TWI762195B - Using methods for image sensor - Google Patents

Abstract

Disclosed herein is a method of using an image sensor comprising N sensing areas for capturing images of a scene, the N sensing areas being physically separate from each other, the method comprising: for i=1,…,P, and j=1,…,Q(i), positioning the image sensor at a location (i,j) and capturing a partial image (i,j) of the scene using the image sensor while the image sensor is at the location (i,j), thereby capturing in total R partial images, wherein R is the sum of Q(i), i=1,…,P, wherein P＞1, wherein Q(i), i=1,…,P are positive integers and are not all 1, wherein for i=1,…,P, a location group (i) comprises the locations (i,j), j=1,…,Q(i), and wherein a minimum distance between 2 locations of 2 different location groups is substantially larger than a maximum distance between two locations of a same location group; and determining a combined image of the scene based on the R partial images.

Description

How to use the image sensor

The disclosure of the present invention relates to a method of using an image sensor.

A radiation detector is a device that measures the properties of radiation. Examples of such properties may include the spatial distribution of the intensity, phase and polarization of the radiation. The radiation may be radiation interacting with the object. For example, the radiation measured by the radiation detector may be radiation that has penetrated or reflected from the object. The radiation may be electromagnetic radiation, such as infrared light, visible light, ultraviolet light, X-rays or gamma rays. The radiation may be of other types, such as alpha rays and beta rays. An image sensor may include multiple radiation detectors. Radiation may include radiating particles such as photons (electromagnetic waves) and subatomic particles.

The present invention discloses a method of using an image sensor. The image sensor includes N sensing areas for capturing scene images, where N is a positive integer, and the N sensing areas are physically separated from each other, so The method includes: for i = 1,...,P, and j = 1,...,Q(i), placing the image sensor at position (i,j) relative to the scene, and using the image sensor to capture a partial image (i, j) of the scene when the image sensor is at the position (i, j), thereby capturing a total of R partial images, where R is Q(i) , the sum of i = 1, ..., P, where P is an integer greater than 1, where Q(i), i = 1, ..., P, are positive integers and not all 1, where for i = 1, .. .,P, the position group(i) includes the positions(i,j), j = 1,...,Q(i), and where in the position group(i), i = 1,...,P , the minimum distance between one position in one position group and another position in the other position group in the position group (i), i = 1, ..., P, is substantially greater than that in the position group ( i), i = 1, . . . , P, the maximum distance between two positions in the same position group; and the combined image of the scene is determined based on the R partial images.

According to an embodiment, N is greater than one.

According to an embodiment, said placing the image sensor at position (i,j) for i = 1,...,P, and j = 1,...,Q(i), is performed one by one .

According to an embodiment, Q(i), i = 1, . . . , P, are the same and greater than 1.

According to an embodiment, the minimum distance is close to and smaller than the size of the sensing areas in the N sensing areas.

According to an embodiment, the minimum distance is greater than 100 times the maximum distance.

According to an embodiment, the maximum distance is less than 10 times the size of the sensing elements of the N sensing regions.

According to an embodiment, said placing said image sensor at said position (i,j) for i = 1,...,P, and j = 1,...,Q(i), includes placing all The image sensor is directly moved from a position of a position group in the position group (i), i = 1, . . . , P, to the position group (i), i = 1, . . . , P, another position in another position group, and does not include moving the image sensor directly from a position in one position group in the position group (i), i = 1, . . . , P, Move to another location in the same location group.

According to an embodiment, the determining of the combined image includes stitching the partial images (i, 1), i = 1, . . . , P, to form a stitched image of the scene.

According to an embodiment, the determining the combined image further comprises, for i = 1, . . . , P, determining an enhanced partial image ( i).

According to an embodiment, the determining the combined image further comprises for i = 1, . . . , P, using the enhanced partial image (i) to replace the partial image (i, 1) of the stitched image.

According to an embodiment, the determining the combined image further comprises, after performing the using, equalizing the resolutions of different regions of the stitched image.

According to an embodiment, the determining the combined image further comprises for i = 1, . . . , P, if the resolution of the enhanced partial image (i) is higher than the resolution of the partial image (i, 1), The enhanced partial image (i) is then used to replace the partial image (i, 1) of the stitched image.

According to an embodiment, said determining said enhanced partial image (i) comprises determining said positions (i, j), j = 1, . . . , Q(i), relative to each other.

According to an embodiment, said determining said positions (i, j), j = 1, . . . , Q(i), said positions relative to each other comprises using markers that are stationary relative to said scene.

