TWI765318B - Insert-molded product and insert-molded product manufacturing method - Google Patents

Abstract

The insert-molded product 1 of the present invention includes a metal plate 3 for a lead frame provided with a through-space 2 in which the semiconductor chip 51 is disposed, and a resin member 4 having outer resin portions 4a, 4b along the through-holes 4a and 4b. At least a part of the periphery of the outer side of the space 2 is disposed on both sides of the metal plate 3, respectively, and the through-space 2 has a plurality of notches 5 extending from the through-space 2 toward the outer side to between the outer resin parts 4a, 4b on both sides, The outer resin portions 4a, 4b on both sides are connected to each other by a resin portion 4c located in the notch portion 5, and injection marks 6 are provided at each position of the notch portion 5 at at least two places on the outer resin portions 4a, 4b.

Description

Insert-molded product and insert-molded product manufacturing method

The present invention relates to an insert-molded product including a metal plate for a lead frame provided with a through-space for arranging a semiconductor chip, and a resin member having an outer resin portion, and a method for manufacturing the insert-molded product, and in particular, proposes an insert-molded product that can contribute to improving In the technique of reliability of the insert-molded product, the outer resin portion is arranged along at least a part of the periphery of the outer side of the penetration space.

Such an insert-molded product can be used, for example, to package ICs, LSIs, or other semiconductors or electronic components, and the metal plate on which the semiconductor chip is mounted functions as a lead frame for connecting the semiconductor chip and external wiring (for example, refer to Patent Document 1). ).

To manufacture such an insert-molded product, a metal plate formed into a predetermined shape by press working, etching, or the like is placed in an injection mold. Next, the resin material is injected and injected into the cavity in which the metal plate is arranged in the injection mold, and the resin material is cured there. Then, it is taken out from the injection molding die to obtain an insert-molded product as a composite part in which a resin member and a metal plate are integrated. [Prior Art Literature] [Patent Literature]

Patent Document 1: Japanese Patent No. 3952084

[Problems to be Solved by Invention]

However, as in the above-mentioned insert-molded product, the resin member and the metal plate need to be tightly adhered depending on the application and the like. However, there is a problem that the required adhesiveness cannot be sufficiently ensured due to the shape of the resin member which is in close contact with the metal plate.

The present invention has been made to solve such a problem, and an object of the present invention is to provide an insert-molded product which has a resin member of a specific shape and can improve the adhesion between the resin member and a metal plate, and a manufacturing method of the insert-molded product. [Technical means to solve problems]

The insert molding product of the present invention includes a metal plate for a lead frame provided with a through space in which a semiconductor chip is arranged, and a resin member having an outer resin portion, the outer resin portion being arranged on at least a part of the periphery of the outer side of the through space, respectively. On both sides of the metal plate, the through-space has a plurality of notches extending from the through-space toward the outside to between the outer resin parts of the two sides, and the outer resin parts of the two sides are connected to each other by the resin parts located in the notches, at The outer resin portion has at least two positions of the notch portion, and is provided with injection marks.

In the insert-molded product of the present invention, it is preferable that one of the front and back surfaces of the metal plate and the outer surface of the outer resin portion on the side of the one side are provided with ejection pin marks. In this case, it is preferable to arrange the outer resin portion of the resin member on the surface side of the metal plate so that the inner edge portion of the metal plate around the through space is exposed, and the ejection pin trace exists in the The inner edge of the metal plate is demarcated by the notch on each surface of the plurality of metal segments.

In addition, in the insert-molded article of the present invention, the resin member may contain a liquid crystalline polyester resin. Moreover, in the insert molding of this invention, it is preferable that the density of the said resin member is 1.50 g/cm< ³ > or more. In addition, in the insert molding of the present invention, it is preferable that the volume of the resin member is 0.02 cm ³ to 0.5 cm ³ per the injection mark.

