TWI776317B - All-round correction module - Google Patents

Abstract

An omnidirectional calibration module, which includes a transmission unit, which has an installation plane, and the transmission unit has a degree of freedom to move in space; a suction nozzle unit, which has an adsorption end and an oppositely arranged installation end, the adsorption end can adsorb a For wafers or other objects to be adsorbed, the mounting end is detachably mounted on the mounting plane of the transmission unit; an adjusting unit has an adjusting end corresponding to the shape of the suction nozzle unit and a control element, and the adjusting end makes the suction nozzle unit on the mounting plane moving and rotating; and a visual recognition unit, which is electrically connected to the control element of the adjustment unit. The present invention uses the visual recognition unit to identify the difference between the wafer and the position required by the system, and then uses the adjustment unit to move the suction nozzle unit for alignment. Compared with the conventional device method, the invention has the effect of aligning the wafer quickly and safely.

Description

All-round correction module

The present invention relates to a wafer moving device, in particular to an omnidirectional calibration module that can quickly and safely align the wafer.

Wafers have become an indispensable part of life in the modern age with advanced technology, but wafers must undergo many moves between devices during processing, so there are many devices that move wafers. However, when the conventional method moves the wafer to be placed in the tray or performs subsequent operations, because the wafer cannot be perfectly sucked in the predetermined position and angle of the system every time, the transmission module must be fine-tuned in position and angle to be able to The wafer can be oriented smoothly to proceed to the next process, or an additional adjustment module is used to move the wafer that has been sucked up, or the transmission module first places the wafer on an intermediate platform, and the intermediate platform first moves and rotates the wafer. After the angle is turned, the transmission module performs another suction to facilitate subsequent actions; but these three methods have their own shortcomings, such as: the transmission module itself is large and not suitable for rapid movement, so it takes time to align; some wafers are thin It is also brittle and not suitable for being clamped by the adjustment module; if one more transfer to the intermediary platform is carried out, there is an additional risk of wafer collision, and the intermediary platform is also difficult to move quickly.

In view of this, the inventors of the present invention have devoted themselves to research and design, hoping to provide a device for safely and quickly aligning a chip, which is the motivation of the present invention.

The main purpose of the omnidirectional calibration module of the present invention is to provide an omnidirectional calibration module for safely and quickly aligning the wafer, so as to adjust the unit adjustment and the position and angle of the rotating suction nozzle unit to increase the speed of aligning the wafer.

The omnidirectional calibration module of the present invention includes a transmission unit, which has an installation plane, and the transmission unit has a degree of freedom to move in space; a suction nozzle unit, which has an adsorption end and an oppositely arranged installation end, and the adsorption end can be A wafer or other object to be adsorbed is adsorbed, and the mounting end is detachably mounted on the mounting plane of the transmission unit; an adjusting unit has an adjusting end corresponding to the shape of the suction nozzle unit and a control element, and the adjusting end enables the suction nozzle unit to be installed moving and rotating on the plane; and a visual recognition unit, which is electrically connected to the control element of the adjustment unit.

The present invention uses the visual recognition unit to identify the predetermined position and angle difference between the wafer and the system, and then uses the adjustment unit to move and rotate the suction nozzle unit to align the wafer, without repeatedly moving the heavy transmission unit, and without The clamping of the wafer is moved, and no intermediate platform is used, which has the effect of aligning the wafer quickly and safely compared with the conventional method.

The installation end of the suction nozzle unit can extend along the extending direction of the installation plane with an installation flange, so as to facilitate the installation of the suction nozzle unit. The transmission unit can be a robotic arm.

The nozzle unit can be installed by magnetic force, vacuum or multiple spring clips on the mounting surface.

In order to further understand the features, characteristics and technical content of the present invention, please refer to the following detailed description of the present invention.

Please refer to the first to fourth figures, which reveal the drawings of the embodiments of the present invention. The embodiment (1) of the omnidirectional calibration module of the present invention includes a transmission unit 1, which has an installation plane 10, and the transmission unit 1 With freedom of movement in space, the transmission unit 1 can be a robotic arm; a suction nozzle unit 2 has a suction end 20 and an oppositely arranged mounting end 21, and the suction end 20 can absorb a wafer A or other objects to be absorbed. The article, the installation end 21 is detachably installed on the installation plane 10 of the transmission unit 1, in this embodiment (1), the installation end 21 of the suction nozzle unit 2 extends along the extension direction of the installation plane 10. A mounting flange 211 ; an adjustment unit 3, which has an adjustment end 31 corresponding to the shape of the suction nozzle unit 2 and a control element (not drawn), the adjustment end 31 makes the suction nozzle unit 2 move the position and rotation angle on the installation plane 10, in this embodiment (1) The adjustment end 31 has two clamping jaws 311, so that the adjustment end 31 can use each clamping jaw 311 to clamp the nozzle unit 2 from both sides to move and rotate the angle so that the wafer A is aligned with the tray B, and the adjustment unit 3 can have a movable joint ( not shown) to rotate the suction nozzle unit 2; and a visual recognition unit 4, which is electrically connected to the control element (not shown) of the adjustment unit 3. In the second figure, after the visual recognition unit 4 identifies the predetermined position and angle difference between the wafer A and the system, the adjustment unit 3 is used to move and rotate the suction nozzle unit 2 for alignment, and then allow the wafer to proceed to the next predetermined process or As shown in Figure 3, move the wafer A to another position to place the wafer A on a tray B. There is no need to repeatedly move the heavy transmission unit 1, and there is no need to clamp the wafer A to move, so there is no fear of damaging the wafer, and no intermediate platform is used to move the wafer A. The number of operations is increased, and the effect of aligning the wafer A is faster and safer than the conventional method. Embodiment (1) As shown in the fourth figure, at least one magnetic element 101 is provided on the installation plane 10 , so that the suction nozzle unit 2 is magnetically attached to the installation plane 10 , and the magnetic element 101 can also be disposed on the installation end 21 .