According to an embodiment, said determining said positions (i, j), j = 1, . 1,...,Q(i), upsamples the partial images (i,j), respectively; , j), j = 1, ..., Q(i), are associated to determine the positions of (i, j), j = 1, ..., Q(i), relative to each other.

According to an embodiment, the determining of the combined image comprises: for i = 1, . . . , P, based on the partial images (i, j), j = 1, . i).

According to an embodiment, the determining the combined image further comprises stitching the enhanced partial images (i), i = 1, . . . , P, to form a stitched image of the scene.

According to an embodiment, the determining the combined image further comprises equalizing the resolutions of different regions of the stitched image.

Figure 1 schematically shows a radiation detector 100 as an example. The radiation detector 100 may include an array of sensing elements 150 (also referred to as pixels 150). The array may be a rectangular array (as shown in Figure 1), a cellular array, a hexagonal array, or any other suitable array. The radiation detector 100 in the example of FIG. 1 has 28 sensing elements 150 arranged in 4 rows and 7 columns. In general, however, the radiation detector 100 may have any number of sensing elements 150 arranged in any manner.

Each sensing element 150 may be configured to detect radiation incident thereon from a radiation source (not shown), and may be configured to measure a characteristic of the radiation (eg, particle energy, wavelength, radiant flux) amount and frequency). Radiation can include particles such as photons (electromagnetic waves) and subatomic particles. Each sensing element 150 may be configured to count the number of radiation particles incident thereon whose energy falls into the plurality of energy bins over a period of time. All of the sensing elements 150 may be configured to count the number of radiation particles incident thereon within the plurality of energy boxes within the same time period. When the incident radiation particles have similar energies, the sensing element 150 may simply be configured to count the number of radiation particles incident thereon over a period of time without measuring the energy of the individual radiation particles.

Each sensing element 150 may have its own analog-to-digital converter (ADC) configured to digitize an analog signal representing incident radiation particle energy into a digital signal, or to digitize a plurality of incident radiation particles The analog signal of the total energy is digitized into a digital signal. The sensing elements 150 may be configured to operate in parallel. For example, while one sensing element 150 measures an incident radiation particle, another sensing element 150 may be waiting for the radiation particle to arrive. The sensing elements 150 may not necessarily be individually addressable.

The radiation detector 100 described herein may have features such as X-ray telescopes, mammography, industrial X-ray defect detection, X-ray microscopy or photomicrography, X-ray casting inspection, X-ray nondestructive testing, X-ray welding inspection, X-ray Radiographic digital subtraction angiography and other applications. The radiation detector 100 can also be used in place of a photographic negative, photographic film, photoexcitable phosphor plate, X-ray image intensifier, scintillator or X-ray detector.

2A schematically illustrates a simplified cross-sectional view of the radiation detector 100 of FIG. 1 along line 2A-2A, according to an embodiment. More specifically, the radiation detector 100 may include a radiation absorbing layer 110 and an electronic layer 120 (eg, an application specific integrated circuit) for processing or analyzing electrical signals of incident radiation generated in the radiation absorbing layer 110 . The radiation detector 100 may or may not include a scintillator (not shown in the figure). The radiation absorbing layer 110 may comprise a semiconductor material such as silicon, germanium, gallium arsenide, cadmium telluride, cadmium zinc telluride, or combinations thereof. The semiconductor material may have a high mass decay coefficient for the radiation of interest.

FIG. 2B schematically shows a detailed cross-sectional view of the radiation detector 100 along line 2A-2A of FIG. 1 as an example. More specifically, the radiation absorbing layer 110 may include one or more diodes (eg, p-i-n or p-n) consisting of a first doped region 111, one or more discrete regions 114 of a second doped region 113 ). The second doped region 113 may be separated from the first doped region 111 by an optional intrinsic region 112 . The discrete regions 114 are separated from each other by the first doped region 111 or the intrinsic region 112 . The first doped region 111 and the second doped region 113 have opposite types of doping (eg, region 111 is p-type and region 113 is n-type, or region 111 is n-type and region 113 is p-type ). In the example in FIG. 2B , each discrete region 114 of the second doped region 113 together with the first doped region 111 and the optional intrinsic region 112 forms a diode. That is, in the example of FIG. 2B , the radiation absorbing layer 110 includes a plurality of diodes (more specifically, 7 diodes correspond to the 7 sense elements 150 of a row in the array of FIG. 1 ) ). The plurality of diodes have electrical contacts 119A as shared (common) electrodes. The first doped region 111 may also have discrete portions.

