container, and the filter filters the gas molecular pollutants in the accommodating space, Furthermore, the concentration of the gas molecule pollutants is reduced, so that the quality of the wafers in the wafer container can be prevented from being affected by the gas molecule pollutants.

以上所述僅係用以闡述本發明所欲解決的問題、解決問題的技術手段、及其產生的功效等等,本發明之具體細節將在下文的實施方式及相關圖式中詳細介紹。The above description is only used to illustrate the problem to be solved by the present invention, the technical means for solving the problem, and the effects thereof, etc. The specific details of the present invention will be described in detail in the following implementation methods and related drawings.

以下將以圖式揭露本發明之複數個實施方式,為明確說明起見,許多實務上的細節將在以下敘述中一併說明。然而,應瞭解到,這些實務上的細節不應用以限制本發明。也就是說,在本發明部分實施方式中,這些實務上的細節是非必要的。除此之外,為簡化圖式起見,一些習知慣用的結構與元件在圖式中將以簡單示意的方式繪示之。Several embodiments of the present invention will be disclosed in the following figures. For the sake of clarity, many practical details will be described together in the following description. It should be understood, however, that these practical details should not be used to limit the invention. That is, in some embodiments of the present invention, these practical details are unnecessary. In addition, for the sake of simplifying the drawings, some commonly used structures and elements will be shown in a simple and schematic manner in the drawings.

請參考第1圖,第1圖繪示為本發明一個或多個實施方式中晶圓容器100的立體示意圖,其中晶圓容器100包括容器本體110及複數個支撐結構120。容器本體110包括盒體111、門體113及盒體111所定義出的容置空間115,當門體113蓋闔於盒體111時,容器本體110的容置空間115是密閉的。具體而言,晶圓容器100為前開式晶圓傳送盒(front opening unified fod),但本發明並不以此為限。Please refer to FIG. 1 , which is a perspective view of a wafer container 100 in one or more embodiments of the present invention, wherein the wafer container 100 includes a container body 110 and a plurality of supporting structures 120 . The container body 110 includes a box body 111 , a door body 113 and an accommodating space 115 defined by the box body 111 . When the door body 113 is closed on the box body 111 , the accommodating space 115 of the container body 110 is airtight. Specifically, the wafer container 100 is a front opening unified fod, but the invention is not limited thereto.

請同時參考第2圖,第2圖繪示為本發明一個或多個實施方式中晶圓容器100的前視示意圖,複數支撐結構120設置於容置空間115內,且複數支撐結構120沿縱向V排列於盒體111的內側壁上,藉此支撐結構120可用於承載晶圓W。具體而言,支撐結構120為晶圓槽,但本發明並不以此為限。在本揭露中,縱向V及上下方向為同一軸向,而上下方向可分別代表縱向V上的相反方向。此外,本揭露中的橫向H與縱向V為大致相互垂直的兩軸向。Please refer to FIG. 2 at the same time. FIG. 2 is a schematic front view of the wafer container 100 in one or more embodiments of the present invention. A plurality of support structures 120 are arranged in the accommodation space 115, and the plurality of support structures 120 are arranged along the longitudinal direction. V is arranged on the inner wall of the box body 111 , so that the support structure 120 can be used to carry the wafer W. Specifically, the supporting structure 120 is a wafer tank, but the invention is not limited thereto. In the present disclosure, the longitudinal direction V and the up-down direction are the same axial direction, and the up-down direction may represent opposite directions in the longitudinal direction V, respectively. In addition, the horizontal direction H and the vertical direction V in the present disclosure are two axes substantially perpendicular to each other.

