TWI762477B - Buffer material for hot pressing - Google Patents

Abstract

The buffer material for hot pressing according to the embodiment of the present invention includes one or more base material layers, a second polymer-based antistatic material, and a third polymer-based antistatic material; wherein the one or more base material layers are made of a woven fabric. A fibrous layer composed of cloth or non-woven fabric, and a first polymer-based antistatic material existing along the fiber surface of the fibrous layer; the second polymer-based antistatic material is connected to a main part of the base material layer. On the surface, it exists as the outermost layer, and the third polymer-based antistatic material exists as the outermost layer on the other main surface of the base material layer.

Description

Buffer material for hot pressing

The present invention relates to a buffer material for hot pressing.

Construction and aircraft materials use printed substrates, decorative panels or honeycomb panels, among which the printed substrates are copper-clad laminates or flexible printed substrates that are frequently used in various electrical machines. Construction and aircraft materials are generally processed and formed by hot pressing or hot pressing. At that time, the buffer material for hot pressing was arranged and used so as to be sandwiched between a hot pressing platen and an object to be pressed.

Therefore, the buffer material for hot pressing is required to have the following properties: heat resistance or durability that can withstand heat and pressure from a hot pressing platen, and thermal conductivity or cushioning properties that can uniformly transfer heat and pressure to an object to be pressed.

In addition, when the buffer material for hot pressing is used, it may come into direct contact with an object to be pressed. For example, if foreign matter adheres to the contact surface of the buffer material for hot pressing and the object to be bonded, it will cause foreign matter defects in the bonded product. In addition, the buffer material for hot pressing may also indirectly process the pressing target by interposing the metal plate between itself and the pressing target. For example, if foreign matter adheres between the buffer material for hot pressing and the metal plate, it is difficult to uniformly transmit the heat and pressure from the hot pressing platen to the pressing object. In order to prevent such foreign matter from adhering, for example, a buffer material for hot pressing to which antistatic treatment is applied has been proposed (Japanese Patent Laid-Open No. 2011-116034). Moreover, in order to suppress the generation|occurrence|production of such a foreign material, the buffer material for hot pressing which provided the heat resistant elastic layer in the edge surface, for example is proposed (Japanese Unexamined-Japanese-Patent No. 2014-87999).

An object of the present invention is to provide a buffer material for hot pressing, which can suppress the generation of dust from the buffer material itself and the adhesion of foreign matter to the buffer material, and can uniformly transmit pressure to an object to be pressed.

The buffer material for hot pressing according to the embodiment includes: one or more base material layers including a fibrous layer composed of a woven fabric or a non-woven fabric, and a first polymer system existing along the fiber surface of the fibrous layer an antistatic material; a second polymer-based antistatic material, which is attached to one main surface of the base material layer and exists as the outermost layer; and a third polymer-based antistatic material, which is attached to the base material layer On the other main surface, it exists as the outermost layer.

[Mode for Carrying Out the Invention] The hot-pressing buffer material according to the embodiment includes: one or more base material layers including a fibrous layer made of a woven fabric or a non-woven fabric, and a fiber surface along the fibrous layer. The existing first polymer-based antistatic material; the second polymer-based antistatic material, which is attached to one main surface of the base material layer and exists as the outermost layer; and the third polymer-based antistatic material, It exists on the other main surface of the said base material layer as an outermost layer.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.

FIG. 1 is an enlarged cross-sectional view showing an example of the buffer material for hot pressing according to the embodiment. The buffer material 10 for hot pressing includes a fibrous layer 1 composed of a plurality of fibers 2 entangled with each other. The polymer-based antistatic material 3 exists along the surface of the fiber 2 . The base material layer 4 is constituted by the fibrous layer 1 and the polymer-based antistatic material 3 . The polymer-based antistatic material 3 includes a polymer-based material and an antistatic material 3 c dispersed in the polymer-based material, respectively. The polymer-based antistatic material 15 is present to cover the entire surface of one main surface of the base material layer 4 and to have a substantially flat surface. The polymer-based antistatic material 16 is present to cover the entire surface of the other main surface of the base material layer 4 and to have a substantially flat surface. In this embodiment, the polymer-based antistatic material 15 includes a polymer-based material and an antistatic material 15c dispersed in the polymer-based material. The polymer-based antistatic material 16 includes a polymer-based material and an antistatic material 16c dispersed in the polymer-based material.

In this embodiment, the polymer-based antistatic material 3 exists along the surface of the fiber 2, and corresponds to the above-mentioned first polymer-based antistatic material. The polymer-based antistatic material 15 is present on one main surface of the base material layer 4 , and corresponds to the second polymer-based antistatic material. The polymer-based antistatic material 16 is present on the other main surface of the base material layer 4 , and corresponds to the above-described third polymer-based antistatic material.

According to this configuration, the buffer material 10 for hot pressing includes the base material layer 4 including the fibrous layer 1 and the polymer-based antistatic material 3 existing along the surfaces of the fibers 2 of the fibrous layer 1 ; the polymer-based antistatic material 3 A charging material 15, which is present on the base material layer 4, provides the outermost layer on the base material layer 4 shown in FIG. 1; and a polymer-based antistatic material 16, which provides the base material shown in FIG. 1 The outermost layer under layer 4.

The fibrous layer 1 may contain a sufficient amount of fibrous material for use as a buffer material for hot pressing. The fibrous material contains, for example, at least one fiber. For example, the fiber may be composed of one fiber, or may be composed of two or more fibers. For example, the fibrous layer 1 may be woven or non-woven, or a combination of these. For example, when the fibrous layer 1 is a woven fabric, the weave method may be any of plain weave, twill weave, satin weave, or multiple weave of these, but is not limited to these. The thickness of one layer of the fibrous layer 1 may be in the range of 0.05 mm to 5.0 mm, for example, in the range of 0.3 mm to 4.0 mm, but is not limited to these ranges.

The buffer material 10 for hot pressing may include at least one fibrous layer. For example, the buffer material 10 for hot pressing may include at least one fibrous layer, or may include a plurality of fibrous layers, for example, may be a stack of a plurality of fibrous layers.

