TWI761152B - Substrate processing equipment - Google Patents

Substrate processing equipment Download PDF

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Publication number
TWI761152B
TWI761152B TW110110896A TW110110896A TWI761152B TW I761152 B TWI761152 B TW I761152B TW 110110896 A TW110110896 A TW 110110896A TW 110110896 A TW110110896 A TW 110110896A TW I761152 B TWI761152 B TW I761152B
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Taiwan
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substrate
working area
module
pick
substrate processing
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TW110110896A
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Chinese (zh)
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TW202238776A (en
Inventor
余世琮
李彥志
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聯策科技股份有限公司
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Priority to TW110110896A priority Critical patent/TWI761152B/en
Priority to CN202110515891.4A priority patent/CN115123793B/en
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Publication of TW202238776A publication Critical patent/TW202238776A/en

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
    • B65G47/22—Devices influencing the relative position or the attitude of articles during transit by conveyors
    • B65G47/24—Devices influencing the relative position or the attitude of articles during transit by conveyors orientating the articles
    • B65G47/248—Devices influencing the relative position or the attitude of articles during transit by conveyors orientating the articles by turning over or inverting them
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G43/00—Control devices, e.g. for safety, warning or fault-correcting
    • B65G43/08—Control devices operated by article or material being fed, conveyed or discharged
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
    • B65G47/74—Feeding, transfer, or discharging devices of particular kinds or types
    • B65G47/90—Devices for picking-up and depositing articles or materials
    • B65G47/91—Devices for picking-up and depositing articles or materials incorporating pneumatic, e.g. suction, grippers
    • B65G47/914—Devices for picking-up and depositing articles or materials incorporating pneumatic, e.g. suction, grippers provided with drive systems incorporating rotary and rectilinear movements
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G2201/00—Indexing codes relating to handling devices, e.g. conveyors, characterised by the type of product or load being conveyed or handled
    • B65G2201/02—Articles
    • B65G2201/0214—Articles of special size, shape or weigh
    • B65G2201/022—Flat

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Supply And Installment Of Electrical Components (AREA)

Abstract

A substrate processing equipment including a first working area, a second working area and a turning mechanism is provided. The second working area is disposed beside the first working area. The turning mechanism is disposed at the first working area and the second working area. A substrate is placed in the first working area, and the substrate includes a first surface and a second surface opposite to the first surface. The turning mechanism takes the substrate from the first surface and transfers the substrate from the first working area to a junction of the first working area and the second working area. The turning mechanism takes the second surface at the junction instead of taking the first surface, and transfer the substrate from the junction to the second working area.

Description

基板處理設備Substrate processing equipment

本發明是有關於一種基板處理設備，且特別是有關於一種具有翻轉機構的基板處理設備。The present invention relates to a substrate processing apparatus, and more particularly, to a substrate processing apparatus having a turning mechanism.

傳統的基板處理設備將工作區域區分成四區，依序為第一處理區、第一翻轉區、第二翻轉區以及第二處理區，基板在第一處理區進行其中一面的處理，例如檢測，接著基板自第一處理區輸送至第一翻轉區，再透過翻轉機構將基板從第一翻轉區翻面至第二翻轉區，最後基板自第二翻轉區輸送至第二處理區進行另一面的處理，例如檢測。The traditional substrate processing equipment divides the working area into four areas, which are the first processing area, the first inversion area, the second inversion area, and the second processing area. The substrate is processed in one of the first processing areas, such as inspection. , then the substrate is transported from the first processing area to the first inversion area, and then the substrate is turned from the first inversion area to the second inversion area through the inversion mechanism, and finally the substrate is transported from the second inversion area to the second processing area for the other side processing, such as detection.

然而，由於傳統的基板處理設備將工作區域區分成四區，故傳統的基板處理設備存在著占地面積大、設備體積過大的缺點。However, since the conventional substrate processing equipment divides the working area into four zones, the conventional substrate processing equipment has the disadvantages of large footprint and excessively large equipment volume.

本發明提供一種基板處理設備，其具有較小的體積。The present invention provides a substrate processing apparatus having a small volume.

