JP7338295B2 - Molded body manufacturing method - Google Patents

Description

The present invention relates to a method for producing a molded article. More specifically, it relates to a method for manufacturing a molded article by a so-called imprint process.

A method for producing a molded article having a fine relief structure by a so-called "imprint process" is known.
The imprint process flow is, for example, as follows.
(1) First, the resin material is heated and softened.
(2) Next, the softened resin is pressed against a transfer surface having a fine structure provided on the surface of the mold and pressure-molded.
(3) Cool the resin as it is (while maintaining the pressurization).
(4) After the resin has cooled, the resin is released from the mold to obtain a molded resin article onto which the fine structure of the transfer surface of the mold has been transferred.

As an example of the prior art, Patent Literature 1 discloses that a semi-cured dry film is pressed against a semi-cured dry film by an imprint process in a heated state with a mold, and then cooled after being pressed, so that the uneven shape of the mold is formed. A method of forming an inverted transferred Fresnel lens is disclosed.

As another example of the prior art, US Pat. No. 6,300,001 discloses a method of forming a membrane carrier with a recessed microstructure for use in a liquid sample test kit by an imprint process.

WO2012/043573 WO2016/098740

The inventors of the present invention, in the course of studying improvements to the imprint process, found that unintended "wrinkles" occurred in the molded article when producing a molded article having a fine relief structure by the imprint process, and the desired molded article was not produced. I found that it may not be obtained.

The present invention has been made in view of such circumstances. One of the objects of the present invention is to make it difficult for unintended "wrinkles" to occur in a molded article in the production of the molded article by an imprint process.

As a result of intensive studies, the inventors of the present invention completed the invention provided below and solved the above problems.

According to the invention,
A pressing step of pressing the heated transfer material against the transfer surface of a mold having a transfer surface provided with a fine uneven structure,
The material to be transferred has a property of being softened by heating,
In the pressing step, a low-friction member having a static friction coefficient of 1 or less is in contact with the surface of the material to be transferred opposite to the mold,
The low-friction member contains one or more resins selected from the group consisting of polyimide and polyetheretherketone .

Advantageous Effects of Invention According to the present invention, unintended "wrinkles" are less likely to occur in a molded article in the production of the molded article by the imprint process.

It is a figure for demonstrating the manufacturing method of a molded object. It is a figure for demonstrating the manufacturing method of a molded object. It is a schematic diagram for demonstrating a "mold." It visualizes the state of wrinkles in Examples and Comparative Examples.

BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.
In all the drawings, the same constituent elements are denoted by the same reference numerals, and the description thereof will be omitted as appropriate.
In order to avoid complication, (i) when there are a plurality of the same components in the same drawing, only one of them is given a reference numeral and not all of them, and (ii) in particular the figure 2 onward, the same constituent elements as those in FIG. 1 may not be denoted by reference numerals.
All drawings are for illustration purposes only. The shape and dimensional ratio of each member in the drawings do not necessarily correspond to the actual article.

In this specification, the notation "x to y" in the description of numerical ranges means from x to y, unless otherwise specified. For example, "1 to 5% by mass" means "1% by mass or more and 5% by mass or less".
The notation "(meth)acryl" used herein represents a concept that includes both acryl and methacryl. The same applies to similar notations such as "(meth)acrylate".

<Method for manufacturing molded body>
I. in FIG. ~III. 2A and 2B are schematic diagrams for explaining the method for producing a molded article according to the present embodiment. More specifically, FIG. ~III. and FIG. 2 can be said to be a schematic cross-sectional view showing the "apparatus" for carrying out the method for producing a molded article of the present embodiment, its operation, procedures, and the like. I. in FIG. ~III. , and the procedure as illustrated in FIG. 2, a molded body having a fine relief structure can be produced.

