TWI759490B - Monitoring device, monitoring method and computer-readable recording medium - Google Patents

Abstract

The present invention provides a monitoring device, a monitoring method, and a computer-readable recording medium. The monitoring device (1) comprises: a photographing unit (11), which takes the furnace lining (24) as a photographing object and performs multiple photographs; and an image selecting unit (16), which selects images from among the multiple images photographed by the photographing unit , selects an image most relevant to the reference image as an analysis target image; and a state determination unit (17) determines the state of the vapor deposition device (2) by analyzing the analysis target image selected by the image selection unit. With this configuration, the state of the vapor deposition apparatus can be determined with high accuracy.

Description

Monitoring device, monitoring method, and computer-readable recording medium

The present invention relates to monitoring of vapor deposition apparatuses.

Conventionally, a technique has been developed to monitor a vapor deposition apparatus that forms a film on a substrate by vapor deposition of a vapor deposition material on the substrate. Patent Document 1 discloses one example.

Patent Document 1 discloses a technique of recognizing the irradiation position of an electron beam on a vapor deposition material by a CCD (Charge Coupled Device) camera, and controlling the position of the electron beam based on the irradiation position. [Prior Art Document] [Patent Document]

[Patent Document 1] Japanese Patent Laid-Open Publication No. 2005-126759 (published on May 19, 2005)

THE PROBLEM TO BE SOLVED BY THE INVENTION However, Patent Document 1 does not disclose that a plurality of images are acquired every time the monitoring of the melt surface condition or the control of the electron beam position is performed. Therefore, in the technique of Patent Document 1, when the monitoring or control is performed, an inappropriate image may be acquired as an analysis target due to differences in the surrounding environment of the material container (for example, the brightness of the material container itself or its surroundings). possibility. In this case, there is a possibility that the monitoring or control cannot be performed with high accuracy.

An object of one embodiment of the present invention is to realize a monitoring device or the like capable of accurately determining the state of a vapor deposition device. [Means of Solving Problems]

In order to solve the above-mentioned problems, a monitoring device according to one aspect of the present invention monitors a vapor deposition device that forms a film on a substrate by vapor-depositing a vapor deposition material on the substrate, and the monitoring device includes an imaging unit. , taking the container for holding the vapor deposition material provided in the vapor deposition device as a photographing object, and photographing a plurality of times; the image selection unit selects a plurality of images from the plurality of images photographed by the photographing unit an image most related to a reference image as an analysis target image, the reference image being an image showing the container; and a state determination unit that analyzes the analysis target image selected by the image selection unit, to determine the state of the vapor deposition apparatus.

Furthermore, in order to solve the above-mentioned problems, a monitoring method according to one aspect of the present invention monitors a vapor deposition apparatus that forms a film on a substrate by vapor deposition of a vapor deposition material on the substrate, and the monitoring method includes: In the photographing step, the container for holding the vapor deposition material provided by the vapor deposition device is used as the photographing object, and multiple times of photographing are performed; selecting an image most relevant to a reference image as an analysis target image, the reference image being an image showing the container; and a state determination step of analyzing the analysis target image selected by the image selection step image to determine the state of the vapor deposition device. Furthermore, in order to solve the above-mentioned problems, a computer-readable recording medium according to one embodiment of the present invention records a computer program that realizes each step of the above-mentioned monitoring method when the computer program is executed by a processor. [Effect of invention]

According to the monitoring device, the monitoring method, and the computer-readable recording medium of one aspect of the present invention, it is possible to obtain the effect of being able to accurately determine whether or not the state of the vapor deposition device is a normal state.

(Embodiment 1) Hereinafter, an embodiment of the present invention will be specifically described with reference to FIGS. 1 to 13 .

(Configuration of Monitoring System) First, an example of the monitoring system according to the present embodiment will be described with reference to FIGS. 2 to 4 . FIG. 2 is a diagram showing an example of the monitoring system according to the present embodiment. FIG. 3 is a diagram showing an example of the configuration of the turret 25 included in the vapor deposition apparatus 2 . FIG. 4 is a schematic cross-sectional view of a hearth liner 24 and its surroundings. In addition, FIG. 4 is a sectional view when the furnace lining 24 is in a normal position.

Moreover, the container for holding a vapor deposition material with which the vapor deposition apparatus is equipped is mentioned, for example, a crucible. In addition, when the inner wall of the crucible is provided with a furnace lining, for example, a furnace lining can be cited as the container. In this embodiment, the case where the container is a furnace lining is exemplified.

As shown in FIG. 2 , the monitoring system of the present embodiment includes a monitoring device 1 , a vapor deposition device 2 , and a material supply device 3 . The vapor deposition apparatus 2 is an apparatus for forming a film on the substrate 100 by vapor deposition of the vapor deposition material MA on the substrate 100 . The monitoring device 1 is a device for monitoring the vapor deposition device 2 . Moreover, the material supply apparatus 3 is an apparatus which supplies the vapor deposition material MA to the furnace lining 24 with which the vapor deposition apparatus 2 is equipped. The vapor deposition material MA includes, for example, an aluminum wire, but is not limited thereto, and may be various materials (eg, metal materials) that the vapor deposition apparatus 2 forms a film on the substrate 100 . The structures of the monitoring device 1 and the vapor deposition device 2 will be described in more detail below. First, the vapor deposition apparatus 2 will be described.

(Vapor deposition apparatus 2 ) The vapor deposition apparatus 2 includes an electron beam source (EB (Electron Beam) source) 21 , a beam deflection magnet 22 , a pole piece 23 , a furnace lining 24 , a turret 25 , a turret rotating portion 26 , and a substrate Rotary part 27 .

The electron beam source 21 is a beam emission source, and is controlled by a control unit (not shown) included in the vapor deposition apparatus 2 to emit electron beams EB to the vapor deposition material MA supplied (held) to the furnace lining 24 . In addition, the electron beam source 21 contains a filament capable of releasing photons and thermionic electrons constituting the electron beam EB. By applying an accelerating voltage and an electric current to the filament, thermionic electrons emitted from the electron beam source 21 are emitted forward of the electron beam source 21 as the electron beam EB.

Furthermore, by applying a current to the filament without applying an accelerating voltage, the filament emits only photons. At this time, the electron beam source 21 functions as an illumination light source (an incandescent lamp) that illuminates its surroundings. By making the electron beam source 21 function as an illumination light source at the timing of imaging by the imaging unit 11 (described later), it is not necessary to separately provide an illumination light source for imaging. In addition, when the illumination light source is provided separately, it is often provided in the vicinity of the imaging unit 11 . At this time, a halo is generated, and there is a possibility that the furnace lining 24 and the turret 25 cannot be clearly photographed. As described above, by using the electron beam source 21 as the illumination light source, the occurrence of halos can be prevented, and the furnace lining 24 and the turret 25 can be clearly photographed. In addition, an illumination light source independent of the electron beam source 21 may be provided at a position where the halo is not generated.

The beam deflecting magnet 22 and the pole piece 23 are an outward path changing portion for changing the outward path of the electron beam EB emitted from the electron beam source 21 . Specifically, the beam deflection magnet 22 and the pole piece 23 are controlled by the control unit to change the generated magnetic force, thereby changing the path of the electron beam EB. Thereby, the electron beam EB draws a substantially circular arc trajectory from the electron beam source 21 and is irradiated to the vapor deposition material MA in the furnace lining 24 . In addition, the irradiation position of the electron beam EB is controlled to the position where the film formation speed is the fastest, that is, the electron beam EB is irradiated to the center of the melt surface (bath surface) of the vapor deposition material MA in the furnace lining 24 .

The furnace lining 24 is a crucible for holding the vapor deposition material MA supplied from the material supply device 3 . The position of the furnace lining 24 is changed by the driving of the turret rotating part 26 . In the vicinity of the material supply device 3 (material supply position), the vapor deposition material MA is supplied to the furnace lining 24 . Further, at a position (vapor deposition position) facing the substrate 100 , the vapor deposition material MA in the furnace lining 24 is melted and evaporated by receiving the electron beam EB emitted from the electron beam source 21 . Then, by evaporating (adhering) the evaporated vapor deposition material MA to the substrate 100 , film formation of the vapor deposition material MA is performed on the substrate 100 .

The turret 25 is a base on which a plurality of furnace liners 24 are provided. In this embodiment, as shown in FIG. 3 , six furnace liners 24 are provided around the rotation axis AX. The turret 25 is rotated around the rotation axis AX by the drive of the turret rotating part 26, so that the furnace lining 24 can be moved between the material supply position and the vapor deposition position. Therefore, the vapor deposition material MA can be evaporated from the furnace lining 24A at the vapor deposition position to which the vapor deposition material MA is supplied to form a film on the substrate 100, and the vapor deposition can be supplied to the other furnace linings 24B at the material supply position Plating material MA. That is, the supply of the vapor deposition material MA toward the furnace lining 24 and the vapor deposition of the vapor deposition material MA toward the substrate 100 can be performed continuously.

Furthermore, as shown in FIG. 4 , the furnace lining 24 is provided on the turret 25 via the heat insulating material (reflector) 30 . The heat insulating material 30 is used to improve the heat preservation property for heat preservation of the vapor deposition material MA supplied to the furnace lining 24 . With the heat insulating material 30, the vapor deposition material MA can be efficiently melted. In addition, the furnace lining 24 can be positioned relative to the turret 25 using the thermal insulation 30 .

