KR20180131439A - Monitoring device, monitoring method, and computer readable recording medium - Google Patents

Abstract

A monitoring device (1) comprises: a photographing unit (11) photographing a hearth liner (24) as a subject many times; an image selection unit (16) selecting an image having high relations with a reference image as an analysis target image from a plurality of images photographed by the photographing unit; and a state determination unit (17) determining a state of a deposition device (2) by analyzing the analysis target image selected by the image selection unit. As stated above, the state of the deposition device can be accurately determined.

Description

TECHNICAL FIELD [0001] The present invention relates to a monitoring apparatus, a monitoring method, and a computer readable recording medium.

The present invention relates to monitoring of a deposition apparatus.

A technique for monitoring a deposition apparatus for depositing a deposition material on a substrate by depositing an evaporation material on the substrate has been conventionally developed. An example thereof is disclosed in Patent Document 1.

Patent Document 1 discloses a technique of recognizing an irradiation position (irradiation position) of an electron beam (electron beam) with respect to an evaporation material by a CCD (Charge Coupled Device) camera and controlling the position of the electron beam based on the irradiation position .

: Japanese Unexamined Patent Publication No. 2005-126759 (published on May 19, 2005)

However, in Patent Document 1, there is no disclosure concerning acquiring a plurality of images every time the monitoring of the bath surface situation or the control of the position of the electron beam is made. Therefore, according to the technique of Patent Document 1, there is a possibility that an inappropriate image is acquired as an object to be analyzed, depending on the surrounding environment of the material container (for example, the brightness of the material container itself or the periphery thereof) . In this case, there is a possibility that the monitoring or control can not be performed with high precision.

One aspect of the present invention is to realize a monitoring apparatus and the like that can accurately determine the state of a deposition apparatus.

According to one aspect of the present invention, there is provided a monitoring apparatus for monitoring a deposition apparatus for forming a film on a substrate by depositing an evaporation material on the substrate, the monitoring apparatus comprising: An image capturing unit that captures a plurality of images using a container for supporting the evaporation material as an object; and an image processing unit that, from the plurality of images captured by the image capturing unit, an image having the highest correlation with the reference image, And a state determination section that determines the state of the deposition apparatus by analyzing the analysis object image selected by the image selection section.

According to another aspect of the present invention, there is provided a monitoring method for monitoring a deposition apparatus for forming a film on a substrate by depositing an evaporation material on the substrate, the monitoring method comprising: An imaging step of taking a plurality of images with the container for supporting the evaporation material as an object; and an imaging step of acquiring, from a plurality of images captured in the imaging step, an image having the highest correlation with a reference image, And a state determination step of determining the state of the deposition apparatus by analyzing the analysis object image selected in the image selection step.

According to another aspect of the present invention, there is provided a computer-readable recording medium having a computer program stored thereon, Each process of the method is realized.

According to the monitoring apparatus and the monitoring method according to one aspect of the present invention, it is possible to accurately determine whether the state of the vapor deposition apparatus is in a normal state or not.

1 is a block diagram showing an example of a specific configuration of a monitoring apparatus according to Embodiment 1 of the present invention.
2 is a diagram showing an example of a monitoring system according to Embodiment 1 of the present invention.
3 is a diagram showing an example of the configuration of a turret included in the evaporation apparatus according to Embodiment 1 of the present invention.
4 is a schematic cross-sectional view of the washer liner and the periphery thereof, which the deposition apparatus is provided with.
Fig. 5 is a diagram showing an example of a reference image group registered in a reference image DB included in the monitoring apparatus, in which (a) is a reference image group including a plurality of reference images whose use states of the harness liner are different from each other (B) shows an example of a reference image group including a plurality of reference images having different bath surface positions, and (c) includes a plurality of reference images having different slopes of the underline liner within a predetermined range (D) shows an example of a reference image group including a plurality of reference images in which the irradiation positions of the electron beams are different from each other.
Fig. 6 is a view for explaining a process of determining the position of the harness liner. Fig.
Fig. 7 is a view for explaining the bath surface position determination process.
Fig. 8 is a diagram for explaining the irradiation position determination process.
Fig. 9 shows an example of a plurality of images photographed in monitoring the position of the harness liner.
Fig. 10 shows an example of a plurality of images photographed in the bath surface position monitoring.
Fig. 11 shows an example of a plurality of images photographed in the irradiation position monitoring.
12 is a flowchart showing an example of the processing flow in the above-described monitoring system.
13 is a flowchart showing an example of a processing flow in the monitoring apparatus.

[Embodiment 1]

An embodiment of the present invention will be described in detail below with reference to Figs.

«Configuration of surveillance system»

First, an example of a monitoring system according to the present embodiment will be described with reference to Figs. 2 to 4. Fig. 2 is a diagram showing an example of a monitoring system according to the present embodiment. 3 is a view showing an example of the configuration of a turret 25 provided in a vapor deposition apparatus 2. As shown in Fig. 4 is a schematic cross-sectional view of a hearth liner 24 and its surroundings. 4 is a cross-sectional view of the washer liner 24 when it is in the normal position.

As a container (container) for supporting the evaporation material, which is provided in the evaporation apparatus, for example, a crucible can be mentioned. When the hash liner is provided on the inner wall of the crucible, the container may be, for example, a washer liner. In the present embodiment, the case where the container is an ash liner will be described as an example.

As shown in Fig. 2, the monitoring system according to the present embodiment includes a monitoring device (monitoring device) 1, a deposition device 2, and a material supply device 3. The deposition apparatus 2 is an apparatus for forming a film on a substrate 100 by depositing an evaporation material MA on the substrate 100. [ The monitoring apparatus 1 is a device for monitoring the vapor deposition apparatus 2. The material supply device 3 is a device for supplying the evaporation material MA to the harness liner 24 provided in the deposition apparatus 2. [ The evaporation material MA may be, for example, an aluminum wire material, but is not limited thereto. The evaporation device 2 may be various materials (for example, metal materials) for forming a film on the substrate 100 . Hereinafter, the configurations of the monitoring apparatus 1 and the deposition apparatus 2 will be described more specifically. First, the deposition apparatus 2 will be described.

<Deposition Apparatus (2)>

The evaporation apparatus 2 includes an electron beam source (EB (Electron Beam) source) 21, a beam deflecting magnet 22, a pole piece 23, A turret 25, a turret rotation unit 26, and a substrate rotation unit 27.

The electron beam source 21 is controlled by the control unit (not shown) included in the deposition apparatus 2 to irradiate the evaporation material MA supplied (supported) to the harness liner 24 with the electron beam EB, Is a beam emitting source that emits a beam. The electron beam source 21 also includes a photon and a filament capable of emitting thermoelectrons constituting the electron beam EB. The electron beam source 21 emits the emitted thermoelectrically electron beam EB in front of the electron beam source 21 by applying an accelerating voltage together with the current to the filament.

Further, the filament is supplied with a current, but by not applying the acceleration voltage, the filament emits only the photon. In this case, the electron beam source 21 functions as an illumination light source (incandescent lamp) for illuminating the periphery thereof. It is unnecessary to separately provide an illumination light source for photographing by making the electron beam source 21 function as an illumination light source at the timing of photographing by the photographing section 11 (described later). In addition, when an illumination light source is separately provided, it is often installed in the vicinity of the photographing section 11. [ In this case, halation occurs, and there is a possibility that the washer liner 24 and the turret 25 can not be clearly photographed. By using the electron beam source 21 as the illumination light source as described above, the occurrence of halation can be prevented, and it becomes possible to take a clear picture of the washer liner 24 and the turret 25. In addition, an illumination light source may be provided at a position where the halation does not occur separately from the electron beam source 21.

The beam deflecting magnet 22 and the pole piece 23 are a course changing portion for changing the course of the electron beam EB emitted from the electron beam source 21. [ Specifically, the beam deflecting magnet 22 and the pole piece 23 under the control of the control unit change the course of the electron beam EB by changing the magnetic force to be generated. The electron beam EB is irradiated onto the evaporation material MA in the washer liner 24 by drawing the locus of the substantially arc from the electron beam source 21. [ The irradiation position is controlled so that the electron beam EB is irradiated to the position at which the deposition rate (film formation rate) is maximized, that is, the center of the bath surface (surface) of the evaporation material MA in the washer liner 24 do.