The electronic layer 120 may include an electronic system 121 suitable for processing or interpreting signals generated by radiation incident on the radiation absorbing layer 110 . The electronic system 121 may include analog circuits such as filter networks, amplifiers, integrators, comparators, or digital circuits such as microprocessors and memory. The electronic system 121 may include one or more analog-to-digital converters. The electronic system 121 may include components common to the sensing elements 150 or components dedicated to a single sensing element 150 . For example, the electronic system 121 may include an amplifier dedicated to each sensing element 150 and a microprocessor shared among all the sensing elements 150 . The electronic system 121 may be electrically connected to the sensing element 150 through the via 131 . The spaces between the vias can be filled with a filling material 130 which can increase the mechanical stability of the connection of the electronic layer 120 to the radiation absorbing layer 110 . Other bonding techniques are possible to connect the electronic system 121 to the sensing element 150 without using the vias 131 .

When radiation from the radiation source (not shown) strikes the radiation absorbing layer 110 comprising a diode, the radiation particles can be absorbed and generate one or more charge carriers through several mechanisms (eg, electrons, holes). The charge carriers can drift towards the electrodes of one of the diodes under an electric field. The electric field may be an external electric field. The electrical contacts 119B may include discrete portions, each of which is in electrical contact with the discrete regions 114 . The term "electrical contact" is used interchangeably with the word "electrode". In embodiments, the charge carriers may drift in different directions such that the charge carriers generated by a single radiation particle are not substantially shared by the two different discrete regions 114 ("substantially not shared" means herein Less than 2%, less than 0.5%, less than 0.1%, or less than 0.01% of these carriers flow to a different one of the discrete regions 114) than the rest of the carriers. Carriers generated by radiation particles incident around the footprint of one of the discrete regions 114 are substantially not shared by the other of the discrete regions 114 . A sensing element 150 associated with a discrete region 114 may be the region surrounding said discrete region 114 in which substantially all (over 98%, over 99.5%, over 98%, over 99.5%, over 99.9% or more) into it. That is, less than 2%, less than 1%, less than 0.1%, or less than 0.01% of the carriers flow out of the sensing element 150 .

2C schematically illustrates an alternative detailed cross-sectional view of the radiation detector 100 of FIG. 1 along line 2A-2A, according to an embodiment. More specifically, the radiation absorbing layer 110 may include a semiconductor material, such as a resistor of silicon, germanium, gallium arsenide, cadmium telluride, cadmium zinc telluride, or combinations thereof, but not a diode. The semiconductor material may have a high mass decay coefficient for the radiation of interest. In an embodiment, the electronic layer 120 in Figure 2C is similar in structure and function to the electronic layer 120 in Figure 2B.

When the radiation strikes the radiation absorbing layer 110 including the resistor but not the diode, the radiation can be absorbed and generate one or more charge carriers through several mechanisms. One radiating particle can generate 10 to 100,000 charge carriers. The charge carriers can drift toward electrical contacts 119A and 119B under the electric field. The electric field may be an external electric field. The electrical contacts 119B include discrete portions. In embodiments, the charge carriers may drift in different directions such that the charge carriers generated by a single radiation particle are not substantially shared by the two different discrete portions of the electrical contact 119B ("substantially not shared" "Here it is meant that less than 2%, less than 0.5%, less than 0.1%, or less than 0.01% of these carriers flow to a different set of discrete parts than the rest of the carriers). Carriers generated by radiation particles incident around the footprint of one of the discrete portions of the electrical contact 119B are substantially not shared by the other discrete portion of the electrical contact 119B. A sensing element 150 associated with one of the discrete portions of the electrical contact 119B may be the region around the discrete portion in which substantially all (over 98%, over 98%, more than 99.5%, over 99.9%, or over 99.99%) into it. That is, less than 2%, less than 0.5%, less than 0.1%, or less than 0.01% of the charge carriers flow to the sensing element associated with one of the discrete portions of the electrical contact 119B outside.

FIG. 3 schematically illustrates a top view of a package 200 including the radiation detector 100 and a printed circuit board 400 according to an embodiment. The term "printed circuit board" used in the present invention is not limited to a specific material. For example, printed circuit boards may include semiconductors. The radiation detector 100 is mounted to the printed circuit board 400 . For clarity, the wiring between the radiation detector 100 and the printed circuit board 400 is not shown. The printed circuit board 400 may have one or more radiation detectors 100 . The printed circuit board 400 may have areas 405 not covered by the radiation detector 100 (eg, areas for accommodating bond wires 410). The radiation detector 100 may have a sensing area 190 where the sensing element 150 ( FIG. 1 ) is located. The radiation detector 100 may have a peripheral region 195 near its edges. The peripheral area 195 has no sensing elements, and the radiation detector 100 does not detect radiation particles incident on the peripheral area 195 .

