TWI764351B - Thermal sensor - Google Patents
Thermal sensorInfo
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- TWI764351B TWI764351B TW109138127A TW109138127A TWI764351B TW I764351 B TWI764351 B TW I764351B TW 109138127 A TW109138127 A TW 109138127A TW 109138127 A TW109138127 A TW 109138127A TW I764351 B TWI764351 B TW I764351B
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K15/00—Testing or calibrating of thermometers
- G01K15/005—Calibration
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/80—Calibration
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/0003—Radiation pyrometry, e.g. infrared or optical thermometry for sensing the radiant heat transfer of samples, e.g. emittance meter
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- G—PHYSICS
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- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/02—Constructional details
- G01J5/06—Arrangements for eliminating effects of disturbing radiation; Arrangements for compensating changes in sensitivity
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- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/10—Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors
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- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/10—Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors
- G01J5/12—Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors using thermoelectric elements, e.g. thermocouples
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J2005/0077—Imaging
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- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/02—Constructional details
- G01J5/06—Arrangements for eliminating effects of disturbing radiation; Arrangements for compensating changes in sensitivity
- G01J2005/065—Arrangements for eliminating effects of disturbing radiation; Arrangements for compensating changes in sensitivity by shielding
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/02—Constructional details
- G01J5/06—Arrangements for eliminating effects of disturbing radiation; Arrangements for compensating changes in sensitivity
- G01J2005/066—Differential arrangement, i.e. sensitive/not sensitive
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/10—Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors
- G01J2005/106—Arrays
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/10—Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors
- G01J5/12—Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors using thermoelectric elements, e.g. thermocouples
- G01J2005/123—Thermoelectric array
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Abstract
Description
本發明是有關於一種感測器,且特別是有關於一種熱感測器。 The present invention relates to a sensor, and particularly to a thermal sensor.
熱感測器通常可針對目標區域或目標物所發出的熱輻射進行感測,可據此產生對應的熱感測結果或熱影像。但熱感測器除了會接收到目標區域或目標物所發出的熱輻射之外,往往也會接收到其他介質透過熱傳導所提供的熱能,因而造成感測結果的誤差或是熱影像中的不均勻。 The thermal sensor can generally sense the thermal radiation emitted by the target area or the target, and can generate corresponding thermal sensing results or thermal images accordingly. However, in addition to receiving the thermal radiation emitted by the target area or object, the thermal sensor often also receives thermal energy provided by other media through thermal conduction, resulting in errors in sensing results or inconsistencies in thermal images. evenly.
為了校正熱傳導所產生的誤差,傳統的熱感測器通常會控制快門(shutter)的開關來阻隔射入熱感測器的熱輻射,僅針對熱傳導進行感測以進行校正。但首先,快門的開關需要設置額外的控制電路來操控,其會造成成本上升。再者,快門關閉時會阻隔所有熱輻射,造成感測結果或熱影像中的訊息遺漏。最後,機械式的快門更容易受到損壞,造成熱感測器無法執行校正功能。因此,傳統技術的熱感測器實有改善的必要。 In order to correct the error caused by heat conduction, the conventional thermal sensor usually controls the opening and closing of a shutter to block the thermal radiation injected into the thermal sensor, and only senses the thermal conduction for correction. But first, the opening and closing of the shutter needs to be controlled by an additional control circuit, which increases the cost. Furthermore, when the shutter is closed, all thermal radiation is blocked, resulting in missing information in sensing results or thermal images. Finally, mechanical shutters are more susceptible to damage, rendering the thermal sensor unable to perform its corrective function. Therefore, it is necessary to improve the thermal sensor of the conventional technology.
本發明提供一種熱感測器,其透過熱感測器中未遮蔽熱感測胞及遮蔽熱感測胞的感測結果來進行感測結果的校正。 The present invention provides a thermal sensor, which calibrates the sensing results through the sensing results of the unshielded thermal sensing cells and the shielded thermal sensing cells in the thermal sensor.
