TWI773448B - Wafer feeder and parts transfer device - Google Patents

Wafer feeder and parts transfer device Download PDF

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TWI773448B
TWI773448B TW110126898A TW110126898A TWI773448B TW I773448 B TWI773448 B TW I773448B TW 110126898 A TW110126898 A TW 110126898A TW 110126898 A TW110126898 A TW 110126898A TW I773448 B TWI773448 B TW I773448B
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wafer
opening
door
pallet
movement
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TW110126898A
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TW202247331A (en
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佐藤祐輝
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日商山葉發動機股份有限公司
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67775—Docking arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/6773—Conveying cassettes, containers or carriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/67346—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders characterized by being specially adapted for supporting a single substrate or by comprising a stack of such individual supports
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67772—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving removal of lid, door, cover
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/02—Feeding of components

Abstract

本發明之晶圓供給裝置(6)中，裝置本體(91)具有朝向晶圓平台(10)側開口之第1開口部(911A)、及朝向與晶圓平台(10)相反之側開口之第2開口部(912A)。移動機構(96)使托板收容體(95)於第1位置與第2位置之間移動，上述第1位置容許托板(8)經由第1開口部(911A)於托板收容體(95)與晶圓平台(10)之間移動，上述第2位置容許經由第2開口部(912A)更換收容於托板收容體(95)中之托板(8)。開閉板(97)能夠與利用移動機構(96)所進行之托板收容體(95)之移動連動地移動。開閉板(97)於托板收容體(95)配置於第1位置之狀態下，開放整個第1開口部(911A)，另一方面，於托板收容體(95)配置於第2位置之狀態下，封閉整個第1開口部(911A)。In the wafer feeding device (6) of the present invention, the device body (91) has a first opening (911A) that opens toward the side of the wafer stage (10), and a first opening (911A) that opens toward the side opposite to the wafer stage (10). The second opening (912A). The moving mechanism (96) moves the pallet accommodating body (95) between a first position and a second position, and the first position allows the pallet (8) to pass through the first opening (911A) in the pallet accommodating body (95) ) and the wafer stage (10), the second position allows the pallet (8) accommodated in the pallet accommodating body (95) to be replaced through the second opening (912A). The opening and closing plate (97) can move in conjunction with the movement of the pallet accommodating body (95) by the moving mechanism (96). The opening and closing plate (97) opens the entire first opening (911A) in the state where the pallet accommodating body (95) is arranged at the first position, and on the other hand, the pallet accommodating body (95) is arranged at the second position. In this state, the entire first opening (911A) is closed.

Description

晶圓供給裝置及零件移載裝置Wafer feeder and parts transfer device

本發明係關於一種供給被分割成複數個零件之晶圓的晶圓供給裝置、及具備該晶圓供給裝置之零件移載裝置。The present invention relates to a wafer supply device for supplying a wafer divided into a plurality of parts, and a parts transfer device including the wafer supply device.

作為用以將零件安裝於基板上之零件安裝裝置，已知有一種裝置，其具備將零件以保持於托板之狀態供給至特定之零件取出作業位置之零件供給裝置。此種零件供給裝置例如記載於專利文獻1中。As a component mounting apparatus for mounting a component on a board|substrate, the apparatus provided with the component supply apparatus which supplies the component in the state hold|maintained on the pallet to a specific component extraction operation position is known. Such a parts supply apparatus is described in Patent Document 1, for example.

專利文獻1所揭示之零件供給裝置具備：托板收容體(匣盒)，其收容搭載著配置有複數個零件之托盤的托板；及升降機構，其使托板收容體於上下方向移動。升降機構使托板收容體於上下方向，在與上述零件取出作業位置相同之高度位置的第1位置、和用於更換使用過之托板的第2位置之間移動。於托板收容體配置於第1位置之狀態下，托板從托板收容體被供給至零件取出作業位置。另一方面，於托板收容體配置於第2位置之狀態下，使用過之托板從托板收容體被取出更換為新的托板。The parts supply device disclosed in Patent Document 1 includes a pallet storage body (cassette) that stores a pallet on which a tray on which a plurality of components are arranged, and a lift mechanism that moves the pallet storage body in an up-down direction. The elevating mechanism moves the pallet container in the up-down direction between a first position at the same height as the above-mentioned parts extraction operation position, and a second position for exchanging used pallets. In a state where the pallet storage body is arranged at the first position, the pallet is supplied from the pallet storage body to the parts extraction operation position. On the other hand, in a state where the pallet storage body is arranged at the second position, the used pallet is taken out from the pallet storage body and replaced with a new one.

於零件供給裝置中，在托板收容體配置於第2位置之狀態下，必須限制通過托板收容體進出零件取出作業位置。專利文獻1所揭示之零件供給裝置中，複數個防插入構件以隔開容許托板通過之特定間隔之狀態安裝於托板收容體。利用安裝於托板收容體之複數個防插入構件能限制通過托板收容體進出零件取出作業位置。In the parts supply device, in the state where the pallet accommodating body is arranged in the second position, it is necessary to restrict the movement of the pallet accommodating body into and out of the parts taking-out operation position. In the parts supply device disclosed in Patent Document 1, a plurality of insertion preventing members are attached to the pallet accommodating body in a state of being spaced apart by a predetermined interval allowing the pallet to pass therethrough. Using a plurality of anti-insertion members mounted on the pallet accommodating body can limit the operation position of the parts taking out through the pallet accommodating body.

但，作為零件供給裝置之一種，存在晶圓供給裝置。晶圓供給裝置係以將被分割成複數個零件之晶圓保持原樣之狀態、或保持於托板之狀態供給晶圓的裝置。於該晶圓供給裝置中，當以保持於托板之狀態供給晶圓時，通常使用厚度較大之托板。於將上述專利文獻1所揭示之防插入構件應用於晶圓供給裝置之情形時，鄰接之防插入構件彼此之間隔隨著托板厚度增大而變大。於該情形時，存在如下擔憂：於收容有保持於托板之狀態之晶圓的托板收容體(晶圓收容體)配置於第2位置之狀態下，變得無法確實地限制通過晶圓收容體進出零件取出作業位置。 [先前技術文獻] [專利文獻] However, as one of the parts supplying apparatuses, there is a wafer supplying apparatus. The wafer supply apparatus is an apparatus that supplies wafers in a state of being divided into a plurality of parts in a state where the wafers are kept as they are, or in a state of being held on a pallet. In this wafer supply apparatus, when the wafer is supplied in a state of being held on a pallet, a pallet with a relatively large thickness is usually used. When the insertion preventing member disclosed in the above-mentioned Patent Document 1 is applied to a wafer feeding apparatus, the interval between the adjacent insertion preventing members increases as the thickness of the pallet increases. In such a case, there is a concern that when the pallet holder (wafer holder) containing the wafer held in the pallet is placed at the second position, it is not possible to reliably restrict the passage of the wafer. The accommodating body goes in and out of the parts taking out working position. [Prior Art Literature] [Patent Literature]

[專利文獻1]日本專利第4322863號公報[Patent Document 1] Japanese Patent No. 4322863

本發明之目的在於提供一種能確實地限制通過晶圓收容體進出零件取出作業位置之晶圓供給裝置、及具備其之零件移載裝置。An object of the present invention is to provide a wafer feeder capable of reliably restricting entry and exit of a part taking out operation position through a wafer container, and a parts transfer device provided with the same.

本發明之一態樣之晶圓供給裝置係將被分割成複數個零件之晶圓供給至特定之零件取出作業位置之裝置。該晶圓供給裝置具備：裝置本體，其包含形成有朝向上述零件取出作業位置側開口之第1開口部的第1框架板、及形成有朝向與上述零件取出作業位置側相反之側開口之第2開口部的第2框架板，且於上述第1框架板與上述第2框架板之間界定出與上述第1開口部及上述第2開口部連通之內部空間；晶圓收容體，其構成為能夠收容上述晶圓，且配置於上述內部空間內；移動機構，其使上述晶圓收容體在第1位置與第2位置之間，於從上述第1位置朝向上述第2位置之第1移動方向移動，並且使上述晶圓收容體於從上述第2位置朝向上述第1位置之第2移動方向移動，上述第1位置容許上述晶圓經由上述第1開口部於上述晶圓收容體與上述零件取出作業位置之間移動，上述第2位置容許經由上述第2開口部更換收容於上述晶圓收容體中之上述晶圓；以及開閉板，其以能夠與利用上述移動機構所進行之上述晶圓收容體之移動連動地移動之方式設置於上述內部空間內，於上述晶圓收容體配置於上述第1位置之狀態下，開放整個上述第1開口部，另一方面，於上述晶圓收容體配置於上述第2位置之狀態下，封閉整個上述第1開口部。A wafer supply apparatus according to an aspect of the present invention is an apparatus for supplying a wafer divided into a plurality of parts to a specific part extraction operation position. The wafer feeding apparatus includes: an apparatus main body including a first frame plate formed with a first opening that opens toward the parts extraction operation position side, and a first frame plate formed with an opening toward the side opposite to the parts extraction operation position side. a second frame plate with 2 openings, and an internal space communicating with the first opening and the second opening is defined between the first frame plate and the second frame plate; In order to be able to accommodate the above-mentioned wafer, and to be arranged in the above-mentioned internal space; a moving mechanism, which makes the above-mentioned wafer accommodating body between the first position and the second position, in the first position from the above-mentioned first position to the above-mentioned second position. The moving direction is moved, and the wafer container is moved in a second movement direction from the second position toward the first position, and the first position allows the wafer to be moved between the wafer container and the wafer container through the first opening. moving between the above-mentioned parts extracting operation positions, the above-mentioned second position allows replacement of the above-mentioned wafer accommodated in the above-mentioned wafer accommodating body through the above-mentioned second opening portion; The movement of the wafer container is provided in the inner space, and the entire first opening is opened in a state where the wafer container is arranged in the first position. In a state where the container is arranged at the second position, the entirety of the first opening is closed.

本發明之另一態樣之零件移載裝置具備：上述晶圓供給裝置，其將被分割成複數個零件之晶圓供給至特定之零件取出作業位置；及零件移載單元，其從供給至上述零件取出作業位置之上述晶圓取出上述零件並移載至特定之零件移載部。A parts transfer device according to another aspect of the present invention includes: the above-mentioned wafer supply device for supplying the wafer divided into a plurality of parts to a specific parts take-out operation position; and a parts transfer unit for supplying to The above-mentioned wafer in the above-mentioned parts extraction operation position extracts the above-mentioned parts and transfers them to a specific parts transfer part.

關於本發明之目的、特徵及優點將根據以下之詳細說明及附圖而更加明瞭。The objects, features, and advantages of the present invention will become more apparent from the following detailed description and accompanying drawings.

以下，基於附圖，對本發明之實施方式詳細地進行說明。再者，以下，針對方向關係，使用XYZ正交座標軸進行說明。X方向及Y方向於水平面上相互正交，Z方向為沿著與X方向及Y方向這兩個方向正交之鉛直方向延伸之方向。又，將X方向之一側稱為「+X側」，將X方向之與一側相反之另一側稱為「-X側」。同樣地，將Y方向之一側稱為「+Y側」，將Y方向之與一側相反之另一側稱為「-Y側」。又，將Z方向之一側即上方側稱為「+Z側」，將Z方向之與一側相反之另一側即下方側稱為「-Z側」。Hereinafter, embodiments of the present invention will be described in detail based on the drawings. In the following, the directional relationship will be described using the XYZ orthogonal coordinate axes. The X direction and the Y direction are orthogonal to each other on the horizontal plane, and the Z direction is a direction extending along the vertical direction orthogonal to the two directions of the X direction and the Y direction. In addition, one side in the X direction is referred to as the "+X side", and the other side opposite to the one side in the X direction is referred to as the "-X side". Similarly, one side in the Y direction is referred to as "+Y side", and the other side opposite to one side in the Y direction is referred to as "-Y side". In addition, the upper side, which is one side of the Z direction, is referred to as the "+Z side", and the other side of the Z direction opposite to the one side, that is, the lower side is referred to as the "-Z side".

具備本發明之晶圓供給裝置之零件移載裝置可應用於例如將從晶圓切割出之晶粒收容於帶(tape)之編帶裝置、將上述晶粒打線接合於基板之黏晶機、或將上述晶粒安裝於基板之零件安裝裝置等各種裝置。此處，對將本發明之零件移載裝置應用於零件安裝裝置之例進行說明。The parts transfer device provided with the wafer feeding device of the present invention can be applied to, for example, a taping device that accommodates dice cut out from a wafer in a tape, a die bonder that wire-bonds the dice to a substrate, Or various devices such as a component mounting device that mounts the above-mentioned die on a substrate. Here, an example in which the parts transfer device of the present invention is applied to a parts mounting device will be described.

[零件安裝裝置之整體構成] 如圖1所示，本實施方式之零件安裝裝置1係將從晶圓7切割出之晶粒7a(零件)安裝於基板P(特定之零件移載部)之裝置。如圖1及圖2所示，零件安裝裝置1包含基台2、輸送器3、頭單元4(零件移載單元)、零件供給部5、晶圓供給裝置6、相機單元32U及頂起單元40。 [Overall structure of parts mounting device] As shown in FIG. 1, the component mounting apparatus 1 of this embodiment is an apparatus which mounts the die 7a (component) cut out from the wafer 7 on the board|substrate P (specific component transfer part). As shown in FIGS. 1 and 2 , the component mounting device 1 includes a base 2, a conveyor 3, a head unit 4 (component transfer unit), a component supply unit 5, a wafer supply device 6, a camera unit 32U, and a lift unit 40.

基台2係零件安裝裝置1所具備之各種機器之載台。輸送器3係以沿X方向延伸之方式設置於基台2上之基板P之搬送線路。輸送器3將基板P從機器外搬入特定之安裝作業位置，並於安裝作業後將基板P從上述安裝作業位置搬出至機器外。輸送器3具有將基板P保持於上述安裝作業位置之未圖示之固定(clamp)機構。再者，圖1中示出之基板P之位置為上述安裝作業位置。零件供給部5將複數個晶粒7a以從晶圓7切割出之配置狀態供給。The base 2 is a stage for various devices included in the component mounting apparatus 1 . The conveyor 3 is installed in the conveyance line of the board|substrate P on the base 2 so that it may extend along the X direction. The conveyor 3 carries the board P from outside the machine to a specific installation work position, and carries out the board P from the above-mentioned installation work position to the outside of the machine after the installation work. The conveyor 3 has a clamp mechanism (not shown) that holds the substrate P at the above-mentioned mounting work position. In addition, the position of the board|substrate P shown in FIG. 1 is the said installation work position. The parts supply unit 5 supplies the plurality of die 7 a in an arrangement state cut out from the wafer 7 .

頭單元4於零件供給部5中從晶圓7取出晶粒7a並拾取(picking)，向上述安裝作業位置移動，並且將晶粒7a安裝於基板P。頭單元4具備於上述拾取時吸附而保持晶粒7a，且於上述安裝時釋放所保持之晶粒7a之複數個頭4H。頭4H能相對於頭單元4沿Z方向進退(升降)移動，且能繞軸旋轉移動。於頭單元4，搭載有拍攝基板P之基板識別相機31。根據基板識別相機31之拍攝影像，識別基板P上標註之基標(fiducial mark)。藉此，識別基板P之位置偏移，於安裝零件時修正上述位置偏移。The head unit 4 takes out the die 7 a from the wafer 7 in the parts supply unit 5 , picks it up, moves to the above-mentioned mounting work position, and mounts the die 7 a on the substrate P. As shown in FIG. The head unit 4 is provided with a plurality of heads 4H that adsorb and hold the die 7a during the above-mentioned pickup, and release the held die 7a during the above-mentioned mounting. The head 4H can move forward and backward (lift and lower) with respect to the head unit 4 in the Z direction, and can rotate and move around the axis. The head unit 4 is equipped with a board recognition camera 31 for photographing the board P. The fiducial mark marked on the substrate P is identified according to the image captured by the substrate identification camera 31 . Thereby, the positional misalignment of the board|substrate P is recognized, and the said positional misalignment is corrected when a component is mounted.

