TW202237366A - Mold used for induction heating and compound formula material - Google Patents

Abstract

A mold used for induction heating, a hot embossing method, and a compound formula material are provided. At least a surface of the mold forms a microstructure, and the mold is formed by a compound formula material. The compound formula material includes: a soft matrix material and a magnetic particle material mixed in the soft matrix material. The magnetic particle material is configured to assist in raising a shore hardness of the mold after baking, and the magnetic particle material is configured as an internal heat source of the mold to receive an induction heating frequency during a hot embossing process, thereby assisting in raising a mold temperature of the mold.

Description

Molds, hot embossing methods and composite formulations that can be used for induction heating

The invention relates to a mould, in particular to a mould, which can be used for induction heating, a hot embossing method utilizing the mould, and a composite formula material forming the mould.

Compared with general hard molds, soft molds, such as PDMS molds and PFPE molds, have the ability to deform, and the molds are flexible after curing. Furthermore, flexible molds have the advantages of excellent reproducibility, easy demoulding, short casting time, and can effectively reduce costs...etc. Therefore, the application of flexible molds has attracted more and more attention.

High-frequency induction heating technology has the advantage of fast heating, which solves the problem of slow heating rate in traditional manufacturing processes. However, if the existing flexible mold is to be used as a mold for high-frequency induction heating, it mainly faces three challenges: 1. The rigidity and hardness of the flexible mold are low; 2. The thermal resistance of the flexible mold is high and the heat conduction efficiency is poor; and 3. The flexible mold Cannot be heated directly by induction.

The inventor of the present invention feels that the above defects can be improved, so he devoted himself to research and combined with the application of theories, and finally proposed an invention with reasonable design and effective improvement of the above defects.

The technical problem to be solved by the present invention is to provide a mold that can be used for induction heating, a hot embossing method and a composite formula material in view of the deficiencies in the prior art.

In order to solve the above technical problems, one of the technical solutions adopted by the present invention is to provide a mold that can be used for induction heating, which has two surfaces on opposite sides, and at least one of the surfaces is formed with a microstructure, which It is characterized in that the mold is formed by a composite formula material, and the composite formula material includes: a soft matrix material; and a magnetic particle material, which is mixed in the soft matrix material; wherein, the magnetic The particulate material is configured to assist in increasing a Shore hardness of the mold, and the magnetic particulate material is configured to act as an internal heat source for the mold to receive an induction heating frequency during a hot embossing process, thereby A mold temperature of the mold is auxiliary raised.

In order to solve the above technical problems, another technical solution adopted by the present invention is to provide a hot embossing method, which includes: placing a mold on a stage; wherein at least one of the surfaces of the mold is formed There is a microstructure, and the mold is formed by a composite formula material, which includes a soft matrix material and a magnetic particle material; placing an embossing plate on the mold, and making the embossing plate stick Adapt to the microstructure of the mold; apply an induction heating frequency to the mold, so that the magnetic particle material receives the induction heating frequency, thereby assisting in raising a mold temperature of the mold, and making the the embossed sheet can be softened by the mold temperature; and applying a longitudinal pressure to the embossed sheet with a pressure unit so that the embossed sheet partially sinks into the microstructure of the mold and causes the The surface of the embossed sheet is formed with a transfer structure geometrically complementary to the microstructure of the mold.

In order to solve the above-mentioned technical problems, another technical solution adopted by the present invention is to provide a composite formula material, which is suitable for making a mould, and the composite formula material includes: a soft matrix material and mixed in the soft matrix A magnetic particle material in the material, the magnetic particle material is configured so that the composite formula material has a Shore hardness not less than 80 HD after baking for 1 hour and then baking for 48 hours, and the magnetic particle The material is configured to generate a skin effect after receiving an induction heating frequency.

One of the beneficial effects of the present invention is that the mold, hot embossing method, and composite formula material that can be used for induction heating provided by the present invention can be obtained by "mixing magnetic particle materials with specific specifications in the soft matrix material forming the mould." ", so that the mold can have higher hardness and higher heat conduction efficiency, and the mold can generate an internal heat source through direct induction heating, which is suitable for high-frequency induction heating.

