TWI766721B - Electronic device - Google Patents

Abstract

An electronic device configured to be connected to external heat dissipation device and includes casing, heat source and heat dissipation assembly. Heat source is disposed on casing. Heat dissipation assembly includes evaporator, condenser and fin assembly. Evaporator is in thermal contact with heat source. Condenser has external surface, condensation space and liquid cooling space. External surface faces away from condensation space and liquid cooling space. Condensation space is not connected to liquid cooling space. Condensation space is connected to evaporator. Liquid cooling space is configured to be connected to external heat dissipation device. Fin assembly is in thermal contact with condenser and protrudes from external surface of condenser along a direction away from condensation space or liquid cooling space.

Description

electronic device

The present invention relates to an electronic device, in particular to an electronic device including a heat dissipation component.

Generally, a rack is installed in a computer room where air-conditioning equipment is arranged, and a plurality of servers are accommodated in the rack. In addition, the greater the temperature difference between the air flow into the cabinet and the air flow out of the cabinet, the better the cooling efficiency of the air conditioner to the cabinet. Therefore, in order to increase the temperature difference between the air flow into the cabinet and the air flow out of the cabinet to increase the overall cooling efficiency of the cabinet, a water cooling plate is installed at the air outlet of the cabinet to cool the hot air flowing out of the server.

Of course, because the water-cooling plate is installed at the air outlet of the cabinet, when a certain server in the cabinet needs to be repaired, the water-cooling plate needs to be removed first. As a result, the hot air flowing from the other servers still running in the rack cannot be cooled by the water cooling plate, which reduces the temperature difference between the airflow entering the rack and the airflow out of the rack, which in turn reduces the cooling efficiency of the rack.

The present invention is to provide an electronic device to prevent the problem of reducing the cooling efficiency of the cabinet caused by the maintenance of a single electronic device.

An electronic device disclosed in an embodiment of the present invention is used for connecting to an external heat dissipation device and includes a casing, a heat source and a heat dissipation component. The heat source is arranged on the casing. The heat dissipation assembly includes an evaporator, a condenser and a set of heat dissipation fins. The evaporator is in thermal contact with the heat source. The condenser has an outer surface, a condensation space and a liquid cooling space. The outer surface faces away from the condensation space and the liquid cooling space. The condensation space and the liquid cooling space are not communicated with each other. The condensation space communicates with the evaporator. The liquid cooling space is used for connecting to an external heat sink. The heat dissipation fin group is in thermal contact with the condenser and protrudes from the outer surface of the condenser in a direction away from the condensation space or the liquid cooling space.

The electronic device disclosed in another embodiment of the present invention is used for connecting to an external heat dissipation device and includes a casing, a heat source and a heat dissipation component. The heat source is arranged on the casing. The heat dissipation assembly includes an evaporator, a pipeline, a liquid cooling plate and a heat dissipation fin group. The evaporator is in thermal contact with the heat source. The pipeline includes an evaporation section and a condensation section. The evaporation section communicates with the condensation section and is in thermal contact with the evaporator. The liquid cooling plate is arranged on the casing and is separated from the heat source. The liquid cooling plate has an outer surface and a liquid cooling space. The outer surface faces away from the liquid cooling space. The liquid cooling space is used for connecting to an external heat sink. The condensing section of the pipeline is located in the liquid cooling space. The heat dissipation fin group is in thermal contact with the liquid cooling plate and protrudes from the outer surface of the liquid cooling plate in a direction away from the liquid cooling space.

According to the electronic device disclosed in the above embodiments, the heat dissipation fin group protrudes from the outer surface of the condenser or the liquid cooling plate in a direction away from the condensation space or the liquid cooling space. Therefore, the heat dissipation component can not only cool the condensing section or the heat dissipation fluid in the condensing space through the cooling liquid in the liquid cooling space, but also cool the hot air in the casing through the heat dissipation fin group. Since the hot air in the cooling case will be cooled through the heat dissipation fin set inside the case, the maintenance of a single electronic device in the cabinet will not affect the cooling operation of the heat dissipation fin set in the case of other electronic devices, and also There is no need to install a water cooling plate at the air outlet of the cabinet with a plurality of electronic devices, thereby preventing the problem of lowering the cooling efficiency of the cabinet caused by the maintenance of a single electronic device.