零件安裝裝置1具備第1驅動機構D1，該第1驅動機構D1能使頭單元4至少於零件供給部5與保持於上述安裝作業位置之基板P之間之上方空間內，於水平方向(X方向及Y方向)上移動。第1驅動機構D1於+X側及-X側各具備一對Y軸固定軌道13、第1 Y軸伺服馬達14及滾珠螺桿軸15作為頭單元4之Y方向之移動機構。一對Y軸固定軌道13固定於基台2上，於X方向上隔開特定間隔且相互平行地沿Y方向延伸。滾珠螺桿軸15以沿Y方向延伸之方式配置於接近Y軸固定軌道13之位置。第1 Y軸伺服馬達14將滾珠螺桿軸15旋轉驅動。於一對Y軸固定軌道13之間，架設有支持頭單元4之支持框架16。於支持框架16之+X側端部及-X側端部，組裝有螺合於各滾珠螺桿軸15之螺帽17。The component mounting apparatus 1 includes a first drive mechanism D1 that enables the head unit 4 to move in the horizontal direction (X) at least in the upper space between the component supply portion 5 and the substrate P held at the above-mentioned mounting operation position. direction and Y direction). The first drive mechanism D1 includes a pair of Y-axis fixed rails 13 , a first Y-axis servo motor 14 and a ball screw shaft 15 on the +X side and the -X side, respectively, as moving mechanisms in the Y direction of the head unit 4 . A pair of Y-axis fixing rails 13 are fixed on the base 2 , and extend along the Y-direction parallel to each other at a certain interval in the X-direction. The ball screw shaft 15 is arranged at a position close to the Y-axis fixed rail 13 so as to extend in the Y direction. The first Y-axis servo motor 14 rotationally drives the ball screw shaft 15 . A support frame 16 for supporting the head unit 4 is erected between the pair of Y-axis fixed rails 13 . Nuts 17 screwed to the respective ball screw shafts 15 are assembled to the +X side end and the −X side end of the support frame 16 .

第1驅動機構D1具備搭載於支持框架16之未圖示之導向構件、第1 X軸伺服馬達18及滾珠螺桿軸19，作為頭單元4之X方向之移動機構。上述導向構件係引導頭單元4於X方向移動之構件，以沿X方向延伸之方式固定於支持框架16之+Y側之面。滾珠螺桿軸19以接近上述導向構件且沿X方向延伸之方式配設。第1 X軸伺服馬達18將滾珠螺桿軸19旋轉驅動。於頭單元4附設有未圖示之螺帽，該螺帽螺合於滾珠螺桿軸19。The first drive mechanism D1 includes a guide member (not shown) mounted on the support frame 16 , a first X-axis servo motor 18 , and a ball screw shaft 19 , as a moving mechanism in the X direction of the head unit 4 . The above-mentioned guide member is a member that guides the movement of the head unit 4 in the X direction, and is fixed to the +Y side surface of the support frame 16 so as to extend along the X direction. The ball screw shaft 19 is arranged so as to be close to the above-mentioned guide member and to extend in the X direction. The first X-axis servo motor 18 rotationally drives the ball screw shaft 19 . A nut not shown is attached to the head unit 4 , and the nut is screwed to the ball screw shaft 19 .

根據具備以上構成之第1驅動機構D1，第1 Y軸伺服馬達14作動而將滾珠螺桿軸15旋轉驅動，從而使得頭單元4與支持框架16一體地於Y方向移動。又，第1 X軸伺服馬達18作動而將滾珠螺桿軸19旋轉驅動，從而使得頭單元4相對於支持框架16於X方向移動。According to the first drive mechanism D1 having the above configuration, the first Y-axis servo motor 14 is actuated to drive the ball screw shaft 15 to rotate, thereby moving the head unit 4 and the support frame 16 in the Y direction integrally. In addition, the first X-axis servo motor 18 is actuated to drive the ball screw shaft 19 to rotate, thereby moving the head unit 4 in the X direction with respect to the support frame 16 .

零件供給部5具備將被分割成複數個晶粒7a之晶圓7供給至特定之零件取出作業位置(晶圓平台10)之晶圓供給裝置6。本實施方式中，晶圓供給裝置6將晶圓7以保持於托板8之狀態供給至晶圓平台10。晶圓7係圓盤形狀之半導體晶圓，已形成有電路圖案等。托板8保持有晶圓片8a。於晶圓片8a，貼合有將晶圓7切割成柵格狀而形成之多個晶粒7a、7a…之集合體。亦即，晶圓供給裝置6將晶圓片8a上貼合有複數個晶粒7a之狀態的晶圓7以保持於托板8之狀態供給至晶圓平台10。關於晶圓供給裝置6之詳細情況，將於下文進行敍述。再者，零件供給部5亦可除了晶圓供給裝置6以外，還具備以收容有電子零件之零件收容帶之形態供給零件之帶式饋送器(tape feeder)。The parts supply part 5 is provided with the wafer supply apparatus 6 which supplies the wafer 7 divided into a plurality of die 7a to a specific parts extraction operation position (wafer stage 10). In the present embodiment, the wafer supply device 6 supplies the wafer 7 to the wafer stage 10 in a state of being held on the pallet 8 . The wafer 7 is a disc-shaped semiconductor wafer, and a circuit pattern and the like have been formed thereon. The pallet 8 holds the wafer 8a. On the wafer 8a, an aggregate of a plurality of die 7a, 7a . . . formed by cutting the wafer 7 into a grid shape is bonded. That is, the wafer supply device 6 supplies the wafer 7 in a state in which the plurality of die 7 a are attached to the wafer 8 a to the wafer stage 10 in a state of being held on the pallet 8 . Details of the wafer supply device 6 will be described later. In addition to the wafer supply device 6 , the parts supply unit 5 may further include a tape feeder for supplying parts in the form of a parts accommodating tape in which electronic parts are accommodated.

相機單元32U係能夠於X方向及Y方向移動之單元，具備晶圓相機32。晶圓相機32拍攝定位於晶圓平台10上之晶圓7之一部分、亦即相機視野內之晶粒7a。基於該拍攝影像，進行拾取對象之晶粒7a之位置識別。零件安裝裝置1具備第2驅動機構D2，該第2驅動機構D2能使相機單元32U至少於零件供給部5與特定之待機位置之間之上方空間內，沿水平方向(X方向及Y方向)移動。該第2驅動機構D2係與驅動頭單元4之第1驅動機構D1分開且獨立之驅動系統。再者，本實施方式中，上述待機位置係從晶圓平台10向+Y側離開之位置。The camera unit 32U is a unit that can move in the X direction and the Y direction, and includes the wafer camera 32 . The wafer camera 32 captures a portion of the wafer 7 positioned on the wafer stage 10, that is, the die 7a within the camera's field of view. Based on the captured image, position recognition of the chip 7a to be picked up is performed. The component mounting device 1 includes a second drive mechanism D2 that enables the camera unit 32U to move in the horizontal direction (X direction and Y direction) at least in the upper space between the component supply unit 5 and a specific standby position. move. The second drive mechanism D2 is a separate and independent drive system from the first drive mechanism D1 of the drive head unit 4 . In addition, in the present embodiment, the above-mentioned standby position is a position separated from the wafer stage 10 to the +Y side.

第2驅動機構D2於+X側及-X側具備一對Y軸固定軌道33，且具備配置於+X側之第2 Y軸伺服馬達34及滾珠螺桿軸35，作為相機單元32U之Y方向之移動機構。一對Y軸固定軌道33固定於基台2上，於X方向隔開特定間隔且相互平行地沿Y方向延伸。滾珠螺桿軸35於接近+X側之Y軸固定軌道33之位置，以沿Y方向延伸之方式配置。第2 Y軸伺服馬達34將滾珠螺桿軸35旋轉驅動。於一對Y軸固定軌道33之間，架設有支持相機單元32U之支持框架36。於支持框架36之+X側端部，組裝有螺合於滾珠螺桿軸35之螺帽37。The second drive mechanism D2 includes a pair of Y-axis fixed rails 33 on the +X side and -X side, and a second Y-axis servo motor 34 and a ball screw shaft 35 arranged on the +X side as the Y direction of the camera unit 32U the mobile mechanism. A pair of Y-axis fixing rails 33 are fixed to the base 2 , and extend along the Y-direction parallel to each other at a predetermined interval in the X-direction. The ball screw shaft 35 is arranged to extend in the Y direction at a position close to the Y-axis fixed rail 33 on the +X side. The second Y-axis servo motor 34 rotationally drives the ball screw shaft 35 . A support frame 36 for supporting the camera unit 32U is erected between the pair of Y-axis fixed rails 33 . A nut 37 screwed to the ball screw shaft 35 is assembled on the +X side end of the support frame 36 .

第2驅動機構D2具備搭載於支持框架36之未圖示之導向構件、第2 X軸伺服馬達38及滾珠螺桿軸39，作為相機單元32U之X方向之移動機構。上述導向構件係引導相機單元32U於X方向移動之構件，以沿X方向延伸之方式固定於支持框架36之-Y側之面。滾珠螺桿軸39以接近上述導向構件且沿X方向延伸之方式配設。第2 X軸伺服馬達38將滾珠螺桿軸39旋轉驅動。於相機單元32U附設有未圖示之螺帽，該螺帽螺合於滾珠螺桿軸39。The second drive mechanism D2 includes a guide member (not shown) mounted on the support frame 36, a second X-axis servo motor 38, and a ball screw shaft 39 as a moving mechanism in the X direction of the camera unit 32U. The above-mentioned guide member is a member that guides the movement of the camera unit 32U in the X direction, and is fixed to the surface on the -Y side of the support frame 36 so as to extend along the X direction. The ball screw shaft 39 is arranged so as to be close to the above-mentioned guide member and to extend in the X direction. The second X-axis servo motor 38 rotationally drives the ball screw shaft 39 . A nut not shown is attached to the camera unit 32U, and the nut is screwed to the ball screw shaft 39 .

根據具備以上構成之第2驅動機構D2，第2 Y軸伺服馬達34作動而將滾珠螺桿軸35旋轉驅動，從而使得相機單元32U與支持框架36一體地於Y方向移動。又，第2 X軸伺服馬達38作動而將滾珠螺桿軸39旋轉驅動，從而使得相機單元32U相對於支持框架36於X方向移動。According to the second drive mechanism D2 having the above-described configuration, the second Y-axis servo motor 34 is actuated to rotationally drive the ball screw shaft 35 to move the camera unit 32U and the support frame 36 integrally in the Y direction. In addition, the second X-axis servo motor 38 is actuated to drive the ball screw shaft 39 to rotate, thereby moving the camera unit 32U in the X direction with respect to the support frame 36 .

頂起單元40配置於零件供給部5之下方，將頭4H應吸附之晶粒7a從晶圓片8a之下表面側頂起。頂起單元40以能在與晶圓平台10對應之程度之範圍內於XY方向移動之方式配置於基台2上。頂起單元40由能沿著於Y方向延伸之一對導軌41移動之支持框架42支持而能於X方向移動。The lift-up unit 40 is disposed below the parts supply unit 5, and lifts up the die 7a to be sucked by the head 4H from the lower surface side of the wafer 8a. The lift unit 40 is arranged on the base 2 so as to be movable in the XY directions within a range corresponding to the wafer stage 10 . The jacking unit 40 is supported to move in the X direction by a support frame 42 that can move along a pair of guide rails 41 extending in the Y direction.

與設置於支持框架42內部之未圖示之螺帽部分螺合之滾珠螺桿軸43藉由第3 Y軸伺服馬達44而旋轉驅動。藉此，頂起單元40與支持框架42一體地於Y方向移動。又，於支持框架42，配設有與設置於頂起單元40內部之未圖示之螺帽部分螺合之滾珠螺桿軸45。滾珠螺桿軸45藉由第3 X軸伺服馬達46而旋轉驅動，從而使得頂起單元40於X軸方向移動。頂起單元40具有將晶粒7a頂起之頂起銷47。頭4H吸附晶粒7a時，頂起銷47上升，通過晶圓片8a將晶粒7a頂起。頂起銷47藉由銷升降馬達而升降驅動。The ball screw shaft 43 screwed with the nut part not shown provided inside the support frame 42 is rotationally driven by the third Y-axis servo motor 44 . Thereby, the jacking unit 40 moves in the Y direction integrally with the support frame 42 . In addition, the support frame 42 is provided with a ball screw shaft 45 which is screwed with a nut part not shown provided inside the jacking unit 40 . The ball screw shaft 45 is rotationally driven by the third X-axis servo motor 46 to move the jacking unit 40 in the X-axis direction. The lift unit 40 has lift pins 47 that lift the die 7a. When the head 4H sucks the die 7a, the ejector pins 47 rise, and the die 7a is ejected by the wafer 8a. The lift pins 47 are driven up and down by a pin lift motor.

於基台2，裝配有零件識別相機30。零件識別相機30於將頭單元4之頭4H所吸附之晶粒7a安裝於基板P之前，從下側拍攝。基於該拍攝影像，判定頭4H對晶粒7a之吸附異常或吸附失敗等。A part recognition camera 30 is mounted on the base 2 . The part recognition camera 30 photographs from the lower side before mounting the die 7a sucked by the head 4H of the head unit 4 on the substrate P. Based on the captured image, it is determined that the adsorption of the die 7a by the head 4H is abnormal or that the adsorption fails.

[晶圓供給裝置之詳細構成] 除了圖1以外，還參照圖3～圖8，對晶圓供給裝置6之構成詳細地進行說明。晶圓供給裝置6具備晶圓收納升降機9、晶圓平台10及晶圓輸送器11。晶圓收納升降機9將貼合有晶圓7之晶圓片8a以保持於托板8之狀態，於Z方向上收納成多層。晶圓平台10於晶圓收納升降機9之-Y側之位置，設置於基台2上。晶圓平台10配置於與成為基板P之停止位置之上述安裝作業位置在+Y側並排的位置。本實施方式中，被分割成複數個晶粒7a之晶圓7於基台2上配置之區域即晶圓平台10，成為藉由晶圓供給裝置6供給托板8之目標零件取出作業位置。晶圓輸送器11將托板8從晶圓收納升降機9抽出至晶圓平台10上，或者將晶圓平台10上之托板8歸還至晶圓收納升降機9。 [Detailed structure of wafer feeding device] 3 to 8 in addition to FIG. 1 , the configuration of the wafer feeding device 6 will be described in detail. The wafer feeder 6 includes a wafer storage elevator 9 , a wafer stage 10 , and a wafer feeder 11 . The wafer storage lifter 9 stores the wafers 8 a to which the wafers 7 are bonded in a state of being held on the pallet 8 , and stores them in multiple layers in the Z direction. The wafer stage 10 is disposed on the base 2 at a position on the -Y side of the wafer storage elevator 9 . The wafer stage 10 is arranged at a position on the +Y side side by side with the above-mentioned mounting operation position serving as the stop position of the substrate P. As shown in FIG. In the present embodiment, the wafer stage 10 is the region where the wafer 7 divided into a plurality of dies 7 a is arranged on the base 2 , which is the target parts extraction operation position supplied to the pallet 8 by the wafer supply device 6 . The wafer conveyor 11 pulls out the pallet 8 from the wafer storage elevator 9 to the wafer stage 10 , or returns the pallet 8 on the wafer stage 10 to the wafer storage lift 9 .

晶圓收納升降機9構成為能夠將保持著貼合有晶圓7之晶圓片8a之托板8供給至晶圓平台10，並且能夠從晶圓平台10回收使用過之托板8。晶圓收納升降機9具備裝置本體91、托板收容體95(晶圓收容體)、移動機構96及開閉板97。The wafer storage elevator 9 is configured to be capable of supplying the pallet 8 holding the wafer 8 a to which the wafer 7 is bonded to the wafer stage 10 and to recover the used pallet 8 from the wafer stage 10 . The wafer storage elevator 9 includes an apparatus body 91 , a pallet storage body 95 (wafer storage body), a moving mechanism 96 , and an opening and closing plate 97 .

裝置本體91具有界定出配置托板收容體95、移動機構96及開閉板97等之內部空間917之殼體構造。裝置本體91包含：於Y方向相互對向配置之第1框架板911及第2框架板912、於X方向相互對向配置之一對第3框架板913、以及於Z方向相互對向配置之第4框架板914及第5框架板915。裝置本體91將由上述各框架板包圍之空間界定為上述內部空間917。The device main body 91 has a casing structure defining an inner space 917 in which the pallet accommodating body 95 , the moving mechanism 96 , the opening and closing plate 97 and the like are arranged. The device body 91 includes: a first frame plate 911 and a second frame plate 912 arranged to face each other in the Y direction, a pair of third frame plates 913 arranged to face each other in the X direction, and a pair of third frame plates 913 arranged to face each other in the Z direction. The fourth frame plate 914 and the fifth frame plate 915 . The device body 91 defines the space surrounded by the frame plates as the inner space 917 .

第1框架板911構成裝置本體91之-Y側之壁面。於第1框架板911，形成有朝向晶圓平台10側即-Y側開口之第1開口部911A。如圖4所示，第1開口部911A具有容許保持有晶圓7之狀態之1個托板8通過之形狀。具體而言，第1開口部911A之沿著X方向之長度被設定為較1個托板8之沿著X方向之長度稍大之值，第1開口部911A之沿著Z方向之長度被設定為較1個托板8之沿著Z方向之長度稍大之值。第1開口部911A於Z方向上形成在與晶圓平台10相同之高度位置。The first frame plate 911 constitutes a wall surface on the -Y side of the device body 91 . In the first frame plate 911, a first opening 911A that opens toward the wafer stage 10 side, that is, the -Y side, is formed. As shown in FIG. 4 , the first opening 911A has a shape that allows passage of one pallet 8 holding the wafer 7 . Specifically, the length along the X direction of the first opening 911A is set to be slightly larger than the length along the X direction of one pallet 8 , and the length along the Z direction of the first opening 911A is set by It is set to a value slightly larger than the length along the Z direction of one pallet 8 . The first opening 911A is formed at the same height position as the wafer stage 10 in the Z direction.