In order to further understand the features and technical content of the present invention, please refer to the following detailed description and drawings related to the present invention. However, the provided drawings are only for reference and description, and are not intended to limit the present invention.

The following is an illustration of the disclosed embodiments of the present invention through specific specific examples, and those skilled in the art can understand the advantages and effects of the present invention from the content disclosed in this specification. The present invention can be implemented or applied through other different specific embodiments, and various modifications and changes can be made to the details in this specification based on different viewpoints and applications without departing from the concept of the present invention. In addition, the drawings of the present invention are only for simple illustration, and are not drawn according to the actual size, which is stated in advance. The following embodiments will further describe the relevant technical content of the present invention in detail, but the disclosed content is not intended to limit the protection scope of the present invention.

It should be understood that although terms such as "first", "second", and "third" may be used herein to describe various elements or signals, these elements or signals should not be limited by these terms. These terms are mainly used to distinguish one element from another element, or one signal from another signal. In addition, the term "or" used herein may include any one or a combination of more of the associated listed items depending on the actual situation.

[Molds that can be used for induction heating]

Please refer to FIG. 1 and FIG. 2 , the embodiment of the present invention provides a mold M, which can be used for induction heating, especially for high-frequency induction heating (high-frequency induction heating).

The mold M has two surfaces 101 and 102 on opposite sides, at least one of the surfaces 101 is formed with a microstructure M1, and the microstructure M1 can be used for an embossed plate ( Such as: PMMA) is embossed, so that a transfer structure (such as: a concave lens structure or a convex lens structure) complementary in shape to the microstructure M1 is formed on the surface of the embossed sheet.

In an embodiment of the present invention, the thickness of the mold M may be, for example, between 0.5 millimeters (mm) to 5 millimeters, for example, the thickness of the mold M is 1.5 millimeters. Furthermore, the microstructure M1 may be, for example, at least one of a concave microstructure and a protruding microstructure.

Wherein, a longitudinal height of the microstructure M1 may be, for example, between 5 microns and 10 microns, and a lateral width of the microstructure M1 may, for example, be between 40 microns and 60 microns, but the present invention Not limited to this.

Furthermore, as shown in FIG. 2 , the mold M is formed by a composite material C. The composite formulation material C includes: a soft matrix material C1 (soft matrix material) and a magnetic particle material C2 (magnetic particle material) mixed in the soft matrix material C1.

In terms of material types, the soft matrix material C1 may be, for example, at least one of organosilicon polymer materials, derivatives of organosilicon polymer materials, and copolymers of organosilicon polymer materials.

It should be noted that the term "derivatives of organosilicon polymer materials" mentioned herein refers to materials in which organosilicon polymer materials have been modified with functional groups or chemically modified. Furthermore, the term "copolymer of organosilicon polymer material" mentioned in this article refers to the material formed by the copolymerization reaction of organosilicon polymer material and other types of monomers.

In this embodiment, the organosilicon polymer material is polydimethylsiloxane (PDMS), but the invention is not limited thereto. For example, the soft matrix material C1 may also be, for example, perfluoropolyethers (perfluoropolyethers, PFPE) and other materials suitable for making soft molds.

The magnetic particle material C2 is mixed in the soft matrix material C1, which can assist in improving the physical properties (such as hardness) of the soft matrix material C1. More specifically, the magnetic particle material C2 is configured to assist in increasing the shore-A-hardness of the mold M.

Moreover, the magnetic particle material C2 is configured as an internal heat source of the mold M to receive an induction heating frequency during a hot embossing process, thereby assisting in enhancing the A mold temperature of the mould.

In terms of material types, the magnetic particle material is selected from iron particles, cobalt particles, nickel particles, iron-cobalt alloy particles (Fe-Co alloy particles), iron-nickel particles Material group consisting of Fe-Ni alloy particles, Ni-Co alloy particles, Fe-Co-Ni alloy particles, and their derivatives At least one of the groups.

Furthermore, the magnetic particle material C2 provided by the embodiment of the present invention has specific specifications, so that the magnetic particle material C2 is mixed in the soft matrix material C1, which can provide the mold M with higher hardness and higher The heat conduction efficiency is high, and the mold can be heated by direct induction heating.