I. in FIG. , the transfer material 20 is placed on the upper press plate 31 with the silicon wafer 33 and the low-friction member 15 interposed therebetween. The low-friction member 15 exists between the silicon wafer 33 and the transfer material 20 . A silicon wafer 33 is present between the press top plate 31 and the low friction member 15 .
The material to be transferred 20 has a property of being softened by heating.
The static friction coefficient of the surface of the low-friction member 15 (the surface in contact with the transferred material 20) is 10 or less.
Just to be sure, if the lower surface of the upper press plate 31, both surfaces of the silicon wafer 33, both surfaces of the low-friction member 15, and at least the upper surface of the transfer material 20 are sufficiently flat, I in FIG. . , the silicon wafer 33, the low-friction member 15, and the transferred material 20 can be prevented from "falling downward" due to gravity (because air does not enter between the members). Of course, some or all of these may be physically fixed by some means so as not to fall.

I. in FIG. , the mold 10 is placed on the lower press plate 32 with the silicon wafer 34 interposed therebetween.
I. in FIG. , the transfer surface 10a of the mold 10 (provided with a fine uneven structure) faces the surface 20a of the material 20 to be transferred.

I. in FIG. , the press upper plate 31 and the press lower plate 32 are capable of pressing the transfer surface 10a of the mold 10 against the surface 20a of the material 20 to be transferred.
Generally, at least one (preferably both) of the upper press plate 31 and the lower press plate 32 incorporate heating means. The heating means can heat the mold 10, the transfer material 20, and the like. Then, the mold 10 and/or the material to be transferred 20 can be pressed while being heated.

The arrangement positions of the transferred material 20 and the low-friction member 15 correspond to I. in FIG. It may be on the side of the lower press plate 32 as shown in FIG. In other words, the silicon wafer 34, the mold 10, the material to be transferred 20, and the low-friction member 15 may be stacked in this order on the upper surface of the lower press plate 32. FIG.

II. of FIG. is I. in FIG. Alternatively, the state of FIG. 2 is changed to schematically show a state (pressing step) in which the transferred material 20 that has been heated and softened is pressed against the transfer surface 10a of the mold 10. FIG.
Since the transferred material 20 is softened by heating, it is plastically deformed when pressed against the transfer surface 10 a of the mold 10 . Then, the fine concavo-convex structure of the transfer surface 10 a is transferred to the transferred material 20 .

At this time, since the low-friction member 15 is in contact with the surface of the transfer material 20 opposite to the mold 10, the transfer material 20 is prevented from wrinkling. This presumed mechanism is explained as follows (the following explanation does not limit the present invention).
When the transfer material 20 is heated, it is presumed that the transfer material 20 "expands" and causes "deflection", "distortion", and the like. It is presumed that when the transfer material 20 having such "bending" and "distortion" is pressed against the transfer surface 10a, the transfer material 20 is wrinkled due to the "bending" and "distortion".
However, if the low-friction member 15 is in contact with the surface of the transfer-receiving material 20 opposite to the mold 10, the "low-friction property" of the low-friction member 15 causes the transfer-receiving material 20 to "deflect". It is presumed that the "distortion" is successfully released, and wrinkles are less likely to occur.

The method and timing of heating the transfer material 20 are not particularly limited as long as the fine concavo-convex structure of the transfer surface 10 a is transferred to the transfer material 20 .

Specifically, the method of heating the transfer material 20 includes (i) a method of heating the transfer material 20 using a heating means built in the press upper plate 31, and (ii) a method of heating the transfer material 20 built into the press lower plate 32 (iii) a combination of (i) and (ii) above, that is, a press upper plate; 31 and the press lower plate 32, and the like.
In the case of (iii), the temperature of heating by the upper press plate 31 and the temperature of heating by the lower press plate 32 may be the same or different. For example, the heating temperature of the upper press plate 31 may be lower than the glass transition temperature of the transfer material 20 and the heating temperature of the lower press plate 32 may be higher than the glass transition temperature of the transfer material 20 . By doing so, it is possible to transfer the fine concavo-convex structure by quickly deforming the transfer material 20 after pressing while suppressing the occurrence of "deflection" and "distortion" of the transfer material 20 before the pressing process.

Regarding the timing of heating the transfer material 20 and the mold 10 (heating start timing), (i) heating may be started before pressing (stage I in FIG. 1 or FIG. 2), or ( ii) Heating may be started after the transfer material 20 is pressed against the transfer surface 10a or at the same time as the transfer material 20 is pressed against the transfer surface 10a. Timing (i) is preferable in terms of industrial productivity.