第2框架板912構成裝置本體91之+Y側之壁面。於第2框架板912，形成有朝向與晶圓平台10側相反之側即+Y側開口之第2開口部912A。如圖3所示，第2開口部912A具有容許配置於內部空間917內之下述托板收容體95整體露出的形狀。具體而言，第2開口部912A之沿著X方向之長度被設定為較托板收容體95之沿著X方向之長度大之值，第2開口部912A之沿著Z方向之長度被設定為較托板收容體95之沿著Z方向之長度大之值。第2開口部912A之開口面積大於第1開口部911A之開口面積。The second frame plate 912 constitutes the wall surface on the +Y side of the device body 91 . The second frame plate 912 is formed with a second opening 912A that opens toward the side opposite to the wafer stage 10 side, that is, the +Y side. As shown in FIG. 3 , the second opening portion 912A has a shape that allows the entirety of the pallet accommodating body 95 disposed in the inner space 917 to be exposed. Specifically, the length along the X direction of the second opening 912A is set to be larger than the length along the X direction of the pallet container 95 , and the length along the Z direction of the second opening 912A is set It is a value larger than the length along the Z direction of the pallet accommodating body 95 . The opening area of the second opening 912A is larger than the opening area of the first opening 911A.

裝置本體91中被界定於第1框架板911與第2框架板912之間之內部空間917和第1開口部911A及第2開口部912A連通。而且，第1開口部911A與第2開口部912A形成為於從與Z方向正交之Y方向觀察之視點處彼此不重疊，Z方向為托板收容體95在內部空間917內移動之方向。第1開口部911A相較於第2開口部912A於Z方向上形成在-Z側。The inner space 917 defined between the first frame plate 911 and the second frame plate 912 in the device body 91 communicates with the first opening 911A and the second opening 912A. The first opening 911A and the second opening 912A are formed so as not to overlap each other when viewed from the Y direction orthogonal to the Z direction, which is the direction in which the pallet container 95 moves in the interior space 917 . The first opening 911A is formed on the -Z side in the Z direction with respect to the second opening 912A.

一對第3框架板913分別構成裝置本體91之+X側及-X側之壁面。第4框架板914構成裝置本體91之+Z側之壁面。第5框架板915構成裝置本體91之-Z側之壁面。The pair of third frame plates 913 respectively constitute the wall surfaces on the +X side and the -X side of the device body 91 . The fourth frame plate 914 constitutes the wall surface on the +Z side of the device body 91 . The fifth frame plate 915 constitutes the wall surface on the -Z side of the apparatus body 91 .

又，如圖3所示，裝置本體91進而包含用以將第2開口部912A開放及封閉之門體916。門體916藉由繞設置於第2框架板912中之-X側之端部且沿Z方向延伸之旋動軸旋動，而將第2開口部912A開閉。Moreover, as shown in FIG. 3, the apparatus main body 91 further includes the door body 916 for opening and closing the 2nd opening part 912A. The door body 916 opens and closes the second opening portion 912A by rotating around the rotation axis extending in the Z direction provided at the end portion on the -X side of the second frame plate 912 .

又，如圖5及圖6所示，於裝置本體91之第5框架板915中之+X側之端部區域部分，設置有收容體支持構造92。收容體支持構造92係用以支持托板收容體95而使其能在內部空間917內沿Z方向移動之構造。收容體支持構造92具有於Y方向上相互隔開間隔地配置且沿Z方向延伸之一對軌道構件921。該一對軌道構件921支持托板收容體95而使其能夠移動。托板收容體95能夠藉由在支持於一對軌道構件921之狀態下，沿著該一對軌道構件921移動，而向Z方向移動。Furthermore, as shown in FIGS. 5 and 6 , in the end region portion on the +X side of the fifth frame plate 915 of the apparatus main body 91 , a container support structure 92 is provided. The container supporting structure 92 is a structure for supporting the pallet container 95 so as to be movable in the Z direction in the inner space 917 . The container support structure 92 has a pair of rail members 921 which are arranged at a distance from each other in the Y direction and extend in the Z direction. The pair of rail members 921 supports the pallet accommodating body 95 so as to be movable. The pallet accommodating body 95 can move in the Z direction by moving along the pair of rail members 921 in a state supported by the pair of rail members 921 .

又，如圖3所示，於第4框架板914中之+Y側之區域部分，設置有門開關94A。進而，於一對第3框架板913中之+X側之第3框架板913之+Y側端面，設置有門鎖定機構93，並且設置有門檢測機構94B。Moreover, as shown in FIG. 3, in the area|region part of the +Y side in the 4th frame board 914, the door switch 94A is provided. Further, a door locking mechanism 93 and a door detection mechanism 94B are provided on the +Y side end surface of the third frame plate 913 on the +X side of the pair of third frame plates 913 .

門開關94A係受理與門體916之開閉相關之操作之開關。門開關94A於受理用以請求打開門體916之操作時，輸出門打開請求信號SA1(後記之圖11)，另一方面，於門體916關閉之情形時，輸出門關閉信號SA2(後記之圖13)。The door switch 94A is a switch that accepts operations related to the opening and closing of the door body 916 . The door switch 94A outputs a door opening request signal SA1 (referred to in FIG. 11 ) when receiving an operation for requesting opening of the door 916 , and outputs a door closing signal SA2 (referred to below) when the door 916 is closed. Figure 13).

門鎖定機構93係用以維持門體916將第2開口部912A封閉之狀態之機構。門檢測機構94B係用以檢測門鎖定機構93對門體916之封閉狀態之維持被解除而門體916打開的檢測機構。門檢測機構94B檢測出門體916打開時，輸出門打開檢測信號SC(後記之圖12)。The door locking mechanism 93 is a mechanism for maintaining the state in which the door body 916 closes the second opening 912A. The door detection mechanism 94B is a detection mechanism for detecting that the maintenance of the closed state of the door body 916 by the door lock mechanism 93 is released and the door body 916 is opened. When the door detection mechanism 94B detects that the door body 916 is open, it outputs a door open detection signal SC (see FIG. 12 later).

托板收容體95係將保持於托板8之狀態之晶圓7以於Z方向上排列有複數個之狀態收容之晶圓收容體。亦即，托板收容體95收容保持有晶圓7之狀態之托板8。托板收容體95於裝置本體91之內部空間917內，由收容體支持構造92之一對軌道構件921支持而能於Z方向上移動(參照圖5及圖6)。如圖7及圖8所示，托板收容體95包含匣盒架(magazine rack)951、閂鎖構件952及閂鎖開閉機構953。The pallet accommodating body 95 is a wafer accommodating body that accommodates the wafers 7 held on the pallet 8 in a state where a plurality of wafers 7 are arranged in the Z direction. That is, the pallet accommodating body 95 accommodates the pallet 8 in a state in which the wafers 7 are held. The pallet accommodating body 95 is supported by a pair of rail members 921 by one of the accommodating body supporting structures 92 in the inner space 917 of the device body 91 so as to be movable in the Z direction (refer to FIGS. 5 and 6 ). As shown in FIGS. 7 and 8 , the pallet accommodating body 95 includes a magazine rack 951 , a latch member 952 , and a latch opening and closing mechanism 953 .

匣盒架951係形成為Y方向之兩端開口之箱形，且構成用以收容保持有晶圓7之狀態之托板8之收容本體的構造體。於匣盒架951之X方向之兩側面，於Z方向排列地設置有複數個支持托板8而使其能於Y方向移動之支持部9511。再者，支持於複數個支持部9511各者之各托板8所保持之各晶圓7彼此為同一種。亦即，匣盒架951中收容之複數個托板8分別保持具有同一種晶粒7a之晶圓7。本實施方式中，匣盒架951於裝置本體91之內部空間917內，以與第1框架板911之間形成特定之間隙GP(圖6)之方式配置。The cassette rack 951 is formed in a box shape with both ends opened in the Y direction, and constitutes a structure body for accommodating a receiving body of the pallet 8 in a state where the wafers 7 are held. On both sides of the cassette holder 951 in the X direction, a plurality of supporting portions 9511 for supporting the pallets 8 to be movable in the Y direction are arranged in a row in the Z direction. Furthermore, the wafers 7 held by the pallets 8 supported by the plurality of support portions 9511 are of the same type. That is, the plurality of pallets 8 accommodated in the cassette rack 951 respectively hold the wafers 7 having the same type of die 7a. In this embodiment, the cassette holder 951 is arranged in the inner space 917 of the apparatus main body 91 so as to form a specific gap GP ( FIG. 6 ) with the first frame plate 911 .

閂鎖構件952係相對於匣盒架951，在上述間隙GP之範圍內向第1框架板911側突出地設置且沿Z方向延伸之棒狀構件。閂鎖構件952係晶圓移動控制構件之一例。閂鎖構件952分別設置於匣盒架951中之位於第1框架板911側(-Y側)及X方向之+X側及-X側之各端部。閂鎖構件952能夠繞沿Z方向延伸之閂鎖旋動軸9521旋動。閂鎖旋動軸9521分別設置於匣盒架951中之位於-Y側及+X側之端部、以及位於-Y側及-X側之端部。閂鎖構件952藉由繞閂鎖旋動軸9521旋動而能夠於以下兩種姿勢之間變更，即：限制保持有晶圓7之狀態之托板8從匣盒架951向第1框架板911側(-Y側)移動之移動限制姿勢(圖7之姿勢)、及容許該移動之移動容許姿勢(圖8之姿勢)。The latch member 952 is a rod-shaped member provided to protrude toward the first frame plate 911 and extending in the Z direction within the range of the above-mentioned gap GP with respect to the cassette holder 951 . The latch member 952 is an example of a wafer movement control member. The latch members 952 are respectively provided at the ends of the cassette holder 951 on the first frame plate 911 side (-Y side) and the +X side and the -X side in the X direction. The latch member 952 is rotatable about a latch rotation shaft 9521 extending in the Z direction. The latch rotation shafts 9521 are respectively disposed at the ends of the cassette holder 951 on the -Y side and the +X side, and the ends on the -Y side and the -X side. The latch member 952 can be changed between the following two postures by rotating around the latch rotating shaft 9521, that is, restricting the pallet 8 holding the wafer 7 from the cassette frame 951 to the first frame plate 911 side (-Y side) movement restriction posture (posture of FIG. 7), and movement permission posture (posture of FIG. 8) which allows this movement.

閂鎖開閉機構953設置於匣盒架951中之+Z側之上表面。閂鎖開閉機構953係藉由使閂鎖構件952繞閂鎖旋動軸9521旋動，而使該閂鎖構件952於上述移動限制姿勢與上述移動容許姿勢之間變更姿勢之機構。The latch opening and closing mechanism 953 is provided on the +Z side upper surface of the cassette holder 951 . The latch opening and closing mechanism 953 is a mechanism for changing the posture of the latch member 952 between the movement restricting posture and the movement permitting posture by rotating the latch member 952 around the latch rotating shaft 9521 .

如圖6所示，於裝置本體91，安裝有托板檢測機構94C。托板檢測機構94C係用以檢測保持有晶圓7之狀態之托板8從匣盒架951向第1框架板911側(-Y側)移動之晶圓檢測機構之一例。托板檢測機構94C包含發光部94C2及受光部94C3。發光部94C2與受光部94C3係於形成在匣盒架951與第1框架板911之間之上述間隙GP之範圍內，於沿Z方向(托板收容體95之移動方向)延伸之光路94C1上相互對向配置。托板檢測機構94C基於從發光部94C2出射且沿光路94C1前進之光於受光部94C3中之接收狀況，檢測托板8從匣盒架951向第1框架板911側之移動。As shown in FIG. 6, the pallet detection mechanism 94C is attached to the apparatus main body 91. As shown in FIG. The pallet detection mechanism 94C is an example of a wafer detection mechanism for detecting the movement of the pallet 8 holding the wafer 7 from the cassette frame 951 to the first frame plate 911 side (-Y side). The pallet detection mechanism 94C includes a light-emitting portion 94C2 and a light-receiving portion 94C3. The light-emitting portion 94C2 and the light-receiving portion 94C3 are in the range of the above-mentioned gap GP formed between the cassette frame 951 and the first frame plate 911 , on the light path 94C1 extending in the Z direction (the moving direction of the pallet accommodating body 95 ). configuration opposite to each other. The pallet detection mechanism 94C detects the movement of the pallet 8 from the cassette rack 951 to the first frame plate 911 based on the reception state of the light emitted from the light-emitting portion 94C2 and traveling along the optical path 94C1 in the light-receiving portion 94C3.

移動機構96係於裝置本體91之內部空間917內，用以使收容體支持構造92之一對軌道構件921所支持之托板收容體95於Z方向移動的機構。如圖5及圖6所示，移動機構96具備滾珠螺桿軸961與驅動馬達962。滾珠螺桿軸961以接近一對軌道構件921且沿Z方向延伸之方式配設。驅動馬達962係產生用以使托板收容體95移動之驅動力之伺服馬達，將滾珠螺桿軸961旋轉驅動。於托板收容體95附設有未圖示之螺帽，該螺帽與滾珠螺桿軸961螺合。根據此種構成之移動機構96，驅動馬達962作動而將滾珠螺桿軸961旋轉驅動，從而使得托板收容體95沿著一對軌道構件921於Z方向移動。The moving mechanism 96 is located in the inner space 917 of the device body 91 , and is used to move the pallet accommodating body 95 supported by the rail member 921 in one of the accommodating body supporting structures 92 in the Z direction. As shown in FIGS. 5 and 6 , the moving mechanism 96 includes a ball screw shaft 961 and a drive motor 962 . The ball screw shaft 961 is arranged so as to be close to the pair of rail members 921 and to extend in the Z direction. The drive motor 962 is a servo motor that generates a drive force for moving the pallet accommodating body 95, and drives the ball screw shaft 961 to rotate. A nut not shown is attached to the pallet receiving body 95 , and the nut is screwed with the ball screw shaft 961 . According to the moving mechanism 96 having such a configuration, the drive motor 962 is actuated to drive the ball screw shaft 961 to rotate, so that the pallet accommodating body 95 is moved in the Z direction along the pair of rail members 921 .

移動機構96於裝置本體91之內部空間917內，使托板收容體95於面向第1開口部911A之第1位置、與面向第2開口部912A之第2位置之間在Z方向移動。上述第1位置係容許托板8經由第1開口部911A於托板收容體95與晶圓平台10之間移動之位置。上述第2位置係容許經由第2開口部912A更換收容於托板收容體95中之托板8之位置。再者，如上所述，第1開口部911A相較於第2開口部912A形成得更靠Z方向之-Z側，因此於該情形時，上述第1位置係較上述第2位置更靠Z方向之-Z側之位置。移動機構96使托板收容體95於從上述第1位置朝向上述第2位置之第1移動方向Z1移動，並且使托板收容體95於從上述第2位置朝向上述第1位置之第2移動方向Z2移動。The moving mechanism 96 moves the pallet accommodating body 95 in the Z direction between a first position facing the first opening 911A and a second position facing the second opening 912A in the inner space 917 of the device body 91 . The above-mentioned first position is a position allowing the pallet 8 to move between the pallet accommodating body 95 and the wafer stage 10 through the first opening 911A. The above-mentioned second position is a position allowing the pallet 8 accommodated in the pallet accommodating body 95 to be exchanged through the second opening 912A. Furthermore, as described above, the first opening 911A is formed closer to the -Z side in the Z direction than the second opening 912A, so in this case, the first position is closer to Z than the second position. The position of the -Z side of the direction. The moving mechanism 96 moves the pallet accommodating body 95 in the first movement direction Z1 from the first position toward the second position, and moves the pallet accommodating body 95 in the second movement from the second position toward the first position. Move in direction Z2.