Please continue to refer to FIG. 2 , the magnetic particle material C2 includes a plurality of first magnetic particles C21 and a plurality of second magnetic particles C22 mixed with each other. Wherein, the first magnetic particles C21 have a first average particle size. The first magnetic particles C21 are configured in a thermal embossing process to receive an induction heating frequency. Wherein, the induction heating frequency corresponds to a skin depth (skin depth, δ), and the first average particle diameter of the first magnetic particles C21 is larger than the skin depth.

In many embodiments of the present invention, the first average particle size of the first magnetic particles C21 is at least 2 times or more, preferably 4 times or more, and particularly preferably 8 times or more, the skin depth, but The present invention is not limited thereto.

In various embodiments of the present invention, the induction heating frequency may be, for example, between 1 kilohertz (kHz) and 2,000 kHz, and the skin depth corresponding to the induction heating frequency may be, for example, between between 5 microns and 80 microns, and preferably between 10 microns and 80 microns.

In various embodiments of the present invention, the induction heating frequency may be, for example, between 30 kHz and 80 kHz, and the skin depth may be, for example, between 15 microns and 80 microns. Furthermore, the first average particle diameter of the first magnetic particles C21 may be, for example, not less than 10 microns, and preferably not less than 30 microns. Particularly preferably, the first average particle diameter of the first magnetic particles C21 is more than 4 times the skin depth and not less than 120 microns. For example, the first average particle size of the first magnetic particles C21 may be, for example, between 200 microns and 400 microns, but the present invention is not limited thereto.

According to the above configuration, the first magnetic particle C21 can be used as an internal heat source of the mold M, and the mold meets the following condition: when the first magnetic particle C21 receives induction heating frequency, the first magnetic particle C21 A magnetic particle C21 produces a skin effect (skin effect), and the first magnetic particle C21 can make a mold temperature of the mold M rise from a normal temperature between 15 ^° C to 30 ^° C to between 100 ^° C to A high temperature of 250 ^o C can be completed within 90 seconds, and preferably within 60 seconds, but the present invention is not limited thereto. That is to say, the first magnetic particles C21 are used as an internal heat source, which can make the temperature of the mold M rise from normal temperature to a temperature suitable for hot embossing in a short time.

It is worth mentioning that, in this embodiment, the induction heating frequency received by the first magnetic particles C21 is generated by a high-frequency induction heating apparatus. That is to say, the first magnetic particle C21 is a high-frequency induction heat source.

In addition, it is worth mentioning that the first average particle size of the first magnetic particles C21 must be limited to be larger than the skin depth, so as to achieve high-frequency induction heating efficiency. If the particle diameters of the magnetic particles in the mold M are all smaller than the skin depth, the high-frequency induction heating efficiency will become poor, so that the internal temperature of the mold cannot be effectively raised by induction heating.

The inventors of the present application have found through experiments that if only nickel particles with a particle size of 3.5 microns or smaller are added to the PDMS mold (to increase the hardness of the soft mold), the efficiency of high-frequency induction heating is not good. The induction heating frequency of 80 kHz is about 48 microns to the skin depth of nickel at room temperature. Therefore, it is necessary to add a second type of magnetic particles with a larger particle size into the mold, for example, iron particles or nickel-cobalt alloy particles with a size of 200 microns to 400 microns. The particle size of the magnetic particles needs to be much larger than the skin depth corresponding to 80 kHz of iron, cobalt, and nickel, so that the induction heating efficiency can be significantly improved.

The inventors of the present application have also found through experiments that adding a nickel (75%)-cobalt (25%) alloy with a particle size of 200 microns to 400 microns in the PDMS mold has a faster induction heating rate of the internal heat source, and can be heated from normal temperature within 60 seconds. The temperature was raised to 220°C. Conversely, if only nickel particles of 3.5 microns are added to the mold, the mold can only be heated up to 82° C. within 60 seconds under the same heating conditions.

Further, please continue to refer to FIG. 2, the second magnetic particle C22 of the magnetic particle material C2 has a second average particle size, and the second average particle size of the second magnetic particle C22 is smaller than the first an average particle size. In various embodiments of the present invention, the second average particle size of the second magnetic particles C22 is not greater than 10 microns, and preferably not greater than 5 microns.