The shape of the fibers 2 may be, for example, a filament yarn shape or an elastic fiber yarn shape. For example, the fibers contained in the fibrous layer may be only filament yarn-like fibers, only elastic fiber yarn-like fibers, or a mixture of filament yarn-like fibers and elastic fiber yarn-like fibers, but not limited to these fiber.

The thickness or width of the fibers 2 may range, for example, from 1 mm to 100 mm.

唑(PBO)纖維，以及該等纖維的2種以上的組合等，但不限定於該等纖維。The fibers 2 contained in the fibrous layer 1 can be, for example, glass fibers, carbon fibers, ceramic fibers, polyester fibers, amide fibers and polybenzoyl

azole (PBO) fibers, and combinations of two or more of these fibers, etc., but not limited to these fibers.

The polymer-based antistatic material 3 is present, for example, by covering the surface of the fiber 2 .

Each of the polymer-based antistatic materials 3, 15, and 16 described above is a member having antistatic performance. Thereby, the antistatic performance is imparted to the buffer material 10 for hot pressing. In other words, the polymer-based antistatic materials 3 , 15 , and 16 may be constructed and prepared as polymer-based antistatic members.

The anti-static performance refers to the performance that the foreign matter such as dust or fine dust has a low property of adhering to itself due to static electricity and other charging. In other words, the substance having the antistatic property is less likely to be charged, and as a result, the adhesion of foreign matter is prevented. For example, the anti-static performance can be represented by the charging voltage. The charging voltage may be, for example, an initial voltage obtained by a half-life measurement method in accordance with JIS L 1094.

The degree of antistatic performance of the polymer-based antistatic material in the state of being included in the hot-pressing buffer material of the embodiment is expressed as the charging voltage obtained by the half-life measurement method in accordance with JIS L 1094, and the low charging voltage is used. Preferably, for example, it may be 1 kV or less, and more preferably 0.5 kV or less. In other words, the antistatic performance of the buffer material for hot pressing of the embodiment as a whole represents the electrification voltage measured by the method according to the measurement method of JIS L 1094.

A buffer material for hot pressing having antistatic performance with a charging voltage of 1 kV or less obtained by the half-life measurement method in accordance with JIS L 1094 can, for example, suppress the adhesion of foreign matter to the buffer material for hot pressing. For example, a buffer material for hot pressing having antistatic performance with a charging voltage of 0.5 kV or less obtained by the half-life measurement method in accordance with JIS L 1094 can further suppress the adhesion of foreign matter to itself.

The desired antistatic performance of the hot-pressing buffer material of the embodiment can be adjusted, for example, by adjusting the content of the polymer-based antistatic material contained in the hot-pressing buffer material, or the amount of the antistatic material contained in the polymer-based antistatic material. type, content or combination, etc.

The polymer-based anti-static material may be, for example, a combination of the above-mentioned anti-static material and polymer-based material, or a polymer-based material with anti-static performance itself. For example, when the polymer-based antistatic material is a combination of the antistatic material and the polymer-based material, the antistatic material may be dispersed in the polymer-based material. The first, second, and third polymer-based antistatic materials may be, for example, the same member, different members, or any two members that are the same member.

The polymer-based material may be, for example, a polymer having heat resistance to temperatures such as thermocompression processing or thermocompression bonding. For example, polymer materials can be fluororubber, silicone rubber, EPDM, fluororesin, phenolic resin, epoxy resin, polyimide resin, melamine resin, unsaturated polyester resin, thermosetting resin acrylic resin, furan resin, urea resin or polyurethane resin, or any combination of two or more of these materials.

The antistatic material 3c may be, for example, metal oxides such as titanium oxide, zinc oxide, or iron oxide powder, carbon powder, or a combination of any two or more of these materials.

The thickness of the second and third polymer-based antistatic materials 15 and 16 in the state of being included in the hot-pressing buffer material 10 of the embodiment slightly varies depending on the unevenness of the main surface of the base material layer 4 . For example, the second and third polymer-based antistatic materials in the state of being included in the hot-pressing buffer material of the embodiment may exist as the outermost layer having a thickness of 0.1 mm or more and 1000 mm or less, but not limited to this . When the buffer material for thermocompression has the second and third polymer-based antistatic materials with a thickness of less than 0.1 mm, sufficient wear resistance for thermocompression processing or thermocompression bonding may not be obtained.

The buffer material 10 for hot pressing of the embodiment can be produced, for example, as follows.

A polymer-based material, an antistatic material, and a fibrous layer were prepared as the material of the buffer material for hot pressing.

First, an antistatic material is added to each polymer-based material and dispersed to prepare a polymer-based antistatic material. Next, a solvent is added to the polymer-based antistatic material to adjust the viscosity to impregnate the fibrous layer. Next, it is made to dry, and a base material layer is obtained. A polymer-based anti-static material is coated on one main surface of the base material layer, and a polymer-based anti-static material is coated on the other main surface of the base material layer. After drying, heat treatment was further performed, and the ends were cut to obtain a buffer material for hot pressing.

In this embodiment, the buffer material 10 for hot pressing has the following effects.

The buffer material 10 for hot pressing is provided with polymer-based antistatic materials 15 and 16 on both the side that directly or indirectly contacts the object to be pressed and the side that directly or indirectly contacts the hot pressing plate. Therefore, the buffer material 10 for hot pressing can suppress the generation of dust due to the loosening of fibers on the contact surface itself, and the adhesion of foreign matter to the contact surface, and can uniformly transmit pressure to the object to be pressed.

Furthermore, since the polymer-based antistatic material 3 also exists in the base material layer 4 in the buffer material 10 for hot pressing, loosening of fibers at the time of cutting can be suppressed.

Fig. 2 is an enlarged cross-sectional view showing an example of a buffer material for hot pressing according to a further embodiment. The buffer material 20 for hot pressing includes film-like antistatic polymers 25 and 26 in place of the second and third polymer-based antistatic materials 15 and 16 of the buffer material 10 for hot pressing described above. The film-like antistatic polymer 25 exists to cover the substantially flat surface of one main surface of the base material layer 4 . The film-like antistatic polymer 26 exists to cover the substantially flat surface of the other main surface of the base material layer 4 .