再者，如圖5所示，於裝置本體91之內部空間917內，設置有收容體檢測機構94D。收容體檢測機構94D係用以檢測托板收容體95配置於上述第2位置之機構。收容體檢測機構94D包含：發光部94D1，其安裝於托板收容體95中之第1框架板911側之端部；及受光部94D2，其安裝於第1框架板911中之與第2開口部912A對向之區域部分(參照後記之圖10～圖13)。再者，亦可將發光部94D1安裝於第1框架板911，將受光部94D2安裝於托板收容體95。收容體檢測機構94D基於從發光部94D1出射之光於受光部94D2中之接收狀況，檢測托板收容體95配置於上述第2位置。收容體檢測機構94D於檢測出托板收容體95配置於上述第2位置之情形時，輸出收容體檢測信號SB(後記之圖11)。再者，關於收容體檢測機構94D，只要能檢測出托板收容體95配置於上述第2位置，則不限定於利用光之上述構造。Furthermore, as shown in FIG. 5, in the inner space 917 of the apparatus main body 91, the accommodation body detection mechanism 94D is provided. The accommodating body detection mechanism 94D is a mechanism for detecting that the pallet accommodating body 95 is arranged at the above-mentioned second position. The container detection mechanism 94D includes: a light-emitting part 94D1 mounted on the end of the pallet container 95 on the side of the first frame plate 911; and a light-receiving part 94D2 mounted on the first frame plate 911 and the second opening The portion of the region facing the portion 912A (refer to FIGS. 10 to 13 described later). Furthermore, the light-emitting portion 94D1 may be attached to the first frame plate 911 , and the light-receiving portion 94D2 may be attached to the pallet housing body 95 . The container detection mechanism 94D detects that the pallet container 95 is arranged at the second position based on the reception state of the light emitted from the light-emitting portion 94D1 in the light-receiving portion 94D2. When the container detection means 94D detects that the pallet container 95 is arranged at the second position, it outputs a container detection signal SB (FIG. 11 described later). In addition, the container detection mechanism 94D is not limited to the above-described structure using light as long as it can detect that the pallet container 95 is arranged at the second position.

開閉板97係以能夠與利用移動機構96進行之托板收容體95之移動連動地移動之方式，設置於裝置本體91之內部空間917內之板狀構件。開閉板97藉由與托板收容體95之移動連動地移動，而將形成於第1框架板911之第1開口部911A開閉。The opening and closing plate 97 is a plate-like member provided in the inner space 917 of the apparatus main body 91 so as to be movable in conjunction with the movement of the pallet accommodating body 95 by the moving mechanism 96 . The opening and closing plate 97 opens and closes the first opening 911A formed in the first frame plate 911 by moving in conjunction with the movement of the pallet accommodating body 95 .

具體而言，開閉板97於托板收容體95配置於上述第1位置之狀態下開放整個第1開口部911A。藉此，於托板收容體95配置於上述第1位置之狀態下，能從托板收容體95通過第1開口部911A向晶圓平台10供給托板8。又，能從晶圓平台10通過第1開口部911A向托板收容體95回收托板8。另一方面，於托板收容體95配置於上述第2位置之狀態下，開閉板97封閉整個第1開口部911A。藉此，於托板收容體95配置於上述第2位置之狀態下，能於整個第1開口部911A利用開閉板97阻斷從托板收容體95向晶圓平台10之通過第1開口部911A之連通。因此，於托板收容體95配置於上述第2位置之狀態下，能確實地限制通過托板收容體95進出晶圓平台10。Specifically, the opening and closing plate 97 opens the entire first opening 911A in a state in which the pallet accommodating body 95 is arranged at the above-mentioned first position. Thereby, the pallet 8 can be supplied from the pallet accommodating body 95 to the wafer stage 10 through the first opening 911A in a state where the pallet accommodating body 95 is arranged at the first position. In addition, the pallet 8 can be recovered from the wafer stage 10 to the pallet storage body 95 through the first opening 911A. On the other hand, in a state where the pallet housing body 95 is arranged at the second position, the opening and closing plate 97 closes the entire first opening 911A. Thereby, when the pallet accommodating body 95 is arranged in the second position, the passage of the pallet accommodating body 95 to the wafer stage 10 can be blocked by the opening and closing plate 97 in the entire first opening 911A. 911A connectivity. Therefore, in the state in which the pallet accommodating body 95 is arranged in the second position, it is possible to surely restrict the entry and exit of the wafer stage 10 through the pallet accommodating body 95 .

如圖6～圖8所示，開閉板97安裝於托板收容體95中之位於第1移動方向Z1之上游側(-Z側)及第1框架板911側(-Y側)之端部。藉由如此將開閉板97安裝於托板收容體95之簡易構成，能實現如下之開閉板97，即能與利用移動機構96進行之托板收容體95之移動連動地移動。而且，托板收容體95中安裝開閉板97之部位係位於從上述第1位置朝向上述第2位置之第1移動方向Z1之上游側及形成有第1開口部911A之第1框架板911側之端部。因此，於托板收容體95配置於較上述第1位置更靠第1移動方向Z1之下游側之上述第2位置之狀態下，能利用安裝於該托板收容體95中之位於第1移動方向Z1之上游側及第1框架板911側之端部的開閉板97，將形成於第1框架板911之第1開口部911A確實地封閉。藉此，於托板收容體95配置於上述第2位置之狀態下，能更確實地限制通過托板收容體95進出晶圓平台10。As shown in FIGS. 6 to 8 , the opening and closing plate 97 is attached to the end portion of the pallet housing body 95 on the upstream side (-Z side) and the first frame plate 911 side (-Y side) in the first moving direction Z1 . With the simple configuration of attaching the opening and closing plate 97 to the pallet accommodating body 95 in this way, the opening and closing plate 97 can be moved in conjunction with the movement of the pallet accommodating body 95 by the moving mechanism 96 . In addition, the portion of the pallet housing body 95 to which the opening and closing plate 97 is attached is located on the upstream side of the first moving direction Z1 from the first position toward the second position and on the side of the first frame plate 911 where the first opening 911A is formed. the end of. Therefore, in a state in which the pallet accommodating body 95 is arranged at the second position on the downstream side of the first movement direction Z1 from the first position, the pallet accommodating body 95 installed in the pallet accommodating body 95 can be used in the first moving position. The opening/closing plate 97 on the upstream side in the direction Z1 and the end on the first frame plate 911 side securely closes the first opening 911A formed in the first frame plate 911 . Thereby, in the state where the pallet accommodating body 95 is arranged in the above-mentioned second position, the entry and exit of the wafer stage 10 through the pallet accommodating body 95 can be restricted more reliably.

如上所述，第1開口部911A與第2開口部912A形成為於從與Z方向正交之Y方向觀察之視點處彼此不重疊，Z方向為托板收容體95在裝置本體91之內部空間917內移動之方向。於該情形時，於托板收容體95配置於與第2開口部912A對應之上述第2位置之狀態下，能於整個第1開口部911A利用開閉板97更確實地阻斷從托板收容體95向晶圓平台10之通過第1開口部911A之連通。因此，於托板收容體95配置於上述第2位置之狀態下，能更確實地限制通過托板收容體95進出晶圓平台10。As described above, the first opening 911A and the second opening 912A are formed so as not to overlap each other when viewed from the Y direction orthogonal to the Z direction, which is the inner space of the pallet container 95 in the device body 91 The direction of movement within 917. In this case, in a state where the pallet housing body 95 is arranged at the above-mentioned second position corresponding to the second opening 912A, the entire first opening 911A can be more reliably blocked from the pallet by the opening and closing plate 97 . The body 95 communicates with the wafer stage 10 through the first opening 911A. Therefore, in the state in which the pallet accommodating body 95 is arranged at the second position, the entry and exit of the wafer stage 10 through the pallet accommodating body 95 can be restricted more reliably.

又，如上所述，托板收容體95包含閂鎖構件952而構成，該閂鎖構件952於形成在匣盒架951與第1框架板911之間之上述間隙GP之範圍內相對於匣盒架951向第1框架板911側突出。於閂鎖構件952對應於利用閂鎖開閉機構953所進行之繞閂鎖旋動軸9521之旋動而取上述移動容許姿勢之狀態下，容許托板8從匣盒架951向第1框架板911側之移動。於該情形時，能夠從匣盒架951通過第1開口部911A向晶圓平台10供給托板8。另一方面，於閂鎖構件952取上述移動限制姿勢之狀態下，限制托板8自匣盒架951向第1框架板911側之移動。於該情形時，例如，於托板收容體95藉由移動機構96而移動時、或者托板收容體95配置於上述第2位置之狀態下，能限制托板8自匣盒架951向第1框架板911側之凸出。Further, as described above, the pallet housing body 95 is configured to include the latch member 952 that is opposed to the cassette within the range of the above-mentioned gap GP formed between the cassette holder 951 and the first frame plate 911 The frame 951 protrudes toward the first frame plate 911 side. In a state where the latch member 952 assumes the above-mentioned movement permitting posture in response to the rotation of the latch rotating shaft 9521 by the latch opening and closing mechanism 953, the pallet 8 is allowed to move from the cassette holder 951 to the first frame plate. Movement on the 911 side. In this case, the pallet 8 can be supplied to the wafer stage 10 from the cassette rack 951 through the first opening 911A. On the other hand, in the state in which the latch member 952 assumes the above-mentioned movement restricting posture, the movement of the pallet 8 from the cassette holder 951 to the first frame plate 911 side is restricted. In this case, for example, when the pallet accommodating body 95 is moved by the moving mechanism 96, or when the pallet accommodating body 95 is arranged at the second position, the pallet 8 can be restricted from moving from the cassette rack 951 to the second position. 1. The protrusion on the side of the frame plate 911.

於托板收容體95包含閂鎖構件952而構成之情形時，變成如上所述於匣盒架951與第1框架板911之間形成有間隙GP之狀態。由於該間隙GP形成於匣盒架951與第1框架板911之間，故而形成於第1框架板911之第1開口部911A與間隙GP連通。因此，於托板收容體95配置於上述第2位置之狀態下，匣盒架951與晶圓平台10變成通過間隙GP及第1開口部911A而連通之狀態。於該情形時，為了限制通過匣盒架951進出晶圓平台10，必須阻斷從匣盒架951向晶圓平台10之通過間隙GP及第1開口部911A之連通。When the pallet accommodating body 95 is constituted including the latch member 952, the gap GP is formed between the cassette holder 951 and the first frame plate 911 as described above. Since the gap GP is formed between the cassette frame 951 and the first frame plate 911, the first opening 911A formed in the first frame plate 911 communicates with the gap GP. Therefore, in the state in which the pallet accommodating body 95 is arrange|positioned at the said 2nd position, the cassette frame 951 and the wafer stage 10 are in the state which communicated with each other through the gap GP and the 1st opening part 911A. In this case, it is necessary to block the communication between the passing gap GP and the first opening 911A from the cassette rack 951 to the wafer table 10 in order to restrict the entry and exit of the wafer stage 10 through the cassette rack 951 .

因此，如圖6所示，開閉板97包含突出部971與延出部972而構成。突出部971係從匣盒架951中之位於第1移動方向Z1之上游側(-Z側)及第1框架板911側(-Y側)之端部，在上述間隙GP之範圍內向第1框架板911側突出之板狀部分。突出部971之沿著X方向之長度被設定為與匣盒架951之沿著X方向之長度大致相同之值。又，突出部971從匣盒架951起之突出長度被設定為較上述間隙GP之尺寸稍小之值。延出部972係以能夠開放或封閉整個第1開口部911A之方式，從突出部971向第2移動方向Z2側(-Z側)延伸之板狀部分。延出部972之沿著X方向之長度與突出部971之沿著X方向之長度相同，被設定為較第1開口部911A之沿著X方向之長度大之值。又，延出部972之沿著Z方向之長度被設定為較第1開口部911A之沿著Z方向之長度大之值。Therefore, as shown in FIG. 6 , the opening and closing plate 97 includes a protruding portion 971 and an extending portion 972 . The protruding portion 971 extends from the end portion of the cassette holder 951 on the upstream side (-Z side) of the first moving direction Z1 and the first frame plate 911 side (-Y side) to the first side within the range of the above-mentioned gap GP. A plate-like portion protruding from the frame plate 911 side. The length along the X direction of the protruding portion 971 is set to be substantially the same as the length along the X direction of the cassette holder 951 . In addition, the protruding length of the protruding portion 971 from the cassette holder 951 is set to a value slightly smaller than the size of the above-mentioned gap GP. The extension portion 972 is a plate-shaped portion extending from the protruding portion 971 to the second moving direction Z2 side (−Z side) so that the entire first opening portion 911A can be opened or closed. The length along the X direction of the extension portion 972 is the same as the length along the X direction of the protruding portion 971, and is set to a value greater than the length along the X direction of the first opening portion 911A. Moreover, the length along the Z direction of the extension part 972 is set to the value larger than the length along the Z direction of the 1st opening part 911A.

本實施方式中，開閉板97係包含突出部971與延出部972為一體的剖面形狀呈L型之構件。藉由使用剖面形狀為L型之構件，能簡單地構成突出部971與延出部972為一體之開閉板97。In the present embodiment, the opening and closing plate 97 is a member having an L-shaped cross-sectional shape including the protruding portion 971 and the extension portion 972 as a whole. By using a member having an L-shaped cross-sectional shape, the opening and closing plate 97 in which the protruding portion 971 and the extending portion 972 are integrated can be easily configured.

開閉板97之突出部971從匣盒架951中之位於第1移動方向Z1之上游側及第1框架板911側之端部，在上述間隙GP之範圍內向第1框架板911側突出。藉此，於托板收容體95配置於較上述第1位置更靠第1移動方向Z1之下游側之上述第2位置之狀態下，可利用突出部971阻斷上述間隙GP與第1開口部911A之連通。而且，開閉板97之延出部972以能夠開放或封閉整個第1開口部911A之方式從突出部971延伸。藉此，於托板收容體95配置於上述第2位置之狀態下，可利用延出部972將第1開口部911A封閉。亦即，於托板收容體95配置於上述第2位置之狀態下，利用突出部971阻斷匣盒架951與第1框架板911之間之上述間隙GP和第1開口部911A的連通，並且利用延出部972將第1開口部911A封閉。藉此，於托板收容體95配置於上述第2位置之狀態下，能確實地限制通過匣盒架951進出晶圓平台10。The protruding portion 971 of the opening and closing plate 97 protrudes from the end portion of the cassette holder 951 on the upstream side of the first moving direction Z1 and on the first frame plate 911 side within the range of the gap GP to the first frame plate 911 side. As a result, in a state where the pallet housing body 95 is disposed at the second position on the downstream side of the first movement direction Z1 from the first position, the gap GP and the first opening can be blocked by the protruding portion 971 . 911A connectivity. And the extension part 972 of the opening-closing plate 97 is extended from the protrusion part 971 so that the whole 1st opening part 911A can be opened or closed. Thereby, in the state in which the pallet accommodating body 95 is arrange|positioned at the said 2nd position, the 1st opening part 911A can be closed by the extension part 972. That is, when the pallet housing body 95 is arranged at the second position, the protruding portion 971 blocks the communication between the gap GP between the cassette holder 951 and the first frame plate 911 and the first opening portion 911A. And the 1st opening part 911A is closed by the extension part 972. Thereby, in the state in which the pallet accommodating body 95 is arrange|positioned in the said 2nd position, it can restrict|limit reliably the access to the wafer stage 10 through the cassette rack 951.

又，如上所述，於形成在匣盒架951與第1框架板911之間之上述間隙GP之範圍內，設置有托板檢測機構94C，該托板檢測機構94C包含在該間隙GP之範圍內於沿Z方向延伸之光路94C1上相互對向配置之發光部94C2及受光部94C3。基於托板檢測機構94C之檢測結果，可檢測出來自匣盒架951之托板8向第1框架板911側凸出之狀況等。於該情形時，從匣盒架951在上述間隙GP之範圍內向第1框架板911側突出之開閉板97之突出部971具有透光孔9711。該透光孔9711係藉由將托板檢測機構94C之光路94C1開放而容許光從發光部94C2透射至受光部94C3之孔。藉此，能避免開閉板97妨礙托板檢測機構94C檢測托板8。Further, as described above, within the range of the gap GP formed between the cassette rack 951 and the first frame plate 911, the pallet detection mechanism 94C is provided, and the pallet detection mechanism 94C is included in the range of the gap GP. The light-emitting portion 94C2 and the light-receiving portion 94C3 are arranged opposite to each other on the light path 94C1 extending in the Z direction. Based on the detection result of the pallet detection mechanism 94C, the state that the pallet 8 from the cassette holder 951 protrudes toward the side of the first frame plate 911 and the like can be detected. In this case, the protruding portion 971 of the opening and closing plate 97 protruding from the cassette holder 951 to the first frame plate 911 side within the range of the above-mentioned gap GP has a light-transmitting hole 9711 . The light-transmitting hole 9711 is a hole that allows light to pass from the light-emitting portion 94C2 to the light-receiving portion 94C3 by opening the light path 94C1 of the pallet detection mechanism 94C. Thereby, the opening and closing plate 97 can be prevented from interfering with the detection of the pallet 8 by the pallet detection mechanism 94C.