The turret rotating part 26 is connected to the approximate center of the turret 25, and rotates the turret 25 around the rotation axis AX. Further, by attaching the substrate rotating unit 27 to the approximate center of the substrate 100 to be film-formed, the substrate rotating unit 27 rotates the substrate 100 under film formation. The driving of the turret rotating unit 26 and the substrate rotating unit 27 is controlled by the control unit.

(Monitoring Device 1 ) Next, the monitoring device 1 will be described with reference to FIGS. 1 , 2 , and 4 to 11 . FIG. 1 is a block diagram showing an example of a specific configuration of a monitoring device 1 according to the present embodiment. FIG. 5 is a diagram showing an example of a reference image group registered in the reference image database 141, (a) shows an example of a reference image group including a plurality of reference images with different usage states of the furnace lining 24, ( b) shows an example of a reference image group including a plurality of reference images with different melt surface positions, (c) shows a reference image including a plurality of reference images with different inclinations of the furnace lining 24 within a predetermined range As an example of the group, (d) shows an example of a reference image group including a plurality of reference images having different irradiation positions of the electron beam EB. FIG. 6 is a diagram for explaining the determination process of the position of the furnace lining 24 . FIG. 7 is a diagram for explaining the determination process of the melt surface position. FIG. 8 is a diagram for explaining the determination processing of the irradiation position. 9 to 11 show an example of a plurality of images captured.

The monitoring device 1 monitors whether the state of the vapor deposition device 2 is a normal state by analyzing the image of the furnace lining 24 captured by the imaging unit 11 . As shown in FIG. 1 , the monitoring device 1 includes a control unit 10 , an imaging unit 11 (also shown in FIG. 2 ), a notification unit 13 , and a recording unit 14 . Furthermore, as shown in FIG. 2 , the monitoring device 1 includes a camera shutter 12 .

(Image capture unit) The image capture unit 11 uses the control of the image capture control unit 15 (described later) to place the furnace lining 24 (specifically, the furnace lining 24 and its surrounding area) for holding the vapor deposition material MA irradiated with the electron beam EB. As the subject of photography, and shot many times.

Compared with the case where an image (captured image) obtained by one shot is used as the image to be analyzed, the selection range can be expanded by multiple shots. Therefore, the possibility of using a clear image of the furnace lining 24 (and its surroundings) as an analysis target image increases, so that the state of the vapor deposition apparatus 2 can be determined with high accuracy.

The monitoring objects of the monitoring device 1 are: (A) the position of the furnace lining 24 ; (B) the melt surface position of the vapor deposition material MA supplied to the furnace lining 24 ; and (C) the electrons emitted from the electron beam source 21 . The irradiation position of the beam EB in the furnace lining 24 . In other words, in the monitoring device 1 , the state determination unit 17 described later determines the state of the vapor deposition device 2 by analyzing (A), (B), and (C) appearing in the analysis target image as the analysis target. Whether the status is normal. Specifically, the state determination unit 17 determines whether or not each position is a normal position (reference position) by analyzing each position appearing in the analysis target image.

Here, the image to be analyzed is an image captured by the imaging unit 11 and is an image analyzed for determining whether or not the respective positions are in normal positions in each of the monitoring of (A) to (C). . In addition, the normal position (reference position) refers to a state in which the virtual surface including the opening of the furnace lining 24 is not substantially inclined with respect to the surface of the turret 25 in the above (A) (with a predetermined range of state of the inclination); in the above (B), when the vapor deposition material MA is supplied to the furnace lining 24 to such an extent that the vapor deposition process of the substrate 100 by the vapor deposition apparatus 2 is not hindered, the melt surface of the vapor deposition material MA is The position; in the above (C), it is the center of gravity (center) of the melt surface of the vapor deposition material MA in the furnace lining 24 .

In the present embodiment, the imaging unit 11 continuously captures a plurality of images in each of the above-mentioned monitoring (A) to (C). In other words, in each of the three monitoring of (A) to (C), a plurality of shots are performed. Thereby, in each monitoring of the above-mentioned (A) to (C), a plurality of images showing the furnace lining 24 with different brightness can be acquired. However, if it is not considered to acquire a plurality of images in each monitoring, the continuous multiple imaging may be performed only once in one vapor deposition process.

In the present embodiment, the monitoring device 1 uses (A) to (C) as monitoring objects (analysis objects), but at least any one of (A) to (C) may be monitored.

In addition, the imaging unit 11 changes at least one of the imaging sensitivity and the shutter speed every time the furnace lining 24 is captured. The photographing sensitivity is used to define the light intake amount (capacity) per predetermined time during photographing. Shutter speed is used to specify the focusing time when shooting. By changing either the shooting sensitivity or the shutter speed, images with different brightness can be obtained. Generally, the lower the shooting sensitivity and the faster the shutter speed, the darker the image.

For example, when only one image is captured, it may be difficult to determine the furnace lining 24 or the vapor deposition material MA in the image if the image is too bright (or too dark). By acquiring a plurality of images with different brightness, an image with reduced brightness (or an image with enhanced brightness) can be acquired. At this time, by analyzing the image, it can be determined that the furnace lining 24 or the vapor deposition material MA has an increased possibility.

Shooting sensitivity and shutter speed are each set in multiple levels. The photographing sensitivity and shutter speed are set within a range where it is estimated that the image of the furnace lining 24 can be obtained in a range with a high possibility of being able to be obtained by experiments, etc. Contrast like contrast. In addition, the shooting sensitivity and shutter speed are set in consideration of the correlation with each other. In addition, the reference image is preliminarily captured by the imaging unit 11 , and is an image showing the imaging result of the furnace lining 24 registered in the reference image database (Database) 141 (described later) of the recording unit 14 .

In the present embodiment, the shooting sensitivity is set to 16 steps of "1", "1.5", "2", . . . , "7", "7.5", and "8". "1" is equivalent to 100 of the ISO sensitivity. When the imaging sensitivity is increased by 1, the light intake amount per predetermined time is doubled. That is, when the imaging sensitivity is increased by 0.5, the intake amount becomes √2 times. In addition, the shutter speed is set to three steps of "1/60", "1/120" and "1/240". These set values and set numbers are just an example.

In addition, the photographing sensitivity and shutter speed can be set in accordance with each of the above-mentioned monitoring (A) to (C). At this time, the imaging unit 11 is controlled by the imaging control unit 15, and in each of the monitoring (A) to (C), the furnace lining 24 is photographed at the imaging sensitivity and shutter speed set in accordance with the monitoring.

In addition, in each of the above-mentioned monitoring (A) to (C), during the period from which the imaging unit 11 starts to capture a plurality of images to the end, a predetermined period during which the images are not captured may be set. The predetermined period is set to an appropriate value in each of the above-mentioned monitoring (A) to (C) through experiments or the like. For example, the start point of the predetermined period is defined as the time when the shooting starts and the predetermined number of shots are finished (for example: when the shooting of 4 shots ends), and the predetermined period is defined as several seconds (for example: 10 seconds) from the end of the shooting bell). The imaging control unit 15 controls the imaging unit 11 so that imaging is not performed for a predetermined period in accordance with each of the above-mentioned monitoring (A) to (C).

In this way, by appropriately changing the imaging sensitivity, shutter speed, or imaging timing to capture a plurality of images, it is possible to obtain the furnace lining 24 (the vapor deposition material MA contained in the furnace lining 24 or the irradiated electrons) with different brightness. Multiple images of Evaporated Material MA) of beam EB.

An example of a plurality of images captured by the imaging unit 11 changing the imaging setting will be described later.

In addition, a CCD camera etc. are mentioned as the imaging part 11. FIG. The imaging unit 11 is arranged at a position having a predetermined angle α with respect to the vertical line (center line CL) of the center of the opening surface of the furnace lining 24 when passing through the normal position. By capturing images from these positions, the monitoring device 1 can calculate the inclination amounts of the furnace lining 24 in various directions in the image of the furnace lining 24 captured by the imaging unit 11 .

(Camera Shutter) The camera shutter 12 is controlled by the imaging control unit 15 to open the front of the imaging unit 11 at the timing when the imaging unit 11 is imaging the furnace lining 24 , and is in the closed state at other times. With the above-described control, it is possible to prevent the scattered vapor deposition material MA from adhering to the lens (not shown) of the imaging unit 11 in a time period other than imaging. In addition, a glass plate may be bonded to the front of the lens of the imaging unit 11 to prevent the scattered vapor deposition material MA from adhering to the lens of the imaging unit 11 .

(Notification Unit) The notification unit 13 provides various notifications to the operator using the monitoring system. The notification unit 13 is controlled by, for example, the state determination unit 17, and when the position of the furnace lining 24, the position of the melt surface of the vapor deposition material MA in the furnace lining 24, or the irradiation position of the electron beam EB in the vapor deposition material MA When they deviate from their normal positions, a warning is issued. The notification unit 13 is realized by, for example, a microphone that outputs various notifications by sound and/or a display device that outputs various notifications by images.

(Recording Unit) The recording unit 14 records, for example, various control programs executed by the control unit 10 and the like, and is composed of, for example, a non-volatile recording device such as a hard disk and a flash memory. The recording unit 14 records, for example: (1) a monitoring program showing the steps of the monitoring process; (2) data showing the image captured by the imaging unit 11 ; (3) a reference to be a comparison object with which the captured image is compared The data of the image; (4) the data indicating the shooting settings; and (5) various threshold values (values defining a predetermined range) used in the determination process of the control unit 10 . Examples of the imaging settings include the imaging position, imaging sensitivity, shutter speed, imaging timing, and the like of the imaging unit 11 in each of the above-mentioned monitoring (A) to (C). Further, the recording unit 14 includes a reference image database 141 in which reference images can be registered (recorded).