本發明的熱感測器包含熱感測陣列及校正電路。熱感測陣列包含多個熱感測胞。熱感測胞包含第一未遮蔽熱感測胞及第一遮蔽熱感測胞。第一未遮蔽熱感測胞獲得第一未遮蔽感測資訊。第一遮蔽熱感測胞相鄰於第一未遮蔽熱感測胞而設置,並獲得第一遮蔽感測資訊。校正電路耦接第一未遮蔽熱感測胞及第一遮蔽熱感測胞。校正電路依據第一遮蔽感測資訊,對相鄰的第一未遮蔽熱感測胞所獲得的第一未遮蔽感測資訊進行校正。 The thermal sensor of the present invention includes a thermal sensing array and a calibration circuit. The thermal sensing array includes a plurality of thermal sensing cells. The thermal sensing cells include a first unshielded thermal sensing cell and a first shielded thermal sensing cell. The first unshielded thermal sensing cell obtains first unshielded sensing information. The first shielded thermal sensing cells are disposed adjacent to the first unshielded thermal sensing cells, and obtain first shielded sensing information. The calibration circuit is coupled to the first unshielded thermal sensing cell and the first shielded thermal sensing cell. The calibration circuit calibrates the first unshielded sensing information obtained by the adjacent first unshielded thermal sensing cells according to the first shielded sensing information.
基於上述,熱感測器透過遮蔽熱感測胞所獲得的遮蔽感測資訊,來對遮蔽熱感測胞所相鄰的未遮蔽熱感測胞所獲得的未遮蔽感測資訊進行校正,以排除感測結果的誤差或不均勻等非理想因素。 Based on the above, the thermal sensor corrects the unshaded sensing information obtained by the unshaded thermal sensing cell adjacent to the shaded thermal sensing cell through the shaded sensing information obtained by the shaded thermal sensing cell, so as to Eliminate non-ideal factors such as errors or unevenness in the sensing results.
1、2:熱感測器 1, 2: Thermal sensor
10、10-1、10-2、10-3、10-4:熱感測陣列 10, 10-1, 10-2, 10-3, 10-4: Thermal Sensing Array
10m:遮蔽熱感測胞 10m: shielding thermal sensing cells
10u:未遮蔽熱感測胞 10u: Unshielded thermal sensing cell
11、21、21a、21b、21c:校正電路 11, 21, 21a, 21b, 21c: Correction circuit
12:鏡頭 12: Lens
23:運算電路 23: Operational circuit
210:類比減法器 210: Analog Subtractor
211、212:類比數位轉換器 211, 212: Analog-to-digital converters
213:數位減法器 213: Digit Subtractor
214:開關電路 214: switch circuit
CH:熱傳導 CH: heat conduction
RH:熱輻射 RH: heat radiation
圖1A為本發明實施例一熱感測器的示意圖。 FIG. 1A is a schematic diagram of a thermal sensor according to an embodiment of the present invention.
圖1B為圖1A所繪示的熱感測陣列的部分放大示意圖。 FIG. 1B is a partially enlarged schematic view of the thermal sensing array shown in FIG. 1A .
圖2A為本發明實施例一熱感測器的示意圖。 FIG. 2A is a schematic diagram of a thermal sensor according to an embodiment of the present invention.
圖2B為本發明實施例一校正電路的示意圖。 FIG. 2B is a schematic diagram of a calibration circuit according to an embodiment of the present invention.
圖2C為本發明實施例一校正電路的示意圖。 FIG. 2C is a schematic diagram of a calibration circuit according to an embodiment of the present invention.
圖2D為本發明實施例一校正電路的示意圖。 FIG. 2D is a schematic diagram of a calibration circuit according to an embodiment of the present invention.
圖3A~3D為本發明實施例多個熱感測陣列的示意圖。 3A-3D are schematic diagrams of a plurality of thermal sensing arrays according to embodiments of the present invention.
