TWI759815B - Elastic and electroconductive pin, manufacturing method thereof and probe card using the same - Google Patents
Elastic and electroconductive pin, manufacturing method thereof and probe card using the same Download PDFInfo
- Publication number
- TWI759815B TWI759815B TW109126945A TW109126945A TWI759815B TW I759815 B TWI759815 B TW I759815B TW 109126945 A TW109126945 A TW 109126945A TW 109126945 A TW109126945 A TW 109126945A TW I759815 B TWI759815 B TW I759815B
- Authority
- TW
- Taiwan
- Prior art keywords
- modified
- nanofuller
- spheres
- elastic conductive
- graphene
- Prior art date
Links
Images
Landscapes
- Measuring Leads Or Probes (AREA)
Abstract
Description
本發明是有關於一種彈性導電柱體、製造方法及使用其的探針卡,且特別是有關於一種使用表面改質過的奈米富勒球體、表面改質過的奈米金屬顆粒及表面改質過的石墨烯,配合高分子材料所形成的彈性導電柱體、製造方法及使用其的探針卡。 The present invention relates to an elastic conductive cylinder, a manufacturing method and a probe card using the same, and particularly relates to a surface-modified nanofuller sphere, a surface-modified nano-metal particle and a surface Modified graphene, elastic conductive column formed by combining with polymer material, manufacturing method and probe card using the same.
隨著半導體產業的快速發展,半導體裝置的電性測試變得相當重要。具有多個導電柱體的探針卡(Probe card)是晶圓與電子測試系統之間的媒介,通常直接放在探測器上並用連接線連接測試機,其目的是提供晶片與測試機之間的橋樑,以完成晶圓的電性測試。 With the rapid development of the semiconductor industry, electrical testing of semiconductor devices has become very important. The probe card (Probe card) with multiple conductive columns is the medium between the wafer and the electronic test system. bridge to complete the electrical test of the wafer.
隨著元件尺寸遞減與產品使用頻率升高,元件測試之柱體間距與電阻也需縮小與降低來滿足未來元件的測試設計。目前測試柱體具有許多種類包括:探針卡、彈簧形式(pogo pin)與軟性矽膠式(rubber socket)等種類,這些探針的製作材料包括:錸/鎢(La/W)、鎳/金(Ni/Au)與銅/鈀/銀合金(Cu/Pd/Ag),部分材料本身硬度較低,造成測試過程中不斷摩擦而損耗降低使用壽命(目前軟性矽膠式壽命大約是40至80K次),隨著使用次數提升,電性穩定度隨之下降而影響測試量測結果。此外,待測元件表面也具有金屬物成分,譬如錫(Sn)、銀(Ag)、銅(Cu) 等,在測試過程中兩者互相接觸造成探針表面與待測元件金屬產生共晶效應,這些黏著顆粒將造成電阻升高影響可靠度與良率等結果。根據上述之技術發展問題,為了順應產品內部元件體積尺寸趨於更輕薄化的需求、降低產品支出成本與提高產品品質測試之附加價值,故利用奈米富勒球體與矽膠高分子等材料,開發出具備高壽命、抗沾黏、低清針頻率與低電阻之軟性柱體。 As the size of components decreases and the frequency of product use increases, the column spacing and resistance of component testing also need to be reduced and reduced to meet future component testing designs. At present, there are many types of test cylinders, including: probe card, spring form (pogo pin) and soft silicone type (rubber socket), etc. These probes are made of: rhenium/tungsten (La/W), nickel/gold (Ni/Au) and copper/palladium/silver alloys (Cu/Pd/Ag), some materials have low hardness, resulting in continuous friction during the test and loss of service life (currently, the service life of soft silicone rubber is about 40 to 80K times) ), as the number of uses increases, the electrical stability decreases and affects the test measurement results. In addition, the surface of the component to be tested also has metal components, such as tin (Sn), silver (Ag), copper (Cu) etc., during the test process, the contact between the two causes the probe surface and the metal to be tested to produce a eutectic effect, and these adherent particles will increase the resistance and affect the reliability and yield. According to the above-mentioned technical development problems, in order to meet the demand for thinner and lighter internal components, reduce product expenditure costs and improve the added value of product quality testing, nanofuller spheres and silicone polymers are used to develop materials such as A flexible cylinder with long life, anti-sticking, low clearing frequency and low resistance is produced.