FIG. 4 schematically illustrates a cross-sectional view of an image sensor 490 according to an embodiment. The image sensor 490 may include the plurality of packages 200 of FIG. 3 mounted to a system printed circuit board 450 . FIG. 4 shows that the image sensor 490 may include two packages 200 as an example. The electrical connection between the printed circuit board 400 and the system printed circuit board 450 may be achieved by bonding wires 410. In order to accommodate the bond wires 410 on the printed circuit board 400 , the printed circuit board 400 has an area 405 not covered by the radiation detector 100 . In order to accommodate the bonding wires 410 on the system printed circuit board 450 , there are gaps between the packages 200 . The gap may be about 1 mm or more. Radiation particles incident on the peripheral area 195, on the area 405 or on the gap cannot be detected by the package 200 on the system printed circuit board 450.

A dead zone of a radiation detector (eg, the radiation detector 100 ) refers to an area of the radiation receiving surface of the radiation detector where incident radiation particles cannot be detected by the radiation detector. A dead zone of a package (eg, the package 200 ) refers to an area of the radiation receiving surface of the package where incident radiation particles cannot be detected by the radiation detector or radiation detectors in the package. In the example shown in FIGS. 3 and 4 , the dead area of the package 200 includes the peripheral area 195 and the area 405 . A dead zone (eg, dead zone 488 ) of an image sensor (eg, image sensor 490 ) has a group of packages (eg, packages mounted on the same printed circuit board, packages arranged in the same layer) included in the group The combination of the dead area of the package and the gap between the packages.

In embodiments, the image sensor 490 including the radiation detector 100 may have the dead zone 488 that cannot detect incident radiation. However, in embodiments, the image sensor 490 with the sensing area 190 may capture partial images of an object or scene (not shown), and these captured partial images may then be stitched to form the entire object or scene. A complete image of the object or scene described.

5A-5D schematically illustrate top views of the image sensor in operation according to an embodiment. For simplicity, only two sensing areas 190a and 190b of the image sensor 490 and the blind area 488 (ie, other parts of the image sensor 490, such as the peripheral area 195 (Fig. 4), not shown). In an embodiment, the carton 510 surrounding the metal sword 512 may be located between the image sensor 490 and a radiation source (not shown) in front of the page. The carton 510 is between the image sensor 490 and the viewer's eye. In the following, for the sake of generality, the cardboard box 510 enclosing the metal sword 512 may be referred to as object/scene 510+512.

In an embodiment, the operation of the image sensor 490 in capturing the image of the object/scene 510+512 may be as follows. First, as shown in FIG. 5A, the object/scene 510+512 may be stationary, and the image sensor 490 may be moved to a first image capture position relative to the object/scene 510+512. Then, when the image sensor 490 is in the first image capture position, the image sensor 490 can be used to capture a first partial image 520.1 of the object/scene 510+512.

Next, in an embodiment, as shown in Figure 5B, the image sensor 490 may be moved to a second image capture position relative to the object/scene 510+512. Then, when the image sensor 490 is in the second image capture position, the image sensor 490 can be used to capture a second partial image 520.2 of the object/scene 510+512.

Next, in an embodiment, as shown in Figure 5C, the image sensor 490 may be moved to a third image capture position relative to the object/scene 510+512. Then, when the image sensor 490 is in the third image capture position, the image sensor 490 can be used to capture a third partial image 520.3 of the object/scene 510+512.

In an embodiment, the size and shape of the sensing regions 190a and 190b and the positions of the first, second and third image capturing locations may be such that the partial images 520.1, 520.2 and 520.3 Any partial image of 520.1, 520.2 and 520.3 overlaps with at least another partial image of said partial images 520.1, 520.2 and 520.3. For example, the distance 492 between the first image capturing location and the second image capturing location may be close to and less than the width 190w of the sensing area 190a; thus, the first portion of the image 520.1 and the second portion Image 520.2 overlay.

In an embodiment, the partial images 520.1, 520.2 may be stitched where any of the partial images 520.1, 520.2 and 520.3 overlap with at least another of the partial images 520.1, 520.2 and 520.3 and 520.3 to form a more complete image 520 of the object/scene 510+512 (FIG. 5D). In an embodiment, the size and shape of the sensing regions 190a and 190b and the positions of the first, second and third image capturing locations may be such that the stitched image 520 covers the entire Object/Scene 510 + 512, as shown in Figure 5D.