The second magnetic particles C22 have a smaller average particle diameter than the first magnetic particles C21. The second magnetic particles C22 are added to the mold M to increase the hardness of the mold M. More specifically, the second magnetic particles C22 are used to assist in increasing the Shore hardness (shore-A-hardness) of the mold M, and make the Shore hardness of the mold M preferably not less than 38 HD and not Greater than 100 HD. Wherein, the Shore hardness is obtained through the measurement of a Shore hardness tester.

In terms of content range, based on 100% by weight of the composite formulation material C, the content range of the soft matrix material C1 is between 5% by weight and 50% by weight, and the magnetic particles The content range of the material C2 (including the first magnetic particle C21 and the second magnetic particle C22 ) is between 50% by weight and 95% by weight. Wherein, the content range of the first magnetic particle C21 is between 20 weight percent concentration and 70 weight percent concentration, and the content range of the second magnetic particle C22 is between 20 weight percent concentration and 70 weight percent concentration. between weight percent concentrations. That is to say, the content range of the magnetic particle material C2 is preferably greater than the content range of the soft matrix material C1, but the present invention is not limited thereto.

In various embodiments of the present invention, the second magnetic particles C22 can be, for example, ultrafine iron powder with a particle size ranging from 2 microns to 4 microns and an iron purity of more than 99%, or a particle size ranging from 3.5 microns to Ultrafine nickel powder with 4 microns and a nickel purity of 99.8% or more, or ultrafine nickel powder with a particle size of 0.3 microns and a nickel purity of 99% or more. The above materials can be used to improve the hardness, rigidity, and heat transfer efficiency of flexible molds medium.

Overall, the embodiments of the present invention provide a flexible mold with an internal heat source that can be directly heated by induction, which breaks through the limitation that traditional flexible molds (such as PDMS molds) cannot generate heat by themselves. Since PDMS is an insulator, high-frequency waves cannot be directly induced to heat. In the embodiment of the present invention, magnetic metal powder is added inside PDMS, so that high-frequency waves can directly induce internal heat sources, heat the PDMS mold body, and reduce heat loss and increase in external heat source conduction. Heating efficiency. The magnetic metal powder also indirectly greatly improves the embossing hardness of PDMS, which is convenient for the subsequent application of large-area mobile roller induction heating embossing.

It is worth mentioning that generally PDMS is mixed with AB agent 10:1, but because PDMS is a soft mold, the Shaw A hardness measurement is only 38HD, which is not suitable for large-area roller heat embossing. In many embodiments of the present invention, it is necessary to increase the formula ratio of AB agent to 4~6:1, and add hardening and baking for at least 24 hours after curing to increase the intrinsic hardness of PDMS to 60HD. It is also possible to add magnetic metal materials such as iron, nickel, and cobalt to PDMS to further increase its hardness and thermal conductivity, so as to facilitate thermal embossing of larger-area mobile rollers.

It should be noted that the term "induction heating" mentioned in this article refers to the use of electromagnetic induction to heat metal, and high-frequency electromagnetic fields will be generated around the coil and inside the conductor during heating. The alternating current produces a time-varying magnetic field passing through the workpiece, which excites eddy currents inside the conductor due to the skin effect, and concentrates on the surface of the conductor to generate Joule heat.

It should be noted that the term "skin effect" mentioned in this article is a phenomenon in which the current distribution inside the conductor is uneven. The alternating current in the conductor concentrates the current on the surface and increases the current density, thereby reducing the current from the surface to the internal density distribution. The skin depth δ (m) is the distance from the surface to the inner region, where the eddy current density decreases exponentially from 100% to 36.8%, which is called the skin depth.

The skin effect prevents eddy currents from passing through the center of a solid conductor, thereby confining it to conduction near the surface of the conductor. This will effectively limit the flow of electrons through the cross-sectional area of the conductor, thereby increasing the resistance of the conductor to a resistance greater than direct current, prompting the Joule effect (I ² R).

[Mold preparation method]

Referring to FIG. 7 , the mold M of the embodiment of the present invention can be prepared, for example, in the following manner, but the present invention is not limited thereto.