In this embodiment, the polymer-based antistatic material 3 exists along the surface of the fiber 2, and corresponds to the above-mentioned first polymer-based antistatic material. The film-like antistatic polymer 25 is present on one main surface of the base material layer 4 and corresponds to the second polymer-based antistatic material described above. The film-like antistatic polymer 26 is present on the other main surface of the base material layer 4 , and corresponds to the third polymer-based antistatic material described above.

According to this configuration, the buffer material 20 for hot pressing includes: the base material layer 4 including the fibrous layer 1 and the polymer-based antistatic material 3 existing along the surfaces of the fibers 2 of the fibrous layer 1; The polymer 25, which is present on the substrate layer 4, provides the outermost layer shown on the substrate layer 4 in Figure 2; and the film-like antistatic polymer 26, which provides the substrate in Figure 2 The outermost layer shown under layer 4.

The second and third polymer-based antistatic materials are film-like antistatic polymers. For example, the film-like antistatic polymer may be a polyimide film containing an antistatic material or a fluororesin film containing an antistatic material, but is not limited to these.

The buffer material 20 for hot pressing of the embodiment can be obtained by using, for example, the above-described base material layer 4 as a base, and can be produced as follows.

A polymer-based material, an antistatic material, a fibrous layer, and a film-like antistatic polymer were prepared as the material of the buffer material 20 for hot pressing.

First, the base material layer 4 is formed as described above. On one main surface of the base material layer 4 , a film-like antistatic polymer 25 is adhered, and on the other main surface of the base material layer 4 , a film-like antistatic polymer 26 is adhered. Next, heat treatment is performed to integrate them, and the ends are cut to obtain a buffer material 20 for hot pressing.

For example, when adhering a film-like anti-static polymer and a polymer-based anti-static material, the polymer-based anti-static material on the adhesive surface with the film-like anti-static polymer can also be disposed before solidification, and then dried. , when the polymer-based anti-static material solidifies to make it stick. When adhering the film-like anti-static polymer and other components, an adhesive can also be used on the adhesive surface of the film-like anti-static polymer and other components.

The adhesive may be, for example, a heat-resistant adhesive that can withstand heat from a hot platen during thermocompression processing or thermocompression bonding. For example, epoxy adhesives or ceramic adhesives can also be used, but are not limited to these adhesives.

In this embodiment, the buffer material 20 for hot pressing can have the following effects in addition to the effects of the buffer material 10 for hot pressing described above.

Since the buffer material 20 for hot pressing has film-like antistatic polymers 25 and 26 on both main surfaces thereof, dust generation due to loosening of fibers 2 on the main surface of the base material layer 4 can be suppressed.

In a further embodiment, one or more layers of the first intermediate layer may be included between the second polymer-based antistatic material and one main surface of the base material layer, and one or more layers of the second intermediate layer may be included. An intermediate layer is present between the third polymer-based antistatic material and the other main surface of the base material layer.

Hereinafter, an embodiment including the first intermediate layer and the second intermediate layer will be described with reference to the drawings.

FIG. 3 shows an example of a buffer material for hot pressing according to a further embodiment, and is a partially enlarged cross-sectional view. The buffer material 30 for hot pressing is based on the configuration of the base material layer 4 described above, and further includes film-like polymers 37 and 38 as intermediate layers and polymer-based antistatic materials 35 and 36 as outermost layers. The film-like polymer 37 exists to cover the substantially flat surface of one main surface of the base material layer 4 . The polymer-based antistatic material 35 exists to cover the above-mentioned film-like polymer 37 . The film-like polymer 38 exists to cover the substantially flat surface of the other main surface of the base material layer 4 . The polymer-based antistatic material 36 exists to cover the film-like polymer 38 described above. The polymer-based antistatic material 35 includes a polymer-based material and an antistatic material 35c dispersed therein, and the polymer-based antistatic material 36 includes a polymer-based material and an antistatic material 36c dispersed therein.

In this embodiment, the polymer-based antistatic material 3 exists along the surface of the fiber 2, and corresponds to the above-mentioned first polymer-based antistatic material. The film-like polymer 37 on one main surface of the base material layer 4 corresponds to the above-mentioned first intermediate layer. The polymer-based antistatic material 35 corresponds to the second polymer-based antistatic material described above. In addition, the film-like polymer 38 on the other main surface of the base material layer 4 corresponds to the above-mentioned second intermediate layer. The polymer-based antistatic material 36 corresponds to the above-described third polymer-based antistatic material.

According to this configuration, the buffer material 30 for hot pressing includes: the base material layer 4 including the fibrous layer 1 and the polymer-based antistatic material 3 existing along the surfaces of the fibers 2 of the fibrous layer 1; a film-like polymer 37, which is present on the base material layer 4, providing an intermediate layer on the base material layer 4 shown in Figure 3; the polymer-based antistatic material 35, which is present on the base material layer 4, providing the outermost layer; A film-like polymer 38, which is present on the base material layer 4, provides an intermediate layer below the base material layer 4 shown in FIG. 3; and a polymer-based antistatic material 36, which is present on the base material layer 4 , which provides the outermost layer.

The intermediate layer in the state contained in the buffer material for hot pressing of the embodiment may have, for example, an antistatic type or may not have antistatic properties. In addition, the intermediate layer may be, for example, a layer composed of a film-like polymer, or a layer composed of a non-film-like polymer-based material (non-film-like polymer).

The film-like polymer may be, for example, polytetrafluoroethylene (PTFE), ethylene tetrafluoroethylene copolymer (ETFE), perfluoroalkoxy fluororesin (PFA), polyimide, or the like, or may include an antistatic material.

The intermediate layer may have a thickness of, for example, 1 mm to 500 mm, but is not limited thereto. The intermediate layer having a thickness of 5 mm to 300 mm may have sufficient softness, for example, for handling at the time of manufacture.

The film-like polymers 37 and 38 in the state of being included in the buffer material for hot pressing of the embodiment can suppress the generation of dust due to, for example, loosening of the fibers 2 of the base material layer 4 .

The buffer material 30 for hot pressing of the embodiment can be obtained by using, for example, the above-described base material layer 4 as a base, and can be produced as follows.

A polymer-based material, an antistatic material, a fibrous layer, and a film-like polymer were prepared as the material of the buffer material 30 for hot pressing.