The washer liner 24 is a crucible for supporting the evaporation material MA supplied by the material supply device 3. The position of the harness liner 24 is changed by the driving of the turret rotation section 26. The evaporation material MA is supplied to the harness liner 24 in the vicinity of the material supply device 3 (material supply position). The evaporation material MA in the washer liner 24 is melted by receiving the electron beam EB emitted from the electron beam source 21 at a position (deposition position) opposite to the substrate 100 do. The evaporated deposition material MA is deposited on the substrate 100 so that the deposition of the deposition material MA on the substrate 100 is performed.

The turret 25 is a base on which a plurality of the washer liner 24 are provided. In the present embodiment, as shown in Fig. 3, six washer liners 24 are provided around the rotating shaft AX. The turret 25 is rotated about the rotation axis AX by the driving of the turret rotation part 26 so that the harness liner 24 can be moved between the material supply position and the deposition position. The evaporation of the evaporation material MA from the washer liner 24A already supplied with the evaporation material MA is carried out to form the film on the substrate 100 and at the same time, And the evaporation material MA can be supplied to the other was liner 24B. The supply of the deposition material MA to the washer liner 24 and the deposition of the deposition material MA to the substrate 100 can be performed continuously.

4, the washer liner 24 is provided with a heat insulating material (reflector) 30 interposed therebetween with respect to the turret 25. As shown in Fig. The heat insulating material 30 enhances the warmth of the evaporation material MA supplied to the washer liner 24. [ It is possible to efficiently dissolve the evaporation material MA by the heat insulating material 30. Further, the insulating liner 30 can position the washer liner 24 with respect to the turret 25.

The turret rotation section 26 is connected to the substantially center of the turret 25 and rotates the turret 25 around the rotation axis AX. Further, the substrate rotating part 27 rotates the substrate 100 during film formation by attaching the substrate 100 to be film-formed to substantially its center. The driving of the turret rotation unit 26 and the substrate rotation unit 27 is controlled by the control unit.

<Monitoring device (1)>

Next, the monitoring apparatus 1 will be described with reference to Figs. 1, 2, and 4 to 11. Fig. 1 is a block diagram showing an example of a specific configuration of the monitoring apparatus 1 according to the present embodiment. Fig. 5 is a view showing an example of a reference image group (reference image group) registered in a reference image (reference image) DB 141. Fig. 5 (a) (B) shows an example of a reference image group including a plurality of reference images having different bath surface positions, (c) shows an example of a reference image group including a reference image, (D) shows an example of a reference image group including a plurality of reference images in which the irradiation positions of the electron beam EB are different from each other. Fig. 6 is a view for explaining a process of determining the position of the harness liner 24. Fig. Fig. 7 is a view for explaining the process of determining the bath surface position. Fig. 8 is a diagram for explaining the irradiation position determination process. 9 to 11 illustrate an example of a plurality of photographed images.

The monitoring apparatus 1 monitors whether or not the state of the deposition apparatus 2 is in a normal state by analyzing the image of the washer liner 24 photographed by the photographing section 11. [ 1, the monitoring apparatus 1 includes a control section 10, a photographing section 11 (also shown in Fig. 2), a notifying section 13, and a storing section 14. [ Further, as shown in Fig. 2, the monitoring apparatus 1 includes a camera shutter 12. Fig.

(Photographing section)

The photographing section 11 is provided with a hash liner 24 (specifically, a haas liner 24) for supporting the evaporation material MA irradiated with the electron beam EB under the control of the photographing control section 15 And the peripheral region thereof) as a photographed body.

By photographing a plurality of times, the selection width can be widened as compared with a case where an image (shot image) obtained by one shooting is used as an analysis target image. Therefore, it is possible to increase the possibility that the clear image of the washer liner 24 (and its surroundings) is to be analyzed as an image to be analyzed, so that the state of the deposition apparatus 2 can be judged with high precision.

The monitoring apparatus 1 is capable of controlling the positions of (A) the position of the washer liner 24, (B) the bath surface position of the evaporation material MA supplied to the washer liner 24, and (C) And the irradiation position of the electron beam EB emitted from the electron beam source 21 as an object to be monitored. In other words, in the monitoring apparatus 1, the state determining section 17, which will be described later, analyzes the above-described (A), (B) and (C) It is determined whether or not the state is normal. More specifically, the state determining section 17 determines whether or not each position is at a normal position (reference position) by analyzing angular positions reflected in the analysis object image.

Here, the interpretation object image is interpreted as an image taken by the photographing section 11 in order to judge whether or not each position is in a normal position in each of the above-mentioned (A) to (C) surveillance It is a picture. The above-mentioned normal position (reference position) means that the imaginary surface including the opening of the harness liner 24 in the above (A) is in a state in which it is not nearly inclined with respect to the surface of the turret 25 Quot;). &Lt; / RTI &gt; (B), the evaporation material (MA) is supplied to the washer liner 24 when the evaporation material MA is supplied to the evaporation source 2 in such a degree that there is no problem in the evaporation processing on the substrate 100 in the evaporation apparatus 2 MA). (Center) of the bath surface of the evaporation material MA in the washer liner 24 in the above (C).

In the present embodiment, the photographing section 11 continuously photographs a plurality of times in each of the above-mentioned (A) to (C) surveillance. In other words, a plurality of shots are performed in each of the three surveillance (A) to (C). Thus, in each of the above-mentioned surveillance (A) to (C), it is possible to acquire a plurality of images illuminated by the hash liner 24 having different brightness. However, if it is not considered to acquire a plurality of images in each surveillance, only a plurality of consecutive shots may be performed once in one deposition process.

In the present embodiment, the monitoring apparatus 1 may be a monitoring target (at least one of the above (A) to (C)) while the above (A) to .

Further, the photographing section 11 changes at least one of the photographing sensitivity and the shutter speed every time the washer liner 24 is photographed. The photographing sensitivity defines the amount (ability) to receive light per predetermined time at the time of photographing. The shutter speed defines the light-condensing time at the time of photographing. By changing either the photographing sensitivity or the shutter speed, it is possible to acquire an image having different brightness. Generally, the lower the photographing sensitivity and the faster the shutter speed, the darker the image.

For example, when only one image is photographed, there is a possibility that it becomes difficult to specify the hash liner 24 or the evaporation material MA in the image when the image is excessively bright (or excessively dark) have. It is possible to acquire an image in which the brightness is suppressed (or an image in which the brightness is emphasized) by acquiring a plurality of images having different brightnesses. In this case, by analyzing the image, there is a high possibility that the washer liner 24 or the evaporation material MA can be specified.

The photographing sensitivity and the shutter speed are respectively set in a plurality of stages. The photographing sensitivity and the shutter speed are set within a range in which it is estimated that the possibility of obtaining an image of the harness liner 24 having a comparatively easy contrast with the reference image is relatively high by experiments or the like. The photographing sensitivity and the shutter speed are set in consideration of mutual correlation. The reference image is an image that is photographed beforehand by the photographing section 11 and indicates the photographing result of the harness liner 24 registered in the reference image DB (Database) 141 (described later) of the storage section 14 .

In the present embodiment, the photographing sensitivity is "1", "1.5", "2", ... Quot ;, &quot; 7 &quot;, &quot; 7.5 &quot;, and &quot; 8 &quot;. &Quot; 1 &quot; corresponds to 100 of the ISO sensitivity. When the photographing sensitivity is increased by one, the amount of light received per predetermined time is doubled. That is, when the photographing sensitivity is increased by 0.5, the above-mentioned amount of received is 2 times. The shutter speed is set to three levels of "1/60", "1/120", and "1/240". The set value and the set number of these are merely examples.

The photographing sensitivity and the shutter speed may be set in accordance with the respective surveillance of (A) to (C). In this case, under the control of the photographing control unit 15, the photographing unit 11 photographs the washer liner 24 with the photographing sensitivity and shutter speed set in accordance with the respective surveillance in each of the above (A) to (C) .

Further, in the respective surveillance of the above (A) to (C), even if the predetermined period during which the image is not photographed is set in the period from when the photographing section 11 starts photographing of a plurality of images until the photographing section 11 finishes good. In the predetermined period, appropriate values are set in each of the above-mentioned surveillance (A) to (C) by experiments and the like. For example, a predetermined period starts when a predetermined number of shots are completed (e.g., when four shots have been completed), and a predetermined period is defined as a period of several seconds (e.g., 10 seconds) . The photographing control unit 15 controls the photographing unit 11 so that photographing is not performed for a predetermined period of time in accordance with the respective surveillance of (A) to (C).

