TWI768780B - Mold used for induction heating and compound formula material - Google Patents

Abstract

A mold used for induction heating, a hot embossing method, and a compound formula material are provided. At least a surface of the mold forms a microstructure, and the mold is formed by a compound formula material. The compound formula material includes: a soft matrix material and a magnetic particle material mixed in the soft matrix material. The magnetic particle material is configured to assist in raising a shore hardness of the mold after baking, and the magnetic particle material is configured as an internal heat source of the mold to receive an induction heating frequency during a hot embossing process, thereby assisting in raising a mold temperature of the mold.

Description

Mold and compound formulation materials for induction heating

The present invention relates to a mold, in particular to a mold that can be used for induction heating, a hot embossing method using the mold, and a composite formulation material for forming the mold.

Compared with general hard molds, soft molds, such as PDMS molds and PFPE molds, have the ability to deform, and the molds are flexible after curing. Furthermore, the soft mold has the advantages of excellent reproducibility, easy demoulding, short casting time, and cost reduction...etc. Therefore, the application of soft molds has been paid more and more attention.

High-frequency induction heating technology has the advantage of fast heating, which solves the problem of slow heating rate in traditional processes. However, if the existing soft mold is to be used as a mold for high-frequency induction heating, it mainly faces three challenges: 1. The rigidity and hardness of the soft mold are low; 2. The thermal resistance of the soft mold is high and the heat conduction efficiency is poor; and 3. The soft mold Direct induction heating is not possible.

The inventors of the present invention feel that the above deficiencies can be improved, so they have devoted themselves to research and application of theories, and finally come up with an invention with a reasonable design and effectively improving the above deficiencies.

The technical problem to be solved by the present invention is to provide a mold that can be used for induction heating, a hot embossing method and a composite formula material in view of the deficiencies of the prior art.

In order to solve the above technical problems, one of the technical solutions adopted by the present invention is to provide a mold that can be used for induction heating, which has two surfaces located on opposite sides, and at least one of the surfaces is formed with a microstructure, which is It is characterized in that, the mold is formed by a composite formula material, and the composite formula material includes: a soft matrix material; and a magnetic particle material, which is mixed in the soft matrix material; wherein, the magnetic The particle material is configured to assist in increasing a Shore hardness of the mold, and the magnetic particle material is configured to act as an internal heat source for the mold to receive an induction heating frequency during a hot embossing process, thereby A mold temperature of the mold is additionally raised.

In order to solve the above technical problems, another technical solution adopted by the present invention is to provide a hot embossing method, which includes: placing a mold on a stage; wherein, at least one of the surfaces of the mold is formed There is a microstructure, and the mold is formed by a composite formula material, which includes a soft matrix material and a magnetic particle material; an imprinting plate is placed on the mold, and the imprinting plate is attached suitable for the microstructure of the mold; applying an induction heating frequency to the mold, so that the magnetic particle material receives the induction heating frequency, thereby assisting in increasing a mold temperature of the mold, and making the The embossing sheet can be softened by the mold temperature; and a longitudinal pressure is applied to the embossing sheet with a pressure unit, so that the embossing sheet is partially trapped in the microstructure of the mold, and the The surface of the embossing sheet is formed with a transfer structure that is geometrically complementary to the microstructure of the mold.

In order to solve the above-mentioned technical problem, another technical solution adopted by the present invention is to provide a composite formula material, which is suitable for making a mold, and the composite formula material includes: a soft matrix material and a mixture mixed in the soft matrix A magnetic particle material in the material, the magnetic particle material is configured so that the composite formula material has a Shore hardness of not less than 80HD after baking for 1 hour and then baking for 48 hours, and the magnetic particle material configured After receiving an induction heating frequency, a skin effect can be generated.