(Example of Reference Image) In this embodiment, a plurality of reference images are registered. As a reference image, at least an image suitable for selecting an image to be analyzed from a plurality of images needs to be set. As a reference image, for example, the outline of the furnace lining 24, the melt surface position of the vapor deposition material MA (the boundary between the inner wall of the furnace lining 24 and the melt surface), or the melt surface clearly appearing Image of the irradiated electron beam EB. Further, an image is set as a reference image, by analyzing (processing) the reference image, the position of the contour portion, the boundary portion, or the electron beam EB can be estimated. At this time, the estimated position of the contour portion, the boundary portion, or the electron beam EB is associated with the reference image and recorded in the recording unit 14 .

In the present embodiment, as a plurality of reference images, for example, one reference image is registered in the reference image database 141 for each of the monitors (A) to (C) described above. In the case of (A), as will be described later, the position of the furnace lining 24 is monitored based on the contour of the furnace lining 24 appearing in the captured image. Therefore, it is preferable that the reference image clearly shows the outline portion, and for example, an image showing the new furnace lining 24 is set as the reference image. Further, in the case of (B) or (C), the melt surface position or the irradiation position is monitored based on the boundary portion or the irradiation position appearing in the captured image. Therefore, for example, an image that clearly shows the boundary portion or the irradiation position is set as a reference image.

In this way, when an image corresponding to each of the above-mentioned monitoring (A) to (C) is set as a reference image, when compared with the reference image, the result is that the selected analysis target image is easily The possibility of determining the contour portion, the boundary portion or the irradiation position increases.

In addition, for example, the following reference image groups may be registered in the reference image database 141 as a plurality of reference images: (a) Reference images including a plurality of reference images whose use states of the furnace lining 24 are different from each other group; (b) a reference image group including a plurality of reference images whose melt surface positions of the vapor deposition material MA supplied to the furnace lining 24 are different from each other; (c) a reference image group including the furnace lining 24 with respect to a predetermined reference plane A reference image group of a plurality of reference images having different inclinations from each other, wherein the inclinations are within a predetermined range; and (d) including the electron beam EB emitted from the electron beam source 21 in the furnace lining 24 A reference image group of a plurality of reference images whose irradiation positions are different from each other. FIG. 5 shows an example of the reference image groups of (a) to (d). In addition, each reference image may be, for example, an image in which the furnace lining 24 (and the vapor deposition material MA) are in a red-hot state.

(a) of FIG. 5 shows the reference image group corresponding to the above (a). In the above example, as the used state of the furnace lining 24, a state in which the furnace lining 24 is basically unused (new), a state in which the vapor deposition material MA is adhered to the inner wall of the furnace lining 24 (used), and a vaporized state are prepared. There are three states in which the plating material MA leaks to the outside of the furnace lining 24 along the inner wall of the furnace lining 24 (a state in which "overflow" occurs) (old).

The reference image group corresponding to the above-mentioned (b) is shown in (b) of FIG. 5 . In the above example, the state where the melt surface position is in the vicinity of the opening of the furnace lining 24 (the state in which the amount of vapor deposition material MA (the amount of melt) is large), the state in the vicinity of the middle, and the vicinity of the bottom are prepared. status of these three.

The reference image group corresponding to the above-mentioned (c) is shown in (c) of FIG. 5 . In the example, three reference images were prepared when the position of the furnace lining 24 was in the normal position. In this embodiment, the predetermined reference plane refers to the surface of the turret 25 , and the predetermined range refers to the distance between the virtual surface (the virtual surface including the opening of the furnace lining 24 ) relative to the surface of the turret 25 . The inclination is in a range (a range of about several degrees) that does not interfere with the vapor deposition process. In FIG. 5( c ), the case where the inclination of the furnace lining 24 is 0° within the predetermined range, the case where the left side of the furnace lining 24 is tilted upward, and the case where the right side of the furnace lining 24 is tilted upward are prepared. Three benchmark images. The inclination on the left side and the incline on the right side will be explained later.

The reference image group corresponding to the above-mentioned (d) is shown in (d) of FIG. 5 . In the above example, three reference images are prepared in which the irradiation positions are the center, the left, and the right of the melt surface.

In addition, the types of reference images in each reference image group may be two or four or more. For example, in FIG. 5( c ), a reference image may be prepared for a case where the front side is tilted up and/or the back side is tilted up (described later). In addition, it is not necessary to prepare all of the above (a) to (d), and it is sufficient to prepare a necessary reference image group corresponding to the monitoring object monitored by the monitoring device 1 . In other words, it is sufficient to prepare at least one reference image group among the above (a) to (d).

(Control Unit) The control unit 10 controls the monitoring device 1 as a whole. Specifically, the control unit 10 includes an imaging control unit 15 , an image selection unit 16 , and a state determination unit 17 to determine the state of the vapor deposition apparatus 2 with high accuracy, and to notify or stop the vapor deposition process according to the determination result. .

The imaging control unit 15 controls the imaging unit 11 . As described above, the imaging control unit 15 causes the imaging unit 11 to capture images a plurality of times in each of the above-mentioned monitoring (A) to (C). The photographing control unit 15 selects the photographing position, photographing sensitivity, and shutter speed of the photographing unit 11 set for each of the monitors (A) to (C) described above in each of the monitors (A) to (C). In addition, the imaging control unit 15 operates a timer (not shown) after completing the imaging of a predetermined number of images in each of the above-mentioned monitoring (A) to (C), and controls the monitoring for the above-mentioned (A) to (C). ) for the predetermined period of each monitoring setting, and the imaging by the imaging unit 11 is stopped. Then, when a notification from the timer that a predetermined period has elapsed is received, shooting is resumed.

For example, in the monitoring of the above (A), the imaging control unit 15 confirms that the film formation rate is 0 (a state in which the vapor deposition material MA is not scattered) after the vapor deposition is completed. The photographing control unit 15 changes the photographing sensitivity to "6", "5", "4" and "3" in sequence after the confirmation (for example, about 2 to 3 minutes after the vapor deposition finishes), and continuously photographing four times . The imaging control unit 15 counts a predetermined period (eg, 10 seconds) set for the monitoring of the above (A), and interrupts imaging during this period. When confirming that the predetermined period has elapsed, the photographing control unit 15 changes the photographing sensitivity to "6", "5", "4", and "3" in this order, and continues photographing four times. Thereby, a total of eight images are acquired. In addition, the shutter speed is set to "1/60" or "1/120".

In the monitoring of (B) described above, the imaging control unit 15 confirms that the deposition rate is zero after the vapor deposition is completed. After the confirmation, the photographing control unit 15 sequentially changes the photographing sensitivity to "6", "5", "4", and "3" to continuously photograph four times. Subsequently, the imaging control unit 15 counts a predetermined period (for example: 10 seconds) set for the monitoring of (B), and interrupts the imaging for this period. When confirming that the predetermined period has elapsed, the photographing control unit 15 changes the photographing sensitivity to "6", "5", "4", and "3" in this order, and continues photographing four times. In this way, a total of eight images are acquired. In addition, the shutter speed is set to "1/60" or "1/120".

In the monitoring of (C), the shooting sensitivity is changed to "8", "7.5", "7", "6.5", "6", "5.5", "5", "4.5" in order, and continuous shooting eight times. That is, in the present embodiment, the predetermined period set for the monitoring of (C) is 0 seconds. In this way, a total of eight images are acquired. In addition, the shutter speed is set to "1/60", "1/120" or "1/240".

In the present embodiment, after the vapor deposition (main vapor deposition) is completed and the furnace lining 24 and the vapor deposition material MA are red-hot due to vapor deposition, imaging for monitoring of the above (A) and (B) is performed. . The red-hot state lasts for about 5 minutes after the deposition on the substrate 100 is completed and the irradiation of the electron beam EB is stopped. In this embodiment, the imaging is performed at a time point of about 2 to 3 minutes after the stop. In addition, the image of the new furnace lining 24 tends to be brighter than the overflowing furnace lining 24 . In other words, when the overflow occurs, since the vapor deposition material MA covers the inner wall of the furnace lining 24, the image tends to become dark. In particular, when the vapor deposition material MA is a metal-based material such as aluminum or silver, it becomes significantly darker. Furthermore, the brightness of the image differs depending on the position of the melt surface of the vapor deposition material MA. When the melt surface position is high, the furnace lining 24 and the vapor deposition material MA are not easily cooled (it is easy to maintain a red-hot state), and on the other hand, when the melt surface position is low, it is easy to cool.

In this way, in the monitoring of (A) and (B), the degree of the red heat is different depending on the state of the furnace lining 24 or the position of the melt surface, etc., on the basis of photographing in the red hot state. Therefore, for the image analysis for extracting the contour portion or the boundary portion, depending on the situation, there is a possibility that an image that is too bright is captured. At this time, in the captured image, the contour portion or the border portion is not clear (the contrast of the portion decreases), and there is a possibility that the contour portion or the border portion cannot be obtained with high accuracy.