圖1A為本發明實施例一熱感測器1的示意圖。熱感測器1包含熱感測陣列10、校正電路11及鏡頭12。鏡頭12可接收來自目標物或目標區域所發出的熱輻射RH。熱感測陣列10可用來感測透過鏡頭12所傳入的熱輻射RH。熱感測陣列10包含多個熱感測胞,其中包含有未遮蔽熱感測胞10u及遮蔽熱感測胞10m。未遮蔽熱感測胞10u及遮蔽熱感測胞10m可進行感測,以分別獲得未遮蔽感測資訊及遮蔽感測資訊。校正電路11耦接未遮蔽熱感測胞10u及遮蔽熱感測胞10m,校正電路11可依據遮蔽感測資訊來校正未遮蔽感測資訊,進而產生目標區域或目標物的熱感測影像。
FIG. 1A is a schematic diagram of a
大致而言,在熱感測陣列10中,未遮蔽熱感測胞10u會相鄰於至少一個遮蔽熱感測胞10m。進一步,校正電路11可依據遮蔽熱感測胞10m所獲得的遮蔽感測資訊,對相鄰的未遮蔽熱感測胞10u所獲得的未遮蔽感測資訊進行校正。因此,熱感測器1所產生的熱感測影像中,熱感測影像的誤差或不均勻等非理想因素可較佳地被排除。
Generally speaking, in the
詳細而言,針對熱感測器1的整體操作,熱感測器1的鏡頭12可接收目標區域或目標物所發出的熱輻射RH,熱輻射RH
通過鏡頭12後可射入至熱感測陣列10。
In detail, for the overall operation of the
熱感測陣列10中具有多個熱感測胞,熱感測胞包含有未遮蔽熱感測胞10u及遮蔽熱感測胞10m。熱感測胞可針對熱輻射RH進行感測以獲得感測資訊,並據以產生出熱感測影像。在此實施例中,未遮蔽熱感測胞10u及遮蔽熱感測胞10m在行方向上及列方向上互相交錯設置,也就是說,未遮蔽熱感測胞10u在行方向跟列方向上都相鄰於遮蔽熱感測胞10m。但本發明不以此排列方式為限,只要未遮蔽熱感測胞10u相鄰於至少一個遮蔽熱感測胞10m即可。對於熱感測陣列10的感測操作而言,除了會透過熱輻射方式由鏡頭12接收到目標區域或目標物所傳遞的熱輻射RH之外,熱感測器1本身更會透過熱傳導或其他方式,接收到由空氣、感測器支撐材料、操作者或其他來源的熱傳導CH,而並非目標區域或目標物所提供的熱能,進而造成熱感測影像的誤差或不均勻(non-uniformity)。因此,熱感測陣列10中設置有未遮蔽熱感測胞10u及遮蔽熱感測胞10m。未遮蔽熱感測胞10u可感測到穿透鏡頭12所射入的熱輻射RH及熱傳導CH,並獲得未遮蔽感測資訊。遮蔽熱感測胞10m為被遮蔽的熱感測胞,其可感測到熱傳導CH,並獲得遮蔽感測資訊。在一實施例中,遮蔽熱感測胞10m可透過在未熱感測胞10u上設置或塗設熱遮蔽材料來實現,本發明對遮蔽熱感測胞10m的實現方式並不限制。
The
校正電路11接收未遮蔽感測資訊及遮蔽感測資訊後,校正電路11可依據遮蔽熱感測胞10m所感測的遮蔽感測資訊,來校
正該遮蔽熱感測胞10m相鄰的未遮蔽熱感測胞10u所感測的未遮蔽感測資訊,如此一來,熱感測影像中的誤差或不均勻可被有效地消除。
After the calibration circuit 11 receives the unshaded sensing information and the shading sensing information, the calibration circuit 11 can calibrate the shading sensing information sensed by the shading
在一實施例中,校正電路11將未遮蔽熱感測胞10u所感測的未遮蔽感測資訊,扣除該未遮蔽熱感測胞10u相鄰的遮蔽熱感測胞10m所感測的遮蔽感測資訊,以產生出經校正的未遮蔽感測資訊。舉例而言,請參考圖1B,圖1B為圖1A所繪示的熱感測陣列10的部分放大示意圖,校正電路11依據遮蔽感測資訊校正未遮蔽感測資訊的操作,可參考下方的公式(1)~(3)。
In one embodiment, the calibration circuit 11 deducts the unshielded sensing information sensed by the unshielded
v(m+1,n)=r(m+1,n)+c(m+1,n) (1) v(m+1,n)=r(m+1,n)+c(m+1,n) (1)
v(m,n)=c(m,n) (2) v(m,n)=c(m,n) (2)
r’(m+1,n)=v(m+1,n)-v(m,n)=r(m+1,n)+[c(m+1,n)-c(m,n)] (3)其中,在公式(1)中,v(m+1,n)是設置在位置(m+1,n)的未遮蔽熱感測胞10u所感測的未遮蔽感測資訊,其包含了r(m+1,n)的熱輻射資訊以及c(m+1,n)的熱傳導資訊。在公式(2)中,v(m,n)是設置在位置(m,n)的遮蔽熱感測胞10m所感測的遮蔽感測資訊,其僅包含了c(m,n)的熱傳導資訊。
r'(m+1,n)=v(m+1,n)-v(m,n)=r(m+1,n)+[c(m+1,n)-c(m,n )] (3) wherein, in formula (1), v(m+1,n) is the unshielded sensing information sensed by the unshielded