First, the base material layer 4 is formed as described above. A film-like polymer 37 is adhered to one main surface of the base material layer 4 , and a film-like polymer 38 is adhered to the other main surface of the base material layer 4 , and heat treatment is performed to integrate them. Next, the polymer-based antistatic material 35 is coated on the main surface of the film-like polymer 37 . On the main surface of the film-like polymer 38, a polymer-based antistatic material 36 is applied. Then, the end portion was cut to obtain the buffer material 30 for hot pressing.

For example, when adhering a film-like polymer and a polymer-based anti-static material, it can also be arranged before the polymer-based anti-static material on the adhesive surface with the film-like polymer is solidified, and then dried. The charged material sticks when it solidifies. When adhering the film-like polymer and other components, an adhesive can also be used on the adhesive surface of the film-like polymer and other components.

In this embodiment, the buffer material 30 for hot pressing can have the same effect as the above-mentioned buffer materials 10 and 20 for hot pressing.

Since the buffer material 30 for hot pressing has film-like polymers 37 and 38 on both main surfaces of the base material layer 4 itself, dust generation due to loosening of the fibers 2 of the base material layer 4 can be suppressed.

In a further embodiment, a fourth polymer-based antistatic material may be included on the end surface of the buffer material for hot pressing.

Hereinafter, an embodiment including the fourth polymer-based antistatic material will be described with reference to the drawings.

Fig. 4 is an enlarged cross-sectional view showing an example of a buffer material for hot pressing according to a further embodiment. The buffer material for hot pressing 40 is further provided with a layer of a polymer-based antistatic material 49 in addition to the configuration of the buffer material for hot pressing 30 described above. The polymer-based antistatic material 49 exists along the end surface of the buffer material 30 for hot pressing, and covers the end surface.

The polymer-based antistatic material that exists to coat the end surface of the buffer material for hot pressing may be provided on the buffer material 10 or 20 for hot pressing.

In this embodiment, the polymer-based antistatic material 49 exists along the end surface of the buffer material 30 for hot pressing, covering the end surface, and corresponds to the fourth polymer-based antistatic material.

According to this configuration, the buffer material 40 for hot pressing includes: the base material layer 4 including the fibrous layer 1 and the polymer-based antistatic material 3 existing along the surfaces of the fibers 2 of the fibrous layer 1; a film-like polymer 37, which is present on the base material layer 4, providing an intermediate layer on the base material layer 4 shown in Figure 4; the polymer-based antistatic material 35, which is present on the base material layer 4, providing the outermost layer; A film-like polymer 38, which provides the intermediate layer below the substrate layer 4 shown in FIG. 4; the polymer-based antistatic material 36, which provides the outermost layer; and the polymer-based antistatic material 49, which coats the end faces and exist.

For example, the fourth polymer-based antistatic material 49 may be the same member as any of the first, second, and third polymer-based antistatic materials 3, 35, and 36, or may be a different member. Not limited to these. For example, polymer-based antistatic materials that are mutually the same components can enhance mutual adhesion due to compatibility.

The fourth polymer-based antistatic material 49 in the state of being included in the buffer material for hot pressing of the embodiment can further suppress dust generation such as loosening of fibers 2 on the end face of the buffer material for hot pressing, for example. Moreover, adhesion of foreign matter to the end surface of the buffer material for hot pressing can be further suppressed.

The buffer material for hot pressing 40 of the embodiment can be obtained, for example, by using the above-mentioned buffer material 30 for hot pressing as a base, and can be produced as follows.

A polymer-based material, an antistatic material, a fibrous layer, and a film-like polymer are prepared as the material of the buffer material 40 for hot pressing.

First, an antistatic material is added to a polymer-based material and dispersed to prepare a polymer-based antistatic material 49 . In addition, the substrate 30 is formed as described above. A solvent is added to the polymer-based anti-static material 49 to adjust the viscosity, and is coated on the end surface of the substrate 30 . Next, it is dried and heat-treated to obtain a buffer material 40 for hot pressing.

For example, when the buffer material 40 for hot pressing is produced, the end surface of the base 30 may be impregnated with the polymer-based antistatic material 49 to be produced.

In this embodiment, the buffer material 40 for hot pressing can have the following effects in addition to the effects of the above-mentioned buffer materials 10 to 30 for hot pressing.

The buffer material 40 for hot pressing is formed by the presence of the polymer-based antistatic material 49 on the end surface of the base 30 , so that the generation of dust and the adhesion of foreign matter to the end surface due to the loosening of the fibers 2 of the base layer 4 can be further suppressed. .

Fig. 5 is an enlarged cross-sectional view showing an example of a buffer material for hot pressing according to a further embodiment. In addition to the base material layer 4 described above, the buffer material 50 for hot pressing further includes a film-like polymer 58 as an intermediate layer, and further includes a layer of polymer-based antistatic materials 55 and 56 as an outermost layer. The film-like polymer 58 exists to cover the substantially flat surface of one main surface of the base material layer 4 . The polymer-based antistatic material 56 exists to cover the film-like polymer 58 described above. The polymer-based antistatic material 55 is present to cover the entire surface of the other main surface of the base material layer 4 and to have a substantially flat surface. The polymer-based antistatic material 55 includes a polymer-based material and an antistatic material 55c dispersed therein, and the polymer-based antistatic material 56 includes a polymer-based material and an antistatic material 56c dispersed therein.

In this embodiment, the polymer-based antistatic material 3 exists along the surface of the fiber 2, and corresponds to the above-mentioned first polymer-based antistatic material. The polymer-based antistatic material 55 exists on one main surface of the base material layer 4 as the outermost layer, and corresponds to the second polymer-based antistatic material. In addition, the polymer-based antistatic material 56 exists as the outermost layer on the other main surface of the base material layer 4, and corresponds to the third polymer-based antistatic material, and the film-like polymer 58 is interposed therebetween. Between the antistatic material 56 and the base material layer 4, it corresponds to the above-mentioned intermediate layer.