Among them, the AB agent of PDMS is the PDMS of Sylgard 184 type from Dow Corning Company. Because of its low viscosity coefficient and easy flow, it is suitable for precise microstructure casting.

The mold turning step of the mold M includes step S1 to step S7 in sequence. Step S1 is to mix the AB agent of PDMS and the magnetic particle material to form a composite formula material C. Step S2 is to stir the composite formula material C. Step S3 is to degas the composite formulation material C. Step S4 is casting the composite formula material C. Step S5 is curing and baking the composite formula material C at 85° C. for 1 hour. Step S6 is to demould the composite formula material C to form a PDMS mold M. Finally, in step S7, the mold M is hardened and baked at 85° C. for 24 to 72 hours, so as to increase the hardness of the mold.

[Hot embossing method for molds]

Please refer to FIG. 3 , an embodiment of the present invention further provides a thermal embossing method, which includes steps S110 to S140 . The hot embossing method is to use the mold provided in the above embodiment to hot emboss the embossed plate.

The step S110 includes: placing a mold M on a stage P1. Wherein, at least one surface of the mold M is formed with a microstructure M1. Furthermore, the mold M is formed by the composite formula material C as in the above embodiment, and the composite formula material C includes a soft matrix material C1 and a magnetic particle material C2 mixed with each other.

The step S120 includes: placing an embossing plate P2 on the mold M, and attaching the embossing plate P2 to the microstructure M1 on the surface of the mold M. Wherein, the embossed sheet P2 may be, for example, a polymethyl methacrylate sheet (that is, a PMMA sheet), but the present invention is not limited thereto.

The step S130 includes: applying an induction heating frequency to the mold M, so that the magnetic particle material C2 receives the induction heating frequency, thereby assisting in raising a mold temperature of the mold M, and The embossed sheet material P2 is heated and softened by the mold temperature.

The step S140 includes: using a pressure unit P3 to apply a longitudinal pressure to the embossed sheet P2, so that the embossed sheet P2 is partially trapped in the microstructure of the mold M (not shown in the figure), and A transfer structure (not shown) that is geometrically complementary to the microstructure M1 is formed on the surface of the embossed plate P2.

In an embodiment of the present invention, the induction heating frequency received by the magnetic particle material C2 is generated by a high-frequency induction heating apparatus.

In an embodiment of the present invention, the pressure unit P3 is an embossing roller, and the transfer structure formed on the surface of the embossed plate P2 is a concave transfer structure (such as a concave lens structure) and a convex At least one of the transfer structures (such as: convex lens structure).

In an embodiment of the present invention, the hot embossing method further includes: placing a cushioning pad P4 between the pressure unit P3 and the embossing plate P2, so as to spread and apply it on the embossing plate P2 the vertical pressure. Wherein, the Shore hardness (shore-A-hardness) of the buffer pad P4 is less than the Shore hardness of the mold M, and the Shore hardness of the buffer pad P4 is not greater than 10 HD, preferably not greater than 6 HD, and particularly preferably no more than 4 HD. For example, the cushioning pad P4 may be, for example, a high temperature resistant foamed silicone pad.

In one embodiment of the present invention, as shown in FIG. 4, the microstructure M1 is formed on both surfaces of the mold M, so that the hot embossing method can be applied on both surfaces of the mold M. The embossed sheet material P2 is arranged on the upper surface, and the embossed sheet material P2 located on the two surfaces is respectively partially sunk into all the two surfaces of the mold M after the longitudinal pressure is applied. In the above microstructure, the transfer printing operation is completed. It is worth mentioning that the microstructures on the two surfaces of the mold M can be respectively designed as the same or different microstructures, for example: a concave microstructure is designed on one surface, and a convex microstructure is designed on the other surface. structure, the present invention is not limited.

In an embodiment of the present invention, as shown in FIG. 5 , the number of molds M may also be more than two, and the embossed sheet P2 is arranged on both surfaces of each mold M, It realizes quadruple stacked embossing or multi-stacked embossing, thereby improving production efficiency.

In an embodiment of the present invention, as shown in FIG. 6 , the magnetic particle material C2 can also be added to PDMS inside an embossing roller P3 , and form a microstructure M1 on the surface of the embossing roller P3 .

