TWI772916B - 撓性影像顯示裝置及用於其之光學積層體 - Google Patents
撓性影像顯示裝置及用於其之光學積層體 Download PDFInfo
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Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW201816050A (zh) * | 2016-08-15 | 2018-05-01 | 日商日東電工股份有限公司 | 可撓性圖像顯示裝置用黏著劑組合物、可撓性圖像顯示裝置用黏著劑層、可撓性圖像顯示裝置用積層體及可撓性圖像顯示裝置 |
JP2018529987A (ja) * | 2015-06-24 | 2018-10-11 | サムスン エレクトロニクス カンパニー リミテッド | 表示装置用ハードコートフィルムおよびこれを含む表示装置 |
JP2018200463A (ja) * | 2017-05-09 | 2018-12-20 | 日東電工株式会社 | 光学部材用組成物、光学部材及び画像表示装置 |
JP2019095506A (ja) * | 2017-11-20 | 2019-06-20 | 株式会社ジャパンディスプレイ | 表示装置及びその製造方法 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100844164B1 (ko) * | 2006-12-05 | 2008-07-04 | (주)매트릭스 | 칼라 필터층이 형성된 키패드용 이엘 시트 및 그 제조 방법 |
JP6018397B2 (ja) | 2012-04-09 | 2016-11-02 | 共同技研化学株式会社 | 情報表示面用の両面粘着シート,情報表示面の保護シート,及び前記両面粘着シート及び保護シートの製造方法 |
JP2013218188A (ja) * | 2012-04-11 | 2013-10-24 | Nec Casio Mobile Communications Ltd | 表示パネル保護フィルム |
KR101874616B1 (ko) * | 2015-07-22 | 2018-07-05 | 스미또모 가가꾸 가부시키가이샤 | 수지 필름, 적층체, 광학 부재, 가스 배리어재 및 터치 센서 기재 |
JP2017165941A (ja) * | 2015-12-25 | 2017-09-21 | 日東電工株式会社 | 有機el表示装置用粘着剤組成物、有機el表示装置用粘着剤層、有機el表示装置用粘着剤層付き偏光フィルム、及び有機el表示装置 |
KR102494986B1 (ko) | 2016-01-11 | 2023-02-03 | 삼성디스플레이 주식회사 | 폴더블 표시장치 |
KR101933765B1 (ko) * | 2016-08-23 | 2018-12-28 | 동우 화인켐 주식회사 | 편광판 및 이를 포함하는 화상표시장치 |
KR102318145B1 (ko) * | 2017-09-15 | 2021-10-26 | 동우 화인켐 주식회사 | 플렉시블 디스플레이 장치 |
KR102370422B1 (ko) * | 2018-03-05 | 2022-03-07 | 삼성디스플레이 주식회사 | 전자 장치 |
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Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2018529987A (ja) * | 2015-06-24 | 2018-10-11 | サムスン エレクトロニクス カンパニー リミテッド | 表示装置用ハードコートフィルムおよびこれを含む表示装置 |
TW201816050A (zh) * | 2016-08-15 | 2018-05-01 | 日商日東電工股份有限公司 | 可撓性圖像顯示裝置用黏著劑組合物、可撓性圖像顯示裝置用黏著劑層、可撓性圖像顯示裝置用積層體及可撓性圖像顯示裝置 |
JP2018200463A (ja) * | 2017-05-09 | 2018-12-20 | 日東電工株式会社 | 光学部材用組成物、光学部材及び画像表示装置 |
JP2019095506A (ja) * | 2017-11-20 | 2019-06-20 | 株式会社ジャパンディスプレイ | 表示装置及びその製造方法 |
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WO2021070756A1 (ja) | 2021-04-15 |
JP2021060576A (ja) | 2021-04-15 |
KR20220044853A (ko) | 2022-04-11 |
CN114514570A (zh) | 2022-05-17 |
KR102458092B1 (ko) | 2022-10-25 |
TW202114860A (zh) | 2021-04-16 |
CN114514570B (zh) | 2023-04-04 |
JP6934996B2 (ja) | 2021-09-15 |
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