The detailed features and advantages of the embodiments of the present invention are described in detail below in the embodiments, and the contents are sufficient to enable any person with ordinary knowledge in the art to understand the technical contents of the embodiments of the present invention and implement them accordingly, and according to the disclosure in this specification Any person with ordinary knowledge in the art can easily understand the related objects and advantages of the present invention. The following examples further illustrate the viewpoints of the present invention in detail, but do not limit the scope of the present invention in any viewpoint.

See Figures 1 through 3. FIG. 1 is a perspective view of an external heat sink and an electronic device according to a first embodiment of the present invention. FIG. 2 is an exploded view of the electronic device and the external heat sink in FIG. 1 . FIG. 3 is a schematic side sectional view of the electronic device in FIG. 1 .

The electronic device 10 is connected to an external heat dissipation device 20 and includes a casing 100 , a heat source 200 and a heat dissipation component 300 . The electronic device 10 is, for example, a server. In this embodiment, the casing 100 includes a bottom plate 101 , a side plate 102 and a partition plate 103 . The side plate 102 stands on the periphery 1010 of the bottom plate 101 . The partition plate 103 stands on the bottom plate 101 and is connected to opposite sides of the side plate 102 . The heat source 200 is disposed on the base plate 101 and is, for example, a central processing unit or a graphics processing unit.

In this embodiment, the heat dissipation assembly 300 includes an evaporator 301 , a condenser 302 , a heat dissipation fin set 303 , two first flow pipes 304 and two second flow pipes 305 . The evaporator 301 is in thermal contact with the side of the heat source 200 away from the bottom plate 101 . In this embodiment, the condenser 302 is a stacked structure and includes a first heat-conducting plate 3020, a second heat-conducting plate 3021, a third heat-conducting plate 3022, a fourth heat-conducting plate 3023, a plurality of connecting pipes 3024, a plurality of A first convex hull 3025 and a plurality of second convex hulls 3026 . In addition, the condenser 302 has an outer surface 3027 , a condensation space 3028 , a first liquid cooling space 3029 and a second liquid cooling space 306 .

The first thermally conductive plate 3020 , the second thermally conductive plate 3021 and the third thermally conductive plate 3022 are stacked in sequence, and the fourth thermally conductive plate 3023 is stacked on the side of the first thermally conductive plate 3020 away from the second thermally conductive plate 3021 . That is, the fourth thermally conductive plate 3023, the first thermally conductive plate 3020, the second thermally conductive plate 3021 and the third thermally conductive plate 3022 are stacked in sequence. In addition, the first heat conduction plate 3020 , the second heat conduction plate 3021 , the third heat conduction plate 3022 and the fourth heat conduction plate 3023 are made of metal, for example.

The first heat conduction plate 3020 , the second heat conduction plate 3021 , the third heat conduction plate 3022 and the fourth heat conduction plate 3023 together form an outer surface 3027 . The first liquid cooling space 3029 is formed between the second heat conduction plate 3021 and the third heat conduction plate 3022 . The condensation space 3028 is formed between the first heat conduction plate 3020 and the second heat conduction plate 3021 . The second liquid cooling space 306 is formed between the fourth heat conducting plate 3023 and the first heat conducting plate 3020 . The condensation space 3028 is located between the first liquid cooling space 3029 and the second liquid cooling space 306 . In addition, the outer surface 3027 faces away from the condensation space 3028 , the first liquid cooling space 3029 and the second liquid cooling space 306 .