在本發明的一些實施方式中,晶圓容器100更包括過濾器130,過濾器130用於過濾氣體分子汙染物(airborne molecular contamination),其中過濾器130設置於容置空間115內,複數支撐結構120的一者承載過濾器130,其中氣體分子汙染物會經由擴散被過濾器130吸附,進而降低晶圓容器100內氣體分子汙染物的濃度。具體而言,過濾器130包括濾芯131及殼體133,其中殼體133包覆濾芯131並在縱向V上部分裸露濾芯131。舉例而言,過濾器130設置於複數支撐結構120中的最下者,而殼體133具有開口135,開口135從殼體133的上方裸露至少部分濾芯131。此外,可以將複數個晶圓W設置於過濾器130上方,濾芯131經由開口135朝向上方的複數個晶圓W裸露,藉此濾芯131能有效地過濾晶圓W周遭的氣體分子汙染物。具體而言,濾芯131可以是活性碳濾芯或其他用以濾除氣體分子汙染物之濾材,進而過濾容置空間115內氣體分子汙染物,但本發明並不以此為限。In some embodiments of the present invention, the wafer container 100 further includes a filter 130 for filtering airborne molecular contamination, wherein the filter 130 is disposed in the accommodating space 115, and the plurality of supporting structures One of the 120 carries the filter 130 , wherein the gaseous molecular pollutants are adsorbed by the filter 130 through diffusion, thereby reducing the concentration of the gaseous molecular pollutants in the wafer container 100 . Specifically, the filter 130 includes a filter element 131 and a casing 133 , wherein the casing 133 covers the filter element 131 and partially exposes the filter element 131 in the longitudinal direction V. As shown in FIG. For example, the filter 130 is disposed at the bottom of the plurality of support structures 120 , and the casing 133 has an opening 135 , and the opening 135 exposes at least part of the filter element 131 from above the casing 133 . In addition, a plurality of wafers W can be disposed above the filter 130 , and the filter element 131 is exposed to the upper plurality of wafers W through the opening 135 , so that the filter element 131 can effectively filter gaseous molecular pollutants around the wafer W. Specifically, the filter element 131 may be an activated carbon filter element or other filter materials used to filter out gas molecule pollutants, thereby filtering the gas molecule pollutants in the accommodating space 115 , but the present invention is not limited thereto.

請參考第3圖,第3圖繪示為本發明過濾器130的上視圖。在本發明的一些實施方式中,過濾器130的殼體133為圓盤狀,而殼體133的開口135也是圓形,藉此殼體133經由開口135從殼體133的上頂部大面積地露出濾芯131,但本發明並不以此為限。Please refer to FIG. 3 , which is a top view of the filter 130 of the present invention. In some embodiments of the present invention, the housing 133 of the filter 130 is disc-shaped, and the opening 135 of the housing 133 is also circular, so that the housing 133 is separated from the upper top of the housing 133 through the opening 135 in a large area. The filter element 131 is exposed, but the present invention is not limited thereto.

請參考第4圖,第4圖繪示為本發明一些實施方式中晶圓容器100a的前視示意圖。晶圓容器100a更包括第一過濾器130a及第二過濾器130b,第一過濾器130a及第二過濾器130b用於過濾氣體分子汙染物並與前述的過濾器130大致相同,其中第一過濾器130a及第二過濾器130b設置於容置空間115內,複數支撐結構120中的兩者分別承載第一過濾器130a及第二過濾器130b。具體而言,第一過濾器130a包括濾芯131a及殼體133a,其中殼體133a包覆濾芯131a並在縱向V上部分裸露濾芯131a。第二過濾器130b也包括濾芯131b及殼體133b,其中殼體133b包覆濾芯131b並在縱向V上部分裸露濾芯131b。Please refer to FIG. 4, which is a schematic front view of the wafer container 100a in some embodiments of the present invention. The wafer container 100a further includes a first filter 130a and a second filter 130b. The first filter 130a and the second filter 130b are used to filter gaseous molecular pollutants and are substantially the same as the aforementioned filter 130, wherein the first filter The filter 130a and the second filter 130b are disposed in the accommodating space 115, and the two of the plurality of supporting structures 120 carry the first filter 130a and the second filter 130b respectively. Specifically, the first filter 130a includes a filter element 131a and a casing 133a, wherein the casing 133a covers the filter element 131a and partially exposes the filter element 131a in the longitudinal direction V. As shown in FIG. The second filter 130b also includes a filter element 131b and a casing 133b, wherein the casing 133b covers the filter element 131b and partially exposes the filter element 131b in the longitudinal direction V. As shown in FIG.