III. of FIG. II. of FIG. 2 is a diagram schematically showing a mold release step of releasing the transferred material 20 (on which the fine concavo-convex structure has been transferred) from the mold 10 after the pressing step of . III. of FIG. , description of components other than the transferred material 20 and the mold 10 is omitted.
The releasing process is usually performed after the material to be transferred 20 is sufficiently cooled after the pressing process. A method for cooling the transfer material 20 is not particularly limited. For example, it may be left in the atmosphere or exposed to air.

As described above, I. in FIG. ~III. , and the procedure as illustrated in FIG. 2, a molded body having a fine relief structure can be produced. In particular, in the pressing step, the low-friction member 15 is in contact with the surface of the transferred material 20 opposite to the mold 10, thereby suppressing wrinkles in the molded body.

The "outline" of the method for producing a molded article according to this embodiment is as described above.
A more specific description of the method for manufacturing the molded article of the present embodiment will be given below.

(Receiving material)
The material to be transferred 20 has the property of being softened by heating, and can be of any material, shape, etc., as long as it can form a fine uneven structure by being pressed against the transfer surface 10a of the mold 10. .

The transfer material 20 is preferably a first resin film (since the low-friction member 15 may also be a "resin film", it is referred to as a "first" resin film for distinction). Since the material to be transferred 20 is in the form of a film, it is easy to apply pressure uniformly to the material to be transferred 20 in the pressing process, and it is easy to manufacture a molded product with good dimensional accuracy.

The transfer material 20 usually contains a thermoplastic resin and/or a thermosetting resin. Considering ease of mold release in the mold release process, ease of subsequent processing of the molded article to be manufactured, etc., it is preferable that the material to be transferred 20 contains a thermoplastic resin.

The material to be transferred 20 is, for example, polymethyl(meth)acrylate, polycarbonate, polycycloolefin, polyethylene, polystyrene, polypropylene, acrylonitrile/styrene copolymer, acrylonitrile/butadiene/styrene copolymer, polynorbornene, polyethylene terephthalate, or the like. can include These are usually classified as thermoplastics.
From another point of view, the transfer material 20 preferably contains an amorphous resin. Amorphous materials have a wide molding temperature range, and therefore have good moldability and are effective in improving dimensional stability. Examples of amorphous resins include polymethyl(meth)acrylate, polycarbonate, polycycloolefin, polystyrene, (meth)acrylonitrile/styrene copolymer, and (meth)acrylonitrile/butadiene/styrene copolymer.
The material to be transferred 20 may contain only one kind of resin, or may contain two or more kinds of resins.

The material to be transferred 20 preferably contains one or more resins selected from the group consisting of polycycloolefin, polycarbonate, polymethylmethacrylate and polystyrene. Among them, polycycloolefin is preferable from the viewpoint of good releasability. In addition, polycycloolefin is preferable in terms of optical properties when the molded article is applied to uses (biochips, etc.) described below.

The glass transition temperature Tg of the transfer material 20 is typically 50 to 300.degree. C., preferably 60 to 250.degree. C., more preferably 70 to 200.degree.
As the glass transition temperature, for example, the temperature at the inflection point at which the storage elastic modulus begins to decrease when the transfer material 20 is subjected to dynamic viscoelasticity measurement can be used. The measurement mode of the dynamic viscoelasticity measurement can be the shear mode, the frequency can be 1 Hz, and the heating rate can be 5° C./min.

When the material to be transferred 20 is the first resin film, its thickness is preferably 0.01 to 10 mm, more preferably 0.02 to 5 mm, even more preferably 0.04 to 2 mm.
By setting the thickness of the transfer material 20 to 0.01 mm or more, the generation of wrinkles in the transfer material 20 can be further suppressed. Further, by setting the thickness of the transfer material to 10 mm or less, the cooling property of the transfer material 20 is enhanced, and production efficiency and production time can be reduced.

Commercially available products from synthetic resin manufacturers, film manufacturers, and the like can be used as the material to be transferred 20 .