(The evaporation material MA or the electron beam EB included in the washer liner 24) having different brightness is obtained by appropriately changing the photographing sensitivity, the shutter speed or the photographing timing, It is possible to acquire a plurality of images reflected by the deposited material MA (the irradiated evaporation material MA).

An example of a plurality of images photographed by changing the photographing setting by the photographing section 11 will be described later.

The photographing section 11 may be a CCD camera or the like. The photographing section 11 is disposed at a position having a predetermined angle alpha from a perpendicular line (center line CL) passing through the center of the opening surface of the washer liner 24 at the normal position have. By photographing from this position, the monitoring apparatus 1 can calculate the inclination amount of the harness liner 24 in various directions in the image of the harness liner 24 captured by the photographing section 11 do.

(Camera shutter)

The camera shutter 12 causes the front of the photographing section 11 to be opened at the timing at which the photographing section 11 photographs the harness liner 24 under the control of the photographing control section 15, Closed state. By this control, it is possible to prevent the evaporated deposition material MA scattered in the time zone other than the photographing from adhering to the lens (not shown) of the photographing section 11. [ A glass plate may be adhered to the front of the lens of the photographing section 11 for the purpose of prevention.

(Notification section)

The notifying unit 13 performs various notifications to the operator using the monitoring system. The notification unit 13 controls the position of the washer liner 24, the position of the bath surface of the evaporation material MA in the washer liner 24 or the position of the evaporation material When the irradiated position of the electron beam EB in the exposure position MA is deviated from its normal position. The notifying unit 13 outputs, for example, a speaker for outputting various notices and / or a display for outputting various notifications as an image.

(Storage unit)

The storage unit 14 stores various control programs and the like to be executed by the control unit 10, for example, and is constituted by a nonvolatile storage device such as a hard disk or a flash memory. The storage unit 14 is provided with a storage unit 14 for storing a monitoring program that indicates a process of (1) monitoring processing, (2) data representing an image captured by the photographing unit 11, and (3) (4) data indicating photographing settings, and (5) various threshold values (values that define a predetermined range) used in determination processing in the control unit 10 are stored. The photographing setting includes the photographing position of the photographing section 11, the photographing sensitivity, the shutter speed and the photographing timing in each of the above-mentioned (A) to (C) surveys. The storage unit 14 also has a reference image DB 141 that can register (store) the reference image.

(Example of reference image)

In the present embodiment, a plurality of reference images are registered. As the reference image, it is necessary to set an image suitable for selecting an analysis object image from at least a plurality of images. As the reference image, for example, an electron beam EB irradiated on the contour portion of the washer liner 24, the bath surface position of the evaporation material MA (the boundary portion between the inner wall of the underliner 24 and the bath surface) An image to be displayed is set. Or an image that can estimate the position of the contour portion, the boundary portion or the electron beam EB is set as a reference image by analyzing (processing) the reference image. In this case, the estimated contour portion, the boundary portion, or the position of the electron beam EB is stored in the storage unit 14 in association with the reference image.

In the present embodiment, one reference image is registered as a plurality of reference images, for example, for each of the above-mentioned surveillance (A) to (C) in the reference image DB 141. [ In the case of (A), the position of the harness liner 24 is monitored based on the contour portion of the harness liner 24 reflected on the photographed image as described later. For this reason, it is preferable that the contour portion be clearly shaded in the reference image, and for example, an image of the new washer liner 24 is set as the reference image. In the case of (B) or (C) above, the bath surface position or the irradiation position is monitored based on the boundary portion or the irradiation position reflected in the photographed image. For this reason, for example, an image in which the boundary portion or the irradiation position is clear is set as the reference image.

As described above, in the case where the reference image is set according to the monitoring of each of (A) to (C), it is possible to specify the outline portion, the boundary portion, The possibility of the occurrence of the problem becomes easy.

As a plurality of reference images, for example,

(a) a reference image group including a plurality of reference images whose use states of the harness liner 24 are different from each other,

(b) a reference image group including a plurality of reference images having different bath surface positions of the evaporation material MA supplied to the washer liner 24,

(c) a reference image group including a plurality of reference images different in inclination within a predetermined range as a gradient of the hash liner 24 with respect to a predetermined reference plane, and

(d) A reference image group including a plurality of reference images of different irradiation positions of the electron beam EB emitted from the electron beam source 21 in the underliner 24

Or may be registered in the reference image DB 141. An example of the reference image group of (a) to (d) is shown in Fig. Each reference image may be, for example, a state in which the harness liner 24 (and the evaporation material MA) is in a red heat state.

5 (a) shows the reference image group corresponding to (a). In this example, the use state of the washer liner 24 is a state in which the washer liner 24 is hardly used (new article), a state in which the evaporation material MA is attached to the inner wall of the washer liner 24 (New used) and the vapor deposition material MA leaking on the inner wall of the washer liner 24 to the outside of the washer liner 24 (a state in which "wetting rise" occurs) )) Are prepared.

In Fig. 5B, the reference image group corresponding to the above (b) is shown. In this example, three kinds of states, i.e., a state in which the bath surface position is in the vicinity of the opening of the harness liner 24 (a state in which the amount of the evaporation material MA is large (hot water amount)), .

5 (c) shows a reference image group corresponding to (c). In this example, three reference images are prepared when the position of the washer liner 24 is at the normal position. In the present embodiment, the predetermined reference surface is the surface of the turret 25, and the predetermined range is the virtual surface (the imaginary surface including the opening of the underliner 24) (Inclusive of the surface) is within a range (a range of about several degrees) that does not hinder the deposition process. 5 (c), in the case where the inclination of the washer liner 24 is 0 ° in this predetermined range, when the washer liner 24 is raised to the left side and when the washer liner 24 is raised to the right side, Type reference image is prepared. Upward to the left side and upward to the right side will be described later.

In (d) of FIG. 5, the reference image group corresponding to (d) is shown. In this example, three kinds of reference images are prepared: the irradiation position is shifted to the center of the bath surface, the left side, and the right side.

The reference image in each reference image group may be of two types or four or more types. For example, in (c) of FIG. 5, a reference image may be prepared in the case where the image has been moved forward and / or backward (described later). It is not always necessary to prepare all of the above (a) to (d), and it suffices that the necessary reference image group is prepared in accordance with the monitored object to be monitored by the monitoring apparatus 1. In other words, at least one reference image group of (a) to (d) may be prepared.

(Control section)

The control unit 10 controls the monitoring device 1 in a general manner. More specifically, the control unit 10 controls the shooting control unit 15, the image selection unit 16, and the control unit 14 in order to precisely determine the state of the deposition apparatus 2, And a state judgment section 17.

The photographing control unit 15 controls the photographing unit 11. As described above, the photographing control unit 15 photographs the photographing unit 11 multiple times in each of the above-mentioned surveillance (A) to (C). The photographing control unit 15 selects the photographing position, the photographing sensitivity and the shutter speed of the photographing unit 11 set for each of the above-mentioned surveillance (A) to (C) do. The imaging control unit 15 also operates a timer (not shown) after completion of the predetermined number of images in each of the above-mentioned surveillance of (A) to (C) And stops the photographing of the photographing section 11. [0052] When receiving a notification of the elapse of a predetermined period from the timer, the photographing is resumed.

For example, in the monitoring of the above (A), the image pickup control unit 15 confirms that the deposition rate is 0 after the deposition is completed (the deposition material MA is not scattered). The photographing control section 15 changes the photographing sensitivity in the order of "6", "5", "4" and "3" after the confirmation is completed (for example, about two to three minutes after the completion of the deposition) Take four consecutive shots. The photographing control unit 15 measures a predetermined period (for example, 10 seconds) set for the monitoring of the above (A), and stops the photographing therebetween. When the elapse of the predetermined period is confirmed, the photographing control section 15 changes the photographing sensitivity again in the order of "6", "5", "4" and "3" In this manner, a total of eight images are acquired. The shutter speed is set to "1/60" or "1/120".

In the monitoring of (B) above, the image pickup control unit 15 confirms that the deposition rate is 0 after the completion of the deposition. The photographing control section 15 changes the photographing sensitivity in the order of "6", "5", "4", and "3" after the confirmation is completed, Thereafter, the photographing control section 15 measures a predetermined period (for example, 10 seconds) set for the monitoring of the above (B), and stops the photographing therebetween. When the elapse of the predetermined period is confirmed, the photographing control section 15 changes the photographing sensitivity again in the order of "6", "5", "4" and "3" In this manner, a total of eight images are acquired. The shutter speed is set to "1/60" or "1/120".