US7438563專利揭露一種用於測試半導體封裝的連接器,此案所使用材料組合是在矽膠球表面上塗佈鎳/金導電材料,並與矽膠混合,最後利用磁控方式進行製作整合出半導體電性測試組件。然而,這種連接器具有低壽命、高測試壓力與高電阻及高成本的問題。 The US7438563 patent discloses a connector for testing a semiconductor package. The material combination used in this case is to coat the surface of the silicone ball with nickel/gold conductive material, mix it with the silicone, and finally use the magnetron method to manufacture and integrate the semiconductor electrical properties. Test components. However, such connectors suffer from low lifetime, high test pressure and high resistance and high cost.
因此,如何改善目前軟性測試探針(材料組成:金/鎳/高分子)的低壽命、高測試壓力與高電阻以及高支出成本問題,實為本案所欲解決的問題。 Therefore, how to improve the problems of low lifetime, high test pressure, high resistance and high expenditure cost of the current soft test probe (material composition: gold/nickel/polymer) is the problem to be solved in this case.
因此,本發明的目的在於提供一種具有低電流、低測試壓縮力量、高壽命的彈性導電柱體、製造方法及使用其的探針卡,。 Therefore, the purpose of the present invention is to provide an elastic conductive cylinder with low current, low test compression force and long life, a manufacturing method and a probe card using the same.
為達上述目的,本發明提供一種彈性導電柱體,包含:表面改質過的奈米富勒球體、表面改質過的奈米金屬顆粒及表面改質過的石墨烯,各自具有表面官能基;及高分子材料,將所述表面改質過的奈米富勒球體、所述表面改質過的奈米金屬顆粒及所述表面改質過的石墨烯交聯在一起而形成一柱狀結構,藉由所述表面官能基以增加所述表面改質過的奈米富勒球體、所述表面改質過的奈米金屬顆粒及所述表面改質過的石墨烯彼此間的鍵結,以增加電子傳遞路徑,並增加所述高分子材料和所述表面改質過的奈米富勒球體、所述表面改質過的奈米金屬 顆粒及所述表面改質過的石墨烯的附著強度。 In order to achieve the above purpose, the present invention provides an elastic conductive cylinder, comprising: a surface-modified nanofuller sphere, a surface-modified nano-metal particle and a surface-modified graphene, each of which has a surface functional group. And polymer material, the nanofuller sphere that described surface modification has crossed, the nano metal particle that described surface modification has crossed and the graphene that described surface modification has crossed together to form a columnar shape Structure, by the surface functional groups to increase the bonding between the surface-modified nanofuller spheres, the surface-modified nano-metal particles and the surface-modified graphene , in order to increase the electron transfer path, and increase the polymer material, the surface-modified nanofuller sphere, the surface-modified nano-metal Adhesion strength of particles and the surface-modified graphene.
本發明更提供一種探針卡,包含:一框體;一基板,設置於框體上,並具有多個孔洞;及多個所述的彈性導電柱體,貫通基板的此些孔洞,並且凸出基板的兩側,以作電性接觸用。 The present invention further provides a probe card, comprising: a frame body; a base plate, disposed on the frame body and having a plurality of holes; and a plurality of the elastic conductive pillars, penetrating the holes of the base plate and protruding Out of both sides of the substrate for electrical contact.