(Mold)
FIG. 3 is a schematic diagram for explaining the mold 10 in FIG. Specifically, FIG. 2A. 1] is a top view showing a transfer surface 10a of a mold 10. [FIG. Also, FIG. 2B. is an XX vertical sectional view of the mold 10. FIG.
The transfer surface 10a of the mold 10 usually has a plurality of convex portions. The shape of each convex portion can be, for example, a columnar shape, a conical shape, a hemispherical shape, a shape obtained by chamfering the corners of these shapes, a shape in which each shape is connected, a shape in which each shape is synthesized, or the like. The “columnar shape” as used herein includes a columnar shape, a square columnar shape, and the like.
Further, the transfer surface 10a may have a stripe-shaped uneven fine structure.

The mold 10 is preferably a Ni electroformed mold. In other words, at least the transfer surface 10a of the mold 10 is preferably Ni electroformed. A Ni electroformed mold is preferable in terms of wear resistance and the like.

The pitch (p in FIG. 3A) of the projections of the fine uneven structure provided on the transfer surface 10a is, for example, 0.02 to 6000 μm, specifically 0.04 to 4000 μm, more specifically 0.06 to 0.06 μm. 2000 μm.
When the projections of the fine uneven structure provided on the transfer surface 10a are columnar, the diameter of the column (d in FIG. 3A) is, for example, 0.1 to 3000 μm, specifically 0.2 to 2000 μm, or more. Specifically, it is 0.3 to 1000 μm.
The height (h in FIG. 3B) of the projections of the fine uneven structure provided on the transfer surface 10a is, for example, 0.01 to 3000 μm, specifically 0.02 to 2000 μm, more specifically 0.03. ~1000 μm.

The mold 10 can be manufactured by a known manufacturing method.

(Low friction member)
The material, shape, and the like of the low-friction member 15 are not particularly limited as long as the effect of preventing wrinkles from forming on the molded body can be obtained.

The low-friction member 15 is preferably a second resin film.
When the low-friction member 15 is the second resin film, its thickness is preferably 1 to 1000 μm, more preferably 10 to 800 μm, even more preferably 20 to 500 μm.

The low-friction member 15 preferably contains one or more resins selected from the group consisting of polyimide, polyester and polyetheretherketone. By adopting one or more of these resins as the material of the low friction member 15, the coefficient of friction of the low friction member 15 can be easily reduced. In addition, since these resins have relatively high heat resistance, it is easy to avoid deformation of the low-friction member 15 during the pressing process. Moreover, since it has high heat resistance, it is also preferable in terms of repeated use.
Incidentally, in order to reliably avoid deformation of the low-friction member 15, the temperature during the pressing process is adjusted so that the glass transition temperature of the transferred material 20<the temperature during the pressing process<the glass transition temperature of the low-friction member. Also, it is preferable to select a material having an appropriate glass transition temperature for each member.

The static friction coefficient of the low friction member 15 (more precisely, the static friction coefficient of the surface of the low friction member 15 in contact with the transferred material 20) is 10 or less, preferably 5 or less, more preferably 3 or less, and still more preferably 1 or less. is.
There is no particular lower limit for the coefficient of static friction, and basically, the smaller the coefficient of static friction, the less wrinkled the molded product. However, from a realistic point of view, the coefficient of static friction is, for example, 0.01 or more, specifically 0.1 or more.

The static friction coefficient is obtained by superimposing the transferred material 20 (for example, a polycycloolefin resin film) and the low-friction member 15, applying a load of 200 g according to JIS K 7125, and friction at a speed of 100 mm / min. It can be determined by conducting tests. The measurement environment at this time is preferably set to 23° C. and 50% RH.

As the low-friction member 15, one having a static friction coefficient of 10 or less can be selected and used from commercial products (films) available from synthetic resin makers, film makers, and the like.

(silicon wafer)
I. in FIG. and II. , the silicon wafer 33 is usually used to prevent damage to the upper press plate 31 . Also, the silicon wafer 34 is generally used to prevent damage to the lower press plate 32 . In other words, silicon wafer 33 and silicon wafer 34 are not "essential" for the production of the compact. However, it is preferable to use the silicon wafer 33 and the silicon wafer 34 for the purpose of suppressing damage to the press upper plate 31 and the press lower plate 32 and extending the life of the apparatus. In addition, it can be said that by performing the pressing step through the silicon wafer, even if the surfaces of the press upper plate 31 and the press lower plate 32 are uneven, the pressing force can be easily made uniform.
As for the silicon wafer 33 and the silicon wafer 34, commercially available ones can be appropriately used.