The method of manufacturing an insert-molded product of the present invention is a method of manufacturing an insert-molded product including a metal plate for a lead frame provided with a through space for disposing a semiconductor chip, and a resin member having an outer resin portion. , the outer resin portion is respectively arranged on both sides of the metal plate along at least a part of the periphery of the outside of the through space, In the manufacturing method, the metal plate is arranged in an injection molding die, the metal plate is provided with a plurality of notches extending from the through space toward the outside to the outer resin portions on both sides, and in the injection molding die, from The resin material is injected from gates disposed at at least two positions of the metal plate where the notch portions are provided.

In the method of manufacturing an insert-molded product of the present invention, preferably, after molding the resin member in the injection molding die, each ejector pin is pressed against one of the front and back surfaces of the metal plate and the one surface. the outer surface of the outer resin portion, and the insert-molded product is taken out from the injection mold. In this case, it is preferable to manufacture an insert-molded product in which the resin member outside the resin member is disposed on the surface side of the metal plate so that the inner edge of the metal plate around the through-space is exposed Part) of the method, each ejector pin is pressed against each surface of a plurality of metal sections of the inner edge of the metal plate that are demarcated by the notch.

In addition, in the manufacturing method of the insert molding of this invention, the said resin material containing a liquid crystalline polyester resin may be used. In addition, in the method for manufacturing an insert molding product of the present invention, it is preferable that, during molding of the resin member, each injection port injects 0.02 cm ³ to 0.5 cm ³ of the resin material. [Effect of invention]

In the insert-molded product of the present invention, injection marks are provided at each position where the notch portion exists at at least two places in the outer resin portion, and during injection molding, the resin material injected from the injection port passes through the notch portion to prevent Good fluidity flows almost uniformly to both sides of the metal plate, and as a result, outer resin portions are formed on both sides of the metal plate, respectively. Thereby, the adhesiveness of a metal plate and the resin member containing this outer resin part on each of both surfaces can be improved.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. The insert-molded product 1 illustrated in FIG. 1 includes a metal plate 3 having a predetermined planar outline shape such as a rectangle, and a resin member 4 closely arranged on the metal plate 3. (front and back directions on the paper) through space 2. In addition, the through-space 2 provided in the metal plate 3 has a substantially rectangular shape in a plan view, but as described later, it can be formed as Various shapes such as squares or other polygons or circles.

Here, the resin member 4 has outer resin portions 4a and 4b arranged along at least a part of the outer periphery of the through space 2 on both surfaces of the metal plate 3 as shown in plan views and bottom views, respectively, in FIGS. 1 and 2 .

More specifically, in this embodiment, the outer resin portions 4a and 4b constituting most of the resin member 4 are respectively arranged on the front Sf side and the back Sb side of the metal plate 3, both on the front Sf side and the back surface. Each on the Sb side is in the shape of a hollow rectangular frame in plan view surrounding the entire circumference of the through space 2 on the outer side of the through space 2 . However, although illustration is omitted, the outer resin part may have a flat shape other than a rectangle, and other parts may be interrupted and not frame-shaped. The outer resin parts 4 a and 4 b may be arranged along at least a part of the outer periphery of the through space 2 .

Here, as shown in FIG. 3 , a plurality of notches 5 are formed in the metal plate 3 , and the notches 5 are opened, for example, in the through-space 2 located in the substantially central region in plan view, and extend from the through-space 2 toward the outside. In the embodiment shown in the figure, on each outer side of the rectangular metal plate 3 in the longitudinal direction (left-right direction in the figure), there are formed connecting to the through-space 2 and extending toward the outer side through the arrangement of the outer resin portions 4a and 4b. A widened rectangular notch 5 and a polygonal notch 5 having a larger area than the rectangular notch 5 are formed at the center of the longitudinal direction of the metal plate 3 on each outer side in the width direction (up and down direction). There are six notches 5 in total, which are connected to the through-space 2 and extend outwardly and widen into a slightly elongated rectangle. However, the formation location, number, and shape of the notch portions can be appropriately determined. In addition, in this example, the said notch part 5 is formed in the plate|board thickness direction of the metal plate 3, and the metal plate 3 has substantially the same shape on the surface Sf side and the back surface Sb side.