One of the beneficial effects of the present invention is that the mold, hot embossing method and composite formulation material provided by the present invention can be used for induction heating, which can be achieved by "mixing magnetic particle materials with specific specifications in the soft matrix material forming the mold. ”, so that the mold can have higher hardness and higher heat conduction efficiency, and the mold can generate an internal heat source by means of direct induction heating, so that it is suitable for high-frequency induction heating.

For a further understanding of the features and technical content of the present invention, please refer to the following detailed descriptions and drawings of the present invention. However, the drawings provided are only for reference and description, and are not intended to limit the present invention.

M: mold

101, 102: Surface

M1: Microstructure

C: Composite formula material

C1: Soft matrix material

C2: Magnetic particle material

C21: The first magnetic particle

C22: Second Magnetic Particle

P1: stage

P2: embossed sheet

P3: Pressure unit

P4: Cushioning cushion

FIG. 1 is a schematic diagram of a mold that can be used for induction heating according to an embodiment of the present invention.

FIG. 2 is a partial enlarged schematic view of area II of FIG. 1 .

FIG. 3 is a schematic diagram of a hot embossing method according to an embodiment of the present invention.

FIG. 4 is a schematic diagram (1) of a variation of the hot embossing method of FIG. 3 .

FIG. 5 is a schematic diagram (2) of a variation of the hot embossing method of FIG. 3 .

FIG. 6 is a schematic view of the mold in the shape of a roller.

FIG. 7 is a flowchart of a method for manufacturing a mold.

The following are specific specific examples to illustrate the embodiments disclosed in the present invention, and those skilled in the art can understand the advantages and effects of the present invention from the contents disclosed in this specification. The present invention can be implemented or applied through other different specific embodiments, and various details in this specification can also be modified and changed based on different viewpoints and applications without departing from the concept of the present invention. Even. In addition, the drawings of the present invention are merely schematic illustrations, and are not drawn according to the actual size, and are stated in advance. The following embodiments will further describe the related technical contents of the present invention in detail, but the disclosed contents are not intended to limit the protection scope of the present invention.

It should be understood that although terms such as "first", "second" and "third" may be used herein to describe various elements or signals, these elements or signals should not be limited by these terms. These terms are primarily used to distinguish one element from another element, or a signal from another signal. In addition, the term "or", as used herein, should include any one or a combination of more of the associated listed items, as the case may be.

[Molds available for induction heating]

Referring to FIG. 1 and FIG. 2 , an embodiment of the present invention provides a mold M, which can be used for induction heating, especially high-frequency induction heating.

The mold M has two surfaces 101 and 102 located on opposite sides, at least one of the surfaces 101 is formed with a microstructure M1, and the microstructure M1 can be used for a hot embossing process for an embossing plate ( For example, PMMA) is imprinted, so that a transfer structure (such as a concave lens structure or a convex lens structure) complementary in shape to the microstructure M1 is formed on the surface of the imprinting plate.

In an embodiment of the present invention, the thickness of the mold M may be, for example, between 0.5 millimeters (mm) and 5 mm. For example, the thickness of the mold M is 1.5 mm. Furthermore, the microstructure M1 may be, for example, at least one of a concave microstructure and a protruding microstructure.

Wherein, a longitudinal height of the microstructure M1 may be, for example, between 5 micrometers to 10 micrometers, and a lateral width of the microstructure M1 may be, for example, between 40 micrometers and 60 micrometers. Not limited to this.

Further, as shown in FIG. 2 , the mold M is formed by a compound formula material C. As shown in FIG. The composite formula material C includes: a soft matrix material C1 (soft matrix material) and a magnetic particle material C2 (magnetic particle material) mixed in the soft matrix material C1.

In terms of material types, the soft matrix material C1 may be, for example, at least one of an organosilicon polymer material, a derivative of an organosilicon polymer material, and a copolymer of an organosilicon polymer material.

It should be noted that the term "derivatives of organosilicon polymer materials" mentioned herein refers to materials of organosilicon polymer materials modified or chemically modified with functional groups. Furthermore, the term "copolymer of organosilicon polymer material" mentioned herein refers to a material formed by the copolymerization reaction of organosilicon polymer material with other kinds of monomers.