在公式(3)中,校正電路11在取得v(m,n)及v(m+1,n)之後,可將v(m+1,n)扣除v(m,n)來產生經校正的未遮蔽感測資訊r’(m+1,n)。具體而言,由於c(m+1,n)及c(m,n)兩者是由相鄰的未遮蔽熱感測胞10u及遮蔽熱感測胞10m所獲得的,校正電路11可
以把c(m,n)用來近似於c(m+1,n),v(m+1,n)在扣除c(m,n)後,其中的熱傳導資訊c(m+1,n)可被較佳地消去,使得經校正的未遮蔽感測資訊r’(m+1,n)中僅保留下熱輻射資訊。
In formula (3), after obtaining v(m,n) and v(m+1,n), the correction circuit 11 can deduct v(m,n) from v(m+1,n) to generate a corrected The unmasked sensing information r'(m+1,n). Specifically, since both c(m+1,n) and c(m,n) are obtained from the adjacent unshielded
另外,在一實施例中,校正電路11可依據遮蔽感測資訊的平均來校正未遮蔽感測資訊。舉例而言,請參考圖1B,圖1B為圖1A所繪示的熱感測陣列10的部分放大示意圖,接下將以圖1B中熱感測陣列10的排列以及下方的公式(4)、(5)來說明校正電路11的操作。
In addition, in one embodiment, the correction circuit 11 may correct the unmasked sensing information according to the average of the masked sensing information. For example, please refer to FIG. 1B , which is a partially enlarged schematic diagram of the
c’(m+1,n)=(v(m+1,n-1)+v(m,n)+v(m+2,n)+v(m+1,n+1))/4 (4) c'(m+1,n)=(v(m+1,n-1)+v(m,n)+v(m+2,n)+v(m+1,n+1))/ 4 (4)
r’(m+1,n)=v(m+1,n)-c’(m+1,n) (5)其中,在公式(4)中,v(m+1,n-1)、v(m,n)、v(m+2,n)、v(m+1,n+1)分別為位置(m+1,n-1)、(m,n)、(m+2,n)、(m+1,n+1)上的遮蔽熱感測胞10m所獲得的遮蔽感測資訊,其僅包含有熱傳導資訊,而c’(m+1,n)即為該些未遮蔽感測資訊的平均。進一步,在公式(5)中,校正電路11可將在(m+1,n)上的未遮蔽熱感測胞10u所獲得的未遮蔽感測資訊v(m+1,n)扣除掉相鄰遮蔽熱感測胞10m所獲得的未遮蔽感測資訊的平均c’(m+1,n),以獲得經校正的未遮蔽感測資訊r’(m+1,n)。
r'(m+1,n)=v(m+1,n)-c'(m+1,n) (5) Wherein, in formula (4), v(m+1,n-1) , v(m,n), v(m+2,n), v(m+1,n+1) are positions (m+1,n-1), (m,n), (m+2 ,n), (m+1,n+1) The shading sensing information obtained by the shading
換言之,校正電路11可取得相鄰於位置(m+1,n)的多個遮蔽感測資訊,校正電路11可以把該些遮蔽感測資訊的平均c’(m+1,n)用來近似於位置(m+1,n)的熱傳導資訊c(m+1,n),透過 扣除c’(m+1,n)來消去未遮蔽感測資訊中的熱傳導資訊,使得經校正的未遮蔽感測資訊r’(m+1,n)中僅保留下熱輻射資訊。 In other words, the calibration circuit 11 can obtain a plurality of occlusion sensing information adjacent to the position (m+1,n), and the calibration circuit 11 can use the average c'(m+1,n) of the occlusion sensing information to be used for The thermal conduction information c(m+1,n) at position (m+1,n) is approximated by C'(m+1,n) is subtracted to eliminate the heat conduction information in the unmasked sensing information, so that only the thermal radiation information remains in the corrected unmasked sensing information r'(m+1,n).