In the monitoring of (C), the photographing sensitivity is changed in the order of "8", "7.5", "7", "6.5", "6", "5.5", "5" 8 times. That is, in the present embodiment, the predetermined period set for the monitoring of (C) is 0 second. In this manner, a total of eight images are acquired. The shutter speed is set to "1/60", "1/120", or "1/240".

In the present embodiment, the photographing for monitoring in (A) and (B) is performed in a state in which the washer liner 24 and the evaporation material MA are being heated by evaporation after deposition (main deposition) do. This state of glowing continues for about 5 minutes after deposition on the substrate 100 is completed and the irradiation of the electron beam EB is stopped. In the present embodiment, the above photographing is performed at about 2 to 3 minutes after the stop. In addition, the new washer liner 24 tends to have an image brighter as compared with the washer liner 24 where the wetting is rising. In other words, in the case where the rise of the wetting occurs, since the evaporation material MA covers the inner wall thereof, the image tends to become dark. Particularly, when the evaporation material MA is a metal such as aluminum or silver, it becomes significantly dark. Also, the brightness of the image differs depending on the bath surface position of the evaporation material MA. When the bath surface position is high, the washer liner 24 and the evaporation material MA become difficult to be drained (the glow state is easily maintained). On the other hand, when the bath surface position is low, the dish is easy to be drained.

As described above, in the surveillance of the above (A) and (B), the degree of redness varies depending on the state of the harness liner 24, the position of the bath surface, and the like after being photographed in the red state. Therefore, depending on the situation, there is a possibility that an overly bright image may be photographed in the image analysis for extracting the contour portion or the boundary portion. In this case, in the image photographed in this case, there is a possibility that the contour portion or the boundary portion becomes unclear (the contrast of the portion is lowered), and the contour portion or the boundary portion can not be obtained with high accuracy.

Therefore, in the photographing in (A) and (B), the photographing sensitivity is lower than that in the photographing for monitoring in (C), which is carried out after a while from the completion of the vapor deposition , Respectively. Therefore, it is possible to expect the acquisition of an image in which the brightness is suppressed. Also, as time elapses, the red state of the washer liner 24 or the like is settled. It is possible to expect the acquisition of an image in which the glow state is suppressed in the photographing after the predetermined period by setting the photographing waiting period for a predetermined period during photographing of a plurality of consecutive photographs. The predetermined period may be set a plurality of times during one continuous shooting.

On the other hand, it is expected that the photographing for monitoring in (C) above will not heat the washer liner 24 or the like in comparison with the photographing in (A) and (B) as described above. Therefore, in the photographing in (C), the photographing sensitivity is set higher than the photographing in (A) and (B) above.

In each surveillance, it is possible to increase the possibility that the contour portion, the boundary portion, or the irradiation position can be acquired with high precision by photographing a plurality of images.

The setting of the photographing sensitivity, the shutter speed, and the predetermined period is only an example. The photographing sensitivity, the shutter speed, and the predetermined period may be set as long as it is possible to select an analysis object image capable of analyzing the position, bath surface position, or irradiation position of the harness liner 24 in each monitoring from a plurality of photographed images , It may be set to any value. Also, in one deposition process, the number of images photographed in the surveillance of (A) to (C) is not limited to eight, and may be changed appropriately.

The image selecting unit 16 selects, from the plurality of images photographed by the photographing unit 11, an image having the highest correlation with the reference image as an analysis object image.

Specifically, the image selecting unit 16 calculates a correlation value indicating the degree of correlation of each of the images with respect to the reference image, based on the pixel values of the respective images captured by the photographing unit 11. In this calculation of the correlation value, for example, a statistical method called a normalized correlation that calculates the correlation value (similarity degree) between each image and the reference image using pattern matching is used.

In the normalized correlation, the correlation value is calculated by the following equation. I is a pixel value (luminance value) of each pixel in each image, M is a pixel value of each pixel in the reference image, n is the total number of pixels in each of the images and the reference image to be. The bar (-) represents the average value.

In the above equation, the closer the image is to the reference image, the closer the value is to 100 (%). The image selection unit 16 selects, as the analysis target image, an image closest to the correlation value among the plurality of captured images in each of the above-mentioned surveillance (A) to (C). The correlation value may be calculated as the contour portion or the boundary portion in each image and reference image. For example, when the image selecting section 16 selects an analysis object image by correlation between the contour portions in a plurality of images and a reference image, the possibility of erroneous detection of the contour portion in the picked- .

As described above, in the present embodiment, during the monitoring of (A) and (B), the washer liner 24 or the evaporation material MA in a red state is photographed. In order to suppress this influence, the monitoring device 1 photographs a plurality of the washer liners 24, at least the photographing portion 11 having changed the photographing sensitivity. Thus, it is possible to acquire a plurality of images of the hash liner 24 or the evaporation material MA having different brightness. The image selecting unit 16 selects the image of which the brightness acquired by the photographing unit 11 is different from the brightness of the reference image on which the heated hash liner 24 or the evaporation material MA is reflected Or an image that can be obtained by the boundary portion), an image having a high correlation with the reference image is selected. Thus, it is possible to select an image that is easy to interpret for the determination of the state of the deposition apparatus 2 as an analysis object image. The image of the contour of the contour portion or the boundary portion is not lowered or the image of the contrast portion of the contour portion or the boundary portion is suppressed in the captured plural images as an object to be analyzed, It is possible to make the determination of the position or the position of the bath surface accurately with high accuracy.

Further, at the time of surveillance in the above (C), photographing is performed while irradiating the electron beam EB. Therefore, the brightness of the surrounding environment of the washer liner 24 at the time of photographing is likely to fluctuate, so that there is a possibility that the irradiated position of the electron beam EB in the photographed image becomes unclear due to the fluctuation . Also in this case, the photographing section 11 photographs a plurality of the washer liners 24 at least changing the photographing sensitivity. The image selection unit 16 compares a plurality of images of the evaporation material MA having different brightnesses with a reference image of, for example, the evaporation material MA being heated, Highly selected image is selected. This makes it possible to select an image to be analyzed as an image to be analyzed similarly to the above, so that the irradiation position can be determined with high precision.

When the predetermined period is set, the image selection unit 16 may compare the reference image with the reference image before and after the predetermined period. For example, in the case of the monitoring of (A) and (B) above, the image selecting unit 16 compares the first four images with the reference image and sets an image having the highest correlation with the reference image among the four images as Select one. Thereafter, the image selecting unit 16 selects one image having the highest correlation with the reference image among the four images, in comparison with the reference image and the four images after a predetermined period. Then, the image selecting unit 16 selects, as an analysis target image, an image having a higher correlation with the reference image, from the image selected from the four images before the predetermined period and the image selected from the four images after the predetermined period.

Further, in the present embodiment, as described above, a plurality of reference images having different states of the harness liner 24 are set. Therefore, the image selecting unit 16 selects an image to be analyzed from a plurality of images photographed by the photographing unit 11, using the reference image selected from the plurality of reference images. Examples of the condition of the washer liner 24 include the use state of the washer liner 24, the position of the bath surface of the evaporation material MA in the washer liner 24, the inclination of the washer liner 24, (EB) in the evaporation material (MA) in the deposition material (MA).

The image selection unit 16 selects a reference image (reference image for selection of an image to be analyzed) for selecting an analysis object image, for example, by analyzing the acquired image. In this case, for example, the image selecting unit 16 calculates the luminance value of the contour portion, the inner wall, or the area assumed to be near the bath surface of the harness liner 24, and compares the luminance value of the relevant region with the reference image The luminance value of the area to be processed is compared. The image selecting unit 16 selects a reference image having the luminance value closest to the luminance value of the region obtained by the analysis as the reference image for selecting the image to be analyzed.

The image selecting unit 16 also selects the reference image for selection of the image to be analyzed corresponding to the state of the harness liner 24 on the basis of the magnitude of the current value applied to the electron beam source 21 good. In this case, the magnitude (range) of the current value may correspond to a plurality of reference images and may be stored in the reference image DB 141. [ The image selection unit 16 acquires a current value when the image pickup unit 11 acquires an image and selects a reference image for selection of an image to be analyzed by referring to the reference image DB 141. [

In this manner, the image selecting unit 16 can specify the approximate state of the harness liner 24 from the information such as the photographed image or the current value, and can select the reference image for selecting the image to be analyzed. In addition, the image selection unit 16 acquires the analysis or current value for one (e.g., the first acquired image) among the acquired images, but the present invention is not limited to this. For example, May be acquired.