本發明又提供一種彈性導電柱體的製造方法,包含以下步驟:提供奈米富勒球體、奈米金屬顆粒及石墨烯;對所述奈米富勒球體、所述奈米金屬顆粒及所述石墨烯進行,以讓所述奈米富勒球體、所述奈米金屬顆粒及所述石墨烯產生表面官能基;利用高分子材料將所述表面改質過的奈米富勒球體、所述表面改質過的奈米金屬顆粒及所述表面改質過的石墨烯連結在一起而形成一混合物;及將混合物進行熱壓,以形成一柱狀結構,藉由所述表面官能基以增加所述表面改質過的奈米富勒球體、所述表面改質過的奈米金屬顆粒及所述表面改質過的石墨烯彼此間的鍵結,以增加電子傳遞路徑,並增加所述高分子材料和所述表面改質過的奈米富勒球體、所述表面改質過的奈米金屬顆粒及所述表面改質過的石墨烯的附著強度。 The present invention further provides a method for manufacturing an elastic conductive pillar, comprising the following steps: providing nanofuller spheres, nano metal particles and graphene; Graphene, so that the nanofuller sphere, the nano metal particles and the graphene generate surface functional groups; the nanofuller sphere, the surface modified nanofuller sphere, the The surface-modified nano-metal particles and the surface-modified graphene are linked together to form a mixture; and the mixture is hot-pressed to form a columnar structure, which is increased by the surface functional groups The surface-modified nanofuller spheres, the surface-modified nano-metal particles and the surface-modified graphene are bonded to each other to increase the electron transfer path and increase the The adhesion strength of the polymer material, the surface-modified nanofuller spheres, the surface-modified nano-metal particles, and the surface-modified graphene.
藉由上述實施例,可以提供一種具有低電流、低測試壓縮力量、高壽命的彈性導電柱體,利用具有高硬度、高機械強度(高硬度及高彈性強度)與導電度之奈米富勒球體,配合奈米銀顆粒(或奈米銀片)以及石墨烯與高分子材料,來取代現有的軟性測試探針的材料,用以提高測試壽命、降低測試壓力、電阻與成本。 With the above embodiments, an elastic conductive cylinder with low current, low test compression force, and long life can be provided, using nanofuller with high hardness, high mechanical strength (high hardness and high elastic strength) and electrical conductivity. The sphere, combined with nano-silver particles (or nano-silver flakes), graphene and polymer materials, can replace the materials of the existing soft test probes to improve test life, reduce test pressure, resistance and cost.
為讓本發明的上述內容能更明顯易懂,下文特舉較佳實施例,並配合所附圖式,作詳細說明如下。 In order to make the above-mentioned content of the present invention more obvious and easy to understand, the preferred embodiments are exemplified below, and are described in detail as follows in conjunction with the accompanying drawings.
S10,S20,S30,S40:步驟 S10, S20, S30, S40: Steps
10:彈性導電柱體 10: Elastic conductive cylinder
14:柱狀結構 14: Columnar structure
15:疏水材料層 15: Hydrophobic material layer
20:框體 20: Frame
30:基板 30: Substrate
32:孔洞 32: Holes
100:探針卡 100: Probe card
〔圖1〕顯示依據本發明較佳實施例的彈性導電柱體的剖面示意圖。 [FIG. 1] is a schematic cross-sectional view of an elastic conductive cylinder according to a preferred embodiment of the present invention.
〔圖2〕顯示依據本發明較佳實施例的探針卡的局部剖面示意圖。 [FIG. 2] shows a partial cross-sectional schematic diagram of a probe card according to a preferred embodiment of the present invention.
〔圖3〕顯示依據本發明較佳實施例的彈性導電柱體的製造方法的流程圖。 [FIG. 3] is a flow chart showing a manufacturing method of an elastic conductive cylinder according to a preferred embodiment of the present invention.
〔圖4〕顯示依據本發明較佳實施例的彈性導電柱體的顯微組織圖。 [FIG. 4] shows the microstructure diagram of the elastic conductive cylinder according to the preferred embodiment of the present invention.
〔圖5〕顯示〔圖4〕的銀成分分佈圖。 [Fig. 5] shows a silver composition distribution diagram of [Fig. 4].
〔圖6〕顯示〔圖4〕的奈米富勒球體及石墨烯的分佈圖。 [FIG. 6] shows the distribution diagram of the nanofuller spheres and graphene of [FIG. 4].
〔圖7〕顯示〔圖4〕的氧原子的分佈圖。 [ Fig. 7 ] is a diagram showing the distribution of oxygen atoms in [ Fig. 4 ].