因此,熱感測器1可透過在熱感測陣列10設置未遮蔽熱感測胞10u及遮蔽熱感測胞10m,使未遮蔽熱感測胞10u相鄰於至少一個遮蔽熱感測胞10m。如此一來,校正電路11即可利用遮蔽熱感測胞10m所獲得的遮蔽感測資訊來校正相鄰的未遮蔽熱感測胞10u所感測的未遮蔽感測資訊,排除熱感測影像中的誤差或不均勻等非理想因素。另一方面而言,熱感測器1可在不需中斷感測操作的情況下,即時地校正熱感測器的感測結果,避免熱影像的訊息遺漏,進而提升熱感測器1的操作便利性。
Therefore, the
在一實施例中,校正電路11除了可依據遮蔽感測資訊來對相鄰的未遮蔽熱感測胞10u所獲得的未遮蔽感測資訊進行校正之外,校正電路11還可依據未遮蔽感測資訊,來還原相鄰的遮蔽熱感測胞10m的感測結果,進而產生熱感測影像。接下來將以圖1B以及下方的公式(6)、(7)來說明校正電路11的操作。
In one embodiment, the calibration circuit 11 can not only calibrate the unshielded sensing information obtained by the adjacent unshielded
v’(m,n)=(v(m,n-1)+v(m-1,n)+v(m+1,n)+v(m,n+1))/4 (6) v'(m,n)=(v(m,n-1)+v(m-1,n)+v(m+1,n)+v(m,n+1))/4 (6)
r’(m,n)=v’(m,n)-v(m,n) (7)其中,在公式(6)中,v(m,n-1)、v(m-1,n)、v(m+1,n)、v(m,n+1)分別為位置(m,n-1)、(m-1,n)、(m+1,n)、(m,n+1)上的未遮蔽熱感測胞10u所獲得的未遮蔽感測資訊,v’(m,n)即為該些未遮蔽感測資訊的平均。在公式(7)中,v(m,n)即為位置上的遮蔽熱感測胞10m所獲得的遮蔽感測資訊,其僅包含熱傳導資訊。校正電路11
將未遮蔽感測資訊的平均v’(m,n)扣除遮蔽感測資訊v(m,n),進而產生經還原的遮蔽感測資訊。
r'(m,n)=v'(m,n)-v(m,n) (7) Among them, in formula (6), v(m,n-1), v(m-1,n ), v(m+1,n), v(m,n+1) are positions (m,n-1), (m-1,n), (m+1,n), (m,n respectively For the unshielded sensing information obtained by the unshielded
換言之,校正電路11可以把該些未遮蔽感測資訊的平均v’(m,n)用來近似於位置(m,n)的未遮蔽感測資訊,透過扣除掉熱傳導資訊v(m,n)來消去熱傳導資訊,使得經還原的感測資訊中僅保留下熱輻射資訊。 In other words, the calibration circuit 11 can use the average v'(m,n) of the unmasked sensing information to approximate the unmasked sensing information of the position (m,n) by deducting the heat conduction information v(m,n ) to remove the heat conduction information, so that only the heat radiation information remains in the restored sensing information.