本發明的基板處理設備包括第一工作區、第二工作區以及翻轉機構。第二工作區設置於第一工作區的旁側。翻轉機構設置於第一工作區及第二工作區。基板放置於第一工作區，且基板包括第一面及相對第一面的第二面。翻轉機構以第一面拿取基板，並從第一工作區將基板轉移至第一工作區及第二工作區的交界處，翻轉機構在交界處以第二面拿取基板替代以第一面拿取基板，並從交界處將基板轉移至第二工作區。The substrate processing apparatus of the present invention includes a first working area, a second working area, and a turning mechanism. The second work area is arranged beside the first work area. The turning mechanism is arranged in the first working area and the second working area. The substrate is placed in the first working area, and the substrate includes a first surface and a second surface opposite to the first surface. The flipping mechanism takes the substrate with the first side, and transfers the substrate from the first working area to the junction of the first working area and the second working area. The flipping mechanism takes the substrate with the second side instead of the first side at the junction. Take the substrate and transfer the substrate from the interface to the second work area.

在本發明的一實施例中，上述的基板放置於第一工作區或第二工作區，且基板處於水平擺放。基板位於交界處，且基板處於垂直擺放。In an embodiment of the present invention, the above-mentioned substrate is placed in the first working area or the second working area, and the substrate is placed horizontally. The substrate is located at the junction, and the substrate is placed vertically.

在本發明的一實施例中，上述的翻轉機構以真空吸力方式拿取基板。In an embodiment of the present invention, the above-mentioned turning mechanism picks up the substrate in a vacuum suction manner.

在本發明的一實施例中，上述的基板處理設備更包括機體，且第一工作區及第二工作區設置於機體。翻轉機構包括滑動件、第一拿取模組以及第二拿取模組。滑動件滑設於機體。第一拿取模組樞接滑動件，活動設置於機體，位於第一工作區，且用以拿取基板。第二拿取模組樞接滑動件，活動設置於機體，位於第二工作區，且用以拿取基板。In an embodiment of the present invention, the above-mentioned substrate processing apparatus further includes a body, and the first working area and the second working area are disposed on the body. The turning mechanism includes a sliding piece, a first taking module and a second taking module. The sliding piece is slidably arranged on the body. The first taking module is pivotally connected to the sliding piece, is movably arranged on the body, is located in the first working area, and is used to take the substrate. The second taking module is pivotally connected to the sliding piece, is movably arranged on the body, is located in the second working area, and is used for taking the substrate.

在本發明的一實施例中，上述的滑動件滑設於交界處。In an embodiment of the present invention, the above-mentioned sliding member is slidably arranged at the junction.

在本發明的一實施例中，上述的第一拿取模組及第二拿取模組的旋轉方向互為相反。In an embodiment of the present invention, the rotation directions of the first taking module and the second taking module are opposite to each other.

在本發明的一實施例中，上述的翻轉機構更包括動力源。動力源設置於機體，且滑動件連接動力源。In an embodiment of the present invention, the above-mentioned turning mechanism further includes a power source. The power source is arranged on the body, and the sliding piece is connected to the power source.

在本發明的一實施例中，上述的第一拿取模組及第二拿取模組各自包括第一連接側及相對第一連接側的第二連接側。第一拿取模組及第二拿取模組以各自的第一連接側樞接滑動件，且以各自的第二連接側活動設置於機體。In an embodiment of the present invention, the above-mentioned first pick-up module and second pick-up module each include a first connection side and a second connection side opposite to the first connection side. The first pick-up module and the second pick-up module are pivotally connected to the sliding member with their respective first connection sides, and are movably arranged on the body with their respective second connection sides.

在本發明的一實施例中，上述的機體包括設置於第一工作區的第一滑槽及設置於第二工作區的第二滑槽。第一拿取模組活動設置於第一滑槽，且第二拿取模組活動設置於第二滑槽。In an embodiment of the present invention, the above-mentioned body includes a first chute disposed in the first working area and a second chute disposed in the second working area. The first pick-up module is movably arranged on the first chute, and the second pick-up module is movably arranged on the second chute.

在本發明的一實施例中，上述的基板位於交界處，第一拿取模組及第二拿取模組分別位於基板的第一面及第二面。In an embodiment of the present invention, the above-mentioned substrate is located at the junction, and the first picking module and the second picking module are located on the first surface and the second surface of the substrate, respectively.

基於上述，本發明的基板處理設備透過翻轉機構而直接使基板在從第一工作區轉移至第二工作區的同時進行翻面，省卻了傳統的基板處理設備中的其中兩區，故占地面積較小，有助於降低基板處理設備的體積。Based on the above, the substrate processing apparatus of the present invention directly flips the substrate while transferring from the first working area to the second working area through the turning mechanism, which saves the two areas in the conventional substrate processing equipment, thus occupying a lot of space. Smaller area helps reduce the size of substrate processing equipment.