本揭露內容提出利用具有高硬度、高機械強度(高硬度及高彈性強度)與導電度之奈米富勒球體,配合奈米銀顆粒(或奈米銀片)以及石墨烯與高分子材料,來取代現有的軟性測試探針的材料,用以提高測試壽命、降低測試壓力、電阻與成本。 The present disclosure proposes to use nanofuller spheres with high hardness, high mechanical strength (high hardness and high elastic strength) and electrical conductivity, combined with nanosilver particles (or nanosilver flakes), graphene and polymer materials, To replace the material of the existing soft test probe to improve test life, reduce test pressure, resistance and cost.
再者,本揭露內容利用疏水材料與導電材料和高分子材料(譬如矽膠、樹脂或橡膠)進行組合後,進行模塑製作具導電與彈力的組件,利用上述的技術組合製作具有導電性、耐磨性與彈力的柱體。 Furthermore, the present disclosure utilizes the combination of hydrophobic material, conductive material and macromolecular material (such as silicone, resin or rubber) to mold components with electrical conductivity and elasticity. Abrasive and elastic cylinder.
本揭露內容的基本目的在於因應未來高頻元件(譬如是5G的元件)與人工智慧使用的產品元件的尺寸縮小的狀況下,測試該產品元件的測試柱體與柱體的間距將縮小。另外,待測元件頻率升高,使得測試的柱體整體電阻將降低。因此,利用具有導電高硬度的奈米富勒球體與導電矽膠與抗磨耗材料整合,製作可配合未來元件縮小以及頻率增高所使用的測試柱體與產品。 The basic purpose of the present disclosure is to reduce the size of the product components used in high-frequency components (eg, 5G components) and artificial intelligence. In addition, the frequency of the component under test increases, so that the overall resistance of the tested cylinder will decrease. Therefore, by integrating nanofuller spheres with conductive and high hardness, conductive silica gel and anti-wear materials, test cylinders and products that can be used for shrinking components and increasing frequencies in the future are fabricated.
檢測過程中,待測物(元件)會將導電柱體的頂端往下壓縮進行元件電性的測試,測試後則需要將柱體頂端往上推回至原點,來完成這個檢測的流程,故在本揭露內容中,是利用具彈性結構特性的導電橡膠配合奈米富勒球體材料進行整合,來製作具低電阻與高彈性的組件,以製作此高頻測試用的柱體。 During the detection process, the object to be tested (component) will compress the top of the conductive cylinder to test the electrical properties of the component. After the test, the top of the cylinder needs to be pushed back to the origin to complete the detection process. Therefore, in the present disclosure, the conductive rubber with elastic structural characteristics is integrated with the nanofuller sphere material to fabricate components with low resistance and high elasticity, so as to fabricate the column for high frequency testing.
圖1顯示依據本發明較佳實施例的彈性導電柱體10的剖面示意圖。如圖1所示,彈性導電柱體10包含一柱狀結構14,柱狀結構14的特徵將說明於後。此外,彈性導電柱體10可以更包含一疏水材料層15,包覆柱狀結構14的外表面,以提供疏水的效果。於一例子中,疏水材料層15的厚度介於10nm至20nm之間,彈性導電柱體10的直徑介於50μm(微米)至600μm之間,高度介於為50μm至800μm之間。
FIG. 1 shows a schematic cross-sectional view of an elastic
圖2顯示依據本發明較佳實施例的探針卡100的局部剖面示意圖。如圖2所示,探針卡100包含一框體20、一基板30及彈性導電柱體10。基板30設置於框體20上,並具有多個孔洞32。彈性導電柱體10貫通基板30的此等孔洞32,並且凸出基板30的兩側,以作電性接觸用。彈性導電柱體10可以更進一步貫通框體20,於此不作特別限制。基板30的材料可以使用與彈性導電柱體10相同的高分子材料,譬如是樹脂或矽膠。