[晶圓供給裝置之控制構成] 繼而，參照圖9之方塊圖，對晶圓供給裝置6之控制構成進行說明。晶圓供給裝置6具備控制晶圓輸送器11及晶圓收納升降機9之動作之控制部6C。控制部6C包含內置有例如記憶控制程式之ROM(Read Only Memory，唯讀記憶體)或暫時記憶資料之快閃記憶體等記憶裝置之微電腦。控制部6C藉由讀出上述控制程式，而控制晶圓輸送器11及晶圓收納升降機9之動作。控制部6C例如配置於裝置本體91中之第5框架板915上(參照圖5)。控制部6C之功能構成包含輸送器控制部11C與升降機控制部9C。 [Control structure of wafer feeder] Next, with reference to the block diagram of FIG. 9, the control structure of the wafer supply apparatus 6 is demonstrated. The wafer feeder 6 includes a control unit 6C that controls the operations of the wafer feeder 11 and the wafer storage elevator 9 . The control unit 6C includes a microcomputer having a built-in memory device such as a ROM (Read Only Memory) for storing a control program or a flash memory for temporarily storing data. The control unit 6C controls the operations of the wafer transporter 11 and the wafer storage elevator 9 by reading the above-mentioned control program. The control part 6C is arrange|positioned on the 5th frame board 915 in the apparatus main body 91, for example (refer FIG. 5). The functional configuration of the control unit 6C includes a conveyor control unit 11C and an elevator control unit 9C.

輸送器控制部11C控制晶圓輸送器11。輸送器控制部11C於要將托板8供給至晶圓平台10之情形時，控制晶圓輸送器11以將托板8從托板收容體95通過第1開口部911A抽出至晶圓平台10上。另一方面，於要回收配置於晶圓平台10之使用過之托板8之情形時，輸送器控制部11C控制晶圓輸送器11以將晶圓平台10上之托板8通過第1開口部911A歸還至托板收容體95。The conveyor control unit 11C controls the wafer conveyor 11 . When the carrier control unit 11C is to supply the pallet 8 to the wafer stage 10 , the wafer carrier 11 is controlled so as to extract the pallet 8 from the pallet storage body 95 to the wafer stage 10 through the first opening 911A superior. On the other hand, when the used pallet 8 arranged on the wafer stage 10 is to be recovered, the conveyor control unit 11C controls the wafer conveyor 11 to pass the pallet 8 on the wafer stage 10 through the first opening The portion 911A is returned to the pallet storage body 95 .

升降機控制部9C控制晶圓收納升降機9。對升降機控制部9C，輸入門開關94A之輸出信號，並且輸入門檢測機構94B、托板檢測機構94C及收容體檢測機構94D各自之檢測信號。升降機控制部9C之功能構成包含鎖定控制部9C1、閂鎖控制部9C2及移動控制部9C3。The elevator control unit 9C controls the wafer storage elevator 9 . To the elevator control part 9C, the output signal of the door switch 94A is input, and the detection signal of each of the door detection mechanism 94B, the pallet detection mechanism 94C, and the container detection mechanism 94D is input. The functional configuration of the elevator control unit 9C includes a lock control unit 9C1, a latch control unit 9C2, and a movement control unit 9C3.

鎖定控制部9C1基於收容體檢測機構94D之檢測信號，控制門鎖定機構93。鎖定控制部9C1於收容體檢測機構94D輸出表示托板收容體95配置於上述第2位置之收容體檢測信號SB(後記之圖11)之情形時，控制門鎖定機構93以解除門鎖定機構93對門體916之封閉狀態之維持。藉此，於托板收容體95配置於上述第2位置之情形時，門體916之封閉狀態之維持被解除。亦即，於與托板收容體95配置於上述第2位置對應地，開閉板97封閉整個第1開口部911A之狀態下，門體916之封閉狀態之維持被解除。因此，於為托板收容體95配置於上述第2位置之狀態、且為第1開口部911A由開閉板97封閉之狀態之情形時，可將門體916打開。另一方面，於收容體檢測機構94D未輸出收容體檢測信號SB之情形時，鎖定控制部9C1控制門鎖定機構93以維持利用門鎖定機構93之門體916之封閉狀態。The lock control unit 9C1 controls the door lock mechanism 93 based on the detection signal of the container detection mechanism 94D. The lock control unit 9C1 controls the door lock mechanism 93 to release the door lock mechanism 93 when the container detection mechanism 94D outputs the container detection signal SB indicating that the pallet container 95 is arranged at the second position (see FIG. 11 hereinafter). Maintenance of the closed state of the door body 916 . Thereby, when the pallet accommodating body 95 is arrange|positioned at the said 2nd position, the maintenance of the closed state of the door body 916 is cancelled|released. That is, the maintenance of the closed state of the door body 916 is released in a state where the opening and closing plate 97 closes the whole of the first opening 911A corresponding to the arrangement of the pallet accommodating body 95 at the second position. Therefore, the door body 916 can be opened when the pallet accommodating body 95 is arranged at the second position and the first opening 911A is closed by the opening and closing plate 97 . On the other hand, when the container detection mechanism 94D does not output the container detection signal SB, the lock control unit 9C1 controls the door lock mechanism 93 to maintain the closed state of the door body 916 by the door lock mechanism 93 .

閂鎖控制部9C2根據托板收容體95於裝置本體91之內部空間917內之位置，來控制閂鎖開閉機構953。閂鎖控制部9C2於托板收容體95配置於上述第1位置之情形時，控制閂鎖開閉機構953以使閂鎖構件952取上述移動容許姿勢。於閂鎖構件952取上述移動容許姿勢之狀態下，容許來自匣盒架951之托板8向第1框架板911側移動。藉此，能夠從匣盒架951通過第1開口部911A向晶圓平台10供給托板8。另一方面，於利用移動機構96使托板收容體95移動時、或者托板收容體95配置於上述第2位置之情形時，閂鎖控制部9C2控制閂鎖開閉機構953以使閂鎖構件952取上述移動限制姿勢。於閂鎖構件952取上述移動限制姿勢之狀態下，來自匣盒架951之托板8向第1框架板911側之移動受到限制。藉此，能限制托板8自匣盒架951向第1框架板911側之凸出。The latch control part 9C2 controls the latch opening and closing mechanism 953 according to the position of the pallet accommodating body 95 in the inner space 917 of the device body 91 . The latch control unit 9C2 controls the latch opening and closing mechanism 953 so that the latch member 952 assumes the movement permitting posture when the pallet housing body 95 is arranged at the first position. In a state where the latch member 952 takes the above-mentioned movement permitting posture, the pallet 8 from the cassette holder 951 is allowed to move to the first frame plate 911 side. Thereby, the pallet 8 can be supplied to the wafer stage 10 from the cassette rack 951 through the first opening 911A. On the other hand, when the pallet accommodating body 95 is moved by the moving mechanism 96 or when the pallet accommodating body 95 is arranged at the second position, the latch control unit 9C2 controls the latch opening and closing mechanism 953 so that the latch member 952 takes the above-mentioned movement restriction posture. In the state where the latch member 952 assumes the above-mentioned movement restricting posture, the movement of the pallet 8 from the cassette holder 951 to the first frame plate 911 side is restricted. Thereby, the protrusion of the pallet 8 from the cassette holder 951 to the 1st frame board 911 side can be restrained.

移動控制部9C3基於門開關94A之輸出信號，控制移動機構96。當門開關94A輸出受理了請求打開門體916之操作之情形時的門打開請求信號SA1(後記之圖11)時，移動控制部9C3控制移動機構96以使托板收容體95配置於與設置有門體916之第2開口部912A對應的上述第2位置。藉此，於門開關94A之操作後，門體916打開之情形時，托板收容體95配置於上述第2位置。於如此托板收容體95配置於上述第2位置之狀態下，藉由打開門體916，能經由第2開口部912A更換收容於托板收容體95中之托板8。於該情形時，利用開閉板97確實地限制了通過托板收容體95進出晶圓平台10。The movement control unit 9C3 controls the movement mechanism 96 based on the output signal of the door switch 94A. When the door switch 94A outputs the door opening request signal SA1 (FIG. 11 hereinafter) when the operation requesting the opening of the door body 916 is accepted, the movement control unit 9C3 controls the movement mechanism 96 so that the pallet storage body 95 is arranged and installed in the There is the above-mentioned second position corresponding to the second opening portion 912A of the door body 916 . Thereby, when the door body 916 is opened after the operation of the door switch 94A, the pallet accommodating body 95 is arranged at the above-mentioned second position. In the state where the pallet accommodating body 95 is arranged in the above-mentioned second position, the pallet 8 accommodated in the pallet accommodating body 95 can be exchanged through the second opening 912A by opening the door body 916 . In this case, the opening and closing plate 97 securely restricts the entry and exit of the wafer stage 10 through the pallet accommodating body 95 .

另一方面，當門開關94A輸出門體916關閉之情形時之門關閉信號SA2(後記之圖13)時，移動控制部9C3控制移動機構96以使托板收容體95配置於與朝向晶圓平台10開口之第1開口部911A對應之上述第1位置。藉此，於門體916關閉之情形時，托板收容體95配置於上述第1位置。於如此托板收容體95配置於上述第1位置之狀態下，利用開閉板97將第1開口部911A開放。因此，能夠從托板收容體95通過第1開口部911A向晶圓平台10供給托板8。On the other hand, when the door switch 94A outputs the door closing signal SA2 (FIG. 13 described later) when the door body 916 is closed, the movement control unit 9C3 controls the movement mechanism 96 so that the pallet storage body 95 is disposed in and toward the wafer. The above-mentioned first position corresponds to the first opening portion 911A of the opening of the platform 10 . Thereby, when the door body 916 is closed, the pallet accommodating body 95 is arrange|positioned at the said 1st position. In a state where the pallet storage body 95 is arranged at the above-mentioned first position, the first opening 911A is opened by the opening and closing plate 97 . Therefore, the pallet 8 can be supplied to the wafer stage 10 from the pallet accommodating body 95 through the first opening 911A.

又，移動控制部9C3基於門檢測機構94B之檢測信號，控制移動機構96。當門檢測機構94B輸出表示門體916打開之檢測結果之門打開檢測信號SC(後記之圖12)時，移動控制部9C3使移動機構96之驅動馬達962之驅動停止。藉此，於門體916打開之狀態下，可限制托板收容體95移動。再者，即便於移動控制部9C3使驅動馬達962之驅動停止之狀態下，零件安裝裝置1中之用以使頭單元4移動之各伺服馬達14，18、用以使相機單元32U移動之各伺服馬達34，38、及用以使頂起單元40移動之各伺服馬達44，46之驅動亦不會停止。因此，於晶圓供給裝置6之驅動馬達962之驅動停止之狀態下，繼續利用零件安裝裝置1使用晶圓平台10上配置之托板8上之晶圓7之晶粒7a進行安裝動作。Moreover, the movement control part 9C3 controls the movement mechanism 96 based on the detection signal of the door detection means 94B. When the door detection mechanism 94B outputs a door open detection signal SC (FIG. 12 described later) indicating the detection result of the door body 916 being opened, the movement control unit 9C3 stops the driving of the drive motor 962 of the movement mechanism 96. Thereby, when the door body 916 is opened, the movement of the pallet accommodating body 95 can be restricted. Furthermore, even in the state where the movement control section 9C3 stops the driving of the drive motor 962, the servo motors 14 and 18 for moving the head unit 4 in the component mounting apparatus 1, and the respective servo motors 14 and 18 for moving the camera unit 32U in the component mounting apparatus 1. The driving of the servo motors 34, 38 and the respective servo motors 44, 46 for moving the jacking unit 40 does not stop. Therefore, while the drive motor 962 of the wafer feeding device 6 is stopped, the component mounting device 1 continues to perform the mounting operation using the die 7a of the wafer 7 on the pallet 8 arranged on the wafer stage 10 .

[晶圓供給裝置之基本動作] 繼而，參照圖10～圖13以及圖14之流程圖，對表示利用晶圓供給裝置6進行之托板8之供給及回收之處理的托板供給回收處理進行說明。 [Basic operation of wafer feeder] Next, with reference to the flowcharts of FIGS. 10 to 13 and FIG. 14 , the pallet supply and recovery process showing the supply and recovery of the pallet 8 by the wafer supply device 6 will be described.

如圖10所示，於在裝置本體91之內部空間917內托板收容體95配置於上述第1位置之狀態下，利用開閉板97將第1開口部911A開放(步驟S1)。於該情形時，閂鎖控制部9C2控制閂鎖開閉機構953以使閂鎖構件952取上述移動容許姿勢。於閂鎖構件952取上述移動容許姿勢之狀態下，容許來自匣盒架951之托板8向第1框架板911側移動。於該狀態下，輸送器控制部11C控制晶圓輸送器11，以使配置於晶圓平台10之使用過之托板8E通過第1開口部911A返回至托板收容體95(步驟S2)。藉此，配置於晶圓平台10之使用過之托板8E被回收至托板收容體95。As shown in FIG. 10 , the first opening 911A is opened by the opening and closing plate 97 with the pallet accommodating body 95 arranged in the first position in the inner space 917 of the apparatus main body 91 (step S1 ). In this case, the latch control part 9C2 controls the latch opening and closing mechanism 953 so that the latch member 952 assumes the above-mentioned movement permitting posture. In a state where the latch member 952 takes the above-mentioned movement permitting posture, the pallet 8 from the cassette holder 951 is allowed to move to the first frame plate 911 side. In this state, the conveyor control unit 11C controls the wafer conveyor 11 so that the used pallet 8E placed on the wafer stage 10 is returned to the pallet storage body 95 through the first opening 911A (step S2 ). Thereby, the used pallet 8E arranged on the wafer stage 10 is recovered to the pallet storage body 95 .

於回收使用過之托板8E之後，輸送器控制部11C控制晶圓輸送器11以將新的托板8通過第1開口部911A從托板收容體95抽出至晶圓平台10上(步驟S3)。藉此，代替使用過之托板8E，新的托板8被供給至晶圓平台10。頭單元4從供給至晶圓平台10之新的托板8所保持之晶圓7取出晶粒7a。After recovering the used pallet 8E, the conveyor control unit 11C controls the wafer conveyor 11 to pull out the new pallet 8 from the pallet accommodating body 95 to the wafer stage 10 through the first opening 911A (step S3 ). ). Thereby, a new pallet 8 is supplied to the wafer stage 10 in place of the used pallet 8E. The head unit 4 takes out the die 7 a from the wafer 7 held by the new pallet 8 supplied to the wafer stage 10 .

於托板收容體95配置於上述第1位置之狀態下，升降機控制部9C監視門開關94A是否輸出門打開請求信號SA1(步驟S4)。如圖11所示，當門開關94A輸出門打開請求信號SA1時(步驟S4中為是(YES))，閂鎖控制部9C2控制閂鎖開閉機構953以使閂鎖構件952取上述移動限制姿勢。於閂鎖構件952取上述移動限制姿勢之狀態下，限制托板8自匣盒架951向第1框架板911側之移動。於該狀態下，移動控制部9C3控制移動機構96以使托板收容體95配置於與設置有門體916之第2開口部912A對應之上述第2位置(步驟S5)。In the state in which the pallet storage body 95 is arrange|positioned at the said 1st position, the elevator control part 9C monitors whether the door switch 94A outputs door opening request signal SA1 (step S4). As shown in FIG. 11 , when the door switch 94A outputs the door opening request signal SA1 (YES (YES) in step S4 ), the latch control unit 9C2 controls the latch opening/closing mechanism 953 so that the latch member 952 assumes the above-described movement restricting posture . In a state where the latch member 952 takes the above-mentioned movement restricting posture, the movement of the pallet 8 from the cassette holder 951 to the first frame plate 911 side is restricted. In this state, the movement control part 9C3 controls the movement mechanism 96 so that the pallet storage body 95 may be arrange|positioned at the said 2nd position corresponding to the 2nd opening part 912A in which the door body 916 was provided (step S5).

升降機控制部9C監視收容體檢測機構94D是否輸出收容體檢測信號SB(步驟S6)。如圖11所示，當收容體檢測機構94D輸出收容體檢測信號SB時(步驟S6中為是)，成為托板收容體95配置於上述第2位置且開閉板97封閉整個第1開口部911A之狀態。於該狀態下，鎖定控制部9C1控制門鎖定機構93以解除門鎖定機構93對門體916之封閉狀態之維持(步驟S7)。The elevator control unit 9C monitors whether or not the container detection mechanism 94D outputs the container detection signal SB (step S6). As shown in FIG. 11 , when the container detection mechanism 94D outputs the container detection signal SB (YES in step S6 ), the pallet container 95 is arranged at the second position and the opening and closing plate 97 closes the entire first opening 911A. state. In this state, the lock control unit 9C1 controls the door lock mechanism 93 to release the maintenance of the closed state of the door body 916 by the door lock mechanism 93 (step S7).