In this embodiment, the organosilicon polymer material is polydimethylsiloxane (PDMS), but the present invention is not limited thereto. For example, the soft matrix material C1 can also be, for example, perfluoropolyethers (perfluoropolyethers, PFPE) and other materials suitable for making soft molds.

The magnetic particle material C2 is mixed in the soft matrix material C1, which can assist in improving the physical properties (eg hardness) of the soft matrix material C1. More specifically, the magnetic particle material C2 is configured to assist in increasing the shore-A-hardness of the mold M.

Furthermore, the magnetic particle material C2 is configured as an internal heat source of the mold M, so as to receive an induction heating frequency in a hot embossing process, thereby assisting in increasing the temperature of the mold M. a mold temperature of the mold.

In terms of material types, the magnetic particle material is selected from iron particles, cobalt particles, nickel particles, Fe-Co alloy particles, iron-nickel particles Alloy particles (Fe-Ni alloy particles), nickel-cobalt alloy particles (Ni-Co alloy particles), iron-cobalt-nickel alloy particles (Fe-Co-Ni alloy particles), and their derivatives, composed of material groups at least one of the groups.

Further, the magnetic particle material C2 provided in the embodiment of the present invention has specific specifications, so that the magnetic particle material C2 is mixed in the soft matrix material C1, and the mold M can be provided with higher hardness and higher The heat transfer efficiency is high, and the mold can be heated by direct induction heating.

Please continue to refer to FIG. 2 , the magnetic particle material C2 includes a plurality of first magnetic particles C21 and a plurality of second magnetic particles C22 mixed with each other. Wherein, the first magnetic particles C21 have a first average particle size. The first magnetic particles C21 are configured in a hot embossing process to receive an induction heating frequency. The induction heating frequency corresponds to a skin depth (δ), and the first average particle size of the first magnetic particles C21 is greater than the skin depth.

In various embodiments of the present invention, the first average particle diameter of the first magnetic particles C21 is at least 2 times or more, preferably 4 times or more, and particularly preferably 8 times or more of the skin depth, but The present invention is not limited to this.

In various embodiments of the present invention, the induction heating frequency may be, for example, between 1 kilohertz (kHz) and 2,000 kilohertz, and the skin depth corresponding to the induction heating frequency may be, for example, between between 5 microns and 80 microns, and preferably between 10 and 80 microns.

In various embodiments of the present invention, the induction heating frequency may be, for example, between 30 kHz and 80 kHz, and the skin depth may be, for example, between 15 and 80 microns. Furthermore, the first average particle size of the first magnetic particles C21 may be, for example, not less than 10 microns, and preferably not less than 30 microns. Particularly preferably, the first average particle size of the first magnetic particles C21 is more than 4 times the skin depth and not less than 120 microns. For example, the first average particle size of the first magnetic particles C21 may be, for example, between 200 μm and 400 μm, but the present invention is not limited thereto.

According to the above configuration, the first magnetic particles C21 can be used as an internal heat source of the mold M, and the mold meets the following conditions: when the first magnetic particles C21 receive the induction heating frequency, the A magnetic particle C21 produces a skin effect (skin effect), and the first magnetic particles C21 can increase a mold temperature of the mold M from a normal temperature ranging from 15°C to 30°C to a high temperature ranging from 100°C to 250°C, which can be completed within 90 seconds, and Preferably, it can be completed within 60 seconds, but the present invention is not limited thereto. That is to say, the first magnetic particles C21 serve as an internal heat source, so that the mold M can be heated from normal temperature to a temperature suitable for hot embossing in a short time.

It is worth mentioning that, in this embodiment, the induction heating frequency received by the first magnetic particles C21 is generated by a high-frequency induction heating apparatus. That is to say, the first magnetic particles C21 are high-frequency-induced heat sources.

