TWM403181U - Printed circuit board for filtering the pad - Google Patents

Printed circuit board for filtering the pad

Info

Publication number
TWM403181U
TWM403181U TW099217673U TW99217673U TWM403181U TW M403181 U TWM403181 U TW M403181U TW 099217673 U TW099217673 U TW 099217673U TW 99217673 U TW99217673 U TW 99217673U TW M403181 U TWM403181 U TW M403181U
Authority
TW
Taiwan
Prior art keywords
filtering
pad
circuit board
printed circuit
printed
Prior art date
Application number
TW099217673U
Other languages
Chinese (zh)
Inventor
Zong-Ren Yu
Original Assignee
Cybertan Technology Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cybertan Technology Inc filed Critical Cybertan Technology Inc
Priority to TW099217673U priority Critical patent/TWM403181U/en
Publication of TWM403181U publication Critical patent/TWM403181U/en

Links

TW099217673U 2010-09-13 2010-09-13 Printed circuit board for filtering the pad TWM403181U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW099217673U TWM403181U (en) 2010-09-13 2010-09-13 Printed circuit board for filtering the pad

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW099217673U TWM403181U (en) 2010-09-13 2010-09-13 Printed circuit board for filtering the pad

Publications (1)

Publication Number Publication Date
TWM403181U true TWM403181U (en) 2011-05-01

Family

ID=60590985

Family Applications (1)

Application Number Title Priority Date Filing Date
TW099217673U TWM403181U (en) 2010-09-13 2010-09-13 Printed circuit board for filtering the pad

Country Status (1)

Country Link
TW (1) TWM403181U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI761756B (en) * 2020-02-04 2022-04-21 矽品精密工業股份有限公司 Electronic package and substrate structure thereof

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI761756B (en) * 2020-02-04 2022-04-21 矽品精密工業股份有限公司 Electronic package and substrate structure thereof

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Legal Events

Date Code Title Description
MM4K Annulment or lapse of a utility model due to non-payment of fees