Therefore, compared with the photographing for the monitoring of the (C) after a certain period of time has elapsed after the vapor deposition (in a state where the red heat caused by the vapor deposition has disappeared), in the (A) and (B) During shooting, the shooting sensitivity is set lower. Therefore, it can be expected to obtain an image with reduced brightness. In addition, the red-hot state of the furnace lining 24 and the like becomes stable over time. By providing an imaging standby period of a predetermined period in a plurality of consecutive imaging, it can be expected to acquire an image in which the red-hot state is suppressed in imaging after the predetermined period. In addition, in one continuous shooting, the predetermined period may be set a plurality of times.

On the other hand, compared to the shootings of (A) and (B), the shooting for the monitoring of (C) is as described above, and it is foreseeable that the furnace lining 24 and the like are no longer red hot. Therefore, in the photographing of the (C), the photographing sensitivity is set higher than the photographing of the (A) and (B).

In each monitoring, by capturing a plurality of images in this way, the possibility that the contour portion, the boundary portion, or the irradiation position can be obtained with high accuracy increases.

In addition, the setting of the above-mentioned photographing sensitivity, shutter speed, and predetermined period is only an example. In each monitoring, as long as an analysis target image that can analyze the position of the furnace lining 24, the melt surface position, or the irradiation position can be selected from a plurality of images captured, the imaging sensitivity, shutter speed and predetermined The period can also be set to any value. In addition, in one vapor deposition process, the number of images captured in the monitoring of (A) to (C) is not limited to eight, and can be appropriately changed.

The image selection unit 16 selects an image most relevant to the reference image from among the plurality of images captured by the imaging unit 11 as an analysis target image.

Specifically, the image selection unit 16 calculates a correlation value indicating the degree of correlation with respect to the reference image of each image based on the pixel value of each image captured by the imaging unit 11 . In the calculation of the correlation value, a statistical method of normalized correlation is used, for example, pattern matching is used to calculate the correlation value (similarity) between the respective images and the reference image.

In the normalized correlation, the correlation value is calculated by the following formula. In the following formula, I represents the pixel value (brightness value) of each pixel in each of the images, M represents the pixel value of each pixel in the reference image, and n represents each of the images and the reference image. All picture primes in the image. Also, a horizontal bar (-) indicates the average value.

(Formula 1) In the above formula, the more similar each image is to the reference image, the more a value close to 100 (%) is expressed. The image selection unit 16 selects an image whose correlation value is closest to 100 among a plurality of images captured in each of the above-mentioned monitoring (A) to (C) as an analysis target image. In addition, the object of calculation of the correlation value may be the contour portion or the boundary portion in each image and the reference image. For example, when the image selection unit 16 selects the image to be analyzed by using the correlation between the plurality of images and the contour portion in the reference image, the possibility of erroneous detection of the contour portion in the captured image can be suppressed.

As described above, in the present embodiment, during the monitoring of (A) and (B), the furnace lining 24 or the vapor deposition material MA in the red-hot state is photographed. In order to suppress the influence, the monitoring device 1 first causes the imaging unit 11 to image at least the plurality of furnace liners 24 whose imaging sensitivity has been changed. Thereby, a plurality of images showing the furnace lining 24 or the vapor deposition material MA with different brightness can be acquired. Then, the image selection unit 16 compares a plurality of images with different brightness acquired by the imaging unit 11 and, for example, the furnace lining 24 showing red heat or the reference image of the vapor deposition material MA (the outline part or the boundary part can be acquired). images) to compare and select the image that is most relevant to the baseline image. As a result, an image that is easy to analyze in order to determine the state of the vapor deposition apparatus 2 can be selected as an analysis target image. Among a plurality of captured images, since the image in which the contrast of the outline portion or the boundary portion is not reduced, or the contrast reduction of the outline portion or the boundary portion is suppressed is selected as the image to be analyzed, it is possible to achieve high accuracy. Determine the position of the furnace lining 24 or the position of the melt surface.

In addition, in the monitoring of the above-mentioned (C), imaging is performed while irradiating the electron beam EB. Therefore, since the brightness of the surrounding environment of the furnace lining 24 at the time of photographing tends to fluctuate, there is a possibility that, for example, the irradiation position of the electron beam EB in the photographed image may not be clear due to the fluctuation. Even in this case, the imaging unit 11 images at least the plurality of furnace liners 24 whose imaging sensitivity has been changed. Then, the image selection unit 16 compares a plurality of images of the vapor deposition material MA showing different brightness with a reference image of the vapor deposition material MA showing red heat, for example, and selects a photographed image most relevant to the reference image picture. As a result, like the above, since an image that is easy to analyze can be selected as an analysis target image, the irradiation position can be determined with high accuracy.

In addition, when the predetermined period is provided, the image selection unit 16 may compare the captured image and the reference image before and after the predetermined period. For example, in the case of monitoring of (A) and (B), the image selection unit 16 compares the first four images with the reference image, and selects the reference image among the four images. One of the most relevant images. Then, the image selection unit 16 compares the four images after a predetermined period with the reference image, and selects one image most related to the reference image among the four images. Then, the image selection unit 16 selects an image more related to the reference image among the images selected from the four images before the predetermined period and the images selected from the four images after the predetermined period as the reference image. Analyze object images.

In addition, in the present embodiment, as described above, a plurality of reference images with different states of the furnace lining 24 are provided. Therefore, the image selection unit 16 selects an image to be analyzed from the plurality of images captured by the imaging unit 11 using the reference image selected from the plurality of reference images. The state of the furnace lining 24 includes, for example, the use state of the furnace lining 24 , the melt surface position of the vapor deposition material MA in the furnace lining 24 , the inclination of the furnace lining 24 , and the effect of electron beam EB on the inside of the furnace. The irradiation position where the vapor deposition material MA in the liner 24 is irradiated.

The image selection unit 16 selects a reference image for selecting an image to be analyzed (a reference image for selecting an image to be analyzed) by analyzing the acquired image, for example. At this time, the image selection unit 16 calculates, for example, the luminance value of an area assumed to be the contour portion of the furnace lining 24, the inner wall, or the vicinity of the melt surface, and compares the luminance value of the area with the luminance value of the corresponding area in the reference image. Brightness values are compared. The image selection unit 16 selects a reference image having a luminance value closest to the luminance value of the region obtained by analysis as a reference image for selecting an image to be analyzed.

In addition, the image selection unit 16 may select a reference image for selecting an image to be analyzed according to the state of the furnace lining 24 , for example, based on the magnitude of the current value applied to the electron beam source 21 . At this time, the magnitude (range) of the current value may be associated with a plurality of reference images and recorded in the reference image database 141 . The image selection unit 16 acquires a current value when the imaging unit 11 acquires an image, and selects a reference image for selecting an image to be analyzed by referring to the reference image database 141 .

In this way, the image selection unit 16 can determine the approximate state of the furnace lining 24 from the information such as the captured image and the current value, and can select a reference image for selecting an image to be analyzed. In addition, the image selection unit 16 performs the above analysis or acquires the current value for one of the acquired images (for example, the first acquired image), but the present invention is not limited to this, and the above may be performed for a plurality of images. Analyze or obtain current values.

In addition, the image selection unit 16 , for example, when one reference image is provided for each monitoring, the reference image (reference image associated with each monitoring) used in each of the above-mentioned (A) to (C) monitoring image) is selected as the reference image for selecting the analysis object image. In addition, the image selection unit 16 may select a reference image for selecting an image to be analyzed in accordance with each of the monitors (A) to (C) described above.

In the present embodiment, the reference image groups (a) to (d) described above are provided as a plurality of reference images. Therefore, the image selection unit 16 can select a target image group from at least one reference image group among the reference image groups in the above (a) to (d) in accordance with each of the monitoring (A) to (C). for selecting the reference image of the analysis target image.

Here, as a reference image group corresponding to each of the above-mentioned monitoring (A) to (C), it is preferable to set a reference image group that can be easily selected from a plurality of captured images to clearly show each monitoring. image of necessary parts (eg: the outline part, the boundary part or the irradiation position). In addition, in each monitoring, when processing using a reference image is performed on a selected image, the reference image group is preferably selected with reference to the processing.

In the case of the monitoring of the above (A), among the captured images, it is preferable to select an image in which the outline portion (HL shown in FIG. 6 ) can be acquired. Therefore, the reference image group used by the image selection unit 16 is set to, for example, the above (a) or (c).

In the case of the monitoring of (B), it is preferable to select the outline portion (ED _b shown in FIG. 7 ) and the boundary portion (ED _f shown in FIG. 7 ) in the captured image. )Image. Therefore, as the reference image group used by the image selection unit 16 , for example, the above-mentioned (a) to (c) are set.

In the case of the monitoring of the above (C), among the captured images, it is preferable to select an image that can acquire the melt surface position and the irradiation position. Therefore, the reference image group used by the image selection unit 16 is set to, for example, (b) or (d) described above.

In this state of setting, the image selection unit 16 corresponds to, for example, each of the monitors (A) to (C) described above (in other words, corresponds to the setting), from (a) to (d) above. The reference image group selects at least one reference image group, and selects a reference image for selecting an analysis target image from among the selected reference image groups. When selecting a reference image for selecting an image to be analyzed, the image selection unit 16 can select the reference image by analyzing the acquired image or acquiring the current value, as described above. In addition, a preselected reference image may be provided in the reference image group (a) to (d), and in this case, the image selection unit 16 selects the reference image for selecting the analysis target The base image for the image.