As shown in FIG. 4, the insert molding product 1 has a semiconductor wafer 51 disposed inside the through space 2 of the metal plate 3, and an inner edge portion 3a exposed to the inside from the frame-shaped outer resin portion 4a on the surface Sf side. The metal plate 3 is connected by the semiconductor chip 51 and the bonding wire 52 . Thereby, the metal plate 3 of the insert molded product 1 can function as a lead frame for connecting the semiconductor chip 51 and external wirings (not shown). In addition, the details of the inner edge portion 3a of the metal plate 3 will be described later.

In addition, the above-mentioned insert-molded product 1 can be produced by insert-molding in which the metal plate 3 is placed in an injection-molding mold (not shown) and injection-molded. Specifically, the metal plate 3 is placed in an injection molding die having a cavity corresponding to the shape of the resin member 4, and in this state, from the injection port provided at a predetermined position of the injection molding die, toward the cavity Injection resin material. At this time, the resin material flows through the flow paths corresponding to the shapes of the outer resin portions 4a and 4b in the cavity from the injection port, and the cavity is filled. Then, the resin material is solidified by cooling or the like to obtain an insert-molded product 1 .

Here, the notch portion 5 of the metal plate 3 is located between the outer resin portion 4a on the surface Sf side and the outer resin portion 4b on the back side Sb side because a part of the notch portion 5 extends at least between them, so the notch portion 5 is also in the above-mentioned It is filled with resin material flowing in the cavity during injection molding. As a result, in the insert-molded product 1, the outer resin portion 4a on the surface Sf side and the outer resin portion 4b on the rear surface Sb side are connected by the resin portion 4c which is located inside the cutout 5 and is filled and cured there. In this way, at least a part of the cutout 5 provided in the metal plate 3 is filled with a resin material, and the resin portion 4c located in the cutout 5 is connected to the outer resin portion 4a, 4b, whereby the adhesion between the metal plate 3 and the resin member 4 can be greatly improved.

On the other hand, since the notch portion 5 is formed by partially removing the metal plate 3, the portion where each of the outer resin portions 4a and 4b passes through the notch portion 5 of the metal plate 3 is inevitably not supported by the metal plate 3 from behind. That is, at the site where the notch part 5 is provided, the metal plate 3 does not exist between the outer resin parts 4a, 4b. Therefore, the strength of the outer resin portions 4a and 4b is lowered at the portion where the notch portion 5 is provided.

In this case, according to the position of the injection port provided in the injection mold described above, it is assumed that the weld line that will be generated when the resin material flowing in the cavity is formed in the part where the notch part is provided in the outer resin part is formed. In this case, not only the strength of the outer resin part will be reduced due to the existence of the notch, but also cracks are likely to be generated in this part of the outer resin part starting from the weld line, which will reduce the reliability of the insert molded product.

In order to cope with this problem, in the injection molding die, the injection port for injecting the resin material is arranged at each position where the notches 5 are provided in at least two places of the metal plate 3 . In this way, the resin material is ejected from the injection ports arranged at the positions where the notches 5 are provided at at least two places on the metal plate 3 and flows into the cavity, so that the resin material will be different from the positions where the notches 5 are provided. location confluence. Then, in the insert-molded product 1 thus produced, the above-mentioned weld line due to the fusion of the resin materials is formed in the outer resin portions 4a, 4b at positions deviated from the positions where the notch portion 5 is present (that is, the notch portion 5 does not exist). position), and injection marks 6 are provided at each position where there are at least two notches 5 . Thereby, even if the insert-molded product 1 is bent and deformed, cracks starting from the weld line are less likely to occur, so that the bending characteristics of the insert-molded product 1 are improved.

Moreover, in this case, in the cavity of the injection molding die, by injecting the resin material from the injection ports disposed at the positions where the notches 5 are provided at at least two places of the metal plate 3, the resin material will pass through the notches. The parts 5 flow substantially uniformly to the surface Sf side and the back surface Sb side of the metal plate 3 with good fluidity, so that the adhesion between the metal plate 3 and the outer resin parts 4a and 4b can be improved. In other words, when the injection port is disposed at a position different from the notch portion 5 and the resin material is injected therefrom, the flow of the resin material flowing through the notch portion is delayed on either the front side or the back side of the metal plate. As the temperature of the resin material is gradually lowered on the side, curing starts in the middle, and as a result, the adhesion between the metal plate and the outer resin portion may be lowered.

