TWM610454U - Position adjusting module - Google Patents

Abstract

A position adjustment module includes a transmission unit, which has an installation plane, and the transmission unit has a degree of freedom to move in space; a suction nozzle unit, which has a suction end and an opposite installation end, and the suction end can absorb a wafer or For other articles to be adsorbed, the mounting end is detachably installed on the installation plane of the transmission unit; an adjustment unit has an adjustment end corresponding to the shape of the nozzle unit and a control element. The adjustment end makes the nozzle unit move on the installation plane and Rotation; and a visual recognition unit, which is electrically connected to the control element of the adjustment unit. After identifying the gap between the chip and the required position of the system by the visual recognition unit, the present invention uses the adjustment unit to move the suction nozzle unit for alignment, and has a faster and safer chip alignment effect than the conventional device method.

Description

Position adjustment module

This creation is about a chip moving device, especially a position adjustment module that can quickly and safely position the chip.

The chip has become an indispensable part of life in the modern era of advanced technology, but the chip must undergo multiple movements between devices during processing, so there are many devices for moving the chip. However, when the conventional method moves the chip into a tray or performs subsequent operations, because the chip cannot be perfectly sucked at the predetermined position and angle of the system every time, the transmission module must be fine-tuned in position and angle. To smoothly place the wafer in the next process, or use an additional adjustment module to move the wafer that has been sucked up, or the drive module to place the wafer on an intermediate platform first, and the intermediate platform first moves and rotates the wafer. After the angle, the transmission module performs another absorption to facilitate subsequent actions; these three methods have their own shortcomings, for example: the transmission module itself is large and not suitable for rapid movement, so it takes more time to position; some chips are thin It is fragile and not suitable for being clamped by the adjustment module; one more transfer to the intermediate platform will increase the risk of chip collision, and the intermediate platform is difficult to move quickly.

In view of this, the creator has accumulated many years of research and practical experience in related fields, and specially created a position adjustment module to improve the lack of the above-mentioned conventional technology.

The main purpose of this creation is to provide a position adjustment module to adjust the position and angle of the unit to adjust and rotate the nozzle unit, so as to increase the speed of correcting the chip.

In order to achieve the above-mentioned purpose, the position adjustment module of this creation includes a transmission unit with an installation plane, and the transmission unit has the freedom to move in space; a suction nozzle unit with an adsorption end and an opposite installation end, The suction end can suck a chip or other objects to be sucked, and the installation end is detachably installed on the installation plane of the transmission unit; an adjustment unit, which has an adjustment end corresponding to the shape of the nozzle unit and a control element, and the adjustment end makes the suction nozzle The unit moves and rotates on the installation plane; and a visual recognition unit, which is electrically connected to the control element of the adjustment unit.

This creation uses the visual recognition unit to identify the predetermined position and angle difference required by the chip system, and then uses the adjustment unit to move and rotate the nozzle unit to align the chip without repetitively moving the heavy transmission unit or clamping. It supports chip movement and does not use an intermediary platform. Compared with the conventional method, it has the effect of quickly and safely setting the chip.

The installation end of the nozzle unit can extend a mounting flange along the extension direction of the installation plane to facilitate the installation of the nozzle unit. The transmission unit can be a mechanical arm.

The nozzle unit can be installed with magnetic force, vacuum or a plurality of elastic tenons on the installation plane.

In order to be able to clearly and fully expose the creation, examples of preferred implementations are listed to illustrate the implementation in detail as described later.

Please refer to the first to fourth figures to reveal the drawings of the implementation of this creation. The above drawings illustrate the embodiment (1) of the position adjustment module of this creation, which includes a transmission unit 1 with a mounting plane 10 , The transmission unit 1 has the freedom to move in space. The transmission unit 1 can be a robotic arm; a suction nozzle unit 2, which has a suction end 20 and an opposite mounting end 21. The suction end 20 can adsorb a wafer A or For other articles to be adsorbed, the mounting end 21 is detachably mounted on the mounting plane 10 of the transmission unit 1. In this embodiment (1), the mounting end 21 of the nozzle unit 2 extends along the extension direction of the mounting plane 10 The flange 211 is installed, and the installation plane 10 is provided with at least one magnetic element 101, so that the suction nozzle unit 2 is magnetically attracted to the installation plane 10;