In this way, the image selection unit 16 selects one representative reference image assumed to be the most relevant in each of the above-mentioned monitoring (A) to (C) as the reference image for selecting the analysis target image.

The state determination unit 17 determines the state of the vapor deposition apparatus 2 by analyzing the image to be analyzed selected by the image selection unit 16 . The state determination part 17 is provided with the furnace lining position monitoring part 171, the melt surface position monitoring part 172, and the irradiation position monitoring part 173, and it monitors the said (A)-(C).

In addition, the state determination part 17 does not necessarily have all the functions of the furnace lining position monitoring part 171 , the melt surface position monitoring part 172 , and the irradiation position monitoring part 173 . The state determination unit 17 may have only one or two of the three functions described above. The state determination unit 17 only needs to have a function of making the monitoring device 1 a monitoring target.

The furnace lining position monitoring unit 171 monitors the position of the furnace lining 24 . Specifically, the furnace lining position monitoring unit 171 determines whether or not the position of the furnace lining 24 is in a normal position by analyzing the image captured by the imaging unit 11 . For example, the furnace lining position monitoring unit 171 identifies the contour portion of the furnace lining 24 in the analysis target image and the reference image, calculates a correlation value between the identified contour portions of the furnace lining 24, and determines whether the correlation value is not within the predetermined range. Further, the furnace lining position monitoring section 171 calculates the distance between two positions that are a part of the contour portion and are opposed to each other, and determines whether the distance is within a predetermined range. Then, if the correlation value or distance is within a predetermined range, the furnace lining position monitoring unit 171 determines that the position of the furnace lining 24 is in a normal position, and on the other hand, if it is outside the range, it determines that it is in an abnormal position .

As an example when it is judged to be in an abnormal position, as shown in Fig. 6, furnace linings such as "inward tilting up", "frontward tilting up", "left tilting up" and "right tilting up" can be listed. 24 status.

"Inclining on the back side" refers to a state in which the upper side (closer to y=0 side) of the furnace lining 24 is inclined in the direction of the upper surface of the turret 25 . "Inclining on the front side" refers to a state in which the lower side of the furnace lining 24 (deviation from y=0 to the +y direction side) is inclined toward the upper surface of the turret 25 . "Left-side upward inclination" refers to a state in which the left side (closer to x=0 side) of the furnace lining 24 is inclined in the direction of the upper surface of the turret 25 . The "right-side upward inclination" refers to a state in which the right side of the furnace lining 24 (deviation from x=0 to the +x direction side) is inclined toward the upper surface of the turret 25 .

The melt surface position monitoring unit 172 monitors the melt surface position of the vapor deposition material MA supplied to the furnace lining 24 . Specifically, the melt surface position monitoring unit 172 detects the melt surface position by analyzing the image captured by the imaging unit 11 , and determines whether the melt surface position is in a normal position. For example, as shown in FIG. 7 , the melt surface position monitoring unit 172 detects a part ED _b of the contour part and a part ED _f of the boundary part which are opposed to each other. Then, the melt surface position monitoring unit 172 calculates the distance D _{s between the part ED b of the contour part and the part ED f of the boundary part, and if the distance D s is within a} predetermined range, it is determined as a melt surface The position is in the normal position, on the other hand, if it is outside the range, it is determined to be in the abnormal position.

In addition, when the melt surface position monitoring unit 172 determines that it is an abnormal position and determines that the vapor deposition material MA in the furnace lining 24 is small, the melt surface position monitoring unit 172 calculates the amount of the vapor deposition material MA toward the furnace lining 24 . The supply amount is sent to the material supply device 3 with data indicating the supply amount. When the material supply device 3 receives the material, it supplies the vapor deposition material MA to the furnace lining 24 in the supply amount indicated by the material.

The irradiation position monitoring unit 173 monitors the irradiation position of the electron beam EB emitted from the electron beam source 21 in the furnace lining 24 . Specifically, the irradiation position monitoring unit 173 detects the irradiation position by analyzing the image captured by the imaging unit 11 , and determines whether the irradiation position is in a normal position. For example, as shown in FIG. 8 , the irradiation position monitoring unit 173 determines, as the irradiation position IA (irradiation area), a range having a pixel value equal to or greater than a predetermined pixel value and an area equal to or greater than a predetermined area in the captured image, And determine the center of gravity position CP of the irradiation position. The irradiation position monitoring unit 173 determines that the irradiation position IA is in the normal position as long as the center of gravity position CP is within the predetermined range, and determines that the irradiation position IA is in the abnormal position if it is outside the range. In addition, it is also possible to determine whether or not the irradiation position is in the normal position by comparing with a reference image in which the electron beam EB appears in the normal position.

In addition, when it is outside the range, the irradiation position monitoring unit 173 calculates a movement amount (correction amount) for moving the irradiation position to the normal position. Then, the irradiation position monitoring unit 173 causes the vapor deposition apparatus 2 to change the irradiation position of the electron beam EB according to the correction amount. In the vapor deposition apparatus 2, the irradiation position is corrected by controlling the beam deflection magnet 22 and the pole piece 23 so that the irradiation position becomes the normal position.

In addition, when the state determination part 17 determines that it is an abnormal position in each monitoring, it determines that an abnormality has occurred in the vapor deposition apparatus 2, and the control notification part 13 issues a warning. In addition, the state determination part 17 stops the vapor deposition process of the vapor deposition apparatus 2 in the case of the said determination. Specifically, the state determination unit 17 stops the power supply of the power supply (not shown) included in the vapor deposition apparatus 2 to each part of the vapor deposition apparatus 2 .

In addition, in the case of the above-mentioned determination, the state determination unit 17 does not necessarily need to execute both of the above-mentioned warning notification and power supply stop of the vapor deposition apparatus 2 . For example, when the amount of deviation from the normal position is within a certain range, the state determination unit 17 may determine that the vapor deposition process may be hindered and the vapor deposition process should not continue to be executed (maintenance required). status, so-called "minor failure"), only warning notifications are made. On the other hand, when the offset exceeds a certain range, the state determination unit 17 determines that the vapor deposition process is not only hindered but also the safety cannot be guaranteed (so-called "major failure"), At least stop the evaporation process.

(Example of Captured Image) FIGS. 9 to 11 show an example of a plurality of images captured in each of the above-mentioned monitoring (A) to (C). FIG. 9 is an example of an image captured during position monitoring of the furnace lining 24 , FIG. 10 is an example of an image captured during melt surface position monitoring, and FIG. 11 is an example of an image captured during irradiation position monitoring. In FIGS. 9 to 11 , the images surrounded by diagonal lines are images selected as the analysis target images by the image selection unit 16 .

In addition, in the example of FIG. 9 and FIG. 10, the case of shooting at the shutter speed "1/60" and "1/120" is illustrated. In addition, in the example of FIG. 11, the case of shooting at the shutter speeds of "1/60", "1/120", and "1/240" is listed. However, in each monitoring, it is sufficient to set any one of the above-mentioned shutter speeds (for example, "1/60"). In other words, in this example, it is only necessary to obtain eight images with different shooting sensitivities and shooting timings as a plurality of images.

However, in order to increase the possibility of selecting an image more relevant to the reference image, in each monitoring, in order to increase the number of a plurality of images to be compared with the reference image, it is also possible to obtain a plurality of shutter speeds corresponding to the reference image. corresponding images respectively. In other words, all of the images shown in FIGS. 9 to 11 may be used as comparison objects to be compared with the reference image.

In the examples of FIGS. 9 and 10 , regardless of whether the shutter speed is “1/60” or the shutter speed is “1/120”, the image selection unit 16 selects the most relevant image No. 1 as Analyze object images. In the example of FIG. 11 , when the shutter speed is “1/60”, the image selection unit 16 selects the image No. 2 with the highest correlation value as the analysis target image, and when the shutter speed is “1/120” and “ 1/240", the most relevant image No. 1 is selected as the analysis target image.

In addition, if two or more images can be selected as the most relevant images among the eight images at each shutter speed, the image selection unit 16 may select one image as the analysis target image by a predetermined method. picture. As the method, for example, the image with the smallest image number (No.) among the most relevant images (the image captured first) can be cited as the image to be analyzed.

(Processing Flow of Monitoring System) Next, an example of the processing flow of the monitoring system will be described with reference to FIG. 12 . FIG. 12 is a flowchart showing an example of the processing flow of the monitoring system.

First, before vapor deposition of the vapor deposition material MA on the substrate 100 , the vapor deposition apparatus 2 emits an electron beam EB from the electron beam source 21 and irradiates the vapor deposition material MA in the furnace lining 24 , thereby depositing the vapor deposition material MA. of melting (processing step (hereafter referred to as S) 1). Next, the vapor deposition apparatus 2 evaporates the vapor deposition material MA in the furnace lining 24 by increasing the light intensity and irradiates the vapor deposition material MA with the electron beam EB to form a film (main vapor deposition) on the substrate 100 ( S2 ).