In addition, the injection mark 6 is formed on the outer surface of the outer resin portion 4a, 4b corresponding to the position where the injection port is provided with the injection molding die in the following shape: the outer surface parallel to the metal plate 3 A shape such as a concave shape recessed from the outer surface or a convex shape protruding from the outer surface is formed by tearing off; this can be easily confirmed by visual inspection. Also, although the welding line is omitted from the drawing, it is formed in a linear shape such as a straight line or a curve at the position where the resin materials injected from the two or more injection ports meet, and the outer resin portion can also be visually observed. 4a, 4b outer surface.

Here, the injection port of the injection mold is a position where the outer resin parts 4a and 4b are to be formed, and may be arranged at at least two positions among a plurality of positions where the notch portions 5 are provided. In the example shown in the figure, since the injection port is arranged in each of the notch portions 5 that are larger on the outer side in the longitudinal direction of the metal plate 3 and each notch portion 5 at the central position in the longitudinal direction of the metal plate 3 and the through space 2 , respectively. There are four adjacent and narrowed positions in total, which are manufactured with such an injection mold, so that injection marks 6 are provided at each of these positions. However, the disposition position of the injection port and the formation position of the injection mark caused therefrom are the positions where the notch portion exists, and can be appropriately determined so as not to form a weld line in the notch portion. If the injection mark 6 overlaps with the position where the notch part 5 exists even if it is slightly, it is regarded as being provided in the position where the notch part exists.

In this embodiment, as a result of arranging the injection port on the surface Sf side of the metal plate 3, as shown in FIGS. 1 and 2, respectively, as shown in FIGS. On the other hand, the injection marks 6 do not exist on the outer surface of the outer resin portion 4b on the back surface Sb side. In addition, in FIGS. 1, 2, 4 and FIGS. 5-7 mentioned later, although the injection port is provided in the surface Sf side of a metal plate, a injection port may be arrange|positioned in the back surface Sb side of a metal plate. When the sprue is arranged on the back Sb side, the insert-molded product has an excellent appearance on the front Sf side. In addition, in this embodiment, the width of the outer resin portion 4a is narrower than that of the outer resin portion 4b. Therefore, when a flat target is attached to the outer resin portions 4a and 4b or the like, if the injection port is provided on the side of the outer resin portion 4a (surface Sf), the flat bonding area in the vicinity of the injection port will be reduced. If it becomes too small, there is a possibility that the adhesion strength between the target object and the outer resin portion 4a cannot be ensured. Therefore, it is preferable to arrange|position the injection port on the resin part side (in the illustration, the back surface Sb side) of the outer side of the width|variety.

The volume of the resin member 4 is preferably 0.02 cm ³ to 0.5 cm ³ per injection mark 6 . In other words, when it is suitable for injection molding, 0.02cm ³ to 0.5cm ³ of resin material is injected from each injection port. If the amount of resin material in each injection port is reduced, the number of injection ports will need to be increased. If the number of sprues is too large, a large number of welds will be formed, and besides cracks are likely to occur, the degree of adhesion between the metal plate 3 and the resin member 4 will be reduced from the weld as a starting point. On the other hand, if the number of sprues is too small, the filling rate may decrease due to the longer travel distance of the resin, and the density of the resin member 4 may decrease between the sprues. The volume of the resin member 4 for each injection mark 6 is calculated by dividing the volume of the entire resin member 4 by the number of injection marks 6 . In addition, the thickness of the metal plate 3 is generally about 0.10 mm to 0.30 mm. The metal plate 3 may contain, for example, a copper-based alloy, an iron-based alloy, or an aluminum-based alloy.

Here, at the outermost sides in the longitudinal direction of the metal plate 3, a perfectly circular hole 9 is provided at the center in the width direction, penetrating the metal plate 3, but these holes 9 are larger than the outer resin portion. 4a and 4b are located further outside, regardless of the adhesion between the metal plate 3 and the resin member 4 .