In this embodiment, the condensation space 3028 is communicated with the evaporator 301 through the two first flow pipes 304 . As shown in FIG. 3 , one end 3040 of each first flow pipe 304 away from the evaporator 301 extends from the side of the fourth heat conducting plate 3023 of the condenser 302 close to the bottom plate 101 into the condenser 302 and communicates with the condensation space 3028 . The second liquid cooling space 306 is used for connecting to the external heat dissipation device 20 through two second flow pipes 305 . As shown in FIG. 3 , one end 3050 of each second flow pipe 305 away from the external heat sink 20 extends from the side of the fourth heat conducting plate 3023 of the condenser 302 close to the bottom plate 101 into the condenser 302 and communicates with the second liquid Cold space 306. In addition, in this embodiment, the first liquid cooling space 3029 is communicated with the second liquid cooling space 306 through the connecting pipe 3024 . Specifically, opposite ends of each connecting pipe 3024 are respectively connected to the first liquid cooling space 3029 and the second liquid cooling space 306 and are connected in parallel with each other, and the connecting pipe 3024 penetrates but is not connected to the condensation space 3028 .

The partition 103 is located between the heat source 200 and the condenser 302 to prevent the cooling liquid leaked from the condenser 302 from flowing further to the heat source 200 . The separator 103 has two grooves 1030 . The two grooves 1030 are recessed from the side of the partition plate 103 away from the bottom plate 101 , and the two first flow pipes 304 are respectively located in the two grooves 1030 .

The heat dissipation fin group 303 is in thermal contact with the fourth heat conducting plate 3023 of the condenser 302 and protrudes from the outer surface 3027 of the condenser 302 in a direction away from the second liquid cooling space 306 . In this embodiment, the heat dissipation fin set 303 protrudes from the side of the fourth heat conducting plate 3023 of the condenser 302 close to the bottom plate 101 and extends to the bottom plate 101 so that the condenser 302 and the bottom plate 101 are spaced apart from each other. As shown in FIG. 3 , in this embodiment, the cooling fin set 303 elevates the condenser 302 relative to the bottom plate 101 , so that the side of the third heat-conducting plate 3022 of the condenser 302 away from the bottom plate 101 is relative to the height H1 of the bottom plate 101 It is equal to the height H2 of the side of the side plate 102 away from the bottom plate 101 relative to the bottom plate 101 . The heat dissipation fin set 303 is used for a hot air A1 to flow through and absorb the heat of the hot air A1, wherein the hot air A1 is guided by, for example, a fan (not shown) inside or outside the electronic device 10 and absorbs the heat in the electronic device 10 heat generated.

The first convex hull 3025 protrudes from the first heat conducting plate 3020 toward the condensation space 3028 . In this embodiment, the first convex hull 3025 is, for example, a structure formed by performing a stamping process on the first thermally conductive plate 3020 , so that the first thermally conductive plate 3020 has a groove 30250 located in the second liquid cooling space 306 . The second convex hull 3026 protrudes from the second heat conducting plate 3021 toward the condensation space 3028 . In this embodiment, the second protrusion 3026 is, for example, a structure formed by performing a stamping process on the second thermally conductive plate 3021 , so that the second thermally conductive plate 3021 has a groove 30260 located in the first liquid cooling space 3029 .

The evaporator 301 , the first flow pipe 304 and the condensing space 3028 are used for circulating a cooling fluid (not shown), wherein the cooling fluid is, for example, a refrigerant. The first liquid cooling space 3029 , the second liquid cooling space 306 , the connecting pipe 3024 and the external heat dissipation device 20 circulate a cooling liquid (not shown), wherein the cooling liquid is, for example, water. After the heat dissipation fluid is evaporated into gas in the evaporator 301 , it will flow to the condensation space 3028 through one of the first flow pipes 304 . The cooling liquid flowing in the first liquid cooling space 3029 and the second liquid cooling space 306 cools the heat dissipation fluid flowing into the condensation space 3028 to condense the heat dissipation fluid into a liquid. The cooling fluid condensed into liquid will flow back to the evaporator 301 through another first flow pipe 304 . The cooling liquid that absorbs heat from the heat dissipation fluid flows to the external heat sink 20 to be cooled by the external heat sink 20 . In this embodiment, the flow directions of the cooling fluid and the cooling liquid in the condenser 302 are opposite, for example, so as to increase the heat exchange efficiency between the cooling fluid and the cooling liquid.

