TWI779448B - Wafer container - Google Patents
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- TWI779448B TWI779448B TW110100156A TW110100156A TWI779448B TW I779448 B TWI779448 B TW I779448B TW 110100156 A TW110100156 A TW 110100156A TW 110100156 A TW110100156 A TW 110100156A TW I779448 B TWI779448 B TW I779448B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67389—Closed carriers characterised by atmosphere control
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67389—Closed carriers characterised by atmosphere control
- H01L21/67393—Closed carriers characterised by atmosphere control characterised by the presence of atmosphere modifying elements inside or attached to the closed carrierl
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Abstract
Description
本發明關於一種容器,特別涉及用於收納晶圓的容器。The present invention relates to a container, in particular to a container for accommodating wafers.
在半導體製造工業中,前開式晶圓傳送盒(Front Opening Unified Pod;FOUP)為一種存放半導體晶圓的可攜式容器。在製程步驟之間,鑑於各種因素,諸如生產運行、迴圈次數的多寡等,晶圓可能存放於前開式晶圓傳送盒內一段時間。在這段時間內,氧氣或濕氣可能滲入至前開式晶圓傳送盒。不幸地,氧氣及濕氣可能對半導體晶圓的表面造成有害的影響,故減少晶圓表面曝露於這些元素是必要的。In the semiconductor manufacturing industry, a Front Opening Unified Pod (FOUP) is a portable container for storing semiconductor wafers. Between process steps, wafers may be stored in the FOUP for a period of time due to various factors such as production runs, number of cycles, etc. During this time, oxygen or moisture may seep into the FOUP. Unfortunately, oxygen and moisture can have detrimental effects on the surface of semiconductor wafers, so it is necessary to reduce the exposure of the wafer surface to these elements.
為解決上述問題本發明提供一種晶圓容器,其包括容器本體、複數支撐結構及過濾器。容器本體具有密閉的容置空間。複數支撐結構縱向排列於容置空間內。過濾器則用於過濾氣體分子汙染物,其中過濾器設置於容置空間內,複數支撐結構的一者承載過濾器。To solve the above problems, the present invention provides a wafer container, which includes a container body, a plurality of support structures and a filter. The container body has a closed accommodating space. Multiple support structures are arranged longitudinally in the accommodation space. The filter is used for filtering gas molecular pollutants, wherein the filter is arranged in the containing space, and one of the plurality of supporting structures carries the filter.
在本發明的一個或多個實施方式中,晶圓容器更包括氣流單元,其中氣流單元設置於容置空間內並用以產生通過至少一過濾器的氣流。In one or more embodiments of the present invention, the wafer container further includes an airflow unit, wherein the airflow unit is disposed in the accommodating space and used to generate airflow passing through at least one filter.
在本發明的一個或多個實施方式中,氣流單元設置於些支撐結構的上方或下方。In one or more embodiments of the present invention, the airflow unit is disposed above or below the supporting structures.
在本發明的一個或多個實施方式中,晶圓容器更包括第一氣流單元及第二氣流單元,其中第一氣流單元及第二氣流單元橫向間隔設置於容置空間內,第一氣流單元及第二氣流單元分別用於產生方向相反的縱向氣流。In one or more embodiments of the present invention, the wafer container further includes a first airflow unit and a second airflow unit, wherein the first airflow unit and the second airflow unit are laterally spaced in the accommodation space, and the first airflow unit and the second airflow unit are respectively used to generate longitudinal airflows in opposite directions.
在本發明的一個或多個實施方式中,至少一過濾器包括第一過濾器及第二過濾器,些支撐結構中的最上者及最下者分別承載第一過濾器及第二過濾器。In one or more embodiments of the present invention, at least one filter includes a first filter and a second filter, and the uppermost and the lowermost of the supporting structures respectively carry the first filter and the second filter.
在本發明的一個或多個實施方式中,至少一過濾器包括濾芯及殼體,其中殼體包覆濾芯並在縱向上部分裸露濾芯。In one or more embodiments of the present invention, at least one filter includes a filter element and a casing, wherein the casing covers the filter element and partially exposes the filter element in the longitudinal direction.