當門鎖定機構93對門體916之封閉狀態之維持被解除時，可打開門體916。升降機控制部9C監視門檢測機構94B是否輸出門打開檢測信號SC(步驟S8)。如圖12所示，當門檢測機構94B輸出門打開檢測信號SC時(步驟S8中為是)，移動控制部9C3停止移動機構96之驅動馬達962之驅動(步驟S9)。藉此，於門體916打開之狀態下，可限制托板收容體95移動。於門體916打開之狀態下，能夠將回收至托板收容體95之使用過之托板8E經由第2開口部912A更換為新的托板8。於該情形時，利用開閉板97確實地限制通過托板收容體95進出晶圓平台10。再者，於該狀態下，頭單元4繼續進行從供給至晶圓平台10之托板8所保持之晶圓7取出晶粒7a之動作。When the maintenance of the closed state of the door body 916 by the door locking mechanism 93 is released, the door body 916 can be opened. The elevator control unit 9C monitors whether or not the door detection mechanism 94B outputs the door open detection signal SC (step S8). As shown in FIG. 12 , when the door detection mechanism 94B outputs the door open detection signal SC (YES in step S8 ), the movement control unit 9C3 stops the driving of the drive motor 962 of the movement mechanism 96 (step S9 ). Thereby, when the door body 916 is opened, the movement of the pallet accommodating body 95 can be restricted. When the door body 916 is opened, the used pallet 8E collected in the pallet storage body 95 can be replaced with a new pallet 8 through the second opening 912A. In this case, the opening and closing plate 97 is used to surely restrict the entry and exit of the wafer stage 10 through the pallet accommodating body 95 . Furthermore, in this state, the head unit 4 continues the operation of taking out the die 7 a from the wafer 7 held by the pallet 8 supplied to the wafer stage 10 .

升降機控制部9C監視門開關94A是否輸出門關閉信號SA2(步驟S10)。如圖13所示，當門開關94A輸出門關閉信號SA2時(步驟S10中為是)，移動控制部9C3控制移動機構96以使托板收容體95配置於與朝向晶圓平台10開口之第1開口部911A對應之上述第1位置(步驟S11)。藉此，於門體916關閉之情形時，托板收容體95配置於上述第1位置。於如此托板收容體95配置於上述第1位置之狀態下，利用開閉板97將第1開口部911A開放。因此，能將托板8從托板收容體95通過第1開口部911A供給至晶圓平台10。The elevator control unit 9C monitors whether the door switch 94A outputs the door close signal SA2 (step S10). As shown in FIG. 13 , when the door switch 94A outputs the door close signal SA2 (YES in step S10 ), the movement control unit 9C3 controls the movement mechanism 96 so that the pallet accommodating body 95 is arranged on the first side of the opening facing the wafer stage 10 . 1. The above-mentioned first position corresponding to the opening portion 911A (step S11). Thereby, when the door body 916 is closed, the pallet accommodating body 95 is arrange|positioned at the said 1st position. In a state where the pallet storage body 95 is arranged at the above-mentioned first position, the first opening 911A is opened by the opening and closing plate 97 . Therefore, the pallet 8 can be supplied to the wafer stage 10 from the pallet accommodating body 95 through the first opening 911A.

[關於晶圓供給裝置之變化實施方式] 以上，對本發明之實施方式之零件安裝裝置1所具備之晶圓供給裝置6進行了說明，但本發明並不限定於此，例如可採用如下所述之變化實施方式。 [About the modified embodiment of the wafer feeding device] As mentioned above, although the wafer supply apparatus 6 with which the component mounting apparatus 1 concerning embodiment of this invention is equipped was demonstrated, this invention is not limited to this, For example, the following modified embodiment can be employ|adopted.

上述實施方式中，對在晶圓收納升降機9之裝置本體91中，第1開口部911A相較於第2開口部912A在Z方向形成於更-Z側之構成進行了說明，但並不限定於此。如圖15所示，第1開口部911A亦可相較於第2開口部912B在Z方向形成於更+Z側。於該情形時，關於利用移動機構96之托板收容體95之移動方向，從與第1開口部911A對應之第1位置朝向與第2開口部912A對應之第2位置的第1移動方向Z1成為從+Z側朝向-Z側之方向。另一方面，從與第2開口部912A對應之第2位置朝向與第1開口部911A對應之第1位置的第2移動方向Z2成為從-Z側朝向+Z側之方向。In the above-described embodiment, the configuration in which the first opening 911A is formed on the -Z side in the Z direction compared to the second opening 912A in the apparatus body 91 of the wafer storage elevator 9 has been described, but it is not limited to here. As shown in FIG. 15 , the first opening 911A may be formed on the +Z side in the Z direction compared to the second opening 912B. In this case, the moving direction of the pallet container 95 by the moving mechanism 96 is the first moving direction Z1 from the first position corresponding to the first opening 911A to the second position corresponding to the second opening 912A. It becomes the direction from the +Z side to the -Z side. On the other hand, the second movement direction Z2 from the second position corresponding to the second opening 912A to the first position corresponding to the first opening 911A is the direction from the -Z side to the +Z side.

於該情形時，開閉板97安裝於托板收容體95中之位於第1移動方向Z1之上游側(+Z側)及第1框架板911側(-Y側)之端部。藉由此種構成，於托板收容體95配置於較第1位置更靠第1移動方向Z1之下游側(-Z側)之第2位置之狀態下，能利用安裝於該托板收容體95中之位於第1移動方向Z1之上游側(+Z側)及第1框架板911側(-Y側)之端部的開閉板97，確實地封閉形成於第1框架板911之第1開口部911A。藉此，於托板收容體95配置於第2位置之狀態下，能確實地限制通過托板收容體95進出晶圓平台10。In this case, the opening and closing plate 97 is attached to the end portion on the upstream side (+Z side) and the first frame plate 911 side (−Y side) of the pallet housing body 95 in the first movement direction Z1. With such a configuration, in a state where the pallet accommodating body 95 is arranged at the second position on the downstream side (-Z side) of the first moving direction Z1 from the first position, the pallet accommodating body 95 can be attached to the pallet accommodating body. The opening and closing plate 97 located at the upstream side (+Z side) of the first moving direction Z1 and the end portion on the first frame plate 911 side (-Y side) of the 95 securely closes the first frame plate 911 formed on the first frame plate 911. Opening 911A. Thereby, in the state in which the pallet accommodating body 95 is arrange|positioned in the 2nd position, it can restrict|limit reliably the access to the wafer stage 10 through the pallet accommodating body 95.

又，上述實施方式中，示出了托板收容體95中用以收容托板8之收容本體僅由匣盒架951構成之例，但並不限定於此。如圖16所示，托板收容體95中之收容本體亦可包含匣盒架951與外殼951A。外殼951A係Y方向之兩端開口之箱形殼體。外殼951A安裝於移動機構96之滾珠螺桿軸961，並且收容匣盒架951而使其能夠向Y方向之+Y側移動。於該情形時，於托板收容體95配置於第2位置之狀態下，能使匣盒架951通過第2開口部912A進出外殼951A。因此，能以收容有複數個托板8之狀態之匣盒架951為單位進行更換。In addition, in the above-mentioned embodiment, the accommodating main body for accommodating the pallet 8 in the pallet accommodating body 95 was shown as the example comprised only by the cassette holder 951, but it is not limited to this. As shown in FIG. 16 , the accommodating body in the pallet accommodating body 95 may also include a cassette holder 951 and a casing 951A. The case 951A is a box-shaped case with both ends opened in the Y direction. The housing 951A is attached to the ball screw shaft 961 of the moving mechanism 96, and accommodates the cassette holder 951 so as to be movable to the +Y side in the Y direction. In this case, in a state where the pallet accommodating body 95 is arranged at the second position, the cassette rack 951 can be moved in and out of the casing 951A through the second opening 912A. Therefore, it is possible to replace the cassette racks 951 in units of the state in which the plurality of pallets 8 are accommodated.

於該情形時，開閉板97安裝於外殼951A中之位於第1移動方向Z1之上游側及第1框架板911側之端部。藉由此種構成，於托板收容體95配置於第2位置之狀態下，能利用安裝於外殼951A中之位於第1移動方向Z1之上游側及第1框架板911側之端部的開閉板97，確實地封閉形成於第1框架板911之第1開口部911A。藉此，於托板收容體95配置於第2位置之狀態下，能確實地限制通過托板收容體95進出晶圓平台10。In this case, the opening and closing plate 97 is attached to the end portion on the upstream side of the first movement direction Z1 and the first frame plate 911 side in the casing 951A. With such a configuration, in a state where the pallet housing body 95 is arranged at the second position, the opening and closing of the ends on the upstream side of the first moving direction Z1 and the first frame plate 911 side mounted in the casing 951A can be used. The plate 97 securely closes the first opening 911A formed in the first frame plate 911 . Thereby, in the state in which the pallet accommodating body 95 is arrange|positioned in the 2nd position, it can restrict|limit reliably the access to the wafer stage 10 through the pallet accommodating body 95.

再者，上述具體實施方式主要包含具有以下構成之發明。In addition, the above-mentioned specific embodiment mainly includes invention which has the following structures.

本發明之一態樣之晶圓供給裝置係將被分割成複數個零件之晶圓供給至特定之零件取出作業位置之裝置。該晶圓供給裝置具備：裝置本體，其包含形成有朝向上述零件取出作業位置側開口之第1開口部之第1框架板、及形成有朝向與上述零件取出作業位置側相反之側開口之第2開口部之第2框架板，且於上述第1框架板與上述第2框架板之間界定出與上述第1開口部及上述第2開口部連通之內部空間；晶圓收容體，其構成為能夠收容上述晶圓，且配置於上述內部空間內；移動機構，其使上述晶圓收容體在第1位置與第2位置之間，於從上述第1位置朝向上述第2位置之第1移動方向移動，並且使上述晶圓收容體於從上述第2位置朝向上述第1位置之第2移動方向移動，上述第1位置容許上述晶圓於上述晶圓收容體與上述零件取出作業位置之間經由上述第1開口部移動，上述第2位置容許經由上述第2開口部更換收容於上述晶圓收容體中之上述晶圓；以及開閉板，其以能夠與利用上述移動機構所進行之上述晶圓收容體之移動連動地移動之方式設置於上述內部空間內，於上述晶圓收容體配置於上述第1位置之狀態下，開放整個上述第1開口部，另一方面，於上述晶圓收容體配置於上述第2位置之狀態下，封閉整個上述第1開口部。A wafer supply apparatus according to an aspect of the present invention is an apparatus for supplying a wafer divided into a plurality of parts to a specific part extraction operation position. The wafer feeding apparatus includes: an apparatus main body including a first frame plate formed with a first opening opening toward the side of the parts extraction operation position, and a first frame plate formed with an opening toward the side opposite to the side of the parts extraction operation position. a second frame plate with 2 openings, and an internal space communicated with the first opening and the second opening is defined between the first frame plate and the second frame plate; a wafer accommodating body comprising In order to be able to accommodate the above-mentioned wafer, and to be arranged in the above-mentioned internal space; a moving mechanism, which makes the above-mentioned wafer accommodating body between the first position and the second position, in the first position from the above-mentioned first position to the above-mentioned second position. moving in the moving direction, and moving the wafer container in a second movement direction from the second position toward the first position, the first position allowing the wafer to be located between the wafer container and the parts extraction operation position moving through the first opening, the second position allows the wafer accommodated in the wafer housing to be exchanged through the second opening; The movement of the wafer container is provided in the inner space, and the entire first opening is opened in a state where the wafer container is arranged in the first position. In a state where the container is arranged at the second position, the entirety of the first opening is closed.

根據該晶圓供給裝置，裝置本體具有朝向零件取出作業位置側開口之第1開口部、及朝向與零件取出作業位置側相反之側開口之第2開口部。移動機構使晶圓收容體於容許晶圓在晶圓收容體與零件取出作業位置之間經由第1開口部移動的第1位置、和容許經由第2開口部更換收容於晶圓收容體中之晶圓的第2位置之間移動。開閉板能與利用移動機構所進行之晶圓收容體之移動連動地移動。According to this wafer feeding apparatus, the apparatus main body has the first opening that opens toward the part extraction operation position side, and the second opening that opens toward the side opposite to the parts extraction operation position side. The moving mechanism moves the wafer container to a first position that allows the wafer to move between the wafer container and the parts extraction operation position through the first opening, and allows the wafer to be replaced and accommodated in the wafer container through the second opening Move between the 2nd positions of the wafer. The opening and closing plate can move in conjunction with the movement of the wafer container by the moving mechanism.

開閉板於晶圓收容體配置於第1位置之狀態下開放整個第1開口部。藉此，於晶圓收容體配置於第1位置之狀態下，能夠將晶圓從晶圓收容體通過第1開口部供給至零件取出作業位置。另一方面，於晶圓收容體配置於第2位置之狀態下，開閉板封閉整個第1開口部。藉此，於晶圓收容體配置於第2位置之狀態下，能於整個第1開口部利用開閉板阻斷從晶圓收容體向零件取出作業位置之通過第1開口部之連通。因此，於晶圓收容體配置於第2位置之狀態下，能確實地限制通過晶圓收容體進出零件取出作業位置。The opening and closing plate opens the entire first opening in a state where the wafer container is arranged at the first position. Thereby, in the state in which the wafer container is arranged at the first position, the wafer can be supplied from the wafer container to the parts extraction operation position through the first opening. On the other hand, in a state where the wafer container is arranged at the second position, the opening and closing plate closes the entire first opening. Thereby, in the state where the wafer container is arranged in the second position, the communication through the first opening from the wafer container to the component extraction operation position can be blocked by the opening and closing plate over the entire first opening. Therefore, in the state where the wafer container is arranged at the second position, the position for taking out the parts through the wafer container can be reliably restricted.

關於上述晶圓供給裝置，上述開閉板亦可為安裝於上述晶圓收容體中之位於上述第1移動方向之上游側及上述第1框架板側之端部的構成。In the above-mentioned wafer feeding device, the opening and closing plate may be attached to an end portion located on the upstream side of the first moving direction and on the side of the first frame plate in the wafer housing body.

於該態樣中，藉由將開閉板安裝於晶圓收容體之簡易構成，能實現如下之開閉板，即能與利用移動機構所進行之晶圓收容體之移動連動地移動。而且，晶圓收容體中安裝開閉板之部位係位於從第1位置朝向第2位置之第1移動方向之上游側及形成有第1開口部之第1框架板側的端部。因此，於晶圓收容體配置於較第1位置更靠第1移動方向之下游側之第2位置的狀態下，能利用安裝於該晶圓收容體中之位於第1移動方向之上游側及第1框架板側之端部的開閉板，確實地封閉形成於第1框架板之第1開口部。藉此，於晶圓收容體配置於第2位置之狀態下，能更確實地限制通過晶圓收容體進出零件取出作業位置。In this aspect, with the simple structure of attaching the opening and closing plate to the wafer container, it is possible to realize the opening and closing plate that can move in conjunction with the movement of the wafer container by the moving mechanism. In addition, the portion where the opening and closing plate is mounted in the wafer container is located on the upstream side in the first moving direction from the first position to the second position and at the end portion on the side of the first frame plate where the first opening is formed. Therefore, in a state in which the wafer container is disposed at the second position that is further downstream in the first moving direction than the first position, it is possible to utilize the upstream side and the upstream side of the first moving direction mounted in the wafer container. The opening and closing plate at the end on the first frame plate side securely closes the first opening formed in the first frame plate. Thereby, in the state in which the wafer container is arranged at the second position, it is possible to more reliably restrict the position for taking out the parts in and out of the wafer container.

上述晶圓供給裝置中，上述第1開口部與上述第2開口部亦可為以如下方式形成之構成，即從與上述第1移動方向及上述第2移動方向正交之方向觀察之視點處不重疊。In the above-mentioned wafer feeding device, the first opening and the second opening may be formed so as to be viewed from a viewpoint in a direction orthogonal to the first moving direction and the second moving direction. do not overlap.

於該態樣中，於晶圓收容體配置於與第2開口部對應之第2位置之狀態下，能於整個第1開口部利用開閉板更確實地阻斷從晶圓收容體向零件取出作業位置之通過第1開口部之連通。因此，於晶圓收容體配置於第2位置之狀態下，能更確實地限制通過晶圓收容體進出零件取出作業位置。In this aspect, in a state where the wafer container is arranged at the second position corresponding to the second opening, it is possible to more reliably block the removal of components from the wafer container by the opening and closing plate over the entire first opening. Communication at the working position through the first opening. Therefore, in the state where the wafer container is arranged at the second position, the position for taking out the parts through the wafer container can be restricted more reliably.

上述晶圓供給裝置中，上述晶圓收容體亦可為包含如下構件之構成，即：收容本體，其以於上述內部空間內與上述第1框架板之間形成特定之間隙之方式配置，用以收容上述晶圓；及晶圓移動控制構件，其相對於上述收容本體，在上述間隙之範圍內向上述第1框架板側突出地設置，能夠於限制上述晶圓自上述收容本體向上述第1框架板側之移動之移動限制姿勢與容許該移動之移動容許姿勢之間變更姿勢。於該情形時，上述開閉板包含：突出部，其從上述收容本體中之位於上述第1移動方向之上游側及上述第1框架板側之端部，在上述間隙之範圍內向上述第1框架板側突出；以及延出部，其以能夠開放整個上述第1開口部或封閉之方式從上述突出部延伸。In the above-mentioned wafer feeding device, the above-mentioned wafer receiving body may be constituted by including the following members, that is, the receiving body is arranged so as to form a specific gap between the above-mentioned inner space and the above-mentioned first frame plate, to accommodate the wafer; and a wafer movement control member, relative to the accommodating body, provided so as to protrude toward the first frame plate within the range of the gap, so as to restrict the movement of the wafer from the accommodating body to the first frame plate. The posture is changed between the movement restricting posture of the movement on the frame plate side and the movement permitting posture allowing the movement. In this case, the opening/closing plate includes a protruding portion extending from the end portion of the housing body on the upstream side in the first moving direction and on the side of the first frame plate to the first frame within the range of the gap. a plate-side protruding portion; and an extension portion extending from the protruding portion so as to be able to open or close the entirety of the first opening portion.