According to this configuration, the buffer material 50 for hot pressing includes the base material layer 4 including the fibrous layer 1 and the polymer-based antistatic material 3 existing along the surfaces of the fibers 2 of the fibrous layer 1 ; the polymer-based antistatic material 3 The charging material 55, which is present on the base material layer 4, provides the outermost layer on the base material layer 4 shown in Fig. 5; the film-like polymer 58, which is present on the base material layer 4, provides the outermost layer shown in Fig. 5 The intermediate layer below the base material layer 4 in Fig. 5; and the polymer-based antistatic material 56, which is present on the base material layer 4, providing the outermost layer.

The buffer material 50 for hot pressing of the embodiment can be obtained by using, for example, the above-described base material layer 4 as a base, and can be produced as follows.

A polymer-based material, an antistatic material, a fibrous layer, and a film-like polymer are prepared as materials for the buffer material 50 for hot pressing.

First, the base material layer 4 is formed as described above. A film-like polymer 58 is adhered to one main surface of the base material layer 4 , and a polymer-based antistatic material 55 is coated on the other main surface of the base material layer 4 . Furthermore, a polymer-based antistatic material 56 is coated on the main surface of the film-like polymer 58 . Finally, it was dried and heat-treated to obtain a buffer material 50 for hot pressing.

The buffer material for hot pressing according to the embodiment may have, for example, the structure on one main surface of the base material layer 4 and the structure on the other main surface of the base material layer 4 which are the same as each other, or a structure different from each other. .

The structure on the main surface of the base material layer 4 may be the polymer-based antistatic material of the outermost layer. Moreover, between the base material layer 4 and the polymer-based antistatic material of the outermost layer, one or more intermediate layers or other base material layers may be included. For example, when the structure on the main surface of the base material layer 4 is a plurality of layers, the order of layer arrangement may be as long as the polymer-based antistatic material is arranged in the outermost layer, and the order of arrangement in the intermediate layer is not limited.

Any of the above-described embodiments can have the following effects.

The thickness of the buffer material for hot pressing of the embodiment may be in the range of 0.1 mm to 5.5 mm, for example, in the range of 0.5 mm to 5.0 mm, but is not limited thereto. In the buffer material system for hot pressing having a thickness exceeding 5.5 mm, the heat transfer from the hot pressing plate decreases, and the productivity decreases.

The volume of voids contained in the buffer material for hot pressing of the embodiment can be calculated by, for example, the following formula: [Volume of voids contained in the buffer material for hot pressing]=[Volume of the buffer material for hot pressing]-([For The volume of fibers contained in the buffer material]+[the volume of the polymer-based antistatic material contained in the buffer material for hot pressing]+[the volume of the intermediate layer contained in the buffer material for hot pressing]).

The volume of fibers contained in the buffer material for hot pressing can be calculated, for example, from the basis weight and the specific gravity of fibers of the fibrous layer used for producing the buffer material for hot pressing.

The volume of the polymer-based antistatic material contained in the buffer material for hot pressing can be calculated, for example, from the weight and specific gravity of the polymer-based antistatic material used in the production of the buffer material for hot pressing, or from the volume of the film-like antistatic polymer. Calculate using weight and specific gravity.

The volume of the intermediate layer contained in the buffer material for hot pressing can be calculated, for example, from the used weight and specific gravity of the film-like polymer or polymer-based antistatic material used for producing the buffer material for hot pressing.

The volume ratio of voids contained in the buffer material for hot pressing can be calculated as the void ratio by, for example, the following formula: [void ratio]=([volume of voids contained in the buffer material for hot pressing]/[volume of the buffer material for hot pressing] )´100%.

The porosity of the buffer material for hot pressing according to the embodiment may be, for example, 20 to 80%, or, for example, 40 to 75%. For example, a buffer material for hot pressing with a porosity of 20% to 80% can be compressed to a thickness of 30% to 90% of the thickness before compression by pressing 3MPa in the thickness direction at normal temperature.

For example, a cushioning material for hot pressing having a void ratio of less than 20% has low cushioning properties. In addition, with a buffer material for hot pressing having a porosity of more than 80%, the buffer material was dented after being pressed and bonded several times, and the buffer properties could not be maintained.

Generally, the cushioning property for hot pressing which is filled with the polymer-based antistatic material is low. However, the buffer material for thermocompression of the embodiment has sufficient cushioning properties for thermocompression processing or thermocompression bonding because it contains the above-mentioned voids. In addition, since the polymer-based antistatic material is present, adhesion of foreign matter can also be suppressed.

For example, the porosity of the buffer material for hot pressing can be divided into the edge part and the center part of the buffer material for hot pressing, and can be calculated individually.

The end portion of the buffer material for hot pressing may refer to, for example, a portion within a distance of 3 mm inward from the end surface of the buffer material for hot pressing.

The central part of the buffer material for hot pressing may refer to, for example, a portion that is 100 mm or more inward from the end face of the buffer material for hot pressing.

The relationship between the porosity ratio of the end portion and the central portion of the buffer material for hot pressing can be calculated, for example, by the following formula: [void ratio]=[void ratio of the end portion of the buffer material for hot pressing]/[buffer material for hot pressing] porosity of the central part].

The end surface of the buffer material for hot pressing is the edge of the buffer material for hot pressing in the final form, and is connected to the surface that spans the two main surfaces facing each other. When the shape of the main surface is a quadrangle, there may be four end surfaces corresponding to the four sides that define the main surface. Regarding the regulation of the end portion and the central portion of the buffer material for hot pressing, the distance from the end face is tied to the end face side of the buffer material for hot pressing in the final form, and it exists on the outermost side, and it may be a buffer for hot pressing that forms a boundary with the outside world. distance from the end face of the material. Also, for example, the distance from the end face may be a distance measured from a specific region of the end face constituting the outer edge of the buffer material for hot pressing in the final form, perpendicular to that position, and to the center side of the buffer material for hot pressing. For example, when the end surface has irregularities, it may be the distance of the largest region protruding to the outside. For example, in the case of the hot pressing buffer material 40 shown in FIG. 4 , the polymer-based antistatic material 49 exists as the outermost layer of the end face, and the distance can be measured from the surface of the polymer-based antistatic material 49 .

The void ratio of the buffer material for hot pressing of the embodiment may be, for example, 0.9 or more. A buffer material for hot pressing with a void ratio of less than 0.9, for example, when used for hot pressing or hot pressing, is likely to have a compression difference between the ends and the center of the buffer material for hot pressing, and it is difficult to press the molded product. There may be voids (ie pores) inside.