因此,熱感測器1可透過未遮蔽感測資訊來對相鄰的遮蔽熱感測胞的感測結果進行還原。如此一來,熱感測器1所產生的熱感測影像中不但可排除熱感測影像中的誤差或不均勻等非理想因素之外,熱感測器1更可還原遮蔽熱感測胞的感測結果,進而提升熱感測影像的畫質及解析度。
Therefore, the
圖2A為本發明實施例一熱感測器2的示意圖。圖2所繪示的熱感測器2相似於圖1所繪示的熱感測器1,只是在熱感測器2中,校正電路11被校正電路21所替代,且熱感測器2還包含有耦接於校正電路21的運算電路23。校正電路21可將經校正的感測資料轉換為數位資料,並提供至運算電路23。運算電路23可接收經校正的感測資料進行數位運算,並據此產生熱影像。大致而言,熱感測器2可透過校正電路21校正熱傳導CH所產生的誤差之外,熱感測器2還可透過運算電路23以數位運算的方式來消除熱感測器2的其他非理想因素,以較佳地產生熱影像。
FIG. 2A is a schematic diagram of a
圖2B為本發明實施例一校正電路21a的示意圖。在此實施例中,校正電路21a中可包含類比減法器210及類比數位轉換
器(analog to digital converter,ADC)211。類比減法器210耦接於熱感測陣列10,用以接收遮蔽熱感測資訊v(m,n)及未遮蔽熱感測資訊v(m+1,n)。類比減法器210可用來將類比資料的未遮蔽熱感測資訊v(m+1,n)及相鄰的遮蔽熱感測資訊v(m,n)進行相減,以產生經校正的未遮蔽感測資訊r’(m+1,n)。類比數位轉換器211耦接於類比減法器210,用來將類比資料的經校正未遮蔽熱感測資訊r’(m+1,n)轉換為數位資料的經校正未遮蔽熱感測資訊R’(m+1,n),並提供至運算電路23,其中小寫的r’(m+1,n)及大寫的R’(m+1,n)分別代表類比及數位的經校正未遮蔽熱感測資訊。據此,運算電路23可接收數位資料的感測資料,並進行數位運算,並據此消除熱感測器2中,例如為製程不均勻或雜訊干擾等其他的非理想因素,以較佳地產生高畫質的熱影像。
FIG. 2B is a schematic diagram of a
圖2C為本發明實施例一校正電路21b的示意圖。在此實施例中,校正電路21b中可包含類比數位轉換器212及數位減法器213。在此實施例中,校正電路21b透過類比數位轉換器212先接收類比的遮蔽熱感測資訊v(m,n)及未遮蔽熱感測資訊v(m+1,n),並轉換為數位資料的遮蔽熱感測資訊V(m,n)及未遮蔽熱感測資訊V(m+1,n),再提供給數位減法器213進行相減,其中小寫的v(m+1,n)及V(m+1,n)分別代表類比及數位的未遮蔽熱感測資訊。在此實施例中,數位減法器213可為用來對數位資料的未遮蔽熱感測資訊V(m+1,n)及遮蔽熱感測資訊V(m,n)進行相減,以產生數位資料的經校正未遮蔽熱感測資訊R’(m+1,n)。運算電路23可據此進
行數位運算以產生熱影像。
FIG. 2C is a schematic diagram of a
圖2D為本發明實施例一校正電路21c的示意圖。圖2D所繪示的校正電路21c相似於圖2B所繪示的校正電路21a,只是在校正電路21c還包含有開關電路214。校正電路21c包含有類比減法器210、類比數位轉換器211及開關電路214。關於類比減法器210及類比數位轉換器211的操作請參考前述圖2B的相關段落,於此不另贅述。
FIG. 2D is a schematic diagram of a
詳細而言,在圖2D的校正電路21c中還可包含開關電路214接收熱感測資訊v(0,0)~v(x,y),開關電路214中選擇出欲進行運算的未遮蔽熱感測資訊v(m+1,n)及遮蔽熱感測資訊v(m,n),並分別提供至類比減法器210的正輸入端及負輸入端。如此一來,類比減法器210可依據開關電路214所提供的訊號,使未遮蔽熱感測資訊v(m+1,n)正確地扣除遮蔽熱感測資訊v(m,n),以利校正電路21c及運算電路23後續的運算。
In detail, the
進一步,運算電路23可例如是中央處理單元(Central Processing Unit,CPU),或是其他可程式化之一般用途或特殊用途的微控制單元(Micro Control Unit,MCU)、微處理器(Microprocessor)、數位信號處理器(Digital Signal Processor,DSP)、可程式化控制器、特殊應用積體電路(Application Specific Integrated Circuit,ASIC)、圖形處理器(Graphics Processing Unit,GPU)、算數邏輯單元(Arithmetic Logic Unit,ALU)、複雜可程式邏輯裝置(Complex Programmable Logic Device,CPLD)、現場可
程式化邏輯閘陣列(Field Programmable Gate Array,FPGA)或其他類似元件或上述元件的組合。或者,運算電路23可以是透過硬體描述語言(Hardware Description Language,HDL)或是其他任意本領域具通常知識者所熟知的數位電路的設計方式來進行設計,並透過現場可程式邏輯門陣列(Field Programmable Gate Array,FPGA)、複雜可程式邏輯裝置(Complex Programmable Logic Device,CPLD)或是特殊應用積體電路(Application-specific Integrated Circuit,ASIC)的方式來實現的硬體電路。只要運算電路23可接收校正電路21所提供的經校正感測資料,並對經校正感測資料進行數位運算皆屬於本發明的範疇。
Further, the