圖1是本發明一實施例的基板處理設備的立體示意圖。圖2是圖1的基板處理設備的作動原理示意圖。圖2中以虛線繪示翻轉機構130移動後的位置。請參考圖1及圖2，本實施例的基板處理設備100可應用於處理基板S的任意製程，以圖2作為具體舉例，其應用於基板檢測設備，但不以此為限。基板檢測設備包括第一檢測器D1、第二檢測器D2，第一檢測器D1是當基板S位於第一工作區110時，用於檢測基板S的第一面S1，且第二檢測器D2是當基板S位於第二工作區120時，用於檢測基板S的第二面S2。為此，本發明提供了翻轉機構130，應用於基板檢測設備或是其他的基板處理設備，本發明並無限制。FIG. 1 is a schematic perspective view of a substrate processing apparatus according to an embodiment of the present invention. FIG. 2 is a schematic diagram of the operation principle of the substrate processing apparatus of FIG. 1 . In FIG. 2 , the moved position of the turning mechanism 130 is shown by a dotted line. Referring to FIGS. 1 and 2 , the substrate processing apparatus 100 of the present embodiment can be applied to any process of processing the substrate S. Taking FIG. 2 as a specific example, the substrate processing apparatus 100 is applied to a substrate inspection apparatus, but not limited thereto. The substrate inspection apparatus includes a first detector D1 and a second detector D2. The first detector D1 is used to detect the first surface S1 of the substrate S when the substrate S is located in the first working area 110, and the second detector D2 It is used to detect the second surface S2 of the substrate S when the substrate S is located in the second working area 120 . To this end, the present invention provides the turning mechanism 130, which is applied to the substrate inspection equipment or other substrate processing equipment, which is not limited in the present invention.

圖3A至圖3E繪示圖1的基板處理設備的作動流程。請參考圖1及圖3A，第二工作區120設置於第一工作區110的旁側，第一工作區110及第二工作區120之間具有交界處J。或者是說，第一工作區110及第二工作區120彼此相鄰且互相併排設置。3A to 3E illustrate the operation flow of the substrate processing apparatus of FIG. 1 . Referring to FIG. 1 and FIG. 3A , the second work area 120 is disposed beside the first work area 110 , and there is a junction J between the first work area 110 and the second work area 120 . In other words, the first working area 110 and the second working area 120 are adjacent to each other and arranged side by side with each other.

翻轉機構130設置於第一工作區110及第二工作區120。基板S包括第一面S1及相對第一面S1的第二面S2。當基板S如圖3A所示放置於第一工作區110時，基板S例如但不限於處於水平擺放，且以第一面S1朝向翻轉機構130，故翻轉機構130能夠以基板S的第一面S1拿取基板S。The turning mechanism 130 is disposed in the first working area 110 and the second working area 120 . The substrate S includes a first surface S1 and a second surface S2 opposite to the first surface S1. When the substrate S is placed in the first working area 110 as shown in FIG. 3A , the substrate S is placed horizontally, for example but not limited to, with the first surface S1 facing the inversion mechanism 130 , so the inversion mechanism 130 can use the first surface S1 of the substrate S to face the inversion mechanism 130 . The substrate S is taken from the surface S1.

當基板S已於第一工作區110完成處理時，翻轉機構130以基板S的第一面S1拿取基板S，並如圖3A至圖3C所示的流程將基板S從第一工作區110轉移至交界處J，從而基板S例如但不限於處於垂直擺放。當基板S如圖3C所示位於交界處J時，基板S的第一面S1朝向第一工作區110，且基板S的第二面S2朝向第二工作區120。When the substrate S has been processed in the first working area 110 , the turning mechanism 130 takes the substrate S with the first surface S1 of the substrate S, and removes the substrate S from the first working area 110 according to the process shown in FIG. 3A to FIG. 3C . Transfer to the junction J so that the substrate S is placed vertically, for example but not limited to. When the substrate S is located at the junction J as shown in FIG. 3C , the first surface S1 of the substrate S faces the first working area 110 , and the second surface S2 of the substrate S faces the second working area 120 .