舉例而言,第一過濾器130a設置於複數支撐結構120中的最下者,而第二過濾器130b設置於複數支撐結構120中的最上者,其餘的複數支撐結構120則用來承載複數個晶圓W,因此複數個晶圓W被設置於第一過濾器130a及第二過濾器130b之間,進而有效過濾複數個晶圓W周遭的氣體分子汙染物。此外,第一過濾器130a及第二過濾器130b的殼體133a、133b具有開口135a、135b,第一過濾器130a的開口135a從殼體133a的上頂部裸露至少部分濾芯131a,而第二過濾器130b的開口135b從殼體133b的下底部裸露至少部分濾芯131b。因此,濾芯131a、131b分別經由開口135a、135b朝向複數個晶圓W裸露於殼體133a、133b,進而有效過濾晶圓W周遭的氣體分子汙染物。For example, the first filter 130a is arranged at the bottom of the plurality of supporting structures 120, and the second filter 130b is arranged at the uppermost of the plurality of supporting structures 120, and the remaining plurality of supporting structures 120 are used to carry a plurality of The wafer W, therefore, a plurality of wafers W is disposed between the first filter 130a and the second filter 130b, so as to effectively filter the gaseous molecular pollutants around the plurality of wafers W. In addition, the casings 133a, 133b of the first filter 130a and the second filter 130b have openings 135a, 135b, the opening 135a of the first filter 130a exposes at least part of the filter element 131a from the upper top of the casing 133a, and the second filter The opening 135b of the filter 130b exposes at least part of the filter element 131b from the lower bottom of the housing 133b. Therefore, the filter elements 131a, 131b are exposed to the shells 133a, 133b facing the plurality of wafers W through the openings 135a, 135b, respectively, so as to effectively filter the gas molecule pollutants around the wafer W.

請參考第5圖,第5圖繪示為第4圖中晶圓容器100b的一些實施方式的前視示意圖,其中晶圓容器100b更包括氣流單元140,其中氣流單元140設置於容置空間115內並用以產生通過第一過濾器130a和/或第二過濾器130b的氣流。此外,氣流單元140設置於複數支撐結構120的一者上,例如氣流單元140是設置於複數支撐結構120的最上者或最下者。Please refer to FIG. 5, which is a schematic front view of some embodiments of the wafer container 100b in FIG. and used to generate air flow through the first filter 130a and/or the second filter 130b. In addition, the airflow unit 140 is disposed on one of the plurality of supporting structures 120 , for example, the airflow unit 140 is disposed on the uppermost or the lowermost of the plurality of supporting structures 120 .

在第5圖中,氣流單元140是設置於複數支撐結構120的最下者,而第一過濾器130a設置於氣流單元140之上 (例如第一過濾器130a是設置於複數支撐結構120中由下往上數的第二者),且第二過濾器130b設置於第一過濾器130a上之上(例如第二過濾器130b是設置於複數支撐結構120中的最上者),而第一過濾器130a及第二過濾器130b之間的支撐結構120用於承載晶圓W。藉此,氣流單元140產生通過第一過濾器130a、第二過濾器130b及複數晶圓W的氣流,以便於有效地過濾容置空間115內的氣體分子汙染物。此外,氣流單元140可搭配有馬達或扇葉等組件,進而驅動氣流,但本發明並不以此為限。In Fig. 5, the airflow unit 140 is arranged at the bottom of the plurality of support structures 120, and the first filter 130a is arranged on the airflow unit 140 (for example, the first filter 130a is arranged in the plurality of support structures 120 by the second one from the bottom to the top), and the second filter 130b is arranged above the first filter 130a (for example, the second filter 130b is the uppermost one arranged in the plurality of support structures 120), and the first filter The supporting structure 120 between the filter 130a and the second filter 130b is used to carry the wafer W. Accordingly, the airflow unit 140 generates airflow passing through the first filter 130a, the second filter 130b and the plurality of wafers W, so as to effectively filter the gas molecule pollutants in the accommodation space 115 . In addition, the airflow unit 140 may be equipped with components such as motors or fan blades to drive the airflow, but the present invention is not limited thereto.