The buffer material for hot pressing of the embodiment can be used, for example, as follows.

The buffer material for thermocompression of the embodiment can be used for thermocompression processing or thermocompression bonding either alone or after stacking a sufficient number of sheets for the application.

When the buffer material for hot pressing according to the embodiment is cut, since the polymer-based antistatic material exists on the fiber surface, dust generation due to loosening of the fibers contained in the base material layer can be suppressed.

For example, when the polymer-based antistatic material of one embodiment is cut, the polymer-based antistatic material is coated on the cut surface, dried, and subjected to heat treatment, and then the buffer material for hot pressing is used for hot pressing or heat treatment. Compression bonding is also possible.

The buffer material for thermocompression according to the embodiment functions as a cushion material having sufficient cushioning properties for applications such as thermocompression processing and thermocompression bonding.

The embodiments of the invention are merely illustrative, and the scope of the invention is not limited to these embodiments. <Example>

In order to confirm the effect of the present invention, the buffer materials for hot pressing of Examples 1 to 11 were produced, and comparative experiments were conducted. ‧Example 1 Manufacture of buffer material for hot pressing of Example 1

The materials of the buffer material for hot pressing of Preparation Example 1 are as follows: basis weight: 900 g/m ² , thickness 2.0 mm; and Conex (registered trademark) amide double woven fabric, DAI-EL (registered trademark) G701 as Fluorine rubber compound of the base, epoxy resin 383J, carbon of KETJENBLACK EC600JD, and polyimide film (manufactured by DU PONT-TORAY Co., Ltd., thickness 125m, part number 500H).

Amide double woven fabric is used as a fibrous layer. Fluorine rubber compound and epoxy resin 383J are used as polymer materials. Carbon is used as an antistatic material. Polyimide films are used as non-static films.

The buffer material for hot pressing of Example 1 was produced as follows.

When the weight of the fluororubber compound was set to 100, the weight of the carbon relative to it (that is, phr) was 15 phr, and 15 phr of carbon was dispersed in the fluororubber compound to prepare a fluororubber antistatic material. A solvent such as ethyl acetate or methyl ethyl ketone is added to the fluororubber-based antistatic material to prepare a fluororubber-based antistatic material paste having a solid concentration of about 20 to 50%.

The fluorine rubber-based anti-static material paste is impregnated with amide double-woven fabric. After that, it was dried to remove the solvent so that the impregnated solids amount of the fluororubber-based antistatic material was 500 g/m ² .

The fluorine rubber-based anti-static material paste is applied to both main surfaces of the amide double woven fabric impregnated with the fluoro-rubber-based anti-static material. After that, it was dried to remove the solvent, and the polyimide films were thermocompression-bonded on both main surfaces to be integrated, and the fluororubber-based antistatic material was cured.

In addition, 15 phr of carbon and a curing agent were added to the epoxy resin and dispersed to prepare an epoxy resin-based antistatic material.

An epoxy resin-based antistatic material was applied as the outermost layer on both main surfaces of the constituent members integrated by thermocompression bonding of the polyimide film. Next, the epoxy resin-based antistatic material is cured, and the end of the cured product is cut.

Furthermore, a solvent such as ethyl acetate or methyl ethyl ketone is added to the fluororubber-based antistatic material to prepare a fluororubber-based antistatic material having a solid content concentration of about 5 to 20%. The fluororubber-based antistatic material paste was applied to the cut ends. After the end portion treatment, drying was performed to remove the solvent, and heat treatment was performed to obtain a buffer material for hot pressing having a thickness of 2.1 mm. This was used as the buffer material for hot pressing of Example 1. ‧Example 2

From the manufacturing method of the buffer material for hot pressing of Example 1, the step of bonding and integrating the polyimide film by thermocompression was omitted, and the buffer material for hot pressing was manufactured by this manufacturing method. This was used as the buffer material for hot pressing of Example 2.

When the buffer material for hot pressing of Example 2 is compared with the buffer material for hot pressing of Example 1, the difference in structure is that it does not have a polyimide film. ‧Example 3

From the production method of the buffer material for hot pressing of Example 1, the step of processing the end portion using the fluororubber-based antistatic material was omitted, and the buffer material for hot pressing was produced by this production method. This was used as the buffer material for hot pressing of Example 3.

Comparing the buffer material for hot pressing of Example 3 with the buffer material for hot pressing of Example 1, the difference in structure is that the edge treatment using the fluororubber-based antistatic material paste is not performed. ‧Example 4

From the manufacturing method of the buffer material for thermocompression of Example 1, the step of thermocompression bonding and integration of the polyimide film, and the step of edge treatment using the fluororubber-based antistatic material are omitted. Buffer material for pressing. This was used as the buffer material for hot pressing of Example 4.

Comparing the buffer material for hot pressing of Example 4 with the buffer material for hot pressing of Example 1, the difference in structure lies in that it does not have a polyimide film and does not have an edge treatment with a fluororubber-based antistatic material paste. ‧Example 5 Manufacture of buffer material for hot pressing of Example 5

The materials of the buffer material for hot pressing of Preparation Example 5 are as follows: basis weight: 900 g/m ² , thickness 2.0 mm; and Conex (registered trademark) amide double woven fabric, DAI-EL (registered trademark) G701 as The fluororubber compound of the base, the carbon of KETJENBLACK EC600JD, and the antistatic fluororesin film.

Amide double woven fabric is used as a fibrous layer. The fluororubber compound is used as a polymer-based material. Carbon is used as an antistatic material. The antistatic fluororesin film is used as the outermost layer.

The buffer material for hot pressing of Example 5 was produced as follows.

Disperse 15 phr of carbon in the fluororubber compound to prepare a fluororubber antistatic material. A solvent such as ethyl acetate or methyl ethyl ketone is added to the fluororubber-based antistatic material to prepare a fluororubber-based antistatic material paste having a solid concentration of about 20 to 50%.

The fluorine rubber-based anti-static material paste is impregnated with amide double-woven fabric. After that, it was dried to remove the solvent so that the impregnated solids amount of the fluororubber-based antistatic material was 500 g/m ² .