在本發明的一個或多個實施方式中,濾芯為活性碳濾芯或其他用以濾除氣體分子汙染物之濾材。In one or more embodiments of the present invention, the filter element is an activated carbon filter element or other filter materials for filtering gas molecular pollutants.
在本發明的一個或多個實施方式中,晶圓容器更包括氣體感測器,氣體感測器用以感測容置空間內的氣體分子汙染物。In one or more embodiments of the present invention, the wafer container further includes a gas sensor for sensing gas molecule pollutants in the containing space.
在本發明的一個或多個實施方式中,晶圓容器更包括控制器、氣流單元及氣體感測器,控制器連接氣體感測器及氣流單元,當氣體感測器偵測到容置空間內的氣體分子汙染物到達或超過濃度閾值時,控制器驅動氣流單元產生通過至少一過濾器的氣流。In one or more embodiments of the present invention, the wafer container further includes a controller, an airflow unit, and a gas sensor. The controller is connected to the gas sensor and the airflow unit. When the gas sensor detects that the accommodating space When the gas molecular pollutants in the gas reach or exceed the concentration threshold, the controller drives the airflow unit to generate airflow through at least one filter.
在本發明的一個或多個實施方式中,晶圓容器更包括電源模組及氣流單元,其中電源模組連接氣流單元,電源模組用以供電給氣流單元並具有無線充電功能,而氣流單元用以產生通過至少一過濾器的氣流。In one or more embodiments of the present invention, the wafer container further includes a power supply module and an airflow unit, wherein the power supply module is connected to the airflow unit, the power supply module is used to supply power to the airflow unit and has a wireless charging function, and the airflow unit for generating air flow through at least one filter.
綜上所述,本發明的晶圓容器具有密閉的容置空間,可以將晶圓及過濾器放置於晶圓容器的容置空間內,過濾器將容置空間內的氣體分子汙染物過濾,進而降低氣體分子汙染物的濃度,因此能避免晶圓容器內的晶圓受到氣體分子汙染物影響而降低品質。In summary, the wafer container of the present invention has an airtight accommodating space, and the wafer and the filter can be placed in the accommodating space of the wafer container, and the filter filters the gas molecular pollutants in the accommodating space, Furthermore, the concentration of the gas molecule pollutants is reduced, so that the quality of the wafers in the wafer container can be prevented from being affected by the gas molecule pollutants.
以上所述僅係用以闡述本發明所欲解決的問題、解決問題的技術手段、及其產生的功效等等,本發明之具體細節將在下文的實施方式及相關圖式中詳細介紹。The above description is only used to illustrate the problem to be solved by the present invention, the technical means for solving the problem, and the effects thereof, etc. The specific details of the present invention will be described in detail in the following implementation methods and related drawings.
以下將以圖式揭露本發明之複數個實施方式,為明確說明起見,許多實務上的細節將在以下敘述中一併說明。然而,應瞭解到,這些實務上的細節不應用以限制本發明。也就是說,在本發明部分實施方式中,這些實務上的細節是非必要的。除此之外,為簡化圖式起見,一些習知慣用的結構與元件在圖式中將以簡單示意的方式繪示之。Several embodiments of the present invention will be disclosed in the following figures. For the sake of clarity, many practical details will be described together in the following description. It should be understood, however, that these practical details should not be used to limit the invention. That is, in some embodiments of the present invention, these practical details are unnecessary. In addition, for the sake of simplifying the drawings, some commonly used structures and elements will be shown in a simple and schematic manner in the drawings.