6A-6D schematically illustrate top views of the image sensor 490 in operation according to an alternative embodiment. In an embodiment, the operation of the image sensor 490 in FIGS. 6A-6D may be similar to the operation of the image sensor 490 in FIGS. 5A-5D with respect to the capture of the partial images 520.1, 520.2 and 520.3 Operation of image sensor 490 . In an embodiment, the operation of the image sensor 490 in FIGS. 6A-6D may include the following in addition to the capture of the partial images 520.1, 520.2 and 520.3 as described above.

In an embodiment, after capturing the third partial image 520.3, the image sensor 490 may be moved to the first image capture position (solid rectangular image sensor 490 in FIG. 6A) or A fourth image capture location in its vicinity (dotted rectangular image sensor 490 in FIG. 6A ). Then, when the image sensor 490 is at the fourth image capture location, the image sensor 490 may be used to capture a fourth partial image 520.4 of the object/scene 510+512. The first image capturing location and the fourth image capturing location may be considered to belong to a first location group. The first partial picture and the fourth partial picture may be considered to belong to the first partial picture group.

In an embodiment, after capturing the fourth partial image 520.4, the image sensor 490 may be moved to the second image capture position (solid rectangular image sensor 490 in FIG. 6B) or A fifth image capture position in its vicinity (dotted rectangular image sensor 490 in FIG. 6B ). Then, when the image sensor 490 is at the fifth image capture position, the image sensor 490 may be used to capture a fifth partial image 520.5 of the object/scene 510+512. The second image capturing location and the fifth image capturing location may be considered to belong to a second location group. The second partial picture and the fifth partial picture may be considered to belong to the second partial picture group.

In an embodiment, after capturing the fifth partial image 520.5, the image sensor 490 may be moved to the third image capture position (solid rectangular image sensor 490 in FIG. 6C) or A sixth image capture location in its vicinity (dotted rectangular image sensor 490 in FIG. 6C ). Then, when the image sensor 490 is at the sixth image capture location, the image sensor 490 may be used to capture a sixth partial image 520.6 of the object/scene 510+512. The third image capturing position and the sixth image capturing position may be considered to belong to a third position group. The third partial picture and the sixth partial picture may be considered to belong to the third partial picture group.

In an embodiment, the positions of the six image capturing positions may be such that the image capturing positions of one position group of the first position group, the second position group and the third position group are the same as the first position The maximum distance of another image capture location of another location group of the group, the second group of locations, and the third group of locations is substantially greater (eg, greater than 10 times, greater than 20 times, greater than 50 times, or greater than 100 times) ) the maximum distance between two image capture positions of one of the first position group, the second position group and the third position group. In other words, the minimum distance between two image capturing positions of two different position groups is substantially greater than the maximum distance between two image capturing positions of the same group.

In embodiments, the minimum distance may be close to and less than the width 190w of the sensing region 190a (FIG. 5A). For example, the minimum distance may be in the range of 80% to 99.99% of the width 190w. In an embodiment, the minimum distance may be greater than 100 times the maximum distance. In an embodiment, the maximum distance may be less than 10 times the size of the sensing element 150 .

In an embodiment, the image sensor 490 may only be moved directly from an image capture position of a position group to another image capture position of another position group. This means that in this embodiment, the image sensor 490 may not directly move from an image capture position of a position group to another image capture position of the same position group. For example, in this embodiment, the image sensor 490 can be moved directly from the third image capturing position to the fifth image capturing position because the third image capturing position and the fifth image capturing position The locations belong to two different location groups (ie, a third location group and a second location group, respectively). However, in this embodiment, since the third image capturing position and the sixth image capturing position belong to the same position group (ie, the third position group), the image sensor 490 may not Move directly from the third image capturing position to the sixth image capturing position.

Next, in an embodiment, after capturing the six partial images 520.1-6, a combined image 620 of the object/scene 510+512 may be determined based on the six partial images 520.1-6 (FIG. 6D) as follows. Specifically, in embodiments, the partial images 520.1, 520.2, and 520.3 may be stitched to form a stitched image of the object/scene 510+512.

Next, in an embodiment, a first enhanced partial picture may be determined for the first partial picture group based on the partial picture 520.1 and the partial picture 520.4 of the first partial picture group, and then used in place of the The partial image 520.1 of the stitched image. In other words, the partial image 520.4 is used to enhance the partial image 520.1 of the stitched image. More specifically, in an embodiment, the first enhanced partial image may be determined as follows. First, the positions of the first image capture location and the fourth image capture location relative to each other can be determined by (A) measurement using markers or (B) inter-image correlation estimation.