In addition, it is worth mentioning that the first average particle size of the first magnetic particles C21 must be defined to be larger than the skin depth, so that the induction heating efficiency with high frequency can be achieved. If the particle diameters of the magnetic particles in the mold M are all smaller than the skin depth, the high-frequency induction heating efficiency will become poor, so that the internal temperature of the mold cannot be effectively increased by induction heating.

The inventors of the present application found through experiments that if only nickel particles with a particle size of 3.5 microns or smaller are added to the PDMS mold (to improve the hardness of the soft mold), the high-frequency induction heating efficiency is not good. An induction heating frequency of 80 kHz corresponds to a skin depth of about 48 microns for nickel at room temperature. Therefore, a second magnetic particle with a larger particle size must be added to the mold, such as iron particles or nickel-cobalt alloy particles ranging from 200 microns to 400 microns. The particle size of the magnetic particles needs to be much larger than the skin depth of iron, cobalt, and nickel corresponding to 80 kHz, so that the induction heating efficiency can be significantly improved.

The inventor of the present application also found through experiments that adding nickel (75%)-cobalt (25%) alloy with a particle size of 200 microns to 400 microns into the PDMS mold, the induction heating rate of the internal heat source is faster, and the temperature can be changed from room temperature within 60 seconds. The temperature was raised to 220°C. Conversely, if only 3.5 micron nickel particles are added to the mold, the mold can only be heated to a maximum of 82°C within 60 seconds under the same heating conditions.

Further, please continue to refer to FIG. 2 , the second magnetic particles C22 of the magnetic particle material C2 have a second average particle size, and the second average particle size of the second magnetic particles C22 The particle size is smaller than the first average particle size. In various embodiments of the present invention, the second average particle size of the second magnetic particles C22 is no greater than 10 microns, and preferably no greater than 5 microns.

The second magnetic particles C22 have a smaller average particle diameter than the first magnetic particles C21. The second magnetic particles C22 are added to the mold M to increase the hardness of the mold M. More specifically, the second magnetic particles C22 are used to assist in improving the shore-A-hardness of the mold M, and the Shore-A-hardness of the mold M is preferably not less than 38HD and not greater than 100HD. Wherein, the Shore hardness is obtained by measuring with a Shore hardness tester.

In terms of content range, based on the composite formula material C being 100% by weight, the content range of the soft matrix material C1 is between 5% by weight and 50% by weight, and the magnetic particles The content of the material C2 (including the first magnetic particles C21 and the second magnetic particles C22 ) ranges from 50 weight percent to 95 weight percent. Wherein, the content range of the first magnetic particles C21 is between 20 weight percent concentration and 70 weight percent concentration, and the content range of the second magnetic particles C22 is between 20 weight percent concentration and 70 weight percent concentration. weight percent concentration. That is, the content range of the magnetic particle material C2 is preferably larger than the content range of the soft matrix material C1, but the present invention is not limited thereto.

In various embodiments of the present invention, the second magnetic particles C22 can be, for example, ultrafine iron powder with a particle size ranging from 2 to 4 microns and iron purity of more than 99%, or a particle size ranging from 3.5 to 4 microns. Ultrafine nickel powder with a nickel purity of 4 microns and a nickel purity of 99.8% or more, or ultrafine nickel powder with a particle size of 0.3 microns and a nickel purity of more than 99%, the above materials can be used to improve the hardness, stiffness, and heat conduction efficiency of soft molds medium.

In general, the embodiments of the present invention provide that the soft mold has an internal heat source and can be directly heated by induction, which breaks through the limitation that the traditional soft mold (eg, PDMS mold) cannot generate heat by itself. Since PDMS is an insulator, high-frequency waves cannot be directly inductively heated. In the embodiment of the present invention, magnetic metal powder is added inside the PDMS, so that the high-frequency waves can directly induce an internal heat source. Heat the PDMS mold body, and reduce the heat loss of external heat source conduction and improve the heating efficiency. The magnetic metal powder also indirectly greatly improves the imprinting resistance of PDMS, which facilitates the subsequent application of large-area mobile roller induction heating imprinting.