請參考第1圖,第1圖繪示為本發明一個或多個實施方式中晶圓容器100的立體示意圖,其中晶圓容器100包括容器本體110及複數個支撐結構120。容器本體110包括盒體111、門體113及盒體111所定義出的容置空間115,當門體113蓋闔於盒體111時,容器本體110的容置空間115是密閉的。具體而言,晶圓容器100為前開式晶圓傳送盒(front opening unified fod),但本發明並不以此為限。Please refer to FIG. 1 , which is a perspective view of a
請同時參考第2圖,第2圖繪示為本發明一個或多個實施方式中晶圓容器100的前視示意圖,複數支撐結構120設置於容置空間115內,且複數支撐結構120沿縱向V排列於盒體111的內側壁上,藉此支撐結構120可用於承載晶圓W。具體而言,支撐結構120為晶圓槽,但本發明並不以此為限。在本揭露中,縱向V及上下方向為同一軸向,而上下方向可分別代表縱向V上的相反方向。此外,本揭露中的橫向H與縱向V為大致相互垂直的兩軸向。Please refer to FIG. 2 at the same time. FIG. 2 is a schematic front view of the
在本發明的一些實施方式中,晶圓容器100更包括過濾器130,過濾器130用於過濾氣體分子汙染物(airborne molecular contamination),其中過濾器130設置於容置空間115內,複數支撐結構120的一者承載過濾器130,其中氣體分子汙染物會經由擴散被過濾器130吸附,進而降低晶圓容器100內氣體分子汙染物的濃度。具體而言,過濾器130包括濾芯131及殼體133,其中殼體133包覆濾芯131並在縱向V上部分裸露濾芯131。舉例而言,過濾器130設置於複數支撐結構120中的最下者,而殼體133具有開口135,開口135從殼體133的上方裸露至少部分濾芯131。此外,可以將複數個晶圓W設置於過濾器130上方,濾芯131經由開口135朝向上方的複數個晶圓W裸露,藉此濾芯131能有效地過濾晶圓W周遭的氣體分子汙染物。具體而言,濾芯131可以是活性碳濾芯或其他用以濾除氣體分子汙染物之濾材,進而過濾容置空間115內氣體分子汙染物,但本發明並不以此為限。In some embodiments of the present invention, the
請參考第3圖,第3圖繪示為本發明過濾器130的上視圖。在本發明的一些實施方式中,過濾器130的殼體133為圓盤狀,而殼體133的開口135也是圓形,藉此殼體133經由開口135從殼體133的上頂部大面積地露出濾芯131,但本發明並不以此為限。Please refer to FIG. 3 , which is a top view of the
請參考第4圖,第4圖繪示為本發明一些實施方式中晶圓容器100a的前視示意圖。晶圓容器100a更包括第一過濾器130a及第二過濾器130b,第一過濾器130a及第二過濾器130b用於過濾氣體分子汙染物並與前述的過濾器130大致相同,其中第一過濾器130a及第二過濾器130b設置於容置空間115內,複數支撐結構120中的兩者分別承載第一過濾器130a及第二過濾器130b。具體而言,第一過濾器130a包括濾芯131a及殼體133a,其中殼體133a包覆濾芯131a並在縱向V上部分裸露濾芯131a。第二過濾器130b也包括濾芯131b及殼體133b,其中殼體133b包覆濾芯131b並在縱向V上部分裸露濾芯131b。Please refer to FIG. 4, which is a schematic front view of the
舉例而言,第一過濾器130a設置於複數支撐結構120中的最下者,而第二過濾器130b設置於複數支撐結構120中的最上者,其餘的複數支撐結構120則用來承載複數個晶圓W,因此複數個晶圓W被設置於第一過濾器130a及第二過濾器130b之間,進而有效過濾複數個晶圓W周遭的氣體分子汙染物。此外,第一過濾器130a及第二過濾器130b的殼體133a、133b具有開口135a、135b,第一過濾器130a的開口135a從殼體133a的上頂部裸露至少部分濾芯131a,而第二過濾器130b的開口135b從殼體133b的下底部裸露至少部分濾芯131b。因此,濾芯131a、131b分別經由開口135a、135b朝向複數個晶圓W裸露於殼體133a、133b,進而有效過濾晶圓W周遭的氣體分子汙染物。For example, the
請參考第5圖,第5圖繪示為第4圖中晶圓容器100b的一些實施方式的前視示意圖,其中晶圓容器100b更包括氣流單元140,其中氣流單元140設置於容置空間115內並用以產生通過第一過濾器130a和/或第二過濾器130b的氣流。此外,氣流單元140設置於複數支撐結構120的一者上,例如氣流單元140是設置於複數支撐結構120的最上者或最下者。Please refer to FIG. 5, which is a schematic front view of some embodiments of the