In method (A), in an embodiment, markers may be added at fixed positions relative to said object/scene 510+512, such that at least one of said markers is present in each of said first partial photo group The partial images 520.1 and 520.4. For example, marker 630 (FIG. 6A) is shown for illustration (other markers are not shown for simplicity) and its images are in the partial images 520.1 and 520.4. In an embodiment, the indicia may have the shape of a cross (eg, indicia 630). In an embodiment, the indicia may comprise a metal such as aluminum. Given the position of the marker relative to the object/scene 510+512, the position of the first image capture position and the fourth image capture position can be measured relative to each other.

In an embodiment, method (B) may involve correlating the two partial images 520.1 and 520.4 to determine the positions of the first image capture location and the fourth image capture location relative to each other. Specifically, in an embodiment, the two parts of the two partial pictures 520.1 and 520.4 of the first partial picture group may be compared to determine the correlation coefficient. In an embodiment, if the determined correlation coefficient exceeds a predetermined threshold, the two parts from the two partial images 520.1 and 520.4 may be considered to be the same, so that the first image capture location and The positions of the fourth image capture locations (520.4 and 520.4 respectively) relative to each other. In an embodiment, the two parts from the two partial pictures 520.1 and 520.4 may be considered to be different if the determined correlation coefficient does not exceed a predetermined threshold, and all of the first partial picture set The other two parts of the two partial images 520.1 and 520.4 can be compared, and so on.

In an embodiment, the resolution of the two partial pictures 520.1 and 520.4 of the first partial picture group may be increased (upsampled) before the above-described correlation processing is performed. In an embodiment, the upsampling process may be performed using interpolation.

In an embodiment, where the positions of the first image capture position and the fourth image capture position relative to each other are determined as described above, a resolution enhancement algorithm (also referred to as a super-resolution algorithm) may be The two partial images 520.1 and 520.4 are applied to the first set of partial images to form the first enhanced partial image. In an embodiment, the first enhanced partial image may be used to replace the first partial image 520.1 in the stitched image.

In an embodiment, in a similar manner, a second enhanced partial picture may be determined for this group based on the two partial pictures 520.2 and 520.5 of the second partial picture group, which may then be used in place of the stitched pictures in the stitched picture. The partial image 520.2. Similarly, a third enhanced partial picture can be determined for this group based on the two partial pictures 520.3 and 520.6 of the third partial picture group, which can then be used to replace the partial picture 520.3 in the stitched picture. In an embodiment, after 3 replacements as described above, if different regions of the stitched image have different resolutions, an algorithm may be executed to make the entire stitched image have the same resolution, resulting in the The combined image 620 (FIG. 6D) is described.

Figure 7 shows a flowchart 700 summarizing the operation of the image sensor 490 in accordance with Figures 6A-6D. Specifically, in step 710, the image sensor 490 moves through different image capture positions and captures partial images while in these image capture positions. At step 720, a portion of the captured partial images (eg, one partial image from each partial image group) are stitched to form a stitched image of the scene. In step 730, for each partial picture group, an enhanced partial picture is determined based on the partial picture of the partial picture group, and the resulting enhanced partial picture is used to replace the corresponding partial picture of the stitched picture (ie, to enhance the stitched image). At step 740, if required (ie, if different regions of the stitched image have different resolutions), resolution equalization is performed on the stitched image, resulting in the described object/scene 510+512 (FIG. 6D) Composite image 620 .

FIG. 8 shows a flowchart 800 summarizing and summarizing the operation of the image sensor 490 according to an embodiment. In step 810, the image sensors 490 may be arranged at different locations, and different partial images of the same scene may be captured by the image sensors 490 at these different locations, wherein two different location groups The minimum distance between two locations is basically greater than the maximum distance between two locations in the same location group. In an embodiment, the image sensors 490 may be arranged one by one at these different locations (ie, one location after another) to capture those partial images. At step 820, a combined image of the scene may be determined based on the captured partial imagery.

In the above embodiment, referring to FIGS. 4 and 5A-5D, the image sensor 490 includes two sensing regions 190a and 190b, which are physically separated from each other by the dead zone 488 and have a rectangular shape. In general, the image sensor 490 may include N sensing regions 190 (N being a positive integer), which may be physically separated from each other by dead zones (eg, dead zones 488 ), may be of any size or shape, and may be in any way to arrange.

In the above-described embodiment, the cardboard box 510 surrounding the metal sword 512 is used as an example of the object or scene being examined. In general, the image sensor 490 can be used to inspect any object or scene.