簡言之,熱感測器2透過校正電路21產生經校正的未遮蔽感測資訊並將其轉換為數位訊號的形式之後,熱感測器2還可進一步透過運算電路23以數位運算的方式來對感測資訊進行補償。因此,熱感測器2除了可消去熱傳導資訊以之外,還可進一步排除製程不均勻或雜訊干擾等其他的非理想因素,進而產生高畫質的熱影像。
In short, after the
圖2B~圖2D僅為熱感測器2中校正電路21的示例性實施例,本發明具通常知識者當然可依據不同的設計概念或使用需求來修改或組合。舉例而言,圖2B、2C中所繪示的校正電路21a、21b的結構可被修改以平行運算地方式來同時的產生多個經校正的未遮蔽感測資訊。或者,圖2D中所繪示的開關電路214亦可應用於圖2C所繪示的校正電路21b中,開關電路214可耦接於熱感
測陣列10與類比數位轉換器212之間,或者是開關電路214可耦接於類比數位轉換器212與數位減法器213之間。只要開關電路214耦接於數位減法器213之前,開關電路214可選擇正確的感測資訊以輸入至數位減法器213的正輸入端及負輸入端即可。
2B to 2D are only exemplary embodiments of the calibration circuit 21 in the
圖3A~3D為本發明實施例熱感測陣列10-1~10-4的示意圖。在圖3A所示的實施例中,熱感測陣列10-1中的未遮蔽熱感測胞10u可形成一矩形,以環繞方式與遮蔽熱感測胞10m相鄰設置。且每個未遮蔽熱感測胞10u所形成的矩形之間,可沿著熱感測陣列10-1的列方向及行方向來排列設置。
3A to 3D are schematic diagrams of thermal sensing arrays 10-1 to 10-4 according to embodiments of the present invention. In the embodiment shown in FIG. 3A , the unshielded
在圖3B所示的實施例中,熱感測陣列10-2相似於熱感測陣列10-1。同樣地,熱感測陣列10-2中的未遮蔽熱感測胞10u可形成一矩形,以環繞方式與遮蔽熱感測胞10m相鄰設置。不過在熱感測陣列10-2中,未遮蔽熱感測胞10u所形成的矩形,只有在列方向是對齊的,在行方向則為交錯設置的。
In the embodiment shown in Figure 3B, thermal sensing array 10-2 is similar to thermal sensing array 10-1. Likewise, the unshielded
在圖3C所示的實施例中,未遮蔽熱感測胞10u與遮蔽熱感測胞10m可分別設置為熱感測陣列10-3的多個行,且未遮蔽熱感測胞10u的多個行可與遮蔽熱感測胞10m的多個行互相交錯排列。
In the embodiment shown in FIG. 3C , the unshielded
在圖3D所示的實施例中,未遮蔽熱感測胞10u與遮蔽熱感測胞10m可分別設置為熱感測陣列10-4的多個列,且未遮蔽熱感測胞10u的多個列可與遮蔽熱感測胞10m的多個列互相交錯排列。
In the embodiment shown in FIG. 3D , the unshielded
當然,本領域具通常知識者當然可依據不同設計概念或使用需求來修改或組合圖1A、1B、3A~3D中所繪示的熱感測陣列。舉例而言,在圖3A所繪示的熱感測陣列10-1中,每個遮蔽熱感測胞10m之間可由間隔一個未遮蔽熱感測胞10u變更為間隔兩個未遮蔽熱感測胞10u。或者,在圖3C所繪示的熱感測陣列10-3中,每個遮蔽熱感測胞10m所形成的多行之間可由間隔一行的未遮蔽熱感測胞10u變更為間隔兩行的未遮蔽熱感測胞10u。應注意的是,上述說明僅為示例性地說明熱感測陣列的排列方式,不應被用來限制熱感測陣列的實施態樣,只要未遮蔽熱感測胞10u相鄰於至少一個遮蔽熱感測胞10m,其皆屬於本發明的熱感測陣列的範疇。
Of course, those skilled in the art can of course modify or combine the thermal sensing arrays shown in FIGS. 1A , 1B, 3A to 3D according to different design concepts or usage requirements. For example, in the thermal sensing array 10-1 shown in FIG. 3A, the distance between each shielded
綜上所述,本發明的熱感測器可設置有未遮蔽熱感測胞及遮蔽熱感測胞,未遮蔽熱感測胞相鄰於至少一個遮蔽熱感測胞,如此一來,熱感測器中的校正電路即可依據遮蔽熱感測胞所獲得的感測資訊,來校正該遮蔽熱感測胞所相鄰的未遮蔽熱感測胞所獲得的感測資訊。據此,熱感測器可即時地校正熱感測器的感測結果,避免熱影像的訊息遺漏,進而提升熱感測器的操作便利性。另一方面,熱感測器還可還原遮蔽熱感測胞的感測結果,以提升熱影像的畫質。 