In order to improve the adhesiveness of the resin member 4 and the metal plate 3, it is preferable that the density of the resin member 4 is 1.50 g/cm< ³ > or more. Especially at the interface of the metal plate 3, the density of the resin member 4 has a great influence on the adhesiveness in many cases, and the adhesiveness tends to be improved as the density is higher. If the density of the resin member 4 is less than 1.50 g/cm ³ , the helium leak measured in accordance with the helium leak test specified in JIS Z2331 will be 1.0×10 ⁻⁶ pa·m ³ /sec or more, and there will be no close contact. Danger of bad. From this viewpoint, the density of the resin member 4 is more preferably 1.60 g/cm ³ or more. The density of the resin member 4 was calculated by measuring the weight of the insert-molded product 1, dissolving the resin member 4 using pentafluorophenol (PFP) or a mixed solution of PFP and chloroform as a solvent, and measuring the weight of the metal plate 3, Divide the difference by the volume of the resin member 4 .

The insert-molded product 11 of the embodiment shown in FIG. 5 has substantially the same configuration as that of the previously described embodiment except that the ejection pins 20a to 20c having substantially circular shapes are provided. The ejection pin marks 20a to 20c are formed by pressing the ejector pins that operate when they are taken out from the injection mold. Here, the ejection pin traces 20 a to 20 c are all present on the surface Sf side of the metal plate 13 , but may also be provided on the back surface Sb side of the metal plate 13 .

Especially in the insert molded product 11, it is important that not only the ejection pin marks 20a, 20c on the surface Sf of the metal plate 13, but also the outer surface of the outer resin portion 14a arranged on the same side as the surface Sf is formed. The pin mark 20b is ejected. Also, the outer surface of the outer resin portion 14a has the ejection pin marks 20b, which means that the outer surface of the outer resin portion 14a also presses the ejection pins when taken out from the injection molding die for insert molding, whereby the metal plate 13 Adhesion with the resin member 14 is greatly improved. In other words, when the ejector pin is pressed only on the surface or the back of the metal plate, the time point when the resin member starts to separate from the injection mold is longer than the time when the metal plate starts to separate from the injection mold when it is inserted into the molded product. As a result, a force in the direction of peeling from the metal plate acts on the resin member, and the adhesiveness between the resin member and the metal plate may be deteriorated at this time.

The ejection pin marks 20b on the outer surface of the outer resin portion 14a are preferably provided in plural along the outer resin portion 14a in a frame shape, for example, as in this embodiment. Thereby, when the insert-molded product 11 is taken out from the injection molding die, the force can be equally applied to the outer resin portion 14a arranged along the outer periphery of the through space 12 by the plurality of ejector pins, which can be more effective. A decrease in the adhesion between the metal plate 13 and the resin member 14 is effectively suppressed.

The ejection pin marks 20a to 20c are formed on the surface Sf or back Sb of the metal plate 13 and the outer surface of the outer resin portion 14a or 14b in a concave shape slightly recessed from the surface, and the presence or absence thereof can be checked visually.

In the insert-molded product 11 shown in the figure, like the insert-molded product 1 described above, the outer resin portion 14b of the back surface Sb of the metal plate 13 is arranged to cover the inner edge of the metal plate 13 around the through space 12 . 13a, on the other hand, the outer resin portion 14a on the surface Sf side is arranged to expose the inner edge portion 13a of the metal plate 13, as shown in the enlarged view of FIG. 6 . Further, the inner edge portion 13a of the metal plate 13 exposed to the inner side of the outer resin portion 14a on the surface Sf side is, as shown in FIG. It is divided into a plurality of metal segments 13c and 13d.

Among these metal segments 13c and 13d, the metal segment 13c is located at the center in the longitudinal direction of the metal plate 13, and has a bonding wire 52 attached to the aforementioned semiconductor chip 51, which functions as a so-called main lead wire. The ends of the functional rectangular sheet metal sections. In addition, the metal segment 13d corresponds to the front end portion of the bent portion 13b of the metal plate 13 extending inside the outer resin portion 14a.