Further, in the case where a reference image is set for each one for each monitoring purpose, the image selecting unit 16 selects a reference image to be used in each of the above-mentioned surveillance (A) to (C) As a reference image for selecting an image to be analyzed. Further, the image selecting unit 16 may select a reference image for selection of an image to be analyzed in accordance with the above-mentioned surveillance (A) to (C).

In the present embodiment, the reference image groups (a) to (d) are set as a plurality of reference images. Therefore, the image selecting unit 16 selects, from at least one of the reference image groups (a) to (d) according to the respective surveillance of (A) to (C) May be selected.

Here, as the reference image group corresponding to each of the above-mentioned surveillance (A) to (C), an image in which a part required for each surveillance (for example, the outline part, boundary part or irradiation position) It is preferable that it is set so as to be easily selected from a plurality of images. Further, in the respective surveillances, when the processing using the reference image is performed on the selected image, it is preferable that the reference image group is selected in consideration of the processing.

In the case of (A), it is preferable that an image capable of obtaining the contour portion (HL shown in FIG. 6) is selected in the photographed image. For this reason, for example, the above-mentioned (a) or (c) is set as the reference image group used by the image selecting unit 16.

In the case of (B), it is preferable that an image capable of acquiring the contour portion (ED _b shown in FIG. 7) and the boundary portion (ED _f shown in FIG. 7) is selected in the photographed image. For this reason, for example, the above-mentioned (a) to (c) are set as the reference image group used by the image selecting unit 16. [

In the case of (C) monitoring, it is preferable that an image which can acquire the bath surface position and the irradiation position in the photographed image is selected. For this reason, for example, the above-mentioned (b) or (d) is set as the reference image group used by the image selecting unit 16. [

In such a state, the image selection unit 16 selects the reference (a) to the reference (d) in accordance with the respective surveillance (A) to At least one reference image group is selected from the group of images and a reference image for selection of an image to be analyzed is selected from among the selected reference image groups. The image selection unit 16 may also select the reference image by analyzing the acquired image or acquiring the current value in the same manner as above, even in the case of selecting the reference image for analysis target image selection. Further, a reference image to be selected in advance in the reference image groups (a) to (d) may be set. In this case, the image selecting unit 16 sets the reference image as a reference image for selecting an image to be analyzed Select.

In this manner, the image selection unit 16 selects one representative reference image which is assumed to have the highest correlation as the reference image for selecting the image to be analyzed, in each of the above-mentioned (A) to (C) surveillance.

The state determination section 17 determines the state of the deposition apparatus 2 by analyzing the analysis object image selected by the image selection section 16. [ The state determining section 17 includes a hash liner position monitoring section 171, a bath surface position monitoring section 172 and an irradiation position monitoring section 173 for monitoring the above (A) to (C).

The state determining section 17 does not necessarily have to have all the functions of the washer liner position monitoring section 171, the bath surface position monitoring section 172 and the irradiation position monitoring section 173. The state determination section 17 may have only one or two functions among these three functions. The status determination section 17 only needs to have a function to be monitored by the monitoring apparatus 1.

The harness liner position monitoring unit 171 monitors the position of the harness liner 24. [ Specifically, the hash liner position monitoring unit 171 determines whether or not the position of the washer liner 24 is in the normal position by analyzing the image captured by the photographing unit 11. [ For example, the hash liner position monitoring unit 171 specifies the contour portion of the harness liner 24 in the analysis object image and the reference image, calculates the correlation value between the contour portions of the specified hash liner 24 , And determines whether or not the correlation value is within a predetermined range. Further, the washer-liner position monitoring unit 171 calculates distances between two opposing positions as a part of the contour portion, and determines whether or not the distance is within a predetermined range. If the correlation value or the distance is within the predetermined range, it is determined that the position of the harness liner 24 is at the normal position, and if the correlation value or the distance is out of the range, it is determined that the harness liner position monitoring unit 171 is in the non- .

As shown in Fig. 6, an example of judging that the vehicle is in the non-normal position is a case in which the vehicle is raised to the rear, the vehicle is raised to the front, the vehicle is raised to the left, (24).

Indicates that the upper side (near y = 0) of the washer liner 24 is inclined toward the upper surface of the turret 25. Indicates a state in which the lower side of the washer liner 24 (side away from y = 0 to + y direction) is inclined toward the top surface of the turret 25. "Upward to the left" indicates a state in which the left side (near x = 0) of the washer liner 24 is inclined toward the upper surface of the turret 25. Indicates that the right side of the washer liner 24 (the side away from x = 0 to the + x direction) is inclined toward the top surface of the turret 25.

The bath surface position monitoring unit 172 monitors the bath surface position of the evaporation material MA supplied to the washer liner 24. Specifically, the bath surface position monitoring unit 172 detects the bath surface position by analyzing the image photographed by the photographing unit 11, and determines whether or not the bath surface position is in the normal position. For example, the bath surface position monitoring unit 172 detects a part (ED _b ) of the contour part and a part (ED _f ) of the boundary part which face each other as shown in Fig. And the bath surface position monitoring section 172, a part (ED _b) and calculates the distance (D _s) of the portion of the boundary portion (ED _f), the art distance (D _s) is a predetermined range of the edge portion within the It is determined that the bath surface position is at a normal position, and if it is out of the range, it is determined that the position is not normal.

When it is determined that the position of the bath surface position monitoring unit 172 is not normal and the bath surface position monitoring unit 172 determines that the evaporation material MA in the washer liner 24 is small, MA), and transmits data representing the supply amount to the material supply device 3. [0050] Upon receiving the data, the material supply device 3 supplies the deposition material MA to the harness liner 24 by the supply amount indicated by the data.

The irradiation position monitoring unit 173 monitors the irradiation position of the electron beam EB emitted from the electron beam source 21 in the washer liner 24. [ Specifically, the irradiation position monitoring unit 173 detects the irradiation position by analyzing the image photographed by the photographing unit 11, and determines whether or not the irradiation position is in the normal position. For example, as shown in Fig. 8, the irradiation position monitoring unit 173 detects a range having a pixel value equal to or larger than a predetermined pixel value and having an area equal to or larger than a predetermined area at the irradiation position IA ( Irradiation area), and specifies the center of gravity position (CP) of the irradiation position. The irradiation position monitoring unit 173 determines that the irradiation position IA is in the normal position when the center of gravity position CP is within the predetermined range and determines that the irradiation position IA is in the non-normal position if out of the range . The determination as to whether or not the irradiation position is the normal position may be made by comparing with the reference image in which the electron beam EB is projected at the normal position.

When the irradiation position monitoring unit 173 is out of the range, the irradiation position monitoring unit 173 calculates the movement amount (correction amount) for moving the irradiation position to the normal position. The irradiation position monitoring unit 173 causes the deposition apparatus 2 to change the irradiation position of the electron beam EB by the correction amount. In the deposition apparatus 2, the beam deflection magnet 22 and the pole piece 23 are controlled so that the irradiation position is corrected so that the irradiation position becomes the normal position.

When it is determined that the position is not normal in each monitoring, the state determination section 17 determines that an abnormality has occurred in the deposition apparatus 2 and controls the notification section 13 Generate a warning. Further, in the case of this determination, the state determination section 17 stops the deposition processing by the deposition apparatus 2. [ More specifically, the state determination section 17 stops power supply to each section of the deposition apparatus 2 by a power source (not shown) included in the deposition apparatus 2.

In addition, in the case of the above determination, the status determination section 17 does not necessarily execute both of the warning notification and the power supply stop of the deposition apparatus 2. [ For example, when the amount of deviation from the normal position is within a certain range, the state determination section 17 may cause a trouble in the deposition processing, and it is preferable to avoid the continuous deposition processing (A state requiring maintenance, that is, a so-called &quot; slight failure &quot;), and only warning notification may be performed. On the other hand, in the case where the amount of deviation exceeds a certain range, the state judgment section 17 judges that the deposition process is hindered and the safety can not be ensured (so-called &quot; serious failure & The deposition process is stopped.

(Example of photographed image)

Figs. 9 to 11 show an example of a plurality of photographed images in the respective surveillance of (A) to (C). FIG. 9 is an example of an image captured at the time of monitoring the position of the harness liner 24, FIG. 10 is an example of an image captured at the time of monitoring the bath surface position, and FIG. 11 is an example of an image captured at the time of monitoring the irradiation position. 9 to 11, the image surrounded by oblique lines is the image selected by the image selecting unit 16 as the analysis object image.