In other embodiments, the condenser may not be a stacked structure but an integrated structure having a condensing space and a liquid cooling space that are not communicated with each other. In other embodiments, the condenser may only include the first liquid cooling space without including the second liquid cooling space.

In other embodiments, the height of the side of the third heat-conducting plate of the condenser away from the bottom plate relative to the bottom plate may also be smaller than the height of the side of the side plate away from the bottom plate relative to the bottom plate.

In other embodiments, the end of each first flow pipe that is far away from the evaporator can also extend into the condenser from the side of the third heat-conducting plate of the condenser that is far away from the bottom plate, and the end of each second flow pipe that is far away from the external heat sink can also extend into the condenser. The ends may also extend into the condenser from the side of the third heat conducting plate remote from the bottom plate.

In other embodiments, the separator does not need to have a groove and the first flow pipe can be separated from the separator. In still other embodiments, the casing may not need to include a partition.

In other embodiments, the first convex hull may also protrude from the first heat conducting plate toward the second liquid cooling space. In still other embodiments, the condenser need not include the first convex hull. In other embodiments, the second convex hull may also protrude from the second heat conducting plate toward the first liquid cooling space. In still other embodiments, the condenser need not include the second convex hull.

In other embodiments, the condenser may also include only a single connecting pipe. In addition, in other embodiments, the connecting pipe does not need to penetrate the condensation space but is located outside the condensation space.

The heat dissipation fin group 303 is not limited to protrude from the side of the fourth heat conducting plate 3023 of the condenser 302 close to the bottom plate 101 . See Figure 4. 4 is a schematic side sectional view of an electronic device according to a second embodiment of the present invention. In this embodiment, the heat dissipation fin set 303a protrudes from the side of the third heat conducting plate 3022a of the condenser 302a away from the bottom plate 101a.

The present invention is not limited to the structure of the heat dissipation assembly, please refer to FIG. 5 to FIG. 8 . 5 is a perspective view of an external heat sink and an electronic device according to a third embodiment of the present invention. FIG. 6 is an exploded view of the electronic device and the external heat sink in FIG. 5 . FIG. 7 is a top cross-sectional view of the electronic device in FIG. 5 . FIG. 8 is a schematic side sectional view of the electronic device in FIG. 5 .

In this embodiment, the electronic device 10b is, for example, a server. In this embodiment, the electronic device 10b is connected to an external heat dissipation device 20b and includes a casing 100b, a heat source 200b and a heat dissipation component 300b.

In this embodiment, the casing 100b includes a bottom plate 101b, a side plate 102b and a partition plate 103b. The side plate 102b stands on the peripheral edge 1010b of the bottom plate 101b. The partition plate 103b stands on the bottom plate 101b and is connected to opposite sides of the side plate 102b. The heat source 200b is disposed on the bottom plate 101b and is, for example, a central processing unit or a graphics processing unit.

In this embodiment, the heat dissipation assembly 300b includes an evaporator 301b, a pipeline 302b, a liquid cooling plate 303b, a heat dissipation fin set 305b, and two conduits 304b. The evaporator 301b is in thermal contact with the heat source 200b. In this embodiment, the pipeline 302b is used for a heat dissipation fluid (not shown) to flow and includes an evaporation section 3020b, a first communication section 3021b, a second communication section 3022b and a condensation section 3023b, wherein heat dissipation is The fluid is, for example, a refrigerant. The evaporation section 3020b communicates with the condensation section 3023b through the first communication section 3021b and the second communication section 3022b. The opposite ends of the first communication section 3021b are respectively communicated with the evaporation section 3020b and the condensation section 3023b. The opposite ends of the second communication section 3022b are respectively communicated with the evaporation section 3020b and the condensation section 3023b. The evaporation section 3020b is in thermal contact with the evaporator 301b and is located on the side of the evaporator 301b away from the heat source 200b. In this embodiment, the first communication section 3021b and the second communication section 3022b are separated from the partition plate 103b.