此時，翻轉機構130以拿取基板S的第二面S2接替原先拿取基板S的第一面S1。舉例而言，翻轉機構130以真空吸力方式拿取基板S，且翻轉機構130在交界處J以吸取基板S的第二面S2取代原先吸取基板S的第一面S1，但翻轉機構130拿取基板S的方式並不以此為限。接著，翻轉機構130在以基板S的第二面S2拿取基板S的狀態下，經由如圖3C至圖3E所示的流程將基板S轉移至第二工作區120，從而基板S例如但不限於轉換為水平擺放，且以第二面S2朝向翻轉機構130。At this time, the reversing mechanism 130 replaces the first surface S1 of the substrate S with the second surface S2 on which the substrate S was taken. For example, the inversion mechanism 130 picks up the substrate S by vacuum suction, and the inversion mechanism 130 replaces the first surface S1 of the original suction substrate S with the second surface S2 of the substrate S at the junction J, but the inversion mechanism 130 picks up the substrate S. The form of the substrate S is not limited to this. Next, the inversion mechanism 130 transfers the substrate S to the second work area 120 through the process shown in FIG. 3C to FIG. 3E in a state in which the substrate S is taken by the second surface S2 of the substrate S, so that the substrate S, for example but not It is limited to be converted into a horizontal arrangement, and the second surface S2 faces the turning mechanism 130 .

據此，本發明的基板處理設備100透過翻轉機構130而得以直接使基板S在從第一工作區110轉移至第二工作區120的同時進行翻面，省卻了傳統的基板處理設備中的其中兩個區域，故基板處理設備100的占地面積較小，且有助於降低基板處理設備100的體積。Accordingly, the substrate processing apparatus 100 of the present invention can directly turn the substrate S while transferring from the first working area 110 to the second working area 120 through the turning mechanism 130 , eliminating the need for the conventional substrate processing apparatus. Since there are two areas, the footprint of the substrate processing apparatus 100 is small, and the volume of the substrate processing apparatus 100 is reduced.

請參考圖1及圖3A，本實施例的基板處理設備100包括機體140，其中第一工作區110及第二工作區120設置於機體140。Please refer to FIG. 1 and FIG. 3A , the substrate processing apparatus 100 of this embodiment includes a body 140 , wherein the first working area 110 and the second working area 120 are disposed on the body 140 .

翻轉機構130包括滑動件131、第一拿取模組132以及第二拿取模組133。滑動件131以垂直方向滑設於機體140，也就是滑設於交界處J。舉例而言，翻轉機構130更包括設置於機體140的動力源134，滑動件131連接動力源134，以受動力源134的驅動而在交界處J往復移動，其中動力源134可採用氣壓缸或液壓缸，但不限於此。The turning mechanism 130 includes a sliding member 131 , a first taking module 132 and a second taking module 133 . The sliding member 131 is slidably arranged on the body 140 in a vertical direction, that is, slidably arranged at the junction J. For example, the turning mechanism 130 further includes a power source 134 disposed on the body 140 , and the sliding member 131 is connected to the power source 134 to be driven by the power source 134 to reciprocate at the junction J, wherein the power source 134 can be a pneumatic cylinder or Hydraulic cylinders, but not limited to this.

第一拿取模組132及第二拿取模組133用以拿取基板S。第一拿取模組132包括第一連接側132a及相對第一連接側132a的第二連接側132b，且第二拿取模組133包括第一連接側133a及相對第一連接側133a的第二連接側133b。第一拿取模組132以第一連接側132a樞接滑動件131，且第二拿取模組133以第一連接側133a樞接滑動件131。The first pick-up module 132 and the second pick-up module 133 are used to pick up the substrate S. The first taking module 132 includes a first connecting side 132a and a second connecting side 132b opposite to the first connecting side 132a, and the second taking module 133 includes a first connecting side 133a and a second connecting side 133a opposite to the first connecting side 133a. Two connecting sides 133b. The first picking module 132 is pivotally connected to the sliding member 131 with the first connecting side 132a, and the second picking module 133 is pivotally connecting the sliding member 131 with the first connecting side 133a.

另一方面，機體140包括設置於第一工作區110的第一滑槽141及設置於第二工作區120的第二滑槽142。第一拿取模組132以第二連接側132b活動設置於第一滑槽141，且第二拿取模組133以第二連接側133b活動設置於第二滑槽142。因此，隨著滑動件131在垂直方向上滑移，第一拿取模組132的第二連接側132b能在第一滑槽141內滑動，且第一拿取模組132相對滑動件131旋轉，第二拿取模組133的第二連接側133b能在第二滑槽142內滑動，且第二拿取模組133相對滑動件131旋轉。On the other hand, the body 140 includes a first chute 141 provided in the first work area 110 and a second chute 142 provided in the second work area 120 . The first pick-up module 132 is movably arranged on the first chute 141 with the second connection side 132b, and the second pick-up module 133 is movably arranged on the second chute 142 with the second connection side 133b. Therefore, as the sliding member 131 slides in the vertical direction, the second connecting side 132b of the first picking module 132 can slide in the first sliding groove 141, and the first picking module 132 rotates relative to the sliding member 131 , the second connection side 133b of the second pick-up module 133 can slide in the second chute 142 , and the second pick-up module 133 rotates relative to the sliding member 131 .