在第5圖中,氣流單元140是設置於複數支撐結構120的最下者,而第一過濾器130a設置於氣流單元140之上 (例如第一過濾器130a是設置於複數支撐結構120中由下往上數的第二者),且第二過濾器130b設置於第一過濾器130a上之上(例如第二過濾器130b是設置於複數支撐結構120中的最上者),而第一過濾器130a及第二過濾器130b之間的支撐結構120用於承載晶圓W。藉此,氣流單元140產生通過第一過濾器130a、第二過濾器130b及複數晶圓W的氣流,以便於有效地過濾容置空間115內的氣體分子汙染物。此外,氣流單元140可搭配有馬達或扇葉等組件,進而驅動氣流,但本發明並不以此為限。In Fig. 5, the
請同時參考第6圖,第6圖為經由第5圖中線段5-5所繪出的上視示意圖。其中,氣流單元140的排氣口141位於氣流單元140的上頂部並相鄰於殼體111的內壁面。藉此,氣流單元140經由排氣口141所產生的氣流不會被氣流單元140上方支撐結構120所乘載的晶圓W所阻礙,氣流單元140進而能有效地在容置空間115中形成循環氣流,以便於第一過濾器130a和/或第二過濾器130b過濾氣體分子汙染物。在本發明的一些實施方式中,氣流單元140的排氣口141則是相鄰於門體111的內壁面,但本發明並不以此為限。Please also refer to Figure 6, which is a schematic top view drawn through the line segment 5-5 in Figure 5. Wherein, the
在本發明的一些實施方式中,晶圓容器100更包括電源模組150,電源模組150設置於容置空間115內並連接氣流單元140,電源模組150用以供電給氣流單元140並具有無線充電功能。藉此,在門體113蓋闔於盒體111時,電源模組150仍能夠進行充電,而不需要將門體113分離於盒體111。因此,電源模組150的充電過程不會影響到容置空間115內的氣體。舉例來說,電源模組150可包括無線充電晶片和/或無線充電用的線圈結構,但本發明並不以此為限。In some embodiments of the present invention, the
請同時參考第7圖,第7圖是由第5圖中剖面線5-5所繪示的上視示意圖。本發明的另一些實施方式中,晶圓容器100包括第一氣流單元140a及第二氣流單元140b,其中第一氣流單元140a及第二氣流單元140b大致與第6圖中的氣流單元140相同。由第7圖中可知,第一氣流單元140a及第二氣流單元140b沿著橫向H對準並間隔設置於容置空間115內。此外,第一氣流單元140a及第二氣流單元140b分別用於產生方向相反的氣流。也就是說,第一氣流單元140a的頂部的排氣口141a及第二氣流單元140b的頂部的排氣口141b分別會沿著縱向V向上及向下產生氣流。藉此,第一氣流單元140a及第二氣流單元140b能有效地在容置空間115中形成循環氣流,以便於第一過濾器130a和/或第二過濾器130b有效地過濾氣體分子汙染物。Please refer to FIG. 7 at the same time. FIG. 7 is a schematic top view shown by section line 5-5 in FIG. 5 . In other embodiments of the present invention, the
在本發明的一些實施方式中,第一氣流單元140a及第二氣流單元140b分別設置於電源模組150的相反兩側,排氣口141a及排氣口141b分別相鄰於盒體111的對立的內壁,但本發明並不以此為限。在另一些實施方式中,第一氣流單元140a的排氣口141a相鄰於門體113的內壁面,而第二氣流單元140b的排氣口141b則相鄰於盒體111的一壁面,其中盒體111的所述內壁面對立於門體113的內壁面。In some embodiments of the present invention, the
請參考第8圖,第8圖繪示晶圓容器100的功能方塊圖。在本發明的一些實施方式中,晶圓容器100更包括控制器160及氣體感測器170,控制器160及氣體感測器170設置於容置空間115內,控制器160連接氣體感測器170及氣流單元140,氣體感測器170用以感測容置空間115內的氣體分子汙染物。當氣體感測器170偵測到容置空間115內的氣體分子汙染物到達或超過預設的濃度閾值時,控制器160驅動氣流單元140產生通過過濾器130的氣流。具體而言,電源模組150可供電給控制器160及氣體感測器170。控制器160可以為中央處理器(CPU;Central Processing Unit)、微處理器或其他具有運算功能的運算裝置,控制器160可搭配軟體、韌體或其他硬體來驅動氣流單元140運轉,而氣體感測器170包括晶片型氣體感測器,但本發明不以此為限。Please refer to FIG. 8 , which shows a functional block diagram of the