Incidentally, in terms of suppressing damage to the upper press plate 31/lower press plate 32, some kind of "backing plate" made of a suitable material other than silicon may be used. In this embodiment, a silicon wafer is used as a plate material with high flatness that is relatively easily available on the market.

(Pressure, temperature, etc. in the pressing process)
The pressure in the pressing step is preferably 0.1 to 50 MPa, more preferably 1 to 20 MPa, from the viewpoints of sufficiently deforming the transfer material 20 and preventing damage to the mold 10 . The pressure can be adjusted by changing the press pressure by the press upper plate 31 and press lower plate 32 .

The temperature at which the material to be transferred 20 is heated in the pressing step is not particularly limited as long as the material to be transferred 20 is sufficiently softened. An appropriate heating temperature may be set based on the material, softening point, glass transition temperature, etc., of the material to be transferred 20 .

In the pressing step, at least the surface of the transfer material 20 pressed against the transfer surface 10a is typically heated to 50 to 300°C, preferably 60 to 250°C, more preferably 80 to 200°C. More specifically, when the transfer material 20 contains polycycloolefin, the transfer material 20 is preferably heated to 100-180.degree.

From another point of view, the temperature at which the surface of the transfer material 20 pressed against the transfer surface 10a in the pressing step is heated is (i) slightly higher than the glass transition temperature of the transfer material 20, and (ii) It is preferably not too high compared to the glass transition temperature of the transfer material 20 . According to (i), the material to be transferred 20 is sufficiently deformed by pressing, and it is easy to manufacture a molded article having a fine concavo-convex structure faithful to the transfer surface 10a. Further, due to (ii), excessive softening of the transfer material 20 is suppressed, and unintended deformation of the transfer material 20 is suppressed.
Specifically, when the temperature at which the surface of the material to be transferred 20 pressed against the transfer surface 10a in the pressing step is heated is T (°C), and the glass transition temperature of the material to be transferred 20 is Tg (°C) , preferably satisfies the relationship of the formula "Tg + 5 ° C. ≤ T ≤ Tg + 60 ° C.", more preferably satisfies the relationship of the formula "Tg + ₁₀ ° C. ≤ T ₀ ≤ Tg + 50 ° C." ° C” is particularly preferred.

As the glass transition temperature, for example, the temperature at the inflection point at which the storage elastic modulus begins to decrease when the transfer material 20 is subjected to dynamic viscoelasticity measurement can be used. The measurement mode of the dynamic viscoelasticity measurement can be the shear mode, the frequency can be 1 Hz, and the heating rate can be 5° C./min.

“The temperature at which the surface of the material to be transferred 20 pressed against the transfer surface 10 a is heated” in the pressing step can be generally regarded as the same as the temperature of the mold 10 . In particular, when the material to be transferred 20 is the first resin film (that is, when the material to be transferred 20 is thin), the temperature of the material to be transferred 20 rapidly reaches the temperature of the mold 10 in the pressing step. Conceivable.

(Uses of manufactured compacts)
The use of the molded article having a fine relief structure obtained as described above is not particularly limited.
Examples of uses include biochips and the like. That is, a biochip can be obtained by fixing a recognition substance such as a specific antibody to the concave portion (corresponding to the convex portion of the transfer surface 10a) of the molded body.
For specific aspects of the biochip, for example, JP-A-2015-49161, JP-A-2015-49162, etc. can be referred to.