The condensation section 3023b of the pipeline 302b includes a first pipe portion 3024b, a second pipe portion 3025b and a plurality of connecting pipe portions 3026b. The opposite ends of each connecting pipe portion 3026b are respectively connected to the first pipe portion 3024b and the second pipe portion 3025b so that these connecting pipe portions 3026b are connected in parallel with each other. The first pipe portion 3024b and the second pipe portion 3025b communicate with the first communication section 3021b and the second communication section 3022b, respectively.

It should be noted that, in this embodiment, the opposite ends of one of the connecting pipe portions 3026b farthest from the first communication section 3021b and the second communication section 3022b are respectively connected through the two curved portions 3027b of the condensation section 3023b In the first pipe portion 3024b and the second pipe portion 3025b, the cooling fluid can flow smoothly in the condensation section 3023b.

In addition, as shown in FIG. 7 , in this embodiment, the extending directions F of the connecting pipe portions 3026b are substantially parallel to each other.

In other embodiments, the condensing section does not need to include two curved parts, and one of the connecting pipe parts farthest from the first communication section and the second communication section can also be directly and vertically connected to the first pipe section and the second communication section. Second tube. In other embodiments, the extending directions of the connecting pipe portions may not be parallel to each other. In other embodiments, the partition plate does not need to have two through holes, and the first communication section and the second communication section can also be supported on the side of the partition plate away from the bottom plate.

In other embodiments, the condensing section can also include only a single connecting pipe part and connect the connecting pipe part, the first pipe part and the second pipe part in series with each other.

In this embodiment, the liquid cooling plate 303b has an outer surface 3032b and a liquid cooling space 3033b. The liquid cooling plate 303b is disposed on the bottom plate 101b of the casing 100b and is separated from the heat source 200b. The liquid cooling space 3033b is used for a cooling liquid to flow, wherein the cooling liquid is, for example, water. The entire condensation section 3023b of the pipeline 302b is located in the liquid cooling space 3033b. The partition 103b is located between the heat source 200b and the liquid cooling plate 303b to prevent the cooling liquid leaking from the liquid cooling space 3033b from flowing further to the heat source 200b. It should be noted that, in other embodiments, the casing may not need to include a partition.

The heat dissipation fin group 305b is in thermal contact with the liquid cooling plate 303b and protrudes from the outer surface 3032b of the liquid cooling plate 303b in a direction away from the liquid cooling space 3033b. In this embodiment, the heat dissipation fin set 305b protrudes from the side of the liquid cooling plate 303b close to the bottom plate 101b and extends to the bottom plate 101b so that the liquid cooling plate 303b and the bottom plate 101b are spaced apart from each other. In addition, as shown in FIG. 8 , in this embodiment, the heat dissipation fin group 305b elevates the liquid cooling plate 303b, so that the height H3 of the side of the liquid cooling plate 303b away from the bottom plate 101b relative to the bottom plate 101b is equal to the height H3 of the side plate 102b away from the bottom plate One side of 101b is relative to the height H4 of the bottom plate 101b. The heat dissipation fin set 305b is used for a hot air A2 to flow through and absorb the heat of the hot air A2, wherein the hot air A2 is guided by, for example, a fan (not shown) inside or outside the electronic device 10b and absorbs the heat in the electronic device 10b heat generated.

The liquid cooling space 3033b of the liquid cooling plate 303b is connected to the external heat sink 20b through two conduits 304b. That is, the cooling liquid circulates between the liquid cooling plate 303b, the two conduits 304b and the external heat sink 20b.

It should be noted that, in other embodiments, the height of the side of the liquid cooling plate away from the bottom plate relative to the bottom plate may also be smaller than the height of the side of the side plate away from the bottom plate relative to the bottom plate.

In addition, the heat dissipation fin group 305b is not limited to protrude from the side of the liquid cooling plate 303b close to the bottom plate 101b. See Figure 9. 9 is a schematic side sectional view of an electronic device according to a fourth embodiment of the present invention. In this embodiment, the heat dissipation fin group 305c protrudes from a side of the liquid cooling plate 303c away from the bottom plate 101c.