FIG. 2 is a schematic partial cross-sectional view of the
圖3顯示依據本發明較佳實施例的彈性導電柱體的製造方法的流程圖。如圖3與圖1所示,彈性導電柱體10的製造方法包含以下步驟。首先,於步驟S10,提供奈米富勒球體(球型的富勒烯(Fullerene),由多層石墨烯所組成)、奈米金屬顆粒及石墨烯。接著,於步驟S20,對所述奈米富勒球體、所述奈米金屬顆粒及所述石墨烯進行
表面改質,以讓所述奈米富勒球體、所述奈米金屬顆粒及所述石墨烯產生表面官能基。然後,於步驟S30,利用高分子材料將所述表面改質過的奈米富勒球體、所述表面改質過的奈米金屬顆粒及所述表面改質過的石墨烯連結在一起而形成一混合物。於一例子中,高分子材料是反應型高分子,譬如是環氧矽烷/環氧樹脂/矽膠/壓克力(丙烯酸樹脂)等。接著,於步驟S40,將該混合物進行熱壓,以形成一柱狀結構14。
FIG. 3 shows a flow chart of a manufacturing method of an elastic conductive cylinder according to a preferred embodiment of the present invention. As shown in FIG. 3 and FIG. 1 , the manufacturing method of the elastic
藉由所述表面官能基以增加所述表面改質過的奈米富勒球體、所述表面改質過的奈米金屬顆粒及所述表面改質過的石墨烯彼此間的鍵結,以增加電子傳遞路徑,並增加所述高分子材料和所述表面改質過的奈米富勒球體、所述表面改質過的奈米金屬顆粒及所述表面改質過的石墨烯的附著強度。表面改質的材料的例子包含但不限於:十六烷基三甲基溴化銨、4-乙氧基苯甲醯氯(4-ethoxybenzoyl chloride)、1,2-雙(三氯甲矽烷基)乙烷、1,6-雙(三氯甲矽烷基)己烷。 The surface functional groups are used to increase the bonding between the surface-modified nanofuller spheres, the surface-modified nano-metal particles and the surface-modified graphene, so as to Increase the electron transfer path, and increase the adhesion strength of the polymer material and the surface-modified nanofuller spheres, the surface-modified nano-metal particles and the surface-modified graphene . Examples of surface-modifying materials include, but are not limited to: cetyltrimethylammonium bromide, 4-ethoxybenzoyl chloride, 1,2-bis(trichlorosilyl chloride) ) ethane, 1,6-bis(trichlorosilyl)hexane.
因此,如圖1所示,本實施例的彈性導電柱體10包含:表面改質過的奈米富勒球體、表面改質過的奈米金屬顆粒及表面改質過的石墨烯,各自具有表面官能基;及高分子材料,其中高分子材料與所述表面改質過的奈米富勒球體、所述表面改質過的奈米金屬顆粒及所述表面改質過的石墨烯各自交聯在一起而形成一柱狀結構14,藉由所述表面官能基以增加所述表面改質過的奈米富勒球體、所述表面改質過的奈米金屬顆粒及所述表面改質過的石墨烯彼此間的鍵結,以增加電子傳遞路徑,並增加所述高分子材料和所述表面改質過的奈米富勒球體、所述表面改質過的奈米金屬顆粒及所述表面改質過的石墨烯的附著強度。表面改質過的奈米金屬顆粒包含但不限於銀、鉑、金、鈀、鎳、銅、鉛、錫、鋁、鈦、其合金及混合物。
Therefore, as shown in FIG. 1 , the elastic
於一例子中,所述表面改質過的奈米富勒球體為中空奈米富勒球體(具有500nm至10μm之間的尺度),所述表面改質過的奈米富勒球體為內部具有金屬奈米顆粒的實心奈米富勒球體,且所述金屬奈米顆粒的材料包含選自於鐵、鈷及鎳所組成的群組,並且具有100nm至2μm之間的尺度,其中所述表面官能基包含選自於-OH、-SH、-COOH、-SiH、-SiOR與-NH2所組成的群組。 In one example, the surface-modified nanofuller spheres are hollow nanofuller spheres (having a scale between 500 nm and 10 μm), and the surface-modified nanofuller spheres are internally Solid nanofuller spheres of metal nanoparticles, and the material of the metal nanoparticles comprises selected from the group consisting of iron, cobalt and nickel, and has a dimension between 100 nm and 2 μm, wherein the surface The functional group is selected from the group consisting of -OH, -SH, -COOH, -SiH, -SiOR and -NH 2 .