如圖3A至圖3C所示，當滑動件131在垂直方向上相對往遠離動力源134的方向移動時，第一拿取模組132的第二連接側132b及第二拿取模組133的第二連接側133b朝向彼此的方向靠攏，而在圖3C所示的狀態下，第一拿取模組132位於基板S的第一面S1，且第二拿取模組133位於基板S的第二面S2。就圖3A至圖3C的視角而言，滑動件131為往上移動，第一拿取模組132為逆時針旋轉，且第二拿取模組133為順時針旋轉。換句話說，第一拿取模組132及第二拿取模組133兩者的旋轉方向互為相反。As shown in FIG. 3A to FIG. 3C , when the sliding member 131 moves in a direction away from the power source 134 in the vertical direction, the second connection side 132 b of the first picking module 132 and the second connecting side 132 b of the second picking module 133 The second connection sides 133b are close to each other, and in the state shown in FIG. 3C , the first pick-up module 132 is located on the first surface S1 of the substrate S, and the second pick-up module 133 is located on the first surface S1 of the substrate S. Two-sided S2. From the perspective of FIGS. 3A to 3C , the slider 131 moves upward, the first picking module 132 rotates counterclockwise, and the second picking module 133 rotates clockwise. In other words, the rotation directions of the first pick-up module 132 and the second pick-up module 133 are opposite to each other.

綜上所述，本發明的基板處理設備透過翻轉機構而直接使基板在從第一工作區轉移至第二工作區的同時進行翻面，省卻了傳統的基板處理設備中的其中兩區，故占地面積較小，有助於降低基板處理設備的體積。To sum up, the substrate processing equipment of the present invention directly turns the substrate from the first working area to the second working area through the inversion mechanism, which saves the two areas in the conventional substrate processing equipment. Therefore, Small footprint helps reduce the size of substrate processing equipment.

100:基板處理設備 110:第一工作區 120:第二工作區 130:翻轉機構 131:滑動件 132:第一拿取模組 132a:第一連接側 132b:第二連接側 133:第二拿取模組 133a:第一連接側 133b:第二連接側 134:動力源 140:機體 141:第一滑槽 142:第二滑槽 D1:第一檢測器 D2:第二檢測器 J:交界處 S:基板 S1:第一面 S2:第二面100: Substrate Processing Equipment 110: The first work area 120: Second work area 130: Flip Mechanism 131: Slider 132: The first take module 132a: first connection side 132b: Second connection side 133: Second take module 133a: first connection side 133b: Second connection side 134: Power Source 140: Body 141: The first chute 142: Second chute D1: first detector D2: Second detector J: Junction S: substrate S1: The first side S2: Second side

圖1是本發明一實施例的基板處理設備的立體示意圖。 圖2是圖1的基板處理設備的作動原理示意圖。 圖3A至圖3E繪示圖1的基板處理設備的作動流程。 FIG. 1 is a schematic perspective view of a substrate processing apparatus according to an embodiment of the present invention. FIG. 2 is a schematic diagram of the operation principle of the substrate processing apparatus of FIG. 1 . 3A to 3E illustrate the operation flow of the substrate processing apparatus of FIG. 1 .

100:基板處理設備 100: Substrate Processing Equipment

110:第一工作區 110: The first work area

120:第二工作區 120: Second work area

130:翻轉機構 130: Flip Mechanism

131:滑動件 131: Slider

132:第一拿取模組 132: The first take module

132a:第一連接側 132a: first connection side

132b:第二連接側 132b: Second connection side

133:第二拿取模組 133: Second take module

133a:第一連接側 133a: first connection side

133b:第二連接側 133b: Second connection side

134:動力源 134: Power Source

140:機體 140: Body

141:第一滑槽 141: The first chute

142:第二滑槽 142: Second chute

J:交界處 J: Junction

S:基板 S: substrate

S1:第一面 S1: The first side

S2:第二面 S2: Second side

Claims (10)