In such an insert-molded product 11, as shown in FIG. 6, each of the plurality of metal segments 13c and 13d suitably partitioned by the notch portion 15 is provided with an ejector pin 20a. The reason is that by making the ejector pins act on the metal segments 13c and 13d, the speed at which they are separated from the injection mold can be approximately the same, and the metal plate 13 can be released from the injection mold without being twisted. The forming die takes out the insert-molded product 11 . In addition, as shown in the figure, each metal section 13c at the end of the main lead wire may be provided with a plurality of, for example, two ejector pin traces 20a as required. The metal plate portion outside the resin portion 14a, which is the main lead-out wire, has a larger area, so as shown in the figure, the ejection pin 20c with a relatively larger diameter can be provided.

The resin members 4 and 14 of the above-mentioned insert-molded products 1 and 11 may contain materials selected from the group consisting of polyacetal resin, polyethylene terephthalate resin, polybutylene terephthalate resin, polyphenylene sulfide resin, polystyrene At least one of the group consisting of amide resin, liquid crystalline polyester resin, polyimide resin, syndiotactic polystyrene resin and polycyclohexane dimethylene terephthalate resin. In particular, in the case where the resin members 4 and 14 contain liquid crystalline polyester resin (LCP) in order to satisfy the prescribed required performance, it is thought that the problem of the adhesion between the resin members 4 and 14 and the metal plates 3 and 13 will appear. , so it is advisable to implement the adhesion improvement measures as described above. [Example]

Next, since the insert-molded article of the present invention has been trial-produced and its effect has been confirmed, the following description will be given. However, the description here is for illustration only, and is not intended to be limited thereto.

Inventive Examples 1 to 4 and Comparative Examples 1 and 2 in which the density of the resin member in the insert molding shown in Figs. 1 to 3, the number of nozzles, and the like were changed were produced. Inventive Example 1 has the same characteristics as in FIG. 1 except that the injection port is arranged on the back Sb side of the metal plate in FIG. 1 instead of the front Sf side, and the injection mark is formed on the outer resin portion on the back Sb side. composition. Inventive Example 2 has the same configuration as Inventive Example 1 except that the density of the resin member is changed. Inventive Example 3 has the same structure as Inventive Example 1, except that the density of the resin member is changed, the number of injection ports is six, and the positions of the injection ports are as shown in FIG. 7 . . In Inventive Example 4, the density of the resin member was changed, the number of injection ports was three, and the injection ports were located at the two points on the left and right sides of FIG. 1 on the back Sb side of the metal plate and the bottom Except for one point (that is, there is no injection mark at one point on the upper side of FIG. 1 ), the structure is the same as that of the invention example 1.

Comparative Example 1 has the same configuration as Inventive Example 1 except that the filling amount of the resin material is changed so that the density of the resin member is different. In Comparative Example 2, the density of the resin component was changed, and the number of injection ports was two, so that the injection ports were located at the two points on the left and right sides of Figure 1 on the Sb side of the backside of the metal plate (that is, no Except for the injection marks at two points on the upper side and the lower side in Fig. 1 , the structure is the same as that of the invention example 1.

For each of these Invention Examples 1 to 4 and Comparative Examples 1 and 2, a helium leak test specified in JIS Z2331 as an index of the adhesion between a metal plate and a resin member was performed, and helium leak (He leak) was confirmed. The results are shown in Table 1.

[Table 1]

In Invention Examples 1 to 4, since the density of the resin member was relatively high, the value of He leakage was small, and the adhesion between the metal plate and the resin member was excellent. On the other hand, in Comparative Examples 1 and 2, since the density of the resin member was low, the value of He leakage became large. Thereby, Comparative Examples 1 and 2 can be judged as poor adhesion. Moreover, especially, since the number of nozzles of the invention example 3 is larger than that of the invention example 1, the density of the resin member is increased, and the adhesiveness is further improved.