於一個例子中,使用的材料的參數如表1所示,其中wt%代表重量百分比。 In one example, the parameters of the materials used are shown in Table 1, where wt% represents weight percent.
此外,上述製造方法可以更包含以下步驟將一疏水材料層15塗佈在該柱狀結構14上。於一例子中,可以用浸泡或者是蒸氣塗佈在柱狀結構14的外表面上,所使用材料可以譬如是含氟矽烷基-Si(CHF)nF,可以達成疏水材料層的塗佈。
In addition, the above manufacturing method may further include the following steps of coating a
圖4顯示依據本發明較佳實施例的彈性導電柱體的顯微組織圖。於圖4中,偏黑色部分為主要為高分子材料。圖5顯示圖4的銀成分分佈圖。如圖5所示,偏白色部分表示銀成分。圖6顯示圖4的奈米富勒球體及石墨烯的分佈圖。如圖6所示,偏白色部分表示奈米富勒球體及石墨烯,由於主要都是碳(C)的成分,所以共同顯示在圖6中。圖7顯示圖4的氧原子的分佈圖。如圖7所示,偏白色部分表示氧原子。因此,彈性導電柱體可以更包含氧原子,分佈於所述高分子材料中。當然,熱壓也可以於無氧環境中進行,故氧原子並非是必要成分。 FIG. 4 shows a microstructure diagram of an elastic conductive cylinder according to a preferred embodiment of the present invention. In FIG. 4 , the black parts are mainly polymer materials. FIG. 5 shows the silver composition distribution diagram of FIG. 4 . As shown in FIG. 5 , the whitish portion represents the silver component. FIG. 6 shows a distribution diagram of the nanofuller spheres and graphene of FIG. 4 . As shown in FIG. 6 , the off-white parts represent nanofuller spheres and graphene, which are mainly composed of carbon (C), so they are shown together in FIG. 6 . FIG. 7 shows a distribution diagram of oxygen atoms of FIG. 4 . As shown in FIG. 7 , the whitish portions represent oxygen atoms. Therefore, the elastic conductive pillars may further contain oxygen atoms distributed in the polymer material. Of course, hot pressing can also be performed in an oxygen-free environment, so oxygen atoms are not an essential component.
US7438563與本案的技術差異的至少包含兩項特徵。在材料製備方面,US7438563主要是利用矽膠球為主體在球體外沉積鎳與金的薄膜。本揭露內容則是將中空奈米富勒球體/內部含有鐵或鎳的奈米富勒球體、奈米銀及石墨烯先進行表面改質。在製程方面,US7438563將導電矽膠球體混和矽膠並透過磁性控制方式製作組件。本揭露內容是將上述材料混和樹酯(或是矽膠)透過網印/熱壓/磁控等方式進行製作出組件。因此無論在材料端或是製程端都與前案有著明顯的差異。本揭露內容所產生的功效可以降低測試時的壓縮力量與行程並且降低測試時的電阻。詳細的比較資料如表2所示。亦即,將彈性導電柱體進行彈性及導電性測試,測試結果跟習知技術比較如表2所列,其中m-ohm代表毫歐姆,且彈性導電柱體的長度為800微米。 The technical differences between US7438563 and this case include at least two features. In terms of material preparation, US7438563 mainly uses silica gel spheres as the main body to deposit nickel and gold films outside the spheres. In the present disclosure, the surfaces of hollow nanofuller spheres/nanofuller spheres containing iron or nickel, nanosilver and graphene are first modified. In terms of process, US7438563 mixes conductive silicone spheres with silicone and manufactures components through magnetic control. In the present disclosure, the above-mentioned materials are mixed with resin (or silicone) to manufacture components by means of screen printing/hot pressing/magnetron. Therefore, there are obvious differences from the previous case in both the material end and the process end. The effects of the present disclosure can reduce the compression force and travel during testing and reduce the resistance during testing. The detailed comparative information is shown in Table 2. That is, the elastic conductive cylinders are tested for elasticity and conductivity. The test results are compared with the prior art as shown in Table 2, where m-ohm represents milliohms, and the length of the elastic conductive cylinders is 800 microns.