於該態樣中，利用形成於晶圓收容體之收容本體與第1框架板之間之間隙設置晶圓移動控制構件。於該晶圓移動控制構件取移動容許姿勢之狀態下，容許來自收容本體之晶圓向第1框架板側移動。於該情形時，能夠將晶圓從收容本體通過第1開口部供給至零件取出作業位置。另一方面，於晶圓移動控制構件取移動限制姿勢之狀態下，限制晶圓自收容本體向第1框架板側之移動。於該情形時，例如，於利用移動機構使晶圓收容體移動時、或者晶圓收容體配置於第2位置之狀態下，能限制晶圓自收容本體向第1框架板側之凸出。In this aspect, the wafer movement control member is provided by utilizing the gap formed between the accommodating body of the wafer accommodating body and the first frame plate. In a state in which the wafer movement control member takes the movement permitting posture, the wafer from the housing body is allowed to move to the first frame plate side. In this case, the wafer can be supplied from the housing body to the parts extraction operation position through the first opening. On the other hand, when the wafer movement control member assumes the movement restriction posture, the movement of the wafer from the housing body to the first frame plate side is restricted. In this case, for example, when the wafer container is moved by the moving mechanism, or when the wafer container is arranged in the second position, the wafer can be restricted from protruding from the container body to the first frame plate side.

於晶圓收容體包含晶圓移動控制構件而構成之情形時，成為如上所述於收容本體與第1框架板之間形成有間隙之狀態。該間隙形成於收容本體與第1框架板之間，故而形成於第1框架板之第1開口部與間隙連通。因此，於晶圓收容體配置於第2位置之狀態下，收容本體與零件取出作業位置通過間隙及第1開口部成為連通狀態。於該情形時，為了限制通過收容本體進出零件取出作業位置，必須阻斷從收容本體向零件取出作業位置之通過間隙及第1開口部之連通。In the case where the wafer storage body includes the wafer movement control member, a gap is formed between the storage body and the first frame plate as described above. The gap is formed between the housing body and the first frame plate, so that the first opening formed in the first frame plate communicates with the gap. Therefore, in a state in which the wafer container is arranged at the second position, the container body and the parts extraction operation position are in a communication state through the gap and the first opening. In this case, it is necessary to block the communication between the passage gap and the first opening from the accommodating body to the parts extracting operation position in order to restrict the entry and exit of the parts extraction operation position through the storage body.

因此，將開閉板設為包含突出部與延出部之構成。開閉板之突出部從收容本體中之位於第1移動方向之上游側及第1框架板側之端部，在間隙之範圍內向第1框架板側突出。藉此，於晶圓收容體配置於較第1位置更靠第1移動方向下游側之第2位置之狀態下，能利用從收容本體中之位於第1移動方向上游側及第1框架板側之端部，在間隙之範圍內向第1框架板側突出的突出部，阻斷間隙與第1開口部之連通。而且，開閉板之延出部以能夠開放或封閉整個第1開口部之方式從突出部延伸。藉此，於晶圓收容體配置於第2位置之狀態下，能利用延出部將第1開口部封閉。亦即，於晶圓收容體配置於第2位置之狀態下，利用突出部阻斷收容本體與第1框架板之間之間隙和第1開口部的連通，並且利用延出部封閉第1開口部。藉此，於晶圓收容體配置於第2位置之狀態下，能確實地限制通過收容本體進出零件取出作業位置。Therefore, the opening and closing plate is configured to include the protruding portion and the extending portion. The protruding portion of the opening and closing plate protrudes toward the first frame plate side within the range of the gap from the end portion of the housing body located on the upstream side in the first moving direction and on the first frame plate side. Thereby, in the state where the wafer holder is arranged at the second position downstream of the first movement direction from the first position, the wafer holder can be used from the holder body on the upstream side in the first movement direction and on the first frame plate side. At the end of the gap, a protrusion protruding toward the first frame plate side within the range of the gap blocks the communication between the gap and the first opening. And the extension part of an opening and closing plate is extended from a protrusion part so that the whole 1st opening part can be opened or closed. Thereby, in the state where the wafer container is arrange|positioned at the 2nd position, the 1st opening part can be closed by the extension part. That is, in the state where the wafer container is arranged at the second position, the protruding portion blocks the communication between the gap between the container body and the first frame plate and the first opening, and the extension portion closes the first opening. department. Thereby, in the state in which the wafer container is arranged at the second position, the position for taking out the parts through the container body can be reliably restricted.

上述晶圓供給裝置中，上述開閉板包含上述突出部與上述延出部為一體的剖面形狀呈L型之構件。In the above-mentioned wafer feeding device, the opening and closing plate includes a member having an L-shaped cross-sectional shape in which the protruding portion and the extending portion are integrated.

於該態樣中，藉由使用剖面形狀為L型之構件，能簡單地構成突出部與延出部為一體之開閉板。In this aspect, by using a member whose cross-sectional shape is an L-shape, the opening and closing plate in which the protruding portion and the extending portion are integrated can be easily constituted.

上述晶圓供給裝置亦可為進而具備晶圓檢測機構之構成，該晶圓檢測機構係檢測上述晶圓自上述收容本體向上述第1框架板側之移動之機構，包含在上述間隙之範圍內於沿上述第1移動方向及上述第2移動方向延伸之光路上相互對向配置的發光部及受光部。於該情形時，上述開閉板之上述突出部具有藉由將上述光路開放而容許光從上述發光部透射至上述受光部之透光孔。The wafer feeding device may be further provided with a wafer inspection mechanism that detects the movement of the wafer from the housing body to the first frame plate side, which is included in the range of the gap. The light-emitting portion and the light-receiving portion are arranged to face each other on the optical path extending along the first moving direction and the second moving direction. In this case, the protruding portion of the opening and closing plate has a light-transmitting hole that allows light to be transmitted from the light-emitting portion to the light-receiving portion by opening the light path.

於該態樣中，可基於晶圓檢測機構之檢測結果，檢測來自收容本體之晶圓向第1框架板側之凸出狀況等。於該情形時，於開閉板中之在收容本體與第1框架板之間之間隙之範圍內突出之突出部，形成有將晶圓檢測機構之光路開放之透光孔。藉此，能避免開閉板妨礙晶圓檢測機構對晶圓之檢測。In this aspect, based on the detection result of the wafer detection mechanism, the protruding state of the wafer from the housing body to the first frame plate side, etc. can be detected. In this case, a light-transmitting hole for opening the optical path of the wafer inspection mechanism is formed in the protrusion of the opening and closing plate that protrudes within the range of the gap between the receiving body and the first frame plate. In this way, it is possible to prevent the opening and closing plate from interfering with the detection of the wafer by the wafer detection mechanism.

上述晶圓供給裝置中，上述裝置本體亦可為包含用以將上述第2開口部開放及封閉之門體之構成。於該情形時，上述晶圓供給裝置進而具備：門開關，其於受理請求打開上述門體之操作時，輸出門打開請求信號；及移動控制部，其基於從上述門開關輸出之信號，控制上述移動機構。而且，上述移動控制部於從上述門開關輸出上述門打開請求信號時，控制上述移動機構使上述晶圓收容體朝向上述第2位置移動並配置於該第2位置。In the above-mentioned wafer supply apparatus, the apparatus body may include a door for opening and closing the second opening. In this case, the wafer feeding apparatus further includes: a door switch that outputs a door opening request signal when an operation requesting to open the door body is received; and a movement control unit that controls the door switch based on the signal output from the door switch. The above-mentioned moving mechanism. Further, when the door opening request signal is outputted from the door switch, the movement control unit may control the movement mechanism to move the wafer container toward the second position and arrange it at the second position.

於該態樣中，移動控制部基於裝置本體之門體中之與第2開口部之開閉相關之門開關之輸出信號，控制移動機構。於門開關輸出受理請求打開門體之操作時之門打開請求信號之情形時，移動控制部控制移動機構以使晶圓收容體配置於與設置有門體之第2開口部對應之第2位置。藉此，於在門開關之操作後，門體打開之情形時，晶圓收容體配置於第2位置。於如上所述晶圓收容體配置於第2位置之狀態下，藉由打開門體，能經由第2開口部更換收容於晶圓收容體中之晶圓。於該情形時，利用開閉板確實地限制通過晶圓收容體進出零件取出作業位置。In this aspect, the movement control unit controls the movement mechanism based on the output signal of the door switch related to the opening and closing of the second opening in the door body of the device body. When the door switch outputs a door opening request signal when an operation requesting to open the door is received, the movement control unit controls the movement mechanism so that the wafer container is arranged at a second position corresponding to the second opening where the door is provided . Thereby, when the door is opened after the door switch is operated, the wafer container is arranged at the second position. In the state where the wafer container is arranged at the second position as described above, by opening the door, the wafer accommodated in the wafer container can be exchanged through the second opening. In this case, the opening and closing plate is used to surely restrict the operation position of taking out the parts in and out of the wafer container.

上述晶圓供給裝置中，上述裝置本體亦可為包含用以將上述第2開口部開放及封閉之門體之構成。於該情形時，上述晶圓供給裝置進而具備：門開關，其於上述門體關閉時，輸出門關閉信號；及移動控制部，其基於從上述門開關輸出之信號，控制上述移動機構。而且，上述移動控制部於從上述門開關輸出上述門關閉信號時，控制上述移動機構以使上述晶圓收容體朝向上述第1位置移動並配置於該第1位置。In the above-mentioned wafer supply apparatus, the apparatus body may include a door for opening and closing the second opening. In this case, the wafer feeding apparatus further includes: a door switch that outputs a door closing signal when the door body is closed; and a movement control unit that controls the movement mechanism based on the signal output from the door switch. Further, when the door closing signal is outputted from the door switch, the movement control unit may control the movement mechanism so that the wafer container is moved toward the first position and disposed at the first position.

於該態樣中，當門開關輸出門體關閉之情形時之門關閉信號時，移動控制部控制移動機構以使晶圓收容體配置於與朝向零件取出作業位置開口之第1開口部對應之第1位置。藉此，於門體關閉之情形時，晶圓收容體配置於第1位置。於如上所述晶圓收容體配置於第1位置之狀態下，利用開閉板將第1開口部開放。因此，能將晶圓從晶圓收容體通過第1開口部供給至零件取出作業位置。In this aspect, when the door switch outputs a door closing signal when the door is closed, the movement control unit controls the movement mechanism so that the wafer container is arranged in the position corresponding to the first opening that opens toward the part extraction operation position. 1st position. Thereby, when the door is closed, the wafer container is arranged at the first position. In the state where the wafer container is arranged at the first position as described above, the first opening is opened by the opening and closing plate. Therefore, the wafer can be supplied from the wafer container through the first opening to the parts extraction operation position.

上述晶圓供給裝置亦可為進而具備如下構件之構成，即：收容體檢測機構，其於檢測出上述晶圓收容體配置於上述第2位置時輸出收容體檢測信號；門鎖定機構，其維持上述門體將上述第2開口部封閉之狀態；及鎖定控制部，其於上述收容體檢測機構輸出上述收容體檢測信號時，控制上述門鎖定機構以解除上述門鎖定機構對上述門體之封閉狀態之維持。The wafer feeding apparatus may be further provided with the following components: a container detection mechanism that outputs a container detection signal when it is detected that the wafer container is arranged at the second position, and a door locking mechanism that maintains a state in which the door body closes the second opening; and a lock control unit that controls the door lock mechanism to release the door lock mechanism from closing the door body when the container body detection mechanism outputs the container body detection signal maintenance of state.

於該態樣中，於從收容體檢測機構輸出表示晶圓收容體配置於第2位置之檢測結果的收容體檢測信號時，鎖定控制部控制鎖定機構以解除利用鎖定機構維持門體之關閉的鎖定狀態。藉此，於晶圓收容體配置於第2位置之情形時，門體之封閉狀態之維持被解除。亦即，於與晶圓收容體配置於第2位置對應地，開閉板封閉整個第1開口部之狀態下，門體之封閉狀態之維持被解除。因此，於為晶圓收容體配置於第2位置之狀態，且為第1開口部被開閉板封閉之狀態之情形時，能打開門體。In this aspect, when the container detection signal indicating the detection result that the wafer container is arranged at the second position is output from the container detection mechanism, the lock control unit controls the lock mechanism to release the locking mechanism for maintaining the door closed. locked state. Thereby, when the wafer container is arranged at the second position, the maintenance of the closed state of the door is released. That is, in a state in which the entire first opening is closed by the opening and closing plate corresponding to the wafer container being arranged at the second position, the maintenance of the closed state of the door is released. Therefore, in the state where the wafer container is arranged at the second position and the first opening is closed by the opening and closing plate, the door can be opened.

上述晶圓供給裝置亦可為進而具備於檢測出上述門體打開時，輸出門打開檢測信號之門檢測機構之構成。而且，上述移動機構包含產生用以使上述晶圓收容體移動之驅動力之驅動馬達，上述移動控制部於上述門檢測機構輸出上述門打開檢測信號時，使上述驅動馬達之驅動停止。The above-mentioned wafer feeder may further include a door detection mechanism that outputs a door-open detection signal when the door is detected to be open. Further, the movement mechanism includes a drive motor that generates a drive force for moving the wafer container, and the movement control unit stops the drive of the drive motor when the door detection mechanism outputs the door opening detection signal.

於該態樣中，於門檢測機構輸出表示門體已打開之檢測結果之門打開檢測信號時，移動控制部停止移動機構之驅動馬達之驅動。藉此，於門體打開之狀態下，能限制晶圓收容體移動。In this aspect, when the door detection mechanism outputs the door opening detection signal indicating the detection result that the door body has been opened, the movement control unit stops the driving of the drive motor of the movement mechanism. Thereby, when the door is open, the movement of the wafer container can be restricted.

本發明之另一態樣之零件移載裝置具備：上述晶圓供給裝置，其將被分割成複數個零件之晶圓供給至特定之零件取出作業位置；及零件移載單元，其從供給至上述零件取出作業位置之上述晶圓取出上述零件並移載至特定之零件移載部。A parts transfer device according to another aspect of the present invention includes: the above-mentioned wafer supply device for supplying the wafer divided into a plurality of parts to a specific parts take-out operation position; and a parts transfer unit for supplying to The above-mentioned wafer in the above-mentioned parts extraction operation position extracts the above-mentioned parts and transfers them to a specific parts transfer part.

如以上所說明，根據本發明，可提供一種能確實地限制通過晶圓收容體進出零件取出作業位置之晶圓供給裝置、及具備其之零件移載裝置。As described above, according to the present invention, it is possible to provide a wafer feeder capable of reliably restricting entry and exit of a part taking out operation position through a wafer container, and a parts transfer device including the same.