1, 11: Insert molding 2, 12: Through the space 3, 13: metal plate 3a, 13a: inner edge 3b, 13b: Bending part 13c, 13d: Metal section 4, 14: Resin components 4a, 4b, 14a, 14b: outer resin part 4c, 14c: Resin part 5, 15: Notch part 6, 16: injection mark 9, 19: Hole 20a～20c: Ejection pin marks 51: Semiconductor wafer 52: Bonding wire Sf: Surface Sb: Back

1 is a plan view showing an insert-molded product according to an embodiment of the present invention. [Fig. 2] is a bottom view of the insert-molded product of Fig. 1. [Fig. [ Fig. 3] Fig. 3 is a plan view showing the metal plate of the insert-molded product of Fig. 1 after removing the resin member. [ Fig. 4] Fig. 4 is a plan view showing the insert-molded product of Fig. 1 in a state where a semiconductor wafer is mounted. [ Fig. 5] Fig. 5 is a plan view showing an insert-molded product according to another embodiment. [ Fig. 6] Fig. 6 is an enlarged plan view showing a main part of the insert-molded product of Fig. 5 . 7] It is a top view which shows the injection mark of Inventive Example 3. [FIG.

Claims (11)

An insert-molded product comprising a metal plate for a lead frame provided with a through space for disposing a semiconductor chip, and a resin member having an outer resin portion, the outer resin portion being respectively arranged on the metal along at least a part of the periphery of the outer side of the through space On both sides of the board, the through space has a plurality of notch parts extending from the through space toward the outside to the outer resin parts of the two sides, and the outer resin parts of the two sides are connected with each other by the resin part located in the notch part, on the outer side The resin portion has at least two positions where the notch portion is present, and injection marks are provided, and a weld line is formed at the position where the notch portion does not exist on the outer resin portion. The insert molding product of claim 1 is formed by providing ejection pin marks on one of the front and back surfaces of the metal plate and the outer surface of the outer resin portion on the side of the one surface. The insert-molded product of claim 2, wherein the outer resin portion of the resin member is disposed on the surface side of the metal plate such that the inner edge portion of the metal plate around the through space is exposed, the ejection pin Each surface of a plurality of metal segments existing in the inner edge portion of the metal plate is demarcated by the notch portion. The insert-molded article according to any one of claims 1 to 3, wherein the resin member contains a liquid crystalline polyester resin. The insert-molded article according to any one of claims 1 to 3, wherein the resin member has a density of 1.50 g/cm ³ or more. The insert molding product according to any one of claims 1 to 3, wherein the volume of the resin member is 0.02 cm ³ to 0.5 cm ³ for each of the injection marks. A method of manufacturing an insert-molded product comprising a metal plate for a lead frame provided with a through-space for disposing a semiconductor chip, and a resin member having an outer resin portion along at least a periphery of the outer periphery of the through-space. A part is respectively arranged on the metal plate Both sides; the metal plate is arranged in the injection molding die, the metal plate is provided with a plurality of notches extending from the through space toward the outside, and the metal plate is arranged in at least two places in the injection molding die. The gate of each position of the notch part injects resin material, and the outer resin part connected by the resin part located in the notch part is respectively formed on both sides of the metal plate, and the notch does not exist in the outer resin part The position of the part forms a weld line. The method for producing an insert-molded product according to claim 7, wherein, after molding the resin member in the injection molding die, each ejector pin is pressed against one of the front and back surfaces of the metal plate and the one surface side the outer surface of the outer resin portion, and the insert-molded product is taken out from the injection mold. The method for manufacturing an insert-molded product as claimed in claim 8, wherein, when manufacturing the insert-molded product, each ejector pin is pressed against each surface of a plurality of metal sections demarcated by the notch at the inner edge of the metal plate, The insert-molded product is provided with the resin member outer resin portion on the surface side of the metal plate such that the inner edge portion of the metal plate around the through space is exposed. The method for producing an insert-molded article according to any one of claims 7 to 9, which uses the resin material containing a liquid crystalline polyester resin. The method for manufacturing an insert-molded product according to any one of claims 7 to 9, wherein, during the molding of the resin component, each of the injection ports ejects 0.02 cm ³ to 0.5 cm ³ of the resin material.

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