Next, when the film forming process of the vapor deposition device 2 is completed, the monitoring device 1 confirms that the film forming speed is 0, and then performs the melt surface management of the vapor deposition material MA in the furnace lining 24 (S3; corresponding to the above (B) Surveillance). Specifically, the melt surface position monitoring unit 172 makes the imaging setting a setting for monitoring the melt surface position (melt surface position imaging setting). The imaging unit 11 is controlled by the imaging control unit 15 and captures a plurality of images under the above-described imaging settings. The image selection unit 16 selects an analysis target image suitable for monitoring the position of the melt surface from the plurality of images using the reference image for monitoring the position of the melt surface. Then, the melt surface position monitoring unit 172 determines whether or not the melt surface position is in a normal position by analyzing the image to be analyzed. The melt surface position monitoring unit 172 executes a warning notification by the notification unit 13 and/or a stop of the vapor deposition apparatus 2 when it is determined that the melt surface position is at an abnormal position. In addition, when the melt surface position monitoring unit 172 determines that it is an abnormal position and determines that the vapor deposition material MA in the furnace lining 24 is small, the melt surface position monitoring unit 172 calculates the amount of the vapor deposition material MA toward the furnace lining 24 . The supply amount is sent, and data indicating the supply amount is sent to the material supply device 3 .

Further, when the film formation process of the vapor deposition apparatus 2 is completed, the monitoring apparatus 1 confirms that the film formation speed is zero, and then performs position management of the furnace lining 24 ( S4 ; monitoring corresponding to the above (A)). The furnace lining position monitoring unit 171 starts the processing of the position management after a predetermined period (eg, after several seconds. However, after the start of the melt surface management) has elapsed after confirming that the deposition rate is zero. In addition, the furnace lining position monitoring unit 171 may start the processing of the position management by receiving a notification from the melt surface position monitoring unit 172 that the imaging unit 11 has captured a plurality of images in the process of S3.

The furnace lining position monitoring unit 171 first instructs the vapor deposition device 2 to emit only photons from the filament of the electron beam source 21 . When the vapor deposition apparatus 2 receives the instruction, the electron beam source 21 functions as an illumination light source. Further, the furnace lining position monitoring unit 171 switches the imaging setting from the melt surface position imaging setting to the imaging setting for monitoring the position of the furnace lining 24 (furnace lining position imaging setting) before capturing a plurality of images. The imaging unit 11 is controlled by the imaging control unit 15 and captures a plurality of images under the above-described imaging settings. The image selection unit 16 selects an analysis target image suitable for monitoring the position of the furnace lining 24 from the plurality of images using the reference image for monitoring the position of the furnace lining 24 . Then, the furnace lining position monitoring unit 171 determines whether or not the position of the furnace lining 24 is in the normal position by analyzing the image to be analyzed. When it is determined that the position of the furnace lining 24 is at an abnormal position, the furnace lining position monitoring unit 171 performs a warning notification from the notification unit 13 and/or stops the vapor deposition apparatus 2 .

Further, in the monitoring device 1, the furnace lining position monitoring unit 171 notifies the melt surface position monitoring unit 172 of the contents after capturing the plurality of images for monitoring the furnace lining position. The melt surface position monitoring unit 172 switches the imaging setting from the furnace lining position imaging setting to the melt surface position imaging setting. In addition, the above-mentioned processing timing should just be before the imaging|photography of the furnace lining 24 (before the processing of S6 mentioned later).

In addition, in the process of S3, when the melt surface position monitoring unit 172 transmits the data indicating the supply amount to the material supply device 3, the material supply device 3 supplies the furnace lining 24 to which the supply amount is calculated. Vapor deposition material MA (S5).

Next, when the supply process of the vapor deposition material MA by the material supply device 3 is completed, the vapor deposition apparatus 2 melts the vapor deposition material MA in the furnace lining 24 in the same manner as in S1 . The monitoring apparatus 1 performs melt surface management of the vapor deposition material MA in the furnace lining 24 when the melting process of the vapor deposition apparatus 2 is completed ( S6 ; monitoring corresponding to the above (B)). The processing is the same as the processing of the melt surface position monitoring unit 172 in S3.

In addition, the process of S3 is for managing the melt surface state after film formation on the substrate 100 , and the process of S6 is for managing the melt surface state after supplying the vapor deposition material MA.

Moreover, in the monitoring apparatus 1, the melt surface position monitoring unit 172 notifies the irradiation position monitoring unit 173 of the content after capturing of the plurality of images for monitoring the melt surface position is completed. The irradiation position monitoring unit 173 switches the imaging setting from the melt surface position imaging setting to the imaging setting for monitoring the irradiation position (irradiation position imaging setting). In addition, the processing timing may be before the imaging of the furnace lining 24 (before the processing of S7).

Next, the monitoring device 1 performs irradiation position management of the electron beam EB irradiating the vapor deposition material MA in the furnace lining 24 ( S7 ; monitoring corresponding to the above (C)). Specifically, the imaging unit 11 is controlled by the imaging control unit 15 and captures a plurality of images under the illumination position imaging setting. The image selection unit 16 selects an analysis target image suitable for monitoring the irradiation position from the plurality of images using the reference image for monitoring the irradiation position. Then, the irradiation position monitoring unit 173 determines whether or not the irradiation position is in a normal position by analyzing the image to be analyzed. When it is determined that the irradiation position is at an abnormal position, the irradiation position monitoring unit 173 performs a warning notification from the notification unit 13 and/or stops the vapor deposition apparatus 2 .

In addition, at this time, the irradiation position monitoring unit 173 determines the correction amount corresponding to the irradiation position, and transmits the data of the correction amount to the vapor deposition apparatus 2 . The vapor deposition apparatus 2 corrects the irradiation position based on the data so that the irradiation position becomes a normal position.

Moreover, in the monitoring apparatus 1, the irradiation position monitoring part 173 notifies the melt surface position monitoring part 172 of the said content after completion|finish of imaging|photography of several images for monitoring an irradiation position. The melt surface position monitoring unit 172 switches the imaging setting from the irradiation position imaging setting to the melt surface position imaging setting. In addition, the processing timing may be before the next imaging of the furnace lining 24 (before the processing of S3 ).

In addition, the processing order of the furnace lining position monitoring part 171, the melt surface position monitoring part 172, and the irradiation position monitoring part 173 is not limited to the above-mentioned order.

(Processing Flow of Monitoring Device) Next, an example of the processing flow (monitoring method) of the monitoring device 1 will be described with reference to FIG. 13 . FIG. 13 is a flowchart showing an example of the processing flow of the monitoring device 1 .

First, in each of the above-mentioned monitoring (A) to (C) (each process of S3 , S4 , S6 , and S7 in FIG. 12 ), the photographing control unit 15 controls the photographing unit 11 , and the photographing setting set by the state determining unit 17 is used. , the furnace lining 24 is photographed multiple times (S11; photographing step). When acquiring a plurality of images, the imaging control unit 15 notifies the image selection unit 16 of the content.

The image selection unit 16 receives the notification, and selects one reference image (for selecting an analysis target) corresponding to each of the monitoring of (A) to (C) from the plurality of reference images (reference image group). image reference image) (S12). When there is one reference image associated with each monitor, the reference image is selected as a reference image for selecting an image to be analyzed. Then, in each monitoring, the image selection unit 16 compares the plurality of images captured with the selected reference image, and calculates a correlation value for each image ( S13 ). In each monitoring, the image selection unit 16 selects an image having the largest correlation value (maximum correlation value) among the calculated correlation values as an analysis target image ( S14 ; image selection step). The image selection unit 16 notifies the state determination unit 17 of the selection of the analysis target image.

The state determination unit 17 determines whether or not the state of the vapor deposition apparatus 2 is the state of the vapor deposition apparatus 2 by executing processing corresponding to each monitoring (processing performed by the furnace lining position monitoring unit 171 , the melt surface position monitoring unit 172 , or the irradiation position monitoring unit 173 ). Normal state (S15; state determination step). When the state determination unit 17 determines that the state of the vapor deposition apparatus 2 is normal in all the monitoring of (A) to (C) (YES in S15 ), the process flow ends. On the other hand, when the state determination unit 17 determines that the state of the vapor deposition apparatus 2 is abnormal during any one of the above-mentioned monitoring (A) to (C) (NO in S15 ), the notification unit 13 notifies a warning ( S16). In addition, the state determination part 17 stops the vapor deposition apparatus 2 at the time of a serious failure (S17).

(Main Effect) In the monitoring device 1 , the imaging unit 11 images the furnace lining 24 a plurality of times. Further, the imaging unit 11 performs imaging by changing at least any one of imaging sensitivity, shutter speed, and imaging timing. Therefore, a plurality of images with different luminances can be acquired.

Then, the image selection unit 16 selects an image most relevant to the reference image in which the furnace lining 24 appears from among the plurality of images captured by the imaging unit 11 as an analysis target image. Therefore, it is possible to select an image with a brightness that is easy to perform image analysis. The state determination unit 17 analyzes the image to be analyzed thus selected, and determines the state of the vapor deposition apparatus 2 .

When the image is captured only once and is set as an analysis target image, when an image that is too bright or too dark is captured, there is a possibility that the analysis target such as the contour portion cannot be identified even if the image is analyzed. In this case, you need to adjust the shooting settings and shoot again. In addition, as described above, depending on the state of the furnace lining 24, the position of the melt surface, etc., the degree of red heat or the red heating time of the furnace lining 24 and the vapor deposition material MA are different, so there is an image that is too bright to be analyzed. image possibilities. In this case, there is a possibility that the analysis target cannot be identified.

On the other hand, according to the monitoring apparatus 1, taking into consideration the red heat state, it is possible to select a photographed image that is most easily analyzed as an analysis target image. Therefore, compared with the above-mentioned case, the possibility that the state of the vapor deposition apparatus 2 can be determined with high accuracy is increased without depending on the surrounding environment of the furnace lining 24 . Furthermore, according to the monitoring apparatus 1, the possibility of re-imaging can be reduced. Therefore, it is possible to save troublesome work or time for re-shooting.