請同時參考第6圖,第6圖為經由第5圖中線段5-5所繪出的上視示意圖。其中,氣流單元140的排氣口141位於氣流單元140的上頂部並相鄰於殼體111的內壁面。藉此,氣流單元140經由排氣口141所產生的氣流不會被氣流單元140上方支撐結構120所乘載的晶圓W所阻礙,氣流單元140進而能有效地在容置空間115中形成循環氣流,以便於第一過濾器130a和/或第二過濾器130b過濾氣體分子汙染物。在本發明的一些實施方式中,氣流單元140的排氣口141則是相鄰於門體111的內壁面,但本發明並不以此為限。Please also refer to Figure 6, which is a schematic top view drawn through the line segment 5-5 in Figure 5. Wherein, the exhaust port 141 of the airflow unit 140 is located on the upper top of the airflow unit 140 and adjacent to the inner wall of the casing 111 . Thereby, the airflow generated by the airflow unit 140 through the exhaust port 141 will not be hindered by the wafer W carried by the support structure 120 above the airflow unit 140 , and the airflow unit 140 can effectively form a circulation in the accommodating space 115 gas flow so that the first filter 130a and/or the second filter 130b filters gaseous molecular pollutants. In some embodiments of the present invention, the exhaust port 141 of the airflow unit 140 is adjacent to the inner wall of the door body 111 , but the present invention is not limited thereto.

在本發明的一些實施方式中,晶圓容器100更包括電源模組150,電源模組150設置於容置空間115內並連接氣流單元140,電源模組150用以供電給氣流單元140並具有無線充電功能。藉此,在門體113蓋闔於盒體111時,電源模組150仍能夠進行充電,而不需要將門體113分離於盒體111。因此,電源模組150的充電過程不會影響到容置空間115內的氣體。舉例來說,電源模組150可包括無線充電晶片和/或無線充電用的線圈結構,但本發明並不以此為限。In some embodiments of the present invention, the wafer container 100 further includes a power module 150, the power module 150 is arranged in the accommodating space 115 and connected to the air flow unit 140, the power module 150 is used to supply power to the air flow unit 140 and has Wireless charging function. In this way, when the door 113 is closed on the box body 111 , the power module 150 can still be charged without separating the door 113 from the box body 111 . Therefore, the charging process of the power module 150 will not affect the gas in the accommodating space 115 . For example, the power module 150 may include a wireless charging chip and/or a coil structure for wireless charging, but the invention is not limited thereto.