In the above-described embodiment, the image sensor 490 includes two sensing regions 190 and moves through three position groups of two image capture positions. Typically, the image sensor 490 may include N sensing regions (N is a positive integer) and move through P groups of locations (P is an integer greater than 1), where each group of locations may have any number of image captures Location. Therefore, the number of image capturing positions of the position group need not be the same.

In the above-described embodiment, the image sensor 490 is moved between the six image capture positions in the order of first, second, third, fourth, fifth, and then sixth image capture positions. In general, the image sensor 490 can be moved between the six image capture positions (or any number of image capture positions) in any order. For example, the image sensor 490 may move among the six image capture positions in the order of first, second, third, fifth, sixth, and then fourth image capture positions.

In the above embodiment, the object/scene 510+512 remains stationary and the image sensor 490 moves relative to the object/scene 510+512. In general, any moving arrangement is possible as long as the image sensor 490 moves relative to the object/scene 510+512. For example, the image sensor 490 may remain stationary and the object/scene 510 + 512 may move relative to the image sensor 490 .

In the above embodiment, the partial images 520.1, 520.2 and 520.3 are stitched to form a stitched image of the object/scene 510+512. Typically, a combination of partial images and one partial image of each partial image group may be stitched to form a stitched image of the object/scene 510+512. For example, the partial images 520.1, 520.5, and 520.6 may be stitched to form a stitched image of the object/scene 510+512.

In the above-described embodiments, stitching is performed, and then an enhanced partial image is determined and used to enhance the stitched image. Alternatively, the enhanced portion of the image is determined before stitching is performed. For example, the first, second and third enhanced partial images may be determined as described above. The first, second and third enhanced partial images may then be stitched to form the combined and complete image of the object/scene 510+512 (eg, image 620 of Figure 6D). Many other possible ways of processing the six partial images 520.1-520.6 may be used to form the combined and complete image of the object/scene 510+512.

In the above embodiment, the first, second and third enhanced partial images are used to replace the corresponding partial images in the stitched image. In an alternative embodiment, if the resolution of the enhanced partial image is not higher than the resolution of the partial image that the enhanced partial image should replace in the stitched image, the enhanced partial image of the partial image group is not used for such replacement .

For example, if the resolution of the first enhanced partial image is not higher than the resolution of the partial image 520.1, the first enhanced partial image of the first partial image group is not used to replace all the stitched images Partial image 520.1. This occurs when the distance (or offset) between the corresponding first image capture location and the fourth image capture location is K times the size of the sensing element 150, where K is a non-negative integer.

While various aspects and embodiments of the present invention have been disclosed, other aspects and embodiments will be apparent to those skilled in the art. The various aspects and embodiments disclosed in the present invention are for the purpose of illustration rather than limitation, and the true scope and spirit thereof should be subject to the scope of the claims in the present invention.

100: Radiation detector 110: Radiation absorbing layer 111: the first doping region 112: Eigen region 113: the second doping region 114: Discrete area 119A, 119B: electrical contacts 120: Electron layer 121: Electronic Systems 130: Filling material 131: Through hole 150: Sensing element (pixel) 190, 190a, 190b: Sensing area 190w: width 195: Surrounding area 200: Package 400: Printed Circuit Board 405: District 410: Bonding wire 450: System Printed Circuit Board 488: Blind Spot 490: Image Sensor 492: Distance 510: Cardboard Box 512: Metal Sword 510+512: Object/Scene 520.1, 520.2, 520.3, 520.4, 520.5, 520.6, 620: Image 630:Mark 700, 800: Flowchart 710, 720, 730, 740, 810, 820: Steps

Figure 1 schematically shows a radiation detector according to an embodiment. Figure 2A schematically shows a simplified cross-sectional view of the radiation detector according to an embodiment. Figure 2B schematically shows a detailed cross-sectional view of the radiation detector according to an embodiment. Figure 2C schematically illustrates an alternative detailed cross-sectional view of the radiation detector according to an embodiment. 3 schematically illustrates a top view of a package including a radiation detector and a printed circuit board (PCB) according to an embodiment. 4 schematically illustrates a cross-sectional view of an image sensor according to an embodiment, wherein a plurality of the packages of FIG. 3 are mounted to a system printed circuit board. 5A-5D schematically illustrate top views of the image sensor in operation according to an embodiment. 6A-6D schematically illustrate top views of the image sensor in operation according to an alternative embodiment. 7 shows a flowchart outlining the operation of the image sensor, according to an embodiment. 8 shows another flowchart summarizing and summarizing the operation of the image sensor according to an embodiment.