1:零件安裝裝置 2:基台 3:輸送器 4:頭單元 4H:頭 5:零件供給部 6:晶圓供給裝置 6C:控制部 7:晶圓 7a:晶粒 8:托板 8a:晶圓片 8E:托板 9:晶圓收納升降機 9C:升降機控制部 9C1:鎖定控制部 9C2:閂鎖控制部 9C3:移動控制部 10:晶圓平台 11:晶圓輸送器 11C:輸送器控制部 13:Y軸固定軌道 14:第1Y軸伺服馬達 15:滾珠螺桿軸 16:支持框架 17:螺帽 18:第1X軸伺服馬達 19:滾珠螺桿軸 30:零件識別相機 31:基板識別相機 32:晶圓相機 32U:相機單元 33:Y軸固定軌道 34:第2Y軸伺服馬達 35:滾珠螺桿軸 36:支持框架 37:螺帽 38:第2X軸伺服馬達 39:滾珠螺桿軸 40:頂起單元 41:導軌 42:支持框架 43:滾珠螺桿軸 44:第3Y軸伺服馬達 45:滾珠螺桿軸 46:第3X軸伺服馬達 47:頂起銷 91:裝置本體 92:收容體支持構造 93:門鎖定機構 94A:門開關 94B:門檢測機構 94C:托板檢測機構 94C1:光路 94C2:發光部 94C3:受光部 94D:收容體檢測機構 94D1:發光部 94D2:受光部 95:托板收容體 96:移動機構 97:開閉板 911:第1框架板 911A:第1開口部 912:第2框架板 912A:第2開口部 913:第3框架板 914:第4框架板 915:第5框架板 916:門體 917:內部空間 921:軌道構件 951:匣盒架 951A:外殼 952:閂鎖構件 953:閂鎖開閉機構 961:滾珠螺桿軸 962:驅動馬達 971:突出部 972:延出部 9511:支持部 9521:閂鎖旋動軸 9711:透光孔 D1:第1驅動機構 D2:第2驅動機構 P:基板1: Parts mounting device 2: Abutment 3: Conveyor 4: Head unit 4H: Head 5: Parts Supply Department 6: Wafer Feeder 6C: Control Department 7: Wafer 7a: Die 8: pallet 8a: Wafer 8E: pallet 9: Wafer storage elevator 9C: Elevator Control Department 9C1: Lock Control Section 9C2: Latch Control Section 9C3: Mobile Control Department 10: Wafer Platform 11: Wafer feeder 11C: Conveyor Control Section 13: Y-axis fixed track 14: 1st Y-axis servo motor 15: Ball screw shaft 16: Support Framework 17: Nut 18: 1X axis servo motor 19: Ball screw shaft 30: Part recognition camera 31: Substrate recognition camera 32: Wafer Camera 32U: camera unit 33: Y-axis fixed track 34: 2nd Y-axis servo motor 35: Ball screw shaft 36: Support Framework 37: Nut 38: 2X axis servo motor 39: Ball screw shaft 40: Jack up unit 41: Rails 42: Support Framework 43: Ball screw shaft 44: 3rd Y-axis servo motor 45: Ball screw shaft 46: 3X axis servo motor 47: Jack up pins 91: Device body 92: Containment body support structure 93: Door Locking Mechanism 94A: Door switch 94B: Door Inspection Agency 94C: Pallet inspection mechanism 94C1: Optical Path 94C2: light-emitting part 94C3: Receiver 94D: Containment Body Testing Agency 94D1: Light-emitting part 94D2: Receiver 95: Pallet container 96: Moving Mechanisms 97: Opening and closing plate 911: 1st frame plate 911A: 1st opening 912: 2nd frame plate 912A: 2nd opening 913: 3rd frame plate 914: 4th frame plate 915: 5th frame plate 916: Door body 917: Interior Space 921: Track Components 951: Cassette Holder 951A: Shell 952: Latch member 953: Latch opening and closing mechanism 961: Ball Screw Shaft 962: Drive Motor 971: Protrusion 972: Extension Department 9511: Support Department 9521: Latch Rotary Shaft 9711: Translucent hole D1: 1st drive mechanism D2: 2nd drive mechanism P: substrate

圖1係表示本發明之實施方式之零件安裝裝置之整體構成的俯視時之平面圖。 圖2係表示頭單元及頂起單元之概略立體圖。 圖3係從+Y側觀察晶圓供給裝置之晶圓收納升降機時之立體圖。 圖4係從-Y側觀察晶圓供給裝置之晶圓收納升降機時之立體圖。 圖5係於卸除框架板之狀態下從+Y側觀察晶圓供給裝置之晶圓收納升降機時之立體圖。 圖6係於卸除框架板之狀態下從-Y側觀察晶圓供給裝置之晶圓收納升降機時之立體圖。 圖7係托板收容體之立體圖，且係表示閂鎖構件取移動限制姿勢之狀態之圖。 圖8係托板收容體之立體圖，且係表示閂鎖構件取移動容許姿勢之狀態之圖。 圖9係表示晶圓供給裝置之控制構成之方塊圖。 圖10係用於說明利用晶圓供給裝置進行之托板供給回收處理之圖，且係表示托板收容體配置於第1位置之狀態之圖。 圖11係用於說明利用晶圓供給裝置進行之托板供給回收處理之圖，且係表示托板收容體配置於第2位置之狀態之圖。 圖12係用於說明利用晶圓供給裝置進行之托板供給回收處理之圖，且係表示門體打開之狀態之圖。 圖13係用於說明利用晶圓供給裝置進行之托板供給回收處理之圖，且係表示托板收容體移動至第1位置之狀態之圖。 圖14係利用晶圓供給裝置進行之托板供給回收處理之流程圖。 圖15係表示晶圓供給裝置之第1變化例之圖。 圖16係表示晶圓供給裝置之第2變化例之圖。 FIG. 1 is a plan view showing the overall configuration of a component mounting apparatus according to an embodiment of the present invention in a plan view. FIG. 2 is a schematic perspective view showing the head unit and the jacking unit. FIG. 3 is a perspective view of the wafer storage lifter of the wafer feeder viewed from the +Y side. FIG. 4 is a perspective view of the wafer storage lifter of the wafer feeder viewed from the -Y side. FIG. 5 is a perspective view when the wafer storage elevator of the wafer feeder is viewed from the +Y side in a state in which the frame plate is removed. FIG. 6 is a perspective view of the wafer storage lifter of the wafer feeder viewed from the -Y side in a state in which the frame plate is removed. FIG. 7 is a perspective view of the pallet accommodating body, and is a view showing a state in which the latch member takes a movement restricting posture. FIG. 8 is a perspective view of the pallet accommodating body, and is a view showing a state in which the latch member takes a movement permitting posture. FIG. 9 is a block diagram showing the control structure of the wafer feeding device. FIG. 10 is a diagram for explaining a pallet supply and recovery process by a wafer supply device, and is a diagram showing a state in which the pallet storage body is arranged at the first position. FIG. 11 is a diagram for explaining a pallet supply and recovery process by a wafer supply device, and is a diagram showing a state in which the pallet storage body is arranged at the second position. FIG. 12 is a diagram for explaining a pallet supply and recovery process by a wafer supply device, and is a diagram showing a state in which the door is opened. FIG. 13 is a diagram for explaining a pallet supply and recovery process by a wafer supply device, and is a diagram showing a state in which the pallet storage body is moved to the first position. FIG. 14 is a flowchart of a pallet feeding and recycling process by a wafer feeding device. FIG. 15 is a diagram showing a first modification of the wafer feeding apparatus. FIG. 16 is a diagram showing a second modification of the wafer feeding apparatus.

4:頭單元 4: Head unit

6:晶圓供給裝置 6: Wafer Feeder

8:托板 8: pallet

8E:托板 8E: pallet

9:晶圓收納升降機 9: Wafer storage elevator

10:晶圓平台 10: Wafer Platform

11:晶圓輸送器 11: Wafer feeder

93:門鎖定機構 93: Door Locking Mechanism

94A:門開關 94A: Door switch

94B:門檢測機構 94B: Door Inspection Agency

94C:托板檢測機構 94C: Pallet inspection mechanism

94C2:發光部 94C2: light-emitting part

94C3:受光部 94C3: Receiver

94D:收容體檢測機構 94D: Containment Body Testing Agency

94D1:發光部 94D1: Light-emitting part

94D2:受光部 94D2: Receiver

95:托板收容體 95: Pallet container

96:移動機構 96: Moving Mechanisms

97:開閉板 97: Opening and closing plate

911:第1框架板 911: 1st frame plate

911A:第1開口部 911A: 1st opening

912:第2框架板 912: 2nd frame plate

912A:第2開口部 912A: 2nd opening

914:第4框架板 914: 4th frame plate

915:第5框架板 915: 5th frame plate

916:門體 916: Door body

917:內部空間 917: Interior Space

951:匣盒架 951: Cassette Holder

952:閂鎖構件 952: Latch member

961:滾珠螺桿軸 961: Ball Screw Shaft

962:驅動馬達 962: Drive Motor

971:突出部 971: Protrusion

972:延出部 972: Extension Department

Claims (11)

一種晶圓供給裝置，其係將被分割成複數個零件之晶圓供給至特定之零件取出作業位置者，且具備： 裝置本體，其包含形成有朝向上述零件取出作業位置側開口之第1開口部的第1框架板、及形成有朝向與上述零件取出作業位置側相反之側開口之第2開口部的第2框架板，且於上述第1框架板與上述第2框架板之間界定出與上述第1開口部及上述第2開口部連通之內部空間； 晶圓收容體，其構成為能夠收容上述晶圓，且配置於上述內部空間內； 移動機構，其使上述晶圓收容體於第1位置與第2位置之間，於從上述第1位置朝向上述第2位置之第1移動方向移動，並且使上述晶圓收容體於從上述第2位置朝向上述第1位置之第2移動方向移動，上述第1位置容許上述晶圓經由上述第1開口部於上述晶圓收容體與上述零件取出作業位置之間移動，上述第2位置容許經由上述第2開口部更換收容於上述晶圓收容體中之上述晶圓；以及 開閉板，其以能夠與利用上述移動機構所進行之上述晶圓收容體之移動連動地移動之方式設置於上述內部空間內，於上述晶圓收容體配置於上述第1位置之狀態下，開放整個上述第1開口部，另一方面，於上述晶圓收容體配置於上述第2位置之狀態下，封閉整個上述第1開口部。 A wafer supply device, which supplies wafers divided into a plurality of parts to a specific part extraction operation position, and is provided with: A device body comprising a first frame plate formed with a first opening opening toward the side of the parts extraction operation position, and a second frame plate formed with a second opening opened toward the side opposite to the parts extraction operation position side a plate, and an internal space communicating with the first opening and the second opening is defined between the first frame plate and the second frame plate; a wafer accommodating body, which is configured to be capable of accommodating the above-mentioned wafers, and is arranged in the above-mentioned inner space; A moving mechanism that moves the wafer container between a first position and a second position in a first movement direction from the first position to the second position, and moves the wafer container from the first position to the second position. The second position moves toward the second movement direction of the first position, the first position allows the wafer to move between the wafer container and the parts extraction operation position through the first opening, and the second position allows the movement of the wafer through the first opening. The second opening portion replaces the wafer accommodated in the wafer container; and an opening and closing plate provided in the inner space so as to be movable in conjunction with the movement of the wafer container by the moving mechanism, and opened in a state where the wafer container is arranged in the first position On the other hand, the whole of the first opening is closed in the state where the wafer container is arranged at the second position. 如請求項1之晶圓供給裝置，其中上述開閉板安裝於上述晶圓收容體中之位於上述第1移動方向上游側且上述第1框架板側之端部。The wafer feeding apparatus according to claim 1, wherein the opening and closing plate is attached to an end portion of the wafer housing body located on the upstream side in the first moving direction and on the side of the first frame plate. 如請求項2之晶圓供給裝置，其中上述第1開口部與上述第2開口部形成為於從與上述第1移動方向及上述第2移動方向正交之方向觀察之視點處不重疊。The wafer feeding apparatus according to claim 2, wherein the first opening and the second opening are formed so as not to overlap at a viewpoint viewed from a direction orthogonal to the first moving direction and the second moving direction. 如請求項1之晶圓供給裝置，其中上述晶圓收容體包含： 收容本體，其以於上述內部空間內，與上述第1框架板之間形成特定之間隙之方式配置，用以收容上述晶圓；及 晶圓移動控制構件，其相對於上述收容本體，在上述間隙之範圍內向上述第1框架板側突出地設置，能夠在限制上述晶圓自上述收容本體向上述第1框架板側之移動之移動限制姿勢、與容許該移動之移動容許姿勢之間變更姿勢； 上述開閉板包含： 突出部，其從上述收容本體中之位於上述第1移動方向上游側且上述第1框架板側之端部，在上述間隙之範圍內向上述第1框架板側突出；以及 延出部，其以能夠開放整個上述第1開口部或封閉之方式，從上述突出部延伸。 The wafer supply device of claim 1, wherein the wafer receiving body comprises: an accommodating body, which is arranged in a manner of forming a specific gap with the first frame plate in the inner space, and is used for accommodating the wafer; and The wafer movement control member is provided to protrude toward the first frame plate side within the range of the gap with respect to the storage body, and can restrict the movement of the wafer from the storage body to the first frame plate side. Changing the posture between the restricted posture and the movement-permissive posture that allows the movement; The above-mentioned opening and closing plate includes: a protruding portion that protrudes from the end portion of the housing body on the upstream side in the first moving direction and on the side of the first frame plate, within the range of the gap, to the side of the first frame plate; and The extension part is extended from the said protruding part so that the whole said 1st opening part can be opened or closed. 如請求項4之晶圓供給裝置，其中上述開閉板包含上述突出部與上述延出部為一體的剖面形狀呈L型之構件。The wafer feeding device according to claim 4, wherein the opening and closing plate includes a member having an L-shaped cross-sectional shape in which the protruding portion and the extending portion are integrated. 如請求項4之晶圓供給裝置，其進而具備晶圓檢測機構，該晶圓檢測機構係檢測上述晶圓自上述收容本體向上述第1框架板側之移動之機構，且包含在上述間隙之範圍內於沿上述第1移動方向及上述第2移動方向延伸之光路上相互對向配置之發光部及受光部， 上述開閉板之上述突出部具有藉由將上述光路開放而容許光從上述發光部透射至上述受光部之透光孔。 The wafer feeding device according to claim 4, further comprising a wafer inspection mechanism that detects the movement of the wafer from the storage body to the first frame plate side, and is included in the gap between the gaps. The light-emitting part and the light-receiving part arranged opposite to each other on the light path extending along the first moving direction and the second moving direction within the range, The protruding portion of the opening and closing plate has a light-transmitting hole that allows light to be transmitted from the light-emitting portion to the light-receiving portion by opening the light path. 如請求項1之晶圓供給裝置，其中上述裝置本體包含用以將上述第2開口部開放及封閉之門體， 上述晶圓供給裝置進而具備：門開關，其於受理請求打開上述門體之操作時，輸出門打開請求信號；及移動控制部，其基於從上述門開關輸出之信號，控制上述移動機構；且 上述移動控制部於從上述門開關輸出上述門打開請求信號時，控制上述移動機構以使上述晶圓收容體朝向上述第2位置移動並配置於該第2位置。 The wafer feeding device according to claim 1, wherein the device body includes a door for opening and closing the second opening, The above-mentioned wafer feeding apparatus further includes: a door switch that outputs a door-opening request signal when an operation requesting to open the door body is received; and a movement control unit that controls the movement mechanism based on the signal output from the door switch; and When the door opening request signal is output from the door switch, the movement control unit controls the movement mechanism so that the wafer container moves toward the second position and is disposed at the second position. 如請求項1之晶圓供給裝置，其中上述裝置本體包含用以將上述第2開口部開放及封閉之門體， 上述晶圓供給裝置進而具備：門開關，其於上述門體關閉時，輸出門關閉信號；及移動控制部，其基於從上述門開關輸出之信號，控制上述移動機構；且 上述移動控制部於從上述門開關輸出上述門關閉信號時，控制上述移動機構以使上述晶圓收容體朝向上述第1位置移動並配置於該第1位置。 The wafer feeding device according to claim 1, wherein the device body includes a door for opening and closing the second opening, The wafer feeding apparatus further includes: a door switch that outputs a door closing signal when the door body is closed; and a movement control unit that controls the movement mechanism based on the signal output from the door switch; and When the door closing signal is outputted from the door switch, the movement control unit controls the movement mechanism so that the wafer container is moved toward the first position and placed at the first position. 如請求項7之晶圓供給裝置，其進而具備： 收容體檢測機構，其於檢測出上述晶圓收容體配置於上述第2位置時，輸出收容體檢測信號； 門鎖定機構，其維持上述門體將上述第2開口部封閉之狀態；及 鎖定控制部，其於上述收容體檢測機構輸出上述收容體檢測信號時，控制上述門鎖定機構以解除上述門鎖定機構對上述門體之封閉狀態之維持。 The wafer supply device according to claim 7, further comprising: a container detection mechanism, which outputs a container detection signal when it is detected that the wafer container is arranged at the second position; A door locking mechanism that maintains a state in which the door body closes the second opening; and The lock control unit controls the door locking mechanism to release the maintenance of the closed state of the door body by the door locking mechanism when the storage body detection mechanism outputs the storage body detection signal. 如請求項7之晶圓供給裝置，其進而具備於檢測出上述門體打開時輸出門打開檢測信號之門檢測機構， 上述移動機構包含產生用以使上述晶圓收容體移動之驅動力之驅動馬達， 上述移動控制部於上述門檢測機構輸出上述門打開檢測信號時，停止上述驅動馬達之驅動。 The wafer feeding apparatus according to claim 7, further comprising a door detection mechanism that outputs a door open detection signal when the door is detected to be open, The moving mechanism includes a drive motor that generates a drive force for moving the wafer container, The movement control unit stops the driving of the drive motor when the door detection mechanism outputs the door opening detection signal. 一種零件移載裝置，其具備：如請求項1至10中任一項之晶圓供給裝置，其將被分割成複數個零件之晶圓供給至特定之零件取出作業位置；及 零件移載單元，其從供給至上述零件取出作業位置之上述晶圓取出上述零件並移載至特定之零件移載部。 A parts transfer device comprising: the wafer supply device according to any one of claims 1 to 10, which supplies wafers divided into a plurality of parts to a specific part extraction operation position; and A component transfer unit which picks up the component from the wafer supplied to the component pick-up operation position, and transfers the component to a specific component pick-up unit.
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