請同時參考第7圖,第7圖是由第5圖中剖面線5-5所繪示的上視示意圖。本發明的另一些實施方式中,晶圓容器100包括第一氣流單元140a及第二氣流單元140b,其中第一氣流單元140a及第二氣流單元140b大致與第6圖中的氣流單元140相同。由第7圖中可知,第一氣流單元140a及第二氣流單元140b沿著橫向H對準並間隔設置於容置空間115內。此外,第一氣流單元140a及第二氣流單元140b分別用於產生方向相反的氣流。也就是說,第一氣流單元140a的頂部的排氣口141a及第二氣流單元140b的頂部的排氣口141b分別會沿著縱向V向上及向下產生氣流。藉此,第一氣流單元140a及第二氣流單元140b能有效地在容置空間115中形成循環氣流,以便於第一過濾器130a和/或第二過濾器130b有效地過濾氣體分子汙染物。Please refer to FIG. 7 at the same time. FIG. 7 is a schematic top view shown by section line 5-5 in FIG. 5 . In other embodiments of the present invention, the wafer container 100 includes a first airflow unit 140a and a second airflow unit 140b, wherein the first airflow unit 140a and the second airflow unit 140b are substantially the same as the airflow unit 140 in FIG. 6 . As can be seen from FIG. 7 , the first airflow unit 140 a and the second airflow unit 140 b are aligned along the horizontal direction H and arranged at intervals in the accommodating space 115 . In addition, the first airflow unit 140a and the second airflow unit 140b are respectively used to generate airflows in opposite directions. That is to say, the air outlet 141 a at the top of the first air flow unit 140 a and the air outlet 141 b at the top of the second air flow unit 140 b generate air flow upward and downward along the longitudinal direction V, respectively. Thereby, the first airflow unit 140a and the second airflow unit 140b can effectively form a circulating airflow in the accommodating space 115, so that the first filter 130a and/or the second filter 130b can effectively filter gaseous molecular pollutants.

在本發明的一些實施方式中,第一氣流單元140a及第二氣流單元140b分別設置於電源模組150的相反兩側,排氣口141a及排氣口141b分別相鄰於盒體111的對立的內壁,但本發明並不以此為限。在另一些實施方式中,第一氣流單元140a的排氣口141a相鄰於門體113的內壁面,而第二氣流單元140b的排氣口141b則相鄰於盒體111的一壁面,其中盒體111的所述內壁面對立於門體113的內壁面。In some embodiments of the present invention, the first airflow unit 140a and the second airflow unit 140b are respectively disposed on opposite sides of the power module 150, and the exhaust port 141a and the exhaust port 141b are respectively adjacent to opposite sides of the box body 111. The inner wall, but the present invention is not limited thereto. In other embodiments, the exhaust port 141a of the first airflow unit 140a is adjacent to the inner wall of the door body 113, and the exhaust port 141b of the second airflow unit 140b is adjacent to a wall of the box body 111, wherein The inner wall of the box body 111 is upright to the inner wall of the door body 113 .

請參考第8圖,第8圖繪示晶圓容器100的功能方塊圖。在本發明的一些實施方式中,晶圓容器100更包括控制器160及氣體感測器170,控制器160及氣體感測器170設置於容置空間115內,控制器160連接氣體感測器170及氣流單元140,氣體感測器170用以感測容置空間115內的氣體分子汙染物。當氣體感測器170偵測到容置空間115內的氣體分子汙染物到達或超過預設的濃度閾值時,控制器160驅動氣流單元140產生通過過濾器130的氣流。具體而言,電源模組150可供電給控制器160及氣體感測器170。控制器160可以為中央處理器(CPU;Central Processing Unit)、微處理器或其他具有運算功能的運算裝置,控制器160可搭配軟體、韌體或其他硬體來驅動氣流單元140運轉,而氣體感測器170包括晶片型氣體感測器,但本發明不以此為限。Please refer to FIG. 8 , which shows a functional block diagram of the wafer container 100 . In some embodiments of the present invention, the wafer container 100 further includes a controller 160 and a gas sensor 170, the controller 160 and the gas sensor 170 are arranged in the accommodating space 115, and the controller 160 is connected to the gas sensor 170 and the airflow unit 140 , the gas sensor 170 is used for sensing gas molecular pollutants in the accommodating space 115 . When the gas sensor 170 detects that the gas molecular pollutants in the accommodating space 115 reach or exceed a preset concentration threshold, the controller 160 drives the airflow unit 140 to generate airflow through the filter 130 . Specifically, the power module 150 can supply power to the controller 160 and the gas sensor 170 . The controller 160 can be a central processing unit (CPU; Central Processing Unit), a microprocessor or other computing devices with computing functions. The controller 160 can be used with software, firmware or other hardware to drive the air flow unit 140 to run, and the gas The sensor 170 includes a wafer-type gas sensor, but the invention is not limited thereto.