700: Flowchart

710, 720, 730, 740: Steps

Claims (23)

A method of using an image sensor, the image sensor comprising N sensing areas for capturing an image of a scene, N being a positive integer, the N sensing areas being physically separated from each other, the method comprising : For i=1,...,P, and j=1,...,Q(i), place the image sensor at position (i,j) relative to the scene, and at the image sensor using the image sensor to capture a partial image (i, j) of the scene while the detector is at the position (i, j), thereby capturing a total of R partial images, where R is Q(i), i= The sum of 1, . , the position group (i) includes the position (i, j), j = 1, ..., Q(i), and where in the position group (i), i = 1, ..., P, one of The minimum distance between one position in the position group and another position in the other position group in the position group (i), i=1,...,P, is substantially greater than that in the position group (i) , i=1, . . . , P, the maximum distance between two positions in the same position group; and the combined image of the scene is determined based on the R partial images. The method of claim 1, wherein N is greater than one. The method of claim 1, wherein said image sensor is placed at a position (i,j) relative to i=1,...,P, and j=1,...,Q(i), ) are executed one by one. The method of claim 1, wherein Q(i), i=1, . . . , P, are the same and greater than 1. The method of claim 1, wherein the minimum distance is close to and smaller than the size of the N sensing regions. The method of claim 1, wherein the minimum distance is greater than 100 times the maximum distance. The method of claim 1, wherein the maximum distance is less than 10 times the size of the sensing elements of the N sensing regions. The method of claim 1, wherein said placing said image sensor at said position (i) relative to i=1,...,P, and j=1,...,Q(i), , j) comprising directly moving the image sensor from a position of a position group in the position group (i), i=1, . . . , P, to the position group (i), i = 1, . A position in a position group is moved directly to another position in the same position group. The method of claim 1, wherein the determining the combined image comprises stitching the partial images (i, 1), i=1, . . . , P to form a stitched image of the scene. The method of claim 9, wherein said determining said combined picture further comprises for i=1,...,P, based on said partial picture(i,j),j=1,...,Q(i) , to determine the enhanced part of the image (i). The method of claim 10, wherein said determining the combined image further comprises, for i=1, . . . , P, using the enhanced partial image (i) in place of the partial image ( i, 1). The method of claim 11, wherein said determining said combined image further comprises performing said using said enhanced partial image (i) to replace said partial image (i, 1) of said combined image Afterwards, the resolutions of the different regions of the stitched image are equalized. The method of claim 10, wherein said determining said combined image further comprises for i=1, . . . , P, if said enhanced partial image (i) has a higher resolution than said partial image (i, 1), the enhanced partial image (i) is used to replace the partial image (i, 1) of the stitched image. The method of claim 13, wherein said determining said combined image further comprises equalizing resolutions of different regions of said stitched image after said using. The method of claim 10, wherein said determining said enhanced partial image (i) comprises determining said positions (i, j), j=1, . . . , Q(i), relative to each other Location. The method of claim 15, wherein said determining said positions (i, j), j=1, . . . , Q(i), said positions relative to each other comprises using stationary relative to said scene mark. The method of claim 15, wherein said determining said positions (i, j), j=1, . . . , Q(i), said positions relative to each other comprises: Up-sampling is performed on the partial images (i, j), j=1, . . . , Q(i), so that the partial images (i, j), j=1, . and correlate the upsampled partial images (i,j), j=1,...,Q(i), to determine the position (i,j), j=1,...,Q( i), the position relative to each other. The method of claim 1, wherein said determining the combined image comprises: for i=1,...,P, based on the partial images (i,j), j=1,...,Q(i) , to determine the enhanced part of the image (i). The method of claim 18, wherein said determining the combined image further comprises stitching the enhanced partial images (i), i=1, . . . , P, to form a stitched image of the scene. The method of claim 19, wherein said determining said combined image further comprises equalizing resolutions of different regions of said stitched image. The method of claim 18, wherein said determining said enhanced partial image (i) comprises determining said positions (i, j), j=1, . . . , Q(i), relative to each other Location. The method of claim 21, wherein said determining said positions (i, j), j=1, . . . , Q(i), said positions relative to each other comprises using stationary relative to said scene mark. The method of claim 21, wherein said determining said positions (i, j), j=1, . . . , Q(i), said positions relative to each other comprises: Up-sampling is performed on the partial images (i, j), j=1, . . . , Q(i), so that the partial images (i, j), j=1, . and correlate the upsampled partial images (i,j), j=1,...,Q(i), to determine the position (i,j), j=1,...,Q( i), the position relative to each other.

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