TWI759938B - 高速且低功率傳輸及接收資料之記憶體裝置 - Google Patents
高速且低功率傳輸及接收資料之記憶體裝置 Download PDFInfo
- Publication number
- TWI759938B TWI759938B TW109138212A TW109138212A TWI759938B TW I759938 B TWI759938 B TW I759938B TW 109138212 A TW109138212 A TW 109138212A TW 109138212 A TW109138212 A TW 109138212A TW I759938 B TWI759938 B TW I759938B
- Authority
- TW
- Taiwan
- Prior art keywords
- write data
- data strobe
- strobe signal
- signal
- memory device
- Prior art date
Links
Images
Classifications
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
- G11C11/21—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements
- G11C11/34—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices
- G11C11/40—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors
- G11C11/401—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors forming cells needing refreshing or charge regeneration, i.e. dynamic cells
- G11C11/4063—Auxiliary circuits, e.g. for addressing, decoding, driving, writing, sensing or timing
- G11C11/407—Auxiliary circuits, e.g. for addressing, decoding, driving, writing, sensing or timing for memory cells of the field-effect type
- G11C11/4076—Timing circuits
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
- G11C11/21—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements
- G11C11/34—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices
- G11C11/40—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors
- G11C11/401—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors forming cells needing refreshing or charge regeneration, i.e. dynamic cells
- G11C11/4063—Auxiliary circuits, e.g. for addressing, decoding, driving, writing, sensing or timing
- G11C11/407—Auxiliary circuits, e.g. for addressing, decoding, driving, writing, sensing or timing for memory cells of the field-effect type
- G11C11/409—Read-write [R-W] circuits
- G11C11/4093—Input/output [I/O] data interface arrangements, e.g. data buffers
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Dram (AREA)
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR20200008110 | 2020-01-21 | ||
KR10-2020-0008110 | 2020-01-21 | ||
KR1020200061441A KR20210095009A (ko) | 2020-01-21 | 2020-05-22 | 고속 및 저전력으로 데이터를 송수신하는 메모리 장치 |
KR10-2020-0061441 | 2020-05-22 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW202129509A TW202129509A (zh) | 2021-08-01 |
TWI759938B true TWI759938B (zh) | 2022-04-01 |
Family
ID=77127844
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW109138212A TWI759938B (zh) | 2020-01-21 | 2020-11-03 | 高速且低功率傳輸及接收資料之記憶體裝置 |
TW110102104A TWI769671B (zh) | 2020-01-21 | 2021-01-20 | 記憶體裝置及其操作方法 |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW110102104A TWI769671B (zh) | 2020-01-21 | 2021-01-20 | 記憶體裝置及其操作方法 |
Country Status (3)
Country | Link |
---|---|
KR (2) | KR20210095009A (ko) |
SG (1) | SG10202100590QA (ko) |
TW (2) | TWI759938B (ko) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20230067190A1 (en) * | 2021-08-27 | 2023-03-02 | Macronix International Co., Ltd. | Reconfigurable ai system |
TWI789064B (zh) * | 2021-10-20 | 2023-01-01 | 鯨鏈科技股份有限公司 | 基於晶圓堆疊架構的計算機系統 |
TWI779935B (zh) * | 2021-11-24 | 2022-10-01 | 瑞昱半導體股份有限公司 | 資料處理系統、緩衝電路與緩衝電路的操作方法 |
US20240072772A1 (en) * | 2022-08-31 | 2024-02-29 | Global Unichip Corporation | Interface device and signal transceiving method thereof |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20110055671A1 (en) * | 2009-09-03 | 2011-03-03 | International Business Machines Corporation | Advanced memory device having improved performance, reduced power and increased reliability |
US20140233292A1 (en) * | 2010-05-25 | 2014-08-21 | Samsung Electronics Co., Ltd. | 3d semiconductor device |