It is worth mentioning that the soft mold M provided by the embodiment of the present invention has better deformability than the existing hard mold (such as nickel mold). When the embossing roller P3 exerts longitudinal pressure on the flexible mold M, the flexible mold M can be slightly deformed, so that the gas in the depression of the microstructure M1 can be discharged. Furthermore, the cushioning pad P4 is a heat-resistant foamed silicone pad, which can be easily pressed into the depression, thereby facilitating the discharge of gas.

In an embodiment of the present invention, the composite formula material further includes: a metal particle material or a non-metal particle material mixed in the soft matrix material, and the Shore hardness of the composite formula material, Adjustments can be made by adjusting the baking time and controlling the concentration range of all particle materials.

In an embodiment of the present invention, the layered distribution and local concentration change of the magnetic particle material in the composite formula material can be adjusted to form an induction heating target area, thereby adjusting the local rotation of the mold. The difference in the printing effect.

In an embodiment of the present invention, the composite formula material further includes: a metal particle material mixed in the soft matrix material, and the electrical conductivity and temperature distribution uniformity of the composite formula material can be passed through the The metal particle material is regulated.

[Advantageous Effects of Embodiment]

One of the beneficial effects of the present invention is that the molds, hot embossing methods and composite formula materials that can be used for induction heating provided by the embodiments of the present invention can be obtained by "mixing magnetic materials with specific specifications in the soft matrix material forming the mould." Particle material", so that the mold can have higher hardness and higher heat conduction efficiency, and the mold can generate an internal heat source through direct induction heating, which is suitable for high-frequency induction heating.

The content disclosed above is only a preferred feasible embodiment of the present invention, and does not therefore limit the scope of the patent application of the present invention. Therefore, all equivalent technical changes made by using the description and drawings of the present invention are included in the application of the present invention. within the scope of the patent.

M: Mold 101, 102: surface M1: Microstructure C: Composite formula material C1: soft matrix material C2: Magnetic Particle Materials C21: The first magnetic particle C22: second magnetic particle P1: stage P2: Embossed sheet P3: Pressure unit P4: Buffer cushion

FIG. 1 is a schematic diagram of a mold that can be used for induction heating according to an embodiment of the present invention.

FIG. 2 is a partially enlarged schematic diagram of area II in FIG. 1 .

FIG. 3 is a schematic diagram of a thermal embossing method according to an embodiment of the present invention.

FIG. 4 is a schematic diagram (1) of the variation of the hot embossing method in FIG. 3 .

FIG. 5 is a schematic diagram (2) of the variation of the hot embossing method in FIG. 3 .

Figure 6 is a schematic view of the mold in the shape of a roller.

Fig. 7 is a flow chart of the manufacturing method of the mould.

M: Mold

M1: Microstructure

P1: stage

P2: Embossed sheet

P3: Pressure unit

P4: Buffer cushion

Claims (18)