在本發明的一些實施方式中,晶圓容器100包括濕度感測器180,濕度感測器180連接電源模組150及控制器160,且濕度感測器180設置於容置空間115內並用以偵測容置空間115內的溼度。當濕度感測器180偵測到容置空間115內的溼度到達或超過預設的溼度閾值時,控制器160驅動氣流單元140產生通過過濾器130的氣流。In some embodiments of the present invention, the wafer container 100 includes a humidity sensor 180, the humidity sensor 180 is connected to the power module 150 and the controller 160, and the humidity sensor 180 is arranged in the accommodating space 115 and used for Humidity in the accommodation space 115 is detected. When the humidity sensor 180 detects that the humidity in the accommodating space 115 reaches or exceeds a preset humidity threshold, the controller 160 drives the airflow unit 140 to generate airflow through the filter 130 .

綜上所述,本發明的晶圓容器具有密閉的容置空間,可以將晶圓及過濾器放置於晶圓容器的容置空間內,過濾器將容置空間內的氣體分子汙染物過濾,進而降低氣體分子汙染物的濃度,因此能避免晶圓容器內的晶圓受到氣體分子汙染物影響而降低品質。In summary, the wafer container of the present invention has an airtight accommodating space, and the wafer and the filter can be placed in the accommodating space of the wafer container, and the filter filters the gas molecular pollutants in the accommodating space, Furthermore, the concentration of the gas molecule pollutants is reduced, so that the quality of the wafers in the wafer container can be prevented from being affected by the gas molecule pollutants.

於本發明的內文中,說明書中的用語在所使用的特定上下文中具有本技術領域中的普通涵義。特定的用語用於闡釋本說明書之具體內容,便於引導本發明的通常知識者閱讀本說明書。為便於說明,某些用語特別標示,例如使用斜體和/或引號。這種特別標示並不影響用語的涵義或範圍,也就是說不論某些用語是否被特別標示,並不影響這些用語的涵義或範圍。應當理解的是,可以用不同方式描述同樣的元件。因此,在此討論的任何用詞皆可使用替代用語或同義詞替換之,也不在本文中闡述或討論用語是否有任何特殊意義。所舉例的一個或多個用詞並不會排除其他同義詞。本說明書中例示性的用語僅用於闡述而不限制本發明的涵義或範圍。相同地,本發明也不會被說明書中的實施方式所限制。In the context of the present invention, terms in the specification have their ordinary meanings in the technical field in the specific contexts used. Specific terms are used to explain the specific content of this specification, so as to guide those with ordinary knowledge of the present invention to read this specification. For ease of description, certain terms are highlighted, eg, in italics and/or in quotation marks. Such special marking does not affect the meaning or scope of the terms, that is to say, whether some terms are specially marked or not does not affect the meaning or scope of these terms. It should be understood that the same elements may be described in different ways. Accordingly, any terms discussed herein may be replaced by alternative terms or synonyms, nor is it stated or discussed herein whether the terms have any special meaning. The exemplification of one or more terms does not exclude other synonyms. The illustrative terms in this specification are used for illustration only and do not limit the meaning or scope of the present invention. Likewise, the present invention is not limited by the embodiments described in the specification.