In the example of Figs. 9 and 10, the case where the shutter speed is 1/60 and 1/120 is taken. In the example of Fig. 11, there is a case where the image is photographed with shutter speeds "1/60", "1/120", and "1/240". However, in each surveillance, it may be set to any one of the above shutter speeds (e.g., &quot; 1/60 &quot;). In other words, in this example, it suffices to obtain eight images in which the photographing sensitivity and the photographing timing are different from each other as a plurality of images.

However, in order to increase the possibility of selecting an image having a higher correlation with the reference image, an image corresponding to each of a plurality of shutter speeds in each monitoring is acquired for the purpose of increasing the number of the plurality of images to be compared with the reference image It is also good. In other words, all of the images shown in Figs. 9 to 11 may be objects to be compared with the reference image.

9 and 10, the image selecting unit 16 selects the image No. 1 having the highest correlation even when the shutter speed is 1/60, or the shutter speed is 1/120, As shown in FIG. 11, when the shutter speed is 1/60, the image selecting unit 16 selects the image No. 2 having the highest correlation value as the image to be analyzed and sets the shutter speed &quot; 1/120 &quot;Quot;, and &quot; 1/240 &quot;, the image No. 1 having the highest correlation is selected as the analysis object image.

When two or more images can be selected as the image with the highest correlation in the eight images at each shutter speed, the image selecting unit 16 selects one image as an analysis object image in a predetermined method An image may be selected. As such a method, for example, a method in which an image (the firstly photographed image) having the smallest image number among a plurality of images having the highest correlation is used as an analysis object image.

«Process flow of monitoring system»

Next, an example of a processing flow in the monitoring system will be described with reference to Fig. 12 is a flowchart showing an example of a processing flow in the monitoring system.

First, the deposition apparatus 2 irradiates the evaporation material MA in the washer liner 24 by emitting an electron beam EB from the electron beam source 21 before deposition of the evaporation material MA on the substrate 100 And melts the evaporation material MA (processing step (hereinafter referred to as S) 1). Next, the deposition apparatus 2 irradiates the electron beam EB onto the evaporation material MA by increasing the intensity of the light, thereby evaporating the evaporation material MA in the washer liner 24, (Main deposition) (S2).

Next, when the film forming process by the vapor deposition apparatus 2 is completed, the monitoring apparatus 1 manages the bath surface of the evaporation material MA in the washer liner 24 after confirming that the film forming rate is zero (S3; Corresponding to the monitoring of (B) above). More specifically, the bath surface position monitoring unit 172 sets the photographing setting for the bath surface position monitoring (bath surface position photographing setting). The photographing section 11 is under the control of the photographing control section 15 and photographs a plurality of images under the photographing setting. The image selecting unit 16 selects an analysis object image suitable for monitoring the bath surface position from the plurality of images using the reference image for bath surface position monitoring. Then, the bath surface position monitoring unit 172 analyzes the analysis object image to determine whether the bath surface position is in the normal position or not. When the bath surface position monitoring unit 172 determines that the bath surface position is at a non-normal position, the bath surface position monitoring unit 172 performs warning notification from the notification unit 13 and / or stops the evaporation apparatus 2. [ When it is determined that the position of the bath surface position monitoring unit 172 is not normal and the bath surface position monitoring unit 172 determines that the evaporation material MA in the washer liner 24 is small, MA), and transmits data representing the supply amount to the material supply device 3. [0050]

The monitoring apparatus 1 also manages the position of the harness liner 24 after confirming that the film deposition rate is 0 when the film deposition process by the deposition apparatus 2 is completed (S4) Response). The hash liner position monitoring unit 171 starts the position management process after a predetermined period of time has elapsed after confirming that the film deposition rate is 0 (e.g., after several seconds, after the start of the hot water tank management). In addition, the hash liner position monitoring unit 171 receives the notification from the bath surface position monitoring unit 172 that the photographing unit 11 has photographed a plurality of images in the process of S3, thereby starting the process of the position management .

The washer liner position monitoring unit 171 instructs the evaporation apparatus 2 to emit only photons from the filament of the electron beam source 21. [ When the deposition apparatus 2 receives the instruction, the electron beam source 21 functions as an illumination light source. The washer liner position monitoring section 171 switches the photographing setting from the bath surface position photographing setting to the photographing setting for monitoring the position of the harness liner 24 (lower switch photographing setting) before photographing a plurality of images. The photographing section 11 is under the control of the photographing control section 15 and photographs a plurality of images under the photographing setting. The image selecting unit 16 selects an analysis object image suitable for monitoring the position of the harness liner 24 from the plurality of images using the reference image for monitoring the position of the harness liner 24. [ The hash liner position monitoring unit 171 determines whether or not the position of the washer liner 24 is in the normal position by analyzing the analysis object image. If the hash liner position monitoring unit 171 determines that the position of the washer liner 24 is not normal, the alarm notification from the notification unit 13 and / or the stop of the vapor deposition apparatus 2 is performed do.

In addition, in the monitoring apparatus 1, the hash liner position monitoring unit 171 notifies the bath surface position monitoring unit 172 of the fact that the taking of a plurality of images for monitoring the hash liner position is completed. The bath surface position monitoring unit 172 switches the photographing setting from the hash liner position photographing setting to the bath surface position photographing setting. The processing timing may be before the photographing of the harness liner 24 (before the processing of S6 described later).

When the bath surface position monitoring unit 172 transmits the data representing the supply amount to the material supply device 3 in the process of S3, the material supply device 3 supplies the data to the hot liner 24 to the deposition material MA (S5).

Next, the deposition apparatus 2 dissolves the evaporation material MA in the washer liner 24 similarly to S1 when the supply processing of the evaporation material MA by the material supply apparatus 3 is completed. The monitoring apparatus 1 performs the management of the bath surface of the evaporation material MA in the washer liner 24 after completing the melting process by the vapor deposition apparatus 2. (S6: Corresponding to the monitoring in the above (B)) [ . This processing is the same as the processing by the bath surface position monitoring unit 172 in S3.

The processing of S3 is performed to manage the state of the bath surface after the deposition of the substrate 100, and the processing of S6 is performed to manage the state of the bath surface after the deposition material MA is supplied.

Further, in the monitoring apparatus 1, the bath surface position monitoring unit 172 notifies the irradiation position monitoring unit 173 of the completion of the photographing of a plurality of images for bath surface position monitoring. The irradiation position monitoring unit 173 switches the shooting setting from the bath surface position photographing setting to the photographing setting for survey position monitoring (the irradiation position photographing setting). The processing timing may be before the photographing of the harness liner 24 (before the processing of S7).

Next, the monitoring apparatus 1 manages the irradiation position of the electron beam EB with respect to the evaporation material MA in the washer liner 24 (S7; corresponding to the monitoring in the above (C)). Specifically, the photographing section 11 is under the control of the photographing control section 15 and photographs a plurality of images under the illumination position photographing setting. The image selecting unit 16 selects an image to be analyzed suitable for monitoring the irradiation position from the plurality of images by using the reference image for monitoring the irradiation position. Then, the irradiation position monitoring unit 173 determines whether the irradiation position is in the normal position by analyzing the analysis object image. When the irradiation position monitoring unit 173 determines that the irradiation position is at a non-normal position, the irradiation position monitoring unit 173 issues a warning notification from the notification unit 13 and / or stops the deposition apparatus 2. [

In this case, the irradiation position monitoring unit 173 determines the correction amount corresponding to the irradiation position, and transmits the data indicating the correction amount to the deposition apparatus 2. The deposition apparatus 2 corrects the irradiation position so that the irradiation position is a normal position based on the data.

Further, in the monitoring apparatus 1, the irradiation position monitoring unit 173 notifies the bath surface position monitoring unit 172 of the completion of the photographing of a plurality of images for monitoring the irradiation position. The bath surface position monitoring unit 172 switches the photographing setting from the irradiation position photographing setting to the bath surface position photographing setting. Further, the processing timing may be before the photographing of the next hash liner 24 (before the processing of S3).

In addition, the order of processing of the washer liner position monitoring section 171, the bath surface position monitoring section 172, and the irradiation position monitoring section 173 is not limited to the above procedure.