從表2可以看出,彈性導電柱體具有以下特徵:於彈性導電柱體被壓縮0.25mm時,所需的壓縮力介於13g與23g之間;以及彈性導電柱體具有範圍從0.02到0.04歐姆的電阻值。值得注意的是,除了表面改質過的奈米富勒球體、表面改質過的奈米金屬顆粒及表面改質過的石墨烯以外,彈性導電柱體10的材料可以更包含奈米碳管。此
外,彈性導電柱體10可以具有圓柱狀、方柱狀、圓錐狀或其他形狀。
As can be seen from Table 2, the elastic conductive cylinder has the following characteristics: when the elastic conductive cylinder is compressed by 0.25mm, the required compressive force is between 13g and 23g; and the elastic conductive cylinder has a range from 0.02 to 0.04 resistance value in ohms. It is worth noting that, in addition to the surface-modified nanofuller spheres, the surface-modified nano-metal particles and the surface-modified graphene, the material of the elastic
藉由上述實施例,可以提供一種具有低電流、低測試壓縮力量、高壽命的彈性導電柱體,利用具有高硬度、高機械強度(高硬度及高彈性強度)與導電度之奈米富勒球體,配合奈米銀顆粒(或奈米銀片)以及石墨烯與高分子材料,來取代現有的軟性測試探針的材料,用以提高測試壽命、降低測試壓力、電阻與成本。 With the above embodiments, an elastic conductive cylinder with low current, low test compression force, and long life can be provided, using nanofuller with high hardness, high mechanical strength (high hardness and high elastic strength) and electrical conductivity. The sphere, combined with nano-silver particles (or nano-silver flakes), graphene and polymer materials, can replace the materials of the existing soft test probes to improve test life, reduce test pressure, resistance and cost.
在較佳實施例的詳細說明中所提出的具體實施例僅用以方便說明本發明的技術內容,而非將本發明狹義地限制於上述實施例,在不超出本發明的精神及申請專利範圍的情況下,所做的種種變化實施,皆屬於本發明的範圍。 The specific embodiments proposed in the detailed description of the preferred embodiments are only used to facilitate the description of the technical content of the present invention, rather than limiting the present invention to the above-mentioned embodiments in a narrow sense, without exceeding the spirit of the present invention and the scope of the patent application Under the circumstance, all kinds of changes and implementations made belong to the scope of the present invention.
S10,S20,S30,S40:步驟 S10, S20, S30, S40: Steps
Claims (10)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201962887216P | 2019-08-15 | 2019-08-15 | |
US62/887,216 | 2019-08-15 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW202109554A TW202109554A (en) | 2021-03-01 |
TWI759815B true TWI759815B (en) | 2022-04-01 |
Family
ID=76035355
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW109126945A TWI759815B (en) | 2019-08-15 | 2020-08-07 | Elastic and electroconductive pin, manufacturing method thereof and probe card using the same |
Country Status (1)
Country | Link |
---|---|
TW (1) | TWI759815B (en) |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20100116527A1 (en) * | 2008-11-12 | 2010-05-13 | Khosla Ajit | Electrically conductive, thermosetting elastomeric material and uses therefor |
US20120077020A1 (en) * | 2009-05-26 | 2012-03-29 | Kazuo Muramatsu | Carbon material and method for producing same |
CN102766439A (en) * | 2012-07-05 | 2012-11-07 | 北京师范大学 | High-temperature coefficient and high-stability room temperature switch nanocomposite |
CN103429427A (en) * | 2011-03-28 | 2013-12-04 | 东丽株式会社 | Conductive laminated body and touch panel |
WO2015161203A1 (en) * | 2014-04-18 | 2015-10-22 | Massachusetts Institute Of Technology | Functionalized nanostructures and devices including photovoltaic devices |
CN108351233A (en) * | 2015-07-10 | 2018-07-31 | 南布列塔尼大学 | For physical features, preferably include the sensor of multilayered structure |
-
2020
- 2020-08-07 TW TW109126945A patent/TWI759815B/en active
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20100116527A1 (en) * | 2008-11-12 | 2010-05-13 | Khosla Ajit | Electrically conductive, thermosetting elastomeric material and uses therefor |
US20130126216A1 (en) * | 2008-11-12 | 2013-05-23 | Ajit KHOSLA | Electrically conductive, thermosetting elastomeric material and uses therefor |