(Embodiment 2) The description of Embodiment 2 of the present invention is as follows. In addition, for convenience of description, the same reference numerals are attached to the components having the same functions as the components described in the above-described embodiments, and the description thereof will be omitted.

In Embodiment 1, the case where one reference image for selecting the image to be analyzed is selected from among the plurality of reference images has been described, but a plurality of reference images may be selected.

For example, in each of the above-mentioned monitoring (A) to (C), the number of reference images to be selected for selecting the analysis target image may be set to two or more in advance, and the image selection unit 16 may select the above-mentioned number of benchmark images. In this case, for example, the image selection unit 16 analyzes the acquired image as described in Embodiment 1, and determines the luminance value from the luminance value of a region included in the image (for example, a region assumed to be the outline portion). The reference images that are close to (the luminance value of the region in the reference image corresponding to the region) are selected in order according to the set number. When selecting by the current value, the image selection unit 16 selects, for example, a reference image corresponding to the acquired current value, and selects a reference image corresponding to a value near the current value within a range not exceeding the set number. Baseline image.

Furthermore, when a plurality of reference images are provided for each monitoring, a correlation value between each of the plurality of images captured and each of the plurality of reference images may be calculated in each monitoring. In other words, at this time, the correlation values between all the images captured by the imaging unit 11 and all the reference images recorded in the reference image database 141 are calculated.

In addition, the image selection unit 16 may compare each of the images captured by the imaging unit 11 with only a part of the plurality of reference images. For example, the image selection unit 16 may select an image captured by the imaging unit 11 from a plurality of reference images recorded in the reference image database 141 in accordance with each of the above-mentioned monitoring (A) to (C). Baseline image for comparison.

For example, the image selection unit 16 may select at least one reference image group among the reference image groups (a) to (d) as the corresponding monitoring of each of the above (A) to (C). A plurality of reference images for comparing images captured in each monitoring. As described in Embodiment 1, when the reference image groups (a) to (d) are associated with each of the above-mentioned monitoring (A) to (C), the image selection unit 16 performs each monitoring. Select the corresponding reference image group.

The image selection unit 16 compares each of the plurality of reference images selected as the reference image for selecting the analysis target image as described above with each of the plurality of images captured by the imaging unit 11 to calculate out the correlation values with each other. Then, the image selection unit 16 selects an image having the highest correlation value among the calculated correlation values as an analysis target image. In other words, the image selection unit 16 selects an image most relevant to at least a part of the plurality of reference images from among the plurality of images captured by the imaging unit 11 as the analysis target image.

In this way, even when there are a plurality of reference images for selecting an image to be analyzed, as in Embodiment 1, it is possible to most easily obtain the part necessary for image analysis for each monitoring from the plurality of images. The image selected as the analysis object image. Therefore, in each monitoring, the state of the vapor deposition apparatus 2 can be determined with high accuracy. In addition, since there are a plurality of reference images for selecting the image to be analyzed, the correlation between the images captured by the imaging unit 11 and the reference images can be confirmed more widely.

(Embodiment 3) The description of Embodiment 3 of the present invention is as follows. In addition, for convenience of description, the same reference numerals are attached to the components having the same functions as the components described in the above-described embodiments, and the description thereof will be omitted.

In Embodiment 1 and Embodiment 2, a plurality of reference images are registered in the reference image database 141 . However, it is not limited to this, and only one reference image common to the monitoring of (A) to (C) may be registered in the reference image database 141 .

As an analysis target image, it is desirable to select an image in which the contour portion can be extracted with high accuracy during the monitoring of (A); the contour portion and the boundary portion can be extracted with high accuracy during the monitoring of (B); and During the monitoring of (C), the irradiation position can be extracted with high accuracy. Therefore, as a reference image, an image in which the outline portion, the boundary portion, and the irradiation position are clearly visualized is preferable. At this time, as the reference image, for example, the new furnace lining 24 may be displayed, and the image of the electron beam EB irradiated to the vicinity of the center of gravity of the melt surface position at the normal position may be displayed.

In addition, when the image selection unit 16 selects the image to be analyzed by, for example, using the correlation between the contour portion of the furnace lining 24 in each captured image and the contour portion of the furnace lining 24 in the reference image, it is preferable to select the image to be analyzed in the reference image. The outline is clearly seen in the image. At this time, the reference image may be any image showing the new furnace lining 24 .

In this way, even if there is only one registered reference image, from among a plurality of images, the image that is most easily acquired for the part necessary for the image analysis of each monitor can be selected as the analysis target image. Therefore, in each monitoring, the state of the vapor deposition apparatus 2 can be determined with high accuracy.

(Example of Implementation of Software) The control module of the monitoring device 1 (in particular, each functional module of the control unit 10 ) may be implemented by a logic circuit (hardware) formed of an integrated circuit (IC chip) or the like, or a CPU may be used. (Central Processing Unit: Central Processing Unit) is implemented by software.

In the latter case, the monitoring device 1 includes a CPU for executing commands of programs, which are software for realizing each function, and a ROM (only the program) that records the programs and various data readable by a computer (or CPU). A read memory (Read Only Memory) or a recording device (referred to as a "recording medium"), a RAM (Random Access Memory) for developing the program, and the like. Furthermore, the computer (or CPU) realizes the object of the present invention by reading the program from the recording medium and executing it. As the recording medium, a "non-volatile tangible medium" such as a tape, a disk, a card, a semiconductor memory, a programmable logic circuit, or the like can be used. In addition, the program may be provided to the computer via any transmission medium (communication network, broadcast wave, etc.) capable of transmitting the program. In addition, one aspect of the present invention may be realized by a method in which the program is embodied by electronic transmission and embedded in a data signal of a transmission wave.

(Summary) (1) In order to solve the above-mentioned problems, a monitoring device according to an aspect of the present invention monitors a vapor deposition device that forms a film on a substrate by vapor-depositing a vapor deposition material on a substrate, the The monitoring device includes an imaging unit that takes a container for holding the vapor deposition material included in the vapor deposition apparatus as an imaging object and performs multiple images, and an image selection unit that selects a plurality of images captured by the imaging unit among the images, an image most related to a reference image, which is an image showing the container, is selected as an analysis target image; and a state determination unit that selects by analyzing the image selection unit to determine the state of the vapor deposition apparatus.

According to the above-described structure, the image most relevant to the reference image is selected as the analysis target image from the images of the container captured multiple times. Then, the state of the vapor deposition apparatus is determined using the analysis target image. Therefore, the state of the vapor deposition apparatus can be determined with high accuracy.

(2) Further, in the monitoring device according to one aspect of the present invention, in addition to the configuration of (1), the imaging unit may change at least one of imaging sensitivity and shutter speed every time the image is captured .

In general, depending on the brightness of the container itself or its surroundings, the contrast of the container appearing in the captured image may be low, making it difficult to compare with the reference image. According to the above-described structure, since the photographing sensitivity and/or shutter speed are changed every photographing, containers with different brightness can be photographed. Therefore, the image of the container suitable for comparison with the reference image can be selected as the analysis target image.

(3) Further, in addition to the configuration of (2), the monitoring device according to one aspect of the present invention may be configured to not capture the images during the period from the start to the end of capturing the plurality of images. Like the scheduled period.

According to the above-described configuration, by setting a predetermined period during which no image is captured, the possibility of obtaining a container image having a brightness suitable for comparison with the reference image increases.

(4) Further, in the monitoring device according to one aspect of the present invention, in addition to the configuration of (2) or (3), the state determination unit may display (A) described in the analysis target image. Any one of the position of the container, (B) the position of the melt surface of the vapor deposition material supplied to the container, and (C) the irradiation position of the electron beam emitted from the beam emission source in the container is used as the object of analysis The analysis is performed to determine the state of the vapor deposition device, and the imaging unit performs imaging at the imaging sensitivity and shutter speed set in accordance with the analysis target.

According to the above-mentioned configuration, the container can be photographed with the photographing sensitivity and/or shutter speed corresponding to the analysis target of the above (A) to (C). In other words, the possibility of obtaining a container image suitable for comparison with the reference image corresponding to each analysis object increases.

(5) Furthermore, in addition to the configuration of any one of (1) to (4), the monitoring device according to one aspect of the present invention may be provided with a plurality of the reference images in which the state of the container is different, The image selection unit selects the analysis target image from the plurality of images using a reference image selected from the plurality of reference images.

According to the above-described structure, the plurality of images captured can be compared with at least one reference image among the plurality of reference images in which the state of the container is different. Therefore, the analysis target image can be selected with reference to the state of the container.

(6) Further, in the monitoring device according to one aspect of the present invention, in addition to the configuration of (5), the plurality of reference images may be at least one reference image group among the following reference image groups: ( a) a reference image group including a plurality of reference images in which the use states of the container are different from each other; (b) a plurality of reference images including a plurality of reference images in which the positions of the melt surfaces of the vapor deposition materials supplied to the container are different from each other (c) a reference image group comprising a plurality of reference images whose inclinations of the container are different from each other with respect to a predetermined reference plane, wherein the inclinations are within a predetermined range; and ( d) A reference image group including a plurality of reference images in which the irradiation positions of the electron beams emitted from the beam emission source in the container are different from each other.