«Process flow of monitoring device»

Next, an example of a processing flow (monitoring method) in the monitoring apparatus 1 will be described with reference to Fig. Fig. 13 is a flowchart showing an example of the processing flow in the monitoring apparatus 1. Fig.

The imaging control unit 15 controls the photographing unit 11 to detect the state of the subject by the state determination unit 17 (step S7) (S11: photographing process). When the photographing control unit 15 acquires a plurality of images, it notifies the image selection unit 16 of the fact.

The image selection unit 16 receives the notification and generates one reference image corresponding to each of the above-mentioned surveillance (A) to (C) Image) is selected (S12). When one reference image corresponding to each monitoring is set, the reference image is selected as a reference image for selecting an image to be analyzed. Then, the image selection unit 16 compares the plurality of images photographed in each surveillance with the selected reference image, and calculates a correlation value for each image (S13). The image selection unit 16 selects an image having the maximum correlation value (maximum correlation value) among the correlation values calculated in each monitoring as an analysis object image (S14; image selection step). The image selecting unit 16 notifies the state determining unit 17 that the image to be analyzed has been selected.

The state determination section 17 executes processing corresponding to each monitoring (the process of the hash liner position monitoring section 171, the bath surface position monitoring section 172, or the irradiation position monitoring section 173) 2) is in a normal state (S15; state determining step). If the state of the deposition apparatus 2 is judged to be normal (YES in S15) in all the above-mentioned surveillance of (A) to (C), the state judging section 17 ends the process flow. On the other hand, when the state determination unit 17 determines that the state of the deposition apparatus 2 is not normal in any of the above-mentioned surveillance (A) to (C) (NO in S15) (S16). Further, in a case of a serious failure, the state determination section 17 stops the deposition apparatus 2 (S17).

«Main effects»

In the monitoring apparatus 1, the photographing section 11 photographs the lotion liner 24 a plurality of times. Further, the photographing section 11 changes at least one of the photographing sensitivity, the shutter speed, and the photographing timing to take a photograph. Therefore, a plurality of images having different brightness can be obtained.

The image selecting unit 16 selects an image having the highest correlation with the reference image on which the harness liner 24 is projected from the plurality of images captured by the photographing unit 11 as an analysis object image. Therefore, it becomes possible to select an image having a brightness at which image analysis is easy to be performed. The state determination section 17 analyzes the thus-selected analysis object image to determine the state of the deposition apparatus 2. [

In the case where an image to be analyzed is photographed only once and an overly bright or too dark image is photographed, there is a possibility that the object of analysis such as the outline portion can not be specified even if the image is analyzed. In this case, photographing is required again while adjusting the photographing setting. Further, as described above, since the hot rolling or heating time of the washer liner 24 and the evaporation material MA is changed depending on the state of the washer liner 24, the position of the bath surface, and the like, There is a possibility of acquiring. Even in this case, there is a possibility that the analysis object can not be specified.

On the other hand, according to the monitoring apparatus 1, it is possible to select, as the analysis target image, an image which is easiest to be interpreted after taking into account the glow state. Therefore, the possibility that the state of the deposition apparatus 2 can be determined with high accuracy can be increased without depending on the surrounding environment of the washer liner 24, as compared with the above case. Further, according to the monitoring apparatus 1, the possibility of shooting again can be reduced. Therefore, it is possible to reduce the time and effort for taking the picture again.

[Embodiment 2]

The second embodiment of the present invention will be described below. For convenience of explanation, members having the same functions as the members described in the above embodiments are denoted by the same reference numerals, and a description thereof will be omitted.

In the first embodiment, one reference image for selection of an image to be analyzed is selected from a plurality of reference images, but a plurality of reference images may be selected.

For example, in each of the above-mentioned surveillance (A) to (C), the number of reference images for selection of the image to be analyzed to be selected is preset to be 2 or more, and the image selecting unit 16 May be selected. In this case, for example, the image selecting section 16 analyzes the acquired image as described in the first embodiment and determines whether or not the luminance value of the area included in the image (for example, the area assumed as the outline part) The selected number is selected in order from the reference image having the near luminance value (the luminance value of the region in the reference image corresponding to the region). When the current value is selected by using the current value, the image selection section 16 selects, for example, a reference image corresponding to the obtained current value, and a reference image corresponding to the value in the vicinity of the current value, The number is selected in the range not exceeding the number.

Further, in a case where a plurality of reference images are set for each monitoring, a correlation value may be calculated for each of a plurality of photographed images and each of a plurality of reference images in each monitoring. In other words, in this case, the correlation value between all the images photographed by the photographing section 11 and all the reference images stored in the reference image DB 141 is calculated.

Further, the image selecting unit 16 may be arranged such that each of the images photographed by the photographing unit 11 covers only a part of a plurality of reference images. For example, the image selection unit 16 selects, based on each of the above-mentioned surveillance of (A) to (C), a criterion for comparing the plurality of reference images stored in the reference image DB 141 with the image captured by the imaging unit 11 An image may be selected.

For example, the image selecting unit 16 may select at least one of the reference image groups (a) to (d) in accordance with the respective surveillance of (A) to (C) Or may be selected as a plurality of reference images to be compared. As described in Embodiment 1, when the reference images of (a) to (d) are associated with each of the above surveillance (A) to (C) And selects the corresponding reference image group.

As described above, the image selecting unit 16 selects each of the plurality of reference images selected as the reference image for the image to be analyzed with respect to each of the plurality of images photographed by the photographing unit 11, Lt; / RTI &gt; Then, the image selecting unit 16 selects an image having the highest correlation value among the calculated correlation values as an image to be analyzed. In other words, the image selecting unit 16 selects, as an analysis target image, an image having the highest correlation with each of at least some of the plurality of reference images, from the plurality of images captured by the photographing unit 11. [

Even in the case where there are a plurality of reference images for selection of an image to be analyzed in this manner, as in the first embodiment, it is possible to obtain, from a plurality of images, an image that is easiest to be acquired in a part required for image analysis in each monitoring, You can choose. Therefore, it is possible to accurately determine the state of the deposition apparatus 2 in each monitoring. In addition, since there are a plurality of reference images for selecting an image to be analyzed, the correlation between the image taken by the image pickup section 11 and the reference image can be confirmed more widely.

[Embodiment 3]

A third embodiment of the present invention will be described below. For convenience of explanation, members having the same functions as the members described in the above embodiments are denoted by the same reference numerals, and a description thereof will be omitted.

In Embodiments 1 and 2, a plurality of reference images are registered in the reference image DB 141. The present invention is not limited to this, and only one reference image common to the surveillance of (A) to (C) may be registered in the reference image DB 141.

As an image to be analyzed, an image which can be extracted with high precision can be selected as the image of the contour portion if the surveillance of (A) is performed, the contour portion and the boundary portion if surveillance of (B) . Therefore, as the reference image, it is preferable that the contour portion, the boundary portion, and the irradiation position are clear images. In this case, the reference image may be an image in which the electron beam EB irradiated near the center of gravity of the bath surface position at the normal position in the image of the new washer liner 24, for example.

The image selection unit 16 may also be configured to determine whether or not the image to be analyzed is an image to be analyzed by correlating the contour portion of the hash liner 24 in each captured image with the contour portion of the hash liner 24 in the reference image, It is preferable that the contour portion of the reference image be clearly shone. In this case, the reference image may be a new image of the hash liner 24.

Even if there is only one reference image thus registered, it is possible to select, as the analysis target image, an image most easily obtainable from the plurality of images, which is required in the image analysis in each monitoring. Therefore, it is possible to accurately determine the state of the deposition apparatus 2 in each monitoring.

[Examples of realization by software]

The control block of the monitoring apparatus 1 (in particular, each functional block of the control section 10) may be realized by a logic circuit (hardware) formed on an integrated circuit (IC chip) or the like, .

In the latter case, the monitoring apparatus 1 includes a CPU for executing instructions of a program which is software for realizing the functions, a ROM (Read Only Memory) in which the above program and various data are recorded so as to be read by a computer ) Or a storage device (these are called &quot; recording media &quot;), a RAM (Random Access Memory) for expanding the program, and the like. The object of the present invention is achieved by a computer (or CPU) reading the program from the recording medium and executing the program. As the recording medium, for example, a tape, a disk, a card, a semiconductor memory, a programmable logic circuit, or the like can be used. Further, the program may be supplied to the computer through an arbitrary transmission medium (such as a communication network or a broadcast wave) capable of transmitting the program. One aspect of the present invention may also be realized in the form of a data signal on a carrier, in which the program is embodied by electronic transmission.