It is worth mentioning that in general, PDMS is mixed with AB agent in a 10:1 formula, but because PDMS is a soft mold, the Shore A hardness measurement is only 38HD, which is not suitable for large-area roller hot embossing. In various embodiments of the present invention, it is necessary to increase the formulation ratio of the AB agent to 4-6:1, and then add curing and baking for at least 24 hours after curing to increase the intrinsic hardness of PDMS to 60HD. Magnetic metal materials such as iron, nickel, and cobalt can also be added to PDMS to further improve its hardness and thermal conductivity, so as to facilitate the hot stamping of large-area mobile rollers.

It should be noted that the term "induction heating" mentioned in this article uses electromagnetic induction to heat metals, and a high-frequency electromagnetic field is generated around the coil and inside the conductor during heating. The alternating current creates a time-varying magnetic field through the workpiece, which excites eddy currents inside the conductor due to the skin effect and concentrates on the conductor surface and generates Joule heating.

It should be noted that the term "skin effect" mentioned in this article is a phenomenon in which the current distribution inside a conductor is not uniform. The alternating current in the conductor concentrates the current on the surface and increases the current density, thereby reducing the flow from the surface. to the internal density distribution. The skin depth δ (m) is the distance from the surface to the inner region, where the eddy current density decreases exponentially from 100% to 36.8% of the depth, called the skin depth.

The skin effect prevents eddy currents from passing through the center of a solid conductor, so that it is limited to conduct near the conductor surface. This will effectively limit the flow of electrons through the conductor cross-sectional area, thereby increasing the resistance of the conductor to a resistance greater than that of direct current, promoting the Joule effect (I 2R ⁾ .

[Preparation method of mold]

Referring to FIG. 7 , the mold M in the embodiment of the present invention may, for example, use the following method: prepared by the formula, but the present invention is not limited to this.

Among them, the AB agent of PDMS is PDMS of Sylgard 184 type of Dow Corning Company. Because of its low viscosity coefficient, it is easy to flow and suitable for precision microstructure casting.

The turning step of the mold M includes steps S1 to S7 in sequence. Step S1 is to mix the AB agent of PDMS and the magnetic particle material to form a composite formulation material C. Step S2 is to stir the composite formula material C. Step S3 is to degas the composite formula material C. Step S4 is to cast the composite formula material C. Step S5 is curing and baking the composite formulation material C at 85° C. for 1 hour. Step S6 is to demold the composite formulation material C to form a PDMS mold M. Finally, step S7 is to further harden and bake the mold M at 85° C. for 24 to 72 hours, thereby increasing the hardness of the mold.

[Hot embossing method of mold]

Referring to FIG. 3 , an embodiment of the present invention further provides a thermal embossing method, which includes steps S110 to S140 . The hot embossing method is to perform hot embossing on the embossing plate by using the mold provided in the above embodiment.

The step S110 includes: placing a mold M on a stage P1. Wherein, a microstructure M1 is formed on at least one surface of the mold M. Furthermore, the mold M is formed by the composite formulation material C as in the above-mentioned embodiment, and the composite formulation material C includes a soft matrix material C1 and a magnetic particle material C2 mixed with each other.

The step S120 includes: placing an embossing plate P2 on the mold M, and making the embossing plate P2 adhere to the microstructure M1 on the surface of the mold M. Wherein, the embossing sheet P2 may be, for example, a polymethyl methacrylate sheet (ie, a PMMA sheet), but the present invention is not limited thereto.

The step S130 includes: applying an induction heating frequency to the mold M, so that the magnetic particle material C2 receives the induction heating frequency. The heat frequency further assists in increasing a mold temperature of the mold M, and causes the imprinting plate P2 to be heated and softened by the mold temperature.