The fluorine rubber-based anti-static material paste is applied to both main surfaces of the amide double woven fabric impregnated with the fluoro-rubber-based anti-static material. After that, it was dried to remove the solvent, and the antistatic fluororesin film was thermocompression-bonded on both main surfaces to integrate it, and the fluororubber-based antistatic material was cured, and the end of the cured product was cut to obtain a thermocompression buffer material. This was used as the buffer material for hot pressing of Example 5. ‧Example 6 Manufacture of buffer material for hot pressing of Example 6

The materials of the buffer material for hot pressing of Preparation Example 6 are as follows: basis weight: 900 g/m ² , thickness 2.0 mm; and Conex (registered trademark) amide double woven fabric, DAI-EL (registered trademark) G701 as Fluoroelastomer compound of base, epoxy 383J, and carbon of KETJENBLACK EC600JD.

Amide double woven fabric is used as a fibrous layer. Fluorine rubber compound and epoxy resin 383J are used as polymer materials. Carbon is used as an antistatic material.

The buffer material for hot pressing of Example 6 was produced as follows.

Add a solvent such as ethyl acetate or methyl ethyl ketone to the fluororubber compound to prepare a fluororubber compound paste with a solid concentration of about 20 to 50%.

The fluororubber compound paste is impregnated with amide double-woven fabric. After that, it was dried to remove the solvent so that the impregnated solids amount of the fluororubber compound was 500 g/m ² . Further heat treatment is performed to harden the fluororubber compound.

In addition, 15 phr of carbon and a curing agent were added to the epoxy resin and dispersed to prepare an epoxy resin-based antistatic material.

On the two main surfaces of the amide double woven fabric impregnated with the fluororubber compound, an epoxy resin-based antistatic material is coated as the outermost layer. Next, heat treatment was performed to harden the epoxy resin-based antistatic material, and the end portion of the hardened product was cut to obtain a buffer material for hot pressing. This was used as the buffer material for hot pressing of Example 6. ‧Example 7

In the method for producing a buffer material for hot pressing of Example 6, a step of edge treatment using a fluororubber-based antistatic material was added to produce a buffer material for hot pressing. This was used as the buffer material for hot pressing of Example 7.

Comparing the buffer material for hot pressing of Example 7 with the buffer material for hot pressing of Example 6, the difference lies in the additional use of an edge treatment of a fluororubber-based antistatic material. ‧Example 8

In the manufacturing method of the buffer material for hot pressing of Example 6, the step of applying the epoxy resin-based antistatic material as the outermost layer was changed to the step of applying the epoxy resin. Furthermore, in the method after this change, the process of edge part processing using a fluororubber-type antistatic material was added, and the buffer material for hot pressing was produced. This was used as the buffer material for hot pressing of Example 8.

Comparing the buffer material for hot pressing of Example 8 with the buffer material for hot pressing of Example 6, the difference lies in the presence of epoxy resin as the outermost layer and the additional use of edge treatment of a fluororubber-based antistatic material. ‧Example 9

The method for producing a hot-pressing buffer material in Example 6 was changed by omitting the step of impregnating the amide double woven fabric with the fluororubber compound. Furthermore, in the method after this change, the process of edge part processing using a fluororubber-type antistatic material was added, and the buffer material for hot pressing was produced. This was used as the buffer material for hot pressing of Example 9.

The difference between the buffer material for hot pressing of Example 9 and the buffer material for hot pressing of Example 6 is that the fluorine rubber compound is not impregnated with the amide double woven fabric, and the edge treatment of the fluorine rubber antistatic material is added. . ‧Example 10

From the manufacturing method of the buffer material for hot pressing of Example 6, the process of apply|coating an epoxy resin type antistatic material as an outermost layer was omitted and manufactured. This was used as the buffer material for hot pressing of Example 10.

Comparing the buffer material for hot pressing of Example 10 with the buffer material for hot pressing of Example 6, the difference lies in the absence of the epoxy resin-based antistatic material as the outermost layer. ‧Example 11

In the manufacturing method of the buffer material for hot pressing in Example 6, the step of applying the epoxy resin-based antistatic material as the outermost layer was changed to the step of applying the epoxy resin, and the impregnation of the amide double woven fabric with fluororubber was omitted. Complex steps. Furthermore, in the method after this change, the process of edge part processing using a fluororubber compound is added, and the buffer material for hot pressing is manufactured. This was used as the buffer material for hot pressing of Example 11.

[評估項目] ‧空隙比率If the buffer material for hot pressing of Example 11 is compared with the buffer material for hot pressing of Example 6, the difference lies in the presence of epoxy resin as the outermost layer, without impregnating the amide double woven fabric with the fluororubber compound, and the additional use of fluororubber end treatment. [Table 1]

[Assessment item] ‧Void ratio

Calculate the void ratio of the end portion and the central portion of the buffer material for hot pressing by the following formula: [void ratio]=[void ratio of the end portion of the buffer material for hot pressing]/[voids in the central portion of the buffer material for hot pressing Rate]. ‧Foreign body adhesion after cutting

The buffer material for hot pressing was cut out, the end surface of the buffer material for hot pressing that was cut was visually confirmed, and the state of foreign matter adhering to the end surface was evaluated in two stages. For example, as 1<2, 1 shows that less foreign matter adheres to the end surface of the buffer material for hot pressing, and 2 shows that more foreign matter adheres to the end surface of the buffer material for hot pressing. ‧Dust generation during hot pressing

The pressure-bonding at a temperature of 200° C. and a pressure of 3 MPa was performed once for 60 minutes, and the compression-bonding was performed 10 times with respect to the buffer material for hot pressing. After that, the buffer material for hot pressing and the metal plate, such as stainless steel (SUS), were visually confirmed, and the dust generation condition was evaluated in three stages. For example, the evaluation result is 1<2<3, 1 observes the least dust generation, and 3 observes the most dust generation. ‧Foreign matter adhesion during hot pressing

The pressure-bonding at a temperature of 200° C. and a pressure of 3 MPa was performed once for 60 minutes, and the compression-bonding was performed 10 times with respect to the buffer material for hot pressing. After that, the buffer material for hot pressing was visually confirmed, and the state of foreign matter adhesion was evaluated in four stages. For example, as 1<2<3<4, 1 is observed to have the least adhesion of foreign matter to the buffer material for hot pressing, and 4 is observed to have the most adhesion of foreign matter to the buffer material for hot pressing. ‧Effect on pressing products