一種基板處理設備，包括： 第一工作區； 第二工作區，設置於該第一工作區的旁側；以及 翻轉機構，設置於該第一工作區及該第二工作區， 其中基板放置於該第一工作區，且該基板包括第一面及相對該第一面的第二面，其中該翻轉機構以該第一面拿取該基板，並從該第一工作區將該基板轉移至該第一工作區及該第二工作區的交界處，該翻轉機構在該交界處以該第二面拿取該基板替代以該第一面拿取該基板，並從該交界處將該基板轉移至該第二工作區。 A substrate processing equipment, comprising: the first work area; A second work area is provided on the side of the first work area; and A turning mechanism is arranged in the first working area and the second working area, Wherein the substrate is placed in the first working area, and the substrate includes a first surface and a second surface opposite to the first surface, wherein the turning mechanism takes the substrate with the first surface, and transfers the substrate from the first working area The substrate is transferred to the junction of the first working area and the second working area, the turning mechanism takes the substrate with the second side at the junction instead of picking up the substrate with the first side, and from the junction The substrate is transferred to the second work area. 如請求項1所述的基板處理設備，其中該基板放置於該第一工作區或該第二工作區，且該基板處於水平擺放，其中該基板位於該交界處，且該基板處於垂直擺放。The substrate processing apparatus of claim 1, wherein the substrate is placed in the first working area or the second working area, and the substrate is placed horizontally, wherein the substrate is located at the junction, and the substrate is placed in a vertical swing put. 如請求項1所述的基板處理設備，其中該翻轉機構以真空吸力方式拿取該基板。The substrate processing apparatus of claim 1, wherein the turning mechanism picks up the substrate in a vacuum suction manner. 如請求項1所述的基板處理設備，更包括機體，該第一工作區及該第二工作區設置於該機體，其中該翻轉機構包括： 滑動件，滑設於該機體； 第一拿取模組，樞接該滑動件，活動設置於該機體，位於該第一工作區，且用以拿取該基板；以及 第二拿取模組，樞接該滑動件，活動設置於該機體，位於該第二工作區，且用以拿取該基板。 The substrate processing apparatus according to claim 1, further comprising a body, the first working area and the second working area are disposed on the body, wherein the turning mechanism includes: a sliding member, which is slidably arranged on the body; a first pick-up module, pivotally connected to the slider, movably arranged on the body, located in the first working area, and used for picking up the substrate; and The second taking module is pivotally connected to the sliding piece, is movably arranged on the body, is located in the second working area, and is used to take the substrate. 如請求項4所述的基板處理設備，其中該滑動件滑設於該交界處。The substrate processing apparatus of claim 4, wherein the sliding member is slidably disposed at the junction. 如請求項4所述的基板處理設備，其中該第一拿取模組及該第二拿取模組的旋轉方向互為相反。The substrate processing apparatus of claim 4, wherein the rotation directions of the first pick-up module and the second pick-up module are opposite to each other. 如請求項4所述的基板處理設備，其中該翻轉機構更包括： 動力源，設置於該機體，且該滑動件連接該動力源。 The substrate processing apparatus according to claim 4, wherein the turning mechanism further comprises: The power source is arranged on the body, and the sliding piece is connected to the power source. 如請求項4所述的基板處理設備，其中該第一拿取模組及該第二拿取模組各自包括第一連接側及相對該第一連接側的第二連接側，該第一拿取模組及該第二拿取模組以各自的該第一連接側樞接該滑動件，且以各自的該第二連接側活動設置於該機體。The substrate processing apparatus of claim 4, wherein the first pick-up module and the second pick-up module each include a first connection side and a second connection side opposite to the first connection side, the first pick-up module The pick-up module and the second pick-up module are pivotally connected to the sliding piece with the respective first connecting sides, and are movably arranged on the body with the respective second connecting sides. 如請求項4所述的基板處理設備，其中該機體包括設置於該第一工作區的第一滑槽及設置於該第二工作區的第二滑槽，該第一拿取模組活動設置於該第一滑槽，且該第二拿取模組活動設置於該第二滑槽。The substrate processing apparatus of claim 4, wherein the body comprises a first chute disposed in the first working area and a second chute disposed in the second working area, and the first pick-up module is movably disposed in the first chute, and the second pick-up module is movably arranged in the second chute. 如請求項4所述的基板處理設備，其中該基板位於該交界處，該第一拿取模組及該第二拿取模組分別位於該基板的該第一面及該第二面。The substrate processing apparatus of claim 4, wherein the substrate is located at the junction, and the first picking module and the second picking module are located on the first surface and the second surface of the substrate, respectively.
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