An adjustment unit 3, which has an adjustment end 31 corresponding to the shape of the nozzle unit 2 and a control element (not drawn). The adjustment end 31 makes the nozzle unit 2 move and rotate on the installation plane 10. In this embodiment (1) The middle adjustment end 31 has two clamping jaws 311, and each clamping jaw 311 has a plurality of rollers 312 respectively, so that the adjustment end 31 can clamp the suction nozzle unit 2 from both sides by the clamping jaws 311 to move and rotate the angle so that the wafer A is aligned with the tray B. The unit 3 can have a movable joint (not shown) to rotate the nozzle unit 2; and a visual recognition unit 4, which is electrically connected to the control element (not shown) of the adjustment unit 3. In the third figure, after the visual recognition unit 4 distinguishes the wafer A from the predetermined position and angle difference required by the system, the adjustment unit 3 is used to move and rotate the nozzle unit 2 for alignment, and then the wafer is allowed to perform the next predetermined process or For example, in the third figure, move to another position to place wafer A on a tray B. There is no need to repeatedly move the heavy transmission unit 1 or clamp the wafer A to move, so there is no doubt about damaging the wafer, and no intermediate platform is used. Increase the number of operations. Compared with the conventional method, it has the effect of quickly and safely aligning the chip A. This embodiment (1) is provided with at least one magnetic element 101 on the mounting plane 10 as shown in the fourth figure, allowing the suction nozzle unit 2 to use magnetic force. Adsorbed on the mounting plane 10, the magnetic element 101 can also be arranged on the mounting end 21.

In the fifth figure, in the second embodiment of the invention, the installation plane 10 is provided with a vacuum suction element 102, and the vacuum suction element 102 attracts the installation end 21 of the nozzle unit 2 so that the nozzle unit 2 is installed on the transmission unit 1.

In the sixth figure, in the embodiment (3) of this creation, the mounting plane 10 is protrudingly provided with a plurality of L-shaped latches 103 in the direction of the mounting end 21, and each L-shaped latch 103 is not connected to the mounting plane 10 One end faces each other oppositely, that is, faces the other L-shaped latch 103. One end of each L-shaped latch 103 that is not connected to the installation plane 10 is provided with an elastic latch 1031, and each elastic latch The tenons 1031 respectively latch the mounting ends 21 so that each elastic tenon 1031 supports the nozzle unit 2. Since the width of the mounting flange 211 is larger than the opening formed between the elastic tenons 1031, the nozzle unit 2 will not accidentally fall. Each L-shaped latch 103 can be annularly arranged on the installation plane 10 to provide support for the nozzle unit 2 in various directions. When the nozzle unit 2 is to be removed, the elastic latches 1031 can be compressed to remove the nozzle unit 2.

However, the above are only the preferred embodiments of this creation, and should not be used to limit the scope of implementation of this creation. Any obvious changes and modifications that can be made by those who are accustomed to this industry should be regarded as not deviating from it. The essence of this creation.

1: Transmission unit 10: Installation plane 101: Magnetic components 102: Vacuum suction element 103: L-shaped latch 1031: Elastic Tenon 2: Nozzle unit 20: Adsorption end 21: Mounting end 211: mounting flange 3: adjustment unit 31: adjust end 311: Gripper 312: Wheel 4: Visual recognition unit A: Chip B: Tray

The first picture is a schematic diagram (1) of the creative embodiment (1). The second figure is a schematic diagram (1) of the action of the creative embodiment (1). The third figure is a schematic diagram (2) of the creative embodiment (1). The fourth figure is a partial cross-sectional schematic diagram of the side view of the creative embodiment (1). The fifth figure is a partial cross-sectional schematic diagram of the side view of the creative embodiment (2). The sixth figure is a partial cross-sectional schematic diagram of the side view of the creative embodiment (3).

1: Transmission unit

10: Installation plane

2: Nozzle unit

20: Adsorption end

21: Mounting end

211: mounting flange

3: adjustment unit

31: adjust end

311: Gripper

4: Visual recognition unit

A: Chip

Claims (7)

A position adjustment module includes: A transmission unit, which has an installation plane, and the transmission unit has the freedom to move in space; A suction nozzle unit, which has a suction end and an opposite installation end, and the installation end is detachably installed on the installation plane of the transmission unit; An adjustment unit having a pair of adjustment ends corresponding to the shape of the nozzle unit and a control element, the adjustment end enables the nozzle unit to move and rotate on the installation plane; and A visual recognition unit is electrically connected to the control element of the adjustment unit. The position adjustment module according to claim 1, wherein the mounting end of the nozzle unit extends along the extension direction of the mounting plane with a mounting flange. The position adjustment module according to claim 1 or 2, wherein the mounting plane or the mounting end is provided with at least one magnetic element. The position adjustment module according to claim 1 or 2, wherein the installation plane is provided with a vacuum suction element, and the vacuum suction element attracts the installation end of the nozzle unit. The position adjustment module according to claim 1 or 2, wherein the installation plane is projected with a plurality of L-shaped latches in the direction of the mounting end, and one end of each of the L-shaped latches that is not connected to the installation plane is respectively Facing each other, one end of each of the L-shaped latches that is not connected to the installation plane is respectively provided with an elastic latch, and each of the elastic latches latches the installation end respectively. The position adjustment module according to claim 1, wherein the transmission unit is a mechanical arm. The position adjustment module according to claim 1, wherein the adjustment end of the adjustment unit includes two clamping jaws.

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