The step S140 includes: using a pressure unit P3 to apply a longitudinal pressure to the embossing plate P2, so that the embossing plate P2 partially sinks into the microstructure of the mold M (not shown), and A transfer structure (not shown) that is geometrically complementary to the microstructure M1 is formed on the surface of the imprinting plate P2.

In an embodiment of the present invention, the induction heating frequency received by the magnetic particle material C2 is generated by a high-frequency induction heating apparatus.

In an embodiment of the present invention, the pressure unit P3 is an embossing roller, and the transfer structure formed on the surface of the embossing plate P2 is a concave transfer structure (eg, a concave lens structure) and a convex structure. at least one of the transferred transfer structures (eg, convex lens structures).

In an embodiment of the present invention, the hot embossing method further includes: placing a cushion pad P4 between the pressure unit P3 and the embossing plate P2, so as to be applied to the embossing plate P2 dispersedly longitudinal pressure. Wherein, the Shore-A-hardness of the cushioning pad P4 is smaller than the Shore-A-hardness of the mold M, and the Shore-A-hardness of the cushioning cushion P4 is not greater than 10HD, preferably not greater than 6HD , and particularly preferably not greater than 4HD. For example, the cushion pad P4 may be a high temperature resistant foamed silicone pad.

In an embodiment of the present invention, as shown in FIG. 4 , the microstructures M1 are formed on both surfaces of the mold M, so that the hot embossing method can be applied to both surfaces of the mold M The embossing plates P2 are arranged on the two surfaces, and the embossing plates P2 located on the two surfaces are respectively partially plunged into all the surfaces on the two surfaces of the mold M after the longitudinal pressure is applied. in the microstructure described above, thereby completing the transfer operation. It is worth mentioning that, the microstructures on the two surfaces of the mold M can be respectively designed as the same or different microstructures, for example: a microstructure with concave design on one surface, The other surface is designed with protruding microstructures, which is not limited in the present invention.

In an embodiment of the present invention, as shown in FIG. 5 , the number of the molds M may be, for example, more than two, and the imprinting plate P2 is provided on both surfaces of each of the molds M, It realizes quadruple stack imprinting or multiple stack imprinting, thereby improving the efficiency of production.

In an embodiment of the present invention, as shown in FIG. 6 , the magnetic particle material C2 can also be added to PDMS inside an imprinting roller P3, and a microstructure M1 is formed on the surface of the imprinting roller P3.

It is worth mentioning that the soft mold M provided by the embodiment of the present invention has better deformability than the existing hard molds (eg, nickel molds). When the embossing roller P3 exerts a longitudinal pressure on the soft mold M, the soft mold M can be slightly deformed, so that the gas in the recesses of the microstructure M1 can be discharged. Furthermore, the cushion pad P4 is a high-temperature-resistant foamed silicone pad, which can be easily pressed into the depression, thereby facilitating the discharge of gas.

In an embodiment of the present invention, the composite formulation material further comprises: a metal particle material or a non-metallic particle material mixed in the soft matrix material, and the Shore hardness of the composite formulation material, It can be adjusted by adjusting the baking time and adjusting the concentration range of all particle materials.

In an embodiment of the present invention, the layered distribution and local concentration change of the magnetic particle material in the composite formulation material can be regulated to form an induction heating target area, thereby regulating the local rotation of the mold. The difference between the high and low printing effect.

In an embodiment of the present invention, the composite formulation material further includes: a metal particle material mixed in the soft matrix material, and the electrical conductivity and temperature distribution uniformity of the composite formulation material can pass the Metal particle material is regulated.

[Advantageous effects of the embodiment]

One of the beneficial effects of the present invention is that the embodiments of the present invention can be used for Induction heating mold, hot embossing method and composite formulation material, which can enable the mold to have higher hardness and higher The heat conduction efficiency is high, and the mold can generate an internal heat source by means of direct induction heating, so it is suitable for high-frequency induction heating.