According to the electronic device disclosed in the above embodiments, the heat dissipation fin group protrudes from the outer surface of the condenser or the liquid cooling plate in a direction away from the condensation space or the liquid cooling space. Therefore, the heat dissipation component can not only cool the condensing section or the heat dissipation fluid in the condensing space through the cooling liquid in the liquid cooling space, but also cool the hot air in the casing through the heat dissipation fin group. Since the hot air in the cooling case will be cooled through the heat dissipation fin set inside the case, the maintenance of a single electronic device in the cabinet will not affect the cooling operation of the heat dissipation fin set in the case of other electronic devices, and also There is no need to install a water cooling plate at the air outlet of the cabinet with a plurality of electronic devices, thereby preventing the problem of lowering the cooling efficiency of the cabinet caused by the maintenance of a single electronic device.

In addition, since the heat dissipation fin group protrudes from the side of the liquid cooling plate or the condensing plate close to the bottom plate and extends to the bottom plate to elevate the liquid cooling plate or the condensing plate, it can promote the heat dissipation fluid in the condensation space to flow back to the evaporator , thereby improving the heat exchange efficiency between the cooling fluid and the cooling liquid. In addition, the first flow pipe and the second flow pipe do not need to extend to opposite sides of the side plate respectively in order to promote the cooling fluid in the condensation space to flow back to the evaporator, thereby reducing the structural complexity of the first flow pipe and the second flow pipe . In addition, with the simplification of the structures of the first flow tube and the second flow tube, these heat-conducting plates can have similar structures and be manufactured with the same mold, thereby reducing the manufacturing cost of the condenser.

In an embodiment of the present invention, the server of the present invention can be used for artificial intelligence (AI) computing, edge computing (edge computing), and can also be used as a 5G server, a cloud server or a car networking server use.

Although the present invention is disclosed above by the aforementioned embodiments, it is not intended to limit the present invention. Anyone who is familiar with similar techniques can make some changes and modifications without departing from the spirit and scope of the present invention. Therefore, this The scope of patent protection of the invention shall be determined by the scope of the patent application attached to this specification.

10, 10b: Electronic device

100, 100b: Shell

101, 101a, 101b, 101c: Bottom plate

1010, 1010b: Peripheral

102, 102b: side panels

103, 103b: Separator

1030: Groove

200, 200b: heat source

300, 300b: cooling components

301, 301b: Evaporator

302, 302a: condenser

3020: The first thermal plate

3021: Second thermal plate

3022, 3022a: The third thermal conductive plate

3023: Fourth thermal plate

3024: Connecting Tube

3025: First convex hull

30250: Groove

3026: Second convex hull

30260: Groove

3027, 3032b: External surface

3028: Condensation space

3029, 306, 3033b: Liquid-cooled spaces

303, 303a, 305b, 305c: heat dissipation fin group

304: First Flow Tube

3040: End

305: Second flow tube

3050: End

20, 20b: External heat sink

H1, H2, H3, H4: height

A1, A2: hot air

302b: Piping

3020b: Evaporation section

3021b: First connecting segment

3022b: Second connecting segment

3023b: Condensing Section

3024b: First Tube Section

3025b: Second Tube Section

3026b: Connecting Tubes

3027b: Bend

303b, 303c: Liquid cold plate

304b: Catheter

F: extension direction

FIG. 1 is a perspective view of an external heat sink and an electronic device according to a first embodiment of the present invention. FIG. 2 is an exploded view of the electronic device and the external heat sink in FIG. 1 . FIG. 3 is a schematic side sectional view of the electronic device in FIG. 1 . 4 is a schematic side sectional view of an electronic device according to a second embodiment of the present invention. 5 is a perspective view of an external heat sink and an electronic device according to a third embodiment of the present invention. FIG. 6 is an exploded view of the electronic device and the external heat sink in FIG. 5 . FIG. 7 is a top cross-sectional view of the electronic device in FIG. 5 . FIG. 8 is a schematic side sectional view of the electronic device in FIG. 5 . 9 is a schematic side sectional view of an electronic device according to a fourth embodiment of the present invention.