Although the embodiments of the present invention have been described above, these are examples of the present invention, and various configurations other than those described above can be adopted. Moreover, the present invention is not limited to the above-described embodiments, and includes modifications, improvements, etc. within the scope of achieving the object of the present invention.
Examples of reference forms are added below.
1.
A pressing step of pressing the heated transfer material against the transfer surface of a mold having a transfer surface provided with a fine uneven structure,
The material to be transferred has a property of being softened by heating,
In the pressing step, a method for producing a molded body having a fine uneven structure, wherein a low-friction member having a static friction coefficient of 10 or less is in contact with the surface of the material to be transferred opposite to the mold.
2.
1. A method for producing a molded article according to
A method for producing a molded article, wherein the material to be transferred is a first resin film.
3.
1. or 2. A method for producing a molded article according to
A method for producing a molded body, wherein the material to be transferred contains a thermoplastic resin.
4.
1. ~3. A method for producing a molded article according to any one of
A method for producing a molded article, wherein the material to be transferred contains one or more resins selected from the group consisting of polycycloolefin, polycarbonate, polymethylmethacrylate and polystyrene.
5.
1. ~ 4. A method for producing a molded article according to any one of
A method for producing a molded body, wherein the low-friction member is a second resin film.
6.
1. ~ 5. A method for producing a molded article according to any one of
A method for producing a molded body, wherein the low-friction member contains one or more resins selected from the group consisting of polyimide, polyester and polyetheretherketone.
7.
1. ~6. A method for producing a molded article according to any one of
The method for producing a molded body, wherein in the pressing step, the surface of the material to be transferred that is pressed against the transfer surface is heated to 50 to 300°C.
8.
1. ~7. A method for producing a molded article according to any one of
A method for producing a compact, wherein the mold is a Ni electroforming mold.
9.
1. ~8. A method for producing a molded article according to any one of
The method for producing a molded article, wherein the height of the projections of the fine uneven structure provided on the transfer surface is 0.01 to 3000 μm.
10.
1. ~ 9. A method for producing a molded article according to any one of
A method for manufacturing a molded body, comprising a mold release step of releasing the transferred material from the mold after the pressing step.

Embodiments of the present invention will be described in detail based on examples and comparative examples. It should be noted that the invention is not limited to the examples only.

<Preparation>
A mold, a material to be transferred, a low-friction member, and a silicon wafer were prepared as follows.

(Mold)
A Ni electroforming mold having cylindrical projections on the transfer surface as shown in FIG. 2 was prepared.
The cylindrical projections had a diameter (d in FIG. 2) of 10 μm, a height (h in FIG. 2) of 10 μm, and a pitch (p in FIG. 2) of 20 μm.

(Receiving material)
The following "COP" was used.
・ COP: polycycloolefin resin film (Zeonor film ZF-14 manufactured by Zeon Corporation, thickness: 0.19 mm, glass transition temperature: 136 ° C.)

For the glass transition temperature, dynamic viscoelasticity measurement was performed under the following conditions, and the glass transition temperature was determined from the inflection point at which the storage elastic modulus (G') began to decrease.
・ Measuring device: ARES-2KFRTN1-FCO-HR manufactured by TA Instruments
・Sample size: Parallel plate φ25mm, gap 2mm
・Measurement temperature range: 100 to 180°C
・Temperature increase rate: 5°C/min
・Frequency: 1Hz
・Mode: Shear mode

(Low friction member, or member with large friction coefficient for comparison)
・PI (polyimide), 125 μm thick, static friction coefficient 0.35
・PEEK (polyetheretherketone), 500 μm thick, static friction coefficient 0.59
・PET (polyethylene terephthalate), 100 μm thick, static friction coefficient 0.44
・PC (polycarbonate), 300 μm thick, static friction coefficient 10.41 (for comparison)
・PES (polyethersulfone), 200 μm thick, static friction coefficient 14.49 (for comparison)

As described above, the static friction coefficient of the low-friction member is 100 mm/min when the material to be transferred (COP) and each low-friction member are superimposed and a load of 200 g is applied according to JIS K 7125. It was determined by performing a friction test at high speed. The measurement environment was set at 23° C. and 50% RH.
Three measurements were performed on each low-friction member, and the average of the three obtained values was adopted as the static friction coefficient.