In FIG. 5 , in the second embodiment of the present invention, the installation plane 10 is provided with a vacuum suction element 102 .

In the sixth figure, in the third embodiment of the present invention, a plurality of L-shaped latching members 103 are protruded from the mounting plane 10 toward the mounting end 21 , and each L-shaped latching member 103 is not connected to the mounting plane 10 . One end is facing each other, that is, facing the other L-shaped latching member 103, and one end of each L-shaped latching member 103 that is not connected to the installation plane 10 is respectively provided with an elastic tenon 1031. The tenons 1031 clamp the mounting ends 21 respectively, so that each elastic tenon 1031 supports the suction nozzle unit 2. Since the width of the mounting flange 211 is larger than the opening formed between the elastic tenons 1031, the suction nozzle unit 2 will not drop accidentally. Each L-shaped latching member 103 can be disposed on the installation plane 10 in a ring shape to provide support for the suction nozzle unit 2 in all directions. When the suction nozzle unit 2 is to be removed, each elastic latch 1031 can be compressed to remove the suction nozzle unit 2 .

However, the above descriptions are only preferred embodiments of the present invention, and should not be used to limit the scope of implementation of the present invention. Any changes and modifications that can be obviously made by those who are accustomed to the industry should be regarded as not departing from the essence of the present invention.

1: Transmission unit

10: Installation plane

101: Magnetic Components

102: Vacuum suction element

103: L-shaped clip

1031: Elastic tenon

2: Nozzle unit

20: Adsorption end

21: Mounting end

211: Mounting flange

3: Adjustment unit

31: Adjustment end

311: Gripper

4: Visual recognition unit

A: Wafer

B: Tray

The first figure is a schematic diagram (1) of the embodiment (1) of the present invention.

The second figure is a schematic diagram (1) of the operation of the embodiment (1) of the present invention.

The third figure is a schematic diagram (2) of the operation of the embodiment (1) of the present invention.

The fourth figure is a schematic partial cross-sectional view of the side view of the embodiment (1) of the present invention.

FIG. 5 is a partial cross-sectional schematic diagram of the side view of the second embodiment of the present invention.

Fig. 6 is a partial cross-sectional schematic diagram of the side view of the embodiment (3) of the present invention.

1 Drive unit 10 Mounting plane 2 Nozzle unit 20 Adsorption end 21 Mounting end 211 Mounting flange 3 Adjustment unit 31 Adjustment end 311 Gripper 4 Visual recognition unit A chip

Claims (7)

An omnidirectional calibration module, comprising: a transmission unit, which has an installation plane, and the transmission unit has a degree of freedom to move in space; a suction nozzle unit, which has an adsorption end and an oppositely arranged installation end, the installation end can be Removably installed on the installation plane of the transmission unit; an adjustment unit, which has a pair of adjustment ends corresponding to the shape of the suction nozzle unit and a control element, the adjustment end enables the suction nozzle unit to move the position and rotation angle on the installation plane; and a visual recognition unit, which is electrically connected to the control element of the adjustment unit. The omnidirectional calibration module according to claim 1, wherein a mounting flange extends from the mounting end of the suction nozzle unit along the extending direction of the mounting plane. The omnidirectional calibration module according to claim 1 or 2, wherein at least one magnetic element is disposed on the installation plane or the installation end. The omnidirectional calibration module according to claim 1 or 2, wherein the installation plane is provided with a vacuum suction element, and the vacuum suction element attracts the installation end of the suction nozzle unit. The omnidirectional calibration module according to claim 1 or 2, wherein a plurality of L-shaped latching elements are protruded from the mounting plane toward the mounting end, and each end of the L-shaped latching elements is not connected to the mounting plane facing each other, one end of each of the L-shaped latching pieces that is not connected to the mounting plane is respectively provided with an elastic tenon, and each of the elastic tenons latches the mounting end respectively. The omnidirectional calibration module according to claim 1, wherein the transmission unit is a mechanical arm. The omnidirectional calibration module according to claim 1, wherein the adjustment end of the adjustment unit comprises two clamping jaws.

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