100, 100a, 100b:晶圓容器 110:容器本體 111:盒體 113:門體 115:容置空間 120:支撐結構 130:過濾器 130a:第一過濾器 130b:第二過濾器 131:濾芯 133:殼體 135:開口 140:氣流單元 140a:第一氣流單元 140b:第二氣流單元 141, 141a, 141b:排氣口 150:電源模組 160:控制器 170:氣體感測器 180:濕度感測器 V:縱向 W:晶圓 H:橫向 100, 100a, 100b: wafer container 110: container body 111: box body 113: door body 115:Accommodating space 120:Support structure 130: filter 130a: first filter 130b: second filter 131: filter element 133: Shell 135: opening 140: Airflow unit 140a: first air flow unit 140b: Second Airflow Unit 141, 141a, 141b: Exhaust ports 150: Power module 160: controller 170: gas sensor 180: humidity sensor V: Vertical W: Wafer H: Horizontal

為達成上述的優點和特徵,將參考實施方式對上述簡要描述的原理進行更具體的闡釋,而具體實施方式被展現在附圖中。這些附圖僅例示性地描述本發明,因此不限制發明的範圍。通過附圖,將清楚解釋本發明的原理,且附加的特徵和細節將被完整描述,其中: 第1圖繪示為本發明一個或多個實施方式中晶圓容器的立體示意圖; 第2圖繪示為本發明一個或多個實施方式中晶圓容器的前視示意圖 第3圖繪示為本發明一個或多個實施方式中過濾器的上視圖; 第4圖繪示為本發明一個或多個實施方式中晶圓容器的前視示意圖; 第5圖繪示為第4圖中晶圓容器的一些實施方式的前視示意圖; 第6圖繪示為第5圖中線段5-5所繪出的上視示意圖; 第7圖繪示為第5圖中線段5-5所繪出的上視示意圖;以及 第8圖繪示本發明一個或多個實施方式中晶圓容器的功能方塊圖。 In order to achieve the above advantages and features, the principles of the above brief description will be more specifically explained with reference to the embodiments shown in the accompanying drawings. These drawings illustrate the invention only, and therefore do not limit the scope of the invention. The principles of the invention will be clearly explained and additional features and details will be fully described by means of the accompanying drawings, in which: FIG. 1 is a schematic perspective view of a wafer container in one or more embodiments of the present invention; Figure 2 is a schematic front view of a wafer container in one or more embodiments of the present invention Figure 3 is a top view of a filter according to one or more embodiments of the present invention; FIG. 4 is a schematic front view of a wafer container in one or more embodiments of the present invention; FIG. 5 is a schematic front view of some embodiments of the wafer container in FIG. 4; Figure 6 is a schematic top view drawn by line segment 5-5 in Figure 5; Figure 7 is a schematic top view drawn by line segment 5-5 in Figure 5; and Figure 8 illustrates a functional block diagram of a wafer container in one or more embodiments of the present invention.

國內寄存資訊(請依寄存機構、日期、號碼順序註記) 無 國外寄存資訊(請依寄存國家、機構、日期、號碼順序註記) 無 Domestic deposit information (please note in order of depositor, date, and number) none Overseas storage information (please note in order of storage country, institution, date, and number) none

100:晶圓容器 110:容器本體 111:盒體 115:容置空間 120:支撐結構 130:過濾器 131:濾芯 133:殼體 135:開口 V:縱向 W:晶圓 H:橫向 100: wafer container 110: container body 111: box body 115:Accommodating space 120:Support structure 130: filter 131: filter element 133: shell 135: opening V: Vertical W: Wafer H: Horizontal

Claims (9)