[theorem]

(1) In order to solve the above problems, a monitoring apparatus according to one aspect of the present invention is a monitoring apparatus for monitoring a deposition apparatus for forming a film on a substrate by depositing an evaporation material on the substrate, An image capturing unit that captures a plurality of images by using a container for supporting the evaporation material as an object, and an image analyzing unit that analyzes an image having the highest correlation with a reference image, And a state determination unit that determines the state of the deposition apparatus by analyzing the analysis object image selected by the image selection unit.

According to the above configuration, an image having the highest correlation with the reference image is selected as an analysis object image from the image of the container captured a plurality of times. Then, the state of the deposition apparatus is determined using the analysis object image. Therefore, it is possible to determine the state of the deposition apparatus with high precision.

(2) In the monitoring apparatus according to one aspect of the present invention, in the configuration of (1), the photographing section may change at least one of photographing sensitivity and shutter speed every time the image is photographed.

In general, depending on the brightness of the container itself or its surroundings, the contrast of the container reflected in the captured image may decrease, making it difficult to compare with the reference image. According to the above configuration, since the photographing sensitivity and / or the shutter speed are changed each time the photographing is performed, it is possible to photograph the container having different brightness. Therefore, it becomes possible to select the image of the container suitable for comparison with the reference image as the analysis object image.

(3) In the monitoring apparatus according to one aspect of the present invention, in the above-mentioned constitution (2), in a period from the start of shooting to the end of shooting of the plurality of images, The period may be set.

According to the above configuration, it is possible to increase the likelihood of acquiring an image of the container having a brightness suitable for contrast with the reference image by setting a predetermined period during which no image is captured.

(4) In the monitoring apparatus according to one aspect of the present invention, in the arrangement of (2) or (3) ) Of the evaporation source supplied to the vessel and (C) the irradiation position of the electron beam emitted from the beam emission source in the vessel is analyzed as an analysis object, The photographing section may photograph at the photographing sensitivity and the shutter speed set in accordance with the object to be analyzed.

According to the above configuration, the container can be photographed with the photographing sensitivity and / or the shutter speed according to the analysis objects (A) to (C). In other words, it is possible to increase the likelihood of acquiring an image of the container suitable for comparison with the reference image according to each analysis object.

(5) In the monitoring apparatus according to one aspect of the present invention, it is preferable that the plurality of reference images having different states of the containers are set in any one of the constitutions (1) to (4) The image selection unit may select the analysis object image from the plurality of images using the reference image selected from the plurality of reference images.

According to the above configuration, it is possible to prepare a plurality of captured images with at least one of a plurality of reference images having different states of the container. Therefore, it becomes possible to select an analysis object image in consideration of the state of the container.

(6) In the monitoring apparatus according to one aspect of the present invention, in the arrangement of (5), the plurality of reference images may include: (a) a plurality of reference images (B) a reference image group including a plurality of reference images having different bath surface positions of the evaporation material supplied to the container, (c) a slope of the container with respect to a predetermined reference plane, (D) a reference image group including a plurality of reference images different in irradiation position in the container from electron beam emitted from the beam emission source, .

According to the above configuration, the photographed image can be compared with at least one of the reference image groups (a) to (d). The image to be analyzed can be selected in consideration of the use state of the container, the bath surface position of the evaporation material, the inclination of the container, or the irradiation position of the electron beam.

(7) In the monitoring apparatus according to one aspect of the present invention, it is preferable that, in the arrangement of (6), the state judging section judges whether or not (A) Wherein the state of the deposition apparatus is determined by analyzing one of an irradiation position of the supplied evaporation material and an irradiation position of the electron beam emitted from the beam outgoing source in the container (C) , And a reference image to be used for selecting the analysis object image from at least one of the reference image groups (a) to (d) may be selected according to the analysis object.

According to the above arrangement, the reference image included in at least one of the reference image groups (a) to (d) is selected according to the analysis object of (A) to (C) Lt; / RTI &gt; Therefore, it is possible to accurately determine the state of the evaporation apparatus for each analysis target.

(8) A monitoring method according to one aspect of the present invention is a monitoring method for monitoring a deposition apparatus for forming a film on a substrate by depositing an evaporation material on the substrate, the monitoring method comprising the steps of: An image picking up step of picking up a plurality of images by taking a container for supporting a subject as a subject; and an image selecting unit that selects, as an image to be analyzed, an image having the highest correlation with a reference image, And a state determination step of determining the state of the deposition apparatus by analyzing the analysis object image selected in the image selection step.

According to the above method, the same effect as the effect of the constitution of (1) is obtained.

The monitoring device according to each aspect of the present invention may be realized by a computer. In this case, by operating the computer as each unit (software element) included in the monitoring device, A monitoring control program of the apparatus and a computer readable recording medium on which the program is recorded are also included in the scope of the present invention.

[Additions]

It is to be understood that the present invention is not limited to the embodiments described above and that various changes can be made within the scope of the claims and embodiments obtained by appropriately combining the technical means disclosed in the other embodiments with the technical scope of the present invention .

1: Monitoring device
2: Deposition device
11:
16: Image selection unit
17:
21: electron beam source (beam outgoing source)
24: Haas Liner (container)
100: substrate
EB: electron beam
IA: Investigation location
MA: Deposition material

Claims (9)

1. A monitoring apparatus for monitoring a deposition apparatus for forming a film on a substrate by depositing an evaporation material on the substrate,
A photographing unit provided in the apparatus for photographing a plurality of times using a container for supporting the evaporation material as a subject;
An image selection unit that selects, from the plurality of images photographed by the photographing unit, an image having the highest correlation with a reference image that is an image of the container;
And a state determination unit that determines the state of the deposition apparatus by analyzing the analysis object image selected by the image selection unit
Wherein the monitoring device comprises:
The method according to claim 1,
Wherein the photographing section changes at least one of the photographing sensitivity and the shutter speed every time the image is photographed.
3. The method of claim 2,
Wherein a predetermined period during which the image is not photographed is set in a period from the start of shooting of the plurality of images to the end of shooting of the plurality of images.
The method according to claim 2 or 3,
(A) the position of the container, (B) the bath surface position of the evaporation material supplied to the container (hot water surface position), and (C) (Irradiating position) of an electron beam (beam) emitted from a beam emitting source is analyzed as an analysis object to determine the state of the deposition apparatus,
Wherein the photographing section performs photographing with the photographing sensitivity and the shutter speed set in accordance with the object to be analyzed
Characterized by a monitoring device.
The method according to claim 1,
A plurality of reference images having different states of the container are set,
Wherein the image selecting unit selects the image to be analyzed from the plurality of images using the reference image selected from the plurality of reference images
Characterized by a monitoring device.
6. The method of claim 5,
The plurality of reference images may include:
(a) a reference image group including a plurality of reference images whose use states of the containers are different from each other,
(b) a reference image group including a plurality of reference images having different bath surface positions of the evaporation material supplied to the container,
(c) a reference image group including a plurality of reference images different in inclination within a predetermined range as the inclination of the container with respect to a predetermined reference plane, and
(d) a reference image group including a plurality of reference images whose irradiating positions in the container are different from each other, of the electron beam emitted from the beam emitting source
Wherein the at least one monitoring device is at least one of the plurality of monitoring devices.
The method according to claim 6,
(A) the position of the container, (B) the position of the bath surface of the evaporation material supplied to the container, and (C) the position of the electron beam emitted from the beam outgoing source in the container The state of the deposition apparatus is determined by analyzing any one of the irradiation positions of the deposition apparatus,
Wherein the image selection unit selects a reference image to be used in selecting the analysis object image from at least one of the reference image groups (a) to (d) in accordance with the analysis object
Characterized by a monitoring device.
A monitoring method for monitoring a deposition apparatus for forming a film on a substrate by depositing an evaporation material on the substrate,
A photographing step of photographing a plurality of times by using a container for supporting the evaporation material provided in the evaporation apparatus as an object;
An image selection step of selecting, as an analysis target image, an image having the highest correlation with a reference image, which is an image of the container, from a plurality of images captured in the shooting step;
A state determination step of determining the state of the deposition apparatus by analyzing the analysis object image selected in the image selection step
The monitoring method comprising:
A computer-readable recording medium in which a computer program is stored, wherein each step of the monitoring method of claim 8 is realized when the computer program is executed by a processor. Possible recording medium.

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