101: Bottom plate

102: Side panels

103: Separator

1030: Groove

302: Condenser

3020: The first thermal plate

3021: Second thermal plate

3022: The third heat conduction plate

3023: Fourth thermal plate

3024: Connecting Tube

3025: First convex hull

30250: Groove

3026: Second convex hull

30260: Groove

3027: External Surface

3028: Condensation space

3029: The first liquid cooling space

306: Second liquid cooling space

303: cooling fin group

304: First Flow Tube

3040: End

305: Second flow tube

3050: End

H1, H2: height

A1: hot air

Claims (6)

An electronic device for connecting to an external heat sink, the electronic device comprising: a casing, wherein the casing comprises a bottom plate and a side plate, the side plate is standing on the periphery of the bottom plate; a heat source is arranged on the casing the bottom plate; and a heat dissipation component, including: an evaporator, thermally in contact with the heat source; a condenser, with an outer surface, a condensation space and a liquid cooling space, the outer surface facing away from the condensation space and the liquid Cold space, the condensation space and the liquid cooling space are not communicated with each other, the condensation space is communicated with the evaporator, the liquid cooling space is used to connect to the external heat sink; and a heat dissipation fin set, thermally in contact with the condenser And along the direction away from the condensation space or the liquid cooling space, it protrudes from the outer surface of the condenser, and the heat dissipation fin group protrudes from the side of the condenser close to the bottom plate and extends to the bottom plate to make the The device and the base plate are spaced apart from each other by a distance. The electronic device of claim 1, wherein a height of a side of the condenser away from the bottom plate relative to the bottom plate is equal to a height of a side of the side plate away from the bottom plate relative to the bottom plate. The electronic device according to claim 1, wherein the heat dissipation component further comprises two first flow pipes and two second flow pipes, the evaporator is communicated with the condensation space through the two first flow pipes, and each of the first flow pipes is far away from the condensing space. one end of the evaporator from the The side of the condenser close to the bottom plate extends into the condenser and communicates with the condensation space. The liquid cooling space is used to communicate with the external heat dissipation device through the two second flow pipes, each of which is far away from the One end of the external heat sink extends into the condenser from the side of the condenser close to the bottom plate and communicates with the liquid cooling space. The electronic device as claimed in claim 1, wherein the casing further comprises a partition, the partition stands on the bottom plate and is connected to opposite sides of the side plate, and the partition is located between the heat source and the condenser , the separator has two grooves, the two grooves are recessed from the side of the separator away from the bottom plate, and the two first flow pipes are respectively located in the two grooves. An electronic device for connecting to an external heat sink, the electronic device comprising: a casing, wherein the casing comprises a bottom plate and a side plate, the side plate is standing on the periphery of the bottom plate; a heat source is arranged on the casing the bottom plate; and a heat dissipation component, comprising: an evaporator, thermally in contact with the heat source; a pipeline, including an evaporation section and a condensation section, the evaporation section communicates with the condensation section and thermally contacts the evaporator; A liquid cooling plate is disposed on the casing and separated from the heat source. The liquid cooling plate has an outer surface and a liquid cooling space, the outer surface faces away from the liquid cooling space, and the liquid cooling space is used for connecting to the liquid cooling space. an external heat sink, the condensation section of the pipeline is located in the liquid cooling space; and A set of radiating fins, thermally contacting the liquid cooling plate and protruding from the outer surface of the liquid cooling plate in a direction away from the liquid cooling space, the radiating fin set protruding from the side of the condenser close to the bottom plate out and extend to the bottom plate so that the liquid cooling plate and the bottom plate are spaced apart from each other by a distance. The electronic device of claim 5, wherein a height of a side of the liquid-cooling plate away from the base plate relative to the base plate is equal to a height of a side of the side plate away from the base plate relative to the base plate.

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