To sum up, the thermal sensor of the present invention can be provided with an unshielded thermal sensing cell and a shielded thermal sensing cell, and the unshielded thermal sensing cell is adjacent to at least one shielded thermal sensing cell. The calibration circuit in the sensor can correct the sensing information obtained by the unshielded thermal sensing cell adjacent to the shielded thermal sensing cell according to the sensing information obtained by the shielded thermal sensing cell. Accordingly, the thermal sensor can correct the sensing result of the thermal sensor in real time, so as to avoid information omission of the thermal image, thereby improving the operational convenience of the thermal sensor. On the other hand, the thermal sensor can also restore the sensing result of the shielded thermal sensing cell, so as to improve the image quality of the thermal image.
1:熱感測器 1: Thermal sensor
10:熱感測陣列 10: Thermal Sensing Array
11:校正電路 11: Correction circuit
12:鏡頭 12: Lens
10m:遮蔽熱感測胞 10m: shielding thermal sensing cells
10u:未遮蔽熱感測胞 10u: Unshielded thermal sensing cell
CH:熱傳導 CH: heat conduction
RH:熱輻射 RH: heat radiation
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TWI455298B (en) * | 2011-10-25 | 2014-10-01 | Pixart Imaging Inc | Photosensor device and method for determining incident light |
CN103095963A (en) * | 2011-12-17 | 2013-05-08 | 中国航空工业集团公司洛阳电光设备研究所 | Infrared linear detector inhomogeneous correction method and infrared linear detector inhomogeneous correction device based on field programmable gate array (FPGA) |
CN103528690B (en) * | 2013-09-24 | 2016-03-02 | 电子科技大学 | A kind of non-uniform correction method of thermal infrared imager |
US20150226613A1 (en) * | 2014-02-07 | 2015-08-13 | Raytheon Company | Imaging device with shutterless non-uniformity correction |
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-
2020
- 2020-11-02 TW TW109138127A patent/TWI764351B/en active
-
2021
- 2021-09-09 CN CN202111056612.9A patent/CN114526820A/en not_active Withdrawn
- 2021-09-28 US US17/486,959 patent/US20220136911A1/en not_active Abandoned
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TW200929133A (en) * | 2007-10-29 | 2009-07-01 | Toshiba Matsushita Display Tec | Photodetector circuit |
CN102564605A (en) * | 2011-11-09 | 2012-07-11 | 魏建明 | High-definition thermal imaging infrared detector |
TW201404150A (en) * | 2012-07-03 | 2014-01-16 | Himax Imaging Ltd | Image capture devices and image processing method thereof |
Also Published As
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TW202220430A (en) | 2022-05-16 |
CN114526820A (en) | 2022-05-24 |
US20220136911A1 (en) | 2022-05-05 |
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