According to the above configuration, the captured image can be compared with at least one of the reference image groups in (a) to (d). The analysis target image can be selected with reference to the use state of the container, the melt surface position of the vapor deposition material, the inclination of the container, or the irradiation position of the electron beam.

(7) Further, in the monitoring device according to one aspect of the present invention, in addition to the configuration of (6), the state determination unit may determine (A) the position of the container, (B) The position of the melt surface of the vapor deposition material supplied to the container, and (C) any position of the irradiation position of the electron beam emitted from the beam emission source in the container is analyzed as an analysis object to analyze. The state of the vapor deposition apparatus is determined, and the image selection unit selects at least one reference image group out of the reference image groups in (a) to (d) corresponding to the analysis target, and selects the selected The reference image used when analyzing the image of the object.

According to the above configuration, a reference image included in at least one of the reference image groups (a) to (d) can be selected corresponding to the analysis objects of (A) to (C), and combined with The captured images are compared. Therefore, for each analysis object, the state of the vapor deposition apparatus can be determined with high accuracy.

(8) Further, a monitoring method according to one aspect of the present invention monitors a vapor deposition device that forms a film on a substrate by vapor deposition of a vapor deposition material on the substrate, the monitoring method comprising: photographing The step is to take the container for holding the vapor deposition material provided by the vapor deposition device as the photographing object, and photographing is performed for multiple times; the image selection step is to select from the plurality of images photographed in the photographing step. selecting an image most relevant to a reference image as an analysis target image, the reference image being an image showing the container; and a state determination step of analyzing the analysis target image selected by the image selection step , to determine the state of the vapor deposition device.

According to the above-mentioned method, the same effects as those of the above-mentioned configuration (1) can be exhibited.

In addition, the monitoring device of each aspect of the present invention may be realized by a computer, and the monitoring control program of the monitoring device operates the computer as each part (software element) included in the monitoring device, thereby causing the monitoring device to be implemented by the computer. In this case, the monitoring and control program and the computer-readable recording medium in which the monitoring and control program is recorded are also included in the scope of the present invention.

(Remarks) The present invention is not limited to the above-described embodiments, and various modifications can be made within the scope of the claims, and embodiments obtained by appropriately combining technical contents disclosed in different embodiments are also included in the scope of the present invention. within the technical scope.

1‧‧‧Monitoring device 2‧‧‧Vapor deposition device 3‧‧‧Material supply device 10‧‧‧Control unit 11‧‧‧Photography unit 12‧‧‧Camera shutter 13‧‧‧Notifying unit 14‧‧‧Recording unit 15‧‧‧Image capture control part 16‧‧‧Image selection part 17‧‧‧State determination part 21‧‧‧Electron beam source (beam emission source) 22‧‧‧Magnet for beam deflection 23‧‧‧pole piece 24‧ ‧‧Furnace lining (vessel) 24A‧‧‧Furnace lining 24B‧‧‧Other furnace linings 25‧‧‧Turret 26‧‧‧Rotating part of turret 27‧‧‧Rotating part of base plate 30‧‧‧Insulation Parts (reflectors) 100‧‧‧Substrate 141‧‧‧Reference image database 171‧‧‧ Furnace lining position monitoring part 172‧‧‧Melt surface position monitoring part 173‧‧‧Irradiation position monitoring part AX‧‧ ‧Rotation axis CL‧‧‧Center line CP‧‧‧Center of gravity position D _s ‧‧‧Distance EB‧‧‧Electron beam ED _b ‧‧‧Part of contour ED _f ‧‧‧Part of boundary HL‧‧‧Contour Part IA‧‧‧Irradiation position MA‧‧‧Evaporation material S1~S7, S11~S17‧‧‧Processing step α‧‧‧angle

FIG. 1 is a block diagram showing an example of a specific configuration of a monitoring device according to Embodiment 1 of the present invention. FIG. 2 is a diagram showing an example of a monitoring system according to Embodiment 1 of the present invention. 3 is a diagram showing an example of a configuration of a turret included in the vapor deposition apparatus according to Embodiment 1 of the present invention. FIG. 4 is a schematic cross-sectional view of a furnace lining and its periphery included in the vapor deposition apparatus. 5 : is a figure which shows an example of the reference image group registered in the reference image database with which the said monitoring apparatus is equipped, (a) shows the reference image including a plurality of reference images in which the use state of the furnace lining is different An example of a group, (b) shows an example of a reference image group including a plurality of reference images with different melt surface positions, (c) shows a plurality of reference images including a predetermined range of different inclinations of the furnace lining (d) shows an example of a reference image group including a plurality of reference images having different electron beam irradiation positions. FIG. 6 is a diagram for explaining the determination process of the position of the furnace lining. FIG. 7 is a diagram for explaining the determination process of the melt surface position. FIG. 8 is a diagram for explaining the determination processing of the irradiation position. FIG. 9 shows an example of a plurality of images captured in the position monitoring of the furnace lining. FIG. 10 shows an example of a plurality of images captured in the melt surface position monitoring. FIG. 11 shows an example of a plurality of images captured in irradiation position monitoring. FIG. 12 is a flowchart showing an example of the processing flow of the monitoring system. FIG. 13 is a flowchart showing an example of a processing flow of the monitoring device.

1‧‧‧Monitoring device

2‧‧‧Evaporation device

3‧‧‧Material supply device

10‧‧‧Control Department

11‧‧‧Photography Department

13‧‧‧Notification Department

14‧‧‧Records Department

15‧‧‧Camera Control Department

16‧‧‧Image Selection Section

17‧‧‧Status Judgment Section

141‧‧‧Benchmark Image Database

171‧‧‧ Furnace lining position monitoring department

172‧‧‧Melt surface position monitoring section

173‧‧‧Irradiation position monitoring department

Claims (8)

A monitoring device for monitoring a vapor deposition device that forms a film on a substrate by vapor deposition of a vapor deposition material on a substrate, the monitoring device is characterized by comprising: an imaging unit that images the substrate. A container for holding the vapor deposition material included in the vapor deposition device is used as a photographing object, and photographing is performed a plurality of times; an image selection unit selects a reference image from among the plurality of images photographed by the photographing unit The most relevant image is an image to be analyzed, the reference image is an image showing the container; and a state determination unit determines by analyzing the image to be analyzed selected by the image selection unit The state of the vapor deposition apparatus, and a reference image group including a plurality of the reference images having different states of the container is provided, and the image selection unit is based on the image captured by the imaging unit (1) The brightness or clarity of the container and/or the vapor deposition material contained therein, or (2) the current value at the time of electron beam irradiation in the vapor deposition apparatus, a reference image is selected from the reference image group, Using the selected reference image, the analysis target image is selected from the plurality of images. The monitoring device according to claim 1, wherein the imaging unit changes at least one of imaging sensitivity and shutter speed every time the image is captured. The monitoring device according to claim 2, wherein a predetermined period during which the images are not captured is provided in the period from the start to the end of the capture of the plurality of images. The monitoring device according to claim 2 or claim 3, wherein the state determination unit supplies (A) the position of the container and (B) the container appearing in the analysis target image to the container The position of the melt surface of the vapor deposition material and (C) the irradiation position of the electron beam emitted from the beam emission source in the container is analyzed as an analysis object to determine the state of the vapor deposition apparatus. , and the photographing unit performs photographing at the photographing sensitivity and the shutter speed set corresponding to the analysis target. The monitoring device according to claim 1, wherein the reference image group is at least one reference image group among reference image groups that (a) include a plurality of containers whose usage states are different from each other. (b) a reference image group including a plurality of reference images whose melt surface positions of the vapor deposition material supplied to the container are different from each other; (c) a reference image group including the a reference image group of a plurality of reference images whose inclinations of the container are different from each other with respect to a predetermined reference plane, wherein the inclinations are within a predetermined range; A reference image group of a plurality of reference images whose irradiation positions in the container are different from each other. The monitoring device according to claim 5, wherein the state determination unit provides (A) the position of the container and (B) the vapor deposition material to be supplied to the container, which are displayed in the analysis target image. The position of the melt surface and (C) any position of the irradiation position of the electron beam emitted from the beam emission source in the container is analyzed as an analysis object to determine the state of the vapor deposition apparatus. The image selection unit corresponds to the analysis target, and selects a reference image used when selecting the analysis target image from at least one reference image group among the reference image groups (a) to (d). picture. A monitoring method for monitoring a vapor deposition device that forms a film on a substrate by vapor deposition of a vapor deposition material, the monitoring method is characterized by comprising: a photographing step, wherein the The container for holding the vapor deposition material provided in the vapor deposition device is used as a photographing object, and photographing is performed for a plurality of times; the image selection step is to select a reference image from among the plurality of images photographed in the photographing step. the most relevant image as an analysis target image, the reference image being an image showing the container; and a state determination step of determining the analysis target image selected by the image selection step The state of the vapor deposition apparatus, in the image selection step, based on (1) the brightness or clarity of the container and/or the vapor deposition material included in the image captured in the capturing step, or (2) ) Current value at the time of electron beam irradiation in the vapor deposition apparatus, from a plurality of the reference graphs including the state of the container A reference image is selected from a reference image group of images, and the analysis target image is selected from the plurality of images using the selected reference image. A computer-readable recording medium recording a computer program, characterized in that, when the computer program is executed by a processor, each step of the monitoring method described in item 7 of the scope of the patent application is implemented.

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