US20120077020A1 (en) * | 2009-05-26 | 2012-03-29 | Kazuo Muramatsu | Carbon material and method for producing same |
CN103429427A (en) * | 2011-03-28 | 2013-12-04 | 东丽株式会社 | Conductive laminated body and touch panel |
CN102766439A (en) * | 2012-07-05 | 2012-11-07 | 北京师范大学 | High-temperature coefficient and high-stability room temperature switch nanocomposite |
WO2015161203A1 (en) * | 2014-04-18 | 2015-10-22 | Massachusetts Institute Of Technology | Functionalized nanostructures and devices including photovoltaic devices |
CN108351233A (en) * | 2015-07-10 | 2018-07-31 | 南布列塔尼大学 | For physical features, preferably include the sensor of multilayered structure |
Also Published As
Publication number | Publication date |
---|---|
TW202109554A (en) | 2021-03-01 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
Song et al. | Superfast and high-sensitivity printable strain sensors with bioinspired micron-scale cracks | |
EP3330327B1 (en) | Paste material, wiring member formed from the paste material, and electronic device including the wiring member | |
Chan et al. | Effects of bonding parameters on the reliability performance of anisotropic conductive adhesive interconnects for flip-chip-on-flex packages assembly II. Different bonding pressure | |
JP3616031B2 (en) | Anisotropic conductive sheet, method for manufacturing the same, electronic device and inspection device for operation test | |
Gul et al. | Retracted Article: 3D printed highly flexible strain sensor based on TPU–graphene composite for feedback from high speed robotic applications | |
EP1585197B1 (en) | Anisotropic conductive connector and production method therefor and inspection unit for circuit device | |
US8173260B1 (en) | Nano-structure enhancements for anisotropic conductive adhesive and thermal interposers | |
KR101959536B1 (en) | Anisotropic sheet comprising conductive particles mixed different kind of particles | |
JPH03183974A (en) | Electric inspection device using anisotropic conductive sheet and manufacture of anisotropic conductive sheet | |
KR101401574B1 (en) | Electrical conductive adhesives with hybrid fillers and fabrication method therof | |
CN111253751B (en) | Carbon nanotube polydimethylsiloxane composite material and preparation method and application thereof | |
YoungáLim | Fabrication of a stretchable electromagnetic interference shielding silver nanoparticle/elastomeric polymer composite | |
MX2010011575A (en) | Multilayer electrical component, coating composition, and method of making electrical component. | |
US5975922A (en) | Device containing directionally conductive composite medium | |
CN110527468B (en) | Preparation and application of force-induced conductive adhesive based on one-dimensional and two-dimensional materials | |
JP5018612B2 (en) | Anisotropic conductive sheet and method for producing anisotropic conductive sheet | |
US11866623B2 (en) | Conductive polymer composite for adhesion to flexible substrate and method for preparing same | |
TWI759815B (en) | Elastic and electroconductive pin, manufacturing method thereof and probe card using the same | |
KR20110110388A (en) | Method of manufacturing pressure sensitive device, pressure sensitive device manufactured by the same method and pressure measurement method using the same device | |
Tao et al. | Novel isotropical conductive adhesives for electronic packaging application | |
Park et al. | Self-sensing and interfacial evaluation of Ni nanowire/polymer composites using electro-micromechanical technique | |
TWM572564U (en) | Single-layered conductive elastomer particles | |
KR101746062B1 (en) | Preparation method thereof and a conductive adhesive tape by using a conductive ball cushion | |
JPWO2018030438A1 (en) | Conductivity inspection member and continuity inspection device | |
KR102225647B1 (en) | Self-Healing Strain Senso |