The contents disclosed above are only preferred feasible embodiments of the present invention, and are not intended to limit the scope of the present invention. Therefore, any equivalent technical changes made by using the contents of the description and drawings of the present invention are included in the application of the present invention. within the scope of the patent.

M: mold

M1: Microstructure

P1: stage

P2: embossed sheet

P3: Pressure unit

P4: Cushioning cushion

Claims (10)

A mold that can be used for induction heating, it has two surfaces on opposite sides, and at least one of the surfaces is formed with a microstructure, characterized in that the mold is formed by a composite formula material, the composite formula The material includes: a soft matrix material; and a magnetic particle material mixed into the soft matrix material; wherein the magnetic particle material is configured to assist in increasing a Shore hardness of the mold, and the magnetic The particle material is configured as an internal heat source of the mold, so as to receive an induction heating frequency in a hot embossing process, so as to assist in raising a mold temperature of the mold; wherein the magnetic particle material includes a : a plurality of first magnetic particles, and the first magnetic particles have a first average particle size; wherein, the first magnetic particles are configured in the hot embossing process and receive the induction heating frequency, so The induction heating frequency corresponds to a skin depth, and the first average particle size of the first magnetic particles is greater than the skin depth. The mold for induction heating according to claim 1, wherein the soft matrix material is at least one of an organosilicon polymer material, a derivative thereof, and a copolymer thereof. The mold for induction heating according to claim 1, wherein the magnetic particle material is selected from iron particles, cobalt particles, nickel particles, iron-cobalt alloy particles, iron-nickel alloy particles, and nickel-cobalt alloy particles , iron-cobalt-nickel alloy particles, and derivatives thereof, at least one of the material group consisting of. The mold that can be used for induction heating according to claim 1, wherein the first magnetic particles are the internal heat source of the mold; and the mold meets the following conditions: when the first magnetic particles receive the When the induction heating frequency is mentioned, The first magnetic particles generate a skin effect, and the mold temperature of the mold is increased from a normal temperature ranging from 15°C to 30°C to a high temperature ranging from 100°C to 250°C within 90 seconds. Finish. The mold for induction heating according to claim 1, wherein the magnetic particle material further comprises: a plurality of second magnetic particles, the second magnetic particles have a second average particle size, and the first The second average particle size of the second magnetic particles is smaller than the first average particle size and not larger than 10 microns. The mold for induction heating according to claim 5, wherein the second magnetic particles assist in increasing the Shore hardness of the mold, and the Shore hardness of the mold is not less than 38HD, and Not more than 100HD. The mold that can be used for induction heating according to claim 5, wherein, based on 100 weight percent concentration of the composite formulation material, a content range of the soft matrix material is between 5 weight percent concentration and 50 weight percent concentration concentration, and a content range of the magnetic particle material is between 50 weight percent concentration and 95 weight percent concentration. A composite formula material, which is suitable for making a mold, and the composite formula material includes: a soft matrix material and a magnetic particle material mixed in the soft matrix material, the magnetic particle material is configured so that the composite The formula material has a Shore hardness of not less than 38HD, and the magnetic particle material is configured to generate a skin effect after receiving an induction heating frequency; wherein, the composite formula material further comprises a mixture mixed in the soft matrix material A metal particle material in the composite formulation material, and the electrical conductivity and temperature distribution uniformity of the composite formulation material can be regulated by the metal particle material. The composite formula material according to claim 8, further comprising: a metal particle material or a non-metal particle material mixed in the soft matrix material, and the Shore hardness of the composite formula material can pass through Adjust the baking time and adjust the concentration range of all particle materials. The composite formula material according to claim 8, wherein the layered distribution and local concentration changes of the magnetic particle material in the composite formula material can be regulated to form an induction heating target area, thereby regulating the The difference in the local transfer effect of the mold.

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