一種晶圓容器,包括:容器本體,具有密閉的容置空間;複數支撐結構,縱向排列於該容置空間內;以及至少一過濾器,用於過濾氣體分子汙染物,其中該至少一過濾器設置於該容置空間內,該些支撐結構的至少一者承載該至少一過濾器,其中該至少一過濾器包括第一過濾器及第二過濾器,該些支撐結構中的最上者及最下者分別承載該第一過濾器及該第二過濾器。 A wafer container, comprising: a container body with an airtight accommodating space; a plurality of support structures arranged longitudinally in the accommodating space; and at least one filter for filtering gaseous molecular pollutants, wherein the at least one filter Set in the accommodating space, at least one of the supporting structures carries the at least one filter, wherein the at least one filter includes a first filter and a second filter, the uppermost and the uppermost of the supporting structures The lower one carries the first filter and the second filter respectively. 如請求項1所述之晶圓容器,更包括氣流單元,其中該氣流單元設置於該容置空間內並用以產生通過該至少一過濾器的氣流。 The wafer container as claimed in claim 1 further comprises an air flow unit, wherein the air flow unit is disposed in the containing space and used for generating air flow through the at least one filter. 如請求項2所述之晶圓容器,其中該氣流單元設置於該些支撐結構的一者上。 The wafer container as claimed in claim 2, wherein the airflow unit is disposed on one of the supporting structures. 如請求項1所述之晶圓容器,更包括第一氣流單元及第二氣流單元,其中該第一氣流單元及該第二氣流單元橫向間隔設置於該容置空間內,該第一氣流單元及該第二氣流單元分別用於產生方向相反的縱向氣流。 The wafer container as described in Claim 1 further includes a first airflow unit and a second airflow unit, wherein the first airflow unit and the second airflow unit are laterally spaced apart in the accommodating space, and the first airflow unit and the second airflow unit are respectively used to generate longitudinal airflows in opposite directions. 如請求項1所述之晶圓容器,其中該至少一過濾器包括濾芯及殼體,其中該殼體包覆該濾芯並在縱向 上部分裸露該濾芯。 The wafer container as claimed in claim 1, wherein the at least one filter includes a filter element and a housing, wherein the housing covers the filter element and is vertically The upper part exposes the filter element. 如請求項5所述之晶圓容器,其中該濾芯為活性碳濾芯。 The wafer container according to claim 5, wherein the filter element is an activated carbon filter element. 如請求項1所述之晶圓容器,更包括氣體感測器,其中該氣體感測器用以感測該容置空間內的氣體分子汙染物。 The wafer container as claimed in claim 1 further includes a gas sensor, wherein the gas sensor is used for sensing gas molecular pollutants in the containing space. 如請求項1所述之晶圓容器,更包括控制器、氣流單元及氣體感測器,該控制器連接該氣體感測器及該氣流單元,當該氣體感測器偵測到該容置空間內的氣體分子汙染物到達或超過濃度閾值時,該控制器驅動該氣流單元產生通過該至少一過濾器的氣流。 The wafer container as described in claim 1 further includes a controller, a gas flow unit and a gas sensor, the controller is connected to the gas sensor and the gas flow unit, when the gas sensor detects that the container When the gas molecular pollutants in the space reach or exceed the concentration threshold, the controller drives the airflow unit to generate airflow through the at least one filter. 如請求項1所述之晶圓容器,更包括電源模組及氣流單元,其中該電源模組連接該氣流單元,該電源模組用以供電給該氣流單元並具有無線充電功能,而該氣流單元用以產生通過該至少一過濾器的氣流。 The wafer container as described in claim 1 further includes a power supply module and an airflow unit, wherein the power supply module is connected to the airflow unit, the power supply module is used to supply power to the airflow unit and has a wireless charging function, and the airflow unit A unit is used to generate air flow through the at least one filter.
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Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201533829A (en) * 2014-02-07 2015-09-01 Taiwan Semiconductor Mfg Apparatus, semiconductor wafer process system and method for manufacturing semiconductor wafer
CN108231636A (en) * 2016-12-13 2018-06-29 Tdk株式会社 Wafer conveying container and its interior atmosphere measuring device, cleaning device and method

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201533829A (en) * 2014-02-07 2015-09-01 Taiwan Semiconductor Mfg Apparatus, semiconductor wafer process system and method for manufacturing semiconductor wafer
CN108231636A (en) * 2016-12-13 2018-06-29 Tdk株式会社 Wafer conveying container and its interior atmosphere measuring device, cleaning device and method

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