TWI761756B - Electronic package and substrate structure thereof - Google Patents

Abstract

This invention provides an electronic package, which disposes an electronic component on a substrate structure, and a plurality of second electrical contact pads of the substrate structure are arranged along the outline of the first electrical contact pad, so that one side of the electronic component can be electrically connected to one of the second electrical contact pads having suitable voltage value according to the needs, and the other side is electrically connected to the first electrical contact pad, such that there is no need to develop a variety of substrates with different specifications to reduce the process time and cost.

Description

Electronic package and its substrate structure

The present invention relates to a package substrate, in particular to an electronic package with special wiring design and its substrate structure.

With the vigorous development of the electronic industry, most electronic products are developing towards the goal of miniaturization and high-speed development, especially the development of the communication industry has been generally integrated and applied to various electronic products, such as cell phones, laptops, etc. Laptop, etc.

At present, in mobile communication devices, passive components, such as capacitors, are arranged on the packaging substrate to act as a DC block to resist Electrostatic Discharge (ESD) and avoid electrostatic damage caused by instantaneous high voltage. circuit. Specifically, a contact group is disposed on the conventional package substrate, which includes a power pad and a ground pad to electrically connect the positive and negative electrodes of the passive element.

However, in the same type of mobile communication device, different passive components are configured according to different functional requirements. At this time, the contact group of the package substrate cannot meet the voltage requirements required by various passive components. Therefore, for the same type of mobile communication device, Package substrates with different voltage specifications need to be developed, thus increasing the time and cost of manufacturing the package substrate.

Furthermore, as shown in FIG. 1, although some manufacturers have formed a plurality of contact groups 10 with different voltages on the package substrate 1 (including a power pad 10b and a ground pad 10a), so as to connect the passive components to the power supply according to the requirements. However, the conventional package substrate 1 needs to add a layout space to configure multiple groups of contact groups 10, which leads to a substantial increase in the layout area of the package substrate 1, so it is difficult to meet the requirements of miniaturization. need.

Therefore, how to overcome the above-mentioned problems of the prior art has actually become an urgent problem to be overcome in the current industry.

In view of various deficiencies in the above-mentioned prior art, the present invention provides a substrate structure, comprising: a board body; at least one first electrical contact pad disposed on the board body; and a plurality of second electrical contact pads disposed on the board body Arranged on the board and along the contour of the first electrical contact pads, one of the at least one first electrical contact pad cooperates with one of the plurality of second electrical contact pads to form a contact point group.

In the aforementioned substrate structure, the board system has a circuit layer for electrically connecting the at least one first electrical contact pad and/or the plurality of second electrical contact pads.

In the aforementioned substrate structure, the plurality of second electrical contact pads are symmetrically located on opposite sides of the at least one first electrical contact pad.

In the aforementioned substrate structure, the plurality of second electrical contact pads are symmetrically located on any four orientations of the at least one first electrical contact pad.

In the aforementioned substrate structure, the plurality of second electrical contact pads are power contacts. For example, the voltage values of at least two of the plurality of second electrical contact pads are different.

In the aforementioned substrate structure, the at least one first electrical contact pad is a ground contact.

The present invention also provides an electronic package, comprising: the aforementioned substrate structure; and an electronic component disposed on the board and electrically connected to one of the at least one first electrical contact pad and electrically connected one of the plurality of second electrical contact pads.

The aforementioned electronic package further includes a semiconductor chip disposed on the substrate structure.

In the aforementioned electronic package, the electronic components are passive components.

As can be seen from the above, the electronic package and its substrate structure of the present invention are mainly arranged by arranging a plurality of second electrical contact pads along the periphery (outline) of the at least one first electrical contact pad, so that the at least one first electrical contact pad can be One of the electrical contact pads can cooperate with the plurality of second electrical contact pads to form a contact group, so that one side (such as the power terminal) of the electronic device can be electrically connected to one of the suitable voltage values according to the requirements The second electrical contact pad is electrically connected to the other side of the at least one first electrical contact pad. Therefore, compared with the prior art, when the electronic package is fabricated using the substrate structure of the present invention, there is no need to additionally fabricate a variety of different The package substrate of the specification can reduce the time and cost of making the package substrate.