(silicon wafer)
Commercially available 6-inch silicon wafer

<Example 1: Production of compact>
The procedure was as follows.
(1) As shown in FIG. 2, a mold, a material to be transferred, PI as a low-friction member, and a silicon wafer were placed between an upper press plate and a lower press plate (with built-in heating means).
(2) The mold was heated to 155.degree.
(3) While maintaining the above temperature, the material to be transferred COP was pressed against the transfer surface of the mold by the press upper plate and the press lower plate, and pressed for 2 minutes at a pressure of 4 MPa.
(4) After that, the temperature of the mold and the transferred material COP was cooled down to 135° C. over about 3 minutes while being pressed with the same pressure.
(5) Raise the upper plate of the press and apply cold air to the integrated mold and material to be transferred on the lower plate of the press to sufficiently heat the material to be transferred (at least to a temperature below Tg). ) cooled.
(6) The transferred material COP was released from the mold to obtain a compact having a fine concave-convex structure.

<Examples 2 and 3 and Comparative Examples 1 and 2: Production of compacts>
Example 2: A molded article was produced in the same manner as in Example 1, except that PET was used instead of PI as the low-friction member.
Example 3: A compact was produced in the same manner as in Example 1, except that PEEK was used instead of PI as the low-friction member.
Comparative Example 1: A compact was produced in the same manner as in Example 1, except that PC having a large friction coefficient was used instead of the low-friction member PI.
Comparative Example 2: A molded article was produced in the same manner as in Example 1, except that PES having a large friction coefficient was used instead of the low friction member PI.

<Visual evaluation of wrinkles>
The obtained molded article was carefully visually observed, and the case where no wrinkles were observed was evaluated as ◯ (good), and the case where even one wrinkle was observed was evaluated as x (bad). Table 1 shows the evaluation results.

From Table 1, it is understood that unintended "wrinkles" are less likely to occur in the molded article when producing the molded article having the fine relief structure.

<Confirmation of wrinkles by pressure measurement film>
For reference, FIG. 4 shows the state of wrinkles visualized by a pressure measurement film (Prescale (registered trademark) manufactured by Fuji Film Co., Ltd.).
Figure 4A. is a visualization of the state of wrinkles when PES with a large friction coefficient is used. A large wrinkle is generated in the part indicated by the arrow.
Figure 4B. is a visualization of the state of wrinkles when PEEK is used as the low-friction member. No noticeable wrinkles are seen.

10 mold 10a transfer surface 15 low friction member 20 transfer material 20a surface (surface of transfer material)
31 press upper plate 32 press lower plate 33 silicon wafer 34 silicon wafer

Claims (9)

A pressing step of pressing the heated transfer material against the transfer surface of a mold having a transfer surface provided with a fine uneven structure,
The material to be transferred has a property of being softened by heating,
In the pressing step, a low-friction member having a static friction coefficient of 1 or less is in contact with the surface of the material to be transferred opposite to the mold,
A method for producing a molded article having a fine relief structure, wherein the low-friction member contains one or more resins selected from the group consisting of polyimide and polyetheretherketone. A method for producing a molded article according to claim 1,
A method for producing a molded article, wherein the material to be transferred is a first resin film. A method for producing a molded article according to claim 1 or 2,
A method for producing a molded body, wherein the material to be transferred contains a thermoplastic resin. A method for producing a molded article according to any one of claims 1 to 3,
A method for producing a molded article, wherein the material to be transferred contains one or more resins selected from the group consisting of polycycloolefin, polycarbonate, polymethylmethacrylate and polystyrene. A method for producing a molded article according to any one of claims 1 to 4,
A method for producing a molded body, wherein the low-friction member is a second resin film. A method for producing a molded article according to any one of claims 1 to 5 ,
The method for producing a molded body, wherein in the pressing step, the surface of the material to be transferred that is pressed against the transfer surface is heated to 50 to 300°C. A method for producing a molded article according to any one of claims 1 to 6 ,
A method for producing a compact, wherein the mold is a Ni electroforming mold. A method for producing a molded article according to any one of claims 1 to 7 ,
The method for producing a molded article, wherein the height of the projections of the fine uneven structure provided on the transfer surface is 0.01 to 3000 μm. A method for producing a molded article according to any one of claims 1 to 8 ,
A method for manufacturing a molded body, comprising a mold release step of releasing the transferred material from the mold after the pressing step.

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