US20170084320A1 (en) * | 2015-06-16 | 2017-03-23 | SK Hynix Inc. | Semiconductor devices and semiconductor systems including the same |
US20190163650A1 (en) * | 2017-11-29 | 2019-05-30 | Samsung Electronics Co., Ltd. | Memory device communicating with system on chip through at least two channels, electronic device including the same, and operating method of electronic device |
US20190206478A1 (en) * | 2017-12-28 | 2019-07-04 | Samsung Electronics Co., Ltd. | Memory device for receiving operation codes through dq pins, a memory module including the same, and a setting method of the memory module |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5420433B2 (ja) * | 2010-01-14 | 2014-02-19 | ルネサスエレクトロニクス株式会社 | 半導体装置および電源装置 |
KR20130102816A (ko) * | 2012-03-08 | 2013-09-23 | 삼성전자주식회사 | 데이터 액세스 메모리 및 그것의 데이터 손실 방지 방법 |
EP3743784B1 (en) * | 2018-01-25 | 2022-01-12 | CSEM Centre Suisse d'Electronique et de Microtechnique SA - Recherche et Développement | Electronic device |
-
2020
- 2020-05-22 KR KR1020200061441A patent/KR20210095009A/ko unknown
- 2020-08-18 KR KR1020200103438A patent/KR20210094446A/ko unknown
- 2020-11-03 TW TW109138212A patent/TWI759938B/zh active
-
2021
- 2021-01-19 SG SG10202100590QA patent/SG10202100590QA/en unknown
- 2021-01-20 TW TW110102104A patent/TWI769671B/zh active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20110055671A1 (en) * | 2009-09-03 | 2011-03-03 | International Business Machines Corporation | Advanced memory device having improved performance, reduced power and increased reliability |
US20140233292A1 (en) * | 2010-05-25 | 2014-08-21 | Samsung Electronics Co., Ltd. | 3d semiconductor device |
US20170084320A1 (en) * | 2015-06-16 | 2017-03-23 | SK Hynix Inc. | Semiconductor devices and semiconductor systems including the same |
US20190163650A1 (en) * | 2017-11-29 | 2019-05-30 | Samsung Electronics Co., Ltd. | Memory device communicating with system on chip through at least two channels, electronic device including the same, and operating method of electronic device |
US20190206478A1 (en) * | 2017-12-28 | 2019-07-04 | Samsung Electronics Co., Ltd. | Memory device for receiving operation codes through dq pins, a memory module including the same, and a setting method of the memory module |
Also Published As
Publication number | Publication date |
---|---|
KR20210094446A (ko) | 2021-07-29 |
KR20210095009A (ko) | 2021-07-30 |
TWI769671B (zh) | 2022-07-01 |
TW202129509A (zh) | 2021-08-01 |
TW202134895A (zh) | 2021-09-16 |
SG10202100590QA (en) | 2021-08-30 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US11769547B2 (en) | Memory device transmitting and receiving data at high speed and low power | |
TWI759938B (zh) | 高速且低功率傳輸及接收資料之記憶體裝置 | |
US11636885B2 (en) | Memory device for supporting new command input scheme and method of operating the same | |
US11309013B2 (en) | Memory device for reducing resources used for training | |
KR102501147B1 (ko) | 메모리에서 에러 체킹 및 정정 코드의 확장된 적용 | |
JP2021093129A (ja) | メモリデバイスへのコマンドバストレーニングの技術 | |
US11599458B2 (en) | Stacked memory device and operating method thereof | |
US20230171007A1 (en) | Translation device, test system including the same, and memory system including the translation device | |
KR20210133832A (ko) | 트레이닝을 위해 사용되는 리소스를 감소시키기 위한 메모리 장치 | |
US20240196633A1 (en) | Memory device and system having multiple physical interfaces | |
US20240241840A1 (en) | Apparatus and method for die-to-die (d2d) interconnects | |
CN115104154B (zh) | 存储器装置中的多循环命令处理以及相关方法、装置及系统 | |
US20240257896A1 (en) | Memory device including repair circuit and operating method thereof | |
EP4210099A1 (en) | Package routing for crosstalk reduction in high frequency communication |