In addition, when the first electrical contact pads are plural, a plurality of contact groups can be formed with the corresponding second electrical contact pads.

Furthermore, through the design that the plurality of second electrical contact pads are arranged along the outline of the first electrical contact pad, it is only necessary to arrange at least one first electrical contact pad on the board for different electronic components, Therefore, compared with the plurality of contact groups of the conventional package substrate, the substrate structure of the present invention can effectively reduce the layout area of the board to meet the requirement of miniaturization.

1: Package substrate

10: Contact group

10a: Ground Pad

10b: Power Pad

2: Substrate structure

20: Board body

200: circuit layer

21: The first electrical contact pad

22a, 22b, 22c, 22d: second electrical contact pads

3: Electronic packages

30: Electronic Components

301: Ground electrode

302: Power electrode

FIG. 1 is a schematic top plan view of a conventional package substrate.

FIG. 2 is a schematic top plan view of the substrate structure of the present invention.

FIG. 3 is a schematic cross-sectional view of the electronic package of the present invention.

The following specific embodiments are used to illustrate the implementation of the present invention, and those skilled in the art can easily understand other advantages and effects of the present invention from the contents disclosed in this specification.

It should be noted that the structures, proportions, sizes, etc. shown in the drawings in this specification are only used to cooperate with the contents disclosed in the specification for the understanding and reading of those who are familiar with the art, and are not intended to limit the implementation of the present invention. Therefore, it has no technical significance. Any modification of the structure, change of the proportional relationship or adjustment of the size should still fall within the scope of the present invention without affecting the effect and the purpose that the present invention can achieve. The technical content disclosed by the invention can be covered within the scope. At the same time, terms such as "first", "second", "on", and "one" quoted in this specification are only for the convenience of description and are not used to limit the scope of the present invention. , the change or adjustment of the relative relationship shall be regarded as the scope of the present invention without substantial changes in the technical content.

FIG. 2 is a schematic top plan view of the substrate structure 2 of the present invention. As shown in FIG. 2 , the substrate structure 2 includes: a board body 20 , at least one first electrical contact pad 21 provided on the board body 20 , and a plurality of first electrical contact pads 21 provided on the board body 20 . Two electrical contact pads 22a, 22b, 22c, 22d.

The board body 20 has at least one circuit layer 200 (eg, the first electrical contact pad 21 and/or the plurality of second electrical contact pads 22a, 22b, 22c, 22d) for electrically connecting the at least one circuit layer 200. 3 as shown).

In this embodiment, the board body 20 is a package substrate with a core layer and a circuit structure or a package substrate without a core layer (coreless), and the circuit layer 200 is formed on a dielectric material, such as a fan-out. (fan out) type redistribution layer (RDL), and the dielectric material is polybenzoxazole (PBO), polyimide (PI), prepreg (Prepreg, referred to as PP) and so on.

The at least one first electrical contact pad 21 is a ground contact, which is rectangular. It should be understood that the shape of the at least one first electrical contact pad 21 can be designed according to requirements, and is not particularly limited.

The plurality of second electrical contact pads 22a, 22b, 22c, 22d are power contacts, which are arranged along the periphery of the at least one first electrical contact pad 21, so that the at least one first electrical contact pad 21 (ground contact) cooperates with one of the plurality of second electrical contact pads 22a, 22b, 22c, 22d (power contact) to form a contact group.

In this embodiment, the plurality of second electrical contact pads 22 a , 22 b , 22 c , and 22 d are symmetrically located on opposite sides of the at least one first electrical contact pad 21 . For example, the plurality of second electrical contact pads 22 a , 22 b , 22 c , and 22 d are symmetrically located in four directions of the at least one first electrical contact pad 21 , up, down, left, and right. Specifically, the number of the plurality of second electrical contact pads 22 a , 22 b , 22 c , and 22 d is four, which symmetrically surround the at least one first electrical contact pad 21 with the at least one first electrical contact pad 21 as the center , so that the plurality of second electrical contact pads 22a, 22b, 22c, 22d and the at least one first electrical contact pad 21 are arranged in a cross shape.

Furthermore, the voltage values of at least two of the plurality of second electrical contact pads 22a, 22b, 22c, and 22d are different. For example, the voltage values of each of the four second electrical contact pads 22a, 22b, 22c, 22d are different.