在本發明的一些實施方式中,晶圓容器100包括濕度感測器180,濕度感測器180連接電源模組150及控制器160,且濕度感測器180設置於容置空間115內並用以偵測容置空間115內的溼度。當濕度感測器180偵測到容置空間115內的溼度到達或超過預設的溼度閾值時,控制器160驅動氣流單元140產生通過過濾器130的氣流。In some embodiments of the present invention, the
綜上所述,本發明的晶圓容器具有密閉的容置空間,可以將晶圓及過濾器放置於晶圓容器的容置空間內,過濾器將容置空間內的氣體分子汙染物過濾,進而降低氣體分子汙染物的濃度,因此能避免晶圓容器內的晶圓受到氣體分子汙染物影響而降低品質。In summary, the wafer container of the present invention has an airtight accommodating space, and the wafer and the filter can be placed in the accommodating space of the wafer container, and the filter filters the gas molecular pollutants in the accommodating space, Furthermore, the concentration of the gas molecule pollutants is reduced, so that the quality of the wafers in the wafer container can be prevented from being affected by the gas molecule pollutants.
於本發明的內文中,說明書中的用語在所使用的特定上下文中具有本技術領域中的普通涵義。特定的用語用於闡釋本說明書之具體內容,便於引導本發明的通常知識者閱讀本說明書。為便於說明,某些用語特別標示,例如使用斜體和/或引號。這種特別標示並不影響用語的涵義或範圍,也就是說不論某些用語是否被特別標示,並不影響這些用語的涵義或範圍。應當理解的是,可以用不同方式描述同樣的元件。因此,在此討論的任何用詞皆可使用替代用語或同義詞替換之,也不在本文中闡述或討論用語是否有任何特殊意義。所舉例的一個或多個用詞並不會排除其他同義詞。本說明書中例示性的用語僅用於闡述而不限制本發明的涵義或範圍。相同地,本發明也不會被說明書中的實施方式所限制。In the context of the present invention, terms in the specification have their ordinary meanings in the technical field in the specific contexts used. Specific terms are used to explain the specific content of this specification, so as to guide those with ordinary knowledge of the present invention to read this specification. For ease of description, certain terms are highlighted, eg, in italics and/or in quotation marks. Such special marking does not affect the meaning or scope of the terms, that is to say, whether some terms are specially marked or not does not affect the meaning or scope of these terms. It should be understood that the same elements may be described in different ways. Accordingly, any terms discussed herein may be replaced by alternative terms or synonyms, nor is it stated or discussed herein whether the terms have any special meaning. The exemplification of one or more terms does not exclude other synonyms. The illustrative terms in this specification are used for illustration only and do not limit the meaning or scope of the present invention. Likewise, the present invention is not limited by the embodiments described in the specification.