A mold that can be used for induction heating has two surfaces on opposite sides, and at least one of the surfaces is formed with a microstructure, it is characterized in that the mold is formed by a compound formula material, and the compound formula Materials include: a soft matrix material; and A magnetic particle material, which is mixed in the soft matrix material; wherein, the magnetic particle material is configured to assist in raising a Shore hardness of the mold, and the magnetic particle material is configured as the mold An internal heat source is used to receive an induction heating frequency during a hot embossing process, thereby assisting in increasing a mold temperature of the mold. The mold for induction heating according to claim 1, wherein the soft matrix material is at least one of an organosilicon polymer material, its derivatives, and its copolymers. The mold that can be used for induction heating as described in claim 1, wherein the magnetic particle material is selected from iron particles, cobalt particles, nickel particles, iron-cobalt alloy particles, iron-nickel alloy particles, nickel-cobalt alloy particles , iron-cobalt-nickel alloy particles, and derivatives thereof, at least one of the material group consisting of. The mold that can be used for induction heating according to claim 1, wherein the magnetic particle material includes: a plurality of first magnetic particles, and the first magnetic particles have a first average particle size; wherein, the The first magnetic particle is configured in the thermal embossing process, receives the induction heating frequency, the induction heating frequency corresponds to a skin depth, and the first magnetic particle of the first magnetic particle The average particle size is larger than the skin depth. The mold that can be used for induction heating according to claim 4, wherein the first magnetic particles are the internal heat source of the mold; and the mold meets the following conditions: when the first magnetic particles receive the When the frequency of the induction heating is increased, the first magnetic particles produce a skin effect, and the mold temperature of the mold is increased from a normal temperature between 15 ^° C to 30 ^° C to a temperature between 100 ^° C to 250 ^° C The high temperature of C-1 can be completed within 90 seconds. The mold that can be used for induction heating according to claim 4, wherein the magnetic particle material further includes: a plurality of second magnetic particles, the second magnetic particles have a second average particle size, and the first The second average particle diameter of the two magnetic particles is smaller than the first average particle diameter and not greater than 10 microns. The mold that can be used for induction heating as claimed in claim 6, wherein the second magnetic particles assist in increasing the Shore hardness of the mold, and the Shore hardness of the mold is not less than 38HD, and No more than 100 HD. The mold that can be used for induction heating as described in claim 6, wherein, based on the 100% by weight concentration of the composite formula material, a content range of the soft matrix material is between 5% by weight and 50% by weight Concentrations, and a content range of the magnetic particle material is between 50% by weight and 95% by weight. A method of hot embossing, comprising: A mold is placed on a stage; wherein at least one surface of the mold is formed with a microstructure, and the mold is formed by a composite formula material, which includes a soft matrix material and a magnetic particle material ; placing an embossed sheet on the mold, and attaching the embossed sheet to the microstructure of the mold; applying an induction heating frequency to the mold, such that the magnetic particle material receives the induction heating frequency, thereby assisting in raising a mold temperature of the mold, and causing the embossed sheet to be softened by the mold temperature; and A pressure unit is used to apply a longitudinal pressure to the embossed plate, so that the embossed plate is partially trapped in the microstructure of the mold, and a transfer structure is formed on the surface of the embossed plate. The thermal embossing method as claimed in claim 9, wherein the induction heating frequency received by the magnetic particle material is generated by a high-frequency induction heating apparatus. The thermal embossing method according to claim 9, wherein the pressure unit is an embossing roller, and the transfer structure formed on the surface of the embossed sheet is a concave transfer structure and a protruding one. At least one of the transfer structures. The hot embossing method according to claim 9, wherein when the pressure unit applies the longitudinal pressure to the embossed sheet, the pressure unit can slightly deform the mold so that the The gas in the depressions of the microstructure of the mold is exhausted. The thermal embossing method according to claim 9, further comprising: placing a cushion cushion between the pressure unit and the embossing plate to distribute the longitudinal pressure applied to the embossing plate ; Wherein, a Shore hardness of the cushion cushion is less than a Shore hardness of the mold, and the Shore hardness of the cushion cushion is not greater than 10 HD. The thermal embossing method according to claim 9, wherein the microstructures are formed on both the surfaces of the mold, so that the thermal embossing method can be applied on both the surfaces of the mold The embossed sheets are arranged on the upper surface, and the embossed sheets located on both the surfaces are respectively partially sunk into the said embossed sheets on the two surfaces of the mould, after the longitudinal pressure is applied. microstructure. A composite formulation material, which is suitable for making a mold, and the composite formulation material includes: a soft matrix material and a magnetic particle material mixed in the soft matrix material, the magnetic particle material is configured so that the composite The formulation material has a Shore hardness not less than 38HD, and the magnetic particle material is configured to generate a skin effect after receiving an induction heating frequency. The composite formula material as claimed in claim 15, which further includes: a metal particle material or a non-metal particle material mixed in the soft matrix material, and the Shore hardness of the composite formula material can be passed Adjustments are made by adjusting the baking time and adjusting the concentration range of all particle materials. The composite formula material according to claim 15, wherein, the layered distribution and local concentration change of the magnetic particle material in the composite formula material can be adjusted to form an induction heating target area, and then regulate the The difference in the local transfer effect of the mold. The composite formula material as claimed in claim 15, which further includes: a metal particle material mixed in the soft matrix material, and the conductivity and temperature distribution uniformity of the composite formula material can pass through the metal particle Material is regulated.

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