FIG. 3 is a schematic cross-sectional view of the electronic package 3 of the present invention. As shown in FIG. 3 , the electronic package 3 includes: a substrate structure 2 and an electronic component 30 disposed on the board 20 .

The electronic device 30 is a passive device, such as a capacitor, a resistor, an inductor or other types, which is electrically connected to one of the plurality of second electrical contact pads 22a, 22b, 22c, 22d and the at least one first Electrical contact pads 21 .

In addition, in the electronic package 3, a semiconductor chip (not shown) such as a control chip, a logic chip, a function chip or other chips can also be arranged on the substrate structure 2, and a packaging layer can be formed on the substrate structure 2 (Fig. omitted) to cover the electronic component 30 and the semiconductor wafer.

To sum up, the electronic package 3 of the present invention makes the plurality of second electrical contact pads 22a, 22b, 22c, 22d along the periphery of the at least one first electrical contact pad 21 ( outline) arrangement, so that at least one ground pad can cooperate with a plurality of power pads to form a contact group, so one side of the electronic component 30 (such as the power electrode 302 ) can be electrically connected to a plurality of power pads suitable for voltage values as required. One of the two electrical contact pads 22 a , 22 b , 22 c , and 22 d , and the other side of the electronic device 30 (eg, the ground electrode 301 ) is electrically connected to the at least one first electrical contact pad 21 . Therefore, when the electronic package 3 is fabricated by using the substrate structure 2 of the present invention, it is not necessary to develop various package substrates of different specifications to satisfy the electronic components 30 with various voltage requirements. Therefore, the present invention is effective compared to the prior art. The time and cost of fabricating the substrate structure 2 are reduced.

Furthermore, the present invention uses the design that the plurality of second electrical contact pads 22a, 22b, 22c, 22d are arranged along the periphery (outline) of the at least one first electrical contact pad 21, so that corresponding to different electronic components 30 only At least one first electrical contact pad 21 needs to be arranged on the board body 20 . Therefore, compared with a plurality of contact sets of the conventional package substrate, the substrate structure 2 of the present invention can effectively reduce the layout area of the board body 20 . to meet the needs of miniaturization.

In addition, when the first electrical contact pads 21 are plural, a plurality of contact groups can be formed with the corresponding second electrical contact pads 22a, 22b, 22c, 22d.

The above embodiments are used to illustrate the principles and effects of the present invention, but not to limit the present invention. Any person skilled in the art can make modifications to the above embodiments without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the right of the present invention should be listed in the scope of the patent application described later.

2: Substrate structure

20: Board body

21: The first electrical contact pad

22a, 22b, 22c, 22d: second electrical contact pads

Claims (9)

A substrate structure, comprising: a board body; at least one first electrical contact pad arranged on the board body; and a plurality of second electrical contact pads of the same type and symmetrically arranged on the board body and arranged symmetrically along the periphery of the first electrical contact pad, so that one of the at least one first electrical contact pad is matched with one of the plurality of second electrical contact pads of the same type and arranged symmetrically A contact group is formed, wherein the voltage values of at least two of the plurality of second electrical contact pads of the same type and arranged symmetrically are different. The substrate structure of claim 1, wherein the board system has a circuit layer for electrically connecting the first electrical contact pads and/or the plurality of second electrical contact pads. The substrate structure of claim 1, wherein the plurality of second electrical contact pads are symmetrically located on opposite sides of the at least one first electrical contact pad. The substrate structure of claim 1, wherein the plurality of second electrical contact pads are symmetrically located on four directions of the at least one first electrical contact pad. The substrate structure of claim 1, wherein the plurality of second electrical contact pads are power contacts. The substrate structure of claim 1, wherein the at least one first electrical contact pad is a ground contact. An electronic package, comprising: a substrate structure as described in one of the claims 1 to 6 of the scope of the application; and an electronic component disposed on the board and electrically connected to the at least one first electrical contact One of the pads is electrically connected to one of the plurality of second electrical contact pads. The electronic package as described in item 7 of the claimed scope further includes a semiconductor chip disposed on the substrate structure. The electronic package as described in claim 7, wherein the electronic component is a passive component.

Images