Hot pressing is performed using a buffer material for hot pressing. The inside of the press-molded product formed by this hot pressing was confirmed, and the state of the generation of voids was evaluated in two stages. For example, as 1<2, 1 means that no voids are observed inside the pressed product, and 2 means that voids are observed inside the pressed product. [result]

The results of the evaluation project are as follows. ‧Void ratio

In Examples 9 and 11, the void ratio at the end and the center of the hot-pressing buffer material was less than 0.9, and in Examples 9 and 11, fluororubber or fluororubber-based antistatic material was present only at the end. ‧Foreign body adhesion after cutting

As a result, the hot-pressing buffer materials of Examples 1 to 5, which have base material layers produced by impregnating a fluororubber-based antistatic material with amide double-woven fabrics, had less foreign matter adhesion after cutting. ‧Dust generation during hot pressing

As a result, the buffer materials for hot pressing of Example 1, Example 3, and Example 5 generated the least dust, and Example 1 and Example 3 used polyimide, and Example 5 used an antistatic fluororesin film. In addition, a lot of dust generation was observed in Examples 9 to 11, and these Examples 9 to 11 did not have the outermost layer, or the base material layer was not impregnated. ‧Foreign matter adhesion during hot pressing

Example 8, Example 10, and Example 11 have the most foreign matter adhered, and in this Example 8, Example 10, and Example 11, the epoxy resin-based antistatic material is not provided in the outermost layer. ‧Effect on pressing products

The generation of voids was observed in the press-bonded products of the buffer materials for hot pressing of Examples 9 and 11 having a void ratio of less than 0.9. ‧Overall

In the hot-pressing buffer materials of Examples 1 to 5, the fluororubber-based antistatic material present in the base material layer, and the epoxy-based antistatic material or antistatic fluororesin film present as the outermost layer are effective in suppressing heat. The anti-static property of foreign matter adhesion of the buffer material for pressing is very helpful. Furthermore, the fluororubber-based antistatic material present on the end face of the buffer material for hot pressing also contributes to the suppression of foreign matter adhesion to the buffer material for hot pressing. Moreover, the polyimide film existing on the main surface of the base material layer contributes to the suppression of dust generation from the base material layer of the buffer material for hot pressing. Then, the buffer material for hot pressing with a void ratio of 0.9 or more can be press-molded without causing abnormal voids in the press-molded product.

1‧‧‧fibrous layer 2‧‧‧Fiber 3, 15, 16, 35, 36, 49, 55, 56‧‧‧Polymer anti-static material 3c, 15c, 16c, 35c, 36c, 55c, 56c‧‧‧anti-static material 4‧‧‧Substrate layer 10, 20, 30, 40, 50‧‧‧Buffer material for hot pressing 25, 26‧‧‧Film antistatic polymer 37, 38, 58‧‧‧Film polymer

FIG. 1 is an enlarged cross-sectional view of a part of a buffer material for hot pressing according to an embodiment. FIG. 2 is an enlarged cross-sectional view of a part of a buffer material for hot pressing according to a further embodiment. Fig. 3 is an enlarged cross-sectional view of a part of a buffer material for hot pressing according to a further embodiment. Fig. 4 is an enlarged cross-sectional view of a part of the buffer material for hot pressing according to a further embodiment. Fig. 5 is an enlarged cross-sectional view of a part of the buffer material for hot pressing according to a further embodiment.

1‧‧‧fibrous layer

2‧‧‧Fiber

3, 15, 16‧‧‧Polymer anti-static material

3c, 15c, 16c‧‧‧anti-static material

4‧‧‧Substrate layer

10‧‧‧Buffer material for hot pressing

Claims (8)

A buffer material for hot pressing, comprising: one or more base material layers, comprising a fibrous layer made of a woven fabric or a non-woven fabric, and a first polymer system that covers the surfaces of fibers constituting the fibrous layer An antistatic material; a second polymer-based antistatic material, which is attached to one main surface of the base material layer and exists as the outermost layer; and a third polymer-based antistatic material, which is attached to the base material layer The other main surface exists as the outermost layer, and the first, second, and third polymer-based antistatic materials include a polymer-based material and an antistatic material dispersed in the polymer-based material. The buffer material for hot pressing according to claim 1, further comprising: one or more first intermediate layers present on one main surface of the second polymer-based antistatic material and the base material layer and/or one or more second intermediate layers, which are present between the third polymer-based antistatic material and the other main surface of the base material layer. The buffer material for hot pressing according to claim 1 or claim 2, wherein the second polymer-based antistatic material or the third polymer-based antistatic material is in the form of a film. The buffer material for hot pressing according to claim 2, wherein the buffer material for hot pressing comprises the first intermediate layer and/or the second intermediate layer; the first intermediate layer and/or the second intermediate layer The layer is an antistatic or non-antistatic non-film-like polymer or a film-like polymer. The buffer material for hot pressing according to claim 1 or claim 2, further comprising a fourth polymer-based antistatic material, which is coated on the edge of the buffer material for hot pressing and connects across the opposing sides. Exist on the face of the two main faces. The buffer material for hot pressing as described in claim 1 or claim 2 of the scope of the application, wherein the thickness during compression is 30-90% of the thickness before compression by pressing 3 MPa in the thickness direction at room temperature. The buffer material for hot pressing as described in claim 1 or 2 of the scope of claim 2, wherein if the edge of the buffer material for hot pressing is connected to the surface that spans across the two main surfaces facing each other, the distance to the inner side is within 3 mm. When the porosity is set as A, and the porosity of the part with a distance of 100 mm or more inward from the surface connecting the edges of the buffer material for hot pressing across the opposing two main surfaces is set as B, the porosity of the buffer material for hot pressing is set as B. The relationship between the porosity A and the porosity B conforms to the following formula: A/B

0.9. The buffer material for hot pressing according to claim 1 or claim 2 of the scope of claim 2, wherein the overall antistatic performance has a charging voltage of 1 kV or less when measured by a method according to the JIS L 1094 measurement method.

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