100, 100a, 100b:晶圓容器
110:容器本體
111:盒體
113:門體
115:容置空間
120:支撐結構
130:過濾器
130a:第一過濾器
130b:第二過濾器
131:濾芯
133:殼體
135:開口
140:氣流單元
140a:第一氣流單元
140b:第二氣流單元
141, 141a, 141b:排氣口
150:電源模組
160:控制器
170:氣體感測器
180:濕度感測器
V:縱向
W:晶圓
H:橫向
100, 100a, 100b: wafer container
110: container body
111: box body
113: door body
115:Accommodating space
120:Support structure
130:
為達成上述的優點和特徵,將參考實施方式對上述簡要描述的原理進行更具體的闡釋,而具體實施方式被展現在附圖中。這些附圖僅例示性地描述本發明,因此不限制發明的範圍。通過附圖,將清楚解釋本發明的原理,且附加的特徵和細節將被完整描述,其中: 第1圖繪示為本發明一個或多個實施方式中晶圓容器的立體示意圖; 第2圖繪示為本發明一個或多個實施方式中晶圓容器的前視示意圖 第3圖繪示為本發明一個或多個實施方式中過濾器的上視圖; 第4圖繪示為本發明一個或多個實施方式中晶圓容器的前視示意圖; 第5圖繪示為第4圖中晶圓容器的一些實施方式的前視示意圖; 第6圖繪示為第5圖中線段5-5所繪出的上視示意圖; 第7圖繪示為第5圖中線段5-5所繪出的上視示意圖;以及 第8圖繪示本發明一個或多個實施方式中晶圓容器的功能方塊圖。 In order to achieve the above advantages and features, the principles of the above brief description will be more specifically explained with reference to the embodiments shown in the accompanying drawings. These drawings illustrate the invention only, and therefore do not limit the scope of the invention. The principles of the invention will be clearly explained and additional features and details will be fully described by means of the accompanying drawings, in which: FIG. 1 is a schematic perspective view of a wafer container in one or more embodiments of the present invention; Figure 2 is a schematic front view of a wafer container in one or more embodiments of the present invention Figure 3 is a top view of a filter according to one or more embodiments of the present invention; FIG. 4 is a schematic front view of a wafer container in one or more embodiments of the present invention; FIG. 5 is a schematic front view of some embodiments of the wafer container in FIG. 4; Figure 6 is a schematic top view drawn by line segment 5-5 in Figure 5; Figure 7 is a schematic top view drawn by line segment 5-5 in Figure 5; and Figure 8 illustrates a functional block diagram of a wafer container in one or more embodiments of the present invention.
國內寄存資訊(請依寄存機構、日期、號碼順序註記) 無 國外寄存資訊(請依寄存國家、機構、日期、號碼順序註記) 無 Domestic deposit information (please note in order of depositor, date, and number) none Overseas storage information (please note in order of storage country, institution, date, and number) none
100:晶圓容器 110:容器本體 111:盒體 115:容置空間 120:支撐結構 130:過濾器 131:濾芯 133:殼體 135:開口 V:縱向 W:晶圓 H:橫向 100: wafer container 110: container body 111: box body 115:Accommodating space 120:Support structure 130: filter 131: filter element 133: shell 135: opening V: Vertical W: Wafer H: Horizontal
Claims (9)
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TW110100156A TWI779448B (en) | 2021-01-04 | 2021-01-04 | Wafer container |
CN202110561108.8A CN114724988A (en) | 2021-01-04 | 2021-05-21 | Wafer container |
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TW110100156A TWI779448B (en) | 2021-01-04 | 2021-01-04 | Wafer container |
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TW202228188A TW202228188A (en) | 2022-07-16 |
TWI779448B true TWI779448B (en) | 2022-10-01 |
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Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW201533829A (en) * | 2014-02-07 | 2015-09-01 | Taiwan Semiconductor Mfg | Apparatus, semiconductor wafer process system and method for manufacturing semiconductor wafer |
CN108231636A (en) * | 2016-12-13 | 2018-06-29 | Tdk株式会社 | Wafer conveying container and its interior atmosphere measuring device, cleaning device and method |
-
2021
- 2021-01-04 TW TW110100156A patent/TWI779448B/en active
- 2021-05-21 CN CN202110561108.8A patent/CN114724988A/en active Pending
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Publication number | Priority date | Publication date | Assignee | Title |
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TW201533829A (en) * | 2014-02-07 | 2015-09-01 | Taiwan Semiconductor Mfg | Apparatus, semiconductor wafer process system and method for manufacturing semiconductor wafer |
CN108231636A (en) * | 2016-12-13 | 2018-06-29 | Tdk株式会社 | Wafer conveying container and its interior atmosphere measuring device, cleaning device and method |
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CN114724988A (en) | 2022-07-08 |
TW202228188A (en) | 2022-07-16 |
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